Laser flight optical path debugging method and laser processing equipment

Abstract

The present application provides a laser flight optical path debugging method and laser processing equipment, the method comprising setting an indicator light beam directed to a scanning mirror, and causing the indicator light beam to irradiate a first reflector in the reverse direction of the optical path; adjusting a third reflector so that the indicator light beam between the third reflector and the second reflector propagates in a vertical direction; installing an optical path positioning device with a light-through hole between the second reflector and the third reflector, and adjusting the position of the optical path positioning device so that the indicator light beam passes through the light-through hole; setting a positioning light beam directed to the first reflector, and causing the positioning light beam to irradiate a scanning mirror in the forward direction of the optical path; and adjusting the first reflector and the second reflector so that the positioning light beam passes through the light-through hole. The laser flight optical path debugging method and laser processing equipment provided by the present application utilize the principle of optical path reversibility to improve debugging accuracy, thereby ensuring that the position accuracy of the flight optical path meets optical requirements.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a laser flight optical path debugging method and laser processing equipment. Background Art

[0002] In existing laser processing equipment, a flying optical path structure is often used to adjust the direction of the laser. Ensuring strict collimation of the flying light beam is one of the necessary prerequisites for achieving high-quality processing.

[0003] However, the actual flying optical path structure of laser processing equipment is installed on a plurality of assembled module structures. The purely mechanical positioning and debugging method is difficult to ensure that the position accuracy of the optical path meets the optical requirements. Summary of the Invention

[0004] In view of this, the present application provides a laser flight optical path debugging method and laser processing equipment to solve the problems of low adjustment accuracy and difficulty in adjusting the flight optical path of laser processing equipment in the prior art.

[0005] The present application provides a laser flight optical path debugging method, which is applied to laser processing equipment. The laser processing equipment includes a first reflector, a second reflector, a third reflector, a galvanometer assembly, a scanning mirror, and a work platform arranged in sequence along the optical path. The laser flight optical path debugging method includes:

[0006] Setting an indicator light beam directed to the scanning mirror, and making the indicator light beam illuminate the first reflecting mirror in the reverse direction of the optical path;

[0007] adjusting the third reflector so that the indicator light beam between the third reflector and the second reflector propagates in a vertical direction;

[0008] Installing an optical path positioning device having a light-through hole between the second reflector and the third reflector, and adjusting the position of the optical path positioning device so that the indicator light beam passes through the light-through hole;

[0009] Setting a positioning light beam directed to the first reflector, and making the positioning light beam irradiate the scanning mirror in a forward direction along the optical path direction;

[0010] The first reflector and the second reflector are adjusted to allow the positioning light beam to pass through the light hole.

[0011] The present application also provides a laser processing device, which is debugged using the above-mentioned laser flight optical path debugging method. The laser processing device includes a first reflector, a second reflector, a third reflector, a galvanometer assembly, a scanning mirror and a work platform arranged in sequence along the optical path direction. The laser processing equipment also includes an indicator laser, a positioning laser and an optical path positioning device. The indicator laser is used to generate an indicator light beam pointing to the scanning mirror, and the positioning laser is used to generate a positioning light beam pointing to the first reflector. The optical path positioning device is arranged between the first reflector and the third reflector. The optical path positioning device is provided with a light-through hole, and the light-through hole is used for allowing the indicator light beam and the positioning light beam to pass through.

[0012] The laser flight optical path debugging method and laser processing equipment provided by the present application first set an indicator light beam in the reverse light path direction, and adjust the position of the optical path positioning device so that the indicator light beam passes through the light hole. In this way, the position of the optical path positioning device can represent the position of the indicator light beam. Then, a positioning light beam is set along the light path direction, and the positioning light beam passes through the light hole of the optical path positioning device by adjusting the first reflector and the second reflector. At this time, the theoretical position of the positioning light beam coincides with the theoretical position of the indicator light beam, and the position adjustment of the first reflector and the second reflector is completed. The laser can pass through the first reflector, the second reflector, the third reflector, the galvanometer assembly and the scanning mirror in sequence along the positive light path direction to irradiate the work platform. The present application uses the principle of reversible optical path to improve the debugging accuracy, thereby ensuring that the position accuracy of the flight optical path meets the optical requirements.

