Polymer-graphene electronic component housing

Abstract

An electronic component housing defining an EMI shield and ESD protective cover includes a polymer core formed of a first polymer material having a reinforcing material and an overmolded outer layer formed of a second polymer material having between about 2 wt.% and about 30 wt.% graphene. The reinforcing material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, the overmolded outer layer defining a housing skin disposed on the polymer core.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 290,139, filed December 16, 2021, which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure generally relates to polymer component housings, and more specifically, to polymer component housings for electronic devices. Background Technology

[0004] The background description provided herein is intended to generally present the background of this disclosure. The work of the currently named inventors within the scope that may be described in this background section, and descriptions that may not conform to prior art at the time of application, are neither expressly nor implicitly acknowledged as prior art to this invention.

[0005] Electronic circuits in devices such as electric motors, electric drive systems, radar sensors, vehicle speed sensors, electric locks, radios, and consoles emit electromagnetic (EM) radiation. Furthermore, this EM radiation can interfere with other electronic devices, such as electronic control units (ECUs) located near the emitting devices. This EM radiation interference is known as electromagnetic interference (EMI), and EMI shielding is used to attenuate EM radiation through reflection and / or absorption. Electronic devices may also require the dissipation of static charge or protection against electrostatic discharge (ESD) due to electrostatic buildup.

[0006] Traditional protection strategies against EMI and ESD include conductive metal enclosures, polymer enclosures with electroless metal coatings or electroplated metal coatings, polymer enclosures with conductive spray coatings, and polymer enclosures with metallized coatings (e.g., vacuum deposition or sputtering coatings). However, conductive metal enclosures may have limitations in weight, size, and design flexibility; polymer enclosures with electroless metal, electroplated metal, or metallized coatings may have environmental health and safety (EHS) and waste disposal limitations; and polymer enclosures with conductive spray coatings may have limitations in coating adhesion.

[0007] This disclosure addresses issues related to EMI and ESD enclosures, as well as other issues related to EMI shielding and ESD protection. Summary of the Invention

[0008] This section provides a general overview of this disclosure, rather than a full disclosure of its entire scope or all its features.

[0009] In one form of this disclosure, an electronic component housing having a polymer core and an overmolded outer layer is provided. The polymer core is formed of a first polymer material and the overmolded outer layer is formed of a second polymer material having graphene. Furthermore, the overmolded outer layer defines a housing skin disposed on the polymer core.

[0010] In another form of this disclosure, the electronic component housing defining the EMI shield and ESD protection cover comprises a polymer core formed of a first polymer material having a reinforcing material and an overmolded outer layer formed of a second polymer material and between about 2 wt.% and about 30 wt.% graphene. The reinforcing material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral fillers, and combinations thereof, and the overmolded outer layer defines a housing skin disposed on the polymer core.

[0011] In another form of this disclosure, a method of manufacturing an electronic component housing defining an EMI shield and an ESD protection cover includes injection molding a first polymer material having a reinforcing material using a secondary injection molding machine to form a polymer core, and injection molding a second polymer material having between about 2 wt.% and 30 wt.% graphene using a secondary injection molding machine to form an overmolded outer layer defining a housing skin on the polymer core. The reinforcing material is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, and provides structural reinforcement for the electronic component housing. Furthermore, the thickness of the polymer core is between about 1 mm and about 10 mm, the thickness of the housing skin is between about 0.5 mm and about 5 mm, the shielding efficiency of the polymer core with the housing skin is between about 35 dB and about 90 dB for EM radiation frequencies between about 1 GHz and about 40 GHz, and / or the polymer core with the housing skin has a shielding efficiency greater than about 10 dB. -10 S / m and less than or equal to approximately 10 -6 Antistatic conductivity of S / m, and / or greater than about 10 -8 S / m and less than or equal to approximately 10 -3 Electrostatic dissipation conductivity S / m.

