Display substrate and display device

Abstract

A display substrate and a display device are disclosed. The display substrate includes a substrate and a plurality of sub-pixels. Each sub-pixel includes a light-emitting element, and each light-emitting element includes a light-emitting functional layer, which includes a plurality of film layers. The display substrate further includes an isolation structure, wherein an isolation structure is disposed between adjacent sub-pixels. The isolation structure includes a first sub-isolation structure and a second sub-isolation structure stacked together. The first sub-isolation structure is located between the second sub-isolation structure and the substrate. The size of the first sub-isolation structure is smaller than the size of the second sub-isolation structure so that the second sub-isolation structure includes a protruding portion; or, the slope angle of the side surface of the first sub-isolation structure is greater than 60 degrees and less than 120 degrees, and / or, the slope angle of the side surface of the second sub-isolation structure is greater than 60 degrees and less than 120 degrees; at least one of the plurality of film layers is disconnected at the isolation structure. Disconnecting at least one layer of the light-emitting functional layer at the isolation structure helps to reduce the probability of crosstalk between adjacent sub-pixels.

Description

Technical Field

[0001] At least one embodiment of this disclosure relates to a display substrate and a display device. Background Technology

[0002] With the development of display technology, users have increasingly higher performance requirements for display devices. By separating the light-emitting material layers between adjacent sub-pixels to reduce signal crosstalk, the performance requirements of high brightness and low power consumption of display devices can be met as much as possible. Summary of the Invention

[0003] At least one embodiment of this disclosure provides a display substrate and a display device.

[0004] At least one embodiment of this disclosure provides a display substrate, comprising: a substrate including at least a first display area; a plurality of sub-pixels located on the first display area on the substrate, wherein at least some of the sub-pixels each sub-pixel includes a light-emitting element, the light-emitting element including a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the substrate, the first electrode being located between the light-emitting functional layer and the substrate, the light-emitting functional layer including a plurality of film layers. The display substrate further includes an isolation structure, with at least one isolation structure disposed between adjacent sub-pixels. The isolation structure includes a first sub-isolation structure and a second sub-isolation structure stacked together, the first sub-isolation structure being located between the second sub-isolation structure and the substrate. Along the arrangement direction of adjacent sub-pixels, the size of the first sub-isolation structure in the isolation structure located between the adjacent sub-pixels is smaller than the size of the second sub-isolation structure, such that the second sub-isolation structure includes a portion protruding relative to the edge of the first sub-isolation structure; or, at least a portion of the side surface of the first sub-isolation structure has a slope angle greater than 60 degrees and less than 120 degrees with a plane parallel to the contact surface of the first and second sub-isolation structures, and / or, at least a portion of the side surface of the second sub-isolation structure has a slope angle greater than 60 degrees and less than 120 degrees with a plane parallel to the contact surface of the first and second sub-isolation structures; at least one of the plurality of film layers is broken at the isolation structure.

[0005] For example, according to an embodiment of this disclosure, the material of the first sub-isolation structure is different from the material of the second sub-isolation structure.

[0006] For example, according to embodiments of this disclosure, the material of the first sub-isolation structure and the second sub-isolation structure both include the same element, or the material of the first sub-isolation structure and the second sub-isolation structure both include metal.

[0007] For example, according to embodiments of this disclosure, the material of the first sub-isolation structure includes inorganic non-metallic materials, metallic materials, or metal oxides, and the material of the second sub-isolation structure includes organic materials.

[0008] For example, according to an embodiment of this disclosure, each isolation structure further includes a third sub-isolation structure stacked with the second sub-isolation structure and the first sub-isolation structure, the third sub-isolation structure being located between the first sub-isolation structure and the substrate; along the arrangement direction of adjacent sub-pixels, the maximum size of the third sub-isolation structure among the isolation structures between adjacent sub-pixels is greater than the maximum size of the first sub-isolation structure.

[0009] For example, according to an embodiment of this disclosure, the first sub-isolation structure and the second sub-isolation structure are integrally formed, and the material of the first sub-isolation structure includes organic materials.

[0010] For example, according to an embodiment of this disclosure, the distance between the side surface of the isolation structure facing the substrate and the substrate is less than the distance between the side surface of the first electrode facing the substrate and the substrate.

[0011] For example, according to an embodiment of this disclosure, the surface of the second sub-isolation structure away from the substrate is a curved surface, and the curved surface is curved toward the first sub-isolation structure.

[0012] For example, according to an embodiment of this disclosure, the second sub-isolation structure includes a central region distributed along the arrangement direction of two adjacent sub-pixels and edge regions located on both sides of the central region. Along a direction perpendicular to the substrate, the thickness of the central region of the second sub-isolation structure is greater than the thickness of the edge regions.

[0013] For example, according to an embodiment of this disclosure, the slope angle of the portion of the second sub-isolation structure that protrudes from the edge of the first sub-isolation structure away from the surface of the first sub-isolation structure is smaller than the slope angle of at least a portion of the side surface of the second sub-isolation structure to a plane parallel to the contact surface of the first and second sub-isolation structures.

[0014] For example, according to an embodiment of this disclosure, the slope angle of the portion of the second sub-isolation structure that protrudes from the edge of the first sub-isolation structure away from the surface of the first sub-isolation structure is 15 to 70 degrees.

[0015] For example, according to an embodiment of this disclosure, the ratio of the thickness of the first sub-isolation structure to the thickness of the light-emitting functional layer is 0.7 to 1.5.

[0016] For example, according to an embodiment of this disclosure, the second electrode is continuously disposed at the portion of the second sub-isolation structure that protrudes from the edge of the first sub-isolation structure.

[0017] For example, according to an embodiment of this disclosure, an organic layer is disposed between the first electrode and the substrate, the first electrode is in contact with the surface of the organic layer, and the second sub-isolation structure is made of the same material as the organic layer.

[0018] For example, according to an embodiment of this disclosure, the organic layer includes an organic layer opening, the isolation structure is located within the organic layer opening, and the isolation structure is spaced apart from the sidewall of the organic layer opening.

[0019] For example, according to an embodiment of this disclosure, the display substrate further includes: a pixel defining pattern, wherein the pixel defining pattern, at least located in the first display area, includes a plurality of first openings, one sub-pixel corresponds to at least one first opening, the light-emitting element of the sub-pixel is at least partially located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode. The pixel defining pattern further includes a plurality of second openings, the second openings being configured to expose at least a portion of the organic layer opening and the isolation structure, and the isolation structure is spaced apart from the pixel defining portion of the pixel defining pattern.

[0020] For example, according to an embodiment of this disclosure, the display substrate further includes: a first conductive layer located between the first electrode and the substrate; and a second conductive layer located on the side of the first conductive layer away from the substrate. The first conductive layer includes a first power signal line and a data line, the second conductive layer includes a second power signal line, and the first sub-isolation structure is disposed on the same layer as the second conductive layer.

[0021] For example, according to an embodiment of this disclosure, the first sub-isolation structure includes at least one film layer, the first electrode includes at least one electrode layer, and the film layer of the first sub-isolation structure and the electrode layer of the first electrode are disposed in the same layer.

[0022] For example, according to an embodiment of this disclosure, the third sub-isolation structure includes at least one film layer, the first electrode includes at least one electrode layer, and the film layer of the third sub-isolation structure is disposed in the same layer as the electrode layer of the first electrode.

[0023] For example, according to an embodiment of this disclosure, the display substrate further includes: a pixel defining pattern, wherein the pixel defining pattern, at least located in the first display area, includes a plurality of first openings, one sub-pixel corresponds to at least one first opening, the light-emitting element of the sub-pixel is at least partially located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode. The pixel defining pattern further includes a plurality of second openings, the isolation structure is located in the second openings, and the isolation structure is spaced apart from the sidewalls of the second openings.

[0024] For example, according to an embodiment of this disclosure, the pixel defining pattern includes a pixel defining portion located between the first opening and the second opening which are adjacent to each other, wherein the angle between the sidewall of the pixel defining portion forming the first opening and the plane parallel to the substrate is different from the angle between the sidewall of the pixel defining portion forming the second opening and the plane parallel to the substrate.

[0025] For example, according to an embodiment of this disclosure, the second sub-isolation structure is made of the same material as the pixel defining portion of the pixel defining pattern.

[0026] For example, according to an embodiment of this disclosure, the display substrate further includes a planarization layer located between the substrate and the pixel defining pattern. The isolation structure and the first electrode are both located on the planarization layer.

[0027] For example, according to an embodiment of this disclosure, the material of the second sub-isolation structure is the same as the material of the third sub-isolation structure, and the material of the second sub-isolation structure is different from the material of the first sub-isolation structure.

[0028] For example, according to embodiments of this disclosure, the materials of the first sub-isolation structure and the second sub-isolation structure are both inorganic non-metallic materials or metallic materials.

[0029] For example, according to embodiments of this disclosure, at least one of the first sub-isolation structure and the second sub-isolation structure includes at least one membrane layer.

[0030] For example, according to an embodiment of this disclosure, the display substrate further includes: a pixel defining pattern, wherein the pixel defining pattern, at least located in the first display area, includes a plurality of first openings, each sub-pixel corresponds to at least one first opening, the light-emitting element of the sub-pixel is at least partially located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode. The isolation structure is located on the side of the pixel defining portion of the pixel defining pattern away from the substrate.

[0031] For example, according to an embodiment of this disclosure, the display substrate further includes: a pixel defining pattern, wherein the pixel defining pattern at least located in the first display area includes a plurality of first openings, one sub-pixel corresponds to at least one first opening, the light-emitting element of the sub-pixel is at least partially located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode. The pixel defining pattern further includes a plurality of second openings, the isolation structure is located within the second openings and is spaced apart from the sidewalls of the second openings; a barrier portion is provided between the third sub-isolation structure and the substrate, and the barrier portion is disposed in the same layer as the first electrode.

[0032] For example, according to an embodiment of this disclosure, the light-emitting functional layer includes a first light-emitting layer, a charge-generating layer, and a second light-emitting layer stacked together, wherein the charge-generating layer is located between the first light-emitting layer and the second light-emitting layer, and the charge-generating layer is disconnected at the isolation structure.

[0033] For example, according to an embodiment of this disclosure, the film layer of the charge generating layer in the light-emitting functional layer facing the substrate is disconnected at the isolation structure.

[0034] For example, according to an embodiment of this disclosure, the color of the light emitted by the first light-emitting layer in the same sub-pixel is the same as the color of the light emitted by the second light-emitting layer, and the colors of the light emitted by the light-emitting layers in at least two adjacent sub-pixels are different.

[0035] For example, according to an embodiment of this disclosure, the light-emitting functional layer includes a light-emitting layer, wherein the area of ​​the orthographic projection of at least one disconnected film layer in the light-emitting functional layer onto the substrate is greater than the area of ​​the orthographic projection of the light-emitting layer onto the substrate.

[0036] For example, according to an embodiment of this disclosure, the light-emitting functional layer includes at least one light-emitting layer, and the film layers that are disconnected at the isolation structure in the light-emitting functional layer include at least one light-emitting layer and at least one other film layer; the area of ​​the orthographic projection of the disconnected at least one other film layer on the substrate is greater than the area of ​​the orthographic projection of the disconnected at least one light-emitting layer on the substrate; or, the area of ​​the portion of the isolation structure covered by the disconnected at least one other film layer is greater than the area of ​​the portion of the isolation structure covered by the disconnected at least one light-emitting layer.

[0037] For example, according to an embodiment of this disclosure, at least one of the plurality of films included in the light-emitting functional layer and the second electrode overlap with the projection of the isolation structure on the substrate.

[0038] For example, according to an embodiment of this disclosure, at least a portion of at least one of the plurality of film layers comprising the light-emitting functional layer covers a portion of the side surface of the isolation structure.

[0039] For example, according to an embodiment of this disclosure, the substrate further includes a second display area, the first display area surrounding at least a portion of the second display area.

[0040] For example, according to an embodiment of this disclosure, the thickness of the first sub-isolation structure is greater than the thickness of the light-emitting functional layer, and the second electrode is disconnected at the isolation structure.

[0041] This disclosure provides at least one embodiment of a display device, including the above-described display substrate. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0043] Figure 1A This is a partial cross-sectional structural diagram of a display substrate provided according to an example of an embodiment of the present disclosure;

[0044] Figure 1B This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0045] Figure 1C This is a plan view of a display substrate provided according to an embodiment of the present disclosure;

[0046] Figure 2 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0047] Figure 3 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0048] Figure 4A To form Figure 2 A schematic diagram of the previous display substrate;

[0049] Figure 4B To form Figure 2 A schematic diagram of the subsequent display substrate;

[0050] Figures 5A to 5D To form Figure 3 A schematic diagram of the previous display substrate manufacturing process;

[0051] Figure 6 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0052] Figure 7 for Figure 6The diagram shows a display substrate including a light-emitting functional layer and a multilayer film layer on the side away from the substrate.

[0053] Figure 8 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of an embodiment of the present disclosure;

[0054] Figures 9A to 9B To form Figure 8 A schematic diagram of the previous display substrate manufacturing process;

[0055] Figures 10A to 10E This is a schematic diagram of the planar structure of a display substrate provided according to an embodiment of the present disclosure;

[0056] Figure 11A This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0057] Figure 11B This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of another embodiment of the present disclosure;

[0058] Figure 12 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0059] Figures 13A to 13F To form Figure 11A A schematic diagram of the previous display substrate manufacturing process;

[0060] Figure 14 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0061] Figures 15A to 15B To form Figure 14 A schematic diagram of the previous display substrate manufacturing process;

[0062] Figure 16 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0063] Figures 17A to 17B To form Figure 16 A schematic diagram of the previous display substrate manufacturing process;

[0064] Figure 18 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0065] Figures 19A to 19B To form Figure 18 A schematic diagram of the previous display substrate manufacturing process;

[0066] Figure 20 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0067] Figures 21A to 21B To form Figure 20 A schematic diagram of a previous method for manufacturing a display substrate;

[0068] Figures 22A to 22C To form Figure 20 A schematic diagram of another manufacturing process for a previous display substrate;

[0069] Figure 23 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0070] Figure 24 To form Figure 23 A schematic diagram of a previous method for manufacturing a display substrate;

[0071] Figure 25 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0072] Figures 26A to 26B To form Figure 25 A schematic diagram of a previous method for manufacturing a display substrate;

[0073] Figure 27 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0074] Figure 28A This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0075] Figure 28B This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another example of another embodiment of the present disclosure;

[0076] Figures 29A to 29D To form Figure 27 A schematic diagram of a previous method for manufacturing a display substrate;

[0077] Figures 30A to 30C To form Figure 28A The diagram shows a process flow chart of a manufacturing method prior to the display substrate.

[0078] Figure 31 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0079] Figure 32 This is a partial cross-sectional structural schematic diagram of a display substrate provided according to another embodiment of the present disclosure;

[0080] Figures 33A to 33B To form Figure 31 A schematic diagram of a previous method for manufacturing a display substrate;

[0081] Figures 34A to 34B To form Figure 32 A schematic diagram of a previous method for manufacturing a display substrate;

[0082] Figure 35 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0083] Figure 36 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0084] Figure 37 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0085] Figure 38 This is a schematic diagram of the structure of another display substrate provided in an embodiment of the present disclosure;

[0086] Figures 39A-39C A schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of this disclosure;

[0087] Figure 40 A schematic diagram of another display substrate provided in an embodiment of this disclosure; and

[0088] Figures 41A-41C This is a schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of the present disclosure. Detailed Implementation

[0089] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0090] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0091] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain errors, taking into account measurement and errors associated with the measurement of a specific quantity (e.g., limitations of the measurement system), and represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of said value. Unless otherwise specified in the following embodiments of this disclosure, the quantity of a component is implied to mean that the component can be one or more, or can be understood as at least one. "At least one" means one or more, and "more" means at least two. In the embodiments of this disclosure, "same layer" refers to the relationship between multiple film layers formed from the same material after undergoing the same step (e.g., a patterning process). Here, "same layer" does not always mean that multiple film layers have the same thickness or that multiple film layers have the same height in a cross-sectional view.

[0092] In the research, the inventors of this application discovered that the light-emitting functional layer may include multiple light-emitting layers stacked together, and a charge generation layer (CGL) is disposed between at least two layers of the multiple light-emitting layers. The charge generation layer has a high conductivity. When the charge generation layer is a whole film layer, the charge generation layers of two adjacent organic light-emitting elements are continuous film layers, which can easily cause crosstalk between adjacent sub-pixels.

[0093] This disclosure provides a display substrate and a display device in at least one embodiment. The display substrate includes a substrate and at least a first display area; a plurality of sub-pixels located on the first display area on the substrate, each sub-pixel including at least a portion of the sub-pixels including a light-emitting element, the light-emitting element including a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the substrate, the first electrode being located between the light-emitting functional layer and the substrate, the light-emitting functional layer including a plurality of film layers. The display substrate further includes an isolation structure, with at least one isolation structure disposed between adjacent sub-pixels. The isolation structure includes a first sub-isolation structure and a second sub-isolation structure stacked together, the first sub-isolation structure located between the second sub-isolation structure and the substrate. Along the arrangement direction of adjacent sub-pixels, the size of the first sub-isolation structure in the isolation structure located between the adjacent sub-pixels is smaller than the size of the second sub-isolation structure, such that the second sub-isolation structure includes a portion protruding relative to the edge of the first sub-isolation structure; or, at least a portion of the side surface of the first sub-isolation structure has a slope angle greater than 60 degrees and less than 120 degrees with a plane parallel to the contact surface of the first and second sub-isolation structures, and / or, at least a portion of the side surface of the second sub-isolation structure has a slope angle greater than 60 degrees and less than 120 degrees with a plane parallel to the contact surface of the first and second sub-isolation structures; at least one of the plurality of film layers is disconnected at the isolation structure. By providing an isolation structure between adjacent sub-pixels in the display substrate, embodiments of this disclosure can disconnect at least one layer of the plurality of film layers of the light-emitting functional layer at the isolation structure, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0094] The display substrate and display device provided in the embodiments of this disclosure are described below with reference to the accompanying drawings.

[0095] Figure 1A This is a partial cross-sectional structural diagram of a display substrate provided according to an example of an embodiment of the present disclosure. Figure 1B This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 1C This is a plan view of a display substrate provided according to an embodiment of this disclosure. Figures 1A to 1C As shown, the display substrate includes a first display region A1 and a second display region A2 located on a substrate 01. For example, the first display region A1 surrounds at least a portion of the second display region A2. Figure 1B The second display area A2 shown is located at the top center of the substrate 01. For example, the four sides of the rectangular first display area A1 can all surround the second display area A2, meaning the second display area A2 can be surrounded by the first display area A1. Alternatively, the second display area A2 may not be located at... Figure 1B The second display area A2 is not located at the top center of the substrate 01 shown, but at other locations. For example, the second display area A2 can be located at the upper left or upper right corner of the substrate 01. For example, the first display area A1 can be a non-transparent display area, and the second display area A2 can be a transparent display area. Thus, the display substrate does not need to be perforated to directly set the required hardware structure such as the photosensor within the second display area A2, providing a foundation for realizing a full-screen display.

[0096] like Figures 1A to 1C As shown, the display substrate includes a substrate 01, a plurality of sub-pixels 10 of a first display area A1 located on the substrate 01, and an insulating layer 200 located on the substrate 01. For example, the material of the insulating layer 200 may include an organic material, and the insulating layer 200 may be an organic layer.

[0097] like Figures 1A to 1C As shown, the sub-pixel 10 includes an organic light-emitting element 100. The organic light-emitting element 100 includes a light-emitting functional layer 130 and a first electrode 110 and a second electrode 120 located on both sides of the light-emitting functional layer 130 along a direction perpendicular to the substrate 01. The first electrode 110 is located between the light-emitting functional layer 130 and the substrate 01. The light-emitting functional layer 130 includes multiple film layers, such as a charge generation layer 133.

[0098] like Figures 1A to 1C As shown, the display substrate also includes a shielding portion 300 located on the side of the insulating layer 200 away from the substrate 01, and the orthographic projection of the shielding portion 300 on the substrate 01 overlaps with the orthographic projection of the insulating layer 200 on the substrate 01. The material of the shielding portion 300 is different from the material of the insulating layer 200. For example, the material of the shielding portion 300 may include an inorganic non-metallic material or a metallic material.

[0099] like Figures 1A to 1C As shown, the insulating layer 200 includes a plurality of grooves 210 along a direction perpendicular to the substrate 01. The thickness of the portion of the insulating layer 200 excluding the grooves 210 is greater than the thickness of the shielding portion 300. The thickness of at least the portion where the insulating layer 200 and the shielding portion 300 overlap on the substrate 01 is greater than the thickness of the shielding portion 300.

[0100] like Figure 1BAs shown, the groove 210 and the blocking portion 300 are at least partially located between adjacent sub-pixels 10, and at least two blocking portions 300 are provided between adjacent sub-pixels 10, arranged along the arrangement direction of the adjacent sub-pixels 10 and spaced apart from each other. The blocking portion 300 is located at the edge of the groove 210 and protrudes into the groove 210 in the arrangement direction to form a protrusion 310 covering a portion of the groove opening. The arrangement direction can be approximately the extension direction of the line connecting the centers of the light-emitting areas of adjacent sub-pixels or the line connecting the closest distances, or the light-emitting areas of adjacent sub-pixels can be distributed along the X direction, which is the X direction.

[0101] like Figure 1C As shown, the slope angle between at least a portion of the side surface of the shielding portion 300 and the plane parallel to the side surface of the insulating layer 200 away from the substrate 01 is a first slope angle, and the slope angle between at least a portion of the side surface of the groove 210 and the plane parallel to the side surface of the insulating layer 200 away from the substrate 01 is a second slope angle, and at least one of the first slope angle and the second slope angle is greater than 60 degrees.

[0102] like Figure 1C As shown, the slope angle between at least a portion of the side surface of the shielding portion 300 and the plane parallel to the contact surface of the shielding portion 300 and the insulating layer 200 is a first slope angle, and the slope angle between at least a portion of the side surface of the groove 210 and the plane parallel to the contact surface of the shielding portion 300 and the insulating layer 200 is a second slope angle. At least one of the first slope angle and the second slope angle is greater than 60 degrees. For example, at least one of the first slope angle and the second slope angle is 60 to 120 degrees. For example, at least one of the first slope angle and the second slope angle is 70 to 110 degrees. For example, at least one of the first slope angle and the second slope angle is 80 to 100 degrees. For example, at least one of the first slope angle and the second slope angle is greater than 70 degrees. For example, at least one of the first slope angle and the second slope angle is greater than 80 degrees. For example, at least one of the first slope angle and the second slope angle is greater than 70 degrees. For example, at least one of the first slope angle and the second slope angle is greater than 80 degrees. For example, at least one of the first slope angle and the second slope angle is greater than 90 degrees.

[0103] The first slope angle can be the angle between the surface of the shielding portion away from the substrate and the side surface of the shielding portion, or it can be the angle between the surface of the shielding portion facing the substrate and the side surface of the shielding portion. The second slope angle can be the angle between the surface of the insulating layer away from the substrate and the side surface of the groove. The side surface of the shielding portion can refer to the surface of the shielding portion that has a certain angle with the substrate, and the side surface of the groove can refer to the sidewall of the groove that has a certain angle with the substrate.

[0104] Figure 1B and Figure 1CThe difference in the example shown lies in the positional and angular relationship between the shielding part 300 and the sidewall of the groove 210.

[0105] like Figures 1A to 1C The light-emitting functional layer 130 has at least one film layer broken at at least a portion of the edge of the shielding portion 300.

[0106] In this embodiment of the present disclosure, a groove and a blocking portion are provided between adjacent sub-pixels in a display substrate. By adjusting the relative positional relationship between the blocking portion and the edge of the groove, or the angle of the side surface of the blocking portion and the angle of the side wall of the groove, at least one layer of the light-emitting functional layer can be broken at the protrusion of the blocking portion relative to the edge of the groove, or broken at the edge of the blocking portion and the side wall of the groove, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0107] For example, when both the insulating layer 200 and the shielding portion 300 are made of light-transmitting materials, the refractive index of the insulating layer 200 is less than that of the shielding portion. For example, in a direction perpendicular to the substrate 01, the shielding portion 300 may overlap with a transistor in the pixel circuit described later to provide a light-shielding function.

[0108] In any embodiment of this disclosure, "adjacent sub-pixels" refers to two sub-pixels that are not separated by other sub-pixels.

[0109] For example, such as Figure 1A As shown, the plurality of sub-pixels 10 may include two adjacent sub-pixels 10 arranged along the X direction. For example, a plurality of blocking portions 300 provided in the two adjacent sub-pixels 10 are arranged along the X direction. For example, the blocking portion 300 provided between the two adjacent sub-pixels 10 protrudes into the groove 210 relative to the edge of the groove 210 in the X direction to form a protrusion 310. The protrusion 310 in the blocking portion 300 is suspended and blocks the edge portion of the opening of the groove 210. The portion of the blocking portion 300 other than the protrusion 310 is attached to the surface of the insulating layer 200 on the side away from the substrate 01. For example, the protrusion 310 extends in a direction parallel to the substrate 01. For example, the orthographic projection of the protrusion 310 on the insulating layer 200 is located in the groove 210.

[0110] For example, such as Figure 1A As shown, the distance between one of the two adjacent sub-pixels 10 and the other of the two adjacent sub-pixels 10 is less than the distance between the two adjacent sub-pixels 10 and the other of the two adjacent sub-pixels 10; among the two adjacent sub-pixels 10, the sub-pixel 10 that is closer to the occlusion portion 300 is sub-pixel P1, and the protrusion 310 in the occlusion portion 300 is further away from sub-pixel P1 than the other parts of the occlusion portion 300, and the center of the groove 210 is located on the side of the occlusion portion 300 that is away from sub-pixel P1.

