A dual-band array antenna and its implementation method

Abstract

A dual-band array antenna and implementation method, belonging to the technical field of dual-band array antennas, comprises: a first metal layer of a common feed power splitter network having a feed port and a power splitter network; a first array antenna and a second array antenna arranged symmetrically on opposite sides of the common feed power splitter network, each comprising a second metal layer, a third metal layer, a fourth metal layer, and a fifth metal layer stacked in sequence, with a ceramic substrate disposed therebetween. The second metal layer serves as a ground layer, and the third metal layer comprises an impedance matching network. The first array antenna is connected to the power splitter network via a first metallized hole; the second array antenna is connected to the power splitter network via a second metallized hole. The fourth metal layer is arrayed with coupling slots. Radiating patches are provided on the fifth metal layer corresponding to the coupling slots. The array antenna is implemented using a thick-film circuit process, resulting in a more compact antenna. Antennas for different frequency bands can be manufactured separately, simplifying the design and manufacturing process.

Description

Technical Field

[0001] The present invention belongs to the technical field of dual-band array antennas, and in particular relates to a dual-band array antenna and an implementation method thereof. Background Art

[0002] As wireless communication systems develop towards miniaturization, low power consumption, and high stability, their integration is increasing, and the need for wider or more frequency bands within the system is becoming increasingly prominent, which in turn increases the need for multi-band antenna coexistence. Furthermore, the trend towards miniaturization and high integration of systems requires that antennas be miniaturized as much as possible while still maintaining their functionality.

[0003] Existing multi-band antennas require special designs. For example, microstrip antennas are often implemented by slotting the radiating patch, adding parasitic elements, or through specialized feed structure design. However, these designs involve complex design processes and increased workload. Slotting the patch reduces its radiation efficiency; adding parasitic elements increases the size of the radiating element; and the specialized design of the feed network introduces impedance matching issues. Furthermore, in array antennas, complex feed networks can degrade antenna performance. Furthermore, the feed network itself can also generate radiation, affecting antenna radiation performance. To mitigate the impact of the feed network, the feed network and radiating elements are typically layered. Consequently, these conventional approaches increase the overall size of the system, while also adding additional design effort and complexity. Summary of the Invention

[0004] To address the shortcomings of the existing technology, the present invention provides a dual-band array antenna and its implementation method, which adopts thick-film circuit technology to form multi-layer circuits, thereby realizing the dual-band array antenna function and achieving the characteristics of antenna miniaturization. Antennas of different frequency bands can be manufactured separately, making the entire design and manufacturing process simpler.

[0005] In order to achieve the purpose of the present invention, the following scheme is proposed:

[0006] A dual-band array antenna comprises a first array antenna, a second array antenna and a common feed power division network.

[0007] The common feeding power dividing network comprises a first metal layer having a feeding port and a power dividing network having a microstrip structure. The power dividing network divides a feeding signal inputted from the feeding port into two.

[0008] The first array antenna and the second array antenna are symmetrically arranged on two sides of the common feeding power division network. The first array antenna and the second array antenna both include a second metal layer, a third metal layer, a fourth metal layer and a fifth metal layer stacked in sequence, wherein the second metal layer faces one side of the common feeding power division network.

[0009] A ceramic substrate is disposed between the first metal layer, the second metal layer, the third metal layer, the fourth metal layer and the fifth metal layer.

[0010] The second metal layer is a ground layer.

[0011] The third metal layer has an impedance matching network.

[0012] The second metal layer, the third metal layer, the first metal layer and the adjacent ceramic substrates of the first array antenna are penetrated by first metallized holes, and a group of signals of the power division network are transmitted to the impedance matching network of the first array antenna through the first metallized holes.

[0013] The second metal layer, the third metal layer, the first metal layer and the adjacent ceramic substrates of the second array antenna are penetrated by second metallized holes, and another group of signals of the power division network are transmitted to the impedance matching network of the second array antenna through the second metallized holes.

[0014] The fourth metal layer array is provided with coupling gaps, and the sizes of the coupling gaps corresponding to the first array antenna and the second array antenna are different.

[0015] The fifth metal layer is provided with radiation patches corresponding to the coupling gaps. The impedance matching network couples the signal with the radiation patch through the corresponding coupling gap. The radiation patches corresponding to the first array antenna and the second array antenna have different shapes and / or sizes.

[0016] Furthermore, the corresponding radiation patch in the direction orthogonal to the coupling slot is provided with a varactor diode.

