A regional covering film laminating device

Abstract

The present invention discloses a regional cover film laminating device for laminating films on multiple surface areas of a circuit board. The regional cover film laminating device includes a circuit board conveying module for conveying the circuit board, a first cover film feeding module for continuously feeding a sheet of a first cover film, a second cover film feeding module for continuously feeding a sheet of a second cover film, and a laminating module. The laminating module is configured to draw a first cover film from the first cover film feeding module and laminarize it on one surface area of ​​the circuit board, and to draw a second cover film from the second cover film feeding module and laminarize it on another surface area of ​​the circuit board. The first cover film and the second cover film laminating device laminating the multiple surface areas of the circuit board are combined to form an integrated cover film. The laminating module of the present invention can automatically laminarize multiple surface areas of the circuit board as needed, thereby improving production efficiency and facilitating the diversified development of circuit boards.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a regional cover film laminating device for laminating films on multiple surface areas of a circuit board. Background Art

[0002] In the production process of circuit boards, especially flexible circuit boards, it is often necessary to attach a cover film to the surface of the circuit board. The cover film can be various films such as developer dry film, solder mask dry film, etc., which are temporarily or permanently attached to the surface of the semi-finished or finished circuit board.

[0003] Currently, cover film application is typically done manually by tearing the protective film from a roll, applying it to the circuit board, and then laminating it in a high-temperature machine. This manual process requires significant labor and is inefficient. Furthermore, manual application can easily lead to wrinkles and bubbles, resulting in significant material waste.

[0004] With the development of technology, covering film laminating equipment has appeared in the prior art, such as a film laminating mechanism and a fully automatic covering film laminating equipment disclosed in Chinese Patent 202110318952.8. As the application of circuit boards becomes more and more extensive, the types and functions of circuit boards are becoming more and more abundant; currently, during the production of circuit boards, it is often necessary to simultaneously laminate multiple surface areas of a circuit board, especially when the hole positions, reference points and layouts on multiple surface areas of the circuit board are different, two or more covering film laminating operations need to be performed. However, the covering film laminating equipment in the prior art is all for the laminating of a specific single covering film, and different covering films cannot be simultaneously laminarized on different surface areas of the circuit board, thereby failing to meet the needs of a circuit board with multiple surface areas that needs to have different covering films laminarized on its multiple surface areas. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the main purpose of the present invention is to provide a regional cover film laminating device, which can laminarize multiple cover films to different surface areas of the same surface of a circuit board (circuit board unit), and has the advantage of high production efficiency.

[0006] In order to achieve the above main purpose, the present invention provides a regional cover film laminating device for laminating films to multiple surface areas of a circuit board; the regional cover film laminating device includes:

[0007] A circuit board conveying module, used for conveying circuit boards;

[0008] A first covering film feeding module, used for continuously feeding out a sheet of the first covering film;

[0009] A second covering film feeding module, used for continuously feeding out a sheet of the second covering film;

[0010] The laminating module is used to suck the first cover film from the first cover film feeding module and laminate it to one surface area of ​​the circuit board, and to suck the second cover film from the second cover film feeding module and laminate it to another surface area of ​​the circuit board.

[0011] The first covering film and the second covering film attached to multiple surface areas of the circuit board are assembled to form an integral covering film.

[0012] In the above technical solution of the present invention, the covering films are supplied respectively by the first covering film feeding module and the second covering film feeding module, and the laminating module performs automatic lamination of multiple surface areas of the circuit board as needed, thereby improving production efficiency; the first covering film and the second covering film laminated on multiple surface areas of the circuit board are spliced ​​to form an overall covering film, which is conducive to adapting to the diversified development needs of the circuit board.

[0013] As a specific embodiment of the present invention, the first covering film feeding module and the second covering film feeding module each include a covering film feeding frame, an unwinding mechanism, a peeling mechanism and a winding mechanism;

[0014] The covering film feeding frame is arranged on the main frame;

[0015] The unwinding mechanism is used to supply a film including a cover film and a release film;

[0016] The peeling mechanism is used to peel off the cover film and the release film;

[0017] The winding mechanism is used to collect the release film after peeling off the cover film;

[0018] Among them, the stripping mechanism includes a movable frame, a stripping platform, a storage platform and a covering film suction component; the movable frame can be slidably arranged on the covering film feeding frame along the covering film feeding direction, and the stripping platform and the storage platform are arranged at intervals on the movable frame along the covering film feeding direction; the covering film suction component is fixedly arranged on the covering film feeding frame to absorb the covering film located on the stripping platform during part of the reciprocating movement of the movable frame, and transfer the absorbed covering film to the storage platform.

[0019] Further, the movable frame has a suction position, a first peeling position and a second peeling position;

[0020] When the movable frame is in the suction position, the stripping platform and the storage platform are both located on one side of the cover film suction component. At this time, the storage platform corresponds to the laminating module;

[0021] When the movable frame is in the first stripping position, the stripping platform moves to the bottom of the covering film suction assembly, and the covering film suction assembly can now suck the covering film on the stripping platform;

[0022] When the movable frame is in the second stripping position, the material storage platform moves to the bottom of the covering film suction component. At this time, the covering film suction component can place the sucked covering film on the material storage platform, and the material storage platform adsorbs and fixes the covering film through negative pressure.

[0023] Furthermore, the first covering film feeding module and the second covering film feeding module also include a self-adjusting mechanism for keeping the film roll unwinding smoothly during the reciprocating motion of the moving frame; the self-adjusting mechanism is arranged between the unwinding mechanism and the peeling mechanism, and includes a self-adjusting roller; during the reciprocating motion of the moving frame, the self-adjusting roller can move freely up and down.

