A solder strip handling device

Abstract

The application discloses a welding strip processing device for processing a plurality of welding strips extending along a first direction, the plurality of welding strips are arranged at intervals along a second direction, the second direction is perpendicular to the first direction, the welding strip processing device comprises at least one processing module, each processing module comprises a plurality of processing units, in each processing module, the plurality of processing units are arranged at intervals along the second direction, each processing unit is used for processing one welding strip, each processing unit has a processing space for accommodating part of the welding strip, the processing space is through along the first direction, and the processing space has an opening for the welding strip to enter along a radial direction of the processing space, and the opening is towards one side of the second direction. In the welding strip processing device, each processing unit adopts a "half-enclosed" structure, and each welding strip does not need to be accurately aligned into each processing space when being pulled out, so that the operation steps of welding strip alignment are simplified, time and labor are saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar cell string production, and particularly relates to a welding strip processing device. BACKGROUND

[0002] Cell string welding is an important process in the production of solar cell panels, which uses welding strips to weld cell pieces into cell strings, and the welding strips play an important role in conducting electricity and gathering electricity. In the string welding process, one section of the welding strip is usually welded to the back of one of the two adjacent cell pieces, and the other section is welded to the front of the other cell piece. Since the structure of the silicon-based cell piece is extremely thin and fragile, the stress at the connection between the front and back of the cell piece is large during the overlapping process with the welding strip, and there is a risk of hidden cracks or even fragments, so some string welding processes will perform a "dotting" pretreatment on the welding strip, which thins the middle part of the welding strip locally, to eliminate or reduce the risk of cell piece fragmentation. In the prior art, the welding strip is generally placed in a roll, and before being welded to the cell piece, it needs to be pretreated by stretching, shaping, dotting, cutting and other processes. In actual production, multiple parallel welding strips are needed for cell string welding, so the welding strip processing device needs to be able to process multiple welding strips at the same time.

[0003] A common welding strip processing device includes a rectangular slot, and the stretching direction of each welding strip is parallel to the length direction of the slot, and the distribution direction of different welding strips is parallel to the width direction of the slot. Stretching, shaping, dotting, cutting and other processing modules with different functions are arranged along the length direction of the slot. Each module includes a mounting bracket erected above the slot, which is composed of a vertical column fixed on both sides of the width of the slot and a crossbeam connected between the two vertical columns. The crossbeam is provided with a processing unit composed of moving parts, air cylinders and other components required for processing the welding strip, and multiple processing units need to be arranged on one mounting bracket to correspond to the multiple welding strips distributed along the width direction of the slot. The above welding strip processing device has at least the following defects: (1) when each welding strip is pulled out from the reel, it needs to pass under each crossbeam in turn and be accurately placed in the processing hole or slot under each processing unit, which consumes a lot of manpower and time, especially when the number of welding strips to be processed is large and the slot is wide, the operation is more difficult; (2) when the number of welding strips to be processed is large, the width of the crossbeam also increases accordingly, and the total weight of the processing units also increases, which causes the straightness of the crossbeam to deteriorate significantly, especially the processing units in the middle of the crossbeam will sink obviously, and the heights of the processing units are not uniform, which leads to uneven processing effects of the welding strips (such as uneven pressure), and further seriously affects the production quality of the cell string, especially the multi-parallel cell string. SUMMARY

[0004] The present application aims to solve the problems in the prior art, and provides a welding strip processing device that can simplify the operation and improve the processing quality of the welding strip.

[0005] To achieve the above object, the technical scheme adopted by the present application is:

[0006] A solder strip processing device is used for processing a plurality of solder strips extending along a first direction, the plurality of solder strips are arranged at intervals along a second direction, the second direction is perpendicular to the first direction, the solder strip processing device comprises at least one processing module, each processing module comprises a plurality of processing units, in each processing module, the plurality of processing units are arranged at intervals along the second direction, each processing unit is used for processing one solder strip, each processing unit has a processing space for accommodating part of the solder strip, the processing space penetrates along the first direction, the processing space has an opening for the solder strip to enter along the radial direction of itself, and the opening is towards one side of the second direction.

[0007] In some embodiments, in the same processing module, the openings of all the processing spaces are towards the same side of the second direction, the solder strip can enter the gap between two processing units from top to bottom, and then enter the processing space from the opening.

