Semiconductor cleaning apparatus and method of cleaning semiconductor products

Abstract

The present disclosure provides a semiconductor cleaning device and a semiconductor product cleaning method, the semiconductor cleaning device comprises a bearing part, a cleaning part, a limiting part and a drying part, the bearing part is used for bearing the product to be cleaned, the cleaning part is used for providing cleaning fluid to clean the product, the limiting part comprises a mounting frame and a cover, the cover is closed at the top, the product is located in the cover, the limiting part is provided with a through hole, the through hole can pass the cleaning fluid, and the drying part is used for drying the cleaned product. In the present disclosure, a plurality of sample stages are arranged on the bearing part, one product can be placed on each sample stage, so that multiple samples can be cleaned at the same time, and the cleaning efficiency is improved; the limiting part is arranged to limit the product on the bearing part, and the product can be effectively prevented from falling off and being lost during the cleaning, drying process of the product, and the closed cover at the top can avoid damage caused by excessive drying of the drying part on the product.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor technology, and in particular, to a semiconductor cleaning device and a cleaning method of a semiconductor product. BACKGROUND

[0002] With the continuous development of semiconductor technology, various chips have been widely used in people's daily life, work and industry, bringing great convenience to people's life. In order to facilitate engineers to continuously improve and repair chips, it is necessary to analyze the physical properties of chip samples, and currently it is necessary to delaminate chip samples for physical property analysis.

[0003] After the chip sample is delaminated on a large area, impurities are easily left on the surface, and the remaining impurities will affect the accuracy of the physical property analysis, so the chip needs to be cleaned to ensure the accuracy of the analysis. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0005] According to a first aspect of the present disclosure, a semiconductor cleaning device is provided, comprising:

[0006] a carrying part comprising a base and a plurality of sample stages arranged on the base, for carrying products to be cleaned;

[0007] a limiting part comprising a mounting frame and a cover, the cover being mounted below the mounting frame, the top of the cover being closed, and the product being located in the cover to limit the product on the carrying part, wherein a through hole is arranged on the cover, and the through hole can pass the cleaning fluid;

[0008] a cleaning part for providing cleaning fluid to clean the product;

[0009] a drying part for drying the cleaned product.

[0010] In some embodiments, a first driving part is further included, the first driving part being connected with the mounting frame of the limiting part, and the first driving part being used to drive the limiting part to move, so that the cover of the limiting part contacts or separates from the carrying part.

[0011] In some embodiments, the mounting frame comprises a plurality of longitudinal and transverse intersecting connecting beams, and a baffle is arranged on the connecting beam, the baffle being located directly above the cover to seal the top of the cover.

[0012] In some embodiments, the through hole is arranged in multiple numbers and located on the side wall of the cover.

[0013] In some embodiments, the mask is provided in a plurality, and the plurality of sample carriers correspond to the plurality of masks one by one.

[0014] In some embodiments, a second driving part is provided in the base, and a spoiler is provided on the sample carrier, and the second driving part is used to drive the sample carrier to rotate around an axis.

[0015] In some embodiments, the cleaning part comprises:

[0016] a cleaning cavity;

[0017] a fluid input pipeline in communication with the cleaning cavity, used to input cleaning fluid into the cleaning cavity;

[0018] a fluid discharge pipeline in communication with the cleaning cavity, used to discharge the cleaned cleaning fluid and impurities out of the cleaning cavity.

[0019] In some embodiments, the fluid input pipeline comprises a cleaning liquid input pipeline and a pure water input pipeline; and / or,

[0020] the fluid discharge pipeline comprises a first discharge pipeline provided on the side wall of the cleaning cavity, and a second discharge pipeline provided on the bottom of the cleaning cavity.

[0021] In some embodiments, a handle is further provided on the carrying part, and the carrying part is taken out of or put into the cleaning cavity through the handle.

[0022] According to a second aspect of the present disclosure, a cleaning method of a semiconductor product is provided, which is performed by using the semiconductor cleaning device according to the first aspect, and comprises the following steps:

[0023] S1: placing the product to be cleaned on the carrying part;

[0024] S2: limiting the product on the carrying part;

[0025] S3: inputting cleaning liquid for cleaning, discharging the cleaning liquid and impurities on the product after cleaning, and inputting pure water for secondary cleaning, and discharging the cleaned pure water;

[0026] S4: drying the product after cleaning;

[0027] S5: controlling the limiting part to rise, so that the limiting part is separated from the carrying part.

