LED driver backplane and display device

Abstract

This disclosure provides a light-emitting diode (LED) driving backplane and a display device, belonging to the field of display technology. The LED driving backplane of this disclosure includes: a substrate divided into multiple light-emitting lamp areas, and a first wiring area surrounding the light-emitting lamp areas; at least one pair of first connection pads, multiple signal traces, and auxiliary functional components, all disposed on the substrate, wherein the at least one pair of first connection pads and the auxiliary functional components are disposed in the light-emitting lamp areas; the signal traces are disposed in the first wiring area; wherein each pair of the at least one pair of first connection pads includes a positive pad and a negative pad, and the signal traces are electrically connected to the corresponding positive and negative pads to provide driving signals; the auxiliary functional components are disposed on the same layer as at least a portion of the multiple signal traces.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, and specifically relates to a light-emitting diode-driven backplane base display device. Background Technology

[0002] Micro / Mini-LED display technology, as a new generation of display technology, boasts advantages such as high brightness, high luminous efficiency, and low power consumption. Mini LED has two main applications: backlighting and display. Mini LED backlighting, combined with a traditional liquid crystal display (LCD) panel, can achieve high contrast, high color gamut, high brightness, and high dynamic range lighting effects through local dimming. Currently, it is mainly used in televisions, touch displays, and automotive products. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and provides a light-emitting diode driving backplane and display device.

[0004] In a first aspect, embodiments of this disclosure provide a light-emitting diode driving backplane, which includes:

[0005] The substrate is divided into multiple light-emitting areas and a first wiring area surrounding the light-emitting areas;

[0006] At least one pair of first connection pads, multiple signal traces, and auxiliary functional components are all disposed on the substrate. The at least one pair of first connection pads and the auxiliary functional components are disposed in the light-emitting lamp area. The signal traces are disposed in the first wiring area. Each pair of the at least one pair of first connection pads includes a positive pad and a negative pad, and the signal traces are electrically connected to the corresponding positive pads and negative pads. The auxiliary functional components are disposed on the same layer as at least a portion of the multiple signal traces.

[0007] The first connection pads are in multiple pairs; the LED driving backplane also includes at least one first connection trace located in the light-emitting lamp area; in any light-emitting lamp area, one first connection trace is connected to the positive pad in one pair of first connection pads and the negative pad in another pair of first connection pads, so that the LEDs to be installed are connected in series.

[0008] The LED driving backplane includes a first conductive layer; the first conductive layer includes the first connection trace and the auxiliary functional component.

[0009] Each of the light-emitting lamp areas includes multiple pairs of the first connection pads arranged in an array, and the multiple pairs of the first connection pads define a receiving area, wherein the auxiliary functional components in each of the light-emitting lamp areas are located within the receiving area.

[0010] The plurality of light-emitting areas form multiple groups of light-emitting areas along a first direction, and each group of light-emitting areas includes a plurality of light-emitting areas arranged side by side along a second direction; any auxiliary component includes a main structure and a first connecting structure surrounding and electrically connected to the main structure, and the first connecting structure of the auxiliary component arranged adjacent to it in the second direction is electrically connected through a second connecting structure.

[0011] The light-emitting diode driving backplane includes a second conductive layer disposed on the side of the auxiliary structure opposite to the substrate; the second conductive layer includes a second connection structure and a first connection pad.

[0012] The LED driving backplane includes: a first conductive layer, a first insulating layer, and a second conductive layer sequentially disposed along a direction away from the substrate; the first conductive layer includes the auxiliary functional component and the first connection trace; the second conductive layer includes the second connection structure; the second connection structure is electrically connected to the first connection structure through a via penetrating the first insulating layer.

[0013] The minimum spacing between the first connection structure and the first connection trace is not less than twice the line width of the first connection structure.

[0014] The plurality of light-emitting areas form multiple groups of light-emitting areas along a first direction, and each group of light-emitting areas includes multiple light-emitting areas arranged side by side along a second direction; the plurality of signal traces include a first power signal line and a second power signal line; the first power signal line is electrically connected to the corresponding positive terminal connection pad, and the second power signal line is electrically connected to the corresponding negative terminal connection pad; the first power signal line and the second power signal line are respectively located on two opposite sides of a group of light-emitting areas in the first direction, and the first power signal line and the second power signal line in the LED driving backplane are alternately arranged.

