Management device and inspection result management method

Abstract

The present disclosure provides a management device and an inspection result management method, wherein the management device comprises: an inspection result acquisition unit, which acquires data including inspection results from an inspection device that sequentially inspects a plurality of substrates; and a display processing unit, which displays the inspection result of a first substrate detected as unqualified among the plurality of substrates and the inspection result of a second substrate inspected before the first substrate on the same screen.

Description

[0001] This application is a divisional application of the invention patent application with application date of November 14, 2019, application number 201911117907.5, and invention name “Substrate Processing System”. Technical Field

[0002] The present disclosure relates to a substrate processing system including a processing device for sequentially processing a plurality of substrates. Background Art

[0003] A component mounting system for producing a mounting substrate on which components are mounted is constructed by connecting processing devices for processing the substrate, such as a solder printing device for printing solder on the substrate, a component mounting device for mounting components on the substrate, and a mounting inspection device for inspecting the state of the components mounted on the substrate. Furthermore, when a component is detected to be mounted unqualified in the mounting inspection device, a cause analysis such as an investigation of the device where the failure occurred is performed. In the component mounting production line described in Patent Document 1, when a mounting failure is detected in the mounting inspection device, the mounting operation is performed while the subsequent substrate is sequentially conveyed by a plurality of component mounting devices, and after the mounting operation, the same portion as the portion where the mounting failure was detected is photographed by a camera provided in each component mounting device, and the photographs are arranged and displayed on the display unit of the mounting inspection device, so that the cause analysis can be performed.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-225905 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the substrate inspection method described in Patent Document 1, the cause analysis is started after a plurality of component mounting devices have performed operations on the substrate to be photographed. Therefore, it takes time to find out the cause, and there is a possibility that mounting failures may occur in mounting substrates produced between the substrate in which mounting failures are found and the substrate to be photographed.

[0009] Therefore, an object of the present disclosure is to provide a substrate processing system capable of analyzing the cause of a process failure in a short period of time.

[0010] Means for solving problems

[0011] The substrate processing system disclosed in the present invention includes a processing device, a storage device, and a management device.

[0012] The processing device processes a plurality of substrates sequentially.

[0013] The storage device stores data on processing of a plurality of substrates in the processing device.

[0014] The management device reads out the data of the designated first substrate and the data of the second substrate processed before the first substrate from the storage device, and displays them on the same screen of the display unit.

[0015] Another substrate processing system disclosed herein includes a processing device, a storage device, and a management device.

[0016] The processing device processes a plurality of substrates sequentially.

[0017] The storage device stores data on processing of a plurality of substrates in the processing device.

[0018] The management device reads out the data of the designated first substrate and the data of the third substrate processed after the first substrate from the storage device, and displays them on the same screen of the display unit.

[0019] Effects of the Invention

[0020] According to the present disclosure, it is possible to perform cause analysis of process failure in a short time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram for explaining a component mounting system according to an embodiment.

[0022] Figure 2 This is a block diagram showing the structure of a management computer (management device) according to the embodiment.

[0023] Figure 3 This is a diagram showing an example of an inspection result display screen displayed on the display unit of the management computer (management device) according to the embodiment.

[0024] Figure 4 This is a diagram showing an example of a printing process inspection result display screen displayed on the display unit of the management computer (management device) according to the embodiment.

[0025] Figure 5 This is a diagram showing an example of a display screen of the inspection result of the mounting process displayed on the display unit of the management computer (management device) according to the embodiment.

[0026] Figure 6 This is a diagram showing an example of an inspection result selection display screen displayed on the display unit of the management computer (management device) according to the embodiment.

[0027] Figure 7 This is a flowchart of a method for displaying inspection results in a management computer (management device) according to an embodiment.

