Pre-laminated inlay for smart card, method of forming a pre-laminated inlay for smart card, and smart card

Abstract

The present disclosure provides, in various schemes, a pre-laminated inlay for a smart card, a method for forming a pre-laminated inlay for a smart card, and a smart card having a card body with such a pre-laminated inlay. According to some embodiments herein, the pre-laminated inlay for a smart card includes a pre-laminated inlay substrate and a chip, the pre-laminated inlay substrate having an IC landing area arranged on a first main surface of the pre-laminated inlay substrate, the IC landing area having at least one contact pad and at least one dummy island, wherein the at least one contact pad is electrically connected to at least one wire wired in or on the pre-laminated inlay substrate, and the chip having at least one contact element configured on a second main surface of the chip, wherein the at least one contact element is electrically connected to the at least one contact pad. The chip is flip-chip bonded to the pre-laminated inlay substrate so that the first main surface and the second main surface face each other and the chip at least partially covers the at least one contact pad. In this article, the at least one dummy island and the at least one contact pad respectively represent supports for the chip on the pre-laminated inlay substrate.

Description

Technical Field

[0001] The present invention relates to a prelaminated inlay for a smart card, a method of forming a prelaminated inlay for a smart card and a smart card having a card body with such a prelaminated inlay. Background Art

[0002] Smart cards are typically components of complex systems, interacting with other entities in the complex system via one or more interfaces, depending on the card's intended application. A defining characteristic of smart cards is the integrated circuit embedded within them that transmits, stores, and processes data. For example, conventional smart cards may be equipped with memory, a processor, and / or an antenna. Furthermore, smart cards may be contact, contactless, or hybrid.

[0003] Since a smart card is often the only component a user has in their possession, the ongoing task is to develop multifunctional cards that combine the functionality associated with various types of applications into a single smart card. Several standards have been developed for smart cards of contact, contactless, or hybrid types. These standards clearly define stringent requirements for the structure and performance of smart cards and their components. In particular, the relevant ISO / IEC standards are particularly important for smart cards because they are based on broad international consensus and define the fundamental properties of smart cards, making them compatible with a large number of card terminals worldwide. Therefore, strict adherence to the relevant ISO / IEC standards is essential in any smart card manufacturing process to ensure that the manufactured smart cards comply with the relevant ISO / IEC standards. Therefore, it is assumed that those skilled in the art are aware of the relevant ISO / IEC standards and take them into account when developing smart cards.

[0004] Smart cards are the youngest members of the family of identification cards that use the ID-1 specification defined in ISO / IEC standard 7810, "Identification cards — Physical characteristics." This standard specifies the physical characteristics of identification cards, including their material properties, such as flexibility and temperature resistance, as well as the dimensions of three different card sizes: ID-1, ID-2, and ID-3. The smart card standards in the ISO 7816-I series are based on the ID-1 card specification and are commonly used for payment cards used by millions of people. Other specifications have also been established for some applications, particularly those that do not require a magnetic stripe card (such as the so-called ID-000 specification SIM card).

[0005] Current smart cards typically have dimensions similar to a credit card. The typical size of a smart card is given by ID-1 of the ISO / IEC 7810 standard, which defines a card nominally measuring 85.60 mm × 53.98 mm (3.37 inches × 2.13 inches). Another common size is ID-000, which is nominally 25 mm × 15 mm (0.98 inches × 0.59 inches) and is commonly used in SIM cards. In each case, the thickness is approximately 0.76 mm (0.030 inches). Accordingly, the size of smart cards is considered standardized, and therefore does not change even as the number of features to be integrated into the smart card increases. Therefore, as the number of contacts and interconnects increases, the size of the interconnects must be adjusted proportionally to accommodate the increasing number of contacts and interconnects in the card body. Providing high-quality electrical interconnects between the integrated features and integrated circuitry in the card body and ensuring reliable interconnections over the long term use of the smart card becomes a challenge.

[0006] As used herein, the term "pre-laminated inlay" should be understood to refer to a pre-laminated body comprising multiple layers of insulating material, such as PVC, pre-laminated together. This pre-laminated body represents an intermediate product obtained during the manufacture of the smart card. For example, an illustrative pre-laminated inlay can be obtained by fusing different layers of thermoplastic material together into a single, homogeneous sheet body, thereby embedding a substrate having at least one contact and / or interconnect within the pre-laminated inlay. For example, a "pre-laminated inlay" can be considered a monolithic structure obtained during the manufacture of the smart card, which may have wiring structures formed within its physical body. It should be noted that the overall integration of the electronic module is only completed at a later stage during the manufacture of the smart card.

[0007] Regarding the expression "body of a smart card," this expression, as used throughout this specification, refers to the physical body of a smart card. For example, depending on the stage during the manufacture of the smart card, the body of a smart card at a given stage during manufacture may represent the physical body of the smart card at that stage during manufacture, including only the physical elements that physically constitute the smart card at that stage during manufacture. In another embodiment, the body of a finished smart card may be understood to include the pre-laminated inlay and at least one feature module integrated therein.

