Control system and method for a processing device, electronic device and storage medium

Abstract

Embodiments of the present application provide a kind of control system and method for processing device, electronic equipment and storage medium.The system includes: data receiving module, for receiving the position information of piece to be processed and the distance information corresponding to position information in real time, data storage module, for storing distance information;Read control module is connected with data storage module and data receiving module, for at least based on the position information in the case where it is determined that piece to be processed is in effective processing area, from the processing starting point of effective processing area, from data storage module, read corresponding distance information, to control the movement of machining head in second direction to focal position matched with distance information based on the distance information read.This scheme can accurately determine the working position of focusing mechanism, help to improve the stability of following.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and more particularly to a control system for a processing device, a control method for a processing device, an electronic device and a storage medium. BACKGROUND

[0002] In many fields, a processing device is provided with an automatic following system. The following takes laser processing as an example for illustration. The laser processing device includes a stage assembly, a laser range finder, a processing head, a piezoelectric ceramic motor and an automatic following system. In the laser processing device, the automatic following system is a non-contact measurement real-time focusing system. In the laser cutting process, the automatic following system can realize automatic focusing, and the focal point is automatically adjusted in real time to follow the change of the product thickness, so as to ensure that the laser focusing modification layer depth of the invisible cutting is consistent, and the cutting quality is ensured.

[0003] In the conventional laser processing equipment, the hardware characteristics of the piezoelectric ceramic motor result in unstable following performance, which cannot accurately control the starting point and the ending point of the following, and cannot ensure the cutting quality. SUMMARY

[0004] The present application is proposed in consideration of the above problems. The present application provides a control system for a processing device, a control method for a processing device, an electronic device and a storage medium.

[0005] According to an aspect of the present application, a control system for a processing device is provided, comprising: a data receiving module, configured to receive position information of a workpiece to be processed and distance information corresponding to the position information in real time, the position information being used to indicate a position of the workpiece to be processed in a first direction when the workpiece to be processed and a processing head of the processing device move relatively in the first direction, and the distance information being used to indicate a distance between the processing head and the workpiece to be processed in a second direction when the workpiece to be processed and the processing head move relatively in the first direction; a data storage module, configured to store the distance information; and a reading control module, connected with the data storage module and the data receiving module, and configured to read the corresponding distance information from the data storage module starting from a processing starting point of an effective processing area, and to control the processing head to move to a focal point position matched with the distance information in the second direction based on the read distance information, when it is determined that the workpiece to be processed is in the effective processing area based on at least the position information.

[0006] Exemplarily, the reading control module is further configured to determine whether the workpiece to be processed reaches a target position point on the effective processing area according to the position information and the distance information, the target position point being the processing starting point or the processing ending point.

[0007] Exemplarily, the reading control module determines whether the workpiece reaches the target position point on the effective machining area according to the position information and the distance information by: determining whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece according to the change range of the distance information; in the case of yes, determining the target position information corresponding to the case that the workpiece is at the target position point based on the position information corresponding to the currently received distance information; and determining that the workpiece is at the target position point when the position information received by the data receiving module is the target position information.

[0008] Exemplarily, the machining device comprises a distance measuring mechanism for measuring distance information, the position information comprises position information corresponding to each different position point of the workpiece, and the distance information comprises distance information corresponding to each different position point of the workpiece, wherein the reading control module reads the corresponding distance information from the data storage module by: determining the second position information X2 according to the first position information X1 corresponding to at least one position point in the effective machining area; reading the distance information corresponding to the first position information X1 from the data storage module when the position information received by the data receiving module is the second position information X2; and wherein the second position information X2 satisfies the following formula: X2=X1+δx1, and δx1 represents the distance between the distance measuring mechanism and the machining head in the first direction.

[0009] Exemplarily, the machining device further comprises a distance measuring mechanism and a focusing mechanism, the distance measuring mechanism is used for measuring distance information, the focusing mechanism is used for driving the machining head to move in the second direction, the position information comprises position information corresponding to each different position point of the workpiece, and the distance information comprises distance information corresponding to each different position point of the workpiece, wherein the reading control module reads the corresponding distance information from the data storage module by: determining the second position information X2 according to the first position information X1 corresponding to at least one position point in the effective machining area; reading the distance information corresponding to the first position information X1 from the data storage module when the position information received by the data receiving module is the second position information X2; and wherein the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, δx1 represents the distance between the distance measuring mechanism and the machining head in the first direction, and δx2 represents the movement distance of the workpiece relative to the machining head in the first direction within the response time of the focusing mechanism.

[0010] Exemplarily, the processing device further comprises a focusing mechanism configured to drive the processing head to move in the second direction, and the system further comprises: a first data processing module connected with the reading control module, configured to perform digital-analog fitting according to the read distance information received from the reading control module to obtain a fitting signal; and an output module connected with the first data processing module, configured to generate a corresponding real-time control signal according to the fitting signal and output the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to move to a focal point position matched with the distance information in the second direction.

[0011] Exemplarily, the system further comprises: a first interaction module connected with the output module, configured to obtain first indication information from the upper computer, and the output module is further configured to generate a fixed control signal based on the first indication information before the processing head reaches a processing starting point in the effective processing area and output the fixed control signal to the focusing mechanism to control the focusing mechanism to keep the processing head at a fixed position in the second direction.

[0012] Exemplarily, the reading control module is further configured to control the data storage module to store the distance information in a process that the workpiece to be processed reaches a collection starting point and a collection ending point of an effective collection area, and the effective collection area comprises the effective processing area, and the system further comprises: a judgment module connected with the data receiving module and the reading control module, configured to determine whether the workpiece to be processed reaches the collection starting point or the collection ending point according to the position information; and a second interaction module connected with the judgment module, configured to obtain second indication information from the upper computer, and the judgment module determines position information corresponding to the collection starting point and the collection ending point based on the second indication information.

[0013] According to another aspect of the present application, a control method for a processing device is provided, characterized in that comprising: receiving position information of a workpiece to be processed and distance information corresponding to the position information in real time, the position information being used to indicate a position of the workpiece to be processed in a first direction when the workpiece to be processed moves relative to a processing head of the processing device in the first direction, and the distance information being used to indicate a distance between the processing head and the workpiece to be processed in a second direction when the workpiece to be processed moves relative to the processing head in the first direction; storing the distance information; in a case that the workpiece to be processed is determined to be in an effective processing area based on at least the position information, reading corresponding distance information from a processing starting point of the effective processing area, and controlling a focusing mechanism of the processing device to drive the processing head to move to a focal point position matched with the distance information in the second direction based on the read distance information.

[0014] Exemplarily, the method further comprises: determining whether the workpiece to be processed reaches a target position point on the effective processing area according to the position information and the distance information, the target position point being the processing starting point or a processing ending point.

[0015] According to the position information and the distance information, it is determined whether the workpiece reaches a target position point on the effective machining area, including: according to the change range of the distance information, it is determined whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece; in the case of yes, based on the position information corresponding to the currently received distance information, the target position information corresponding to the target position point of the workpiece is determined; when the position information received by the data receiving module is the target position information, it is determined that the workpiece is at the target position point.

[0016] According to the position information and the distance information, it is determined whether the workpiece reaches a target position point on the effective machining area, including: according to the change range of the distance information, it is determined whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece; in the case of yes, based on the position information corresponding to the currently received distance information, the target position information corresponding to the target position point of the workpiece is determined; when the position information received by the data receiving module is the target position information, it is determined that the workpiece is at the target position point.