[0012] Further applications and various methods for enhancing the above-described technology will become apparent from the description provided herein. The descriptions and specific examples in this invention are for illustrative purposes only and are not intended to limit the scope of this disclosure. Attached Figure Description

[0013] This teaching will be understood more fully from the detailed description and accompanying drawings, in which:

[0014] Figure 1 It is a 3D view of a vehicle equipped with an electronic control unit (ECU);

[0015] Figure 2 It is a device with EMI shielding and / or ESD protection cover according to the teachings of this disclosure. Figure 1 An exploded view of the ECU;

[0016] Figure 3 yes Figure 2 Cross-sectional view of section 3-3 in the figure;

[0017] Figure 3A yes Figure 3 Enlarged view of section 3A in the image;

[0018] Figure 4A This is a cross-sectional view of the polymer core of the ECU housing formed in the first mold assembly in accordance with the teachings of this disclosure;

[0019] Figure 4B It is positioned in the second mold group according to the teachings of this disclosure. Figure 4A A cross-sectional view of the polymer core in the image;

[0020] Figure 4C It is a cross-sectional view of an overmolded outer layer formed on a polymer core in a second mold assembly in accordance with the teachings of this disclosure;

[0021] Figure 5 This is a cross-sectional view of an ECU housing for EMI shielding and / or ESD protection formed using a secondary injection molding process according to the teachings of this disclosure; and

[0022] Figure 6 This is a flowchart of a method for manufacturing an ECU housing for EMI shielding and / or ESD protection in accordance with the teachings of this disclosure. Detailed Implementation

[0023] This disclosure provides an electronic component housing (also referred to herein simply as a "housing") having a polymer core (also referred to herein as or considered as a "polymer layer" and / or a "polymer substrate") and an overmolded outer layer defining a housing skin disposed on the polymer core. The polymer core may be formed from a first polymer material with added reinforcing materials, the overmolded outer layer may be formed from a second polymer material with added graphene and / or carbon black, and the housing provides EMI shielding and / or ESD protection for the electronic device. For example, the housing provides EMI shielding and / or ESD protection for an ECU that is at least partially contained within the housing and located near other electronic devices emitting EM radiation. In this way, a lightweight EMI shield and / or ESD protection cover for one or more ECUs of a vehicle is provided.

[0024] In some variations of this disclosure, a conductive polymer layer rich in graphene and / or carbon black is secondary injection molded or overmolded onto a polymer core to form a shell, and the shell overcomes the problems of traditional shielding solutions. For example, compared to metal or metal fiber reinforced polymer shells, the shell is lightweight and manufactured via a high-volume secondary molding process, thereby eliminating secondary operations such as joining and welding. Adhesion and durability issues are also eliminated by using the same base resin system for both the polymer core and the shell skin. Injection molding is suitable for complex geometries and allows for the free design of parts with different graphene and / or carbon black densities and / or wall thicknesses to optimize performance.

[0025] In addition to EMI shielding and / or ESD protection, graphene and / or carbon black offer additional benefits such as heat resistance, UV resistance, abrasion and wear resistance, and flame retardancy. In some variations, graphene and / or carbon black are contained solely in the outer casing, thereby reducing the cost of using conductive fillers within the casing.

[0026] refer to Figure 1 and 2 , Figure 1 The image shows a 3D view of a vehicle with an ECU 10, designated "V". Figure 2 An exploded view of ECU10 is shown. Although in Figure 1 and Figure 2 Only one ECU 10 is shown, but more than one ECU can and typically exists in a vehicle. Non-limiting examples of ECUs that control or assist in the control of various components of the vehicle include ECUs for engine control, cruise control, overhead console control, electronically adjustable steering wheel control, etc. It should also be understood that control of one or more vehicle components can be assigned to and executed by a single ECU. For example, an engine control unit ECU (also known as an engine control module (ECM)) may include inputs from camshaft position sensors, mass airflow sensors, heated oxygen sensors, manifold absolute pressure (MAP) sensors, exhaust gas recirculation (EGR) sensors, coolant temperature sensors, throttle position sensors, crankshaft position sensors, vehicle speed sensors, and knock sensors, etc.

[0027] Special Reference Figure 2The ECU 10 includes a housing 100, an electronic circuit board 150 (e.g., a printed circuit board (PCB)), and a base 170, as described in more detail below. The electronic circuit board 150 includes several electronic components, such as a core 152 (i.e., a microcontroller) and a memory 154, configured to receive sensor signal inputs and provide device signal outputs, enabling the desired functioning of one or more vehicle devices. The base 170 provides a platform or support structure for the electronic circuit board 150 to be mounted. Furthermore, the base 170 can be mounted to another structure, for example, using threaded fasteners (not shown) extending through holes 172 in the base 170, to securely mount the ECU 10 to the vehicle V. While the housing 100... Figure 1 and Figure 2 The housing 100 is shown as a vehicle component housing, but housing 100 could be an electronic component housing for an ECU 10 not included in the vehicle.

