Transfer apparatus and transfer method for light emitting diodes

Abstract

This disclosure provides a transfer device and method for light-emitting diodes (LEDs), belonging to the field of optoelectronic manufacturing technology. The transfer device includes: a carrier plate, a fastening ring, a clamp, a shim, and a lifting assembly. The carrier plate has a first side and a second side. The first side has a through hole. The fastening ring is located on the first side, and the through hole is located within the fastening ring. The surface of the fastening ring away from the carrier plate is used to support a carrier film. The shim is connected to the first side. The clamp is located on the surface of the shim away from the first side and is arranged around the fastening ring. The clamp has a clamping surface for clamping the edge of the carrier film. The distance from the clamping surface to the first side is not greater than the distance from the surface of the fastening ring away from the carrier plate to the first side. The lifting assembly is located on the side containing the second side and opposite the through hole. The lifting assembly is used to push the carrier film through the through hole and the fastening ring. This disclosure can improve the problem of misalignment of LEDs after transfer to the carrier film.

Description

Technical Field

[0001] This disclosure relates to the field of optoelectronic manufacturing technology, and in particular to a transfer device and transfer method for light-emitting diodes. Background Technology

[0002] Light-emitting diodes (LEDs) are highly influential new products in the optoelectronics industry, characterized by their small size, long lifespan, rich and varied colors, and low energy consumption. They are widely used in lighting, displays, signal lights, backlights, toys, and other fields. Finished LEDs are typically transferred using sorting machines for storage or use. The transfer process involves aligning and adhering the individual LEDs onto a carrier film.

[0003] In related technologies, sorting machines typically include a swing arm and a suction nozzle located on the swing arm. During transfer, the LEDs are first adsorbed through the suction nozzle. Then, the swing arm is rotated to the position of the carrier film, and the swing arm is lowered to the carrier contact height, at which point the vacuum is stopped. Next, a lifting device lifts the blue film, bringing it into contact with the LEDs. Relying on the adhesiveness of the carrier film, the LEDs are transferred onto the carrier film.

[0004] Because there are a large number of light-emitting diodes (LEDs), they need to be transferred multiple times. As the carrier film is frequently lifted, its tension and shrinkage rate will change, which will cause the spacing between the LEDs transferred to the carrier film to change, resulting in misalignment. Summary of the Invention

[0005] This disclosure provides a transfer device and a transfer method that can improve the problem of changes in the tension and shrinkage rate of the carrier film after repeated stretching, and effectively prevent misalignment of the light-emitting diodes after transfer to the carrier film. The technical solution is as follows:

[0006] This disclosure provides a transfer device for a light-emitting diode, comprising: a carrier plate, a fastening ring, a clamp, a shim, and a lifting assembly; the carrier plate has opposite first and second sides, the first side having a through hole extending to the second side, the fastening ring being located on the first side with the through hole located within the fastening ring, the surface of the fastening ring away from the carrier plate being used to support a carrier film; the shim is connected to the first side, the clamp is located on the surface of the shim away from the first side and arranged around the fastening ring, the clamp having a clamping surface for clamping the edge of the carrier film, the distance from the clamping surface to the first side being no greater than the distance from the surface of the fastening ring away from the carrier plate to the first side; the lifting assembly is located on the side containing the second side and opposite the through hole, the lifting assembly being used to push the carrier film through the through hole and the fastening ring.

[0007] In one implementation of this disclosure, the thickness of the shim is 0.5 mm to 2 mm.

[0008] In one implementation of this disclosure, the clamp is connected to the bearing plate by bolts, and the shim is sleeved outside the bolts.

[0009] In one implementation of this disclosure, the telescopic distance of the lifting component is 800mm to 1000mm.

[0010] In one implementation of this disclosure, the transfer device further includes a swing arm and a suction nozzle, the suction nozzle being located on the swing arm, and the distance between the suction nozzle and the carrier film during the transfer of the light-emitting diode to the carrier film is in the range of 2 mm to 8 mm.

[0011] In another implementation of the present disclosure, the transfer device includes two clamps located on both sides of the fastening ring, and a shim is provided between each clamp and the bearing plate.