[0111] For example, such as Figure 1A As shown, the light-emitting functional layer 130 may include a first light-emitting layer (EML) 131, a charge-generating layer (CGL) 133, and a second light-emitting layer 132 stacked together, with the charge-generating layer 133 located between the first light-emitting layer 131 and the second light-emitting layer 132. The charge-generating layer has strong conductivity, which enables the light-emitting functional layer to have advantages such as long lifespan, low power consumption, and high brightness. For example, compared to a light-emitting functional layer without a charge-generating layer, a sub-pixel can nearly double its brightness by incorporating a charge-generating layer within the light-emitting functional layer.

[0112] For example, the sub-pixels including the charge generation layer mentioned above adopt Tandem technology, using N / P-CGL as a heterojunction to connect the two light-emitting layers in series. This technology realizes the series connection of dual light-emitting devices, which greatly reduces the light-emitting current of the light-emitting devices under the same light intensity, improves the lifespan of organic light-emitting elements, and is beneficial for application in new technologies with long lifespans such as automotive.

[0113] For example, in each sub-pixel 10, the light-emitting functional layer 130 may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). For example, the hole injection layer, hole transport layer, electron transport layer, electron injection layer, and charge generation layer 133 are all shared film layers among the multiple sub-pixels 10, and can be referred to as common layers. For example, at least one film layer in the light-emitting functional layer 130 that is broken at the edge of the groove can be at least one of the aforementioned common layers. By breaking at least one of the aforementioned common layers at the edge of the groove located between adjacent sub-pixels, it is beneficial to reduce the probability of crosstalk between adjacent sub-pixels.

[0114] For example, the second light-emitting layer 132 can be located between the first light-emitting layer 131 and the second electrode 120, and the hole injection layer can be located between the first electrode 110 and the first light-emitting layer 131. For example, an electron transport layer can also be disposed between the charge generation layer 133 and the first light-emitting layer 131. For example, a hole transport layer can be disposed between the second light-emitting layer 132 and the charge generation layer 133. For example, an electron transport layer and an electron injection layer can be disposed between the second light-emitting layer 132 and the second electrode 120.

[0115] For example, in the same sub-pixel 10, the first light-emitting layer 131 and the second light-emitting layer 132 can be light-emitting layers that emit the same color of light. For example, the first light-emitting layer 131 (or the second light-emitting layer 132) in a sub-pixel 10 that emits different colors of light emits different colors of light. Of course, the embodiments disclosed herein are not limited to this. For example, in the same sub-pixel 10, the first light-emitting layer 131 and the second light-emitting layer 132 can be light-emitting layers that emit different colors of light. By setting light-emitting layers that emit different colors of light in the same sub-pixel 10, the light emitted by the multiple light-emitting layers included in the sub-pixel 10 can be mixed into white light, and the color of the light emitted by each sub-pixel can be adjusted by setting a color filter layer.

[0116] For example, in adjacent sub-pixels 10, the light-emitting layers located on the same side of the charge generation layer 133 can be spaced apart from each other, or they can overlap or connect at the interval between two sub-pixels 10. This disclosure does not limit this.

[0117] For example, the first light-emitting layer 131 (second light-emitting layer 132) of adjacent sub-pixels can overlap within the groove 210. However, it is not limited to this. For example, the first light-emitting layer 131 (second light-emitting layer 132) of adjacent sub-pixels can be spaced apart within the groove 210; or, only the first light-emitting layer 131 (second light-emitting layer 132) of one of the adjacent sub-pixels can be provided within the groove 210.

[0118] For example, the materials of the electron transport layer may include aromatic heterocyclic compounds, such as imidazole derivatives, imidazopyridine derivatives, benzimidazolephenanthridine derivatives, and other imidazole derivatives; pyrimidine derivatives, triazine derivatives, and other azine derivatives; quinoline derivatives, isoquinoline derivatives, phenanthreneroline derivatives, and other compounds containing a nitrogen-containing six-membered ring structure (including compounds with phosphine oxide substituents on the heterocycle), etc.

[0119] For example, the material of the charge generation layer 133 can be a material containing phospho groups or a material containing triazine.

[0120] For example, when the insulating layer 200 between two adjacent sub-pixels 10 does not have a groove 210 and no blocking portion 300 is provided on the insulating layer 200, at least one film layer in the light-emitting functional layer 130 of the two adjacent sub-pixels 10 may be connected or be a whole film layer. By providing grooves and blocking portions between adjacent sub-pixels, at least one film layer (such as a charge generation layer) in the light-emitting functional layer of the two adjacent sub-pixels is spaced apart, which can increase the resistance of the light-emitting functional layer between adjacent sub-pixels, thereby reducing the probability of crosstalk between the two adjacent sub-pixels without affecting the normal display of the sub-pixels.

[0121] In the display substrate provided in this embodiment, by providing a groove in the organic layer between two adjacent sub-pixels and providing a shielding portion protruding inward relative to the edge of the groove, the charge generation layer formed at the protrusion of the shielding portion protruding into the groove can be disconnected. At this time, at least one film layer (such as a charge generation layer) in the light-emitting functional layer of the two adjacent sub-pixels is provided at intervals, which can increase the resistance of the light-emitting functional layer between the adjacent sub-pixels. This reduces the probability of crosstalk between the two adjacent sub-pixels without affecting the normal display of the sub-pixels.

[0122] For example, the film between the second light-emitting layer 132 and the first electrode 110 is broken at the protrusion 310 of the shielding portion 300.

[0123] For example, the depth of the groove 210 is greater than the thickness of the light-emitting functional layer 130, and all the film layers included in the light-emitting functional layer 130 are broken at the protrusion 310. For example, a portion of the film layers of the light-emitting functional layer 130 and the second electrode 120 may be disposed in the groove 210. For example, all the film layers of the light-emitting functional layer 130 and the second electrode 120 may be disposed in the groove 210.

[0124] For example, the first orthographic projection of at least one of the light-emitting functional layers 130 on the substrate 01 is continuous, and the second orthographic projection on the plane perpendicular to the substrate 01 is discontinuous; or, the first orthographic projection of at least one of the light-emitting functional layers 130 on the substrate 01 and the second orthographic projection on the plane perpendicular to the substrate 01 are both discontinuous, and the width of the interval at the discontinuous position in the first orthographic projection is smaller than the width of the interval at the discontinuous position in the second orthographic projection.

[0125] For example, at least one of the light-emitting functional layers 130 may be a charge-generating layer 133. The first orthographic projection of the charge-generating layer 133 on the substrate 01 is continuous, while its second orthographic projection on a plane perpendicular to the substrate 01 is discontinuous. For example, the charge-generating layer 133 may include a portion located within the groove 210 and a portion not located within the groove 210, with these two portions discontinuous at the edge of the groove 210. For example, the first orthographic projections of these two portions on the substrate 01 may be adjacent or overlapping, and the first orthographic projection is continuous. For example, if the distances between these two portions and the substrate 01 are different, then the second orthographic projections of these two portions on the XY plane are discontinuous.

[0126] For example, at least one of the light-emitting functional layers 130 may be a charge-generating layer 133. The first orthographic projection of the charge-generating layer 133 on the substrate 01 and its second orthographic projection on a plane perpendicular to the substrate 01 are both discontinuous, and the width of the gap at the discontinuous position in the first orthographic projection is smaller than the width of the gap at the discontinuous position in the second orthographic projection. For example, the charge-generating layer 133 may include a portion located within the groove 210 and a portion not located within the groove 210, these two portions being disconnected at the edge defining the structure 300. For example, a gap may be provided between the first orthographic projections of these two portions on the substrate 01, and the first orthographic projection is discontinuous. For example, if the distances between these two portions and the substrate 01 are different, then the second orthographic projections of these two portions on the XY plane are discontinuous, and a gap may be provided between the second orthographic projections of the two portions on the XY plane.

[0127] For example, such as Figure 1A As shown, the insulating layer 200 is located between the first electrode 110 and the substrate 01.

[0128] For example, the substrate 01 may be made of one or more of the following materials: glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone. This embodiment includes, but is not limited to, these materials.

[0129] For example, insulating layer 200 includes an organic layer. For example, the organic layer includes a planarization (PLN) layer. For example, the first electrode 110 is in contact with the surface of the organic layer away from the substrate 01. For example, a groove 210 is located in the organic layer, and the ratio of the depth of the groove 210 to the thickness of the planarized portion of the organic layer is greater than or equal to 0.2 and less than 1. For example, the groove 210 is located in the planarization layer, and the ratio of the depth of the groove 210 to the thickness of the planarization layer is 0.2 to 0.9. For example, the ratio of the depth of the groove 210 to the thickness of the planarization layer is 0.3 to 0.8. For example, the ratio of the depth of the groove 210 to the thickness of the planarization layer is 0.4 to 0.7. For example, the ratio of the depth of the groove 210 to the thickness of the planarization layer is 0.5 to 0.6. The thickness of the planarization layer can refer to the thickness at the location of maximum thickness of the planarization layer, the thickness at the location of minimum thickness of the planarization layer excluding grooves and vias, or the average thickness of the planarization layer. For example, the thickness of the planarization layer can be 1.5 micrometers, and the depth of the groove 210 can be 0.5 micrometers.

[0130] For example, the materials for the planarization layer include one or a combination of several of the following: resin, acrylic or polyethylene terephthalate, polyimide, polyamide, polycarbonate, epoxy resin, etc.

[0131] For example, such as Figure 1AAs shown, the second electrode 120 in the plurality of sub-pixels 10 can be a common electrode shared by the plurality of sub-pixels 10. When the insulating layer 200 between two adjacent sub-pixels 10 does not have a groove 210 and the insulating layer 200 does not have a shielding portion 300, the second electrode 120 is a whole film layer. When the insulating layer 200 between two adjacent sub-pixels 10 has a groove 210 and a shielding portion 300 protruding inward relative to the edge of the groove 210 is provided at the edge of the groove 210, the light-emitting functional layer 130 and the second electrode 120 are both disconnected at the protrusion 310 of the shielding portion 300.

[0132] For example, the orthographic projection of the second electrode 210 onto the substrate 01 is continuous. For example, the orthographic projection of the second electrode 120 onto a surface perpendicular to the substrate 01 may be discontinuous.

[0133] For example, the depth of the groove 210 can be greater than the thickness of the light-emitting functional layer 130 so that both the light-emitting functional layer 130 and the second electrode 120 are disconnected at the protrusion 310 of the shielding portion 300. For example, the depth of the groove 210 can also be set to be smaller so that the light-emitting functional layer 130 is disconnected at the protrusion 310 of the shielding portion 300, while the second electrode 120 is not disconnected at the protrusion 310.

[0134] For example, the material of the shielding portion 300 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride. Alternatively, the material of the shielding portion 300 may also be inorganic materials such as metals or alloys, metal oxides, metal sulfides, or metal nitrides; this embodiment is not limited in this regard. For example, metal oxides may include calcium oxide, zinc oxide, copper oxide, titanium dioxide, tin dioxide, etc.; metal sulfides may include iron sulfide, copper sulfide, zinc sulfide, tin disulfide, etc.; metal nitrides may include silicon nitride, aluminum nitride, etc., and this embodiment includes, but is not limited to, these.

[0135] For example, such as Figure 1AAs shown, along the X direction, the ratio of the size of the protrusion 310 protruding into the groove 210 of the blocking portion 300 to the size of the blocking portion 300 can be 0.005 to 0.5. For example, along the X direction, the ratio of the size of the protrusion 310 protruding into the groove 210 of the blocking portion 300 to the size of the blocking portion 300 can be 0.01 to 0.45. For example, along the X direction, the ratio of the size of the protrusion 310 protruding into the groove 210 of the blocking portion 300 to the size of the blocking portion 300 can be 0.05 to 0.4. For example, along the X direction, the ratio of the size of the protrusion 310 protruding into the groove 210 of the blocking portion 300 to the size of the blocking portion 300 can be 0.1 to 0.35. For example, along the X direction, the ratio of the size of the protrusion 310 protruding into the groove 210 of the blocking portion 300 to the size of the blocking portion 300 can be 0.2 to 0.3. For example, the size of the protrusion 310 protruding into the groove 210 from the blocking portion 300 can be in the range of 0.1 to 5 micrometers. For example, the size of the protrusion 310 protruding into the groove 210 from the blocking portion 300 can be in the range of 0.2 to 2 micrometers.

[0136] For example, such as Figure 1A As shown, the display substrate also includes a pixel defining pattern 400 located on the side of the first electrode 110 away from the substrate 01. The pixel defining pattern 400, located at least in the first display area A1, includes a plurality of first openings 410. Each sub-pixel corresponds to at least one first opening 410. The light-emitting element of the sub-pixel is at least partially located in the first opening 410 corresponding to the sub-pixel, and the first opening 410 is configured to expose the first electrode 110. For example, at least a portion of the first electrode 110 is located between the pixel defining pattern 400 and the substrate 01. For example, when the light-emitting functional layer 130 is formed in the first opening 410 of the pixel defining pattern 400, the first electrode 110 and the second electrode 120 located on both sides of the light-emitting functional layer 130 can drive the light-emitting functional layer 130 in the first opening 410 of the pixel defining pattern 400 to emit light. For example, the light-emitting area can refer to the area where the sub-pixel effectively emits light, and the shape of the light-emitting area refers to a two-dimensional shape. For example, the shape of the light-emitting area can be the same as the shape of the first opening 410 of the pixel defining pattern 400.

[0137] For example, the portion of the pixel-defined pattern 400 other than the first opening 410 includes a pixel-defined portion, and the material of the pixel-defined portion may include polyimide, acrylic, or polyethylene terephthalate, etc.

[0138] For example, such as Figure 1A As shown, the pixel defining portion covers at least a portion of the obstruction portion 300. For example, the pixel defining portion does not cover the protrusion 310 of the obstruction portion 300.

[0139] For example, such as Figure 1AAs shown, a pixel limiting portion is provided between the shielding portion 300 and the first electrode 110 along a direction parallel to the substrate 01, that is, the pixel limiting portion can separate the shielding portion 300 from the first electrode 110.

[0140] For example, the first electrode 110 includes at least one film layer, and the shielding portion 300 is disposed in the same layer as one film layer of the first electrode 110. For example, the material of one film layer in the first electrode 110 is the same as the material of the shielding portion 300. For example, the first electrode includes at least one film layer, and the shielding portion is disposed in the same layer as at least one film layer of the first electrode. For example, the shielding portion and at least one film layer of the first electrode are disposed on the same surface of the same film layer.

[0141] For example, the first electrode 110 can be an anode, and the second electrode 120 can be a cathode. For example, the cathode can be formed of a material with high conductivity and low work function; for example, the cathode can be made of a metallic material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0142] For example, the shielding portion 300 can be integrated with the film layer of the first electrode 110 closest to it on the side closest to the substrate 01. For example, by extending the first electrode along, for example Figure 1A The X-direction dimension shown is set to be longer to include the protrusion 310 extending to the edge of the groove 210, which can save the patterning process of patterning the masking part.

[0143] For example, along Figure 1A In the X direction shown, the size of the first electrode 110 may be larger than the size of the pixel defining portion. For example, the first electrode 110 may include a portion exposed by the first opening 410, a portion covered by the pixel defining portion, and a protrusion 310 extending into the edge of the groove 210.

[0144] For example, such as Figure 1A As shown, along the arrangement direction of adjacent sub-pixels 10 (X direction in the figure), the pixel limiting portion located between the centers of the light-emitting areas of the adjacent sub-pixels 10 is called the first pixel limiting portion, and the pixel limiting portions located on both sides of the centers of the light-emitting areas of the adjacent sub-pixels 10 are called the second pixel limiting portions. The size of the first pixel limiting portion along the X direction can be smaller than the size of the second pixel limiting portion along the X direction, thereby increasing the distance between the two first pixel limiting portions, so that a groove 210 and a blocking portion 300 can be provided between the two first pixel limiting portions.

[0145] For example, such as Figure 1A As shown, the pixel-defined pattern 400 also includes a second opening 420, which is configured to expose at least a portion of the recess 210. For example, the second opening 420 may expose a portion of the obstruction 300. For example, the second opening 420 may completely expose the recess 210.

[0146] For example, such as Figure 1A As shown, along the X direction, the distance between the edges of the two blocking portions 300 that are close to each other (i.e., the edges of the protrusions 310 that are close to each other) is smaller than the opening of the groove 210.

[0147] For example, such as Figure 1A As shown, the cross-section of the groove 210 parallel to the XY plane may include an open shape formed by three straight sides, wherein the two intersecting straight sides may form a right angle, an acute angle, or an obtuse angle; the cross-section of the groove 210 parallel to the XY plane may also include an open shape formed by an arc-shaped side, along with... Figure 1A The arrow pointing in the Y direction indicates the opposite direction; the size of the figure along the X direction can gradually increase, or increase first and then decrease.

[0148] For example, such as Figure 1A As shown, an additional film layer 011 is disposed between the insulating layer 200 and the substrate 01. This additional film layer 011 may include a gate insulating layer, an interlayer insulating layer, various film layers in pixel circuits (e.g., structures including thin-film transistors, storage capacitors, etc.), data lines, gate lines, power signal lines, reset power signal lines, reset control signal lines, light emission control signal lines, etc. For example, the additional film layer 011 may include only one power signal line. For example, the surface of the insulating layer 200 facing the substrate 01 may be in contact with the interlayer insulating layer.

[0149] For example, Figure 2 This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 2 The substrate 01, insulating layer 200, shielding portion 300, other film layers 011, and organic light-emitting element shown can be coupled with each other. Figure 1A The corresponding structure in the display substrate shown is the same, and will not be described again here. For example, as Figure 2 As shown, the first electrode 110 of the organic light-emitting element can be connected to one of the source and drain electrodes of the thin-film transistor in the pixel circuit through a via penetrating the insulating layer 200. For example, the pixel circuit also includes a storage capacitor 014.

[0150] For example, such as Figure 2 As shown, a spacer 012 is also provided on the pixel-limiting part of the pixel-limiting pattern 400 to support the vapor deposition mask for making the light-emitting layer.

[0151] For example, such as Figure 2 As shown, the orthographic projection of the blocking portion 300 on the substrate 01 lies entirely within the orthographic projection of the pixel defining portion on the substrate 01. For example, the pixel defining portion covers the protrusion 310 of the blocking portion 300.

[0152] For example, such as Figure 2 As shown, the pixel-limiting portion of the pixel-limiting pattern 400 covers part of the opening of the groove 210, and the second opening 420 of the pixel-limiting pattern 400 only exposes part of the opening of the groove 210.

[0153] For example, such as Figure 2 As shown, the distance between two occlusion portions 300 located between adjacent sub-pixels can be 2 to 15 micrometers. For example, the distance between two occlusion portions 300 located between adjacent sub-pixels can be 5 to 10 micrometers. For example, the distance between two occlusion portions 300 located between adjacent sub-pixels can be 3 to 7 micrometers. For example, the distance between two occlusion portions 300 located between adjacent sub-pixels can be 4 to 12 micrometers.

[0154] For example, Figures 1A to 2 The other film layer 011 shown may include a source / drain metal layer SD layer (i.e., the film layer where the data lines and power signal lines are located), or it may include two source / drain metal layers SD1 and SD2 (for example, the other film layer may include two power signal lines that can be electrically connected).

[0155] For example, Figure 3 This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 3 The substrate 01, shielding portion 300, organic light-emitting element, and spacer 012 shown can be coupled with... Figure 2 The corresponding structure in the display substrate shown is the same, and will not be described again here. For example, as Figure 3 As shown, the orthographic projection of the pixel defining portion of the pixel defining pattern 400 onto the substrate 01 may not overlap with the orthographic projection of the shielding portion 300 onto the substrate 01. For example, the second opening 420 of the pixel defining pattern 400 may completely expose the shielding portion 300.

[0156] For example, such as Figure 3 As shown, two grooves 210 can be provided between adjacent sub-pixels, and each groove 210 has a blocking portion 300 on both sides of its opening in the X direction. Of course, the embodiments of this disclosure are not limited to having one or two grooves between adjacent sub-pixels, but can also have three or more, and the number of grooves can be set according to the distance between adjacent sub-pixels and the size of the grooves.

[0157] For example, such as Figure 3As shown, the two blocking portions 300 between two adjacent grooves 210 can be spaced apart. The embodiments of this disclosure are not limited to this. When the distance between two adjacent grooves 210 is small, a blocking portion 300 can also be provided between the two adjacent grooves 210, and the two ends of the blocking portion 300 extend toward the openings of the two grooves 210 to form two protrusions 310.

[0158] For example, such as Figure 3 As shown, when two grooves 210 are provided between two adjacent sub-pixels, at least one of the two blocking portions 300 located on both sides of the two grooves 210 can also be a part of at least one of the two first electrodes 110 of the two adjacent sub-pixels. For example, a part of the first electrode 110 is exposed by the first opening 410 of the pixel defining pattern 400 to drive the light-emitting functional layer to emit light, and another part of the first electrode 110 is exposed by the second opening 420 of the pixel defining pattern 400 and extends to the opening edge of the groove 210 to disconnect the charge generation layer 133, thereby saving process steps.

[0159] For example, such as Figure 3 As shown, the display substrate includes a first conductive layer pattern 015 and a second conductive layer pattern 016 located between the first electrode 110 and the substrate 01. The first conductive layer pattern 015 is located between the substrate 01 and the second conductive layer pattern 016. For example, the first conductive layer pattern 015 may include a data line and a first power signal line, and the second conductive layer pattern 016 may include a second power signal line. The first power signal line and the second power signal line are electrically connected. For example, the data line is configured to be electrically connected to the pixel circuit to provide a data signal (data) to the pixel circuit, and the first power signal line is electrically connected to the pixel circuit to provide a power signal (vdd) to the pixel circuit.

[0160] For example, along a direction perpendicular to the substrate 01, the groove 210 overlaps with the first conductive layer pattern 015. For example, along a direction perpendicular to the substrate 01, the groove 210 overlaps with at least one of the data lines and power lines. For example, the extension direction of the orthographic projection of the groove 210 onto the substrate 01 is different from the extension direction of at least one of the data lines and power lines. For example, the extension direction of the data lines could be... Figure 10A The direction shown is either V or U. For example, the extension direction of the power line can be... Figure 10A The V direction or U direction shown.

[0161] For example, such as Figure 3 As shown, the cross-section of the groove 210, when cut parallel to the XY plane, may include a shape with an opening formed by an arc-shaped edge, along with... Figure 3 The arrow pointing in the Y direction indicates the opposite direction; the size of the figure along the X direction can first increase and then decrease.

[0162] For example, such as Figure 3 As shown, the dimensions of the first light-emitting layer 131 and the second light-emitting layer 132 in the sub-pixel along the direction parallel to the substrate 01 can be set to be small, and the first light-emitting layer 131 and the second light-emitting layer 132 may not extend to the opening edge of the groove 210.

[0163] For example, Figure 4A To form Figure 2 A previous schematic diagram of a display substrate. Figure 4B To form Figure 2 The following is a schematic diagram of the display substrate. Figures 5A to 5D To form Figure 3 A schematic diagram of the previous display substrate manufacturing process. For example, as shown... Figure 2-3 , Figure 4A as well as Figures 5A to 5D As shown, the method for manufacturing a display substrate includes forming a plurality of sub-pixels on a substrate 01. The sub-pixels include forming a first electrode 110, a light-emitting functional layer 130, and a second electrode 120 sequentially in a direction perpendicular to the substrate 01; forming an insulating layer 200 on the substrate 01; forming a shielding material layer on the insulating layer 200, and patterning the shielding material layer to form a plurality of shielding portions 300, wherein the shielding portions 300 are located between adjacent sub-pixels, and at least two shielding portions 300 arranged along the arrangement direction of the adjacent sub-pixels are provided between adjacent sub-pixels; and etching the insulating layer 200 to form a groove 210. The opening edge of the groove 210 extends outward relative to the edges of two adjacent blocking portions 300 that are close to each other, so that the blocking portion 300 includes a protrusion 310 that protrudes into the groove 210 in the arrangement direction; or, the slope angle between at least a portion of the side surface of the blocking portion 300 and the plane parallel to the contact surface of the blocking portion 300 and the insulating layer 200 is a first slope angle, and the slope angle between at least a portion of the side surface of the groove 210 and the plane parallel to the contact surface of the blocking portion 300 and the insulating layer 200 is a second slope angle, and at least one of the first slope angle and the second slope angle is greater than 60 degrees.

[0164] The material of the insulating layer 200 is different from that of the shielding portion 300, and along the direction perpendicular to the substrate 01, the thickness of the insulating layer 200, excluding the location of the groove 210, is greater than the thickness of the shielding portion 300. For example, the material of the insulating layer 200 may include an organic material, and the material layer of the shielding portion may be an inorganic non-metallic material layer or a metallic material layer.

[0165] The light-emitting functional layer 130 is formed after the groove 210 is formed. The light-emitting functional layer 130 includes multiple film layers, and at least one of the multiple film layers is broken at the edge of the shielding portion 300 near the groove 210.

[0166] For example, after forming the insulating layer 200 and before forming the groove 210, the manufacturing method further includes: forming an electrode layer on the insulating layer 200 and patterning the electrode layer to form a first electrode 110.

