A height-adjustable polishing pad cleaning apparatus

Abstract

The application relates to a height-adjustable polishing pad cleaning device, which comprises a workbench, a polishing pad fixing table and a cleaning assembly, the workbench is provided with a limiting table, the polishing pad fixing table is arranged on the workbench and is provided with a bearing surface for placing a polishing pad; the cleaning assembly is arranged on the polishing pad fixing table through a vertical sliding rail, the cleaning assembly is provided with a position-adjustable limiting rod, one end of the limiting rod points to the limiting table, and when the cleaning assembly slides along the vertical sliding rail to approach the bearing surface, the limiting rod can limit the minimum distance between the cleaning assembly and the bearing surface after abutting against the limiting table. Compared with the prior art, the distance between the cleaning assembly and the bearing surface can be adjusted by adjusting the distance between the limiting rod and the limiting table, so that the polishing pad with different thicknesses can be adapted, and the adjusting precision of the cleaning assembly is improved.

Description

Technical Field

[0001] This invention relates to the field of polishing pad cleaning, and more particularly to a height-adjustable polishing pad cleaning device. Background Technology

[0002] Electronic wafers are formed by depositing different layered materials. Silicon wafers are one of the substrates for layered materials. When each new material layer is deposited, a grinding or polishing step is often required to remove excess deposited material and planarize the wafer. Therefore, this polishing process is often called Chemical Mechanical Polishing (CMP). Since wafers are formed by stacking various thin film material layers, multiple CMP polishing steps are necessary to uniformly remove the material layers from the wafer surface and achieve planarization.

[0003] During chemical mechanical polishing (CMP), a chemical polishing slurry is introduced between the wafer and the polishing pad. The deposited thin film material layer is removed from the wafer surface through chemical interaction with the slurry or through mechanical interaction with particles in the slurry. Grooves are typically etched into the polishing surface of the polishing pad. These grooves increase the friction between the pad and the wafer, ensure uniform distribution of the polishing slurry on the pad's surface, and allow abrasive particles and polishing debris suspended in the slurry to flow out of the pad's surface along the grooves.

[0004] After grooving the polishing pad, the debris left behind is distributed on the polishing surface and grooves of the pad. On the one hand, the debris in the grooves can clog the grooves, affecting the distribution and flow of the polishing fluid in the grooves and reducing the planarization effect; on the other hand, the debris on the polishing surface can rub against the wafer, damaging the wafer surface. Therefore, a specialized device is needed to perform deep cleaning of the polishing pad after grooving. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a highly adjustable polishing pad cleaning device.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A height-adjustable polishing pad cleaning device, the polishing pad cleaning device comprising:

[0008] A workbench, wherein a limiting platform is provided on the workbench;

[0009] A polishing pad fixing table is provided on the worktable and has a bearing surface for placing the polishing pad.

[0010] A cleaning component is mounted on the polishing pad mounting platform via a vertical slide rail. The cleaning component is equipped with an adjustable limiting rod, one end of which points towards the limiting platform. When the cleaning component slides along the vertical slide rail closer to the bearing surface, the limiting rod abuts against the limiting platform, thus limiting the minimum distance between the cleaning component and the bearing surface.

[0011] In one embodiment, the cleaning component is provided with a thickness gauge, and the thickness gauge is provided with a measuring head for pressing against the limiting platform. The distance between the measuring head and the limiting platform is equal to the distance between the cleaning component and the bearing surface.

[0012] In one embodiment, the cleaning component includes a mounting plate located directly above the limiting platform, and the mounting plate is provided with the limiting rod and the thickness gauge.

[0013] In one embodiment, the limiting rod is threadedly connected to the mounting plate, and one end of the limiting rod is provided with a fixing nut.

[0014] In one embodiment, the mounting plate is provided with a through second mounting hole, and the thickness gauge includes a thickness measuring bracket, a thickness measuring instrument and the measuring head. The thickness measuring bracket is connected to the thickness measuring instrument, and the thickness measuring instrument is movably connected to the measuring head. The thickness measuring bracket is disposed on the mounting plate, and the measuring head is movably inserted through the second mounting hole.

[0015] In one embodiment, the limiting platform is provided with a first abutting part and a second abutting part, the first abutting part is used to abut against the limiting rod, and the second abutting part is used to abut against the thickness gauge, the first abutting part and the second abutting part are flush.

[0016] In one embodiment, the cleaning assembly includes a cleaning bracket and a cleaning brush connected to each other, the cleaning bracket being slidably connected to the vertical slide rail, and the cleaning brush being used to abut against the polishing pad.

[0017] In one embodiment, the cleaning brush includes a roller brush rotatably connected to the cleaning bracket, the roller brush being rotatable about its own axis, and the axis of the roller brush being parallel to the bearing surface.