[0008] In some embodiments, the processing module comprises a base, the base has a bearing surface, the processing space is located above the bearing surface, each processing unit comprises a moving part, the moving part can move relatively in the processing space, and the processing module further comprises a driving device for driving the moving part to move relatively, the driving device is located below the bearing surface.

[0009] In some embodiments, the solder strip processing device comprises a plurality of processing modules, the plurality of processing modules are arranged at intervals along the first direction, and the plurality of processing modules comprise one or more of a first positioning module, a second positioning module, a dotting module and a cutting module.

[0010] In some embodiments, the first positioning module is used for positioning a part of the solder strip, the processing units therein are first positioning units, and each first positioning unit comprises a first pressing part capable of moving relatively in the up-down direction.

[0011] In some embodiments, the second positioning module is used for positioning another part of the solder strip, the processing units therein are second positioning units, and each second positioning unit comprises a second pressing part capable of moving relatively in the up-down direction.

[0012] In some embodiments, the dotting module is used for locally thinning the solder strip, the processing units therein are dotting units, and each dotting unit comprises a dotting pressing block capable of moving relatively in the up-down direction.

[0013] In some embodiments, the cutting module is configured to cut the solder strip, and each of the cutting units comprises a cutting knife.

[0014] In some embodiments, all of the processing spaces of all of the processing modules are open to the same side of the second direction, and the processing units of different processing modules correspond to each other along the first direction.

[0015] In some embodiments, the processing modules comprise the first positioning module, the dotting module, and the second positioning module, the first positioning module, the dotting module, and the second positioning module are arranged in sequence along the first direction, and the second positioning module is arranged to be relatively movable along the first direction.

[0016] In some embodiments, the first positioning module comprises a first base having a first bearing surface, and the first positioning module further comprises a first driving device configured to drive the first pressing members to move up and down, at least a portion of each of the first pressing members is located above the first bearing surface, and the first driving device is located below the first bearing surface.

[0017] In some embodiments, the second positioning module comprises a second base having a second bearing surface, and the second positioning module further comprises a second driving device configured to drive the second pressing members to move up and down, at least a portion of each of the second pressing members is located above the second bearing surface, and the second driving device is located below the second bearing surface.

[0018] In some embodiments, the dotting module comprises a third base having a third bearing surface, and the dotting module further comprises a third driving device configured to drive the dotting pressing blocks to move up and down, at least a portion of each of the dotting pressing blocks is located above the third bearing surface, and the third driving device is located below the third bearing surface.

[0019] In some embodiments, the solder strip processing device comprises a cutting module, the cutting module comprises a plurality of cutting units, the cutting units are arranged at intervals along the second direction, each of the cutting units comprises a first cutting knife and a second cutting knife, the first cutting knife and the second cutting knife are configured to move towards or away from each other along the second direction, each of the cutting units is configured to cut a solder strip, and the solder strip can enter a gap between the first cutting knife and the second cutting knife from above.

[0020] In some embodiments, the cutting module comprises a fourth base having a fourth bearing surface, and the cutting module further comprises a fourth driving device for driving the relative movement of the first cutting knife and the second cutting knife, at least part of the first cutting knife and the second cutting knife being located above the fourth bearing surface, and the fourth driving device being located below the fourth bearing surface.

[0021] In some embodiments, the solder strip processing device comprises a limiting module, the limiting module has at least two limiting modules arranged in the first direction, and at least one processing module is arranged between the two limiting modules, each limiting module comprises a plurality of limiting assemblies arranged in the second direction, the plurality of limiting assemblies correspond to the plurality of processing units in each processing module in the first direction, and each limiting assembly comprises two limiting columns arranged in the second direction, and the solder strip can enter the gap between the two limiting columns from top to bottom.

[0022] Due to the use of the above technical solutions, in the solder strip processing device provided by the application, each processing unit adopts a "semi-enclosed" structure, and the opening of the processing space is arranged on one side in the second direction. In this way, each solder strip does not need to be accurately aligned or threaded into each processing space when being pulled out, and only the head and tail of a section of solder strip need to be positioned, and then the operator can quickly realize the accurate alignment of each solder strip by pushing each solder strip into the opening of the corresponding processing space. Even if the number of solder strips is large, the operation difficulty of the solder strip processing device will not increase significantly, which saves time and effort, and is especially suitable for the production of large-scale battery string assemblies such as multi-parallel battery strings.

