Method for manufacturing circuit board and circuit board

Abstract

Embodiments of the present invention relate to the technical field of circuit board manufacturing processes, and disclose a method for manufacturing a circuit board and a circuit board, including preparing a substrate, providing a selective soldering jig and a plurality of IGBT components, placing the plurality of IGBT components on a first surface, with one IGBT component located at a soldering position, plugging a pin of an IGBT component into a first socket, placing the substrate with the plurality of IGBT components on a first base plate assembly, placing a pressure plate assembly on one side of the first base plate assembly, placing a functional board assembly on the other side of the first base plate assembly, and abutting an IGBT component with the other end of an elastic abutment member passing through the first base plate assembly and a first through hole to push the IGBT component toward the abutment block, soldering the pins of the plurality of IGBTs to a second surface through a first soldering port, and after soldering the pins of the plurality of IGBTs is completed, removing the selective soldering jig to obtain a circuit board. Through the above-described method, the embodiments of the present invention can ensure that after soldering, the plane of the plurality of IGBT components facing away from the substrate is in the same plane.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of circuit board manufacturing processes, and in particular to a method for manufacturing a circuit board and a circuit board. Background Art

[0002] A photovoltaic inverter is an electrical device used in photovoltaic power generation systems, responsible for converting the direct current (DC) generated by photovoltaic modules into alternating current (AC). IGBTs are crucial components in photovoltaic inverters. The inverter's circuit board typically integrates multiple IGBTs, located on the same side of the board. However, IGBTs are high-power and generate a lot of heat. Therefore, photovoltaic inverters incorporate a heat sink that abuts the multiple IGBTs to dissipate heat. When multiple IGBTs directly abut the heat sink, they must be located on the same plane. If they are not located on the same plane, the contact areas between the IGBTs and the heat sink vary, making it very easy for some IGBTs to have insufficient contact with the heat sink, resulting in insufficient heat dissipation for some IGBTs.

[0003] However, in the process of implementing the embodiments of the present invention, the inventors found that: currently, when soldering IGBT components to the substrate of the circuit board, the main method is: first manually insert the IGBT components into the substrate, and then solder the IGBT components to the substrate. When soldering the IGBT components to the substrate, visually check whether the multiple IGBT components are in the same plane, and adjust them while soldering. This visual inspection method makes it difficult to ensure that the multiple IGBT components are in the same plane, which will affect the subsequent heat dissipation effect of the multiple IGBT components. Summary of the Invention

[0004] The main technical problem solved by the embodiments of the present invention is to provide a method for manufacturing a circuit board and a circuit board. When manufacturing the circuit board, multiple IGBT components are ensured to be on the same plane, thereby not affecting the heat dissipation effect of subsequent multiple IGBT components.

[0005] To solve the above technical problems, a technical solution adopted in an embodiment of the present invention is: a method for manufacturing a circuit board, comprising:

[0006] Manufacturing a substrate, wherein the substrate has a first surface and a second surface, the first surface is provided with a plurality of welding positions, the substrate is further provided with a plurality of first through holes and a plurality of first insertion holes, the plurality of first through holes and the plurality of first insertion holes both pass through the first surface and the second surface, and a first through hole and a first insertion hole are located at a welding position;

[0007] A selective soldering jig and several IGBT components are provided, wherein the selective soldering jig includes a first base plate assembly, a pressure plate assembly, and a functional plate assembly. The pressure plate assembly includes a pressure plate and a height limiting column. One end of the height limiting column is disposed on a surface of the pressure plate. A plurality of abutment blocks extend from the surface of the pressure plate. The plurality of abutment blocks are flush with the surface facing away from the pressure plate. The functional plate assembly includes a functional plate and several elastic abutment members. One end of the elastic abutment member is disposed on the functional plate. The functional plate is provided with several first welding ports.

[0008] Arrange a plurality of IGBT components on the first surface, with one IGBT component located at a welding position and a pin of the IGBT component plugged into a first socket;

[0009] Placing a substrate with a plurality of IGBT components on a first base plate assembly;

[0010] The pressure plate assembly is arranged on one side of the first base plate assembly, wherein the other end of the height-limiting column abuts against the first base plate assembly, and an abutting block corresponds to an IGBT component;

[0011] The function board assembly is arranged on the other side of the first base plate assembly, and the other end of an elastic abutment member passes through the first base plate assembly and a first through hole and abuts against an IGBT component to push the IGBT component toward the abutment block, wherein a surface of the IGBT component facing away from the substrate abuts against a surface of the abutment block facing away from the pressure plate, and a pin of the IGBT component is exposed at a first welding joint;

[0012] Soldering a plurality of IGBT pins to the second surface through the first welding port;

[0013] After the pins of several IGBTs are soldered, the selective soldering jig is removed to obtain the circuit board.

[0014] Optionally, the first bottom plate assembly includes a first bottom plate and a first pressing fastener, a placement groove is provided on one side of the first bottom plate, and the first pressing fastener is provided on one side of the first bottom plate;

[0015] The step of placing a plurality of IGBT components and a substrate on a first base plate assembly includes: placing the substrate with the plurality of IGBT components into a placement groove;

[0016] The first pressing member is controlled to press the surface of the substrate away from the placement groove to fix the substrate in the placement groove.

[0017] Optionally, the first base plate assembly further includes a second pressing fastener, which is disposed on one side of the base plate;

[0018] The step of arranging the pressure plate assembly on one side of the first base plate assembly further includes:

[0019] The pressure plate cover is arranged on one side of the first bottom plate, wherein the other end of the height-limiting column abuts against the first bottom plate;

[0020] The second pressing member is controlled to press the surface of the pressing plate away from the first bottom plate, so as to fix the pressing plate to the first bottom plate.