[0017] According to the position information and the distance information, it is determined whether the workpiece reaches a target position point on the effective machining area, including: according to the change range of the distance information, it is determined whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece; in the case of yes, based on the position information corresponding to the currently received distance information, the target position information corresponding to the target position point of the workpiece is determined; when the position information received by the data receiving module is the target position information, it is determined that the workpiece is at the target position point.

[0018] According to another aspect of the present application, an electronic device is provided, including a processor and a memory, wherein the memory stores computer program instructions, and the computer program instructions are used to execute the above-mentioned control method for the machining device when the processor runs.

[0019] According to another aspect of the present application, there is provided a storage medium having stored thereon program instructions which, when executed, implement the above-mentioned control method for a processing device.

[0020] According to the control system and method of the laser processing device, the electronic device and the storage medium, the position information and the distance information of the workpiece to be processed are received in real time by the data receiving module, and the processing head is controlled in real time by the reading control module during the process that the workpiece to be processed is in the effective processing area, which can accurately determine the working position of the focusing mechanism and help to improve the stability of the following. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which like reference characters refer to like parts throughout the figures. The accompanying drawings are intended to provide a further understanding of embodiments of the present application and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and serve to explain the principles of the present application, and are not intended to limit the present application. In the drawings, like reference numerals refer to like parts throughout the various views.

[0022] Figure 1 A schematic diagram of a processing device according to an embodiment of the present application is shown;

[0023] Figure 2 A schematic block diagram of a control system for a processing device according to an embodiment of the present application is shown;

[0024] Figure 3 A schematic diagram of a wafer sheet containing a wafer according to an embodiment of the present application is shown;

[0025] Figure 4 An exemplary structural schematic diagram of a control system according to an embodiment of the present application is shown;

[0026] Figure 5 A schematic flowchart of a control method for a processing device according to an embodiment of the present application is shown; and

[0027] Figure 6 A schematic block diagram of an electronic device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of the present invention.

[0029] To facilitate understanding, an exemplary structure of the processing device will be introduced below. Figure 1 A schematic diagram of a processing apparatus 100 according to an embodiment of the present invention is shown. Figure 1 As shown, the processing apparatus 100 may include a stage assembly 110, a ranging mechanism 120, a processing head 130, and a focusing mechanism 140. Furthermore, Figure 1 The workpiece 150 to be processed is also shown. The workpiece can be any item, such as ceramics or a wafer. For ease of description and understanding, the following description primarily uses a wafer as the workpiece. Exemplarily, and not limitingly, the ranging mechanism 120 can be a laser rangefinder, and the focusing mechanism 140 can be a piezoelectric ceramic motor. The workpiece 150 and the processing head 130 can move relative to each other along a first direction, which can be such as... Figure 1 The X-axis direction shown is in the X-axis direction. Figure 1 The image shows a horizontal orientation. Note that... Figure 1 The position of the X-axis shown is only an example; its actual position can be relative to... Figure 1 The indicated position moves vertically. The focusing mechanism 140 is connected to the processing head 130, and the focusing mechanism 140 can drive the processing head 130 to move together in a second direction. The second direction can be... Figure 1 The vertical direction is perpendicular to the X-axis. The ranging mechanism 120 and the processing head 130 / focusing mechanism 140 are spaced a certain distance apart in the X-axis direction.

[0030] The position of the workpiece 150 in the first direction can be measured by a position measuring mechanism when the workpiece 150 and the machining head 130 move relatively in the first direction. In one embodiment, the relative movement between the workpiece 150 and the machining head 130 can be that the machining head 130 keeps stationary and the workpiece 150 moves in the first direction. In this case, the position measuring mechanism (e.g. a grating scale) can be used to measure the moving distance of the workpiece 150 in the first direction, which represents the position of the workpiece 150 in the first direction. In another embodiment, the relative movement between the workpiece 150 and the machining head 130 can be that the workpiece 150 keeps stationary and the machining head 130 moves in the first direction. In this case, the position measuring mechanism (e.g. a grating scale) can be used to measure the moving distance of the machining head 130 in the first direction, which represents the position of the workpiece 150 in the first direction. In yet another embodiment, the relative movement between the workpiece 150 and the machining head 130 can be that the workpiece 150 and the machining head 130 move together in the first direction. In this case, the position measuring mechanism (e.g. a grating scale) can be used to measure the distance between the machining head 130 and the workpiece 150 in the first direction, which represents the position of the workpiece 150 in the first direction. Hereinafter, the embodiment that the machining head 130 keeps stationary and the workpiece 150 moves in the first direction will be mainly described.

[0031] Figure 1 The shown stage assembly 110 can include a machining platform for carrying the workpiece 150, a driving assembly for driving the machining platform (i.e. driving the workpiece 150) to move in the X-axis direction, and a position measuring mechanism for measuring the moving distance of the machining platform (i.e. measuring the workpiece 150) when the machining platform moves in the X-axis direction. The driving assembly can be a linear motor, such as Figure 1The X-axis linear motor is shown. The position measurement mechanism can be a grating ruler. Exemplarily, the zero point of the grating ruler measurement can be preset, and the grating ruler is used to measure the distance of the machining platform from the origin, that is, to measure the distance of the workpiece 150 from the origin. During machining, the driving assembly can drive the machining platform to move along the X-axis direction, and in this process, the machining head 130 processes each machining point in the X-axis direction, and the position of each machining point in the X-axis direction can be determined by the grating ruler. In the case of a wafer as a workpiece, the machining point can be a machining point on any cutting lane of the wafer parallel to the X-axis direction. The height of each machining point can be determined by the distance information collected by the distance measuring mechanism 120. The distance information collected by the distance measuring mechanism 120 can be transmitted to the control system (which can be referred to as an automatic following system) for the machining device described herein. The control system for the machining device can determine the corresponding control signal based on the distance information and output the control signal to the focusing mechanism 140, thereby controlling the focusing mechanism 140 to move up and down to drive the machining head 130 to move up and down to the focal point position matching the distance information, that is, the machining position matching the height of each machining point.

[0032] It can be understood that although in the example of using a laser range finder as a distance measuring mechanism, the laser range finder measures the distance between the workpiece and the laser range finder in the second direction, this distance can be used to represent the distance between the workpiece and the machining head in the second direction. For example, the laser emitting end and the receiving end of the laser range finder can be arranged at the same height as the end of the machining head facing the workpiece, so that the distance between the laser emitting end and the receiving end of the laser range finder and the workpiece in the second direction (first distance) and the distance between the machining head and the workpiece in the second direction (second distance) remain consistent. Of course, even if the first distance and the second distance are not consistent, there is a fixed difference between them. In this case, the distance information collected by the laser range finder can still be used to represent the distance between the machining head and the workpiece in the second direction. Only when subsequently controlling the machining head to move in the second direction to the focal point position matching the distance information, the focal point position can be appropriately raised or lowered according to the preset difference between the first distance and the second distance. Of course, the distance measuring mechanism can also be designed to directly measure the distance between the workpiece and the machining head in the second direction, for example, realized by the principle similar to the grating ruler.

[0033] As can be understood from the above description, the position information measured by the position measurement mechanism can include position information corresponding to each different position point of the workpiece, and the distance information can include distance information corresponding to each different position point of the workpiece. Among them, the position point can be understood as the physical position of the workpiece. For example, when the workpiece is in the effective machining area, each position point can be the above-mentioned machining point.

[0034] In one embodiment, the processing apparatus 100 may further include the control system for the processing apparatus described herein. Figure 1 (Not shown in the image). In another embodiment, the control system for the processing apparatus can be independent of the processing apparatus 100, for example, communicatively connected to the ranging mechanism 120 and the position measuring mechanism in the processing apparatus 100, receiving distance information collected by the ranging mechanism 120 and position information collected by the position measuring mechanism, and then performing follow control based on the distance information and position information.