[0023] On the other hand, the upper part of each processing module of the solder strip processing device is open, and the pulled-out solder strip can enter the corresponding processing space from top to bottom. The components in the processing unit are all transferred downward, and in addition to the necessary moving parts, other supporting driving devices and linkage mechanisms are all moved to the lower part of the base, so that there is no need to set an installation rack above the base, which is beneficial to the rapid entry of the solder strip into the corresponding processing space, and can avoid the problem of deformation of the installation rack due to pressure when the number of processing units is large, so that the consistency of different solder strip processing is good, and the processing quality of the whole solder strip is improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the application, the drawings needed in the following embodiment description will be briefly introduced.

[0025] FIG. 1 is a schematic view of a solder strip processing device according to an embodiment of the application; Figure 1 FIG. 1 is a schematic view of a solder strip processing device according to an embodiment of the application;

[0026] FIG. 1 is a schematic view of a solder strip processing device according to an embodiment of the application; Figure 2This is another perspective view of the solder strip processing device in this embodiment;

[0027] Appendix Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0028] Appendix Figure 4 This is a side view of the solder strip processing device in this embodiment;

[0029] Appendix Figure 5 This is a partial three-dimensional schematic diagram of the second positioning module in this embodiment;

[0030] Appendix Figure 6 for Figure 5 Enlarged view of point B in the middle;

[0031] Appendix Figure 7 This is a partial front view schematic diagram of the second positioning module in this embodiment;

[0032] Appendix Figure 8 for Figure 7 Enlarged view of point C in the middle;

[0033] Appendix Figure 9 This is a partial three-dimensional schematic diagram of the dot-mapping module in this embodiment;

[0034] Appendix Figure 10 for Figure 9 Enlarged view of point D;

[0035] Appendix Figure 11 This is a partial front view schematic diagram of the dot-mapping module in this embodiment;

[0036] Appendix Figure 12 for Figure 11 Enlarged view of point E in the middle;

[0037] Appendix Figure 13 This is a partial three-dimensional schematic diagram of the first positioning module and the cutting module in this embodiment;

[0038] Appendix Figure 14 for Figure 13 Enlarged diagram at point F;

[0039] Appendix Figure 15 This is a partial front view schematic diagram of the first positioning module and the cutting module in this embodiment;

[0040] Appendix Figure 16 for Figure 15 Enlarged diagram of point G in the middle;

[0041] Wherein: 101, processing space; 100, first positioning module; 110, first base; 111, first bearing surface; 120, first positioning unit; 121, first pressing part; 122, first driving rod; 130, first driving device;

[0042] 200, second positioning module; 210, second base; 211, second bearing surface; 220, second positioning unit; 221, second pressing part; 222, second driving rod; 230, second driving device; 240, shaping cylinder;

[0043] 300, dotting module; 310, third base; 311, third bearing surface; 320, dotting unit; 321, dotting pressing block; 330, third driving device;

[0044] 400, cutting module; 410, fourth base; 411, fourth bearing surface; 420, cutting unit; 421, first cutting knife; 422, second cutting knife;

[0045] 500, limiting module; 510, limiting assembly; 511, limiting column;

[0046] 1, solder strip; 10, solder strip group; X, first direction; Y, second direction; Z, up-down direction. DETAILED DESCRIPTION

[0047] The preferred embodiments of the present application will be described in detail with reference to the drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art.

[0048] Referring to Figure 1 As shown in the drawings, the present embodiment provides a solder strip processing device for processing a plurality of solder strips 1 extending along a first direction X, the plurality of solder strips 1 are arranged at intervals along a second direction Y, and the second direction Y is perpendicular to the first direction X. The XYZ three-dimensional coordinate system is established with reference to the solder strip processing device, so as to facilitate the description of the structure and working principle of the solder strip processing device, wherein the first direction X and the second direction Y extend along the horizontal direction respectively, and the up-down direction Z is perpendicular to the horizontal plane.

