Hardware antiseptic and preparation method thereof, and power transmission network hardware antiseptic

Abstract

The hardware anti-corrosion agent provided in the present application can block stress concentration points and hardware connections, so that corrosive media cannot pass through various gaps caused by hardware connections. At the same time, under the synergistic effect of each component and the weight ratio of each component, the hardware anti-corrosion agent provided in the present application has excellent anti-corrosion performance; synergistic anode sacrificial agent, even after a trace amount of medium infiltration, can form excellent protective performance for hardware through the cathodic protection effect of the sacrificial anode. Furthermore, the hardware anti-corrosion agent in the present application has good adhesion and elasticity. The hardware anti-corrosion agent described in the present application is used to block the gaps, threads, and connections of the hardware. The good adhesion allows the blocking agent to remain on the surface of the hardware continuously, and the good elasticity allows the anti-corrosion agent to deform with the deformation of the hardware, and will not form peeling caused by stress concentration, thereby achieving a lasting protective effect.

Description

Technical Field

[0001] The present application relates to the field of electric power engineering materials, and in particular to a hardware anti-corrosion agent and a preparation method thereof, and a power transmission network hardware anti-corrosion agent. Background Art

[0002] The power transmission and transformation system undertakes the important tasks of power transformation and transmission in the power system. It is the only channel connecting power plants and power users and is one of the most important infrastructures in all countries. However, in the construction and operation environment of the power transmission and transformation system, corrosion will cause the materials, equipment, facilities, etc. in the system to reduce performance, increase maintenance, and even be scrapped prematurely. Among them, the corrosion of transmission network hardware is particularly serious. In actual use, the transmission network hardware suffers from crevice corrosion, stress corrosion, galvanic corrosion, and chemical medium corrosion. Due to the large number of hardware, complex shapes, scattered locations, different stress conditions, and various installation and connection methods, crevice corrosion is one of the main causes of hardware corrosion.

[0003] At present, the corrosion protection of hardware is generally solved by metal coating. However, it is impossible to increase the anti-corrosion layer in the stress concentration or gap during use. As the frequency of use increases, the coating of the hardware will fail, local corrosion will occur, and its anti-corrosion performance will be reduced. Summary of the invention

[0004] Based on this, the present application provides a hardware anti-corrosion agent and a preparation method thereof, as well as a power transmission network hardware anti-corrosion agent. The hardware anti-corrosion agent provided in the present application can be specifically coated on stress concentration or gaps, and has excellent anti-corrosion performance.

[0005] In a first aspect of the present application, a metal fittings preservative is provided, comprising the following components in parts by weight:

[0006]

[0007] In one embodiment, the number average molecular weight of the α,ω-dihydroxy polysiloxane is 10,000 to 80,000;

[0008] The mass fraction of hydroxyl groups in the α,ω-dihydroxy polysiloxane is 0.3% to 1.5%.

[0009] In one embodiment, the α,ω-dihydroxy polysiloxane includes one or more of α,ω-dihydroxy polydimethylsiloxane and α,ω-dihydroxy polydiethylsiloxane.

[0010] In one embodiment, the curing agent includes one or more of methyl triisopropenyloxy silane, ethyl triisopropenyloxy silane, phenyl triisopropenyloxy silane and vinyl triisopropenyloxy silane.

[0011] In one embodiment, the anode sacrificial agent includes one or more of zinc powder, zinc-magnesium alloy powder and zinc-aluminum alloy powder.

[0012] In one embodiment, the other additives include one or more of a catalyst, a thickener and an activator; the weight portion of the catalyst is 0.01 to 1 part; the weight portion of the thickener is 0.5 to 5 parts; the weight portion of the activator is 0.5 to 2 parts.

[0013] In one embodiment, the other auxiliary agent has one or more of the following characteristics:

[0014] (1) The catalyst comprises one or more of isopropyl tri(dioctyl pyrophosphate) titanate, tetraisopropyl bis(dioctyl phosphite) titanate, tetraoctyl bis[di(dodecyl)phosphite] titanate and 1,1,3,3-tetramethylguanidinepropyltrimethoxysilane;

[0015] (2) The thickener includes one or more of organic bentonite powder and BYK410;

[0016] (3) The activator includes one or more of sodium thiosulfate and potassium thiosulfate.

[0017] The second aspect of the present application provides a method for preparing the metal fittings antiseptic according to the first aspect of the present application, comprising the following steps:

[0018] The components are mixed and then dispersed to prepare the metal fittings antiseptic.

