Cooling module and method of cooling an electronic circuit module using a cooling module

Abstract

The present disclosure relates to a cooling module and a method of cooling an electronic circuit module using the cooling module. Example embodiments relate to a cooling module and a method of cooling an electronic circuit module. The cooling module includes a first cooling component and a second cooling component fluidly connected to each other. The first cooling component includes a first fluid passage having a supply section, a return section, and a main section, and a second fluid passage. The second cooling component includes an intermediate fluid passage. The main section bifurcates into a first main section and a second main section, and the first main section and the second main section further merge into a third main section. The supply section is connected to the first main section and the second main section. The return section is connected to the third main section and to the intermediate fluid passage via an inlet fluid flow path established between the first cooling component and the second cooling component. The second fluid passage is connected to the intermediate fluid passage via an outlet fluid flow path established between the first cooling component and the second cooling component.

Description

[0001] Cross Reference to Related Applications

[0002] This application is related to co-pending U.S. Application entitled “cooling module and a method of assembling the cooling module to an electronic circuit module” (U.S. Application Serial No. 17 / 541,477) filed on December 3, 2021, having an application reference number of “710230676US01” and assigned to Wise & Developed Limited Partnership. TECHNICAL FIELD

[0003] The present disclosure relates to a cooling module for an electronic circuit module, and a method of cooling an electronic circuit module of an electronic circuit assembly. BACKGROUND

[0004] Electronic systems generally include one or more circuit assemblies, each having at least one electronic circuit module. Typically, an electronic circuit module includes a circuit board and a set of chips (e.g., one or more electronic chips) disposed on the circuit board. These electronic chips can generate waste heat during their operation. If the waste heat is not dissipated from the electronic circuit module, the waste heat can exceed the thermal specifications of the electronic chips, resulting in reduced performance, reliability, and expected lifetime of the electronic circuit module having such electronic chips, and in some cases, failure of the circuit assembly having such electronic circuit module. To minimize such adverse effects of waste heat, electronic systems can include a thermal management system for circulating a fluid (e.g., a cold fluid) to the circuit assembly to carry waste heat away from the electronic chips of the electronic circuit module. SUMMARY

[0005] According to one aspect of the disclosure, a cooling module for an electronic circuit module is disclosed, including a first cooling component and a second cooling component. The first cooling component includes a first fluidic channel, a second fluidic channel, and a pair of first fluidic connectors. The first fluidic channel includes a supply segment, a return segment, and a main segment. The second cooling component includes an intermediate fluidic channel and a pair of second fluidic connectors. The second cooling component is positioned within a recessed portion of the first cooling component and fluidically connected to the first cooling component. The main segment bifurcates into a first main segment and a second main segment. The first main segment and the second main segment further merge into a third main segment. The supply segment is connected to the first main segment and the second main segment. The return segment is connected to the third main segment and to the intermediate fluidic channel via an inlet fluid flow path established between the first cooling component and the second cooling component. The second fluidic channel is connected to the intermediate fluidic channel via an outlet fluid flow path established between the first cooling component and the second cooling component. A first connector of the pair of first fluidic connectors is movably connected to another first connector of the pair of second fluidic connectors to establish the inlet fluid flow path between the first cooling component and the second cooling component. A second connector of the pair of first fluidic connectors is movably connected to another second connector of the pair of second fluidic connectors to establish the outlet fluid flow path between the first cooling component and the second cooling component.

[0006] In some embodiments, the main segment includes microchannels formed within the first cooling component. The intermediate fluidic channel includes microchannels formed within the second cooling component.

[0007] In some embodiments, the first cooling component further includes a fluid inlet and a fluid outlet. The first fluidic channel extends between the fluid inlet and a first connector of the pair of first fluidic connectors. The second fluidic channel extends between a second connector of the pair of first fluidic connectors and the fluid outlet.

[0008] In some embodiments, the intermediate fluidic channel extends between a first connector and a second connector of the pair of second fluidic connectors.

[0009] In some embodiments, each connector of the pair of first fluidic connectors is one of a fluid piston or a fluid bore. Each connector of the pair of second fluidic connectors is the other of a fluid piston or a fluid bore.

[0010] In some embodiments, the cooling module further includes an O-ring seal. The O-ring seal is disposed in an outer peripheral groove of the fluid piston. Upon movably connecting the fluid piston to the fluid bore, the O-ring seal is pressed against a wall of the fluid bore to prevent leakage of fluid from the inlet fluid flow path and the outlet fluid flow path.

[0011] In some embodiments, the O-ring seal slides along a wall of the fluid aperture by up-and-down movement of the second cooling component relative to the first cooling component, is eccentrically pressed against the wall of the fluid aperture by tilting movement of the second cooling component relative to the first cooling component, or a combination thereof.

[0012] According to another aspect of the disclosure, a method of cooling an electronic circuit module of an electronic circuit assembly is disclosed, comprising: receiving a cold fluid by a first cooling component of a cooling module, wherein the first cooling component is connected to a frame of the electronic circuit assembly to establish a first thermal interface with a first chip set of the electronic circuit module coupled to the frame; directing the cold fluid in a first fluid channel of the first cooling component having a tortuous flow route to absorb waste heat from the first chip set and generate a partially hot fluid; discharging the partially hot fluid from the first fluid channel into an intermediate fluid channel of a second cooling component of the cooling module via an inlet fluid flow path established between the first cooling component and the second cooling component, wherein the second cooling component is positioned within a recessed portion of the first cooling component and fluidly connected to the first cooling component, and wherein the second cooling component is connected to the frame to establish a second thermal interface with a second chip set of the electronic circuit module; directing the partially hot fluid in the intermediate fluid channel to absorb waste heat from the second chip set and generate a hot fluid; discharging the hot fluid from the intermediate fluid channel into a second fluid channel of the first cooling component via an outlet fluid flow path established between the first cooling component and the second cooling component; and directing the hot fluid in the second fluid channel back from the first cooling component.

[0013] In some embodiments, the first chip set and the second chip set are disposed on a circuit board of the electronic circuit module. The first chip set includes a second electronic chip and a plurality of first electronic chips. The plurality of first electronic chips are arranged along a first row and a second row located around the second electronic chip.

[0014] In some embodiments, the first fluid channel includes a supply segment, a return segment, and a body segment. The body segment bifurcates into a first body segment and a second body segment. The first body segment and the second body segment further merge into a third body segment. The supply segment is connected to the first body segment and the second body segment. The return segment is connected to the third body segment.

[0015] In some embodiments, the first body segment extends over the plurality of first electronic chips arranged along the first row. The second body segment extends over the plurality of first electronic chips arranged along the second row. The third body segment extends over the second electronic chip.

[0016] In some embodiments, directing the cold fluid in the first fluidic channel includes: directing a first portion of the cold fluid in the first body segment to produce a first portion of the partially hot fluid; directing a second portion of the cold fluid in the second body segment to produce a second portion of the partially hot fluid. The first and second portions of the cold fluid are directed parallel to each other; and directing a mixed portion of the partially hot fluid in the third body segment to produce the partially hot fluid. The mixed portion of the partially hot fluid is a mixture of the first and second portions of the partially hot fluid.

[0017] In some embodiments, the intermediate fluidic channel extends over the second chip set.

[0018] In some embodiments, the first cooling component includes a pair of first fluid connectors. The second cooling component includes a pair of second fluid connectors. A first connector of the pair of first fluid connectors is movably connected to another first connector of the pair of second fluid connectors to establish the inlet fluid flow path between the first cooling component and the second cooling component. A second connector of the pair of first fluid connectors is movably connected to another second connector of the pair of second fluid connectors to establish the outlet fluid flow path between the first cooling component and the second cooling component.

[0019] In some embodiments, each connector of the pair of first fluid connectors is one of a fluid piston or a fluid bore. Each connector of the pair of second fluid connectors is the other of the fluid piston or the fluid bore. An O-ring seal is disposed in an outer peripheral groove of the fluid piston. Upon movably connecting the fluid piston to the fluid bore, the O-ring seal is pressed against a wall of the fluid bore to prevent i) leakage of the partially hot fluid from the inlet fluid flow path and ii) leakage of the hot fluid from the outlet fluid flow path.

[0020] In some embodiments, the body segment includes a microchannel formed within the first cooling component. The first fluidic channel extends between a fluid inlet of the first cooling component and a first connector of the pair of first fluid connectors. The second fluidic channel extends between a second connector of the pair of first fluid connectors and a fluid outlet of the first cooling component.

[0021] In some embodiments, the intermediate fluidic channel includes a microchannel formed within the second cooling component. The intermediate fluidic channel extends between the first and second connectors of the pair of second fluid connectors. BRIEF DESCRIPTION OF DRAWINGS

[0022] Various examples will be described below with reference to the following figures.

[0023] FIG. 1A An exploded perspective view of a circuit assembly is illustrated in accordance with example implementations of the present disclosure.

[0024] FIG. 1B a perspective view of the assembled circuit assembly of FIG. 1A

[0025] FIG. 1C a cross-sectional view of a first connector of a pair of first fluid connectors having an O-ring, the first connector being movably connected to FIGS. 1A-1B a second connector of the pair of second fluid connectors.

[0026] FIG. 1D a cross-sectional view of a first connector of a pair of first fluid connectors having an O-ring, the first connector being movably connected to FIGS. 1A-1B a second connector of the pair of second fluid connectors.

[0027] FIG. 2A an exploded perspective view of a frame of the circuit assembly of FIGS. 1A-1B

[0028] FIG. 2B a perspective view of an electronic circuit module of the circuit assembly of FIGS. 1A-1B

[0029] FIG. 2C a cross-sectional view of the electronic circuit assembly taken along line 1-1’ of FIG. 2B

[0030] an exploded perspective top view of a cooling module of the circuit assembly of FIG. 2D FIGS. 1A-1B an exploded perspective bottom view of a cooling module of the circuit assembly of

[0031] FIG. 2E FIGS. 1A-1B a perspective view of a spring-loaded fastener of a cooling module in the circuit assembly of

[0032] FIG. 2F a perspective view of a tethered fastener of a cooling module in the circuit assembly of FIGS. 1A-1B

[0033] FIG. 2G a perspective view of a tethered fastener of a cooling module in the circuit assembly of FIGS. 1A-1B

[0034] FIG. 3 a perspective view of a tethered fastener of a cooling module in the circuit assembly of​​​​​​​FIGS. 1A-1B and FIG. 2G Perspective view of a portion of the first cooling component and the tethered fastener of

[0035] FIG. 4 illustrates a flowchart showing a method of assembling a cooling module according to an example embodiment of the present disclosure.

[0036] FIG. 5A illustrates a cross-sectional top view of a circuit assembly according to an example embodiment of the present disclosure taken along line 2-2’ of FIG. 1B

[0037] FIG. 5B illustrates a cross-sectional top view of a cooling module having a first cooling component and a second cooling component of FIGS. 1A-1B

[0038] FIG. 6 illustrates a flowchart showing a method of carrying heat away from an electronic circuit module by a cooling module according to an example embodiment of the present disclosure.

[0039] FIG. 7 illustrates a cross-sectional view of a first connector of a pair of first fluid connectors that is movably connected to another first connector of a pair of second fluid connectors according to another example embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] The following detailed description references the drawings, wherein like numerals indicate the same or similar elements. In embodiments, the drawings described below are intended as illustrative examples and are not limiting of the disclosure. The following detailed description is not limiting in any way and is intended to teach one skilled in the art about the example embodiments of the disclosure. The applicant(s) expect experts in the fields of the technology covered here to

[0041] ​​The terminology used herein is for the purpose of describing example embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "multiple" is defined as two or more. As used herein, the term "another" is defined as at least a second or more. As used herein, the term "coupled" is defined as connected, whether directly without any intervening elements or indirectly with at least one intervening element. Two elements can be coupled mechanically, electrically, or in communication contact through a communication channel, path, network, or system. As used herein, the term "and / or" means and includes any and all possibilities of the associated listed items. It will also be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, these elements should not be limited by these terms since such terms are only used to distinguish one element from another, unless otherwise specified or clear from context. As used herein, the term "includes" means includes without limitation, and the term "including" means including, but not limited to. The term "based on" means "based, at least in part, on."

