Automatic sapphire wafer slice device and method

Abstract

A kind of sapphire wafer automatic shovel piece device and method, wherein installation frame is provided with workbench, workbench is provided with rotary table, rotary table top is provided with bearing disc, bearing disc one side is provided with air bearing guide rail, collection jam;The guide rail surface of air bearing guide rail is provided with micropore array, and the bottom of air bearing guide rail is provided with flow guide cavity;Bearing disc top is provided with shovel knife, air knife, rotating frame at intervals, rotating frame is provided with vacuum chuck.Using rotary table, distance adjusting actuator respectively to bearing disc and wafer form rotary drive and inclination control, by air knife, shovel knife and vacuum chuck assembly to wafer array inner circle, outer circle is distributed automatically shovel, transfer operation, after being sent into air bearing guide rail, make wafer be positive pressure air film float to drift state to guarantee not to be physically impacted, then slide into collection jam and be collected, ensure wafer and carrier separation, transfer operation is highly automated, while ensuring wafer quality is intact and the consistency of collection piece sequence, increase the production efficiency of wafer manufacturing industry.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer automatic processing, in particular to a sapphire wafer automatic spade piece device and method. BACKGROUND

[0002] In the process of LED chip preparation, the device epitaxial layer is mainly grown on the sapphire substrate. Since the sapphire substrate has the excellent characteristics of high mechanical strength, good stability, and high-temperature growth, it is selected as the substrate material by most growth processes.

[0003] At present, the polishing process of sapphire substrate production is divided into rough polishing and fine polishing processes. After the two processes, the thickness of the wafer on the ceramic disc needs to be measured, and then the wafer needs to be manually separated from the carrier and collected into a wafer special cassette. In this process, the ceramic disc handling, peeling, transfer and collection operations are all completed by manual work. Since the ceramic disc carrying the wafer is heavy, manual operation is time-consuming, laborious, low in efficiency and high in labor intensity. In addition, the operation caused by human factors may cause damage to the production materials. In addition, the manual operation of the transfer equipment has safety hazards, and the operation of collecting the wafer into the special cassette also has the defects of high working intensity, low efficiency, and easy to cause the wafer to be collected in disorder and abnormal quality due to human factors. At the same time, since the wafer is brittle, it is arranged in multiple circles on the carrier disc and has a certain adhesion between the wafer and the carrier disc. The peeling and transfer operations of the conventional automatic equipment will also cause physical impact on the wafer and damage it. Therefore, a new technical solution is needed to improve it. SUMMARY

[0004] In view of the problems in the prior art, the present application provides a sapphire wafer automatic spade piece device and method to realize the full automatic operation of separating the sapphire wafer from the carrier, reduce the labor intensity, improve the production efficiency, ensure the wafer quality and the consistency of the collected wafer sequence, and increase the production benefit of the wafer manufacturing industry.

[0005] The application is implemented by the following technical scheme: a sapphire wafer automatic spade device, comprising a mounting frame, wherein the mounting frame is provided with a hinge base, a distance adjusting actuator, and a workbench is provided at intervals, one end of the workbench is hingedly mounted with the hinge base, and the other end is connected with an output shaft of the distance adjusting actuator; a rotating table driven by a rotating actuator is provided on the workbench, a bearing disc is placed above the rotating table, an air floating guide rail and a collection plug are sequentially provided on one side of the bearing disc; the air floating guide rail is fixed on the workbench, the air floating guide rail inlet is aligned with the bearing disc, a plurality of micropores arranged at equal intervals form a micropore array through the guide rail surface of the air floating guide rail, and a flow guide cavity is arranged at the bottom of the air floating guide rail; the collection plug is an open container provided with a plurality of U-shaped notches on one side, and the U-shaped notches are aligned with the air floating guide rail outlet, the collection plug is connected with a vertical movement module, the vertical movement module has a vertical driving function and is arranged on the workbench; a spade knife, an air knife, and a rotating frame are provided at intervals above the bearing disc, the spade knife and the air knife are installed on the workbench through a hinged mechanism, the rotating frame is installed on the workbench through a rotating mechanism, one end or both ends of the rotating frame are provided with a downward vacuum chuck, the spade knife, the air knife blade, and the rotating frame body all form an acute angle with the bearing disc, and the air knife is provided with at least two and is symmetrically distributed along the bearing disc axial section.

[0006] Further, the cavity extension path of the flow guide cavity is in a closed frame structure, the long and wide dimensions of the upper opening of the frame structure are greater than the corresponding dimensions of the lower opening, the upper opening is seamlessly connected with the air floating guide rail, the lower end of the lower opening is empty, a flow guide frame is arranged in the lower opening, the outer wall profile of the flow guide frame and the inner wall profile of the lower opening form an equidistant array, the outer wall of the flow guide frame and the inner wall of the lower opening are clamped to form an air outlet gap, and the air outlet gap is in through communication with the inner cavity of the flow guide cavity; a positive pressure device is arranged beside the flow guide cavity, the positive pressure end of the positive pressure device penetrates the cavity wall of the flow guide cavity through a pipeline and is in communication with the inner cavity thereof; an inclined wall is arranged on the inner wall of the flow guide cavity, the inner side of the inclined wall presents an inwardly convex arc surface, the junction between the inner side of the inclined wall and the inner side of the lower opening forms an external fillet, and the junction between the inner side of the inclined wall and the inner side of the upper opening forms an internal fillet.

[0007] Further, a plurality of wafer pieces are attached above the bearing disc, the plurality of wafer pieces respectively form an outer circle center array and an inner circle center array, the diameter of the inscribed circle of the outer circle center array is a, the diameter of the circumscribed circle of the inner circle center array is b, the diameter of the inscribed circle of the inner circle center array is c, the diameter of the wafer piece is r, the distance between the air knife edge and the spade knife edge is x, and (a-b) / 2+r+c>x>r.

