A vibration-damping crystal bonding structure and crystal bonding equipment

Abstract

The present invention provides a vibration-damping crystal bonding structure and crystal bonding equipment, which specifically include a frame and a first crossbeam installed on the frame; a first driving component is installed on the first crossbeam, and the first driving end and the second driving end of the first driving component can move along a first direction; a crystal bonding component is installed on the first driving end, and a balancing block is installed on the second driving end; wherein the moving direction of the balancing block is opposite to the moving direction of the crystal bonding component. When performing crystal bonding, the first driving component can be used to drive the crystal bonding component to move, and the crystal bonding component can absorb the chip to achieve the movement of the chip, thereby completing the action of placing the chip in a specified position; during the crystal bonding process, the crystal bonding component will be accelerated and decelerated. During this stage, the balancing block will move in the opposite direction relative to the crystal bonding component, thereby generating a movement trend opposite to that of the crystal bonding component, thereby offsetting the vibration generated by the crystal bonding component during the acceleration and deceleration process, thereby improving the overall accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding equipment structures, and in particular to a vibration-damping crystal bonding structure and crystal bonding equipment. Background Art

[0002] Die bonding refers to a process in which a chip is bonded to a designated area of ​​a bracket through colloid to form a thermal or electrical path, providing conditions for subsequent wire bonding. Die bonding equipment refers to the automated equipment that can complete this process.

[0003] The current crystal bonding equipment is described in the patent document "CN113921434A", which generally includes a first crossbeam and a crystal bonding machine head installed on the first crossbeam, wherein a motor and a driving screw are installed on the first crossbeam, and the motor drives the screw to rotate, so that the crystal bonding machine head moves horizontally along the first crossbeam; and the crystal bonding machine head includes a glue dropping head and an adsorption rod, the glue dropping head is used for dripping glue, and the adsorption rod is used for adsorbing wafers; through the above settings, the crystal bonding machine head can adsorb the wafer and bond it to the bracket by dispensing glue.

[0004] However, current die-bonding equipment is primarily used for assembling LED wafers and brackets. LED wafers are relatively thick, typically exceeding 100 microns, and the aforementioned die-bonding equipment can typically meet these precision requirements. For various chips, such as memory chips, which are thinner, up to 20 microns, these thinner chips require higher precision. However, the die-bonding equipment frequently accelerates and decelerates during movement, and when the acceleration is high, the die-bonding head vibrates, reducing the overall precision of the die-bonding equipment. Summary of the Invention

[0005] The purpose of the present invention is to provide a vibration-damping crystal bonding structure and a crystal bonding device to solve the problem of insufficient precision of current crystal bonding devices.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A vibration-damping crystal bonding structure comprises a frame and a first crossbeam mounted on the frame; a first driving assembly is mounted on the first crossbeam, and a first driving end and a second driving end of the first driving assembly are both capable of moving along a first direction;

[0008] A die-bonding assembly is mounted on the first driving end, and a balancing block is mounted on the second driving end. The die-bonding assembly is used to absorb the chip. The moving direction of the balancing block is opposite to that of the die-bonding assembly.

[0009] Optionally, the die-bonding assembly includes a die-bonding base mounted on the first driving end; a second driving assembly is mounted on the die-bonding base, and a third driving end of the second driving assembly is movable along a second direction; the second direction is perpendicular to the first direction;

[0010] A suction component is installed on the third driving end, and the suction component is used to generate negative pressure.

[0011] Optionally, the third driving end includes a mounting base, the mounting base is slidably connected to the die-bonding base; and the suction assembly is mounted on the mounting base;

[0012] The solid crystal base is connected to a first positioning column, the mounting base is connected to a second positioning column, and a tension spring is connected between the first positioning column and the second positioning column; one end of the tension spring is sleeved on the first positioning column, and the other end of the tension spring is sleeved on the second positioning column.

[0013] Optionally, a wire board is further installed on the installation base plate, and a plurality of wire blocks are installed on the wire board, with a gap left between the wire blocks and the wire board.

