Automatic laminating machine
By designing an automatic bonding machine, hot melt adhesive is used to automate the sole glue and bonding, solving the problems of low efficiency, unstable quality and health risks in the existing technology, and achieving efficient and stable bonding production.
Patent Information
- Application Number
- CN202310188824.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-02
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2043-03-02
AI Technical Summary
The existing sole glue technology is low in efficiency and unstable in quality, and the liquid glue used has an impact on human health, increasing corporate costs.
An automatic lamination integrated machine is designed to realize the glueing and lamination automation using hot melt adhesive, and the automatic alignment and lamination of the first substrate and the second substrate are realized through components such as frame, assembly line, feeding mechanism, activation device, glue passing device, alignment and lamination device.
Improve the production efficiency and quality of fit, reduce the labor intensity of workers, reduce costs, and achieve stability and consistency of glue applying and fitting.
Smart Images

Figure CN116250674B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of mechanical equipment, in particular to a laminating machine used in shoe production. Background Art
[0002] It is known that some composite products need to be connected by glue. For example, when making shoes, the upper and the sole generally need to be glued together, as well as the midsole and the outsole, so the sole needs to be glued. Common sole gluing is mainly done by manual brushing, which has low gluing efficiency and unstable gluing quality. In addition, liquid glue is used. Most liquid glues are solvent glues with formaldehyde added. Formaldehyde has an impact on human health, which limits production. At the same time, liquid glues are double-sided glues, which need to be applied on both sides of the two objects to be bonded. The amount of glue used is large, which increases the cost of double-sided gluing for enterprises. With the development of science and technology, hot melt adhesive (solid glue) as an emerging and environmentally friendly colloid has better overcome the defects of liquid glue, so it has been widely used. When using hot melt adhesive, it needs to be heated first to melt it from a solid state into a liquid before it can be applied on the surface of the product. Therefore, it works at a certain temperature and there is a risk of burns when applying it manually. Then, gluing devices using hot melt adhesive have appeared, but after gluing, the two substrates to be bonded still need to be manually bonded together, resulting in low work efficiency, unstable alignment, and poor consistency. Summary of the invention
[0003] The purpose of the present invention is to provide an automatic all-in-one laminating machine, which is suitable for hot melt glue gluing, mechanical gluing and laminating, reduces the labor intensity of workers in gluing and manual alignment laminating, improves the laminating production efficiency, and has stable and reliable gluing quality, stable alignment laminating and good consistency.
[0004] In order to achieve the above object, the present invention adopts the following technical scheme:
[0005] The automatic laminating machine realizes the laminating production between the first substrate and the second substrate, and has:
[0006] A frame, wherein a first assembly line and a second assembly line are arranged side by side, the first assembly line is provided with a movable first supporting plate; the second assembly line is provided with a movable second supporting plate;
[0007] A first material rack, which is assembled on the frame and is used to store the first substrates and transport them one by one;
[0008] A second material rack, which is assembled on the frame and is used to store the second substrates and transport them one by one;
[0009] A loading mechanism, which is assembled on the frame and is used to transfer the first substrate sent out by the first material rack to the first supporting plate of the first assembly line, and to transfer the second substrate sent out by the second material rack to the second supporting plate of the second assembly line; the first substrate is positioned on the first supporting plate and moves with the first supporting plate, and the second substrate is positioned on the second supporting plate and moves with the second supporting plate;
[0010] A first activation device, which is assembled on the frame and is used to dry the first substrate and the second substrate;
[0011] A glue-coating device, assembled on the frame and located downstream of the first activating device, and used for gluing the first substrate;
[0012] A second activation device, assembled on the frame and located downstream of the glue device, the second activation device is at least used to bake the first substrate after glue application;
[0013] An alignment and laminating device, assembled on the frame and located downstream of the second activation device, is used to adjust the spatial position of the first substrate and the second substrate and to laminate the second substrate onto the upper adhesive surface of the first substrate;
[0014] The feeding directions of the first assembly line and the second assembly line are consistent, and the first activation device, the gluing device, the second activation device and the alignment and laminating device are arranged in sequence along the feeding directions of the first assembly line and the second assembly line.