[0008] Further, the micropore array has a micropore aperture of 0.08mm-0.12mm.

[0009] Further, the hinge mechanism where the shovel knife is located is provided with an execution motor and an execution cylinder, the hinge mechanism where the air knife is located is provided with an adjustment motor, the inclination angles of the shovel knife and the air knife are controlled by the execution motor and the adjustment motor respectively, the linear stroke of the shovel knife is controlled by the execution cylinder, and the execution cylinder is a multi-position cylinder; a rotary cylinder and a double-shaft cylinder are arranged above the rotary frame, the rotary frame is connected with the output shaft of the rotary cylinder, and the cylinder body of the rotary cylinder is connected with the output shaft of the double-shaft cylinder.

[0010] Further, one side of the bearing disc is provided with two symmetrically arranged sliding tables, the other side of the bearing disc is provided with two symmetrically arranged fixed tables, each of the sliding tables and the fixed tables is provided with a positioning seat, each of the positioning seats is provided with a transversely arranged positioning wheel through shaft hole cooperation, the sliding table is a sliding mechanism arranged on a sliding rail, one side of the sliding table is provided with a positioning cylinder, and the output shaft of the positioning cylinder is in transmission connection with the positioning seat on the sliding table.

[0011] Further, the rotary actuator is one of a servo motor and a stepping motor, the body of the rotary actuator is fixed on the lifting table, the output shaft of the rotary actuator is connected to the rotary table, a thrust bearing is embedded between the rotary table and the lifting table, a plurality of lifting cylinders are arranged on the workbench, and the output shafts of the plurality of lifting cylinders are jointly connected to support the lifting table.

[0012] Further, the distance adjusting actuator is one of a multi-stage cylinder, a multi-stage electric cylinder and a multi-stage oil cylinder, the output shaft of the distance adjusting actuator is in hinged connection with the workbench, the disc surface of the bearing disc, the rail surface of the air floating rail and the U-shaped notch groove bottom surface of the collection cassette are parallel.

[0013] The application further provides a sapphire wafer automatic splicing method, which comprises the following steps:

[0014] S1 positioning: the bearing disc and the wafer array produced above the bearing disc are sent to the workbench upper station through an automatic carrier, the bearing disc is placed on the rotary table, the positioning cylinder is started to drive the sliding table to slide through the output shaft of the positioning cylinder, the two positioning wheels on one side of the bearing disc are attached to the side walls of the bearing disc, and the bearing disc is pushed to the other side of the bearing disc until the side walls of the bearing disc are attached to the positioning wheels on the two fixed tables, so that the bearing disc is transversely moved to a preset station to complete the positioning work;

[0015] S2 Angle adjustment: Start the output shaft of the distance adjustment executor to lift one end of the workbench, and make the workbench and the upper part thereof enter the inclined state under the guide of the hinge seat at the other end. Stop the distance adjustment executor by using the limiting member or the precision functional member, so as to keep the workbench at a standard inclined angle. Start the execution motor and the adjustment motor to adjust the inclined angles of the spade and the air knife respectively, so that the spade edge enters the inner circle center array of the wafer, and the air knife edge enters the area between the inner circle center array and the outer circle center array of the wafer.

[0016] S3 Inner circle peeling: Start the execution cylinder to drive the output shaft thereof to extend the spade, and simultaneously start the execution motor to adjust the inclined angle of the spade until the spade contacts the wafer of the inner circle array, so as to ensure that the spade edge abuts against the corner formed by the side wall of the wafer of the inner circle and the surface of the bearing disc. Continue to start the execution cylinder to make the spade enter the gap between the wafer of the inner circle and the bearing disc, so that one end of the wafer of the inner circle is lifted by the spade. Start the double-shaft cylinder to make the rotary frame move downward, so that the vacuum chuck at one end of the rotary frame adheres to and sucks the wafer of the inner circle that is lifted. Again start the double-shaft cylinder to make the rotary frame drive the vacuum chuck and the wafer to move upward, and complete the inner circle peeling work.

[0017] S4 Inner circle transfer: Start the rotary cylinder to make the rotary frame rotate, and drive the vacuum chuck and the wafer to the upper part of the air floating guide rail. Start the positive pressure device to make the positive pressure airflow be released to the air floating guide rail through the flow guide cavity. The positive pressure airflow is uniformly dispersed through the micro-hole array of the air floating guide rail and forms a positive pressure air film on the guide rail surface. Disconnect the vacuum source of the vacuum chuck to release the wafer, so that the wafer falls onto the air floating guide rail and is floated by the positive pressure air film. Under the action of gravity, the wafer in the drift state is guided by the air floating guide rail in the inclined state and the positive pressure air film to the collection card slot in the obliquely lower part.

[0018] S5 Inner circle collection: Start the rotary executor to drive the rotary disc and the bearing disc to rotate, so that any remaining wafer of the inner circle array is aligned with the inlet of the air floating guide rail. Repeat the operations of S3 and S4 to peel off the remaining wafers of the inner circle array one by one and transfer them to the collection card slot. Simultaneously control the vertical moving module to adjust the vertical position of the collection card slot, so as to provide more storage space and complete the collection work of all the wafers of the inner circle array.

[0019] S6 Outer circle peeling: Start the execution cylinder to drive the output shaft thereof to extend the spade, and simultaneously start the execution motor to adjust the inclined angle of the spade until the spade contacts the wafer of the outer circle array, so as to ensure that the spade edge abuts against the corner formed by the side wall of the wafer of the outer circle and the surface of the bearing disc. Continue to start the execution cylinder to make the spade enter the gap between the wafer of the outer circle and the bearing disc, so that one end of the wafer of the outer circle is lifted by the spade. Simultaneously open the output jet airflow of the air knife at both sides to make the wafer of the outer circle that is lifted at one end be blown and slide by the jet airflow at both sides to the inlet of the air floating guide rail nearby, and complete the outer circle peeling work.

