Die-cutting process for layered film materials and dust screen production line

Abstract

The present invention discloses a die-cutting process for layered film materials and a dust-proof net production line. In step (8), after the first material strip and the third material strip are compounded to form a fourth material strip, the fourth material strip is composed of a first face paper, a first back adhesive, a release film, a first low-viscosity film, a screen, a second back adhesive, foam, and a second low-viscosity film from top to bottom. When the first material strip and the third material strip are bonded together, the first low-viscosity film of the first material strip and the screen of the third material strip are in contact and will not be directly bonded together, which facilitates positioning and alignment. Through the die-cutting process for layered film materials of the present invention, the first material strip and the third material strip are not directly bonded together, but are punched to allow the first face paper and the first back adhesive to pass through the contoured hole so that the first back adhesive is bonded to the screen. Before punching, the relative positions of the first material strip and the third material strip can be easily adjusted to ensure the alignment accuracy between the sheet layer of the layered film material and the first frame layer and the second frame layer, thereby improving the production yield of the layered film material.

Description

Technical Field

[0001] The invention relates to the field of die-cutting, and in particular to a die-cutting process for layered film materials. Background Art

[0002] Die-cut products are widely used in the automotive and electronics industries, particularly in the electronics industry, where layered film materials are ubiquitous. Insulation materials, shock-absorbing materials, heat-resistant insulation materials, adhesive products, dust-proof materials, shielding materials, and more all require die-cutting technology for manufacturing. The layered film material includes a whole sheet layer and a hollow frame layer. The sheet layer is arranged between the frame layers. Taking the dustproof net of a mobile phone speaker as an example, the sheet layer is a wire mesh, and the frame layer includes a first adhesive, foam and a second adhesive. The dustproof net of the mobile phone speaker is compounded by the first adhesive, wire mesh, second adhesive and foam in sequence. Because there is a layer of wire mesh in the middle of the dustproof net, and both sides of the wire mesh are hollow frame layers, the frame layers on both sides of the wire mesh need to be punched separately first, and then the wire mesh is compounded with the frame layer on one side after punching, and then the frame layer compounded with the wire mesh is bonded to the frame layer on the other side. The traditional process uses manual alignment and bonding. During bonding, the alignment accuracy is difficult to guarantee, and the adhesive of the frame layer on one side is completely exposed, resulting in that after the wire mesh and the adhesive are adhered, it is difficult to separate and adjust the bonding position again. If the bonding position is offset at the beginning, the subsequent offset will become larger and larger, resulting in low product yield. At the same time, the manual efficiency is low, automation cannot be achieved, and it is difficult to meet the needs of fast production. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a die-cutting process for layered film materials, which enables the frame-like layer with a composite wire mesh to be laminated to the frame-like layer on the other side without directly laminating. After die-cutting, the frame-like layer on the other side passes through a contoured hole and is laminated to the frame-like layer with a composite wire mesh, thereby ensuring lamination accuracy.

[0004] The present invention also provides a dust screen production line having the above-mentioned layered film material die-cutting process.

[0005] According to the first aspect of the present invention, a die-cutting process for a layered film material is used to produce a layered film material. The layered film material includes a whole sheet layer and a first frame layer and a second frame layer. The sheet layer is arranged between the first frame layer and the second frame layer. The sheet layer is a wire mesh. The first frame layer includes a first adhesive, and the second frame layer includes foam and a second adhesive. The layered film material is the first adhesive, the wire mesh, the second adhesive, and the foam that are sequentially composited. The process includes the following steps:

[0006] (1) a composite release film and a first low-viscosity film;

[0007] (2) punching the release film and the first low-viscosity film, cutting the release film and the first low-viscosity film to form a contour hole and a first positioning hole, wherein the contour hole is larger than the outline of the layered film material;

[0008] (3) compounding a first adhesive backing onto an end of the release film facing away from the first low-viscosity film to form a first material strip, wherein an end of the first adhesive backing facing away from the release film is compounded with a first surface paper;

[0009] (4) punching the second low-viscosity membrane to cut the second low-viscosity membrane to form a second positioning hole;

[0010] (5) compounding a second adhesive backing, foam, and the second low-viscosity film in sequence to form a second material strip, wherein the end of the second adhesive backing facing away from the foam is compounded with a second face paper;

