A method, device and readable storage medium for adjusting a tool path

Abstract

The application provides a method, device and readable storage medium for adjusting a tool path. The method comprises: acquiring position information of a positioning mark of a to-be-divided circuit board by using a camera device; determining a deviation parameter according to the position information of the positioning mark and position information of a reference mark, the reference mark being located on a reference circuit board, and the position information of the positioning mark and the position information of the reference mark being position information in a rectangular coordinate system; and adjusting a reference tool path according to the deviation parameter and position deviation information between the camera device and a tool, adjusting the reference tool path to obtain a new tool path of the to-be-divided circuit board. The application can realize adjustment of the reference tool path according to the deviation parameter and the position deviation information between the camera device and the tool based on the rectangular coordinate system, so as to obtain a precise new tool path of the to-be-divided circuit board, accurately cut the to-be-divided circuit board by using the tool, and improve the cutting precision of the tool.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of computer technology, and particularly relates to a method for adjusting a tool path, a device and a readable storage medium. BACKGROUND

[0002] When a circuit board is processed, the circuit board is placed on a bearing table, and a required tool path on the circuit board is opposite to a tool moving direction of a processing tool. Then, the processing tool is moved along the direction of the tool path based on a vision system to realize cutting of the circuit board. However, in the cutting process, the processing tool has poor control precision, and thus cutting effect is unstable. SUMMARY

[0003] Embodiments of the present application provide a method and device for adjusting a tool path, an electronic device, a readable storage medium and a computer program product, which can solve the problem of poor tool control precision.

[0004] In a first aspect, a method for adjusting a tool path is provided, comprising:

[0005] acquiring position information of a positioning mark of a to-be-cut circuit board by using a camera device;

[0006] determining a deviation parameter according to the position information of the positioning mark and position information of a reference mark, the reference mark being located on a reference circuit board, and the position information of the positioning mark and the position information of the reference mark being position information in a rectangular coordinate system;

[0007] adjusting a reference tool path according to the deviation parameter and position deviation information between the camera device and a tool to obtain a new tool path of the to-be-cut circuit board, the reference tool path being used for cutting the reference circuit board, and the new tool path being used for cutting the to-be-cut circuit board.

[0008] Optionally, the determining of the deviation parameter according to the position information of the positioning mark and the position information of the reference mark comprises:

[0009] determining a positioning difference value according to the position information of the positioning mark;

[0010] determining a reference difference value according to the position information of the reference mark;

[0011] determining a trigonometric function value based on a deviation angle based on a preset deviation formula according to the positioning difference value and the reference difference value, the trigonometric function value being the deviation parameter.

[0012] Optionally, the preset deviation formula comprises:

[0013]

[0014] wherein, θ is the deviation angle, (x0, y0) is the reference difference value, and (x1, y1) is the positioning difference value.

[0015] Optionally, the reference tool path is adjusted according to the deviation parameter and the position deviation information between the camera device and the tool to obtain a new tool path of the circuit board to be cut.

[0016] For each reference cutting point on the reference tool path, the position information of a corresponding new cutting point is determined according to the trigonometric function value, the position information of the reference cutting point, and the position deviation information between the camera device and the tool.

[0017] The new tool path is generated according to the position information of the new cutting point.

[0018] Optionally, the position information of the new cutting point is calculated according to the following formula:

[0019] x n1 =x n0 *cosθ-y n0 *sinθ+x ref 、y n1 =y n0 *cosθ+x n0 *sinθ+y ref ;

[0020] wherein, (x n0 , y n0 ) is the position information of the reference cutting point, (x n1 , y n1 ) is the position information of the new cutting point, and (x ref , y ref ) is the position deviation information.

[0021] Optionally, before adjusting the reference tool path according to the deviation parameter and the position deviation information between the camera device and the tool, the method further comprises:

[0022] acquiring first position information of the moving module when the moving module is controlled to move to a first target position, the first position information of the moving module being position information of the moving module when the reference mark is located at the center of the camera range of the camera device;

[0023] acquiring second position information of the moving module when the moving module is controlled to move to a second target position, the second position information of the moving module being position information of the moving module when the vertex of the tool coincides with the reference mark;

[0024] determine the position deviation information according to the first position information and the second position information of the mobile module;

[0025] The camera device and the tool are mounted on the mobile module.

