Heat dissipating device and mounting method

Abstract

The application provides a heat dissipation device and a mounting method. The heat dissipation device comprises a heat dissipation assembly, a circuit board, a chip, a support and a pressure detection module. The chip is arranged on the circuit board. The heat dissipation assembly is arranged on the side of the chip away from the circuit board and dissipates heat for the chip. The pressure detection module is located between the heat dissipation assembly and the chip, and is configured to detect the pressure received by the chip. The support is arranged on the side of the circuit board away from the chip. The support comprises a support body and an elastic arm. The support body is opposite to the chip. The first end of the elastic arm is connected with the support body. The second end of the elastic arm is connected with the heat dissipation assembly. The elastic arm can produce elastic deformation of different amplitudes relative to the support body, so that the support body produces pressure on the circuit board, and the chip is clamped between the heat dissipation assembly and the circuit board. The pressure of the heat dissipation assembly on the chip can be adjusted, and the risk of damage of the chip due to excessive pressure can be reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit device technology, and in particular to a heat dissipation device and its installation method. Background Technology

[0002] With the development of technology, the integration of circuit boards is getting higher and higher, and the computing power of chips is also further improved. However, high computing power chips also bring high heat and power consumption problems. Chips generate heat during high-speed operation. When this heat approaches or exceeds the chip's maximum withstand temperature, if it is not dissipated in time, it may damage the chip or even bring safety hazards.

[0003] In related technologies, chip heat dissipation methods generally include self-heating, air cooling, and liquid cooling. To improve the heat dissipation efficiency of different heat dissipation methods, the contact thermal resistance along the heat transfer path can be reduced. When the heat dissipation module dissipates heat from the chip, the pressure between the heat dissipation module and the chip can be increased to improve heat dissipation efficiency.

[0004] However, current methods for improving chip heat dissipation efficiency can easily lead to excessive pressure on the chip surface, causing chip damage. Summary of the Invention

[0005] This invention provides a heat dissipation device and installation method to solve the technical problem that excessive surface pressure during chip heat dissipation can easily cause damage.

[0006] In a first aspect, this application provides a heat dissipation device, which includes a heat dissipation component, a circuit board, a chip, a support member, and a pressure detection module. The chip is disposed on the circuit board, and the heat dissipation component is disposed on the side of the chip away from the circuit board and dissipates heat from the chip. The pressure detection module is located between the heat dissipation component and the chip, and the pressure detection module is configured to detect the pressure on the chip.

[0007] The support component is located on the side of the circuit board away from the chip. The support component includes a support body and an elastic arm. The support body is opposite to the chip. The first end of the elastic arm is connected to the support body, and the second end of the elastic arm is connected to the heat dissipation component. The elastic arm can generate elastic deformation of different amplitudes relative to the support body, so that the support body exerts pressure on the circuit board, thereby clamping the chip between the heat dissipation component and the circuit board. The pressure of the heat dissipation component on the chip can be adjusted.

[0008] The heat dissipation device provided in this application has heat dissipation components and support members respectively arranged on both sides of the circuit board. Through the structural design of the support members, the support members and heat dissipation components can apply controllable pressure to the circuit board and the chip to reduce the contact resistance of the chip and improve the heat dissipation efficiency. At the same time, by setting a pressure detection module, the pressure on the chip is monitored, reducing the risk of chip damage due to excessive pressure and ensuring the reliability of chip operation.

[0009] As an alternative implementation, the support body is attached to the circuit board, and the elastic arm is tilted relative to the support body in a direction away from the circuit board.

[0010] With this configuration, when the elastic arm is connected to the heat dissipation component, the elastic arm can undergo elastic deformation toward the circuit board, thereby causing the support body to press tightly against the circuit board and exert pressure on the circuit board.

[0011] As an optional implementation, the tilt angle of the elastic arm relative to the support body can be 135°-175°.

[0012] This configuration allows the elastic deformation of the elastic arm relative to the supporting body to be controlled within a reasonable range, thereby controlling the range of pressure exerted on the chip.

[0013] As an optional implementation, there can be multiple elastic arms, which can be distributed circumferentially along the support body; the tilt angle of the multiple elastic arms relative to the support body can be adjusted.

[0014] This configuration maintains a balance of pressure when the support body and heat dissipation components clamp the circuit board and chip, facilitating the monitoring and control of the pressure on the chip.

[0015] As an optional implementation, the support body may have an opening opposite to the chip; the shape of the opening may match the shape of the chip, and the size of the opening may be greater than or equal to the size of the chip.