[0008] The term "card body" refers to a pre-laminated inlay having a top layer and / or bottom layer and one or more optional compensation layers attached thereto. In particular, the card body may represent the body of a smart card during the manufacturing of the smart card, after the preparation of the pre-laminated inlay and before the complete integration of the electronic module into the smart card body. In other words, the card body may represent the body of a smart card during the manufacturing phase, in which the geometric dimensions of the body conform to the geometric dimensions defined in accordance with the ISO standard for smart cards, before the complete integration of the electronic module to be incorporated into the smart card into the card body.

[0009] "Smart card" is considered to represent the final product obtained after completing the overall integration of the electronic modules to be incorporated into the smart card.

[0010] refer to Figure 1 , schematically shows a conventional pre-laminated inlay of a conventional smart card in a cross-sectional view. Figure 1 At the stage during production shown, a pre-laminated inlay 1 comprises a pre-laminated inlay substrate 2 equipped with two IC landing elements 3, 4 arranged in an IC landing area of ​​a main surface 5 of the pre-laminated inlay substrate 2. A chip 6 is mounted to the pre-laminated inlay substrate 2 according to flip-chip technology, such that a main surface 7 of the chip 6, having contact studs 9, 10 arranged therein, faces the main surface 5 of the pre-laminated inlay substrate 2. The space between the chip 6 and the pre-laminated inlay substrate 2 is filled with an adhesive material 8.

[0011] The IC landing elements 3, 4 are provided as large-area contact pads on the main surface 5 of the pre-laminated inlay substrate 2 for reliably contacting the contact pillars 9, 10 of the chip 6 during flip-chip bonding. However, the adhesive material 8 (which is pre-deposited before mounting the chip 6 on the pre-laminated inlay substrate 2) has a given thickness, which leads to bending of the chip 6 because excess adhesive material 8 accumulates between the chip 6 and the contact pads 3, 4 of the pre-laminated inlay substrate 2. The resulting uneven distribution of the adhesive material 8 between the chip 6 and the pre-laminated inlay substrate 2 poses a risk of problems during the curing of the adhesive material 8 in subsequent processing steps. For example, there is a possibility that undesirable stresses are imposed on the chip 6. Even when attempting to squeeze the adhesive material 8 from under the chip 6 onto the pre-laminated inlay substrate 2, it is impossible to obtain a planar chip module and a uniform distribution of the adhesive material 8 between the chip 6 and the pre-laminated inlay substrate 2. When attempting to reduce the thickness of the accumulated adhesive material 8 by depositing less adhesive material 8 in the IC landing area on the pre-laminated inlay substrate 2 , the bonding force between the chip 6 and the pre-laminated inlay substrate 2 is reduced. Summary of the Invention

[0012] In view of the above, an object is to provide a pre-laminated inlay for a smart card having a uniform distribution of adhesive material between the chip of the smart card and the pre-laminated inlay substrate, thereby enabling an improved bond between the chip and the pre-laminated inlay substrate without the risk of subjecting the chip to undesirable mechanical stresses and / or destructive manufacturing processes during flip-chip bonding.

[0013] The above problems are solved and the above objects are achieved in various aspects of the present disclosure, some of which relate to a pre-laminated inlay for a smart card according to independent claim 1, some to a method of forming a pre-laminated inlay for a smart card according to independent claim 11, and some to a smart card according to claim 21. Further advantageous embodiments are defined in dependent claims 2 to 10, 12 to 20 and 22.

[0014] In a first embodiment of the present disclosure, a pre-laminated inlay for a smart card is provided. According to an illustrative embodiment of the present invention, the pre-laminated inlay includes a pre-laminated inlay substrate and a chip, the pre-laminated inlay substrate having an IC landing area arranged on a first main surface of the pre-laminated inlay substrate, the IC landing area having at least one contact pad and at least one dummy island, wherein at least one contact pad is electrically connected to at least one wire wired in or on the pre-laminated inlay substrate, and the chip having at least one contact element configured on a second main surface of the chip, wherein at least one contact element is electrically connected to at least one contact pad. The chip is flip-chip bonded to the pre-laminated inlay substrate so that the first main surface and the second main surface face each other and the chip at least partially covers the at least one contact pad. In this article, the at least one dummy island and the at least one contact pad respectively represent a support for the chip on the pre-laminated inlay substrate. With the help of the at least one dummy island, the adhesive material can be more evenly distributed during flip-chip bonding, thereby avoiding the accumulation of adhesive material under the chip. The dummy island and the contact pad can lead to any excess adhesive material due to the spacing between the island and the contact pad. Furthermore, the bonding force between the chip and the pre-laminated inlay substrate is increased due to the increased surface provided by the spaced dummy islands and contact pads.