[0028] Explanation of symbols

[0029] 1: Component installation system,

[0030] 2: Communication network,

[0031] 3: Management computer (management device),

[0032] 10: Processing Department,

[0033] 11: Production Monitoring Department,

[0034] 12: Inspection result acquisition department,

[0035] 13: Operation result acquisition department,

[0036] 14: Display processing unit,

[0037] 15: Production plan storage department,

[0038] 15a: Production planning information,

[0039] 15b: Production data,

[0040] 16: Production history storage department,

[0041] 16a: Component information,

[0042] 16b: Check result information,

[0043] 16c: Job result information,

[0044] 16d: Check the non-conformity information,

[0045] 17: Input section,

[0046] 18: Display unit,

[0047] 18a: Display screen (screen),

[0048] 20: Check the result table,

[0049] 21: Check the result table,

[0050] 22: Button,

[0051] 23a: Check the image,

[0052] 23b: Check the image,

[0053] 24: pad,

[0054] 26: Check the result table,

[0055] 27: Button,

[0056] 28a: Check the image,

[0057] 28b: Check the image,

[0058] 28c: Column,

[0059] 29: pad,

[0060] 30: Parts,

[0061] 31: Check result selection table,

[0062] 31a: Drop-down button,

[0063] 32: Image frame,

[0064] 33: Image frame,

[0065] 34: Image frame,

[0066] 35: Image frame,

[0067] B: substrate,

[0068] D: components,

[0069] M1: Solder printing device (processing device),

[0070] M2: Printing inspection device (processing device),

[0071] M3~M5: Component installation device (processing device),

[0072] M6: Post-loading inspection device (processing device),

[0073] M7: Reflux device (processing device),

[0074] M8: Post-reflow inspection device (disposal device). DETAILED DESCRIPTION

[0075] Hereinafter, an embodiment of the present invention will be described in detail using the accompanying drawings. The structures, shapes, etc. described below are examples for explanation and can be appropriately changed according to the specifications of the component installation system. Hereinafter, the same symbols are marked for corresponding elements in all the accompanying drawings, and repeated descriptions are omitted.

[0076] First, refer to Figure 1 , the structure of the component mounting system 1 is described. The component mounting system 1 is composed of production equipment such as a solder printing device M1, a printing inspection device M2, component mounting devices M3 to M5, a post-loading inspection device M6, a reflow device M7, and a post-reflow inspection device M8 connected in series from the upstream side (left side of the paper) toward the downstream side (right side of the paper) in the substrate conveying direction. Each production equipment is connected to a management computer 3 via a communication network 2.

[0077] The component mounting system 1 is a substrate processing system that processes the substrates B carried into the solder printing device M1 by each production device while being sequentially transported, thereby producing a mounted substrate having components D mounted on the substrate B. Each production device is a processing device that processes a plurality of substrates B sequentially.

[0078] exist Figure 1 In the process, the solder printing device M1 performs the following printing operation, and prints (transfers) the solder supplied to the mask by a reciprocating scraper on the pad formed on the substrate B brought in from the upstream side. The operation results such as the printing time in the printing operation and the moving direction of the scraper (forward, backward) are sent to the management computer 3. The printing inspection device M2 is equipped with a solder inspection camera (photographing unit) and performs a printing inspection operation of inspecting the state of the solder printed on the substrate B. The printing inspection device M2 inspects the quality of the state of the solder printed on the substrate B according to the inspection position and inspection reference set according to the production model of the mounting substrate. The printing inspection result and the photographed printing inspection image are sent to the management computer 3.

[0079] The component mounting devices M3 to M5 include a plurality of feeders for supplying components D to be mounted on the substrate B, and a mounting head equipped with a plurality of suction nozzles for holding the components D. Furthermore, the component mounting devices M3 to M5 perform a component mounting operation, move the mounting head, and use the suction nozzle to take out the components D supplied by the feeder, and transfer them to the mounting position of the substrate B. In addition, the component mounting devices M3 to M5 are equipped with a component recognition camera (photographing unit) for photographing the components D held by the suction nozzle from below. The component mounting devices M3 to M5 inspect the quality of the holding state of the components D held by the suction nozzle for each component D according to a pre-set inspection standard. In addition, the component mounting devices M3 to M5 correct the position of the mounting head and the rotation angle of the suction nozzle based on the correction value calculated according to the shooting result, and mount the components D on the substrate B.

[0080] The mounting time of the component D in the component mounting operation, the mounting head number, the nozzle type, the nozzle address, the feeder address, the correction value and other operation results, and the component recognition image captured by the component recognition camera are sent to the management computer 3. In addition, the component mounting devices M3, M5, M5 of the component mounting system 1 are not limited to 3, and can be 1 to 2, or 4 or more.