[0020] S7 outer ring transfer: the outer ring wafer peeled off is blown by the air knife on both sides to slide onto the air floating guide rail, the wafer is floated by the air film on the surface of the air floating guide rail, and the wafer is guided into the collection card slot under the action of gravity;

[0021] S8 outer ring collection: the rotating member is started to drive the rotating disc and the bearing disc to rotate, so that any remaining wafer of the outer ring array is aligned with the air floating guide rail inlet, the operations of S6 and S7 are repeated, the remaining wafers of the outer ring array are peeled off and transferred into the collection card slot one by one, and the vertical moving module is controlled synchronously to adjust the vertical position of the collection card slot, so as to provide more storage space and complete the collection work of all wafers of the outer ring array.

[0022] The beneficial effects of the present application are: the device utilizes the rotating table and the distance adjusting member to respectively rotate and control the inclination angle of the bearing disc and the wafer, so that the wafer is tilted by the workbench and sent to the shovel piece station after being placed into the bearing disc, the inner and outer rings of the wafer array are distributed and automatically shovelled and transferred by the air knife, the shovel knife and the vacuum suction cup assembly, after being sent to the air floating guide rail, a layer of positive pressure air film is formed on the surface of the air floating guide rail by the airflow jetting micro hole array, so that the sent wafer is floated to the drift state by the positive pressure air film to protect the wafer from physical impact, and then slides into the collection card slot according to the inclination angle of the workbench for collection. The flexible conveying track provided by the positive pressure air film and the inclination structure of the air floating guide rail can effectively ensure the integrity of the wafer shape and size, the distributed processing of the inner and outer rings of the wafer array by the air knife, the shovel knife and the vacuum suction cup assembly can safely release the adhesion between the wafer and the bearing disc, and ensure the high automation of the wafer separation and transfer operation, effectively reduce the labor intensity and improve the production efficiency, at the same time, the wafer quality is guaranteed to be intact and the collection piece sequence is consistent, and the production benefit of the wafer manufacturing industry is increased. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a structure side view of an embodiment of the present application;

[0024] Figure 2 is a partial structure top view of an embodiment of the present application;

[0025] Figure 3 is a structure diagram of the air floating guide rail and the flow guide cavity in an embodiment of the present application;

[0026] Figure 4 is a positioning operation diagram of an embodiment of the present application;

[0027] Figure 5 is an inclination angle adjustment operation diagram of an embodiment of the present application;

[0028] Figure 6 is an inner ring peeling operation 1 diagram of an embodiment of the present application;

[0029] Figure 7 is a schematic diagram of the inner ring stripping operation 2 of an embodiment of the present application;

[0030] Figure 8 is a schematic diagram of the inner ring transfer operation of an embodiment of the present application;

[0031] Figure 9 is a schematic diagram of the outer ring stripping operation of an embodiment of the present application;

[0032] Figure 10 is a schematic diagram of the outer ring transfer operation of an embodiment of the present application;

[0033] Figure 11 is a schematic diagram of the floatation of the air-float guide rail and the flow guide cavity in an embodiment of the present application;

[0034] Figure 12 is a schematic diagram of the stripping operation of the spade and the air knife in an embodiment of the present application.

[0035] In the figure: 1 - mounting frame, 1a - hinge seat, 1b - distance adjustment actuator, 2 - workbench, 2a - sliding table, 2b - fixed table, 2c - positioning seat, 2d - positioning wheel, 2e - positioning cylinder, 3 - rotating table, 3a - rotating actuator, 3b - lifting table, 3c - thrust bearing, 3d - lifting cylinder, 4 - carrier disc, 4a - wafer, 5 - air-float guide rail, 5a - micro-hole array, 5b - flow guide cavity, 5c - positive pressure device, 5d - upper opening, 5e - lower opening, 5f - inclined wall, 5g - flow guide frame, 6 - collection cassette, 6a - vertical movement module, 7 - spade, 7a - actuator motor, 7b - actuator cylinder, 7x - spade edge, 8 - air knife, 8a - adjustment motor, 8x - air knife edge, 9 - rotating frame, 9a - vacuum chuck, 9b - rotating cylinder, 9c - double-shaft cylinder, 9x - end of vacuum chuck. DETAILED DESCRIPTION

[0036] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0037] As Figures 1-3As shown, a sapphire wafer automatic spade device includes a mounting frame 1, wherein the mounting frame 1 is provided with a hinge base 1a, a distance adjusting actuator 1b, and a workbench 2 is provided at intervals, one end of the workbench 2 is hingedly mounted with the hinge base 1a, and the other end is connected with the output shaft of the distance adjusting actuator 1b; the workbench 2 is provided with a rotating actuator 3a connected belt driven rotating table 3, the rotating table 3 is placed above the bearing disc 4, one side of the bearing disc 4 is sequentially provided with the air floating guide rail 5 and the collection plug 6; the air floating guide rail 5 is fixed on the workbench 2, the inlet of the air floating guide rail 5 is aligned with the bearing disc 4, the guide rail surface of the air floating guide rail 5 is provided with a plurality of micropores arranged at equal intervals to form a micropore array 5a, and the bottom of the air floating guide rail 5 is provided with a flow guide cavity 5b; the collection plug 6 is an open container provided with a plurality of U-shaped notches on one side, and the U-shaped notches are aligned with the outlet of the air floating guide rail 5, the collection plug 6 is connected with the vertical moving module 6a, the vertical moving module 6a has a vertical driving function and is arranged on the workbench 2; the bearing disc 4 is provided with a spade knife 7, an air knife 8 and a rotating frame 9 at intervals above the bearing disc 4, the spade knife 7 and the air knife 8 are installed on the workbench through a hinged mechanism, the rotating frame 9 is installed on the workbench through a rotating mechanism, the rotating frame 9 is provided with a vacuum chuck 9a facing downward at both ends, the blade body of the spade knife 7 and the air knife 8 and the frame body of the rotating frame 9 form an acute angle with the bearing disc 4, and the air knife 8 is provided with at least two and is symmetrically distributed with the bearing disc 4 axial section.