[0026] Optionally, before the position information of the positioning mark of the circuit board to be cut is acquired by the camera device, the method further includes:

[0027] The pixel coordinates and corresponding physical coordinates of the plurality of calibration marks are acquired.

[0028] The camera device is calibrated according to the pixel coordinates and corresponding physical coordinates of the calibration marks.

[0029] In a second aspect, an apparatus for adjusting a tool path is provided, and the apparatus includes:

[0030] A position acquisition module is configured to acquire position information of a positioning mark of a circuit board to be cut by a camera device.

[0031] A parameter determination module is configured to determine a deviation parameter according to the position information of the positioning mark and position information of a reference mark, the reference mark being located on a reference circuit board, and the position information of the positioning mark and the position information of the reference mark being position information in a rectangular coordinate system.

[0032] A path adjustment module is configured to adjust a reference tool path according to the deviation parameter and position deviation information between the camera device and a tool, to obtain a new tool path of the circuit board to be cut, the reference tool path being used to cut the reference circuit board, and the new tool path being used to cut the circuit board to be cut.

[0033] In a third aspect, an electronic device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the method of any one of the first aspect when executing the computer program.

[0034] In a fourth aspect, a computer readable storage medium is provided, and the computer readable storage medium stores a computer program, and the computer program is executable on a processor to implement the method of any one of the first aspect.

[0035] In a fifth aspect, a computer program product is provided, and when the computer program product is executed on an electronic device, the electronic device executes the method of any one of the first aspect.

[0036] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0037] The embodiment of the present application obtains position information of a positioning mark of a circuit board to be segmented by a camera device; determines a deviation parameter according to the position information of the positioning mark and position information of a reference mark, the reference mark being located on a reference circuit board, the position information of the positioning mark and the position information of the reference mark being position information in a rectangular coordinate system; adjusts a reference tool path according to the deviation parameter and position deviation information between the camera device and a tool, adjusts the reference tool path, and obtains a new tool path of the circuit board to be segmented, so that the reference tool path is adjusted according to the deviation parameter and the position deviation information between the camera device and the tool based on the rectangular coordinate system, a precise new tool path of the circuit board to be segmented is obtained, the tool precisely cuts the circuit board to be segmented, and the cutting precision of the tool is improved.

[0038] It can be understood that the beneficial effects of the second aspect to the fifth aspect can be referred to the related description in the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0040] Figure 1 is a schematic diagram of the first part of the segmentation system provided by an embodiment of the present application;

[0041] Figure 2 is a schematic diagram of the second part of the segmentation system provided by an embodiment of the present application;

[0042] Figure 3 is an enlarged view of A in Figure 2

[0043] Figure 4 is a first flowchart of the method for adjusting the tool path provided by an embodiment of the present application;

[0044] Figure 5 is a second flowchart of the method for adjusting the tool path provided by an embodiment of the present application;

[0045] Figure 6 is a schematic diagram of the distance invariance principle provided by an embodiment of the present application;

[0046] Figure 7 is a structural schematic diagram of the device for adjusting the tool path provided by an embodiment of the present application;

[0047] Figure 8 ​FIG. 1 is a structural schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0048] In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular architectures, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application can be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known methods, devices, circuits, and

[0049] It is to be understood that the terminology "includes", "has", "holds", "contains" and / or "comprising", "including", "having" and their conjugates, as used herein, means "including but not limited to", and not to the exclusion of any other term or aspect.

[0050] It is also to be understood that the terminology "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items, as well as to the

[0051] As used in the description of the application and the appended claims, the term "if" can be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting" depending on the context. Similarly, the phrase "if it is determined" or "if [a described condition or event] is detected" can be interpreted to mean "upon determining" or "in response to determining" or "upon detecting [the described condition or event]" or "in response to detecting [the described condition or event]".

[0052] In addition, the terms "first", "second", "third", etc. as used in the description of the application and the appended claims are not used to denote or imply relative importance but are used to distinguish one element from another.

[0053] Reference throughout this specification to "one embodiment", "an embodiment", or "a specific embodiment", means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, appearances of the phrases "in one embodiment", "in an embodiment", "in some embodiments", "in other embodiments", "in additional embodiments", and so on, do not necessarily all refer to the same embodiment, unless otherwise indicated. The terms "including", "containing", "comprising", "having" and variations thereof, mean "including but not limited to", unless expressly specified otherwise.

