Touch sensing module and electronic device

Abstract

The application provides a touch sensing module and an electronic device. The touch sensing module is provided with a driving signal line and a sensing signal line on the first side of the first substrate and the second substrate arranged oppositely. The sensing signal line includes a capacitance sensing signal line and a pressure sensing signal line. When the first substrate is touched, the capacitance sensing signal line at the corresponding position generates a first capacitance signal, realizing the capacitance touch function. When the first substrate is pressed, the relative distance between the first substrate and the second substrate changes, the capacitance sensing signal line at the corresponding position generates the first capacitance signal, and the pressure sensing signal line generates a second capacitance signal. At this time, the pressure detection function is realized by identifying the second capacitance signal. The touch sensing module does not need to additionally set a pressure sensor, thereby optimizing the thickness and overall structure of the electronic product and reducing the design cost.

Description

Technical Field

[0001] This invention belongs to the field of touch technology, and particularly relates to a touch sensing module and an electronic device. Background Technology

[0002] With the technological development of electronic devices, electronic devices are using touch modules to replace hardware devices such as keyboards, or additional touch modules are set on display modules to realize touch display functions. In order to obtain the current touch status more comprehensively, touch modules are usually also equipped with pressure sensing functions to realize pressure detection functions.

[0003] Conventional electronic devices typically incorporate additional pressure sensors placed at the bottom or periphery of the device. For example, a pressure sensor might be placed at the bottom or periphery of the touch panel in a touchscreen device or laptop, enabling both touch control and pressure detection. However, using an additional pressure sensor increases the overall thickness of the electronic device and occupies more space, which contradicts the trend towards thinner and lighter products and fails to truly integrate touch control and pressure detection into a single unit. Summary of the Invention

[0004] The purpose of this invention is to provide a touch sensing module that solves the problem of complex structure caused by the additional pressure sensor in traditional touch modules.

[0005] A first aspect of this invention provides a touch sensing module, comprising:

[0006] A first substrate and a second substrate are disposed opposite to each other along a first direction. The first substrate includes a first side facing the second substrate and a second side facing away from the second substrate. The second substrate includes a first side facing the first substrate and a second side facing away from the second substrate.

[0007] Multiple drive signal lines are disposed on a first side of the first substrate, and the multiple drive signal lines are arranged side by side along a second direction and used to input drive signals;

[0008] Multiple sensing signal lines are disposed on a first side of the second substrate. The multiple sensing signal lines include multiple capacitive sensing signal lines and multiple pressure sensing signal lines arranged side by side and interleaved in a third direction. The width of the driving signal line is greater than the width of the pressure sensing signal line.

[0009] Wherein, the first direction is perpendicular to the second direction and the third direction.

[0010] Optionally, the drive signal line includes interleaved first connecting segments and second connecting segments, the width of the first connecting segment is greater than the width of the second connecting segment, the i-th first connecting segment of the plurality of drive signal lines is aligned end to end along the second direction, and the j-th second connecting segment of the plurality of drive signal lines is aligned end to end along the second direction, where i and j are positive integers;

[0011] The capacitive sensing signal line has a U-shaped structure, and one of the capacitive sensing signal lines partially surrounds the pressure sensing signal line.

[0012] The first connecting segment overlaps with the pressure sensing signal line along the first direction;

[0013] The second connecting segment overlaps with a portion of the capacitive sensing signal line along the first direction.

[0014] Optionally, the capacitive sensing signal line includes a third connecting segment, a fourth connecting segment, and a fifth connecting segment connected in sequence, wherein the third connecting segment, the fourth connecting segment, and the fifth connecting segment form a U-shaped structure;

[0015] The third connecting segment includes an interleaved sixth connecting segment and a seventh connecting segment, wherein the width of the sixth connecting segment is greater than the width of the seventh connecting segment;

[0016] The fifth connection segment includes an interleaved eighth connection segment and a ninth connection segment. The width of the eighth connection segment is greater than the width of the ninth connection segment. The Mth sixth connection segment of the plurality of capacitive sensing signal lines is aligned end-to-end with the Mth eighth connection segment. The Nth seventh connection segment of the plurality of capacitive sensing signal lines is aligned end-to-end with the Nth ninth connection segment. Where M and N are positive integers.