[0042] As used herein, the term "fluid connector" can refer to a mechanical coupler that is movably connected to another mechanical coupler in order to fluidically connect at least two fluidic chambers to each other. As used herein, the term "movably connected" or "movable connection" can refer to a non-rigid fluidic connection formed between two fluid connectors, where one of the fluid connectors can be moved 3-dimensionally with respect to the other fluid connector while maintaining a leak-proof fluid flow path therebetween. As used herein, the term "tool-less" design can refer to a design incorporated in the fluid connectors that enables the fluid connectors to be movably connected to each other without the need for any tools to complete the assembly of the cooling component. As used herein, the term "cooling component" can refer to a thermally conductive component that includes internal passages (or microchannels) through which a cold fluid is directed to absorb waste heat transferred to the cooling component from a waste heat generating component (e.g., one or more electronic chipsets disposed on a circuit board). For example, the cooling component can also be referred to as a cold plate. The term "fluid" can refer to a liquid medium or a gaseous medium of a coolant or a combination thereof. Further, the term "insertion" can refer to connecting the fluid connectors (e.g., fluid holes or fluid pistons) to each other by pushing or inserting one of the fluid holes or fluid pistons into the other. Similarly, the term "extraction" can refer to disconnecting the fluid connectors from each other by pulling or extracting one of the fluid holes or fluid pistons from the other. Further, as used herein, the term "thermal interface" can refer to the surfaces of two components that are in direct contact with each other or indirectly contact each other through a thermal interface material (TIM) to facilitate the transfer of waste heat from one component to the other. As used herein, the term "height" can refer to the electronic chip height from the bottom surface to the top surface of the electronic chip or from the bottom surface of the circuit board to the top surface of the electronic chip. As used herein, the term "flatness" can refer to the planar surface (or horizontal surface or uniform surface) of an electronic chip or the coplanarity between two electronic chips (e.g., between the top surfaces) that minimizes the raised areas or depressions. For example, when an electronic chip has a uniform height, it can have a planar top surface.

[0043] It can be noted herein that an object, device, or assembly (which can include multiple different bodies thermally coupled and can include multiple different materials) is "thermally conductive" between two thermal interfaces if any of the following is true: (i) the coefficient of thermal transfer between the thermal interfaces is 5 W / m 2 K or more between 0 °C and 100 °C, (ii) the object includes a thermal conductivity (often denoted as k) between the two interfaces that is 0.5 W / m k 、 or (iii) the object is a heat pipe, a vapor chamber, a copper body, or an aluminum body. Examples of materials having a thermal conductivity between 1 W / mK and 300 W / mK at any temperature between 0 °C and 100 °C include, for example, certain types of copper, aluminum, silver, and gold.

[0044] For purposes of explanation, certain examples are described with reference to the components illustrated in FIGS. 1 through FIG. 6 However, the functionality of the illustrated components can overlap and can exist in a fewer or greater number of elements and components. Furthermore, the disclosed examples can be implemented in a variety of environments and are not limited to the example illustrated. Additionally, the order of the operations described in conjunction with FIG. 4 and FIG. 6 The order of the operations described in conjunction with FIGS. 1 through 3 is an example and is not intended to be limiting. Additional or fewer operations or combinations of operations can be used without departing from the scope of the disclosed examples. Therefore, the present disclosure merely illustrates feasible examples of implementations and many variations and modifications can be made to the described examples. Such modifications and variations are intended to fall within the scope of this disclosure and are to be included within the appended claims.

[0045] Electronic systems, including but not limited to computers, server systems, storage systems, wireless access points, network switches, routers, docking stations, printers, or scanners, include circuit assemblies each having one or more electronic circuit modules. The electronic circuit modules include several chipsets disposed on a circuit board, such as a printed circuit board. Each chipset can include one or more electronic chips (or electronic components or integrated circuit chips). Examples of electronic chips can include, but are not limited to, central processing unit (CPU) chips, graphics processing unit (GPU) chips, power supply chips, memory chips, or electronic elements such as capacitors, inductors, resistors, and the like. During operation of the circuit assembly, the electronic chips of the electronic circuit modules can generate waste heat (or heat). It will be appreciated that such waste heat is undesirable and can impact the operation of the electronic circuit modules. For example, the waste heat can cause physical damage to the electronic chips, reduce the performance, reliability, or expected lifetime of the electronic circuit modules having such electronic chips, and in some cases, the waste heat can even cause the circuit assembly to fail.

[0046] To minimize the adverse effects of the waste heat in the electronic circuit modules having several electronic chips, in certain implementations, the thermal interface material that is typically disposed between each electronic chip and the frame supporting the electronic circuit module is removed as it reduces the thermal resistance of the electronic chips by several degrees. However, handling such bare electronic chips is hazardous and can cause damage to the electronic chips, for example, cracking of the electronic chips that occurs when the cooling module is later installed improperly at the factory and especially in the field.

[0047] Accordingly, to overcome these issues with bare electronic chips, some electronic systems include thermal management systems for carrying waste heat away from (or removing) the electronic chips. In some implementations, the thermal management systems can include cooling modules that require the use of cooling components (e.g., cold plates) to remove waste heat from the electronic chips. For example, the cooling components are disposed in contact (e.g., direct physical contact) with the electronic chips disposed on the circuit board to establish a thermal interface between the cooling components and the electronic chips. Accordingly, such cooling components absorb waste heat generated by the electronic chips and transfer the absorbed waste heat away from the electronic chips.

[0048] However, in certain designs of electronic circuit modules, the electronic chips can have different heights, resulting in uneven or uneven topography of the top surfaces of the electronic chips. Accordingly, in such implementations, the electronic chips disposed on the circuit board can have different heights from the circuit board. Accordingly, the top surfaces of the electronic chips can be positioned at different heights. In some other implementations, even though the electronic chips disposed on the circuit board can have the same height, the top surfaces of the electronic chips can be positioned at different heights due to one or more of soldering defects and variations in pressure exerted on the electronic chips by the cooling components to establish a thermal interface between the cooling components and the electronic chips. In certain other designs of electronic circuit modules, due to design tolerances along the top surfaces of the electronic chips, some of the electronic chips can have different flatness (i.e., uneven or uneven surfaces), resulting in uneven or uneven topography of the top surfaces of the electronic chips. Accordingly, in such implementations, the electronic chips disposed on the circuit board can have uneven topography.

[0049] Accordingly, when a common cooling component (i.e., a single cooling component) is used in an electronic circuit module having such uneven topography between the top surfaces of the electronic chips disposed thereon, the common cooling component cannot be disposed in uniform contact with the top surfaces of all the electronic chips to establish a uniform thermal interface therebetween. For example, such a common cooling component cannot be in contact with the electronic chips having lower heights. Similarly, even when a common cooling component having different heights (e.g., heights complementary to the heights of the different height electronic chips) is used in an electronic circuit module having different height electronic chips, the common cooling component cannot be disposed in contact with the top surfaces of the electronic chips to establish a thermal interface therebetween. For example, such a common cooling component cannot be in uniform contact with the electronic chips having different uneven topography.

[0050] Accordingly, any change in at least one of the height or flatness between the electronic chips in the module can result in inefficient cooling and, thus, change the chip temperature of the entire electronic circuit module. In other words, the common cooling component can not be able to effectively cool the electronic chips having at least one of different heights or flatness. Moreover, any improper installation of the common cooling component on the electronic chips having at least one of different heights or flatness can result in damage to some of the electronic chips. For example, the common cooling component can not be able to apply uniform pressure on all of the electronic chips to establish a thermal interface therebetween, resulting in damage, such as cracking of some of the electronic chips.

[0051] Moreover, in certain embodiments, the cooling module can direct the cold fluid into a single-pass internal fluid chamber of the common cooling component that is in thermal contact with the number of electronic chips to dissipate the waste heat from the number of electronic chips regardless of the case temperature of each of the number of electronic chips. However, due to the high flow area of the single-pass internal fluid chamber, the velocity of the cold fluid directed into the single-pass internal fluid chamber can be low. Accordingly, the coefficient of heat transfer between the common cooling component and each of the number of electronic chips can be reduced. Therefore, to address these issues related to the low velocity of the cold fluid, the cooling module can need to direct the cold fluid into the single-pass internal fluid chamber at a high volumetric flow rate. Accordingly, the chiller distribution unit (CDU) of the thermal management system fluidically connected to the common cooling component of the cooling module can have to supply the cold fluid at a high volumetric flow rate. However, the CDU can deliver the cold fluid at a high volumetric flow rate to only a small number of electronic systems, such as server systems, thereby necessitating the thermal management system to utilize multiple CDUs to meet the demand for the cold fluid by the number of server systems in a data center environment. Accordingly, when the CDU is configured to deliver the cold fluid at a high volumetric flow rate to a small number of server systems, then this can significantly increase the CAPEX and operational costs of the data center environment. Moreover, the data center environment can need more floor space to accommodate the larger number of CDUs to meet the demand for the cold fluid by the server systems.

[0052] Furthermore, in one or more embodiments, the fluid (e.g., a cold fluid or a partially hot fluid or a hot fluid) can need to have a thermal margin that enables the fluid to efficiently absorb waste heat from the electronic chips. As used herein, the term "thermal margin" can refer to a temperature difference between a case temperature of the electronic chips and a temperature of the fluid. Furthermore, as used herein, the term "case temperature" can refer to a maximum temperature that the electronic chips can reach when operating to perform assigned tasks or workloads. In some examples, when the cold fluid flows in thermal contact over one or more upstream electronic chips of the number of electronic chips, the cold fluid can have sufficient thermal margin (e.g., about 4 degrees). Thus, the cold fluid can efficiently absorb waste heat from the one or more upstream electronic chips of the number of electronic chips and produce a partially hot fluid or a hot fluid. As used herein, the term "upstream electronic chip" can designate an electronic chip that is positioned near a fluid inlet of the common cooling component. However, when the partially hot fluid or the hot fluid flows in thermal contact over one or more downstream electronic chips, it can not have sufficient thermal margin. Thus, the partially hot fluid can not efficiently absorb waste heat from the one or more downstream electronic chips of the number of electronic chips. As used herein, the term "downstream electronic chip" can designate an electronic chip that is positioned near a fluid outlet of the common cooling component. Thus, the common cooling component can not adequately or uniformly dissipate waste heat from all of the electronic chips.

[0053] One approach that the electronics industry has tried to address the above issues with common cooling components is by using discrete (or individual) cooling components for each electronic chip, rather than using a common cooling component for the number of electronic chips. However, cooling modules with such discrete cooling components can increase factory installation complexity and field and factory serviceability challenges. For example, circuit assemblies can need extensive plumbing modifications for each electronic chip to include the discrete cooling components (e.g., individual cold plates). In some embodiments, the modifications can include i) introducing and exiting a plurality of flow tubes to and from each cooling component, and ii) implementing a discrete fluid inlet connector and a discrete fluid outlet connector for each cooling component. Additionally, during service or installation events, a technician can need to follow a complex procedure to complete the connection (or disconnection) of the discrete fluid inlet and outlet of each cooling component with the corresponding flow tubes of the plurality of flow tubes.

[0054] Further, in some implementations, the discrete cooling components can be interconnected using external tubing in order to reduce the complexity of installation and serviceability. However, directing the cold fluid between the discrete cooling components via external tubing can result in higher pressure drops within each cooling component. As a result, in such implementations, the CDU can consume more power to maintain the required volumetric flow, addressing the associated pressure drop in each cooling component. This can impact the ability of the CDU to supply cold fluid to several server systems of the data center environment. Additionally, the cooling modules with external tubing can occupy more space within each server system.

[0055] According to aspects of the present disclosure, an improved cooling module for an electronic circuit module of a circuit assembly is provided that mitigates one or more of the challenges described above. For example, the improved cooling module includes a first cooling component and a second cooling component positioned within a recessed portion of the first cooling component. In some examples, the first cooling component is mounted on a frame of the circuit assembly supporting the electronic circuit module to fluidly connect to the second cooling component and establish a first thermal interface with a first electronic die package of the electronic circuit module. Similarly, the second cooling component is mounted on the frame to establish a second thermal interface with a second electronic die package of the electronic circuit module. In such examples, the first cooling component can be independently 3-dimensionally movable (e.g., float) relative to the second cooling component to accommodate a change in at least one of a height or flatness between the first electronic die package and the second electronic die package after the first cooling component is mounted to the frame. In some examples, the first cooling component can be tilted relative to the second cooling component to align with a surface of the second cooling component to accommodate a change in flatness between the first electronic die package and the second electronic die package. In some other examples, the first cooling component can be moved up and down relative to the second cooling component to accommodate a change in height between the first electronic die package and the second electronic die package. In one or more examples, the first cooling component can be tilted relative to the second cooling component to accommodate a change in flatness between the first electronic die package and the second electronic die package, or can be moved up and down relative to the second cooling component to accommodate a change in height between the first electronic die package and the second electronic die package, or a combination thereof.