[0081] exist Figure 1In the embodiment, the post-loading inspection device M6 is equipped with a post-loading inspection camera (photographing unit) and performs a post-loading inspection operation to inspect the state of the component D mounted on the substrate B. The post-loading inspection device M6 inspects the quality of the state of the component D mounted on the substrate B according to the inspection position and inspection reference set according to the production model of the mounting substrate, and calculates the offset of the mounted component D from the mounting position. The post-loading inspection result including the offset of the component D and the photographed post-loading inspection image are sent to the management computer 3. The reflow device M7 performs a reflow operation, heats the substrate B carried into the device through the substrate heating unit, melts the solder on the substrate B and solidifies it, and performs the bonding of the pad of the substrate B with the electrode of the component D.

[0082] The post-reflow inspection device M8 is equipped with a post-reflow inspection camera (photographing unit) and performs a post-reflow inspection operation for inspecting the state of the component D mounted on the substrate B after reflow. The post-reflow inspection device M8 inspects the quality of the state of the component D mounted on the substrate B after reflow according to the inspection position and inspection reference set according to the production model of the mounting substrate. The post-reflow inspection result and the photographed post-reflow inspection image are sent to the management computer 3.

[0083] As described above, the printing inspection device M2, the post-loading inspection device M6, and the post-reflow inspection device M8 are processing devices that include an imaging unit that images the substrate B. In addition, the printing inspection device M2 is a printing inspection device that inspects the substrate B printed with solder. In addition, the post-loading inspection device M6 and the post-reflow inspection device M8 are mounting inspection devices that inspect the substrate B with the component D mounted thereon. In addition, the data sent from the processing device to the management computer 3 includes an image captured by the imaging unit of the processing device.

[0084] Next, refer to Figure 2 , the structure related to the function of the management computer 3 that displays the inspection results of the substrate B based on the processing device of the component mounting system 1 is explained. In addition to the processing unit 10, the production plan storage unit 15 as a storage device, and the production history storage unit 16, the management computer 3 also has an input unit 17 and a display unit 18. The processing unit 10 is a data processing device such as a CPU, and has a production monitoring unit 11, an inspection result acquisition unit 12, an operation result acquisition unit 13, and a display processing unit 14 as an internal processing unit. In addition, the management computer 3 is not necessarily composed of a single computer, but can also be composed of multiple devices. For example, the storage device can also be a file server connected to the communication network 2.

[0085] The input unit 17 is an input device such as a keyboard, a touch panel, or a mouse, and is used when inputting operation instructions or data. The display unit 18 is a display device such as a liquid crystal panel, and in addition to displaying various data stored in the production plan storage unit 15 and the production history storage unit 16, it also displays various information such as an operation screen for operating the input unit 17 and an inspection result display screen.

[0086] exist Figure 2 In the production plan storage unit 15, production plan information 15a and production data 15b are stored. In the production plan information 15a, a production plan including the number of mounted substrates to be produced, a scheduled start time and a scheduled end time of production, etc. is stored for each production model name that determines the model of the mounted substrate produced by the component mounting system 1. In the production data 15b, a component name, a mounting position (XY coordinates), a mounting angle, etc. of the component D mounted on the substrate B are stored for each production model name.

[0087] The production history storage unit 16 stores component information 16a, inspection result information 16b, operation result information 16c, inspection failure information 16d, and the like. The component information 16a stores component numbers that identify the components D that are supplied by the feeders of the component mounting devices M3 to M5 and mounted on the substrate B. The component number is component identification information that combines the component name, lot number, position stored in the tray, order stored in the carrier tape, and the like.

[0088] exist Figure 2 In the process, the production monitoring unit 11 monitors the processing status and processing results of the mounting substrate (processed substrate B) produced by the component mounting system 1, and sequentially obtains data such as inspection results, inspection images, and operation results from the processing devices provided in the component mounting system 1. The production monitoring unit 11 stores the inspection results and inspection images obtained from the printing inspection device M2, the post-mounting inspection device M6, and the post-reflow inspection device M8 in the production history storage unit 16 as inspection result information 16b.

[0089] In addition, the production monitoring unit 11 stores the operation results obtained from the solder printing device M1, the component mounting devices M3 to M5, and the reflow device M7 as operation result information 16c in the production history storage unit 16. That is, the production history storage unit 16 is a storage device that stores the data processed in the processing device. In addition, the data processed in the processing device can also be stored in the storage device equipped in the processing device.