[0019] In one embodiment, the dispersion process parameters include: the pressure is set to 0.05Mpa to 0.09Mpa.

[0020] The third aspect of the present application provides a transmission network hardware anti-corrosion agent, including the hardware anti-corrosion agent described in the first aspect of the present application.

[0021] The hardware anticorrosion agent provided by the present application can block stress concentration points and hardware connections, so that corrosive media cannot pass through various gaps caused by hardware connections. At the same time, under the synergistic effect of each component and the weight ratio of each component, the hardware anticorrosion agent provided by the present application has excellent anticorrosion performance; in synergistic with the anode sacrificial agent, trace media can form excellent protective performance for hardware through the cathodic protection effect of the sacrificial anode after penetration.

[0022] Furthermore, the hardware anti-corrosion agent in the present application has good adhesion and elasticity. The hardware anti-corrosion agent described in the present application is used to seal the gaps, threads, and connections of the hardware. The good adhesion enables the sealing agent to remain on the surface of the hardware continuously, and the good elasticity enables the anti-corrosion agent to deform with the deformation of the hardware, and will not form peeling caused by stress concentration, thereby achieving a long-lasting protective effect. DETAILED DESCRIPTION

[0023] The following is a further complete and clear description of the hardware anticorrosion agent, the preparation method of the hardware anticorrosion agent, and the power transmission network hardware anticorrosion agent of the present application in conjunction with specific examples. The present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0025] As used herein, "one or more" refers to any one, any two, or any two or more of the listed items.

[0026] In this application, "first aspect", "second aspect", "third aspect", "fourth aspect", "fifth aspect", etc. are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity, nor can they be understood as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first", "second", "third", "fourth", "fifth", etc. only serve the purpose of non-exhaustive enumeration and description, and it should be understood that they do not constitute a closed limitation on quantity.

[0027] In the present application, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0028] In this application, when it comes to numerical ranges, unless otherwise specified, the above numerical ranges are deemed to be continuous and include the minimum and maximum values ​​of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values ​​of the range is included. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges included therein.

[0029] The percentage contents involved in this application, unless otherwise specified, refer to mass percentage for solid-liquid mixing and solid-solid mixing, and refer to volume percentage for liquid-liquid mixing.

[0030] The percentage concentrations mentioned in this application, unless otherwise specified, refer to the final concentration, which refers to the percentage of the added component in the system after the addition of the component.

[0031] The temperature parameters in this application, unless otherwise specified, allow for both constant temperature treatment and treatment within a certain temperature range. The constant temperature treatment allows the temperature to fluctuate within the accuracy range of instrument control.

[0032] In the present application, unless otherwise specified, "α,ω-dihydroxy polysiloxane" refers to a polysiloxane containing two hydroxyl-terminated polysiloxanes, wherein the Si atoms to which the two hydroxyl groups are connected are the farthest apart.

[0033] In a first aspect of the present application, a metal fittings preservative is provided, comprising the following components in parts by weight:

[0034]

[0035] Specifically, the weight proportion of the α,ω-dihydroxy polysiloxane includes, but is not limited to, 90 parts, 95 parts, 98 parts, 99 parts, 100 parts, 105 parts or 110 parts.

[0036] Specifically, the weight proportions of the curing agent include but are not limited to 2 parts, 4 parts, 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, 40 parts, 45 parts or 50 parts.

[0037] Specifically, the weight percentage of the anode sacrificial agent includes but is not limited to 200 parts, 300 parts, 400 parts, 450 parts, 500 parts, 800 parts, 900 parts, 1000 parts, 1400 parts, 1500 parts, 1600 parts, 2000 parts, 2400 parts, 2500 parts, 2600 parts, 2800 parts or 3000 parts.

[0038] The hardware anticorrosion agent provided by the present application can block stress concentration points and hardware connections, so that corrosive media cannot pass through various gaps caused by hardware connections. At the same time, under the synergistic effect of each component and the weight ratio of each component, the hardware anticorrosion agent provided by the present application has excellent anticorrosion performance; after the trace medium penetrates the sacrificial anode, it can form excellent protective performance for the hardware through the cathodic protection of the sacrificial anode, thereby reducing the maintenance work of the hardware, extending the maintenance cycle of the hardware, and increasing the service life of the hardware.