[0167] For example, such as Figure 2 and Figure 4A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. For example, the substrate 01 may be a flexible substrate. For example, forming the substrate 01 may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer on the glass carrier plate. The first and second flexible material layers are made of materials such as polyimide (PI), polyethylene terephthalate (PET), or surface-treated polymer films. The first and second inorganic material layers are made of materials such as silicon nitride (SiNx) or silicon oxide (SiOx) to improve the substrate's resistance to water and oxygen; these first and second inorganic material layers are also referred to as barrier layers. The semiconductor layer is made of amorphous silicon (a-Si). For example, taking the stacked structure PI1 / Barrier1 / a-si / PI2 / Barrier2 as an example, its preparation process includes: firstly, coating a layer of polyimide on a glass substrate, curing it into a film to form a first flexible (PI1) layer; then depositing a barrier film on the first flexible layer to form a first barrier (Barrier1) layer covering the first flexible layer; then depositing an amorphous silicon film on the first barrier layer to form an amorphous silicon (a-si) layer covering the first barrier layer; then coating another layer of polyimide on the amorphous silicon layer, curing it into a film to form a second flexible (PI2) layer; then depositing a barrier film on the second flexible layer to form a second barrier (Barrier2) layer covering the second flexible layer, and finally completing the preparation of the substrate 01.

[0168] For example, such as Figure 2 and Figure 4A As shown, forming other film layers 011 on the substrate 01 includes forming a driving structure layer on the substrate 01. The driving structure layer includes multiple driving circuits, each driving circuit including multiple transistors 013 and at least one storage capacitor 014. For example, the driving circuits can adopt a 2T1C, 3T1C, or 7T1C design. For example, forming the driving structure layer may include sequentially depositing a first insulating film and an active layer film on the substrate 01, patterning the active layer film through a patterning process to form a first insulating layer 0111 covering the entire substrate 01, and an active layer pattern 0112 disposed on the first insulating layer 0111, the active layer pattern 0112 including at least the first active layer.

[0169] For example, such as Figure 2 and Figure 4A As shown, a second insulating film and a first metal film are deposited sequentially. The first metal film is patterned by a patterning process to form a second insulating layer 0113 covering the active layer pattern, and a first gate metal layer pattern 0114 disposed on the second insulating layer 0113. The first gate metal layer pattern 0114 includes at least a first gate electrode 0131 and a first capacitor electrode.

[0170] For example, such as Figure 2 and Figure 4A As shown, a third insulating film and a second metal film are deposited sequentially. The second metal film is patterned by a patterning process to form a third insulating layer 0115 covering the first gate metal layer, and a second gate metal layer pattern 0116 disposed on the third insulating layer 0115. The second gate metal layer pattern 0116 includes at least a second capacitor electrode, and the position of the second capacitor electrode corresponds to the position of the first capacitor electrode.

[0171] Subsequently, a fourth insulating film is deposited, and the fourth insulating film is patterned by a patterning process to form a fourth insulating layer 0117 covering the second gate metal layer. At least two first vias are formed on the fourth insulating layer 0117. The fourth insulating layer 0117, the third insulating layer 0115 and the second insulating layer 0113 in the two first vias are etched away to expose the surface of the first active layer of the active layer pattern 0112.

[0172] Subsequently, a third metal thin film is deposited, and the third metal thin film is patterned using a patterning process to form a source / drain metal layer pattern on the fourth insulating layer 0117. The source / drain metal layer pattern includes at least a first source electrode 0132 and a first drain electrode 0133 located in the display area. The first source electrode 0132 and the first drain electrode 0133 can be connected to the first active layer in the active layer pattern 0112 through first vias, respectively.

[0173] For example, such as Figure 2 and Figure 4A As shown, in the driving circuit, the first active layer, the first gate electrode 0131, the first source electrode 0132, and the first drain electrode 0133 in the active layer pattern 0112 can form a transistor 013, and the first capacitor electrode and the second capacitor electrode can form a storage capacitor 014. During the above fabrication process, driving circuits for both green and blue sub-pixels can be formed simultaneously.

[0174] For example, such as Figure 2 and Figure 4AAs shown, the first, second, third, and fourth insulating layers are made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be single-layer, multi-layer, or composite layers. The first insulating layer 0111 is called a buffer layer, used to improve the water and oxygen resistance of the substrate 01; the second insulating layer 0113 and the third insulating layer 0115 are called gate insulator (GI) layers; and the fourth insulating layer 0117 is called an interlayer dielectric (ILD) layer. The first, second, and third metal thin films are made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be single-layer structures or multi-layer composite structures, such as Ti / Al / Ti, etc. The active layer thin film uses one or more materials such as amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, and polythiophene. That is, this disclosure is applicable to transistors manufactured based on oxide technology, silicon technology, and organic technology.

[0175] For example, such as Figure 2 and Figure 4A As shown, an insulating layer 200, such as a planarization layer, is formed on the substrate 01 on which the aforementioned pattern is formed. For example, an organic material is coated onto the substrate 01 on which the aforementioned pattern is formed to form a planarization (PLN) layer 200 covering the entire substrate 01. Multiple second vias are formed on the planarization layer 200 in the display area through a masking, exposure, and development process. The planarization layer 200 within the multiple second vias is developed away, exposing the surfaces of the first drain electrodes 0133 of the transistors 013 of the driving circuits of multiple sub-pixels.

[0176] For example, such as Figure 2 and Figure 4A As shown, an inorganic material layer is formed on the planarization layer 200, and a masking portion 300 is formed by patterning the inorganic material layer. For example, the material of the masking portion 300 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride.

[0177] For example, such as Figure 2 and Figure 4AAs shown, in one example of an embodiment of this disclosure, after the shielding portion 300 is formed, a first electrode 110 of the sub-pixel is patterned on the planarization layer 200. For example, the first electrode 110 is connected to the first drain electrode 0133 of the transistor 013 through a second via in the planarization layer 200.

[0178] For example, such as Figure 2 and Figure 4A As shown, the first electrode 110 can be made of any one or more of the following metallic materials: magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, or a stacked structure formed by metal and transparent conductive materials, such as reflective materials like ITO / Ag / ITO or Mo / AlNd / ITO.

[0179] Of course, the embodiments disclosed herein are not limited to forming the first electrode 110 after the shielding portion 300 is formed; the first electrode 110 may also be formed before the shielding portion 300 is formed.

[0180] For example, in another embodiment of this disclosure, the shielding portion 300 can be formed in the same patterning process as the first electrode 110. For example, a material layer is formed on the insulating layer 200, and patterning this material layer can simultaneously form the shielding portion 300 and the first electrode 110. For example, both the first electrode 110 and the shielding portion 300 can be single-layer structures. For example, the first electrode 110 can be a multilayer composite structure, such as ITO / Ag / ITO, and the shielding portion 300 can be a single-layer structure. The material of the shielding portion 300 can be the same as the material of one layer of the first electrode 110, such as ITO. For example, both the first electrode 110 and the shielding portion 300 can be single-layer structures, and the material of the shielding portion 300 is the same as the material of the first electrode 110.

[0181] For example, the material of the shielding part 300 can be ITO, and the thickness of the shielding part 300 can be 1000~5000Å. This can block the organic light-emitting functional layer 130, while the second electrode 120 remains continuous and uninterrupted, thereby preventing crosstalk between adjacent sub-pixels. At the same time, the uninterrupted second electrode ensures the uniformity of the display.

[0182] For example, such as Figure 2 and Figure 4AAs shown, after forming the first electrode 110 and the shielding portion 300, a pixel defining pattern 400 can be formed. For example, a pixel defining film is coated on the substrate 01 on which the aforementioned pattern is formed, and the pixel defining pattern 400 is formed by a masking, exposure, and development process. For example, the pixel defining pattern 400 of the display area includes a plurality of pixel defining portions, and a plurality of first openings 410 and second openings 420 are formed between adjacent pixel defining portions. The pixel defining film in the first openings 410 and second openings 420 is developed away, exposing at least a portion of the surface of the first electrode 110 of a plurality of sub-pixels and the insulating layer 200, respectively.

[0183] For example, such as Figure 2 and Figure 4A As shown, the pixel-limiting portion of the pixel-limiting pattern 400 can completely cover the obscuring portion 300. However, it is not limited to this; the pixel-limiting portion of the pixel-limiting pattern 400 may also partially cover the obscuring portion 300, or the pixel-limiting portion of the pixel-limiting pattern 400 may not cover the obscuring portion 300.

[0184] For example, such as Figure 2 and Figure 4A As shown, after forming the pixel-defined pattern 400, a spacer 012 can be formed on the pixel-defined portion. For example, an organic material thin film is coated on the substrate 01 on which the aforementioned pattern is formed, and the spacer 012 is formed by a masking, exposure, and development process. The spacer 012 can serve as a support layer and is configured to support the FMM (high-precision mask) during the evaporation process.

[0185] For example, such as Figure 2 and Figure 4A As shown, after the spacer 012 is formed, the portion other than the second opening 420 can be masked to dry-etch the insulating layer 200 in the second opening 420 to form a groove 210. The edge of the masking portion 300 and the edge of the groove 210 form an undercut structure. At this time, the masking portion 300 includes a protrusion 310 that protrudes into the groove 210.

[0186] For example, such as Figure 2 and Figure 4B As shown, after forming the groove 210, a light-emitting functional layer 130 and a second electrode 120 are formed sequentially. For example, the second electrode 120 can be a transparent cathode. The light-emitting functional layer 130 can emit light from the side away from the substrate 010 through the transparent cathode, achieving top emission. For example, the second electrode 120 can be any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of metal and transparent conductive material.

[0187] For example, after forming the second electrode 120, forming the display substrate includes: sequentially depositing a hole injection layer and a hole transport layer using an open mask; sequentially depositing a first light-emitting layer 131 emitting different colors of light, such as a blue light-emitting layer, a green light-emitting layer, and a red light-emitting layer, using an open mask; sequentially depositing an electron transport layer, a charge generation layer 133, and a hole transport layer using an open mask; sequentially depositing a second light-emitting layer 132 emitting different colors of light, such as a blue light-emitting layer, a green light-emitting layer, and a red light-emitting layer, using an open mask; and sequentially depositing an electron transport layer, a second electrode, and an optical coupling layer using an open mask. For example, the hole injection layer, hole transport layer, electron transport layer, charge generation layer, second electrode, and optical coupling layer are all common layers for multiple sub-pixels.

[0188] For example, such as Figure 4B As shown, the formed light-emitting functional layer 130 breaks at the protrusion 310 of the shielding portion 300, such that a portion of the light-emitting functional layer 130 is located at the edge of the shielding portion 300, and another portion of the light-emitting functional layer 130 is deposited into the groove 210. For example, as Figure 4B As shown, the formed second electrode 120 will break at the protrusion 310 of the shielding portion 300, so that a portion of the second electrode 120 is located at the edge of the shielding portion 300, and another portion of the second electrode 120 is deposited in the groove 210.

[0189] For example, such as Figure 2 and Figure 4B As shown, after forming the second electrode 120, the method for manufacturing the display substrate further includes forming an encapsulation layer. The encapsulation layer may include a first encapsulation layer 017, a second encapsulation layer 018, and a third encapsulation layer 019 stacked together. The first encapsulation layer 017 is made of an inorganic material and covers the second electrode 120 in the display area. The second encapsulation layer 018 is made of an organic material. The third encapsulation layer 019 is made of an inorganic material and covers the first encapsulation layer 017 and the second encapsulation layer 018. However, this embodiment is not limited to this. For example, the encapsulation layer may also adopt a five-layer structure of inorganic / organic / inorganic / organic / inorganic. For example, both the first encapsulation layer 017 and the second encapsulation layer 018 fill the groove 210. For example, along the direction perpendicular to the substrate 01, the thickness of the second encapsulation layer 018 at the location of the groove 210 is greater than the thickness of the second encapsulation layer 018 at the location of the light-emitting area of ​​the light-emitting element.

[0190] For example, such as Figure 3 , Figures 5A to 5D As shown, the display substrate formed in this example is... Figure 2 , Figures 4A-4B The difference in the display substrate shown is that the display substrate in this example includes two source / drain metal layer patterns 015 and 016 (first conductive layer pattern 015 and second conductive layer pattern 016).

[0191] For example, such as Figure 3 , Figures 5A to 5D As shown, after forming the insulating layer 200, the method for manufacturing the display substrate includes patterning a plurality of shielding portions 300 on the surface of the insulating layer 200 away from the substrate 01; after forming the shielding portions 300, a first electrode 110 is patterned. This example schematically shows that the shielding portions 300 and the first electrode 110 are made of different materials and are formed by a two-step patterning process, but is not limited thereto. For example, after forming the insulating layer 200, the method for manufacturing the display substrate may include forming a plurality of shielding portions 300 and a plurality of first electrodes 110 on the surface of the insulating layer 200 away from the substrate 01 using a one-step patterning process.

[0192] For example, such as Figure 3 , Figures 5A to 5D As shown, after the first electrode 110 is formed, a pixel defining pattern 400 can be formed. For example, a pixel defining film is coated on the substrate 01 on which the aforementioned pattern is formed, and the pixel defining pattern 400 is formed by a masking, exposure, and development process. For example, the pixel defining pattern 400 of the display area includes a plurality of pixel defining portions, and a plurality of first openings 410 and second openings 420 are formed between adjacent pixel defining portions. The pixel defining film in the first openings 410 and second openings 420 is developed away, exposing at least a portion of the surface of the first electrode 110 of the plurality of sub-pixels, the shielding portion 300, and a portion of the insulating layer 200, respectively.

[0193] For example, such as Figure 3 , Figures 5A to 5D As shown, the pixel-limiting portion of the pixel-limiting pattern 400 may not overlap with the occluding portion 300. However, it is not limited to this; the pixel-limiting portion of the pixel-limiting pattern 400 may also partially cover the occluding portion 300, or the pixel-limiting portion of the pixel-limiting pattern 400 may completely cover the occluding portion 300.

[0194] For example, such as Figure 3 , Figures 5A to 5D As shown, after forming the pixel-defined pattern 400, spacers 012 can be formed on the pixel-defined portion. The method for forming spacers 012 can be the same as... Figure 4B The method shown is the same, so it will not be repeated here.

[0195] For example, such as Figure 3 , Figures 5A to 5D As shown, after the spacer 012 is formed, the portion outside the second opening 420 can be masked to dry-etch the insulating layer 200 inside the second opening 420 to form a groove 210. The edge of the masking portion 300 and the edge of the groove 210 form an undercut structure. At this time, the masking portion 300 includes a protrusion 310 protruding into the groove 210.

[0196] For example, such as Figure 3 , Figures 5A to 5D As shown, after forming the groove 210, a light-emitting functional layer 130 and a second electrode 120 are formed sequentially. For example, the formed light-emitting functional layer 130 is interrupted at the protrusion 310 of the shielding portion 300, such that a portion of the light-emitting functional layer 130 is located at the edge of the shielding portion 300, and another portion of the light-emitting functional layer 130 is deposited in the groove 210. For example, the formed second electrode 120 is also interrupted at the protrusion 310 of the shielding portion 300, such that a portion of the second electrode 120 is located at the edge of the shielding portion 300, and another portion of the second electrode 120 is deposited in the groove 210.

[0197] For example, Figure 6 This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 7 for Figure 6 The diagram shows a display substrate including a light-emitting functional layer and a multilayer film layer on the side away from the substrate. Figure 6 and Figure 7 In the example shown, the substrate 01, other film layers 011, light-emitting functional layer 130, second electrode 120, spacer 012, and encapsulation layer in the display substrate can be combined with... Figure 2 , Figures 4A to 4B The substrate 01, other film layers 011, light-emitting functional layer 130, second electrode 120, spacer 012, and encapsulation layer shown have the same characteristics, and will not be described again here. Figure 6 The display substrate in the example shown is Figures 1A to 5D The difference in the display substrate shown is that Figure 6 The insulating layer 200 shown includes a pixel-defined pattern 400, that is, the pixel-defined pattern 400 includes a groove 210, while the planarization layer 500 does not include the groove 210.

[0198] For example, such as Figure 6 and Figure 7 As shown, along the X direction, the size of the groove 210 can be smaller than the size of the first opening 410.

[0199] For example, such as Figure 6 and Figure 7 As shown, the blocking portion 300 is located on the side of the pixel-defined pattern 400 away from the substrate 01. For example, as... Figure 6 and Figure 7As shown, the groove 210 includes a second opening 420 penetrating the pixel defining portion of the pixel defining pattern 400. However, it is not limited to this. For example, the ratio of the depth of the groove 210 to the thickness of the flat portion of the pixel defining portion in the pixel defining pattern 400 is greater than or equal to 0.2 and less than 1. For example, the ratio of the depth of the groove 210 to the thickness of the flat portion of the pixel defining portion in the pixel defining pattern 400 can be 0.1 to 1. For example, the ratio of the depth of the groove 210 to the thickness of the pixel defining portion in the pixel defining pattern 400 can be 0.2 to 0.9. For example, the ratio of the depth of the groove 210 to the thickness of the pixel defining portion in the pixel defining pattern 400 can be 0.3 to 0.8. For example, the ratio of the depth of the groove 210 to the thickness of the pixel defining portion in the pixel defining pattern 400 can be 0.4 to 0.7. For example, the ratio of the depth of the groove 210 to the thickness of the pixel defining portion in the pixel defining pattern 400 can be 0.5 to 0.6. In this embodiment of the present disclosure, the thickness of the pixel defining portion may refer to the average thickness of the pixel defining portion, but is not limited thereto. It may also refer to the thickness at the position where the thickness of the pixel defining portion is the maximum, or the thickness at the position where the thickness is the minimum.

[0200] For example, the depth of the groove 210 in the pixel-defined pattern 400 can be greater than the thickness of the light-emitting functional layer 130 so that both the light-emitting functional layer 130 and the second electrode 120 are disconnected at the protrusion 310 of the blocking portion 300. For example, the depth of the groove 210 can also be set to be smaller so that the light-emitting functional layer 130 is disconnected at the protrusion 310 of the blocking portion 300, while the second electrode 120 is not disconnected at the protrusion 310.

[0201] For example, such as Figure 6 and Figure 7 As shown, the spacer 012 may cover a portion of the shielding portion 300. However, it is not limited to this; for example, the spacer 012 may cover the entire shielding portion 300, or the spacer 012 may not overlap with the shielding portion 300.

[0202] For example, such as Figure 6 and Figure 7 As shown, a conductive layer 140 is disposed between the first electrode 110 and the light-emitting functional layer 130, and the material of the conductive layer 140 is the same as the material of the shielding portion 300. For example, the material of the conductive layer 140 can be the same as the material of the first electrode 110. For example, the conductive layer 140 located between the first electrode 110 and the light-emitting functional layer 130 can be electrically connected to the first electrode 110 so as to work together with the first electrode 110 to excite the light-emitting functional layer to emit light.

[0203] Of course, the embodiments disclosed herein are not limited to this. No film layer may be provided between the first electrode 110 and the light-emitting functional layer 130, and the first electrode 110 and the light-emitting functional layer 130 may be in contact.

[0204] For example, the materials of the conductive layer 140 and the shielding portion 300 may include metallic materials (such as titanium, aluminum, silver, etc.) or metal oxides (such as indium tin oxide), etc.

[0205] For example, Figure 8 This is a partial cross-sectional structural diagram of a display substrate provided according to another example of an embodiment of the present disclosure. Figure 8 In the example shown, the substrate 01 and other film layers 011 in the display substrate can be connected with... Figure 3 The substrate 01 and other film layers 011 shown have the same characteristics, which will not be described again here. Figure 8 The display substrate in the example shown is Figures 1A to 5D The difference in the display substrate shown is that Figure 8 The insulating layer 200 shown includes a pixel-defined pattern 400, that is, the pixel-defined pattern 400 includes a groove 210, while the planarization layer 500 does not include the groove 210. Figure 8 The groove 210 shown in the pixel-defined pattern 400 can be connected with Figure 3 The grooves 210 in the flat layer shown have the same shape, size and other characteristics, which will not be described in detail here.

[0206] For example, such as Figure 8 As shown, along the X direction, the size of the groove 210 can be smaller than the size of the first opening 410.

[0207] For example, such as Figure 8 As shown, the blocking portion 300 is located on the side of the pixel-defined pattern 400 away from the substrate 01. For example, as... Figure 8 As shown, the ratio of the depth of the groove 210 to the thickness of the pixel defining portion in the pixel defining pattern 400 can be 0.2 to 0.9. For example, the ratio of the depth of the groove 210 to the thickness of the pixel defining portion in the pixel defining pattern 400 can be 0.4 to 0.7. For example, the ratio of the depth of the groove 210 to the thickness of the pixel defining portion in the pixel defining pattern 400 can be 0.5 to 0.6. In the embodiments of this disclosure, the thickness of the pixel defining portion can refer to the average thickness of the pixel defining portion, but is not limited to this; it can also refer to the thickness at the position with the maximum thickness of the pixel defining portion, or the thickness at the position with the minimum thickness.

[0208] In this example, the groove 210 may not be an opening that penetrates the pixel definition portion, so as to prevent the etching of the planarization layer from affecting the second conductive layer pattern 016.

[0209] For example, Figures 9A to 9B To form Figure 8 A schematic diagram of the previous display substrate manufacturing process. For example, as shown... Figures 8 to 9BAs shown, the method for fabricating a display substrate includes forming a plurality of sub-pixels on a substrate 01. Forming the sub-pixels includes sequentially forming a first electrode 110, a light-emitting functional layer 130, and a second electrode 120 stacked in a direction perpendicular to the substrate 01; forming an insulating layer 200 on the substrate 01; forming a shielding material layer on the insulating layer 200; and patterning the shielding material layer to form a plurality of shielding portions 300, wherein the shielding portions 300 are located between adjacent sub-pixels, and at least two shielding portions 300 are arranged and spaced apart from each other along the arrangement direction of the adjacent sub-pixels between adjacent sub-pixels; and etching the insulating layer 200 to form a groove 210. The opening edge of the groove 210 extends outward relative to the edges of two adjacent shielding portions 300 that are close to each other, such that the shielding portion 300 includes a protrusion 310 protruding into the groove 210 in the arrangement direction. After the groove 210 is formed, a light-emitting functional layer 130 is formed on the insulating layer 200. The light-emitting functional layer 130 includes a charge-generating layer 133, which is broken at the protrusion 310 of the shielding portion 300.

[0210] For example, such as Figures 8 to 9B As shown, before forming the insulating layer 200, the fabrication method further includes: forming an electrode layer on a substrate 01 and patterning the electrode layer to form a first electrode 110; forming the insulating layer 200 includes: forming a pixel defining film (i.e., insulating layer 200) on the first electrode 110; and patterning the pixel defining film to form a first opening 410 and a groove 210 exposing the first electrode 110, wherein the first opening 410 is configured to define a light-emitting area of ​​a sub-pixel.

[0211] For example, such as Figures 8 to 9B As shown, after the first opening 410 is formed, a spacer 012 is formed on the insulating layer 200.

[0212] For example, such as Figures 8 to 9B As shown, after the spacer 012 is formed, a shielding material layer is formed on the insulating layer 200, and the shielding material layer is patterned to form the shielding portion 300. For example, the material of the shielding portion 300 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride.

[0213] For example, such as Figures 8 to 9B As shown, after the shielding portion 300 is formed, a mask is used to cover the area outside the shielding portion 300 to dry-etch the insulating layer 200 between adjacent shielding portions 300 to form a groove 210. The edge of the shielding portion 300 and the edge of the groove 210 form an undercut structure. At this time, the shielding portion 300 includes a protrusion 310 that protrudes into the groove 210.

[0214] For example, Figures 10A to 10EThis is a schematic diagram of a planar structure of a display substrate provided according to an embodiment of the present disclosure. Figures 1A to 9B In the embodiment shown, the groove 210 and the shielding portion 300 constitute a partition structure for blocking the charge generation layer 133 in the light-emitting functional layer 130.

[0215] For example, such as Figures 10A to 10E As shown, the plurality of sub-pixels 10 include a plurality of first color sub-pixels 101, a plurality of second color sub-pixels 102, and a plurality of third color sub-pixels 103. For example, one of the first color sub-pixels 101 and the third color sub-pixels 103 emits red light, and the other emits blue light; the second color sub-pixels 102 emit green light. Figures 10A to 10E The diagram schematically shows that the first color sub-pixel 101 emits red light and is a red sub-pixel; the third color sub-pixel 103 emits blue light and is a blue sub-pixel; and the second color sub-pixel 102 emits green light and is a green sub-pixel.

[0216] For example, such as Figures 10A to 10E As shown, a plurality of first color sub-pixels 101 and a plurality of third color sub-pixels 103 are alternately arranged along a first direction and a second direction parallel to the substrate 01 (for example, one of the first direction and the second direction can be the U direction shown in the figure, and the other is the V direction shown in the figure) to form a plurality of first pixel rows 02 and a plurality of first pixel columns 03. A plurality of second color sub-pixels 101 are arrayed along the first direction and the second direction to form a plurality of second pixel rows 04 and a plurality of second pixel columns 05. The plurality of first pixel rows 02 and the plurality of second pixel rows 04 are alternately arranged along the second direction and staggered from each other in the first direction. The plurality of first pixel columns 03 and the plurality of second pixel columns 05 are alternately arranged along the first direction and staggered from each other in the second direction.

[0217] For example, the groove 210 includes an annular groove surrounding a first color sub-pixel 101, a second color sub-pixel 102, or a third color sub-pixel 103. For example, at least a portion of the annular groove includes at least one notch G1, and the orthographic projection of the blocking portion 300 on the substrate is located on both sides of the groove 210 perpendicular to the extension direction of its orthographic projection on the substrate 01. For example, when the shape of the orthographic projection of the groove 210 on the substrate 01 is strip-shaped, the extension direction of the orthographic projection refers to the extension direction of the strip; when the shape of the orthographic projection of the groove 210 on the substrate 01 is arc-shaped, the extension direction of the orthographic projection refers to the extension direction of the arc-shaped edge; when the shape of the orthographic projection of the groove 210 on the substrate 01 is annular, the extension direction of the orthographic projection refers to the extension direction of the annular edge.

[0218] For example, at least a portion of the boundary of the groove 210 is substantially the same as the boundary contour of the light-emitting area of ​​the adjacent sub-pixel 10. For example, the boundary contour of the light-emitting area of ​​the sub-pixel 10 may include multiple straight edges, and / or curved edges connecting adjacent straight lines. The boundary contour of the groove 210 surrounding the light-emitting area may include straight edge contours corresponding to the straight edges of the light-emitting area, and / or curved edge contours corresponding to the curved edges.