[0028] Reference Figure 3 and Figure 3A , Figure 3 A cross-sectional view of the housing 100 is shown in the figure, and Figure 3A It shows Figure 3 An enlarged view of segment 3A in the diagram. In some variations, housing 100 is formed by or includes one or more planar segments 110 and flanges 120. Furthermore, housing includes a polymer core 112 and an overmolded outer layer 114. As used herein, the term "overmolded" means forming an injection-molded layer on or "over" a previously formed layer, substrate, or core (which may or may not be injection-molded), and the term "outer" means a surface or layer facing away from an electronic circuit board of an ECU that is at least partially contained within or positioned between housing 100 and base 170. Polymer core 112 is formed of a first polymer material and overmolded outer layer 114 is formed of a second polymer material. The first and second polymer materials may or may not be the same polymer material. In some variations, the first and / or second polymer material is at least one of thermoplastic, thermosetting epoxy, and phenolic polymers. For example, in some variations, the first polymer material and / or the second polymer material is at least one of polypropylene (PP), polybutylene terephthalate (PBT), acrylonitrile butadiene styrene (ABS), and combinations thereof. In at least one variation of this disclosure, the first polymer material and the second polymer material are polypropylene.

[0029] In some variations, the polymer core 112 is formed of a first polymer material to which a reinforcing material has been added, providing structural reinforcement to the outer shell 100. Non-limiting examples of reinforcing materials include glass (e.g., glass fibers and / or glass beads), talc, one or more mineral fillers (e.g., calcium carbonate, silica, wollastonite, clay, calcium sulfate fibers, mica, and alumina trihydrate), and combinations thereof.

[0030] In at least one variation, the overmolded outer layer 114 is formed of a second polymer material to which graphene and / or carbon black have been added. In some variations, the overmolded outer layer 114 is formed of a second polymer material having between approximately 2 wt.% and 30 wt.% graphene. In such variations, the overmolded outer layer 114 defines a shell skin providing EMI shielding and / or ESD protection for the electronic circuit board 150. That is, the polymer core 112 and the overmolded outer layer 114 define an EMI shield and / or ESD protection cover.

[0031] The polymer core 112 has a first thickness 't1' and the overmolded outer layer 114 has a second thickness 't2'. In some variations, the polymer core 112 has a first thickness t1 between about 1 mm and about 10 mm, and in at least one variation, the first thickness t1 is between about 2 mm and about 5 mm. Furthermore, in some variations, the overmolded outer layer 114 has a second thickness t2 between about 0.5 mm and about 5 mm, and in at least one variation, the second thickness t2 is between about 1 mm and about 2.5 mm.

[0032] As described above, in some variations, the polymer core 112 and the overmolded outer layer 114, i.e., the housing 100, define an EMI shield that reflects and / or absorbs EM radiation. In such variations, the housing 100 has a shielding efficiency of at least 30 dB for EM radiation frequencies between approximately 1 kHz and approximately 100 GHz. For example, in at least one variation, the housing 100 has a shielding efficiency of at least 35 dB for EM radiation frequencies between approximately 1 kHz and approximately 100 GHz, and in some variations, the housing 100 has a shielding efficiency between approximately 40 dB and approximately 60 dB for EM radiation frequencies between approximately 1 kHz and approximately 100 GHz. It should be understood that shielding efficiency refers to the attenuation level provided by the housing 100, and attenuation (in dB) refers to the ratio between the EM field strength with and without the housing 100, as measured by coaxial transmission line testing and / or shielding box testing.

[0033] As also described above, in some variations, the polymer core 112 and the overmolded outer layer 114, i.e., the housing 100, define an ESD protective cover for dissipating static electricity. In such variations, the housing 100 has a strength greater than about 10 -10 The antistatic conductivity of S / m and / or greater than about 10 -8 Electrostatic dissipative conductivity (S / m). For example, in at least one variant, the housing 100 has an electrostatic dissipative conductivity greater than about 10. -9 S / m and less than or equal to approximately 10 -6 The antistatic conductivity of S / m and / or greater than about 10 -7 S / m and less than or equal to approximately 10 -3 Electrostatic dissipation conductivity S / m.