[0054] The method for adjusting the tool path provided in the embodiments of the present application is applied to a circuit board splitting system. Figure 1 is a schematic diagram of a first part of a splitting system provided in an embodiment of the present application. As shown in the figure, Figure 1 the splitting system comprises a circuit board splitting platform 10 and a first moving module 11 of a moving module, and the circuit board splitting platform 10 is installed on the first moving module 11 and parallel to the first moving module 11. The plane on which the circuit board splitting platform 10 is located is a working surface. Figure 2 is a schematic diagram of a second part of a splitting system provided in an embodiment of the present application. As shown in the figure, Figure 2 the splitting system further comprises a second moving module 12 of the moving module, a camera device 13 and a tool 14. The camera device 13 and the tool 14 are both installed on the second moving module 12.

[0055] In application, the first moving module is vertically installed on the second moving module. The first moving module is an X-axis module, and the second moving module is a Y-axis module. The camera device and the tool are both located below the circuit board splitting platform and perpendicular to the working surface. Correspondingly, the camera device is a downward-looking camera. In a possible implementation, the tool is a cutter head. Figure 3 is an enlarged view of A in Figure 2 . As shown in the figure, Figure 3 the top point of the tool 14 is the top point 15 of the outer peripheral teeth of the cutter head.

[0056] In the process of using the splitting system, the focus ring and the aperture of the camera device are always adjusted so that the imaging range of the camera device can clearly image.

[0057] Figure 4 is a first flowchart of a method for adjusting a tool path provided in an embodiment of the present application.

[0058] As shown in the figure, Figure 4 the method comprises the following steps.

[0059] S11: Obtain position information of a positioning mark of a circuit board to be split by a camera device.

[0060] In application, after the circuit board to be split is placed on the circuit board splitting platform, when the positioning mark of the circuit board to be split appears in the imaging range of the camera device, the electronic device obtains the position information of the positioning mark of the circuit board to be split by the camera device, and the position information is pixel coordinates. The splitting system of the circuit board comprises the electronic device.

[0061] S12: Determine a deviation parameter according to the position information of the positioning mark and the position information of a reference mark.

[0062] The reference mark is located on a reference circuit board, and the position information of the positioning mark and the position information of the reference mark are position information in a rectangular coordinate system.

[0063] In an application, the position information of the reference mark of the reference circuit board is acquired in advance. After the reference circuit board is placed on the circuit board dividing platform, the position information of the reference mark is acquired by the imaging device when the reference mark is located at the center of the imaging range, and the position information is pixel coordinates.

[0064] The pixel coordinates of the positioning mark are converted into physical coordinates, the pixel coordinates of the reference mark are converted into physical coordinates, and the deviation parameter is determined according to the physical coordinates of the positioning mark and the physical coordinates of the reference mark. The deviation parameter represents the positional deviation between the circuit board to be divided located on the platform and the reference circuit board located on the platform, and the deviation parameter is used to adjust the reference tool path.

[0065] S13: adjusting the reference tool path according to the deviation parameter and the positional deviation information between the imaging device and the tool, to obtain a new tool path of the circuit board to be divided.

[0066] The reference tool path is used to divide the reference circuit board, and the new tool path is used to divide the circuit board to be divided.

[0067] In an application, the positional deviation information between the imaging device and the tool is determined in advance. In a possible implementation, the positional deviation information between the imaging device and the tool is determined, comprising:

[0068] S21: acquiring first position information of the moving module when the moving module is controlled to move to a first target position.

[0069] The first target position is the position of the moving module when the reference mark is located at the center of the imaging range of the imaging device. The first position information of the moving module is the position information of the moving module when the reference mark is located at the center of the imaging range of the imaging device.

[0070] In a possible implementation, the reference mark can be a reference mark on the reference circuit board.

[0071] S22: acquiring second position information of the moving module when the moving module is controlled to move to a second target position.

[0072] The second target position is the position of the moving module when the vertex of the tool coincides with the reference mark. The second position information of the moving module is the position information of the moving module when the vertex of the tool coincides with the reference mark.

[0073] The first position information and the second position information of the moving module are physical coordinates.