[0056] In one or more examples, the first cooling component includes a pair of first fluid connectors and the second cooling component includes a pair of second fluid connectors. In such examples, each connector of the pair of first fluid connectors is movably connected to a respective connector of the pair of second fluid connectors to establish a fluid flow path between the first cooling component and the second cooling component. In some examples, each connector of the pair of first fluid connectors is one of a fluid hole or a fluid piston. Similarly, each connector of the pair of second fluid connectors is the other of a fluid hole or a fluid piston. In such examples, the cooling module further includes an O-ring seal disposed in an outer peripheral groove of the fluid piston. In one or more examples, where the fluid piston is movably connected to the fluid hole to establish the fluid flow path between the first cooling component and the second cooling component, the O-ring seal can contact a wall of the fluid hole (i.e., press against the wall) thereby preventing leakage of fluid (partially hot fluid or hot fluid) from the fluid flow path. In some examples, the O-ring seal (in a compressed state against the wall) can slide along the wall (an inner wall) of the fluid hole with up-and-down movement of the first cooling component relative to the second cooling component. In some other examples, the O-ring seal can be eccentrically pressed against the wall (an inner wall) of the fluid hole with tilting movement of the first cooling component relative to the second cooling component. In other words, where the first cooling component is tilted to accommodate a change in flatness between the first electronic die and the second electronic die, the O-ring seal can be eccentrically compressed by displacement of the first cooling component relative to the first electronic die stack. In one or more examples, the O-ring seal slides along the wall of the fluid hole with up-and-down movement of the first cooling component relative to the second cooling component, is eccentrically pressed against the wall of the fluid hole with tilting movement of the first cooling component relative to the second cooling component, or a combination thereof.

[0057] The first cooling component receives fluid (cool fluid) from a coolant distribution unit (CDU) of a thermal management system in a data center environment. In such examples, the first cooling component directs the cool fluid within a first fluid passageway of the first cooling component to absorb waste heat from the first electronic die and produce partially hot fluid. The first cooling component also discharges the partially hot fluid to an intermediate passageway of the second cooling component via a fluid flow path (e.g., an inlet fluid flow path). In such examples, the second cooling component directs the partially hot fluid within the intermediate passageway of the second cooling component to absorb waste heat from the second electronic die and produce hot fluid. Later, the second cooling component discharges the hot fluid to a second fluid passageway of the first cooling component via a fluid flow path (e.g., an outlet fluid flow path). The first cooling component directs the hot fluid in the second fluid passageway to return the hot fluid outside of the cooling module. In some examples, the first fluid passageway includes a body segment having a tortuous flow route disposed in thermal contact with the first electronic die. For example, the body segment first bifurcates into a first body segment and a second body segment, and then the first body segment and the second body segment merge into a third body segment to define the tortuous flow route for the body segment. In one or more examples, the body segment having the tortuous flow route can significantly increase the velocity of the fluid within the first cooling component to efficiently dissipate waste heat from a high-power electronic die or the first electronic die (e.g., a plurality of memory dies (or a plurality of first electronic dies) and a GPU die (or a second electronic die)). Thus, the CDU can be enabled to deliver the cool fluid to the first cooling component of the cooling module at a low volumetric flow rate to cool the first electronic die. Moreover, the intermediate fluid passageway having a single pass flow route is disposed in thermal contact with the second electronic die. In one or more examples, the intermediate fluid passageway having the single pass flow route can enable the fluid to be directed at a relatively low velocity to efficiently dissipate waste heat from a low-power electronic die or the second electronic die (e.g., a CPU die or a third electronic die). In some examples, the body segment of the first fluid passageway having the tortuous flow route can enable the cooling module to have a volumetric flow rate of about 0.12 gallons per minute. Thus, the CDU in the data center environment can be enabled to accommodate the demand for cool fluid by a plurality of server systems of the data center environment. In some examples, the CDU can be provided to supply cool fluid for a plurality of racks (e.g., at least four racks), where each rack can have about thirty-two server systems, and each server system can have about eight circuit assemblies, and each circuit assembly can have at least one cooling module.

[0058] In some examples, since the cold fluid is first directed to the bifurcated fluid section in thermal contact with the plurality of first electronic chips having low enclosure temperatures, the cold fluid can have sufficient thermal margin to efficiently dissipate waste heat from the plurality of first electronic chips. Further, since the mixed portion of the partially hot fluid from the bifurcated fluid section is directed to the merged body section in thermal contact with the second electronic chip having high enclosure temperatures, the mixed portion of the partially hot fluid can still have sufficient thermal margin to efficiently dissipate waste heat from the second electronic chip. Further, since the partially hot fluid from the first cooling component is directed to the intermediate fluid passage in thermal contact with the third electronic chip having the highest enclosure temperature, the partially hot fluid can still have sufficient thermal margin to efficiently dissipate waste heat from the third electronic chip. Thus, the cooling module can be able to sufficiently and uniformly dissipate waste heat from all of the electronic chips in the electronic circuit module.

[0059] Accordingly, the present disclosure describes an example implementation of a cooling module for an electronic circuit module of a circuit assembly, and a method of cooling an electronic circuit module. The cooling module includes a first cooling component and a second cooling component. The first cooling component includes a pair of first fluid connectors and an intermediate fluid passage. The second cooling component includes a first fluid passage and a second fluid passage, where the first fluid passage includes a supply section, a return section, and a body section. The second cooling component is positioned within a recessed portion of the first cooling component and fluidically connected to the first cooling component. The body section bifurcates into a first body section and a second body section, and the first body section and the second body section further merge into a third body section. The supply section is connected to the first body section and the second body section. The return section is connected to the third body section and to the intermediate fluid passage via an inlet fluid flow path established between the first cooling component and the second cooling component. The second fluid passage is connected to the intermediate fluid passage via an outlet fluid flow path established between the first cooling component and the second cooling component.

[0060] Referring to the drawings, FIG. 1A An exploded perspective view of the circuit assembly 100 is shown. FIG. 1B An assembled perspective view of the circuit assembly 100 is shown. FIG. 1A An assembled perspective view of the circuit assembly 100 is shown. FIG. 1C A cross-sectional view of one of the pair of first fluid connectors 164A having an O-ring seal 182, one connector movably connected to the other connector 148A of the pair of second fluid connectors 148, is shown according to one example of the present disclosure. FIGS. 1A-1B A cross-sectional view of one of the pair of first fluid connectors 164A having an O-ring seal 182, one connector movably connected to the other connector 148A of the pair of second fluid connectors 148, is shown according to one example of the present disclosure. FIG. 1D A cross-sectional view of one of the pair of first fluid connectors 164A having an O-ring seal 182, one connector movably connected to the other connector 148A of the pair of second fluid connectors 148, is shown according to one example of the present disclosure. FIGS. 1A-1Bthe other of the pair of second fluid connectors 148. In the description that follows, for ease of illustration, both the FIGS. 1A-1D and FIGS. 2A-2G .

[0061] The circuit assembly 100 can be used as an electronic packaging unit configured to provide mechanical protection to the electronic circuit module 104, dissipate waste heat from the electronic circuit module 104, and distribute electrical energy for the functionality of the electronic circuit module 104 to perform at least one workload. In some examples, the circuit assembly 100 includes the frame 102, the electronic circuit module 104, and the cooling module 106. In one or more examples, the circuit assembly 100 can be disposed within an electronic system, such as but not limited to a server system, a storage system, an access point, a network switch, a router, a docking station, a printer, or a scanner, to perform at least one workload. In certain examples, the circuit assembly 100 is a compute node of an electronic system, such as a server system. In such examples, multiple compute nodes can be disposed within a chassis of the server system, and multiple such server systems can be deployed in a housing or rack or tray of a data center environment (not shown) to perform multiple workloads. As discussed herein, the circuit assembly 100 includes the electronic circuit module 104 coupled to the frame 102, and the cooling module 106 assembled to the electronic circuit module 104 and connected to the frame 102.

[0062] With reference to FIGS. 1A-1B , the frame 102 can act as a stiffener and heat spreader for the circuit assembly 100. In some examples, the frame 102 includes a base 102A and a cover 102B. FIG. 2A An exploded perspective view of the frame 102 is shown in particular. In some examples, the base 102A is an open box-like element. In such examples, the base 102A has a circuit board 128 (such as a motherboard) of the electronic circuit module 104 supported therein. In some examples, the cover 102B is a planar element that is configured to be coupled to the base 102A to enclose the electronic circuit module 104. FIG. 1AThe base 102A includes a base segment 112A (shown in phantom). The base segment 112A of the base 102A includes a plurality of first clamping holes 114A. In addition, the base 102A can include a plurality of retention holes (not shown) formed in the base segment 112A. In such examples, the plurality of retention holes can be used to clamp the frame 102 to an electronic system. In some examples, the cover 102B is another open box-like element. In such examples, the cover 102B has an opening 110 formed in a cover segment 112B of the cover 102B. For example, the opening 110 can be formed substantially in a center portion of the cover segment 112B. Additionally, the cover segment 112B includes a plurality of first holes 118A, a plurality of second holes 118B, and a plurality of second clamping holes 114B. In some examples, each hole of the plurality of second clamping holes 114B is aligned with a corresponding hole of the plurality of first clamping holes 114A in the base 102A. In one or more examples, the cover 102B can be mounted on and coupled with the base 102A to form the frame 102.

[0063] Referring to FIGS. 1A-1B , the electronic circuit module 104 can be used as a multi-chip module of the circuit assembly 100. In some examples, the electronic circuit module 104 includes a first chip set 124 (or first electronic chip set), a second chip set 126 (or second electronic chip set), and a circuit board 128. FIG. 2B A perspective view of the electronic circuit module 104 is shown in detail. In some examples, the circuit board 128 can be a printed circuit board (PCB) that includes a number of conductive traces (not shown) to electrically interconnect the first electronic chip set 124 and the second electronic chip set 126, respectively. In some examples, the first electronic chip set 124 and the second electronic chip set 126 are each positioned adjacent to each other and disposed on and coupled with the circuit board 128. For example, the first electronic chip set 124 and the second electronic chip set 126 can be coupled to the circuit board 128 by solder joints. In some examples, the first electronic chip set 124 includes a plurality of first electronic chips 124A and a second electronic chip 124B. Similarly, the second electronic chip set 126 includes a third electronic chip 126A. It can be noted herein that the plurality of first electronic chips 124A, the second electronic chip 124B, and the third electronic chip 126A can be collectively referred to as electronic chips 125 (as labeled in FIG. 2B Examples of the electronic chips 125 can include, but are not limited to, a central processing unit (CPU) chip, a graphics processing unit (GPU) chip, a power chip, a memory chip, or other electronic components such as capacitors, inductors, resistors, etc. In the illustrated example, each of the plurality of first electronic chips 124A is a memory chip, the second electronic chip 124B is a graphics chip, and the third electronic chip 126A is a processor (CPU) chip. In FIG. 2BIn the example, a plurality of first electronic chips 124A are arranged along a first row 127A and a second row 127B surrounding a second electronic chip 124B. It should be noted that the electronic circuit module 104 may include various combinations of different types of electronic chips 125 without limiting the scope of this disclosure. Furthermore, although the electronic circuit module 104 is shown as including three types of electronic chips 125 arranged in a particular manner, the scope of this disclosure is not limited to the number or type of electronic chips 125 or the manner in which the electronic chips 125 are arranged on the circuit board 128. The circuit board 128 further includes a plurality of third clamping holes 114C, each third clamping hole being aligned with a corresponding hole in one of the plurality of first clamping holes 114A and second clamping holes 114B of the frame 102.

[0064] FIG. 2C Specifically, the electronic circuit module 104 is shown along... FIG. 2B A cross-sectional view taken by line 1-1'. A first electronic chipset 124 (e.g., a plurality of first electronic chips 124A and / or second electronic chips 124B) may have a flatness “F1” along its top surface 134. For example, the flatness “F1” is approximately 0 degrees. Furthermore, the first electronic chipset 124 may have a first height “H1” from the top surface 132 of the circuit board 128. Similarly, a second electronic chipset 126 (e.g., a third electronic chip 126A) may have a different flatness “F2” along its top surface 130. In some examples, the different flatness “F2” may be approximately -5 degrees. Furthermore, the third electronic chipset 126 may have a second height “H2” from the top surface 132 of the circuit board 128. FIG. 2C In the illustrated example, the first height "H1" is greater than the second height "H2". Therefore, in the illustrated example, the first electronic chipset 124 and the second electronic chipset 126 have different heights and flatnesses. In one or more examples, the top surface 134 of the first electronic chipset 124 is the first thermal bonding surface 134A of the electronic circuit module 104, and the top surface 130 of the second electronic chipset 126 is the second thermal bonding surface 130A of the electronic circuit module 104.