[0039] Furthermore, the hardware anti-corrosion agent in the present application has good adhesion and elasticity. The hardware anti-corrosion agent described in the present application is used to seal the gaps, threads, and connections of the hardware. The good adhesion enables the sealing agent to remain on the surface of the hardware continuously, and the good elasticity enables the anti-corrosion agent to deform with the deformation of the hardware, and will not form peeling caused by stress concentration, thereby achieving a long-lasting protective effect.

[0040] In one example, the number average molecular weight of the α,ω-dihydroxy polysiloxane is 10,000 to 80,000;

[0041] The mass fraction of hydroxyl groups in the α,ω-dihydroxy polysiloxane is 0.3% to 1.5%. The present application limits the mass fraction of hydroxyl groups in the α,ω-dihydroxy polysiloxane so that the prepared metal preservative has good bonding performance and elasticity. When the hydroxyl content is lower than this range, the prepared metal preservative has slightly poor strength and bonding performance; when the hydroxyl content is higher than this range, the prepared metal preservative is slightly brittle and has slightly poor elasticity.

[0042] In one example, the α,ω-dihydroxy polysiloxane includes one or more of α,ω-dihydroxy polydimethylsiloxane and α,ω-dihydroxy polydiethylsiloxane.

[0043] In one example, the curing agent includes one or more of methyl triisopropenyloxysilane, ethyl triisopropenyloxysilane, phenyl triisopropenyloxysilane and vinyl triisopropenyloxysilane. The curing agent is used to control the curing speed, and the curing speed is moderate, and the substrate is not corrosive, and the cured product has excellent performance.

[0044] In one example, the anode sacrificial agent includes one or more of zinc powder, zinc-magnesium alloy powder and zinc-aluminum alloy powder. The anode sacrificial agent has an excellent cathode protection effect and can still provide continuous protection current to the hardware after the corrosive medium penetrates.

[0045] In one example, the fineness of the anode sacrificial agent is 500-1800 mesh.

[0046] In one specific example, the mass fraction of zinc in the zinc-magnesium alloy powder is 90% to 95%.

[0047] In one specific example, the mass fraction of zinc in the zinc-aluminum alloy powder is 50% to 80%.

[0048] In one example, the other auxiliary agents include one or more of a catalyst, a thickener, and an activator.

[0049] In one example, the weight portion of the catalyst is 0.01 to 1 part. It is understandable that the weight portion of the catalyst can be selected from any value between 0.01 and 1 part. Specifically, the weight portion of the catalyst includes but is not limited to 0.01, 0.015, 0.02, 0.1, 0.4, 0.5, 0.6, 0.7, 0.78, 0.8, 0.9 or 1 part.

[0050] In one example, the catalyst includes one or more of isopropyl tri(dioctyl pyrophosphate) titanate, tetraisopropyl bis(dioctyl phosphite) titanate, tetraoctyl bis[di(dodecyl)phosphite] titanate and 1,1,3,3-tetramethylguanidine propyl trimethoxysilane. By selecting the above catalysts, the catalytic speed can be increased without affecting the adhesion, elasticity and corrosion resistance of the prepared metal preservative.

[0051] In one example, the weight portion of the thickener is 0.5 to 5 parts. It is understandable that the weight portion of the thickener can be selected from any value between 0.5 and 5 parts. Specifically, the weight portion of the thickener includes but is not limited to 0.5, 0.6, 0.9, 1, 2, 2.4, 2.5, 2.6, 2.7, 3, 4 or 5 parts.

[0052] In one example, the thickener includes one or more of organic bentonite powder and BYK 410. The thickener is selected from organic bentonite powder and BYK 410, and has the advantages of low cost and good thixotropy.

[0053] In one example, the weight portion of the activator is 0.5 to 2 parts. It is understandable that the weight portion of the activator can be selected from any value between 0.5 and 2 parts. Specifically, the weight portion of the activator includes but is not limited to 0.5, 0.6, 0.7, 0.75, 0.8, 1, 1.4, 1.5, 1.6, 1.8 or 2 parts.

[0054] In one example, the activator includes one or more of sodium thiosulfate and potassium thiosulfate. Selecting sodium thiosulfate and potassium thiosulfate as the activator can effectively activate the anode sacrificial agent and prevent the anode sacrificial agent from having a reduced protection current and a poor protection effect after surface oxidation.