[0018] In one embodiment, the workbench is provided with a hydraulic drive, which is connected to the cleaning bracket and is used to drive the cleaning bracket to move along the vertical slide rail.

[0019] In one embodiment, the workbench is provided with a slide rail bracket and a horizontal slide rail, the slide rail bracket is provided with a vertical slide rail and a hydraulic drive, the slide rail bracket is slidably connected to the horizontal slide rail, and the guiding direction of the horizontal slide rail is parallel to the bearing surface.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. In the aforementioned polishing pad cleaning equipment, the cleaning component is slidably connected to the vertical slide rail. Therefore, the distance between the cleaning component and the polishing pad fixing table can be adjusted by moving along the vertical slide rail, so that the cleaning component abuts against the polishing pad to achieve cleaning. However, due to the small thickness of the polishing pad, the adjustment accuracy of the distance between the cleaning component and the polishing pad fixing table is required to be high. Therefore, a limiting platform on the worktable and a limiting rod on the cleaning component are further provided. When the limiting rod abuts against the limiting platform, the cleaning component cannot continue to approach the bearing surface, and the cleaning component abuts against the polishing pad. Therefore, the distance between the cleaning component and the bearing surface can be adjusted by adjusting the distance between the limiting rod and the limiting platform, thereby adapting to polishing pads of different thicknesses and improving the adjustment accuracy of the cleaning component.

[0022] 2. The cleaning component is equipped with a thickness gauge. Since the distance between the thickness gauge and the limiting platform is equal to the distance between the cleaning component and the bearing surface, that is, the distance between the thickness gauge and the limiting platform is less than the distance between the limiting rod and the limiting platform. This difference is the difference between the distance between the thickness gauge and the limiting platform and the distance between the limiting rod and the limiting platform, which is also the thickness of the polishing pad that can be accommodated between the cleaning component and the bearing surface. Therefore, the thickness gauge allows the polishing pad cleaning equipment to precisely adjust the cleaning component and the bearing surface so that the cleaning component just abuts against the polishing pad, improving cleaning efficiency and reducing damage to the polishing pad.

[0023] 3. Since the limiting rod is threadedly connected to the mounting plate, the distance between the limiting rod and the limiting platform can be adjusted by controlling the depth of the limiting rod screwing into and out of the first mounting hole. This allows for adjustment of the minimum distance between the cleaning component and the bearing surface when the cleaning component moves along the vertical slide rail. The operation is simple and convenient.

[0024] 4. A second mounting hole is provided on the mounting plate, and the measuring head is moved through the second mounting hole. This helps to ensure the stability of the thickness gauge and the mobility of the measuring head at the same time, and to achieve accurate control of the minimum distance between the cleaning component and the bearing surface.

[0025] 5. Using a roller brush to contact the polishing pad helps clean debris on the polishing pad surface and in the grooves, thus improving the cleaning effect.

[0026] 6. The cleaning component can move along the horizontal slide rail. When the cleaning component moves along the horizontal slide rail, the cleaning brush moves from one end of the polishing pad to the other end, thereby completing the cleaning of the polishing pad. The cleaning efficiency is high and the cleaning effect is excellent. Attached Figure Description

[0027] Figure 1 This is a perspective view of a polishing pad cleaning device in one embodiment.

[0028] Figure 2 This is a front view of a polishing pad cleaning device in one embodiment.

[0029] Figure 3 This is a perspective view of a polishing pad cleaning device (workbench and top cover hidden) in one embodiment.

[0030] Figure 4 This is a rear view of a polishing pad cleaning device (workbench and top cover hidden) in one embodiment.

[0031] Figure 5 This is a perspective view of a polishing pad cleaning device in another embodiment.

[0032] Figure 6 This is a top view of a polishing pad cleaning device (top cover hidden) in another embodiment.

[0033] Figure 7 This is a perspective view of a polishing pad cleaning device in yet another embodiment.

[0034] Figure 8 This is a top view of a polishing pad cleaning device in yet another embodiment.

[0035] Figure 9 This is a top view of the polishing pad holder and cleaning assembly in one embodiment.

[0036] Figure 10 This is a top view of the polishing pad holder and cleaning assembly in another embodiment.

[0037] Figure 11 This is a side view of the polishing pad holder and cleaning assembly in another embodiment.

[0038] Figure 12 This is a side view of the cleaning component in one embodiment.

[0039] Figure 13 This is a cross-sectional view of the cleaning component in another embodiment.