[0024] As a specific embodiment of the present invention, the bonding module includes a bonding platform, a bonding head mechanism and a bonding drive mechanism; the bonding platform is located below the circuit board to adsorb and fix the circuit board; the bonding head mechanism is located above the circuit board, and is used to perform horizontal and lifting movements under the drive of the bonding drive mechanism to absorb the first covering film and the second covering film, and bond the first covering film and the second covering film to corresponding surface areas of the circuit board.

[0025] Furthermore, the placement head mechanism includes a placement platform; a turntable is provided on the placement drive mechanism, and the placement platform is arranged on the turntable via a spring floating mechanism;

[0026] The spring floating mechanism includes a plurality of sliding support seats and a plurality of floating springs;

[0027] The sliding support seat is arranged on the mounting platform; a vertical slide groove is provided on the sliding support seat; an outwardly protruding sliding support shaft is provided on the turntable, the sliding support shaft protrudes into the slide groove and is restricted to vertical sliding in the slide groove;

[0028] The upper and lower ends of the floating spring are respectively in contact with the turntable and the mounting platform.

[0029] As a specific embodiment of the present invention, the regional cover film laminating device further includes a pressing module; the pressing module includes an upper mold mechanism, a lower mold mechanism, a pressing heating mechanism, a lower mold driving mechanism and a supporting mechanism;

[0030] The lower mold mechanism is driven by the lower mold driving mechanism to reciprocate in the vertical direction toward the upper mold mechanism; the pressing and heating mechanism heats the upper mold mechanism and the lower mold mechanism when they are pressed together; the supporting mechanism is used to support the circuit board between the upper mold mechanism and the lower mold mechanism;

[0031] During pressing, the lower mold mechanism moves upward, and the circuit board supported on the supporting mechanism is pressed by the upper mold mechanism and the lower mold mechanism; after pressing is completed, the lower mold mechanism moves downward, and the circuit board supported on the supporting mechanism naturally droops, thereby separating from the upper mold mechanism and the lower mold mechanism respectively.

[0032] In the above technical solution, the pressing module adopts a pressing structure from bottom to top, and heats the circuit board through the heating component when pressing; after the pressing is completed, the lower mold mechanism moves downward, and the circuit board falls down to be supported on the supporting mechanism and droops naturally, and the circuit board is supported by the supporting mechanism, so that the circuit board is separated from the upper mold mechanism and the lower mold mechanism respectively; the circuit board is suspended in the middle, and the upper mold mechanism and the lower mold mechanism have no direct contact with the circuit board, and will not damage the circuit board and the covering film.

[0033] Furthermore, the pressing module also includes a plurality of vertical connecting guide rods, and the lower mold mechanism is slidably arranged on the connecting guide rods; wherein, the lower mold driving mechanism includes a slide rail and a sliding member arranged on the slide rail, and a guide structure is provided on the sliding member; the lower mold mechanism and the guide structure are abutted and fitted, so that when the sliding member slides, the lower mold mechanism is driven by the guide structure to move up or down along the connecting guide rods.

[0034] Preferably, the guide structure includes a guide surface with a variable height, and the lower mold mechanism is provided with a rolling member that abuts against the guide surface; wherein, when the sliding member slides, the abutting position of the rolling member and the guide surface changes.

[0035] As a specific embodiment of the present invention, the regional covering film laminating equipment also includes a detection and feeding module; the detection and feeding module includes a carrying mechanism, a moving mechanism, a detection mechanism and a clamping mechanism; the carrying mechanism is used to support the circuit board; the moving mechanism includes an X-axis moving module and a Y-axis moving module installed on the X-axis moving module; the detection mechanism is arranged on the Y-axis moving module to detect the flexible circuit board supported by the carrying mechanism; the clamping mechanism is arranged on the X-axis moving module, and is used to clamp the circuit board after the detection mechanism detects the circuit board, and move a specified stroke along the X-direction for feeding.

[0036] In the above technical solution, an independent motion mechanism is used to drive the detection mechanism to detect the laminated circuit board, which will not affect the normal operation of the placement head mechanism in the bonding module, thereby improving the overall production efficiency; at the same time, the X-axis moving module in the motion mechanism drives the circuit board clamped by the clamping mechanism to move a specified stroke along the X direction for feeding, thereby accurately controlling the length of each feed. Compared with the reel reeling and unwinding method in the existing technology, it has the advantages of high accuracy and good reliability.

[0037] In order to more clearly illustrate the purpose, technical solutions and advantages of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a front view of an embodiment of a regional cover film laminating device according to the present invention;

[0039] Figure 2 is a top view of an embodiment of a regional cover film laminating device according to the present invention;

[0040] Figure 3 is a perspective view of an embodiment of a regional cover film laminating device according to the present invention;

[0041] Figure 4 yes Figure 3 Schematic diagram of working status;

[0042] Figure 5 Here are the surface area layouts for the two types of circuit boards;

[0043] Figure 6 It is a structural diagram of the main frame in this embodiment;

[0044] Figure 7 is a structural diagram of the bonding module in this embodiment;

[0045] Figure 8 is a structural diagram of the bonding platform in this embodiment;

[0046] Figure 9 is a structural diagram of the translation module in this embodiment;

[0047] Figure 10 It is a structural diagram of the lifting module in this embodiment;

[0048] Figure 11 is a structural diagram of the mounting platform in this embodiment;

[0049] Figure 12 is a structural diagram of the pressing module in this embodiment;

[0050] Figure 13 is an exploded view of the press-fit module in this embodiment;

[0051] Figure 14 This is a structural diagram of the pressing module in the present embodiment in a standby state;

[0052] Figure 15 yes Figure 14 A schematic diagram showing the status of the circuit board is shown in the status;

[0053] Figure 16 This is a structural diagram of the pressing module in this embodiment in a pressing state;

[0054] Figure 17 This is a first perspective view of the detection and feeding module in this embodiment;