[0090] The production monitoring unit 11 stores the substrate identification information that specifies the substrate B in association with the inspection result information 16b or the operation result information 16c in the production history storage unit 16 for each processed substrate B. The substrate identification information is the order in which the substrate B is carried into the solder printing device M1, the substrate number displayed by a barcode or a two-dimensional code on the substrate B, and the like. The substrate number is obtained by reading the barcode on the substrate B using a substrate number reading device (not shown) before carrying the substrate B into the solder printing device M1.

[0091] When the production monitoring unit 11 determines that a substrate B has failed inspection, the processing unit 10 causes the display unit 18 to display an inspection result display screen described later. The production monitoring unit 11 stores at least a predetermined number of pieces (e.g., 3 pieces) of data in the production history storage unit 16, including information on substrates B that are not failed inspection. Specifically, when the storage capacity of the production history storage unit 16 is sufficient, the production monitoring unit 11 causes the production history storage unit 16 to store data on all substrates B. On the other hand, when the storage capacity of the production history storage unit 16 is insufficient, if the data stored in the production history storage unit 16 exceeds the predetermined number of pieces, the production monitoring unit 11 deletes the data of the old substrate B from the inspection result information 16b and the operation result information 16c in sequence.

[0092] exist Figure 2 In the process, when the production monitoring unit 11 detects that an inspection failure has occurred, the inspection result acquisition unit 12 acquires the data that the display processing unit 14 displays on the display unit 18 from the inspection result information 16b. Alternatively, when the inspection result information 16b does not contain the required data, the required inspection result is acquired from the storage device of the processing device. When the production monitoring unit 11 detects that an inspection failure has occurred, the operation result acquisition unit 13 acquires the data that the display processing unit 14 displays on the display unit 18 from the operation result information 16c. Alternatively, when the operation result information 16c does not contain the required data, the required operation result is acquired from the storage device of the processing device.

[0093] When the production monitoring unit 11 detects that an inspection failure has occurred, the display processing unit 14 causes the display unit 18 to display an inspection result display screen described later, based on the inspection result obtained by the inspection result obtaining unit 12 and the operation result obtained by the operation result obtaining unit 13. In addition, the display processing unit 14 displays the data of the substrate B specified by the input unit 17 (input device) or the data of the substrate B on which the component D with the specified component identification information is mounted, as an inspection result selection display screen described later, on the display unit 18. That is, the management computer 3 (management device) specifies the substrate B for which data is to be displayed based on the information from the processing device or specifies the substrate B for which data is to be displayed from the input device, reads the data of the specified substrate B from the storage device, and displays it on the display unit 18.

[0094] Here, refer to Figure 3 to Figure 5 , an example of the inspection result display screen displayed on the display unit 18 by the display processing unit 14 is described. Figure 3 The display screen 18a of the display unit 18 shown in the figure displays an inspection result table 20 including data of the substrate B detected as unqualified. In the inspection result table 20, there are columns for the inspection result number, date, production model name, substrate number, component name, component number, installation coordinates, installation angle, printing process, adsorption process, loading process, and reflow process. The inspection result number is a number assigned in the order in which the inspection failure was detected. The date is the date on which the substrate B detected as unqualified was processed. The production model name is the model name of the substrate B detected as unqualified.

[0095] The substrate number is information identifying the substrate B detected as unqualified. The component name and component number are the component name and component identification information of the component D to be installed or installed at the location detected as unqualified. The installation coordinates and installation angle are the installation coordinates (XY coordinates) and installation angle (rotation angle) of the component D to be installed or installed at the location detected as unqualified. In the column of the printing process, columns for printing time, printing direction, and printing inspection image are provided. The printing time and printing direction are the time when solder is printed on the substrate B that failed the inspection in the solder printing device M1 and the moving direction (forward, backward) of the scraper during printing.

[0096] exist Figure 3 In the column of the adsorption process, columns for mounting time, mounting head number, adsorption nozzle address, adsorption nozzle type, feeder address, component recognition image, and correction value are provided. The mounting time is the moment when component D is mounted on substrate B that has been found to have failed inspection in component mounting devices M3 to M5. The mounting head number is information that identifies the mounting head that has mounted component D at the position where the failed inspection was found, and is a combination of information that identifies component mounting devices M3 to M5 and information that identifies the position within the device. For example, the mounting head number ("H1F") with an inspection result number of "1" combines the information "1" that identifies the component mounting device M3 and the information "F" that identifies the front side. Here, "front side" refers to Figure 1 The near front side of the Figure 1 The inside of the.