[0017] Furthermore, a third metallized hole is provided through the ceramic substrate between the second metal layer and the third metal layer corresponding to the first array antenna for connecting the second metal layer and the third metal layer, and the third metallized hole is connected to a separate feeding port.

[0018] A fourth metallized hole is provided through the ceramic substrate between the second metal layer and the third metal layer corresponding to the second array antenna for connecting the second metal layer and the third metal layer, and the fourth metallized hole is connected to a separate feeding port.

[0019] A method for implementing a dual-band array antenna, comprising the steps of:

[0020] Eight ceramic substrates are provided, wherein a first metal layer is formed on the top surface of one ceramic substrate using a thick film circuit process, a second metal layer is formed on the top surfaces of two ceramic substrates using a thick film circuit process, a third metal layer is formed on the top surfaces of two ceramic substrates using a thick film circuit process, a fourth metal layer is formed on the top surfaces of two ceramic substrates using a thick film circuit process, a fifth metal layer is formed on the top surface of one ceramic substrate using a thick film circuit process, and a fifth metal layer is formed on the bottom surface of one of the ceramic substrates having the fourth metal layer formed thereon using a thick film circuit process.

[0021] A feeding port and a power dividing network are formed by etching on the first metal layer. The power dividing network has two signal output terminals.

[0022] An impedance matching network is formed by etching on the third metal layer.

[0023] The fourth metal layer is processed with a coupling gap, and the sizes of the coupling gaps of the fourth metal layers corresponding to the two ceramic substrates are different.

[0024] The fifth metal layer is provided with radiation patches in an array, and the radiation patches on the fifth metal layers corresponding to the two ceramic substrates are different in shape and / or size.

[0025] Overlap.

[0026] Press-fit sintering and thick film process are used to form a dual-band array antenna.

[0027] Furthermore, when stacking, the ceramic substrate with the fifth metal layer on the bottom is placed at the bottom layer, and a ceramic substrate with the fourth metal layer, a ceramic substrate with the third metal layer, a ceramic substrate with the second metal layer, a ceramic substrate with the first metal layer, a ceramic substrate with the second metal layer, a ceramic substrate with the third metal layer, a ceramic substrate with the fourth metal layer and a ceramic substrate with the fifth metal layer are stacked in sequence from bottom to top.

[0028] During pressing and sintering, the eight layers of ceramic substrates are pressed together and solidified into an integrated dual-band array antenna through sintering. After pressing and sintering, one output end of the power division network is connected to the impedance matching network above the first metal layer through the first metalized hole, and the other output end of the power division network is connected to the impedance matching network below the first metal layer through the second metalized hole. The first metalized hole and the second metalized hole are completed before stacking.

[0029] Furthermore, a third metallized hole is provided through the ceramic substrate between the second metal layer and the third metal layer above the first metal layer for connecting the second metal layer and the third metal layer above the first metal layer. The third metallized hole is connected to a separate feeding port.

[0030] A fourth metallized hole is provided through the ceramic substrate between the second metal layer and the third metal layer below the first metal layer for connecting the second metal layer and the third metal layer below the first metal layer. The fourth metallized hole is connected to a separate feeding port.

[0031] Furthermore, a ceramic substrate having a second metal layer, a ceramic substrate having a third metal layer, a ceramic substrate having a fourth metal layer, and a ceramic substrate having a fifth metal layer are stacked in sequence from bottom to top, and pressed and sintered to form a first array antenna. Before stacking, a first metallized hole is made on the ceramic substrate having the third metal layer, the second metal layer, and its corresponding ceramic substrate.

[0032] A ceramic substrate having a fifth metal layer on its bottom surface is placed at the bottom layer, and a ceramic substrate having a fourth metal layer, a ceramic substrate having a third metal layer, and a ceramic substrate having a second metal layer are stacked on top of the ceramic substrate from bottom to top. The substrates are pressed and sintered to form a second array antenna. Before stacking, second metallized holes are made on the ceramic substrate having the first metal layer, the second metal layer, and their corresponding ceramic substrates.

[0033] A ceramic substrate with a first metal layer is stacked on top of the second array antenna, and the first array antenna is stacked on top of the ceramic substrate with the first metal layer, and pressed and sintered to form a dual-band array antenna. After sintering, the impedance matching network on the first array antenna is connected to one output end of the power division network through a first metalized hole, and the impedance matching network on the second array antenna is connected to the other output end of the power division network through a second metalized hole.