[0015] The LED driving backplane further includes: multiple sets of second connection pads, and the multiple signal traces further include: multiple working indicator signal lines;

[0016] Each of the multiple sets of second connection pads is configured to electrically connect the driver chip to be installed to the corresponding working indicator signal line and the second power signal line, so that the second power signal output by the second power signal line is output to the corresponding negative connection pad under the control of the driver chip; one of the driver chips is configured to control the luminous brightness of the light-emitting diode to be installed in one of the light-emitting areas.

[0017] Each group of second connection pads includes a second power connection pad, a work indicator connection pad, an output connection pad, and a control connection pad; the second power connection pad and the work indicator connection pad are arranged side by side in the second direction; the second power connection pad is electrically connected to the second power signal line through a second connection trace; the work indicator connection pad is electrically connected to the work indicator signal line through a third connection trace.

[0018] In a set of second connection pads, the second power signal line electrically connected to the second power connection pad and the work indicator signal line electrically connected to the work indicator connection pad are located on the same side of a set of lamp areas; the work indicator signal line includes signal line segments spaced apart, and a connecting segment electrically connecting adjacent signal line segments; and the orthographic projection of the connecting segment on the substrate intersects with the orthographic projection of the second connection trace on the substrate.

[0019] The LED driving backplane includes: a first conductive layer, a first insulating layer, and a second conductive layer sequentially disposed along a direction away from the substrate; the first conductive layer includes the auxiliary functional component, the first power signal line, the second power signal line, the second connection trace, the third connection trace, and the connection segment; the second conductive layer includes the second power connection pad, the working indicator connection pad, the output connection pad, the control connection pad, and the connection segment.

[0020] In any given set of light areas, the control connection pad corresponding to the Nth light-emitting light area is connected to the output connection pad connected to the negative electrode connection pad in the (N+1)th light-emitting light area via a fourth connection trace; N is an integer greater than or equal to 1.

[0021] The first conductive layer further includes the third connection trace.

[0022] The auxiliary functional components include an antenna array.

[0023] The auxiliary functional component includes a conductive mesh structure.

[0024] The substrate further includes a bonding area; the bonding area is provided with a third connection pad; the signal trace extends from the first wiring area to the bonding area and is electrically connected to the third connection pad.

[0025] The LED driving backplane includes: a first conductive layer, a first insulating layer, and a second conductive layer sequentially disposed along a direction away from the substrate; the first conductive layer includes the auxiliary functional component; and the second conductive layer includes the first connection pad and the third connection pad.

[0026] The LED driving backplate serves as a backlight source.

[0027] Secondly, embodiments of this disclosure provide a display device that includes any of the aforementioned light-emitting diode driving backplanes. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a backplane for a light-emitting diode according to an embodiment of the present disclosure.

[0029] Figure 2 This is a partial planar schematic diagram of the backplane of a light-emitting diode according to an embodiment of the present disclosure.

[0030] Figure 3 This is a schematic diagram of a millimeter-wave antenna array on a backplane of a light-emitting diode according to an embodiment of the present disclosure.

[0031] Figure 4 for Figure 2 The AA' cross-sectional view in the diagram.

[0032] Figure 5 This is a partial planar schematic diagram of the backplane of a light-emitting diode according to an embodiment of the present disclosure.

[0033] Figure 6 This is a schematic diagram of the wiring at a set of second connection pads in the backplane of a light-emitting diode according to an embodiment of the present disclosure.

[0034] Figure 7 for Figure 2 BB' cross-sectional view.

[0035] Figure 8 This is a partial planar schematic diagram of the backplane of a light-emitting diode according to an embodiment of the present disclosure.

[0036] Figure 9 This is a cross-sectional view of the third connection pad location in the backplane of the light-emitting diode according to an embodiment of this disclosure.

[0037] Figure 10 This is a flowchart illustrating a method for fabricating a backplane for a light-emitting diode according to an embodiment of the present disclosure. Detailed Implementation

[0038] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0040] Firstly, this disclosure provides a light-emitting diode (LED) driving backplane, which can be applied to both backlighting and display. This disclosure uses the application of the LED driving backplane in backlighting as an example, meaning the LED driving backplane can be at least a partial structure of the backlight source. Specifically, the LED driving backplane in this disclosure integrates auxiliary functional components, including but not limited to a millimeter-wave antenna array 2. When the auxiliary functional component is a millimeter-wave antenna array 2, the display device using this LED driving backplane can achieve air-based human-computer interaction, such as gesture recognition. In the following description, the auxiliary functional component is described as a millimeter-wave antenna array 2. The LED driving backplane in this disclosure is described in detail below.