[0015] The above scheme is further that the first assembly line has a first circulating chain, and a plurality of first supporting plates are fixed on the first circulating chain at intervals along the movement direction of the first circulating chain; the second assembly line has a second circulating chain, and a plurality of second supporting plates are fixed on the second circulating chain at intervals along the movement direction of the second circulating chain; the first circulating chain and the second circulating chain move synchronously.
[0016] The above scheme is further that the first activation device is provided with two side-by-side first activation channels, and the second activation device is provided with two side-by-side second activation channels, the first activation channels and the second activation channels are in the form of tunnels, and the first assembly line and the second assembly line pass through different first activation channels and second activation channels respectively and in sequence.
[0017] The above scheme is further that the alignment and bonding device includes a first alignment component arranged in conjunction with the first assembly line, a second alignment component arranged in conjunction with the second assembly line, a bonding robot arranged across the first assembly line and the second assembly line, and a flipping component arranged in conjunction with the second assembly line; the first alignment component is used to adjust the spatial position of the first substrate on the first supporting plate; the flipping component is used to flip the second substrate on the second supporting plate so that the upper and lower surfaces and the front and rear sides of the second substrate are swapped, and the second alignment component is used to adjust the flipped second substrate so that the second substrate is parked at a set spatial position on the second supporting plate; the bonding robot moves and bonds the second substrate to the upper adhesive surface of the first substrate when the spatial positions of the first substrate and the second substrate are adjusted, so that the second substrate is aligned and bonded together with the first substrate; a material unloading mechanism is also provided downstream of the alignment and bonding device, and the material unloading mechanism is assembled on the frame, and is used to transfer the bonded first and second substrates to the laminating device.
[0018] The above scheme is further that the first alignment component drives the alignment adjustment of the first substrate by a squeezing method, and the first alignment component has a first alignment block, a second alignment block, a third alignment block and a fourth alignment block arranged around the first supporting plate, the first alignment block and the fourth alignment block form a front-to-back relationship, and the first alignment block and the fourth alignment block can both be raised and lowered, and at least one of the first alignment block and the fourth alignment block can move forward and backward; the second alignment block and the third alignment block form a left-right relationship, and at least one of the second alignment block and the third alignment block can move left-right.
[0019] The above scheme is further that the second alignment component drives the alignment adjustment of the second substrate by a squeezing method, and the second alignment component has a first stop plate, a second stop plate and a fifth alignment block arranged around the second supporting plate, the first stop plate is arranged on the front side of the moving direction of the second supporting plate, and a gap is left between the lower side edge of the first stop plate and the upper side surface of the second supporting plate; the second stop plate and the fifth alignment block are relatively arranged on the left and right sides of the moving direction of the second supporting plate, and the fifth alignment block can move left and right, so that the fifth alignment block is close to or away from the second stop plate.
[0020] The above scheme is further that the bonding robot has a sliding seat, a bonding cylinder and a material picking head. The sliding seat is assembled on a gantry preset on the frame through a linear slide rail structure and is driven to slide back and forth between the first assembly line and the second assembly line. The bonding cylinder is installed on the sliding seat, and the bonding cylinder is used to drive the material picking head to move up and down.
[0021] The above scheme is further that the material turning assembly includes a turning shaft spanning the upper side of the second assembly line and a clamping claw moving with the turning shaft, and the clamping claw grabs the second substrate by opening and closing the clamping method.
[0022] The above scheme is further that the gluing device is a hot melt glue gluing device, the gluing device has a glue tank and a glue roller, the glue roller is partially immersed in the glue tank, and the glue tank and the glue roller are driven up and down by an adjustable lifting mechanism, and the glue roller is horizontally arranged above the first assembly line, and the glue roller transfers the first substrate of the first assembly line to glue by rolling.
[0023] The above scheme is further that the loading mechanism is a multi-degree-of-freedom manipulator, and the loading mechanism synchronously transfers the first substrate sent out by the first material rack and the second substrate sent out by the second material rack to the first assembly line and the second assembly line respectively.