[0035] To at least partially solve the above problems, embodiments of the present invention provide a control system for a processing apparatus. Figure 2 A schematic block diagram of a control system 200 for a processing apparatus according to an embodiment of the present invention is shown. By way of example, and not limitation, the control system 200 may be implemented using a field-programmable gate array (FPGA). FPGAs have high-speed signal processing capabilities, which helps to accurately determine the position of the effective processing area, thereby helping to improve the tracking performance of the control system 200. Figure 2 As shown, the control system 200 may include a data receiving module 210, a data storage module 220, and a read control module 230.

[0036] The data receiving module 210 can be used to receive the position information of the workpiece to be processed and the distance information corresponding to the position information in real time. The position information is used to indicate the position of the workpiece to be processed in the first direction when it moves relative to the processing head of the processing device in the first direction. The distance information is used to indicate the distance between the processing head and the workpiece to be processed in the second direction when the workpiece to be processed moves relative to the processing head in the first direction.

[0037] The data storage module 220 can be used to store distance information.

[0038] The read control module 230, connected to the data storage module 220 and the data receiving module 210, is used to read the corresponding distance information from the data storage module starting from the processing start point of the effective processing area when it is determined, at least based on the position information, that the workpiece to be processed is within the effective processing area. Based on the read distance information, the processing head is controlled to move in the second direction to a focal position that matches the distance information.

[0039] The exemplary structure and working principle of the control system 200 are further described below.

[0040] Exemplarily but not limitatively, the data receiving module 210 can include a first data receiving module and a second data receiving module. The first data receiving module can be communicatively connected with the distance measuring mechanism 120 for receiving distance information from the distance measuring mechanism 120. The second data receiving module can be communicatively connected with the position measuring mechanism for receiving position information from the position measuring mechanism. Exemplarily, the first data receiving module can be an analog-to-digital conversion (ADC) module. In the case that the distance measuring mechanism 120 is a laser distance meter, the distance information collected by the distance measuring mechanism 120 is an analog signal. Through the ADC module, the distance information can be converted from an analog signal to a digital signal. The sampling frequency of the ADC module can be set as needed, for example, 20 megabits per second (Mbps). In the case that the position measuring mechanism is a grating ruler, the position information output by the grating ruler is a digital pulse signal. The output frequency of the grating ruler can be, for example, 500 kilohertz (KHz). Exemplarily but not limitatively, the control system 200 can further include at least one downsampling module for downsampling the distance information (e.g., digitized distance information) output by the data receiving module 210 at least once. Downsampling can be, for example, data extraction from the received data at a preset number of data points (each data point can be understood as distance information corresponding to a position point). The data collected by the first data receiving module is relatively large, and all the data does not need to be processed. Through downsampling, the workload of subsequent modules can be reduced. In one example, the control system 200 can further include a first downsampling module connected with the data receiving module 210 (specifically, the first data receiving module described above) for downsampling the distance information output by the data receiving module. For example, the 20 Mbps distance information can be downsampled to 500 Kbps. Exemplarily but not limitatively, the first downsampling module can further filter the distance information, for example, sliding filtering. Through filtering, interference can be removed, and the output distance signal (i.e., distance information) can be smoother. Filtering can be performed before or after downsampling.

[0041] For example, the workpiece to be processed is a wafer, and the data receiving module 210 can receive the position information of the wafer and the distance information corresponding to the position information in real time. The position information of the wafer can be obtained according to the measurement value of the grating ruler at the current time. The distance information corresponding to the position information can be obtained according to the measurement value of the distance measuring mechanism at the same time. As shown in FIG. 2, the distance measuring mechanism measures the distance between the wafer surface, for example, represented by h. Figure 1

[0042] ​The data storage module 220 can be configured to store the acquired distance information. The data storage module 220 can be implemented by any memory, such as a Random Access Memory (RAM), a Read Only Memory (ROM), a FLASH memory, etc. Optionally, the data storage module 220 can further store the acquired position information. When storing the position information and the distance information, the data storage module 220 can store the position information and the distance information in a one-to-one correspondence manner, for example, by associating the position information corresponding to each position point with the distance information. In one example, the data storage module 220 can store all the distance information outputted by the data receiving module 210 or outputted by at least one down-sampling module connected to the data receiving module 210 during the entire working period of the distance measuring mechanism. In another example, the data storage module 220 can store only the distance information outputted by the data receiving module 210 or outputted by at least one down-sampling module connected to the data receiving module 210 during a part of the working period of the distance measuring mechanism. For example, the data storage module 220 can store only the distance information outputted by the data receiving module 210 or outputted by at least one down-sampling module connected to the data receiving module 210 when the workpiece is in the effective acquisition area. The effective acquisition area can be pre-set. For example, the user can input the position information corresponding to the acquisition start point and the acquisition end point of the effective acquisition area in the control system 200. When the position information acquired by the grating ruler, i.e., the position information received by the data receiving module 210, is the position information corresponding to the acquisition start point, the data storage module 220 can be controlled to start storing the current distance information, or start storing the current distance information and the position information. In addition, when the position information acquired by the grating ruler, i.e., the position information received by the data receiving module 210, is the position information corresponding to the acquisition end point, the data storage module 220 can be controlled to stop storing the distance information, or stop storing the distance information and the position information. The above-mentioned operation of controlling the data storage module 220 to store the distance information can be performed by the reading control module 230, which is exemplary but not limiting.

[0043] Optionally, similar to the data storage module 220, the data receiving module 210 can also be configured to receive the distance information measured by the distance measuring mechanism (for example, to perform ADC sampling on the distance information) during the entire working period of the distance measuring mechanism, or during a part of the working period of the distance measuring mechanism. The working manner of the data receiving module 210 can be understood by referring to the above description of the data storage module 220, which is not described herein again.

[0044] The reading control module 230 can be connected with the data receiving module 210 and the data storage module 220. The reading control module 230 can determine whether the workpiece to be processed is in the effective processing area based on the current position information, and read the distance information corresponding to each position point in the effective processing area from the data storage module 220 starting from the processing starting point of the effective processing area, so as to control the movement of the processing head to the focal point position matching the distance information in the second direction based on the read distance information. In other words, the reading control module 430 reads the distance information corresponding to each position point in the effective processing area, including the processing starting point of the effective processing area and the processing ending point of the effective processing area. In one example, for any one or more position points, when the current position information received by the data receiving module 210 is the original position information X1 corresponding to the one or more position points, the reading control module 230 can directly read the distance information h1 corresponding to the original position information X1 from the data storage module 220, and control the movement of the processing head to the matching focal point position according to the distance information h1. In another example, for any one or more position points, the original position information X1 can be corrected (or error compensation) to determine new position information X2. When the current position information received by the data receiving module 210 is the position information X2, the reading control module 230 can read the distance information h1 corresponding to the original position information X1 from the data storage module 220, and control the movement of the processing head to the matching focal point position according to the distance information h1. The correction can be based on multiple aspects, such as the distance between the processing head and the distance measuring mechanism and / or the response time of the focusing mechanism, which will be described below. The operation of controlling the movement of the processing head to the focal point position matching the distance information in the second direction based on the read distance information can be performed by the reading control module 230 alone, or by the reading control module 230 in cooperation with other subsequent modules connected with the reading control module 230.