[0074] S23: determining the positional deviation information according to the first position information and the second position information of the moving module.

[0075] The position deviation information is also position information in the rectangular coordinate system.

[0076] It can be understood that the cutting system applies the rectangular coordinate system, which includes positioning in the X-axis and Y-axis. Under the visual guidance and motion control of the camera equipment, high-precision positioning and cutting can be achieved, and the working range of the cutting system becomes flexible, with the function of flexible adjustment according to actual conditions.

[0077] The embodiment obtains position information of a positioning mark of the circuit board to be cut; determines a deviation parameter according to the position information of the positioning mark and position information of a reference mark, the reference mark being located on a reference circuit board, the position information of the positioning mark and the position information of the reference mark being position information in a rectangular coordinate system; adjusts a reference tool path according to the deviation parameter and position deviation information between the camera equipment and the tool, adjusts the reference tool path, obtains a new tool path of the circuit board to be cut, and realizes adjustment of the reference tool path according to the deviation parameter and the position deviation information between the camera equipment and the tool based on the rectangular coordinate system, to obtain a precise new tool path of the circuit board to be cut, so that the tool can precisely cut the circuit board to be cut and improve the cutting precision of the tool.

[0078] Figure 5 is a second flowchart of the rectangular coordinate system method provided by an embodiment of the present application. As shown in Figure 5 , step S12 includes:

[0079] S121: determining a positioning difference value according to the position information of the positioning mark.

[0080] In application, the pixel coordinates of the positioning mark are converted into physical coordinates, and the positioning difference value is determined according to the physical coordinates of the positioning mark.

[0081] S122: determining a reference difference value according to the position information of the reference mark.

[0082] In application, the pixel coordinates of the reference mark are converted into physical coordinates, and the reference difference value is determined according to the physical coordinates of the reference mark.

[0083] S123: determining a trigonometric function value based on a deviation angle based on the positioning difference value and the reference difference value based on a preset deviation formula, the trigonometric function value being the deviation parameter.

[0084] In application, the preset deviation formula includes:

[0085]

[0086] wherein θ is the deviation angle, (x0, y0) is the reference difference value, and (x1, y1) is the positioning difference value.

[0087] Figure 6is a schematic diagram of the distance invariance principle provided by an embodiment of the present application. As shown in Figure 6 the original angle of the point After the point is rotated by an angle θ around the origin of the coordinate system, the distance r of the point to the origin is invariant. The preset deviation formula is determined according to the principle. Specifically, the positioning deviation is expressed by using a trigonometric formula:

[0088]

[0089]

[0090] wherein r is the distance of the point to the origin, is the original angle of the point.

[0091] The reference deviation is expressed by using a trigonometric formula:

[0092] Based on the invariance of the distance after rotation, the following is obtained:

[0093]

[0094]

[0095] Further derivation obtains:

[0096]

[0097]

[0098]

[0099] y1*x0=x1*y0+y0 2 *sinθ+x0 2 *sinθ;

[0100] For example, two reference marks, mark1 and mark2, are arranged on the reference circuit board. When mark1 is located at the center of the imaging range of the imaging device, the position information (x a0 , y a0 ) of mark1 is acquired by the imaging device, and (x a0 , y a0 ) are pixel coordinates. When mark2 is located at the center of the imaging range of the imaging device, the position information (x a1 , y a1 ) of mark2 is acquired by the imaging device, and (x a1 , y a1 ) are pixel coordinates. The calculation formula of the reference deviation is: x0=x a1 -x a0 , y0=y a1 -ya0 The pixel coordinates of mark1 and mark2 are converted into physical coordinates, and the reference difference value is calculated according to the physical coordinates of mark1 and mark2.

[0101] Two positioning marks, mark1' and mark2', are arranged on the circuit board to be segmented. When mark1' is located in the imaging range of the imaging device, the position information (x b0 , y b0 ) of mark1' is acquired by the imaging device, and (x b0 , y b1 ) are pixel coordinates. When mark2' is located in the imaging range of the imaging device, the position information (x b1 , y b1 ) of mark1' is acquired by the imaging device, and (x b1 , y b1 ) are pixel coordinates. The calculation formula of the positioning difference value is: x1=x b0 -x b1 , y1=y b0 -y n0 . The pixel coordinates of mark1' and mark2' are converted into physical coordinates, and the positioning difference value is calculated according to the physical coordinates of mark1' and mark2'.