[0011] (6) Punching the first material strip and the second material strip, punching in from one side of the first surface paper, cutting the first surface paper and the first adhesive backing to form the first inner hole, punching in from one side of the second surface paper, leaving the second low-viscosity film uncut, cutting the second surface paper, the second adhesive backing, and the foam to form the second inner hole;

[0012] (7) removing the second paper and laminating the screen to the end of the second adhesive facing away from the foam to form a third material strip;

[0013] (8) Compounding the first material strip and the third material strip to form a fourth material strip, wherein during compounding, the positioning posts of the mold pass through the first positioning holes and the second positioning holes respectively, and the first low-viscosity film is compounded on the end of the screen away from the second adhesive backing;

[0014] (9) Punching the fourth strip of material from one side of the first surface paper, leaving the second low-viscosity film uncut and cutting the rest completely to cut out the outer shape of the layered film material;

[0015] (10) The outer frame waste formed by the foam, the second adhesive, the screen, the first low-viscosity film, the release film, the first adhesive, and the first surface paper in step (9) is discharged, and the outer frame waste is separated from the layered film material and the second low-viscosity film by the fourth material belt through a scraper, and the separated outer frame waste is rolled up;

[0016] (11) removing the first side paper and laminating the delivery tape to the end of the first adhesive facing away from the screen;

[0017] (12) The second low-viscosity film is removed, and the first adhesive, the screen, the second adhesive and the foam remain on the shipping material belt.

[0018] According to the die-cutting process of the layered film material of the embodiment of the present invention, there are at least the following beneficial effects: in step (8), after the first material strip and the third material strip are compounded to form the fourth material strip, the fourth material strip is composed of the first surface paper, the first back glue, the release film, the first low-viscosity film, the screen, the second back glue, the foam and the second low-viscosity film from top to bottom. The first material strip and the third material strip are positioned by the first positioning hole and the second positioning hole so that the first inner hole and the second inner hole are aligned. When the first material strip and the third material strip are attached, the first low-viscosity film of the first material strip and the screen of the third material strip are in contact and will not be directly bonded together, which facilitates positioning and alignment. In step (9), when punching out the fourth material strip, punch in from one side of the first surface paper to punch out the product shape. The punched-out first surface paper and the first back glue pass through the contoured hole so that the first back glue is attached to the screen, thereby obtaining a layered film material in which the first back glue, the screen, the second back glue and the foam are compounded in sequence. It can be understood that, through the die-cutting process of the layered film material of the present invention, the first material strip and the third material strip are not directly bonded together, but the first surface paper and the first adhesive backing are passed through the contoured hole by punching so that the first adhesive backing is bonded to the screen. Therefore, before punching, the relative positions of the first material strip and the third material strip can be easily adjusted to ensure accurate alignment, thereby ensuring the alignment accuracy between the sheet layer of the layered film material and the first frame layer and the second frame layer, thereby improving the production yield of the layered film material.

[0019] According to some embodiments of the present invention, the first low-viscosity film and the second low-viscosity film are two parts of the same low-viscosity film, the first positioning hole and the second positioning hole are cut out simultaneously in the same punching, and the first low-viscosity film and the second low-viscosity film are cut and separated before compounding the first material strip and the third material strip.

[0020] According to some embodiments of the present invention, the die-cutting die for punching the fourth material strip is also provided with a mold pad, the size of the mold pad is smaller than the size of the product contour, so that when punching the fourth material strip, the mold pad can pass through the contoured hole to stick the first adhesive to the screen tightly.

[0021] According to some embodiments of the present invention, the following step is further included: after laminating the shipping tape to the first adhesive, punching the shipping tape so that the shipping tape meets the precision requirement.

[0022] The dustproof net production line according to the second embodiment of the present invention includes the layered film material die-cutting process according to the first embodiment of the present invention.

[0023] The dustproof net production line according to the embodiment of the present invention has at least the following beneficial effects: including all the beneficial effects of the layered film material die-cutting process of the above-mentioned first embodiment, which will not be repeated here.