[0097] The nozzle address and nozzle type are information that specifies the position where the nozzle that mounts the component D at the location where the inspection failure is found is mounted in the mounting head, and the type of the nozzle that is mounted. The feeder address is information that specifies the position where the feeder that supplies the component D mounted at the location where the inspection failure is found is mounted. The correction value is a correction value (XY coordinate, rotation angle) used when mounting the component D at the location where the inspection failure is found.

[0098] exist Figure 3 In the column of the loading process, columns for post-loading inspection images and offsets are provided. The offsets are the positional offsets in the X, Y, and θ directions of the component D loaded at the location where the inspection failure was found by the post-loading inspection device M6. A column for post-reflow inspection images is provided in the column of the reflow process.

[0099] In the column of printed inspection images, the presence or absence of inspection images taken by the printed inspection device M2 at the location where the inspection failed is found, and the inspection results are displayed with symbols. In the column of post-mounting inspection images, the presence or absence of inspection images taken by the post-mounting inspection device M6 at the location where the inspection failed is found, and the inspection results are displayed with symbols. In the column of post-reflow inspection images, the presence or absence of inspection images taken by the post-reflow inspection device M8 at the location where the inspection failed is found, and the inspection results are displayed with symbols. In the column of component recognition images, the presence or absence of recognition images taken by the component recognition cameras of the component mounting devices M3 to M5 at the location where the inspection failed is found, and the quality of the holding state of the suction nozzle are displayed with symbols.

[0100] exist Figure 3 In the printing inspection image, post-loading inspection image, post-reflow inspection image, and component identification image columns, the symbols displayed are the same, and an example is described below. "○" indicates that the inspection image or identification image has been shot, and the inspection result or holding status has been determined to be good. "●" indicates that the inspection image or identification image has been shot, and the inspection result or holding status has been determined to be unqualified. The "●" displayed when unqualified is detected is displayed in a flashing manner until the symbol is operated as described later and the detailed inspection result display screen of the process is transferred. In this way, it can be clearly identified that the detailed confirmation of the unqualified part has not been completed.

[0101] "△" indicates that the substrate B whose inspection result or holding status is judged as unqualified is being processed in the previous process, waiting for the inspection image or recognition image to be taken. For example, "△" is displayed in the column of the post-reflow inspection image with the inspection result number "2". This is because the post-reflow inspection image of the substrate B that was detected as unqualified in the post-loading inspection device M6 is in the reflow operation in the reflow device M7, and the post-reflow inspection image of the substrate B is not taken. When the post-reflow inspection image of the substrate B is taken in the post-reflow inspection device M8, the display of the column of the post-reflow inspection image automatically changes from "△" to "○" or "●".

[0102] exist Figure 3 In the display screen of the inspection result of each process, in addition to the substrate B detected as unqualified, the image data of the substrate processed before the substrate B (hereinafter referred to as "the substrate immediately before") and the substrate processed after the substrate B (hereinafter referred to as "the substrate immediately after") are displayed. In addition, the substrate B detected as unqualified is regarded as the designated substrate (first substrate), the substrate processed before the substrate B is regarded as the second substrate, and the substrate processed after the substrate B is regarded as the third substrate.

[0103] Next, refer to Figure 4 , an example of a display screen of the inspection result of the printing process displayed on the display unit 18 by the display processing unit 14 is described. Figure 4 Indicates that the operation has just been completed. Figure 3 The display screen 18a of the display unit 18 is displayed after the symbol ("●") displayed in the column of the printed inspection image with the inspection result number "1" in the inspection result table 20. The display screen 18a displays the inspection result table 21 of the printing process and the "return" button 22. In the inspection result table 21 of the printing process, in addition to the substrates B detected as unqualified in printing, the data of the substrates B that were printed before and after the substrate B, that is, the data of three substrates B, are also displayed, so that they can be easily compared. If the "return" button 22 is operated using the input unit 17, the display returns to the original state. Figure 3 The inspection result display screen is shown.