[0034] In some variations, housing 100 defines an EMI shielding element, wherein the overmolded layer 114 is formed of a second polymer material having between about 12.5 wt.% and about 30 wt.% graphene (e.g., between about 15 wt.% and about 30 wt.%). In at least one variation, housing 100 defines an ESD protection cover configured for electrostatic dissipation, wherein the overmolded layer 114 is formed of a second polymer material having between about 5 wt.% and about 17.5 wt.% graphene (e.g., between about 5 wt.% and about 15 wt.%). And in some variations, housing 100 defines an ESD protection cover configured for antistatic conduction, wherein the overmolded layer 114 is formed of a second polymer material having between about 2 wt.% and about 12.5 wt.% graphene (e.g., between about 2 wt.% and about 10 wt.%).

[0035] Now for reference Figures 4A-4C This illustrates the formation of a housing 100 using an overmolding process according to one form of this disclosure. Specifically, and referring to... Figure 4A The polymer core 112 is formed by injecting a first polymer material having a reinforcing material 112p (i.e., a mechanical mixture of the first polymer material and the reinforcing material) into a mold cavity 205 defined between a first mold 200 and a second mold 210 of a first mold assembly 20. The polymer core 112 is then removed from the mold cavity 205 and placed in another mold cavity 215, which is defined as follows: Figure 4B Between another first mold 220 and another second mold 230 of the second mold assembly 22 shown, a second polymer material having graphene and / or carbon black 114p (i.e., a mechanical mixture of the second polymer material and graphene and / or carbon black) is injection molded into the mold cavity 215 to form as shown. Figure 4CThe outer layer 114 is shown as an overmolded layer. In some variations, the first mold 220 is the same as the first mold 200, while in other variations, the first mold 220 is a different mold from the first mold 200.

[0036] refer to Figure 5 This illustrates another form of the secondary injection molding process or machine 30 according to the present disclosure for forming the housing 100. The secondary injection molding machine 30 includes a rotatable first mold 300, a second mold 302 having a first mold cavity 310 and a second mold cavity 320, a first injection unit 312, and a second injection unit 314. The first injection unit 312 injects a first polymer material having a reinforcing material 112p into the first mold cavity 310 and forms a polymer core 112. The rotatable first mold 300 with the polymer core 112 then rotates about a mold axis 'D' such that the polymer core 112 is positioned within the second mold cavity 320. The second injection unit 314 injects a second polymer material having graphene 114p into the second mold cavity and forms an overmolded outer layer 114 on the polymer core 112, while the first injection unit 312 injects the first polymer material having the reinforcing material 112p into the first mold cavity 310 and forms another polymer core 112. After the outer layer 114 is formed by secondary injection molding, i.e., after the outer shell 100 is formed, the rotatable first mold 300 and the second mold 302 separate from each other (in the x-direction), pushing (removing) the outer shell 100 away from the rotatable first mold 300, and the rotatable first mold 300 rotates about the mold axis D, so that another polymer core 112 is positioned in the second mold cavity 320. This cycle, i.e., forming the polymer core 112 in the first mold cavity 310, forming the overmolded outer layer 114 on the polymer core 112 in the second mold cavity, removing the outer shell 100 from the rotatable first mold 300, and rotating the rotatable first mold 300, continues, thereby forming a plurality of outer shells 100.

[0037] refer to Figure 6A flowchart of a method 40 for forming a shell 100 is shown. Method 40 includes injection molding a first polymer material having a reinforcing material 112p at 410 to form a polymer core 112, and injection molding a second polymer material having graphene 114p at 420 to form an overmolded outer layer 114 on the polymer core 112. The first polymer material having the reinforcing material 112p may be a mixture of thermoplastic granules and thermoplastic plastic having the reinforcing material granules, which is fed into a first hopper and barrel of a first injection unit such that the first polymer material having the reinforcing material 112p has the desired reinforcing material content before being injection molded to form the polymer core 112. Furthermore, the second polymer material having graphene 114p may be a mixture of thermoplastic granules and thermoplastic plastic having graphene granules, which is fed into a second hopper and barrel of a second injection unit such that the second polymer material having graphene 114p has the desired graphene content before being injection molded to form the overmolded outer layer 114.