[0021] Optionally, the step of manufacturing the substrate further includes:

[0022] Provided are an original board, a first SMT component, a second SMT component, an insert component, and a wave soldering jig, wherein the original board is provided with a second jack, a plurality of soldering positions, a plurality of first through holes, and a plurality of first jacks are provided on the original board, the wave soldering jig includes a cover plate assembly and a second base plate assembly, the second base plate assembly is provided with a second solder opening, and the original board has a first surface and a second surface;

[0023] Bake the original plate;

[0024] Mounting the first SMT component on the second surface of the original board;

[0025] Mounting a second SMT component on the first surface of the original board;

[0026] Insert the pins of the plug-in device into the second socket along the direction from the first surface to the second surface;

[0027] Placing the original board with the plug-in device on the second base plate assembly, and the second base plate assembly covers the second SMT device;

[0028] The cover plate assembly is detachably fixed to the second base plate assembly, the cover plate assembly abuts against the second surface of the original board with the plug-in component, and the pins of the plug-in component are exposed in the second welding opening;

[0029] The pins of the plug-in device are welded to the original board through the second welding opening to obtain a base board.

[0030] Optionally, the original plate is provided with a second through hole;

[0031] The second base plate assembly includes a second base plate and a limiting block, the second base plate is provided with a first screw hole, the limiting block is provided on the second base plate, the limiting block is provided with a first limiting groove, the cover plate assembly includes a cover plate, a support member and a tightening screw, one end of the support member is provided on the cover plate, the tightening screw is provided on the cover plate, and the second welding opening is provided on the second base plate;

[0032] The step of placing the original board with plug-in components on the second baseboard assembly,

[0033] Place the original board with plug-in components on the second base board;

[0034] The step of detachably fixing the cover plate assembly to the second base plate assembly further includes:

[0035] Insert the support member into the first limiting groove;

[0036] The tightening screw is passed through the second through hole and then screwed into the first screw hole, wherein the tightening screw abuts against the second surface of the original board with the plug-in device.

[0037] Optionally, the step of mounting the first SMT component on the second surface of the original board further includes:

[0038] Provide the first solder paste and placement machine;

[0039] Apply the first solder paste to the second surface of the original board;

[0040] The original board coated with the first solder paste is placed in a placement machine, the placement machine attaches the first SMT component to the first solder paste, and the placement machine heats the first solder paste to solder the first SMT component to the second surface of the original board.

[0041] Optionally, the second surface of the original plate is provided with a first mark;

[0042] The step of applying the first solder paste to the second surface of the original board further includes:

[0043] Providing a first steel mesh, wherein the first steel mesh is provided with a second mark;

[0044] attaching the first steel mesh to the second surface, with the second mark aligned with the first mark;

[0045] Applying the first solder paste to the first steel mesh to apply the first solder paste to the second surface;

[0046] After the first solder paste is solidified, remove the first steel mesh.

[0047] Optionally, the step of mounting the second SMT component on the first surface of the original board further includes:

[0048] Provide a second solder paste;

[0049] Apply the second solder paste to the first surface of the original board;

[0050] The original board coated with the second solder paste is placed in a placement machine, and the placement machine attaches the second SMT component to the second solder paste, and the placement machine heats the second solder paste to solder the second SMT component to the first surface of the original board.

[0051] Optionally, the first surface of the original plate is provided with a third mark;

[0052] The step of applying the second solder paste to the second surface of the original board further includes:

[0053] providing a second steel mesh, wherein the second steel mesh is provided with a fourth mark;

[0054] attaching a second steel mesh to the first surface, with the fourth mark aligned with the third mark;

[0055] Applying the second solder paste to the second steel mesh to apply the second solder paste to the first surface;

[0056] After the second solder paste solidifies, remove the second stencil.

[0057] In order to solve the above technical problem, another technical solution adopted in an embodiment of the present invention is: providing a circuit board, which is prepared by using the above method.

[0058] The beneficial effects of the embodiments of the present invention are: different from the prior art, the embodiments of the present invention fix the substrate with the plurality of IGBT components to the first base plate assembly before soldering the pins of the plurality of IGBT components to the substrate, and an elastic abutment abuts against an IGBT component to push the IGBT component toward the abutment block, so that the surface of an IGBT component facing away from the substrate abuts against the surface of an abutment block facing away from the pressure plate. Since the surfaces of the plurality of abutment blocks facing away from the pressure plate are flush, the surfaces of the plurality of IGBT components facing away from the substrate are ensured to be in the same plane, thereby not affecting the subsequent heat dissipation effect of the plurality of IGBTs, and at the same time, improving the production efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly describes the drawings required for describing the specific embodiments or the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0060] Figure 1 1 is a schematic structural diagram of a selective welding jig provided in an embodiment of the present invention;

[0061] Figure 2 2. It is a schematic diagram of the structure explosion of the selective welding jig provided by an embodiment of the present invention;

[0062] Figure 3 1 is a schematic exploded view of the structure of a first pressing fastener in a first base plate assembly in a selective welding jig provided by an embodiment of the present invention;

[0063] Figure 4 1 is a schematic exploded view of the structure of a first pressing fastener in a second base plate assembly in a selective welding jig provided by an embodiment of the present invention;

[0064] Figure 5 1 is a schematic structural diagram of a cover plate assembly in a selective welding jig provided by an embodiment of the present invention;

[0065] Figure 6 Schematic diagram of the structure explosion of the wave soldering fixture provided by an embodiment of the present invention;

[0066] Figure 7 This is a front view of a circuit board provided by an embodiment of the present invention;

[0067] Figure 8 is a rear view of a circuit board provided in an embodiment of the present invention;

[0068] Figure 9 This is a flow chart of a method for manufacturing a circuit board according to embodiment 1 of the present invention;

[0069] Figure 10 This is a flow chart of a method for manufacturing a circuit board according to a second embodiment of the present invention;

[0070] Figure 11 This is a flow chart of a method for manufacturing a circuit board according to a third embodiment of the present invention;

[0071] Figure 12 yes Figure 11 Detailed flowchart of step 12 in FIG.