[0015] In a second embodiment of the present disclosure, a method for forming a pre-laminated inlay for a smart card is provided. According to some illustrative embodiments herein, the method includes: preparing a pre-laminated inlay substrate, providing an IC landing area in or on a first major surface of the pre-laminated inlay substrate, wherein at least one contact pad and at least one dummy island are formed in or on the first major surface, wherein the at least one contact pad is electrically connected to at least one wire routed in or on the pre-laminated inlay substrate. The method also includes: preparing a chip having at least one contact element configured on a second major surface of the chip, and flip-chip bonding the chip to the pre-laminated inlay substrate such that the at least one contact element is electrically connected to the at least one contact pad. The first major surface and the second major surface face each other. The chip at least partially covers the at least one dummy island and the at least one contact pad. With the at least one dummy island, adhesive material applied during flip-chip bonding can be more evenly distributed, thereby avoiding accumulation of adhesive material under the chip. The dummy island and the contact pad can draw out any excess adhesive material due to the spacing between the island and the contact pad. Furthermore, the bonding force between the chip and the pre-laminated inlay substrate is increased due to the increased surface provided by the spaced dummy islands and contact pads.

[0016] According to some illustrative embodiments of the first and / or second aspects, a plurality of dummy islands can be arranged in a configuration pattern adjacent to at least one contact pad in an IC landing area, wherein the chip at least partially covers at least some of the dummy islands. Providing the plurality of dummy islands in the configuration pattern adjacent to at least one contact pad advantageously influences bonding forces and results in a more uniform distribution of adhesive material applied during the bonding process. The chip at least partially covering the dummy islands ensures adequate support for the chip on the pre-laminated inlay substrate.

[0017] According to some illustrative examples of these illustrative embodiments, the configuration pattern may have a polygonal boundary. Accordingly, the configuration pattern may be easily provided in a repeating manner and may be easily adapted to different chip sizes.

[0018] According to some illustrative examples of these illustrative embodiments, at least some of the plurality of dummy islands may be formed into a cylindrical shape, with the cylindrical shape extending to a height level substantially the same as the height level to which the at least one contact pad extends on the first major surface. Accordingly, the dummy islands can be easily manufactured when preparing the pre-laminated inlay.

[0019] According to some illustrative examples of these illustrative embodiments, at least some of the plurality of dummy islands may be formed in a fin shape that extends above the first major surface to a height level substantially the same as the height level to which at least one contact pad extends on the first major surface. The fin-shaped dummy islands are less susceptible to mechanical damage and provide improved support for the chip on the pre-laminated inlay substrate.

[0020] According to some illustrative examples of these illustrative embodiments, the configuration pattern can be a regular grid-like pattern of dummy islands in the IC landing area. Thus, the regular grid-like pattern of dummy islands can be easily manufactured in a repeatable manner and can also provide a well-defined bonding force between the chip and the pre-laminated inlay substrate.

[0021] According to some illustrative embodiments of the first and / or second aspects, at least one contact pad and at least one conductive line may be arranged in and / or on the pre-laminated inlay substrate to laterally surround at least one dummy island in the IC landing area.

[0022] According to some illustrative embodiments of the first approach, an adhesive material may be sandwiched between the chip and the pre-laminated inlay substrate, wherein the adhesive material may be, for example, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) or a non-conductive paste (NCP).

[0023] According to some illustrative embodiments of the second aspect, an adhesive material may be provided between the chip and the pre-laminated inlay substrate during flip-chip bonding, wherein the adhesive material may be, for example, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) or a non-conductive paste (NCP).

[0024] According to some illustrative embodiments of the first and / or second aspects, at least one dummy island may be formed of a conductive material. Accordingly, the dummy island may have advantageous mechanical properties and may be formed according to a technique for manufacturing contact pads.

[0025] According to some illustrative embodiments of the first and / or second solutions, at least one dummy island may be formed on the insulating material layer of the first main side. Accordingly, the risk of a short circuit (occurring when a contact element of the chip accidentally contacts the at least one dummy island) may be avoided.

[0026] In a third aspect of the present disclosure, a smart card is provided. According to some illustrative embodiments of the third aspect, the smart card includes a card body having the pre-laminated inlay of the first aspect and an electrical module integrated into the card body, wherein the electrical module is electrically coupled to at least one contact pad. For example, the electrical module may be an antenna coil.

[0027] According to some particular illustrative but non-limiting embodiments of various aspects of the present disclosure, a chip may be understood to represent a bare die, or a die in a packaged form, or at least in a packaged packaged form. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Other aspects and illustrative embodiments of the present disclosure will be described in more detail in the following detailed description and in conjunction with the accompanying drawings, which are not drawn to scale.

[0029] Figure 1 A conventional pre-laminated inlay is shown schematically in cross-section.