[0028] The semiconductor cleaning device and the semiconductor product cleaning method provided by the present disclosure can place multiple sample carriers on the bearing part, and each sample carrier can place one product, so that multiple samples can be cleaned at the same time, and the cleaning efficiency is improved; the limiting part is arranged to limit the product on the bearing part, and the product can be effectively prevented from falling off the bearing part during the cleaning, drying and other processes, and the top-sealed cover can prevent the product from being damaged due to excessive drying of the drying part.

[0029] Other aspects can become apparent from the following detailed description, when taken in conjunction with the accompanying drawings and detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the embodiments of the present disclosure. Similar reference numerals in the drawings represent similar elements. The drawings in the following description are of some embodiments of the present disclosure, and not all embodiments. Other drawings can be derived from these drawings by a person of ordinary skill in the art without paying creative labor.

[0031] Figure 1 is a schematic view of a semiconductor cleaning device according to an exemplary embodiment.

[0032] Figure 2 is a schematic view of a semiconductor cleaning device according to an exemplary embodiment. Figure 1 is a schematic view of A-A in FIG. 4.

[0033] Figure 3 is a schematic view of A-A in FIG. 5. Figure 1 is a schematic view of A-A in FIG. 5.

[0034] Figure 4 is a schematic view of A-A in FIG. 6. Figure 1 is a schematic view of A-A in FIG. 6.

[0035] Figure 5 is a sectional view of a semiconductor cleaning device according to an exemplary embodiment.

[0036] Figure 6 is a sectional view of a semiconductor cleaning device according to an exemplary embodiment.

[0037] Figure 7 is a schematic view of a limiting part according to an exemplary embodiment.

[0038] Figure 8 is a schematic view of a limiting part according to an exemplary embodiment.

[0039] Figure 9FIG. 1 is a flow chart of a cleaning method of a semiconductor product according to an exemplary embodiment.

[0040] Explanation of reference numerals:

[0041] 100, semiconductor cleaning device;

[0042] 10, bearing part; 11, base; 12, sample stage; 13, handle;

[0043] 20, cleaning part; 21, cleaning cavity; 22, fluid input pipeline; 23, fluid discharge pipeline; 231, first discharge pipeline; 232, second discharge pipeline;

[0044] 30, limiting part; 31, mounting frame; 311, baffle; 32, cover; 321, through hole; 33, first driving part;

[0045] 40, drying part;

[0046] 50, housing. DETAILED DESCRIPTION

[0047] To make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some but not all of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other in any manner without conflict.

[0048] As described in the background, in the prior art, the methods for cleaning chip samples mainly include the following two methods: the first method is to use tweezers to clamp the chip sample for flushing. During the cleaning process, the chip sample is easy to fall off from the tweezers and be lost. In addition, the cleaning effect of clamping for flushing is poor, and it is difficult to completely remove the impurities on the chip. The second method is to clean by ultrasonic wave. The ultrasonic wave is easy to break the thin chip sample, and after the ultrasonic cleaning is completed, the chip sample is usually blown dry by using an air gun (such as nitrogen). The chip sample is easy to be blown away or broken, thereby increasing the cost. Moreover, the above-mentioned cleaning methods are only suitable for cleaning a single chip sample, and are not suitable for cleaning multiple chip samples at the same time, and the cleaning efficiency is low.

[0049] To solve the above problems, the present disclosure provides a semiconductor cleaning device and a cleaning method of a semiconductor product. The semiconductor cleaning device comprises a bearing part, a cleaning part, a limiting part and a drying part. The bearing part is used for bearing the product to be cleaned. The cleaning part is used for providing cleaning fluid to clean the product. The limiting part is used for limiting the product on the bearing part. The limiting part is provided with a through hole which can pass the cleaning fluid. The drying part is used for drying the cleaned product. In the present disclosure, the product on the bearing part is limited by the limiting part, which can effectively avoid the product from falling off the bearing part and being lost during the cleaning process of the product by the cleaning part, so as to cause the confusion or damage of the sample.