[0219] For example, along the extending direction perpendicular to the orthogonal projection of the groove 210 onto the substrate 01, the ratio of the size of the orthogonal projection of the protrusion of the blocking portion 300 protruding into the groove 210 onto the substrate 01 to the size of the orthogonal projection of the blocking portion 300 onto the substrate 01 is 0.005 to 0.5. For example, this ratio can be 0.01 to 0.4. For example, this ratio can be 0.05 to 3. For example, this ratio can be 0.1 to 2. For example, this ratio can be 0.5 to 1.

[0220] For example, along a direction that is perpendicular to the extension direction of the orthographic projection of the groove 210 and parallel to the substrate 01, the two shielding portions 300 located on both sides of the edge of the groove 210 have the same size, and the two shielding portions 300 protrude into the groove 210 by the same size.

[0221] For example, such as Figures 10A to 10E As shown, the groove 210 is located between adjacent first color sub-pixels 101 and third color sub-pixels 103, and / or, the groove 210 is located between adjacent second color sub-pixels 102 and third color sub-pixels 103, and / or, the groove 210 is located between adjacent first color sub-pixels 101 and second color sub-pixels 102.

[0222] For example, such as Figure 10A As shown in one example of an embodiment of this disclosure, the pixel defining portion 401 of the pixel defining pattern includes a ring structure surrounding each first opening 410 and a structure located between the spacer 012 and the substrate 01. A portion of the pixel defining portion between adjacent first openings 410 is removed to facilitate the formation of a groove 210 in the planarization layer. However, this is not a limitation; pixel defining portions can also be provided at locations other than those corresponding to the groove 210 and the first openings 410. For example, when the groove is located within the pixel defining pattern, the pixel defining portion between adjacent first openings 410 cannot be removed.

[0223] For example, Figure 1A The two adjacent sub-pixels 10 shown can be along Figure 10A The arrangement in the X direction is shown. For example, Figure 1A The two adjacent sub-pixels 10 shown can be the second color sub-pixel 102 and the first color sub-pixel 101, or they can be the third color sub-pixel 103 and the second color sub-pixel 102.

[0224] For example, such as Figures 1A to 3 , Figure 6 , Figure 7 as well as Figures 10A to 10B As shown, when there is no groove 210 between two adjacent sub-pixels arranged along the X direction, such as the first color sub-pixel 101 and the second color sub-pixel 102, the charge generation layer 133 of these two sub-pixels will be connected along path PA1. This path is relatively short, which can easily cause crosstalk between the two sub-pixels. When a groove 210 and a blocking part 300 are provided between the first color sub-pixel 101 and the second color sub-pixel 102 to disconnect the charge generation layer 133 in the X direction, the charge generation layer 133 of these two sub-pixels will be connected along path PA2. The path PA2 is longer than path PA1 (for example, path P2 can be 0.5 times longer than path P1), which increases the resistance of the charge generation layer 133 at the interval between the two sub-pixels, which helps to reduce the risk of crosstalk between adjacent sub-pixels.

[0225] For example, such as Figures 1A to 3 , Figure 6 , Figure 7 as well as Figures 10A to 10B As shown, the shape of the light-emitting area of ​​at least some sub-pixels includes rectangles, and the shape of at least some grooves 210 is elongated, with the extension direction (X direction or Z direction) of the elongated shape parallel to the extension direction of the rectangular side of the light-emitting area of ​​the adjacent sub-pixel. The blocking portion 300 is located on both sides of the groove 210 perpendicular to its extension direction. For example, the groove 210 located in two adjacent sub-pixels 10 arranged along the X direction can extend along the Z direction, and the groove 210 located in two adjacent sub-pixels 10 arranged along the Z direction can extend along the X direction.

[0226] For example, such as Figures 1A to 3 , Figure 6 , Figure 7 as well as Figures 10A to 10B As shown, the groove 210 can be set around the sub-pixel 10, and there is a break at the corner of the light-emitting area of ​​the sub-pixel 10. For example, the distance between the light-emitting areas of two adjacent sub-pixels arranged along the X or Z direction is smaller than the distance between the light-emitting areas of two adjacent sub-pixels arranged along the U or V direction. Therefore, the groove 210 can be set between the light-emitting areas of two adjacent sub-pixels arranged along the X or Z direction, and the groove 210 is not set between two adjacent sub-pixels arranged along the U or V direction to ensure the connection of the second electrode of each sub-pixel, reduce the resistance of the second electrode and reduce the loss.

[0227] For example, such as Figures 1A to 3 , Figure 6 , Figure 7 as well as Figures 10A to 10B As shown, the number of grooves 210 surrounding the light-emitting area of ​​a sub-pixel can be four, with the four grooves 210 being parallel to the four sides of the light-emitting area.

[0228] For example, such as Figures 10A to 10B As shown, the apex of the light-emitting area of ​​the third color sub-pixel 103 includes a first corner C1 and a second corner C2 arranged opposite to each other. The distance from the intersection of the extensions of the two sides constituting the first corner C1 or the tangents of the two sides to the center of the sub-pixel is greater than the distance from the intersection of the two sides constituting the second corner C2 or their extensions or the tangents of the two sides to the center of the sub-pixel. The third sub-pixel 103 includes a first type sub-pixel and a second type sub-pixel. In the different types of sub-pixels, the direction from the vertex of the first corner C1 to the vertex of the second corner C2 is different. In the first type sub-pixel and the second type sub-pixel, the direction from the vertex of the first corner C1 to the vertex of the second corner C2 is a first pointing direction and a second pointing direction, respectively, and the first pointing direction and the second pointing direction are opposite. For example, the first pointing direction can be the direction pointed to by the arrow in the U direction, and the second pointing direction can be the opposite direction pointed to by the arrow in the U direction. The first pointing direction and the second pointing direction can be interchanged. For example, the first pointing direction can also be the direction pointed to by the arrow in the V direction, and the second pointing direction can also be the opposite direction pointed to by the arrow in the V direction. The first pointing direction and the second pointing direction can be interchanged.

[0229] For example, such as Figures 10A to 10B As shown, the first corner C1 of the light-emitting area of ​​the third color sub-pixel 103 can be a rounded chamfer. The distance between the first corner C1 of the light-emitting area of ​​the third color sub-pixel 103 and the apex corner of the light-emitting area of ​​the first color sub-pixel 101 opposite to the first corner C1 is the first corner spacing CD1. The distance between the second corner C2 of the light-emitting area of ​​the third color sub-pixel 103 and the apex corner of the light-emitting area of ​​the first color sub-pixel 101 opposite to the second corner C2 is the second corner spacing CD2. The first corner spacing CD1 is greater than the second corner spacing CD2. Therefore, the spacer 012 can be set at the position corresponding to the first corner spacing.

[0230] For example, such as Figures 10A to 10BAs shown, the shape of the groove 210 near the spacer 012 can be different from the shape of the groove 210 at other locations. For example, the planar shape of the groove 210 between the second color sub-pixels 102 on both sides of the spacer 012 and the spacer 012 can be arc-shaped and surround the apex of the light-emitting area of ​​the corresponding second color sub-pixel 102. For example, the groove 210 between a second color sub-pixel 102 and its adjacent first color sub-pixel 101 is a first sub-groove, and the groove 210 between this second color sub-pixel 102 and its adjacent third color sub-pixel 103 is a second sub-groove. The first sub-groove and the second sub-groove can be integrated into a curved groove 210, which is located between the spacer 012 and the second color sub-pixel 102 and is curved toward the second color sub-pixel 102.

[0231] The aforementioned rounded chamfer can refer to the apex corner formed by a curve. This curve can be an arc or an irregular curve, such as a curve truncated from an ellipse, a wavy line, etc. The embodiments of this disclosure schematically show that the curve has a shape that convexes outward relative to the center of the sub-pixel, but it is not limited to this; the curve can also have a shape that is concave inward relative to the center of the sub-pixel. For example, when the curve is an arc, the central angle of the arc can range from 10° to 150°. For example, the central angle of the arc can range from 60° to 120°. For example, the central angle of the arc can range from 90°. For example, the curve length of the rounded chamfer included in the first corner portion 111 can be 10 to 60 micrometers.

[0232] For example, such as Figure 10A and Figure 10B As shown, a plurality of blocking portions 300 are provided between adjacent sub-pixels, arranged along the arrangement direction of the two adjacent sub-pixels and spaced apart. A groove 210 is provided between two adjacent blocking portions 300, and the two blocking portions 300 located on both sides of the edge of the groove 210 protrude into the groove 210.

[0233] For example, such as Figure 10A and Figure 10B As shown, the spacing between the light-emitting areas of adjacent first color sub-pixels 101 and second color sub-pixels 102 arranged along the Z direction is small. The groove 210 between the two light-emitting areas extends along the X direction. The blocking portion 300 can be located on both sides of the groove 210 along the Z direction and protrude into the groove 210 to form a protrusion (the edge of the blocking portion 300 and the edge of the groove 210 together form an undercut structure). Thus, the charge generation layer of the first color sub-pixel 101 and the second color sub-pixel 102 will be broken at the protrusion position to prevent crosstalk between the two sub-pixels.

[0234] For example, such as Figure 10Aand Figure 10B As shown, the groove 210 between adjacent first color sub-pixels 101 and second color sub-pixels 102 arranged along the Z direction extends along the X direction. The blocking part 300 can be located on both sides of the groove 210 along the Z direction. The blocking part can be not provided on both sides of the groove 210 along the X direction so that the light-emitting functional layer and the second electrode passing through the groove 210 in the X direction will not be broken, thereby ensuring the connectivity of the second electrode in the X direction and reducing the resistance of the second electrode.

[0235] For example, such as Figure 10A and Figure 10B As shown, since the distance between the light-emitting areas of two adjacent sub-pixels arranged along at least one of the U and V directions is greater than the distance between the light-emitting areas of two adjacent sub-pixels arranged along the X (or Y) direction, it is not necessary to provide grooves and blocking parts between the light-emitting areas of two adjacent sub-pixels arranged along at least one of the U and V directions.

[0236] For example, such as Figures 10C to 10E As shown, at least one sub-pixel is surrounded by a discontinuous groove 210. For example, as... Figures 10C to 10E As shown, each sub-pixel is surrounded by a discontinuous groove 210. Figure 10A , Figures 10C to 10E Only the groove 210 is shown; the obstructed parts in each figure can be illustrated as follows. Figure 10B The positional relationship between the shielding part 300 and the groove 210 is set as shown.

[0237] For example, such as Figure 10C As shown, in two adjacent sub-pixels arranged along the X or Z direction, the apex corner of the light-emitting area of ​​one sub-pixel is surrounded by a groove 210, and the edge of the light-emitting area of ​​the other sub-pixel is surrounded by a groove 210. For example, in the first color sub-pixel 101 and the second color sub-pixel 102 arranged along the X or Z direction, the apex corner of the light-emitting area of ​​the second color sub-pixel 102 is surrounded by a groove 210, and the edge of the light-emitting area of ​​the first color sub-pixel 101 is surrounded by a groove 210. For example, in the third color sub-pixel 103 and the second color sub-pixel 102 arranged along the X or Z direction, the apex corner of the light-emitting area of ​​the second color sub-pixel 102 is surrounded by a groove 210, and the edge of the light-emitting area of ​​the third color sub-pixel 103 is surrounded by a groove 210. In an example of an embodiment of this disclosure, in a display substrate, by setting a groove corresponding to the edge of one light-emitting area and a groove corresponding to the apex corner of one light-emitting area in two adjacent sub-pixels arranged along the X or Z direction, the shortest interval (with) between the two light-emitting areas can be minimized. Figure 10A The charge generation layer within the path PA1 shown can be broken, and a longer interval (with) between the two luminescent regions can also be created. Figure 10AThe charge generation layer within the path PA2 shown is broken.

[0238] For example, such as Figure 10C As shown, the groove 210 at the edge of the light-emitting area of ​​the second color sub-pixel 102 located on both sides of the spacer 012 can be a continuously curved groove 210 surrounding the three apex corners and two edges of the light-emitting area of ​​the second color sub-pixel 102.

[0239] For example, Figure 10D The display substrate shown is Figure 10C The difference in the display substrate shown is that the edge of the light-emitting area of ​​the second color sub-pixel 102 is surrounded by a groove 210, and the top corners of the light-emitting areas of the first color sub-pixel 101 and the third color sub-pixel 103 are surrounded by a groove 210.

[0240] For example, Figure 10E The display substrate shown is Figure 10C The difference in the display substrate shown is that, along at least one of the U and V directions, a groove 210 is added at the interval between adjacent first color sub-pixels 101 and third color sub-pixels 103, thereby minimizing the breakup of the charge generation layers of adjacent sub-pixels arranged in different directions under the combined action of the groove 210 and the blocking portion. For example, grooves 210 are added at the interval between adjacent first color sub-pixels 101 and third color sub-pixels 103 along both the U and V directions.

[0241] Another embodiment of this disclosure provides a display device, including... Figures 1A to 10E The display substrate shown, by providing grooves and shielding portions protruding into the grooves between adjacent sub-pixels in the display device, can cause the charge generation layer of the light-emitting functional layer to be disconnected at the protrusion of the shielding portion relative to the edge of the groove, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0242] For example, the display device also includes a cover plate located on the light-emitting side of the display panel.

[0243] For example, the display device can be an organic light-emitting diode display device or other display device, as well as any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator that includes the display device. This embodiment is not limited to this.

[0244] Figure 11A This is a partial cross-sectional structural diagram of a display substrate provided according to an example of another embodiment of the present disclosure. Figure 11B This is a partial cross-sectional structural diagram of a display substrate provided according to another example of another embodiment of the present disclosure. Figure 11A The display substrate shown can be used with Figure 1CThe display substrate shown has the same first display area A1 and second display area A2. For example... Figure 11A and Figure 11B As shown, the display substrate includes a substrate 01 and a plurality of sub-pixels 10 disposed on a first display area A1 on the substrate 01. Each sub-pixel 10 includes an organic light-emitting element 100, which includes a light-emitting functional layer 130 and a first electrode 110 and a second electrode 120 located on both sides of the light-emitting functional layer 130 along a direction perpendicular to the substrate 01. The first electrode 110 is located between the light-emitting functional layer 130 and the substrate 01. The light-emitting functional layer 130 includes a plurality of film layers, for example, a charge-generating layer 133.

[0245] like Figure 11A As shown, the display substrate also includes multiple isolation structures 600. At least one isolation structure 600 is disposed between adjacent sub-pixels 10. Each isolation structure 600 includes a first sub-isolation structure 610 and a second sub-isolation structure 620 stacked together. The first sub-isolation structure 610 is located on the side of the second sub-isolation structure 620 facing the substrate 01. Along the arrangement direction of the adjacent sub-pixels 10, the size of the first sub-isolation structure 610 in the isolation structure 600 between the adjacent sub-pixels 10 is smaller than the size of the second sub-isolation structure 620, such that the second sub-isolation structure 620 includes a portion protruding relative to the edge of the first sub-isolation structure 610. For example, the material of the first sub-isolation structure 610 and the second sub-isolation structure 620 both include the same element, or the material of the first sub-isolation structure 610 and the second sub-isolation structure 620 both include metals. For example, the material of the first sub-isolation structure 610 includes inorganic non-metallic materials, metallic materials, or metal oxides, and the material of the second sub-isolation structure 620 includes organic materials.

[0246] like Figure 11BAs shown, at least a portion of the side surface of the first sub-isolation structure 610 has a slope angle greater than 60 degrees and less than 120 degrees with the plane parallel to the contact surface of the first sub-isolation structure 610 and the second sub-isolation structure 620, and / or, at least a portion of the side surface of the second sub-isolation structure 620 has a slope angle greater than 60 degrees and less than 120 degrees with the plane parallel to the contact surface of the first sub-isolation structure 610 and the second sub-isolation structure 620. For example, at least a portion of the side surface of the first sub-isolation structure 610 has a slope angle greater than 70 degrees and less than 110 degrees with the plane parallel to the contact surface of the first sub-isolation structure 610 and the second sub-isolation structure 620, and / or, at least a portion of the side surface of the second sub-isolation structure 620 has a slope angle greater than 70 degrees and less than 110 degrees with the plane parallel to the contact surface of the first sub-isolation structure 610 and the second sub-isolation structure 620. For example, at least a portion of the side surface of the first sub-isolation structure 610 has a slope angle greater than 80 degrees and less than 100 degrees with a plane parallel to the contact surface of the first sub-isolation structure 610 and the second sub-isolation structure 620, and / or, at least a portion of the side surface of the second sub-isolation structure 620 has a slope angle greater than 80 degrees and less than 100 degrees with a plane parallel to the contact surface of the first sub-isolation structure 610 and the second sub-isolation structure 620.

[0247] The slope angle between at least a portion of the side surface of the first sub-isolation structure and the plane parallel to the contact surface of the first and second sub-isolation structures can be the angle between the surface of the first sub-isolation structure away from the substrate and the side surface of the first sub-isolation structure, or the angle between the surface of the first sub-isolation structure facing the substrate and the side surface of the first sub-isolation structure. Similarly, the slope angle between at least a portion of the side surface of the second sub-isolation structure and the plane parallel to the contact surface of the first and second sub-isolation structures can be the angle between the surface of the second sub-isolation structure away from the substrate and the side surface of the second sub-isolation structure, or the angle between the surface of the second sub-isolation structure facing the substrate and the side surface of the second sub-isolation structure. The side surface of the first sub-isolation structure can refer to the surface of the first sub-isolation structure with a certain angle to the substrate, and the side surface of the second sub-isolation structure can refer to the surface of the second sub-isolation structure with a certain angle to the substrate.

[0248] Figure 11A and Figure 11B The difference in the example shown lies in the positional and angular relationship between the first sub-isolation structure 610 and the second sub-isolation structure 620.

[0249] like Figure 11A and Figure 11BAs shown, at least one of the plurality of film layers included in the light-emitting functional layer 130 is disconnected at the isolation structure 600. For example, the light-emitting functional layer 130 includes a charge-generating layer 133, which is disconnected at the edge of the isolation structure 600.

[0250] This embodiment of the present disclosure provides an isolation structure between adjacent sub-pixels in a display substrate. By adjusting the relative positional relationship between the first and second sub-isolation structures, or the angles of the side surfaces of the first and second sub-isolation structures, at least one layer of the light-emitting functional layer can be disconnected at a protrusion of the second sub-isolation structure relative to the edge of the first sub-isolation structure, or disconnected at the edge of the isolation structure. This helps reduce the probability of crosstalk between adjacent sub-pixels. Furthermore, by providing an isolation structure between adjacent sub-pixels in the display substrate, this embodiment of the present disclosure allows the charge generation layer to be disconnected at the edge of the isolation structure, further reducing the probability of crosstalk between adjacent sub-pixels.

[0251] In this embodiment, the substrate 01 and the organic light-emitting element 100 can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here.

[0252] For example, the materials of the first sub-isolation structure 610 and the second sub-isolation structure 620 are different.

[0253] For example, the material of the first sub-isolation structure 610 includes inorganic non-metallic materials or metallic materials, and the material of the second sub-isolation structure 620 includes organic materials.

[0254] For example, such as Figure 11A As shown, the plurality of sub-pixels 10 may include two adjacent sub-pixels 10 arranged along the X direction. For example, a plurality of occluding portions 300 provided in the two adjacent sub-pixels 10 are arranged along the X direction. For example, at least one edge of the second sub-isolation structure 620 provided between the two adjacent sub-pixels 10 protrudes relative to the edge of the first sub-isolation structure 610 in the X direction to form an isolation protrusion 601. The isolation protrusion 601 in the second sub-isolation structure 620 is suspended so that the charge generation layer 133 of the sub-pixel 10 is broken near the at least one edge. For example, the isolation protrusion 601 extends in a direction parallel to the substrate 01. For example, the orthographic projection of the isolation protrusion 601 on the substrate 01 does not overlap with the orthographic projection of the first sub-isolation structure 610 on the substrate 01.

[0255] For example, the first light-emitting layer 131 (second light-emitting layer 132) of adjacent sub-pixels can overlap on the isolation structure 600. However, it is not limited to this. For example, the first light-emitting layer 131 (second light-emitting layer 132) of adjacent sub-pixels can be spaced apart on the isolation structure 600; or, the isolation structure 600 can only have the first light-emitting layer 131 (second light-emitting layer 132) of one of the adjacent sub-pixels.

[0256] For example, a portion of the light-emitting functional layer 130 and the second electrode 120 may be disposed on the isolation structure 600. Alternatively, all of the light-emitting functional layer 130 and the second electrode 120 may be disposed on the isolation structure 600.

[0257] For example, the first orthographic projection of at least one of the light-emitting functional layers 130 on the substrate 01 is continuous, and the second orthographic projection on the plane perpendicular to the substrate 01 is discontinuous; or, the first orthographic projection of at least one of the light-emitting functional layers 130 on the substrate 01 and the second orthographic projection on the plane perpendicular to the substrate 01 are both discontinuous, and the width of the interval at the discontinuous position in the first orthographic projection is smaller than the width of the interval at the discontinuous position in the second orthographic projection.

[0258] For example, at least one of the light-emitting functional layers 130 may be a charge-generating layer 133. The first orthographic projection of the charge-generating layer 133 on the substrate 01 is continuous, while its second orthographic projection on a plane perpendicular to the substrate 01 is discontinuous. For example, the charge-generating layer 133 may include a portion located within the groove 210 and a portion not located within the groove 210, with these two portions discontinuous at the edge of the groove 210. For example, the first orthographic projections of these two portions on the substrate 01 may be adjacent or overlapping, and the first orthographic projection is continuous. For example, if the distances between these two portions and the substrate 01 are different, then the second orthographic projections of these two portions on the XY plane are discontinuous.

[0259] For example, at least one of the light-emitting functional layers 130 may be a charge-generating layer 133. The first orthographic projection of the charge-generating layer 133 on the substrate 01 and its second orthographic projection on a plane perpendicular to the substrate 01 are both discontinuous, and the width of the gap at the discontinuous position in the first orthographic projection is smaller than the width of the gap at the discontinuous position in the second orthographic projection. For example, the charge-generating layer 133 may include a portion located on the isolation structure 600 and a portion not located on the isolation structure 600, with these two portions separated at the edge of the isolation structure 600. For example, a gap may be provided between the first orthographic projections of these two portions on the substrate 01, and the first orthographic projection is discontinuous. For example, if the distances between these two portions and the substrate 01 are different, then the second orthographic projections of these two portions on the XY plane are discontinuous, and a gap may be provided between the second orthographic projections of the two portions on the XY plane.

[0260] For example, at least a portion of the film layer of the charge generation layer 133 in the light-emitting functional layer 130 facing the substrate 01 is disconnected at the isolation structure 600. For example, all the film layers of the charge generation layer 133 in the light-emitting functional layer 130 facing the substrate 01 are disconnected at the isolation structure 600.

[0261] For example, the color of the light emitted by the first light-emitting layer 131 is the same as the color of the light emitted by the second light-emitting layer 132.

[0262] For example, the light-emitting functional layer 130 includes a light-emitting layer (a first light-emitting layer or a second light-emitting layer), and the area of ​​the orthogonal projection of at least one broken film layer in the light-emitting functional layer 130 onto the substrate 01 is greater than the area of ​​the orthogonal projection of the light-emitting layer (the first light-emitting layer or the second light-emitting layer) onto the substrate 01. For example, the broken film layer can be a common layer, and the light-emitting layer can be a patterned film layer formed by a fine metal mask.

[0263] For example, the light-emitting functional layer 130 includes at least one light-emitting layer (a first light-emitting layer or a second light-emitting layer), and the film layers in the light-emitting functional layer 130 that are broken at the isolation structure 600 include at least one light-emitting layer and at least one other film layer. For example, the area of ​​the orthographic projection of the broken at least one other film layer on the substrate 01 is larger than the area of ​​the orthographic projection of the broken at least one light-emitting layer on the substrate 01. For example, the area of ​​the portion of the isolation structure 600 covered by the broken at least one other film layer is larger than the area of ​​the portion of the isolation structure covered by the broken at least one light-emitting layer. For example, the broken at least one other film layer completely covers the isolation structure 600, and the at least one light-emitting layer only covers a portion of the isolation structure 600.

[0264] For example, at least one of the multiple film layers included in the light-emitting functional layer 130 and the projection of the second electrode 120 onto the substrate 01 of the isolation structure 600 overlap.

[0265] For example, at least a portion of at least one of the multiple film layers included in the light-emitting functional layer 130 covers a portion of the side surface of the isolation structure 600. For example, the aforementioned film layer may cover the side surface of the first sub-isolation structure 610, and / or, cover the side surface of the second sub-isolation structure 620.

[0266] For example, such as Figure 11AAs shown, two isolation structures 600 can be provided between adjacent sub-pixels 10. In each isolation structure 600, at least one edge of the second sub-isolation structure 620 protrudes relative to the edge of the first sub-isolation structure 610 in the X direction. For example, two isolation structures 600 can be provided between adjacent sub-pixels 10, with both edges of the second sub-isolation structure 620 in both isolation structures 600 protruding relative to the edge of the first sub-isolation structure 610 in the X direction; or, both edges of the second sub-isolation structure 620 in one isolation structure 600 protruding relative to the edge of the first sub-isolation structure 610 in the X direction, and one edge of the second sub-isolation structure 620 in the other isolation structure 600 protruding relative to the edge of the first sub-isolation structure 610 in the X direction; or, only one edge of the second sub-isolation structure 620 in both isolation structures 600 protruding relative to the edge of the first sub-isolation structure 610 in the X direction. This embodiment of the present disclosure is not limited to this, and can be set according to actual product requirements. This embodiment of the present disclosure is not limited to providing two isolation structures between adjacent sub-pixels, but can also provide one isolation structure or three or more isolation structures.