[0055] Figure 18 is a second perspective view of the detection and feeding module in this embodiment;

[0056] Figure 19 1 is a structural diagram of the X-axis moving module in the detection and feeding module of this embodiment;

[0057] Figure 20 This is a structural diagram of the Y-axis moving module in the detection and feeding module of this embodiment;

[0058] Figure 21 is a structural diagram of the carrying mechanism in the detection and feeding module of this embodiment;

[0059] Figure 22 1 is a structural diagram of the carrying mechanism and the connecting mechanism in the detection and feeding module of this embodiment;

[0060] Figure 23 Schematic diagram of the clamping mechanism in the detection and feeding module of this embodiment in the feeding and sucking position;

[0061] Figure 24 Schematic diagram of the clamping mechanism in the detection and feeding module of this embodiment in the feeding completion position;

[0062] Figure 25 2 is a structural diagram of the first covering film feeding module and the second covering film feeding module in this embodiment;

[0063] Figure 26 It is a structural diagram of the first covering film feeding module in this embodiment. DETAILED DESCRIPTION

[0064] The following description sets forth many specific details to facilitate a thorough understanding of the present invention. However, the present invention may also be implemented in other variations or alternative forms based on these details. Therefore, other possible implementations that may be known to those skilled in the art based on the embodiments described herein are all within the scope of protection of the present invention.

[0065] like Figure 1-3 As shown, the regional cover film laminating equipment of the embodiment includes a main frame 100, a circuit board conveying module 200, a first cover film feeding module 300, a second cover film feeding module 400, a laminating module 500, a pressing module 600, and a detection and feeding module 700. The circuit board conveying module 200 is used to convey circuit boards along the X-direction, while the laminating module 500, the pressing module 600, and the detection and feeding module 700 are arranged sequentially along the X-direction. The first cover film feeding module 300 and the second cover film feeding module 400 are located on opposite sides of the pressing module 600 along the Y-direction.

[0066] Among them, the first cover film feeding module 300 is used to continuously feed out the first cover film in sheet form; the second cover film feeding module 400 is used to continuously feed out the second cover film in sheet form; the laminating module 500 is used to absorb the first cover film from the first cover film feeding module 300 and laminate it to one surface area of ​​the circuit board, and absorb the second cover film from the second cover film feeding module 400 and laminate it to another surface area of ​​the circuit board; the first cover film and the second cover film laminated on multiple surface areas of the same surface of the circuit board are spliced ​​together to form an overall cover film; after the cover film is laminarized on the circuit board, it is transported to the pressing module 600 along with the circuit board for pressing and enters the detection and feeding module 700 for detection. Figure 5 The multiple surface area layouts of two types of circuit boards are shown, wherein one exemplary circuit board has two surface areas A1 and A2, the first covering film feeding module 300 is used to supply the first covering film to the A1 area, and the second covering film feeding module 400 is used to supply the second covering film to the A2 area; another exemplary circuit board has three surface areas A1, A2 and A3, wherein at least two of A1, A2 and A3 are the same, for example, A1 and A3 are the same, the first covering film feeding module 300 is used to supply the first covering film to the A1 and A3 areas, and the second covering film feeding module 400 is used to supply the second covering film to the A2 area.

[0067] It can be understood that in this embodiment, the first covering film feeding module 300 and the second covering film feeding module 400 can be used separately, that is, when the circuit board only needs to be laminated with a single type of covering film, one of the first covering film feeding module 300 and the second covering film feeding module 400 can be selected for use, and the other one of the first covering film feeding module 300 and the second covering film feeding module 400 is not used.

[0068] In this embodiment, the circuit board is specifically a roll-type flexible circuit board, which includes a plurality of continuously distributed circuit board units. The circuit board unit is also described as a "circuit board" in this disclosure; that is, the multiple surface areas of the circuit board should be understood as the multiple surface areas of the circuit board unit in this disclosure.

[0069] Please continue reading Figure 3The circuit board conveying module 200 includes a circuit board loading mechanism 210, a circuit board feeding mechanism 220 and a circuit board unloading mechanism 230; the circuit board loading mechanism 210 is arranged as a whole on the left side of the main frame 100 (the loading side of the circuit board) for loading the rolled circuit board; the circuit board feeding mechanism 220 is arranged on the main frame 100 adjacent to the circuit board loading mechanism 210 for sorting and conveying the circuit boards conveyed in the circuit board loading mechanism 210, and preferably can also perform dust removal. The circuit boards after passing through the circuit board feeding mechanism 220 enter the bonding module 500, the pressing module 600 and the detection and feeding module 700 in turn, and are finally reeled through the circuit board unloading mechanism 230; the circuit board unloading mechanism 230 is arranged as a whole on the right side of the main frame 100 (the receiving side of the circuit board) for receiving the circuit board; wherein, the circuit board conveying module 200 can refer to the conveying structure for loading and unloading circuit board rolls commonly used in the prior art, which will not be described in detail here.

[0070] like Figure 7 As shown, the bonding module 500 includes a bonding platform 510, a mounting head mechanism 520 and a bonding drive mechanism 530. The bonding platform 510 is located below the circuit board to be able to adsorb and fix the circuit board; specifically, as shown in FIG. Figure 8 As shown, an array of negative pressure adsorption holes is provided on the adsorption surface of the bonding platform 510, so that the circuit board can be adsorbed and fixed; the mounting head mechanism 520 is located above the circuit board, and is used to perform horizontal and vertical movements under the drive of the bonding drive mechanism 530 to absorb the first covering film and the second covering film, and bond the first covering film and the second covering film to the corresponding surface areas of the circuit board.

