Wafer ink dot marking method and device

Abstract

This application provides a wafer ink dot marking method and apparatus. The method includes: acquiring a wafer map of a target wafer, the wafer map being used to describe whether the wafer test results of each chip among a plurality of chips on the target wafer are qualified chips; determining a first region corresponding to each qualified chip in the wafer map; calculating a weighted score value for each qualified chip based on whether other chips in the first region corresponding to each qualified chip are qualified chips; for each qualified chip, determining whether the weighted score value of the qualified chip is greater than a preset value; if the weighted score value of the qualified chip is greater than the preset value, then marking the qualified chip with ink dots. This application automatically marks chips on the wafer with ink dots by referring to the wafer test results, solving the technical problem in the prior art where manual marking of unqualified chips in wafer testing leads to inaccurate marking, and achieving the technical effect of improving the accuracy of ink dot marking.

Description

Technical Field

[0001] The present application relates to the field of wafer manufacturing technology, and in particular to a wafer ink dot marking method and device. Background Art

[0002] In the prior art, after the wafer is produced, it is necessary to perform wafer testing (Chip Probing, CP testing) on ​​the wafer to detect the quality of each chip Die on the wafer. The user manually marks the defective chips on the wafer with ink dots based on the results of the wafer testing, thereby distinguishing the wafer quality based on whether there are ink dots on the wafer, and then facilitating the selection of qualified chips during the subsequent chip packaging and testing. Summary of the invention

[0003] In view of this, the purpose of the present application is to at least provide a wafer ink dot marking method and device, which automatically performs ink dot marking on the chips on the wafer by referring to the results of wafer testing, thereby solving the technical problem of manually performing ink dot marking on unqualified chips in wafer testing in the prior art, resulting in inaccurate marking, and achieving the technical effect of improving the accuracy of ink dot marking.

[0004] This application mainly includes the following aspects:

[0005] In a first aspect, an embodiment of the present application provides a wafer ink dot marking method, the method comprising: obtaining a wafer map of a target wafer, the wafer map being used to describe whether a wafer test result of each chip among a plurality of chips of the target wafer is a qualified chip; determining a first area corresponding to each qualified chip of the wafer map; calculating a weighted score value of each qualified chip based on whether other chips within the first area corresponding to each qualified chip are qualified chips; for each qualified chip, determining whether the weighted score value of the qualified chip is greater than a preset value; if the weighted score value of the qualified chip is greater than the preset value, marking the qualified chip with an ink dot.

[0006] Optionally, determining the first area corresponding to each qualified chip in the wafer map includes: treating the chip directly adjacent to each qualified chip as the directly adjacent chip of the qualified chip; treating the chip diagonally adjacent to each qualified chip as the diagonally adjacent chip of the qualified chip; combining each qualified chip with the directly adjacent chips and diagonally adjacent chips corresponding to the qualified chip into a second area, and determining the directly adjacent chips and diagonally adjacent chips of the second area; combining the directly adjacent chips and diagonally adjacent chips corresponding to each qualified chip with the directly adjacent chips and diagonally adjacent chips of the second area corresponding to the qualified chip as the first area corresponding to the qualified chip.

[0007] Optionally, a weighted score value of each qualified chip is calculated based on whether other chips in the first area corresponding to each qualified chip are qualified chips, including: calculating the weighted score value of each qualified chip based on the number of qualified chips of directly adjacent chips corresponding to each qualified chip, the number of qualified chips of diagonally adjacent chips, and the number of qualified chips of directly adjacent chips and diagonally adjacent chips in the second area corresponding to the qualified chip.

[0008] Optionally, a weighted score value of each qualified chip is calculated based on the number of qualified chips of the directly adjacent chips corresponding to each qualified chip, the number of qualified chips of the diagonally adjacent chips, and the number of qualified chips of the directly adjacent chips and the diagonally adjacent chips in the second area corresponding to the qualified chip, including: for each qualified chip, the number of unqualified chips of the directly adjacent chips of the qualified chip is taken as a first number, the number of unqualified chips of the diagonally adjacent chips of the qualified chip is taken as a second number, and the number of unqualified chips of the directly adjacent chips and the diagonally adjacent chips in the second area corresponding to the qualified chip is taken as a third number; multiplying the first number by a preset first coefficient to obtain a first product, multiplying the second number by a preset second coefficient to obtain a second product, and multiplying the third number by a preset third coefficient to obtain a third product; and taking the sum of the first product, the second product and the third product as the weighted score value of the qualified chip.