[0267] For example, when there is no isolation structure 600 between two adjacent sub-pixels 10, the charge generation layer 133 in the light-emitting functional layer 130 of the two adjacent sub-pixels 10 may be connected or be a single film layer. Since the charge generation layer 133 has high conductivity, for display devices with high resolution, the high conductivity of the charge generation layer 133 can easily cause crosstalk between adjacent sub-pixels 10.

[0268] In the display substrate provided in this embodiment, by setting an isolation structure between two adjacent sub-pixels, at least one layer of the light-emitting functional layer (such as a charge generation layer) formed at the edge of the isolation structure can be disconnected. At this time, the at least one layer of the light-emitting functional layer of the two adjacent sub-pixels is spaced apart, which can increase the resistance of the light-emitting functional layer between the adjacent sub-pixels. This reduces the probability of crosstalk between the two adjacent sub-pixels without affecting the normal display of the sub-pixels.

[0269] For example, such as Figure 11A As shown, the distance between the side surface of the isolation structure 600 facing the substrate 01 and the substrate 01 is less than the distance between the side surface of the first electrode 110 facing the substrate 01 and the substrate 01.

[0270] For example, such as Figure 11A As shown, an organic layer 500 is disposed between the first electrode 110 and the substrate 01, and the surface of the first electrode 110 is in contact with the surface of the organic layer 500.

[0271] For example, such as Figure 11AAs shown, the material of the first sub-isolation structure 610 includes inorganic metal materials or metal materials, and the material of the second sub-isolation structure 620 includes organic materials.

[0272] For example, the material of the first sub-isolation structure 610 can be one or a combination of silicon oxide and silicon nitride. However, it is not limited to this; the material of the first sub-isolation structure 610 can also be a metal or a metal oxide.

[0273] For example, along a direction perpendicular to the substrate 01, the thickness of the first sub-isolation structure 610 can be greater than the thickness of the light-emitting functional layer 130, so that both the light-emitting functional layer 130 and the second electrode 120 are disconnected at the portion of the second sub-isolation structure 620 that protrudes from the edge of the first sub-isolation structure 610, i.e., the isolation protrusion 601.

[0274] For example, the second sub-isolation structure 620 can be made of photosensitive polyimide.

[0275] For example, the second sub-isolation structure 620 is made of the same material as the organic layer 500. For example, the organic layer 500 can be... Figures 1A to 9B The organic layer 500 shown uses the same material, which will not be described again here.

[0276] For example, the second sub-isolation structure 620 and the organic layer 500 can be formed in the same patterning process.

[0277] For example, such as Figure 11A As shown, the second sub-isolation structure 620 includes a central region distributed along the arrangement direction of two adjacent sub-pixels 10 and edge regions located on both sides of the central region. Along the direction perpendicular to the substrate 01, the thickness of the central region of the second sub-isolation structure 620 is greater than the thickness of the edge regions.

[0278] For example, such as Figure 11A As shown, the second sub-isolation structure 620 includes a central region CR and an edge region ER surrounding the central region CR. Along a direction perpendicular to the substrate 01, the thickness of the central region CR of the second sub-isolation structure 620 is greater than the thickness of the edge region ER. The thickness of the central region can refer to the average thickness of the second sub-isolation structure within the central region, or it can refer to the maximum thickness of the second sub-isolation structure within the central region. Similarly, the thickness of the edge region can refer to the average thickness of the second sub-isolation structure within the edge region, or it can refer to the maximum thickness of the second sub-isolation structure within the edge region. For example, the average thickness of the second sub-isolation structure within the central region is greater than the average thickness of the second sub-isolation structure within the edge region, or the maximum thickness of the second sub-isolation structure within the central region is greater than the maximum thickness of the second sub-isolation structure within the edge region.

[0279] For example, the thickness of the second sub-isolation structure 620 can gradually decrease from the center of the second sub-isolation structure 620 toward the edge.

[0280] For example, the surface of the second sub-isolation structure 620 away from the substrate 01 is smoothly transitioned. For example, the second sub-isolation structure 620 includes an upper surface and a side surface, both of which are continuous and smooth surfaces.

[0281] For example, such as Figure 11A and Figure 11B As shown, the slope angle of the portion of the second sub-isolation structure 620 that protrudes from the edge of the first sub-isolation structure 610 away from the surface of the first sub-isolation structure 610 is smaller than the slope angle of at least a portion of the side surface of the second sub-isolation structure 620 with the plane parallel to the contact surface of the first sub-isolation structure 610 and the second sub-isolation structure 620.

[0282] For example, the side of the first sub-isolation structure 610 can be curved or straight. For example, the side of the first sub-isolation structure 610 can be curved towards the center of the first sub-isolation structure 610. For example, the angle between the side of the first sub-isolation structure 610 and the surface away from the substrate 01 can be 60 degrees to 90 degrees. For example, the angle between the side of the first sub-isolation structure 610 and the surface near the substrate 01 can be 60 degrees to 90 degrees. The angle between the curved edge and a surface can refer to the angle between the tangent at the intersection of the curved edge and the surface and the surface. However, it is not limited to this; it can also be the angle between the tangent at the midpoint of the curved edge and the surface. For example, the angle between the side of the second sub-isolation structure 620 and the surface near the substrate 01 can be 15 to 70 degrees.

[0283] For example, such as Figure 11A As shown, the organic layer 500 includes a plurality of organic layer openings 510, and the isolation structure 600 is located within the organic layer openings 510. This embodiment of the present disclosure, by providing organic layer openings in the organic layer and an isolation structure within the organic layer openings, ensures that the charge generation layers of adjacent sub-pixels are disconnected at the isolation protrusions of the isolation structure, thereby reducing the probability of crosstalk between adjacent sub-pixels.

[0284] For example, the isolation structure 600 is spaced apart from the sidewall of the organic layer opening 510. For example, there is a gap between the isolation structure 600 and the pixel defining portion, for example, the gap can be 2 micrometers or more, the width of the isolation structure 600 can be 3 μm or more, the width of the pixel defining portions on both sides is 4 μm or more, and the thickness of the isolation structure 600 is less than the thickness of the pixel defining portion.

[0285] For example, a certain gap is provided between the isolation structure 600 and the organic layer 500. For example, the minimum size of the gap between the isolation structure 600 and the organic layer 500 is not less than 2 micrometers.

[0286] For example, when an isolation structure 600 is provided in an organic layer opening 510, the isolation structure 600 can be located in the middle of the organic layer opening 510. For example, when multiple isolation structures 600 are provided in an organic layer opening 510, the multiple isolation structures 600 can be evenly distributed. For example, an isolation structure 600 can be provided between adjacent sub-pixels, the isolation structure 600 being close to one of the adjacent sub-pixels, and at least a portion of the light-emitting layer in the sub-pixel closer to the isolation structure 600 is located on the isolation structure 600, while the light-emitting layer in the sub-pixel farther from the isolation structure 600 may not be located on the isolation structure 600.

[0287] For example, such as Figure 11A As shown, along the X direction, the maximum size of the isolation structure 600 can be no less than 3 micrometers.

[0288] For example, such as Figure 11A As shown, along the direction perpendicular to the substrate 01, the thickness of the first sub-isolation structure 610 can be less than the thickness of the organic layer 500. For example, the ratio of the thickness of the first sub-isolation structure 610 to the thickness of the organic layer 500 can be 0.1 to 0.9. For example, the ratio of the thickness of the first sub-isolation structure 610 to the thickness of the organic layer 500 can be 0.2 to 0.8. For example, the ratio of the thickness of the first sub-isolation structure 610 to the thickness of the organic layer 500 can be 0.3 to 0.7. For example, the ratio of the thickness of the first sub-isolation structure 610 to the thickness of the organic layer 500 can be 0.4 to 0.6. For example, the ratio of the thickness of the first sub-isolation structure 610 to the thickness of the organic layer 500 can be 0.5.

[0289] For example, such as Figure 11A As shown, along the direction perpendicular to the substrate 01, the ratio of the thickness of the isolation structure 600 to the thickness of the organic layer 500 can be 0.8 to 1.2. For example, the ratio can be 0.9 to 1.1. Alternatively, the thicknesses of the isolation structure 600 and the organic layer 500 can be equal. However, this disclosure is not limited to these embodiments; for example, the thickness of the isolation structure 600 can be greater than the thickness of the organic layer 500.

[0290] For example, such as Figure 11A As shown, the pixel-defining pattern 400 is located on the side of the organic layer 500 away from the substrate 01. For example, the first opening 410 in the pixel-defining pattern 400 can be connected to... Figures 1A to 9B The first opening 410 shown has the same features, which will not be described again here.

[0291] For example, such as Figure 11A As shown, the pixel-defined pattern 400 also includes a plurality of second openings 420, which are configured to expose the isolation structure 600, and a gap is provided between the isolation structure 600 and the pixel-defined portion 401 of the pixel-defined pattern 400.

[0292] For example, the second opening 420 is configured to expose at least a portion of the organic layer opening 510 and the isolation structure 600. For example, the orthographic projection of the second opening 420 of the pixel defining pattern 400 onto the substrate 01 may coincide with the orthographic projection of the organic layer opening 510 of the organic layer 500 onto the substrate 01. For example, the second opening 420 may completely expose the organic layer opening 510.

[0293] For example, such as Figure 11A As shown, the first conductive layer pattern 015 in the display substrate includes a first power signal line and a data line, the second conductive layer pattern 016 includes a second power signal line, and the second sub-isolation structure 620 is disposed in the same layer as the second conductive layer pattern 016. In other film layers 011 of this embodiment, the first conductive layer pattern 015 and the second conductive layer pattern 016 can be... Figure 3 , Figures 5A to 5D The first conductive layer pattern 015 and the second conductive layer pattern 016 shown have the same characteristics, which will not be described again here.

[0294] For example, the shape of the orthographic projection of the isolation structure 600 onto the substrate 01 can be similar to... Figures 10A to 10E The groove 210 shown has the same shape as its orthographic projection on the substrate 01. For example, the extension direction of the orthographic projection of the isolation structure 600 on the substrate 01 may be different from the extension direction of at least one of the first power signal line, the data line, and the second power signal line.

[0295] For example, such as Figure 11A As shown, the surface of the second sub-isolation structure 620 away from the substrate 01 is a curved surface, and the curved surface bends toward the first sub-isolation structure 610. For example, the first sub-isolation structure 610 and the second sub-isolation structure 620 form a "mushroom-shaped" isolation structure. For example, when the second sub-isolation structure 620 using organic materials is formed through processes such as exposure and development, the surface of the second sub-isolation structure 620 away from the substrate 01 is a curved surface.

[0296] For example, the first sub-isolation structure 610 includes at least one film layer, the first electrode 110 includes at least one electrode layer, and the film layer of the first sub-isolation structure 610 and the electrode layer of the first electrode 110 are disposed in the same layer.

[0297] For example, Figure 12This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 12 The display substrate in the example shown is Figure 11A The difference in the display substrate shown is that Figure 12 The thickness of the first sub-isolation structure 610 in the display substrate shown is relatively small. For example, the ratio of the thickness of the first sub-isolation structure 610 to the thickness of the light-emitting functional layer 130 is 0.7 to 1.5. Figure 12 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here. Figure 12 The materials of the first sub-isolation structure 610 and the second sub-isolation structure 620 in the isolation structure 600 of the display substrate shown can be compatible with... Figure 11A The first sub-isolation structure 610 and the second sub-isolation structure 620 of the isolation structure 600 shown are made of the same material, which will not be described again here. Figure 12 The flattened layer 500 and pixel-defined pattern 400 shown can be combined with Figure 11A The flat layer 500 and the pixel-defined pattern 400 shown have the same characteristics, which will not be described again here.

[0298] For example, such as Figure 12 As shown, for example, the thickness ratio of the first sub-isolation structure 610 to the thickness of the light-emitting functional layer 130 is 0.8 to 1.3. The thickness ratio of the first sub-isolation structure 610 to the thickness of the light-emitting functional layer 130 is 0.9 to 1.1. For example, the thickness ratio of the first sub-isolation structure 610 to the thickness of the light-emitting functional layer 130 is 1. In one embodiment of this disclosure, by setting the thickness of the first sub-isolation structure and the light-emitting functional layer to be roughly equal, it is possible to ensure that the charge generation layer is disconnected at the edge of the isolation structure while minimizing the disconnection of the second electrode at the edge of the isolation structure, thereby giving the second electrode better electrical characteristics and improving the brightness uniformity of the display substrate.

[0299] For example, the thickness of the first sub-isolation structure 610 can be 100 to 10,000 angstroms. For example, the thickness of the first sub-isolation structure 610 can be 200 to 5,000 angstroms. For example, the thickness of the first sub-isolation structure 610 can be 300 to 1,500 angstroms.

[0300] For example, such as Figure 12As shown, at least one edge of the first sub-isolation structure 610 in the X direction is recessed by more than 0.1 micrometers relative to the corresponding edge of the second sub-isolation structure 620 to form an undercut structure. For example, the dimension of the isolation protrusion 601 in the X direction may be not less than 0.1 micrometers. For example, the dimension of the isolation protrusion 601 in the X direction may be not less than 0.2 micrometers.

[0301] For example, such as Figure 12 As shown, the thickness of the second sub-isolation structure 620 can be 0.5 to 3 micrometers. For example, the thickness of the second sub-isolation structure 620 can be 0.8 to 1.6 micrometers. For example, the thickness of the second sub-isolation structure 620 can be 1 to 1.2 micrometers.

[0302] For example, such as Figure 12 As shown, the slope angle of the surface of the second sub-isolation structure 620 protruding from the edge of the first sub-isolation structure 610 relative to the edge of the first sub-isolation structure 610 can be 15 to 70 degrees. For example, the slope angle of the edge of the curved surface of the isolation protrusion 601 of the second sub-isolation structure 620 can be 15 to 70 degrees. For example, the slope angle of the edge of the curved surface of the isolation protrusion 601 of the second sub-isolation structure 620 is 20 to 60 degrees. For example, the slope angle of the edge of the curved surface of the isolation protrusion 601 of the second sub-isolation structure 620 is 30 to 45 degrees. The shape of the curved surface intercepted by the XY plane is a curve, and the slope angle of the curved surface of the isolation protrusion 601 can refer to the angle between the tangent at the endpoint of the curve and a straight line parallel to the X direction, or the angle between the tangent at the midpoint of the curve of the isolation protrusion 601 and a straight line parallel to the X direction. Setting the slope angle of the curved surface of the isolation protrusion of the second sub-isolation structure to be small helps to reduce the probability of the second electrode breaking at the isolation protrusion.

[0303] The embodiments of this disclosure can, by setting the thickness of the first sub-isolation structure and the second sub-isolation structure, setting the size of the isolation protrusion of the second sub-isolation structure protruding from the edge of the first sub-isolation structure in the direction parallel to the substrate, and setting the slope angle of the curved surface of the second isolation structure, make it possible for part of the material of the light-emitting functional layer to fill the undercut structure. This ensures that the isolation structure, while disconnecting the charge generation layer, does not disconnect the second electrode as much as possible, thus guaranteeing that the second electrode has good electrical characteristics.

[0304] For example, Figures 13A to 13F To form Figure 11A A schematic diagram of the previous display substrate manufacturing process. For example, as shown... Figure 11A and Figure 13A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 11A and Figure 13A As shown, the process flow for forming other film layers 011 on the substrate 01 can be the same as... Figure 5A The process flow for forming other film layers 011 in the display substrate shown is the same, and can also be the same as... Figure 4A The process for forming other film layers 011 in the substrate shown is the same and will not be described again here.

[0305] For example, such as Figure 11A and Figure 13A As shown, a first sub-isolation structure layer is formed on other film layers 011, and the first sub-isolation structure layer is patterned to form a first sub-isolation structure pattern 6100. For example, the first sub-isolation structure layer can be dry-etched or wet-etched to form the first sub-isolation structure pattern 6100.

[0306] For example, such as Figure 11A and Figure 13B As shown, after forming the first sub-isolation structure pattern 6100, the second conductive layer pattern 016 can be patterned. For example, the material of the first sub-isolation structure pattern 6100 is different from the material of the second conductive layer pattern 016. For example, the material of the first sub-isolation structure pattern 6100 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride, and the material of the second conductive layer pattern 016 may include a metallic material. However, the embodiments of this disclosure are not limited to this. For example, the first sub-isolation structure pattern and the second conductive layer pattern may also be formed in the same patterning process, in which case the material of the first sub-isolation structure pattern may include a metallic material.

[0307] For example, such as Figure 11A and Figure 13C As shown, an organic material layer is formed on the first sub-isolation structure pattern 6100 and the second conductive layer pattern 016, and the organic material layer is patterned to form an organic layer opening 510 and a second sub-isolation structure 620 located on the first sub-isolation structure pattern 6100. For example, a photosensitive layer is formed on the first sub-isolation structure pattern 6100 and the second conductive layer pattern 016, and the organic material layer at positions other than the first sub-isolation structure pattern 6100 in the organic layer opening 510 is etched away after coating, exposure, and development.

[0308] For example, such as Figure 11A and Figure 13D As shown, a first electrode 110 is patterned and formed on the organic layer 500. The process for forming the first electrode 110 can be compared with... Figure 5B The process for forming the first electrode 110 shown is the same and will not be described again here.

[0309] For example, such as Figure 11A and Figure 13E As shown, the first sub-isolation structure pattern 6100 is wet-etched (the etching solution has little effect on the second sub-isolation structure 620) so that the edge of the first sub-isolation structure pattern 6100 is recessed relative to the edge of the second sub-isolation structure 620 to form an undercut structure. For example, the first sub-isolation structure 6100 and the isolation structure 600 are formed after wet etching of the first sub-isolation structure pattern 6100.

[0310] For example, such as Figure 11A and Figure 13E As shown, after forming the isolation structure 600, a pixel defining film is formed on the organic layer 500 and the isolation structure 600, and the pixel defining film is patterned to form a pixel defining pattern 400. The pixel defining pattern 400 includes a first opening 410 exposing the first electrode 110 and a second opening 420 exposing the isolation structure 600. For example, the material of the second sub-isolation structure 620 is different from the material of the pixel defining portion 401 in the pixel defining pattern 400 to prevent the second sub-isolation structure 620 from being affected during the patterning process of forming the second opening 420.

[0311] Figure 14 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 14 The display substrate in the example shown is Figure 12 The difference in the display substrate shown is that Figure 14 The first sub-isolation structure 610 and the second sub-isolation structure 620 in the display substrate shown are integrally formed. Figure 14 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here. Figure 14 The flattened layer 500 and pixel-defined pattern 400 shown can be combined with Figure 11A The flat layer 500 and the pixel-defined pattern 400 shown have the same characteristics, which will not be described again here.

[0312] For example, such as Figure 14 As shown, the material of the isolation structure 600 can be the same as the material of the planarization layer 500. Figure 14 The isolation structure 600 shown can be with Figures 11A-12 The isolation structures 600 in any example have the same size and quantity relationships, which will not be repeated here.

[0313] For example, Figure 14The diagram schematically shows a gap between the isolation structure 600 and the planarization layer 500, but it is not limited to this. The isolation structure 600 can also be an integral structure with the planarization layer 500, that is, the isolation structure 600 can be part of the planarization layer 500. The organic layer opening 510 included in the planarization layer 500 has two isolation structures 600 on each side in the X direction, which are used to disconnect the charge generation layer.

[0314] The first and second sub-isolation structures in the display substrate provided in this example are made of the same material, which can isolate the charge generation layer without increasing the number of masks or reducing production capacity during the fabrication of the isolation structure.

[0315] For example, Figures 15A to 15B To form Figure 14 A schematic diagram of the previous display substrate manufacturing process. For example, as shown... Figure 14 and Figure 15A The process flow and method for forming the substrate 01 and other film layers 011 in the display substrate shown can be compared with... Figure 4A The process flow and method for forming the substrate 01 and other film layers 011 in the display substrate shown are the same, and can also be the same as... Figure 5A The process flow and method for forming the substrate 01 and other film layers 011 in the display substrate are the same, and will not be described again here.

[0316] For example, such as Figure 14 and Figure 15A As shown, the method for fabricating a display substrate includes patterning a plurality of inorganic material patterns 601 on other film layers 011. For example, after forming the inorganic material patterns 601, an organic material layer is formed, and an organic layer opening 510 and an isolation structure pattern 6000 located within the organic layer opening 510 are patterned on the organic material layer. For example, as... Figure 15A As shown, along the X direction, at least one edge of each isolation structure pattern 6000 is covered with an inorganic material pattern 601. For example, along the X direction, both edges of each isolation structure pattern 6000 are covered with an inorganic material pattern 601.

[0317] For example, such as Figure 15A As shown, along the X direction, the edge of the inorganic material pattern 601 covered by the isolation structure pattern 6000 protrudes relative to the edge of the isolation structure pattern 6000 covering it, or the edge of the inorganic material pattern 601 covered by the isolation structure pattern 6000 is flush with the edge of the isolation structure pattern 6000 covering it.

[0318] For example, Figure 15AThe schematic diagram shows that the inorganic material pattern 601 covered by two adjacent isolation structural patterns 6000 are separate structures, but it is not limited to this. For example, the inorganic material pattern 601 located between the two isolation structural patterns 6000 can be an integrated structure, that is, the two isolation structural patterns 6000 share the inorganic material pattern 601 located between them.

[0319] For example, such as Figure 14 and Figure 15B As shown, the inorganic material pattern 601 is wet-etched (the etching solution has little effect on the isolation structure pattern 6000) to etch away the inorganic material pattern 601, so that the isolation structure pattern 6000 forms an isolation structure 600 with an undercut structure. The embodiments of this disclosure are not limited to this; the inorganic material pattern may not be completely etched away, as long as the isolation structure pattern forms an undercut structure and the undercut structure can isolate the charge generation layer.

[0320] For example, such as Figure 14 and Figure 15B As shown, along the X direction, multiple isolation structures 600 can be provided between adjacent sub-pixels. The maximum size of each isolation structure 600 can be the same as the minimum size of the gap between adjacent isolation structures 600. For example, along the X direction, the maximum size of each isolation structure 600 and the minimum size of the gap between adjacent isolation structures 600 can both be 10 micrometers. Of course, the embodiments of this disclosure are not limited to this. Along the X direction, the maximum size of each isolation structure 600 and the minimum size of the gap between adjacent isolation structures 600 can also be different. For example, the size of the isolation structure can be larger, or the size of the gap can be larger.

[0321] For example, such as Figure 14 and Figure 15B As shown, along the X direction, the size of the isolation protrusion 601 of the second sub-isolation structure 620 can be 1 to 3 micrometers.

[0322] Figure 16 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 16 The display substrate in the example shown is Figures 11A to 15B The difference in the display substrate shown is that both the isolation structure 600 and the first electrode 110 are disposed on the planarization layer 500. Figure 16 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here. Figure 16The shapes, thicknesses, and dimensional relationships of the first sub-isolation structure 610 and the second sub-isolation structure 620 shown can be compared with those of the substrate. Figures 11A to 15B The first sub-isolation structure 610 and the second sub-isolation structure 620 in the display substrate shown have the same shape, thickness, and dimensional relationship with each other in the direction parallel to the substrate, which will not be described again here.

[0323] For example, such as Figure 16 As shown, the second opening 420 of the pixel-defined pattern 400 exposes the isolation structure 600 and a portion of the planarization layer 500. For example, a gap is provided between the isolation structure 600 and the edge of the second opening 420.

[0324] For example, such as Figure 16 As shown, the first sub-isolation structure 610 is disposed in the same layer as the first electrode 110. For example, the first sub-isolation structure 610 and the first electrode 110 may have the same thickness. For example, the first sub-isolation structure 610 and the first electrode 110 may be made of the same material to save process steps. For example, the first electrode 110 may include multiple layers of film, and the first sub-isolation structure 610 may also include the same multiple layers of film as the first electrode 110. For example, the first electrode 110 may include multiple layers of film, and the first sub-isolation structure 610 may include a layer of film identical to one layer of film in the first electrode 110.

[0325] For example, such as Figure 16 As shown, the second sub-isolation structure 620 is disposed on the same layer as the pixel defining portion 401 of the pixel defining pattern 400 and is made of the same material. For example, as Figure 16 As shown, the surface of the second sub-isolation structure 610 away from the substrate 01 can be a curved surface.

[0326] For example, such as Figure 16 As shown, an isolation structure 600 can be set between adjacent sub-pixels, but it is not limited to this. Two or more can also be set, depending on the product size and requirements.

[0327] For example, such as Figure 16 As shown, the maximum distance between the surface of the second sub-isolation structure 620 away from the substrate 01 and the substrate 01 can be equal to the maximum distance between the surface of the pixel limiting portion 401 away from the substrate 01 and the substrate 01.

[0328] For example, such as Figure 16 As shown, the dimension of the second sub-isolation structure 620 along the X direction is smaller than the dimension of the first electrode 110 along the X direction.

[0329] For example, the first sub-isolation structure 610 and the second sub-isolation structure 620 may be an integrated structure, and the materials of the first sub-isolation structure 610 and the second sub-isolation structure 620 may be the same as the material of the pixel limiting part 401.

[0330] For example, the first sub-isolation structure 610 and the second sub-isolation structure 620 are an integrated structure, and the isolation structure 600 can be part of the pixel defining portion 401 of the pixel defining pattern 400. For example, a pixel defining portion 401 is used to form a first opening 401 on one side in the X direction, and the pixel defining portion 401 forms an isolation structure 600 including a protrusion on the other side in the X direction to form a second opening 420. An example of an embodiment of this disclosure saves process steps by using a part of the pixel defining portion of the pixel defining pattern as the isolation structure.