[0055] In one example, the metal fittings antiseptic comprises the following components in parts by weight:

[0056]

[0057]

[0058] Through the cooperation of α,ω-dihydroxypolysiloxane and curing agent, the hardware anticorrosion agent can ensure a moderate curing speed, improve the bonding effect with the substrate, and has no corrosion to the hardware; at the same time, the synergistic effect of the anode sacrificial agent and the activator can provide a continuous protective current to the hardware after the penetration of the corrosive medium, so that the hardware anticorrosion agent has an excellent cathodic protection effect; further, the addition of catalysts and thickeners can make the hardware anticorrosion agent elastic while ensuring the catalytic rate.

[0059] The second aspect of the present application provides a method for preparing the metal fittings antiseptic according to the first aspect of the present application, comprising the following steps:

[0060] The components are mixed and then dispersed to prepare the metal fittings antiseptic.

[0061] In one example, the dispersion process parameters include: the pressure is set to 0.05Mpa to 0.09Mpa.

[0062] In one example, the dispersion process parameters include: the dispersion time is set to 15min to 30min.

[0063] In one example, the method for preparing the metal fittings preservative comprises the following steps:

[0064] At 25° C. to 50° C., nitrogen is charged into a stirring kettle, α,ω-dihydroxy polysiloxane and an anode sacrificial agent are added into the stirring kettle according to weight parts for primary mixing, and after mixing, a curing agent and other additives are added according to weight parts for secondary mixing to prepare a mixed solution;

[0065] After the mixed liquid is dispersed, nitrogen is added to normal pressure to prepare the metal fitting antiseptic.

[0066] In one example, the process parameters of the initial mixing include: the rotation speed is set to 50r / min to 200r / min, and the stirring time is set to 20min to 60min.

[0067] In one example, the process parameters of the secondary mixing include: the rotation speed is set to 50r / min to 200r / min, and the stirring time is set to 30min to 70min.

[0068] The third aspect of the present application provides a transmission network hardware anti-corrosion agent, including the hardware anti-corrosion agent described in the first aspect of the present application.

[0069] The following are specific examples. Unless otherwise specified, the raw materials used in the examples are all commercially available products.

[0070] The raw materials used in this application are as follows:

[0071] α,ω-dihydroxypolydimethylsiloxane, number average molecular weight: 30000~50000;

[0072] α,ω-dihydroxypolydiethylsiloxane, number average molecular weight: 40000~60000.

[0073] Example 1

[0074] Embodiment 1 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0075] Step S1, weighing raw materials in a weight ratio of: 100 parts by weight of α,ω-dihydroxypolydimethylsiloxane; 2 parts by weight of methyltriisopropyleneoxysilane; 0.01 parts of isopropyl tri(dioctyl pyrophosphate) titanate; 0.5 parts of organic bentonite powder; 200 parts of zinc powder; and 0.5 parts of sodium thiosulfate.

[0076] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolysiloxane and zinc powder into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add methyl triisopropyleneoxy silane, isopropyl tri(dioctyl pyrophosphate) titanate, organic bentonite powder, and sodium thiosulfate in sequence under stirring, the stirring speed is 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 1.

[0077] Example 2

[0078] Embodiment 2 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0079] Step S1, weighing raw materials in the following weight proportions: 100 parts by weight of α,ω-dihydroxypolydiethylsiloxane; 50 parts by weight of ethyltriisopropyleneoxysilane; 1 part by weight of tetraisopropylbis(dioctylphosphite)titanate; 5 parts by weight of BYK410; 3000 parts by weight of zinc-magnesium alloy powder; and 2 parts by weight of potassium thiosulfate.

[0080] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolysiloxane and zinc-magnesium alloy powder into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add ethyl triisopropyleneoxy silane, tetraisopropyl bis(dioctylphosphite) titanate, BYK410, and potassium thiosulfate in sequence under stirring, with a stirring speed of 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 2.

[0081] Example 3

[0082] Embodiment 3 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0083] Step S1, 100 parts by weight of α, ω-dihydroxypolydimethylsiloxane; and 5 parts by weight of phenyltriisopropyloxysilane; and 0.02 parts by weight of tetraoctylbis[di(dodecyl)phosphite]titanate; and 1 part by weight of organic bentonite powder; and 400 parts by weight of zinc-aluminum alloy powder; and 0.75 parts by weight of sodium thiosulfate.

[0084] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α, ω-dihydroxypolysiloxane and zinc-aluminum alloy powder into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add phenyl triisopropyleneoxy silane, tetra-octyl bis[di(dodecyl)phosphite] titanate, organic bentonite powder, and sodium thiosulfate in sequence under stirring, the stirring speed is 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 3.