[0040] Figure Descriptions: 100. Polishing pad cleaning equipment; 10. Workbench; 11. Safety door alarm; 12. Motion controller; 13. Power supply; 20. Polishing pad mounting platform; 21. Air vent; 22. Rotation sensor; 23. Signal generator; 24. Signal receiver; 25. Polishing pad; 26. LED light panel; 30. Cleaning assembly; 31. Cleaning bracket; 311. Mounting plate; 32. Cleaning brush; 321. Roller brush; 322. Connecting part; 323. Elastic element; 33. Vacuum head; 331. Partition; 332. Suction concentrator nozzle; 333. First suction hole; 334. Second suction hole; 335. First space; 336. Second space; 34. Dust removal plate; 35. Electrostatic dust removal rod; 36. Induction counter; 361. Counting display; 40. Safety door; 41. Door frame; 411. Sliding recess 42. Slot; 43. Detector; 44. Sensor; 45. Movable door; 46. Roller; 47. Fixed door; 58. Horizontal slide rail; 59. First horizontal slide rail; 50. Second horizontal slide rail; 51. Transmission block; 52. Sliding block; 523. Lead screw protective shell; 524. Compressible protective cover; 53. Drive motor; 54. Slide rail bracket; 60. Top cover; 70. Dust extraction pipe; 71. Pipe bracket; 72. Pressure gauge; 80. Wire storage box; 81. Storage section; 82. Storage track; 83. First wire storage box; 84. Second wire storage box; 85. Wire; 90. Vertical slide rail; 91. Hydraulic drive; 92. Limiting platform; 93. Limiting rod; 94. Thickness gauge; 941. Thickness measuring bracket; 942. Thickness measuring instrument; 943. Measuring head; 95. First abutment part; 96. Second abutment part. Detailed Implementation

[0041] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0042] The following describes in detail, with reference to the accompanying drawings, a height-adjustable polishing pad cleaning device 100 in some embodiments.

[0043] like Figures 1 to 13 As shown, in one embodiment, a height-adjustable polishing pad cleaning device 100 is provided. The polishing pad cleaning device 100 includes a worktable 10, a polishing pad fixing table 20 disposed on the worktable 10, and a cleaning component 30.

[0044] The polishing pad fixing platform 20 is provided with a bearing surface for placing the polishing pad 25. Multiple air holes 21 are distributed on the bearing surface. The air holes 21 are used to communicate with the vacuum pump. The polishing pad fixing platform 20 is rotatably connected to the worktable 10, so that the polishing pad fixing platform 20 can rotate around its central axis. The cleaning component 30 is arranged opposite to the polishing pad fixing platform 20 and is used to clean the debris on the surface of the polishing pad 25.

[0045] In this specific embodiment, multiple air holes 21 are distributed in concentric circles around the center of the bearing surface.

[0046] Specifically, such as Figure 2 , Figure 3 and Figure 4 As shown, in one embodiment, the workbench 10 is provided with a first horizontal slide rail 51, the cleaning component 30 slides in cooperation with the first horizontal slide rail 51, and the guiding direction of the first horizontal slide rail 51 is parallel to the bearing surface.

[0047] Furthermore, the workbench 10 is provided with a slide rail bracket 54 and a second horizontal slide rail 52. The first horizontal slide rail 51 is provided on the slide rail bracket 54. The slide rail bracket 54 and the second horizontal slide rail 52 are slidably engaged. The guiding direction of the second horizontal slide rail 52 is parallel to the bearing surface and perpendicular to the guiding direction of the first horizontal slide rail 51.

[0048] The second horizontal slide rail 52 includes a transmission screw and a sliding rod, which are respectively located on both sides of the polishing pad fixing platform 20. The two ends of the slide rail bracket 54 are respectively slidably engaged with the transmission screw and the sliding rod.

[0049] Continue to refer to Figure 2 , Figure 3 and Figure 4 In one embodiment, the polishing pad cleaning device 100 includes a lead screw protective shell 523 and a transmission block 521. The drive motor 53 and the transmission lead screw are both located inside the lead screw protective shell 523. One end of the transmission lead screw is rotatably connected to the lead screw protective shell 523, and the other end of the transmission lead screw is connected to the drive motor 53. The transmission block 521 is connected to the transmission lead screw and passes through the lead screw protective shell 523 to connect to the slide rail bracket 54.

[0050] Furthermore, the polishing pad cleaning device 100 includes multiple compressible protective covers 524 and sliding blocks 522. The sliding blocks 522 are connected to the slide rail bracket 54 and slide in cooperation with the sliding rod. The multiple compressible protective covers 524 are sleeved on the sliding rod and distributed on both sides of the sliding blocks 522. The compressible protective covers 524 are used to protect the sliding rod and prevent debris from falling on the sliding rod and affecting the movement of the cleaning component 30 along the second horizontal slide rail 52.

[0051] Furthermore, in one embodiment, the polishing pad cleaning device 100 includes a drive motor 53 connected to a lead screw for driving the first lead screw to rotate around an axis.