[0072] Figure 13 yes Figure 12 Detailed flowchart of step 122;

[0073] Figure 14 yes Figure 11 Detailed flowchart of step 13 in FIG.

[0074] Figure 15 yes Figure 14 Detailed flowchart of step 132;

[0075] Figure 16 This is a flow chart of a method for manufacturing a circuit board according to a fourth embodiment of the present invention;

[0076] Figure 17 This is a flow chart of a method for manufacturing a circuit board according to a fifth embodiment of the present invention;

[0077] Figure 18 This is a flow chart of a method for manufacturing a circuit board according to a sixth embodiment of the present invention;

[0078] Figure 19 This is a flow chart of a method for manufacturing a circuit board according to embodiment 7 of the present invention.

[0079] Description of reference numerals:

[0080] 100. Select welding fixture; 11. First base plate assembly; 111. First base plate; 1111. Placement groove; 112. First pressing fastener; 1121. First abutting member; 1122. Fixed shaft; 1123. Fixed ring; 1124. First elastic member; 1125. Receiving groove; 1126. Third through hole; 113. Second pressing fastener; 1131. Limiting seat; 1132. Second abutting member; 1133. Bolt; 1134. Slide; 1135. Second screw hole; 1136. Second limiting groove; 1137. Fourth through hole; 1138. Protrusion; 114. Transmission bar; 12. Press Plate assembly; 121, pressure plate; 1211, slot; 1212, abutment block; 122, height limiting column; 13, function plate assembly; 131, function plate; 1311, first welding opening; 132, elastic abutment; 1321, abutment column; 1322, second elastic member; 200, wave soldering fixture; 21, second base plate assembly; 211, second base plate; 2111, first screw hole; 2112, second welding opening; 212, limiting block; 2121, first limiting groove; 22, cover plate assembly; 221, cover plate; 222, support member; 223, tensioning screw; 23, straightening assembly. 300, circuit board; 31, original board; 311, first mark; 312, third mark; 32, IGBT component; 33, first SMT component; 34, second SMT component; 35, plug-in component; 36, production mark. DETAILED DESCRIPTION

[0081] For ease of understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed on" another element, it can be directly on the other element or there can be one or more centered elements therebetween. When an element is described as being "connected" to another element, it can be directly connected to the other element or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "inside", "outside", "vertical", "horizontal", etc. used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0082] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0083] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0084] To facilitate readers' understanding of the present invention, the structures of the selective soldering jig 100 , the wave soldering jig 200 , and the circuit board 300 provided for manufacturing the circuit board are described in detail below.

[0085] See also Figure 1 and Figure 2 The selective welding jig 100 includes a first base plate assembly 11, a pressure plate assembly 12, and a functional plate assembly 13. The pressure plate assembly 12 is arranged on one side of the first base plate assembly 11. When welding the plurality of IGBTs to the substrate, a portion of the pressure plate assembly 12 abuts against the surface of the plurality of IGBT components 32 facing away from the substrate, so that the surfaces of the plurality of IGBT components 32 facing away from the substrate are in the same plane. The functional plate assembly 13 is arranged on the other side of the first base plate assembly 11. The functional plate assembly 13 is used to push the plurality of IGBT components 32 toward the pressure plate assembly 12 to prevent the surface of the IGBT components 32 from not abutting against a portion of the pressure plate assembly 12.

[0086] For the first base plate assembly 11, please refer to Figure 2-Figure 4The first base plate assembly 11 includes a first base plate 111, a first pressing member 112, a second pressing member 113 and a conveying bar 114. The first base plate 111 is provided with a placement groove 1111, and the placement groove 1111 is used to place a substrate with a plurality of IGBT elements 32. The first pressing member 112 includes a first abutment member 1121, a fixed shaft 1122, a fixed ring 1123 and a first elastic member 1124. The first abutment member 1121 is provided on one side of the first base plate 111, and the first abutment member 1121 can rotate relative to the first base plate 111. The first abutment member 1121 is provided with a receiving groove 1125 and a third through hole 1126. The third through hole 1126 is provided at the bottom of the receiving groove 1125, and the third through hole 1126 is connected to the receiving groove 1125. One end of the fixed shaft 1122 is disposed on the first base plate 111, and the other end of the fixed shaft 1122 passes through the third through hole 1126 and the receiving groove 1125 in sequence. The fixing ring 1123 is connected to the other end of the fixed shaft 1122. The first elastic member 1124 is sleeved on the fixed shaft 1122, and one end of the first elastic member 1124 abuts against the surface of the fixing ring 1123, and the other end of the first elastic member 1124 abuts against the bottom of the receiving groove 1125. When the substrate with the plurality of IGBT components 32 is placed in the placement groove 1111, the first abutting member 1121 is used to press the surface of the substrate with the plurality of IGBT components 32 away from the placement groove 1111, so as to fix the substrate with the plurality of IGBT components 32 in the placement groove 1111. The second pressing member 113 includes a limit seat 1131, a second abutting member 1132 and a bolt 1133. A limiting seat 1131 is disposed on one side of the first base plate 111. The limiting seat 1131 is provided with a slide groove 1134, a second screw hole 1135, and a second limiting groove 1136. The slide groove 1134 communicates with the second limiting groove 1136, and the second screw hole 1135 is disposed at the bottom of the slide groove 1134. A second abutting member 1132 is received in the slide groove 1134 and is slidable relative to the slide groove 1134. The second abutting member 1132 is provided with an elongated fourth through hole 1137 and a protrusion 1138 disposed at one end of the second abutting member 1132. A bolt 1133 passes through the fourth through hole 1137 and is threadedly engaged with the second screw hole 1135. When the bolt 1133 is screwed to the first depth of the second screw hole 1135, the second abutment 1132 is locked to the stopper 1131. When the bolt 1133 is screwed to the second depth of the second screw hole 1135, the second abutment 1132 and the stopper 1131 are loosened. Under the action of an external force, the second abutment 1132 slides along the slide groove 1134, and the first depth is greater than the second depth. The conveyor bar 114 is provided on the other side of the first base plate 111. The conveyor bar 114 is used to connect to the track of the welding equipment to transport the selective welding jig 100 in and out of the welding equipment.