[0071] In an alternative embodiment, if Figure 6 As shown, the main frame 100 is provided with a first mounting portion 110; the bonding module 500 further includes a first mounting frame 540 detachably provided on the first mounting portion 110, and the first mounting frame 540 is used to install the bonding platform 510; Figure 8As shown, a bearing seat 541 and a plurality of mounting guide rods 542 are provided on the first mounting frame 540. The bonding platform 510 and the plurality of mounting guide rods 542 are slidably engaged with each other so as to be able to vertically lift and lower under the action of a driving force. Specifically, the number of mounting guide rods 542 is, for example, six, and the six mounting guide rods 542 are arranged in a 2x3 array to form a multi-point sliding engagement, thereby maintaining the smooth movement of the bonding platform 510. The bearing seat 541 is provided with a driving member 543 for driving the bearing seat 541 to rise and fall. The driving member 543 is, for example, a cylinder, a motor, or other actuator to drive the bearing seat 541 and the bonding platform 510 to rise and fall. Furthermore, a solenoid valve assembly 544 is also provided on the first mounting frame 540. The solenoid valve assembly 544 is used to control the presence or absence of negative pressure in the negative pressure adsorption holes on the bonding platform 510 to control the adsorption and release of the circuit board.

[0072] like Figure 7 、 Figure 9-10 As shown, the laminating drive mechanism 530 is specifically a three-axis motion mechanism, comprising a first translation frame 531, a translation module 532, a second translation frame 533, and a lifting module 534. The first translation frame 531 is mounted on the translation rail 120 of the main frame 100 and can be driven to slide in the Y direction. The translation module 532 is mounted on the first translation frame 531 to drive the second translation frame 533 and the lifting module 534 mounted on the second translation frame 533 to move in the X direction. The placement head mechanism 520 is connected to the lifting module 534 and is driven by the lifting module 534 to move up and down. This allows the placement head mechanism 520 to move to any position within the horizontal plane, which helps ensure the positional accuracy of the cover film lamination. The structures of the translation module 532 and the lifting module 534 are suitable for drive modules commonly used in the prior art, such as screw-type drive modules, which will not be elaborated here.

[0073] The mounting head mechanism 520 includes a mounting platform 521 adapted to the mounting platform 510. The mounting platform 521 has a negative pressure adsorption surface for absorbing the covering film from the first covering film feeding module 300 and the second covering film feeding module 400. Specifically, a negative pressure control system is provided on the mounting platform 521 for controlling the negative pressure adsorption of the mounting platform 521 to be turned on or off. The negative pressure control system can adopt the solenoid valve system commonly used in the prior art, which will not be elaborated here.

[0074] Specifically, a heating mechanism 550 may be provided on both the laminating platform 510 and the mounting platform 521. The heating mechanism 550 may include, for example, a heating tube, so that the sheet covering film can be laminated to the circuit board by heating and pressing. Accordingly, a temperature probe 560 may also be provided on the laminating platform 510 and the mounting platform 521. The heating temperature may be detected by the temperature probe 560 to control the heating temperature within an appropriate range.

[0075] Please continue reading Figure 10 In this embodiment, the bonding drive mechanism 530 further includes a turntable 535 for driving the mounting platform 521 to rotate. The turntable 535 is mounted on the lifting module 534 via a slip ring 536. The turntable 535 is preferably driven by a DD motor to drive the mounting platform 521 to rotate with high precision. Specifically, the mounting platform 521 is mounted on the turntable 535 via a spring floating assembly 570. Figure 11 As shown, the spring floating assembly 570 includes a plurality of sliding support seats 571 and a plurality of floating springs 572; the sliding support seat 571 is arranged on the mounting platform 521, and a vertical slide groove 573 is provided on the sliding support seat 571; an outwardly protruding sliding support shaft 574 is provided on the turntable 535, and the sliding support shaft 574 protrudes into the slide groove 573 in a horizontal manner and can slide vertically in the slide groove 573; the upper and lower ends of the floating spring 572 are respectively in contact with the turntable 535 and the mounting platform 521, so that the mounting platform 521 can perform a small range of elastic floating during the mounting process to maintain the mounting stability of the mounting platform 521.

[0076] For details, please refer to Figure 11 The turntable 535 is specifically in the shape of a square plate, and the number of sliding support seats 571 is, for example, four, and the four sliding support seats 571 are correspondingly located in the middle of the four sides of the turntable 535; correspondingly, the number of floating springs 572 is also four, and the four floating springs 572 are located at the four corners of the turntable 535 to form a floating fitting connection within the maximum spatial range.

[0077] In this embodiment, a first camera 537 is provided on the second translation frame 533 for detecting the exact position of the circuit board and the covering film to achieve precise alignment of the covering film and the circuit board; the first camera 537 can be a line scanning camera; the detection method of the first camera 537 is not limited here, so it will not be expanded.

[0078] Figure 12-16The structure of the pressing module 600 in the embodiment is shown. Specifically, the pressing module 600 includes a pressing frame 610 and an upper mold mechanism 620, a lower mold mechanism 630, a pressing heating mechanism 640, a lower mold driving mechanism 650 and a supporting mechanism 660 arranged on the pressing frame 610; a second mounting portion 130 is provided on the main frame 100, and the pressing frame 610 is arranged on the second mounting portion 130; the upper mold mechanism 620 and the lower mold mechanism 630 cooperate to perform the pressing operation of the circuit board, and the pressing heating mechanism 640 is used to heat when the upper mold mechanism 620 and the lower mold mechanism 630 are pressed; the lower mold driving mechanism 650 is used to drive the lower mold mechanism 630 to move toward the upper mold mechanism 620 in the vertical direction ( Figure 12 The support mechanism 660 is used to support the circuit board before and after lamination.