[0085] Example 4

[0086] Embodiment 4 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0087] Step S1, weighing raw materials in the following weight ratios: 100 parts by weight of α,ω-dihydroxypolydiethylsiloxane; 40 parts by weight of vinyltriisopropenoxysilane; 0.8 parts by weight of 1,1,3,3-tetramethylguanidinepropyltrimethoxysilane; 5 parts by weight of BYK410; 2500 parts by weight of zinc powder; and 1.5 parts by weight of potassium thiosulfate.

[0088] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolysiloxane and zinc powder into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add vinyl triisopropyleneoxysilane, 1,1,3,3-tetramethylguanidinepropyl trimethoxysilane, BYK410, and potassium thiosulfate in sequence under stirring, with a stirring speed of 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 4.

[0089] Example 5

[0090] Embodiment 5 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0091] Step S1, weigh the raw materials in a weight ratio of: 5 parts by weight of α, ω-dihydroxy polydimethylsiloxane, and 95 parts by weight of α, ω-dihydroxy polydiethylsiloxane; and 0.5 parts by weight of methyl triisopropyleneoxysilane; and 0.5 parts by weight of ethyl triisopropyleneoxysilane; and 0.5 parts by weight of phenyl triisopropyleneoxysilane; and 0.5 parts by weight of vinyl triisopropyleneoxysilane; and 0.005 parts by weight of isopropyl tri(dioctyl pyrophosphate) titanate; and 0.005 parts by weight of tetraisopropyleneoxysilane; Propyl bis(dioctyl phosphite) titanate; and 0.005 parts by weight of tetraoctyl bis[di(dodecyl)phosphite] titanate; and 0.005 parts by weight of 1,1,3,3-tetramethylguanidine propyltrimethoxysilane; and 0.25 parts by weight of organic bentonite powder; and 0.25 parts by weight of BYK410; and 70 parts by weight of zinc powder; and 70 parts by weight of zinc-magnesium alloy powder; and 60 parts by weight of zinc-aluminum alloy powder; and 0.25 parts by weight of sodium thiosulfate; and 0.25 parts by weight of potassium thiosulfate.

[0092] Step S2, at 45° C., first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolysiloxane, zinc powder, zinc-magnesium alloy powder, and zinc-aluminum alloy powder into the stirring kettle, set the stirring speed to 200 r / min, and disperse for 40 minutes until the mixture is uniformly mixed; then add methyl triisopropenyloxysilane, ethyl triisopropenyloxysilane, phenyl triisopropenyloxysilane, vinyl triisopropenyloxysilane, isopropyl tri(dioctyl pyrophosphate) titanate, Tetraisopropyl bis(dioctyl phosphite) titanate, tetraoctyl bis[di(dodecyl) phosphite] titanate, 1,1,3,3-tetramethylguanidinepropyltrimethoxysilane, organic bentonite powder, BYK410, sodium thiosulfate, potassium thiosulfate, stirring speed of 180r / min, disperse for 50 minutes, mix thoroughly; then disperse at a pressure of 0.08Mpa for 20 minutes, then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 5.

[0093] Example 6

[0094] Embodiment 6 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0095] Step S1, weigh the raw materials in the following weight ratios: 95 parts by weight of α,ω-dihydroxy polydimethylsiloxane, and 5 parts by weight of α,ω-dihydroxy polydiethylsiloxane; and 12.5 parts by weight of methyl triisopropenyloxysilane; and 12.5 parts by weight of ethyl triisopropenyloxysilane; and 12.5 parts by weight of phenyl triisopropenyloxysilane; and 12.5 parts by weight of vinyl triisopropenyloxysilane; and 0.25 parts by weight of isopropyl tri(dioctyl pyrophosphate) titanate; and 0.25 parts by weight of of tetraisopropyl bis(dioctyl phosphite) titanate; and 0.25 parts by weight of tetraoctyl bis[di(dodecyl)phosphite] titanate; and 0.25 parts by weight of 1,1,3,3-tetramethylguanidine propyltrimethoxysilane; and 2.5 parts by weight of organic bentonite powder; and 2.5 parts by weight of BYK410; and 1000 parts by weight of zinc powder; and 1000 parts by weight of zinc-magnesium alloy powder; and 1000 parts by weight of zinc-aluminum alloy powder; and 1 part by weight of sodium thiosulfate; and 1 part by weight of potassium thiosulfate.

