Flexible circuit carrier
By designing alignment marks on the flexible circuit board, the problem of heat sink attachment position misalignment was solved, achieving a precise attachment effect.
CN116230688BActive Publication Date: 2026-06-26CHIPMOS TECH INC
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHIPMOS TECH INC
- Filing Date
- 2022-03-03
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
Existing thin-film flip-chip packaging structures are prone to misalignment when attaching heat sinks, resulting in inaccurate placement that is difficult to judge visually by the machine and operators.
Method used
Alignment marks are designed on the flexible circuit board to ensure that the side of the mark is in the same straight line as the side of the heat sink, and the length is equal to the attachment tolerance, providing alignment reference and visual judgment.
Benefits of technology
This improves the accuracy of heat sink application, ensuring that the heat sink is accurately positioned and precisely applied to the flexible circuit board.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116230688B_ABST
Abstract
The present application provides a flexible circuit carrier, which includes a flexible substrate, a first circuit layer, a first heat dissipation patch attaching area and a plurality of first alignment marks. The flexible substrate has a first surface, a second surface, a packaging area, two peripheral areas and a chip setting area. The first circuit layer is located in the packaging area. The first heat dissipation patch attaching area is defined on the first surface and located in the packaging area. The first heat dissipation patch attaching area is larger than and covers the chip setting area and has a first attaching tolerance. The first alignment marks are located in at least one of the two peripheral areas and correspond to two first side edges of the first heat dissipation patch attaching area respectively. A first mark side of each first alignment mark is located on the same line with one of the two first side edges, and a first length of each first alignment mark perpendicular to the two first side edges is equal to the absolute value of the first attaching tolerance. The flexible circuit carrier of the present application has alignment marks, which can effectively improve the attaching accuracy of the heat dissipation patch.
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