[0016] This design allows the area on the circuit board where the chip is located to deform locally under the pressure of the supporting body, thereby lifting the chip and positioning it close to the heat dissipation component, thus improving heat dissipation efficiency.

[0017] As an optional implementation, the pressure detection module may include a piezoelectric unit and a detection unit, with the opposite sides of the piezoelectric unit abutting against a heat dissipation component and a chip, respectively, and the detection unit being electrically connected to the piezoelectric unit.

[0018] This configuration allows the pressure received by the chip to be converted into current from the piezoelectric unit, and the detection unit can accurately feed back the magnitude of the pressure received by the chip.

[0019] As an optional implementation, the piezoelectric unit may include a thermally conductive shell and a piezoelectric layer, with the piezoelectric layer located inside the thermally conductive shell; the thermally conductive shell may be an elastic insulating component.

[0020] This configuration shortens the thermal contact path between the chip and the heat dissipation component when the piezoelectric unit is compressed, thus improving heat dissipation performance.

[0021] As an optional implementation, the thickness of the piezoelectric unit can be 0.3mm-1mm; and / or, the piezoelectric unit is disposed on the surface of the chip, and the size of the piezoelectric unit is 1mm-2mm larger than the size of the chip.

[0022] This configuration allows the connection area between the piezoelectric unit and the heat dissipation component to avoid the chip, thus preventing an increase in contact thermal resistance.

[0023] As an alternative implementation, the heat dissipation assembly may include a heat sink, the side of which faces the circuit board and abuts against the pressure detection module.

[0024] This configuration can improve the heat dissipation efficiency of the radiator.

[0025] As an alternative implementation, the side of the heat sink facing the circuit board may be provided with a boss and a connecting hole, and the surface of the boss may be in contact with the surface of the pressure detection module; the circuit board may be provided with a through hole, and the second end of the elastic arm may be connected to the connecting hole by a fastener passing through the through hole.

[0026] This configuration improves the reliability of the connection between the heat sink and the support, and allows for continuous and stable pressure to be applied to the chip after assembly.

[0027] Secondly, this application provides a method for installing a heat dissipation device, the method comprising:

[0028] The pressure value applied to the chip is obtained through a pressure detection module;

[0029] Determine whether the pressure value is within the preset pressure threshold range;

[0030] If the pressure value is not within the preset pressure threshold range, the amplitude of the elastic deformation generated by the elastic arm is adjusted to adjust the pressure of the heat dissipation component on the chip.

[0031] This application provides a heat dissipation device and installation method. The heat dissipation device includes a heat dissipation component, a circuit board, a chip, a support member, and a pressure detection module. The chip is disposed on the circuit board, and the heat dissipation component is disposed on the side of the chip away from the circuit board and dissipates heat from the chip. The pressure detection module is located between the heat dissipation component and the chip and is configured to detect the pressure exerted on the chip. The support member is disposed on the side of the circuit board away from the chip. The support member includes a support body and an elastic arm. The support body is opposite to the chip. The first end of the elastic arm is connected to the support body, and the second end of the elastic arm is connected to the heat dissipation component. The elastic arm can generate elastic deformation of different amplitudes relative to the support body to adjust the pressure exerted by the heat dissipation component on the chip, thereby reducing the contact resistance of the chip and improving the heat dissipation efficiency. At the same time, it can monitor the pressure exerted on the chip and reduce the risk of chip damage due to excessive pressure.

[0032] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the heat dissipation device and installation method provided by this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific embodiments. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 Schematic diagram of the heat dissipation device provided in the embodiments of this application Figure 1 ;

[0035] Figure 2 Schematic diagram of the heat dissipation device provided in the embodiments of this application Figure 2 ;

[0036] Figure 3 A side view of the heat dissipation device provided in an embodiment of this application;

[0037] Figure 4 A cross-sectional view of the heat dissipation device provided in an embodiment of this application;

[0038] Figure 5 An exploded view of the heat dissipation device provided in the embodiments of this application;

[0039] Figure 6 This is a schematic diagram of the structure of the support member in the heat dissipation device provided in the embodiments of this application;

[0040] Figure 7 for Figure 6 A cross-sectional view along the AA direction;

[0041] Figure 8 This is a schematic diagram of the structure of the heat sink in the heat dissipation device provided in the embodiments of this application;

[0042] Figure 9 This is a schematic diagram illustrating the steps of the heat dissipation device installation method provided in the embodiments of this application;

[0043] Figure 10 This is a schematic diagram illustrating the steps of adjusting chip pressure during the installation of the heat dissipation device provided in this embodiment of the application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100 - Heat dissipation component; 110 - Heat sink; 111 - Fins; 112 - Boss; 120 - Fan;