[0014] Optionally, the wire guide includes a first extending portion extending along the second direction and a second extending portion extending along the first direction; the first extending portion is provided on one side of the second driving assembly, and the second extending portion is provided between the mounting base and the second driving assembly;

[0015] The conductor block includes a first conductor block and a second conductor block, wherein the first conductor block is mounted on the first extension portion, and the second conductor block is mounted on the second extension portion;

[0016] Two first ends of the first conductor block along the first direction are respectively connected to the first extension portion through fasteners;

[0017] The two second ends of the second conductor block are respectively connected to the second extension portion through fasteners; wherein the second conductor block is arranged at an angle and is arranged between the suction component and the first conductor block.

[0018] Optionally, the first driving end includes a first driving slide, and the first driving slide is slidably connected to the first beam along the first direction;

[0019] The first driving slide is provided with a positioning boss protruding in a direction toward the die-bonding assembly, and the positioning boss abuts against the die-bonding base; wherein the positioning boss and the lead plate are respectively located at two ends of the first driving slide.

[0020] Optionally, a third drive assembly is provided between the frame and the first crossbeam; the third drive assembly is mounted on the frame, the first crossbeam is mounted on a fourth drive end of the third drive assembly, and the fourth drive end is movable along a third direction;

[0021] The third direction is perpendicular to the first direction and the second direction respectively.

[0022] Optionally, the third driving assembly includes a second crossbeam, and a crossbeam connecting portion is protruded from a side of the first crossbeam facing the second crossbeam; the crossbeam connecting portion is slidably connected to the second crossbeam along the third direction.

[0023] Optionally, a positioning groove is provided on a side of the second crossbeam facing the first crossbeam;

[0024] A first connecting plate portion and a second connecting plate portion are provided between the first crossbeam and the crossbeam connecting portion, and the first connecting plate portion and the second connecting plate portion are provided in the positioning groove;

[0025] The first connecting plate portion abuts against a groove wall on one side of the positioning groove, and the second connecting plate portion abuts against a groove wall on the other side of the positioning groove.

[0026] A crystal bonding device includes a bracket loading structure, a wafer loading structure and the vibration-damping crystal bonding structure as described above.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The vibration-damping crystal bonding structure and crystal bonding equipment provided by the present invention can utilize the first driving component to drive the crystal bonding component to move, and absorb the chip through the crystal bonding component to realize the movement of the chip, thereby completing the action of placing the chip in the specified position; during the crystal bonding process, the crystal bonding component will be accelerated and decelerated. During this stage, the balance block moves in the opposite direction relative to the crystal bonding component, generating a movement trend opposite to that of the crystal bonding component, thereby offsetting the vibration generated by the crystal bonding component during the acceleration and deceleration process, so that the overall accuracy is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention.

[0031] Figure 1 A schematic diagram of the overall structure of the vibration-damping die-bonding structure provided by an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the overall structure of a die-bonding assembly provided in an embodiment of the present invention;

[0033] Figure 3 A schematic front view of the structure of a die-bonding assembly provided in an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of the exploded structure of a die-bonding assembly provided in an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of a first partial structure of a vibration-damping die-bonding structure provided by an embodiment of the present invention;

[0036] Figure 6 A schematic diagram of a second partial structure of the vibration-damping die-bonding structure provided by an embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of a third partial structure of the vibration-damping die-bonding structure provided by an embodiment of the present invention.

[0038] Illustrations: 10, frame; 20, first crossbeam; 21, crossbeam connecting portion; 22, first connecting plate portion; 23, second connecting plate portion; 30, first drive assembly; 31, first drive slide; 32, positioning boss;

[0039] 40. Die-bonding assembly; 41. Die-bonding base; 42. Second drive assembly; 43. Suction assembly; 44. Mounting base; 451. First positioning post; 452. Second positioning post; 453. Tension spring; 46. Lead wire plate; 461. First extension; 462. Second extension; 47. Lead wire block; 471. First lead wire block; 472. Second lead wire block;

[0040] 50. Balance block; 60. Third drive assembly; 61. Second crossbeam; 611. Positioning slot. DETAILED DESCRIPTION