[0013] Other features and advantages of the embodiments of the present application will be described in the subsequent description, and in part will become apparent from the description, or be understood by practicing the embodiments of the present application. The purposes and other advantages of the embodiments of the present application are achieved and obtained by the structures particularly pointed out in the description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 A schematic diagram of the process of debugging the laser flight optical path provided in an embodiment of the present application;

[0016] Figure 2 A schematic diagram of the structure of the laser processing equipment provided in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of setting an indicator beam for the laser processing equipment provided in an embodiment of the present application;

[0018] Figure 4 Schematic diagram of setting a positioning beam for the laser processing equipment provided in an embodiment of the present application.

[0019] Reference numerals:

[0020] 100. Laser processing equipment; 11. First reflector; 12. Second reflector; 13. Third reflector; 14. Galvanometer assembly; 141. First motor; 142. X-axis reflector; 143. Second motor; 144. Y-axis reflector; 15. Scanning mirror; 16. Working platform; 17. Pointing laser; 18. Adjustment seat; 2. Optical path positioning device; 21. Upper reference aperture; 211. First light hole; 22. Lower reference aperture; 221. Second light hole; 3. Light spot analysis device; 41. Galvanometer exit aperture; 42. Galvanometer entrance aperture; 43. Light spot analyzer.

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0022] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0023] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0024] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0025] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0026] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0027] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0029] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also be indirectly connected to the other element "on" or "under" through an intermediate element.

[0030] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0031] See also Figure 2 , an example of a laser processing device 100 is given. The laser processing device 100 mainly includes a first reflector 11, a second reflector 12, a third reflector 13, a galvanometer assembly 14, a scanning mirror 15 and a working platform 16 arranged in sequence along the light path direction. The laser processing device 100 also includes auxiliary structures such as a laser light source, a frame, and a driving device.

[0032] The laser processing position in the aforementioned laser processing apparatus 100 typically has adjustment space in three directions: X, Y, and Z. These directions refer to the X, Y, and Z axes in a rectangular coordinate system. The first motor 141 and the second motor 143 in the galvanometer assembly 14 adjust the laser processing position in the plane of the work platform 16. The drive mechanism on the processing apparatus adjusts the laser processing position in the vertical direction (i.e., the aforementioned Z-axis direction). This allows the laser processing apparatus 100 to perform high-precision laser processing on workpieces placed on the work platform 16.

[0033] To ensure the processing effect and precision of the processing equipment, it is necessary to improve the parallelism between the first flying beam (between the second reflector 12 and the third reflector 13), the second flying beam (between the scanning mirror 15 and the processing position), and the sliding direction of the slider. Because the mechanical structure of the actual laser processing equipment 100 is assembled from multiple modules and structures, purely mechanical positioning and debugging methods cannot guarantee that the positional accuracy of the optical path meets optical requirements. Therefore, an optical adjustment method is required to achieve precise adjustment of the dual flying optical paths.

[0034] The following describes a specific embodiment of the laser flight optical path debugging method provided in an embodiment of the present application.

[0035] See also Figure 1 The present application provides a laser flight optical path debugging method, which is applied to a laser processing device 100. The laser processing device 100 includes a first reflector 11, a second reflector 12, a third reflector 13, a galvanometer assembly 14, a scanning mirror 15, and a work platform 16, which are sequentially arranged along the optical path. The laser flight optical path debugging method includes:

[0036] S1: Setting the indicator light beam to point to the scanning mirror 15, and making the indicator light beam illuminate the first reflector 11 in the reverse direction of the light path;

[0037] S2: Adjust the third reflector 13 so that the indicator light beam between the third reflector 13 and the second reflector 12 propagates in the vertical direction;

[0038] S3: Installing an optical path positioning device 2 having a light-through hole between the second reflector 12 and the third reflector 13, and adjusting the position of the optical path positioning device 2 so that the indicator light beam passes through the light-through hole;

[0039] S4: Setting the positioning light beam to point to the first reflector 11, and making the positioning light beam illuminate the scanning mirror 15 in the forward direction of the optical path;

[0040] S5: Adjust the first reflector 11 and the second reflector 12 to allow the positioning light beam to pass through the light hole.