[0024] The present invention realizes the automation of gluing and laminating, and can be operated in a continuous flow, which greatly improves the production efficiency and quality. The hot melt adhesive is a single-sided adhesive, and only one side of the substrate needs to be coated with the adhesive for laminating, which greatly saves labor and is a development trend of completely changing the process to save costs in the future, which is in line with industrial utilization and promotion. The present invention has a simple structure, low production cost, and is easy to use. The mechanical gluing and laminating greatly reduce the labor intensity of workers, which is in line with industrial promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Attached Figure 1 It is a schematic diagram of the structure of a preferred embodiment of the present invention;
[0026] Attached Figure 2 , 3 for Figure 1 An enlarged schematic diagram of a local structure of an embodiment;
[0027] Attached Figure 4 for Figure 1 A schematic structural diagram of a glue-passing device according to an embodiment;
[0028] Attached Figure 5 for Figure 1 A schematic structural diagram of an alignment and lamination device according to an embodiment. DETAILED DESCRIPTION
[0029] The concept, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present invention.
[0030] It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0031] See also Figure 1 , 2 , 3, 4, and 5 are schematic diagrams of preferred embodiments of the present invention. The present invention relates to an automatic laminating machine for realizing laminating production between a first substrate and a second substrate. The first substrate and the second substrate can be shoe materials, sports product materials, etc. The automatic laminating machine comprises: a frame 1, a first material rack 2, a second material rack 3, a loading mechanism 4, a first activation device 5, a gluing device 6, a second activation device 7, an alignment laminating device 8, and a unloading mechanism 9.
[0032] The frame 1 is a horizontal design, and a first assembly line 11 and a second assembly line 12 are arranged side by side on the frame 1 to meet the needs of material transmission and processing. A movable first supporting plate 111 is arranged on the first assembly line 11; a movable second supporting plate 121 is arranged on the second assembly line 12. In this embodiment, the first assembly line 11 and the second assembly line 12 are arranged in parallel and side by side, and the feeding direction is consistent. The first activation device 5, the gluing device 6, the second activation device 7, the alignment and laminating device 8 and the unloading mechanism 9 are arranged in sequence along the feeding direction of the first assembly line 11 and the second assembly line 12. This embodiment is further preferred, wherein the first assembly line 11 has a first circulating chain 112, and a plurality of first supporting plates 111 are fixed on the first circulating chain 112 at intervals along the moving direction of the first circulating chain 112; the second assembly line 12 has a second circulating chain 122, and a plurality of second supporting plates 121 are fixed on the second circulating chain 122 at intervals along the moving direction of the second circulating chain 122; the first circulating chain 112 and the second circulating chain 122 move synchronously.
[0033] The first material rack 2 is assembled on the frame 1, and is used to store the first substrate and transport it one by one; as shown in the figure, the first material rack 2 is in the form of a material box, the first substrate is stacked in the first material rack 2, and is discharged one by one through the divider set at the lower end of the first material rack 2, and the discharged first substrate is pushed out by the first push cylinder 21 for subsequent material collection. The second material rack 3 is assembled on the frame 1, and is used to store the second substrate and transport it one by one; as shown in the figure, the second material rack 3 of this embodiment is similar to the first material rack 2 in structure, and the second material rack 3 is also in the form of a material box, which can be made in conjunction with the first material rack 2 or separately. The second substrate is stacked in the second material rack, and is discharged one by one through the divider set at the lower end of the second material rack 3, and the discharged second substrate is pushed out by the second push cylinder 31 for subsequent material collection. The dividers of the first material rack 2 and the second material rack 3 can refer to the stack dividers of the prior art, and will not be described in detail here. The shapes and sizes of the cavities of the first material rack 2 and the second material rack 3 of this embodiment respectively match the first and second substrates. The replenishment of the first material rack 2 and the second material rack 3 can be done manually or automatically, which is not limited here.
[0034] The loading mechanism 4 is assembled on the frame 1, and is used to transfer the first substrate sent out by the first material rack 2 to the first supporting plate 111 of the first assembly line 11, and to transfer the second substrate sent out by the second material rack 3 to the second supporting plate 121 of the second assembly line 12; the first substrate is positioned on the first supporting plate 111 and moves with the first supporting plate 111, and the second substrate is positioned on the second supporting plate 121 and moves with the second supporting plate 121; the first supporting plate 111 and the second supporting plate 121 can carry the first and second substrates to move by friction or grooves and adsorption. In this embodiment, the loading mechanism 4 is a multi-degree-of-freedom manipulator, and the loading mechanism 4 synchronously transfers the first substrate sent out by the first material rack 2 and the second substrate sent out by the second material rack 3 to the first assembly line and the second assembly line respectively. As shown in the figure, the loading mechanism 4 includes a loading sliding seat 41 that can move back and forth, a loading cylinder 42 and a material picking hand 43. The loading sliding seat 41 is connected to the frame 1 through a linear slide rail structure, and the loading sliding seat 41 is driven to move back and forth by a motor screw or a cylinder and other mechanisms. The loading cylinder 42 is assembled on the loading sliding seat 41, and the loading cylinder 42 is connected to the material picking hand 43 through the downward telescopic end. The material picking hand 43 is a left-right symmetrical structure, which satisfies the loading cylinder 42 to drive the material picking hand 43 downward to synchronously obtain the first substrate sent out by the first material rack 2 and the second substrate sent out by the second material rack 3, and then the loading cylinder 42 drives the material picking hand 43 to extract the first substrate and the second substrate and follow the loading sliding seat 41 to move to the first assembly line and the second assembly line, and repeat this action to achieve automatic loading.