[0041] Figure 1 This is a schematic diagram of the backplane of a light-emitting diode according to an embodiment of the present disclosure; Figure 2 This is a partial planar schematic diagram of the backplane of a light-emitting diode according to an embodiment of the present disclosure; Figure 3 This is a schematic diagram of the millimeter-wave antenna array 2 of the backplane of the light-emitting diode according to an embodiment of the present disclosure; Figure 4 for Figure 2 The AA' cross-sectional view in the diagram. (See example...) Figure 1-4As shown, the LED driving backplane in this embodiment may include a substrate 10 and at least one pair of first connection pads 3, multiple signal traces, and a millimeter-wave antenna array 2 disposed on the substrate 10. The substrate 10 is divided into functional areas and bonding areas disposed on at least one side of each functional area. Each functional area is further divided into multiple LED areas Q1 and first wiring areas Q2 surrounding the LED areas Q1. Each LED area Q1 has at least one pair of first connection pads 3, each pair including a positive connection pad 31 and a negative connection pad 32, respectively used for electrical connection to the positive and negative terminals of the LED to be installed. Each LED area Q1 also has a millimeter-wave antenna array 2 for signal reception and transmission. Signal traces are disposed in the first wiring area Q2 and configured to be electrically connected to the corresponding positive and negative connection pads 31 and 32, providing driving signals to drive the LEDs to emit light after installation.

[0042] As can be seen from this, millimeter-wave antenna array 2 is provided in each light-emitting area Q1 of the light-emitting diode driving backplane in this embodiment of the present disclosure. Therefore, when the backplane is applied to a display device, the millimeter-wave antenna array 2 can be controlled to work to realize signal reception and transmission, thereby realizing functions such as gesture recognition.

[0043] In some examples, each light-emitting area Q1 includes multiple pairs of first connection pads 3. It is understood that each pair of first connection pads 3 is configured to electrically connect to one light-emitting diode (LED). In this case, multiple pairs of first connection pads 3 are provided in the light-emitting area Q1, meaning that multiple LEDs can be installed in each light-emitting area Q1. Since the backplate of this embodiment can be used as a backlight for a display device, to ensure uniform light emission, after installing multiple LEDs in each light-emitting area Q1, the multiple LEDs are arranged evenly, for example, in an array. Therefore, the multiple pairs of first connection pads 3 in each light-emitting area Q1 are preferably arranged evenly, for example, in an array. Figure 2 Taking each light-emitting area Q1 as an example, it includes four pairs of first connecting pads 3, and the four pairs of first connecting pads 3 are arranged in a 2*2 array. Furthermore, the area defined by the four pairs of first connecting pads 3 is rectangular, and the millimeter-wave antenna array 2 is then placed within this rectangular area. This arrangement ensures that the millimeter-wave antenna arrays 2 in the backplane are also evenly arranged in an array, thereby guaranteeing the uniformity of induction. It should be noted that this embodiment is only used as an example... Figure 2 As shown, each light-emitting area Q1 includes four pairs of first connection pads 3, and the area defined by the four first connection pads 3 is rectangular. In actual products, the number of pairs of first connection pads 3 in each light-emitting area Q1 is not limited to four, and the shape of the defined area is not limited to a rectangle. In this embodiment, no specific limitation is made.

[0044] Continue to refer to Figure 2 Each light-emitting area Q1 includes not only multiple pairs of first connection pads 3, but also first connection traces 41 that connect the light-emitting diodes in series after each pair of first connection pads 3 electrically connects them. Specifically, each first connection trace 41 can electrically connect the positive connection pad 31 of one pair of first connection pads 3 to the negative connection pad 32 of the other. In some examples, a first conductive layer is provided on the substrate 10, which includes the first connection traces 41 and the millimeter-wave antenna array 2. That is, the first connection traces 41 and the millimeter-wave antenna array 2 are disposed in the same layer and are made of the same material, so a pattern including the first connection traces 41 and the millimeter-wave antenna array 2 can be formed in a single patterning process.