[0052] Specifically, such as Figure 3 and Figure 4 As shown, in one embodiment, a vertical slide rail 90 is provided on the first horizontal slide rail 51, the vertical slide rail 90 is slidably engaged with the first horizontal slide rail 51, the cleaning component 30 is slidably engaged with the vertical slide rail 90, and the guiding direction of the vertical slide rail 90 is perpendicular to the bearing surface.

[0053] Furthermore, in one embodiment, the polishing pad cleaning device 100 includes a limiting platform 92, which is disposed on the worktable 10. The cleaning component 30 is provided with a position-adjustable limiting rod 93, one end of which points towards the limiting platform 92. When the cleaning component 30 slides along the vertical slide rail 90 close to the bearing surface, the limiting rod 93 abuts against the limiting platform 92, thereby limiting the minimum distance between the cleaning component 30 and the bearing surface.

[0054] The cleaning component 30 has a first mounting hole, and an adjustable limiting rod 93 is provided in the first mounting hole. The limiting rod 93 is arranged opposite to the limiting platform 92. When the limiting rod 93 abuts against the limiting platform 92, the cleaning component 30 cannot continue to move along the vertical slide rail 90 towards the bearing surface. The distance between the cleaning component 30 and the bearing surface can only be adjusted by adjusting the position of the limiting rod 93 and the cleaning component 30. When the length of the limiting rod 93 extending out of the cleaning component 30 is shortened, the distance between the cleaning component 30 and the bearing surface decreases. When the length of the limiting rod 93 extending out of the cleaning component 30 is extended, the distance between the cleaning component 30 and the bearing surface increases. In the aforementioned polishing pad cleaning device 100, the cleaning component 30 is slidably connected to the vertical slide rail 90. Therefore, the distance between the cleaning component 30 and the polishing pad fixing table 20 can be adjusted by moving along the vertical slide rail 90, allowing the cleaning component 30 to clean the polishing pad 25 at a specific distance. However, since the polishing pad 25 has a small thickness, the distance adjustment accuracy between the cleaning component 30 and the polishing pad fixing table 20 requires high precision. Therefore, a limiting platform 92 located on the worktable 10 and a limiting rod 93 located on the cleaning component 30 are further provided. When the limiting rod 93 abuts against the limiting platform 92, the cleaning component 30 cannot continue to approach the bearing surface. Therefore, the distance between the cleaning component 30 and the bearing surface can be adjusted by adjusting the distance between the limiting rod 93 and the limiting platform 92, thereby adapting to polishing pads 25 of different thicknesses and improving the adjustment accuracy of the cleaning component 30.

[0055] The cleaning component 30 is equipped with a thickness gauge 94 positioned opposite the limiting platform 92. The thickness gauge 94 has a measuring head 943 for pressing against the limiting platform 92. The distance between the measuring head 943 and the limiting platform 92 is less than the distance between the limiting rod 93 and the limiting platform 92. The limiting platform 92 has a first abutment portion 95 and a second abutment portion 96. The first abutment portion 95 abuts against the limiting rod 93, and the second abutment portion 96 abuts against the thickness gauge 94. The first abutment portion 95 and the second abutment portion 96 are flush.

[0056] The cleaning component 30 is equipped with a thickness gauge 94. Since the distance between the thickness gauge 94 and the limiting platform 92 is less than the distance between the limiting rod 93 and the limiting platform 92, when the limiting rod 93 abuts against the limiting platform 92, the measuring head 943 is pressed back by the limiting platform 92. At this time, the value displayed by the thickness gauge 94 is the difference between the distance between the thickness gauge 94 and the limiting platform 92 and the distance between the limiting rod 93 and the limiting platform 92, which is the thickness of the polishing pad 25 that the cleaning component 30 and the bearing surface can accommodate. Therefore, the thickness gauge 94 enables the polishing pad cleaning device 100 to precisely adjust the cleaning component 30 and the bearing surface so that the cleaning component 30 just abuts against the polishing pad 25, thereby improving cleaning efficiency and reducing damage to the polishing pad 25.

[0057] The method of using the above-mentioned polishing pad cleaning device 100 is as follows:

[0058] Slide the cleaning component 30 along the vertical slide rail 90 to bring the cleaning component 30 close to the bearing surface until the limiting rod 93 on the cleaning component 30 abuts against the limiting platform 92. At this time, the distance between the cleaning component 30 and the bearing surface is the minimum distance. The measuring head 943 of the thickness gauge 94 is retracted under pressure, and the reading of the thickness gauge 94 is the minimum distance.

[0059] Adjust the position of the limit rod 93 and the cleaning component 30. When the length of the limit rod 93 extending out of the cleaning component 30 is shortened, the minimum distance decreases, the measuring head 943 of the thickness gauge 94 is further compressed and shortened, and the reading of the thickness gauge 94 decreases. When the length of the limit rod 93 extending out of the cleaning component 30 is extended, the minimum distance increases, the measuring head 943 of the thickness gauge 94 rebounds and extends, and the reading of the thickness gauge 94 increases.