[0017] The second connecting segment overlaps with the seventh connecting segment and / or the ninth connecting segment along the first direction.

[0018] Optionally, the drive signal line includes an interleaved first connection segment and a second connection segment, wherein the width of the first connection segment is greater than the width of the second connection segment, and the first connection segment has a diamond-shaped structure.

[0019] The capacitive sensing signal line includes an interleaved third connecting segment and a fourth connecting segment, wherein the width of the third connecting segment is greater than the width of the fourth connecting segment, and the third connecting segment has a diamond-shaped structure.

[0020] Along the first direction, the second connecting segment overlaps with the fourth connecting segment, while the first connecting segment and the third connecting segment do not overlap.

[0021] Optionally, the first connecting segment and the third connecting segment are of equal size.

[0022] Optionally, the touch sensing module further includes:

[0023] A transparent, non-conductive fluid is filled between the first substrate and the second substrate.

[0024] Optionally, the touch sensing module further includes a sealant that is sealed at the edge positions of the first substrate and the second substrate.

[0025] Optionally, the first substrate and the second substrate are glass substrates.

[0026] A second aspect of the present invention provides an electronic device including a driving module and a touch sensing module as described above, wherein the driving module is electrically connected to the touch sensing module.

[0027] Optionally, it also includes a display module, wherein the touch sensing module is stacked on top of the display module, and the display module is electrically connected to the driving module.

[0028] The beneficial effects of the present invention compared with the prior art are as follows: The above-mentioned touch sensing module provides driving signal lines and sensing signal lines on the first side of the first substrate and the second substrate that are arranged opposite to each other. The sensing signal lines include capacitive sensing signal lines and pressure sensing signal lines. When the first substrate is touched, the capacitive sensing signal line at the corresponding position generates a first capacitive signal, realizing the capacitive touch function. When the first substrate is pressed, the relative distance between the first substrate and the second substrate changes, the capacitive sensing signal line at the corresponding position generates a first capacitive signal, and the pressure sensing signal line generates a second capacitive signal. At this time, the pressure detection function is realized by recognizing the second capacitive signal. The touch sensing module does not need to set up an additional pressure sensor, which optimizes the thickness and overall structure of electronic products and reduces design costs. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a first structure of a touch sensing module provided in an embodiment of the present invention;

[0030] Figure 2 for Figure 1 The diagram shows a first top view of the drive signal lines and sensing signal lines in the touch sensing module.

[0031] Figure 3 This is a schematic diagram of a second structure of the touch sensing module provided in an embodiment of the present invention;

[0032] Figure 4 for Figure 3 The diagram shows the waveform of the capacitive signal in the touch sensing module.

[0033] Figure 5This is a schematic diagram of a third structure of the touch sensing module provided in an embodiment of the present invention;

[0034] Figure 6 for Figure 5 The diagram shows the waveform of the capacitive signal in the touch sensing module.

[0035] Figure 7 for Figure 2 A schematic diagram of the first structure of the drive signal line in the touch sensing module shown;

[0036] Figure 8 for Figure 2 The diagram shows a first structural schematic of the capacitive sensing signal line in the touch sensing module.

[0037] Figure 9 for Figure 1 The diagram shows a second top view of the drive signal lines and sensing signal lines in the touch sensing module.

[0038] Figure 10 for Figure 2 The diagram shows a second structural representation of the capacitive sensing signal line in the touch sensing module.

[0039] Figure 11 for Figure 1 The diagram shows a third top view of the drive signal lines and sensing signal lines in the touch sensing module.

[0040] Figure 12 for Figure 2 The diagram shows a second structural design of the drive signal line in the touch sensing module.

[0041] Figure 13 for Figure 2 The diagram shows a third structural representation of the capacitive sensing signal line in the touch sensing module.

[0042] Figure 14 for Figure 1 The diagram shows a fourth top view of the drive signal lines and sensing signal lines in the touch sensing module.