[0045] Furthermore, in this embodiment of the present disclosure, the plurality of light-emitting lamp areas Q1 in the backplane are arranged in an array. These arrayed light-emitting lamp areas Q1 form multiple groups of lamp areas Q10 arranged side-by-side along the first direction X. Each group of lamp areas Q10 includes a plurality of light-emitting lamp areas Q1 arranged side-by-side along the second direction Y. Each millimeter-wave antenna array 2 includes a main body structure 21 and a first connection structure 22 surrounding the main body structure 21 and electrically connected to it. The first connection structure 22 can serve as a transmission line for the millimeter-wave antenna array 2. In the same group of lamp areas Q10, adjacent first connection structures 22 of the millimeter-wave antenna array 2 are electrically connected through a second connection structure 6. In some examples, to ensure better electrical connection of the millimeter-wave antenna array 2, the number of second connection structures 6 electrically connecting two adjacent first connection structures 22 can be multiple. In some examples, the orthographic projections of the second connection structure 6 and the first connection structure 22 electrically connected to it on the substrate 10 overlap, while the orthographic projections of the second connection structure 6 and the main body structure 21 on the substrate 10 do not overlap. Of course, the second connection structure 6 in this embodiment of the present disclosure only needs to ensure that the adjacent millimeter-wave antenna arrays 2 in the same group of lamp areas Q10 can be electrically connected to transmit microwave signals.

[0046] In this embodiment, the millimeter-wave antenna array 2 is located within the area defined by multiple pairs of first connection pads 3 in the light-emitting area Q1. After each pair of first connection pads 3 is electrically connected to a light-emitting diode, the light-emitting diodes are connected in series via first connection traces 41. Therefore, the millimeter-wave antenna array 2 is confined within the area defined by the first connection traces 41. However, since the first connection traces 41 are used to transmit electrical signals that drive the light-emitting diodes, the spacing between the first connection traces 41 and the first connection structure 22 of the millimeter-wave antenna array 2 must be reasonably set to avoid interference. In some examples, the minimum distance between the first connection traces 41 and the first connection structure 22 is twice the linewidth of the first connection structure 22. For example, if the linewidth of the first connection structure 22 is approximately 100 μm, the minimum distance between the first connection traces 41 and the first connection structure 22 is not less than 200 μm. In some examples, the main structure 21 of the millimeter-wave antenna array 2 adopts a conductive mesh structure, and the maximum width of the hollow part of the conductive mesh structure is 50-100μm; the included angle of some hollow parts is in the range of 80-90°. Taking each hollow part as a rhombus as an example, the angle of one pair of corners is 80°-90°, and the range of the other pair of corners is 90°-100°.

[0047] In some examples, the backplane in this embodiment includes a first conductive layer, a first insulating layer 7, and a second conductive layer sequentially disposed along a path away from the substrate 10. The first conductive layer includes the aforementioned first connection trace 41, the main structure 21 of the millimeter-wave antenna array 2, and the first connection structure 22. The second conductive layer includes the aforementioned second connection structure 6 and multiple pairs of first connection pads 3. In this case, the first connection pads 3 need to be electrically connected to the corresponding first connection trace 41 through vias penetrating the first insulating layer 7; the second connection structure 6 needs to be electrically connected to the corresponding first connection structure 22 through vias penetrating the first insulating layer 7.

[0048] Continue to refer to Figure 2In this embodiment, the backplane signal traces include at least multiple first power signal lines 11 and multiple second power signal lines 12. For any light-emitting area Q1, the positive connection pad 31 not connected to the first connection trace 41 is connected to the first power signal line 11, and the negative connection pad 32 not connected to the first connection trace 41 is connected to the second power signal line 12. Since the second power signal line 12 is connected to the negative connection pad 32, the second power signal line 12 can be a ground signal line. For clarity, the positive connection pad 31 connected to the first power signal line 11 in each light-emitting area Q1 is referred to as the first positive connection pad 31, and the negative connection pad 32 connected to the second power signal line 12 is referred to as the last negative connection pad 32. After the light-emitting diodes are installed in the light-emitting area Q1, the voltage signals output from the first power signal line 11 and the second power signal line 12 provide the operating voltage for the light-emitting diodes to control their operation.

[0049] Furthermore, the first positive connection pad 31 of each light-emitting area Q1 in the same group of light areas Q10 is electrically connected to the same first power signal line 11, and the last negative connection pad 32 is electrically connected to the same second power signal line 12. In some examples, the first power signal line and the second power signal line 12 electrically connected in a group of light areas Q10 are respectively set on two opposite sides of the group of light areas Q10 in the first direction X. This arrangement is made to make the wiring in the backplane more uniform and facilitates wiring.

[0050] Furthermore, in some examples, the first power signal line 11 and the second power signal line 12 are located on the same layer and are made of the same material. For example, both the first power signal line 11 and the second power signal line 12 are disposed on the same layer as the millimeter-wave antenna array 2, that is, the first power signal line 11 and the second power signal line 12 can also belong to part of the structure of the first conductive layer described above. This facilitates the thinner and lighter design of the LED driving backplane.