[0009] Optionally, the method also includes: determining whether all chips in the second area corresponding to each unqualified chip in the wafer image are marked with ink dots; if all chips in the second area corresponding to any unqualified chip in the wafer image are not marked with ink dots, then taking the unqualified chip as the target chip, and marking all chips in the second area corresponding to the target chip with ink dots.

[0010] Optionally, if all chips in the second area corresponding to any unqualified chip in the wafer image are not marked with ink dots, the unqualified chip is taken as the target chip, and all chips in the second area corresponding to the target chip are marked with ink dots. The method further includes: determining whether there are unqualified chips among other chips in the second area corresponding to the target chip; if there are unqualified chips among other chips in the second area corresponding to the target chip, taking the unqualified chips among other chips as new target chips, and re-determining whether there are unqualified chips among other chips in the second area corresponding to the target chip; if there are no unqualified chips among other chips in the second area corresponding to the target chip, re-determining whether all chips in the second area corresponding to each unqualified chip in the wafer image are marked with ink dots.

[0011] Optionally, the method further includes: marking each non-qualified chip in the wafer image with ink dots.

[0012] In a second aspect, an embodiment of the present application also provides a wafer ink dot marking device, the device comprising: an acquisition module, used to acquire a wafer map of a target wafer, the wafer map being used to describe whether a wafer test result of each chip among a plurality of chips of the target wafer is a qualified chip; a first determination module, used to determine a first area corresponding to each qualified chip of the wafer map; a calculation module, used to calculate a weighted score value of each qualified chip based on whether other chips in the first area corresponding to each qualified chip are qualified chips; a second determination module, used to determine, for each qualified chip, whether the weighted score value of the qualified chip is greater than a preset value; a marking module, used to mark the qualified chip with ink dots if the weighted score value of the qualified chip is greater than a preset value.

[0013] In a third aspect, an embodiment of the present application further provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and the machine-readable instructions are executed by the processor to execute the steps of the wafer ink dot marking method described in the first aspect or any possible implementation manner of the first aspect.

[0014] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the wafer ink dot marking method described in the first aspect or any possible implementation manner of the first aspect are executed.

[0015] The embodiment of the present application provides a wafer ink dot marking method and device, the method comprising: obtaining a wafer map of a target wafer, the wafer map being used to describe whether the wafer test result of each chip among a plurality of chips of the target wafer is a qualified chip; determining a first area corresponding to each qualified chip of the wafer map; calculating a weighted score value of each qualified chip based on whether other chips in the first area corresponding to each qualified chip are qualified chips; for each qualified chip, determining whether the weighted score value of the qualified chip is greater than a preset value; if the weighted score value of the qualified chip is greater than the preset value, marking the qualified chip with ink dots. The present application automatically marks the chips on the wafer with ink dots by referring to the results of the wafer test, thereby solving the technical problem in the prior art of manually marking unqualified chips with ink dots in the wafer test, which leads to inaccurate marking, and achieves the technical effect of improving the accuracy of ink dot marking.

[0016] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A flow chart of a wafer ink dot marking method provided in an embodiment of the present application is shown.

[0019] Figure 2 A wafer diagram provided in an embodiment of the present application is shown.

[0020] Figure 3 A schematic diagram of the first area corresponding to the qualified chip provided in the embodiment of the present application is shown.

[0021] Figure 4 A schematic diagram of ink dot marking on a wafer provided in an embodiment of the present application is shown.

[0022] Figure 5 A functional module diagram of a wafer ink dot marking device provided in an embodiment of the present application is shown.

[0023] Figure 6 A schematic structural diagram of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0024] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art, under the guidance of the content of the present application, can add one or more other operations to the flowchart, or remove one or more operations from the flowchart.

[0025] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0026] In the prior art, only unqualified chips determined in wafer testing are marked with ink dots, while qualified chips obtained in wafer testing may also be chips of unqualified quality, thereby affecting subsequent chip packaging and testing.