[0050] In an exemplary embodiment of the present disclosure, as shown in Figure 1 The semiconductor cleaning device 100 is provided to clean the chip sample so as to meet the testing requirements and ensure the accuracy of the testing result.

[0051] In the present embodiment, as shown in Figures 1 to 6 The semiconductor cleaning device 100 comprises a bearing part 10, a cleaning part 20, a limiting part 30 and a drying part 40, and a shell 50 for mounting and protecting the bearing part 10, the cleaning part 20, the limiting part 30 and the drying part 40.

[0052] As shown in Figures 2 to 7 The bearing part 10 is used for bearing the product to be cleaned. The bearing part 10 comprises a base 11 and a plurality of sample stages 12 arranged on the base 11. During the cleaning process, one sample can be placed on each sample stage 12, so that a plurality of chip samples can be cleaned at the same time. The heights of the plurality of sample stages 12 can be the same or different. When the heights of the plurality of sample stages 12 are different, the height of the sample stage 12 close to the fluid input pipeline 22 is lower, and the height of the sample stage 12 far from the fluid input pipeline 22 is higher, so as to avoid the sample stage 12 from blocking the cleaning fluid and improve the cleaning effect of the cleaning fluid on the product far from the fluid input pipeline 22, and ensure the consistency of the cleaned chip sample.

[0053] Referring to Figure 2 The cleaning part 20 is used for providing cleaning fluid to clean the semiconductor product. The cleaning fluid provided by the cleaning part 20 has a certain flow rate, which can achieve the effect of flushing to separate the impurities attached to the surface of the chip sample from the chip sample. In the present embodiment, the flow rate of the cleaning fluid is not limited too much, and can be adjusted according to the actual requirements.

[0054] Referring to Figure 2The limiting part 30 is used to limit the product on the carrier part 10. The limiting part 30 is provided with multiple through holes 321, which allow cleaning fluid to pass through. This allows the cleaning fluid to enter the limiting part 30 through the through holes 321 and contact the chip sample, thereby cleaning the chip sample. After the cleaning process is completed, the cleaning fluid carrying impurities can be discharged from the through holes 321, while the chip sample remains inside the limiting part 30, awaiting removal.

[0055] The limiting part 30 includes a mounting bracket 31 and a cover 32 connected to the mounting bracket 31, with the cover 32 located below the mounting bracket 31. Figure 2 (As shown in the z-direction), the top of the shield 32 is connected to the mounting bracket 31, and the through hole 321 is located on the side wall of the shield 32. Figure 2 Taking the orientation shown as an example, the limiting part 30 is located directly above the bearing part 10. Figure 2 (as shown in the z-direction), so that the bottom of the mask 32 can mate with the support portion 10 to confine the chip sample within the mask 32. The mounting bracket 31 and the mask 32 can be integrally formed or detachably connected. Detachable connections can be made by means such as threaded connections, fastener connections, snap-fit ​​connections, etc. Other connection methods are also possible and are not limited here.

[0056] Continue reading Figure 2 The top of the mask 32 is designed to be sealed. By making the top of the mask 32 sealed, on the one hand, during the cleaning process of the chip sample, the cleaning fluid can prevent the product from being washed away from the top of the mask 32 and thus lost. On the other hand, when the drying section 40 heats the chip sample, the sealed top prevents infrared rays or heating airflow from directly contacting the chip sample. The hot airflow slows down and enters the mask 32 through the through-hole 321, or heats the chip sample in the mask 32 through heat conduction at the top of the mask 32, avoiding direct contact that could damage the chip sample structure. Furthermore, during the drying process of the drying section 40 blowing out drying airflow, the sealed top can block the drying airflow, preventing direct blowing that could cause the chip sample to detach from the carrier 10 and be lost.

[0057] See Figure 2 The drying section 40 is used to dry the cleaned chip sample to remove any residual cleaning fluid. Figure 2 Taking the orientation shown as an example, the drying section 40 can be positioned directly above the cleaning section 20. Figure 2the footprint of the semiconductor cleaning device 100. Moreover, the drying function is integrated in the semiconductor cleaning device 100, so that after the cleaning is completed, the wafer samples do not need to be transferred, and the wafer samples can be dried in the cleaning device, which improves the integration of the device, simplifies the process flow, and improves the work efficiency. In one example, the distance between the drying part 40 and the carrying part 10 (i.e., the z direction shown in FIG. 1) can be 10-20 cm. Figure 2 The drying part 40 can be, for example, an air flow dryer, an infrared dryer, or other drying devices according to actual needs, and is not limited herein.