[0046] 200 - Circuit board; 201 - Through hole;

[0047] 300-chip;

[0048] 400 - Support component; 410 - Support body; 411 - Opening; 420 - Flexible arm;

[0049] 500 - Pressure detection module; 510 - Piezoelectric unit; 520 - Detection unit;

[0050] 600 - Fasteners. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0052] First, those skilled in the art should understand that these embodiments are merely for explaining the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0053] Secondly, it should be noted that in the description of this application, the terms "inner" and "outer," etc., which indicate the direction or positional relationship, are based on the direction or positional relationship shown in the accompanying drawings. This is only for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0054] Furthermore, it should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0056] Chips generate heat during high-speed operations. When this heat approaches or exceeds the chip's maximum operating temperature, it can damage the chip and even pose safety hazards if not dissipated in time. Therefore, heat dissipation is necessary during operation. Currently, chip heat dissipation methods generally include self-heating, air cooling, and liquid cooling. To improve the heat dissipation efficiency of different methods, the contact thermal resistance along the heat transfer path can be reduced. Specifically, when two nominally contacting solid surfaces actually only make contact at discrete area elements, the gaps between the non-contact interfaces are often filled with air. Heat will conduct through these air gaps, adding additional resistance compared to complete solid surface contact; this is called contact thermal resistance.

[0057] When a heat dissipation module contacts and cools a chip, the heat dissipation efficiency can be improved by increasing the pressure between the heat dissipation module and the chip. However, current methods for improving chip heat dissipation efficiency cannot precisely control the force applied to the chip, which can easily lead to excessive pressure on the chip surface and damage the chip.

[0058] This application provides a heat dissipation device. By designing the support structure in the heat dissipation device, a certain pressure can be maintained between the heat dissipation module and the chip, reducing the contact thermal resistance between the chip and the heat dissipation module. At the same time, by setting a pressure detection module in the heat dissipation device to monitor the pressure on the chip, the heat dissipation efficiency of the chip is improved while reducing the risk of chip damage due to excessive pressure.

[0059] To facilitate understanding, the application scenarios of the heat dissipation device provided in the embodiments of this application will be illustrated first.

[0060] The heat dissipation device provided in this application embodiment can be applied to various occasions where chip heat dissipation is required. Specifically, it can be applied to various electronic devices or smart terminals, including but not limited to mobile terminals, communication base stations, new energy vehicles, computers, etc. In addition, the heat dissipation device can adopt one or more of the following methods: natural heat dissipation, air cooling, water cooling, etc. This application embodiment does not make specific limitations on this.

[0061] Figure 1 Schematic diagram of the heat dissipation device provided in the embodiments of this application Figure 1 , Figure 2 Schematic diagram of the heat dissipation device provided in the embodiments of this application Figure 2 , Figure 3 This is a side view of the heat dissipation device provided in an embodiment of this application. Figure 4 This is a cross-sectional view of the heat dissipation device provided in an embodiment of this application. Figure 5 An exploded view of the heat dissipation device provided in an embodiment of this application.

[0062] like Figures 1 to 5 As shown in the figure, this application embodiment provides a heat dissipation device, which includes a heat dissipation component 100, a circuit board 200, a chip 300, a support member 400, and a pressure detection module 500. The chip 300 is disposed on the circuit board 200. The heat dissipation component 100 is used to dissipate heat from the chip 300. The support member 400 is used to cooperate with the heat dissipation component 100 to generate pressure on the chip 300, thereby reducing the contact thermal resistance between the heat dissipation component 100 and the chip 300 and improving the heat dissipation efficiency. The pressure detection module 500 is used to monitor the pressure on the chip 300.

[0063] The heat dissipation component 100 is disposed on the side of the chip 300 away from the circuit board 200. The pressure detection module 500 is located between the heat dissipation component 100 and the chip 300. The support member 400 is disposed on the side of the circuit board 200 away from the chip 300. The support member 400 is connected to the heat dissipation component 100 and applies a clamping force to the circuit board 200 and the chip 300 connected to the circuit board 200 to reduce the contact thermal resistance between the heat dissipation component 100 and the chip 300. The pressure detection module 500 has good thermal conductivity. When the battery cell is subjected to pressure, the pressure detection module 500 is also compressed. At the same time, the pressure detection module 500 can conduct heat from the chip 300 to the heat dissipation component 100 to improve heat dissipation efficiency.