[0087] In some embodiments, there are multiple first pressing members 112 , and the multiple first pressing members 112 are disposed around one side of the first bottom plate 111 .

[0088] For the above-mentioned pressure plate assembly 12, see Figure 2 and Figure 5 The pressure plate assembly 12 includes a pressure plate 121 and a height-limiting column 122. A slot 1211 is provided on the surface of the pressure plate 121 facing away from the first base plate 111, and the protrusion 1138 is inserted into the slot 1211 to fix the pressure plate 121 to the first base plate 111. One end of the height-limiting column 122 is provided on the surface of the pressure plate 121 facing the first base plate 111, and the height-limiting column 122 is used to abut against the first surface of the substrate. A plurality of abutting blocks 1212 extend from one surface of the pressure plate 121, and the plurality of abutting blocks 1212 are flush with the surface facing away from the pressure plate 121, and the abutting blocks 1212 are used to abut against the surface of the IGBT element 32 facing away from the substrate.

[0089] For the above function board assembly 13, please refer to Figure 2 The function board assembly 13 includes a function board 131 and a plurality of elastic abutting members 132. The function board 131 is provided with a plurality of first welding openings 1311. The elastic abutting member 132 includes an abutting column 1321 and a second elastic member 1322. One end of the abutting column 1321 is provided on the function board 131. One end of the abutting column 1321 can move relative to the function board 131. Along the direction from one end of the abutting column 1321 to the other end, the cross-sectional area of one end of the abutting column 1321 is smaller than the cross-sectional area of the other end of the abutting column 1321. The second elastic member 1322 is sleeved on one end of the abutting column 1321. One end of the second elastic member 1322 abuts against the surface of the other end of the abutting column 1321, and the other end of the second elastic member 1322 abuts against the surface of the other side of the function board 131. When the substrate with several IGBT elements 32 is pressed against the placement groove 1111 by the pressure plate assembly 12, the abutment column 1321 is used to abut against the IGBT element 32 to push the IGBT element 32 toward the abutment block 1212, so that the surface of the IGBT facing away from the substrate abuts against the surface of the abutment block 1212 facing away from the pressure plate 121.

[0090] See also Figure 6The wave soldering jig 200 includes a second base plate assembly 21 and a cover plate assembly 22. The cover plate assembly 22 is arranged on one side of the second base plate assembly 21. The second base plate assembly 21 is used to place the original board 31 with the plug-in component 35. The second base plate assembly 21 includes a second base plate 211 and a limit block 212. The second base plate 211 is provided with a first screw hole 2111 and a plurality of second welding openings 2112. The second welding openings 2112 are used to facilitate the welding equipment to weld the pins of the plug-in component 35 to the original board 31. The second base plate 211 covers the second SMT component 34. The limit block 212 is provided on the second base plate 211. The limit block 212 is provided with a first limit groove 2121. The cover assembly 22 includes a cover 221, a support member 222 and a tightening screw 223. One end of the support member 222 is arranged on the cover 221. The support member 222 is inserted into the first limiting groove 2121 so that there is an accommodating space between the cover 221 and the second base plate 211 for placing the plug-in component 35. The tightening screw 223 is arranged on the cover 221. The tightening screw 223 passes through the second through hole of the original plate 31 and is screwed to the first screw hole 2111. The tightening screw 223 abuts the second surface of the original plate 31 with the plug-in component 35 to avoid deformation of the original plate 31 due to the excessive weight of the original plate 31 with the plug-in component 35, which causes tin bubbling during wave soldering, affecting the welding quality.

[0091] In some embodiments, the number of cover plate assemblies 22 is two, and the wave soldering jig 200 also includes a straightening assembly 23. The two cover plate assemblies 22 are spaced apart on one side of the second base plate assembly 21. One end of the straightening assembly 23 is set on the cover plate assembly 22 corresponding to the functional element of the plug-in device 35. The functional element can be a communication board, a control board, an auxiliary source board or a lightning protection board. The straightening assembly 23 is used to straighten and press the functional element to avoid the functional element from being skewed, floating, or other adverse conditions during wave soldering.