[0043] Figure 15 This is a schematic diagram of a first structure of an electronic device provided in an embodiment of the present invention;

[0044] Figure 16 This is a schematic diagram of a second structure of an electronic device provided in an embodiment of the present invention;

[0045] Figure 17 This is a schematic diagram of a third structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0046] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0047] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0048] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0050] A first aspect of the present invention provides a touch sensing module 100.

[0051] like Figure 1 As shown, the touch sensing module 100 includes:

[0052] A first substrate 10 and a second substrate 20 are disposed opposite to each other along a first direction z. The first substrate 10 includes a first side facing the second substrate 20 and a second side facing away from the second substrate 20. The second substrate 20 includes a first side facing the first substrate 10 and a second side facing away from the second substrate 20.

[0053] A plurality of drive signal lines 30 are disposed on a first side of the first substrate 10, and the plurality of drive signal lines 30 are arranged side by side along the second direction y and are used to input drive signals.

[0054] Multiple sensing signal lines are disposed on the first side of the second substrate 20. The multiple sensing signal lines include multiple capacitive sensing signal lines 40 and multiple pressure sensing signal lines 50 arranged side by side and interleaved along the third direction x. The width of the driving signal line 30 is greater than the width of the pressure sensing signal line 50.

[0055] Wherein, the first direction z is perpendicular to the second direction y and the third direction x.

[0056] In this embodiment, a certain gap is formed between the first substrate 10 and the second substrate 20 to ensure that a certain deformation can be generated when the second side of the first substrate 10 is pressed. The first side of the first substrate 10 is provided with a plurality of driving signal lines 30, which are both capacitor driving signal lines and pressure signal driving lines, and correspond to the input driving signal when working.

[0057] The first side of the second substrate 20 is provided with capacitive sensing signal lines 40 and pressure sensing signal lines 50 arranged side by side and in an alternating manner. That is, a pressure sensing signal line 50 is arranged side by side between two capacitive sensing signal lines 40, and a capacitive sensing signal line 40 is arranged side by side between two pressure sensing signal lines 50. The number of capacitive sensing signal lines 40 and pressure sensing signal lines 50 is equal, and the number of driving signal lines 30 and sensing signal lines may be equal or unequal.

[0058] like Figure 2 As shown in the left-middle figure, in the first direction z, the capacitive sensing signal line 40 and the pressure sensing signal line 50 intersect and overlap with the drive signal line 30, which can be equivalent to... Figure 2 The two touch sensing units shown in the right figure generate corresponding capacitance signals under different touch actions.

[0059] Meanwhile, the thickness of the first substrate 10 is kept as thin as possible within a certain range, such as 0.55mm, so that when the first substrate 10 is pressed, it is easier for the first substrate 10 to be deformed by force and the effective force radius is small. Within a certain range, theoretically, the smaller the effective force radius, the more the sensing signal line will generate an approximately spike-like capacitance signal when sensing the force on the first substrate 10, which is easier for the driving module 200 to identify and analyze, and thus easier to determine and provide the pressing position coordinates to the terminal. If the first substrate 10 is thicker, when the first substrate 10 is pressed, it is not easy for the first substrate 10 to be deformed by force and the effective force radius is larger. The sensing signal line will generate a large area of ​​approximately trapezoidal capacitance signal when sensing the force on the first substrate 10, which is not easy for the driving module 200 to identify and analyze.

[0060] From the first direction z, the pressure sensing signal line 50 is blocked by the driving signal line 30. The driving signal line 30 serves to shield the capacitance signal of the pressure sensing signal line 50, so as to avoid the pressure sensing signal line 50 also generating a first capacitance signal when the second side of the first substrate 10 is touched (with slight force, different from pressing).

[0061] The touch sensing module 100 utilizes the electrical current sensing of the human body for touch operation, for example, Figure 3 and Figure 4 As shown, when a finger touches the second side of the first substrate 10, as Figure 4 In the diagram above, the drive signal line 30 generates a first capacitance signal on the capacitance sensing signal line 40 when a finger touches it. The pressure sensing signal line 50 also generates a first capacitance signal. Since the first capacitance signal of the pressure sensing signal line 50 is shielded by the drive signal line 30, as... Figure 4 As shown in the figure below, the electric field does not penetrate to the top of the first substrate 10, and no signal is generated. At this time, the capacitive touch function is realized. The driving module 200 determines the touch position according to the position of the first capacitive signal output by the capacitive sensing signal line 40, and performs the corresponding signal processing or module control work.