[0012] In another implementation of the present disclosure, the clamp is a clamp, which includes two clamping plates. The two clamping plates are stacked in a direction away from the first side, and the shim is provided between the clamping plate near the first side and the bearing plate.

[0013] In another implementation of the present disclosure, the lifting assembly includes a telescopic member and a pushing block, the pushing block being located at one end of the telescopic member.

[0014] This disclosure provides a method for transferring a light-emitting diode (LED). The method is performed based on the transfer device described above and includes: installing a shim between a clamp and a first side of a carrier plate, such that the distance from the clamping surface of the clamp to the first side is not greater than the distance from the surface of the fastening ring away from the carrier plate to the first side; attaching the middle portion of a carrier film to the surface of the fastening ring away from the carrier plate, and using the clamping surface of the clamp to hold the edge of the carrier film; and controlling a lifting assembly to push the carrier film through a through-hole in the carrier plate and the fastening ring, so that the LED adheres to the carrier film.

[0015] In another implementation of this disclosure, the control of the lifting assembly to push the carrier membrane through the through hole of the carrier plate and the fastening ring includes: controlling the lifting assembly to push the carrier membrane according to the telescopic distance, the telescopic distance being in the range of 800mm to 1000mm.

[0016] The beneficial effects of the technical solutions provided in this disclosure include at least the following:

[0017] The LED transfer device provided in this embodiment has a fastening ring and a clamp on a first side of a carrier plate, and the distance from the clamping surface of the clamp to the first side is not greater than the distance from the surface of the fastening ring away from the carrier plate to the first side. Thus, after the carrier film is installed onto the surface of the fastening ring away from the carrier plate and clamped by the clamp, the height difference between the surface of the fastening ring away from the carrier plate and the clamping surface ensures that the carrier film is taut on the surface of the fastening ring away from the carrier plate, preventing wrinkles on the carrier film from affecting the transfer accuracy of the LED.

[0018] Meanwhile, a shim is also provided between the clamp and the first side. The shim reduces the height difference between the surface of the fastening ring away from the carrier plate and the clamping surface, so that the surface of the fastening ring away from the carrier plate and the clamping surface maintain a small height difference. This keeps the carrier film taut and avoids the carrier film being under too much tension. Even if it is stretched by the frequent pushing of the pushing assembly, it is not easy to cause plastic deformation. This effectively prevents the light-emitting diodes from being misaligned after being transferred to the carrier film. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1This is a schematic diagram of the structure of a light-emitting diode transfer device provided in an embodiment of this disclosure;

[0021] Figure 2 This is a cross-sectional view of a light-emitting diode transfer device provided in an embodiment of this disclosure;

[0022] Figure 3 This is a schematic diagram of the structure of a shim provided in an embodiment of this disclosure;

[0023] Figure 4 This is a schematic diagram of another light-emitting diode transfer device provided in an embodiment of this disclosure;

[0024] Figure 5 This is a flowchart of a method for transferring light-emitting diodes according to an embodiment of this disclosure.

[0025] The markings in the diagram are explained as follows:

[0026] 10. Support plate; 11. First side surface; 12. Second side surface;

[0027] 20. Fastening ring;

[0028] 30. Fixture; 31. Clamping surface; 32. Clamping clamp;

[0029] 40. Supporting membrane;

[0030] 50. Elevating element; 51. Shim; 52. Elastic element; 53. Countersunk hole;

[0031] 60. Lifting assembly; 61. Telescopic component; 62. Pushing block;

[0032] 71. Swing arm; 72. Suction nozzle; 73. Ejector pin. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0034] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” “top,” and “bottom,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0035] Figure 1 This is a schematic diagram of the structure of a light-emitting diode transfer device provided in an embodiment of this disclosure. Figure 1 As shown, the transfer device includes: a support plate 10, a fastening ring 20, a clamp 30, a shim 50, and a lifting assembly 60.

[0036] Figure 2 This is a cross-sectional view of a light-emitting diode transfer device provided in an embodiment of this disclosure. Figure 2 As shown, the carrier plate 10 has a first side 11 and a second side 12 opposite to each other. The first side 11 has a through hole extending to the second side 12. The fastening ring 20 is located on the first side 11 and the through hole is located in the fastening ring 20. The surface of the fastening ring 20 away from the carrier plate 10 is used to support the carrier membrane 40.