[0058] In the embodiment of the present disclosure, a plurality of sample stages are arranged on the carrying part, and one product can be placed on each sample stage, so that a plurality of samples can be cleaned at the same time, and the cleaning efficiency is improved. The limiting part is arranged to limit the products on the carrying part, and the products can be effectively prevented from falling off the carrying part during the cleaning and drying processes. Moreover, the top-sealed cover can prevent the products from being damaged due to excessive drying of the drying part.

[0059] In one example embodiment, as shown in FIG. 1, Figures 1 to 6 The present embodiment provides a semiconductor cleaning device 100, which includes a carrying part 10, a cleaning part 20, a limiting part 30, and a drying part 40. The carrying part 10 is used to carry products to be cleaned, and includes a base 11 and a plurality of sample stages 12 arranged on the base 11. The cleaning part 20 is used to provide cleaning fluid to clean the products. The limiting part 30 includes a mounting frame 31 and a cover 32. The cover 32 is mounted below the mounting frame 31, and the top of the cover 32 is sealed. The products are located in the cover 32 to limit the products on the carrying part 10. The cover of the limiting part 30 is provided with a through hole 321, which can allow the cleaning fluid to pass through. The drying part 40 is used to dry the cleaned products.

[0060] In one example, referring to FIG. 1, Figures 5 to 7 The mounting frame 31 includes a plurality of longitudinal and transverse intersecting connecting beams. The connecting beams are provided with baffles 311, and the baffles 311 are located directly above the cover 32. The baffles 311 are used to seal the top of the cover 32 to block the drying air flow from directly blowing the surface of the wafer samples. It can be understood that, during the drying process, part of the drying air flow can enter the cover 32 through the through hole 321 on the sidewall of the cover 32. The flow rate of this part of the drying air flow is slow, and will not cause damage to the wafer samples. The connecting beams can be made of high-strength materials, such as ceramics, alloys, and the like. The material of the cover 32 can be a material with good heat conduction performance and high strength, such as carbon fiber.

[0061] In another example, referring to FIG. 1, Figure 2 The carrying part 10 is provided with a plurality of sample stages 12, and each sample stage 12 can carry one product. The carrying part 10 is provided with a limiting part 30, which includes a mounting frame 31 and a cover 32. The cover 32 is mounted below the mounting frame 31, and the top of the cover 32 is sealed. The products are located in the cover 32 to limit the products on the carrying part 10. The cover of the limiting part 30 is provided with a through hole 321, which can allow the cleaning fluid to pass through. The drying part 40 is used to dry the cleaned products.Figure 3 、 Figure 4 and Figure 8 , the mounting frame 31 can be in a plate structure, and the cover 32 is arranged below the plate structure, so that the top of the cover 32 is closed. The material of the mounting frame 31 can be a material with good heat conduction performance and high strength, such as carbon fiber.

[0062] Referring to Figure 7 and Figure 8 , the limiting part 30 and the bearing part 10 are in a split structure, and at this time the limiting part 30 can move relative to the bearing part 10. For example, during the cleaning process, the limiting part 30 can cooperate with the bearing part 10 to limit the chip samples on the bearing part 10, and before and after cleaning, the limiting part 30 can be separated from the bearing part 10, so that the limiting part 30 no longer limits the chip samples, so as to facilitate the taking and placing of chip samples on the bearing part 10, and improve the convenience of replacing chip samples. Of course, the limiting part 30 and the bearing part 10 can be in an integrated structure, such as being integrally formed or welded as a whole. When the limiting part 30 and the bearing part 10 are a whole, a space for taking and placing chip samples needs to be left above the limiting part 30.