[0038] The rotating table 3 and the distance adjusting actuator 1b respectively form rotating drive and inclination control for the bearing disc 4 and the wafer, so that the wafer is placed into the bearing disc 4 and then sent into the spade station by the inclination of the workbench 2, and the inner and outer circles of the wafer array are distributed and automatically spaded and transferred by the air knife 8, the spade knife 7 and the vacuum chuck 9a assembly, after being sent into the air floating guide rail 5, the wafer is floated to a drift state by the positive pressure gas film formed on the surface of the air floating guide rail 5 by the air jet micropore array 5a, so as to protect the wafer from physical impact, and then slide into the collection plug 6 according to the inclination angle of the workbench 2 for collection, the flexible conveying track provided by the positive pressure gas film and the inclination structure of the air floating guide rail 5 can effectively ensure the integrity of the wafer shape and size, the distributed processing of the inner and outer circles of the wafer array by the air knife 8, the spade knife 7 and the vacuum chuck 9a assembly can safely release the adhesion of the wafer and the bearing disc 4, and ensure the high automation of the separation and transfer operation of the wafer and the carrier.

[0039] In the embodiment, the cavity extension path of the flow guide cavity 5b is in a closed frame structure, the long and wide dimensions of the upper opening 5d of the frame structure are greater than the corresponding dimensions of the lower opening 5e, the upper opening 5d is seamlessly connected with the air floating guide rail 5, the lower end of the lower opening 5e is empty, the flow guide frame 5g is arranged inside the lower opening 5e, the outer wall profile of the flow guide frame 5g is equidistantly arranged with the inner wall profile of the lower opening 5e, the outer wall of the flow guide frame 5g and the inner wall of the lower opening 5e are clamped to form a gas outlet gap, and the gas outlet gap is in through communication with the inner cavity of the flow guide cavity 5b; the positive pressure device 5c is arranged beside the flow guide cavity 5b, the positive pressure end of the positive pressure device 5c is in through communication with the inner cavity of the flow guide cavity 5b through the pipeline; the inner wall of the flow guide cavity 5b is provided with an inclined wall 5f arranged obliquely, the inner side of the inclined wall 5f is an arc surface protruding inward, the junction between the inner side of the inclined wall 5f and the inner side of the lower opening 5e forms an external fillet, and the junction between the inner side of the inclined wall 5f and the inner side of the upper opening 5d forms an internal fillet.

[0040] The frame path structure of the flow guide cavity 5b and the junction of the inclined wall 5f, the lower opening 5e and the upper opening 5d form a involute pipeline, when the gas flow is sprayed out from the gas outlet gap of the flow guide frame 5g, under the effect of the wall attachment effect of the fluid, part of the gas flow is guided to adhere to the vicinity of the inclined wall 5f (the circular corner surface can further ensure the smooth generation of the wall attachment effect), because part of the gas adheres to the peripheral inclined wall 5f of the involute pipeline, a negative pressure area appears in the middle of the flow guide cavity 5b to absorb the external gas flow into the lower opening 5e, and the adhered gas flow at the inclined wall 5f is transported upward to the air floating guide rail 5, this mode can obtain continuous and uniform surface jet gas flow of the fluid medium, after the surface gas flow is transmitted through the micro-hole array 5a of the air floating guide rail 5, a state-stable positive pressure gas film is formed, and the stability of the positive pressure gas film to float the wafer 4a is further ensured.

[0041] In the embodiment, a plurality of wafers 4a are attached above the bearing disc 4, the plurality of wafers 4a respectively form an outer circle center array and an inner circle center array, the diameter of the inscribed circle of the outer circle center array is a, the diameter of the circumscribed circle of the inner circle center array is b, the diameter of the inscribed circle of the inner circle center array is c, the diameter of the wafer 4a is r, and the distance between the air knife edge and the shovel knife edge is x, so that (a-b) / 2+r+c>x>r.

[0042] Through the above position arrangement, the maximum distance between the two edges is not more than (a-b) / 2+r+c, and the minimum distance is not more than x, which can ensure that after the workbench 2 is tilted and drives the bearing disc 4 to approach the air knife 8 and the shovel knife 7, the shovel knife edge is just located inside the inner circle center array, and the air knife edge is just located between the inner circle center array and the outer circle center array, so as to ensure the smooth implementation of the wafer peeling operation of the air knife 8 and the shovel knife 7.

[0043] In the embodiment, the micro-holes of the micro-hole array 5a have a diameter of 0.08mm-0.12mm, preferably 0.1mm. The 0.1mm diameter can form a more dense and fine micro-hole array, which can ensure that the gas flow formed after the positive pressure gas passes through the micro-hole array 5a has little fluctuation, the gas flow is dense and fine enough, and the uniformity of the positive pressure gas film is ensured, thereby ensuring the stability of the gas film supporting and floating the wafer conveying.

[0044] In other comparative examples, the micro-holes of the micro-hole array 5a have a diameter of 0.5mm. The 0.5mm diameter can form a more dense and fine micro-hole array, which can ensure that the gas flow formed after the positive pressure gas passes through the micro-hole array 5a has little fluctuation, the gas flow is dense and fine enough, and the uniformity of the positive pressure gas film is ensured, thereby ensuring the stability of the gas film supporting and floating the wafer conveying, making the wafer offset and touch or drift out of the air floating guide rail 5, causing damage.

