Pump cover assembly and its PVD vacuum equipment

Abstract

The present invention relates to the field of PVD technology, and provides a pump cover assembly and a PVD vacuum device thereof. The pump cover assembly comprises: a pump cover body, the pump cover body comprises: a first bottom plate, the first bottom plate is suitable for sealing with a reaction chamber; a refrigeration device, the refrigeration device is fixed on the first bottom plate, and is used to cool the inside of the reaction chamber; a heating device, the heating device is fixed on the first bottom plate, and is used to heat the workpiece inside the reaction chamber. The present invention integrates and fixes the refrigeration device and the heating device under the first bottom plate of the pump cover body, so that the refrigeration device and the heating device can be removed together with the pump cover body, thereby improving the integration of the equipment, occupying less space, improving the space utilization, and reserving a large amount of space for installing other structures in the reaction chamber; when it is necessary to clean or maintain the heating device and / or the refrigeration device, the pump cover assembly can be directly removed from the reaction chamber to clean or maintain the heating device and / or the refrigeration device.

Description

Technical Field

[0001] The invention relates to the field of PVD technology, and in particular to a pump cover assembly and a PVD vacuum device thereof. Background Art

[0002] PVD (Chinese meaning: physical vapor deposition; English full name: Physical Vapor Deposition; English abbreviation: PVD) technology refers to the use of low voltage and high current arc discharge technology under vacuum conditions, using gas discharge to evaporate the target material and ionize both the evaporated substance and the gas, and using the acceleration of the electric field to deposit the evaporated substance and its reaction products on the workpiece. At present, in PVD production equipment, the reaction chamber is generally sealed with a cover plate so that the inside of the reaction chamber is in a vacuum environment, and a molecular pump is installed on the cover plate (referred to as the pump cover) to make the reaction chamber reach a high vacuum. The pump cover is usually a square cover plate structure that can be hoisted, in which the bottom plate has a sealing structure; the pump cover is sealed with the reaction chamber through a sealing structure to isolate the external environment to form a closed cavity; at the same time, the interior of the reaction chamber is evacuated by the fore-stage pump and the molecular pump to achieve the required vacuum degree.

[0003] In the PVD equipment in the prior art, a heater is usually required to increase the temperature in the reaction chamber to remove excess moisture inside. The heater is mostly arranged inside the reaction chamber, which brings great inconvenience to the cleaning and subsequent maintenance of the heater; and the water cooling equipment is mostly welded inside the reaction chamber or on the pump cover, and the cooling effect is poor; and the above-mentioned PVD equipment has the defects of low equipment integration, large occupied space and low space utilization. Summary of the invention

[0004] The invention provides a pump cover assembly and a PVD vacuum device thereof, which are used to solve the defects of the PVD device in the prior art, namely, inconvenience in cleaning or maintenance, low device integration and low space utilization.

[0005] The present invention provides a pump cover assembly, comprising:

[0006] A pump cover body, the pump cover body comprising: a first bottom plate, the first bottom plate being adapted to seal with the reaction chamber;

[0007] A refrigeration device, the refrigeration device is fixed to the first bottom plate and is used to cool the interior of the reaction chamber;

[0008] A heating device is fixed to the first bottom plate and is used to heat the workpiece inside the reaction chamber.

[0009] According to a pump cover assembly provided by the present invention, the heating device comprises:

[0010] a first heating unit, wherein the first heating unit is fixed below the first bottom plate;

[0011] The second heating unit is fixed below the first bottom plate and arranged opposite to the first heating unit. A channel is provided between the first heating unit and the second heating unit so that the workpiece passes through the channel and the upper surface and the lower surface of the workpiece are heated by the first heating unit and the second heating unit.

[0012] According to a pump cover assembly provided by the present invention, the refrigeration device comprises:

[0013] A first refrigeration unit is fixed on a side of the first heating unit away from the channel.

[0014] According to a pump cover assembly provided by the present invention, the refrigeration device further includes:

[0015] A second refrigeration unit is fixed on a side of the second heating unit away from the channel.

[0016] A pump cover assembly provided by the present invention further includes:

[0017] A first connecting member, wherein the first heating unit is fixed to the first bottom plate through the first connecting member.

[0018] A pump cover assembly provided by the present invention further includes:

[0019] Second base plate;

[0020] A second connecting member, the second bottom plate is fixed to the first bottom plate through the second connecting member, and the second heating unit is fixed on the second bottom plate.