[0041] See also Figure 3, the direction of the arrow in the figure is the irradiation direction of the indicator light beam (that is, the reverse irradiation direction along the optical path direction). In step S1, a laser that can emit an indicator light beam can be set on the work platform 16. The indicator light beam can be a visible green laser, etc. The indicator laser beam is incident on the scanning mirror 15 in the vertical direction and irradiated to the first reflector 11 in the reverse direction of the optical path direction, that is, the indicator laser beam is incident on the scanning mirror 15 in the vertical direction and irradiates the galvanometer assembly 14, the third reflector 13, the second reflector 12 to the first reflector 11 in the reverse direction of the optical path direction; in order to further improve the debugging accuracy, the first motor 141 and the second motor 143 in the galvanometer assembly 14 can be adjusted to the initial position, and the initial position refers to: when the first motor 141 and the second motor 143 are in the initial position, the light entering the galvanometer assembly 14 from the third reflector 13 along the forward optical path is reflected by the galvanometer assembly 14 and enters the scanning mirror 15 in the vertical direction.

[0042] In step S2, the angle and / or position of the third reflector 13 is adjusted so that the indicator beam is vertically directed to the second reflector 12. At this point, the indicator beam and the ideal dual-flying beams are simultaneously parallel. It will be appreciated that the first reflector 11, the second reflector 12, and the third reflector 13 in the laser processing apparatus 100 all have a certain adjustment range, and adjusting their positions can change the propagation direction of the laser beam.

[0043] In step S3, the optical path positioning device 2 installed between the second reflector 12 and the third reflector 13 can be an aperture or other device that can calibrate and indicate the position of the light beam. An aperture refers to an entity in an optical system that limits the light beam and can be the edge of a lens, a frame, or a specially designed screen with holes. The aperture has two functions: limiting the light beam or limiting the size of the field of view. In an optical system, the aperture that is most commonly used to limit the light beam is called an aperture aperture. The size of the light spot can be adjusted by adjusting the size of the central opening. The size of the aperture aperture determines the amount of light energy that enters the reaction system.

[0044] The optical path positioning device 2 has a light hole. By adjusting the position of the optical path positioning device 2, the indicator beam can be made to pass through the light hole. Furthermore, the indicator beam can be made to pass through the center of the light hole. In this case, the center line of the light hole on the optical path positioning device 2 coincides with the geometric center line of this portion of the indicator beam. When the position of the optical path positioning device 2 is adjusted, the indicator beam can be turned off.

[0045] See also Figure 4The direction of the arrow in the figure is the irradiation direction of the positioning beam. In step S4, the positioning beam can be emitted by a laser. The positioning beam can be a visible green laser, etc. The positioning beam is irradiated to the first reflector 11 and propagates along the forward direction of the optical path to the scanning mirror 15, that is, the positioning beam passes through the first reflector 11, the second reflector 12, the third reflector 13, the galvanometer assembly 14 to the scanning mirror 15 in sequence.

[0046] In step S5, the position of the positioning beam can be changed by adjusting the posture of the first reflector 11 and the second reflector 12. As long as the positioning beam passes through the light hole, the positioning beam can be made to pass through the center of the light hole to improve accuracy. Because the indicator beam in step S2 is irradiated in the vertical direction, and the centerline of the light hole in the optical path positioning device 2 coincides with the centerline of the indicator beam passing through it, according to the principle of optical path reversibility, the positioning beam is now parallel to the indicator beam and the vertical direction, thereby improving the accuracy of the laser processing equipment 100.

[0047] The laser flight optical path debugging method provided in this application first sets an indicator beam in the reverse optical path direction, and adjusts the position of the optical path positioning device so that the indicator beam passes through the light hole. In this way, the position of the optical path positioning device can represent the position of the indicator beam. Then, a positioning beam is set along the optical path direction, and the positioning beam passes through the light hole of the optical path positioning device by adjusting the first reflector and the second reflector. At this time, the theoretical position of the positioning beam and the indicator beam coincide, and the position adjustment of the first reflector and the second reflector is complete. The laser can pass through the first reflector, the second reflector, the third reflector, the galvanometer assembly, and the scanning mirror in the positive optical path direction to irradiate the work platform.