[0037] like Figure 2 As shown, the shim 50 is connected to the first side 11, and the clamp 30 is located on the surface of the shim 50 away from the first side 11 and is arranged around the fastening ring 20. The clamp 30 has a clamping surface 31 for clamping the edge of the carrier film 40. The distance from the clamping surface 31 to the first side 11 is not greater than the distance from the surface of the fastening ring 20 away from the carrier plate 10 to the first side 11.

[0038] like Figure 2 As shown, the lifting assembly 60 is located on the side where the second side 12 is located and is opposite to the through hole. The lifting assembly 60 is used to push the carrier membrane 40 through the through hole and the fastening ring 20.

[0039] The LED transfer device provided in this embodiment has a fastening ring 20 and a clamp 30 on the first side 11 of the carrier plate 10, and the distance from the clamping surface of the clamp to the first side is not greater than the distance from the surface of the fastening ring away from the carrier plate to the first side. Thus, after the carrier film 40 is mounted to the surface of the fastening ring 20 away from the carrier plate and clamped by the clamp 30, due to the height difference between the surface of the fastening ring away from the carrier plate and the clamping surface, the clamp 30 can keep the carrier film 40 taut on the surface of the fastening ring away from the carrier plate, thus preventing wrinkles on the carrier film 40 from affecting the transfer accuracy of the LED.

[0040] Meanwhile, a shim 50 is provided between the clamp 30 and the first side 11. The shim 50 reduces the height difference between the surface of the fastening ring away from the carrier plate and the clamping surface, so that the surface of the fastening ring away from the carrier plate and the clamping surface maintain a small height difference. This keeps the carrier film 40 taut and avoids the carrier film 40 being under a large degree of tension. Even if it is stretched by the frequent pushing of the pushing assembly, it is not easy to cause plastic deformation. This effectively prevents the light-emitting diodes from being misaligned after being transferred to the carrier film 40.

[0041] Optionally, such as Figure 2 As shown, the thickness of the shim 50 is 0.5 mm to 2 mm.

[0042] The thickness of the shim 50 can be its length in a direction perpendicular to the first side 11.

[0043] By setting the thickness of the shim 50 within the aforementioned range, it is possible to avoid setting the thickness of the shim 50 too large, which would significantly reduce the height difference between the surface of the fastening ring away from the carrier plate and the clamping surface, making it difficult for the carrier film 40 to maintain a taut state and thus affecting the transfer accuracy of the light-emitting diode. At the same time, it is also possible to avoid setting the thickness of the shim 50 too small, which would result in a large height difference between the surface of the fastening ring away from the carrier plate and the clamping surface, causing the carrier film 40 to be too taut and easily deformed after frequent stretching.

[0044] For example, the thickness of the shim 50 is 1 mm.

[0045] In this embodiment of the disclosure, the shim 50 is a shim 51.

[0046] For example, Figure 3 This is a structural schematic diagram of a shim 50 provided in an embodiment of this disclosure. (See attached diagram.) Figure 3As shown, the shim 50 may include two shims 51 and an elastic member 52. The sides of the two shims 51 are provided with countersunk holes 53, and the sides of the two shims 51 with countersunk holes 53 are opposite to each other. The elastic member 52 is disposed between the two shims 51, and the opposite sides of the elastic member 52 are respectively located in the countersunk holes 53 of the two shims 51.

[0047] Because the gasket 51 may deform after prolonged use, its thickness may fall below the design requirement. In the above implementation, an elastic element 52 is placed between the gaskets 51. This elastic element 52 applies an elastic force to the gaskets 51, preventing them from deforming under prolonged compression and reducing their thickness, thus improving the reliability of the transfer device.

[0048] As an example, the elastic element 52 can be a disc spring, with its two ends located in the countersunk holes 53 of the two washers 51, respectively. When the disc spring is compressed, it applies an elastic force to the two washers 51, so that the overall thickness of the two washers 51 and the disc spring can be maintained at the thickness required by the design.

[0049] Optionally, the telescopic distance of the lifting component 60 is 800mm to 1000mm. The telescopic distance is equal to the difference between a preset distance and a buffer height, where the preset distance is a pre-set telescopic distance and the buffer height ranges from 0.5mm to 2mm.