[0104] exist Figure 4In the inspection result table 21 of the printing process, there are columns for inspection result number, date, production model name, substrate number, component name, component number, installation coordinates, installation angle, printing time, printing direction, and printing inspection image. Figure 3 The inspection result table 20 shown is the same. The inspection result number "immediately before" is the substrate that was processed (printed) before the substrate B that failed the inspection was detected, and the inspection result number "immediately after" is the substrate that was processed after the substrate B that failed the inspection was detected. Specifically, the inspection result number "1" is the substrate B with the substrate number "BB022" detected as failed, the inspection result number "immediately before" is the substrate with the substrate number "BB021", and the inspection result number "immediately after" is the substrate with the substrate number "BB023".

[0105] In the column of the printed inspection image, inspection images 23a to 23c of the parts detected as unqualified inspections captured by the print inspection device M2 are displayed. Inspection images 23a to 23c include the pads 24 of the parts detected as unqualified inspections, the pads 24 located at the same parts of the immediately preceding substrate and the immediately following substrate, and the printed solder 25. The positions and printing states of the printed solder 25 of the immediately preceding substrate and the immediately following substrate relative to the pads 24 meet the inspection criteria, and the inspection result is judged to be good. On the other hand, in the substrate B detected as unqualified inspections, the solder 25 on the left side in the inspection image 23b is less than the inspection criteria, and the inspection result is judged to be unqualified (insufficient solder).

[0106] exist Figure 4 In this example, the printing direction of the substrate immediately preceding and the substrate immediately following the substrate with good inspection results is both "rear", and the printing direction of the substrate B with unqualified inspection results is "front". Therefore, it can be inferred that the cause of the unqualified processing is caused by the direction of the scraper during printing. In this way, the management computer 3 (management device) reads the data of the substrate B detected as unqualified and the previous substrate processed (the substrate immediately preceding) and the substrate processed (the substrate immediately following) from the production history storage unit 16 (storage device), and displays them on the same screen of the display unit 18 (display screen 18a). As a result, the cause of the unqualified processing can be analyzed in a short time.

[0107] Next, refer to Figure 5 , an example of the inspection result display screen of the mounting process displayed on the display unit 18 by the display processing unit 14 is described. Figure 5 Indicates that the operation has just been completed. Figure 3The display screen 18a of the display unit 18 is displayed after the symbol ("●") displayed in the column of the post-loading inspection image with the inspection result number "2" in the inspection result table 20. The display screen 18a displays the inspection result table 26 of the loading process and the "return" button 27. In the inspection result table 26 of the loading process, in addition to the substrates B that failed the loading, the data of the substrates that underwent component loading operations before and after the substrate B, that is, the data of three substrates, are also displayed, so that they can be easily compared. If the "return" button 27 is operated using the input unit 17, the display screen 18a returns to the original state. Figure 3 The inspection result display screen is shown.

[0108] exist Figure 5 In the inspection result table 26 of the loading process, columns for loading time, loading head number, suction nozzle address, suction nozzle type, feeder address, correction value, offset, and post-loading inspection image are provided instead of columns for printing time, printing direction, and printing inspection image. Figure 4 The inspection result table 21 of the printing process shown in FIG. 28 is the same. In the inspection image 28a of the post-mounting inspection image with the inspection result number "immediately in front", the component mounted at the same position as the component 30 that failed to be mounted and the pad 29 connected to the component are included. In the inspection image 28b of the post-mounting inspection image with the inspection result number "2", the component 30 that failed to be mounted and the pad 29 connected to the component 30 are included.

[0109] In the column 28c of the post-loading inspection image with the inspection result number "immediately following", the inspection image is not displayed because the post-loading inspection device M6 has not yet captured the post-loading inspection image of the substrate immediately following. In addition, if the post-loading inspection image of the substrate immediately following is captured by the post-loading inspection device M6, the inspection image is automatically displayed in the column 28c. In this way, in the inspection result table 26 of the loading process, the data of the substrate B detected as unqualified for loading and the substrate immediately preceding and immediately following are displayed on the same screen (display screen 18a), so the cause analysis of unqualified loading (unqualified processing) can be performed in a short time.