[0041] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0042] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0043] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0044] Please refer to Figures 1 to 7 , Figure 1 This is a schematic diagram of the overall structure of the vibration-damping die-bonding structure provided by an embodiment of the present invention. Figure 2 This is a schematic diagram of the overall structure of the die-bonding assembly provided in an embodiment of the present invention. Figure 3 This is a front view structural diagram of a die-bonding assembly provided in an embodiment of the present invention. Figure 4 A schematic diagram of the exploded structure of a die-bonding assembly provided in an embodiment of the present invention is shown. Figure 5 A schematic diagram of a first partial structure of a vibration-damping die-bonding structure provided by an embodiment of the present invention is shown. Figure 6 A schematic diagram of a second partial structure of the vibration-damping die-bonding structure provided by an embodiment of the present invention is shown. Figure 7 This is a schematic diagram of a third partial structure of the vibration-damping die-bonding structure provided by an embodiment of the present invention.

[0045] Example 1

[0046] The vibration-damping die-bonding structure provided in this embodiment is applied to a die-bonding device, and is particularly suitable for die-bonding scenarios of thinner chips. The structure is optimized to reduce vibration and improve precision.

[0047] like Figure 1As shown, the vibration-damping and crystal-fixing structure in this embodiment includes a frame 10 and a first crossbeam 20 installed on the frame 10; a first driving assembly 30 is installed on the first crossbeam 20, and the first driving end and the second driving end of the first driving assembly 30 can both move along the first direction; wherein, the first driving assembly 30 may include two groups of linear motors arranged along the first direction, the first driving end is installed on the moving end of one of the linear motors, and the second driving end is installed on the moving end of the other linear motor, and the two linear motors are independently controlled, so the first driving end and the second driving end can be separately The first drive end is equipped with a die-bonding assembly 40, and the second drive end is equipped with a balancing block 50, wherein the weight of the balancing block 50 matches that of the die-bonding assembly 40, and the die-bonding assembly 40 is used to absorb the chip; wherein the moving direction of the balancing block 50 is opposite to that of the die-bonding assembly 40. It can be understood that by controlling the two linear motors and making the movement directions of the two linear motors opposite, the first drive end and the second drive end can be made to move toward each other, or move away from each other, that is, the moving direction of the balancing block 50 is always opposite to that of the die-bonding assembly 40. The linear motor can be replaced by a ball screw module equipped with a motor, or by a gear rack structure equipped with a motor, which can drive the die-bonding assembly 40 or the balancing block 50 accordingly.

[0048] Specifically, when performing crystal bonding, the first driving component 30 can be used to drive the crystal bonding component 40 to move, and the chip can be sucked by the crystal bonding component 40 to realize the movement of the chip, thereby completing the action of placing the chip in the specified position. More specifically, it can complete the acquisition of the chip from the base film and place the chip on the chip holder; in the process of crystal bonding, the acceleration and deceleration stages of the crystal bonding component 40 will be involved. In this stage, since the movement directions of the first driving end and the second driving end are opposite, the balance block 50 generates a movement trend opposite to that of the crystal bonding component 40. Therefore, the balance block 50 can generate a movement trend opposite to that of the crystal bonding component 40 through the reverse movement of the balance block 50 relative to the crystal bonding component 40, thereby offsetting the vibration generated by the crystal bonding component 40 during the acceleration and deceleration process, so that the overall accuracy is improved.

[0049] like Figures 1 to 4As shown, the crystal bonding assembly 40 includes a crystal bonding base 41 installed on the first driving end; a second driving assembly 42 is installed on the crystal bonding base 41, and the second driving assembly 42 is a linear motor, a ball screw module equipped with a motor, a gear rack structure equipped with a motor, and other structures with linear movement function; the third driving end of the second driving assembly 42 can move along the second direction; the second direction is perpendicular to the first direction; a suction assembly 43 is installed on the third driving end, and the suction assembly 43 is used to generate negative pressure. The suction assembly 43 can be a vacuum suction cup, and the vacuum suction cup is connected to a negative pressure generating device through an air pipe to generate negative pressure to suck the chip; more specifically, the second direction is a direction perpendicular to the chip, and the second driving assembly 42 can drive the suction assembly 43 to move in a direction close to or away from the chip. For example, when it is necessary to absorb the chip, the second drive component 42 can drive the absorption component 43 to move downward to facilitate the absorption component 43 to absorb the chip; then, the second drive component 42 drives the chip to rise, and the first drive component 30 drives the chip to move along the first direction. After moving to above the chip holder, the second drive component 42 drives the absorption component 43 to move downward to facilitate the absorption component 43 to place the chip on the chip holder.