[0045] In the embodiment, the hinge mechanism where the shovel 7 is located is provided with an execution motor 7a and an execution cylinder 7b, the hinge mechanism where the air knife 8 is located is provided with an adjustment motor 8a, the inclination angles of the shovel 7 and the air knife 8 are controlled by the execution motor 7a and the adjustment motor 8a respectively, the linear stroke of the shovel 7 is controlled by the execution cylinder 7b, and the execution cylinder 7b is a multi-position cylinder; the rotary frame 9 is provided with a rotary cylinder 9b and a double-shaft cylinder 9c, the rotary frame 9 is connected with the output shaft of the rotary cylinder 9b, and the cylinder body of the rotary cylinder 9b is connected with the output shaft of the double-shaft cylinder 9c.

[0046] Through the gas elastic characteristics of the execution cylinder 7b, it is ensured that the linear power of the shovel 7 for picking up the wafer has a certain buffering property, thereby preventing the possibility of impact damage to the wafer caused by the picking-up action, and through the selection design of the multi-position cylinder, the execution cylinder 7b has at least two stroke positions, thereby adapting to the picking-up position of the inner cavity wafer and the outer circle wafer.

[0047] In the embodiment, one side of the bearing disc 4 is provided with two symmetrically arranged sliding tables 2a, the other side of the bearing disc 4 is provided with two symmetrically arranged fixed tables 2b, each sliding table 2a and each fixed table 2b is provided with a positioning seat 2c, each positioning seat is provided with a transversely arranged positioning wheel through shaft hole cooperation, the sliding table 2a is a sliding mechanism arranged on a sliding rail, one side of the sliding table 2a is provided with a positioning cylinder 2e, and the output shaft of the positioning cylinder 2e is in transmission connection with the positioning seat 2c on the sliding table 2a.

[0048] Through the four positioning wheels 2d symmetrically arranged on both sides of the bearing disc 4, the bearing disc 4 can be accurately entered into the set position after being moved to the rotary table 3 each time by using the positioning wheel 2d to push and adjust, the normal rotation of the bearing disc 4 is not affected by the attachment rotation of the positioning wheel 2d, and the tendency of the bearing disc 4 to tilt, move horizontally or separate can be clamped and positioned by the four positioning wheels 2d, thereby further ensuring the position accuracy and operation stability of the bearing disc 4.

[0049] In the embodiment, the rotating actuator 3a is a servo motor, the rotating actuator 3a is fixed on the lifting platform 3b, the output shaft of the rotating actuator 3a is connected to the rotating platform 3, the thrust bearing 3c is embedded between the rotating platform 3 and the lifting platform 3b, and the plurality of lifting cylinders 3d are arranged on the workbench 2, and the output shafts of the plurality of lifting cylinders 3d are connected to support the lifting platform 3b.

[0050] The lifting platform 3b, the thrust bearing 3c and the rotating disc support the bearing disc 4, the lifting cylinders 3d provide support force and vertical movement force to the bearing disc 4, the support stability of the large-mass ceramic bearing disc 4 is ensured, and the rotating action is completed with the aid of the thrust bearing 3c, and then the high-precision angle positioning of the bearing disc 4 is performed by the servo motor.

[0051] In the embodiment, the distance adjusting actuator 1b is a multi-stage electric cylinder, the output shaft of the multi-stage electric cylinder is hingedly connected to the workbench 2, the multi-stage electric cylinder has the characteristics of long stroke and high precision, the inclination angle of the large-size workbench 2 is adjusted and the workbench 2 is placed at a suitable inclined position, and the wind knife 8 and the shovel knife 7 are accurately positioned in the work station; the disc surface of the bearing disc 4, the track surface of the air floating guide rail 5 and the U-shaped notch groove bottom surface of the collection plug 6 are parallel, so as to ensure the consistency of the sliding path of the wafer 4a.

[0052] The working principle of the embodiment is that the sapphire wafer automatic shovel method provided by the embodiment comprises the following steps:

[0053] S1 positioning: the bearing disc 4 and the wafer 4a array produced thereon are sent into the work station above the workbench 2 by the automatic carrier, the bearing disc 4 is placed on the rotating platform 3, preferably, the lifting platform 3b drives the rotating platform 3 to move upward by the pneumatic lifting cylinder 3d, the bearing disc 4 is more stably placed on the rotating platform 3, and then the lifting platform 3b and the rotating platform 3 are moved downward to the home position by the retracted lifting cylinder 3d; as shown in the figure, the positioning cylinder 2e is started to drive the sliding table 2a to slide, the two positioning wheels on one side of the bearing table are attached to the side wall of the bearing disc 4, the bearing disc 4 is pushed until the other side wall of the bearing disc 4 is attached to the positioning wheels on the two fixed tables 2b, the bearing disc 4 is transversely moved to the preset work station to complete the positioning work, so as to accurately dock the positions of the wind knife 8 and the shovel knife 7 in sequence; Figure 4

[0054] S2 inclination angle adjustment: as shown in the figure, the multi-stage electric cylinder 1a is started to drive the workbench 2 to rotate, the workbench 2 is rotated to the appropriate inclination angle, and the wind knife 8 and the shovel knife 7 are accurately positioned in the work station; Figure 5 ​As shown, the output shaft of the adjustable actuator 1b lifts one end of the worktable 2, causing the worktable 2 and the surface above it to tilt under the guidance of the hinge 1a at the other end. The electric cylinder precision function of the adjustable actuator 1b is used to stop the stroke, maintaining the worktable 2 at a standard tilt angle. The actuator motor 7a and the adjustment motor 8a are then activated to adjust the tilt angles of the scraper 7 and the air knife 8, respectively, so that the scraper blade 7x enters the inner ring center array of the wafer 4a, and the air knife blade 8x enters the area between the inner and outer ring center arrays of the wafer 4a. The positions of the air knife blade 8x and the scraper blade 7x are as follows: Figure 2 As shown, at the same time, ensure that the 9x position of the chuck end is aligned with the wafer 4a of the inner cavity center array;