[0049] Referring to Figures 1 to 4As shown, the solder strip processing device comprises at least one processing module, each processing module comprising a plurality of processing units. In each processing module, the plurality of processing units are arranged at intervals along the second direction Y, and each processing unit is used to process a solder strip 1. Further, the solder strip processing device comprises a plurality of processing modules, the plurality of processing modules are arranged at intervals along the first direction X, and the plurality of processing modules comprise one or more of the first positioning module 100, the second positioning module 200, the dotting module 300, and the cutting module 400. In this embodiment, the plurality of processing modules specifically comprise the first positioning module 100, the dotting module 300, and the second positioning module 200, and the first positioning module 100, the dotting module 300, and the second positioning module 200 are arranged in sequence along the first direction X, wherein the second positioning module 200 is also arranged in relative motion along the first direction X, and the second positioning module 200 comprises a shaping cylinder 240 for driving the entire second positioning module 200 to move along the first direction X.

[0050] It should be noted that the solder strip processing device actually further comprises a groove or other basic structure for forming the frame of the entire solder strip processing device, and each processing module and the cutting module 400, the limiting module 500, etc. mentioned in the text are arranged in the groove. However, the groove is omitted in each drawing of this embodiment, so as to facilitate observation of the specific structure of each module inside. The structure of the groove itself can refer to the prior art, and the present application is not limited. In addition, the relative distance between each module in the solder strip processing device of this embodiment can be adjusted, so that different lengths of solder strips 1 can be processed as needed, and therefore Figure 1 The distance between different modules shown in Figure 2 is different.

[0051] In this embodiment, the solder strip processing device is particularly suitable for synchronous processing of a large number of solder strips 1. For example, in a device for producing multiple battery strings, a plurality of battery strings arranged along the second direction Y (not shown in the figure) need to be produced synchronously. Each battery string extends along the first direction X, and two battery plates adjacent along the first direction X are connected by a group of solder strips 10, and each group of solder strips 10 comprises a plurality of solder strips 1, resulting in a large number of solder strips 1 that need to be processed synchronously. For example Figure 1 As shown, the solder strips 1 to be processed can be divided into five groups of solder strips 10, the five groups of solder strips 10 are arranged at intervals along the second direction Y, each group of solder strips 10 comprises a plurality of solder strips 1 arranged at intervals along the second direction Y, and each solder strip 1 extends along the first direction X. Thus, the five groups of solder strips 10 produced can correspond to the demand for five parallel battery strings.

[0052] Referring to Figures 5 to 16As shown, in the embodiment, each processing unit has a processing space 101 for accommodating part of the solder strip 1, the processing space 101 penetrates along the first direction X, and the processing space 101 has an opening for the solder strip 1 to enter along the radial direction of the solder strip 1, and the opening is directed to one side of the second direction Y. Further, in the same processing module, the openings of all the processing spaces 101 are directed to the same side of the second direction Y, and the solder strip 1 can first enter the gap between two processing units from top to bottom, and then enter the processing space 101 from the opening. In the embodiment, each processing module includes a base, and the base has a bearing surface, and the processing space 101 is located above the bearing surface. Each processing unit includes a moving part, and the moving part can move relatively in the processing space 101. The processing module further includes a driving device for driving the relative movement of the moving part, and the driving device is located below the bearing surface. In this way, in each processing module, most of the mechanisms including the driving device are transferred to the lower side of the base, so that the upper side of the processing unit is an open space, and the solder strip 1 can freely enter and exit along the up-down direction Z, and the center of gravity of each processing unit is transferred downward, and can be supported by the base or even the entire tank, and the support force is stable and reliable, so that the processing spaces 101 of different processing units can always be maintained at the same height, and the consistency of the processing effect of different solder strips 1 is improved.

[0053] Referring to Figures 1 to 4 As shown, in the embodiment, in all processing modules, the openings of all processing spaces 101 are directed to the same side of the second direction Y, and the plurality of processing units in different processing modules correspond one by one along the first direction X, so that the solder strip 1 can simultaneously enter different processing spaces 101 from the same side of the second direction Y. Further, in each processing module, the plurality of processing units are uniformly and evenly arranged; in different processing modules, the number of processing units is the same, so that the plurality of processing units can correspond front and back along the first direction X, and each solder strip 1 extending along a straight line can pass through one processing space 101 of each processing module along the axial direction of the solder strip 1 in sequence.