[0064] In some embodiments, the support member 400 includes a support body 410 and an elastic arm 420. The support body 410 is opposite to the chip 300. The first end of the elastic arm 420 is connected to the support body 410, and the second end of the elastic arm 420 is connected to the heat dissipation assembly 100. The elastic arm 420 can generate elastic deformation of different amplitudes relative to the support body 410, so that the support body 410 exerts pressure on the circuit board 200, thereby clamping the chip 300 between the heat dissipation assembly 100 and the circuit board 200, and the pressure of the heat dissipation assembly 100 on the chip 300 can be adjusted.

[0065] Understandably, when the elastic arm 420 and the heat dissipation assembly 100 are connected, the elastic arm 420 and the heat dissipation assembly 100 are relatively fixed. The elastic arm 420 can undergo elastic deformation, and the elastic force of the elastic arm 420 can force the support body 410 and the heat dissipation assembly 100 to apply pressure to the circuit board 200, chip 300, and pressure detection module 500 sandwiched between them. By controlling the deformation of the elastic arm 420 when connected to the heat dissipation assembly 100, the pressure on the chip 300 can be controlled, thereby keeping the pressure on the chip 300 within a reasonable threshold range.

[0066] It should be noted that in the heat dissipation device provided in this application embodiment, the heat dissipation component 100 and the support member 400 are located on opposite sides of the circuit board 200. Through the structural design of the support member 400, the support member 400 and the heat dissipation component 100 can apply controllable pressure to the circuit board 200 and the chip 300, so that the chip 300 is in close contact with the pressure detection module 500, and the pressure detection module 500 is in close contact with the heat dissipation component 100, thereby reducing the contact resistance of the chip 300 and improving the heat dissipation efficiency. The pressure detection module 500 can monitor the pressure on the chip 300, reduce the risk of the chip 300 being damaged due to excessive pressure, and ensure the reliability of the chip 300's operation.

[0067] Furthermore, the circuit board 200 can be a printed circuit board (PCB). This application embodiment does not specifically limit the specific circuit functions implemented by the circuit board 200 and the chip 300.

[0068] The specific structure of the support member 400 will be described in detail below.

[0069] Figure 6 This is a schematic diagram of the structure of the support member in the heat dissipation device provided in the embodiments of this application. Figure 7 for Figure 6 A cross-sectional view along the AA direction.

[0070] Please refer to Figures 1 to 7 In one possible implementation, the support body 410 can be attached to the circuit board 200, and the elastic arm 420 is tilted relative to the support body 410 in a direction away from the circuit board 200. When the elastic arm 420 is connected to the heat dissipation assembly 100, the elastic arm 420 can generate elastic deformation towards the circuit board 200, thereby causing the support body 410 to adhere tightly to the circuit board 200 and exert pressure on the circuit board 200.

[0071] It is understood that the side of the circuit board 200 where the chip 300 is mounted is defined as the front side, and the side of the circuit board 200 away from the chip 300 is defined as the back side. The support body 410 is attached to the back side of the circuit board 200. When the elastic arm 420 and the heat dissipation assembly 100 are relatively fixed and locked, the elastic arm 420 can undergo elastic deformation relative to the support body 410. For example, the elastic arm 420 can be pressed against the back side of the circuit board 200. When the elastic arm 420 undergoes elastic deformation, it tends to return to its initial state, thereby exerting pressure on the back side of the circuit board 200 through the support body 410. This allows the heat dissipation assembly 100 on the front side of the circuit board 200 to clamp the circuit board 200 and the chip 300 together with the support body 410.

[0072] For example, the elastic arm 420 can be made of spring steel or other high-strength metal materials with elasticity. The material of the elastic arm 420 in this embodiment is not specifically limited. In addition, the elastic arm 420 can be integrally formed or welded to the support body 410.

[0073] It should be noted that the surface of the support body 410 can be connected to the back of the circuit board 200 by adhesive bonding. For example, double-sided tape can be applied to the edge of the surface of the support body 410 and then bonded to the back of the circuit board 200 using the double-sided tape.

[0074] In some embodiments, the tilt angle α of the elastic arm 420 relative to the support body 410 can be in the range of 135°-175°, so that the elastic deformation of the elastic arm 420 relative to the support body 410 can be controlled within a reasonable range, thereby controlling the range of pressure on the chip 300.

[0075] It is understood that the elastic arm 420 can be cantilevered relative to the supporting body 410, and the elastic arm 420 can extend in a straight line or in an arc. Taking the elastic arm 420 extending in a straight line as an example, the tilt angle of the elastic arm 420 relative to the supporting body 410 can be, but is not limited to, 135°, 140°, 145°, 150°, 155°, 160°, 165°, 170°, 175°, etc.