[0065] refer to FIGS. 1A-1B The cooling module 106 serves as a fluid cooling module for the circuit assembly 100. The fluid cooling module requires the use of cold fluid 198A (or a fluid, such as...). FIGS. 5A-5B (As shown) the waste heat is carried away from the electronic chip 125 of the electronic circuit module 104 and a heat fluid 198C is generated (e.g.) FIGS. 5A-5Btemperature, or a secondary temperature, a temperature of the hot fluid 198C, which can be about 60 degrees, referred to as a return temperature, or a tertiary temperature, and a temperature of a facility fluid (not shown), which can be about 32 degrees, referred to as a facility temperature, or a primary temperature. As used herein, the term “supply temperature” can refer to a temperature of the cold fluid 198A delivered from a chiller distribution unit (CDU, not shown) to the cooling module 106 of each circuit assembly 100. Similarly, the term “return temperature” can refer to a temperature of the hot fluid 198C discharged from the cooling module 106 of each circuit assembly 100 to the CDU. Further, the term “facility temperature” can refer to a temperature of a facility fluid directed from a data center environment to the CDU to cool the hot fluid 198C received from the cooling module 106. In one or more examples, the CDU can include at least one heat exchanger system to enable transfer of waste heat from the hot fluid 198C to the facility fluid in order to regenerate the cold fluid 198A. In one or more examples, the supply temperature of the cold fluid 198A can be a combination of the facility temperature of the facility fluid and an approach temperature of a heat exchanger in the CDU. In some examples, the approach temperature can be a temperature rise of the cold fluid 198A or a temperature differential between the cold fluid 198A and the facility fluid.

[0066] In some examples, the cooling module 106 includes a first cooling component 136 and a second cooling component 138. In some examples, each of the first cooling component 136 and the second cooling component 138 is a thermally conductive component, e.g., a cold plate. In such examples, each of the first cooling component 136 and the second cooling component 138 has an internal passage or fluid passage, such as a microchannel (not shown in FIG. 1) for directing (or channeling) the cold fluid 198A to absorb waste heat and generate the hot fluid 198C. FIGS. 1A-1B

[0067] FIG. 2D An exploded top view of the cooling module 106 is shown, and FIG. 2E ​An exploded bottom view of the cooling module 106 is shown. In one or more examples, the first cooling component 136 includes a pair of first flange portions 152, a recessed portion 154 located between the pair of first flange portions 152, and a pair of first fluid connectors 164. In some examples, the first cooling component 136 has a top surface 156 and a bottom surface 158. The first cooling component 136 also includes a first cooling portion 160 and a third cooling portion 162. In some examples, the first cooling portion 160 is formed at the bottom surface 158 corresponding to a portion of the first flange 152A of the pair of first flange portions 152. In such examples, the first cooling portion 160 protrudes outward from the bottom surface 158 of the first cooling component 136. In one or more examples, the bottom surface of the first cooling portion 160 serves as a first thermally bonded surface 160A of the cooling module 106. In some examples, the height of the first cooling portion 160 is significantly greater than the height of each flange in the pair of first flange portions 152. Furthermore, each flange in the pair of first flange portions 152 has the same height. A third cooling portion 162 is formed on the top surface 156 of the first cooling member 136. For example, the third cooling portion 162 protrudes outward from the top surface 156 and extends between a pair of first flange portions 152 and a recessed portion 154. In some examples, the height of the third cooling portion 162 is significantly greater than the height of each of the pair of first flange portions 152. The first cooling member 136 also includes a fluid inlet 166 and a fluid outlet 168 spaced apart from each other and formed in a first peripheral wall 162A of the third cooling portion 162.

[0068] In one or more examples, a pair of first fluid connectors 164 are formed at the bottom surface 158. For example, the pair of first fluid connectors 164 are located at a recess 154, wherein each connector of the pair of first fluid connectors 164 protrudes inward from the recess 154 toward the third cooling portion 162. In some examples, the pair of first fluid connectors 164 includes a first connector 164A and a second connector 164B. In one or more examples, the first connector 164A may be located via a first fluid channel 192 formed within the first cooling portion 160 and the third cooling portion 162 of the first cooling member 136 (e.g., ...). FIGS. 5A-5B (As shown) fluid connection to fluid inlet 166. Similarly, the second connector 164B can be connected via a second fluid channel 196 formed within the third cooling portion 162 of the first cooling component 136 (as shown). FIGS. 5A-5B (As shown) The fluid is connected to the fluid outlet 168. In some examples, a pair of first fluid connectors 164 may be either a fluid orifice or a fluid piston. FIGS. 2D-2E In the example, each connector in the pair of first fluid connectors 164 is a fluid orifice. It can be noted in this document that the fluid orifice... FIGS. 1C-1Dare discussed in greater detail in the examples of FIGS. 1-3.

[0069] The first cooling component 136 also includes a plurality of fourth holes 118D formed in the first flange 152A of the pair of first flange portions 152. In one or more examples, each fourth hole of the plurality of fourth holes 118D is aligned with a respective second hole of the plurality of second holes 118B formed in the cover portion 102B of the frame 102. Further, a diameter of each fourth hole of the plurality of fourth holes 118D is substantially equal to a diameter of each second hole of the plurality of second holes 118B.

[0070] In some examples, the first cooling component 136 also includes a plurality of fifth holes 118E formed in the recessed portion 154. Additionally, the first cooling component 136 includes a plurality of fourth clamping holes 114D. Each hole of the plurality of fourth clamping holes 114D is aligned with a respective hole of the plurality of second clamping holes 114B formed in the cover portion 102B of the frame 102. Further, a diameter of each hole of the plurality of fourth clamping holes 114D is substantially greater than a diameter of each respective hole of the plurality of first clamping holes 114A, second clamping holes 114B, and third clamping holes 114C. Further, a diameter of each hole of the plurality of first clamping holes 114A, second clamping holes 114B, and third clamping holes 114C is equal, respectively.

[0071] The first cooling component 136 additionally includes a plurality of retention holes 170 (or a plurality of retention apertures) spaced apart from one another and formed on the third cooling portion 162 of the first cooling component 136. For example, each retention hole of the plurality of retention holes 170 is located in the recessed portion 154 and extends along the third cooling portion 162. Each retention hole of the plurality of retention holes 170 is aligned with a respective retention tab of the plurality of retention tabs 150 formed in the second cooling component 138. In some examples, a diameter of each retention hole of the plurality of retention holes 170 is substantially equal to a diameter / width of a respective retention tab of the plurality of retention tabs 150.

[0072] The first cooling component 136 also includes a plurality of tether fastener holes 172 (or a plurality of tether fastener apertures) formed in the peripheral wall of the third cooling portion 162. For example, a pair of tether fastener holes 172A is formed in the first peripheral wall 162A of the third cooling portion 162, while another pair of tether fastener holes (not shown) is formed in the second peripheral wall 162B of the third cooling portion 162. In some examples, each tether hole of the plurality of tether fastener holes 172 can extend to a respective retention hole of the plurality of retention holes 170. Although not shown in the examples of FIGS. 1-3, it is noted herein that each tether fastener hole 172 is a stepped hole (or aperture). In one or more examples, each tether fastener 178 (as shown in FIG. 4) is a threaded fastener. FIGS. 1A-1B FIG. 2E ​The illustrated) can be freely retained inside the tethering fastener hole (the stepped hole) without causing the corresponding tethering fastener 178 to be lost from the first cooling component 136, and at the same time the stepped hole can allow the corresponding tethering fastener 178 to be selectively fastened to engage (or disengage) with the corresponding retention tab 150, thereby coupling (or decoupling) the first cooling component 136 and the second cooling component 138 to each other, respectively.

[0073] In one or more examples, the second cooling component 138 includes a pair of second flange portions 140, a second cooling portion 142 positioned between the pair of second flange portions 140, and a pair of second fluid connectors 148. In some examples, the second cooling component 138 has a top surface 144 and a bottom surface 146. In such examples, the second cooling portion 142 is formed at the bottom surface 146. For example, the second cooling portion 142 protrudes outwardly from the bottom surface 146 of the second cooling component 138. In one or more examples, the bottom surface of the second cooling portion 142 serves as a second thermal engagement surface 142A of the cooling module 106. In some examples, the height of the second cooling portion 142 is significantly greater than the height of each flange of the pair of second flange portions 140. Further, each flange of the pair of second flange portions 140 is equal in height.

[0074] In some examples, the pair of second fluid connectors 148 is formed at the top surface 144 of the second cooling component 138. For example, the pair of second fluid connectors 148 protrudes outwardly from the top surface 144. The pair of second fluid connectors 148 includes a first connector 148A of the pair of second fluid connectors 148 and a second connector 148B of the pair of second fluid connectors 148. In one or more examples, the first connector 148A of the second cooling component 138 is aligned with the first connector 164A of the first cooling component 136. Similarly, the second connector 148B of the second cooling component 138 is aligned with the second connector 164B of the first cooling component 136. In one or more examples, the pair of second fluid connectors 148 is fluidly connected to the intermediate fluid passage 194 (see FIGS. 5A-5B ) formed within the second cooling portion 142 of the second cooling component 138. For example, the first connector 148A can be connected to one end 184 (as FIG. 1C illustrated) of the intermediate fluid passage 194, and the second connector 148B can be connected to the other end (not illustrated) of the intermediate fluid passage 194. In some examples, the pair of second fluid connectors 148 can be another one of a fluid hole or a fluid piston. In FIGS. 2D-2E examples where the pair of second fluid connectors 148 are fluid pistons, each connector of the pair of second fluid connectors 148 is a fluid piston. It can be noted herein that fluid pistons are discussed in greater detail in FIGS. 1C-1D .

[0075] The second cooling component 138 also includes a plurality of third holes 118C. For example, each flange of the pair of second flange portions 140 can include a pair of the plurality of third holes 118C. In one or more examples, each third hole of the plurality of third holes 118C is aligned with a respective first hole of the plurality of first holes 118A formed in the cover portion 102B of the frame 102. Further, each third hole of the pair of third holes 118C is aligned with a respective fifth hole of the plurality of fifth holes 118E formed in the first cooling component 136. In one or more examples, a diameter of each fifth hole of the plurality of fifth holes 118E is substantially greater than i) a diameter of each third hole of the plurality of third holes 118C formed in the second cooling component 138, and ii) a diameter of each first hole of the plurality of first holes 118A formed in the cover portion 102B of the frame 102. Similarly, a diameter of each third hole of the plurality of third holes 118C is substantially equal to a diameter of each first hole of the plurality of first holes 118A. The second cooling component 138 also includes a plurality of retention tabs 150 spaced apart from one another and formed on a top surface 144 of the second cooling component 138. For example, each retention tab of the plurality of retention tabs 150 extends outwardly from the top surface 144 of the second cooling component 138.

[0076] Referring to FIGS. 1A-1B the example cooling module 106 also includes a plurality of first spring-loaded fasteners 174 and a plurality of second spring-loaded fasteners 176. In one or more examples, each fastener of the plurality of first spring-loaded fasteners 174 can be respectively inserted through a respective hole of the plurality of fourth holes 118D and second holes 118B to connect the first cooling component 136 to the frame 102. Similarly, each fastener of the plurality of second spring-loaded fasteners 176 can be respectively inserted through a respective hole of the plurality of third holes 118C and first holes 118A to connect the second cooling component 138 to the frame 102. Referring to the figures, for example, FIG. 2F one of the plurality of first spring-loaded fasteners 174 is shown. It can be noted herein that the first spring-loaded fasteners 174 and the second spring-loaded fasteners 176 are substantially similar. Referring to the figures, specifically FIG. 2FThe first spring-loaded fastener 174 includes a shoulder screw 174A and a spring 174B. The shoulder screw 174A includes a head 174A1, a shank 174A2, and a threaded portion 174A3. In such examples, the head 174A1 has a larger diameter than the shank 174A2 and the threaded portion 174A3. Further, the shank 174A2 has a larger diameter than the threaded portion 174A3. The spring 174B is a helical compression spring that is mounted to the shank 174A2. In one or more examples, the threaded portion 174A3 of the first spring-loaded fastener 174 can be fastened into the second hole 118B of the cover portion 102B of the frame 102 in order to connect the first cooling component 136 to the frame 102. In such examples, the spring 174B can be compressed by fastening the threaded portion 174A3 into the first hole 118A such that the spring 174B biases the first cooling component 136 to move toward the first electronic chip set 124 to establish a thermal interface with the first electronic chip set 124.

[0077] Accordingly, in one or more examples, each spring 174B of the plurality of first spring-loaded fasteners 174 can individually bias the first cooling component 136 to move toward the first electronic chip set 124 to establish a first thermal interface with the first electronic chip set 124. Similarly, each spring of the plurality of second spring-loaded fasteners 176 can individually bias the second cooling component 138 to move toward the second electronic chip set 126 to establish a second thermal interface with the second electronic chip set 126.