[0102] The mark can be moved by controlling the movement module, or the mark can be moved by manually controlling the reference circuit board.

[0103] The reference difference value and the positioning difference value are substituted into the preset deviation formula to obtain the trigonometric value.

[0104] Correspondingly, step S13 comprises:

[0105] S131: For each reference segmentation point on the reference tool path, according to the trigonometric value, the position information of the reference segmentation point, and the position deviation information between the imaging device and the tool, the position information of the corresponding new segmentation point is determined.

[0106] In application, the position information of the reference segmentation point on the reference tool path is acquired in advance. When the reference segmentation point is located at the center of the imaging range of the imaging device, the position information (x n0 , y n0 ) of the movement module is acquired, and the position information of the movement module is the position information of the reference segmentation point.

[0107] The trigonometric value, the position information of the reference segmentation point, and the position deviation information between the imaging device and the tool are substituted into the calculation formula of the position information of the new segmentation point to obtain the position information of the new segmentation point, and the position of the new segmentation point is the position information of the movement module.

[0108] The calculation formula of the position information of the new split point is as follows:

[0109]

[0110]

[0111] wherein (x n0 , y n0 ) is the position information of the reference split point, (x n1 , y n1 ) is the position information of the new split point, and (x ref , y ref ) is the position deviation information.

[0112] S132: generating a new tool path according to the position information of the new split point.

[0113] It can be understood that the position information of the positioning mark of the circuit board to be split is obtained, and the camera device and the tool are always perpendicular to the working surface, and the position information of the new split point is obtained through the calculation formula of the new split point, and the X axis and the Y axis of the moving module are moved according to the position information, so that the correct tool path cutting of the circuit board to be split can be completed.

[0114] The embodiment is based on the rectangular coordinate system, and the position information of the corresponding new split point is determined according to the trigonometric function value, the position information of the reference split point, and the position deviation information between the camera device and the tool, so that the new tool path of the circuit board to be split can be obtained more accurately, the cutting precision of the tool is improved, and the cutting of circuit boards of different types and sizes is suitable, and the time for changing the tool is saved.

[0115] In one embodiment, before step S11, the method further comprises:

[0116] S31: obtaining pixel coordinates and corresponding physical coordinates of a plurality of calibration marks.

[0117] The physical coordinates of the calibration mark are the actual coordinates of the calibration mark in the cutting system.

[0118] S32: calibrating the camera device according to the pixel coordinates and the corresponding physical coordinates of the calibration mark.

[0119] In application, the parameter matrix of the camera device is determined according to the pixel coordinates and the corresponding physical coordinates of the calibration mark, and the conversion relationship between the pixel coordinate system and the physical size coordinate system of the camera device is established through the parameter matrix.

[0120] The embodiment can obtain the conversion relationship between the pixel coordinate system and the physical size coordinate system accurately by calibrating the camera device according to the pixel coordinates and the corresponding physical coordinates of the calibration mark.

[0121] It should be understood that the size of the serial number of each step in the above embodiments does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0122] Corresponding to the method described in the above embodiments, only the part related to the embodiments of the present application is shown for the convenience of description.

[0123] Figure 7 is a structural schematic diagram of the device for adjusting the tool path provided by an embodiment of the present application. As shown in Figure 7 The device comprises:

[0124] The position acquisition module 20 is configured to acquire position information of a positioning mark of the circuit board to be segmented by the camera device.

[0125] The parameter determination module 21 is configured to determine a deviation parameter according to the position information of the positioning mark and the position information of the reference mark, the reference mark being located on a reference circuit board, and the position information of the positioning mark and the position information of the reference mark being position information in a rectangular coordinate system.

[0126] The path adjustment module 22 is configured to adjust a reference tool path according to the deviation parameter and position deviation information between the camera device and the tool, to obtain a new tool path for the circuit board to be segmented, the reference tool path being used for segmenting the reference circuit board, and the new tool path being used for segmenting the circuit board to be segmented.