[0076] When the support body 410 is attached to the back of the circuit board 200 and the elastic arm 420 is in its initial state, the angle between the elastic arm 420 and the back of the circuit board 200 can be 5°-45°. When the elastic arm 420 is connected to and locked with the heat dissipation assembly 100, the elastic arm 420 undergoes elastic deformation, and the angle between the elastic arm 420 and the back of the circuit board 200 decreases.

[0077] In some embodiments, there may be multiple elastic arms 420, which may be distributed circumferentially along the support body 410. The tilt of the multiple elastic arms 420 relative to the support body 410 may be adjusted, thereby maintaining the balance of pressure when the support body 410 and the heat dissipation assembly 100 clamp the circuit board 200 and the chip 300, so as to facilitate the monitoring and control of the pressure on the chip 300.

[0078] It is understood that the multiple elastic arms 420 can be centrally symmetrically distributed relative to the peripheral edge of the support body 410. The number of elastic arms 420 can be set, including but not limited to two, three, four or more. The specific number and spacing of elastic arms 420 can be set according to the shape and size of the support body 410. This application embodiment does not make specific limitations in this regard.

[0079] In some embodiments, the support body 410 may have an opening 411 opposite to the chip 300. The shape of the opening 411 may match the shape of the chip 300, and the size of the opening 411 may be greater than or equal to the size of the chip 300. This allows the area of ​​the circuit board 200 where the chip 300 is located to locally deform under the pressure of the support body 410, thereby lifting the chip 300 and placing it against the heat dissipation assembly 100, thus improving heat dissipation efficiency.

[0080] For example, the support body 410 can be square, the chip 300 can be square, the opening 411 can be square and opposite to the chip 300, the support body 410 forms a closed square ring structure, and there can be four elastic arms 420, which can be connected to the four corners of the support body 410 respectively.

[0081] Furthermore, multiple elastic arms 420 may have the same or similar structures. When the elastic arm 420 deforms and is connected and locked to the heat dissipation assembly 100, the elastic arm 420 can be pressed against the back of the circuit board 200. At this time, the elastic force generated by the elastic arm 420 can be calculated according to the elastic force formula F=KX, where F is the elastic force of the elastic arm 420, K is the elastic coefficient, and X is the length of the elastic arm 420.

[0082] It should be noted that when the support body 410 is attached to the back of the circuit board 200 and the multiple elastic arms 420 are respectively connected to the heat dissipation component 100, the multiple elastic arms 420 can produce elastic deformation in the same direction and with similar amplitude, so as to ensure the balance of the pressure of the support body 410 on the circuit board 200 when the elastic force of the elastic arm 420 is transmitted to the support body 410.

[0083] The specific structure and configuration of the pressure detection module 500 are described in detail below.

[0084] Please continue to refer to Figures 1 to 7 In one possible implementation, the pressure detection module 500 may include a piezoelectric unit 510 and a detection unit 520. The opposite sides of the piezoelectric unit 510 are respectively in contact with the heat dissipation component 100 and the chip 300, and the detection unit 520 may be electrically connected to the piezoelectric unit 510.

[0085] It is understandable that when the support 400 and the heat dissipation assembly 100 are connected and clamped, the piezoelectric unit 510 and the chip 300 will both bear the pressure between the support 400 and the heat dissipation assembly 100. The pressure borne by the chip 300 can be approximated as the pressure borne by the piezoelectric unit 510. The piezoelectric unit 510 will output different currents depending on the pressure it bears. For example, the greater the pressure on the piezoelectric unit 510, the greater the output current value. Thus, the pressure borne by the chip 300 can be converted into the current of the piezoelectric unit 510, and the detection unit 520 can accurately feed back the magnitude of the pressure borne by the chip 300.

[0086] It should be noted that the detection unit 520 can be connected to the piezoelectric unit 510 via wires. Changes in the current value of the piezoelectric unit 510 when subjected to pressure can be fed back to the detection unit 520, which can proportionally convert the received current feedback into a pressure value. For example, the detection unit 520 can be equipped with a display screen, allowing it to display the pressure applied to the chip 300, facilitating user inspection and adjustment of the chip 300's pressure during assembly. The detection unit 520 can be detachably connected to the circuit board 200, or it can be fixedly connected to the circuit board 200 or other locations on the heat dissipation device.

