A method for forming orderly arrangement of diamond abrasive grains

Abstract

The present invention discloses a method for forming an orderly arrangement of diamond abrasive grains, comprising the steps of: prefabricating a sheet blank of a target thickness; adsorbing paper and coating the surface of the sheet blank with a photosensitive adhesive; photocuring the resulting paper according to a designed arrangement pattern, wherein the size of the designed unexposed points is no larger than a single diamond particle; moving the paper obtained in step S3 and pressing it into a diamond abrasive grain bin, causing the uncured photosensitive colloid points to adhere to single diamond micropowders smaller than 40 mesh; drying and curing the paper with hot air, and directional arrangement of the diamond abrasive grains on the paper surface according to a designed pattern; moving the resulting paper with diamond particles to the upper surface of the blank and pressing it; and hot-pressing and sintering the resulting blank, so that the diamonds formed on the surface of the blank are arranged according to a predetermined pattern. The present invention can achieve directional arrangement of diamond micropowders smaller than 30 mesh, with high manufacturing efficiency and minimal impact of jigs on product quality.

Description

Technical Field

[0001] The invention relates to the technical field of diamond grinding tool production, and in particular to a method for forming orderly arrangement of diamond abrasive grains. Background Art

[0002] Diamond abrasive grains are widely used in machining tools due to their excellent strength, good thermal conductivity, and high sharpness. Metal powder and diamond abrasive grains are typically combined to produce high-strength diamond tools to meet the needs of various industries. Currently available diamond tools have evolved from single-layer processing to multi-layer brazed diamond grinding wheels, significantly improving the tool life. To further achieve an orderly lattice arrangement of diamond abrasive grains, Korean patent application [WO2005075142A1] utilizes ARIX equipment to coat diamond abrasive grains with glue and metal powder to form a spherical structure. Using a cold-pressing process, the device can produce 50,000 green diamond abrasive grains with a 3D punctate structure per month. Chinese patent application [CN105905601B] discloses a needle fixture with an internal hole and a negative pressure system that absorbs diamond abrasive grains and "seeds" them onto pre-pressed metal binder powder, achieving an orderly 3D distribution of diamond abrasive grains. Production efficiency is 3 times higher than that of patent [WO2005075142A1].

[0003] It is worth noting that the above two technical solutions have achieved directional arrangement of diamonds above 40 / 50, but due to the limitations of their manufacturing principles, they are difficult to be used for directional arrangement of diamond micropowder (below 30 mesh). Summary of the Invention

[0004] The technical problem to be solved by the embodiments of the present invention is to provide a method for orderly arranging diamond abrasive grains, which can solve a series of problems in the prior art, such as the difficulty in directional arrangement of diamond micropowder below 30 mesh, low manufacturing efficiency, and poor accuracy.

[0005] In order to solve the above technical problems, an embodiment of the present invention provides a method for forming an orderly arrangement of diamond abrasive grains, comprising the following steps:

[0006] S1: prefabricate the sheet blank with target thickness;

[0007] S2: Place a piece of paper of a set shape on the adsorption moving platform and apply photosensitive adhesive on its surface;

[0008] S3: light-curing the obtained paper according to the designed arrangement pattern, wherein the size of the designed unexposed points is no larger than a single diamond particle;

[0009] S4: The paper obtained in S3 is moved and pressed into the diamond abrasive grain bin, so that the uncured photosensitive colloid spots are adhered to single diamond micropowders smaller than 40 mesh, and then dried and cured with hot air, and the diamond abrasive grains are arranged on the paper surface in a directional pattern according to the designed pattern;

[0010] S5: moving the paper with diamond particles obtained in S4 to the upper surface of the blank and pressing it so that the paper remains on the upper surface of the blank;

[0011] S6: hot pressing and sintering the green body obtained in S5 at a temperature of 200-850° C., so that the diamonds formed on the surface of the green body are arranged according to a predetermined pattern rule.

[0012] Wherein, the S6 further includes repeating steps S1-S5 to form a multi-layer stacked green body.

[0013] The multi-layer stacked blanks are welded to the outer peripheral edge of the steel base through a laser welding process.

[0014] Wherein, in S6, the green body is hot-pressed and sintered at 750° C. and 20 MPa for 5 minutes.