[0035] The first activation device 5 is assembled on the frame 1, and is used to dry the first substrate and the second substrate, remove the corresponding liquids of the first substrate and the second substrate, and achieve the preheating effect on the substrate, which is beneficial to the subsequent bonding production. The gluing device 6 is assembled on the frame 1 and is located downstream of the first activation device 5. The gluing device 6 is used to apply glue to the first substrate. The gluing device 6 is a gluing device for hot melt adhesive. The gluing device 6 has a glue groove 61 and a glue roller 62. The glue roller 62 is partially immersed in the glue groove 61, and the glue groove 61 and the glue roller 62 are driven up and down by the lifting and adjustable mechanism 63. The lifting and adjustable mechanism 63 in the figure adopts a structural system of a cylinder and a slider to meet the requirements of the glue groove 61 and the glue roller 62 to form an integral lifting. The glue roller 62 is horizontally arranged above the first assembly line 11, and the glue roller 62 transfers the first substrate to the first assembly line 11 by rolling. The glue tank 61 is used to store molten hot melt adhesive, and the molten hot melt adhesive can be obtained through an external glue melting mechanism. The glue roller 62 extracts the hot melt adhesive in the glue tank 61 through the surface, and then applies it to the first substrate. The lifting and adjustable mechanism 63 can adjust the contact relationship between the glue roller 62 and the first substrate to ensure stable and uniform gluing quality. In this embodiment, there are two glue devices 6, arranged front and back, which can achieve two gluing. Of course, one of them can be selected as needed. In this embodiment, in order to cooperate with gluing, limit rollers 113 are also provided on both sides of the area of the first assembly line 11 located at the gluing station. The limit rollers 113 are used to cooperate with the left and right sides of the first supporting plate 111 to ensure that the first supporting plate 111 stably carries the first substrate through the glue device 6 to ensure the gluing quality. The second activation device 7 is assembled on the frame 1 and is located downstream of the glue device 6. The second activation device 7 is at least used to bake and activate the first substrate after gluing for subsequent adhesion. In this embodiment, the first activation device 5 is provided with two first activation channels 51 arranged side by side, and the second activation device 7 is provided with two second activation channels 71 arranged side by side. The first activation channels 51 and the second activation channels 71 are in the form of tunnels, and the first assembly line 11 and the second assembly line 12 respectively pass through different first activation channels 51 and second activation channels 71 in sequence. In this embodiment, it can be designed that the two first activation channels 51 are independently controlled, and the two second activation channels 71 are also independently controlled, so that they can be selectively used, convenient to control and energy-saving. The specific activation process is a prior art, and the working principle and other internal structures are not repeated here.
[0036] The alignment and laminating device 8 is assembled on the frame 1 and is located downstream of the second activation device 7. The alignment and laminating device 8 is used to adjust the spatial position of the first substrate and the second substrate and to laminate the second substrate on the upper adhesive surface of the first substrate to achieve automatic alignment and laminating production. The unloading mechanism 9 is assembled on the frame 1 and is used to transfer the laminated first substrate and the second substrate to a laminating device (shown in the figure), further pressurize and maintain the pressure, so that the first substrate and the second substrate are firmly adhered together. In this embodiment, the unloading mechanism 9 is in the form of a manipulator with a simple structure, convenient for manufacture, assembly and control, and preferably adopts negative pressure adsorption to grasp and move the material to achieve automatic unloading.