[0062] like Figure 5 and Figure 6 As shown, when a finger presses the first substrate 10, the first substrate 10 deforms under force, and the relative distance between the first substrate 10 and the second substrate 20 decreases, as... Figure 6 As shown in the figure above, the capacitive sensing signal line 40 continues to generate the first capacitive signal to realize the capacitive touch function. The driving module 200 determines the touch position according to the position of the first capacitive signal output by the capacitive sensing signal line 40 and performs corresponding signal processing or module control work.

[0063] Meanwhile, the pressure sensing signal line 50 is closer to the drive signal line 30 due to the reduced distance, such as Figure 6 As shown in the figure below, the change generates a second capacitance signal. At this time, the drive module 200 analyzes and processes the second capacitance signal generated by the pressure sensing signal line 50 to determine the position coordinates of the finger pressing. At this time, the pressure detection function is realized. At the same time, when the first substrate 10 is pressed at different positions with different forces, the distance between the pressure sensing signal line 50 and the drive signal line 30 changes, generating second capacitance signals of different sizes. The drive module 200 analyzes the different position coordinates based on the second capacitance signals of different sizes, thereby realizing the pressure detection function of different forces.

[0064] Among them, corresponding to Figure 4 and Figure 6As shown, the first capacitor signal is greater than the second capacitor signal. Optionally, the first capacitor signal is a positive capacitor signal and the second capacitor signal is a negative capacitor signal.

[0065] In this embodiment, capacitive touch and pressure detection are integrated into a single touch sensing module 100. This achieves both capacitive touch and pressure detection without requiring additional pressure sensors and circuitry, effectively reducing the space occupied by the touch sensing module 100 and avoiding increased product thickness. It also saves on the cost of purchasing additional pressure sensors and circuitry. Furthermore, it addresses the limitation of traditional capacitive touchscreens that only support 2D touch. By integrating capacitive touch and pressure detection, in addition to supporting traditional 2D capacitive touch, another dimension of touch (the first z-direction), namely pressure detection, is added, thus enabling 3D touch functionality.

[0066] The first substrate 10 and the second substrate 20 can be made of materials such as plastic or glass, depending on the requirements. Optionally, in order to improve visibility, each substrate is made of glass, and its impedance, thickness and transmittance are similar to those of PET substrate.

[0067] Optionally, the drive signal line 30 and the sensing signal line are externally connected to the flexible circuit board and packaged, and connected to the integrated control bus of the drive module 200 through the flexible circuit board. When packaging each signal line, all signal lines can be packaged together, or a segmented packaging method can be used. The specific packaging method and production process can be flexibly selected according to the packaging equipment used.

[0068] When the drive signal line 30 and the sensing signal line are both external signal lines bonded and packaged with the flexible circuit board, an anisotropic conductive adhesive is used for bonding. In terms of manufacturing processes, this packaging method results in a smaller connection area with the flexible circuit board, requiring less space. Alternatively, bonding can be achieved through soldering, which results in a larger connection area, or through a special adhesive layer, with a connection area falling between the two methods. In actual production, a suitable packaging method can be flexibly selected, not limited to the methods mentioned above. Any bonding packaging method that allows each channel to be smoothly connected to the integrated control bus through the flexible circuit board is applicable.

[0069] The second direction y and the third direction x form a preset angle, such as 90° or other corresponding angles.

[0070] The drive signal line 30 and the sensing signal line can have corresponding shapes, such as strips, rhombuses, or similar shapes, and the specific shapes are not limited.

[0071] Furthermore, the touch sensing module 100 also includes a non-conductive medium filled between the first substrate 10 and the second substrate 20. The non-conductive medium can be a liquid medium or a gel-like substance. Optionally, in order to improve transparency, the non-conductive medium is a transparent non-conductive fluid, such as liquid crystal. By filling with a transparent non-conductive fluid, the reflection of light is reduced and the transmission of light is enhanced. At the same time, it also makes the first substrate 10 easier to deform under pressure when pressed.