[0050] Furthermore, if Figures 2 to 4 As shown, the third driving end includes a mounting base 44, which is slidably connected to the crystal-bonding base 41; and the suction assembly 43 is mounted on the mounting base 44; the crystal-bonding base 41 is connected to a first positioning post 451, and the mounting base 44 is connected to a second positioning post 452, and a tension spring 453 is connected between the first positioning post 451 and the second positioning post 452; one end of the tension spring 453 is sleeved on the first positioning post 451, and the other end of the tension spring 453 is sleeved on the second positioning post 452. The provision of the tension spring 453 can provide a reverse tensile force to the mounting base 44 during the downward movement of the third driving end and the mounting base 44, making the suction assembly 43 more stable during the downward movement; in addition, during the upward movement of the suction assembly 43, its elastic potential energy is released, which can help the mounting base 44 to reset faster.

[0051] Furthermore, if Figure 3 and Figure 4 As shown, a wire plate 46 is also installed on the mounting base 44, and a plurality of wire blocks 47 are installed on the wire plate 46, with a gap left between the wire blocks 47 and the wire plate 46; wherein, through the arrangement of the wire plate 46 and the wire blocks 47, the electric wires and the air pipe can pass through the above-mentioned gap and be connected to the suction component 43, and the wire plate 46 and the wire blocks 47 can play a role in positioning and limiting the above-mentioned circuits.

[0052] In this embodiment, the wire guide 46 includes a first extension portion 461 extending along the second direction and a second extension portion 462 extending along the first direction. The first extension portion 461 is disposed on one side of the second drive assembly 42, while the second extension portion 462 is disposed between the mounting base 44 and the second drive assembly 42. In other words, the wire guide 46 is generally L-shaped. The wire block 47 includes a first wire block 471 and a second wire block 472. The first wire block 471 is mounted on the first extension portion 461, while the second wire block 472 is mounted on the second extension portion 462.

[0053] Among them, the two first ends of the first wire block 471 along the first direction are respectively connected to the first extension part 461 through fasteners; the two second ends of the second wire block 472 are respectively connected to the second extension part 462 through fasteners; wherein, the second wire block 472 is arranged at an angle and is arranged between the suction component 43 and the first wire block 471. It can be understood that the wires and air pipes first pass through the gap between the first wire block 471 and the first extension part 461, and move along the second direction toward the suction component 43; then, through the inclined second wire block 472, the wires and air pipes are guided to the suction component 43 by the gap between the second wire block 472 and the second extension part 462, that is, the pipeline structure connected to the suction component 43 can first pass through the gap between the first wire block 471 and the first extension part 461 along the second direction, and then pass through the gap between the second wire block 472 and the second extension part 462 along an inclined direction at an angle to the second direction, so that the pipeline structure is smoothly and seamlessly connected to the suction component 43, and the pipeline structure is not easy to deviate or swing, so that the above-mentioned pipeline structure is more stable during the movement of the first drive component 30, further reducing the influence of vibration.

[0054] Furthermore, if Figure 4 As shown, the first driving end includes a first driving slide 31, which is slidably connected to the first crossbeam 20 along a first direction; the first driving slide 31 is provided with a positioning boss 32 in the direction toward the die-bonding assembly 40, and the positioning boss 32 abuts against the die-bonding base 41; wherein, the positioning boss 32 and the wire plate 46 are respectively located at both ends of the first driving slide 31. It can be understood that the positioning boss 32 can assist in quickly positioning and installing the die-bonding assembly 40 on the first driving slide 31. At the same time, the main weight of the wire plate 46, the wire block 47 and the pipeline structure is distributed at one end (left side) of the first driving end, while the positioning boss 32 arranged on the right side is distributed at the other end (right side) of the first driving end, which can balance the overall weight of the first driving end, so that the center of gravity is located at the midline of the die-bonding assembly 40, which is less likely to tilt or swing, making the overall structure more stable.