[0087] Furthermore, since the support member 400 will slightly lift the part of the circuit board 200 where the chip 300 is located when it applies pressure to the circuit board 200, the circuit board 200 will undergo a slight deformation, for example, the circuit board 200 can deform towards the front by 0.5mm-1mm. Therefore, a gap of 0.5mm-1mm can be reserved between the heat dissipation component 100 and the chip 300, so that the pressure detection module 500 can be set up to avoid damage to the solder joints of the chip 300 or the circuit board 200 when the chip 300 is under pressure.

[0088] In some embodiments, the piezoelectric unit 510 may include a thermally conductive shell and a piezoelectric layer, with the piezoelectric layer located inside the thermally conductive shell. The thermally conductive shell may be an elastic insulating element, thereby shortening the thermal contact path between the chip 300 and the heat dissipation component 100 when the piezoelectric unit 510 is pressed, thus improving heat dissipation performance.

[0089] Understandably, the thermally conductive shell is compressible, and the piezoelectric layer is a thermally conductive material with piezoelectric conversion function. The piezoelectric layer can be encapsulated inside the thermally conductive shell. When the piezoelectric unit 510 is subjected to pressure, the thickness of the thermally conductive shell changes under the action of external force. The greater the external pressure, the smaller the thickness of the thermally conductive shell. Correspondingly, the thermal resistance of the piezoelectric unit 510 deforms, increasing its thermal conductivity and improving the heat dissipation efficiency of the heat dissipation module for the chip 300. Simultaneously, the pressure from the thermally conductive shell is transmitted to the piezoelectric layer, and the current generated by the piezoelectric layer can be transmitted to the detection unit 520.

[0090] It should be noted that encapsulating the piezoelectric layer inside a thermally conductive shell with insulating properties can reduce the size of the piezoelectric unit 510, making it easier to install and set up, and can also avoid causing a short circuit.

[0091] In some embodiments, the thickness of the piezoelectric unit 510 can be 0.3mm-1mm. The piezoelectric unit 510 can be disposed on the surface of the chip 300, and the projection of the piezoelectric unit 510 in the direction perpendicular to the board surface of the circuit board 200 can cover the chip 300. The size of the piezoelectric unit 510 can be larger than the size of the chip 300, and the distance between the edge of the piezoelectric unit 510 and the edge of the chip 300 along the surface extension direction of the chip 300 can be 1mm-2mm.

[0092] Understandably, the piezoelectric unit 510 can make full contact with the upper surface of the chip 300 to ensure the balanced force on the chip 300. The edge area of ​​the piezoelectric unit 510 avoids the pressure area of ​​the chip 300, so that the connection area between the piezoelectric unit 510 and the heat dissipation component 100 avoids the chip 300, thus avoiding increasing the contact thermal resistance.

[0093] For example, the chip 300 can be square, and the piezoelectric unit 510 can also be square. The surface size of the piezoelectric unit 510 can be slightly larger than the size of the chip 300. The distance between the edge of the piezoelectric unit 510 and the edge of the chip 300 can be, but is not limited to, 1mm, 1.1mm, 1.5mm, 1.9mm, 2mm, etc. The piezoelectric unit 510 can be bonded to the heat dissipation component 100. For example, double-sided adhesive can be provided around the edges of the piezoelectric unit 510, and the double-sided adhesive can be applied to an area of ​​1mm-2mm around the edge of the piezoelectric unit 510, thereby fixing the piezoelectric unit 510.

[0094] For example, the thickness of the piezoelectric unit 510 may include, but is not limited to, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 0.9mm, 1mm, etc., to ensure that a piezoelectric layer can be set while shortening the heat conduction path of the piezoelectric unit 510 as much as possible, reducing the thermal resistance of the piezoelectric unit 510, improving the heat conduction efficiency of the chip 300 to the heat dissipation component 100, and improving the heat dissipation efficiency.

[0095] The specific structure of the heat dissipation component 100 and the specific connection method between the support 400 and the heat dissipation component 100 are described below.

[0096] It should be noted that the heat dissipation component 100 can adopt different methods such as natural heat dissipation, air cooling, water cooling, and semiconductor heat dissipation. The following explanation will take air cooling as an example.

[0097] Figure 8 This is a schematic diagram of the structure of the heat sink in the heat dissipation device provided in the embodiment of this application.

[0098] Please refer to Figures 1 to 8 In one possible implementation, the heat dissipation assembly 100 may include a heat sink 110 and a fan 120. The side of the heat sink 110 facing the circuit board 200 abuts against the pressure detection module 500, and the side of the heat sink 110 facing away from the circuit board 200 is provided with heat dissipation fins 111 or fins. The fan 120 is connected to the side of the heat sink 110 facing away from the circuit board 200 and blows cooling airflow onto the heat dissipation fins 111, thereby improving the heat dissipation efficiency of the heat sink 110. The fan 120 may be other heat-conducting units, such as water-cooled pipes, semiconductor heat-conducting components, etc.