[0034] Furthermore, a third metallized hole is provided through the ceramic substrate between the second metal layer and the third metal layer on the first array antenna, which is used to connect the second metal layer and the third metal layer of the first array antenna, and the third metallized hole is connected to a separate feeding port; a fourth metallized hole is provided through the ceramic substrate between the second metal layer and the third metal layer on the second array antenna, which is used to connect the second metal layer and the third metal layer of the second array antenna, and the fourth metallized hole is connected to a separate feeding port.

[0035] Furthermore, after the radiation patch is provided, a varactor diode is provided between the two radiation patches, and the varactor diode and the coupling gap are perpendicular to each other.

[0036] The beneficial effects of the present invention are:

[0037] 1. A multi-layer circuit structure is formed by using thick-thin circuit technology. The circuit can be made into a multi-layer three-dimensional structure. The dielectric plate uses a co-fired ceramic substrate with a high dielectric constant, which can significantly reduce the size of the antenna.

[0038] 2. The antenna arrays working in different frequency bands are designed separately and then sintered together using thick film technology, which can decompose the design and simplify the design process.

[0039] 3. The first array antenna and the second array antenna are respectively composed of a radiation unit, a coupling slot, and an impedance matching network. Each part is independent in a different layer and can also be designed separately. The layered design can also eliminate the negative impact of the feed network on the antenna radiation performance.

[0040] 4. The first array antenna and the second array antenna are connected to their respective corresponding impedance matching networks through a power divider on a common feeding layer and then fed through slot coupling, so that the two antenna arrays with different operating frequency bands share one feeding port, simplifying the feeding part and avoiding the port coupling problem caused by using two feeding ports.

[0041] 5. Both the first and second antenna arrays are equipped with corresponding ground planes, forming a complete array antenna structure. They can be used as independent array antennas simply by connecting the corresponding feed ports. For example, simply by connecting the corresponding feed ports to the impedance matching network through metallized vias, the first antenna array can be used independently as a complete array antenna; similarly, the second antenna array can also be used independently as a complete array antenna. This increases the practicality of dual-band array antennas.

[0042] 6. Since the first and second antenna arrays and the common feed power splitter network can be designed independently, the dual-band array antenna can be formed by independently designing array antennas operating in different frequency bands and then integrating them together through a thick-film process. By replacing different antennas, any combination of operating frequency bands can be achieved. The ability to adjust the antenna's operating frequency band without changing the antenna's structural dimensions greatly expands the antenna's applicability.

[0043] 7. The radiating patch is loaded with a varactor diode. By adjusting the voltage across the varactor diode, the corresponding capacitance value can be changed, so that the equivalent capacitance value of the corresponding radiating patch changes, thereby achieving the purpose of adjusting its corresponding working frequency band. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0045] Figure 1 The figure shows a schematic diagram of the structure of the dual-band array antenna of the present application.

[0046] Markings in the figure: first array antenna-1, third metallized hole-11, second array antenna-2, fourth metallized hole-21, common feeding power splitting network-3, first metal layer-31, feeding port-32, power splitting network-33, first metallized hole-34, second metallized hole-35, second metal layer-4, third metal layer-5, impedance matching network-51, fourth metal layer-6, coupling slot-61, fifth metal layer-7, radiation patch-71, varactor diode-72, ceramic substrate-8. DETAILED DESCRIPTION

[0047] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0048] Example 1

[0049] like Figure 1 As shown, a dual-band array antenna includes: a first array antenna 1, a second array antenna 2 and a common feeding power division network 3.

[0050] The common feeding power splitting network 3 includes a first metal layer 31, which has a feeding port 32 and a power splitting network 33 with a microstrip structure. The feeding port 32 is connected to the power splitting network 33. The power splitting network 33 splits the feeding signal input from the feeding port 32 into two to form two groups of output signals.

[0051] The first array antenna 1 and the second array antenna 2 have a symmetrical structure and are respectively arranged on two sides of the common feeding power division network 3. The first array antenna 1 and the second array antenna 2 both include a second metal layer 4, a third metal layer 5, a fourth metal layer 6 and a fifth metal layer 7 stacked in sequence, wherein the second metal layer 4 is facing the side of the common feeding power division network 3, and the fifth metal layer 7 is on the outside of the array antenna.

[0052] A ceramic substrate 8 is provided between the first metal layer 31, the second metal layer 4, the third metal layer 5, the fourth metal layer 6 and the fifth metal layer 7. The ceramic substrate 8 is a co-fired ceramic substrate. The co-fired ceramic substrate has a high dielectric constant, which significantly reduces the size of the antenna while avoiding signal interference between the various metal layers.