[0127] In one embodiment, the parameter determination module is specifically configured to determine a positioning difference value according to the position information of the positioning mark, determine a reference difference value according to the position information of the reference mark, and determine a trigonometric function value based on a deviation angle based on a preset deviation formula according to the positioning difference value and the reference difference value, the trigonometric function value being the deviation parameter.

[0128] In one embodiment, the path adjustment module is specifically configured to, for each reference cutting point on the reference tool path, determine position information of a corresponding new cutting point according to the trigonometric function value, position information of the reference cutting point, and position deviation information between the camera device and the tool, and generate the new tool path according to the position information of the new cutting point.

[0129] In one embodiment, the device further comprises:

[0130] The position deviation determination module is used to: acquire first position information of the moving module when it is controlled to move to a first target position (the first position information is the position information of the moving module when the reference mark is located at the center of the camera's field of view); acquire second position information of the moving module when it is controlled to move to a second target position (the second position information is the position information of the moving module when the vertex of the tool coincides with the reference mark); and determine position deviation information based on the first and second position information of the moving module.

[0131] The camera equipment and the cutting tools are mounted on the mobile module.

[0132] In one embodiment, the apparatus further includes:

[0133] The calibration module is used to obtain the pixel coordinates and corresponding physical coordinates of multiple calibration marks; and to calibrate the camera device based on the pixel coordinates and corresponding physical coordinates of the calibration marks.

[0134] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 8 As shown, the electronic device 3 of this embodiment includes: at least one processor 30 ( Figure 8 (Only one is shown in the diagram), memory 31, and computer program 32 stored in said memory 31 and executable on said at least one processor 30, wherein said processor 30 executes said computer program 32 to implement the steps in any of the above method embodiments.

[0135] The electronic device 3 can be a desktop computer, laptop, handheld computer, or cloud server, etc. The electronic device 3 may include, but is not limited to, a processor 30 and a memory 31. Those skilled in the art will understand that... Figure 8 This is merely an example of electronic device 3 and does not constitute a limitation on electronic device 3. It may include more or fewer components than shown in the figure, or combine certain components, or different components. For example, it may also include input / output devices, network access devices, etc.

[0136] The processor 30 can be a central processing unit (CPU), and can also be other general-purpose processors, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.

[0137] The memory 31 can be an internal storage unit of the electronic device 3 in some embodiments, for example, a hard disk or a memory of the electronic device 3. The memory 31 can also be an external storage device of the electronic device 3 in other embodiments, for example, a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. Further, the memory 31 can include both the internal storage unit and the external storage device of the electronic device 3. The memory 31 is used to store an operating system, an application program, a boot loader, data and other programs, for example, program codes of the computer program, etc. The memory 31 can also be used to temporarily store data that has been output or is to be output.

[0138] It should be noted that the information interaction, execution process, etc. between the above apparatuses / units, since based on the same concept as the method embodiments of the present application, the specific functions and the brought technical effects can be referred to the method embodiments part, and will not be described here in detail.

[0139] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the above-mentioned division of each functional unit and module is exemplified, and in actual application, the above-mentioned functions can be completed by different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or software functional unit. In addition, the specific name of each functional unit and module is only for easy distinction, and does not limit the protection scope of the application. The specific working process of the unit and module in the system can refer to the corresponding process in the foregoing method embodiment, which will not be described here.

[0140] The embodiment of the application further provides a computer readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in each of the method embodiments described above can be implemented.

[0141] The embodiment of the application provides a computer program product. When the computer program product is run on an electronic device, the steps in each of the method embodiments described above can be implemented.

[0142] The integrated unit, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on this understanding, all or part of the processes in the above-mentioned embodiment methods can be completed by a computer program instructing related hardware, and the computer program can be stored in a computer readable storage medium. When the processor executes the computer program, the steps in each of the method embodiments described above can be implemented. The computer program includes computer program code, which can be in the form of source code, object code, executable file or some intermediate form. The computer readable medium at least includes any entity or device capable of carrying the computer program code to the photographing device / terminal equipment, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal and software distribution medium. For example, U disk, mobile hard disk, magnetic disk or optical disk, etc. In some jurisdictions, according to legislation and patent practice, the computer readable medium cannot be an electrical carrier signal and a telecommunication signal.

[0143] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0144] Those skilled in the art can understand that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0145] In the embodiments provided in the present application, it should be understood that the disclosed apparatus / network device and method can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely schematic, for example, the division of the modules or units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed each other can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.