[0050] In this embodiment of the disclosure, the preset distance refers to the distance at which the lifting component 60 can push the carrier film 40 to the position of the light-emitting diode after extending and retracting a preset distance, so that the light-emitting diode can adhere to the carrier film 40.

[0051] The above implementation reduces the extension distance of the lifting component 60 by subtracting the buffer height from the preset distance, thereby reducing the distance by which the lifting component 60 pushes the carrier film 40 and thus reducing the degree of deformation of the carrier film 40. In this way, even with frequent pushing by the lifting component, the carrier film 40 is less prone to plastic deformation, effectively preventing misalignment of the light-emitting diodes after they are transferred to the carrier film 40.

[0052] For example, the buffer height can be 1 mm.

[0053] Figure 4 This is a schematic diagram of another light-emitting diode transfer device provided in an embodiment of this disclosure. Figure 4 As shown, the transfer device also includes a swing arm 71 and a suction nozzle 72. The suction nozzle 72 is located on the swing arm 71. When transferring the light-emitting diode to the carrier film 40, the distance between the suction nozzle 72 and the carrier film 40 ranges from 2 mm to 8 mm.

[0054] In this embodiment of the present disclosure, before transferring the light-emitting diode to the carrier film 40, the swing arm 71 is first controlled to rotate so as to move the suction nozzle 72 to the production end of the light-emitting diode. After the suction nozzle 72 adsorbs the light-emitting diode from the production end A, the swing arm 71 is then controlled to rotate so that the suction nozzle 72 adsorbs the light-emitting diode and moves it to the transfer end B.

[0055] The transfer end is provided with a support plate 10 and a lifting assembly 60, and the support plate 10 uses a clamp 30 to install the support film 40 on the first side 11.

[0056] After the LED moves to the transfer end, the control arm 71 moves closer to the carrier film 40, ensuring that the distance between the suction nozzle 72 and the carrier film 40 is within the aforementioned range. Because the distance between the suction nozzle 72 and the carrier film 40 is small, the distance that the lifting assembly 60 pushes the carrier film 40 to stretch is also shortened. This reduces the likelihood of plastic deformation of the carrier film 40, effectively preventing misalignment of the LEDs after they are transferred to the carrier film 40.

[0057] For example, the distance between the nozzle 72 and the carrier film 40 is 3 mm.

[0058] Optionally, the swing arm 71 may include a boom and a drive assembly, the boom being connected to the drive assembly, and the drive assembly being able to drive the boom to rotate about one end of the boom as the origin.

[0059] For example, the drive assembly may include a motor, a first gear and a second gear, the output shaft of the motor being coaxially connected to the first gear, the second gear meshing with the first gear, and the second gear being located at one end of the boom.

[0060] When the motor rotates, it drives the first gear and the second gear to rotate, thereby controlling the boom to rotate around the center of the second gear as the origin.

[0061] Optionally, the suction nozzle 72 can be mounted on the boom. This way, when the boom rotates, it will cause the suction nozzle 72 to rotate as well, thereby achieving the purpose of adjusting the position of the suction nozzle 72.

[0062] For example, multiple mounting holes can be provided on the boom, and the mounting holes can be arranged at intervals along the extension direction of the boom. The suction nozzle 72 can be fixed in each mounting hole by fasteners such as pipe clamps and bolts.

[0063] This allows multiple suction nozzles 72 to be installed on the boom simultaneously, enabling the batch transfer of LEDs.

[0064] Meanwhile, when performing a single LED transfer operation, the nozzle 72 can be installed on different mounting holes to adjust the transfer position of the LED and improve the adaptability of the transfer device.

[0065] Optionally, the fixing device may also include a pin 73 and a telescopic mechanism, wherein the pin 73 is connected to the telescopic mechanism, and the telescopic mechanism is used to control the telescopic movement of the pin 73.

[0066] In this embodiment, the ejector pin 73 and the telescopic mechanism can be disposed at the production end and placed below the light-emitting diode to be transferred. Before the suction nozzle 72 needs to pick up the light-emitting diode, the telescopic mechanism can control the ejector pin 73 to extend and retract to push the corresponding light-emitting diode, bringing the light-emitting diode closer to the suction nozzle 72 so that the suction nozzle 72 can pick up the light-emitting diode.