[0078] Reference is made to FIG. 1A , FIG. 2E and FIG. 2GThe cooling module 106 also includes a plurality of tether fasteners 178. In some examples, each tether fastener 178 is a special type of screw that can be freely retained inside an opening (e.g., tether fastener hole 172) of an object without being lost from the tether fastener hole 172, and at the same time the tether fastener 178 can be selectively fastened to lock the first cooling component 136 to the second cooling component 138. In some examples, the tether fastener 178 includes a head 178A, an intermediate portion 178B, an end portion 178C, a first body portion 178D connecting the head 178A and the intermediate portion 178B, and a second body portion 178E connecting the intermediate portion 178B and the end portion 178C. The head 178A and the intermediate portion 178B have substantially equal diameters. The first body portion 178D and the second body portion 178E have substantially equal diameters. The diameter of the intermediate portion 178B can be greater than the diameter of the tether fastener hole 172, thereby freely retaining the tether fastener 178 within the tether fastener hole 172. The second body portion 178E can have threads that move in opposition to threads formed in the tether fastener hole 172. Further, the end portion 178C of the tether fastener 178 can engage (see FIG. 3 ) the retaining tab 150 of the second cooling component 138, so as to couple the first cooling component 136 and the second cooling component 138 to each other.

[0079] Although FIGS. 1A-1B the circuit assembly 100 is shown as including one cooling module 106, it is also contemplated within the scope of the present disclosure to use more than one cooling module in the circuit assembly 100. The cooling module 106 presented herein is a fluid cooling module that requires the use of a cold fluid 198A to carry waste heat away from the electronic chip 125 and produce a hot fluid 198B. For ease of illustration, other components and devices of the thermal management system for effecting the flow of the cold fluid 198A from the CDU to the cooling module 106 and the flow of the hot fluid 198B to the CDU (e.g., CDU, manifold, flow tubes, coolant circulation pump, valves, etc.) are not shown in FIGS. 1A-1B and are considered to be outside the scope of the present disclosure.

[0080] Reference is made to FIGS. 1A-1B and FIGS. 2A-2CDuring assembly of the cooling module 106, the electronic circuit module 104 is disposed on the base portion 102A of the frame 102 such that the circuit board 128 is positioned on the floor segment 112A of the base portion 102A and each of the plurality of third clamping holes 114C is aligned with a respective one of the plurality of first clamping holes 114A in the base portion 102A. Further, the cover portion 102B of the frame 102 is installed in the base portion 102A such that the first electronic die set 124 and the second electronic die set 126 are accessible from the opening 110 in the cover portion 102B. Further, each of the plurality of second clamping holes 114B in the cover portion 102B is aligned with a respective one of the plurality of third clamping holes 114C in the circuit board 128. Subsequently, clamping fasteners of a plurality of clamping fasteners (not shown) are inserted into respective ones of the plurality of second clamping holes 114B, third clamping holes 114C, and first clamping holes 114A in the cover portion 102B, circuit board 128, and base portion 102A, respectively, thereby coupling the cover portion 102B to the base portion 102A and forming the frame 102 that clamps the electronic circuit module 104 therebetween.

[0081] As discussed in the examples of FIG. 2C , the electronic dies 125 (e.g., the first electronic die set 124 and the second electronic die set 126) can have at least one of different heights (“H1,” “H2”) or flatnesses (“F1,” “F2”), resulting in a topology of the respective top surfaces 134, 130 that is not flat. For example, in some implementations, the first electronic die set 124 and the second electronic die set 126 disposed on the circuit board 128 can have different heights “H1” and “H2,” respectively, as shown in FIG. 2C . Accordingly, the top surfaces 134, 130 of the first electronic die set 124 and the second electronic die set 126 can be positioned at different heights, respectively. Similarly, the first electronic die set 124 and the second electronic die set 126 can have different flatnesses “F1” and “F2,” respectively, due to design tolerances or the like, as shown in FIG. 2C . In certain other implementations, even though the first electronic die set 124 and the second electronic die set 126 disposed on the circuit board 128 can have the same height, the top surfaces 134, 130 of the first electronic die set 124 and the second electronic die set 126 can be positioned at different heights due to one or more of soldering defects or variations in pressure exerted on the first electronic die set 124 and the second electronic die set 126.

[0082] According to aspects of the present disclosure, the cooling module 106 facilitates accommodating such variations in at least one of the flatnesses or heights between the first electronic die set 124 and the second electronic die set 126, as discussed herein below. Accordingly, reference is made to FIGS. 1A-1B and FIGS. 2D-2EThe second cooling component 138 is mounted on the frame 102 such that the second cooling portion 142 of the second cooling component 138 faces the second electronic chipset 126 of the circuit board 128. In some examples, after the second cooling component 138 is mounted on the frame 102, the second thermally bonded surface 142A of the second cooling component 138 can be aligned with the second thermally bonded surface 130A of the second electronic chipset 126. As discussed, in FIG. 2C In one example, because the second thermally bonded surface 130A of the second electronic chipset 126 has an uneven flatness “F2”, the second thermally bonded surface 142A of the second cooling component 138 may align with it, resulting in a tilted top surface 144 of the second cooling component 138. Subsequently, each of the plurality of second spring-loaded fasteners 176 is inserted into a corresponding third hole 118C in the second cooling component 138 and a corresponding first hole 118A in the cover 102B to connect the second cooling component 138 to the frame 102. In some examples, each spring of the plurality of second spring-loaded fasteners 176 may bias the second cooling component 138 toward the second electronic chipset 126, thereby establishing a second thermal interface between the second thermally bonded surfaces 142A, 130A of the second cooling component 138 and the second electronic chipset 126.

[0083] Furthermore, the first cooling component 136 is positioned above the second cooling component 138 such that a plurality of retaining holes 170 in the first cooling component 136 are aligned with a plurality of retaining tabs 150 in the second cooling component 138. The first cooling component 136 is then mounted on the frame 102, wherein a first cooling portion 160 of the first cooling component 136 faces the first electronic chipset 124 of the circuit board 128. In such an example, when the first cooling component 136 is mounted on the frame 102, the second cooling component 138 is positioned within a recessed portion 154 of the first cooling component 136, and each of the plurality of retaining tabs 150 protrudes along a corresponding hole in one of the plurality of retaining holes 170.

[0084] Furthermore, when the first cooling component 136 is mounted on the frame 102, as discussed herein, each connector of a pair of first fluid connectors 164 in the first cooling component 136 is movably connected to a corresponding connector of a pair of second fluid connectors 148 in the second cooling component 138 to establish a fluid flow path 190 between the first cooling component 136 and the second cooling component 138 (see [link to document]). FIG. 1C For example, a first connector 164A of a pair of first fluid connectors 164 is movably connected to another first connector 148A of a pair of second fluid connectors 148 to establish an inlet fluid flow path 190A between the first cooling component 136 and the second cooling component 138 (see [link]). FIGS. 5A-5B). Similarly, a second connector 164B of the pair of first fluid connectors 164 is movably connected to another second connector 148B of the pair of second fluid connectors 148 to establish an outlet fluid flow path 190B (see FIGS. 5A-5B ].

[0085] In some examples, mounting the first cooling component 136 on the frame 102 causes the first cooling component 136 to move upwardly (and downwardly) relative to the second cooling component 138 to accommodate changes in height (“H1”, “H2”) between the first electronic chip set 124 and the second electronic chip set 126. Additionally, mounting the first cooling component 136 on the frame 102 also causes the first cooling component 136 to tilt relative to the second cooling component 138 to align with the top surface 144 of the second cooling component 138 to accommodate changes in flatness (“F1”, “F2”) between the first electronic chip set 124 and the second electronic chip set 126. In some examples, mounting the first cooling component 136 on the frame 102 can cause both tilting and up-and-down movement of the first cooling component 136 relative to the second cooling component 138 to accommodate changes in flatness and height, respectively, between the first electronic chip set 124 and the second electronic chip set 126. In such examples, each of the plurality of retention tabs 150 can slide along a respective one of the plurality of retention holes 170 to align the first cooling component 136 with the second cooling component 138.

[0086] Referring to FIGS. 1C-1D In some examples, a first connector 164A of the pair of first fluid connectors 164 is a fluid hole 164A1. In such examples, the fluid hole 164A1 has a first diameter “D1”. In some examples, the first diameter “D1” is about 0.486 inches to about 0.544 inches. The fluid hole 164A1 is connected to one end 188 of a first fluid passage 192 of the second cooling component 138 (as shown in FIG. 2). In some other examples, a first connector 164A of the pair of first fluid connectors 148 can be a fluid piston. FIGS. 5A-5B

[0087] ​In some examples, the other first connector 148A of the pair of second fluid connectors 148 is a fluid piston 148A1. In such examples, the fluid piston 148A1 has a wall 186 (or a circumferential wall) and a second diameter “D2,” and an outer peripheral groove 180 formed on a portion of the fluid piston 148A1 has a groove diameter “D3.” In some examples, the second diameter “D3” is about 0.483 inches to about 0.538 inches. Similarly, the groove diameter “D2” is about 0.376 inches to about 0.378 inches. In some other examples, the other first connector 148A of the pair of second fluid connectors 148 can be a fluid bore. In some examples, the second diameter “D2” is greater than the first diameter “D1.” The cooling module 106 further includes an O-ring seal 182 disposed in the outer peripheral groove 180 of the fluid piston 148A1. In some examples, the O-ring seal 182 can have an inner diameter of about 0.359 inches to about 0.367 inches. In some examples, the fluid piston 148A1 is connected to one end 184 of the intermediate fluid passage 194 (as shown in FIG. 6) of the first cooling component 136. FIGS. 5A-5B

[0088] In one or more examples, the first connector 164A of the pair of first fluid connectors 164 is movably connected to the other first connector 148A of the pair of second fluid connectors 148 to establish the fluid flow path 190 between the first cooling component 136 and the second cooling component 138. In other words, the fluid bore 164A1 is movably connected to the fluid piston 148A1 to establish the fluid flow path 190 therebetween. For example, the fluid piston 148A1 is inserted inside the wall 186 of the fluid bore 164A1 such that the O-ring seal 182 is pressed against the wall 186. In such examples, the fluid piston 148A1 and the fluid bore 164A1 maintain a uniform squeeze gap “Gl” along the first diameter “D1” of the fluid bore 164A1. In some examples, the squeeze gap “Gl” can be about 0.002 inches to about 0.008 inches.

[0089] In some examples, upon movably connecting the fluid piston 148A1 to the fluid bore 164A1, the O-ring seal 182 is pressed against the wall 186 of the fluid bore 164A1 to prevent fluid (such as coolant) from leaking between the fluid piston 148A1 and the fluid bore 164A1. FIG. 5A FIG. 5B ​​from the fluid flow path 190. In some examples, the O-ring seal 182 can be compressed in a range of about 10% to 30% to maintain sufficient contact with the wall 186 of the fluid bore 164A1. As discussed herein, the O-ring seal 182 slides along the wall 186 of the fluid bore 164A1 by the up and down movement of the first cooling component 136 relative to the second cooling component 138. In other words, the wall 186 slides down or up while the O-ring seal 182 remains in contact with the wall 186 to accommodate changes in the height (“H1,” “H2”) between the first electronic chip set 124 and the second electronic chip set 126. Accordingly, the O-ring seal 182 can allow the first cooling component 136 to move independently relative to the second cooling component 138 to accommodate any changes in the height (“H1,” “H2”) between the first electronic chip set 124 and the second electronic chip set 126. In some examples, the changes in the height (“H1,” “H2”) can be about 0.0052 inches to about 0.0058 inches.

[0090] Referring to FIG. 1D , the O-ring seal 182 can be eccentrically compressed against the wall 186 of the fluid bore 164A1 by the tilting movement of the first cooling component 136 relative to the second cooling component 138. In some examples, the O-ring seal 182 can be eccentrically compressed to about 0.15 inches to about 2.5 inches. In such examples, the fluid piston 148A1 and the fluid bore 164A1 maintain different extrusion gaps “G2” circumferentially along the first diameter “D1” of the fluid bore 164A1. Accordingly, the O-ring seal 182 can allow the first cooling component 136 to tilt independently relative to the second cooling component 138 to accommodate changes in the flatness (“F1,” “F2”) between the first electronic chip set 124 and the second electronic chip set 126. In some examples, the changes in the flatness (“F1,” “F2”) can be about 1.975 degrees to about 8.746 degrees. Accordingly, referring to FIGS. 1C-1D , the O-ring seal 182 can allow the first cooling component 136 to move in 3 dimensions relative to the second cooling component 138 in order to accommodate changes in at least one of the height (“H1,” “H2”) or the flatness (“F1,” “F2”) between the first electronic chip set 124 and the second electronic chip set 126.