[0045] According to the above technical solution, the position information and the distance information of the workpiece to be processed are received in real time by the data receiving module, and the movement of the processing head is controlled in real time by the reading control module during the process that the workpiece to be processed is in the effective processing area. This scheme can accurately determine the working position of the focusing mechanism, and helps to improve the stability of the following.

[0046] For the convenience of understanding hereinafter, the "effective collection area" and "effective processing area" described in this paper will be introduced below taking a wafer as an example.

[0047] Figure 3 A schematic diagram of a wafer sheet (Wafer) containing a wafer is shown according to one embodiment of the present application. Generally, on the Wafer, the wafer is fixed on a film, and a metal iron frame is fixed on the outer periphery of the film. As shown inFigure 3 As shown, the edge where B point and E point are located is the iron frame edge on the wafer. The edge where C point and D point are located is the wafer edge, and the circular area surrounded by the wafer edge is the wafer area. During the movement of the wafer along the X axis, the distance measuring mechanism will be aligned with each point on the wafer one by one. For example, when the wafer edge passes the distance measuring mechanism (or vice versa, the distance measuring mechanism passes the wafer edge), the distance information measured by the distance measuring mechanism will have a jump, so based on this jump, it can be judged whether the edge position of the wafer is detected. However, generally speaking, when B point or E point (iron frame edge) passes the distance measuring mechanism, the signal output of the distance measuring mechanism will also have a jump, but this is not the real wafer edge, and if this point is mistakenly considered as the wafer edge, it is easy to cause problems during processing. Therefore, in the embodiment of the present application, the area between BE is defined as the "effective collection area on the wafer", which does not include the edge where B point and E point are located. The effective collection area on the wafer can be an area larger than the wafer area, and the starting point of the effective collection area on the wafer can be a point between B point and C point, and the ending point can be a point between D point and E point.

[0048] It should be noted that although Figure 3 The various areas or position points are described in the above embodiment by taking the points on the wafer as examples, but it can be understood that these areas and position points can be mapped to the areas or position points in the movement range when the wafer and the processing head move relatively, that is, there is an actual movement area corresponding to the "effective collection area on the wafer" in the movement range, which is referred to as "effective collection area" herein. For example, when the wafer reaches the collection starting point of the effective collection area, the distance measuring mechanism can be aligned with the starting point of the effective collection area on the wafer, that is, the distance information collected by the distance measuring mechanism is the distance information at the starting point of the effective collection area on the wafer. When the wafer reaches the collection ending point of the effective collection area, the distance measuring mechanism can be aligned with the ending point of the effective collection area on the wafer, that is, the distance information collected by the distance measuring mechanism is the distance information at the ending point of the effective collection area on the wafer.

[0049] The start point and the end point of the effective collection region have corresponding position information, i.e., corresponding grating ruler readings. The position information measured by the grating ruler can be used to determine whether the wafer enters the effective collection region. Optionally, the data receiving module 210 can only receive (i.e., sample) the distance information corresponding to the time when the wafer enters the effective collection region, and / or the data storage module 220 can only store the distance information corresponding to the time when the wafer enters the effective collection region. In this way, the distance information stored in the data storage module 220 will only have a signal jump when the distance measuring mechanism reaches the C point or the D point (the edge of the wafer). Illustratively but not limitatively, the position information corresponding to the effective collection region on the X axis can be pre-set by the user through the interaction module, and can be optionally stored in the second data storage module. The second data storage module can be the data storage module 220 (which can be referred to as the first data storage module), or a storage module independent of the data storage module 220.

[0050] In one example, when the wafer reaches the start point of the effective collection region, the data receiving module 210 can start sampling the distance information, and sequentially store the sampled distance information in the data storage module 220 after at least one down-sampling. However, the control system 200 does not start implementing the following control from the start point of the effective collection region. The following control is to output a real-time control signal to the focusing mechanism to control the focusing mechanism (i.e., the machining head) to follow the distance information to move up and down. The control system 200 can implement the following control from the time when the wafer enters the effective machining region, which can also be referred to as the following region. Continue to refer to Figure 3 In one embodiment, the region surrounded by the edges where the C point and the D point are located (i.e., the wafer region) can be regarded as the effective machining region on the wafer. In another embodiment, a region located inside the wafer region, i.e., smaller than the wafer region, can be regarded as the effective machining region on the wafer. In theory, the following control (i.e., the machining) can be implemented from the time when the distance measuring mechanism is aligned with one side of the wafer edge to the time when the distance measuring mechanism is aligned with the other side of the wafer edge. However, due to the signal jump at the wafer edge, the real-time control signal generated based on the distance information will also have a jump, resulting in inaccurate following. Therefore, after the distance measuring mechanism is aligned with one side of the wafer edge, the distance measuring mechanism can continue to move a certain distance, e.g., a first correction distance i1, before the following control is started. At this time, the position on the workpiece to be machined corresponding to the following control is the machining start point of the effective machining region, which can also be regarded as the following start position. Conversely, before the distance measuring mechanism is aligned with the other side of the wafer edge, the distance measuring mechanism can stop following a certain distance, e.g., a second correction distance i2, before the following control is ended. At this time, the position on the workpiece to be machined corresponding to the following control is the machining end point of the effective machining region, which is the following end position. That is, the following control can be started late and ended early to avoid the problem of signal jump caused by the wafer edge.

[0051] Similarly to the effective collection area on the wafer, in the moving range of the wafer and the processing head, there is an actual moving area corresponding to the above-mentioned "effective processing area on the wafer", which is referred to as "effective processing area" herein. For example, when the wafer reaches the processing start point of the effective processing area, the ranging mechanism can be aligned with the start point of the effective processing area on the wafer, i.e. the distance information collected by the ranging mechanism is the distance information at the start point of the effective processing area on the wafer. When the wafer reaches the processing end point of the effective processing area, the ranging mechanism can be aligned with the end point of the effective processing area on the wafer, i.e. the distance information collected by the ranging mechanism is the distance information at the end point of the effective processing area on the wafer.

[0052] According to an embodiment of the present application, the reading control module 230 can be further configured to determine whether the workpiece reaches a target position point on the effective processing area according to the position information and the distance information, the target position point being the processing start point or the processing end point.

[0053] As can be understood from the above description, the meaning of the effective processing area is not repeated here. In this embodiment, the reading control module 230 determines whether the workpiece reaches the processing start point or the processing end point on the effective processing area according to the position information and the distance information. This scheme can realize automatic and real-time determination of the effective processing area. Of course, this scheme is only an example and not a limitation of the present application. For example, the user can also input the position information corresponding to the processing start point and the processing end point of the effective processing area through an interactive module. In this way, when the position information received by the data receiving module 210 is equal to the position information corresponding to the processing start point or the processing end point, it can be directly determined that the workpiece reaches the processing start point or the processing end point.

[0054] According to an embodiment of the present application, the reading control module 230 can determine whether the workpiece reaches a target position point on the effective processing area according to the position information and the distance information by: determining whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece according to the change range of the distance information; in the case of determining that the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece, determining the target position information corresponding to the target position point based on the position information corresponding to the currently received distance information; and determining that the workpiece is at the target position point when the position information received by the data receiving module 210 is the target position information.