[0063] In some embodiments, referring to Figures 2 to 6 , the semiconductor cleaning device 100 further comprises a first driving part 33, the first driving part 33 comprising a fixed end and an output end, the output end being connected with the mounting frame 31 of the limiting part 30, and the fixed end being fixedly connected with the frame, the shell or the like of the semiconductor cleaning device 100. The output end moves relative to the fixed end, that is, drives the limiting part 30 to move relative to the bearing part 10, so as to make the limiting part 30 cooperate with or separate from the bearing part 10. When the limiting part 30 cooperates with the bearing part 10, the cover 32 of the limiting part 30 is arranged above the bearing part 10, and at this time the chip samples cannot leave the area defined by the cover 32. When the limiting part 30 separates from the bearing part 10, the cover 32 of the limiting part 30 is away from the bearing part 10, and at this time the chip samples can be taken out of the bearing part 10 or placed on the bearing part 10.

[0064] In one example, referring to Figures 2 to 6 , the first driving part 33 can be, for example, a telescopic pneumatic cylinder, a hydraulic cylinder or an electric push rod. In other alternative embodiments, the first driving part 33 can also be a lead screw mechanism, a driving motor being connected with the lead screw, a sliding block being arranged on the lead screw and being connected with the mounting frame 31, the driving motor rotating to drive the lead screw to rotate, and then driving the sliding block and the mounting frame 31 to slide along the axial direction of the lead screw. Of course, it can be understood that the first driving part can also be a driving motor driving a gear to rotate, and the gear meshes with a rack (the rack being connected with the limiting part 30) to drive the limiting part 30 to move. Here, this is not limited.

[0065] In some embodiments, asFigure 2 and Figure 7 As shown, multiple through holes 321 are disposed on the sidewall of the mask 32. The through holes 321 extend radially along the mask 32 to connect the inner and outer walls of the mask 32, thereby allowing cleaning fluid to flow from the outside of the mask 32 into the inside of the mask 32 and to flush impurities inside the mask 32 to the outside of the mask 32. The cross-sectional shape of the through holes 321 can be circular, square, or irregular, as long as it allows the cleaning fluid to pass through and can block the chip sample. As an example, the through hole 321 can be circular with a diameter of 2mm to 6mm.

[0066] In one embodiment, such as Figures 1 to 6 As shown, Figures 1 to 6 As shown, this embodiment provides a semiconductor cleaning device 100, including a support part 10, a cleaning part 20, a limiting part 30, and a drying part 40. The support part 10 is used to support the product to be cleaned. The support part 10 includes a base 11 and a plurality of sample stages 12 disposed on the base 11. The cleaning part 20 is used to provide cleaning fluid to clean the product. The limiting part 30 includes a mounting frame 31 and a shield 32. The shield 32 is installed below the mounting frame 31 and the top of the shield 32 is sealed. The product is located inside the shield 32 to limit the product to the support part 10. The shield of the limiting part 30 is provided with a through hole 321, which allows the cleaning fluid to pass through. The drying part 40 is used to dry the cleaned product.

[0067] In some embodiments, such as Figures 2 to 7 As shown, the number of masks 32 is the same as the number of sample stages 12 on the support 10, and the projections of the multiple masks 32 on the support 10 correspond to the multiple sample stages 12, so that the multiple masks 32 can limit the chip sample on each sample stage 12. In this way, multiple chip samples can be cleaned simultaneously, improving cleaning efficiency.

[0068] In some embodiments, such as Figures 5 to 7 As shown, a second drive unit (not shown in the attached figure) is provided on the base 11. The second drive unit is connected to the sample stage 12 and is used to drive the sample stage 12 to rotate around the axis. For example, the fixed end of the second drive unit is fixedly connected to the base 11, and the output end of the second drive unit is fixedly connected to the sample stage 12. The second drive unit drives the sample stage 12 to rotate, thereby driving the chip sample on the sample stage 12 to rotate, so that the cleaning fluid can rinse the chip sample from multiple angles to fully remove impurities on the chip sample and improve the cleaning effect.

[0069] In one embodiment, such as Figures 1 to 7As shown, the embodiment provides a semiconductor cleaning device 100, which comprises a bearing part 10, a cleaning part 20, a limiting part 30 and a drying part 40. The bearing part 10 is used for bearing a chip sample to be cleaned. The cleaning part 20 is used for providing a cleaning fluid to clean the chip sample. The limiting part 30 is used for limiting the chip sample on the bearing part 10. The limiting part 30 is provided with a through hole 321, which can allow the cleaning fluid to pass through. The drying part 40 is used for drying the cleaned chip sample.