[0060] In this specific embodiment, the cleaning component 30 includes a mounting plate 311, which is disposed opposite to the limiting platform 92. The mounting plate 311 is provided with a limiting rod 93 and a thickness gauge 94. The limiting rod 93 is threadedly connected to the mounting plate 311, and one end of the limiting rod 93 is provided with a fixing nut. The mounting plate 311 is provided with a through second mounting hole. The thickness gauge 94 includes a thickness measuring bracket 941, a thickness measuring instrument 942, and a measuring head 943. The thickness measuring bracket 941 is connected to the thickness measuring instrument 942, and the thickness measuring instrument 942 is movably connected to the measuring head 943. The thickness measuring bracket 941 is disposed on the mounting plate 311, and the measuring head 943 passes through the second mounting hole and is disposed opposite to the limiting platform 92. The distance between the measuring head 943 and the limiting platform 92 is a third distance.

[0061] Furthermore, in one embodiment, a hydraulic drive 91 is provided on the first horizontal slide rail 51, and the hydraulic drive 91 is connected to the cleaning component 30 to drive the cleaning component 30 to move along the vertical slide rail 90.

[0062] Specifically, such as Figure 5 and Figure 6 As shown, in one embodiment, the polishing pad cleaning device 100 includes a safety door 40 and a door frame 41 disposed on the workbench 10. The safety door 40 is disposed around the polishing pad fixing table 20. The safety door 40 is provided with a detector 42, and the door frame 41 is provided with a sensor 43. When the safety door 40 is closed, the detector 42 can detect the sensor 43.

[0063] The safety door 40 includes a movable door 44 and a fixed door 45. A detector 42 is mounted on the movable door 44. Multiple door frames 41 are spaced apart along the circumference of the workbench 10. One part of the door frame 41 has a door rail, with the movable door 44 slidingly engaging with the door rail. The other part of the door frame 41 has a fixed door 45. The movable door 44 includes multiple door bodies arranged sequentially along the door rail, with adjacent door bodies hinged together.

[0064] In this specific embodiment, the door slide rail is an arc-shaped slide rail with a central angle greater than 90 degrees, and the shape of the movable door 44 is adapted to the shape of the door slide rail. A sliding groove 411 is provided inside the door slide rail, and multiple rollers 441 are provided at the bottom of the movable door 44, with the circumference of the rollers 441 abutting against the side wall of the sliding groove 411.

[0065] The aforementioned polishing pad cleaning equipment 100 features a safety door 40 around the polishing pad fixing platform 20, isolating the polishing pad fixing platform 20 and cleaning components 30 from external personnel. Detectors 42 and sensors 43 are installed on the safety door 40 and door frame 41 respectively to monitor the opening and closing status of the safety door 40, preventing the cleaning equipment from being activated when the safety door 40 is open, thus effectively improving the safety of the cleaning equipment. Additionally, a fixed door 45 and a movable door 44 are provided. The movable door 44 slides along a door rail, facilitating the opening and closing of the safety door 40. The detectors 42 and sensors 43 monitor the opening and closing status of the movable door 44, effectively improving the efficiency of the cleaning equipment.

[0066] Specifically, such as Figure 7 and Figure 8 As shown, in one embodiment, the workbench 10 is provided with a wire storage box 80 arranged parallel to the horizontal slide rail 50. The wire storage box 80 includes a plurality of storage sections 81 that are hinged sequentially along the length direction. The wire 85 of the drive motor 53 passes through both ends of the wire storage box 80 and is connected to the power supply. The first end of the wire storage box 80 near the cleaning component 30 is fixedly connected to the wire 85, and the second end of the wire storage box 80 is fixedly connected to the workbench 10. When the cleaning bracket 31 moves along the horizontal slide rail 50, the two ends of the wire storage box 80 are folded, and the wire 85 can drive the first end of the wire storage box 80 to move closer to or away from the second end of the wire storage box 80. The workbench 10 is provided with a storage rail 82, which is arranged parallel to the horizontal slide rail 50. The wire storage box 80 is disposed in the storage rail 82, and one end of the wire storage box 80 is fixedly connected to the storage rail 82.

[0067] The cable storage box 80 includes a first cable storage box 83 and a second cable storage box 84. The first cable storage box 83 is arranged in parallel with the first horizontal slide rail 51, and the second cable storage box 84 is arranged in parallel with the second horizontal slide rail 52. The cable 85 of the drive motor 53 passes through the first cable storage box 83 and the second cable storage box 84 in sequence and is connected to the power supply. The first end of the first cable storage box 83 away from the second cable storage box 84 is fixedly connected to the cable 85. The second end of the first cable storage box 83 is fixedly connected to the worktable 10. The first end of the second cable storage box 84 near the first cable storage box 83 is fixedly connected to the cable 85. The second end of the second cable storage box 84 is fixedly connected to the worktable 10.