[0037] See also Figure 1 , 3 As shown in Figure 5, in this embodiment, the alignment and bonding device 8 includes a first alignment component 81 arranged in a matching manner with the first assembly line 11, a second alignment component 82 arranged in a matching manner with the second assembly line 12, a bonding robot 83 arranged across the first assembly line 11 and the second assembly line 12, and a flipping component 84 arranged in a matching manner with the second assembly line 12; the first alignment component 81 is used to adjust the spatial position of the first substrate on the first supporting plate 111; the flipping component 84 is used to flip the second substrate on the second supporting plate 121, so that the upper and lower surfaces and the front and rear sides of the second substrate are swapped, that is, the second substrate is flipped 180 degrees, so that the adhesive surface of the second substrate faces downward, and the direction is changed by swapping the front and rear sides of the second substrate to match the subsequent bonding. The second alignment component 82 is used to adjust the flipped second substrate so that the second substrate is parked at the spatial position set on the second supporting plate 121; the bonding robot 83 moves the second substrate and bonds it to the upper adhesive surface of the first substrate when the spatial positions of the first substrate and the second substrate are adjusted, so that the second substrate and the first substrate are aligned and bonded together.
[0038] In this embodiment, the first alignment component 81 drives the alignment adjustment of the first substrate by squeezing. The first alignment component 81 has a first alignment block 811, a second alignment block 812, a third alignment block 813 and a fourth alignment block 814 arranged around the first supporting plate 111. The first alignment block 811 and the fourth alignment block 814 form a front-to-back relationship, and the first alignment block 811 and the fourth alignment block 814 can both be raised and lowered, and at least one of the first alignment block 811 and the fourth alignment block 814 can move forward and backward. In the figure, the first alignment block 811 is driven by a series cylinder system to achieve up and down and forward and backward movement, wherein the upward movement of the first alignment block 811 is to lift up in order to provide a space for escape, so as to facilitate the first support plate 111 to carry the first substrate to move, and the downward movement of the first alignment block 811 is used for adjustment, and in conjunction with the forward and backward movement, to achieve the alignment of the first substrate and the backward movement of the first alignment block 814; the fourth alignment block 814 is driven up and down by a cylinder, and similarly, the upward movement of the fourth alignment block 814 is to lift up in order to provide a space for escape, and the downward movement of the fourth alignment block 814 is used to intercept and stop the front end of the first substrate to provide an alignment reference. The second alignment block 812 and the third alignment block 813 form a left-right relationship, and at least one of the second alignment block 812 and the third alignment block 813 can move left-right. As shown in the figure, the second alignment block 812 and the third alignment block 813 are driven by cylinders to move left and right, and by pushing the left and right sides of the first substrate, cooperating with the front and rear alignment adjustment of the first alignment block 811 and the fourth alignment block 814, the spatial position of the first substrate is adjusted to facilitate subsequent automatic bonding, which is accurate and stable.
[0039] In this embodiment, since the second substrate is first activated before bonding, the bonding surface of the second substrate is facing upward when the material is initially loaded. Therefore, in order to facilitate subsequent bonding, the second substrate needs to be flipped, that is, the second substrate is flipped 180 degrees by the flipping component 84 so that the adhesive surface of the second substrate faces downward. In this embodiment, the flipping component 84 includes a flipping shaft 841 spanning the upper side of the second assembly line 12 and a clamping claw 842 following the flipping shaft 841. The clamping claw 842 grabs the second substrate by left and right clamping, and then the flipping shaft 841 is driven to rotate by a motor or other mechanism, and the clamping claw 842 clamps the second substrate and follows the flipping. At the same time, the second supporting plate 121 continues to move forward from the lower side of the flipping shaft 841. After the second substrate is flipped, it happens to be located above the second supporting plate 121. At this time, the clamping claw 842 is released, and the second substrate falls on the second supporting plate 121 to achieve the flipping work. Subsequently, the second supporting plate 121 carries the flipped second substrate to the alignment adjustment station, and enters the second alignment component 82 to adjust the spatial position of the second substrate for subsequent bonding needs.