[0096] Step S2, at 45° C., first fill a stirring kettle with nitrogen, add weighed α,ω-dihydroxypolydimethylsiloxane, α,ω-dihydroxypolydiethylsiloxane, zinc powder, zinc-magnesium alloy, and zinc-aluminum alloy powder into the stirring kettle, set the stirring speed to 200 r / min, and disperse for 40 minutes until the mixture is evenly mixed;

[0097] Then, methyl triisopropenyloxysilane, ethyl triisopropenyloxysilane, phenyl triisopropenyloxysilane, vinyl triisopropenyloxysilane, isopropyl tri(dioctyl pyrophosphate) titanate, tetraisopropyl bis(dioctyl phosphite) titanate, tetraoctyl bis[di(dodecyl) phosphite] titanate, 1,1,3,3-tetramethylguanidine propyl trimethoxysilane, organic bentonite powder, BYK410, sodium thiosulfate and potassium thiosulfate were added under stirring, the stirring speed was 180r / min, the mixture was dispersed for 50 minutes, and the mixture was fully mixed; then, the mixture was dispersed at a pressure of 0.08Mpa for 20 minutes, and nitrogen was filled to release the vacuum to normal pressure, and finally the hardware preservative of Example 6 was obtained.

[0098] Example 7

[0099] Embodiment 7 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0100] Step S1, weigh the raw materials in the following weight proportions: 50 parts by weight of α,ω-dihydroxypolydimethylsiloxane, and 50 parts by weight of α,ω-dihydroxypolydiethylsiloxane; and 10 parts by weight of methyltriisopropenoxysilane; and 10 parts by weight of ethyltriisopropenoxysilane; and 0.25 parts by weight of isopropyl tri(dioctyl pyrophosphate) titanate; and 0.25 parts by weight of tetraisopropyl bis(dioctyl phosphite) titanate; and 1.3 parts by weight of organic bentonite powder; and 1.3 parts by weight of BYK410; and 500 parts by weight of zinc powder; and 500 parts by weight of zinc-magnesium alloy powder; and 500 parts by weight of zinc-aluminum alloy powder; and 0.5 parts by weight of sodium thiosulfate; and 0.5 parts by weight of potassium thiosulfate.

[0101] Step S2, at 45 ° C, first fill nitrogen into a stirring kettle, add weighed α, ω-dihydroxy polydimethylsiloxane, α, ω-dihydroxy polydiethylsiloxane, zinc powder, zinc-magnesium alloy powder, and zinc-aluminum alloy powder into the stirring kettle, set the stirring speed to 200 r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add methyl triisopropenyloxy silane, ethyl triisopropenyloxy silane, isopropyl tri(dioctyl pyrophosphate) titanate, tetraisopropyl bis(dioctyl phosphite) titanate, organic bentonite powder, BYK410, sodium thiosulfate and potassium thiosulfate under stirring, the stirring speed is 180 r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08 MPa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 7.

[0102] Example 8

[0103] Embodiment 8 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0104] Step S1, weighing raw materials in a weight ratio of: 50 parts by weight of α, ω-dihydroxy polydimethylsiloxane, and 50 parts by weight of α, ω-dihydroxy polydiethylsiloxane; and 10 parts by weight of phenyl triisopropenyloxy silane; and 10 parts by weight of vinyl triisopropenyloxy silane; and 0.25 parts by weight of tetraoctyl bis[di(dodecyl)phosphite] titanate; and 0.25 parts by weight of 1,1,3,3-tetramethylguanidine propyltrimethoxysilane; and 1.3 parts by weight of organic bentonite powder; and 1.3 parts by weight of BYK410; and 500 parts by weight of zinc powder; and 500 parts by weight of zinc-magnesium alloy powder; and 500 parts by weight of zinc-aluminum alloy powder; and 0.5 parts by weight of sodium thiosulfate; and 0.5 parts by weight of potassium thiosulfate.

[0105] Step S2, at 45 ° C, first fill nitrogen into a stirring kettle, add weighed α, ω-dihydroxypolydimethylsiloxane, α, ω-dihydroxypolydiethylsiloxane, zinc powder, zinc-magnesium alloy powder, and zinc-aluminum alloy powder into the stirring kettle, set the stirring speed to 200 r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add phenyl triisopropenyloxysilane, vinyl triisopropenyloxysilane, tetra-octylbis[di(dodecyl)phosphite] titanate, 1,1,3,3-tetramethylguanidinepropyltrimethoxysilane, organic bentonite powder, BYK410, sodium thiosulfate and potassium thiosulfate under stirring, the stirring speed is 180 r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08 MPa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 8.