[0110] exist Figure 2 In the example, when the production monitoring unit 11 detects that a failure in inspection has occurred, the operation result and the inspection result of the substrate B that failed the inspection obtained from the processing device are associated with the component identification information of the component D to be installed or the installed component D at the location where the failure in inspection has been detected, and store it in the production history storage unit 16 as the failure in inspection information 16d. In addition, the production monitoring unit 11 may also store the data of the immediately preceding substrate and the immediately following substrate as the failure in inspection information 16d. In this way, the production history storage unit 16 (storage device) stores the component identification information and the data in association.

[0111] The display processing unit 14 displays data related to the designated inspection failure location on the inspection result selection display screen based on the inspection failure information 16d stored in the production history storage unit 16. Figure 6 , an example of the inspection result selection display screen displayed on the display unit 18 by the display processing unit 14 is described. The display screen 18a displays an inspection result selection table 31, a "printing inspection result" image frame 32, a "adsorption inspection result" image frame 33, a "post-loading inspection result" image frame 34, and a "post-reflow inspection result" image frame 35.

[0112] exist Figure 6 In the inspection result selection table 31, a column is provided with Figure 3 The inspection result table 20 of the inspection result display screen shown is almost the same, but the following points are different. That is, a drop-down button 31a is provided in the columns of the inspection result number, date, production model name, substrate number, component name, and component number. By operating the drop-down button 31a, a list is displayed. By selecting information in the displayed list, data displayed in the inspection result selection table 31 can be selected. In this example, Figure 3 The same as the inspection result table 20, the data with the part number (part identification information) of "D351-C14086" is selected.

[0113] In addition, instead of the columns of the printed inspection image, component recognition image, post-mounting inspection image, and post-reflow inspection image in the inspection result table 20, columns of printed inspection results, component recognition results, post-mounting inspection results, and post-reflow inspection results are provided, and the inspection image or recognition image is displayed in the image frames 32 to 35. In addition, in the columns of the printed inspection results, component recognition results, post-mounting inspection results, and post-reflow inspection results, "failed" indicating that the inspection result or the holding state is unqualified or "good" indicating that it is good is displayed.

[0114] The inspection result selection display screen is used to track and verify the data during production after the production of the mounting substrate in the component mounting system 1 is completed. For example, if the completed mounting substrate fails the electrical characteristics inspection, the data during production is checked on the inspection result selection display screen. Figure 6 When the mounted board with board number "BB022" shown fails in the electrical characteristics inspection, it can be inferred that the cause is insufficient solder in the printing process which cannot be found in the post-finish appearance inspection by referring to the inspection result selection display screen.

[0115] In this way, the management computer 3 (management device) reads the data of the substrate B on which the component D having the designated component number (component identification information) is mounted from the production history storage unit 16 (storage device) and displays it on the display unit 18. In addition, the display unit 18 displays the data of the plurality of processing devices (here, the solder printing device M1, the printing inspection device M2, the component mounting devices M3 to M5, the post-mounting inspection device M6, and the post-reflow inspection device M8) of the designated substrate B on the same screen (display screen 18a).

[0116] Next, follow Figure 7 The following is a flow chart of the inspection result display method of the management computer 3 (management device). In the production of the mounting substrate in the component mounting system 1, when the production monitoring unit 11 detects that the inspection is unqualified (in ST1, it is yes), the display processing unit 14 causes the display unit 18 to display the data of the substrate B detected as unqualified and the immediately preceding substrate on the same display screen 18a (ST2). Next, if the inspection process (printing process, adsorption process, loading process, reflow process) of the immediately following substrate is completed and the inspection result, inspection image, operation result and other data are obtained (in ST3, it is yes), the display processing unit 14 displays the data of the immediately following substrate on the display screen 18a (ST4).

[0117] In this way, if the data of the following substrate (substrate processed next) is stored in the production history storage unit 16 (storage device), the management computer 3 (management device) reads the data from the storage device and displays it on the same screen (display screen 18a) of the display unit 18 together with the substrate B (specified substrate) detected as unqualified. Thus, the cause of unqualified processing can be analyzed in a short time.

[0118] As described above, the component mounting system 1 is a substrate processing system including a processing device that processes a plurality of substrates B in sequence, a storage device (production history storage unit 16) that stores data processed in the processing device, and a management device (management computer 3) that reads data of a designated substrate B and a substrate processed before the substrate (the substrate immediately preceding the substrate) from the storage device and displays the data on the same screen (display screen 18a) of the display unit 18. Thus, the cause analysis of processing failures such as printing failure and loading failure can be performed in a short time.