[0072] Optionally, for the encapsulation of transparent, non-conductive fluids, such as Figure 3 and Figure 5 As shown, the touch sensing module 100 also includes a sealant 60, which seals the edges of the first substrate 10 and the second substrate 20 to prevent the leakage of transparent non-conductive fluid.

[0073] The beneficial effects of the present invention compared with the prior art are as follows: The touch sensing module 100 described above provides a driving signal line 30 and a sensing signal line on a first side of the first substrate 10 and the second substrate 20 that are disposed opposite to each other. The sensing signal line includes a capacitance sensing signal line 40 and a pressure sensing signal line 50. When the first substrate 10 is touched, the capacitance sensing signal line 40 at the corresponding position generates a first capacitance signal to realize the capacitance touch function. When the first substrate 10 is pressed, the relative distance between the first substrate 10 and the second substrate 20 changes, the capacitance sensing signal line 40 at the corresponding position generates a first capacitance signal, and the pressure sensing signal line 50 generates a second capacitance signal to realize the pressure detection function. The touch sensing module 100 does not require an additional pressure sensor, which optimizes the thickness and overall structure of electronic products and reduces design costs.

[0074] like Figures 7 to 9 As shown, optionally, the drive signal line 30 includes interleaved first connection segments 31 and second connection segments 32. The width of the first connection segment 31 is greater than the width of the second connection segment 32. The i-th first connection segment 31 of the plurality of drive signal lines 30 is aligned end to end along the second direction y, and the j-th second connection segment 32 of the plurality of drive signal lines 30 is aligned end to end along the second direction y, where i and j are positive integers.

[0075] The capacitive sensing signal line 40 has a U-shaped structure, with one capacitive sensing signal line 40 partially surrounding a pressure sensing signal line 50.

[0076] The first connecting segment 31 overlaps with the pressure sensing signal line 50 along the first direction z;

[0077] The second connecting segment 32 overlaps with a portion of the capacitive sensing signal line 40 along the first direction z.

[0078] In this embodiment, for example Figure 7As shown, the drive signal lines 30, from left to right, are the first second connection segment 32, the first first connection segment 31, the second second connection segment 32, the second first connection segment 31, the third second connection segment 32, and the third second connection segment 32, respectively. Figure 9 As shown, from top to bottom, there are the first drive signal line 30, the second drive signal line 30, and the third drive signal line 30. The first second connecting segment 32 of each is aligned end to end, and the connecting segments at the same position are aligned end to end. At the same time, in the first direction z, the second connecting segment 32 overlaps with part of the capacitive sensing signal line 40, and the first connecting segment 31 covers the pressure sensing signal line 50.

[0079] By segmenting the drive signal line 30 into connection segments of different widths, the shielding effect of the drive signal line 30 on the pressure sensing signal line 50 can be enhanced. At the same time, the magnetic field strength between the first connection segment 31 and the capacitive sensing signal line 40 is increased, thereby enhancing the first capacitive signal.

[0080] When a finger touches the second side of the first substrate 10, the second connecting segment 32 of the two adjacent driving signal lines 30 along the second direction y generates a first capacitance signal on the capacitance sensing signal lines 40 on both sides through the finger, which enhances the first capacitance signal. The pressure sensing signal line 50 also generates a first capacitance signal. Since the first connecting segment 31 covers the pressure sensing signal line 50, the first capacitance signal of the pressure sensing signal line 50 is shielded by the driving signal line 30, and the electric field does not penetrate to the top of the first substrate 10, so no signal is generated. At this time, the capacitive touch function is realized. The driving module 200 determines the touch position according to the position of the first capacitance signal output by the capacitance sensing signal line 40 and performs the corresponding signal processing or module control work.

[0081] When a finger presses the first substrate 10, the first substrate 10 deforms under force, and the relative distance between the first substrate 10 and the second substrate 20 decreases. The capacitive sensing signal line 40 continues to generate the first capacitive signal to realize the capacitive touch function. The driving module 200 determines the touch position according to the position of the first capacitive signal output by the capacitive sensing signal line 40 and performs corresponding signal processing or module control work.