[0055] S3 Inner Ring Peeling: (e.g., ...) Figure 6 As shown, the actuating cylinder 7b is activated, causing its output shaft to extend the scraper 7. Simultaneously, the actuating motor 7a is activated to adjust the tilt angle of the scraper 7 until it contacts the wafers 4a of the inner ring array. This ensures that the scraper blade 7x abuts against the corner formed by the side wall of the inner ring wafer 4a and the surface of the carrier disk 4. The actuating cylinder 7b is then activated again, causing the scraper 7 to scrape into the gap between the inner ring wafer 4a and the carrier disk 4, lifting one end of the inner ring wafer 4a by the scraper 7. This reduces the adhesion between the wafer 4a and the carrier disk 4. The multi-position output function of the actuating cylinder 7b is used to stop the scraper at the first stroke position to prevent damage to the wafer 4a. The dual-axis cylinder 9c is activated, causing the rotating frame 9 to move downwards. This allows the vacuum suction cup 9a at one end of the rotating frame 9 to adhere to and hold the lifted inner ring wafer 4a. The dual-axis cylinder 9c is activated again, causing the rotating frame 9 to move the vacuum suction cup 9a and the wafer 4a upwards, forming a... Figure 7 As shown in the diagram, the inner ring stripping process is complete.

[0056] In this step, since the lifting operation of the scraper 7 only needs to form a small contact area with the corner of the wafer 4a, the remaining peeling operation is completed by the vacuum chuck 9a. Therefore, the fragile wafer 4a can be protected from physical damage and its quality can be ensured.

[0057] S4 Inner Ring Transfer: Start the rotary cylinder 9b to rotate the rotating frame 9, to the left (direction depends on...). Figure 7 The vacuum chuck 9a and wafer 4a are moved by the rotating frame 9 to the upper part of the right air-bearing guide rail 5, forming a shape like... Figure 8As shown in the state, at this time, the positive pressure device 5c is started to release the positive pressure airflow to the air floating guide rail 5 through the flow guide cavity 5b, and the positive pressure airflow is uniformly dispersed through the micro-pore array 5a of the air floating guide rail 5 and forms a positive pressure air film on the guide rail surface. The vacuum source of the vacuum chuck 9a is turned off to release the wafer 4a, so that the wafer 4a falls onto the air floating guide rail 5 and is floated by the positive pressure air film. Under the action of gravity, the wafer 4a in the drift state is guided by the air floating guide rail 5 in the inclined state and the positive pressure air film to the collection card slot in the obliquely downward direction. The wafer 4a is flexibly floated by the positive pressure air film to avoid physical impact on the wafer 4a, so as to ensure the quality of the wafer. At the same time, the inner wall of the collection card slot can be provided with a flexible material (such as sponge or plush) to further buffer and protect the lateral impact of the wafer 4a.

[0058] In this step, after the positive pressure device 5c is started, the positive pressure airflow fills in the flow guide cavity 5b and is released from the air outlet seam at the flow guide frame 5g. By means of the arc surface of the inclined wall 5f and the transition structure of the arc surface and the outer round corner of the lower opening 5e, part of the upward released positive pressure airflow is attached to the vicinity of the inclined wall 5f under the action of the airflow wall attachment effect, and a continuous and stable positive pressure air film is formed on the wafer 4a. Figure 11 As shown in the state, at this time, part of the gas is guided to the peripheral inclined wall 5f, a negative pressure area appears in the middle of the flow guide cavity 5b to absorb the external air at the open area of the lower opening 5e, so that the positive pressure airflow and the external airflow jointly form a continuous and uniform surface-shaped jet airflow. After passing through the micro-pore array 5a of the air floating guide rail 5, a continuous and stable positive pressure air film is formed. The surface-shaped jet airflow outputted by means of the wall attachment effect is uniform in intensity and stable in state, and there is no defect of discontinuous fluid medium and large intensity difference caused by the air cutting of the traditional fan. Therefore, the stability of the positive pressure air film floating the wafer 4a can be further ensured, and the quality of the wafer transfer process is guaranteed.

[0059] S5 inner circle collection: the rotating member 3a is started to drive the rotating disc and the bearing disc 4 to rotate, so that the remaining wafers 4a in the inner circle array are aligned with the inlet of the air floating guide rail 5. The operations of S3 and S4 are repeated to peel off and transfer the remaining wafers 4a in the inner circle array one by one into the collection card slot. The vertical moving module 6a is controlled synchronously to adjust the vertical position of the collection card slot, so as to provide more storage space and complete the collection of all the wafers 4a in the inner circle array. The above-mentioned fully automatic operation can ensure the consistency of the collected wafer sequence.

[0060] S6 outer circle peeling: as shown in the state, Figure 9As shown, when the inner circle wafer sheet 4a is fully collected, the execution cylinder 7b is started to drive the output shaft to extend the shovel 7, and the execution motor 7a is started to adjust the inclination of the shovel 7 until the shovel 7 contacts the wafer sheet 4a of the outer circle array, and the blade edge 7x of the shovel 7 is ensured to abut against the corner formed by the side wall of the wafer sheet 4a of the outer circle and the surface of the bearing disc 4. The execution cylinder 7b is continuously started to drive the shovel 7 to shovel into the gap between the wafer sheet 4a of the outer circle and the bearing disc 4, so that one end of the wafer sheet 4a of the outer circle is lifted by the shovel 7 to reduce the adhesion between the wafer sheet 4a and the bearing disc 4. At the same time, the output of the air knives 8 on both sides is started to spray air flow, as shown in Figure 12 As shown, the air flow sprayed from both sides forms sufficient transverse force on the wafer sheet 4a in the middle, and the wafer sheet 4a lifted by the shovel 7 is blown and slid by the transverse force of the air flow on both sides to the entrance of the air floating guide rail 5, and the outer circle peeling operation is completed.