[0106] Example 9

[0107] Embodiment 9 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0108] Step S1, weighing raw materials in a weight ratio of: 50 parts by weight of α, ω-dihydroxy polydimethylsiloxane, and 55 parts by weight of α, ω-dihydroxy polydiethylsiloxane; and 10 parts by weight of methyl triisopropenyloxy silane; and 10 parts by weight of ethyl triisopropenyloxy silane; and 0.25 parts by weight of tetraoctyl bis[di(dodecyl)phosphite] titanate; and 0.25 parts by weight of 1,1,3,3-tetramethylguanidine propyltrimethoxysilane; and 2.5 parts by weight of organic bentonite powder; and 500 parts by weight of zinc powder; and 500 parts by weight of zinc-magnesium alloy powder; and 500 parts by weight of zinc-aluminum alloy powder; and 1 part by weight of sodium thiosulfate.

[0109] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolydimethylsiloxane, α,ω-dihydroxypolydiethylsiloxane, zinc powder, zinc-magnesium alloy powder, and zinc-aluminum alloy powder into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add methyl triisopropenyloxysilane, ethyl triisopropenyloxysilane, tetra-octylbis[di(dodecyl)phosphite] titanate, 1,1,3,3-tetramethylguanidinepropyltrimethoxysilane, organic bentonite powder and sodium thiosulfate under stirring, the stirring speed is 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 9.

[0110] Example 10

[0111] Embodiment 10 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0112] Step S1, weighing raw materials in a weight ratio of: 50 parts by weight of α, ω-dihydroxy polydimethylsiloxane, and 50 parts by weight of α, ω-dihydroxy polydiethylsiloxane; and 10 parts by weight of phenyl triisopropyleneoxy silane; and 10 parts by weight of vinyl triisopropyleneoxy silane; and 0.25 parts by weight of isopropyl tri(dioctyl pyrophosphate) titanate; and 0.25 parts by weight of tetraisopropyl bis(dioctyl phosphite) titanate; and 2.5 parts by weight of BYK410; and 500 parts by weight of zinc powder; and 500 parts by weight of zinc-magnesium alloy powder; and 500 parts by weight of zinc-aluminum alloy powder; and 1 part by weight of potassium thiosulfate.

[0113] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolydimethylsiloxane, α,ω-dihydroxypolydiethylsiloxane, zinc powder, zinc-magnesium alloy powder and zinc-aluminum alloy powder into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add phenyltriisopropenyloxysilane, vinyltriisopropenyloxysilane, isopropyl tri(dioctyl pyrophosphate) titanate, tetraisopropylbis(dioctyl phosphite) titanate, BYK410 and potassium thiosulfate under stirring, the stirring speed is 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the hardware preservative of Example 10.

[0114] Comparative Example 1

[0115] Comparative Example 1 of the present application provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0116] Step S1, weighing raw materials in a weight ratio of: 100 parts by weight of α,ω-dihydroxypolydimethylsiloxane; 2 parts by weight of methyltriisopropyleneoxysilane; 0.01 parts of isopropyl tri(dioctyl pyrophosphate) titanate; 0.5 parts of organic bentonite powder; 100 parts of zinc powder; and 0.5 parts of sodium thiosulfate.

[0117] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolysiloxane and zinc powder into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add methyl triisopropyleneoxy silane, isopropyl tri(dioctyl pyrophosphate) titanate, organic bentonite powder, and sodium thiosulfate in sequence under stirring, the stirring speed is 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure, and finally obtain the metal preservative of Comparative Example 1.

[0118] Comparative Example 2

[0119] Comparative Example 2 provides a hardware antiseptic and a preparation method thereof, and a power transmission network hardware antiseptic, as shown below:

[0120] Step S1, weighing raw materials in a weight ratio of: 100 parts by weight of α,ω-dihydroxypolydimethylsiloxane; 2 parts by weight of methyltriisopropyleneoxysilane; 0.01 parts of isopropyl tri(dioctyl pyrophosphate) titanate; 0.5 parts of organic bentonite powder; and 0.5 parts of sodium thiosulfate.