[0027] Based on this, an embodiment of the present application provides a wafer ink dot marking method and device, which automatically performs ink dot marking on the chips on the wafer by referring to the results of the wafer test, thereby solving the technical problem of manually performing ink dot marking on unqualified chips in the wafer test in the prior art, resulting in inaccurate marking, and achieves the technical effect of improving the accuracy of ink dot marking.

[0028] The details are as follows:

[0029] See also Figure 1 , Figure 1 This is a flow chart of a wafer ink dot marking method provided in an embodiment of the present application. Figure 1 As shown, the wafer ink dot marking method provided in the embodiment of the present application includes the following steps:

[0030] S101: Obtain a wafer map of a target wafer.

[0031] The wafer map is used to describe whether the wafer test result of each chip in the target wafer is a qualified chip. In other words, the wafer map marks each chip of the target wafer as a qualified chip or a non-qualified chip. Figure 2 , Figure 2 A wafer diagram is provided in an embodiment of the present application. Figure 2 As shown, the circular area refers to the wafer, and the wafer contains 4×4 chips. The chip corresponding to P is a qualified chip obtained by the wafer test, and the chip corresponding to F is an unqualified chip obtained by the wafer test.

[0032] S102: Determine a first region corresponding to each qualified chip in the wafer map;

[0033] Determine the first area corresponding to each qualified chip of the wafer map, including: using the chip directly adjacent to each qualified chip as the directly adjacent chip of the qualified chip; using the chip diagonally adjacent to each qualified chip as the diagonally adjacent chip of the qualified chip; combining each qualified chip with the directly adjacent chips and diagonally adjacent chips corresponding to the qualified chip into a second area, and determining the directly adjacent chips and diagonally adjacent chips of the second area; combining the directly adjacent chips and diagonally adjacent chips corresponding to each qualified chip with the directly adjacent chips and diagonally adjacent chips of the second area corresponding to the qualified chip as the first area corresponding to the qualified chip.

[0034] See also Figure 3 , Figure 3 This is a schematic diagram of the first area corresponding to the qualified chip provided in the embodiment of the present application. Figure 3 As shown, the qualified chip in the 3rd row and 3rd column is recorded as chip A, the chip in the 2nd row and 3rd column, the chip in the 3rd row and 2nd column, the chip in the 3rd row and 4th column and the chip in the 4th row and 3rd column are directly adjacent chips of chip A; the chip in the 2nd row and 2nd column, the chip in the 2nd row and 4th column, the chip in the 4th row and 2nd column and the chip in the 4th row and 4th column are diagonally adjacent chips of chip A; chip A, the directly adjacent chips of chip A and the diagonally adjacent chips of chip A are combined into the second area of ​​chip A; the chip in the 1st row and 1st column, the chip in the 1st row and 5th column, the chip in the 5th row and 1st column and the chip in the 5th row and 5th column are diagonally adjacent chips of the second area, and the chips in the 1st row and 2nd column to the 1st row and 4th column, the chips in the 1st column and 2nd row to the 1st column and 4th row, the chips in the 5th row and 2nd row to the 5th column and 4th row are directly adjacent chips in the second area. Furthermore, a 3×3 chip group with chip A as the center is a second area of ​​chip A, and a 5×5 chip group with chip A as the center is a first area of ​​chip A.

[0035] S103: Calculate a weighted score value for each qualified chip based on whether other chips in the first region corresponding to each qualified chip are qualified chips.

[0036] A weighted score value of each qualified chip is calculated based on whether other chips in the first area corresponding to each qualified chip are qualified chips, including: calculating the weighted score value of each qualified chip based on the number of qualified chips of the directly adjacent chips corresponding to each qualified chip, the number of qualified chips of the diagonally adjacent chips, and the number of qualified chips of the directly adjacent chips and the diagonally adjacent chips in the second area corresponding to the qualified chip.

[0037] A weighted score value of each qualified chip is calculated based on the number of qualified chips of directly adjacent chips corresponding to each qualified chip, the number of qualified chips of diagonally adjacent chips, and the number of qualified chips of directly adjacent chips and diagonally adjacent chips in the second area corresponding to the qualified chip, including: for each qualified chip, the number of unqualified chips of directly adjacent chips of the qualified chip is taken as a first number, the number of unqualified chips of diagonally adjacent chips of the qualified chip is taken as a second number, and the number of unqualified chips of directly adjacent chips and diagonally adjacent chips in the second area corresponding to the qualified chip is taken as a third number; the first number is multiplied by a preset first coefficient to obtain a first product, the second number is multiplied by a preset second coefficient to obtain a second product, and the third number is multiplied by a preset third coefficient to obtain a third product; and the sum of the first product, the second product and the third product is taken as the weighted score value of the qualified chip.