[0053] The second metal layer 4 is a ground layer.

[0054] The third metal layer 5 has an impedance matching network 51 .

[0055] The second metal layer 4, the third metal layer 5, the first metal layer 31 and the adjacent ceramic substrate 8 of the first array antenna 1 are penetrated by a first metallized hole 34, and a group of signals of the power division network 33 are transmitted to the impedance matching network 51 of the first array antenna 1 through the first metallized hole 34.

[0056] The second metal layer 4, the third metal layer 5, the first metal layer 31 and the adjacent ceramic substrate 8 of the second array antenna 2 are penetrated by a second metallized hole 35, and another group of signals of the power division network 33 are transmitted to the impedance matching network 51 of the second array antenna 2 through the second metallized hole 35.

[0057] The fourth metal layer 6 is provided with an array of coupling slots 61 , and the sizes of the coupling slots 61 corresponding to the first array antenna 1 and the second array antenna 2 are different, so that the first array antenna 1 and the second array antenna 2 have different frequency bands.

[0058] The fifth metal layer 7 is provided with a radiation patch 71 corresponding to the coupling slot 61. The impedance matching network 51 couples the signal with the radiation patch 71 through the corresponding coupling slot 61. The radiation patch 71 corresponding to the first array antenna 1 and the second array antenna 2 has a different shape and / or size, so that the first array antenna 1 and the second array antenna 2 have different frequency bands. The shape of the radiation patch corresponding to the antenna array 1 and the antenna array 2 can be any shape, and its equivalent size determines its corresponding operating frequency band. The impedance matching network is adjusted accordingly according to the shape and size of the patch. Finally, the signal is radiated through the radiation patches 71 set on both sides of the dual-band array antenna, realizing the operating mode of the two-band array antenna.

[0059] The working principle of the dual-band array antenna is as follows: the feeding signal is input to the microstrip feeder through the feeding port 32 of the first metal layer 31. The microstrip feeder is a power splitting network 33 that splits the signal into two. The power splitting network 33 splits the signal into two.

[0060] For the first array antenna 1, one of the signals output by the power splitter network 33 is connected to the impedance matching network 51 on the corresponding third metal layer 5 through the first metalized hole 34. The impedance matching network 51 couples the signal through the corresponding coupling slot 61 of the fourth metal layer 6 and the radiating patch 71 of the fifth metal layer 7. The signal is finally radiated through the radiating patch 71 of the first array antenna 1.

[0061] For the second array antenna 2, the other signal output by the power splitter network 33 is connected to the impedance matching network 51 on the corresponding third metal layer 5 through the second metalized hole 35. The impedance matching network 51 couples the signal through the corresponding coupling slot 61 of the fourth metal layer 6 and the radiating patch 71 of the fifth metal layer 7. The signal is finally radiated through the radiating patch 71 of the second array antenna 2.

[0062] The above principle is used to achieve the working mode of the two-band array antenna. The dual-band array antenna of this application places the feeding part, impedance matching part, and radiating element part on different layers, which can not only meet the working requirements of the dual-band, but also achieve the characteristics of miniaturization, while also minimizing the impact of the feeding network. In addition, since antennas of different frequency bands can be designed separately and then combined together, the entire design process will be simplified.

[0063] Preferably, Figure 1 As shown, the radiating patch 71 in the orthogonal direction of the corresponding coupling slot 61 is provided with a varactor diode 72, that is, the varactor diode 72 is perpendicular to the coupling slot 61. When an external power supply is connected to both ends of the varactor diode 72, the capacitance of the varactor diode 72 can be changed by changing the voltage of the external power supply. The radiating patch 71 itself can be equivalent to an LC resonant circuit of a capacitor and an inductor in series. After the varactor diode 72 is loaded, it is equivalent to adding another capacitor in series. Its resonant frequency, which is also the working center frequency of the antenna, is Therefore, under the premise that the antenna structure remains unchanged, the voltage loaded at both ends of the varactor diode 72 is changed to change the capacitance of the varactor diode, thereby achieving the adjustment of the working frequency band of the antenna array.

[0064] The operating frequency band of an antenna is generally determined by the size of the radiating patch. Changing the operating frequency band requires changing the size of the radiating patch. However, changing the size of the radiating patch can change the feed impedance, leading to impedance mismatch and signal reflection issues. This application adds a varactor diode 72. By changing the voltage of the varactor diode 72, the frequency band can be changed without changing the size of the radiating patch 71.