[0082] Meanwhile, due to the reduced distance between the pressure sensing signal line 50 and the drive signal line 30, and the large overlap area of ​​the first connection segment 31 between the pressure sensing signal line 50 and the drive signal line 30, a strong second capacitance signal is generated. At this time, the drive module 200 analyzes and processes the second capacitance signal generated by the pressure sensing signal line 50 to determine the position coordinates of the finger pressing. Thus, the pressure detection function is realized. At the same time, when the first substrate 10 is pressed at different positions with different forces, the distance between the pressure sensing signal line 50 and the drive signal line 30 changes, generating second capacitance signals of different magnitudes. The drive module 200 analyzes the different position coordinates based on the second capacitance signals of different magnitudes, thereby realizing the pressure detection function of different forces.

[0083] To balance design cost and capacitor signal size, such as Figure 8 , Figure 10 and Figure 11 As shown, optionally, the capacitive sensing signal line 40 includes a third connecting segment 41, a fourth connecting segment 42 and a fifth connecting segment 43 connected in sequence, and the third connecting segment 41, the fourth connecting segment 42 and the fifth connecting segment 43 have a U-shaped structure.

[0084] The third connecting segment 41 includes an interleaved sixth connecting segment 411 and a seventh connecting segment 412, wherein the width of the sixth connecting segment 411 is greater than the width of the seventh connecting segment 412;

[0085] The fifth connecting segment 43 includes an interleaved eighth connecting segment 431 and a ninth connecting segment 432. The width of the eighth connecting segment 431 is greater than the width of the ninth connecting segment 432. The Mth sixth connecting segment 411 of the multiple capacitive sensing signal lines 40 is aligned end-to-end with the Mth eighth connecting segment 431. The Nth seventh connecting segment 412 of the multiple capacitive sensing signal lines 40 is aligned end-to-end with the Nth ninth connecting segment 432. Here, M and N are positive integers.

[0086] The second connecting segment 32 overlaps with the seventh connecting segment 412 and / or the ninth connecting segment 432 along the first direction z.

[0087] In this embodiment, as Figure 10 As shown, the sixth connecting segment 411 and the eighth connecting segment 431 are the same size and are aligned end to end, and the seventh connecting segment 412 and the ninth connecting segment 432 are the same size and are aligned end to end.

[0088] like Figure 11As shown, in the first direction z, the first connecting segment 31 covers the pressure sensing signal line 50. Since the width of the seventh connecting segment 412 and the ninth connecting segment 432 is smaller, the size of the capacitance sensing signal line 40 is reduced, thus reducing the design cost. The overlap area between the second connecting segment 32 and the seventh connecting segment 412 and the ninth connecting segment 432 is reduced, and the size of the sixth connecting segment 411 and the eighth connecting segment 431 is increased. When a finger touches the second side of the first substrate 10, the second connecting segment 32 of the two adjacent driving signal lines 30 generates a larger first capacitance signal through the sixth connecting segment 411 and the eighth connecting segment 431 on both sides of the finger.

[0089] When a finger presses the first substrate 10, the first substrate 10 deforms under force, and the relative distance between the first substrate 10 and the second substrate 20 decreases. The capacitive sensing signal line 40 continues to generate the first capacitive signal to realize the capacitive touch function. The driving module 200 determines the touch position according to the position of the first capacitive signal output by the capacitive sensing signal line 40 and performs corresponding signal processing or module control work.

[0090] Meanwhile, due to the reduced distance between the pressure sensing signal line 50 and the drive signal line 30, and the large overlap area of ​​the first connection segment 31 between the pressure sensing signal line 50 and the drive signal line 30, a strong second capacitance signal is generated. At this time, the drive module 200 analyzes and processes the second capacitance signal generated by the pressure sensing signal line 50 to determine the position coordinates of the finger press, thus realizing the pressure detection function.