[0030] Figure 2 A pre-laminated inlay according to some illustrative embodiments of the present disclosure is schematically shown in cross-section.

[0031] Figure 3 An IC landing area is schematically illustrated in top view, in accordance with some demonstrative embodiments of the present disclosure.

[0032] Figure 4 An IC landing area according to some other illustrative embodiments of the present disclosure is schematically shown in a top view.

[0033] Figure 5 An IC landing area according to some other illustrative embodiments of the present disclosure is schematically shown in a top view.

[0034] Figure 6 An IC landing area according to some other illustrative embodiments of the present disclosure is schematically shown in a top view. DETAILED DESCRIPTION

[0035] refer to Figure 2 , a pre-laminated inlay 20 according to some illustrative embodiments of the present disclosure will be described. The pre-laminated inlay 20 is a pre-laminated inlay of a smart card under manufacture and includes a pre-laminated inlay substrate 22 having an IC landing area disposed on a first major surface 21 of the pre-laminated inlay substrate 22. As used herein, an IC landing area refers to a surface portion of the first major surface 21 in which at least one contact pad and at least one dummy island are formed.

[0036] According to some illustrative embodiments of the present disclosure, the pre-laminated inlay 20 further includes a plurality of contact pads. Figure 2 , a plurality of contact pads are provided by contact pads 23a and contact pads 23b both formed in the first major surface 21. The pre-laminated inlay 20 further includes a plurality of dummy islands formed in the first major surface 21. Figure 2 And for illustration purposes, some of the multiple dummy islands are Figure 2The dummy islands are indicated by reference numerals in the illustration, such as dummy islands 24a, 24b, 24c, and 24d.

[0037] In reference Figure 2 In the illustrated embodiment, dummy islands 24b and 24c may be laterally surrounded by contact pads 23a and 23b with reference to at least one direction, preferably with reference to a direction given by a line drawn between contact pads 23a and 23b that is as short as possible. As used herein, the expression "dummy islands are laterally surrounded by contact pads" means that contact pads are disposed on two or more sides of the dummy islands.

[0038] According to some illustrative embodiments of the present disclosure, contact pads 23a and 23b may be provided by a conductive material that is deposited and patterned on first major surface 21 of pre-laminated inlay substrate 22. The contact pads may be electrically coupled to at least one conductive wire (not shown), which may be provided as a wiring structure within pre-laminated inlay substrate 22, or may be electrically coupled via a conductive wire provided on first major surface 21. For example, conductive pads 23a and 23b, along with the conductive wire (not shown), may be provided by aluminum or copper.

[0039] According to some illustrative embodiments of the present disclosure, and as Figure 2 As shown, one or more dummy islands may be provided in a configuration that laterally surrounds contact pads 23a and 23b. For example, contact pad 23a may be laterally surrounded by dummy islands 24a and 24b. For example, contact pad 23b may be laterally surrounded by dummy islands 24c and 24d. However, this does not limit the present disclosure, and at least one of contact pads 23a and 23b may not be laterally surrounded by dummy islands. As used herein, the phrase "a contact pad is laterally surrounded by dummy islands" means that dummy islands are provided on two or more sides of a contact pad.

[0040] According to some illustrative embodiments of the present disclosure, dummy island 24 may be formed of a conductive material, such as the same material as that forming contact pads 23 a and 23 b. This does not limit the present disclosure in any way, and those skilled in the art will appreciate that dummy island 24 may be formed of an insulating material.

[0041] According to some illustrative embodiments, dummy islands 24 may be made of a conductive material, and the uppermost layer (not shown) of pre-laminated inlay substrate 22 (i.e., the material at first major surface 21 of pre-laminated inlay substrate 22) may be made of an electrically insulating material. In these illustrative embodiments, dummy islands 24 may be electrically floating, and in particular, not connected to any wires or pads present in pre-laminated inlay substrate 22.

[0042] According to some alternative embodiments, at least some of the dummy islands can be electrically connected to each other, so that tolerances on possible misalignment of contact pads can be compensated by one or more dummy islands. Since the dummy islands are electrically isolated from any pads and wires present in the pre-laminated inlay substrate, the dummy islands can reduce the risk of accidental short circuits caused by misaligned bonding of the chip to the pre-laminated inlay substrate in the IC landing area.

[0043] According to some illustrative embodiments of the present disclosure, contact pads 23a, 23b and dummy islands 24 may extend substantially to a common height level with reference to first major surface 21 of pre-laminated inlay substrate 22. The term "substantially" may indicate an acceptable tolerance for deviation from the common height.