[0055] Furthermore, if Figures 5 to 7As shown, a third drive assembly 60 is disposed between the frame 10 and the first crossbeam 20. The third drive assembly 60 is mounted on the frame 10, and the first crossbeam 20 is mounted on the fourth drive end of the third drive assembly 60. The fourth drive end can move in a third direction, which is perpendicular to both the first and second directions. The third drive assembly 60 is a structure capable of linear movement, such as a linear motor, a ball screw module equipped with a motor, or a rack and pinion structure equipped with a motor. The third direction and the first direction are both located in a horizontal plane. The third drive assembly 60 cooperates with the first drive assembly 30 to achieve horizontal movement of the die bond assembly 40.

[0056] Furthermore, the third drive assembly 60 includes a second crossbeam 61. A crossbeam connection portion 21 is protruding from the first crossbeam 20 on the side facing the second crossbeam 61. The crossbeam connection portion 21 is slidably connected to the second crossbeam 61 along the third direction. A mounting groove is formed on the crossbeam connection portion 21. A slide rail is provided on the second crossbeam 61 along the third direction. The slide rail is installed in the mounting groove via a slider to enable the first crossbeam 20 to slide relative to the second crossbeam 61.

[0057] Furthermore, if Figure 6 and Figure 7 As shown, a positioning groove 611 is provided on the side of the second crossbeam 61 facing the first crossbeam 20; a first connecting plate portion 22 and a second connecting plate portion 23 are provided between the first crossbeam 20 and the crossbeam connecting portion 21, and the first connecting plate portion 22 and the second connecting plate portion 23 are provided in the positioning groove 611; wherein the first connecting plate portion 22 abuts against one side wall of the positioning groove 611, and the second connecting plate portion 23 abuts against the other side wall of the positioning groove 611. It can be understood that the first connecting plate portion 22 and the second connecting plate portion 23 act as reinforcing ribs, which play a role in strengthening the first crossbeam 20. At the same time, the cooperation between the connecting plate portion and the positioning groove 611 can improve the positioning accuracy of the first crossbeam 20 relative to the second crossbeam 61, thereby further improving the overall accuracy.

[0058] In summary, the vibration-damping crystal bonding structure provided by the present invention has the advantages of less vibration and high precision, and also has the advantages of compact structure, high stability, and solid structure.

[0059] Example 2

[0060] The crystal bonding equipment of this embodiment includes a bracket loading structure and a wafer loading structure such as the vibration-damping crystal bonding structure in Example 1. Example 1 describes the specific structure and technical effects of the vibration-damping crystal bonding structure. The crystal bonding equipment of this embodiment refers to this structure and also has its technical effects. Among them, the bracket loading structure can be a conveying structure, which can input the chip bracket to the vibration-damping crystal bonding structure through a conveyor belt or other structure; the wafer loading structure can be a conveying structure, which can input the chip to the vibration-damping crystal bonding structure through a conveyor belt or other structure; and the vibration-damping crystal bonding structure can fix the chip on the chip bracket; in addition, the crystal bonding equipment can also include a glue dispensing structure, which can dispense glue on the chip bracket to bond the chip.

[0061] In summary, the die bonding equipment provided by the present invention has the advantages of less vibration and high precision, and also has the advantages of compact structure, high stability, and solid structure.