[0021] According to a pump cover assembly provided by the present invention, a first interface, a second interface and a third interface are provided on the first bottom plate; wherein,

[0022] The first interface is suitable for connecting to the refrigeration device through a pipeline;

[0023] The second interface is suitable for connecting to the heating device through a line;

[0024] The third interface is suitable for installing a vacuum extraction device.

[0025] According to a pump cover assembly provided by the present invention, the pump cover body further comprises:

[0026] A pump cover box, wherein the interior of the pump cover box is used to place a vacuum pumping device;

[0027] A lifting lug is arranged on the top of the pump cover box.

[0028] According to a pump cover assembly provided by the present invention, the refrigeration device includes a water-cooled plate structure;

[0029] The heating device comprises a heating plate structure.

[0030] The present invention also provides a PVD vacuum device, comprising:

[0031] A reaction chamber, wherein the top of the reaction chamber is opened;

[0032] In the pump cover assembly in the above embodiment of the present invention, the first bottom plate of the pump cover assembly can be sealed and matched with the opening.

[0033] A pump cover assembly provided by the present invention can be removed together with the pump cover body by fixing a refrigeration device and a heating device under the first bottom plate of the pump cover body; when the reaction is completed, when the heating device and / or the refrigeration device needs to be cleaned or maintained, the pump cover assembly can be directly removed from the reaction chamber to clean or maintain the heating device and / or the refrigeration device; in addition, since the refrigeration device and the heating device are integrated on the pump cover body, the equipment integration is improved, the space occupied is small, the space utilization is improved, and a large amount of space can be reserved for installing other structures in the reaction chamber.

[0034] Furthermore, the present invention also provides a PVD vacuum equipment, which has the same advantages as above because it includes the pump cover assembly in the above embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 It is a structural schematic diagram of the pump cover assembly provided by the present invention;

[0037] Figure 2 It is a structural schematic diagram of the first base plate provided by the present invention.

[0038] Reference numerals:

[0039] 100: pump cover body; 101: first bottom plate; 102: pump cover box; 103: lifting ear; 104: first interface; 105: second interface; 106: third interface; 200: refrigeration device; 201: first refrigeration unit; 202: second refrigeration unit; 300: heating device; 301: first heating unit; 302: second heating unit; 303: channel; 401: first connecting piece; 402: second bottom plate; 403: second connecting piece. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Combine the following Figure 1 to Figure 2 A pump cover assembly of the present invention is described. The pump cover assembly comprises: a pump cover body 100, a refrigeration device 200 and a heating device 300; wherein the refrigeration device 200 and the heating device 300 are integrally mounted on the pump cover body 100 to form an integrated pump cover assembly.

[0042] Specifically, the pump cover body 100 includes: a first bottom plate 101, which is suitable for sealing with the reaction chamber; a refrigeration device 200 fixed to the first bottom plate 101, used to cool the inside of the reaction chamber; a heating device 300 fixed to the first bottom plate 101, used to heat the workpiece inside the reaction chamber.

[0043] In this embodiment, by fixing the refrigeration device 200 and the heating device 300 below the first bottom plate 101 of the pump cover body 100, when the first bottom plate 101 is sealed with the reaction chamber, the reaction chamber forms a sealed cavity, so as to provide the vacuum environment required for the reaction for the PVD vacuum equipment; the heating device 300 can heat the surface of the workpiece, and the refrigeration device 200 can cool down the internal environment of the reaction chamber to avoid overheating of the reaction chamber. When the reaction is completed, if the heating device 300 and / or the refrigeration device 200 need to be cleaned or maintained, the vacuum inside the reaction chamber can be broken first, and then the pump cover assembly can be hoisted and removed from the reaction chamber to clean or maintain the heating device 300 and / or the refrigeration device 200 or the inside of the reaction chamber; in addition, since the refrigeration device 200 and the heating device 300 are integrated on the pump cover body 100, it also has the advantages of high equipment integration, small space occupation, and more space reserved for other structures of the reaction chamber.

[0044] A pump cover assembly provided by the present invention can be removed together with the pump cover body 100 by fixing the refrigeration device 200 and the heating device 300 under the first bottom plate 101 of the pump cover body 100; when the reaction is completed, when it is necessary to clean or maintain the heating device 300 and / or the refrigeration device 200, the pump cover assembly can be directly removed from the reaction chamber to clean or maintain the heating device 300 and / or the refrigeration device 200; in addition, since the refrigeration device 200 and the heating device 300 are integrated on the pump cover body 100, the equipment integration is improved, the occupied space is small, the space utilization rate is improved, and a large amount of space can be reserved for installing other structures in the reaction chamber.