[0054] Referring to Figures 13 to 16As shown, specifically, in the present embodiment, the first positioning module 100 is used for positioning a portion of the solder strip 1, and the processing unit therein is referred to as a first positioning unit 120. Each first positioning unit 120 comprises a first pressing member 121 capable of relative movement in the up-down direction Z. The first positioning module 100 further comprises a first base 110 having a first bearing surface 111. The first positioning module 100 further comprises a first driving device 130 for driving the first pressing member 121 to move up and down. At least a portion of each first pressing member 121 is located above the first bearing surface 111, and the first driving device 130 is located below the first bearing surface 111. In the present embodiment, each first positioning unit 120 further comprises a first driving rod 122 which passes through the first bearing surface 111 in the up-down direction Z, and the upper portion of the first driving rod 122 is connected with the first pressing member 121, so that the first driving device 130 can drive the first pressing member 121 to move up and down by driving the first driving rod 122 to move up and down. The first pressing member 121, the first driving rod 122 and the first bearing surface 111 located above the first bearing surface 111 together enclose a processing space 101 of the first positioning unit 120, and when the first pressing member 121 moves towards the first bearing surface 111, it can press and position the portion of the solder strip 1 located in the processing space 101. In the present embodiment, each first driving device 130 can simultaneously drive multiple first driving rods 122 and first pressing members 121 to move, and the first driving device 130 specifically adopts a pneumatic cylinder.

[0055] Referring to Figures 5 to 8As shown, in the embodiment, the second positioning module 200 is similar in structure to the first positioning module 100, and is used to position another part of the solder strip 1. The processing unit in the second positioning module 200 is referred to as a second positioning unit 220. Each second positioning unit 220 includes a second pressing member 221 capable of relative movement in the upward and downward direction Z. The second positioning module 200 includes a second base 210 having a second bearing surface 211. The second positioning module 200 further includes a second driving device 230 for driving the second pressing member 221 to move upward and downward. At least part of each second pressing member 221 is located above the second bearing surface 211, and the second driving device 230 is located below the second bearing surface 211. In the embodiment, each second positioning unit 220 further includes a second driving rod 222 which passes through the second bearing surface 211 in the upward and downward direction Z. The upper part of the second driving rod 222 is connected to the second pressing member 221, so that the second driving device 230 can drive the second pressing member 221 to move upward and downward by driving the second driving rod 222 to move upward and downward. The second pressing member 221, the second driving rod 222 and the second bearing surface 211 located above the second bearing surface 211 together define a processing space 101 of the second positioning unit 220. When the second pressing member 221 moves towards the second bearing surface 211, it can press and position part of the solder strip 1 located in the processing space 101. In the embodiment, each second driving device 230 can simultaneously drive multiple second driving rods 222 and second pressing members 221 to move. The second driving device 230 specifically adopts a pneumatic cylinder.

[0056] Referring to Figures 1 to 4 As shown, in the embodiment, the first positioning module 100 mainly functions to fix one end of the pulled-out solder strip 1. After part of the solder strip 1 is pressed by the first pressing member 121, it can prevent the solder strip 1 from slipping under external force. The second positioning module 200 mainly functions to stretch and shape the solder strip 1. Since the solder strip 1 is originally stored in a solder strip roll (not shown in the figure), it still has a certain curvature after being pulled out. In order to obtain a solder strip 1 with better straightness, the second positioning module 200 is required to press and fix the other end of the solder strip 1, and then the second base 210 is driven by the shaping pneumatic cylinder 240 to move in the first direction X away from the first positioning module 100, so that multiple solder strips 1 are synchronously stretched and deformed plastically, thereby straightening the solder strip 1 to facilitate subsequent process operation.

[0057] Referring to Figures 9 to 12As shown, in the embodiment, the dotting module 300 is arranged between the first positioning module 100 and the second positioning module 200, and is configured to locally thin the solder strip 1 so as to reduce the stress at the overlapping part of the solder strip 1 and the battery sheet. The processing units in the dotting module 300 are referred to as dotting units 320, each of which includes a dotting press block 321 capable of moving relative to each other in the up-down direction Z. The dotting module 300 further includes a third base 310 having a third bearing surface 311. The dotting module 300 further includes a third driving device 330 configured to drive the dotting press block 321 to move up and down. At least part of each dotting press block 321 is located above the third bearing surface 311, and the third driving device 330 is located below the third bearing surface 311. Similar to the first positioning module 100 and the second positioning module 200, the dotting press block 321 is capable of extruding the solder strip 1 in the processing space 101 downward, and the difference is that the dotting press block 321 can provide greater pressure so that the local solder strip 1 produces plastic deformation and the thickness is thinned.