[0068] The polishing pad cleaning device 100 described above is equipped with a wire storage box 80. The wire storage box 80 stores the wire 85 by being sleeved on it. The wire storage box 80 has multiple hinged storage sections 81. Therefore, the first end of the wire storage box 80 can move closer to or further away from the second end of the wire storage box 80 as the cleaning bracket 31 moves along the horizontal slide rail 50. Thus, the wire storage box 80 can effectively position the wire 85 and ensure the mobility of the wire 85. On the one hand, it can prevent the movement of the cleaning bracket 31 from being restricted after the wire 85 is completely fixed. On the other hand, it can prevent the wire 85 from moving randomly as the cleaning bracket 31 moves, thereby affecting the operation of the cleaning component 30 and the polishing pad fixing table 20. This improves the operating efficiency and safety of the polishing pad cleaning device 100.

[0069] Specifically, such as Figure 9 As shown, in one embodiment, the polishing pad cleaning device 100 includes a rotation sensor 22 connected to the polishing pad mounting platform 20 for monitoring the number of rotations of the polishing pad mounting platform 20. Since the rotation sensor 22 monitors the number of rotations of the polishing pad mounting platform 20, the cleanliness of the polishing pad 25 can be estimated by monitoring the number of rotations of the polishing pad mounting platform 20, or the cleanliness of the polishing pad 25 can be controlled by controlling the number of rotations of the polishing pad mounting platform 20.

[0070] Furthermore, the polishing pad cleaning device 100 includes a signal generator 23 and a signal receiver 24. The signal receiver 24 is mounted on the worktable 10, and the signal generator 23 is mounted on the polishing pad fixing platform 20. The signal generator 23 and the signal receiver 24 are arranged opposite to each other to determine the rotation starting point of the polishing pad fixing platform 20. When the signal generator 23 and the signal receiver 24 are directly opposite each other, the signal receiver 24 can receive the signal from the signal generator 23, indicating that the polishing pad fixing platform 20 is at the rotation starting point, and the polishing pad fixing platform 20 can be started for rotation cleaning, thus preventing abnormal start-up of the polishing pad fixing platform 20.

[0071] In this specific embodiment, an LED light panel 26 is provided on the polishing pad fixing platform 20, and the LED light panel 26 is used to place the polishing pad 25. When the polishing pad 25 is placed on the LED light panel 26, the LED light panel 26 can illuminate the polishing pad 25 and the area above it, making the debris on the polishing pad 25 and the area above it clearly visible. This helps the operator to judge the cleaning progress at different positions on the polishing pad 25, so as to control the cleaning position and cleaning time of the cleaning component 30 and improve cleaning efficiency.

[0072] Specifically, such as Figure 3 , Figure 10 and Figure 11As shown, in one embodiment, the cleaning component 30 includes a cleaning bracket 31, a cleaning brush 32, and an electrostatic dust removal rod 35. The cleaning brush 32 and the electrostatic dust removal rod 35 are respectively connected to the cleaning bracket 31 and are both arranged opposite to the polishing pad mounting platform 20. The cleaning brush 32 is used for contact and friction with the polishing pad 25, and the electrostatic dust removal rod 35 is used for electrostatic adsorption of dust on the polishing pad 25. The cleaning brush 32 can remove large particles of debris from the surface and grooves of the polishing pad 25 through friction and contact, while the electrostatic dust removal rod 35 can electrostatically adsorb small particles of debris that are raised by the cleaning brush 32 and float in the air, preventing the debris floating in the air from falling back onto the polishing pad 25, thus effectively improving the cleaning effect of the polishing pad 25.

[0073] Furthermore, such as Figure 12 and Figure 13 As shown, in one embodiment, the cleaning brush 32 includes a roller brush 321, which is rotatably connected to the cleaning bracket 31 and can rotate about a horizontal axis. The axis of the roller brush 321 is parallel to the axis of the electrostatic dust removal rod 35. The polishing pad fixing platform 20 is provided with a bearing surface for placing the polishing pad 25. The distance between the cleaning surface of the cleaning brush 32 and the bearing surface is not greater than the distance between the electrostatic dust removal rod 35 and the bearing surface. The rotation direction of the polishing pad fixing platform 20 is opposite to the rotation direction of the roller brush 321. That is, when the polishing pad fixing platform 20 rotates clockwise, the roller brush 321 rotates counterclockwise, which helps the roller brush 321 to carry out the debris in the groove and improves the cleaning efficiency.