[0121] Step S2, at 45°C, first fill the stirring kettle with nitrogen, add the weighed α,ω-dihydroxypolysiloxane into the stirring kettle, set the stirring speed to 200r / min, and disperse for 40 minutes until the mixture is evenly mixed; then add methyl triisopropyleneoxy silane, isopropyl tri(dioctyl pyrophosphate) titanate, organic bentonite powder, and sodium thiosulfate in sequence under stirring, with a stirring speed of 180r / min, disperse for 50 minutes, and mix thoroughly; then disperse for 20 minutes under a pressure of 0.08Mpa, and then fill with nitrogen to release the vacuum to normal pressure to obtain the metal preservative of Comparative Example 2.

[0122] The metal preservatives obtained in Examples 1 to 10 and Comparative Examples 1 to 2 were coated on steel plates with a thickness of 0.3 mm. After curing, the metal preservatives were tested for resistance to 3% salt water. The samples were compared with samples coated with 0.3 mm ordinary silica gel on the steel plates. The blistering and rusting of the samples were used as failure criteria, and the failure time of the samples was statistically analyzed. The results are shown in Table 1.

[0123] Table 1 Performance test results of the embodiments of the present application

[0124]

[0125]

[0126] As can be seen from Table 1, the present invention obtains a metal fitting antiseptic with good antiseptic effect by selecting raw materials and contents.

[0127] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0128] The above-described embodiments only express several implementation methods of the present application, which is convenient for understanding the technical solution of the present application in detail, but it cannot be understood as limiting the scope of protection of the invention patent. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the scope of protection of the present application. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments on the basis of the technical solutions provided in the present application are all within the scope of protection of the claims attached to the present application. Therefore, the scope of protection of the patent of this application shall be based on the content of the attached claims, and the description can be used to interpret the content of the claims.

Claims

1. A metal fittings antiseptic, characterized in that: In parts by weight, it includes the following components: The number average molecular weight of the α,ω-dihydroxy polysiloxane is 10,000 to 80,000; The curing agent includes one or more of methyl triisopropyleneoxysilane, ethyl triisopropyleneoxysilane, phenyl triisopropyleneoxysilane and vinyl triisopropyleneoxysilane; The anode sacrificial agent includes zinc powder, zinc-magnesium alloy powder and zinc-aluminum alloy powder; The catalyst comprises one or more of isopropyl tri(dioctyl pyrophosphate) titanate, tetraisopropyl bis(dioctyl phosphite) titanate, tetraoctyl bis[di(dodecyl)phosphite] titanate and 1,1,3,3-tetramethylguanidinepropyltrimethoxysilane; The thickener includes one or more of organic bentonite powder and BYK410; The activator includes one or more of sodium thiosulfate and potassium thiosulfate.

2. The metal fittings antiseptic according to claim 1, characterized in that: The mass fraction of hydroxyl groups in the α,ω-dihydroxy polysiloxane is 0.3% to 1.5%.

3. The metal fittings antiseptic according to claim 1, characterized in that: The α,ω-dihydroxy polysiloxane includes one or more of α,ω-dihydroxy polydimethylsiloxane and α,ω-dihydroxy polydiethylsiloxane.

4. A method for preparing the metal fittings anticorrosive agent according to any one of claims 1 to 3, characterized in that: The following steps are involved: The components are mixed and then dispersed to prepare the metal fittings antiseptic.

5. The method for preparing the metal fittings antiseptic according to claim 4, characterized in that: The dispersion process parameters include: the pressure is set to 0.05Mpa to 0.09Mpa.

6. The method for preparing the metal fittings antiseptic according to claim 4 or 5, characterized in that: The specific steps of dispersing the components after mixing include: At 25° C. to 50° C., nitrogen is charged into a stirring kettle, α,ω-dihydroxy polysiloxane and an anode sacrificial agent are added into the stirring kettle according to weight parts for primary mixing, and after mixing, a curing agent and other additives are added according to weight parts for secondary mixing to prepare a mixed solution; After the mixed liquid is dispersed, nitrogen is added to normal pressure to prepare the metal fitting antiseptic.

7. The method for preparing the metal fittings antiseptic according to claim 6, characterized in that: The process parameters of the initial mixing include: the rotation speed is set to 50r / min to 200r / min, and the stirring time is set to 20min to 60min.

8. The method for preparing the metal fittings antiseptic according to claim 6, characterized in that: The process parameters of the secondary mixing include: the rotation speed is set to 50r / min to 200r / min, and the stirring time is set to 30min to 70min.

9. A transmission network hardware antiseptic, characterized in that: The invention comprises the metal fittings antiseptic according to any one of claims 1 to 3.

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