[0061] In this step, since the lifting operation of the shovel 7 only needs to form a small contact part with the corner of the wafer sheet 4a, and the remaining peeling operation is completed by the air knives 8 on both sides, the wafer sheet 4a with brittle texture can be prevented from being physically damaged to ensure its quality.

[0062] S7: outer circle transfer, as shown in Figure 10 The wafer sheet 4a peeled off is blown by the air knives 8 on both sides to slide onto the air floating guide rail 5, and the wafer sheet 4a is floated by the surface positive pressure air film of the air floating guide rail 5, and is guided to the collection slot under the action of gravity. The floating process of the positive pressure air film is the same as that in step S4, so as to ensure the stable transportation of the wafer sheet 4a.

[0063] S8: outer circle collection, the rotating member 3a is started to drive the rotating disc and the bearing disc 4 to rotate, so that any remaining wafer sheet 4a of the outer circle array is aligned with the entrance of the air floating guide rail 5. The operations of steps S6 and S7 are repeated to peel off and transfer the remaining wafer sheets 4a of the outer circle array one by one into the collection slot. The vertical position of the collection slot is adjusted by the vertical module 6a, so as to provide more storage space and complete the collection operation of all wafer sheets 4a of the outer circle array. The consistency of the collected wafer sheets is ensured by the above-mentioned fully automatic operation.

[0064] Through the above-mentioned operation, the wafer sheet 4a array arranged in multiple circles, with brittle texture and adhesion to the bearing disc 4, is safely peeled off, transferred and transported. At the same time, the separation and transfer operation of the wafer and the carrier is highly automated, the labor intensity is effectively reduced, the production efficiency is improved, the wafer quality is ensured, the consistency of the collected wafer sheets is ensured, and the production benefit of the wafer manufacturing industry is increased.

[0065] The above merely illustrates the preferred embodiments of the present application, and is not intended to limit the form of the present application, and it should be understood that, within the scope of the features defined in the claims, other equivalent modifications and changes can be made to the embodiments, and these should be covered within the protection scope of the present application.

Claims

1. A device for automatically dicing a sapphire wafer, comprising a mounting frame, characterized in that: The mounting frame is provided with a hinge base, a distance adjusting actuator, and a workbench arranged at intervals, one end of the workbench is hingedly mounted with the hinge base, and the other end is connected with an output shaft of the distance adjusting actuator; a rotating table driven by a rotating actuator is arranged on the workbench, a bearing disc is arranged above the rotating table, a gas floating guide rail and a collecting clamp are sequentially arranged on one side of the bearing disc; the gas floating guide rail is fixed on the workbench, the inlet of the gas floating guide rail is aligned with the bearing disc, the guide rail surface of the gas floating guide rail is provided with a plurality of micropores arranged at equal intervals to form a micropore array, and a flow guide cavity is arranged at the bottom of the gas floating guide rail; the collecting clamp is an open container provided with a plurality of U-shaped notches on one side, and the U-shaped notches are aligned with the outlet of the gas floating guide rail, the collecting clamp is connected with a vertical moving module, the vertical moving module has a vertical driving function and is arranged on the workbench; a shovel, an air knife, and a rotating frame are arranged at intervals above the bearing disc, the shovel and the air knife are mounted on the mounting frame through a hinged mechanism, and one end or both ends of the rotating frame are provided with a downward vacuum chuck through a rotating mechanism; The cavity extension path of the flow guide cavity is in a closed frame structure, the long and wide dimensions of the upper opening of the frame structure are greater than the corresponding dimensions of the lower opening, the upper opening is seamlessly connected with the gas floating guide rail, the lower end of the lower opening is empty, a flow guide frame is arranged in the lower opening, the outer wall profile of the flow guide frame and the inner wall profile of the lower opening form an equidistant array, the outer wall of the flow guide frame and the inner wall of the lower opening are clamped to form an air outlet gap, and the air outlet gap is in through communication with the inner cavity of the flow guide cavity; a positive pressure device is arranged beside the flow guide cavity, the positive pressure end of the positive pressure device is in through communication with the inner cavity of the flow guide cavity through a pipeline; an inclined wall is arranged on the inner wall of the flow guide cavity, the inner side of the inclined wall is an arc surface protruding inward, the junction between the inner side of the inclined wall and the inner side of the lower opening forms an external fillet, and the junction between the inner side of the inclined wall and the inner side of the upper opening forms an internal fillet.

2. The automatic sapphire wafer spade device according to claim 1, wherein: The shovel, the air knife body, and the rotating frame body all form an acute angle with the bearing disc, and the air knife is provided with at least two and is symmetrically distributed with the axial section of the bearing disc.

3. The automatic sapphire wafer spade device of claim 1, wherein: A plurality of wafer slices are attached above the bearing disc, and the plurality of wafer slices respectively form an outer circle center array and an inner circle center array, the diameter a of the inscribed circle of the outer circle center array, the diameter b of the circumscribed circle of the inner circle center array, the diameter c of the inscribed circle of the inner circle center array, the diameter r of the wafer slice, and the distance x between the air knife edge and the shovel edge satisfy: (a-b) / 2+r+c>x>r.

4. The automatic sapphire wafer spade device of claim 1, wherein: The micropore diameter of the micropore array is 0.08mm-0.12mm.

5. The automatic sapphire wafer shoveling device of claim 1, wherein: The hinge mechanism where the shovel blade is located is provided with an execution motor and an execution cylinder, the hinge mechanism where the air knife is located is provided with an adjustment motor, the inclination angles of the shovel blade and the air knife are controlled by the execution motor and the adjustment motor respectively, the linear stroke of the shovel blade is controlled by the execution cylinder, and the execution cylinder is a multi-position cylinder; a rotary cylinder and a double-shaft cylinder are arranged above the rotary frame, the rotary frame is connected with an output shaft of the rotary cylinder, and a cylinder body of the rotary cylinder is connected with an output shaft of the double-shaft cylinder.