[0070] In the embodiment, as shown, Figures 2 to 6 The cleaning part 20 comprises a cleaning cavity 21, a fluid input pipeline 22 and a fluid discharge pipeline 23. The fluid input pipeline 22 is used for conveying the cleaning fluid into the cleaning cavity 21. The fluid discharge pipeline 23 is used for discharging the cleaned fluid and impurities from the cleaning cavity 21.

[0071] In some embodiments, as shown, Figure 5 The fluid input pipeline 22 comprises a cleaning liquid input pipeline and a pure water input pipeline. One end of the cleaning liquid input pipeline is communicated with a cleaning liquid storage device (not shown in the drawings), and the other end is connected to the cleaning cavity 21, which is used for inputting the cleaning liquid from the cleaning liquid storage device into the cleaning cavity 21 to assist in cleaning. One end of the pure water input pipeline is communicated with a pure water storage device (not shown in the drawings), and the other end is connected to the cleaning cavity 21, which is used for inputting the pure water from the pure water storage device into the cleaning cavity 21 to perform secondary cleaning. The cleaning liquid input pipeline and the pure water input pipeline are each provided with a set.

[0072] Of course, in other embodiments, the setting position and number of the fluid input pipeline 22 can also be other reasonable positions, which are not limited here.

[0073] Referring to Figures 2 to 6 During the cleaning process, the cleaning liquid storage device can be controlled to convey the cleaning liquid, such as deionized water (DIW), into the cleaning cavity 21, which is used to remove polymer residues, particulate impurities, metal ion impurities, organic impurities and the like. It can be understood that after the cleaning liquid is used for cleaning, the cleaning fluid and impurities may be left on the surface of the chip sample. The pure water storage device can be controlled to convey the pure water into the cleaning cavity 21, so as to improve the cleaning effect of the chip sample through the secondary cleaning of the pure water.

[0074] Referring to Figures 2 to 6 The fluid discharge pipeline 23 comprises a first discharge pipeline 231 and a second discharge pipeline 232. The first discharge pipeline 231 is arranged on the side wall of the cleaning cavity 21, and is used for discharging the cleaned cleaning liquid, impurities and pure water. For example, the height of the first discharge pipeline 231 can be set to be close to the height of the fluid input pipeline 22, so as to remove the impurities on the surface of the cleaning fluid.Figures 2 to 6 The second discharge pipeline 232 is arranged at the bottom of the cleaning cavity 21 to completely discharge the cleaning fluid and impurities after the cleaning fluid is washed.

[0075] In an optional embodiment, referring to Figures 2 to 6 The bottom of the cleaning cavity 21 can be funnel-shaped, and the second discharge pipeline 232 is connected to the bottom of the funnel, so that the cleaning fluid and impurities after washing can be discharged more timely and effectively.

[0076] In some embodiments, referring to Figure 1 and Figure 2 A handle 13 is arranged on the carrier 10, and the carrier 10 is taken out of the cleaning cavity 21 through the handle 13 to place the chip sample on the carrier 10 or take the chip sample out of the carrier 10, or the carrier 10 is placed into the cleaning cavity 21 to increase the convenience of taking and placing.

[0077] In one example, referring to Figures 1 to 4 The carrier 10 is horizontally placed, and the carrier 10 can be horizontally pushed and pulled along the first direction (x direction shown in Figure 2 ).

[0078] In another example, referring to Figure 4 The carrier 10 is arranged obliquely, and the carrier 10 can be pushed and pulled along the oblique direction (m direction shown in Figure 4 ). It can be understood that when the carrier 10 is arranged obliquely, the plurality of sample carriers 12 on the carrier 10 are arranged along the oblique direction, so that in the washing process, the sample carriers 12 close to the fluid input pipeline 22 are prevented from blocking the cleaning fluid, and the chip samples on the sample carriers 12 away from the fluid input pipeline 22 are prevented from being insufficiently washed.

[0079] According to an example embodiment of the present disclosure, as shown in Figure 9 The present disclosure provides a cleaning method of a semiconductor product, which can be performed by using the semiconductor cleaning device provided by any of the above embodiments of the present disclosure.