[0015] Furthermore, the S5 also includes the step of coating one side of the paper with the diamond particles with adhesive tape.

[0016] Wherein, in S6, the green body is hot-pressed and sintered at 750° C. for 5 minutes.

[0017] The green body is a sheet green body with a thickness of 2 mm pressed from copper-based alloy powder. The sintered green body is brazed to a 45 steel grinding disc substrate at a temperature of 200° C. using a tin-based brazing flux.

[0018] Furthermore, the S5 further includes the step of pressing the paper coated with the adhesive on one side into the copper-based binder powder, and then directly wrapping the paper surface on the outside around the surface of the blank.

[0019] Among them, the method for making the blank is to weigh 100g of thermoplastic resin adhesive and ethanol diluent in a mass ratio of 5:1, mix them thoroughly, and then evenly apply the mixed liquid on the surface of the 50Mn grinding head base; roll the glue-treated grinding head base in copper-based binder powder to form a thin layer of copper-based binder base.

[0020] Furthermore, the S6 further includes bonding and fixing the multi-layer stacked blanks, the fat-based blanks, and the tenon-shaped plastic cards by resin glue, and applying pressure for 3-5 minutes to solidify.

[0021] The implementation of the embodiments of the present invention has the following beneficial effects: Compared with the prior art, the needle fixtures of the prior art inevitably experience wear and tear of the needle inner hole after multiple diamond abrasive adsorption operations, which can easily cause clogging of the needle inner hole and lead to unstable quality. However, the paper plane adhesive solution directly presses the paper plane adhesive into the diamond abrasive bin for adhesion, resulting in high manufacturing efficiency and minimal impact of the fixture on product quality. In addition, the orderly arrangement method implemented by the present invention is not only suitable for the directional arrangement of diamond micropowder (below 30 mesh), but can also be applied to the directional arrangement of coarser diamonds above 40 / 50 mesh, thus having excellent advantages for wide application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the preparation process of the diamond grinding discs arranged in an orderly manner according to a predetermined pattern in Example 1;

[0023] Figure 2 is a front view of the diamond grinding disc in Example 1;

[0024] Figure 3 is a top view of the diamond grinding disc in Example 1;

[0025] Figure 4 is a schematic diagram of the diamond grinding head in Example 2;

[0026] Figure 5 is a schematic diagram of the metal grinding block in Example 3;

[0027] Figure 6 This is a schematic diagram of the diamond saw blade in Example 4. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be described in further detail below with reference to the accompanying drawings.

[0029] Example 1:

[0030] In this embodiment, a diamond grinding disc is manufactured, which includes a grinding disc base 1, diamond abrasive grains 2, a sheet blank 3, and a circular fixing hole 4. A circular fixing hole 4 is set in the center of the grinding disc base 1 of the diamond grinding disc, such as Figure 2 、 3 shown.

[0031] In the production method, Figure 1 The process shown is implemented through the following steps.

[0032] The copper-based alloy powder was pressed into a sheet green body with a thickness of 2 mm.

[0033] A piece of paper with the same shape as the grinding disc is placed on the vacuum negative pressure adsorption mobile platform, and then the paper surface is coated with photosensitive adhesive. Using light curing technology, the paper coated with photosensitive adhesive is exposed according to the designed pattern.

[0034] The vacuum negative pressure adsorption mobile platform with the light-curing paper obtained in step (2) is pressed into a 25-mesh diamond abrasive grain bin under a pressure of 0.12 MPa. The uncured photosensitive colloid is adhered to a single diamond micropowder and dried and cured with hot air to achieve a directional arrangement of the diamond abrasive grains on the paper plane according to a predetermined pattern.

[0035] The diamond side of the paper tape with diamond abrasive grains is coated with adhesive, and the vacuum negative pressure adsorption mobile platform is moved to the upper surface of the blank obtained in step (1) and pressed with a pressure of 0.13 MPa. The negative pressure is removed to form a copper binder bonding layer with diamond abrasive grains 2.

[0036] The green body with the diamond abrasive grains arranged in a directional manner on the surface is hot pressed and sintered at a temperature of 750° C. for 5 minutes, and the paper is burned or carbonized.