[0055] In one embodiment, whether there is a signal jump, i.e., a sudden change, can be determined according to the distance information measured by the distance measuring mechanism, and then whether the position on the wafer corresponding to the currently received distance information is the edge of the wafer can be determined. In the embodiment of the present application, the case where the change range of the distance information is relatively obvious is regarded as the existence of a signal jump. For example, when the change range of the distance information exceeds a change range threshold, it can be determined that there is a signal jump, i.e., it indicates that the distance measuring mechanism has been aligned with the edge of the wafer, or in other words, the distance measuring mechanism has reached above the edge of the wafer. The change range threshold can be set to any suitable size as needed. For example, the change range threshold can be any value greater than or equal to the product thickness of the workpiece to be processed, which is set according to the product thickness of the workpiece to be processed. In one embodiment, the change range threshold can be pre-set by the user through the interaction module, and can be optionally stored in the third data storage module. The third data storage module can be the second data storage module, the data storage module 220 described above, or a storage module contained in the reading control module 230, or a storage module independent of the second data storage module, the data storage module 220 and the reading control module 230.

[0056] The change range of the distance information can be calculated in units of data point groups in the distance information, i.e., the change range within each data point group is calculated. Each data point group can include two or more data points, i.e., distance information corresponding to two or more position points. The two adjacent data point groups can share the data points at the boundary, or can not share any data points. Exemplarily, for each data point group, the difference between the first and last data points in the data point group can be calculated as the change range of the data point group. For example, when the change range between the current data point and the previous data point in the distance information is greater than the change range threshold, it can be determined that the position on the wafer corresponding to the current data point collected by the distance measuring mechanism is the edge of the wafer. Subsequently, the target position information when the wafer is at the target position point can be determined based on the position information corresponding to the current data point.

[0057] In one embodiment, when the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece, the position information corresponding to the currently received distance information can be directly determined as the target position information. For example, if the change range exceeds the change range threshold for the first time, the position information corresponding to the currently received distance information can be determined as the position information corresponding to the workpiece at the start point of processing (for convenience of description, referred to as third position information). If the change range exceeds the change range threshold for the second time, the position information corresponding to the currently received distance information can be determined as the position information corresponding to the workpiece at the end point of processing (for convenience of description, referred to as fourth position information).

[0058] In another embodiment, in the case that the position on the workpiece corresponding to the currently received distance information is an edge of the workpiece, the third position information X3 corresponding to the machining start point of the workpiece reaching the effective machining region and / or the fourth position information X4 corresponding to the machining end point of the workpiece reaching the effective machining region can be determined according to the position information corresponding to the currently received distance information in combination with the correction distance, wherein X3=X5+i1, X5 represents the position information corresponding to the currently received distance information when the currently received distance information corresponds to the starting edge of the workpiece, and i1 represents the first correction distance; and / or wherein X4=X6-i2, X6 represents the position information corresponding to the currently received distance information when the currently received distance information corresponds to the ending edge of the workpiece, and i2 represents the second correction distance. As described above, due to the signal jump at the edge of the wafer, the real-time control signal generated based on the distance information will also have a jump, resulting in inaccurate following. Therefore, after the distance measuring mechanism is aligned with one side of the wafer edge, it can continue to move a certain distance, for example, the first correction distance i1, before starting to follow. Conversely, there is still a certain distance, for example, the second correction distance i2, before the distance measuring mechanism is aligned with the other side of the wafer edge, and the following is ended. That is, the following can be started late and ended early to avoid the problem of signal jump caused by the edge of the wafer.

[0059] When the position information received by the data receiving module 210 is target position information (i.e., the third position information or the fourth position information), it can be determined that the wafer is at the target position point.

[0060] According to the above technical solution, whether the position on the workpiece corresponding to the currently received distance information is an edge of the workpiece is determined according to the change amplitude of the distance information, and then the position information corresponding to the machining start point or the machining end point is determined. This edge judgment-based scheme can simply and accurately determine the position information corresponding to the machining start point or the machining end point.

[0061] According to the embodiment of the present application, the machining device includes a distance measuring mechanism for measuring distance information, the position information includes position information corresponding to each different position point of the workpiece, and the distance information includes distance information corresponding to each different position point of the workpiece. The reading control module 230 can read the corresponding distance information from the data storage module 220 in the following manner: determining the second position information X2 according to the first position information X1 corresponding to at least one position point in the effective machining region; reading the distance information corresponding to the first position information X1 from the data storage module 220 when the position information received by the data receiving module 210 is the second position information X2; wherein the second position information X2 satisfies the following formula: X2=X1+δx1, and δx1 represents the distance between the distance measuring mechanism and the machining head in the first direction.

[0062] Referring back to Figure 1 , the distance measuring mechanism and the machining head have a certain distance in the first direction, which is denoted by δx1. From the above description, it can be understood that the distance measuring mechanism can first reach above any position point, and then the workpiece to be machined and / or the machining head moves a certain distance before the machining head reaches above the position point. Therefore, for any position point, if the machining is performed once the position information received by the data receiving module 210 is equal to the position information corresponding to the distance information measured by the distance measuring mechanism at the position point, the machining is actually not performed above the position point, and thus the machining has a certain error. For any position point, adding its original position information to δx1 can compensate for the error, so that the machining position of the machining head is more accurate.

[0063] It should be noted that the above first position information X1 is position information corresponding to each of the at least one position point, i.e., each of the at least one position point corresponds to its own first position information X1 (i.e., the original position information without error compensation). And for each of the at least one position point, its corresponding first position information X1 can be added to δx1 to obtain the corresponding second position information X2 (i.e., the new position information after error compensation).

[0064] The position points in the effective machining area can include the machining start point and the machining end point, i.e., for these two position points, the above error compensation operation based on δx1 can also be performed.

[0065] According to the above technical solution, the error caused by the installation distance between the distance measuring mechanism and the machining head can be compensated, thereby effectively improving the machining accuracy.

[0066] According to the embodiment of the present application, the processing device further comprises a distance measuring mechanism for measuring distance information and a focusing mechanism for driving the processing head to move in the second direction, the position information comprises position information corresponding to each different position point of the workpiece, and the distance information comprises distance information corresponding to each different position point of the workpiece. The reading control module 230 can read the corresponding distance information from the data storage module in the following manner: determining the second position information X2 according to the first position information X1 corresponding to at least one position point in the effective processing area; reading the distance information corresponding to the first position information X1 from the data storage module 220 when the position information received by the data receiving module 210 is the second position information X2; wherein the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, δx1 represents the distance between the distance measuring mechanism and the processing head in the first direction, and δx2 represents the movement distance of the workpiece relative to the processing head in the first direction within the response time of the focusing mechanism.

[0067] When the following control is performed, a certain response time is required from sending the control signal to the focusing mechanism 140 to the response of the focusing mechanism 140. In the laser processing device, the following accuracy in the movement direction of the wafer (i.e. the X-axis direction) is required to be relatively high, which needs to reach the micron level. However, the response time of the piezoelectric ceramic motor is in the order of milliseconds, which will directly affect the X-axis following accuracy, and even affect the final cutting accuracy. Therefore, the error caused by the response time of the focusing mechanism can be considered to be compensated.

[0068] In one embodiment, the response time of the focusing mechanism can be considered to be fixed, i.e. δx2 is fixed. In this case, the value of δx2 can be set in advance. For each position point, the calculation of the second position information X2 is uniformly based on the preset δx2. Exemplarily, the user can set δx2 through the interaction module, and the set δx2 can be optionally stored in a fourth data storage module. The fourth data storage module can be the second data storage module, the third data storage module, the data storage module 220, or a storage module included in the reading control module 230, or a storage module independent of the second data storage module, the third data storage module, the data storage module 220 and the reading control module 230.