[0065] Preferably, Figure 1 As shown, a third metallized hole 11 is provided through the ceramic substrate 8 between the second metal layer 4 and the third metal layer 5 corresponding to the first array antenna 1 for connecting the second metal layer 4 and the third metal layer 5, and the third metallized hole 11 is connected to a separate feeding port.

[0066] A fourth metallized hole 21 is provided through the ceramic substrate 8 between the second metal layer 4 and the third metal layer 5 corresponding to the second array antenna 2 for connecting the second metal layer 4 and the third metal layer 5 , and the fourth metallized hole 21 is connected to a separate feeding port.

[0067] Through the above configuration, both the first array antenna 1 and the second array antenna 2 can be used separately as a complete array antenna, and the two have different frequency bands, further increasing the practicality of the dual-band array antenna.

[0068] Example 2

[0069] A method for realizing a dual-band array antenna adopts a thick-film circuit process to manufacture the dual-band array antenna. The thick-film circuit process refers to the use of a screen printing method to transfer and print materials such as a conductor paste and a dielectric paste onto a ceramic substrate. After high-temperature firing, a firmly adhered metal film is formed on the ceramic substrate, and then a circuit is formed on the metal film.

[0070] The implementation method includes the following steps:

[0071] Eight ceramic substrates 8 are provided, wherein a first metal layer 31 is formed on the top surface of one ceramic substrate 8 by a thick film circuit process, a second metal layer 4 is formed on the top surfaces of two ceramic substrates 8 by a thick film circuit process, a third metal layer 5 is formed on the top surfaces of two ceramic substrates 8 by a thick film circuit process, a fourth metal layer 6 is formed on the top surfaces of two ceramic substrates 8 by a thick film circuit process, a fifth metal layer 7 is formed on the top surface of one ceramic substrate 8 by a thick film circuit process, and a fifth metal layer 7 is formed on the bottom surface of one of the ceramic substrates 8 on which the fourth metal layer 6 is formed by a thick film circuit process.

[0072] A feeding port 32 and a power division network 33 are etched on the first metal layer 31 . The power division network 33 has two signal output terminals.

[0073] An impedance matching network 51 is formed by etching on the third metal layer 5 .

[0074] The fourth metal layer 6 is processed with a coupling gap 61 that penetrates through it. The sizes of the coupling gaps 61 of the fourth metal layers 6 corresponding to the two ceramic substrates 8 are different.

[0075] The fifth metal layer 7 is provided with radiation patches 71 in an array. The radiation patches 71 on the fifth metal layer 7 corresponding to the two ceramic substrates 8 have different shapes and / or sizes.

[0076] The ceramic substrate 8 with the fifth metal layer 7 on the bottom is stacked at the bottom layer; from bottom to top, a ceramic substrate 8 with a fourth metal layer 6, a ceramic substrate 8 with a third metal layer 5, a ceramic substrate 8 with a second metal layer 4, a ceramic substrate 8 with a first metal layer 31, a ceramic substrate 8 with a second metal layer 4, a ceramic substrate 8 with a third metal layer 5, a ceramic substrate 8 with a fourth metal layer 6 and a ceramic substrate 8 with a fifth metal layer 7 are stacked in sequence.

[0077] Pressing and sintering, using a thick film process to form a dual-band array antenna. The eight layers of ceramic substrate 8, after being laminated, are pressed together and solidified by sintering to form an integrated dual-band array antenna. After pressing and sintering, one output end of the power splitter network 33 on the first metal layer 31 is connected to the impedance matching network 51 above the first metal layer 31 via a first plated via 34. The other output end of the power splitter network 33 on the first metal layer 31 is connected to the impedance matching network 51 below the first metal layer 31 via a second plated via 35. Both the first plated via 34 and the second plated via 35 are completed before lamination.

[0078] Preferably, Figure 1 As shown, after the radiation patch 71 is provided, a varactor diode 72 is provided between the two radiation patches 71 , and the varactor diode 72 and the coupling slot 61 are perpendicular to each other.

[0079] Preferably, Figure 1 As shown, the ceramic substrate 8 between the second metal layer 4 and the third metal layer 5 above the first metal layer 31 is penetrated by a third metalized hole 11 for connecting the second metal layer 4 and the third metal layer 5 above the first metal layer 31. The third metalized hole 11 is connected to a separate feeding port.