[0067] For example, the telescopic mechanism may include a first telescopic rod, one end of which is connected to the ejector pin 73, and the telescopic direction of the first telescopic rod is parallel to the axial direction of the ejector pin 73.

[0068] When the first telescopic rod extends, it can control the ejector pin 73 to extend and push the LED; after the nozzle 72 picks up the LED, the first telescopic rod can be retracted to push the next LED.

[0069] For example, the telescopic mechanism may further include a second telescopic rod, one end of which is connected to the first telescopic rod, and the telescopic direction of the second telescopic rod may be perpendicular to the telescopic direction of the first telescopic rod.

[0070] When the second telescopic rod extends or retracts, it can control the ejector pin 73 to move horizontally, thereby adjusting the position of the ejector pin 73 on the horizontal plane, so as to control the ejector pin 73 to push different light-emitting diodes and improve the adaptability of the transfer device.

[0071] Optionally, such as Figure 1 As shown, the transfer device includes two clamps 30, which are located on both sides of the fastening ring 20. Each clamp 30 is provided with a shim 50 between itself and the bearing plate 10.

[0072] For example, such as Figure 2 As shown, the clamp 30 is a clamp 32, which includes two clamping plates that can move relative to each other. The two clamping plates are stacked in a direction away from the first side 11, and a shim 50 is provided between the clamping plate close to the first side 11 and the bearing plate 10.

[0073] When the two clamping plates are attached together, the carrier film 40 can be clamped. The opposite sides of the two clamping plates are the clamping surfaces of the fixture 30.

[0074] Optionally, such as Figure 2 As shown, the lifting assembly 60 includes a telescopic member 61 and a pushing block 62. The pushing block 62 is located at one end of the telescopic member 61, and the cross-sectional area of ​​the pushing block 62 parallel to the first side 11 is not greater than the cross-sectional area of ​​the through hole.

[0075] The end of the push block 62 closest to the support plate 10 can be hemispherical, so that when the push block 62 pushes the support membrane 40, the contact between the push block 62 and the support membrane 40 is smoother, making the support membrane 40 less prone to tearing. In addition, the cross-sectional area of ​​the push block 62 is smaller than the cross-sectional area of ​​the through hole, to ensure that the push block 62 can pass through the through hole to push the support membrane 40.

[0076] For example, the telescopic member 61 can be a telescopic rod or cylinder or other device with telescopic function.

[0077] Optionally, the carrier film 40 is a blue film, which has good adhesion to stick the light-emitting diode off the nozzle 72.

[0078] Optionally, the carrier film 40 can be a PET (polyethylene terephthalate) film.

[0079] PET film has excellent physical and mechanical properties, can be used at temperatures up to 120℃ for extended periods, has excellent electrical insulation, and exhibits good creep resistance, fatigue resistance, abrasion resistance, and dimensional stability even at high temperatures and high frequencies.

[0080] Figure 5 This is a flowchart of a method for transferring light-emitting diodes according to an embodiment of this disclosure. Figure 5 As shown, this transfer method is performed based on the transfer apparatus described above, and includes:

[0081] Step 101: Install the shim between the clamp and the first side of the support plate, so that the distance from the clamping surface of the clamp to the first side is not greater than the distance from the surface of the fastening ring away from the support plate to the first side.

[0082] Step 102: Attach the middle part of the carrier film to the surface of the fastening ring away from the carrier plate, and use the clamping surface of the clamp to clamp the edge of the carrier film.

[0083] Step 103: Control the lifting assembly to push the carrier film through the through hole and fastening ring of the carrier plate, so that the light-emitting diode adheres to the carrier film.

[0084] The method for transferring LEDs involves placing a shim between the clamp and the first side. This shim reduces the height difference between the surface of the fastening ring furthest from the carrier plate and the clamping surface, ensuring a smaller height difference. This keeps the carrier film taut while preventing it from being under excessive tension. Even with frequent pushing by the push assembly, it is less prone to plastic deformation, effectively preventing misalignment of the LEDs after transfer to the carrier film.