[0051] In some examples, Figure 5 This is a partial planar schematic diagram of the backplane of a light-emitting diode according to an embodiment of the present disclosure;

[0052] Figure 6 This is a schematic diagram of the wiring at the location of a set of second connection pads 5 in the backplane of the light-emitting diode according to an embodiment of the present disclosure; Figure 7 for Figure 2 The BB' cross-sectional view in the image. (See image below.) Figure 5-7As shown, this embodiment of the present disclosure also provides a backplane for light-emitting diodes capable of brightness adjustment. This backplane includes not only the aforementioned structure but also multiple sets of second connection pads 5 corresponding one-to-one with the light-emitting lamp areas Q1. The signal traces include not only the aforementioned first power signal line 11 and second power signal line 12 but also a working indicator signal line 13. Each set of second connection pads 5 is configured to be electrically connected to a driver chip and to the working indicator line and second power signal line 12. The signal output by the working indicator line is configured to provide power to the connected driver chip. The second power signal output by the second power signal line 12 is output to the corresponding negative connection pad 32 under the control of the driver chip. One of the driver chips is configured to control the brightness of the light-emitting diodes to be installed in a light-emitting lamp area Q1.

[0053] For example: refer to Figure 5-7Each group of second connection pads 5 includes four connection pads: a second power connection pad 51, a work indicator connection pad 53, an output connection pad 52, and a control connection pad 54. The second power connection pads 51, work indicator connection pads 53, output connection pads 52, and control connection pads 54 are arranged in a 2*2 array. The second power connection pads 51 and work indicator connection pads 53 are arranged side by side in the second direction Y, and the output connection pads 52 and control connection pads 54 are arranged side by side in the second direction Y. The second power connection pads 51 and output connection pads 52 are arranged side by side in the first direction X, and the control connection pads 54 and work indicator pads are arranged side by side in the first direction X. In a set of second connection pads 5, the second power connection pad 51 is electrically connected to the second power signal line 12 via the second connection trace 42; the work indicator connection pad 53 is electrically connected to the work indicator signal line 13 via the third connection trace 43; and the second power signal line 12 and the work indicator signal line 13 are located on the same side of a set of lamp areas Q10; wherein, the work indicator signal line 13 includes signal segments 131 spaced apart, and connecting segments 132 electrically connecting adjacent signal segments 131; and the orthographic projection of the connecting segment 132 on the substrate 10 intersects with the orthographic projection of the second connection trace 42 on the substrate 10. It should be noted that, in order to avoid short circuit between the second power signal line 12 and the work indicator signal line 13, an insulating material is provided between the connecting segment 132 and the second connection trace 42, thereby preventing short circuit between the two. It can be seen that in this embodiment, the second power signal line 12 and the working indicator signal line 13 are arranged side by side on the substrate 10 without overlapping. After the driver chip is installed, neither the second power signal line 12 nor the working indicator signal line 13 will overlap with the driver chip except at the connection end. Therefore, the spacing between the pins inside the driver chip does not need to be increased. Moreover, the side-by-side arrangement of the second power signal line 12 and the working indicator signal line 13 on the substrate 10 can effectively reduce the problems of short circuit and signal crosstalk.

[0054] Further, continue to refer to Figure 5-7 To facilitate wiring and control, for a group of light zones Q10, the control connection pad 54 corresponding to the Nth light-emitting light zone Q1 is connected to the output connection pad 52 connected to the negative terminal connection pad 32 in the (N+1)th light-emitting light zone Q1 via a fourth connection trace 44; N is an integer greater than or equal to 1. It can be seen that when driver chips are installed on the backplane, the multiple driver chips corresponding to a group of light zones Q10 are connected in series, making it easier to control the brightness of the light-emitting diodes in the backplane.

[0055] Further, continue to refer to Figure 5-7The signal segment 131, second connection trace 42, third connection trace 43, and fourth connection trace 44 of the aforementioned working indicator signal line 13 can all be arranged on the same layer as the second power signal line 12. The connection segment 132 of the working indicator signal line 13 is arranged on the same layer as multiple sets of first connection pads 3 and multiple sets of second connection pads 5. That is to say, the aforementioned first conductive layer includes not only the aforementioned first power signal line 11, second power signal line 12, first connection trace 41, and millimeter-wave antenna array 2, but also the signal segment 131 of the working indicator signal line 13. The second conductive layer includes not only multiple sets of first connection pads 3, multiple sets of second connection pads 5, and second connection structure 6, but also the connection segment 132 of the working indicator signal line 13. This arrangement contributes to the thinner and lighter design of the LED backplane.