[0080] A fourth metallized hole 21 is provided through the ceramic substrate 8 between the second metal layer 4 and the third metal layer 5 below the first metal layer 31 for connecting the second metal layer 4 and the third metal layer 5 below the first metal layer 31 , and the fourth metallized hole 21 is connected to a separate feeding port.

[0081] Example 3

[0082] A method for implementing a dual-band array antenna, comprising the steps of:

[0083] Eight ceramic substrates 8 are provided, wherein a first metal layer 31 is formed on the top surface of one ceramic substrate 8 by a thick film circuit process, a second metal layer 4 is formed on the top surfaces of two ceramic substrates 8 by a thick film circuit process, a third metal layer 5 is formed on the top surfaces of two ceramic substrates 8 by a thick film circuit process, a fourth metal layer 6 is formed on the top surfaces of two ceramic substrates 8 by a thick film circuit process, a fifth metal layer 7 is formed on the top surface of one ceramic substrate 8 by a thick film circuit process, and a fifth metal layer 7 is formed on the bottom surface of one of the ceramic substrates 8 on which the fourth metal layer 6 is formed by a thick film circuit process.

[0084] A feeding port 32 and a power division network 33 are etched on the first metal layer 31 . The power division network 33 has two signal output terminals.

[0085] An impedance matching network 51 is formed by etching on the third metal layer 5 .

[0086] The fourth metal layer 6 is processed with a coupling gap 61 that penetrates through it. The sizes of the coupling gaps 61 of the fourth metal layers 6 corresponding to the two ceramic substrates 8 are different.

[0087] The fifth metal layer 7 is provided with radiation patches 71 in an array. The radiation patches 71 on the fifth metal layer 7 corresponding to the two ceramic substrates 8 have different shapes and / or sizes.

[0088] From bottom to top, a ceramic substrate 8 having a second metal layer 4, a ceramic substrate 8 having a third metal layer 5, a ceramic substrate 8 having a fourth metal layer 6, and a ceramic substrate 8 having a fifth metal layer 7 are stacked in sequence and pressed and sintered to form a first array antenna 1. Before stacking, first metallized holes 34 are made in the ceramic substrate 8 having the third metal layer 5, the second metal layer 4, and the corresponding ceramic substrate 8.

[0089] A ceramic substrate 8 having a fifth metal layer 7 on its bottom surface is placed at the bottom layer, and a ceramic substrate 8 having a fourth metal layer 6, a ceramic substrate 8 having a third metal layer 5, and a ceramic substrate 8 having a second metal layer 4 are stacked on top of the ceramic substrate 8 in sequence from bottom to top. After pressing and sintering, a second array antenna 2 is formed. Before stacking, second metallized holes 35 are made on the ceramic substrate 8 having the first metal layer 31, the second metal layer 4, and its corresponding ceramic substrate 8.

[0090] The ceramic substrate 8 having the first metal layer 31 is stacked on top of the second array antenna 2, and the first array antenna 1 is stacked on top of the ceramic substrate 8 having the first metal layer 31, and pressed and sintered to form a dual-band array antenna. After sintering, the impedance matching network 51 on the first array antenna 1 is connected to one output end of the power division network 33 on the first metal layer 31 through the first metalized hole 34, and the impedance matching network 51 on the second array antenna 2 is connected to the other output end of the power division network 33 on the first metal layer 31 through the second metalized hole 35.

[0091] In this embodiment, the first array antenna 1 and the second array antenna 2 are designed and manufactured separately, and finally connected to the common feed power distribution network 3 through a thick film process. This not only simplifies the design and manufacturing process, but also allows the adaptive selection of the first array antenna 1 and the second array antenna 2 of different frequency bands for matching, which has greater practicality.

[0092] Preferably, Figure 1 As shown, the ceramic substrate 8 between the second metal layer 4 and the third metal layer 5 on the first array antenna 1 is penetrated by a third metallized hole 11 for connecting the second metal layer 4 and the third metal layer 5 of the first array antenna 1. The third metallized hole 11 is connected to a separate feeding port.

[0093] A fourth metallized hole 21 is provided through the ceramic substrate 8 between the second metal layer 4 and the third metal layer 5 on the second array antenna 2 for connecting the second metal layer 4 and the third metal layer 5 of the second array antenna 2, and the fourth metallized hole 21 is connected to a separate feeding port.

[0094] This structure enables the first array antenna 1 and the second array antenna 2 to be used as independent array antennas, making the dual-band array antenna more powerful.