[0040] In this embodiment, the second alignment component 82 drives the alignment adjustment of the second substrate by squeezing. The second alignment component 82 has a first stop plate 821, a second stop plate 822 and a fifth alignment block 823 arranged around the second support plate 121. The first stop plate 821 is arranged at the front side of the moving direction of the second support plate 121, and a gap is left between the lower side of the first stop plate 821 and the upper side of the second support plate 121 so that the second support plate 121 can pass through, but at the same time, the second substrate can be stopped to provide a reference alignment. The second stop plate 822 and the fifth alignment block 823 are relatively arranged on the left and right sides of the moving direction of the second support plate 121, and the fifth alignment block 823 can move left and right through the cylinder drive, so that the fifth alignment block 823 is close to or away from the second stop plate 822. When the second substrate moves following the second support plate 121, the front end of the second substrate is stopped by the first stop plate 821, and the fifth alignment block 823 pushes the second substrate toward the second stop plate 822 from one side, thereby achieving the spatial position adjustment of the second substrate, which can facilitate the accurate grasping of the bonding manipulator 83 for bonding connection with the first substrate. The bonding manipulator 83 has a sliding seat 831, a bonding cylinder 832 and a material taking head 833. The sliding seat 831 is assembled on the gantry preset on the frame 1 through a linear slide structure and driven to slide back and forth between the first assembly line 11 and the second assembly line 12. The bonding cylinder 832 is installed on the sliding seat 831, and the bonding cylinder 832 is used to drive the material taking head 833 to move up and down to achieve material taking and bonding downward pressing. Preferably, in the figure, the material taking head 833 obtains the second substrate through negative pressure adsorption, and then moves with the sliding seat 831 to move the second substrate from the second assembly line 12 to the first assembly line 11, and is driven by the bonding cylinder 832 to bond the second substrate to the adhesive coating surface of the first substrate under a certain pressure, so as to achieve automatic alignment and bonding production. Finally, the bonded first and second substrates are output from the first assembly line 11. In this embodiment, the first and second substrates bonded together are further transferred to the laminating device through the unloading mechanism 9, and further pressurized and maintained to make the first and second substrates firmly bonded together.
[0041] The present invention realizes the automation of gluing and laminating, and can be operated in a continuous flow, which greatly improves the production efficiency and quality. The hot melt adhesive is a single-sided adhesive, and only one side of the substrate needs to be coated with the adhesive for laminating, which greatly saves labor and is a development trend of completely changing the process to save costs in the future, which is in line with industrial utilization and promotion. The present invention has a simple structure, low production cost, and is easy to use. The mechanical gluing and laminating greatly reduce the labor intensity of workers, which is in line with industrial promotion and application.
[0042] Although the preferred specific embodiments of the present invention are described above in conjunction with the accompanying drawings, the present invention should not be limited to the structures and operations that are exactly the same as the above descriptions and drawings. For those skilled in the art, many equivalent improvements and changes can be made to the above embodiments through logical analysis, reasoning or limited experiments without exceeding the concept and scope of the present invention, but these improvements and changes should all fall within the scope of protection required by the present invention.
Claims
1. An automatic laminating machine, which realizes the laminating production between the first substrate and the second substrate, characterized in that: have: A frame, wherein a first assembly line and a second assembly line are arranged side by side, the first assembly line is provided with a movable first supporting plate; the second assembly line is provided with a movable second supporting plate; A first material rack, which is assembled on the frame and is used to store the first substrates and transport them one by one; A second material rack, which is assembled on the frame and is used to store the second substrates and transport them one by one; A loading mechanism, which is assembled on the frame and is used to transfer the first substrate sent out by the first material rack to the first supporting plate of the first assembly line, and to transfer the second substrate sent out by the second material rack to the second supporting plate of the second assembly line; the first substrate is positioned on the first supporting plate and moves with the first supporting plate, and the second substrate is positioned on the second supporting plate and moves with the second supporting plate; A first activation device, which is assembled on the frame and is used to dry the first substrate and the second substrate; A glue-coating device, assembled on the frame and located downstream of the first activating device, and used for gluing the first substrate; A second activation device, assembled on the frame and located downstream of the glue device, the second activation device is at least used to bake the first substrate after glue application; An alignment and laminating device, assembled on the frame and located downstream of the second activation device, is used to adjust the spatial position of the first substrate and the second substrate and to laminate the second substrate onto the upper adhesive surface of the first substrate; The feeding directions of the first assembly line and the second assembly line are consistent, and the first activation device, the gluing device, the second activation device and the alignment and laminating device are arranged in sequence along the feeding directions of the first assembly line and the second assembly line; The alignment and bonding device includes a first alignment component arranged in conjunction with the first assembly line, a second alignment component arranged in conjunction with the second assembly line, a bonding robot arranged across the first assembly line and the second assembly line, and a flipping component arranged in conjunction with the second assembly line; the first alignment component is used to adjust the spatial position of the first substrate on the first supporting plate; the flipping component is used to flip the second substrate on the second supporting plate so that the upper and lower surfaces and the front and rear sides of the second substrate are swapped, and the second alignment component is used to adjust the flipped second substrate so that the second substrate is parked at a set spatial position on the second supporting plate; the bonding robot moves the second substrate and bonds it to the upper adhesive surface of the first substrate when the spatial positions of the first substrate and the second substrate are adjusted, so that the second substrate is aligned and bonded with the first substrate; a material unloading mechanism is also provided downstream of the alignment and bonding device, and the material unloading mechanism is assembled on the frame and is used to transfer the bonded first and second substrates to the laminating device.