[0331] For example, by setting the thickness of the first sub-isolation structure 610, setting the size of the edge protrusion of the second sub-isolation structure 620 relative to the first sub-isolation structure 610, and setting the angle of the edge of the curved surface of the second sub-isolation structure 620, the charge generation layer can be broken at the edge of the isolation structure 600, while the second electrode is not broken at the edge of the isolation structure 600.

[0332] For example, Figures 17A to 17B To form Figure 16 A schematic diagram of the previous display substrate manufacturing process. For example, as shown... Figure 16 and Figure 17A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 16 and Figure 17A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0333] For example, such as Figure 16 and Figure 17A As shown, an electrode layer is formed on the planarization layer 500, and the electrode layer is patterned to form a first electrode 110 and a first sub-isolation structure pattern 6100. For example, the shape and size of the first electrode 110 can be the same as the shape and size of the first sub-isolation structure pattern 6100.

[0334] For example, such as Figure 16 and Figure 17B As shown, a pixel defining film is formed on the first electrode 110 and the first sub-isolation structure pattern 6100, and the pixel defining film is patterned to form a pixel defining pattern 400 and a second sub-isolation structure 620. The pixel defining pattern 400 includes a first opening 410 exposing the first electrode 110 and a second opening 420 exposing the first sub-isolation structure pattern 6100. The second sub-isolation structure 620 is located on the first sub-isolation structure pattern 6100 exposed by the second opening 420. For example, after forming the pixel defining pattern 400, a spacer 012 is patterned to form.

[0335] For example, such as Figure 17B As shown, along the X direction, the size of the first sub-isolation structure pattern 6100 is larger than the size of the second sub-isolation structure 620. For example, along the X direction, the first sub-isolation structure pattern 6100 has a protruding portion relative to at least one edge of the second sub-isolation structure 620. For example, along the X direction, the first sub-isolation structure pattern 6100 has protruding portions relative to both edges of the second sub-isolation structure 620. Of course, this example is not limited to this; the edges of the first sub-isolation structure pattern 6100 may also be flush with the edges of the second sub-isolation structure 620.

[0336] For example, such as Figure 16 and Figure 17B As shown, the first sub-isolation structure pattern 6100 is wet-etched (the etching solution has little effect on the second sub-isolation structure 620) so that the edge of the first sub-isolation structure pattern 6100 is recessed relative to the edge of the second sub-isolation structure 620 to form an undercut structure. For example, the first sub-isolation structure 6100 and the isolation structure 600 are formed after wet etching of the first sub-isolation structure pattern 6100.

[0337] Figure 18 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 18 The display substrate in the example shown is Figures 16 to 17B The difference in the display substrate shown is that the materials of the first sub-isolation structure 610 and the first electrode 110 are different. Figure 18 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here. Figure 18 The shapes, thicknesses, and dimensional relationships of the first sub-isolation structure 610 and the second sub-isolation structure 620 shown can be compared with those of the substrate. Figures 11A to 17BThe first sub-isolation structure 610 and the second sub-isolation structure 620 in the display substrate shown have the same shape, thickness, and dimensional relationship with each other in the direction parallel to the substrate, which will not be described again here.

[0338] For example, such as Figure 18 As shown, the material of the first sub-isolation structure 610 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride, and the material of the second sub-isolation structure 620 may be the same as the material of the pixel limiting portion 401.

[0339] For example, Figures 19A to 19B To form Figure 18 A schematic diagram of the previous display substrate manufacturing process. For example, as shown... Figure 18 and Figure 19A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 18 and Figure 19A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0340] For example, such as Figure 18 and Figure 19A As shown, a first sub-isolation structure layer is formed on the planarization layer 500. For example, the first sub-isolation structure layer is deposited on the planarization layer 500. For example, the thickness of the first sub-isolation structure layer can be 300 to 10,000 angstroms. For example, after forming the first sub-isolation structure layer, the first sub-isolation structure layer is patterned to form a first sub-isolation structure pattern. For example, the first sub-isolation structure layer is dry-etched to form the first sub-isolation structure pattern. For example, a second sub-isolation structure layer is formed on the first sub-isolation structure pattern. For example, the thickness of the second sub-isolation structure layer can be 0.5 to 3 micrometers. For example, after coating, exposing, and developing the second sub-isolation structure layer, a second sub-isolation structure 620 is formed on the first sub-isolation structure pattern.

[0341] For example, such as Figure 19AAs shown, after the second sub-isolation structure 620 is formed, the pattern of the first sub-isolation structure is wet-etched (the etching solution has a smaller impact on the second sub-isolation structure) to cause the edge of the first sub-isolation structure pattern to be recessed relative to the edge of the second sub-isolation structure to form an undercut structure (i.e., isolation structure 600), which includes the edges of the first sub-isolation structure 610 and the second sub-isolation structure 620. For example, the isolation protrusion 601 protruding from the edge of the second sub-isolation structure 620 relative to the first sub-isolation structure 610 can have a dimension in the X direction of not less than 0.2 micrometers.

[0342] For example, such as Figure 18 and Figure 19B As shown, after forming the isolation structure 600, a first electrode 110 is patterned and formed on the planarization layer 500. The process for forming the first electrode and subsequent pixel-defined patterns in this example can be compared with... Figures 1A to 5D The process for forming the first electrode and the subsequent pixel-defining patterns in the display substrate is the same, and will not be described again here.

[0343] For example, such as Figure 18 As shown, a gap is provided between the isolation structure 600 and the pixel defining portion 401 of the pixel defining pattern 400. For example, the thickness of the isolation structure 600 may be less than the thickness of the pixel defining portion 401.

[0344] Figure 20 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 20 The display substrate in the example shown is Figure 16 The difference between the display substrates shown is the number of layers in the isolation structure. Figure 20 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here. Figure 20 The planarization layer 500 in the display substrate shown can be coupled with Figure 16 The planarization layer 500 in the substrate shown has the same characteristics, which will not be described again here.

[0345] For example, such as Figure 20As shown, each isolation structure 600 also includes a third sub-isolation structure 630 stacked with the second sub-isolation structure 620 and the first sub-isolation structure 610. The third sub-isolation structure 630 is located between the first sub-isolation structure 610 and the substrate 01. Along the arrangement direction of adjacent sub-pixels 100 (X direction as shown in the figure), the size of the third sub-isolation structure 630 in the isolation structure 600 between adjacent sub-pixels 100 is larger than the maximum size of the first sub-isolation structure 610.

[0346] For example, such as Figure 20 As shown, along the X direction, the ratio of the size of the second sub-isolation structure 620 to the size of the third sub-isolation structure 630 can be 0.8 to 1.2. For example, along the X direction, the ratio of the size of the second sub-isolation structure 620 to the size of the third sub-isolation structure 630 can be 0.9 to 1.1. For example, along the X direction, the size of the second sub-isolation structure 620 and the size of the third sub-isolation structure 630 can be equal.

[0347] For example, such as Figure 20 As shown, the pixel-defined pattern 400 includes a second opening 420, which is configured to expose the isolation structure 600. For example, a certain gap is provided between the isolation structure 600 and the edge of the second opening 420.

[0348] For example, such as Figure 20 As shown, along the direction perpendicular to the substrate 01, the thickness of the second sub-isolation structure 620 and the thickness of the third sub-isolation structure 630 are both less than the thickness of the first sub-isolation structure 610.

[0349] For example, such as Figure 20 As shown, along the direction perpendicular to the substrate 01, the thickness of the isolation structure 600 can be less than the thickness of the pixel defining portion 401 of the pixel defining pattern 400. However, it is not limited to this; the thickness of the isolation structure 600 can also be greater than or equal to the thickness of the pixel defining portion 401.

[0350] For example, such as Figure 20 As shown, the third sub-isolation structure 630 is disposed in the same layer as the first electrode 110. For example, both the third sub-isolation structure 630 and the first electrode 110 are disposed on the surface of the planarization layer 500.

[0351] For example, such as Figure 20As shown, the material of the second sub-isolation structure 620 is the same as that of the third sub-isolation structure 630, but the material of the second sub-isolation structure 620 is different from that of the first sub-isolation structure 630. For example, both the first sub-isolation structure 610 and the second sub-isolation structure 620 are made of inorganic materials. For example, the material of the first sub-isolation structure 610 can be silicon nitride, and the materials of the second sub-isolation structure 620 and the third sub-isolation structure 630 can be silicon oxide. For example, the material of the first sub-isolation structure 610 can be aluminum, and the materials of the second sub-isolation structure 620 and the third sub-isolation structure 630 can be titanium. The difference in materials can refer to differences in density, refractive index, hydrophilicity, or chemical activity with a solvent, etc.

[0352] For example, such as Figure 20 As shown, the cross-section of the first sub-isolation structure 610 cut by a plane parallel to the XY plane can be trapezoidal, with the upper base of the trapezoid contacting the surface of the second sub-isolation structure 620 and the lower base of the trapezoid contacting the surface of the third sub-isolation structure 630. However, this embodiment is not limited to this; the cross-section of the first sub-isolation structure 610 cut by a plane parallel to the XY plane can also be rectangular.

[0353] For example, such as Figure 20 As shown, the cross-sections of the second sub-isolation structure 620 and the third sub-isolation structure 630 cut by a plane parallel to the XY plane can both be rectangular.

[0354] For example, the sum of the thicknesses of the first sub-isolation structure 610 and the third sub-isolation structure 630 and the thickness of the light-emitting functional layer can be 0.8 to 1.2. For example, the sum of the thicknesses of the first sub-isolation structure 610 and the third sub-isolation structure 630 and the thickness of the light-emitting functional layer can be 0.9 to 1.1. By setting the sum of the thicknesses of the first sub-isolation structure 610 and the third sub-isolation structure 630 to be relatively small, the charge-generating layer can be disconnected at the isolation protrusion 601 of the second sub-isolation structure 620, while the second electrode remains continuous at the isolation protrusion 601. Of course, the embodiments of this disclosure are not limited to this; the sum of the thicknesses of the first sub-isolation structure 610 and the third sub-isolation structure 630 can be greater than the thickness of the light-emitting functional layer so that both the charge-generating layer and the second electrode are disconnected at the isolation protrusion 601 of the second sub-isolation structure 620.

[0355] For example, at least one of the first sub-isolation structure 610, the second sub-isolation structure 620 and the third sub-isolation structure 630 includes at least one membrane layer.

[0356] For example, Figures 21A to 21B To form Figure 20 A schematic diagram of a previous method for manufacturing a display substrate. For example, as shown... Figure 20 and Figure 21A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 20 and Figure 21A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0357] For example, such as Figure 20 and Figure 21A As shown, a third sub-isolation structure layer, a first sub-isolation structure layer, and a second sub-isolation structure layer are sequentially formed on the planarization layer 500. Then, a three-layer isolation structure pattern is formed by dry etching. Afterward, the first sub-isolation structure pattern located in the middle layer is wet-etched (the etching selectivity of the material of the first sub-isolation structure pattern is greater than that of the material of the second and third sub-isolation structure patterns) so that the edge of the first sub-isolation structure pattern is recessed relative to the edge of the second sub-isolation structure pattern to form an undercut structure at the edge of the second and first sub-isolation structure patterns, thereby forming the isolation structure 600.

[0358] For example, such as Figure 20 and Figure 21B As shown, after forming the isolation structure 600, a first electrode 110 is patterned and formed on the planarization layer 500. The process for forming the first electrode and subsequent pixel-defined patterns in this example can be compared with... Figures 1A to 5D The process for forming the first electrode and the subsequent pixel-defining patterns in the display substrate is the same, and will not be described again here.

[0359] For example, Figures 22A to 22C To form Figure 20 A schematic diagram of another manufacturing process for a previous display substrate. Figures 22A to 22C The manufacturing method of the display substrate shown is the same as Figures 21A to 21B The difference in the manufacturing method of the display substrate shown is that the step of forming the isolation structure 600 with undercut characteristics occurs after the formation of the pixel defining pattern 400. For example, as Figure 20 and Figure 22AAs shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 20 and Figure 22A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0360] For example, such as Figure 20 and Figure 22A As shown, a third sub-isolation structure layer, a first sub-isolation structure layer, and a second sub-isolation structure layer are sequentially formed on the planarization layer 500, and then a third sub-isolation structure pattern 6300, a first sub-isolation structure pattern 6100, and a second sub-isolation structure pattern 6200 are formed by dry etching. For example, the orthographic projections of the third sub-isolation structure pattern 6300, the first sub-isolation structure pattern 6100, and the second sub-isolation structure pattern 6200 on the substrate 01 completely overlap.

[0361] For example, such as Figure 20 and Figure 22B As shown, after forming the third sub-isolation structure pattern 6300, the first sub-isolation structure pattern 6100, and the second sub-isolation structure pattern 6200, the first electrode 110 is patterned and formed on the planarization layer 500. The process for forming the first electrode in this example can be compared with... Figures 1A to 5D The process for forming the first electrode in the display substrate shown is the same, and will not be described again here.

[0362] For example, such as Figure 20 and Figure 22C As shown, after forming the first electrode 110, a pixel defining film is formed on the first electrode 110, and the pixel defining film is patterned to form a pixel defining pattern 400. The pixel defining pattern 400 includes a first opening 410 exposing the first electrode 110 and a second opening 420 exposing a third sub-isolation structure pattern 6300, a first sub-isolation structure pattern 6100 and a second sub-isolation structure pattern 6200.

[0363] For example, such as Figure 20 and Figure 22CAs shown, after forming the pixel-defined pattern 400 and the spacer 012, a laminated structure mask exposing each sub-isolation structure pattern is used to wet-etch the first sub-isolation structure pattern 6100 in the exposed laminated structure, causing the edge of the first sub-isolation structure pattern 6100 to be recessed relative to the edge of the second sub-isolation structure pattern 6100 to form an undercut structure, thereby forming the isolation structure 600. Subsequent processes for forming the light-emitting functional layer and other film layers can be performed in conjunction with... Figure 4B and Figure 7 The process steps for forming the light-emitting functional layer and other films in the example shown are the same, and will not be repeated here.

[0364] Figure 23 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 23 The display substrate in the example shown is Figure 20 The difference between the display substrates shown is the location of the isolation structure. Figure 23 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here. Figure 23 The planarization layer 500 in the display substrate shown can be coupled with Figure 20 The planarization layer 500 in the substrate shown has the same characteristics, which will not be described again here.

[0365] For example, such as Figure 23 As shown, the pixel-defined pattern 400 includes a plurality of first openings 410, each of which corresponds to a plurality of sub-pixels 100 to define the light-emitting area of ​​the sub-pixels 100. The first openings 410 are configured to expose the first electrode 110. For example, as Figure 23 As shown, the portion of the pixel-limiting pattern 400 other than the first opening 410 is the pixel-limiting portion 401, and the isolation structure 600 is located on the side of the pixel-limiting portion 401 of the pixel-limiting pattern 400 away from the substrate 01.

[0366] For example, such as Figure 23 As shown, each isolation structure 600 includes a first sub-isolation structure 610, a second sub-isolation structure 620, and a third sub-isolation structure 630 stacked sequentially. The third sub-isolation structure 630 is located between the first sub-isolation structure 610 and the substrate 01. Along the arrangement direction of adjacent sub-pixels 100 (X direction as shown in the figure), the size of the third sub-isolation structure 630 among the isolation structures 600 between adjacent sub-pixels 100 is larger than the maximum size of the first sub-isolation structure 610. Figure 23 The isolation structure 600 in the display substrate shown can be connected with Figure 20 The isolation structure 600 in the display substrate shown has the same characteristics, and will not be described again here.

[0367] For example, Figure 24 To form Figure 23 A schematic diagram of a previous method for manufacturing a display substrate. For example, as shown... Figure 23 and Figure 24 As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 23 and Figure 24 As shown, the process flow for forming other film layers 011, planarization layer 500, and first electrode 110 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011, planarization layer 500, and first electrode 110 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011, planarization layer 500 and first electrode 110 in the display substrate is the same, and will not be described again here.

[0368] For example, such as Figure 23 and Figure 24 As shown, after the first electrode 110 is formed, a pixel defining film is formed on the planarization layer 500 and the first electrode 110, and the pixel defining film is patterned to form a pixel defining pattern 400 having a plurality of first openings 110 exposing a plurality of first electrodes 110.

[0369] For example, such as Figure 23 and Figure 24 As shown, after forming the pixel-defined pattern 400 and the spacer 012, a third sub-isolation structure layer, a first sub-isolation structure layer, and a second sub-isolation structure layer are sequentially formed on the pixel-defined portion 401. Then, a three-layer isolation structure pattern is formed by dry etching. Afterward, the first sub-isolation structure pattern located in the middle layer is wet-etched (the etching selectivity of the etching solution for the first sub-isolation structure pattern is greater than the etching selectivity of the material for the second and third sub-isolation structure patterns) so that the edge of the first sub-isolation structure pattern is recessed relative to the edge of the second sub-isolation structure pattern to form an undercut structure at the edge of the second and first sub-isolation structure patterns, thereby forming the isolation structure 600.

[0370] Figure 25 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 25The display substrate in the example shown is Figure 20 The difference between the display substrates shown lies in the stacked structure included in the isolation structure. For example, as... Figure 25 As shown, the pixel-defined pattern 400 includes a first opening 410 configured to include a first electrode 110 and a second opening 410 configured to expose an isolation structure 600. The isolation structure 600 also includes a barrier portion 640 located between a third sub-isolation structure 630 and the substrate 01, and the barrier portion 640 is disposed in the same layer as the first electrode 110. The barrier portion can effectively isolate the isolation structure and the planarization layer, preventing damage to the planarization layer during the formation of the isolation structure.

[0371] For example, the first electrode 110 may include multiple layers of film, and the barrier portion 640 may be made of an inorganic material. For example, the material of the barrier portion 640 may be the same as the material of at least one of the first sub-isolation structure, the second sub-isolation structure, and the third sub-isolation structure.

[0372] Figure 25 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other films 011 in the illustrated embodiments have the same characteristics, and will not be described again here. Figure 25 The planarization layer 500 in the display substrate shown can be coupled with Figure 20 The planarization layer 500 in the substrate shown has the same characteristics, which will not be described again here.

[0373] For example, such as Figure 25 As shown, along the direction perpendicular to the substrate 01, the ratio of the thickness of the barrier portion 640 to the thickness of the first electrode 110 can be 0.8 to 1.2. For example, the ratio of the thickness of the barrier portion 640 to the thickness of the first electrode 110 can be 0.9 to 1.1. The thickness of the barrier portion 640 and the thickness of the first electrode 110 can be equal.

[0374] For example, such as Figure 25 As shown, the shape and size of the barrier portion 640 can be the same as those of the first electrode 110, but are not limited thereto. The shape and size of the barrier portion can be set according to the actual needs of the product.

[0375] For example, such as Figure 25As shown, the blocking portion 640 is not covered by the pixel defining portion 401 of the pixel defining pattern 400, and the orthographic projection of the blocking portion 640 on the substrate 01 does not overlap with the orthographic projection of the pixel defining portion 401 on the substrate 01. For example, a certain gap is provided between the isolation structure 600 and the pixel defining portion 401 of the pixel defining pattern 400. Of course, this example is not limited to this, and the blocking portion 640 may also be covered by the pixel defining portion 401.

[0376] For example, such as Figure 25 As shown, the isolation structure 600 is located between adjacent sub-pixels 100, and along the arrangement direction of the adjacent sub-pixels 100, the size of the blocking portion 640 can be larger than the size of the third sub-isolation structure 620.

[0377] For example, such as Figure 25 As shown, along the direction perpendicular to the substrate 01, the sum of the thicknesses of the first sub-isolation structure 610, the third sub-isolation structure 630, and the blocking portion 640 can be greater than the thickness of the light-emitting functional layer, so that the charge generation layer and the second electrode are both disconnected at the isolation protrusion 601 of the second sub-isolation structure 620.

[0378] For example, Figures 26A to 26B To form Figure 25 A schematic diagram of a previous method for manufacturing a display substrate. For example, as shown... Figure 25 and Figure 26A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 25 and Figure 26A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0379] For example, such as Figure 25 and Figure 26A As shown, an electrode layer is formed on the planarization layer 500, and the electrode layer is patterned to form a first electrode 110. For example, the barrier portion 640 may be formed before the formation of the first electrode 110, or the barrier portion 640 may be formed after the formation of the first electrode 110.

[0380] For example, such as Figure 25 and Figure 26BAs shown, a third sub-isolation structure layer, a first sub-isolation structure layer, and a second sub-isolation structure layer are sequentially formed on the barrier portion 640. Then, a three-layer isolation structure pattern is formed by dry etching. Afterward, the first sub-isolation structure pattern located in the middle layer is wet-etched (the etching selectivity of the etching solution for the material of the first sub-isolation structure pattern is greater than the etching selectivity of the material of the second and third sub-isolation structure patterns) so that the edge of the first sub-isolation structure pattern is recessed relative to the edge of the second sub-isolation structure pattern to form an undercut structure at the edge of the second and first sub-isolation structure patterns, thereby forming the isolation structure 600.

[0381] For example, such as Figure 25 and Figure 26B As shown, the material of the barrier portion 640 is different from the materials of the first sub-isolation structure 610, the second sub-isolation structure 620 and the third sub-isolation structure 630, so as to prevent the barrier portion 640 from being affected during the formation of the first sub-isolation structure 610, the second sub-isolation structure 620 and the third sub-isolation structure 630.

[0382] For example, such as Figure 25 and Figure 26B As shown, after the isolation structure 600 is formed, a pixel defining film is formed on the isolation structure 600 and the first electrode 110, and the pixel defining film is patterned to form a first opening 410 exposing the first electrode 110 and a second opening 420 exposing the isolation structure 600.

[0383] In this example, the process method for forming the other film layers after the pixel-defining film can be the same as... Figures 1A to 5D The process methods for forming the other film layers after the pixel-defining film in the display substrate are the same, and will not be described again here.

[0384] For example, Figures 11A to 26B The arrangement of multiple sub-pixels in each of the display substrates shown can be compared with... Figures 10A to 10E The multiple sub-pixels in the display substrate shown are arranged in the same way and can... Figures 11A to 26B The isolation structure 600 shown can be located in Figures 10A to 10E The position of the groove 210 shown is, for example... Figures 11A to 26B The isolation structure 600 shown can be with Figures 10A to 10E The grooves 210 shown have the same arrangement, which can Figures 11A to 26B The isolation structure shown is 600 replaced. Figures 10A to 10E The groove 210 is shown.

[0385] For example, when the isolation structure is located in a flat layer, the pixel definition portion between adjacent sub-pixels can be retained or removed; when the isolation structure is located in the second opening of the pixel definition pattern, the pixel definition portion between adjacent sub-pixels can be retained.

[0386] Another embodiment of this disclosure provides a display device, including... Figures 11A to 26B The display substrate shown can be configured such that by setting an isolation structure between adjacent sub-pixels in the display device, the charge generation layer can be broken at the edge of the isolation structure, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0387] For example, the display device also includes a cover plate located on the light-emitting side of the display panel.

[0388] For example, the display device can be an organic light-emitting diode display device or other display device, as well as any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator that includes the display device. This embodiment is not limited to this.

[0389] Figure 27 This is a partial cross-sectional structural diagram of a display substrate provided according to an example of another embodiment of the present disclosure. Figure 28A This is a partial cross-sectional structural diagram of a display substrate provided according to another example of another embodiment of the present disclosure. Figure 28B This is a partial cross-sectional structural diagram of a display substrate provided according to another example of another embodiment of the present disclosure. Figure 27 The display substrate shown can be used with Figure 1C The display substrate shown has the same first display area A1 and second display area A2. For example... Figures 27 to 28B As shown, the display substrate includes a substrate 01 and a plurality of sub-pixels 10 disposed on a first display area A1 on the substrate 01. Each sub-pixel 10 includes an organic light-emitting element 100, which includes a light-emitting functional layer 130 and a first electrode 110 and a second electrode 120 located on both sides of the light-emitting functional layer 130 along a direction perpendicular to the substrate 01. The first electrode 110 is located between the light-emitting functional layer 130 and the substrate 01. The light-emitting functional layer 130 includes a plurality of film layers, for example, the plurality of film layers include a charge-generating layer 133 (which may be as shown in Figure 1 or...). Figure 11A The charge generation layer 133 shown is also included in the display substrate. The display substrate further includes an isolation portion 700, which comprises a first sub-isolation portion 710 and a second sub-isolation portion 720 stacked together. The first sub-isolation portion 710 is located between the second sub-isolation portion 720 and the substrate 01. For example, the material of the first sub-isolation portion 710 may include an inorganic non-metallic material or a metallic material, and the material of the second sub-isolation portion 720 may include an organic material.

[0390] like Figure 27 and Figure 28A As shown, the second sub-isolation portion 720 includes a protrusion 701 that protrudes relative to the edge of the first sub-isolation portion 710, and the protrusion 701 is located between adjacent sub-pixels 100.

[0391] like Figure 28B As shown, at least a portion of the side surface of the second sub-isolation portion 720 has a slope angle greater than 60 degrees and less than 120 degrees with a plane parallel to the contact surface of the first sub-isolation portion 710 and the second sub-isolation portion 720, and / or, at least a portion of the side surface of the second sub-isolation portion 720 has a slope angle greater than 60 degrees and less than 120 degrees with a plane parallel to the contact surface of the first sub-isolation portion 710 and the second sub-isolation portion 720.