[0095] The above description is only a preferred embodiment of the present invention and is not intended to be the only one or to limit the present invention. It should be understood by those skilled in the art that various changes or equivalent replacements made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.

Claims

1. A dual-band array antenna, characterized in that: include: A first array antenna (1), a second array antenna (2), and a common feed power division network (3); The common feeding power splitting network (3) includes a first metal layer (31), the first metal layer (31) has a feeding port (32) and a power splitting network (33) with a microstrip structure, and the power splitting network (33) splits the feeding signal input from the feeding port (32) into two; The first array antenna (1) and the second array antenna (2) are symmetrically arranged on two sides of the common feed power division network (3), and each of the first array antenna (1) and the second array antenna (2) includes a second metal layer (4), a third metal layer (5), a fourth metal layer (6), and a fifth metal layer (7) stacked in sequence, wherein the second metal layer (4) faces one side of the common feed power division network (3); A ceramic substrate (8) is provided between the first metal layer (31), the second metal layer (4), the third metal layer (5), the fourth metal layer (6) and the fifth metal layer (7); The second metal layer (4) is a ground layer; The third metal layer (5) has an impedance matching network (51); The second metal layer (4), the third metal layer (5), the first metal layer (31) and the adjacent ceramic substrate (8) of the first array antenna (1) are penetrated by a first metalized hole (34), and a group of signals of the power division network (33) are transmitted to the impedance matching network (51) of the first array antenna (1) through the first metalized hole (34); The second metal layer (4), the third metal layer (5), the first metal layer (31) and the adjacent ceramic substrate (8) of the second array antenna (2) are penetrated by a second metalized hole (35), and another group of signals of the power division network (33) is transmitted to the impedance matching network (51) of the second array antenna (2) through the second metalized hole (35); The fourth metal layer (6) is provided with an array of coupling slots (61), and the sizes of the coupling slots (61) corresponding to the first array antenna (1) and the second array antenna (2) are different; The fifth metal layer (7) is provided with a radiation patch (71) corresponding to the coupling slot (61), and the impedance matching network (51) couples the signal with the radiation patch (71) through the corresponding coupling slot (61). The radiation patch (71) corresponding to the first array antenna (1) and the second array antenna (2) has a different shape and / or size. Eight ceramic substrates (8) are provided, wherein a first metal layer (31) is formed on the top surface of one ceramic substrate (8) by using a thick film circuit process, a second metal layer (4) is formed on the top surfaces of two ceramic substrates (8) by using a thick film circuit process, a third metal layer (5) is formed on the top surfaces of two ceramic substrates (8) by using a thick film circuit process, a fourth metal layer (6) is formed on the top surfaces of two ceramic substrates (8) by using a thick film circuit process, a fifth metal layer (7) is formed on the top surface of one ceramic substrate (8) by using a thick film circuit process, and a fifth metal layer (7) is formed on the bottom surface of one of the ceramic substrates (8) on which the fourth metal layer (6) is formed by using a thick film circuit process.

2. The dual-band array antenna according to claim 1, wherein: A varicap diode (72) is provided on the radiation patch (71) in a direction orthogonal to the corresponding coupling gap (61).

3. The dual-band array antenna according to claim 1, wherein: A third metallized hole (11) is provided through the ceramic substrate (8) between the second metal layer (4) and the third metal layer (5) corresponding to the first array antenna (1), for connecting the second metal layer (4) and the third metal layer (5), and the third metallized hole (11) is connected to a separate feeding port; A fourth metallized hole (21) is provided through the ceramic substrate (8) between the second metal layer (4) and the third metal layer (5) corresponding to the second array antenna (2), for connecting the second metal layer (4) and the third metal layer (5), and the fourth metallized hole (21) is connected to a separate feeding port.

4. A method for implementing the dual-band array antenna according to any one of claims 1 to 3, characterized in that: Including steps: In the first step, a feeding port (32) and a power division network (33) are formed by etching on the first metal layer (31), and the power division network (33) is provided with two signal output terminals; In the second step, an impedance matching network (51) is formed by etching on the third metal layer (5); The third step is to process a coupling gap (61) on the fourth metal layer (6), wherein the sizes of the coupling gaps (61) of the fourth metal layers (6) corresponding to the two ceramic substrates (8) are different; In the fourth step, a radiation patch (71) is arranged in an array on the fifth metal layer (7), and the radiation patches (71) on the fifth metal layers (7) corresponding to the two ceramic substrates (8) have different shapes and / or sizes; Step 5: overlap; The sixth step is pressing and sintering, using thick film technology to form a dual-band array antenna.