[0024] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0026] Figure 1 A schematic diagram of a layered film material in a die-cutting process of a layered film material according to an embodiment of the first aspect of the present invention;

[0027] Figure 2 Schematic diagram of step (1) of the die-cutting process of a layered film material according to the first embodiment of the present invention;

[0028] Figure 3 Schematic diagram of step (2) and step (4) of the die-cutting process of the layered film material according to the first embodiment of the present invention;

[0029] Figure 4 Schematic diagram of step (3) of the die-cutting process of the layered film material according to the first embodiment of the present invention;

[0030] Figure 5 Schematic diagram of step (5) of the die-cutting process of the layered film material according to the first embodiment of the present invention;

[0031] Figure 6 Schematic diagram of step (6) of the die-cutting process of the layered film material according to the first embodiment of the present invention;

[0032] Figure 7 Schematic diagram of step (7) of the die-cutting process of the layered film material according to the first embodiment of the present invention;

[0033] Figure 8 Schematic diagram of step (8) of the die-cutting process of the layered film material according to the first embodiment of the present invention;

[0034] Figure 9 Schematic diagram of step (9) of the die-cutting process for a layered film material according to the first embodiment of the present invention;

[0035] Figure 10 Schematic diagram of step (10) of the die-cutting process of a layered film material according to the first embodiment of the present invention;

[0036] Figure 11 Schematic diagram of step (11) of the die-cutting process of a layered film material according to the first embodiment of the present invention;

[0037] Figure 12This is a schematic diagram of step (12) of the die-cutting process for a layered film material according to the first embodiment of the present invention.

[0038] Reference numerals:

[0039] First low-viscosity film 110, release film 120, first adhesive 130, first face paper 131, first positioning hole 111, second positioning hole 112, contour hole 113;

[0040] Second low-viscosity film 210, foam 220, second adhesive 230, second face paper 231, first inner hole 114, second inner hole 115, screen 240;

[0041] Shipping material strip 310. DETAILED DESCRIPTION

[0042] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0043] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0044] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0045] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0046] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0047] The die-cutting process for a layered film material according to the first embodiment of the present invention is used to produce a layered film material, referring to Figure 1 The layered film material includes a whole sheet layer and a first frame layer and a second frame layer. The sheet layer is arranged between the first frame layer and the second frame layer. The sheet layer is a wire mesh 240. The first frame layer includes a first adhesive 130. The second frame layer includes a foam 220 and a second adhesive 230. The layered film material is a first adhesive 130, a wire mesh 240, a second adhesive 230 and a foam 220 that are compounded in sequence. Figures 2 to 12 The die-cutting process of the layered film material of the present application comprises the following steps:

[0048] (1) a composite release film 120 and a first low-viscosity film 110;

[0049] (2) punching the release film 120 and the first low-viscosity film 110, cutting the release film 120 and the first low-viscosity film 110 to form a contour hole 113 and a first positioning hole 111, wherein the size of the contour hole 113 is larger than the size of the outline of the layered film material;

[0050] (3) Compounding the first adhesive 130 with the end of the release film 120 facing away from the first low-viscosity film 110 to form a first material strip, and compounding the end of the first adhesive 130 facing away from the release film 120 with the first surface paper 131;

[0051] (4) Punching the second low-viscosity film 210 to form a second positioning hole 112;

[0052] (5) Compounding the second adhesive 230, the foam 220, and the second low-viscosity film 210 in sequence to form a second material strip, wherein the end of the second adhesive 230 facing away from the foam 220 is compounded with a second face paper 231;

[0053] (6) Punching the first and second material strips, punching in from one side of the first paper 131, cutting the first paper 131 and the first adhesive 130 to form the first inner hole 114, punching in from one side of the second paper 231, leaving the second low-viscosity film 210 uncut, cutting the second paper 231, the second adhesive 230, and the foam 220 to form the second inner hole 115;

[0054] (7) Remove the second paper 231 and laminate the screen 240 to the end of the second adhesive 230 facing away from the foam 220 to form a third material strip;

[0055] (8) The first material strip and the third material strip are combined to form a fourth material strip. During the combination, the positioning posts of the mold pass through the first positioning hole 111 and the second positioning hole 112 respectively, and the first low-viscosity film 110 is combined with the end of the screen 240 away from the second adhesive 230;

[0056] (9) Punching the fourth strip of material from one side of the first paper 131, leaving the second low-viscosity film 210 uncut and cutting the rest completely to cut out the outer shape of the layered film material;