[0044] Continue to refer to Figure 2 , a chip 25 having contact elements 27a and 27b arranged on the second main surface 26 of the chip 25 is flip-chip bonded to the pre-laminated inlay substrate 22 so that the first main surface 21 and the second main surface 26 face each other. Due to the flip-chip bonding, the contact elements 27a and 27b are in contact with the contact pads 23a and 23b of the pre-laminated inlay substrate 22. When the chip 25 is bonded to the pre-laminated inlay substrate 22, the chip 25 is arranged on the contact pads 23a and 23b and the dummy island 24 so that the chip 25 at least partially covers the dummy island 24 and the contact pads 23a, 23b. Since any dummy island is at least partially covered by the chip 25, this does not limit the present disclosure to any dummy island being at least partially covered by the chip 25, and therefore does not exclude Figure 2 The dummy islands 24a and 24b are not Figure 2 The chip 25 in the pre-laminated inlay 20 is covered.

[0045] According to some illustrative embodiments, an adhesive material 28 may be sandwiched between the chip 25 and the pre-laminated inlay substrate 22. For example, the adhesive material may be an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) or a non-conductive paste (NCP) or any resin commonly used in flip-chip technology. Since the dummy island 24 is disposed adjacent to the contact pads 23a, 23b, for example, disposed between the contact pads 23a, 23b along the connection direction between the contact pads 23a and 23b, the adhesive material 28 may be evenly distributed between the pre-laminated inlay substrate 22 and the chip 25. Accordingly, Figure 2 The dummy islands 24 increase the surface area of ​​the pre-laminated inlay substrate 22, thereby increasing the bonding force in the flip-chip bonding between the chip 25 and the pre-laminated inlay substrate 22.

[0046] Continue to refer to Figure 2The dummy islands 24 may be arranged in a pattern such that, at least in the connection direction between the contact pads 23a and 23b, the dummy islands 24 are equidistant from each other and the contact pads 23a and 23b. However, this does not limit the present disclosure, and a varying spacing may exist between two adjacent dummy islands.

[0047] According to some illustrative embodiments, the Figure 2 Pre-laminated inlay 20: A pre-laminated inlay substrate 22 that can be cut into a suitable size for a smart card is prepared, for example, as a pre-laminated substrate body; an IC landing area is provided on a first main surface 21 of the pre-laminated inlay substrate 22, wherein at least one contact pad 23a, 23b and at least one dummy island 24 are formed in the first main surface 21. The at least one contact pad 23a, 23b is electrically connected to at least one wire (not shown) wired in the IC landing area. In addition, a chip 25 is prepared having at least one contact element 27a, 27b arranged on a second main surface 26 of the chip 25. Then, flip-chip bonding of the chip 25 to the pre-laminated inlay substrate 22 is performed so that the at least one contact element 27a, 27b is electrically connected to the at least one contact pad 23a, 23b. The first main surface 21 and the second main surface 26 face each other in the flip-chip bonding of the chip 25 to the pre-laminated inlay substrate 22. The chip 25 at least partially covers the at least one dummy island 24 and the at least one contact pad 23 a , 23 b .

[0048] although Figure 2 A plurality of contact pads 23 a , 23 b and a plurality of dummy islands 24 are schematically illustrated, but this does not limit the present disclosure, and one contact pad among the contact pads 23 a , 23 b and one dummy island among the dummy islands 24 may be provided instead.

[0049] Reference Figure 3 , schematically illustrates a top view of an IC landing area 30 of a pre-laminated inlay substrate (not shown). IC landing area 30 includes a contact pattern 32 and a contact pattern 34. Contact pattern 32 includes a contact pad 32a, while contact pattern 34 includes a contact pad 34a and a contact pad 34b. Although only one contact pad is shown for contact pattern 32 and two contact pads are shown for contact pattern 34, in general, each of contact patterns 32, 34 may have any number of contact pads. Although only two contact patterns 32, 34 are shown, any number of contact patterns may be provided, such as a single contact pattern or more than two contact patterns.

[0050] According to some illustrative embodiments, one of the contact patterns 32, 34 may be used to connect to a contact element of the chip (in Figure 3The chip 35 is connected to a different electrical and / or electronic module (not shown) or chip. For example, the contact patterns 32 and 34 can be electrically connected to the terminals of the antenna coil to connect the chip 35 to the antenna coil (not shown).

[0051] like Figure 3 As shown, a plurality of dummy islands 36 are formed between the contact patterns 32, 34 such that the plurality of dummy islands 36 are laterally surrounded by the contact patterns 32, 34. Accordingly, the plurality of dummy islands 36 are considered to be laterally surrounded by the contact pads 32a, 34a, and 34b.

[0052] according to Figure 3 , contact pad 32a is connected to contact pattern 32 via wire 32b. For example, terminal pad 32t can be coupled to contact pad 32a via wire 32b. Similarly, contact pad 34a can be coupled to terminal pad 34t of contact pattern 34 via wire 34c, while contact pad 34b is electrically coupled to terminal pad 34t via wire 34d. The number of wires does not constitute any limitation to the present disclosure, and those skilled in the art will understand that the contact pads can be coupled to the terminal pads via any number of contact pads and wires connected in series and / or in parallel.