[0079] During lamination, the lower mold mechanism 630 moves upward, so that the circuit board with the cover film attached is pressed between the upper mold mechanism 620 and the lower mold mechanism 630, pressing the cover film onto the circuit board; after lamination is completed, the lower mold mechanism 630 moves downward, and the circuit board with the cover film attached is supported on the support mechanism 660 and naturally droops, such as Figure 15 As shown, they are separated from the upper mold mechanism 620 and the lower mold mechanism 630 respectively, and the circuit board with the laminated cover film is suspended in the middle and has no contact with the upper mold mechanism 620 and the lower mold mechanism 630, avoiding the heat still existing in the laminating heating mechanism 640 to cause damage to the circuit board.

[0080] Please continue reading Figure 13-14 The support mechanism 660 includes two support members 661, which are arranged on opposite sides of the upper mold mechanism 620 along the X direction to support the circuit board on both sides of the upper mold mechanism 620 and the lower mold mechanism 630; specifically, the two support members 661 are installed on the pressing frame 610 through the bracket 662, and the installation heights of the two support members 661 are preferably the same.

[0081] In this example, please continue to refer to Figure 13 The lower mold mechanism 630 includes a lower mold base 631 and a lower pressure plate 632; a plurality of vertical connecting guide rods 611 are provided on the pressing frame 610, and the lower mold base 631 is slidably set on the connecting guide rods 611 to form a movable connection with the pressing frame 610; wherein, the lower mold base 631 is preferably provided with a linear bearing 633 that cooperates with the connecting guide rods 611 to reduce the friction resistance of the cooperation; the lower pressure plate 632 is arranged above the lower mold base 631 to provide a pressing surface.

[0082] The upper mold mechanism 620 includes a protective cover 621, an upper mold base 622 and an upper pressure plate 623; the upper mold base 622 is fixed relative to the pressing frame 610, for example, it is installed on the mounting base located at the upper end of the connecting guide rod 611; the protective cover 621 is arranged above the mounting base and the upper mold base 622, and plays a protective and isolating role; the upper pressure plate 623 is arranged below the upper mold base 622 to provide a pressing surface; wherein, the support position of the two support members 661 in contact with the circuit board is preferably set to be flush with the pressing surface of the upper pressure plate 623 to facilitate the pressing operation.

[0083] Furthermore, the support member 661 is preferably a rotary support member to generate rolling when the circuit board is fed, thereby facilitating the transportation of the circuit board; preferably, the support member 661 is a roller that can perform rotary motion; under the rolling conveying structure in this embodiment, the support position where the support member 661 contacts the circuit board is specifically the top area of ​​the roller; in other embodiments, the support member 661 can also adopt a planar support or multi-point support structure, which will not be expanded here.

[0084] Please refer again Figure 13 In this embodiment, the pressing and heating mechanism 640 is arranged on the upper mold mechanism 620 and the lower mold mechanism 630; specifically, the pressing and heating mechanism 640 includes an upper heating tube 641 and a lower heating tube 642, the upper heating tube 641 is arranged on the upper mold base 622, and the lower heating tube 642 is arranged on the lower mold base 631, so as to perform coordinated heating when the circuit board is pressed; preferably, a sensor 624 for detecting pressure is also provided on the upper mold base 622, and the sensor 624 is, for example, a flat-plate force sensor.

[0085] In this embodiment, the lower die driving mechanism 650 includes a lower die driving motor 651, a horizontal screw rod 652, a horizontal slide rail 653 and a sliding member 654; Figure 13-14 、 Figure 16 As shown, the lower die drive motor 651 is preferably a servo motor, which is arranged on the pressing frame 610; the horizontal screw rod 652 is arranged on the pressing frame 610, and rotates under the drive of the lower die drive motor 651; wherein, a reducer 655 can also be provided at the output end of the lower die drive motor 651 to increase the smoothness of the drive; the number of horizontal slide rails 653 is preferably two groups, and the two groups of horizontal slide rails 653 are symmetrically arranged on the pressing frame 610 and located on opposite sides of the horizontal screw rod 652; the sliding member 654 is arranged on the horizontal slide rail 653 and is transmission-coordinated with the horizontal screw rod 652 to slide back and forth under the drive of the lower die drive motor 651 and the horizontal screw rod 652; wherein, a guide structure 654a is provided on the sliding member 654, and the guide structure 654a is used to abut against the lower die base 631 and drive the lower die base 631 to move up or down when the sliding member 654 slides.

[0086] Specifically, the guide structure 654a includes one or more guide surfaces 6541 of varying heights, and the lower die holder 631 is provided with a rolling element 634 that abuts against the guide surface 6541; wherein the guide surface 6541 preferably includes at least one of a guide slope and a guide arc surface. It is understood that the lower die holder 631 is supported on the guide surface 6541 of the sliding member 654 by the rolling element 634, and can move up or down as the height of the abutment position of the rolling element 634 and the guide surface 6541 changes; preferably, the rolling element 634 is a high-temperature resistant rolling bearing to maintain stability during long-term use; Figure 14 、 Figure 16 As shown, when the sliding member 654 slides, the contact position between the rolling member 634 and the guide surface 6541 changes, thereby driving the lower mold base 631 to move up or down, thereby realizing the reciprocating movement of the lower mold mechanism 630 in the vertical direction to complete the pressing operation.

[0087] In this embodiment, the horizontal screw rod 652 is arranged along the X direction. In other embodiments, the horizontal screw rod 652 can also be arranged along other directions, for example, the horizontal screw rod 652 can also be arranged along the X direction. Figure 12 The Y direction setting in the figure can be realized as long as the sliding member 654 can be driven to slide to drive the lower mold base 631 to move up or down. The sliding direction of the sliding member 654 is not restricted here.

[0088] Figure 17-24 The structure of the detection and feeding module 700 in the embodiment is shown. Specifically, the detection and feeding module 700 includes a second mounting frame 710, a supporting mechanism 720, a movement mechanism 730, a detection mechanism 740, and a clamping mechanism 750. The main frame 100 is provided with a third mounting portion 140, and the second mounting frame 710 is disposed on the third mounting portion 140.