5. The method for realizing a dual-band array antenna according to claim 4, wherein: During the fifth stacking step, the ceramic substrate (8) having the fifth metal layer (7) on its bottom surface is placed at the bottom layer, and a ceramic substrate (8) having the fourth metal layer (6), a ceramic substrate (8) having the third metal layer (5), a ceramic substrate (8) having the second metal layer (4), a ceramic substrate (8) having the first metal layer (31), a ceramic substrate (8) having the second metal layer (4), a ceramic substrate (8) having the third metal layer (5), a ceramic substrate (8) having the fourth metal layer (6), and a ceramic substrate (8) having the fifth metal layer (7) are stacked in sequence from bottom to top; In the sixth step, during pressing and sintering, the eight-layer ceramic substrate (8) after being stacked is pressed and solidified into an integrated dual-band array antenna by sintering. After pressing and sintering, one output end of the power division network (33) is connected to the impedance matching network (51) above the first metal layer (31) through the first metalized hole (34), and the other output end of the power division network (33) is connected to the impedance matching network (51) below the first metal layer (31) through the second metalized hole (35). The first metalized hole (34) and the second metalized hole (35) are both completed before stacking.

6. The method for realizing a dual-band array antenna according to claim 5, wherein: A third metallized hole (11) is provided through the ceramic substrate (8) between the second metal layer (4) and the third metal layer (5) above the first metal layer (31), for connecting the second metal layer (4) and the third metal layer (5) above the first metal layer (31), and the third metallized hole (11) is connected to a separate feeding port; A fourth metallized hole (21) is provided through the ceramic substrate (8) between the second metal layer (4) and the third metal layer (5) below the first metal layer (31), for connecting the second metal layer (4) and the third metal layer (5) below the first metal layer (31), and the fourth metallized hole (21) is connected to a separate feeding port.

7. The method for implementing a dual-band array antenna according to claim 4, wherein: A ceramic substrate (8) having a second metal layer (4), a ceramic substrate (8) having a third metal layer (5), a ceramic substrate (8) having a fourth metal layer (6), and a ceramic substrate (8) having a fifth metal layer (7) are sequentially stacked from bottom to top, and pressed and sintered to form a first array antenna (1). Before stacking, a first metallized hole (34) is formed on the ceramic substrate (8) having the third metal layer (5), the second metal layer (4), and the corresponding ceramic substrate (8); A ceramic substrate (8) having a fifth metal layer (7) on its bottom surface is placed at the bottom layer, and a ceramic substrate (8) having a fourth metal layer (6), a ceramic substrate (8) having a third metal layer (5), and a ceramic substrate (8) having a second metal layer (4) are stacked on top of the ceramic substrate (8) in order from bottom to top, and the ceramic substrates (8) are pressed and sintered to form a second array antenna (2). Before stacking, second metallized holes (35) are made on the ceramic substrate (8) having the first metal layer (31), the second metal layer (4), and the corresponding ceramic substrate (8); A ceramic substrate (8) having a first metal layer (31) is stacked on top of the second array antenna (2), and the first array antenna (1) is stacked on top of the ceramic substrate (8) having the first metal layer (31), and the two antennas are pressed and sintered to form a dual-band array antenna. After sintering, the impedance matching network (51) on the first array antenna (1) is connected to one output end of the power division network (33) through the first metalized hole (34), and the impedance matching network (51) on the second array antenna (2) is connected to the other output end of the power division network (33) through the second metalized hole (35).

8. The method for implementing a dual-band array antenna according to claim 7, wherein: A third metallized hole (11) is provided through the ceramic substrate (8) between the second metal layer (4) and the third metal layer (5) on the first array antenna (1), for connecting the second metal layer (4) and the third metal layer (5) of the first array antenna (1), and the third metallized hole (11) is connected to a separate feeding port; a fourth metallized hole (21) is provided through the ceramic substrate (8) between the second metal layer (4) and the third metal layer (5) on the second array antenna (2), for connecting the second metal layer (4) and the third metal layer (5) of the second array antenna (2), and the fourth metallized hole (21) is connected to a separate feeding port.

9. The method for realizing a dual-band array antenna according to claim 4, wherein: After the radiation patch (71) is provided, a varactor diode (72) is provided between the two radiation patches (71), and the varactor diode (72) and the coupling gap (61) are perpendicular to each other.

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