[0099] It is understandable that the piezoelectric unit 510 can be attached to the surface of the heat sink 110 facing the circuit board 200. The side of the heat sink 110 facing the circuit board 200 can be provided with a boss 112 and a connecting hole. The surface of the boss 112 can be attached to the surface of the pressure detection module 500.

[0100] In some embodiments, the circuit board 200 may be provided with a through hole 201, and the second end of the elastic arm 420 may be connected to the connection hole through the through hole 201 by a fastener 600, thereby improving the reliability of the connection between the heat sink 110 and the support member 400, and applying continuous and stable pressure to the chip 300 after assembly.

[0101] It is understood that there are multiple elastic arms 420, and the number of through holes 201 is the same as that of the elastic arms 420, and they are set one-to-one. The fasteners 600 can be threaded fasteners such as bolts. For example, the fasteners 600 can pass through the mounting holes at the end of the elastic part, then through the through holes 201 on the circuit board 200, and be threaded into the threaded holes on the heat sink 110. As the fasteners 600 are tightened, they can compress the elastic arms 420 to produce elastic deformation.

[0102] It should be noted that the tighter the fastener 600 is screwed onto the heat sink 110, the greater the deformation of the elastic arm 420, the greater the pressure on the chip 300, the smaller the contact thermal resistance between the chip 300 and the heat sink 110, and the higher the heat dissipation efficiency.

[0103] The following provides an example illustrating the installation method of the heat dissipation device in the embodiments of this application.

[0104] Figure 9 This is a schematic diagram illustrating the steps of the heat dissipation device installation method provided in the embodiments of this application.

[0105] Please refer to Figure 9 and combined Figure 1 and Figure 8 The heat dissipation device installation method provided in this application includes:

[0106] S100. Connect the pressure detection module to the upper surface of the chip.

[0107] Understandably, the piezoelectric unit 510 is connected to the upper surface of the chip 300.

[0108] S200. Install the heat dissipation component onto the side of the pressure detection module away from the chip, so that the heat dissipation component fits into the pressure detection module.

[0109] It is understandable that the heat sink 110 is mounted above the circuit board 200 so that the heat sink 110 presses down on the piezoelectric unit 510.

[0110] S300. Attach the support to the side of the circuit board away from the chip, and use fasteners to connect the elastic arm of the support to the heat sink through the circuit board.

[0111] Understandably, the support 400 is glued to the back of the circuit board 200, and the elastic arm 420 of the support 400 is connected to the heat sink 110 by fasteners 600 passing through the circuit board 200. At this time, the support body 410 is opposite to the chip 300.

[0112] S400, tighten and adjust the fasteners to regulate the pressure on the chip.

[0113] Understandably, as the fastener 600 is tightened, the elastic arm 420 deforms, and the pressure of the support body 410 on the circuit board 200 causes the chip 300 to be clamped. The pressure received by the chip 300 can be transmitted to the pressure detection module 500, and the pressure on the chip 300 can be adjusted by adjusting the fastener 600.

[0114] Figure 10 This diagram illustrates the steps for adjusting chip pressure during the installation of the heat dissipation device provided in this embodiment. Figure 10 As shown, the heat dissipation device in this embodiment can adjust the pressure on the chip 300 through the following steps.

[0115] S401: Obtain the pressure value of the chip through the pressure detection module.

[0116] Since the pressure detection module is located between the chip and the heat dissipation component, when the heat dissipation component and the support clamp the chip and the circuit board, the pressure on the pressure detection module is the same as or similar to the pressure on the chip. At this time, the pressure detection module can convert the current value into a pressure value according to the change of the piezoelectric layer electrical signal, thereby obtaining the pressure value on the chip.

[0117] S402. Determine whether the pressure value is within the preset pressure threshold range.

[0118] The preset pressure threshold range is the pressure range that can ensure reliable heat dissipation of the chip while avoiding damage to the chip. When the pressure value of the chip is within the preset pressure threshold range, the chip can achieve high heat dissipation efficiency due to the low contact thermal resistance between the pressure detection module and the heat dissipation component. At the same time, the chip installation reliability is high.

[0119] S403. If the pressure value is not within the preset pressure threshold range, adjust the amplitude of the elastic deformation generated by the elastic arm to adjust the pressure of the heat dissipation component on the chip.