[0146] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiments of the present application.

[0147] The above described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A method for adjusting toolpath trajectory, characterized in that, include: The location information of the positioning marks on the circuit board to be segmented is obtained through a camera device; The deviation parameter is determined based on the position information of the positioning mark and the position information of the reference mark. The reference mark is located on the reference circuit board, and the position information of the positioning mark and the position information of the reference mark are position information in a Cartesian coordinate system. When the control module moves to the first target position, the first position information of the mobile module is obtained. The first position information of the mobile module is the position information of the mobile module when the reference mark is located at the center of the camera range of the camera device. The camera device and the cutter are mounted on the mobile module. When the moving module is controlled to move to the second target position, the second position information of the moving module is obtained. The second position information of the moving module is the position information of the moving module when the vertex of the tool coincides with the reference mark. Based on the first position information and the second position information of the mobile module, determine the positional deviation information between the camera device and the cutting tool; Based on the deviation parameters and the positional deviation information between the camera device and the cutting tool, the reference toolpath is adjusted to obtain a new toolpath for the circuit board to be divided. The reference toolpath is used to cut the reference circuit board, and the new toolpath is used to cut the circuit board to be divided.

2. The method according to claim 1, characterized in that, The step of determining the deviation parameter based on the position information of the positioning marker and the position information of the reference marker includes: The positioning difference is determined based on the location information of the positioning marker; The reference difference is determined based on the position information of the reference mark; Based on a preset deviation formula, a trigonometric function value based on the deviation angle is determined according to the positioning difference and the reference difference, and the trigonometric function value is the deviation parameter.

3. The method according to claim 2, characterized in that, The preset deviation formula includes: 、 ； Wherein, θ is the deviation angle, (x0, y0) is the reference difference, and (x1, y1) is the positioning difference.

4. The method according to claim 3, characterized in that, Based on the deviation parameters and the positional deviation information between the camera device and the cutting tool, the reference toolpath is adjusted to obtain a new toolpath for the circuit board to be divided, including: For each reference cutting point on the reference toolpath trajectory, the position information of the corresponding new cutting point is determined based on the trigonometric function value, the position information of the reference cutting point, and the position deviation information between the camera device and the tool. The new toolpath trajectory is generated based on the location information of the new cutting point.

5. The method according to claim 4, characterized in that, The formula for calculating the location information of the new cutting point is as follows: 、 ； Wherein, (xn0, yn0) are the position information of the reference cutting point, (xn1, yn1) are the position information of the new cutting point, and (xref, yref) are the position deviation information.

6. The method according to claim 1, characterized in that, Before acquiring the position information of the positioning marks on the circuit board to be segmented through the camera device, the method further includes: Obtain the pixel coordinates and corresponding physical coordinates of multiple calibration markers; The camera device is calibrated based on the pixel coordinates of the calibration mark and the corresponding physical coordinates.

7. A device for adjusting the toolpath trajectory, characterized in that, include: The position acquisition module is used to acquire the position information of the positioning marks on the circuit board to be segmented through a camera device; The parameter determination module is used to determine the deviation parameter based on the position information of the positioning mark and the position information of the reference mark. The reference mark is located on the reference circuit board, and the position information of the positioning mark and the position information of the reference mark are position information in a Cartesian coordinate system. It is also used to: when controlling the mobile module to move to a first target position, obtain the first position information of the mobile module, wherein the first position information of the mobile module is the position information of the mobile module when the reference mark is located at the center of the camera range of the camera device, and the camera device and the cutter are mounted on the mobile module; when controlling the mobile module to move to a second target position, obtain the second position information of the mobile module, wherein the second position information of the mobile module is the position information of the mobile module when the vertex of the cutter coincides with the reference mark; Based on the first position information and the second position information of the mobile module, determine the positional deviation information between the camera device and the cutting tool; The trajectory adjustment module is used to adjust the reference toolpath trajectory according to the deviation parameter and the positional deviation information between the camera device and the cutting tool to obtain a new toolpath trajectory for the circuit board to be divided. The reference toolpath trajectory is used to cut the reference circuit board, and the new toolpath trajectory is used to cut the circuit board to be divided.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 6.

9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1 to 6.

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