[0038] For example, see Figure 3 , the unqualified chips in the chips directly adjacent to chip A are the chips in the 3rd row and the 2nd column and the chips in the 3rd row and the 4th column, and the first number is 2; the unqualified chips in the diagonally adjacent chips to chip A are the chips in the 2nd row and the 2nd column, the chips in the 2nd row and the 4th column, and the second number is 3; the unqualified chips in the chips directly adjacent to the first area corresponding to chip A and the diagonally adjacent chips are the chips in the 1st row and the 1st column, the chips in the 1st row and the 2nd column, the chips in the 1st row and the 4th column, the chips in the 1st row and the 5th column, the chips in the 3rd row and the 5th column, the chips in the 5th row and the 1st column, and the third number is 7. If the preset first coefficient is set to 2, the preset second coefficient is set to 1, and the preset third coefficient is set to 0.5, the weighted score value of chip A is calculated as 2×2+3×1+7×0.5, and the weighted score value of chip A is 10.5.

[0039] S104: For each qualified chip, determine whether the weighted score value of the qualified chip is greater than a preset value.

[0040] If the weighted score of the qualified chip is less than or equal to the preset value, the qualified chip will not be marked with ink dots. The preset value can be set to 10.

[0041] S105: Mark the qualified chip with ink dots.

[0042] If the weighted score value of the qualified chip is greater than the preset value, the qualified chip is marked with ink dots.

[0043] The present application embodiment provides another wafer ink dot marking method, the method further comprising:

[0044] Determine whether all chips in the second area corresponding to each unqualified chip in the wafer image are marked with ink dots; if all chips in the second area corresponding to any unqualified chip in the wafer image are not marked with ink dots, then take the unqualified chip as the target chip and mark all chips in the second area corresponding to the target chip with ink dots.

[0045] If all chips in the second area corresponding to any unqualified chip in the wafer image are not marked with ink dots, the unqualified chip is taken as the target chip, and all chips in the second area corresponding to the target chip are marked with ink dots. The method also includes: determining whether there are unqualified chips in other chips in the second area corresponding to the target chip; if there are unqualified chips in other chips in the second area corresponding to the target chip, taking the unqualified chips in other chips as new target chips, and re-determining whether there are unqualified chips in other chips in the second area corresponding to the target chip; if there are no unqualified chips in other chips in the second area corresponding to the target chip, re-determining whether all chips in the second area corresponding to each unqualified chip in the wafer image are marked with ink dots.

[0046] For example, see Figure 4 , Figure 4 This is a schematic diagram of ink dot marking on a wafer provided in an embodiment of the present application. Figure 4 As shown, if Figure 4 All chips in the second area corresponding to each unqualified chip are not marked with ink dots, the unqualified chip in the second row and second column is taken as the first chip, and it is determined that there is an unqualified chip in the third row and second column in the second area corresponding to the first chip, and the unqualified chip in the third row and second column is taken as the second chip, and the second areas corresponding to the first chip and the second chip are marked with ink dots. Figure 4 All chips in the second area corresponding to other unqualified chips are not marked with ink dots, the unqualified chip in the 3rd row and 4th column is taken as the third chip, and it is determined that there are unqualified chips in the 3rd row and 5th column and unqualified chips in the 4th row and 4th column in the second area corresponding to the third chip, the unqualified chip in the 3rd row and 5th column is taken as the fourth chip, and the unqualified chip in the 4th row and 4th column is taken as the fifth unqualified chip, and the second areas corresponding to the third chip, the fourth chip and the fifth chip are all marked with ink dots, and it is determined Figure 4 All chips in the second area corresponding to all non-qualified chips are marked with ink dots, and the ink dot marking is ended.

[0047] The method also includes: marking each non-qualified chip in the wafer map with ink dots.

[0048] That is, each non-qualified chip in the wafer image may be marked with ink dots; or, after each non-qualified chip in the wafer image is marked with ink dots, steps S101 to S105 may be performed.