2. The automatic laminating machine according to claim 1, characterized in that: The first assembly line has a first circulating chain, and a plurality of first supporting plates are fixed on the first circulating chain at intervals along the moving direction of the first circulating chain; the second assembly line has a second circulating chain, and a plurality of second supporting plates are fixed on the second circulating chain at intervals along the moving direction of the second circulating chain; the first circulating chain and the second circulating chain move synchronously.
3. The automatic laminating machine according to claim 1, characterized in that: The first activation device is provided with two side-by-side first activation channels, and the second activation device is provided with two side-by-side second activation channels. The first activation channels and the second activation channels are in the form of tunnels, and the first assembly line and the second assembly line pass through different first activation channels and second activation channels respectively and in sequence.
4. The automatic laminating machine according to claim 1, characterized in that: The first alignment component drives the alignment adjustment of the first substrate by squeezing and leaning. The first alignment component has a first alignment block, a second alignment block, a third alignment block and a fourth alignment block arranged around the first supporting plate. The first alignment block and the fourth alignment block form a front-to-back relationship, and the first alignment block and the fourth alignment block can both be raised and lowered, and at least one of the first alignment block and the fourth alignment block can move forward and backward; the second alignment block and the third alignment block form a left-right relationship, and at least one of the second alignment block and the third alignment block can move left-right.
5. The automatic laminating machine according to claim 1, characterized in that: The second alignment component drives the alignment adjustment of the second substrate by a squeezing method. The second alignment component has a first stop plate, a second stop plate and a fifth alignment block arranged around the second supporting plate. The first stop plate is arranged on the front side of the moving direction of the second supporting plate, and a gap is left between the lower side of the first stop plate and the upper side of the second supporting plate; the second stop plate and the fifth alignment block are relatively arranged on the left and right sides of the moving direction of the second supporting plate, and the fifth alignment block can move left and right, so that the fifth alignment block is close to or away from the second stop plate.
6. The automatic laminating machine according to claim 1, characterized in that: The laminating robot comprises a sliding seat, a laminating cylinder and a material picking head. The sliding seat is assembled on a gantry preset on the frame through a linear slide rail structure and is driven to slide back and forth between the first assembly line and the second assembly line. The laminating cylinder is installed on the sliding seat and is used to drive the material picking head to move up and down.
7. The automatic laminating machine according to claim 1, characterized in that: The material turning assembly includes a turning shaft spanning the upper side of the second assembly line and a material clamping claw moving along with the turning shaft, and the material clamping claw grabs the second substrate by opening and closing the clamping mode.
8. The automatic laminating machine according to claim 1, characterized in that: The gluing device is a gluing device for hot melt adhesive, and the gluing device has a glue tank and a glue roller. The glue roller is partially immersed in the glue tank, and the glue tank and the glue roller are driven up and down by an adjustable lifting mechanism. The glue roller is horizontally arranged above the first assembly line, and the glue roller transfers the first substrate of the first assembly line to glue by rolling.
9. The automatic laminating machine according to claim 1, characterized in that: The loading mechanism is a multi-degree-of-freedom manipulator, and the loading mechanism synchronously transfers the first substrate sent out by the first material rack and the second substrate sent out by the second material rack to the first assembly line and the second assembly line respectively.
Citation Information
Patent Citations
Vamp laminating machine
CN203015998U
Improvements in or relating to shoe upper conforming machines
GB540174A