[0062] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vibration-damping die-bonding structure, characterized in that: The invention comprises a frame (10) and a first beam (20) mounted on the frame (10); a first driving component (30) is mounted on the first beam (20), and the first driving end and the second driving end of the first driving component (30) are both capable of moving along a first direction; a solid crystal component (40) is mounted on the first driving end, and a balance block (50) is mounted on the second driving end, and the solid crystal component (40) is used to absorb chips; wherein the moving direction of the balance block (50) is opposite to the moving direction of the solid crystal component (40), and by controlling two linear motors and making the movement directions of the two linear motors opposite, the first driving end and the second driving end can be moved toward each other, so that the moving direction of the balance block (50) is always opposite to the moving direction of the solid crystal component (40); The crystal-bonding assembly (40) comprises a crystal-bonding base (41) mounted on the first driving end; a second driving assembly (42) is mounted on the crystal-bonding base (41); a third driving end of the second driving assembly (42) is movable along a second direction; the second direction is perpendicular to the first direction; a suction assembly (43) is mounted on the third driving end, and the suction assembly (43) is used to generate negative pressure; The third driving end includes a mounting base (44), the mounting base (44) is slidably connected to the crystal-fixing base (41); and the suction assembly (43) is mounted on the mounting base (44); the crystal-fixing base (41) is connected to a first positioning column (451), the mounting base (44) is connected to a second positioning column (452), and a tension spring (453) is connected between the first positioning column (451) and the second positioning column (452); one end of the tension spring (453) is sleeved on the first positioning column (451), and the other end of the tension spring (453) is sleeved on the second positioning column (452); A wire board (46) is also installed on the installation base plate (44); The first driving end includes a first driving slide (31), and the first driving slide (31) is slidably connected to the first crossbeam (20) along the first direction; the first driving slide (31) is provided with a positioning boss (32) in the direction toward the solid crystal component (40), and the positioning boss (32) is in contact with the solid crystal base (41); wherein the positioning boss (32) and the wire plate (46) are respectively located at two ends of the first driving slide (31), and a plurality of wire blocks (47) are installed on the wire plate (46), and a gap is left between the wire blocks (47) and the wire plate (46), and the main weight of the wire plate (46), the wire block (47) and the pipeline structure is distributed at one end of the first driving end, and the positioning boss (32) that can assist the solid crystal component (40) in positioning and is installed on the first driving slide (31) is provided at the other end of the first driving end to balance the overall weight on the first driving end so that the center of gravity is located at the center line of the solid crystal component (40); A third drive assembly (60) is provided between the frame (10) and the first crossbeam (20); the third drive assembly (60) is mounted on the frame (10), and the first crossbeam (20) is mounted on a fourth drive end of the third drive assembly (60), and the fourth drive end is movable along a third direction; the third direction is perpendicular to the first direction and the second direction respectively.

2. The vibration-damping die-bonding structure according to claim 1, characterized in that: The wire plate (46) includes a first extension portion (461) extending along the second direction and a second extension portion (462) extending along the first direction; the first extension portion (461) is arranged on one side of the second driving component (42), and the second extension portion (462) is arranged between the mounting base (44) and the second driving component (42); the wire block (47) includes a first wire block (471) and a second wire block (472), the first wire block (471) is installed on the first extension portion (461), and the second wire block (472) is installed on the second extension portion (462); the two first ends of the first wire block (471) along the first direction are respectively connected to the first extension portion (461) by fasteners; the two second ends of the second wire block (472) are respectively connected to the second extension portion (462) by fasteners; wherein the second wire block (472) is arranged obliquely and is arranged between the suction component (43) and the first wire block (471).

3. The vibration-damping die-bonding structure according to claim 1, characterized in that: The third driving assembly (60) comprises a second crossbeam (61), and a crossbeam connecting portion (21) is protruded on one side of the first crossbeam (20) facing the second crossbeam (61); the crossbeam connecting portion (21) is slidably connected to the second crossbeam (61) along the third direction.

4. The vibration-damping die-bonding structure according to claim 3, characterized in that: The second crossbeam (61) is provided with a positioning groove (611) on one side facing the first crossbeam (20); a first connecting plate portion (22) and a second connecting plate portion (23) are provided between the first crossbeam (20) and the crossbeam connecting portion (21), and the first connecting plate portion (22) and the second connecting plate portion (23) are provided in the positioning groove (611); wherein the first connecting plate portion (22) abuts against a groove wall on one side of the positioning groove (611), and the second connecting plate portion (23) abuts against a groove wall on the other side of the positioning groove (611).

5. A die bonding device, characterized in that: include: A bracket loading structure, a wafer loading structure, and a vibration-damping crystal bonding structure as claimed in any one of claims 1 to 4.

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