[0392] For example, the slope angle between at least a portion of the side surface of the first sub-isolation structure 610 and the plane parallel to the contact surface of the first sub-isolation portion 710 and the second sub-isolation portion 720 is greater than 70 degrees and less than 110 degrees, and / or, the slope angle between at least a portion of the side surface of the second sub-isolation portion 720 and the plane parallel to the contact surface of the first sub-isolation portion 710 and the second sub-isolation portion 720 is greater than 70 degrees and less than 110 degrees. For example, the slope angle between at least a portion of the side surface of the first sub-isolation portion 710 and the plane parallel to the contact surface of the first sub-isolation portion 710 and the second sub-isolation portion 720 is greater than 80 degrees and less than 100 degrees, and / or, the slope angle between at least a portion of the side surface of the second sub-isolation portion 720 and the plane parallel to the contact surface of the first sub-isolation portion 710 and the second sub-isolation portion 720 is greater than 80 degrees and less than 100 degrees.

[0393] The slope angle between at least a portion of the side surface of the first sub-isolator and the plane parallel to the contact surface of the first and second sub-isolators can be the angle between the surface of the first sub-isolator away from the substrate and the side surface of the first sub-isolator, or the angle between the surface of the first sub-isolator facing the substrate and the side surface of the first sub-isolator. Similarly, the slope angle between at least a portion of the side surface of the second sub-isolator and the plane parallel to the contact surface of the first and second sub-isolators can be the angle between the surface of the second sub-isolator away from the substrate and the side surface of the second sub-isolator, or the angle between the surface of the second sub-isolator facing the substrate and the side surface of the second sub-isolator. The side surface of the first sub-isolator can refer to the surface of the first sub-isolator that has a certain angle with the substrate, and the side surface of the second sub-isolator can refer to the surface of the second sub-isolator that has a certain angle with the substrate.

[0394] Figure 28A and Figure 28B The difference in the example shown lies in the positional and angular relationship between the first sub-isolation section 710 and the second sub-isolation section 720.

[0395] like Figures 27 to 28BAs shown, at least one of the multiple film layers included in the light-emitting functional layer 130 is disconnected at the isolation portion 700. For example, the light-emitting functional layer 130 includes a charge-generating layer 133, which is disconnected at the edge of the isolation portion 700.

[0396] In this embodiment, an isolation portion is provided between adjacent sub-pixels in the display substrate. By adjusting the relative positional relationship between the first and second sub-isolation portions, or the angle of the side surface of the first and second sub-isolation portions, at least one layer of the light-emitting functional layer can be broken at the protrusion of the second sub-isolation portion relative to the edge of the first sub-isolation portion, or broken at the edge of the isolation portion, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0397] The embodiments disclosed herein, by providing an isolation portion between adjacent sub-pixels in the display substrate, can cause the charge generation layer to be disconnected at the edge of the isolation portion, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0398] In this embodiment, the substrate 01 and the organic light-emitting element 100 can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other film layers 011 in the illustrated embodiment have the same characteristics and will not be described again here. The planarization layer 500 in this example can be... Figures 16 to 26B The flat layer 500 shown has the same characteristics, which will not be described again here.

[0399] For example, such as Figure 27 As shown, the plurality of sub-pixels 10 may include two adjacent sub-pixels 10 arranged along the X direction. For example, a plurality of isolation portions 700 provided in the two adjacent sub-pixels 10 are arranged along the X direction. Figure 27 The diagram schematically illustrates at least one set of isolation portions between adjacent sub-pixels 100. Each set of isolation portions includes two spaced-apart isolation portions 700 arranged along the arrangement direction (e.g., the X direction) of the adjacent sub-pixels 100 and spaced apart. The protrusions 701 of the two isolation portions 700 are close to each other. However, this is not a limitation; three or more spaced-apart isolation portions may also be provided between adjacent sub-pixels 100. For example, the edge of the first sub-isolation portion 710 is recessed relative to the edge of the second sub-isolation portion 720 covering it to form an undercut structure, and the protrusions 701 of the second sub-isolation portion 720 are suspended.

[0400] For example, when there is no isolation portion 700 between two adjacent sub-pixels 10, the common film layer (e.g., including the charge generation layer) in the light-emitting functional layer 130 of the two adjacent sub-pixels 10 is a whole film layer. Since the charge generation layer has high conductivity, for display devices with high resolution, the high conductivity of the charge generation layer can easily cause crosstalk between adjacent sub-pixels 10.

[0401] In the display substrate provided in this embodiment, by providing an isolation portion between two adjacent sub-pixels, the charge generation layer formed at the protrusion of the isolation portion can be disconnected. At this time, the charge generation layers of the two adjacent sub-pixels are spaced apart, which can increase the resistance of the light-emitting functional layer between the adjacent sub-pixels. This reduces the probability of crosstalk between the two adjacent sub-pixels without affecting the normal display of the sub-pixels.

[0402] For example, such as Figure 27 As shown, along the arrangement direction of the adjacent sub-pixels 10, the interval between the two first sub-isolation portions 710 of the two isolation portions 700 is greater than the interval between the two second sub-isolation portions 720.

[0403] For example, such as Figure 27 As shown, a gap is provided between the film layer that is broken between the two isolation portions 700 and the first sub-isolation portion 710, and the orthographic projection of the broken film layer on the substrate 01 overlaps or connects with the orthographic projection of the second sub-isolation portion 720 on the substrate 01.

[0404] For example, such as Figure 27 As shown, along a direction perpendicular to the substrate 01, the maximum thickness of the second sub-isolation portion 720 is greater than the maximum thickness of the first sub-isolation portion 710. For example, the average thickness of the second sub-isolation portion 720 is greater than the average thickness of the first sub-isolation portion 710.

[0405] For example, such as Figure 27 As shown, along the direction perpendicular to the substrate 01, the thickness of the protrusion 701 is less than the thickness of the portion of the second sub-isolator 720 excluding the protrusion 701. For example, the difference between the thickness of the protrusion 701 and the thickness of the portion of the second sub-isolator 720 excluding the protrusion 701 can be the thickness of the first sub-isolator 710.

[0406] For example, such as Figure 28BAs shown, the surface of the protrusion 701 away from the substrate 01 includes a curved surface, and the curved surface bends toward the first sub-isolator 710. The slope angle of the curved surface of the protrusion 701 is 15 to 70 degrees. For example, the slope angle of the curved surface of the protrusion 701 is 30 to 60 degrees. For example, the slope angle of the curved surface of the protrusion 701 is 40 to 50 degrees. For example, the slope angle of the curved surface of the protrusion 701 is smaller than the angle between the side surface of the first sub-isolator 710 and the substrate 01. For example, the side edge of the first sub-isolator 710 can be a curved edge or a straight edge. For example, the side edge of the first sub-isolator 710 can be bent toward the center of the first sub-isolator 710. For example, the angle between the side edge of the first sub-isolator 710 and its surface away from the substrate 01 can be 60 to 90 degrees. For example, the angle between the side edge of the first sub-isolator 710 and its surface toward the substrate 01 can be 60 to 90 degrees. The angle between the curved edge and the surface can refer to the angle between the tangent at the intersection of the curved edge and the surface and the surface. However, it is not limited to this; it can also be the angle between the tangent at the midpoint of the curved edge and the surface.

[0407] For example, such as Figure 27 As shown, the film layer of the charge generation layer 133 in the light-emitting functional layer 130 facing the substrate 01 is broken at the isolation portion 710.

[0408] For example, such as Figure 27 As shown, the color of the light emitted by the first light-emitting layer is the same as the color of the light emitted by the second light-emitting layer. For example, in the same sub-pixel, the color of the light emitted by the first light-emitting layer is the same as the color of the light emitted by the second light-emitting layer, and in at least two adjacent sub-pixels, the colors of the light emitted by the light-emitting layers are different.

[0409] For example, such as Figure 27 As shown, the light-emitting functional layer 130 includes a light-emitting layer (a first light-emitting layer or a second light-emitting layer). The area of ​​the orthogonal projection of at least one broken film layer in the light-emitting functional layer 130 onto the substrate 01 is greater than the area of ​​the orthogonal projection of the light-emitting layer (the first light-emitting layer or the second light-emitting layer) onto the substrate 01. For example, the broken film layer can be a common layer, and the light-emitting layer can be a patterned film layer formed by a fine metal mask.

[0410] For example, the light-emitting functional layer 130 includes at least one light-emitting layer (a first light-emitting layer or a second light-emitting layer), and the film layers in the light-emitting functional layer 130 that are broken at the isolation portion 700 include at least one light-emitting layer and at least one other film layer. For example, the area of ​​the orthographic projection of the broken at least one other film layer on the substrate 01 is larger than the area of ​​the orthographic projection of the broken at least one light-emitting layer on the substrate 01. For example, the area of ​​the portion of the isolation portion 700 covered by the broken at least one other film layer is larger than the area of ​​the portion of the isolation portion covered by the broken at least one light-emitting layer. For example, the broken at least one other film layer completely covers the isolation portion 700, while the at least one light-emitting layer only covers a portion of the isolation portion 700.

[0411] For example, at least one of the multiple film layers included in the light-emitting functional layer 130 and the projection of the second electrode 120 and the isolation portion 700 on the substrate 01 overlap.

[0412] For example, at least a portion of at least one of the multiple film layers included in the light-emitting functional layer 130 covers a portion of the side surface of the isolation portion 700. For example, the aforementioned film layer may cover the side surface of the first sub-isolation portion 710, and / or, cover the side surface of the second sub-isolation portion 720.

[0413] For example, such as Figure 27 As shown, along the direction perpendicular to the substrate 01, the thickness of the first sub-isolation portion 710 is less than the thickness of the second sub-isolation portion 720.

[0414] For example, such as Figure 27 As shown, along the arrangement direction of adjacent sub-pixels 100, such as the X direction, the size of the protrusion 701 located in the isolation portion 700 between the adjacent sub-pixels 100 can be larger than the size of the first sub-isolation portion 710. However, it is not limited to this; the size of the protrusion in the above-mentioned arrangement direction can also be smaller than or equal to the size of the first sub-isolation portion.

[0415] For example, at least one of the plurality of film layers in the light-emitting functional layer 130 is broken at the edge of the isolation portion 700 facing one of the adjacent sub-pixels, but not broken at the edge facing the other adjacent sub-pixel.

[0416] For example, at least a portion of the second sub-isolation portion 720 facing one of the adjacent sub-pixels has a different slope angle than at least a portion of the second sub-isolation portion 720 facing another adjacent sub-pixel; and / or, at least a portion of the second sub-isolation portion 720 facing one of the adjacent sub-pixels has the protrusion, while the portion of the second sub-isolation portion 720 facing another adjacent sub-pixel does not have the protrusion.

[0417] For example, at least in the portion of the isolation portion where the protrusion is located, the projection of the first sub-isolation portion on the substrate falls entirely within the projection of the second sub-isolation portion.

[0418] For example, such as Figure 27 As shown, the display substrate also includes a pixel defining pattern 400, which includes a plurality of first openings 410. Each of the first openings 410 corresponds to a plurality of sub-pixels 100 to define a light-emitting area of ​​the sub-pixels 100. The first openings 410 are configured to expose a first electrode 110. For example, the pixel defining pattern 400 includes a pixel defining portion 401 surrounding the first opening 410. For example, the pixel defining pattern 400 also includes a second opening 420, with the pixel defining portion 401 surrounding the second opening 420.

[0419] For example, such as Figures 27 to 28B As shown, the pixel defining pattern 400 includes a pixel defining portion 401 located between adjacent first openings 410 and 420. One end of the pixel defining portion 401 is configured to form the first opening 410, and the other end of the pixel defining portion 401 includes a second sub-isolating portion 720. The pixel defining portion 401 is configured such that the angle between the sidewall of the first opening 410 and the plane parallel to the substrate 01 is different from the angle between the sidewall of the second sub-isolating portion 720 and the plane parallel to the substrate 01. For example, the sidewalls of the first opening 410 and the second opening 420 may have different inclination angles or different shapes.

[0420] For example, such as Figure 27 As shown, the pixel-defining pattern 400 includes a second sub-isolation portion 720. For example, the pixel-defining portion 401 surrounding the second opening 420 includes the second sub-isolation portion 720, which is a part of the pixel-defining pattern 400, that is, a portion of the pixel-defining portion 401 is reused as the second sub-isolation portion 720.

[0421] For example, such as Figure 27 As shown, the first electrode 110 includes at least one electrode layer, and the first sub-isolation portion 710 is disposed on the same layer as the electrode layer of the first electrode 110. For example, the first electrode 110 and the first sub-isolation portion 710 may both be disposed on the planarization layer 500. For example, the first electrode 110 may include three electrode layers stacked together, which sequentially include indium tin oxide (ITO), silver (Ag), and indium tin oxide (ITO), but are not limited thereto, and may also sequentially include titanium (Ti), aluminum (Al), and titanium (Ti), or molybdenum (Mo), aluminum-neodymium alloy (AlNd), and indium tin oxide (ITO).

[0422] For example, the first electrode includes at least one electrode layer, the first sub-isolation portion includes at least one film layer, the film layer of the first sub-isolation portion is disposed in the same layer as the electrode layer of the first electrode, and the pixel defining portion is configured to separate the first sub-isolation portion and the first electrode.

[0423] For example, the material of the electrode layer disposed in the same layer as the first electrode and the first sub-isolation layer is the same as the material of the film layer.

[0424] For example, when the first electrode 110 includes multiple electrode layers, the first sub-isolation portion 710 can be disposed in the same layer as the electrode layer of the first electrode 110 that is closest to the substrate 01.

[0425] For example, such as Figure 27 As shown, the material of the electrode layer in the first electrode 110 that is disposed in the same layer as the first sub-isolation portion 710 is the same as the material of the first sub-isolation portion 710. For example, the material of the first sub-isolation portion 710 can be the same as the material of the electrode layer in the first electrode 110 that is closest to the substrate 01, for example, it can be indium tin oxide.

[0426] For example, the size of the portion of the second sub-isolator 720 protruding relative to the first sub-isolator 710 can be 0.1 to 5 micrometers. For example, the size of the portion of the second sub-isolator 720 protruding relative to the first sub-isolator 710 can be 0.2 to 1 micrometer.

[0427] For example, such as Figure 27 As shown, the thickness ratio of the first sub-isolating portion 710 to the light-emitting functional layer is 0.7 to 1.3. For example, the thickness ratio of the first sub-isolating portion 710 to the light-emitting functional layer is 0.8 to 1.2. For example, the thickness ratio of the first sub-isolating portion 710 to the light-emitting functional layer is 0.9 to 1.2.

[0428] For example, the thickness of the first sub-isolation portion 710 can be set to be relatively small, such as 1000~5000 angstroms, or 2000~4000 angstroms, so that the charge generation layer formed at the protrusion 701 position of the second sub-isolation portion 720 is broken, while the second electrode 120 located at the protrusion 701 position is not broken, thus ensuring that the second electrode 120 has better electrical characteristics.

[0429] For example, such as Figure 27 As shown, the light-emitting functional layer 130, after being broken at the edge of the isolation portion 700, fills the undercut structure formed by the first sub-isolation portion 710 and the second sub-isolation portion 720. This ensures that the isolation portion, while breaking the charge-generating layer, does not completely disconnect the second electrode, thus guaranteeing that the second electrode has good electrical characteristics and uniform brightness. Of course, this embodiment is not limited to this; the thickness of the first sub-isolation portion can also be set relatively large so that the second electrode is broken at the undercut structure position of the isolation portion (within...). Figure 4B The second electrode 120 shown is similar to the one disconnected at the undercut structure.

[0430] For example, such as Figure 27 As shown, the first sub-isolation portion 710 and the first electrode 110 are disposed at a distance. For example, the pixel defining portion 401 of the pixel defining pattern 400 is configured to separate the first sub-isolation portion 710 and the first electrode 110.

[0431] For example, Figure 28A This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 28A The display substrate in the example shown is Figure 27 The difference in the display substrate shown is that Figure 28A The material of the first sub-isolation portion 710 in the display substrate shown is different from the material of the first electrode 110. For example, in one embodiment of this disclosure, the material of the first sub-isolation portion 710 may include any one or more of silicon nitride, silicon oxide, or silicon oxynitride.

[0432] Figure 28A The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 and planarization layer 500 in this example can be... Figures 1A to 9B The other film layers 011 in the illustrated embodiment have the same characteristics and will not be described again here. The planarization layer 500 in this example can be... Figures 16 to 26B The flattened layer 500 shown has the same characteristics, which will not be described again here. The pixel-defined pattern 400 in this example can be similar to... Figure 27 The pixel-defined pattern 400 shown has the same characteristics, which will not be described again here.

[0433] For example, Figures 29A to 29D To form Figure 27 A schematic diagram of a previous method for manufacturing a display substrate. For example, as shown... Figure 27 , Figures 29A to 29DAs shown, the method for manufacturing a display substrate includes: forming a plurality of sub-pixels 100 on a substrate 01, wherein forming a sub-pixel 100 includes sequentially forming a second electrode 120, a light-emitting functional layer 130, and a first electrode 110 in a direction perpendicular to the substrate 01; patterning an inorganic layer pattern on the substrate 01; forming an organic layer on the inorganic layer pattern, and patterning an opening pattern 420 on the organic layer; etching the inorganic layer pattern to form a first sub-isolation portion 710, wherein the edge of the opening pattern 420 includes a second sub-isolation portion 720 stacked with the first sub-isolation portion 710, and the edge of the first sub-isolation portion 710 extends outward relative to the edge of the second sub-isolation portion 720 such that the second sub-isolation portion 720 includes a protrusion 701 protruding relative to the edge of the first sub-isolation portion 710, and the protrusion 701 is located between adjacent sub-pixels 100. After the first sub-isolation portion 710 is formed, a light-emitting functional layer 130 is formed on the second sub-isolation portion 720. The light-emitting functional layer includes a charge-generating layer, which is disconnected at the protrusion 701 of the second sub-isolation portion 720.

[0434] For example, such as Figure 27 and Figure 29A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 27 and Figure 29A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0435] For example, such as Figure 27 and Figure 29A As shown, an electrode layer is formed on the planarization layer 500, and a first electrode 110 and a first sub-isolation pattern 7100 are patterned thereon. For example, two first sub-isolation patterns 7100 can be provided between adjacent first electrodes 110, and the distance between these two first sub-isolation patterns 7100 can be 2 to 15 micrometers. For example, as... Figure 29A As shown, both the first electrode 110 and the first sub-isolation pattern 7100 include multilayer films stacked together. For example, as Figure 29AAs shown, the first electrode 110 and the first sub-isolation pattern 7100 both include indium tin oxide (ITO), silver (Ag) and indium tin oxide (ITO) stacked together, but are not limited to this, and may also include titanium (Ti), aluminum (Al) and titanium (Ti) in sequence, or molybdenum (Mo), aluminum-neodymium alloy (AlNd) and indium tin oxide (ITO).

[0436] For example, such as Figure 27 and Figure 29B As shown, a mask is used to shield the first electrode 110, and the first sub-isolation pattern 7100 exposed by the mask is etched to retain a film layer on the side of the first sub-isolation pattern 7100 closest to the substrate 01. For example, an indium tin oxide layer is retained after etching the first sub-isolation pattern 7100. For example, the etching degree can be controlled during the etching process of the first sub-isolation pattern 7100 to control the thickness of the retained film layer. For example, the thickness of the indium tin oxide layer retained after etching the first sub-isolation pattern 7100 can be 1000~5000 angstroms. By setting this film layer thickness to be small, it is possible to ensure that the charge generation layer is disconnected at the protrusion of the subsequently formed isolation portion while the second electrode is not disconnected at the protrusion, so that the second electrode has better electrical characteristics.

[0437] For example, such as Figure 27 , Figures 29C to 29D As shown, the inorganic layer pattern 7100 is located between adjacent sub-pixels 100, and the formed opening pattern 420 exposes the inorganic layer pattern 7100, or the edge of the formed opening pattern 420 is flush with the edge of the inorganic layer pattern 7100; the inorganic layer pattern 7100 is etched so that the edge of the reserved portion of the inorganic layer pattern 7100 forms an undercut structure with the edge of the opening pattern 420. For example, the reserved portion of the inorganic layer pattern 7100 is the first sub-isolation portion 710.

[0438] For example, such as Figure 27 and Figure 29C As shown, after etching the first sub-isolation pattern 7100 (also called the inorganic layer pattern 7100) and retaining a film layer, a pixel defining film and a spacer layer are formed on the film layer and the first electrode 110. The pixel defining film is patterned to form a pixel defining pattern 400, and the spacer layer is patterned to form a spacer 012. For example, as Figure 29CAs shown, the pixel defining pattern 400 includes a first opening 410 and a second opening 420 (also referred to as opening pattern 420) exposing the first electrode 110. For example, the edge of the second opening 420 may be flush with the edge of the remaining side film layer of the first sub-isolation pattern 7100. Of course, the embodiments of this disclosure are not limited to this. A first sub-isolation pattern 7100 may also be formed between two adjacent first electrodes 110. After etching and retaining a film layer in the first sub-isolation pattern 7100, a pixel defining pattern 400 with a second opening 420 is patterned on the film layer, the second opening 420 exposing the film layer. The exposed film layer is then wet-etched to form the first sub-isolation 710.

[0439] For example, such as Figure 27 and Figure 29D As shown, the inorganic layer pattern 7100 is wet-etched (the etching solution has a smaller impact on the materials of the pixel defining portion 401 and the planarization layer 500) so that the edge of the opening pattern 420 forms a protrusion 701 relative to the edge of the portion retained in the inorganic layer pattern 7100. However, it is not limited to this, the inorganic layer pattern 7100 can also be dry-etched.

[0440] For example, such as Figure 27 As shown, the subsequent process for forming the encapsulation layers 017-019, etc., can be compared with... Figure 7 The process flow for forming the encapsulation layer and other films in the substrate shown is the same, and will not be repeated here.

[0441] For example, Figures 30A to 30C To form Figure 28A The diagram shows a process flow chart of a manufacturing method prior to the display substrate. Figure 28A and Figure 30A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 28A and Figure 30A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0442] For example, the slope angle between at least a portion of the side surface of the formed first sub-isolator and the plane parallel to the contact surface of the first and second sub-isolators is greater than 60 degrees and less than 120 degrees, and / or the slope angle between at least a portion of the side surface of the formed second sub-isolator and the plane parallel to the contact surface of the first and second sub-isolators is greater than 60 degrees and less than 120 degrees.

[0443] For example, such as Figure 28A and Figure 30A As shown, an inorganic material layer is formed on the planarization layer 500 and a first sub-isolation material 702 is patterned to form it. For example, after forming the first sub-isolation material 702, an electrode layer is formed on the first sub-isolation material 702, and a first electrode 110 is patterned on the electrode layer.

[0444] For example, such as Figure 30A As shown, a first sub-isolating material 702 can be disposed between two adjacent first electrodes 110. For example, the first sub-isolating material 702 is disposed with a certain gap from the first electrode 110. In this example, the first electrode 110 can be disposed with... Figure 29A The first electrode 110 shown has the same characteristics, which will not be described again here.

[0445] For example, such as Figure 30A As shown, the material of the first sub-isolator 702 is different from the material of the first electrode 110. For example, the thickness of the first sub-isolator 702 can be 1000~5000 angstroms. By setting this film thickness to be relatively small, it is possible to ensure that the charge generation layer is disconnected at the protrusion of the subsequently formed isolator while the second electrode is not disconnected at the protrusion, thus giving the second electrode better electrical characteristics. Of course, the thickness of the first sub-isolator 702 can also be set to be relatively large so that both the light-emitting functional layer and the second electrode are disconnected at the protrusion of the subsequently formed isolator. The embodiments of this disclosure are not limited to this; the material of the first sub-isolator 702 can be the same as the material of the first electrode 110, in which case the first sub-isolator 702 and the first electrode 110 can be formed in the same patterning process.

[0446] For example, such as Figure 28A , Figures 30B to 30C As shown, a pixel defining film and a spacer layer are formed on the first sub-isolator material 702 and the first electrode 110. The pixel defining film is patterned to form a pixel defining pattern 400, and the spacer layer is patterned to form a spacer 012. For example, as... Figures 30B to 30CAs shown, the pixel-defined pattern 400 includes a first opening 410 exposing the first electrode 110 and a second opening 420 (also referred to as an opening pattern 420), the second opening 420 exposing a portion of the first sub-isolating material 702, and dry etching is performed on the exposed first sub-isolating material 702 to form the first sub-isolating pattern 7100. For example, as Figures 30B to 30C As shown, the edge of the second opening 420 can be flush with the edge of the first sub-isolation pattern 7100.

[0447] For example, such as Figure 28A and Figure 30C As shown, the edge of the first sub-isolation pattern 7100 exposed by the second opening 420 is wet-etched to cause the edge of the first sub-isolation pattern 7100 to be recessed relative to the edge of the pixel defining portion 401 surrounding the second opening 420 to form an undercut structure. For example, a protrusion 701 is formed at the edge of the opening pattern 420 relative to the edge of the portion retained by the inorganic layer pattern 7100. For example, the first sub-isolation portion 710 is formed after wet etching of the first sub-isolation pattern 7100.

[0448] For example, such as Figure 28A As shown, the subsequent process for forming the encapsulation layer and other films can be compared with... Figure 7 The process flow for forming the encapsulation layer and other films in the substrate shown is the same, and will not be repeated here.

[0449] Figure 31 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 31 The display substrate in the example shown is Figure 27 The difference in the display substrate shown is that the portion of the first electrode 110 covered by the second sub-isolation portion 720 includes the first sub-isolation portion 710. Figure 31 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other film layers 011 in the illustrated embodiment have the same characteristics and will not be described again here. The planarization layer 500 in this example can be... Figures 16 to 26B The flat layer 500 shown has the same characteristics, which will not be described again here.

[0450] For example, such as Figure 31As shown, the first electrode 110 and the first sub-isolation portion 710 are integrated, and the pixel defining portion 401 and the second sub-isolation structure 720 are integrated. For example, the first electrode 110 is reused as the first sub-isolation portion 710, and the pixel defining portion 401 is reused as the second sub-isolation structure 720. In this embodiment of the present disclosure, by forming a portion of the first electrode and a portion of the pixel defining portion into an isolation portion, process savings can be achieved.