[0037] The sintered copper bond blank with directional diamond abrasive grains on the surface is brazed to a 45 steel grinding disc substrate 1 at 200°C using a tin-based brazing flux to obtain a single-layer diamond grinding disc with directional fine diamond abrasive grains on the working surface.

[0038] Example 2:

[0039] In this embodiment, a diamond grinding head is manufactured, which includes a connecting rod 11, a grinding head base 12, an alloy material 13, and diamond abrasive grains 14. The grinding head base 12 of the diamond grinding head is connected to the connecting rod 11 as a whole. Figure 4 shown.

[0040] Implementation is done by following these steps:

[0041] Weigh 100 g of thermoplastic resin adhesive and ethanol diluent in a mass ratio of 5:1, mix thoroughly, and then evenly apply the mixture on the surface of the 50Mn grinding head base 2.

[0042] The grinding head base 12 coated with glue is rolled in copper-based binder powder to form a thin layer of copper-based binder base.

[0043] A rectangular paper that fits the shape of the grinding head is placed on the vacuum negative pressure adsorption mobile platform, and then photosensitive adhesive is applied to the surface of the paper. Using light curing technology, the paper coated with photosensitive adhesive is exposed according to the designed pattern.

[0044] The vacuum negative pressure adsorption mobile platform with the light-curing paper obtained in step (3) is pressed into the 30-mesh diamond abrasive grain bin under a pressure of 0.13 MPa. The uncured photosensitive colloid is adhered to a single diamond micropowder and dried and cured with hot air to achieve a directional arrangement of the diamond abrasive grains on the paper plane according to a predetermined pattern.

[0045] The paper plane on which the diamond abrasives obtained in step (4) are arranged according to a predetermined pattern rule is coated with acrylic oil-based self-adhesive on one side of the paper plane with the diamond abrasives, and is pressed into the copper-based binder powder at a pressure of 0.14 MPa. Then, the paper surface is directly wrapped around the surface of the copper-based binder material 3 base layer with the paper surface outside.

[0046] Place it in a vacuum furnace and sinter it at 800°C for 1 hour. The copper-based binder material 3 will orderly consolidate the diamond abrasive grains 4 on the surface of the 50Mn grinding head substrate 2. The paper will burn or carbonize under high temperature conditions to form a grinding head with diamonds arranged according to a predetermined pattern.

[0047] Example 3:

[0048] In this embodiment, a metal grinding block is made, such as Figure 5 As shown, it includes diamond abrasive grains 21, a metal blank 22, and a plastic card 23.

[0049] The production method is:

[0050] The aluminum-based binder powder was pressed into a sheet green body with a thickness of 2 mm.

[0051] A rectangular paper with the same shape as the grinding block is placed on a vacuum negative pressure adsorption mobile platform, and then the paper surface is coated with photosensitive adhesive. Using light curing technology, the paper coated with photosensitive adhesive is exposed according to the designed pattern, so that the positions that retain adhesiveness after exposure are staggered.

[0052] The vacuum negative pressure adsorption mobile platform with the light-curing paper obtained in step (2) is pressed into the 25-mesh diamond abrasive grain bin under a pressure of 0.15 MPa. The uncured photosensitive colloid is adhered to a single diamond micropowder and dried and cured with hot air to achieve the directional arrangement of the diamond abrasive grains on the paper plane according to the predetermined pattern.

[0053] The diamond side of the paper tape with diamond abrasives obtained in step (3) is coated with adhesive, and a vacuum negative pressure adsorption mobile platform is moved to the upper surface of the aluminum-based blank obtained in step (1) and pressed with a pressure of 0.15 MPa. The negative pressure is removed to form an aluminum-based binder bonding layer with diamond abrasives 21.

[0054] Repeat steps 1 to 4, and hot press and sinter the single-layer blank with multiple diamond abrasives arranged in a directional and staggered manner on the surface and the connecting steel plate at 20 MPa and 650°C for 10 minutes. The paper is burned or carbonized at high temperature under hot pressing conditions to obtain a multi-layer aluminum-based blank with directional diamond abrasives.