[0056] In some examples, Figure 8 This is a partial planar schematic diagram of the backplane of the light-emitting diode according to an embodiment of the present disclosure; Figure 9 This is a cross-sectional view of the third connection pad 101 in the backplane of the light-emitting diode according to an embodiment of this disclosure; as shown Figure 8 and 9 As shown, the backplane of the light-emitting diode in this embodiment of the present disclosure not only includes the above-described structure, but also includes a plurality of third connection pads 101 located in the bonding area; signal traces extend from the first wiring area Q2 to the bonding area and are electrically connected to the third connection pads 101. For example, the first power signal line 11, the second power signal line 12, the operation indication signal line 13, and the millimeter-wave antenna array 2 are electrically connected to the corresponding third connection pads 101 in the bonding area via fifth connection traces 45.

[0057] Furthermore, the width of the third connection pad 101 in the bonding area is 10 to 15 μm, and the spacing between adjacent third connection pads 101 is 10 to 15 μm.

[0058] Furthermore, in this embodiment, the third connection pad 101 can be disposed on the same layer as multiple sets of first connection pads 3 and multiple sets of second connection pads 5, and use the same material. That is, the second conductive layer not only includes multiple sets of first connection pads 3, multiple sets of second connection pads 5, the second connection structure 6, and the connection segment 132 of the working indicator signal line 13, but may also include the third connection pad 101. This arrangement facilitates fabrication and does not increase process costs. It should be noted that when the third connection pad 101 is electrically connected to the corresponding signal trace, it needs to be electrically connected through a via penetrating the first insulating layer 7, but in the bonding area, the first insulating layer 7 may only include the aforementioned first passivation layer 71.

[0059] In some examples, the first and second conductive layers described above can both be constructed as single-layer structures or composite films using metallic materials. The material of the first conductive layer includes, but is not limited to, at least one of titanium (Ti), molybdenum (Mo), nickel (Ni), niobium (Nb), copper (Cu), silver (Ag), and gold (Au). For example, the first conductive layer may include MoNb / Cu / MoNb or MoNb / Cu; the second conductive layer may include MoNb / Ni. In some examples, the thickness of the first conductive layer is not less than 0.3 μm, and further, the thickness of the first conductive layer is not less than 2.7 μm. The thickness of the second conductive layer is... about.

[0060] In some examples, the first insulating layer 7 described above may include a first passivation layer 71, a planarization layer 72, and a second passivation layer 73 sequentially disposed along the side facing away from the substrate 10. In some examples, both the first passivation layer 71 and the second passivation layer 73 may be made of inorganic materials, and the materials may be the same or different. Inorganic materials include SiNx, SiNOx, and SiOx. The first passivation layer 71 and the second passivation layer 73 may each be composed of one or more of SiNx, SiNOx, and SiOx to form a single-layer structure or a stacked structure. The thickness of both the first passivation layer 71 and the second passivation layer 73 is within [a certain range]. The planarization layer 72 is made of organic materials. Organic materials include photosensitive OC materials, such as acrylic polymers and silicone polymers. The thickness of the planarization layer 72 is between 2μm and 5μm, for example, the thickness of the planarization layer 72 is 3μm.

[0061] In some examples, the backplane of the light-emitting diode in this disclosure embodiment not only includes the structure described above, but also includes a reactive layer 8 disposed between the first conductive layer and the substrate 10. This reactive layer 8 can effectively prevent the substrate 10 from curling up and breaking during the formation of the first conductive layer. The reactive layer 8 can be made of an inorganic material, such as SiNx. The thickness of the reactive layer 8 is... about

[0062] In some examples, the backplane of the light-emitting diode in this disclosure embodiment includes not only the structure described above, but also a protective layer 9 disposed on the side of the second conductive layer facing away from the substrate 10. The material of the protective layer 9 can be an inorganic material, such as SiNx. The thickness of the protective layer 9 is not less than... It should be noted that the protective layer 9 has openings at the positions corresponding to the first connecting pad 3, the second connecting pad 5, and the third connecting pad 101, to facilitate soldering of the first connecting pad 3 to the light-emitting diode, the second connecting pad 5 to the driver chip, and the third connecting pad 101 to the external printed circuit board or flexible circuit board. The size of the openings in the protective layer 9 at the positions corresponding to the first connecting pad 3, the second connecting pad 5, and the third connecting pad 101 is not less than 30μm*30μm.