6. The automatic sapphire wafer shoveling device of claim 1, wherein: The bearing disc is provided with two symmetrically arranged sliding tables on one side and two symmetrically arranged fixed tables on the other side, the sliding tables and the fixed tables are each provided with a positioning seat, each positioning seat is provided with a transversely arranged positioning wheel through a shaft hole, the sliding tables are arranged on sliding rails, and the sliding tables are provided with positioning cylinders on one side, and output shafts of the positioning cylinders are in transmission connection with the positioning seats.

7. The automatic sapphire wafer shoveling device of claim 1, wherein: The rotary execution member is one of a servo motor and a stepping motor, a body of the rotary execution member is fixed on a lifting table, an output shaft of the rotary execution member is connected with the rotary table, a thrust bearing is embedded between the rotary table and the lifting table, a plurality of lifting cylinders are arranged on the workbench, and output shafts of the plurality of lifting cylinders are connected to commonly support the lifting table.

8. The automatic sapphire wafer shoveling device of claim 1, wherein: The distance adjustment execution member is one of a multi-stage cylinder, a multi-stage electric cylinder and a multi-stage oil cylinder, an output shaft of the distance adjustment execution member is in hinged connection with the workbench, and disc surfaces of the bearing disc, the air floating guide rail and the U-shaped groove of the collection cassette are parallel.

9. A method for automatically dicing a sapphire wafer, comprising the automatic dicing apparatus according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: S1 positioning: the bearing disc and the wafer array produced thereon are sent to a workbench by an automatic carrier, the bearing disc is placed on a rotary table, a positioning cylinder is started to drive the sliding table to slide through an output shaft of the positioning cylinder, two positioning wheels on one side of the bearing table are attached to the side walls of the bearing disc, and the bearing disc is pushed to the other side of the bearing disc until the side walls of the bearing disc are attached to the positioning wheels on the two fixed tables, so that the bearing disc is transversely moved to a preset work station to complete the positioning work; S2 inclination angle adjustment: an output shaft of the distance adjustment execution member is started to lift one end of the workbench, the workbench and the wafer array thereon enter an inclined state under the guidance of the other end of the hinge seat, a limiting piece or a precision functional piece is used to stop the distance adjustment execution member, the workbench maintains a standard inclination angle, an execution motor and an adjustment motor are started to adjust the inclination angles of the shovel blade and the air knife respectively, the cutting edge of the shovel blade enters the inner circle center array of the wafers, and the cutting edge of the air knife enters the region between the inner circle center array and the outer circle center array of the wafers; S3 inner circle peeling: an execution cylinder is started to drive the shovel blade to extend through an output shaft of the execution cylinder, the execution motor is started to adjust the inclination angle of the shovel blade, until the shovel blade contacts the wafers in the inner circle array, the cutting edge of the shovel blade is ensured to abut against the corner formed by the side wall of the inner circle wafer and the surface of the bearing disc, the execution cylinder is continuously started to make the shovel blade enter the gap between the inner circle wafer and the bearing disc, so that one end of the inner circle wafer is lifted by the shovel blade; a double-shaft cylinder is started to move the rotary frame downward, a vacuum suction cup at one end of the rotary frame is attached to and sucks the lifted inner circle wafer, the double-shaft cylinder is started again to move the rotary frame, the vacuum suction cup and the wafer upward, and the inner circle peeling work is completed; S4 inner circle transport: start rotating the cylinder to rotate the rotating frame, the vacuum chuck and the wafer are driven by the rotating frame to the above air floating guide rail, start the positive pressure device to make the positive pressure air flow through the guide cavity to the air floating guide rail, and the positive pressure air flow is uniformly dispersed through the micro-hole array of the air floating guide rail and forms a positive pressure air film on the guide rail surface, the vacuum source of the vacuum chuck is disconnected to release the wafer, the wafer falls onto the air floating guide rail and is floated by the positive pressure air film, and under the action of gravity, the wafer in the drift state is guided to the collection card slot below by the air floating guide rail and the positive pressure air film in the inclined state; S5 inner circle collection: start the rotating actuator to rotate the rotating disc and the bearing disc, so that any remaining wafer of the inner circle array is aligned with the air floating guide rail inlet, and the operations of S3 and S4 are repeated to peel off and transport the remaining wafers of the inner circle array one by one into the collection card slot, and the vertical movement module is controlled synchronously to adjust the vertical position of the collection card slot, so as to provide more storage space and complete the collection work of all wafers of the inner circle array; S6 outer circle peeling: start the execution cylinder to drive the output shaft of the shovel to extend, and synchronously start the execution motor to adjust the inclination angle of the shovel until the shovel contacts the wafer of the outer circle array, so as to ensure that the edge of the shovel is in contact with the corner formed by the side wall of the outer circle wafer and the surface of the bearing disc, continue to start the execution cylinder to make the shovel enter the gap between the outer circle wafer and the bearing disc, so that one end of the outer circle wafer is lifted by the shovel; synchronously open the output of the two side air knives to blow air flow, so that the outer circle wafer lifted at one end is blown and slid by the air flow of the two sides to the adjacent air floating guide rail inlet, and the outer circle peeling work is completed; S7 outer circle transport: the peeled outer circle wafer is blown and slid by the two side air knives to the air floating guide rail, and the wafer is floated by the positive pressure air film on the surface of the air floating guide rail, and under the action of gravity, the wafer is guided into the collection card slot; S8 outer circle collection: start the rotating actuator to rotate the rotating disc and the bearing disc, so that any remaining wafer of the outer circle array is aligned with the air floating guide rail inlet, and the operations of S6 and S7 are repeated to peel off and transport the remaining wafers of the outer circle array one by one into the collection card slot, and the vertical movement module is controlled synchronously to adjust the vertical position of the collection card slot, so as to provide more storage space and complete the collection work of all wafers of the outer circle array.

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