[0074] The roller brush 321 has connecting portions 322 at both ends, and the cleaning bracket 31 has strip grooves at both ends along the axial direction of the roller brush 321. The connecting portions 322 are rotatably connected to the strip grooves, and an elastic element 323 is provided between the connecting portions 322 and the sidewalls of the strip grooves. This polishing pad cleaning device 100 uses the roller brush 321 to perform rolling friction on the surface of the polishing pad 25. Simultaneously, the elastic element 323 is provided between the connecting portions 322 of the roller brush 321 and the cleaning bracket 31, making the distance between the roller brush 321 and the polishing pad 25 adaptable. The roller brush 321 can closely rub against the surface and grooves of the polishing pad 25, preventing excessive friction between the roller brush 321 and the surface of the polishing pad 25, thus avoiding wear on the surface of the polishing pad 25. It also increases the friction between the roller brush 321 and the grooves of the polishing pad 25, improving the cleaning ability of the grooves of the polishing pad 25.

[0075] Continue to refer to Figure 12 and Figure 13 In one embodiment, the cleaning assembly 30 includes a vacuum head 33, a cleaning bracket 31 connected to the vacuum head 33, an electrostatic dust removal rod 35 disposed outside the vacuum head 33, and a cleaning brush 32 disposed inside the vacuum head 33. The vacuum head 33 has an opening facing the polishing pad mounting platform 20 and is used to communicate with the vacuum pump. The cleaning surface of the cleaning brush 32 protrudes from the plane where the opening of the vacuum head 33 is located.

[0076] Furthermore, the vacuum head 33 is equipped with a partition 331, which divides the internal space of the vacuum head 33 into a first space 335 and a second space 336. The partition 331 has multiple through first suction holes 333. The first space 335 is connected to the vacuum pump, and the second space 336 contains a roller brush 321. The vacuum head 33 has two spaces connected by the first suction holes 333, which reduces the size of the air intake channel in the first space 335 and concentrates the suction power of the vacuum pump near the cleaning brush 32, which helps to improve suction power and vacuuming efficiency.

[0077] The partition 331 is provided with a suction concentrator 332, which is positioned opposite to the surface of the roller brush 321. The suction concentrator 332 is provided with a second suction hole 334 that communicates with the first suction hole 333. The suction concentrator 332, which is in close contact with the surface of the roller brush 321, further enhances the suction of debris on the cleaning brush 32.

[0078] In this specific embodiment, a dust removal plate 34 extending axially along the roller brush 321 is provided on the inner wall of the suction head 33, and the dust removal plate 34 abuts against the bristles of the roller brush 321. The dust removal plate 34 is provided inside the suction head 33 to abut against the cleaning brush 32, so that the debris adsorbed on the surface of the cleaning brush 32 is dislodged inside the suction head 33, preventing the debris adsorbed on the surface of the cleaning brush 32 from falling back onto the polishing pad 25, effectively improving cleaning efficiency.

[0079] Furthermore, such as Figure 3 As shown, the cleaning bracket 31 is equipped with a sensor counter 36, which is positioned opposite to the polishing pad fixing platform 20 and is used to count the number of polishing pads 25. The sensor counter 36 is used to count the cumulative number of polishing pads 25 processed by each cleaning brush 32, and thus can determine whether the cleaning brush 32 needs to be replaced based on its service life, thereby improving the cleaning effect of the polishing pads 25.

[0080] The cleaning bracket 31 is equipped with a counting display 361 that is electrically connected to the induction counter 36, which is used to display the number of polishing pads 25 counted by the induction counter 36.

[0081] Furthermore, such as Figure 5As shown, in one embodiment, the workbench 10 is provided with a top cover 60, which has an opening. The cleaning component 30 includes a vacuum head 33, a vacuum pipe 70, and a vacuum pump. The top cover 60 is provided with a pipe support 71. The vacuum head 33 is disposed opposite to the polishing pad fixing platform 20. The vacuum pump is located at the bottom of the workbench 10. One end of the vacuum pipe 70 is connected to the vacuum head 33, and the other end of the vacuum pipe 70 passes through the opening and the pipe support 71 in sequence and is connected to the vacuum pump. The polishing pad cleaning device 100 is provided with a top cover 60 and a vacuum pipe 70. The vacuum pipe 70 is movably inserted through a fixing ring, which facilitates the movement of the vacuum pipe 70 along the horizontal slide rail 50 with the cleaning component 30.

[0082] Meanwhile, the cleaning component 30 is equipped with a pressure gauge 72, which is connected to the vacuum pipe 70 to monitor the air pressure in the vacuum pipe 70 and the vacuum head 33, so as to prevent the vacuum pipe 70 and the vacuum head 33 from becoming blocked and causing accidents.