[0092] See also Figure 7 and Figure 8The circuit board 300 includes a base board 31, several IGBT components 32, a first SMT component 33, a second SMT component 34, an insert component 35, and a production mark 36. The base board 31 has a first surface and a second surface, which are opposite each other. The first surface is provided with several soldering locations (not shown). The base board 31 is provided with several first through holes (not shown), several first insertion holes (not shown), second insertion holes (not shown), a second through hole (not shown), a first mark 311, and a third mark 312. The several first through holes, several first insertion holes, second insertion holes, and second through holes all extend through the first and second surfaces. A first through hole and a first insertion hole are located at a soldering location, and the first through hole is used to allow an elastic abutment to pass through. The third mark 312 is provided on the first surface of the base board 31 and is used to align the second stencil. The first mark 311 is provided on the second surface of the base board 31 and is used to align the first stencil with the base board 31. Several IGBT components 32 are mounted on the first surface, with one IGBT component 32 located at a soldering position and its pins plugged into a first socket. A first SMT component 33 is mounted on the second surface. A second SMT component 34 is mounted on the first surface. An insert component 35 is mounted on the second surface, with its pins plugged into the second socket. Production markings 36 are located on the first and second surfaces to improve traceability and process control during the manufacturing process of the circuit board 300. Figure 9 , Figure 9 FIG. 1 is a flow chart of a first embodiment of a method for manufacturing a circuit board 300 according to the present invention. The method includes:

[0093] Step 01: Make the base plate.

[0094] The substrate has a first surface and a second surface. The first surface is provided with a plurality of welding positions. The substrate is also provided with a plurality of first through holes and a plurality of first plug holes. The plurality of first through holes and the plurality of first plug holes all pass through the first surface and the second surface. A first through hole and a first plug hole are located at a welding position.

[0095] Step 02: Provide a selective soldering jig and a plurality of IGBT components 32 .

[0096] Step 03: Place a plurality of IGBT components 32 on the first surface, with one IGBT component 32 located at a welding position and a pin of one IGBT component 32 plugged into a first socket.

[0097] Step 04: Place the substrate with the plurality of IGBT components 32 on the first base plate assembly 11 .

[0098] In some embodiments, step 04 is specifically as follows: placing the substrate with a plurality of IGBT elements 32 into the placement groove 1111, controlling the first pressing member 112 to press the surface of the substrate away from the placement groove 1111 (i.e., the first surface of the substrate) to fix the substrate in the placement groove 1111.

[0099] Step 05: Place the pressing plate assembly 12 on one side of the first base plate assembly 11 .

[0100] The other end of the height-limiting column 122 abuts against the first base plate assembly 11 , and an abutting block 1212 corresponds to an IGBT element 32 .

[0101] In some embodiments, step 05 is specifically as follows: the pressure plate 121 is covered on one side of the first base plate 111, wherein the other end of the height limiting column 122 abuts the first base plate 111, and the second pressing fastener 113 is controlled to press the pressure plate 121 away from the surface of the first base plate 111 to fix the pressure plate 121 to the first base plate 111.

[0102] Step 06: Set the functional board assembly 13 on the other side of the first base plate assembly 11, and the other end of an elastic abutment 132 passes through the first base plate assembly 11 and a first through hole and abuts against an IGBT component 32 to push the IGBT component 32 toward the abutment block 1212.

[0103] A surface of an IGBT element 32 facing away from the substrate abuts against a surface of an abutting block 1212 facing away from the pressing plate 121 , and a pin of the IGBT element 32 is exposed at a first welding joint.

[0104] Step 07: Solder several IGBT pins to the second surface through the first soldering joint.

[0105] Step 08: After soldering of several IGBT pins is completed, the selective soldering jig is removed to obtain the circuit board 300.

[0106] In an embodiment of the present invention, before the pins of a plurality of IGBT elements 32 are soldered to the substrate, the substrate with the plurality of IGBT elements 32 is fixed to the first base plate assembly 11, and an elastic abutting member 132 abuts against an IGBT element 32 to push the IGBT element 32 toward the abutting block 1212, so that the surface of an IGBT element 32 facing away from the substrate abuts against the surface of an abutting block 1212 facing away from the pressure plate 121. Since the surfaces of the plurality of abutting blocks 1212 facing away from the pressure plate 121 are flush, the surfaces of the plurality of IGBT elements 32 facing away from the substrate are ensured to be in the same plane, thereby not affecting the subsequent heat dissipation effect of the plurality of IGBTs, and at the same time, improving the production efficiency of the circuit board 300.

[0107] See also Figure 10 , Figure 101 is a flow chart of a second embodiment of a method for manufacturing a circuit board 300 according to the present invention. The second embodiment differs from the other embodiments in that:

[0108] After step 02 and before step 03, the method includes:

[0109] Step 09: Bend the pins of the IGBT element 32.

[0110] In some embodiments, step 09 specifically includes: using a bending jig to bend the pins of the IGBT component 32 so that the distance from the center hole of the IGBT component 32 to the bending point is 21 mm to 22 mm.

[0111] In the embodiment of the present invention, the IGBT element 32 is bent so that the plane of the IGBT element 32 is flush. When the substrate with several IGBTs is installed in the inverter, the plane of the IGBT element 32 is better fitted to the heat sink, resulting in better heat dissipation effect.

[0112] See also Figure 11 , Figure 11 3 is a flow chart of a third embodiment of a method for manufacturing a circuit board 300 according to the present invention. The third embodiment differs from the other embodiments in that:

[0113] This embodiment is a method for manufacturing a substrate. Before step 02, the method includes:

[0114] Step 10: Provide an original board 31 , a first SMT component 33 , a second SMT component 34 , an insert component 35 and a wave soldering jig 200 .

[0115] The original board 31 is provided with a second plug hole, a plurality of welding positions, a plurality of first through holes and a plurality of first plug holes are provided on the original board 31 , and the original board 31 has a first surface (ie the first surface of the substrate) and a second surface (ie the second surface of the substrate).

[0116] Step 11: Bake the original plate 31.

[0117] It should be noted that the original plate 31 needs to be baked at 115°C to 125°C. After baking, the original plate 31 needs to be flattened to prevent warping and deformation. The next step can be performed after the original plate 31 cools to room temperature.

[0118] Step 12: Mount the first SMT component 33 on the first surface of the original board 31 .