[0045] In one embodiment of the present invention, the heating device 300 includes: a first heating unit 301 and a second heating unit 302. The first heating unit 301 is fixed below the first bottom plate 101; the second heating unit 302 is fixed below the first bottom plate 101 and arranged opposite to the first heating unit 301. A channel 303 is provided between the first heating unit 301 and the second heating unit 302 so that the workpiece passes through the channel 303 and the upper and lower surfaces of the workpiece are heated by the first heating unit 301 and the second heating unit 302. Specifically, in this embodiment, the heating device 300 includes two upper and lower heating modules, namely the first heating unit 301 and the second heating unit 302. The first heating unit 301 is located above the second heating unit 302, and a channel 303 is formed between the two so that the workpiece passes therethrough. When the workpiece is between the first heating unit 301 and the second heating unit 302, the upper and lower surfaces (or the front and back surfaces) of the workpiece can be heated respectively. For example, when the carrier is being processed, the carrier passes through the channel 303 to provide the required temperature for the coating environment. The first heating unit 301 and the second heating unit 302 evenly heat the front and back surfaces of the carrier and the silicon wafer to improve the adhesion and purity of the film.

[0046] In one embodiment of the present invention, the refrigeration device 200 includes: a first refrigeration unit 201, which is fixed on a side of the first heating unit 301 away from the channel 303. Further, the refrigeration device 200 also includes: a second refrigeration unit 202, which is fixed on a side of the second heating unit 302 away from the channel 303. Specifically, in this embodiment, the refrigeration device 200 includes two upper and lower cooling modules, namely the first refrigeration unit 201 and the second refrigeration unit 202, the first refrigeration unit 201 and the second refrigeration unit 202 are respectively attached to the non-heating surfaces of the first heating unit 301 and the second heating unit 302, that is, the first refrigeration unit 201 is attached to the top of the first heating unit 301, and the second refrigeration unit 202 is attached to the bottom of the second heating unit 302. The interior of the reaction chamber is cooled by the first refrigeration unit 201 and the second refrigeration unit 202, so that the non-coating side can achieve the best cooling effect, ensuring that the temperature of the reaction chamber will not be too high.

[0047] In one embodiment of the present invention, the pump cover assembly further includes: a first connecting member 401, and the first heating unit 301 is fixed to the first bottom plate 101 through the first connecting member 401. Further, the pump cover assembly further includes: a second bottom plate 402 and a second connecting member 403, and the second bottom plate 402 is fixed to the first bottom plate 101 through the second connecting member 403, and the second heating unit 302 is fixed on the second bottom plate 402. In this embodiment, the first connecting member 401 and the second connecting member 403 can adopt any one of support columns, support ribs and support beams, which mainly play the role of connection and fixing; taking the first connecting member 401 and the second connecting member 403 adopting support columns as an example, the second bottom plate 402 is connected and fixed to the bottom of the first bottom plate 101 by multiple support columns, the second heating unit 302 is installed on the second bottom plate 402, and the first heating unit 301 is connected and fixed between the first bottom plate 101 and the second bottom plate 402 by multiple support columns. The connection and fixing method of the above-mentioned support columns can be in the form of threaded connection; and the first refrigeration unit 201 can be fixed above the first heating unit 301 by bolt connection, and the second refrigeration unit 202 can be fixed below the second heating unit 302 by bolt connection.

[0048] In one embodiment of the present invention, a first interface 104, a second interface 105 and a third interface 106 are provided on the first bottom plate 101; wherein the first interface 104 is suitable for connecting to the refrigeration device 200 through a pipeline; the second interface 105 is suitable for connecting to the heating device 300 through a line; and the third interface 106 is suitable for installing a vacuum device. Specifically, two third interfaces 106 are symmetrically arranged along the center line of the first bottom plate 101; the second interface 105 is arranged on the left side of the first bottom plate 101, and a total of six interfaces are arranged; the first interface 104 is arranged on the right side of the first bottom plate 101. The above-mentioned first interface 104, second interface 105 and third interface 106 can all adopt flange interfaces or other forms of interfaces.