[0083] Specifically, such as Figure 1 and Figure 2 As shown, in one embodiment, a safety door alarm 11 is provided on the top cover 60. The safety door alarm 11 is electrically connected to the detector 42 of the safety door 40 and the rotation sensor 22 of the polishing pad mounting platform 20. When the detector 42 of the safety door 40 detects that the safety door 40 is in an open state, and the rotation sensor 22 of the polishing pad mounting platform 20 detects that the polishing pad mounting platform 20 is in a rotating state, the safety door alarm 11 will light up.

[0084] Furthermore, the workbench 10 is also equipped with a motion controller 12 and multiple drive motors 53. The drive motors 53 are used to drive the cleaning component 30 along the first horizontal slide rail 51, the second horizontal slide rail 52 and the vertical slide rail 90, and to drive the rotation of the polishing pad fixing table 20 and the rotation of the roller brush 321. The motion controller 12 is electrically connected to the hydraulic drive 91 and the multiple drive motors 53, and is used to control the movement of the cleaning component 30 along the first horizontal slide rail 51, the second horizontal slide rail 52 and the vertical slide rail 90. At the same time, it can also control the rotation of the polishing pad fixing table 20 and the rotation of the roller brush 321.

[0085] In this specific embodiment, the workbench 10 is also equipped with a power supply 13, which provides power to the hydraulic drive 91, drive motor 53, motion controller 12, detector 42 of safety door 40, rotation sensor 22 of polishing pad fixing table 20, signal receiver 24, etc.

[0086] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0087] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0088] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0089] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0090] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0091] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A height-adjustable polishing pad cleaning apparatus, characterized by, The polishing pad cleaning device (100) comprises: a workbench (10) provided with a limiting table (92); a polishing pad fixing table (20) provided on the workbench (10) and provided with a bearing surface for placing a polishing pad (25); a cleaning assembly (30) mounted on the polishing pad fixing table (20) through a vertical slide rail (90), the cleaning assembly (30) is provided with a position-adjustable limiting rod (93), one end of the limiting rod points to the limiting table (92), when the cleaning assembly (30) slides along the vertical slide rail (90) to approach the bearing surface, the limiting rod (93) abuts against the limiting table (92) to limit the minimum distance between the cleaning assembly (30) and the bearing surface; the cleaning assembly (30) is provided with a thickness gauge (94), the thickness gauge (94) is provided with a measuring head (943) for abutting against the limiting table (92), the distance between the measuring head (943) and the limiting table (92) is less than the distance between the limiting rod (93) and the limiting table (92); the cleaning assembly (30) comprises a cleaning support (31) and a cleaning brush (32) connected with each other, the cleaning support (31) is in sliding connection with the vertical slide rail (90), and the cleaning brush (32) is used for abutting against the polishing pad (25); the cleaning brush (32) comprises a rolling brush (321), the rolling brush (321) is in rotational connection with the cleaning support (31), the rolling brush (321) can rotate around its own axis, and the axis of the rolling brush (321) is parallel to the bearing surface; the rotating direction of the polishing pad fixing table (20) is opposite to the rotating direction of the rolling brush (321), which is beneficial to the rolling brush (321) to take out the slag in the groove and improve the cleaning efficiency.

2. A height adjustable polishing pad cleaning apparatus as claimed in claim 1, wherein, the cleaning assembly (30) comprises a mounting plate (311), the mounting plate (311) is located directly above the limiting table (92), and the mounting plate (311) is provided with the limiting rod (93) and the thickness gauge (94).

3. A height adjustable polishing pad cleaning apparatus as claimed in claim 2, wherein, the limiting rod (93) is in threaded connection with the mounting plate (311), and one end of the limiting rod (93) is provided with a fixing nut.

4. The height adjustable polishing pad cleaning apparatus of claim 2, wherein, the mounting plate (311) is provided with a second mounting hole penetrating therethrough, the thickness gauge (94) comprises a thickness gauge support (941), a thickness gauge instrument (942) and the measuring head (943), the thickness gauge support (941) is connected with the thickness gauge instrument (942), the thickness gauge instrument (942) is in movable connection with the measuring head (943), the thickness gauge support (941) is arranged on the mounting plate (311), and the measuring head (943) movably penetrates through the second mounting hole.

5. The height adjustable polishing pad cleaning apparatus of claim 1, wherein, The limiting table (92) is provided with a first abutting portion (95) and a second abutting portion (96), the first abutting portion (95) is used for abutting with the limiting rod (93), the second abutting portion (96) is used for abutting with the thickness gauge (94), and the first abutting portion (95) is flush with the second abutting portion (96).

6. The height adjustable polishing pad cleaning apparatus of claim 1, wherein, The workbench (10) is provided with a hydraulic drive (91), the hydraulic drive (91) is connected with the cleaning support (31), and the hydraulic drive (91) is used for driving the cleaning support (31) to move along the vertical sliding rail (90).

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