[0057] (10) The outer frame waste formed by the foam, the second adhesive, the screen, the first low-viscosity film, the release film, the first adhesive and the first surface paper in step (9) is discharged, and the outer frame waste is separated from the layered film material and the second low-viscosity film by a fourth material belt through a scraper, and the separated outer frame waste is rolled up;

[0058] (11) Remove the first paper 131 and laminate the delivery tape 310 to the end of the first adhesive 130 facing away from the screen 240;

[0059] (12) The second low-viscosity film 210 is removed, and the first adhesive 130, the screen 240, the second adhesive 230 and the foam 220 remain on the shipping tape 310.

[0060] According to the die-cutting process of the layered film material of the embodiment of the present invention, refer to Figure 7 and Figure 8 In step (8), after the first material strip and the third material strip are compounded to form the fourth material strip, the fourth material strip is composed of the first surface paper 131, the first adhesive 130, the release film 120, the first low-viscosity film 110, the screen 240, the second adhesive 230, the foam 220 and the second low-viscosity film 210 from top to bottom. The first material strip and the third material strip are positioned through the first positioning hole 111 and the second positioning hole 112, so that the first inner hole 114 and the second inner hole 115 are aligned. When the first material strip and the third material strip are attached, the first low-viscosity film 110 of the first material strip and the screen 240 of the third material strip are in contact and will not be directly bonded together, which is convenient for positioning and alignment. Figure 8 and Figure 9In step (9), when punching the fourth material strip, punching is performed from one side of the first paper 131 to punch out the product shape. The punched first paper 131 and the first adhesive 130 pass through the profiling hole 113 so that the first adhesive 130 is bonded to the screen 240, thereby obtaining a layered film material in which the first adhesive 130, the screen 240, the second adhesive 230 and the foam 220 are compounded in sequence. It can be understood that, through the die-cutting process of the layered film material of the present invention, the first material strip and the third material strip are not directly bonded, but are punched so that the first paper 131 and the first adhesive 130 pass through the profiling hole 113 so that the first adhesive 130 is bonded to the screen 240. Therefore, before punching, the relative position of the first material strip and the third material strip can be easily adjusted to ensure accurate alignment, thereby ensuring the alignment accuracy between the sheet layer of the layered film material and the first frame layer and the second frame layer, thereby improving the production yield of the layered film material.

[0061] According to the die-cutting process of the layered film material of the first embodiment of the present invention, Figure 7 The first low-viscosity film 110 and the second low-viscosity film 210 are two parts of the same low-viscosity film. The first positioning hole 111 and the second positioning hole 112 are cut out at the same time during the same punching. Before compounding the first material strip and the third material strip, the first low-viscosity film 110 and the second low-viscosity film 210 are cut and separated.

[0062] It can be understood that by setting the first low-viscosity film 110 and the second low-viscosity film 210 as two parts of the same low-viscosity film, the first positioning hole 111 and the second positioning hole 112 can be punched out simultaneously in the sequential punching, thereby improving efficiency. At the same time, punching can ensure the position accuracy of the first positioning hole 111 and the second positioning hole 112, and improve the alignment accuracy of the first material strip and the third material strip in step (8). It should be noted that before compounding the first material strip and the third material strip, the first low-viscosity film 110 and the second low-viscosity film 210 need to be cut and separated first.

[0063] According to the die-cutting process of the layered film material of the first aspect of the present invention, the die-cutting die for punching the fourth material strip is also provided with a die pad. The size of the die pad is smaller than the size of the product contour, so that when punching the fourth material strip, the die pad can pass through the contoured hole 113 to stick the first adhesive 130 to the screen 240 tightly.

[0064] It can be understood that when punching the fourth material strip, the mold pad can be against the side of the first paper 131 away from the first adhesive 130. After the die-cutting mold cuts off the first paper 131 and the first adhesive 130, it moves with the die-cutting mold and presses the first adhesive 130 onto the screen 240 through the contoured hole 113.

[0065] According to the die-cutting process of the layered film material of the first embodiment of the present invention, the following steps are also included: after compounding the delivery tape 310 with the first adhesive 130, punching out the delivery tape 310 so that the delivery tape 310 meets the precision requirements.