[0038] Although Figure 3-5 Only the formation of the outer shell 100 by injection molding a polymer core and then injection molding an overmolded outer layer onto the polymer core is shown; however, in some variations, the base 170 is formed in a similar manner. That is, in some variations, the base 170 defines an EMI shield having a polymer core formed of a first polymer material having reinforcing materials and an overmolded outer layer formed of a second polymer material having graphene.

[0039] In accordance with the teachings of this disclosure, a housing 100 having a polymer core 112 and an overmolded outer layer 114 (i.e., the housing skin) provides an EMI shield without one or more limitations of conventional EMI shields. For example, injection molding of a first polymer material having a reinforcing material 112p and a second polymer material having graphene 114p provides an EMI shield and / or ESD protection cover with reduced weight and increased design flexibility compared to a metal housing, and provides an EMI shield and / or ESD protection cover with reduced EHS and waste disposal limitations compared to polymer housings having electroless metal, electroplated metal, and / or metallized coatings. Furthermore, the housing 100 does not have coating adhesion limitations like polymer housings with conductive spray coatings because the graphene is disposed within the second polymer material forming the overmolded outer layer 114 and not present as a coating on the polymer core 112.

[0040] The foregoing description is illustrative in nature and is in no way intended to limit this disclosure, its application, or use. As used herein, at least one of the phrases A, B, and C should be interpreted as representing logic (A or B or C) using the non-exclusive logic "OR". The steps within the method may be performed in a different order without altering the principles of this disclosure. Scope disclosure includes both the full scope of the disclosure and subdivisions within the entire scope.

[0041] The headings (e.g., “Background Art” and “Summary of the Invention”) and subheadings used herein are intended only for the general organization of the subject matter within this disclosure and are not intended to limit the disclosure of the technology or any aspect thereof. The description of multiple embodiments having the described features is not intended to exclude other embodiments having additional features, or other embodiments combining different combinations of the described features.

[0042] As used herein, the term "about" when referring to numerical values ​​means a known tolerance for variation in commercial and / or experimental measurements or a reference value. In some variations, such a known commercial and / or experimental measurement tolerance is + / - 10% of the measured value; in other variations, it is + / - 5%; and in still other variations, it is + / - 2.5% of the measured value. And in at least one variation, such a known commercial and / or experimental measurement tolerance is + / - 1% of the measured value.

[0043] As used herein, the terms “comprising,” “including,” and variations thereof are intended to be non-limiting, such that a successive reference to an item or list does not exclude other similar items that may also be useful in the apparatus and method of the technology. Similarly, the terms “may” and “capable,” and variations thereof are intended to be non-limiting, such that a description of an embodiment that may or can include certain elements or features does not exclude other embodiments of the technology that do not include those elements or features.

[0044] The extensive teachings of this disclosure can be implemented in many forms. Therefore, although this disclosure includes examples, its true scope should not be so limited, as other modifications will become apparent to those skilled in the art upon studying the specification and appended claims. References herein to an aspect or aspect mean that a particular feature, structure, or characteristic described in connection with an embodiment or system is included in at least one embodiment or aspect. The appearance of the phrase “in an aspect” (or variations thereof) does not necessarily refer to the same aspect or embodiment. It should also be understood that the various method steps discussed herein need not be performed in the same order as depicted, and not every method step is required in every aspect or embodiment.

[0045] For purposes of illustration and description, the foregoing description of embodiments has been provided. It is not intended to be exhaustive or limiting of this disclosure. Various elements or features of the embodiments are generally not limited to that particular embodiment, but are interchangeable where applicable and can be used in selected embodiments, even if not specifically shown or described. The same may also be varied in many ways. Such variations should not be considered as departing from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

Claims

1. A housing for an electronic component, characterized in that, include: An injection-molded polymer core, the injection-molded polymer core comprising a first polymer material; and An injection-molded overmolded outer layer, the injection-molded overmolded outer layer comprising a second polymer material having graphene, wherein the injection-molded overmolded outer layer defines a shell skin disposed on an injection-molded polymer core, and the injection-molded polymer core and the injection-molded overmolded outer layer define an area greater than 10. -10 S / m of antistatic conductivity and greater than 10 -8 Electrostatic discharge (ESD) protection cover with electrostatic dissipation conductivity of S / m.

2. The electronic component housing according to claim 1, characterized in that, in, The injection-molded polymer core does not contain graphene.