[0091] like Figures 12 to 14 As shown, in another embodiment, optionally, the drive signal line 30 includes an interleaved first connecting segment 31 and a second connecting segment 32, the width of the first connecting segment 31 being greater than the width of the second connecting segment 32, and the first connecting segment 31 having a rhomboid structure.

[0092] The capacitive sensing signal line 40 includes an interleaved third connecting segment 41 and a fourth connecting segment 42. The width of the third connecting segment 41 is greater than the width of the fourth connecting segment 42. The third connecting segment 41 has a diamond-shaped structure.

[0093] Along the first direction z, the second connecting segment 32 overlaps with the fourth connecting segment 42, while the first connecting segment 31 and the third connecting segment 41 do not overlap.

[0094] In this embodiment, when a finger touches the second side of the first substrate 10, the first connecting segment 31 of the two adjacent driving signal lines 30 along the second direction y generates a first capacitance signal on the third connecting segment 41 of the middle capacitance sensing signal line 40 through the finger, which enhances the first capacitance signal. The pressure sensing signal line 50 also generates a first capacitance signal. Since the first connecting segment 31 covers the pressure sensing signal line 50, the first capacitance signal of the pressure sensing signal line 50 is shielded by the driving signal line 30, and the electric field does not penetrate to the top of the first substrate 10, so no signal is generated. At this time, the capacitive touch function is realized. The driving module 200 determines the touch position according to the position of the first capacitance signal output by the capacitance sensing signal line 40 and performs the corresponding signal processing or module control work.

[0095] When a finger presses the first substrate 10, the first substrate 10 deforms under force, and the relative distance between the first substrate 10 and the second substrate 20 decreases. The capacitive sensing signal line 40 continues to generate the first capacitive signal to realize the capacitive touch function. The driving module 200 determines the touch position according to the position of the first capacitive signal output by the capacitive sensing signal line 40 and performs corresponding signal processing or module control work.

[0096] Meanwhile, due to the reduced distance between the pressure sensing signal line 50 and the drive signal line 30, and the large overlap area of ​​the first connection segment 31 between the pressure sensing signal line 50 and the drive signal line 30, a strong second capacitance signal is generated. At this time, the drive module 200 analyzes and processes the second capacitance signal generated by the pressure sensing signal line 50 to determine the position coordinates of the finger pressing. Thus, the pressure detection function is realized. At the same time, when the first substrate 10 is pressed at different positions with different forces, the distance between the pressure sensing signal line 50 and the drive signal line 30 changes, generating second capacitance signals of different magnitudes. The drive module 200 analyzes the different position coordinates based on the second capacitance signals of different magnitudes, thereby realizing the pressure detection function of different forces.

[0097] To simplify the manufacturing process and ensure the consistency of touch sensing at each point of the touch sensing module 100, the first connecting segment 31 and the third connecting segment 41 may optionally have the same size.

[0098] The present invention also proposes an electronic device, such as Figure 15 As shown, the electronic device includes a driving module 200 and a touch sensing module 100. The specific structure of the touch sensing module 100 is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The driving module 200 and the touch sensing module 100 are electrically connected.

[0099] In this embodiment, the driving module 200 outputs a driving signal to the driving signal line 30 of the touch sensing module 100 and obtains a capacitance signal of the corresponding size from the reaction signal line in the touch sensing module 100, thereby realizing touch function and pressure detection function, determining different touch positions, different touch pressures, etc., and can also perform corresponding module control based on the analysis results. The driving module 200 can also be connected to a terminal and feed back the obtained position coordinates and capacitance signal data to the terminal, so that the terminal can perform module control or data analysis.

[0100] The drive module 200 may include corresponding drive circuits, processing circuits, such as capacitor signal output circuits, sampling circuits and controllers, etc., and the specific structure is not limited.

[0101] The electronic device may be a touch display device, touch control device, etc., having a touch sensing module 100. Optionally, the electronic device is a touch display device, such as... Figure 16 and Figure 17 As shown, the electronic device also includes a display module 300, a touch sensing module 100 and a display module 300 stacked together, and a display module 300 electrically connected to a driving module 200. Touch display devices, as interactive devices, are now widely used in various fields. The touch sensing module 100 is positioned above the display module 300. The two are combined into a whole using optical bonding technologies such as OCR / OCA or frame bonding technologies such as double-sided adhesive. The display module 300 can be a corresponding type of display screen, or a display module 300, such as an LCD display screen, an LCM display screen, etc. The specific structure is not limited.