[0091] In some examples, upon installation of the first cooling component 136 on the frame 102, the first thermal engagement surface 160A of the first cooling component 136 can be aligned with the first thermal engagement surface 134A of the first electronic chip set 124. Further, each fastener of the plurality of first spring-loaded fasteners 174 is inserted into a respective fourth hole 118D in the first cooling component 136 and a respective second hole 118A in the cover portion 102B to connect the first cooling component 136 to the frame 102. In some examples, each spring of the plurality of first spring-loaded fasteners 174 can bias the first cooling component 136 to move toward the first electronic chip set 124, thereby establishing a first thermal interface between the first thermal engagement surfaces 160A, 134A of the first cooling component 136 and the first electronic chip set 124. In some examples, each of the plurality of second spring-loaded fasteners 176 can be accessed (i.e., for loosening, for example) via a respective hole of a plurality of fifth holes 118E in the first cooling component 136. Similarly, each fastener of the plurality of clamping fasteners can be accessed (i.e., for loosening, for example) via a respective hole of a plurality of fourth clamping holes 114D in the first cooling component 136. Reference is made to FIGS. 1C-1D In one or more examples, the O-ring seal 182 is eccentrically pressed against the wall 186 of the fluid hole 164A1 by the up-and-down movement of the first cooling component 136 relative to the second cooling component 138, by the tilting movement of the first cooling component 136 relative to the second cooling component 138, or a combination thereof.

[0092] FIG. 3 A perspective view of a portion of the second cooling component 138 and the pair of tethered fasteners 178 is shown. It can be noted herein that the first cooling component 136 is not shown and such illustration should not be construed as a limitation of the present disclosure. FIGS. 1A-1B FIG. 3 The first cooling component 136 is not illustrated and such illustration should not be construed as a limitation of the present disclosure. Reference is made to FIG. 2E FIG. 2G and FIG. 3 Each tethered fastener of the plurality of tethered fasteners 178 is pre-disposed within a respective tethered fastener hole of the plurality of tethered fastener holes 172. Further, each tethered fastener of the plurality of tethered fasteners 178 is fastened so as to engage each tethered fastener 178 with a respective retaining tab of the plurality of retaining tabs 150, thereby coupling the first cooling component 136 and the second cooling component 138 to each other. Accordingly, the tethered fasteners 178 can complete the process of assembling the cooling module 106 to the electronic circuit module 104.

[0093] ​​During operation of the circuit assembly 100, the first electronic chip set 124 and the second electronic chip set 126 can generate waste heat. As will be appreciated, such waste heat generated by the first electronic chip set 124 and the second electronic chip set 126 is undesirable and can impact the operation of the electronic circuit module 104 if not effectively managed. Accordingly, in some examples, the proposed cooling module 106 can establish sufficient thermal interfaces between the cooling components and the electronic chips to enable efficient waste heat transfer from the electronic chips regardless of variations in at least one of the height and flatness between the first electronic chip set 124 and the second electronic chip set 126. Thus, in accordance with aspects of the present disclosure, the cooling module 106 facilitates efficient cooling of the first electronic chip set 124 and the second electronic chip set 126 regardless of variations in at least one of the height or flatness between the first electronic chip set 124 and the second electronic chip set 126.

[0094] FIG. 4 is a flowchart illustrating a method 400 of assembling a cooling module to an electronic circuit module of a circuit assembly. It should be noted herein that the method 400 is described in conjunction with, for example FIGS. 1A-1D and FIGS. 2A-2G The method 400 begins with block 402 and continues with block 404. At block 404, the method 400 includes coupling an electronic circuit module to a frame of a circuit assembly. In some examples, the electronic circuit module is disposed on a base portion of the frame. Further, a cover portion of the frame is mounted on the base portion such that the electronic circuit module is sandwiched between the base portion and the cover portion. Subsequently, one of a plurality of clamping fasteners is inserted into each of a plurality of second clamping holes, third clamping holes, and first clamping holes respectively formed in the cover portion of the frame, a circuit board of the electronic circuit module, and the base portion of the frame in order to couple the electronic circuit module to the frame. In some examples, the electronic circuit module includes the circuit board, and a first electronic chip set and a second electronic chip set are disposed on the circuit board. The method 400 continues with block 406.

[0095] At block 406, the method 400 includes connecting a second cooling component of a cooling module in the circuit assembly to the frame to establish a second thermal interface between the second cooling component and the second electronic chip set. In some examples, the second cooling component is connected to the cover portion of the frame using a plurality of second spring-loaded fasteners. The method continues with block 408.

[0096] At block 408, the method 400 includes positioning the first cooling component of the cooling module over the second cooling component to align the plurality of holes (retention holes) of the first cooling component with the plurality of retention tabs of the second cooling component. The method continues to block 410. At block 410, the method 400 includes mounting the first cooling component on the frame. In some examples, the mounting includes positioning the second cooling component within the recessed portion of the first cooling component. Further, the mounting includes projecting each of the plurality of retention tabs along a respective hole of the plurality of retention holes. Additionally, the mounting includes movably connecting each of a pair of first fluid connectors in the first cooling component to a respective connector of a pair of second fluid connectors in the second cooling component to establish a fluid flow path between the first cooling component and the second cooling component. In some examples, the method 400 includes performing additional sub-steps after mounting the second cooling component on the frame. In some examples, a first sub-step can include tilting the first cooling component relative to the second cooling component to align with a surface of the second cooling component to accommodate a flatness variation between the first electronic chip set and the second electronic chip set. Further, a second sub-step can include moving the first cooling component upward (and / or downward) relative to the second cooling component to accommodate a height variation between the first electronic chip set and the second electronic chip set. In some examples, mounting the second cooling component on the frame can cause both a tilting movement and an up-and-down movement of the second cooling component relative to the first cooling component to accommodate the flatness and height variations between the first electronic chip set and the second electronic chip set, respectively. In some examples, the cooling module further includes an O-ring seal connected to one of the pair of first fluid connectors or the pair of second fluid connectors. In such examples, the O-ring seal slides along a wall of the other of the pair of first fluid connectors or the pair of second fluid connectors by the up-and-down movement of the second cooling component relative to the first cooling component, is eccentrically pressed against the wall by the tilting movement of the second cooling component relative to the first cooling component, or a combination thereof. The method 400 continues to block 412.

[0097] At block 412, the method 400 includes connecting the first cooling component to the frame to establish a first thermal interface between the first cooling component and the first electronic chip set. In some examples, the first cooling component is connected to the cover portion of the frame using a plurality of first spring-loaded fasteners. The method 400 can additionally include the step of coupling the first cooling component and the second cooling component to one another by inserting each of a plurality of tether fasteners into a respective tether fastener hole of a plurality of tether fastener holes in the first cooling component so as to join each tether fastener to a respective retention tab of a plurality of retention tabs of the second cooling component. The method 400 ends at block 414.

[0098] FIG. 5A The circuit assembly 100 is shown alongFIG. 1B a cross-sectional top view taken along line 2-2' in FIG. 2. In particular, FIG. 5A a cross-sectional top view of the first cooling component 136 in the cooling module 106 is shown. FIG. 5B a cross-sectional top view of the cooling module 106 of FIG. 1 having the first cooling component 136 and the second cooling component 138 is shown. In particular, FIGS. 1A-1B a cross-sectional top view of the first cooling component 136 and the second cooling component 138 in the cooling module 106 of FIG. 1 is shown. In particular, FIG. 5B a cross-sectional top view of the first cooling portion 160 and the third cooling portion 162 of the first cooling component 136 and the second cooling portion 142 of the second cooling component 138 can be shown. In the following description, for ease of illustration, the first cooling component 136 and the second cooling component 138 are described simultaneously. FIGS. 5A-5B

[0099] As discussed above, the circuit assembly 100 includes the frame 102, the electronic circuit module 104, and the cooling module 106. In such examples, the cooling module 106 includes the first cooling component 136 (as shown in FIG. 5B ) and the second cooling component 138. In some examples, the first cooling component 136 has a fluid inlet 166, a fluid outlet 168, a pair of first fluid connectors 164, a first fluid passage 192, and a second fluid passage 196. The second cooling component 138 has a pair of second fluid connectors 148 and an intermediate fluid passage 194.

[0100] In some examples, the second cooling component 138 is positioned within the recessed portion 154 of the first cooling component 136 (as shown in FIGS. 2D-2E ​As shown), the first cooling component 136 and the second cooling component 138 are fluidly coupled to each other. In such an example, each connector in a pair of first fluid connectors 164 is movably connected to a corresponding connector in a pair of second fluid connectors 148 to establish a fluid flow path 190 between the first cooling component 136 and the second cooling component 138. For example, a first connector 164A in a pair of first fluid connectors 164 is movably connected to another first connector 148A in a pair of second fluid connectors 148 to establish an inlet fluid flow path 190A between the first cooling component 136 and the second cooling component 138. Similarly, a second connector 164B in a pair of first fluid connectors 164 is movably connected to another second connector 148B in a pair of second fluid connectors 148 to establish an outlet fluid flow path 190B between the first cooling component 136 and the second cooling component 138. Thus, the pair of first fluid connectors 164 and the pair of second fluid connectors 148 enable the first cooling component 136 to be fluidly connected to the second cooling component 138. In some examples, each connector in a pair of first fluid connectors 164 is either a fluid piston or a fluid orifice. Furthermore, each connector in a pair of second fluid connectors 148 is either a fluid piston or a fluid orifice. For example, in... FIGS. 1C-1D and FIGS. 5A-5B In the example, each connector in a pair of first fluid connectors 164 is a fluid port 164A1 (see FIGS. 1C-1D ), and each of the pair of second fluid connectors 148 is a fluid piston 148A1 (see FIGS. 1C-1D The cooling module 106 also includes an O-ring seal 182 (such as...). FIGS. 1C-1D As shown). In such an example, the O-ring seal 182 is disposed in the outer peripheral groove 180 of the fluid piston 148A1 (as shown). FIGS. 1C-1D (As shown). After the fluid piston 148A1 is movably connected to the fluid orifice 164A1, the O-ring seal 182 is pressed against the wall 186 of the fluid orifice 164A1 to prevent fluid leakage from the inlet fluid flow path 190A and the outlet fluid flow path 190B. Furthermore, as discussed above, the O-ring seal 182 can slide along the wall 186 of the fluid orifice 164A1 (or the wall 186 can slide along the O-ring seal 182) by the up-and-down movement of the second cooling member 138 relative to the first cooling member 136 to accommodate height variations between the first and second electronic chipsets 124 and 126. Similarly, the O-ring seal 182 is eccentrically pressed against the wall 186 of the fluid orifice 164A1 by the tilting movement of the first cooling member 136 relative to the second cooling member 138 to accommodate flatness variations between the first and second electronic chipsets 124 and 126.

[0101] In some examples, each of the first fluid passage 192 and the second fluid passage 196 is formed within the first cooling component 136. Specifically, the first fluid passage 192 is formed within the first cooling portion 160 and the third cooling portion 162 of the first cooling component 136, respectively (as FIG. 2D indicated). The second fluid passage 196 is formed within the third cooling portion 162. Similarly, the intermediate fluid passage 194 is formed within the second cooling component 138. Specifically, the intermediate fluid passage 194 is formed within the second cooling portion 142 of the second cooling component 138 (as FIG. 5A indicated). In some examples, the first fluid passage 192 extends between the fluid inlet 166 and a first connector 164A of the pair of first fluid connectors 164. The second fluid passage 196 extends between a second connector 164B of the pair of first fluid connectors 164 and the fluid outlet 168. Further, the intermediate fluid passage 194 extends between a first connector 148A and a second connector 148B of the pair of second fluid connectors 148.

[0102] In one or more examples, the first fluid passage 192 includes a supply segment 192A, a body segment 192B, and a return segment 192C. In some examples, the body segment 192B has a tortuous or circuitous flow path. For example, the body segment 192B bifurcates into a first body segment 192B1 and a second body segment 192B2. Further, the first body segment 192B1 and the second body segment 192B2 merge into a third body segment 192B3. In some examples, the first body segment 192B1 and the second body segment 192B2 are parallel segments. In some examples, the intermediate fluid passage 194 has a single-pass flow path. In some examples, the body segment 192B and the intermediate fluid passage 194 include microchannels. In some examples, each microchannel can have a width of about 0.15 millimeters.

[0103] Referring to FIG. 5B , the fluid inlet 166 and the fluid outlet 168 are spaced apart from each other and formed in the first peripheral wall 162A of the third cooling portion 162 (see FIG. 5BFurther, the first fluid passage 192 is formed in the third cooling portion 162 and the first cooling portion 160. For example, a supply segment 192A is formed in the third cooling portion 162, a body segment 192B is formed in the first cooling portion 160, and a return segment 192C is formed in the first cooling portion 160 and the third cooling portion 162. In such an example, a pair of connector body passages 192D connect the first body segment 192B1 and the second body segment 192B2 to the supply segment 192A, respectively. In some examples, each of the pair of connector body passages 192D is a radial passage that extends between the third cooling portion 162 and the first cooling portion 160, respectively. Further, the return segment 192C is an inclined segment that extends between the first cooling portion 160 and the third cooling portion 162, respectively. Further, an intermediate fluid passage 194 is formed in the second cooling portion 142. Similarly, a second fluid passage 196 is formed in the third cooling portion 162.