[0048] In summary, the laser flight optical path debugging method provided in this application utilizes the reversible principle of the optical path to improve the debugging accuracy, thereby ensuring that the position accuracy of the flight optical path in the laser processing equipment meets the optical requirements.

[0049] In one embodiment, after adjusting the first reflector 11 and the second reflector 12 in step S5 so that the positioning light beam passes through the light hole, the method further includes:

[0050] S6: a light spot analysis device 3 is set on the working platform 16, and the position of the light spot analysis device 3 is adjusted so that it can receive the positioning beam emitted from the scanning mirror 15, and the diffraction light spot effect of the positioning beam is checked by the light spot analysis device 3.

[0051] See also Figure 4The spot analysis device 3 can be any spot analysis instrument or CCD detection device that can analyze a light beam. The spot analysis device 3 is a measurement system that can quickly and quantitatively detect and evaluate the shape characteristic parameters of the laser beam. The spot analysis device 3 can control the hardware system to collect and analyze the continuous visible laser spot, thereby obtaining parameters such as the center, radius, and ellipticity of the laser spot. Furthermore, the spot analysis device 3 can display the light intensity energy field in two dimensions and three dimensions. When the spot analysis device 3 detects a circularly symmetrical diffraction spot effect, it can be considered that the positioning beam just passes through the center of the light hole. In this embodiment, by setting the spot analysis device 3, the positioning beam propagating forward along the optical path direction can be detected in real time, so as to improve the debugging accuracy of the first reflector 11 and the second reflector 12 in step S5.

[0052] In one embodiment, the optical path positioning device 2 includes an upper reference aperture 21 and a lower reference aperture 22 independently provided from each other, the upper reference aperture 21 is provided with a first light-through hole 211, and the lower reference aperture 22 is provided with a second light-through hole 221. In step S3, adjusting the position of the optical path positioning device 2 so that the indicator light beam passes through the light-through hole specifically includes:

[0053] S31: Adjust the position of the upper reference aperture 21 so that the indicator light beam passes through the center of the first light hole 211;

[0054] S32 : adjusting the position of the lower reference aperture 22 so that the index light beam passes through the center of the second light hole 221 .

[0055] See also Figure 3 and Figure 4 In this embodiment, the optical path positioning device 2 includes two independently arranged upper reference apertures 21 and lower reference apertures 22. The upper reference aperture 21 can be located near the second reflector 12, and the lower reference aperture 22 can be located near the third reflector 13. The greater the distance between the upper reference aperture 21 and the lower reference aperture 22, the higher the positional accuracy required when the indicator light beam passes through the first light hole 211 and the second light hole 221 simultaneously, and the correspondingly higher the optical path debugging accuracy.

[0056] It should be noted that, in this embodiment, the order of step S31 and step S32 can be interchanged, and step S31 and step S32 can be performed alternately multiple times to reduce debugging difficulty and improve debugging accuracy.

[0057] In one embodiment, step S3 of adjusting the first reflector 11 and the second reflector 12 so that the positioning light beam passes through the light hole specifically includes:

[0058] Install the upper reference diaphragm 21, remove the lower reference diaphragm 22, and adjust the first reflector 11 until the spot analysis device 3 detects a circularly symmetrical spot effect;

[0059] Install the lower reference diaphragm 22 , remove the upper reference diaphragm 21 , and adjust the second reflecting mirror 12 until the light spot analysis device 3 detects a circularly symmetrical light spot effect.

[0060] Because upper reference aperture 21 and lower reference aperture 22 are located on the same optical path and both can block the indicator beam, to prevent mutual interference between the two during debugging, this embodiment only debugs one of the two apertures, removing the other. This prevents interference between the two during debugging, thereby reducing debugging difficulty and increasing debugging speed compared to the previous embodiment.

[0061] In one embodiment, after adjusting the first reflector 11 and the second reflector 12 in step S5 so that the positioning light beam passes through the light hole, the method further includes:

[0062] Remove the optical path positioning device 2 from the laser processing equipment 100 .

[0063] See also Figure 2 , Figure 2 The optical path positioning device 2 has been removed. After debugging is completed, the optical path positioning device 2 should be removed in time to avoid damage to the laser processing equipment 100.