[0102] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A touch sensing module, characterized in that, include: A first substrate and a second substrate are disposed opposite to each other along a first direction. The first substrate includes a first side facing the second substrate and a second side facing away from the second substrate. The second substrate includes a first side facing the first substrate and a second side facing away from the second substrate. Multiple drive signal lines are disposed on a first side of the first substrate, and the multiple drive signal lines are arranged side by side along a second direction and used to input drive signals; Multiple sensing signal lines are disposed on a first side of the second substrate. The multiple sensing signal lines include multiple capacitive sensing signal lines and multiple pressure sensing signal lines arranged side by side and interleaved in a third direction. The width of the driving signal line is greater than the width of the pressure sensing signal line. Wherein, the first direction is perpendicular to the second direction and the third direction; The drive signal line includes interleaved first connecting segments and second connecting segments. The width of the first connecting segment is greater than the width of the second connecting segment. The i-th first connecting segment of the plurality of drive signal lines is aligned end-to-end along the second direction. The j-th second connecting segment of the plurality of drive signal lines is aligned end-to-end along the second direction. Where i and j are positive integers. The capacitive sensing signal line has a U-shaped structure, and one of the capacitive sensing signal lines partially surrounds one of the pressure sensing signal lines. The first connecting segment overlaps with the pressure sensing signal line along the first direction; The second connecting segment overlaps with a portion of the capacitive sensing signal line along the first direction.

2. The touch sensing module as described in claim 1, characterized in that, The capacitive sensing signal line includes a third connecting segment, a fourth connecting segment, and a fifth connecting segment connected in sequence, and the third connecting segment, the fourth connecting segment, and the fifth connecting segment form a U-shaped structure; The third connecting segment includes an interleaved sixth connecting segment and a seventh connecting segment, wherein the width of the sixth connecting segment is greater than the width of the seventh connecting segment; The fifth connection segment includes an interleaved eighth connection segment and a ninth connection segment. The width of the eighth connection segment is greater than the width of the ninth connection segment. The Mth sixth connection segment of the plurality of capacitive sensing signal lines is aligned end-to-end with the Mth eighth connection segment. The Nth seventh connection segment of the plurality of capacitive sensing signal lines is aligned end-to-end with the Nth ninth connection segment. Where M and N are positive integers. The second connecting segment overlaps with the seventh connecting segment and / or the ninth connecting segment along the first direction.

3. The touch sensing module as described in claim 1, characterized in that, The drive signal line includes an interleaved first connection segment and a second connection segment, wherein the width of the first connection segment is greater than the width of the second connection segment, and the first connection segment has a diamond-shaped structure. The capacitive sensing signal line includes an interleaved third connecting segment and a fourth connecting segment, wherein the width of the third connecting segment is greater than the width of the fourth connecting segment, and the third connecting segment has a diamond-shaped structure. Along the first direction, the second connecting segment overlaps with the fourth connecting segment, while the first connecting segment and the third connecting segment do not overlap.

4. The touch sensing module as described in claim 3, characterized in that, The first connecting segment and the third connecting segment are of equal size.

5. The touch sensing module as described in any one of claims 1 to 4, characterized in that, The touch sensing module also includes: A transparent, non-conductive fluid is filled between the first substrate and the second substrate.

6. The touch sensing module as described in claim 5, characterized in that, The touch sensing module also includes a sealant, which is used to seal the edges of the first substrate and the second substrate.

7. The touch sensing module as described in claim 1, characterized in that, The first substrate and the second substrate are glass substrates.

8. An electronic device, characterized in that, It includes a driving module and a touch sensing module as described in any one of claims 1 to 7, wherein the driving module is electrically connected to the touch sensing module.

9. The electronic device as claimed in claim 8, characterized in that, It also includes a display module, wherein the touch sensing module is stacked on top of the display module, and the display module is electrically connected to the driving module.

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