[0451] For example, such as Figure 31 As shown, the pixel defining pattern 400 includes a first opening 410 and a second opening 420, the first opening 410 being configured to expose the first electrode 110 and the second opening 420 exposing a portion of the planarization layer 500. For example, the pixel defining pattern 400 includes a pixel defining portion 401 surrounding the first opening 410 and the second opening 420.

[0452] For example, such as Figure 31 As shown, a pixel defining portion 401 located on the first electrode 110 of a sub-pixel extends toward the sub-pixel adjacent to the sub-pixel, and the edge of the pixel defining portion 401 is closer to the sub-pixel adjacent to the sub-pixel than the edge of the first electrode 110 of the sub-pixel.

[0453] For example, such as Figure 31 As shown, in two adjacent sub-pixels, the distance between the edges of the two first electrodes 110 that are close to each other is greater than the distance between the edges of the two pixel defining portions 401 located on the two first electrodes 110 that are close to each other.

[0454] Figure 32 This is a partial cross-sectional structural diagram of a display substrate provided according to another embodiment of the present disclosure. Figure 32 The display substrate in the example shown is Figure 31 The difference in the display substrate shown is that a spacing structure 800 is provided between two protrusions 701 that are close to each other and located between two adjacent sub-pixels. Figure 32 The substrate 01 and organic light-emitting element 100 in the display substrate shown can be coupled with... Figures 1A to 9B The substrate 01 and organic light-emitting element 100 in the illustrated embodiment have the same characteristics, and will not be described again here. The other film layers 011 in this example can be... Figures 1A to 9B The other film layers 011 in the illustrated embodiment have the same characteristics and will not be described again here. The planarization layer 500 in this example can be... Figures 16 to 26B The flat layer 500 shown has the same characteristics, which will not be described again here.

[0455] For example, such as Figure 32As shown, a spacer structure 800 is provided between two protrusions 701 that are close to each other. The spacer structure 800 is spaced apart from the protrusions 701, and the spacer structure 800 is made of the same material as the second sub-isolation portion 720. For example, when the display substrate is used in a display product with a low pixel density, the distance between adjacent sub-pixels is set to be large. By providing the spacer structure, it is beneficial to reduce the amount of etching of the first electrode.

[0456] For example, such as Figure 32 As shown, along the direction perpendicular to the substrate 01, the ratio of the thickness of the spacer structure 800 to the thickness of the isolation portion 700 can be 0.8 to 1.2. For example, the ratio of the thickness of the spacer structure 800 to the thickness of the isolation portion 700 can be 0.9 to 1.1. For example, the thickness of the spacer structure 800 can be the same as the thickness of the isolation portion 700.

[0457] For example, Figures 33A to 33B To form Figure 31 A schematic diagram of a previous method for manufacturing a display substrate. For example, as shown... Figure 31 and Figure 33A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 31 and Figure 33A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0458] For example, such as Figure 31 and Figure 33A As shown, an electrode layer is formed on the planarization layer 500, and the electrode layer is patterned to form an inorganic layer pattern, the inorganic layer pattern including a first electrode 110.

[0459] For example, such as Figure 31 and Figure 33B As shown, a pixel defining film and a spacer layer are formed on the first electrode 110. The pixel defining film is patterned to form a pixel defining pattern 400, and the spacer layer is patterned to form a spacer 012.

[0460] For example, such as Figure 31 and Figure 33BAs shown, the pixel-defined pattern 400 includes a first opening 410 exposing the first electrode 110 and a second opening 420 (also referred to as opening pattern 420), the second opening 420 exposing the planarization layer 500, and the second opening 420 being located between adjacent sub-pixels. For example, the edge of the second opening 420 may be flush with the edge of the first electrode 110.

[0461] For example, such as Figure 31 and Figure 33B As shown, etching the inorganic layer pattern exposed by the second opening 420 includes etching the portion of the first electrode 110 near the edge of the second opening 420 so that the edge of the first electrode 110 and the edge of the second opening 420 form an undercut structure.

[0462] For example, Figures 34A to 34B To form Figure 32 A schematic diagram of a previous method for manufacturing a display substrate. For example, as shown... Figure 32 and Figure 34A As shown, the method for fabricating a display substrate may include preparing a substrate 01 on a glass carrier plate. The substrate 01 formed in this example can be coupled with… Figure 4A and Figure 5A The substrate 01 formed in the display substrate shown has the same characteristics, which will not be described again here. For example, as Figure 32 and Figure 34A As shown, the process flow for forming other film layers 011 and planarization layer 500 on substrate 01 can be compared with... Figure 5A The process flow for forming other film layers 011 and planarization layer 500 in the display substrate shown is the same, and can also be the same as... Figure 4A The process flow for forming other film layers 011 and planarization layer 500 in the substrate shown is the same, and will not be described again here.

[0463] For example, such as Figure 32 and Figure 34A As shown, an electrode layer is formed on the planarization layer 500, and the electrode layer is patterned to form an inorganic layer pattern, the inorganic layer pattern including a first electrode 110.

[0464] For example, such as Figure 32 and Figure 34B As shown, a pixel defining film and a spacer layer are formed on the first electrode 110. The pixel defining film is patterned to form a pixel defining pattern 400, and the spacer layer is patterned to form a spacer 012.

[0465] For example, such as Figure 32 and Figure 34BAs shown, the pixel-defined pattern 400 includes a first opening 410 exposing the first electrode 110, a second opening 420 (also referred to as the opening pattern 420), and a spacing structure 800. The second opening 420 exposes the planarization layer 500 and is located between adjacent sub-pixels, with the spacing structure 800 located within the second opening 420. For example, the edge of the second opening 420 may be flush with the edge of the first electrode 110.

[0466] For example, such as Figure 32 and Figure 34B As shown, etching the inorganic layer pattern exposed by the second opening 420 includes etching the portion of the first electrode 110 near the edge of the second opening 420 so that the edge of the first electrode 110 and the edge of the second opening 420 form an undercut structure.

[0467] For example, Figures 27 to 34B The arrangement of multiple sub-pixels in each of the display substrates shown can be compared with... Figures 10A to 10E The multiple sub-pixels in the display substrate shown are arranged in the same way and can... Figures 27 to 34B The isolation section 700 shown can be located in Figures 10A to 10E The position of the groove 210 shown is, for example... Figures 27 to 34B The isolation section 700 shown can be connected with Figures 10A to 10E The grooves 210 shown have the same arrangement, which can Figures 27 to 34B The isolation section 700 shown is replaced. Figures 10A to 10E The groove 210 is shown.

[0468] For example, the isolation portion is located in the second opening of the pixel-defined pattern, and the pixel-defined portions between adjacent sub-pixels can be retained.

[0469] Another embodiment of this disclosure provides a display device, including... Figures 27 to 34B The display substrate shown can be configured such that by providing an isolation portion between adjacent sub-pixels in the display device, the charge generation layer can be broken at the edge of the isolation portion, which helps to reduce the probability of crosstalk between adjacent sub-pixels.

[0470] For example, the display device also includes a cover plate located on the light-emitting side of the display panel.

[0471] For example, the display device can be an organic light-emitting diode display device or other display device, as well as any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator that includes the display device. This embodiment is not limited to this.

[0472] At least one embodiment of this disclosure also provides a display substrate. Figure 35 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 35As shown, the display substrate includes a substrate 01 and a plurality of sub-pixels (not shown); the plurality of sub-pixels are located on the substrate 01, and each sub-pixel includes a light-emitting element; each light-emitting element includes a light-emitting functional layer and a first electrode 110 and a second electrode (not shown) located on both sides of the light-emitting functional layer, the first electrode 110 being located between the light-emitting functional layer and the substrate 01; the second electrode is at least partially located on the side of the light-emitting functional layer away from the first electrode 110. It should be noted that the specific structures of the sub-pixels, light-emitting elements, and light-emitting functional layers can be found in the above embodiments, and will not be repeated here. The embodiments of this disclosure are similar to... Figures 27 to 34B The difference in the embodiment shown is that the first sub-isolation section 710 in this embodiment includes at least two membrane layers.

[0473] For example, such as Figure 35 As shown, the display substrate also includes an isolation portion 700, which includes a first sub-isolation portion 710 and a second sub-isolation portion 720 stacked together. The first sub-isolation portion 710 is located between the second sub-isolation portion 720 and the substrate 01.

[0474] For example, the first sub-isolation portion 710 includes at least two film layers, the protrusion 701 protrudes relative to the edge of the film layer closest to the second sub-isolation portion 720 among the at least two film layers, the at least two film layers include two film layers with different patterns, and / or, the at least two film layers include two film layers with different thicknesses.

[0475] For example, such as Figure 35 As shown, at least one of the multiple sub-functional film layers in the light-emitting functional layer is disconnected at the location of the isolation portion 700. The display substrate 100 also includes a pixel defining pattern 400; a portion of the pixel defining pattern 400 is located on the side of the first electrode away from the substrate 01; the pixel defining pattern 400 includes a plurality of second openings 420.

[0476] like Figure 35 As shown, the second sub-isolation portion 720 includes a recessed structure located at the edge of the first sub-isolation portion 710 and recessed into the pixel defining pattern 400. The second sub-isolation portion 720 is a part of the pixel defining pattern 400. Thus, at least one layer of the light-emitting functional layer is disconnected at the edge of the second sub-isolation portion. Therefore, by providing the aforementioned isolation portion between adjacent sub-pixels, the display substrate can avoid crosstalk between adjacent sub-pixels caused by sub-functional layers with higher conductivity in the light-emitting functional layer.

[0477] For example, in this example, the thickness of the first sub-isolation portion 710 is small, and it does not completely fill the concave structure formed by the second sub-isolation portion 720.

[0478] On the other hand, since this display substrate can avoid crosstalk between adjacent sub-pixels through pixel isolation sections, it can increase pixel density while employing a tandem EL design. Therefore, this display substrate has advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0479] In some examples, such as Figure 35 As shown, the orthographic projection of the concave structure on the substrate 01 overlaps with the orthographic projection of the second sub-isolation portion 720 on the substrate 01.

[0480] Figure 36 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 36 As shown, the recessed structure includes a residual structure, which can be a membrane layer 712 in the first sub-isolator 710. For example, the first sub-isolator 710 includes membrane layers 711 and 712, with a protrusion 701 protruding relative to the edge of the membrane layer 712, and the membrane layers 711 and 712 having different patterns.

[0481] In some examples, such as Figure 36 As shown, the material of film layer 712 includes metallic materials, metal oxides, or inorganic non-metallic materials, such as silver or aluminum, or ITO, IZO, etc.; film layer 711 can be a structure that is in the same layer as the first electrode of the light-emitting element and has the same material, for example, it can include a multilayer structure, such as ITO / Ag / ITO.

[0482] For example, in this example, the thickness of the film layer 711 is small and does not completely fill the concave structure formed by the second sub-isolation portion 720. The film layer 712 fills a portion of the concave structure that the film layer 711 did not fill, but the first sub-isolation portion 710 also does not completely fill the concave structure of the second sub-isolation portion 720.

[0483] One embodiment of this disclosure also provides a display substrate. Figure 37 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 37 The display substrate shown provides another pixel separation structure. For example... Figure 37 As shown, the display substrate 100 also includes a pixel defining pattern 400 located on the substrate 01; the pixel defining pattern 400 is partially located on the side of the first electrode 110 away from the substrate 01; the pixel defining pattern 400 includes a plurality of first openings 410 and second openings 420; the plurality of first openings 410 correspond one-to-one with a plurality of sub-pixels to define the effective light-emitting areas of the plurality of sub-pixels; the first openings 410 are configured to expose the first electrode 110 so that the first electrode 110 can contact the subsequently formed light-emitting functional layer 130. The second openings 420 are located between adjacent first electrodes 110.

[0484] like Figure 37 As shown, the pixel defining portion of the pixel defining pattern 400 can be reused as an isolation portion. In this example, the isolation portion may only include the second sub-isolation portion 720, without including the first sub-isolation portion in the example above. As a result, at least one film layer of the light-emitting functional layer is broken at the location of the second sub-isolation portion. Thus, by providing the aforementioned second sub-isolation portion between adjacent sub-pixels, the display substrate can avoid crosstalk between adjacent sub-pixels caused by the highly conductive sub-functional layer in the light-emitting functional layer.

[0485] Figure 38 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 38 As shown, the second sub-isolation portion 720 forms a concave structure in which a first sub-isolation portion 710 is provided, and the edge of the second sub-isolation portion 720 extends outward relative to the edge of the first sub-isolation portion 710.

[0486] In some examples, such as Figure 38 As shown, the material of the first sub-isolation section 710 includes at least one of a metal, a metal oxide, and an organic compound; the metal may be silver, the metal oxide may be indium zinc oxide, and the organic compound may be a fluoropolymer.

[0487] In some examples, when the material of the first sub-isolation portion 710 is a fluoropolymer, the planarization layer material includes photoresist, polyimide (PI) resin, acrylic resin, silicon compound, or polyacrylic acid resin. Therefore, the solvent of the planarization layer is primarily a non-fluorinated organic solvent. While these photoresists may contain a small amount of fluorination, they are not sufficiently soluble in fluorinated solutions or perfluorinated solvents. Therefore, their orthogonal properties (the solution and solvent do not react with each other) allow for the formation of the aforementioned pixel isolation structure using an etching process.

[0488] For example, the aforementioned fluorinated polymer can be a photosensitive fluorinated polymer, which is a polymer similar to a negative photoresist. Compared to conventional photoresists, this polymer has a fluorine content of 40-70%, and must be dissolved in a perfluorinated solvent, such as HFE7100 or HFE7500. However, perfluorinated solvents cannot dissolve PLN (due to insufficient fluorine content), and the fluorinated polymer is also insoluble in PLN's solvent. These two photoresists and their solvents are orthogonal.

[0489] For example, the chemical formula of the above-mentioned fluoropolymer is shown below:

[0490]

[0491] In this context, R1 represents alkyl groups, H, etc., and R2 represents fluorine-containing groups.

[0492] Figures 39A-39C This is a schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of the present disclosure. The method for manufacturing the display substrate includes:

[0493] like Figure 39A As shown, a first electrode 110 and a sacrificial structure 702 are formed on the side of the planarization layer 500 away from the substrate 01. It should be noted that the aforementioned residual structure (first sub-isolation portion) may be part of the sacrificial structure.

[0494] like Figure 39B As shown, a pixel defining pattern 400 is formed on the side of the first electrode 110 and the sacrificial structure 430 away from the substrate 01. The pixel defining pattern 400 includes a plurality of first openings 410 and second openings 420; the plurality of first openings 410 are disposed one-to-one with a plurality of first electrodes 110; the first openings 410 are configured to expose the first electrodes 110 so that the first electrodes 110 can contact the subsequently formed light-emitting functional layer 130. The second openings 420 are located between adjacent first electrodes 110, and the sacrificial structure 430 is partially exposed by the second openings 420.

[0495] like Figure 39C As shown, the display substrate is etched using the pixel-defined pattern 400 as a mask to remove the sacrificial structure 430, thereby forming the first sub-isolation portion 710 described above.

[0496] Figure 40 This is a schematic diagram of another display substrate provided in an embodiment of the present disclosure. Figure 40 As shown, the display substrate also includes a protective structure 240 located on the planarization layer 500 and disposed in the same layer as the first electrode 110; a first sub-isolation portion 710 is disposed on the side of the protective structure 240 away from the substrate 01 and located at the edge of the protective structure 240. Thus, the protective structure 240 can protect the planarization layer 500 during the etching process used to fabricate the first sub-isolation portion 710, preventing the planarization layer 500 from being etched.

[0497] In some examples, such as Figure 40 As shown, the display substrate also includes a light-emitting functional layer 130 and a second electrode 120; the light-emitting functional layer 130 is located on the side of the first electrode 110, the pixel defining pattern 400, and the protective structure 240 away from the substrate 01. Due to the function of the isolation portion, the light-emitting functional layer 130 will be broken at the location of the isolation portion, forming a break; at this time, the subsequently formed second electrode 120 can be connected to the protective structure 240 through the break, and the protective structure 240 can act as an auxiliary electrode.

[0498] In this display substrate, the second electrode is a shared electrode for multiple sub-pixels to provide cathode signals to multiple sub-pixels; even if part of the second electrode in the entire display substrate is disconnected due to pixel isolation structure or other reasons, the protective structure, as an auxiliary electrode, can connect the disconnected part of the second electrode to other parts.

[0499] Figures 41A-41C This is a schematic diagram illustrating the steps of another method for manufacturing a display substrate according to an embodiment of the present disclosure. The method for manufacturing the display substrate includes:

[0500] For example, such as Figure 41A As shown, a first electrode 110, a protective structure 240, and a sacrificial structure 430 are formed on the side of the planarization layer 500 away from the substrate 01. The protective structure 240 is disposed in the same layer as the first electrode 110. The material of the protective structure 240 is the same as that of the first electrode 110, but the material of the protective structure 240 is different from that of the sacrificial structure 430.

[0501] For example, such as Figure 41B As shown, a pixel defining pattern 400 is formed on the side of the first electrode 110 and the sacrificial structure 430 away from the substrate 01. The pixel defining pattern 400 includes a plurality of first openings 410 and second openings 420; the plurality of first openings 410 are disposed one-to-one with a plurality of first electrodes 110; the first openings 410 are configured to expose the first electrodes 110 so that the first electrodes 110 can contact the subsequently formed light-emitting functional layer 130. The second openings 420 are located between adjacent first electrodes 110, and the sacrificial structure 430 is partially exposed by the second openings 420.

[0502] For example, such as Figure 41C As shown, the display substrate is etched using the pixel-defined pattern 400 as a mask to remove the sacrificial structure 430, thereby forming the first sub-isolation portion 710 described above.

[0503] For example, a light-emitting functional layer 130 and a second electrode 120 are formed on the side of the first electrode 110, the pixel defining pattern 400, and the protective structure 240 away from the substrate 01. Due to the function of the isolation portion, the light-emitting functional layer 130 will be broken at the location of the isolation portion, forming a break; at this time, the subsequently formed second electrode 120 can be connected to the protective structure 240 through the break, and the protective structure 240 can act as an auxiliary electrode.

[0504] For example, in this display substrate, the second electrode is a shared electrode for multiple sub-pixels to provide cathode signals to multiple sub-pixels; even if part of the second electrode in the entire display substrate is disconnected due to pixel isolation structure or other reasons, the protective structure, as an auxiliary electrode, can connect the disconnected part of the second electrode to other parts.

[0505] The following points need to be explained:

[0506] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure, and other structures can be referred to the general design.

[0507] (2) Where there is no conflict, features of the same embodiment and different embodiments of this disclosure may be combined with each other.

[0508] The above description is merely an exemplary embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure, which is determined by the appended claims.

Claims

1. A display substrate, comprising: a substrate, comprising at least a first display area; a plurality of sub-pixels, located on the substrate in the first display area, each of at least some of the sub-pixels comprising a light-emitting element, the light-emitting element comprising a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer in a direction perpendicular to the substrate, the first electrode being located between the light-emitting functional layer and the substrate, the light-emitting functional layer comprising a plurality of film layers; a pixel definition pattern, the pixel definition pattern in the first display area comprising a plurality of first openings, wherein the display substrate further comprises an isolation structure, at least one isolation structure being provided between adjacent sub-pixels, the isolation structure comprising a first sub-isolation structure and a second sub-isolation structure stacked together, the first sub-isolation structure being located between the second sub-isolation structure and the substrate; in a direction of arrangement of adjacent sub-pixels, a size of the first sub-isolation structure in the isolation structure between the adjacent sub-pixels is smaller than a size of the second sub-isolation structure, so that the second sub-isolation structure comprises a portion protruding relative to an edge of the first sub-isolation structure; or, at least part of a side surface of the first sub-isolation structure has a slope angle greater than 60 degrees and less than 120 degrees with respect to a plane of a contact surface parallel to the first sub-isolation structure and the second sub-isolation structure; at least one of the plurality of film layers is broken at the isolation structure; the isolation structure is located between adjacent sub-pixels of different colors, a material of the second sub-isolation structure comprises an organic material, a surface of the second sub-isolation structure away from the substrate is a curved surface, and the curved surface is curved towards the first sub-isolation structure, the light-emitting functional layer comprises a first light-emitting layer, a charge generation layer and a second light-emitting layer stacked together, the charge generation layer is located between the first light-emitting layer and the second light-emitting layer, and the charge generation layer is broken at the isolation structure, the second electrode is an electrode continuously provided in an entire layer, a film layer of the first sub-isolation structure and an electrode layer of the first electrode are provided in the same layer and have the same material, and the second sub-isolation structure is part of the pixel definition pattern. 2.The display substrate of claim 1, wherein, a material of the first sub-isolation structure is different from a material of the second sub-isolation structure. 3.The display substrate of claim 2, wherein, the material of the first sub-isolation structure comprises inorganic non-metallic material or metal material. 4.The display substrate of claim 2, wherein, the material of the first sub-isolation structure comprises metal oxide. 5.The display substrate of any one of claims 2-4, wherein, a distance between a surface of the isolation structure facing the substrate and the substrate is smaller than a distance between a surface of the first electrode facing the substrate and the substrate. 6.The display substrate of claim 1, wherein, the second sub-isolation structure comprises a central region distributed along a direction of arrangement of two sub-pixels adjacent to the second sub-isolation structure and edge regions located on both sides of the central region, in a direction perpendicular to the substrate, a thickness of the central region of the second sub-isolation structure is greater than a thickness of the edge regions. 7.The display substrate of claim 1, wherein, An angle of slope of a portion of the second sub-isolation structure protruding relative to an edge of the first sub-isolation structure away from a surface of the first sub-isolation structure is less than an angle of slope of at least a portion of a side surface of the second sub-isolation structure to a plane parallel to a contact surface of the first sub-isolation structure and the second sub-isolation structure. 8.The display substrate of claim 7, wherein, An angle of slope of a portion of the second sub-isolation structure protruding relative to an edge of the first sub-isolation structure away from a surface of the first sub-isolation structure is 15-70 degrees. 9.The display substrate of any one of claims 1-3, wherein, A ratio of a thickness of the first sub-isolation structure to a thickness of the light-emitting functional layer is 0.7-1.

5. 10.The display substrate of claim 9, wherein, The second electrode is continuously provided at the portion of the second sub-isolation structure protruding relative to an edge of the first sub-isolation structure. 11.The display substrate according to claim 3 or 4, wherein An organic layer is provided between the first electrode and the substrate, the first electrode is in contact with a surface of the organic layer, and the second sub-isolation structure is made of the same material as the organic layer.

12. The display substrate of claim 11, further comprising: a first conductive layer between the first electrode and the substrate; a second conductive layer on a side of the first conductive layer away from the substrate, wherein the first conductive layer includes a first power signal line and a data line, the second conductive layer includes a second power signal line, and the first sub-isolation structure is provided in the same layer as the second conductive layer.

13. The display substrate according to any one of claims 2-4, wherein, The first sub-isolation structure includes at least one film layer, and the first electrode includes at least one electrode layer.

14. The display substrate according to any one of claims 1-4, wherein, One of the sub-pixels corresponds to at least one first opening, and a light-emitting element of the sub-pixel is at least partially located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode. The pixel-defining pattern further includes a plurality of second openings, the isolation structure is located in the second opening, and the isolation structure is spaced apart from a sidewall of the second opening. 15.The display substrate of claim 14, wherein, The pixel-defining pattern includes a pixel-defining portion between the first opening and the second opening, an angle between a sidewall of the first opening and a plane parallel to the substrate is different from an angle between a sidewall of the second opening and the plane parallel to the substrate.

16. The display substrate of claim 14, further comprising: a planar layer between the substrate and the pixel-defining pattern, wherein the isolation structure and the first electrode are both located on the planar layer.

17. The display substrate according to any one of claims 1-3, wherein, At least one of the first sub-isolation structure and the second sub-isolation structure includes at least one film layer.

18. The display substrate according to any one of claims 1-3, wherein, A film layer of the light-emitting functional layer facing a side of the substrate is disconnected at the isolation structure. 19.The display substrate of claim 1, wherein, In a same sub-pixel, a color of light emitted by the first light-emitting layer is the same as a color of light emitted by the second light-emitting layer, and in at least two adjacent sub-pixels, a color of light emitted by a light-emitting layer is different.

20. The display substrate of any one of claims 1-3, wherein, The light-emitting functional layer includes a light-emitting layer, and an area of a projection of at least one disconnected film layer in the light-emitting functional layer on the substrate is greater than an area of a projection of the light-emitting layer on the substrate.

21. The display substrate according to any one of claims 1-3, wherein, The light-emitting functional layer includes at least one light-emitting layer, and the film layer that is broken at the isolation structure includes at least one light-emitting layer and at least one other film layer; The area of the orthographic projection of the at least one other film layer that is broken on the substrate is greater than the area of the orthographic projection of the at least one light-emitting layer that is broken on the substrate. Alternatively, The area of the portion of the at least one other film layer that is broken that covers the isolation structure is greater than the area of the portion of the at least one light-emitting layer that is broken that covers the isolation structure.

22. The display substrate of any one of claims 1-3, wherein, The orthographic projection of the second electrode and the isolation structure on the substrate overlaps at least one of the multiple film layers included in the light-emitting functional layer.

23. The display substrate of claim 20, wherein, At least part of the at least one of the multiple film layers included in the light-emitting functional layer covers part of the side surface of the isolation structure.

24. The display substrate according to any one of claims 1-3, wherein, The substrate further includes a second display area, and the first display area surrounds at least part of the second display area.

25. The display substrate of any one of claims 1-3, wherein, The thickness of the first sub-isolation structure is greater than the thickness of the light-emitting functional layer.

26. A display device, comprising the display substrate according to any one of claims 1-25.

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