[0066] It is understandable that the shipping tape 310 is used to carry products and has certain precision requirements. The directly compounded shipping tape 310 has low precision due to problems such as inaccurate positioning. In order to meet the specified precision requirements, the width of the compounded shipping tape 310 in step (10) is greater than the required width, and then the shipping tape 310 is punched to ensure that the shipping tape reaches the required width and precision.

[0067] The dustproof net production line according to the second embodiment of the present invention includes the layered film material die-cutting process according to the first embodiment of the present invention.

[0068] The dustproof net production line according to the embodiment of the present invention includes all the beneficial effects of the layered film material die-cutting process of the above-mentioned first embodiment, which will not be repeated here.

[0069] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. A die-cutting process for a layered film material, for producing a layered film material, wherein the layered film material comprises a whole sheet layer and a first frame layer and a second frame layer, wherein the sheet layer is disposed between the first frame layer and the second frame layer, wherein the sheet layer is a screen, wherein the first frame layer comprises a first adhesive, and the second frame layer comprises foam and a second adhesive, wherein the layered film material is a sequentially composite first adhesive, screen, second adhesive, and foam, characterized in that: The following steps are involved: (1) a composite release film and a first low-viscosity film; (2) punching the release film and the first low-viscosity film, cutting the release film and the first low-viscosity film to form a contour hole and a first positioning hole, wherein the contour hole is larger than the outline of the layered film material; (3) compounding a first adhesive backing onto an end of the release film facing away from the first low-viscosity film to form a first material strip, wherein an end of the first adhesive backing facing away from the release film is compounded with a first surface paper; (4) punching the second low-viscosity membrane to cut the second low-viscosity membrane to form a second positioning hole; (5) compounding a second adhesive backing, foam, and the second low-viscosity film in sequence to form a second material strip, wherein the end of the second adhesive backing facing away from the foam is compounded with a second face paper; (6) Punching the first material strip and the second material strip, punching in from one side of the first surface paper, cutting the first surface paper and the first adhesive backing to form a first inner hole, punching in from one side of the second surface paper, leaving the second low-viscosity film uncut, cutting the second surface paper, the second adhesive backing, and the foam to form a second inner hole; (7) removing the second paper and laminating the screen to the end of the second adhesive facing away from the foam to form a third material strip; (8) Compounding the first material strip and the third material strip to form a fourth material strip, wherein during compounding, the positioning posts of the mold pass through the first positioning holes and the second positioning holes respectively, and the first low-viscosity film is compounded on the end of the screen away from the second adhesive backing; (9) Punching the fourth strip of material from one side of the first surface paper, leaving the second low-viscosity film uncut and cutting the rest completely to cut out the outer shape of the layered film material; (10) The outer frame waste formed by the foam, the second adhesive, the screen, the first low-viscosity film, the release film, the first adhesive, and the first surface paper in step (9) is discharged, and the outer frame waste is separated from the layered film material and the second low-viscosity film by the fourth material belt through a scraper, and the separated outer frame waste is rolled up; (11) removing the first side paper and laminating the delivery tape to the end of the first adhesive facing away from the screen; (12) The second low-viscosity film is removed, and the first adhesive, the screen, the second adhesive and the foam remain on the shipping material belt.

2. The die-cutting process for layered film materials according to claim 1, characterized in that: The first low-viscosity film and the second low-viscosity film are two parts of the same low-viscosity film. The first positioning hole and the second positioning hole are cut out simultaneously in the same punching. Before compounding the first material strip and the third material strip, the first low-viscosity film and the second low-viscosity film are cut and separated.

3. The die-cutting process for layered film materials according to claim 1, characterized in that: The die-cutting die for punching the fourth material strip is also provided with a die pad, the size of which is smaller than the size of the product outline, so that when punching the fourth material strip, the die pad can pass through the contoured hole to stick the first adhesive to the screen tightly.

4. The die-cutting process for layered film materials according to claim 1, characterized in that: The method further includes the following steps: after compounding the shipping tape with the first adhesive, punching out the shipping tape so that the shipping tape meets the precision requirement.

5. Dustproof net production line, characterized in that, The die-cutting process of the layered film material according to any one of claims 1 to 4 can be realized.

Images