[0119] In some embodiments, see Figure 12 , step 12 further includes:

[0120] Step 121: Provide a first solder paste and a placement machine.

[0121] Step 122 : Apply the first solder paste to the second surface of the original board 31 .

[0122] In some embodiments, see Figure 13 , step 112 further includes:

[0123] Step 1221: Provide a first steel mesh.

[0124] The first steel mesh is provided with a second mark, and the second surface of the original plate 31 is provided with a first mark 311 .

[0125] In some embodiments, the thickness of the first steel mesh is 0.133 mm, and the openings of the first steel mesh are opened in different types according to the type of the first SMT component 33. For example, for the resistors, capacitors, etc. of the first SMT component 33, the openings of the first steel mesh are opened according to the 1:1 ratio of the pads, and anti-tin bead grooves are opened. The first steel mesh made in this way is conducive to reducing the occurrence of undesirable conditions such as offset, excessive tin, and continuous tin during the first solder paste application process.

[0126] Step 1222 : Attach the first steel mesh to the second surface, and align the second mark with the first mark 311 .

[0127] It should be noted that the first steel mesh needs to be cleaned, tension tested and inspected in advance. The cleaning procedure helps to prevent residual solder paste from clogging the openings of the first steel mesh and affecting the first solder paste brushing. The tension test procedure is used to select damaged first steel meshes, and the inspection procedure is used to avoid using the wrong first steel mesh.

[0128] Step 1223: Apply the first solder paste to the first steel mesh to apply the first solder paste to the second surface.

[0129] It should be noted that the first solder paste needs to be fully stirred and warmed up in advance.

[0130] Step 1224: After the first solder paste is solidified, remove the first steel mesh.

[0131] Step 123 : Place the original board 31 coated with the first solder paste into a placement machine, attach the first SMT component 33 to the first solder paste by the placement machine, and heat the first solder paste by the placement machine to solder the first SMT component 33 to the second surface of the original board 31 .

[0132] It should be noted that the first SMT component 33 is mounted on the second surface of the original board 31 according to a preset position by a chip mounter. The original board 31 after the first SMT component 33 is mounted is required to be inspected. After confirming that there are no quality issues with the original board 31 after the first SMT component 33 is mounted, mass production can begin. Specifically, an optical inspection device is used to grasp the first mark 311 of the original board 31 for positioning. The original board 31 after the first SMT component 33 is mounted is inspected. After confirming that there are no quality issues such as deviation, missing components, reversed components, reversed components, sideways components, tombstone components, solder joints, or multiple components, mass production can begin.

[0133] Step 13: Mount the second SMT component 34 on the first surface of the original board 31 .

[0134] In some embodiments, see Figure 14 , step 13 further includes:

[0135] Step 131: Provide a second solder paste.

[0136] Step 132 : Apply the second solder paste to the first surface of the original board 31 .

[0137] In some embodiments, see Figure 15 , step 132 further includes:

[0138] Step 1321: Provide a second steel mesh.

[0139] The second steel mesh is provided with a fourth mark, and the first surface of the original plate 31 is provided with a third mark 312 .

[0140] In some embodiments, the second stencil has a thickness of 0.133 mm. The openings in the second stencil are differentiated based on the type of second SMT component 34. For example, for resistors, capacitors, and other second SMT components 34, the openings in the second stencil are arranged 1:1 with the solder pads, and anti-solder beading grooves are provided. For copper strips of the second SMT component 34, the openings in the second stencil are not arranged along the entire length of the solder pads. A 0.5 mm bridge is left between the pads to prevent the copper strip from being misaligned due to excessive soldering. This method of fabricating a second stencil helps reduce undesirable issues such as offset, excessive soldering, and solder bridging during the second solder paste application process.

[0141] Step 1322 : Attach the second steel mesh to the first surface, and align the fourth mark with the third mark 312 .

[0142] It should be noted that the second steel mesh needs to be cleaned, tension tested and inspected in advance. The cleaning procedure helps to prevent residual solder paste from clogging the openings of the second steel mesh and affecting the application of the first solder paste. The tension test procedure is used to select damaged second steel meshes, and the inspection procedure is used to avoid using the wrong steel mesh.

[0143] Step 1323: Apply the second solder paste to the second steel mesh to apply the second solder paste to the first surface.

[0144] It should be noted that the second solder paste needs to be fully stirred and warmed up in advance.

[0145] Step 1324: After the second solder paste is solidified, remove the second steel mesh.

[0146] Step 133 : Place the original board 31 coated with the second solder paste into a placement machine, attach the second SMT component 34 to the second solder paste by the placement machine, and heat the second solder paste by the placement machine to solder the second SMT component 34 to the first surface of the original board 31 .

[0147] It should be noted that the second SMT component 34 is mounted on the first surface of the original board 31 according to a preset position by a chip mounter. The original board 31 after the second SMT component 34 is first mounted needs to be inspected to confirm that there are no quality issues with the original board 31 after the second SMT component 34 is first mounted before mass production can begin. Specifically, the third mark 312 of the original board 31 is grasped and positioned by optical inspection equipment, and the original board 31 after the second SMT component 34 is first mounted is inspected to confirm that there are no quality issues such as deviation, missing components, reversed components, reversed components, sideways components, tombstone components, solder joints, or multiple components before mass production can begin.

[0148] Step 14: Insert the pins of the plug-in component 35 into the second socket along the direction from the first surface to the second surface.

[0149] Step 15: Place the original board 31 with the plug-in component 35 on the second base plate assembly 21 , and the second base plate assembly 21 covers the second SMT component 34 .

[0150] In some embodiments, step 016 specifically includes placing the original board 31 with the plug-in device 35 on the second base board.