[0064] In one embodiment, step S1 sets the indicator light beam directed to the scanning mirror 15, specifically comprising:

[0065] S11: providing an indicator laser 17 for emitting an indicator light beam and an adjustment base 18 for adjusting the posture of the indicator laser 17;

[0066] S12: Setting the adjustment seat 18 on the working platform 16 and setting the indicator laser 17 on the adjustment seat 18;

[0067] S13: Adjust the adjustment seat 18 so that the indicator light beam emitted by the indicator laser 17 enters the scanning mirror 15 along the vertical direction.

[0068] See also Figure 3 The indicator laser 17 is used to emit an indicator beam, which can be a visible green laser, etc. The adjustment base 18 can be a device with multi-dimensional adjustment function. The adjustment base 18 can move the indicator laser 17 in a direction parallel to the plane of the work platform 16. The adjustment base 18 can also adjust the pitch angle between the indicator laser 17 and the plane of the work platform 16. By adjusting the angle of the adjustment base 18, the indicator beam emitted by the laser can be accurately projected into the scanning mirror 15 in the vertical direction.

[0069] In one embodiment, step S1 sets the indicator light beam directed to the scanning mirror 15, and further includes:

[0070] A galvanometer exit aperture 41 is provided on the side of the galvanometer assembly 14 close to the indicator laser 17 , and a galvanometer entrance aperture 42 is provided on the side of the galvanometer assembly 14 close to the third reflector 13 ;

[0071] A spot analyzer 43 is provided on the side of the galvanometer entrance aperture 42 close to the third reflector 13;

[0072] The adjusting seat 18 is adjusted until the light spot analyzer 43 detects a circularly symmetrical light spot effect of the indicator light beam.

[0073] See also Figure 3 When debugging the position of the indicator light beam, the galvanometer entrance aperture 42 can check the error between the indicator light beam and the entrance of the galvanometer assembly 14. The galvanometer exit aperture 41 can check the error between the indicator light beam and the exit of the galvanometer assembly 14.

[0074] In conjunction with the aforementioned embodiment, the indicator beam is emitted from the indicator laser 17 and sequentially passes through the galvanometer exit aperture 41, the galvanometer assembly 14, the galvanometer entrance aperture 42, and finally strikes the spot analyzer 43. The spot analyzer 43 can monitor the indicator beam's illumination effect in real time. Continuous adjustment of the adjustment base 18 can change the indicator beam's illumination direction. When the spot analyzer 43 detects a circularly symmetrical spot effect of the indicator beam, it can be assumed that the indicator beam emitted from the indicator laser 17 is incident vertically onto the scanning mirror 15. Because the initial position of the galvanometer motor in the galvanometer assembly 14 is typically designed and adjusted based on the galvanometer exit and entrance centers, with relatively high precision and errors far below optical dimension requirements, after adjustment, the indicator beam passes through the center of the galvanometer exit aperture 41 and can be considered to simultaneously pass through the center of the galvanometer entrance aperture 42. Because the beam now propagates from the center of the scanning mirror 15 (with minimal aberration), processing results are improved. In this embodiment, the parallelism of the indicator laser beam with the vertical direction is detected by a spot analyzer 43 provided on the side of the galvanometer entrance aperture 42 close to the third reflector 13 , thereby improving the accuracy of optical path adjustment.

[0075] In one embodiment, the laser flight optical path debugging method further includes:

[0076] The third reflector 13, the galvanometer assembly 14 and the scanning mirror 15 are arranged on a sliding member (not shown in the figure), and the sliding member is arranged to slide in the vertical direction;

[0077] The distance between the sliding member and the working platform 16 is changed, and the adjusting seat 18 is adjusted so that when the sliding member is at any position, the light spot analyzer 43 can detect the circularly symmetrical light spot effect of the indicator light beam.

[0078] The third reflector 13, the galvanometer assembly 14 and the scanning mirror 15 are all installed on a sliding part, and the sliding part is arranged in the vertical direction. When the sliding part slides in the vertical direction, the distance between the third reflector 13 and the second reflector 12 changes (the distance between the focusing mirror and the work platform 16 changes), thereby changing the focus of the laser beam emitted from the scanning mirror 15 to better process workpieces of different heights.