[0120] It is understandable that the greater the elastic deformation amplitude of the elastic arm, the greater the pressure of the heat dissipation component on the chip. Conversely, the smaller the elastic deformation amplitude of the elastic arm, the less pressure the heat dissipation component on the chip. Therefore, the elastic deformation amplitude of the elastic arm can be adjusted by judging whether the pressure value is lower or higher than the pressure threshold.

[0121] The above steps can be repeated until the pressure value on the chip is within the preset pressure threshold range, thereby completing the chip pressure adjustment operation.

[0122] The heat dissipation device provided in this application includes a heat dissipation component, a circuit board, a chip, a support member, and a pressure detection module. The chip is disposed on the circuit board, and the heat dissipation component is disposed on the side of the chip away from the circuit board and dissipates heat from the chip. The pressure detection module is located between the heat dissipation component and the chip, and is configured to detect the pressure exerted on the chip. The support member is disposed on the side of the circuit board away from the chip. The support member includes a support body and an elastic arm. The support body is opposite to the chip. The first end of the elastic arm is connected to the support body, and the second end of the elastic arm is connected to the heat dissipation component. The elastic arm can generate elastic deformation of different amplitudes relative to the support body to adjust the pressure exerted by the heat dissipation component on the chip, thereby reducing the contact resistance of the chip and improving the heat dissipation efficiency. At the same time, it can monitor the pressure exerted on the chip and reduce the risk of the chip being damaged due to excessive pressure.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipating device, characterized by, The heat dissipation assembly, the circuit board, the chip, the support and the pressure detection module are included, the chip is arranged on the circuit board, the heat dissipation assembly is arranged on the side of the chip away from the circuit board, and the chip is cooled; The pressure detection module is located between the heat dissipation assembly and the chip, and the pressure detection module is configured to detect the pressure received by the chip;The piezoelectric unit and the detection unit are included in the pressure detection module, the opposite sides of the piezoelectric unit are respectively in abutment with the heat dissipation assembly and the chip, and the detection unit is electrically connected with the piezoelectric unit;The piezoelectric unit includes a heat-conducting shell and a piezoelectric layer, and the piezoelectric layer is located inside the heat-conducting shell; The heat-conducting shell is an elastic insulating member; The support is arranged on the side of the circuit board away from the chip;The support includes a support body and an elastic arm, the support body is provided with an opening, the opening is opposite to the chip, the shape of the opening matches the shape of the chip, and the size of the opening is greater than or equal to the size of the chip;The first end of the elastic arm is connected with the support body, the second end of the elastic arm is connected with the heat dissipation assembly, and the elastic arm can produce elastic deformation of different amplitudes relative to the support body, so that the support body produces pressure on the circuit board, and then the chip is clamped between the heat dissipation assembly and the circuit board, and the pressure of the heat dissipation assembly on the chip can be adjusted.

2. The heat dissipating device according to claim 1, wherein The support body is attached to the circuit board, and the elastic arm is inclined relative to the support body away from the circuit board.

3. The heat dissipating device according to claim 2, wherein The inclination angle of the elastic arm relative to the support body is 135°-175°.

4. The heat dissipating device of claim 2, wherein The elastic arm is a plurality of elastic arms, and the plurality of elastic arms are distributed along the circumference of the support body;The inclination angle of the plurality of elastic arms relative to the support body can be adjusted.

5. The heat dissipating device of claim 1, wherein The thickness of the piezoelectric unit is 0.3mm-1mm;And / or, the piezoelectric unit cover is arranged on the surface of the chip, and the size of the piezoelectric unit is greater than the size of the chip by 1mm-2mm.

6. The heat dissipating device according to any one of claims 1 to 4, wherein The heat dissipation assembly includes a heat sink, and the side of the heat sink facing the circuit board is in abutment with the pressure detection module; The side of the heat sink facing the circuit board is provided with a boss and a connecting hole, the surface of the boss is attached to the surface of the pressure detection module;The circuit board is provided with a through hole, and the second end of the elastic arm is connected with the connecting hole through a fastener passing through the through hole.

7. A heat dissipating device mounting method characterized by comprising: The method is used for installing the heat dissipation device of any one of claims 1-6, and the method comprises: Obtaining the pressure value received by the chip through the pressure detection module; Determine whether the pressure value is within the preset pressure threshold range; If the pressure value is not within the preset pressure threshold range, adjust the amplitude of the elastic deformation of the elastic arm to adjust the pressure of the heat dissipation assembly on the chip.

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