[0151] Step 16: Removably fix the cover plate assembly 22 to the second bottom plate assembly 21 .

[0152] The cover assembly 22 abuts against the first surface of the original board 31 with the plug-in component 35 , and the pins of the plug-in component 35 are exposed in the second welding openings 2112 .

[0153] In some embodiments, step 017 is specifically as follows: inserting the support member 222 into the first limiting groove 2121, passing the tightening screw 223 through the second through hole and screwing it into the first screw hole 2111, wherein the tightening screw 223 abuts the first surface of the original board 31 with the plug-in device 35.

[0154] Step 17: Solder the pins of the plug-in component 35 to the original board 31 through the second welding openings 2112 to obtain a base board.

[0155] In the embodiment of the present invention, the second SMT component 34 located on the first surface is covered by the second base plate 211 to avoid the second SMT component 34 located on the first surface from falling off when the plug-in component 35 is wave soldered. At the same time, the second base plate 211 also covers the first socket to avoid the first socket being blocked by tin. Furthermore, the tightening screw 223 abuts against the second surface of the original board 31 with the plug-in component 35 to avoid deformation of the original board 31 with the plug-in component 35 due to the excessive weight of the original board 31, which may cause tin overflow from the original board 31.

[0156] See also Figure 16 , Figure 16 1 is a flow chart of a fourth embodiment of a method for manufacturing a circuit board 300 according to the present invention. The fourth embodiment differs from the other embodiments in that:

[0157] After step 11 and before step 12, the method includes:

[0158] Step 18: The original plate 31 is engraved with a production mark 36 .

[0159] In some embodiments, step 18 is specifically as follows: using laser engraving equipment to engrave production marks 36 on the second surface and the first surface of the original plate 31. The production mark 36 located on the second surface is a serial number QR code and the name of the product model, and the production mark 36 located on the first surface is a serial number QR code.

[0160] In the embodiment of the present invention, the production mark 36 is used to improve traceability and process control during the manufacturing process of the circuit board 300.

[0161] See also Figure 17 , Figure 17 1 is a flow chart of a fifth embodiment of the method for manufacturing a circuit board 300 according to the present invention. The fifth embodiment differs from the other embodiments in that:

[0162] Before step 14, and after step 13, the method includes:

[0163] Step 19: Trim the pins of the plug-in component 35 with long pins.

[0164] It should be noted that the distance between the protruding pins of the plug-in component 35 after the pins are trimmed and inserted into the second jack is 1.5 mm to 2.5 mm.

[0165] In the embodiment of the present invention, the long pins of the plug-in component 35 are trimmed to prevent the protruding long pins of the plug-in component 35 from occupying space and to prevent the long pins of the plug-in component 35 from accidentally contacting other electrical components.

[0166] See also Figure 18 , Figure 18 1 is a flow chart of a sixth embodiment of the method for manufacturing a circuit board 300 according to the present invention. The sixth embodiment differs from the other embodiments in that:

[0167] After step 17 and before step 02, the method includes:

[0168] Step 20: Apply conformal coating to the soldering surfaces of the connectors of the first SMT component 33 , the second SMT component 34 and the plug-in component 35 .

[0169] In some embodiments, after coating with conformal coating, the substrate is cured in a curing oven at a temperature controlled between 60°C and 90°C, with the temperature gradually increasing. After curing, the soldering surfaces of the connectors for the first SMT component 33, the second SMT component 34, and the plug-in component 35 are ensured to be dry. Conformal coating exhibits excellent high and low temperature resistance, and after curing, it forms a transparent protective film with superior insulation, moisture resistance, leakage protection, shock resistance, dust resistance, corrosion resistance, aging resistance, and corona resistance.

[0170] In the embodiment of the present invention, after the conformal coating is applied, the first SMT component 33 , the second SMT component 34 and other components are protected from environmental corrosion.

[0171] See also Figure 19 , Figure 19 1 is a flow chart of a seventh embodiment of the method for manufacturing a circuit board 300 according to the present invention. The seventh embodiment differs from the other embodiments in that:

[0172] Methods include:

[0173] Step 21: Fix the capacitors, resistors, relays and other components of the plug-in components 35 with glue.

[0174] It should be noted that the first SMT component 33 and the second SMT component 34 cannot be covered during glue dispensing.

[0175] In the embodiment of the present invention, components such as capacitors, resistors, and relays of the plug-in components 35 are fixed to the original board 31 by dispensing glue to prevent loosening.

[0176] The present invention further provides an embodiment of a circuit board 300 , wherein the circuit board 300 is manufactured by the above method.