[0069] In another embodiment, the response time corresponding to the plurality of position points can be determined by the rate of change of the distance information corresponding to the plurality of position points, the δx2 corresponding to the plurality of position points is determined based on the response time, and the second position information X2 corresponding to the plurality of position points is obtained by error compensation for the first position information X1 corresponding to the plurality of position points based on the determined δx2. In this scheme, the position points in the effective processing area can be grouped, and each group of position points can include a plurality of position points. Adjacent position point groups can share position points at the boundary or can not share any position points. For any two different position point groups, if their rates of change are different, the corresponding response times will also be different, and thus the compensated distances δx2 will be different. The reason for implementing this scheme is that the response time of the focusing mechanism 140 is related to the step of the input signal and is basically independent of the amplitude of the input signal. The following is an example of a piezoelectric ceramic motor. When the input signal is a sine (sin) waveform, the response time of the piezoelectric ceramic motor is about 2.7 ms; when the input signal is a pulse waveform, the response time of the piezoelectric ceramic motor is about 5 ms. Exemplarily, an external signal (for example, a signal generated by a signal generator) can be used as an input signal and input into the focusing mechanism 140 for testing. By adjusting the slope of the input signal, a relationship function between the slope k1 of the input signal and the response time y, for example, y = f(k1), can be fitted. In this way, after the rates of change of the plurality of position points are determined, the corresponding response times can be determined based on the above relationship function.

[0070] The above scheme with a fixed response time has simple algorithm, low requirements for software and hardware, and low cost, while the scheme with real-time response time has good following performance and high processing precision.

[0071] According to the above technical scheme, the scheme can compensate for errors caused by the response time and the installation distance between the distance measuring mechanism and the processing head, thereby effectively improving the processing precision.

[0072] According to the embodiment of the application, the processing device further comprises a focusing mechanism for driving the processing head to move in the second direction, and the system further comprises: a first data processing module connected with the reading control module, configured to perform digital-analog fitting based on the read distance information received from the reading control module to obtain a fitting signal; and an output module connected with the first data processing module, configured to generate a corresponding real-time control signal based on the fitting signal and output the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to move to a focus position matched with the distance information in the second direction.

[0073] In one embodiment, the control system 200 can further comprise a first data processing module and an output module. Figure 4An exemplary structure diagram of the control system 200 according to an embodiment of the present application is shown. It should be noted that Figure 4 The various modules in the control system 200 shown are merely examples and are not limiting to the present application, and various modules therein can be omitted or replaced by other modules, and the control system 200 can further include Figure 4 other modules than those shown. In addition, Figure 4 The connection relationship of the various modules shown can also be adjusted.

[0074] Referring to Figure 4 , a first data processing module is shown. The first data processing module can be a digital-analog (DA) fitting output module, which is connected with the reading control module 230. The first data processing module can perform digital-analog fitting according to the distance information received from the reading control module 230 by the formula y=k2h+b. Wherein h represents the distance information measured by the distance measuring mechanism, k2 and b can be pre-set, and y can represent the fitting signal obtained after fitting. Referring to Figure 4 , an output module is also shown. The output module is connected with the first data processing module, and the fitting signal obtained by the first data processing module can be transmitted into the output module. The output module can generate a corresponding real-time control signal according to the fitting signal, and output the real-time control signal to the focusing mechanism. The real-time control signal can control the focusing mechanism to drive the machining head to move in the second direction to the focus position matched with the distance information read by the distance measuring mechanism.

[0075] Exemplarily, referring to Figure 4 , the output module can include an output control sub-module and a data output sub-module. The output control sub-module can be a DA output control sub-module, which is used to control the data output sub-module to output the real-time control signal. The data output sub-module can be a digital-analog conversion (DAC) sub-module, which can perform digital-analog conversion and other operations on the real-time control signal, obtain an analog real-time control signal and output the signal to the focusing mechanism.

[0076] In addition, referring to Figure 4 , the first data receiving module and the second data receiving module described above are also shown, and referring to the description above, the functions of the first data receiving module and the second data receiving module can be understood, which will not be described here. In addition, referring to Figure 4 , a second data processing module is also shown. The second data processing module can be understood as the first downsampling module described above. That is, the second data processing module can downsample the distance information received by the first data receiving module, and can optionally perform sliding filtering. In addition, Figure 4It is also shown that the output signal frequency of the first data receiving module is 200 Mbps, the output signal frequency of the second data processing module is 500 Kbps, and the output signal frequency of the second data receiving module (which can be the pulse output frequency of a position measurement mechanism such as a grating ruler) is 500 KHz, but these are only examples, and these frequencies can be adjusted as needed.

[0077] According to the above technical solution, based on the first data processing module and the output module, a fitting signal can be obtained and a corresponding real-time control signal can be generated according to the fitting signal, so that the focusing mechanism can be automatically controlled to drive the machining head to move in the second direction. This scheme has high automation degree.

[0078] Exemplarily, the system further comprises a first interaction module connected with the output module, configured to obtain the first indication information from the host computer, and the output module is further configured to generate a fixed control signal based on the first indication information before the machining head reaches the machining starting point in the effective machining area, and output the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the machining head to remain at a fixed position in the second direction.

[0079] In one embodiment, the control system 200 can further comprise a first interaction module. Referring to Figure 4 , an interaction module is shown, which can comprise a first interaction module. The first interaction module can comprise any wired and / or wireless communication interface to communicate with the host computer through these communication interfaces and receive the first indication information from the host computer. For example, the first interaction module can comprise one or more of an RS232 interface, a Bluetooth interface, a WiFi interface, a Universal Serial Bus (USB) interface, etc. In addition, the first interaction module can further comprise an instruction configuration submodule configured to transmit the indication information to the corresponding module based on the type of the indication information received from the host computer. For example, upon receiving the first indication information, the instruction configuration submodule can transmit the first indication information to the output module for corresponding output control. For another example, upon receiving the second indication information described below, the instruction configuration submodule can transmit the second indication information to the judgment module for corresponding judgment.

[0080] The user can input the first position information into the host computer through a mouse, a keyboard, a touch screen, etc. input device, and the host computer can transmit the first indication information to the first interaction module. Referring to Figure 4The first interaction module can be connected with the output module. The first indication information can indicate an arbitrary voltage value based on which the focusing mechanism can be started, but the focusing mechanism does not move in the second direction but remains in a fixed position. When the workpiece to be processed enters the effective processing area, the output module can generate a fixed control signal based on the first indication information. Then the fixed control signal is output to the focusing mechanism to control the focusing mechanism to drive the processing head to remain fixed in the vertical direction.

[0081] Exemplarily, the first interaction module can be connected with the output control submodule and transmit the first indication information to the output control submodule. When the output control submodule receives the first indication information, it controls the data output submodule to output a fixed control signal. When the output control submodule receives the fitting signal, it can control the data output submodule to output a real-time control signal.

[0082] The first indication information can include a "register" value for indicating the size of the fixed control signal. The register value has a preset corresponding relationship with the voltage value. For example, when the register value transmitted by the host computer to the first interaction module is 0 (before and after the follow-up control is implemented), the output module can correspondingly output a fixed voltage (for example, according to the corresponding relationship between the register value and the voltage value pre-configured in the FPGA). For another example, the host computer can also output third indication information to the first interaction module. Assuming that the register value included in the third indication information is 1, the size of the voltage output by the output module can be calculated in real time according to the distance information (i.e. in the case of real-time follow-up control).

[0083] Optionally, for the case after the real-time follow-up control, in order to avoid the piezoelectric ceramic motor from shaking caused by the edge signal jumping, the voltage corresponding to the register value 0 can not be used after the follow-up control is implemented, but the follow-up voltage corresponding to the last position point when the follow-up control is implemented is maintained (i.e. the size of the real-time control signal corresponding to the last position point). For this case, the host computer can not need to send the register value 0 to the interaction module after the follow-up control is implemented.