[0063] To make the structure of the backplane of the light-emitting diode in the embodiments of this disclosure clearer, the following description is provided in conjunction with the fabrication method of the backplane. Figure 10 This is a flowchart of a method for fabricating a light-emitting diode backplane according to an embodiment of this disclosure; as follows: Figure 10 As shown, the method for fabricating the backplane of the light-emitting diode in this embodiment may specifically include the following steps.

[0064] S11. A substrate 10 is provided, wherein a reactive layer 8 is formed on the substrate 10 by means including but not limited to sputtering.

[0065] S12. On the side of the reactive layer 8 facing away from the substrate 10, a first conductive layer is formed by a patterning process. The first conductive layer includes: a first power signal line 11, a second power signal line 12, a signal segment 131 of a working indicator signal line 13, a first connection trace 41, a second connection trace 42, a third connection trace 43 and a fourth connection trace 44, and a millimeter-wave antenna array 2.

[0066] S13. A first insulating layer 7 is formed on the side of the first conductive layer that is away from the substrate 10.

[0067] The step of forming the first insulating layer 7 may include forming a first passivation layer 71, a planarization layer 72, and a second passivation layer 73 in sequence.

[0068] S14. A second conductive layer is formed on the side of the first insulating layer 7 facing away from the substrate 10. The second conductive layer includes multiple pairs of first connection pads 3, multiple pairs of second connection pads 5, third connection pads 101, a second connection structure 6, and a connection segment 132 of the working indicator signal line 13.

[0069] S15. A protective layer 9 is formed on the side of the second conductive layer away from the substrate 10.

[0070] It should be noted that the patterns of the first conductive layer, the first insulating layer 7, the second conductive layer, and the protective layer 9 are the same as those in the product, so they will not be described again here.

[0071] In addition, after completing the above steps, the process may include back-end fabrication, such as: cutting, coating of the reflective layer (white oil coating), die bonding, reflow soldering, inspection, application of protective adhesive and spot filling, as well as subsequent bonding processes. These conventional steps will not be described in detail here.

[0072] Secondly, embodiments of this disclosure also provide a display device including the aforementioned light-emitting diode driving backplane. In some embodiments, the display device further includes a light-emitting element, which includes a Micro-LED chip or a Mini-LED chip.

[0073] In this embodiment, the light-emitting element and the LED driving backplane can form a light source with other optical structures (such as light guide plates, diffusers, etc.) to provide light to the display panel in the display device. Alternatively, the light-emitting element and the LED driving backplane can be part of the display panel in the display device and can directly display images.

[0074] In some embodiments, the display device may be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0075] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A light emitting diode driving backplane, comprising: a substrate board divided into a plurality of light emitting lamp areas and a first wiring area around the light emitting lamp areas; at least one pair of first connection pads, a plurality of signal traces and an auxiliary functional component disposed on the substrate board, the auxiliary functional component comprising an antenna array; wherein the at least one pair of first connection pads and the auxiliary functional component are disposed in the light emitting lamp areas; the signal traces are disposed in the first wiring area; wherein each pair of the at least one pair of first connection pads comprises a positive pad and a negative pad, the signal traces are electrically connected with the corresponding positive pad and negative pad; the auxiliary functional component is disposed in the same layer with at least part of the plurality of signal traces; wherein the plurality of light emitting lamp areas form a plurality of groups of lamp areas along a first direction, each group of lamp areas comprising a plurality of the light emitting lamp areas arranged side by side along a second direction; any auxiliary functional component comprises a main structure and a first connection structure surrounding the periphery of the main structure and electrically connected thereto, and the first connection structures of the auxiliary functional components arranged adjacent in the second direction are electrically connected through a second connection structure; the substrate board further has a binding area; the binding area is provided with a third connection pad; the auxiliary functional component is electrically connected with the corresponding third connection pad of the binding area through a fifth connection trace.

2. The light emitting diode driven backplane of claim 1, wherein, The first connection pads are in multiple pairs; the light emitting diode driving backplane further comprises at least one first connection trace in the light emitting lamp areas; in any light emitting lamp area, one first connection trace is connected with the positive pad of one pair of first connection pads and the negative pad of another pair of first connection pads, so as to connect each light emitting diode to be installed in series.

3. The light emitting diode driven backplane of claim 2, wherein, The light emitting diode driving backplane comprises a first conductive layer; the first conductive layer comprises the first connection trace and the auxiliary functional component.

4. The light emitting diode driven backplane of claim 2, wherein, Each light emitting lamp area comprises a plurality of pairs of first connection pads arranged in an array, and the plurality of pairs of first connection pads define a containing area; the auxiliary functional component in each light emitting lamp area is located in the containing area.