[0055] The sintered multi-layer aluminum-based blank with directional diamond abrasive grains is assembled with a plastic holder 23 and a rubber pad using screws to obtain a multi-layer aluminum-based grinding block with regularly arranged fine diamond abrasive grains. After sharpening, the diamonds are evenly spaced vertically and horizontally, and the diamond abrasive grains are staggered and arranged in an orderly manner. When the side of the grinding block is used to polish the surface of semiconductor and electronic ceramic plates, when the diamond abrasive grains in the upper layer are completely consumed, the diamond abrasive grains in the lower layer are exposed, ensuring grinding efficiency. The regularly arranged diamond abrasive grains ensure a long service life, high processing efficiency, and high polishing quality of the aluminum-based grinding block.

[0056] Example 4:

[0057] like Figure 5 As shown, the method of this embodiment is used to manufacture a diamond saw blade, which includes a base 31 and a cutter head 32 . The cutter head 32 is composed of regularly arranged diamonds 33 and a sheet blank 34 .

[0058] The production method is:

[0059] The copper binder powder was pressed into a sheet body with a thickness of 0.8 mm.

[0060] A rectangular paper with the same shape as the cutter head is placed on the vacuum negative pressure adsorption mobile platform, and then the paper surface is coated with photosensitive adhesive. Using light curing technology, the paper coated with photosensitive adhesive is exposed according to the designed pattern.

[0061] The vacuum negative pressure adsorption mobile platform with the light-curing paper obtained in step (2) is pressed into the 40-mesh diamond abrasive grain bin under a pressure of 0.14 MPa. The uncured photosensitive colloid is adhered to a single diamond micropowder and dried and cured with hot air to achieve the directional arrangement of the diamond abrasive grains on the paper plane according to the predetermined pattern.

[0062] The vacuum negative pressure adsorption mobile platform of the paper with diamond abrasive grains is moved to the upper surface of the blank obtained in step (1) and pressed with a pressure of 0.14 MPa, and the negative pressure is removed to form a copper binder bonding layer with diamond abrasive grains 3.

[0063] Repeat steps 1 to 4, and hot press sinter the single-layer green body with multiple diamond particles arranged in a directional manner on the surface at 750° C. and 20 MPa for 5 minutes. The paper is burned or carbonized at high temperature under the hot pressing conditions to obtain a multi-layer green body 4 with directional diamond particles.

[0064] The diamond saw blade is produced by laser welding a multi-layered blank 4 containing regularly arranged sintered diamond abrasive grains to the outer edge of a steel substrate 1. When the upper layer of diamond abrasive grains is completely worn out, the staggered diamond abrasive grains in the lower layer are exposed. This ensures that as each layer of diamond abrasive grains is completely worn out, the next layer of diamond abrasive grains is immediately ready for use, ensuring efficient processing.

[0065] Example 5:

[0066] The method of this embodiment is used to make a resin grinding block, the appearance of which is similar to Figure 5 Consistent, including diamond abrasives, resin blanks, and plastic cards.

[0067] The production method is:

[0068] The resin-based binder powder is pressed into a sheet green body with a thickness of 2 mm.

[0069] A rectangular paper with the same shape as the grinding block is placed on a vacuum negative pressure adsorption mobile platform, and then the paper surface is coated with photosensitive adhesive. Using light curing technology, the paper coated with photosensitive adhesive is exposed according to the designed pattern, so that the positions that retain adhesiveness after exposure are staggered.

[0070] The vacuum negative pressure adsorption mobile platform with the light-curing paper obtained in step (2) is pressed into the 20-mesh diamond abrasive grain bin under a pressure of 0.16 MPa. The uncured photosensitive colloid is adhered to a single diamond micropowder and dried and cured with hot air to achieve directional arrangement of the diamond abrasive grains on the paper plane according to a predetermined pattern.

[0071] The diamond side of the paper tape with diamond abrasives obtained in step (3) is coated with adhesive, and a vacuum negative pressure adsorption mobile platform is moved to the upper surface of the resin-based blank obtained in step (1) and pressed with a pressure of 0.16 MPa. The negative pressure is removed to form a resin bond layer with diamond abrasives 1.

[0072] Repeat steps 1 to 4, and hot press sinter the single-layer green body with multiple diamond abrasive grains arranged in a directional and staggered manner on the surface at 5 MPa and 200°C for 15 minutes. The paper is burned or carbonized at high temperature under hot pressing conditions to obtain a multi-layer resin-based green body with directional diamond abrasive grains.