[0080] Referring to Figure 9 The cleaning method of the semiconductor product includes the following steps:

[0081] Step S1, placing the product to be cleaned on the carrier;

[0082] Step S2, controlling the limiting part to limit the product on the carrier;

[0083] Step S3, inputting the cleaning liquid for washing, discharging the cleaning liquid and impurities on the product after washing, and inputting pure water for secondary washing, and discharging the pure water after washing;

[0084] Step S4, control the drying part to dry the product after cleaning;

[0085] Step S5, control the limiting part to rise, so that the limiting part is separated from the bearing part.

[0086] In step S1, referring to Figure 6 , the bearing part 10 is provided with a plurality of sample stages 12, and the products to be cleaned can be picked up by clamping tools (tweezers) or suction tools (vacuum chuck) and placed on each sample stage 12. Usually, one product is placed on each sample stage 12. Then, the bearing part 10 can be moved into the cleaning cavity 21 of the cleaning part 20 by the handle 13.

[0087] In step S2, referring to Figure 5 , and combining Figure 6 , after placing the chip sample, the bearing part 10 is located directly below the limiting part 30, and the first driving part 33 is controlled to drive the limiting part 30 to move downward, so that the limiting part 30 cooperates with the bearing part 10 to limit the product in the mask 32 of the limiting part 30.

[0088] In step S3, the cleaning fluid can be provided into the cleaning cavity 21 through the fluid input pipeline 22 of the cleaning part 20, and the cleaning fluid has a certain flow rate and can wash the product to separate the impurities on the product. During the washing process, the cleaning fluid and the impurities are discharged to the outside of the cleaning cavity 21 through the fluid discharge pipeline 23.

[0089] Referring to Figure 5 and Figure 6 , the valve on the cleaning liquid input pipeline of the fluid input pipeline 22 can be opened, so that the cleaning liquid storage device transports the cleaning liquid into the cleaning cavity 21 through the cleaning liquid input pipeline. The cleaning liquid is used to remove the impurities on the chip sample. During the cleaning liquid washing process, the valve on the fluid discharge pipeline 23 can be opened to discharge the cleaning liquid carrying the impurities to the outside of the cleaning cavity 21.

[0090] Continuing to refer to Figure 5 and Figure 6 , the valve on the pure water input pipeline of the fluid input pipeline 22 can be opened, so that the pure water storage device transports the pure water into the cleaning cavity through the pure water input pipeline. The pure water can be used to further remove the impurities and wash away the cleaning liquid remaining on the surface of the chip sample. During the pure water washing process, the valve on the fluid discharge pipeline 23 can be opened to discharge the pure water, the impurities and the residual cleaning liquid to the outside of the cleaning cavity 21.

[0091] In step S4, referring to Figure 5 and Figure 6The drying unit 40 can be controlled to provide hot air or infrared rays to dry the product, so as to evaporate and remove the cleaning fluid remaining on the surface of the chip sample.

[0092] In one embodiment, the drying unit 40 can first heat the chip sample to 150℃, maintain the temperature at 150℃ and continue drying for 270s-330s.

[0093] In step S5, referring to Figure 5 and Figure 6 After drying is completed, the first driving unit 33 can be controlled to drive the limiting unit 30 to rise, so that the limiting unit 30 is separated from the bearing unit 10, so as to facilitate taking out the cleaned chip sample from the sample stage 12 of the bearing unit 10.

[0094] Then, an external force is applied to the handle 13 to take out the bearing unit 10 from the cleaning cavity 21 of the cleaning unit 20. Then, a tool such as a tweezer or a vacuum chuck can be used to pick up the product.

[0095] In the embodiments of the present disclosure, the chip sample is placed on each sample stage to clean multiple chip samples at the same time, which improves the cleaning efficiency. The limiting unit limits the product on the bearing unit, so as to effectively prevent the product from being lost during cleaning and drying of the product. In addition, the top-sealed cover can also prevent the product from being damaged due to excessive drying of the drying unit.

[0096] In one exemplary embodiment, step S3 can include the following steps:

[0097] Step S31: controlling the second driving unit to drive the sample stage of the bearing unit to rotate.