[0089] The carrier mechanism 720 supports the circuit board; the motion mechanism 730 includes an X-axis moving module 731 and a Y-axis moving module 732 mounted on the X-axis moving module 731; the inspection mechanism 740 is mounted on the Y-axis moving module 732 and is used to inspect the circuit board; and the clamping mechanism 750 is mounted on the X-axis moving module 731 and is used to clamp the circuit board for feeding. Specifically, the circuit board conveying module 200 in this embodiment is passively conveyed, driven by the clamping mechanism 750; the circuit board conveying module 200 itself does not actively convey the circuit board.

[0090] Among them, before the detection mechanism 740 completes the detection of the circuit board, the clamping mechanism 750 does not clamp the circuit board; in this stage, the X-axis moving module 731 and the Y-axis moving module 732 in the motion mechanism 730 cooperate with each other to drive the detection mechanism 740 to move in the XY plane to detect the circuit board; after the detection mechanism 740 completes the detection of the circuit board, the clamping mechanism 750 clamps the circuit board; in this stage, the X-axis moving module 731 in the motion mechanism 730 drives the clamping mechanism 750 to move along the X direction, moving the circuit board clamped by the clamping mechanism 750 to a specified stroke for feeding, such as Figure 23-24 shown.

[0091] like Figure 19-20 As shown, the X-axis moving module 731 includes a first motor 7311, a first screw rod 7312, a first slide rail 7313 and a first sliding frame 7314; the first motor 7311 is arranged on the second mounting frame 710, the first screw rod 7312 is arranged on the second mounting frame 710 along the X direction and is connected to the output shaft of the first motor 7311, the first slide rail 7313 is arranged on the second mounting frame 710 and is parallel to the first screw rod 7312, and the first sliding frame 7314 is arranged on the first slide rail 7313 and is in transmission cooperation with the first screw rod 7312; specifically, a nut seat 7315 cooperating with the first screw rod 7312 is provided on the first sliding frame 7314.

[0092] like Figure 17 、 Figure 20 As shown, the Y-axis moving module 732 includes a second motor 7321, a second screw rod 7322, a second slide rail 7323 and a second sliding frame 7324; the second motor 7321 is arranged on the first sliding frame 7314, and the second screw rod 7322 is arranged on the first sliding frame 7314 along the Y direction and is connected to the output shaft of the second motor 7321. Specifically, a transmission belt assembly 7325 can also be set between the second motor 7321 and the second screw rod 7322 for power transmission; the second slide rail 7323 is arranged on the first sliding frame 7314 and is parallel to the second screw rod 7322, and the second sliding frame 7324 is arranged on the second slide rail 7323 and cooperates with the second screw rod 7322 for transmission.

[0093] Please continue reading Figure 20The inspection mechanism 740 includes a second camera 741 and a connecting seat 742. The second camera 741 is mounted on the second sliding frame 7324 via the connecting seat 742. The second camera 741 is located above the circuit board carried by the supporting mechanism 720. Driven by the coordinated operation of the X-axis moving module 731 and the Y-axis moving module 732, the second camera 741 performs optical inspection of the cover film pressed onto the circuit board to detect wrinkles, bubbles, and whether the film's reference points are in place. Compared to the prior art solution of placing the second camera 741 on the placement head mechanism 520, the inspection mechanism 740 utilizes an independent motion mechanism 730 to complete the inspection. The motion mechanism 730 can operate simultaneously with the placement head mechanism 520, greatly improving production efficiency.

[0094] The clamping mechanism 750 includes an upper clamping plate 751 and a lower clamping plate 752. At least one of the upper clamping plate 751 and the lower clamping plate 752 is a movable clamping plate to clamp the circuit board passing through the upper clamping plate 751 and the lower clamping plate 752. Figure 20 In this embodiment, the upper clamping plate 751 is a movable clamping plate, which moves from top to bottom to clamp the circuit board; wherein, the clamping mechanism 750 also includes a clamping cylinder 753 for driving the movable clamping plate to perform a clamping action, and the clamping cylinder 753 is installed on the lower clamping plate 752; specifically, the number of the clamping cylinders 753 is two, and the upper clamping plate 751 is preferably a long strip, and the two clamping cylinders 753 act on the two ends of the upper clamping plate 751 respectively to maintain the stability of clamping the circuit board.

[0095] like Figure 17 、 Figure 21-22 As shown, the supporting mechanism 720 includes two carriers 721 mounted on the second mounting frame 710. The two carriers 721 are arranged on opposite sides of the motion mechanism 730 along the X-direction. The carriers 721 are provided with platforms 7211, on which the circuit board can be supported. Furthermore, the carriers 721 are provided with a pressing member 7212 and a pressing cylinder 7213. The pressing cylinder 7213 is used to drive the pressing member 7212 to press the circuit board against the platform 7211 to maintain the position of the circuit board. Preferably, when the circuit board is not being fed, the pressing member 7212 maintains the circuit board pressed against the platform 7211.

[0096] The supporting mechanism 720 in this embodiment further includes two rollers 722 for supporting the circuit board; wherein the two rollers 722 are located on the opposite outer sides of the two pressing members 7212 to form rolling support when the circuit board is fed, thereby facilitating the transportation of the circuit board.

[0097] This embodiment also has a connecting mechanism 760, which is used to connect circuit boards of different rolls; the connecting mechanism 760 is set on the carrier 721; Figure 17 、 Figure 21 As shown, the docking mechanism 760 includes a docking platform 761 and a positioning member 762 for positioning the circuit board on the docking platform 761, wherein the docking platform 761 is set on the carrier 721 and is flush with the carrier 7211; the positioning member 762 is preferably a cylinder-driven bar positioning member to better press and position the circuit board to be docked. Preferably, as Figure 2 As shown, in this embodiment, a docking mechanism 760 is also provided at the circuit board feeding mechanism 220 to provide more docking positions.