[0079] In this embodiment, the sliding member uses a spot analyzer 43 to detect the irradiation effect of the indicator light beam at multiple positions of its sliding stroke, so that no matter where the sliding member slides to, the spot analyzer 43 can detect the circularly symmetrical spot effect of the indicator light beam, thereby improving the debugging accuracy and ensuring the universality of the debugging effect.

[0080] In one embodiment, step S1 causes the indicator light beam to be directed in the reverse direction of the light path to the first reflector 11, specifically including:

[0081] The first motor 141 and the second motor 143 in the galvanometer assembly 14 are adjusted to their initial positions. When the first motor 141 and the second motor 143 are in their initial positions, the light entering the galvanometer assembly 14 from the third reflector 13 is reflected by the galvanometer assembly 14 and then enters the scanning mirror 15 in a vertical direction.

[0082] The galvanometer assembly 14 primarily includes an X-axis reflector 142, a Y-axis reflector 144, a first motor 141 connected to the X-axis reflector 142, and a second motor 143 connected to the Y-axis reflector 144. The laser beam enters the galvanometer assembly 14 after being reflected by the third reflector 13. The galvanometer assembly 14 then reflects the laser beam into the scanning mirror 15. The laser beam is ultimately emitted from the scanning mirror 15 to the processing position on the work platform 16.

[0083] When the first motor 141 and the second motor 143 are in the initial position (zero position), the laser beam reflected from the galvanometer assembly 14 is parallel to the vertical direction. Therefore, in the process of debugging the optical path, adjusting the first motor 141 and the second motor 143 to the initial position first can improve the debugging accuracy.

[0084] The present application also provides a laser processing device 100, which is debugged using the above-mentioned laser flight optical path debugging method. The laser processing device 100 includes a first reflector 11, a second reflector 12, a third reflector 13, a galvanometer assembly 14, a scanning mirror 15 and a work platform 16 arranged in sequence along the optical path direction. The laser processing device 100 also includes an indicator laser, a positioning laser and an optical path positioning device 2. The indicator laser is used to generate an indicator light beam pointing to the scanning mirror 15, and the positioning laser is used to generate a positioning light beam pointing to the first reflector 11. The optical path positioning device 2 is arranged between the first reflector 11 and the third reflector 13. The optical path positioning device 2 is provided with a light-through hole, which is used to allow the indicator light beam and the positioning light beam to pass through.

[0085] The laser processing equipment 100 in this application can specifically be laser cutting equipment, laser surface modification equipment, laser welding equipment, laser drilling equipment, etc.

[0086] To sum up, the laser flight optical path debugging method and laser processing equipment provided by the present application can improve the parallelism between the first flying light beam (between the second reflector 12 and the third reflector 13), the second flying light beam (between the scanning mirror 15 and the processing position) and the sliding direction of the sliding part, thereby ensuring the versatility of the galvanometer assembly 14 and the CCD correction effect under different thicknesses and different defocus states of the workpiece, and can make the light beam propagate from the center of the scanning mirror 15 (with the smallest aberration at this time), thereby improving the processing effect.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laser flight optical path debugging method, characterized in that: The laser flight optical path debugging method is applied to laser processing equipment, which includes a first reflector, a second reflector, a third reflector, a galvanometer assembly, a scanning mirror, and a work platform arranged in sequence along the optical path. The laser flight optical path debugging method includes: Setting an indicator light beam directed to the scanning mirror, and making the indicator light beam illuminate the first reflecting mirror in the reverse direction of the optical path; adjusting the third reflector so that the indicator light beam between the third reflector and the second reflector propagates in a vertical direction; Installing an optical path positioning device having a light-through hole between the second reflector and the third reflector, and adjusting the position of the optical path positioning device so that the indicator light beam passes through the light-through hole; Setting a positioning light beam directed to the first reflector, and making the positioning light beam irradiate the scanning mirror in a forward direction along the optical path direction; The first reflector and the second reflector are adjusted to allow the positioning light beam to pass through the light hole.

