Electronic device cooling system

By combining an airtight electronic device housing and a heat exchanger with a baffle system, and utilizing the pressure difference of the cooling fluid circulation and vapor compression system or a pump drive, the problem of electronic device cooling systems being affected by heat, moisture and dust is solved, achieving efficient cooling and protection.

CN116261308BActive Publication Date: 2026-03-10JOHNSON CONTROLS TYCO IP HLDG LLP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2018-07-19
Publication Date
2026-03-10

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Abstract

An electronic device cooling system (42) is disclosed herein, the electronic device cooling system having an hermetically sealed electronic device housing (40). The system (42) includes a heat exchanger (116) that exchanges heat between a first cooling fluid (108) within the electronic device housing (40) and a second cooling fluid (118) of a vapor compression system (14). A fan (124) circulates the first cooling fluid (108) within the electronic device housing (40). The electronic device cooling system (42) may further include a baffle system (126) located within the electronic device housing (40) that guides the first cooling fluid (108) through one or more electronic components (114) arranged within the electronic device housing (40) to cool the one or more electronic components (114).
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Citation Information

Patent Citations

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