[0098] Specifically, a ruler 763 is provided on the docking platform 761 to facilitate alignment of the circuit boards to be docked.

[0099] Figures 25-26 The structure of the first covering film supply module 300 and the second covering film supply module 400 of an embodiment is shown. The structures of the first covering film supply module 300 and the second covering film supply module 400 are preferably identical, and the covering films they supply can be the same or different types. Specifically, the covering films they supply are half-cut covering film rolls, eliminating the need for further cutting. The specific structure of the first covering film supply module 300 is described below, using the example of the first covering film supply module 300.

[0100] Please continue reading Figure 25 The first covering film feeding module 300 includes a covering film feeding frame 310, a unwinding mechanism 320, a peeling mechanism 330 and a winding mechanism 340; wherein, a fourth mounting portion 150 is provided on the main frame 100, and the covering film feeding frame 310 is arranged on the fourth mounting portion 150; the unwinding mechanism 320 is used to supply a film including a covering film and a base film (such as a release film), the film is half-cut and the covering film makes the covering film on the base film present an independent sheet structure; the peeling mechanism 330 is used to peel off the covering film and the release film; the winding mechanism 340 is used to collect the release film after peeling off the covering film; in this embodiment, the unwinding mechanism 320 and the winding mechanism 340 can refer to the roller system commonly used in the prior art for loading and unloading covering film rolls, which will not be elaborated here; the peeling mechanism 330 includes a moving frame 331, a stripping platform 332, a storage platform 333 and a covering film suction component 334.

[0101] The movable frame 331 is slidably mounted on the cover film feeding frame 310 along the cover film feeding direction (specifically, the negative direction of the X direction). The stripping platform 332 and the storage platform 333 are spaced apart on the movable frame 331 along the cover film feeding direction. In the cover film feeding direction, the stripping platform 332 is located upstream, and the storage platform 333 is located downstream. The cover film suction assembly 334 is fixedly mounted on the cover film feeding frame 310 to suck the cover film on the stripping platform 332 during the reciprocating movement of the movable frame 331 and transfer the sucked cover film to the storage platform 333. Specifically, the cover film suction assembly 334 includes a plurality of vacuum suction nozzles 3341, wherein the plurality of vacuum suction nozzles 3341 are preferably arranged in a linear manner to suck the edges of the cover film, thereby facilitating the pulling and peeling of the cover film from the release film.

[0102] The stripping platform 332 forms a tip adjacent to the side of the storage platform 333 to facilitate separation of the release film and the covering film; specifically, after the covering film is stripped at the tip, the release film is conveyed downward until it is received by the winding mechanism 340.

[0103] In this embodiment, the movable frame 331 has a suction position, a first peeling position and a second peeling position; when the movable frame 331 is in the suction position, the stripping platform 332 and the storage platform 333 are both located on one side of the covering film suction component 334, and at this time, the storage platform 333 corresponds to the bonding platform 510 in the bonding module 500; when the movable frame 331 is in the first peeling position, the stripping platform 332 moves to the bottom of the covering film suction component 334, and at this time the covering film suction component 334 can suck the covering film on the stripping platform 332; when the movable frame 331 is in the second peeling position, the storage platform 333 moves to the bottom of the vacuum suction nozzle, and at this time the covering film suction component 334 can place the sucked covering film on the storage platform 333, and the storage platform 333 adsorbs and fixes the covering film by negative pressure; wherein, the movable frame 331 cyclically moves between the suction position, the first peeling position, the second peeling position and the suction position to complete the peeling of the covering film.

[0104] The process of the peeling mechanism 330 peeling the covering film from the release film is as follows: 1) The moving frame 331 moves from the suction position to the first peeling position, and transports the covering film on the stripping platform 332 to the covering film suction component 334, and the covering film is sucked and fixed by the covering film suction component 334; 2) The moving frame 331 moves from the first peeling position to the second peeling position, and the covering film suction component 334 relaxes the peeled covering film and performs negative pressure suction on the covering through the storage platform 333; in the above process, the covering film is sucked and fixed by the covering film suction component 334 and is continuously peeled off from the release film to transfer the covering film to the storage platform 333; 3) The moving frame 331 moves from the second peeling position to the suction position, waiting for the mounting head mechanism 520 in the bonding module 500 to suck the covering film from the storage platform 333.

[0105] Furthermore, the first covering film feeding module 300 further includes a self-adjusting mechanism 350 for maintaining a stable loading of the covering film roll during the reciprocating motion of the moving frame 331; the self-adjusting mechanism 350 is disposed between the unwinding mechanism 320 and the peeling mechanism 330; Figure 26 As shown, the self-adjusting mechanism 350 includes a self-adjusting roller 351, and during the reciprocating movement of the movable frame 331, the self-adjusting roller 351 can freely move up and down; further, the self-adjusting mechanism 350 also includes a lifting guide rod 352, and the self-adjusting roller 351 can be freely slidably arranged on the lifting guide rod 352; wherein, the covering film roll conveyed by the unwinding mechanism 320 bypasses the self-adjusting roller 351 and is conveyed to the stripping mechanism 330; during the reciprocating movement of the movable frame 331, the self-adjusting roller 351 generates corresponding rise or fall to maintain the smooth unwinding, which is more conducive to maintaining the stability of the covering film stripping process.