[0104] Referring to FIG. 2B The first body segment 192B1 and the second body segment 192B2 extend over a plurality of first electronic chips 124A in the first electronic chip set 124. The third body segment 192B3 extends over a second electronic chip 124B in the first electronic chip set 124. The intermediate fluid passage 194 extends over a third electronic chip 126A in the second electronic chip set 126 disposed on the circuit board 128.

[0105] During operation of the circuit assembly 100, the first electronic chip set 124 and the second electronic chip set 126 can generate waste heat. As will be appreciated, such waste heat generated by the first electronic chip set 124 and the second electronic chip set 126 is undesirable and can impact operation of the electronic circuit module 104 if not effectively managed. Accordingly, in some examples, the proposed cooling module 106 can establish sufficient thermal interface between the cooling components and the electronic chips to enable efficient waste heat transfer from the electronic chips regardless of variations in at least one of height and flatness between the first electronic chip set 124 and the second electronic chip set 126. Further, in some examples, the proposed cooling module 106 can include fluid passages having tortuous flow routes in order to increase a) fluid velocity within the fluid passages, and b) a heat transfer coefficient between the cooling components and the fluid. Accordingly, the proposed cooling module 106 can receive fluid at a reduced volumetric flow rate, thereby allowing the CDU to accommodate the cold fluid (secondary fluid) requirements of multiple compute nodes (or multiple circuit assemblies 100) in each server system of a data center environment. In some examples, the volumetric flow rate can be about 0.12 gallons per minute.

[0106] Referring to FIG. 2B, the first cooling component 136 receives the cold fluid 198A via the fluid inlet 166. For example, the first fluid passage 192 of the first cooling component 136 receives the cold fluid 198A, e.g., from a CDU. In such an example, the supply segment 192A of the first fluid passage 192 directs the cold fluid 198A to the body segment 192B. In the body segment 192B, the cold fluid 198A absorbs waste heat from the first electronic die 124 and produces a partially hot fluid 198B. For example, the cold fluid 198A bifurcates into a first portion 198A1 and a second portion 198A2 in the body segment 192B. The first portion 198A1 is directed to the first body segment 192B1 to absorb waste heat from a plurality of first electronic dies 124A arranged in a first row 127A (as shown, for example) and produce a first portion 198B1 of the partially hot fluid. Similarly, the second portion 198A2 is directed to the second body segment 192B2 to absorb waste heat from a plurality of first electronic dies 124A arranged in a second row 127B (as shown, for example) and produce a second portion 198B2 of the partially hot fluid. The first and second portions 198B1, 198B2 of the partially hot fluid are then mixed together to form a mixed portion 198B3 of the partially hot fluid in the third body segment 192B3. The mixed portion 198B3 of the partially hot fluid is directed in the third body segment 192B3 to absorb waste heat from the second electronic die 124B and produce the partially hot fluid 198B. Further, the third body segment 192B3 directs the partially hot fluid 198B to the return segment 192C. In such an example, the return segment 192C discharges the partially hot fluid 198B into the intermediate fluid passage 194 of the second cooling component 138 via the inlet fluid flow path 190A. In some examples, the intermediate fluid passage 194 directs the partially hot fluid 198B from one end 184 (as shown, for example) to the other end (not labeled) to absorb waste heat from a third electronic die 126A in the second electronic die group 126 and produce the hot fluid 198C. Further, the intermediate fluid passage 194 discharges the hot fluid 198C from the other end to the second fluid passage 196 of the first cooling component 136 via the outlet fluid flow path 190B. In some examples, the second fluid passage 196 also directs the hot fluid 198C to the fluid outlet 168 for return of the hot fluid 198C from the first cooling component 136. FIG. 1C FIG. 6 FIGS. 1A-1D

[0107] ​​​As discussed herein, the first fluid passage 192 of the first cooling component 136 having a tortuous flow route can significantly increase the velocity of the fluid (e.g., the cold fluid 198A and the partially hot fluid 198B) within the first cooling component 136 to dissipate the waste heat from the first electronic chipsets 124 efficiently. Thus, the first fluid passage 192 can reduce the volumetric flow rate of the fluid (e.g., the cold fluid 198A) to be circulated in the cooling module 106 to cool the first electronic chipsets 124. For example, the body segment 192B of the first fluid passage 192 having bifurcated fluid segments (i.e., the first body segment 192B1 and the second body segment 192B2) can enable the cold fluid 198A to be directed in parallel at a relatively high velocity in order to uniformly cool the plurality of first electronic chips 124A (memory chips). In one or more examples, the bifurcation of the body segment 192B into the first body segment 192B1 and the second body segment 192B2 can reduce the flow area of the fluid flow, thereby increasing i) the velocity of the cold fluid 198A in the bifurcated body segments 192B1, 192B2, and ii) the heat transfer coefficient between the cold fluid 198A and the plurality of first electronic chips 124A. Furthermore, the merged body segment (i.e., the third body segment 192B3) can enable the mixed portion of the partially hot fluid 198B1, 198B2 to be directed at a relatively high velocity in order to efficiently cool the high-power second electronic chip 124B (or GPU chip). In one or more examples, the merging of the first body segment 192B1 and the second body segment 192B2 into the merged body segment 192B3 can mix the first partially hot fluid portion 198B1 and the second partially hot fluid portion 198B2 into the mixed portion of the partially hot fluid 198B3, thereby increasing i) the velocity of the mixed portion of the partially hot fluid 198B1, 198B2, and ii) the heat transfer coefficient between the mixed portion of the partially hot fluid 198B1, 198B2 and the second electronic chip 124B. Furthermore, as discussed herein, the intermediate fluid passage 194 of the first cooling component 136 having a single-pass flow route can enable the partially hot fluid 198B to be directed at a relatively low velocity in order to efficiently cool the low-power third electronic chip 126A (or CPU chip). In one or more examples, the third electronic chip 126A is a low-power electronic chipset and thus generates a relatively low amount of waste heat as compared to the waste heat generated by the high-power electronic chipsets (such as the plurality of first electronic chips 124A and the second electronic chip 124B). Additionally, the enclosure temperature of the third electronic chip 126A is higher than the enclosure temperature of the plurality of first electronic chips 124A and the second electronic chip 124B. It can be noted herein that the term “enclosure temperature” can refer to the maximum temperature that an electronic chip can reach when operating to perform an assigned task or workload.Accordingly, the second cooling component 138 can not be required to have a tortuous flow route to dissipate waste heat from the third electronic chip 126A having a low enclosure temperature and a low power consumption.

[0108] In one or more examples, the flow of fluid (e.g., the cold fluid 198A and the partially hot fluid 198B) in the tortuous flow route of the first fluid passage 192 can result in a relatively high pressure drop of the fluid in the first cooling component 136. Similarly, the flow of fluid (e.g., the partially hot fluid 198B) in the single pass flow route of the intermediate fluid passage 194 can also result in a pressure drop of the fluid in the second cooling component 138. Accordingly, the cooling module 106 having a relatively high fluid pressure drop can be advantageous for the CDU in order to maintain a balanced flow of fluid across the plurality of circuit assemblies 100 (or computing nodes) in each electronic system (or each server system) of the data center environment. In some examples, the first fluid passage 192 having the tortuous flow route can enable the cooling module 106 to have a volumetric flow rate of about 0.12 gallons per minute. Accordingly, the CDU in the data center environment can be enabled to accommodate the demand of the plurality of server systems of the data center environment for the cold fluid 198A. In some examples, the CDU can be configured to supply the cold fluid 198A to a plurality of racks (e.g., at least four racks), where each rack can have about thirty-two server systems, and each server system can have about eight circuit assemblies, and each circuit assembly can have at least one cooling module.

[0109] In some examples, the first plurality of electronic chips 124A can have a first case temperature (e.g., a low case temperature), and the second electronic chip 124B can have a second case temperature (e.g., a high case temperature), where the second case temperature is greater than the first case temperature. In some examples, since the cold fluid 198A is first directed to the bifurcated body segment 192B1, 192B2 in thermal contact with the first plurality of electronic chips 124A having a low case temperature, the cold fluid 198A can have sufficient thermal margin to efficiently dissipate waste heat from the first plurality of electronic chips 124A. As used herein, the term “thermal margin” can refer to a temperature difference between a case temperature of an electronic chip and a temperature of a fluid. Further, since the mixed portion of the partially hot fluid 198B1, 198B2 is directed to the merged body segment 192B2 in thermal contact with the second electronic chip 124B having a high case temperature, the mixed portion of the partially hot fluid 198B1, 198B2 can still have sufficient thermal margin to efficiently dissipate waste heat from the second electronic chip 124B. In some examples, the third electronic chip 126A can have a third case temperature (e.g., a highest case temperature), the third case temperature being greater than the first case temperature and the second case temperature of the first plurality of electronic chips 124A and the second electronic chip 124B, respectively. In such examples, since the partially hot fluid 198B is directed to the intermediate fluid channel 194 in thermal contact with the third electronic chip 126A having the highest case temperature, the partially hot fluid 198B can still have sufficient thermal margin to efficiently dissipate waste heat from the third electronic chip 126A.

[0110] FIGS. 5A-5B is a flowchart illustrating a method 600 of dissipating waste heat from an electronic circuit module of a circuit assembly. It should be noted in this document that the method 600 is described in connection with, for example FIG. 7 and ​ described. The method 600 starts from block 602 and continues to block 604. At block 604, the method 600 includes receiving, by a first cooling component of a cooling module, a cold fluid via a fluid inlet in the first cooling component. In some examples, the first cooling component is connected to a frame of an electronic circuit assembly to establish a first thermal interface with a first set of electronic chips of an electronic circuit module coupled to the frame.

[0111] In some examples, the first cooling component is connected to the frame using a plurality of first spring-loaded fasteners. The method 600 continues to block 606.

[0112] At block 606, the method 600 includes directing a cold fluid in a first fluid passageway of the second cooling component to absorb waste heat from the first electronic die package and generate a partially hot fluid. In one or more examples, the first fluid passageway includes a supply segment, a main segment, and a return segment. The main segment bifurcates into a first main segment and a second main segment. Further, the first main segment and the second main segment merge into a third main segment. In some examples, the first main segment and the second main segment are parallel segments. In some examples, directing the cold fluid in the first fluid passageway includes a plurality of sub-steps. In some examples, a first sub-step includes directing a first portion of the cold fluid in the first main segment to generate a first portion of the partially hot fluid. In some examples, the first portion of the cold fluid absorbs waste heat from a plurality of first electronic dies arranged along a first row in the first electronic die package and generates the first portion of the partially hot fluid. A second sub-step includes directing a second portion of the cold fluid in the second main segment to generate a second portion of the partially hot fluid. In some examples, the first portion of the cold fluid absorbs waste heat from a plurality of first electronic dies arranged along a second row in the first electronic die package and generates the second portion of the partially hot fluid. In one or more examples, the first portion and the second portion of the cold fluid are directed parallel to each other. In some examples, each electronic die of the plurality of first electronic dies can include a memory die. A third sub-step includes directing a mixed portion of the partially hot fluid in the third main segment to absorb waste heat from a second electronic die in the first electronic die package and generate the partially hot fluid, where the mixed portion of the partially hot fluid is a mixture of the first portion and the second portion of the partially hot fluid. In some examples, the second electronic die can include a graphics processing unit (GPU) die. The method continues to block 608.

[0113] As discussed above, in some examples, the plurality of first electronic chips have a first case temperature "Tl" and the second electronic chip has a second case temperature "T2". It can be noted herein that the term "case temperature" can refer to the maximum temperature that an electronic chip can reach when operating to perform an assigned task or workload. In some examples, the second case temperature "T2" is greater than the first case temperature "Tl". Since the first case temperature "Tl" is less than the second case temperature "T2", the first fluidic channel 192 is designed such that the cold fluid is first directed into the first body segment and the second body segment of the body segment to absorb waste heat from the plurality of first electronic chips and then the partially hot fluid is directed in the third body segment of the body segment to absorb waste heat from the second electronic chip. In some examples, the body segment first forks into two channels, e.g., the first body segment and the second body segment, in order to i) direct the cold fluid to the plurality of first electronic chips arranged along two parallel rows simultaneously, and ii) increase the speed of the cold fluid to improve the cooling efficiency of the plurality of first electronic chips (i.e., memory chips). In some examples, the speed of the cold fluid can increase due to the reduction in flow area caused by the forking of the first fluidic channel. Subsequently, the first body segment and the second body segment are joined or merged together to form the third body segment in order to increase the speed of the partially hot fluid to further improve the cooling efficiency of the second electronic chip (i.e., high power GPU chip).