[0084] According to the above technical solution, based on the first interaction module, the first indication information can be received, and a fixed control signal can be generated based on the first indication information, so that the processing head driven by the focusing mechanism can be kept in a suitable position according to user demand before the follow-up control is implemented.

[0085] Exemplarily, the reading control module is further configured to control the data storage module to store the distance information in a process that the workpiece moves from the collection start point to the collection end point of the effective collection area, the effective collection area comprising the effective processing area, and the system further comprises a judging module connected with the data receiving module and the reading control module, configured to determine whether the workpiece reaches the collection start point or the collection end point according to the position information; and a second interaction module connected with the judging module, configured to obtain the second indication information from the host computer, and the judging module determines the position information corresponding to the collection start point and the collection end point respectively based on the second indication information.

[0086] The second interaction module can be the same interaction module (e.g. Figure 4 the interaction module shown) as the first interaction module, or can be two separate interaction modules. Similarly to the first interaction module, the second interaction module can include any wired and / or wireless communication interface to communicate with the host computer and receive the second indication information from the host computer through the communication interface. For example, the second interaction module can include one or more of an RS232 interface, a Bluetooth interface, a WiFi interface, a universal serial bus (USB) interface, etc. In the case that the first interaction module and the second interaction module are implemented by the same interaction module, the interaction module can include the instruction configuration sub-module described above. In the case that the first interaction module and the second interaction module are two separate interaction modules, the first interaction module and the second interaction module can optionally omit the instruction configuration sub-module.

[0087] In one embodiment, the reading control module 230 can also be configured to control the data storage module 220 to store the distance information collected by the distance measuring mechanism in a process that the wafer moves from the collection start point to the collection end point of the effective collection area. Figure 5 The control system 200 can further include a judging module, as shown. The judging module can be connected with the second data receiving module and the second interaction module. The user can input the second position information into the host computer through a mouse, a keyboard, a touch screen, etc. The host computer can transmit the second indication information to the second interaction module. The second indication information can include the position information corresponding to the collection start point and the collection end point respectively. For example, the user can input the measurement value on the grating ruler corresponding to the collection start point and the collection end point respectively in an information input box in the user interface displayed on the host computer by using the keyboard. The judging module can determine in real time whether the current workpiece reaches the collection start point or the collection end point according to the position information received by the data receiving module 210. The reading control module 230 can control the data storage module 220 to store the distance information in a process that the workpiece moves from the collection start point to the collection end point of the effective collection area according to the determination result of the judging module.

[0088] According to the technical solution, whether the workpiece to be processed is at the start point and the end point of the collection area can be automatically determined, and the distance information can be stored by the data storage module during the process that the workpiece to be processed is at the start point and the end point of the effective collection area. The technical solution can effectively save storage space and reduce the workload of the control system 200.

[0089] According to another aspect of the present application, a control method for a processing device is also provided. Figure 5 A schematic flow chart of a control method 500 for a processing device according to an embodiment of the present application is shown. Referring to Figure 6 The control method 500 for a processing device includes steps S510, S520 and S530.

[0090] In step S510, the position information of the workpiece to be processed and the distance information corresponding to the position information are received in real time. The position information is used to indicate the position of the workpiece to be processed in the first direction when the workpiece to be processed moves relative to the processing head of the processing device in the first direction. The distance information is used to indicate the distance between the workpiece to be processed and the processing head in the second direction when the workpiece to be processed moves relative to the processing head in the first direction.

[0091] In step S520, the distance information is stored.

[0092] In step S530, when it is determined that the workpiece to be processed is in the effective processing area based on at least the position information, the corresponding distance information is read from the start point of the effective processing area, and the focusing mechanism of the processing device is controlled to drive the processing head to move to the focal point position matching the distance information in the second direction based on the read distance information.

[0093] According to an embodiment of the present application, the method 500 further includes: determining whether the workpiece to be processed reaches a target position point on the effective processing area according to the position information and the distance information, the target position point being the start point or the end point of the processing.

[0094] According to an embodiment of the present application, determining whether the workpiece to be processed reaches a target position point on the effective processing area according to the position information and the distance information includes: determining whether the position on the workpiece to be processed corresponding to the currently received distance information is the edge of the workpiece to be processed according to the change range of the distance information; in the case of determining that the result is yes, determining the target position information corresponding to the target position point based on the position information corresponding to the currently received distance information; and determining that the workpiece to be processed is at the target position point when the position information received by the data receiving module is the target position information.

[0095] According to an embodiment of the present invention, the processing apparatus includes a ranging mechanism for measuring distance information. The position information includes position information corresponding one-to-one with each different position point of the workpiece to be processed, and the distance information includes distance information corresponding one-to-one with each different position point of the workpiece to be processed. Reading the corresponding distance information includes: determining second position information X2 based on first position information X1 corresponding to at least one position point in the effective processing area; when the currently received position information is second position information X2, reading the distance information corresponding to the first position information X1 from the data storage module; wherein the second position information X2 satisfies the following formula: X2=X1+δx1, where δx1 represents the distance between the ranging mechanism and the processing head in the first direction.

[0096] According to an embodiment of the present invention, the processing device includes a ranging mechanism and a focusing mechanism. The ranging mechanism is used to measure distance information, and the focusing mechanism is used to drive the processing head to move in a second direction. The position information includes position information corresponding one-to-one with each different position point of the workpiece to be processed, and the distance information includes distance information corresponding one-to-one with each different position point of the workpiece to be processed. Reading the corresponding distance information includes: determining second position information X2 based on first position information X1 corresponding to at least one position point in the effective processing area; when the currently received position information is second position information X2, reading the distance information corresponding to the first position information X1 from the data storage module; wherein, the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, where δx1 represents the distance between the ranging mechanism and the processing head in the first direction, and δx2 represents the moving distance of the workpiece to be processed relative to the processing head in the first direction during the response time of the focusing mechanism.

[0097] According to another aspect of the present invention, an electronic device is also provided. Figure 6 A schematic block diagram of an electronic device 600 according to an embodiment of the present invention is shown, such as... ​ As shown, the electronic device 600 may include a processor 610 and a memory 620. The memory 620 stores a computer program, and the processor 610 executes the computer program to implement the aforementioned control method for the processing apparatus.

[0098] According to another aspect of the present application, there is also provided a storage medium. A program instruction is stored on the storage medium, and the program instruction, when executed, causes the control method for a processing apparatus as described above to be performed. The storage medium can include, for example, a storage component of a tablet, a hard disk of a personal computer, a read only memory (ROM), an erasable programmable read only memory (EPROM), a portable compact disc read only memory (CD-ROM), a USB memory, or any combination of the above storage media. The computer readable storage medium can be any combination of one or more computer readable storage media.

[0099] Those skilled in the art can understand the specific implementation of the above-mentioned control method for a processing apparatus, electronic device and storage medium by reading the above description related to the control system 200 for a processing apparatus. For brevity, the specific implementation will not be described here again.

[0100] Although the example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the example embodiments are only exemplary and are not intended to limit the scope of the present application thereto. Those skilled in the art can make various changes and modifications without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.

[0101] Those skilled in the art can appreciate that the units and algorithm steps of each example described in connection with the embodiments disclosed herein can be implemented in electronic hardware, or in a combination of computer software and electronic hardware. Whether the functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0102] It should be noted that the above-described embodiments illustrate the present application, but do not limit it, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in the claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claim enumerating several means, several of these means can be embodied by one and the same item of hardware. The use of the words first, second and third, etc. does not imply any order. These words have been used to name the circumstances in which the embodiments have been described, but they are not used to imply any specific order. The word "another" means at least one.