[0053] According to some illustrative embodiments and as disclosed herein Figure 3 As shown, the plurality of dummy islands 36 may be arranged in a regular, grid-like pattern according to the arrangement of the dummy islands. This means that the plurality of dummy islands 36 may be arranged in a regular, matrix-like pattern such that adjacent dummy islands in two orthogonal directions are arranged at the same distance from each other. Figure 3 The configuration of the plurality of dummy islands 36 shown may have a rectangular boundary. For example, the plurality of dummy islands 36 may be arranged in M ​​rows, with N dummy islands in each row. The numbers M and N are natural numbers, both greater than 0. For example, in the case where M=N=1, there may be a single dummy island instead of Figure 3 The plurality of dummy islands 36 are shown. The single dummy island can be configured to Figure 3 Alternatively, the single dummy island may be located at Figure 3 The center of the line drawn between the contact pad of contact pattern 32 and the contact pad of contact pattern 34 in the top view of FIG.

[0054] exist Figure 3 In the illustration, the dummy island is configured in a cylindrical shape with a circular surface. This does not constitute any limitation to the present disclosure, and alternatively, Figure 3 The virtual island has an irregular cylindrical shape in the top view.

[0055] Reference Figure 4, schematically illustrates a top view of an IC landing area 40 according to some other illustrative embodiments of the present disclosure. The IC landing area 40 has a Figure 3 The contact patterns 42 and 44 of the contact patterns 32 and 34 in FIG. This does not constitute any limitation to the present disclosure, and the contact patterns 42 and 44 in FIG. Figure 4 can have different geometric shapes in the top view. Figure 3 The description of contact patterns 32 and 34 presented in the context of FIG. 1 is directly applicable to contact patterns 42 and 44, in particular contact pads 42a, 44a, 44b and conductors 42b, 44c, 44d. Figure 4 In the top view of FIG, it is indicated by a dashed frame 45 .

[0056] Figure 4 A plurality of dummy islands 46 are shown, and the plurality of dummy islands 46 include fin-shaped dummy islands 46a, 46b, and 46c, and pillar-shaped dummy islands 46d, 46e, and 46f. Accordingly, the plurality of dummy islands 46 may include two groups of dummy islands, fin-shaped dummy islands 46a and 46b, and pillar-shaped dummy islands 46d, 46e, and 46f. Figure 4 As shown in the schematic top view of FIG, the dummy islands in each group of dummy islands can have different sizes. For example, the fins 46a and 46c can have a larger length dimension than the fin-shaped dummy island 46b (in FIG. Figure 4 (measured along the length direction representing the longest dimension in the top view of FIG. 1 ). In addition, the fin-shaped dummy islands 46 a and 46 c may be arranged such that their length directions are parallel to each other and orthogonal to the length direction of the fin-shaped dummy island 46 b.

[0057] like Figure 4 As shown, the diameters of the columnar dummy islands 46d, 46e, and 46f may be different. For example, the dummy island 46d may have a smaller diameter than each of the dummy islands 46b and 46f, and may be smaller than the diameter of the dummy island 46d. Figure 4 In the top view of FIG, dummy islands 46d, which are located at or near the center of gravity of chip 45, can have a smaller diameter than dummy islands 46e and 46f. These dummy islands are spaced farther from the center of gravity of chip 45 than dummy island 46d is from the center of gravity of chip 45. Accordingly, stable support of chip 45 on dummy islands 46 can be achieved. In addition, the spacing between the dummy islands allows adhesive material (not shown) to be more evenly distributed in the spaces between dummy islands 46.

[0058] Reference Figure 5 , schematically illustrates a top view of an IC landing area 50 according to some other illustrative embodiments of the present disclosure. The IC landing area 50 has two contact patterns 52 and 54, which substantially correspond to those described above with reference to FIG. Figure 3 and Figure 4 The contact patterns 42, 44 and 32, 34 are described. Accordingly, the description of the above contact patterns 32, 34 and 42, 44 is incorporated herein by reference.

[0059] Figure 5 The diagram schematically illustrates a plurality of dummy islands 56 disposed between the contact patterns 52 and 54. The dummy islands 56 have a substantially cylindrical shape. Figure 5 In the top view, the shapes of the dummy islands 56 deviate from the cylindrical shape, but the general form of the cylindrical shape is achieved. In addition, the plurality of dummy islands 56 are arranged in a configuration pattern consisting of regular polygonal figures, such as a hexagonal sub-configuration of the dummy islands 56 similar to a honeycomb.

[0060] Reference Figure 6 , schematically illustrates IC landing area 60 in a top view, according to some other illustrative embodiments. Figure 6 The IC landing area 60 has relative Figures 3 to 5 The embodiment shown has two contact patterns 62 and 64 of alternative shapes.