[0058] In addition, referring to Figure 13 and Figure 14 As shown, in the embodiment, the solder strip processing device further includes a cutting module 400, which is similar to but different from the above-mentioned processing modules in structure. The cutting module 400 is configured to cut the solder strip 1, and includes a plurality of cutting units 420 arranged at intervals along the second direction Y. Each cutting unit 420 includes a cutting knife, which specifically includes a first cutting knife 421 and a second cutting knife 422 capable of moving relative to each other in the second direction Y. Each cutting unit 420 is configured to cut a solder strip 1, and the solder strip 1 can enter the gap between the first cutting knife 421 and the second cutting knife 422 from above. That is, the opening of the cutting unit 420 faces upward, and when the first cutting knife 421 and the second cutting knife 422 move away from each other, the solder strip 1 can fall into the gap; and then the first cutting knife 421 and the second cutting knife 422 are driven to move close to each other to cut the solder strip 1 at this position. In the embodiment, the cutting module 400 includes a fourth base 410 having a fourth bearing surface 411. The cutting module 400 further includes a fourth driving device (not shown in the figure) configured to drive the first cutting knife 421 and the second cutting knife 422 to move relative to each other. At least part of the first cutting knife 421 and the second cutting knife 422 is located above the fourth bearing surface 411, and the fourth driving device is located below the fourth bearing surface 411, so as not to affect the solder strip 1 entering each cutting unit 420 from above.

[0059] In other embodiments, the structure of each cutting unit 420 in the cutting module 400 can also be slightly changed, and the first cutting knife 421 and the second cutting knife 422 are changed to be spaced apart in the up-down direction and can move relative to each other in the up-down direction Z to achieve cutting. At this time, the opening of the gap between the two changes to the side facing the second direction Y, so that each cutting unit 420 can have a "half-enclosed" structure similar to the processing space 101 of the processing unit described above.

[0060] Referring to Figures 1 to 4 As shown, in the embodiment, the first bearing surface 111, the second bearing surface 211, the third bearing surface 311, and the fourth bearing surface 411 are all located in the same horizontal plane, so that each welding strip 1 can be supported at the same height to ensure stable placement during processing.

[0061] Referring to Figures 1 to 4 As shown, in the embodiment, the welding strip processing device further comprises a limiting module 500, and the limiting module 500 has at least two limiting modules 500 spaced apart along the first direction X, and at least one processing module is arranged between the two limiting modules 500. Specifically, each limiting module 500 comprises a plurality of limiting assemblies 510 spaced apart along the second direction Y, and the plurality of limiting assemblies 510 correspond one-to-one to the plurality of processing units in each processing module along the first direction X. Each limiting assembly 510 comprises two limiting posts 511 spaced apart along the second direction Y, and the welding strip 1 can enter the gap between the two limiting posts 511 from top to bottom. In the embodiment, the limiting module 500 has two limiting modules 500, and the gap between the two limiting posts 511 in each limiting assembly 510 is small, so that the welding strip 1 can be limited in the second direction Y, and the welding strip 1 can be roughly positioned from both ends.

[0062] Referring to Figures 1 to 4 As shown, in the embodiment, along the first direction X gradually away from the welding strip roll, one limiting module 500, the second positioning module 200, the dotting module 300, the first positioning module 100, the other limiting module 500, and the cutting module 400 in the welding strip processing device are sequentially arranged. When the welding strip 1 is pulled out from the welding strip roll, only the two ends of the pulled-out part need to be clamped into the corresponding limiting assemblies 510 in the two limiting modules 500, so that the welding strip 1 can be roughly positioned as a whole, and the other part of the welding strip 1 can be placed arbitrarily. Then, the operator only needs to push the welding strip 1 between the two limiting modules 500 into the processing space 101 of the corresponding processing unit of each processing module, so that the welding strip 1 can be accurately positioned, which is fast, accurate and reliable, and greatly saves manpower and time.

[0063] To sum up, the welding strip processing device provided by the embodiment sets the processing units in each processing module as a "semi-enclosed" structure, and transfers most of the processing mechanisms to the lower side of the groove body, which is convenient for operation, is conducive to improving the processing quality of the welding strip 1, and further improves the production efficiency and product quality of the entire battery string.