[0114] At block 608, the method 600 includes discharging the partially hot fluid from the first fluid channel into an intermediate fluid channel of the second cooling component of the cooling module via the inlet fluid flow path established between the first cooling component and the second cooling component. In some examples, the second cooling component is positioned within the recessed portion of the first cooling component and connected to the frame to establish a second thermal interface with a second electronic chip set of the electronic circuit module. The method continues to block 610. At block 610, the method 600 includes directing the partially hot fluid in the intermediate fluid channel to absorb waste heat from the second electronic chip set and generate a hot fluid. The second electronic chip set can include a third electronic chip, such as a central processing unit (CPU) chip. In some examples, the third electronic chip has a third casing temperature "T3". In some examples, the third casing temperature "T3" is greater than the second casing temperature "T2" and the third casing temperature "T3". As the third casing temperature "T3" is greater than the second casing temperature "T2" and the third casing temperature "T3", the first fluid channel is designed such that the partially hot fluid is directed from the first fluid channel into the intermediate fluid channel in order to effectively absorb waste heat from the third electronic chip and generate the hot fluid. In one or more examples, the intermediate fluid channel has a single pass flow route as the partially hot fluid only needs to dissipate waste heat from the third electronic chip. The method continues to block 612. At block 612, the method 600 includes discharging the hot fluid from the intermediate fluid channel into a second fluid channel of the first cooling component via the outlet fluid flow path established between the first cooling component and the second cooling component. The method 600 continues to block 614. At block 614, the method 600 includes directing the hot fluid in the second fluid channel to a fluid outlet to return the hot fluid from the first cooling component. The method 600 ends at block 616.

[0115] ​ is a cross-sectional view of a first connector 764A of a pair of first fluid connectors 764 according to another example implementation of the disclosure, the first connector being movably connected to another first connector 748A of a pair of second fluid connectors 748. In some examples, the first connector 764A is a fluid piston 764A1. In such examples, the fluid piston 764A1 has a first diameter "D1" and an outer peripheral groove 780 formed on a portion of the fluid piston 764A1 has a second diameter "D2". In some examples, the first diameter "D1" is greater than the second diameter "D2". In some examples, the cooling module further includes an O-ring seal 782 disposed in the outer peripheral groove 780 of the fluid piston 764A1. In some examples, the another first connector 748A is a fluid bore 748A1. In such examples, the fluid bore 748A1 has a wall 786 (or a circumferential wall) having the second diameter "D3". In some examples, the third diameter "D3" is greater than the first diameter "D1".

[0116] In one or more examples, a first connector 764A of the pair of first fluid connectors 764A is movably connected to another first connector 748A of the pair of second fluid connectors 748 to establish a fluid flow path 790 between the second cooling component and the first cooling component of the cooling module, respectively. In other words, the fluid piston 764A1 is movably connected to the fluid aperture 748A1 to establish the fluid flow path 790, e.g., the inlet fluid flow path 790A, therebetween. For example, the fluid piston 764A1 is inserted inside the wall 786 of the fluid aperture 748A1 such that the O-ring seal 782 is pressed against the wall 786 of the fluid aperture 748A1. In some examples, after movably connecting the fluid piston 764A1 to the fluid aperture 748A1, the O-ring seal 782 is pressed against the wall 786 of the fluid aperture 748A1 to prevent fluid leakage from the fluid flow path 790.

[0117] According to the present embodiment, the proposed cooling module can establish sufficient thermal interface between the cooling components and the electronic chips to achieve efficient heat transfer from the electronic chips regardless of the variation in height and flatness between the electronic chips. Moreover, since each connector of the pair of first fluid connectors or each connector of the pair of second fluid connectors has an O-ring seal, it can allow the first cooling component to move independently with respect to the second cooling component. In other words, the O-ring seal can allow the first cooling component to move in 3-dimensions with respect to the second cooling component to accommodate the variation in at least one of the height or flatness between the first electronic chip and the second electronic chip. Due to the floatable (movable) design of the first cooling component disposed on the second cooling component, the cooling module can be interpreted as a monolithic cooling module that can minimize cracking of the electronic chips upon installation and / or during shipping / handling as well as in the field. Moreover, the floatability of the first cooling component can help accommodate the variation in height and coplanarity (flatness) tolerance between two adjacent electronic chips, thereby minimizing the raised areas or depressions. Additionally, since the cooling components are connected to the frame using spring-loaded fasteners, the cooling module can provide improved factory installation as well as improved field and factory service experience. The use of the tethered fasteners (or set screws) to lock the float of the second cooling component in place after positioning the second cooling component on the respective electronic chip can ensure that the electronic chips are not damaged by fluid pressure during assembly, shipping, service, etc.

[0118] Further, as discussed herein, the design of the first fluid passageways in the first cooling component can significantly increase the velocity of the fluid, thereby increasing the cooling efficiency of the high power electronic chipsets and reducing the volumetric flow rate of the fluid being directed within the cooling module. In other words, the first fluid passageways having a circuitous or tortuous flow route can enable the fluid to be directed within the first cooling component at a low volumetric flow rate at a high velocity, thereby facilitating efficient dissipation of waste heat from the first electronic chipsets. Additionally, the design of the intermediate flow passageways in the second cooling component can reduce the velocity of the fluid, thereby increasing the cooling efficiency of the low power electronic chipsets and reducing the volumetric flow rate of the fluid being directed within the cooling module, thereby facilitating efficient dissipation of waste heat from the second electronic chipsets. Thus, the fluid passageways in the first cooling component and the second cooling component can enable the cooling module to have a volumetric flow rate of about 0.12 gallons per minute. Accordingly, the thermal management unit of a data center environment having a coolant distribution unit (CDU) for distributing coolant fluid can be configured to supply cold fluid to at least four racks, each rack having about thirty-two server systems, and each server system having about eight circuit assemblies, and each circuit assembly having at least one cooling module. Additionally, the various features illustrated in the examples described herein can be implemented as a tool-free method of quickly and easily assembling the cooling module to / from the electronic circuit module by a technician or customer, thus, reducing the downtime of the server system and the work associated with such events of assembling the cooling module to / from the electronic circuit module of the server system.

[0119] In the foregoing description, numerous specific details are set forth to provide an understanding of the subject matter disclosed herein. Implementations, however, can be practiced without some or all of these specific details. Other implementations can include modifications, equivalents, and / or improvements to the details disclosed herein. The attached claims are intended to cover such modifications and improvements.

Claims

1. A cooling module for an electronic circuit module, comprising: A first cooling component, comprising a first fluid channel, a second fluid channel, and a pair of first fluid connectors, wherein the first fluid channel includes a supply section, a return section, and a main body section; and The second cooling component includes an intermediate fluid channel and a pair of second fluid connectors. The second cooling component is positioned within a recessed portion of the first cooling component and is fluidly connected to the first cooling component. The main body segment branches into a first main body segment and a second main body segment. The first and second main body segments further merge into a third main body segment. The supply segment is connected to the first and second main body segments. The return segment is connected to the third main body segment and connected to the intermediate fluid channel via an inlet fluid flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid flow path established between the first and second cooling components. A first connector in a pair of first fluid connectors is movably connected to another first connector in a pair of second fluid connectors to establish the inlet fluid flow path between the first and second cooling components. A second connector in a pair of first fluid connectors is movably connected to another second connector in a pair of second fluid connectors to establish the outlet fluid flow path between the first and second cooling components.

2. The cooling module according to claim 1, wherein, The main body segment includes microchannels formed within the first cooling component, and wherein the intermediate fluid channel includes microchannels formed within the second cooling component.

3. The cooling module according to claim 1, wherein, The first cooling component further includes a fluid inlet and a fluid outlet, wherein the first fluid passage extends between the fluid inlet and a first connector of the pair of first fluid connectors, and wherein the second fluid passage extends between a second connector of the pair of first fluid connectors and the fluid outlet.

4. The cooling module according to claim 3, wherein, The intermediate fluid channel extends between the first and second connectors of the pair of second fluid connectors.

5. The cooling module according to claim 1, wherein, Each of the pair of first fluid connectors is either a fluid piston or a fluid orifice, and each of the pair of second fluid connectors is either the fluid piston or the fluid orifice.

6. The cooling module according to claim 5 further includes an O-ring seal, wherein, The O-ring seal is disposed in the outer peripheral groove of the fluid piston, and wherein, after the fluid piston is movably connected to the fluid orifice, the O-ring seal presses against the wall of the fluid orifice to prevent fluid leakage from the inlet fluid flow path and the outlet fluid flow path.

7. The cooling module according to claim 6, wherein, The O-ring seal slides along the wall of the fluid orifice by the up-and-down movement of the second cooling component relative to the first cooling component, and is eccentrically pressed against the wall of the fluid orifice by the tilting movement of the second cooling component relative to the first cooling component, or a combination thereof.

8. A method for cooling an electronic circuit module of an electronic circuit assembly, the method comprising: The first cooling component of the cooling module receives cold fluid, wherein the first cooling component is connected to the frame of the electronic circuit assembly to establish a first thermal interface with a first chipset of the electronic circuit module coupled to the frame; The cold fluid is guided in the first fluid channel of the first cooling component, which has a tortuous flow path, to absorb waste heat from the first chipset and generate partially heated fluid. A portion of the hot fluid is discharged from the first fluid channel into the intermediate fluid channel of the second cooling component of the cooling module via an inlet fluid flow path established between the first cooling component and the second cooling component, wherein the second cooling component is positioned within a recessed portion of the first cooling component and is fluidly connected to the first cooling component, and wherein the second cooling component is connected to the frame to establish a second thermal interface with the second chipset of the electronic circuit module. The partially heated fluid is guided in the intermediate fluid channel to absorb waste heat from the second chipset and generate a hot fluid. The hot fluid is discharged from the intermediate fluid channel into the second fluid channel of the first cooling component via an outlet fluid flow path established between the first cooling component and the second cooling component; and The hot fluid in the second fluid channel is guided back from the first cooling component.

9. The method according to claim 8, wherein, The first chipset and the second chipset are disposed on the circuit board of the electronic circuit module, wherein the first chipset includes a second electronic chip and a plurality of first electronic chips, and wherein the plurality of first electronic chips are arranged along a first row and a second row located around the second electronic chip.

10. The method according to claim 9, wherein, The first fluid channel includes a supply section, a return section, and a main body section, wherein the main body section branches into a first main body section and a second main body section, wherein the first main body section and the second main body section are further merged into a third main body section, wherein the supply section is connected to the first main body section and the second main body section, and wherein the return section is connected to the third main body section.

11. The method according to claim 10, wherein, The first main body segment extends above a plurality of first electronic chips arranged along the first row, wherein the second main body segment extends above a plurality of first electronic chips arranged along the second row, and wherein the third main body segment extends above the second electronic chips.

12. The method according to claim 11, wherein, Guiding the cold fluid in the first fluid channel includes: A first portion of the cold fluid is guided in the first main body section to generate a first portion of the partially heated fluid; A second portion of the cold fluid is guided in the second main body section to generate a second portion of the partially heated fluid, wherein the first and second portions of the cold fluid are guided parallel to each other; and The mixing portion of the partially heated fluid is guided in the third main body section to generate the partially heated fluid, wherein the mixing portion of the partially heated fluid is a mixture of the first and second portions of the partially heated fluid.

13. The method according to claim 10, wherein, The intermediate fluid channel extends above the second chipset.

14. The method of claim 10, wherein, The first cooling component includes a pair of first fluid connectors, and the second cooling component includes a pair of second fluid connectors. The first connector of the pair of first fluid connectors is movably connected to the other first connector of the pair of second fluid connectors to establish the inlet fluid flow path between the first cooling component and the second cooling component. The second connector of the pair of first fluid connectors is movably connected to the other second connector of the pair of second fluid connectors to establish the outlet fluid flow path between the first cooling component and the second cooling component.

15. The method according to claim 14, wherein, Each of the pair of first fluid connectors is one of a fluid piston or a fluid orifice, wherein each of the pair of second fluid connectors is the other of the fluid piston or the fluid orifice, wherein an O-ring seal is disposed in a peripheral groove of the fluid piston, wherein, after the fluid piston is movably connected to the fluid orifice, the O-ring seal is pressed against the wall of the fluid orifice to prevent i) leakage of the partially hot fluid from the inlet fluid flow path and ii) leakage of the hot fluid from the outlet fluid flow path.

16. The method of claim 14, wherein, The main body segment includes microchannels formed within the first cooling component, wherein the first fluid channel extends between a fluid inlet of the first cooling component and a first connector of the pair of first fluid connectors, and wherein the second fluid channel extends between a second connector of the pair of first fluid connectors and a fluid outlet of the first cooling component.

17. The method of claim 14, wherein, The intermediate fluid channel includes microchannels formed within the second cooling component, and wherein the intermediate fluid channel extends between the first connector and the second connector of the pair of second fluid connectors.

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