[0119] In the above description, the substrate processing system is a component mounting system 1 that produces a mounting substrate in which a component D is mounted on a printed substrate (substrate B), but the substrate processing system is not limited to this. For example, it may be a liquid crystal panel production system that mounts (processes) a component D such as a driver on a glass substrate (substrate B) to produce a liquid crystal panel or an organic EL panel. In this case, the processing device is a bonding device that presses the mounted component D onto the glass substrate, an inspection device that inspects traces and positional deviations after pressing, and the like.

[0120] Industrial Applicability

[0121] The substrate processing system disclosed herein has the effect of being able to analyze the cause of a processing failure in a short period of time, and is useful in the field of mounting components on a substrate.

Claims

1. A management device comprising: An inspection result acquisition unit that acquires data including inspection results from an inspection device that sequentially inspects a plurality of substrates; a work result acquisition unit that acquires data including work results from a processing device that sequentially processes the plurality of substrates; and The display processing unit displays the inspection result and operation result corresponding to the unqualified processing of the first substrate detected as unqualified among the multiple substrates and the inspection result and operation result corresponding to the unqualified processing of the second substrate inspected before the first substrate on the same screen according to each item and in a time series. The unqualified processing is a processing detected as unqualified among the processing performed by multiple processing devices.

2. The management device according to claim 1, wherein: The display processing unit displays, on the same screen, an inspection result of a third substrate inspected after the first substrate.

3. The management device according to claim 1, wherein: The management device includes a storage unit that stores the data acquired by the inspection result acquisition unit and the data acquired by the operation result acquisition unit.

4. The management device according to claim 3, wherein: The display processing unit displays the inspection result and the work result of the first substrate and the inspection result and the work result of the second substrate read out from the storage unit.

5. The management device according to claim 1, wherein: The data acquired by the inspection result acquisition unit includes an inspection image. The display processing unit displays the inspection image of the first substrate and the inspection image of the second substrate on the same screen.

6. A management device comprising: An inspection result acquisition unit that acquires data including inspection results from an inspection device that sequentially inspects a plurality of substrates; a work result acquisition unit that acquires data including work results from a processing device that sequentially processes the plurality of substrates; and The display processing unit displays the inspection result and operation result corresponding to the unqualified processing of the first substrate detected as unqualified among the multiple substrates and the inspection result and operation result corresponding to the unqualified processing of the third substrate inspected after the first substrate on the same screen according to each item and in a time series. The unqualified processing is the processing detected as unqualified among the processing performed by the multiple processing devices.

7. The management device according to claim 6, wherein: The management device includes a storage unit that stores the data acquired by the inspection result acquisition unit and the data acquired by the operation result acquisition unit.

8. The management device according to claim 7, wherein: The display processing unit displays the inspection result and the work result of the first substrate and the inspection result and the work result of the third substrate read out from the storage unit.

9. The management device according to claim 6, wherein: The data acquired by the inspection result acquisition unit includes an inspection image. The display processing unit displays the inspection image of the first substrate and the inspection image of the third substrate on the same screen.

10. A method for managing inspection results, comprising: an inspection result acquisition step of acquiring data including inspection results from an inspection device that sequentially inspects a plurality of substrates; an operation result obtaining step of obtaining data including operation results from a processing device that sequentially processes the plurality of substrates; as well as The processing steps are displayed so that the inspection result and the operation result corresponding to the unqualified processing of the first substrate detected as unqualified among the multiple substrates and the inspection result and the operation result corresponding to the unqualified processing of the second substrate inspected before the first substrate are displayed on the same screen according to each item and in a time series. The unqualified processing is the processing detected as unqualified among the processing performed by the multiple processing devices.

11. A method for managing inspection results, comprising: an inspection result acquisition step of acquiring data including inspection results from an inspection device that sequentially inspects a plurality of substrates; an operation result obtaining step of obtaining data including operation results from a processing device that sequentially processes the plurality of substrates; as well as The processing steps are displayed so that the inspection result and the operation result corresponding to the unqualified processing of the first substrate detected as unqualified among the multiple substrates and the inspection result and the operation result corresponding to the unqualified processing of the third substrate inspected after the first substrate are displayed on the same screen according to each item and in a time series. The unqualified processing is the processing detected as unqualified among the processing performed by the multiple processing devices.

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