[0049] Based on the same application concept, the embodiments of the present application also provide a wafer ink dot marking device corresponding to the wafer ink dot marking method provided in the above embodiments. Since the principle of solving the problem by the device in the embodiments of the present application is similar to the wafer ink dot marking method in the above embodiments of the present application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be repeated.

[0050] like Figure 5 As shown, Figure 5 The functional module diagram of a wafer ink dot marking device provided in an embodiment of the present application is as follows: the wafer ink dot marking device 10 comprises: an acquisition module 101 , a first determination module 102 , a calculation module 103 , a second determination module 104 and a marking module 105 .

[0051] An acquisition module 101 is used to acquire a wafer map of a target wafer, wherein the wafer map is used to describe whether a wafer test result of each chip among a plurality of chips of the target wafer is a qualified chip; a first determination module 102 is used to determine a first area corresponding to each qualified chip of the wafer map; a calculation module 103 is used to calculate a weighted score value of each qualified chip based on whether other chips in the first area corresponding to each qualified chip are qualified chips; a second determination module 104 is used to determine, for each qualified chip, whether the weighted score value of the qualified chip is greater than a preset value; a marking module 105 is used to mark the qualified chip with an ink dot if the weighted score value of the qualified chip is greater than a preset value.

[0052] Based on the same application concept, see Figure 6 As shown, it is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application, the electronic device 20 includes: a processor 201, a memory 202 and a bus 203, the memory 202 stores machine-readable instructions executable by the processor 201, when the electronic device 20 is running, the processor 201 and the memory 202 communicate through the bus 203, and the machine-readable instructions are executed by the processor 201 when running, such as the steps of the wafer ink dot marking method described in any of the above embodiments.

[0053] Specifically, when the machine-readable instructions are executed by the processor 201, the following processing can be performed: obtaining a wafer map of the target wafer, the wafer map being used to describe whether the wafer test result of each chip among the multiple chips of the target wafer is a qualified chip; determining the first area corresponding to each qualified chip of the wafer map; calculating a weighted score value of each qualified chip based on whether other chips in the first area corresponding to each qualified chip are qualified chips; for each qualified chip, determining whether the weighted score value of the qualified chip is greater than a preset value; if the weighted score value of the qualified chip is greater than the preset value, marking the qualified chip with an ink dot.

[0054] Based on the same application concept, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the wafer ink dot marking method provided in the above embodiment are executed.

[0055] Specifically, the storage medium can be a general storage medium, such as a mobile disk, a hard disk, etc. When the computer program on the storage medium is run, the above-mentioned wafer ink dot marking method can be executed, and the chips on the wafer are automatically marked with ink dots by referring to the results of the wafer test, thereby solving the technical problem of manually marking unqualified chips in the wafer test with ink dots in the prior art, resulting in inaccurate marking, and achieving the technical effect of improving the accuracy of ink dot marking.

[0056] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. In the several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0057] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0058] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0059] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, etc., various media that can store program codes.

[0060] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A wafer ink dot marking method, characterized in that: The method comprises: Obtaining a wafer map of a target wafer, wherein the wafer map is used to describe whether a wafer test result of each chip among a plurality of chips of the target wafer is a qualified chip; Determine a first region corresponding to each qualified chip of the wafer map; Calculate a weighted score value for each qualified chip according to whether other chips in the first region corresponding to each qualified chip are qualified chips; For each qualified chip, determining whether the weighted score value of the qualified chip is greater than a preset value; If the weighted score of the qualified chip is greater than the preset value, the qualified chip is marked with ink dots; The determining a first area corresponding to each qualified chip of the wafer map includes: The chips directly adjacent to each qualified chip are regarded as the directly adjacent chips of the qualified chip; The chips diagonally adjacent to each qualified chip are used as diagonally adjacent chips of the qualified chip; Combine each qualified chip with its directly adjacent chip and diagonally adjacent chip into a second region, and determine the directly adjacent chips and diagonally adjacent chips in the second region; Combining the directly adjacent chips and diagonally adjacent chips corresponding to each qualified chip with the directly adjacent chips and diagonally adjacent chips of the second region corresponding to the qualified chip as the first region corresponding to the qualified chip; The step of calculating a weighted score value of each qualified chip according to whether other chips in the first region corresponding to each qualified chip are qualified chips comprises: A weighted score value of each qualified chip is calculated based on the number of qualified chips of directly adjacent chips corresponding to each qualified chip, the number of qualified chips of diagonally adjacent chips, and the number of qualified chips of directly adjacent chips and diagonally adjacent chips in the second area corresponding to the qualified chip.