[0085] In this embodiment of the disclosure, controlling the lifting assembly to pass through the through hole of the support plate and push the support membrane with the fastening ring may include the following two steps:

[0086] The first step is to determine the extension distance of the lifting assembly.

[0087] The telescopic distance is equal to the difference between the preset distance and the buffer height, where the preset distance is the pre-set telescopic distance.

[0088] For example, the telescopic distance is 800mm to 1000mm.

[0089] In this embodiment of the disclosure, the preset distance refers to the distance at which the lifting component can push the carrier film to the position of the light-emitting diode after extending and retracting a preset distance, so that the light-emitting diode can adhere to the carrier film.

[0090] For example, the buffer height ranges from 0.5 mm to 2 mm.

[0091] For example, the buffer height can be 1 mm.

[0092] The second step is to control the lifting assembly to push the supporting membrane according to the telescopic distance.

[0093] By subtracting the buffer height from the preset distance to reduce the extension distance of the lifting component, the distance by which the lifting component pushes the carrier film is stretched can be reduced, thereby reducing the degree of deformation of the carrier film. In this way, even with frequent pushing by the lifting component, the carrier film is less likely to experience plastic deformation, effectively preventing misalignment of the light-emitting diodes after they are transferred to the carrier film.

[0094] In this embodiment of the present disclosure, the transferred light-emitting diode may include a substrate, an n-type layer, an epitaxial layer, and a p-type layer stacked sequentially.

[0095] Optionally, the substrate is a sapphire substrate. Sapphire substrates have high light transmittance, meaning they are transparent. Furthermore, sapphire material is relatively hard and chemically stable, giving the light-emitting diode good luminous efficacy and stability.

[0096] The epitaxial layer may include a first semiconductor layer, a multiple quantum well layer, and a second semiconductor layer sequentially stacked on the substrate. One of the first and second semiconductor layers is a p-type layer, and the other is an n-type layer.

[0097] As an example, the first semiconductor layer is a p-type layer and the second semiconductor layer is an n-type layer.

[0098] Optionally, the first semiconductor layer includes an n-type AlGaInP layer. The thickness of the n-type AlGaInP layer can be from 0.5 μm to 3 μm.

[0099] Optionally, the multiple quantum well layer includes alternating AlGaInP quantum well layers and AlGaInP quantum barrier layers, with different Al contents in the AlGaInP quantum well layers and AlGaInP quantum barrier layers. The multiple quantum well layer may include 3 to 8 alternating stacked AlGaInP quantum well layers and AlGaInP quantum barrier layers.

[0100] As an example, in an embodiment of this disclosure, the multi-quantum-well layer includes five alternating stacked AlGaInP quantum-well layers and AlGaInP quantum-barrier layers.

[0101] Optionally, the thickness of the multi-quantum well layer can be from 150 nm to 200 nm.

[0102] Optionally, the second semiconductor layer includes an indium-doped p-type AlInP layer. The thickness of the p-type AlInP layer can be from 0.5 μm to 3 μm.

[0103] Optionally, the light-emitting diode further includes a first electrode, a second electrode, and a passivation layer. The surface of the second semiconductor layer has a groove exposing the first semiconductor layer. The first electrode is located in the groove, and the second electrode is located on the surface of the second semiconductor layer away from the substrate. The passivation layer is located at least on the surface of the second semiconductor layer, the bottom surface of the groove, the surface of the first electrode, and the surface of the second electrode.

[0104] The first electrode is a p-type electrode, and the second electrode is an n-type electrode.

[0105] For example, the passivation layer can be a distributed Bragg reflection (DBR layer), which comprises multiple periodically alternating layers of SiO2 and TiO2. The number of periods in the DBR layer can be between 20 and 50. For example, the DBR layer may have 32 periods.

[0106] The thickness of the SiO2 layer in the DBR layer can be from 800 angstroms to 1200 angstroms, and the thickness of the TiO2 layer can be from 500 angstroms to 900 angstroms.

[0107] In addition to passivation, the DBR layer also reflects light emitted from the multi-quantum-well layer back to the substrate, improving light extraction efficiency.