3. The electronic component housing according to claim 1, characterized in that, in, The injection-molded polymer core includes a reinforcing material, wherein the reinforcing material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof.

4. The electronic component housing according to claim 1, characterized in that, in, The first polymer material and the second polymer material are at least one of thermoplastic, thermosetting epoxy resin and phenolic polymer.

5. The electronic component housing according to claim 1, characterized in that, in, The first polymer material and the second polymer material are at least one of polypropylene, polybutylene terephthalate, acrylonitrile butadiene styrene, and combinations thereof.

6. The electronic component housing according to claim 1, characterized in that, in, The first polymer material and the second polymer material are the same polymer material.

7. The electronic component housing according to claim 1, characterized in that, in, The first polymer material and the second polymer material are polypropylene.

8. The electronic component housing according to claim 1, characterized in that, in, The overmolded outer layer comprises the second polymer material having between 2 wt.% and 30 wt.% graphene.

9. The electronic component housing according to claim 1, characterized in that, in, The injection-molded polymer core and the injection-molded overmolded outer layer define an EMI shield, which has a shielding efficiency of at least 30 dB for EM radiation frequencies between 1 GHz and 40 GHz.

10. The electronic component housing according to claim 9, characterized in that, in, For EM radiation frequencies between 1 GHz and 40 GHz, the shielding efficiency is at least 35 dB.

11. The electronic component housing according to claim 9, characterized in that, in, For EM radiation frequencies between 1 GHz and 100 GHz, the shielding efficiency is between 35 dB and 90 dB.

12. The electronic component housing according to claim 1, characterized in that, in, The antistatic conductivity is greater than 10. -9 S / m and less than or equal to 10 -6 S / m, and the electrostatic dissipation conductivity is greater than 10. -7 S / m and less than or equal to 10 -3 S / m.

13. The electronic component housing according to claim 1, characterized in that, in, The thickness of the injection-molded polymer core is between 1 mm and 10 mm.

14. The electronic component housing according to claim 1, characterized in that, in, The thickness of the injection-molded overmolded outer layer is between 0.5 mm and 5 mm.

15. An electronic component housing defining an EMI shield and an ESD protection cover, characterized in that, The electronic component housing includes: A polymer core comprising a first polymer material having a reinforcing material, wherein the reinforcing material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof; and An overmolded outer layer comprising a second polymer material and between 2 wt.% and 30 wt.% graphene, wherein the overmolded outer layer defines an outer skin disposed on the polymer core, and wherein the polymer core and the overmolded outer layer define an area greater than 10 -10 S / m of antistatic conductivity and greater than 10 -8 Electrostatic discharge (ESD) protection cover with electrostatic dissipation conductivity of S / m.

16. The electronic component housing according to claim 15, characterized in that, in, The first polymer material and the second polymer material are at least one of thermoplastic, thermosetting epoxy resin and phenolic polymer.

17. The electronic component housing according to claim 16, characterized in that, in: The thickness of the polymer core is between 1 mm and 10 mm; The thickness of the outer skin is between 0.5 mm and 5 mm; The polymer core having the outer shell has a shielding efficiency of 35 dB to 90 dB for EM radiation frequencies between 1 GHz and 100 GHz; and The polymer core having the outer skin has a density of less than or equal to 10. -6 Antistatic conductivity of S / m and less than or equal to 10 -3 Electrostatic dissipation conductivity S / m.

18. A housing for an electronic component, characterized in that, include: An injection-molded polymer core, the injection-molded polymer core comprising a first polymer material; and An injection-molded overmolded outer layer, the injection-molded overmolded outer layer comprising a second polymer material having graphene, wherein the injection-molded overmolded outer layer defines a shell skin disposed on an injection-molded polymer core, and the injection-molded polymer core and the injection-molded overmolded outer layer define an area greater than 10. -9 S / m and less than or equal to 10 -6 S / m of antistatic conductivity and greater than 10 -7 S / m and less than or equal to 10 -3 Electrostatic discharge (ESD) protection cover with electrostatic dissipation conductivity of S / m.

19. The electronic component housing according to claim 18, characterized in that, in, The injection-molded polymer core does not contain graphene.

20. The electronic component housing according to claim 18, characterized in that, in, The injection-molded polymer core includes a reinforcing material, wherein the reinforcing material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof.

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