5. The light emitting diode driven backplane of claim 4, wherein, The light emitting diode driving backplane comprises a second conductive layer disposed on the side of the auxiliary functional component away from the substrate board; the second conductive layer comprises the second connection structure and the first connection pad.

6. The light emitting diode driven backplane of claim 4, wherein, The light emitting diode driving backplane comprises a first conductive layer, a first insulating layer and a second conductive layer disposed in sequence away from the substrate board; the first conductive layer comprises the auxiliary functional component and the first connection trace; the second conductive layer comprises the second connection structure; the second connection structure is electrically connected with the first connection structure through a via hole penetrating through the first insulating layer.

7. The light emitting diode driven backplane of claim 6, wherein, The minimum distance between the first connection structure and the first connection trace is not less than twice the line width of the first connection structure.

8. The light emitting diode drive backplane of claim 1, wherein, The plurality of light-emitting lamp areas form a plurality of groups of lamp areas along a first direction, each group of lamp areas including a plurality of the light-emitting lamp areas arranged side by side along a second direction; the plurality of signal lines include a first power signal line and a second power signal line; the first power signal line is electrically connected to the corresponding positive pad, and the second power signal line is electrically connected to the corresponding negative pad; the first power signal line and the second power signal line are respectively located on two opposite sides of a group of lamp areas in the first direction, and each of the first power signal line and the second power signal line in the light-emitting diode driving backboard is arranged alternately.

9. The light emitting diode driven backplane of claim 8, wherein, The light-emitting diode driving backboard further comprises: a plurality of groups of second connection pads, and the plurality of signal lines further comprise: a plurality of working indication signal lines; Each group of the plurality of groups of second connection pads is configured to electrically connect a driving chip to be mounted with the corresponding working indication signal line and the second power signal line, so that a second power signal output by the second power signal line is output to the corresponding negative pad under the control of the driving chip; one of the driving chips is configured to control the luminous intensity of the light-emitting diodes to be mounted in one of the light-emitting lamp areas.

10. The light emitting diode driven backplane of claim 9, wherein, Each group of the second connection pads includes a second power connection pad, a working indication connection pad, an output connection pad, and a control connection pad; the second power connection pad and the working indication connection pad are arranged side by side in the second direction; the second power connection pad is electrically connected to the second power signal line through a second connection trace; and the working indication connection pad is electrically connected to the working indication signal line through a third connection trace. For one group of the second connection pads, the second power signal line electrically connected to the second power connection pad and the working indication signal line electrically connected to the working indication connection pad are located on the same side of a group of lamp areas; the working indication signal line includes signal line segments arranged at intervals, and a connection segment electrically connecting adjacent signal line segments; and the orthographic projection of the connection segment on the substrate is arranged intersecting the orthographic projection of the second connection trace on the substrate.

11. The light emitting diode driven backplane of claim 10, wherein, The light-emitting diode driving backboard comprises: a first conductive layer, a first insulating layer, and a second conductive layer arranged in sequence in a direction away from the substrate; the first conductive layer includes the auxiliary functional component, the first power signal line, the second power signal line, the second connection trace, the third connection trace, and the connection segment; and the second conductive layer includes the second power connection pad, the working indication connection pad, the output connection pad, the control connection pad, and the connection segment.

12. The light emitting diode drive backplane of claim 11, wherein, For any group of lamp areas, the control connection pad corresponding to the Nth light-emitting lamp area is connected to the output connection pad connected to the negative pad in the N+1th light-emitting lamp area through a fourth connection trace; N is an integer greater than or equal to 1.

13. The light emitting diode driven backplane of claim 12, wherein, The first conductive layer further includes the third connection trace.

14. The light emitting diode drive backplane of any of claims 1-13, wherein, The auxiliary functional component includes a conductive grid structure.

15. The light emitting diode drive backplane of any of claims 1-13, wherein, The signal trace is electrically connected by the first wiring area to the binding area and the third connection pad.

16. The light emitting diode drive backplane of claim 15, wherein, The light emitting diode driving backboard comprises a first conductive layer, a first insulating layer and a second conductive layer arranged in sequence in a direction away from the substrate base plate; the first conductive layer comprises the auxiliary functional component; and the second conductive layer comprises the first connection pad and the third connection pad.

17. The light emitting diode drive backplane of any of claims 1-13, wherein, The light emitting diode driving backboard is a backlight source.

18. A display device comprising the light emitting diode driving backboard of any one of claims 1-17.

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