[0061] according to Figure 6 As shown in the figure, the contact pattern 62 has a terminal pad 62t connected to the contact pad 62a by means of two wires 62b and 62c. Similarly, the contact pattern 64 may have a terminal pad 64t connected to the contact pad 64a by means of two wires 64b and 64c. The wires 64b, 64c, 62b, 62c laterally surround a plurality of dummy islands, which are separated into two groups 66' and 66" by separating the wires 62b and 64b of the two groups 66' and 66". Within each of the groups 66' and 66", the dummy islands are arranged in a regular grid pattern, and the boundaries of each of the groups 66' and 66" are polygonal in shape. The polygonal shape may be provided by the wires and the contact pads of each contact pattern in the contact pattern. This does not constitute any limitation to the present disclosure, and Figure 6 The dummy island shown in can be made of Figure 4 As shown in or Figure 5 Instead, use the dummy island shown in FIG.

[0062] exist Figure 6 A chip (not shown) may be positioned in the background so that the chip (not shown) is aligned with the space between the terminal pads 62t and 64t, possibly partially overlapping the terminal pads 62t and 64t.

[0063] In the context of the above-mentioned embodiments and in Figures 1 to 6 In the context of any of the figures, the chip can typically have a size of at least 1×1 mm 2 , such as at least 2×2mm 2 or at least 3×3mm2 or at least 4×4mm 2 or at least 5×5mm 2 In a particular illustrative embodiment, the chip may have a size of approximately 1×1 mm. 2 , such as about 2×2mm 2 or about 3×3mm 2 or about 4×4mm 2 or about 5×5mm 2 or the size of every value in between those values.

[0064] Refer to the above about Figures 2 to 6 In one embodiment, a pre-laminated inlay substrate for providing a pre-laminated inlay of a smart card is provided, which has at least one contact pad and at least one dummy island in the IC landing area for the contact elements of the chip, so that the IC landing area is divided into at least one dummy island and at least one contact pad. Then, an adhesive material (e.g., an adhesive such as ACF, ACP, or NCP) can fill the space around the dummy island with a thickness of the dummy island and the contact pad (standard 18 / 36μm copper / 10 or 39μm aluminum). It is proposed to configure multiple dummy islands in an N-configuration pattern and / or with different shapes.

[0065] According to some illustrative embodiments of the present disclosure, the dummy islands are electrically isolated from any conductive elements in the pre-laminated inlay substrate, thereby preventing accidental short circuits between bumps or open pads of the chip. Generally, the dummy islands can have shapes that differ from a regular circle or rectangle in top view and can represent any arbitrary etchable shape. The shape and configuration of the dummy islands can be determined to stably support the chip in the IC landing area of ​​the pre-laminated inlay and to prevent breakage of the chip and / or the dummy islands during further processing in the manufacture of the smart card.

[0066] According to at least some of the aforementioned embodiments, the dummy islands can set a minimum thickness for the adhesive material during flip-chip bonding of the chip to the pre-laminated inlay substrate during smart card manufacturing. Furthermore, the dummy islands help distribute the adhesive material more evenly between the chip and the pre-laminated inlay substrate and prevent excess adhesive material from being squeezed out during final bonding in the thermal mode of the flip-chip bonding process. Furthermore, the isolated dummy islands can prevent short circuits with bumps or open pads provided on the chip.

[0067] After a thorough review of this disclosure, those skilled in the art will understand that the bonding of a chip to a pre-laminated inlay substrate is not limiting in the above disclosure. When forming a chip module, the above embodiments can be implemented in a flip-chip bonding of a chip to a carrier. For example, such a chip module can be integrated into a pre-laminated inlay substrate of a smart card, or, in an alternative way of understanding the expression "pre-laminated inlay," the term can be understood to represent the chip module obtained after flip-chip bonding of the chip to the carrier, which chip module is then integrated into the card body of the smart card during subsequent manufacturing of the smart card.

[0068] According to some illustrative embodiments, the configuration of the dummy islands between the conductive pads can be designed to avoid break lines. Those skilled in the art will appreciate that the configuration of the dummy islands between the conductive pads can be varied to avoid break lines, given the need to optimize the stable support of the bare die on the base substrate. Figures 4 to 6 The configuration of the dummy islands is clearly shown to avoid flip-chip bonding to the portion of the bare die that is not sensitive to cracking on the base substrate.