2. The method according to claim 1, characterized in that: The step of calculating a weighted score value of each qualified chip according to the number of qualified chips of directly adjacent chips corresponding to each qualified chip, the number of qualified chips of diagonally adjacent chips, and the number of qualified chips of directly adjacent chips and diagonally adjacent chips in the second area corresponding to the qualified chip comprises: For each qualified chip, the number of unqualified chips of chips directly adjacent to the qualified chip is taken as a first number, the number of unqualified chips of chips diagonally adjacent to the qualified chip is taken as a second number, and the number of unqualified chips of chips directly adjacent to the qualified chip and diagonally adjacent to the second region corresponding to the qualified chip is taken as a third number; Multiply the first number by a preset first coefficient to obtain a first product, multiply the second number by a preset second coefficient to obtain a second product, and multiply the third number by a preset third coefficient to obtain a third product; The sum of the first product, the second product and the third product is used as a weighted score value of the qualified chip.

3. The method according to claim 1, characterized in that The method further comprises: Determine whether all chips in the second area corresponding to each non-qualified chip in the wafer map are marked with ink dots; If all chips in the second area corresponding to any unqualified chip in the wafer map are not marked with ink dots, the unqualified chip is used as a target chip, and all chips in the second area corresponding to the target chip are marked with ink dots.

4. The method according to claim 3, characterized in that If all chips in the second area corresponding to any unqualified chip in the wafer map are not marked with ink dots, the unqualified chip is used as a target chip, and all chips in the second area corresponding to the target chip are marked with ink dots, the method further includes: Determine whether there is a non-qualified chip among other chips in the second area corresponding to the target chip; If there are unqualified chips in other chips in the second region corresponding to the target chip, the unqualified chips in other chips are used as new target chips, and the determination of whether there are unqualified chips in other chips in the second region corresponding to the target chip is performed again; If there is no unqualified chip in other chips in the second area corresponding to the target chip, the process of determining whether all chips in the second area corresponding to each unqualified chip in the wafer map are marked with ink dots is performed again.

5. The method according to claim 1 or 2, characterized in that: The method further comprises: Each non-qualified chip in the wafer map is marked with an ink dot.

6. A wafer ink dot marking device, characterized in that: The device comprises: An acquisition module is used to acquire a wafer map of a target wafer, wherein the wafer map is used to describe whether a wafer test result of each chip among a plurality of chips of the target wafer is a qualified chip; A first determination module, configured to determine a first region corresponding to each qualified chip of the wafer map; A calculation module, used to calculate a weighted score value of each qualified chip according to whether other chips in the first area corresponding to each qualified chip are qualified chips; A second determination module is used to determine, for each qualified chip, whether a weighted score value of the qualified chip is greater than a preset value; A marking module, used for marking the qualified chip with ink dots if the weighted score value of the qualified chip is greater than a preset value; The first determination module is further used to: use the chip directly adjacent to each qualified chip as the directly adjacent chip of the qualified chip; use the chip diagonally adjacent to each qualified chip as the diagonally adjacent chip of the qualified chip; combine each qualified chip with the directly adjacent chip and the diagonally adjacent chip corresponding to the qualified chip into a second area, and determine the directly adjacent chips and the diagonally adjacent chips of the second area; combine the directly adjacent chip and the diagonally adjacent chip corresponding to each qualified chip with the directly adjacent chip and the diagonally adjacent chip of the second area corresponding to the qualified chip as the first area corresponding to the qualified chip; The calculation module is also used to calculate the weighted score value of each qualified chip based on the number of qualified chips of the directly adjacent chips corresponding to each qualified chip, the number of qualified chips of the diagonally adjacent chips, and the number of qualified chips of the directly adjacent chips and the diagonally adjacent chips in the second area corresponding to the qualified chip.

7. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and the machine-readable instructions are executed by the processor to execute the steps of the wafer ink dot marking method as described in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer ink dot marking method as claimed in any one of claims 1 to 5 are executed.

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