[0098] In this step, referring to Figure 5 and Figure 6 When the cleaning unit 20 washes the chip sample on the bearing unit 10, the second driving unit (not shown in the figure) on the bearing unit 10 can be controlled to move to drive the sample stage 12 of the bearing unit 10 to rotate relative to the base 11, so that the cleaning liquid can wash the chip sample from multiple angles, thereby improving the washing effect.

[0099] In one example, the speed at which the second driving unit drives the sample stage 12 to rotate can be 15r / min-20r / min.

[0100] In the present specification, each embodiment or implementation is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be mutually referred to.

[0101] In the description of the specification, the description of the terms "embodiment", "exemplary embodiment", "some embodiments", "illustrative embodiment", "example", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure.

[0102] In the description of the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0103] In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0104] It can be understood that the terms "first", "second", and the like used in the present disclosure can be used in the present disclosure to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish the first structure from another structure.

[0105] In one or more drawings, the same elements are denoted by similar reference numerals. For the sake of clarity, parts of the drawings are not drawn to scale. In addition, some well-known parts can not be shown. For the sake of simplicity, structures obtained after several steps can be described in one drawing. Many specific details of the present disclosure are described below, such as the structure, material, size, processing process and technique of the device, in order to make the present disclosure more clearly understood. But as those skilled in the art can understand, the present disclosure can be implemented without these specific details.

[0106] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, and not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1.A semiconductor cleaning device, comprising: a carrying part comprising a base and a plurality of sample carriers arranged on the base, for carrying products to be cleaned; a limiting part comprising a mounting frame and a cover, the cover being arranged below the mounting frame, the cover being closed at the top, the products being arranged in the cover, so as to limit the products on the carrying part, wherein a plurality of through holes are arranged on the cover, and the through holes are capable of allowing cleaning fluid to pass through; a cleaning part for providing cleaning fluid to clean the products; a drying part for drying the products after cleaning; a housing for mounting and protecting the carrying part, the cleaning part, the limiting part and the drying part; and the drying part is arranged directly above the cleaning part. 2.The semiconductor cleaning device according to claim 1, further comprising a first driving part connected to the mounting frame of the limiting part, the first driving part being used to drive the limiting part to move, so that the cover of the limiting part is in contact with or separated from the carrying part. 3.The semiconductor cleaning device according to claim 1, wherein the mounting frame comprises a plurality of connection beams arranged in a crisscross manner, and a plurality of baffles are arranged on the connection beams and located above the cover to seal the top of the cover. 4.The semiconductor cleaning device according to claim 1, wherein the through holes are arranged in a plurality of groups on the side walls of the cover. 5.The semiconductor cleaning device according to claim 1, wherein the cover is arranged in a plurality of groups, and a plurality of the sample carriers correspond to a plurality of the covers one by one. 6.The semiconductor cleaning device according to claim 1, wherein a second driving part is arranged in the base, and a turbulence part is arranged on the sample carrier, and the second driving part is used to drive the sample carrier to rotate around an axis. 7.The semiconductor cleaning device according to claim 1, wherein the cleaning part comprises: a cleaning cavity; a fluid input pipeline in communication with the cleaning cavity, for inputting cleaning fluid into the cleaning cavity; and a fluid discharge pipeline in communication with the cleaning cavity, for discharging the cleaning fluid and impurities after cleaning out of the cleaning cavity. 8.The semiconductor cleaning device according to claim 7, wherein the fluid input pipeline comprises a cleaning liquid input pipeline and a pure water input pipeline; and / or the fluid discharge pipeline comprises a first discharge pipeline arranged on the side wall of the cleaning cavity, and a second discharge pipeline arranged on the bottom of the cleaning cavity. 9.The semiconductor cleaning device according to claim 7, further comprising a handle arranged on the carrying part, and the carrying part is taken out of or put into the cleaning cavity through the handle. 10.A cleaning method of semiconductor products, which is performed by using the semiconductor cleaning device according to any one of claims 1-9, comprising the following steps: S1: arranging products to be cleaned on the carrying part; and S2: limiting the products on the carrying part. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ S3: input cleaning liquid to clean, after cleaning, discharge the cleaning liquid and the impurities on the product, then input pure water to clean again, and discharge the cleaned pure water; S4: dry the product after cleaning; S5: control the limiting part to rise, so that the limiting part is separated from the bearing part.

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