Claims

1. A pre-laminated inlay for a smart card, the pre-laminated inlay comprising: a pre-laminated inlay substrate having an IC landing area disposed on a first major surface of the pre-laminated inlay substrate, the IC landing area having at least one contact pad and a plurality of dummy islands, wherein the at least one contact pad is electrically coupled to at least one conductive line routed in or on the pre-laminated inlay substrate, and the plurality of dummy islands are electrically isolated from any conductive elements in the pre-laminated inlay substrate; as well as a chip having at least one contact element arranged on the second main surface of the chip, the at least one contact element being electrically connected to the at least one contact pad, The chip is flip-chip bonded to the pre-laminated inlay substrate such that the first main surface and the second main surface face each other and the chip at least partially covers the at least one contact pad, and the plurality of dummy islands are used to support the chip on the pre-laminated inlay substrate. The plurality of dummy islands are arranged in a configuration pattern adjacent to the at least one contact pad in the IC landing area. 2 . The pre-laminated inlay of claim 1 , wherein the chip at least partially covers at least some of the plurality of dummy islands.

3. The pre-laminated inlay of claim 2, wherein the configuration pattern has a polygonal boundary.

4. The pre-laminated inlay according to claim 2 or 3, wherein at least some of the plurality of dummy islands are formed into a cylindrical shape, the cylindrical shape extending to a height level on the first major surface substantially the same as the height level to which the at least one contact pad extends on the first major surface.

5. The pre-laminated inlay of claim 2 , wherein at least some of the plurality of dummy islands are formed in a fin shape, the fin shape extending to a height level on the first major surface substantially the same as a height level to which the at least one contact pad extends on the first major surface.

6. The pre-laminated inlay of claim 2, wherein the configuration pattern is a regular grid-like pattern of dummy islands in the IC landing area.

7. The pre-laminated inlay according to claim 1, wherein the at least one contact pad and the at least one conductive line are arranged in and / or on the pre-laminated inlay substrate to laterally surround at least one of the plurality of dummy islands in the IC landing area.

8. The pre-laminated inlay of claim 1, further comprising an adhesive material sandwiched between the chip and the pre-laminated inlay substrate.

9. The pre-laminated inlay according to claim 8, wherein the adhesive material is an anisotropic conductive film or an anisotropic conductive glue or a non-conductive glue.

10. The pre-laminated inlay of claim 1, wherein the plurality of dummy islands are formed of a conductive material. 11 . The pre-laminated inlay of claim 10 , wherein the plurality of dummy islands are formed on the insulating material layer of the first major surface.

12. A method of forming a pre-laminated inlay for a smart card, comprising: preparing a pre-laminated inlay substrate, providing an IC landing area on a first major surface of the pre-laminated inlay substrate, wherein at least one contact pad and a plurality of dummy islands are formed in the first major surface, wherein the at least one contact pad is electrically coupled to at least one conductive line routed in the IC landing area, and the plurality of dummy islands are electrically isolated from any conductive elements in the pre-laminated inlay substrate; preparing a chip having at least one contact element arranged on the second main surface of the chip, and bonding the chip to the pre-laminated inlay substrate by a flip-chip technique so that the at least one contact element is electrically connected to the at least one contact pad, wherein the first main surface and the second main surface face each other, and wherein the chip at least partially covers the at least one contact pad, and the plurality of dummy islands are used to support the chip on the pre-laminated inlay substrate, The plurality of dummy islands are formed in a configuration pattern adjacent to the at least one contact pad in the IC landing area. 13 . The method of claim 12 , wherein the chip at least partially covers at least some of the plurality of dummy islands. The method of claim 13 , wherein the configuration pattern has a polygonal boundary.

15. The method according to claim 13 or 14, wherein at least some of the plurality of dummy islands are formed into a cylindrical shape, and the height level to which the cylindrical shape extends on the first main surface of the pre-laminated inlay substrate is substantially the same as the height level to which the at least one contact pad extends on the first main surface of the pre-laminated inlay substrate.

16. The method of claim 13 , wherein at least some of the plurality of dummy islands are formed into a fin shape, the fin shape extending to a height level on the first major surface of the pre-laminated inlay substrate being substantially the same as a height level to which the at least one contact pad extends on the first major surface of the pre-laminated inlay substrate.

17. The method of claim 13, wherein the configuration pattern is a regular grid-like pattern of dummy islands in the IC landing area.

18. The method of claim 12, wherein the at least one contact pad and the at least one conductive line are arranged in and / or on the pre-laminated inlay substrate to laterally surround at least one of the plurality of dummy islands in the IC landing area.

19. The method according to claim 18, further comprising: An adhesive material is provided between the chip and the pre-laminated inlay substrate during the flip chip technology bonding.

20. The method according to claim 19, wherein the adhesive material is an anisotropic conductive film, an anisotropic conductive glue, or a non-conductive glue. The method of claim 12 , wherein the plurality of dummy islands are formed of a conductive material.

22. The method according to claim 19 or 20, wherein the plurality of dummy islands are formed on an insulating material layer on the first major surface.

23. A smart card comprising: A card body having a pre-laminated inlay according to any one of claims 1 to 11; and an electrical module integrated into the card body, wherein the electrical module is electrically coupled to the at least one contact pad.

24. The smart card of claim 23, wherein the electrical module is an antenna coil.

Images