[0177] It should be noted that the preferred embodiments of the present invention are given in the specification and drawings of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not intended to be additional limitations on the content of the present invention. The purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. In addition, the above-mentioned technical features can be combined with each other to form various embodiments not listed above, which are all considered to be within the scope of the description of the present invention. Furthermore, it is obvious to those skilled in the art that improvements or changes can be made based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A method for manufacturing a circuit board, characterized in that: include: Manufacturing a substrate, wherein the substrate has a first surface and a second surface, the first surface is provided with a plurality of welding positions, the substrate is further provided with a plurality of first through holes and a plurality of first insertion holes, the plurality of first through holes and the plurality of first insertion holes both passing through the first surface and the second surface, and a first through hole and a first insertion hole are located at a welding position; A selective soldering jig and several IGBT components are provided, wherein the selective soldering jig includes a first base plate assembly, a pressure plate assembly, and a functional plate assembly, the pressure plate assembly includes a pressure plate and a height limiting column, one end of the height limiting column is disposed on a surface of the pressure plate, a plurality of abutment blocks extend from one surface of the pressure plate, the plurality of abutment blocks are flush with the surface of the pressure plate, the functional plate assembly includes a functional plate and several elastic abutment members, one end of the elastic abutment members is disposed on the functional plate, and the functional plate is provided with several first welding ports; The plurality of IGBT components are arranged on the first surface, with one of the IGBT components located at one of the welding positions, and a pin of one of the IGBT components plugged into one of the first sockets; placing the substrate with the plurality of IGBT components on the first base plate assembly; The pressure plate assembly is arranged on one side of the first base plate assembly, wherein the other end of the height-limiting column abuts against the first base plate assembly, and one abutting block corresponds to one IGBT element; The function board assembly is arranged on the other side of the first base plate assembly, and the other end of the elastic abutment member passes through the first base plate assembly and the first through hole and abuts against the IGBT component to push the IGBT component toward the abutment block, wherein a surface of the IGBT component facing away from the substrate abuts against a surface of the abutment block facing away from the pressure plate, and a pin of the IGBT component is exposed at a first welding joint; Welding the pins of the plurality of IGBTs to the second surface through the first welding port; After the pins of the plurality of IGBTs are soldered, the selective soldering jig is removed to obtain the circuit board.

2. The method according to claim 1, characterized in that The first bottom plate assembly includes a first bottom plate and a first pressing fastener, a placement groove is provided on one side of the first bottom plate, and the first pressing fastener is provided on one side of the first bottom plate; The step of placing the plurality of IGBT components and the substrate on the first base plate assembly includes: placing the substrate with the plurality of IGBT components into the placement groove; The first pressing member is controlled to press the surface of the substrate away from the placement groove to fix the substrate in the placement groove.

3. The method according to claim 2, characterized in that The first base plate assembly further includes a second pressing fastener, which is disposed on one side of the base plate; The step of arranging the pressure plate assembly on one side of the first base plate assembly further comprises: The pressure plate cover is arranged on one side of the first bottom plate, wherein the other end of the height-limiting column abuts against the first bottom plate; The second pressing member is controlled to press the surface of the pressing plate away from the first bottom plate, so as to fix the pressing plate to the first bottom plate.

4. The method according to claim 1, wherein The step of manufacturing the substrate further includes: Provide an original board, a first SMT component, a second SMT component, an insert component, and a wave soldering jig, wherein the original board is provided with a second jack, the plurality of soldering positions, the plurality of first through holes, and the plurality of first jacks are provided on the original board, the wave soldering jig includes a cover plate assembly and a second base plate assembly, the second base plate assembly is provided with a second solder opening, and the original board has the first surface and the second surface; baking the original plate; Mounting the first SMT component on the second surface of the original board; Mounting the second SMT component on the first surface of the original board; Inserting the pins of the plug-in device into the second sockets along the direction from the first surface to the second surface; Placing the original board with the plug-in device on the second base plate assembly, wherein the second base plate assembly covers the second SMT device; The cover plate assembly is detachably fixed to the second bottom plate assembly, The cover assembly abuts against the second surface of the original board with the plug-in component, and the pins of the plug-in component are exposed in the second welding opening; The pins of the plug-in device are welded to the original board through the second welding opening to obtain the base board.

5. The method according to claim 4, characterized in that The original plate is provided with a second through hole; The second base plate assembly includes a second base plate and a limiting block, the second base plate is provided with a first screw hole, the limiting block is provided on the second base plate, and the limiting block is provided with a first limiting groove, the cover plate assembly includes a cover plate, a support member and a tightening screw, one end of the support member is provided on the cover plate, the tightening screw is provided on the cover plate, and the second welding opening is provided on the second base plate; The step of placing the original board with the plug-in device on the second base plate assembly, Placing the original board with the plug-in device on the second bottom plate; The step of detachably fixing the cover plate assembly to the second base plate assembly further includes: Inserting the support member into the first limiting groove; The tightening screw is passed through the second through hole and then screwed into the first screw hole, wherein the tightening screw abuts against the second surface of the original board with the plug-in device.

6. The method according to claim 4, characterized in that The step of mounting the first SMT component on the second surface of the original board further includes: Provide the first solder paste and placement machine; Applying the first solder paste to the second surface of the original board; The original board coated with the first solder paste is placed in the placement machine, the placement machine attaches the first SMT component to the first solder paste, and the placement machine heats the first solder paste to solder the first SMT component to the second surface of the original board.

7. The method according to claim 6, characterized in that The second surface of the original plate is provided with a first mark; The step of applying the first solder paste to the second surface of the original board further includes: Providing a first steel mesh, wherein the first steel mesh is provided with a second mark; attaching the first steel mesh to the second surface, with the second mark aligned with the first mark; Applying the first solder paste to the first steel mesh to apply the first solder paste to the second surface; After the first solder paste is solidified, the first steel mesh is removed.

8. The method according to claim 6, characterized in that The step of mounting the second SMT component on the first surface of the original board further includes: Providing a second solder paste; Applying the second solder paste to the first surface of the original board; The original board coated with the second solder paste is placed in the placement machine, the placement machine attaches the second SMT component to the second solder paste, and the placement machine heats the second solder paste to solder the second SMT component to the first surface of the original board.

9. The method according to claim 8, characterized in that The first surface of the original plate is provided with a third mark; The step of applying the second solder paste to the second surface of the original board further includes: Providing a second steel mesh, wherein the second steel mesh is provided with a fourth mark; attaching the second steel mesh to the first surface, and aligning the fourth mark with the third mark; Applying the second solder paste to the second steel mesh to apply the second solder paste to the first surface; After the second solder paste is solidified, the second steel mesh is removed.

10. A circuit board, characterized in that: The circuit board is prepared by the method according to any one of claims 1 to 9.

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