[0049] In one embodiment of the present invention, the pump cover body 100 further includes: a pump cover box 102 and a lifting lug 103, the inside of the pump cover box 102 is used to place a vacuum pump; the lifting lug 103 is arranged on the top of the pump cover box 102. Further, the refrigeration device 200 includes a water-cooled plate structure; the heating device 300 includes a heating plate structure. Specifically, the vacuum pump adopts a front pump and a molecular pump, and the molecular pump is installed inside the pump cover box 102 through the third interface 106, and the inside of the reaction chamber is vacuumed by the molecular pump; the refrigeration device 200 adopting a water-cooled structure can be provided with a water source and a water pump inside the pump cover box 102, and the refrigerant is transported to the water-cooled plate structure through the first interface 104 and the pipeline; the heating device 300 adopting a heating plate structure can be provided with a power supply inside the pump cover box 102, the power supply is electrically connected to the wire, the wire passes through the first interface 104 and is electrically connected to the heating plate structure, and the heating plate structure converts electrical energy into heat energy.

[0050] The present invention also provides a PVD vacuum device. The PVD device comprises: a reaction chamber and a pump cover assembly according to the above embodiment. The top of the reaction chamber is provided with an opening, and the first bottom plate 101 of the pump cover assembly covers the opening and can be sealed with the opening.

[0051] Specifically, when the first base plate 101 is sealed with the reaction chamber, the reaction chamber can be isolated from the external environment, and the interior can be evacuated by the front pump and the molecular pump; when the pump cover assembly is removed from the opening of the reaction chamber, the refrigeration device 200 and the heating device 300 are removed together with the pump cover body 100, so as to facilitate cleaning and maintenance.

[0052] Furthermore, in order to ensure the sealing effect between the first bottom plate 101 and the reaction chamber, a sealing ring may be installed between the first bottom plate 101 and the opening.

[0053] The PVD vacuum equipment provided by the present invention has the same advantages as above because it includes the pump cover assembly in the above embodiment of the present invention.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A pump cover assembly, characterized in that: include: A pump cover body, the pump cover body comprising: a first bottom plate, the first bottom plate being adapted to seal with the reaction chamber; a refrigeration device, the refrigeration device being fixed to the first bottom plate and being used for cooling the interior of the reaction chamber; A heating device, the heating device is fixed to the first bottom plate and is used to heat the workpiece in the reaction chamber; The heating device comprises: a first heating unit, wherein the first heating unit is fixed below the first bottom plate; The second heating unit is fixed below the first bottom plate and arranged opposite to the first heating unit. A channel is provided between the first heating unit and the second heating unit so that the workpiece passes through the channel and the upper surface and the lower surface of the workpiece are heated by the first heating unit and the second heating unit.

2. The pump cover assembly according to claim 1, characterized in that: The refrigeration device comprises: A first refrigeration unit is fixed on a side of the first heating unit away from the channel.

3. The pump cover assembly according to claim 1, characterized in that: The refrigeration device also includes: A second refrigeration unit is fixed on a side of the second heating unit away from the channel.

4. The pump cover assembly according to claim 1, characterized in that: Also includes: A first connecting member, wherein the first heating unit is fixed to the first bottom plate through the first connecting member.

5. The pump cover assembly according to claim 1, characterized in that: Also includes: Second base plate; A second connecting member, the second bottom plate is fixed to the first bottom plate through the second connecting member, and the second heating unit is fixed on the second bottom plate.

6. The pump cover assembly according to claim 1, characterized in that: The first bottom plate is provided with a first interface, a second interface and a third interface; wherein, The first interface is suitable for connecting to the refrigeration device through a pipeline; The second interface is suitable for connecting to the heating device through a line; The third interface is suitable for installing a vacuum extraction device.

7. The pump cover assembly according to claim 1, characterized in that: The pump cover body also includes: A pump cover box, wherein the interior of the pump cover box is used to place a vacuum pumping device; A lifting lug is arranged on the top of the pump cover box.

8. The pump cover assembly according to any one of claims 1 to 7, characterized in that: The refrigeration device comprises a water-cooled plate structure; The heating device comprises a heating plate structure.

9. A PVD vacuum equipment, characterized in that: include: A reaction chamber, wherein the top of the reaction chamber is opened; According to the pump cover assembly according to any one of claims 1 to 8, the first bottom plate of the pump cover assembly can be sealed with the opening.

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