[0064] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made in accordance with the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A solder strip handling device for handling a plurality of solder strips extending in a first direction, the plurality of solder strips being spaced apart in a second direction, the second direction being perpendicular to the first direction, characterized in that: The solder strip processing device comprises a plurality of processing modules, the plurality of processing modules are arranged at intervals along the first direction, each processing module comprises a plurality of processing units, the plurality of processing units in each processing module are arranged at intervals along the second direction, each processing unit is used for processing a solder strip, and the processing units in different processing modules correspond to each other along the first direction; each processing unit has a processing space for accommodating part of the solder strip, the processing space penetrates along the first direction, the processing space has an opening through which the solder strip can enter along a radial direction of the solder strip, and the opening is directed to one side of the second direction; in the same processing module, the openings of all the processing spaces are directed to the same side of the second direction, and the solder strip can enter a gap between two processing units from top to bottom and then enter the processing space from the opening; The processing module comprises a base, the base has a bearing surface, the processing space is located above the bearing surface, each processing unit comprises a moving part, the moving part can move relatively in the processing space, and the processing module further comprises a driving device for driving the moving part to move relatively, and the driving device is located below the bearing surface; The plurality of processing modules comprise a dotting module, the dotting module is used for locally thinning the solder strip, the processing units in the dotting module are dotting units, and each dotting unit comprises a dotting pressing block capable of moving relatively in the up-down direction; The solder strip processing device comprises a limiting module, the limiting module has at least two limiting modules arranged at intervals along the first direction, at least one processing module is arranged between the two limiting modules, each limiting module comprises a plurality of limiting assemblies arranged at intervals along the second direction, the plurality of limiting assemblies correspond to the plurality of processing units in each processing module along the first direction, each limiting assembly comprises two limiting columns arranged at intervals along the second direction, and the solder strip can enter a gap between the two limiting columns from top to bottom.

2. The solder strip handling apparatus of claim 1, wherein: The plurality of processing modules comprise one or more of a first positioning module, a second positioning module, and a cutting module, wherein, The first positioning module is used for positioning a part of the solder strip, the processing units in the first positioning module are first positioning units, and each first positioning unit comprises a first pressing part capable of moving relatively in the up-down direction; The second positioning module is used for positioning another part of the solder strip, the processing units in the second positioning module are second positioning units, and each second positioning unit comprises a second pressing part capable of moving relatively in the up-down direction; The cutting module is used for cutting the solder strip, the processing units in the cutting module are cutting units, and each cutting unit comprises a cutting knife.

3. The solder strip handling apparatus of claim 2, wherein: In all the processing modules, the openings of all the processing spaces are directed to the same side of the second direction.

4. The solder strip handling apparatus of claim 2, wherein: The plurality of processing modules include the first positioning module, the dotting module and the second positioning module, the first positioning module, the dotting module and the second positioning module are sequentially arranged along the first direction, and the second positioning module is arranged in relative motion along the first direction.

5. The solder strip handling apparatus of claim 2, wherein: The first positioning module includes a first base having a first bearing surface, and further includes a first driving device for driving the first pressing members to move up and down, at least part of each first pressing member being located above the first bearing surface, and the first driving device being located below the first bearing surface. And / or, The second positioning module includes a second base having a second bearing surface, and further includes a second driving device for driving the second pressing members to move up and down, at least part of each second pressing member being located above the second bearing surface, and the second driving device being located below the second bearing surface. The dotting module includes a third base having a third bearing surface, and further includes a third driving device for driving the dotting pressing blocks to move up and down, at least part of each dotting pressing block being located above the third bearing surface, and the third driving device being located below the third bearing surface.

6. The solder strip handling device of claim 1, wherein: The solder strip processing device includes a cutting module, the cutting module includes a plurality of cutting units, the plurality of cutting units are arranged at intervals along the second direction, each cutting unit includes a first cutting knife and a second cutting knife, the first cutting knife and the second cutting knife can move towards or away from each other along the second direction, and each cutting unit is used for cutting a solder strip, the solder strip can enter the gap between the first cutting knife and the second cutting knife from above.

7. The solder strip handling device of claim 6, wherein: The cutting module includes a fourth base having a fourth bearing surface, and further includes a fourth driving device for driving the first cutting knife and the second cutting knife to move relative to each other, at least part of the first cutting knife and the second cutting knife being located above the fourth bearing surface, and the fourth driving device being located below the fourth bearing surface.

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