[0108] Optionally, the light-emitting diode further includes: a first solder block and a second solder block, the first solder block and the second solder block being located on the passivation layer, the first solder block being connected to the first electrode through a through hole, and the second solder block being connected to the second electrode through another through hole.

[0109] The first and second solder joint blocks are both rectangular blocks to increase the area and facilitate conductivity. Furthermore, the first and second solder joint blocks are spaced apart on the surface of the passivation layer.

[0110] Optionally, a protective layer is provided on the surface of the passivation layer and the improvement layer, and the protective layer extends from the surface of the passivation layer and the surface of the improvement layer to the substrate, and the protective layer has through holes exposing the first solder block and the second solder block to facilitate electrical connection.

[0111] For example, in this embodiment of the disclosure, the protective layer may be a silicon oxide layer with a thickness of 2000 angstroms.

[0112] The above is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above through embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A transfer device for a light-emitting diode, characterized in that, The transfer device includes: a support plate (10), a fastening ring (20), a clamp (30), a shim (50), and a lifting assembly (60); The support plate (10) has opposite first side (11) and second side (12), the first side (11) has a through hole extending to the second side (12), the fastening ring (20) is located on the first side (11) and the through hole is located in the fastening ring (20), and the surface of the fastening ring (20) away from the support plate (10) is used to support the support membrane (40); The shim (50) is connected to the first side (11), the clamp (30) is located on the surface of the shim (50) away from the first side (11) and is arranged around the fastening ring (20), the clamp (30) has a clamping surface (31) for clamping the edge of the carrier film (40), and the distance from the clamping surface (31) to the first side (11) is not greater than the distance from the surface of the fastening ring (20) away from the carrier plate (10) to the first side (11); The lifting assembly (60) is located on the side where the second side (12) is located and is opposite to the through hole. The lifting assembly (60) is used to push the carrier membrane (40) through the through hole and the fastening ring (20).

2. The transfer device according to claim 1, characterized in that, The thickness of the shim (50) is 0.5 mm to 2 mm.

3. The transfer device according to claim 1, characterized in that, The clamp (30) is connected to the bearing plate (10) by bolts, and the shim (50) is fitted over the bolts.

4. The transfer device according to claim 1, characterized in that, The telescopic distance of the lifting assembly (60) is 800mm to 1000mm.

5. The transfer device according to any one of claims 1 to 4, characterized in that, The transfer device also includes a swing arm (71) and a suction nozzle (72). The suction nozzle (72) is located on the swing arm (71). When transferring the light-emitting diode to the carrier film (40), the distance between the suction nozzle (72) and the carrier film (40) is in the range of 2 mm to 8 mm.

6. The transfer device according to any one of claims 1 to 4, characterized in that, The transfer device includes two clamps (30) located on both sides of the fastening ring (20), and a shim (50) is provided between each clamp (30) and the bearing plate (10).

7. The transfer device according to any one of claims 1 to 4, characterized in that, The clamp (30) is a clamp (32), which includes two clamping plates. The two clamping plates are stacked in a direction away from the first side (11), and the shim (50) is provided between the clamping plate near the first side (11) and the bearing plate (10).

8. The transfer device according to any one of claims 1 to 4, characterized in that, The lifting assembly (60) includes a telescopic member (61) and a jacking block (62), the jacking block (62) being located at one end of the telescopic member (61).

9. A method for transferring light-emitting diodes, characterized in that, The transfer method is performed based on the transfer apparatus as described in any one of claims 1 to 8, comprising: The shim is installed between the clamp and the first side of the support plate, such that the distance from the clamping surface of the clamp to the first side is not greater than the distance from the surface of the fastening ring away from the support plate to the first side. The middle part of the carrier film is attached to the surface of the fastening ring away from the carrier plate, and the edge of the carrier film is clamped by the clamping surface of the clamp. The control lifting assembly pushes the carrier film through the through hole of the carrier plate and the fastening ring, causing the light-emitting diode to adhere to the carrier film.

10. The transfer method according to claim 9, characterized in that, The control lifting assembly pushes the carrier membrane through the through hole of the carrier plate and the fastening ring, including: The lifting assembly is controlled to push the supporting membrane according to the telescopic distance, which ranges from 800mm to 1000mm.

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