2. The laser flight optical path debugging method according to claim 1, characterized in that: After adjusting the first reflector and the second reflector so that the positioning light beam passes through the light hole, the method further includes: A light spot analysis device is set on the working platform, and the position of the light spot analysis device is adjusted so that it can receive the positioning light beam emitted from the scanning mirror. The light spot analysis device is used to check the diffraction light spot effect of the positioning light beam.

3. The laser flight optical path debugging method according to claim 2, characterized in that: The optical path positioning device includes an upper reference aperture and a lower reference aperture independently provided, the upper reference aperture is provided with a first light-through hole, and the lower reference aperture is provided with a second light-through hole. Adjusting the position of the optical path positioning device so that the indicator light beam passes through the light-through hole specifically includes: adjusting the position of the upper reference aperture so that the indicator light beam passes through the center of the first light hole; The position of the lower reference aperture is adjusted so that the indicator light beam passes through the center of the second light hole.

4. The laser flight optical path debugging method according to claim 3, characterized in that: The adjusting the first reflector and the second reflector so that the positioning light beam passes through the light hole specifically includes: Install the upper reference aperture, remove the lower reference aperture, and adjust the first reflector until the light spot analysis device detects a circularly symmetrical light spot effect; The lower reference aperture is installed, the upper reference aperture is removed, and the second reflecting mirror is adjusted until the light spot analysis device detects a circularly symmetrical light spot effect.

5. The laser flight optical path debugging method according to claim 2, characterized in that: The light spot analysis device is a CCD detection device.

6. The laser flight optical path debugging method according to claim 2, characterized in that: After adjusting the first reflector and the second reflector so that the positioning light beam passes through the light hole, the method further includes: Remove the optical path positioning device from the laser processing equipment.

7. The laser flight optical path debugging method according to claim 1, characterized in that: The step of setting the indicator light beam directed to the scanning mirror specifically includes: Providing a pointing laser for emitting the pointing light beam and an adjustment base for adjusting the posture of the pointing laser; The adjusting seat is arranged on the working platform, and the indicating laser is arranged on the adjusting seat; The adjustment seat is adjusted so that the indicator light beam emitted by the indicator laser enters the scanning mirror along the vertical direction.

8. The laser flight optical path debugging method according to claim 7, characterized in that: The setting of the indicator light beam directed to the scanning mirror further includes: A galvanometer exit aperture is provided on the side of the galvanometer assembly close to the indicator laser, and a galvanometer entrance aperture is provided on the side of the galvanometer assembly close to the third reflector; A spot analyzer is arranged on the side of the galvanometer entrance aperture close to the third reflecting mirror; The adjustment seat is adjusted until the light spot analyzer detects a circularly symmetrical light spot effect of the indicator light beam.

9. The laser flight optical path debugging method according to claim 8, characterized in that: The laser flight optical path debugging method further includes: The third reflector, the galvanometer mirror assembly and the scanning mirror are arranged on a sliding member, and the sliding member is slidably arranged along the vertical direction; The distance between the sliding member and the working platform is changed, and the adjusting seat is adjusted so that when the sliding member is at any position, the light spot analyzer can detect the circularly symmetrical light spot effect of the indicator light beam.

10. The laser flight optical path debugging method according to any one of claims 1 to 9, characterized in that: The step of causing the indicator light beam to irradiate the first reflector in the reverse direction of the light path specifically includes: The first motor and the second motor in the galvanometer assembly are adjusted to their initial positions, wherein when the first motor and the second motor are located at the initial positions, the light entering the galvanometer assembly from the third reflector is reflected by the galvanometer assembly and enters the scanning mirror along the vertical direction.

11. A laser processing device, characterized in that: The laser processing equipment is debugged using the laser flight optical path debugging method described in any one of claims 1 to 10. The laser processing equipment includes a first reflector, a second reflector, a third reflector, a galvanometer assembly, a scanning mirror and a work platform arranged in sequence along the optical path direction. The laser processing equipment also includes an indicator laser, a positioning laser and an optical path positioning device. The indicator laser is used to generate an indicator light beam pointing to the scanning mirror, and the positioning laser is used to generate a positioning light beam pointing to the first reflector. The optical path positioning device is arranged between the first reflector and the third reflector. The optical path positioning device is provided with a light-through hole, and the light-through hole is used for the indicator light beam and the positioning light beam to pass through.

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