[0073] The sintered multi-layer resin-based blank with directional diamond abrasive grains on its surface is bonded to a tenon-shaped plastic card 3 using resin glue. The blank is then placed on dedicated equipment and pressure is applied for 3-5 minutes. After the glue cures, a multi-layer resin-based grinding block with regularly arranged fine diamond abrasive grains is obtained. After sharpening, the diamonds are evenly spaced vertically and horizontally, and the diamond abrasive grains are staggered and arranged in an orderly manner. When the side of the grinding block is used for polishing the surface of semiconductor and electronic ceramic plates, when the diamond abrasive grains in the upper layer are completely consumed, the diamond abrasive grains in the lower layer will be exposed, ensuring grinding efficiency. The regularly arranged diamond abrasive grains ensure a long service life, high processing efficiency, and high polishing quality for the resin-based grinding block.

[0074] The above disclosure is only a preferred embodiment of the present invention and certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A method for forming an orderly arrangement of diamond abrasive grains, characterized in that: The following steps are involved: S1: prefabricated blank with target thickness; S2: Place a piece of paper of a set shape on the adsorption moving platform and apply photosensitive adhesive on its surface; S3: light-curing the obtained paper according to the designed arrangement pattern, wherein the size of the designed unexposed points is no larger than a single diamond particle; S4: The paper obtained in S3 is moved and pressed into the diamond abrasive grain bin, so that the uncured photosensitive colloid spots are adhered to single diamond micropowders smaller than 40 mesh, and then dried and cured with hot air, and the diamond abrasive grains are arranged on the paper surface in a directional pattern according to the designed pattern; S5: moving the paper with diamond particles obtained in S4 to the upper surface of the blank and pressing it so that the paper remains on the upper surface of the blank; S6: hot pressing and sintering the green body obtained in S5 at a temperature of 200-850° C., so that the diamonds formed on the surface of the green body are arranged according to a predetermined pattern rule, and the paper is burned or carbonized at a high temperature under the hot pressing condition.

2. The method for forming an orderly arrangement of diamond abrasive grains according to claim 1, wherein: The S6 further includes repeating steps S1 to S5 to form a multi-layer stacked green body.

3. The method for forming an orderly arrangement of diamond abrasive grains according to claim 2, wherein: The multi-layer stacked blanks are welded to the outer peripheral edge of the steel base body by a laser welding process.

4. The method for forming an orderly arrangement of diamond abrasive grains according to claim 3, wherein: In the S6, the green body is hot-pressed and sintered at 750° C. and 20 MPa for 5 minutes.

5. The method for forming an orderly arrangement of diamond abrasive grains according to claim 2, wherein: The step S5 further includes applying adhesive tape to one side of the paper having the diamond particles adhered thereto.

6. The method for forming an orderly arrangement of diamond abrasive grains according to claim 5, wherein: In the S6, the green body is hot-pressed and sintered at 750° C. for 5 minutes.

7. The method for forming an orderly arrangement of diamond abrasive grains according to claim 6, wherein: The green body is a sheet green body with a thickness of 2 mm pressed from copper-based alloy powder. The sintered green body is brazed to a 45 steel grinding disc substrate at a temperature of 200° C. using a tin-based brazing flux.

8. The method for forming an orderly arrangement of diamond abrasive grains according to claim 5, wherein: The S5 further includes the step of pressing the paper coated with the self-adhesive surface into the copper-based binder powder, and then directly wrapping the paper surface on the outside of the blank.

9. The method for forming an orderly arrangement of diamond abrasive grains according to claim 8, wherein: The blank manufacturing method comprises the following steps: weighing 100 g of a thermoplastic resin adhesive and an ethanol diluent in a mass ratio of 5:1, thoroughly mixing the mixture, and evenly coating the surface of a 50Mn grinding head substrate; and rolling the glue-coated grinding head substrate in copper-based binder powder to form a thin layer of copper-based binder base.

10. The method for forming an orderly arrangement of diamond abrasive grains according to claim 5, wherein: The S6 further includes bonding and fixing the multi-layer stacked blank, the fat-based blank, and the tenon-shaped plastic card by resin glue, and applying pressure for 3-5 minutes to solidify.

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