[0103] The above merely describes specific embodiments or specific implementation of the present application, and the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. The protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A control system for a processing apparatus, characterized in that, include: The data receiving module is used to receive in real time the position information of the workpiece to be processed and the distance information corresponding to the position information. The position information is used to indicate the position of the workpiece to be processed in the first direction when it moves relative to the processing head of the processing device. The distance information is used to indicate the distance between the processing head and the workpiece to be processed in the second direction when the workpiece to be processed moves relative to the processing head in the first direction. Data storage module, used to store the distance information; A read control module, connected to the data storage module and the data receiving module, is used to read the corresponding distance information from the data storage module starting from the processing start point of the effective processing area when the workpiece to be processed is determined to be within the effective processing area based on the position information or the position information and the distance information, so as to control the processing head to move in the second direction to a focal position matching the distance information based on the read distance information.

2. The system of claim 1, wherein, The reading control module is also used to determine, based on the position information and the distance information, whether the workpiece to be processed has reached the target position point on the effective processing area, wherein the target position point is the processing start point or the processing end point.

3. The system of claim 2, wherein, The reading control module determines whether the workpiece to be processed has reached the target location point on the effective processing area based on the location information and the distance information in the following manner: Based on the change range of the distance information, determine whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece; If the judgment result is yes, based on the location information corresponding to the currently received distance information, determine the target location information corresponding to when the workpiece to be processed is at the target location point; When the location information received by the data receiving module is the target location information, it is determined that the workpiece to be processed is at the target location point.

4. The system according to any one of claims 1-3, characterized in that, The processing device includes a ranging mechanism for measuring distance information. The position information includes location information corresponding one-to-one with each different location point of the workpiece to be processed. The distance information includes distance information corresponding one-to-one with each different location point of the workpiece to be processed. The read control module reads the corresponding distance information from the data storage module in the following manner: For each of at least one location point within the effective processing area, a second location information X2 is determined based on the first location information X1 corresponding to that location point; When the location information received by the data receiving module is the second location information X2, the distance information corresponding to the first location information X1 is read from the data storage module; Wherein, the second position information X2 satisfies the following formula: X2=X1+δx1, where δx1 represents the distance between the ranging mechanism and the processing head in the first direction.

5. The system according to any of claims 1-3, characterized in that, The processing device further includes a ranging mechanism and a focusing mechanism. The ranging mechanism is used to measure the distance information, and the focusing mechanism is used to move the processing head in the second direction. The position information includes position information corresponding one-to-one with each different position point of the workpiece to be processed, and the distance information includes distance information corresponding one-to-one with each different position point of the workpiece to be processed. The read control module reads the corresponding distance information from the data storage module in the following manner: For each of at least one location point within the effective processing area, a second location information X2 is determined based on the first location information X1 corresponding to that location point; When the location information received by the data receiving module is the second location information X2, the distance information corresponding to the first location information X1 is read from the data storage module; Wherein, the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, where δx1 represents the distance between the ranging mechanism and the processing head in the first direction, and δx2 represents the distance the workpiece to be processed moves relative to the processing head in the first direction within the response time of the focusing mechanism.

6. The system of any one of claims 1-3, wherein, The processing apparatus further includes a focusing mechanism, which is used to drive the processing head to move in the second direction. The system also includes: The first data processing module, connected to the reading control module, is used to perform numerical simulation and obtain a fitted signal based on the distance information read from the reading control module. The output module, connected to the first data processing module, is used to generate a corresponding real-time control signal based on the fitted signal and output the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to move in the second direction to a focal position that matches the distance information.

7. The system of claim 6, wherein, The system also includes: The first interaction module, connected to the output module, is used to obtain first indication information from the host computer. The output module is further used to generate a fixed control signal based on the first indication information before the processing head is at the processing start point in the effective processing area, and output the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to stay in a fixed position in the second direction.

8. The system of any of claims 1-3, wherein, The reading control module is also used to control the data storage module to store the distance information during the process of the workpiece being collected at the start and end points of the effective collection area, wherein the effective collection area includes the effective processing area. The system also includes: The judgment module, connected to the data receiving module and the reading control module, is used to determine whether the workpiece to be processed has reached the acquisition start point or the acquisition end point based on the position information. The second interaction module, connected to the judgment module, is used to obtain second indication information from the host computer. The judgment module determines the location information corresponding to the collection start point and the collection end point based on the second indication information.

9. A control method for a processing apparatus, characterized by, include: The device receives in real time the position information of the workpiece to be processed and the distance information corresponding to the position information. The position information is used to indicate the position of the workpiece to be processed in the first direction when it moves relative to the processing head of the processing device. The distance information is used to indicate the distance between the processing head and the workpiece to be processed in the second direction when the workpiece to be processed moves relative to the processing head in the first direction. Store the distance information; When it is determined that the workpiece to be processed is within the effective processing area based on the location information or the location information and the distance information, starting from the processing start point of the effective processing area, the corresponding distance information is read, and the focusing mechanism of the processing device is controlled in real time based on the read distance information to drive the processing head to move in the second direction to a focal position that matches the distance information.

10. The method of claim 9, wherein, The method further includes: Based on the location information and the distance information, it is determined whether the workpiece to be processed has reached the target location point on the effective processing area, where the target location point is the processing start point or the processing end point.

11. The method of claim 10, wherein, The step of determining whether the workpiece to be processed has reached the target location point on the effective processing area based on the location information and the distance information includes: Based on the change range of the distance information, determine whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece; If the judgment result is yes, based on the location information corresponding to the currently received distance information, determine the target location information corresponding to when the workpiece to be processed is at the target location point; When the received location information is the target location information, it is determined that the workpiece to be processed is at the target location point.

12. The method according to any one of claims 9-11, characterized in that, The processing device includes a ranging mechanism for measuring distance information. The position information includes location information corresponding one-to-one with each different location point of the workpiece to be processed. The distance information includes distance information corresponding one-to-one with each different location point of the workpiece to be processed. The reading of the corresponding distance information includes: For each of at least one location point within the effective processing area, a second location information X2 is determined based on the first location information X1 corresponding to that location point; When the currently received location information is the second location information X2, read the distance information corresponding to the first location information X1; Wherein, the second position information X2 satisfies the following formula: X2=X1+δx1, where δx1 represents the distance between the ranging mechanism and the processing head in the first direction.

13. The method according to any one of claims 9-11, characterized in that, The processing device includes a ranging mechanism and a focusing mechanism. The ranging mechanism is used to measure the distance information, and the focusing mechanism is used to move the processing head in the second direction. The position information includes position information corresponding one-to-one with each different position point of the workpiece to be processed, and the distance information includes distance information corresponding one-to-one with each different position point of the workpiece to be processed. The reading of the corresponding distance information includes: For each of at least one location point within the effective processing area, a second location information X2 is determined based on the first location information X1 corresponding to that location point; When the currently received location information is the second location information X2, read the distance information corresponding to the first location information X1; Wherein, the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, where δx1 represents the distance between the ranging mechanism and the processing head in the first direction, and δx2 represents the distance the workpiece to be processed moves relative to the processing head in the first direction within the response time of the focusing mechanism.

14. An electronic device comprising a processor and a memory, wherein, The memory stores computer program instructions, which, when executed by the processor, are used to perform the control method for the processing apparatus as described in any one of claims 9 to 13.

15. A storage medium having stored thereon program instructions which, when executed by a processor, cause the processor to perform the method of any of claims 1 to 14. The program instructions, when executed, are used to perform the control method for the processing apparatus as described in any one of claims 9 to 13.

Images