[0106] Although the present invention has been disclosed above with reference to specific embodiments, these embodiments are not intended to limit the scope of the present invention. Any person skilled in the art may make changes or modifications without departing from the scope of the present invention. Therefore, any equivalent changes or modifications made in accordance with the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A regional cover film laminating device for laminating multiple surface areas of a circuit board; The regional covering film laminating equipment includes: A circuit board conveying module, used for conveying circuit boards; A first covering film feeding module, used for continuously feeding out a sheet of the first covering film; A second covering film feeding module, used for continuously feeding out a sheet of the second covering film; a laminating module, configured to suck a first cover film from the first cover film feeding module and laminate the first cover film to one surface area of ​​the circuit board, and to suck a second cover film from the second cover film feeding module and laminate the second cover film to another surface area of ​​the circuit board; The first covering film feeding module and the second covering film feeding module each include a covering film feeding frame, an unwinding mechanism, a peeling mechanism and a winding mechanism; The covering film feeding frame is arranged on the main frame of the regional covering film laminating equipment; The unwinding mechanism is used to supply a film including a cover film and a release film; The peeling mechanism is used to peel off the cover film and the release film; The winding mechanism is used to collect the release film after peeling off the cover film; The regional cover film laminating device further includes a pressing module; the pressing module includes an upper mold mechanism, a lower mold mechanism, a pressing heating mechanism, a lower mold driving mechanism and a supporting mechanism; The lower mold mechanism is driven by the lower mold driving mechanism to reciprocate in the vertical direction toward the upper mold mechanism; the pressing heating mechanism heats the upper mold mechanism and the lower mold mechanism when they are pressed together; the supporting mechanism is used to support the circuit board between the upper mold mechanism and the lower mold mechanism; During pressing, the lower mold mechanism moves upward, and the circuit board supported on the supporting mechanism is pressed by the upper mold mechanism and the lower mold mechanism; after pressing is completed, the lower mold mechanism moves downward, and the circuit board is supported on the supporting mechanism and naturally droops, thereby separating from the upper mold mechanism and the lower mold mechanism respectively.

2. The regional covering film laminating device according to claim 1, characterized in that: The stripping mechanism includes a movable frame, a stripping platform, a storage platform and a covering film suction component; the movable frame can be slidably arranged on the covering film feeding frame along the covering film feeding direction, and the stripping platform and the storage platform are spaced apart on the movable frame along the covering film feeding direction; the covering film suction component is fixedly arranged on the covering film feeding frame to suck the covering film located on the stripping platform during part of the reciprocating movement of the movable frame, and transfer the sucked covering film to the storage platform.

3. The regional covering film laminating device according to claim 2, characterized in that: The movable frame has a suction position, a first peeling position and a second peeling position; When the movable frame is in the suction position, the stripping platform and the material storage platform are both located on one side of the covering film suction assembly. At this time, the material storage platform corresponds to the laminating module; When the movable frame is in the first stripping position, the stripping platform moves to a position below the covering film suction component, and the covering film suction component is able to suck the covering film on the stripping platform; When the movable frame is in the second peeling position, the material storage platform moves to the bottom of the covering film suction component. At this time, the covering film suction component can place the sucked covering film on the material storage platform, and the material storage platform adsorbs and fixes the covering film by negative pressure.

4. The regional covering film laminating device according to claim 3, characterized in that: The first covering film feeding module and the second covering film feeding module also include a self-adjusting mechanism for keeping the film roll unwinding smoothly during the reciprocating motion of the movable frame; the self-adjusting mechanism is arranged between the unwinding mechanism and the peeling mechanism, and includes a self-adjusting roller; during the reciprocating motion of the movable frame, the self-adjusting roller can move freely up and down.

5. The regional covering film laminating device according to claim 1, characterized in that: The bonding module includes a bonding platform, a bonding head mechanism and a bonding drive mechanism; the bonding platform is located below the circuit board to absorb and fix the circuit board; the bonding head mechanism is located above the circuit board and is used to perform horizontal and lifting movements under the drive of the bonding drive mechanism to absorb the first cover film and the second cover film, and bond the first cover film and the second cover film to corresponding surface areas of the circuit board.

6. The regional covering film laminating device according to claim 5, characterized in that: The placement head mechanism includes a placement platform; the placement drive mechanism is provided with a turntable, and the placement platform is arranged on the turntable via a spring floating mechanism; The spring floating mechanism includes a plurality of sliding support seats and a plurality of floating springs; The sliding support seat is arranged on the mounting platform; a vertical slide groove is provided on the sliding support seat; an outwardly protruding sliding support shaft is provided on the turntable, and the sliding support shaft protrudes into the slide groove and is restricted to vertically slide in the slide groove; The upper and lower ends of the floating spring are respectively in contact with the turntable and the mounting platform.

7. The regional cover film laminating device according to claim 1, characterized in that: The pressing module also includes a plurality of vertical connecting guide rods, and the lower mold mechanism is slidably arranged on the connecting guide rods; wherein, the lower mold driving mechanism includes a slide rail and a sliding member arranged on the slide rail, and a guide structure is provided on the sliding member; the lower mold mechanism and the guide structure are abutted and matched, so that when the sliding member slides, the lower mold mechanism is driven by the guide structure to move up or down along the connecting guide rods.

8. The regional covering film laminating device according to claim 7, characterized in that: The guide structure includes a guide surface with a varying height, and the lower mold mechanism is provided with a rolling member that abuts against the guide surface; wherein, when the sliding member slides, the abutting position of the rolling member and the guide surface changes.

9. The regional covering film laminating device according to claim 1, characterized in that: The regional covering film laminating equipment also includes a detection and feeding module; the detection and feeding module includes a carrying mechanism, a moving mechanism, a detection mechanism and a clamping mechanism; the carrying mechanism is used to support the circuit board; the moving mechanism includes an X-axis moving module and a Y-axis moving module installed on the X-axis moving module; the detection mechanism is arranged on the Y-axis moving module to detect the flexible circuit board supported by the carrying mechanism; the clamping mechanism is arranged on the X-axis moving module, used to clamp the circuit board after the detection mechanism detects the circuit board, and move a specified stroke along the X-direction for feeding.

Images