A refrigerator

Abstract

The application discloses a refrigerator, which comprises a refrigerator liner, an air duct cover plate, an ice making assembly and a heat dissipation assembly. The air duct cover plate and the rear side wall of the refrigerator liner enclose an air duct. The ice making assembly comprises an ice making box and a semiconductor refrigerating sheet. The ice making box is provided with at least one ice making grid for containing water. The semiconductor refrigerating sheet has opposite first and second temperature changing surfaces. The first temperature changing surface is in heat conductive connection with the ice making box. The heat dissipation assembly comprises a shell provided with a heat dissipation channel and a heat dissipation fan rotatably arranged in the heat dissipation channel. The first end of the heat dissipation channel is in communication with the refrigerator liner, and the second end of the heat dissipation channel is in communication with the air duct. The second temperature changing surface is in heat conductive connection with the shell. When the ice making assembly is in an ice making state, the first temperature changing surface provides cold energy to the water in the ice making box to form ice blocks. The heat dissipation fan is used to drive the cold air in the refrigerator liner to flow into the air duct through the first end of the heat dissipation channel and the second end of the heat dissipation channel in sequence.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of refrigerators, in particular to a refrigerator. BACKGROUND

[0002] At present, some refrigerators are internally provided with ice machines, which can freeze water to form ice blocks for users to use, meeting the ice block needs of users. In the prior art, the ice making methods of the ice machines in traditional refrigerators include the following two kinds: the first kind is to cool the ice making box through cold air, but this ice making method has the disadvantage of slow ice making speed, usually taking 90 minutes to start to produce ice blocks, and the ice making amount is about 1.4 kg / 24h. The second kind is to use the low-temperature evaporation pipe in the refrigeration system of the refrigerator to cool the water through low-temperature heat conduction to quickly make ice, which currently starts to produce ice about 45 minutes, and the ice making amount is 2.2 kg / 24h, but this ice making method has the problem of serious frosting, and generally needs to be provided with a special defrosting device, resulting in a relatively complex overall structure and high cost.

[0003] In addition, some existing refrigerators use a semiconductor refrigeration method to make ice, such as the refrigerator disclosed in Chinese Patent No. CN105258418B, and the ice making device disclosed in Chinese Patent No. CN105258423B, which specifically uses a semiconductor refrigeration sheet to adhere to the side of an ice making box, uses the cold end of the semiconductor refrigeration sheet to cool the ice making box to generate ice blocks, and uses an ice making evaporation pipe to dissipate heat from the hot end of the semiconductor refrigeration sheet, thereby achieving the purpose of quickly making ice, and the ice making effect is relatively excellent. However, since the temperature of the ice making evaporation pipe is very low (generally about -30℃), the surface of the ice making evaporation pipe is prone to frost, so the semiconductor ice making method still has the problem of excessive frosting, and needs to additionally provide a defrosting device, resulting in a relatively complex internal structure of the refrigerator and increased cost. SUMMARY

[0004] In order to solve the technical problems of frosting and complex internal structure of the existing refrigerator using the semiconductor refrigeration method to make ice, the present application provides a refrigerator, which comprises:

[0005] A refrigerator liner;

[0006] An air duct cover plate is arranged in the refrigerator liner and close to the rear side wall of the refrigerator liner, the air duct cover plate and the rear side wall of the refrigerator liner form an air duct, an evaporator for generating cold energy is arranged in the air duct, and the air duct cover plate is provided with a ventilation hole communicating with the air duct;

[0007] An ice-making assembly is arranged in the ice-making compartment of the refrigerator, the ice-making assembly comprising an ice-making box and a semiconductor refrigeration sheet, the ice-making box is formed with at least one ice-making grid for containing water, the semiconductor refrigeration sheet has opposite first and second temperature-changing surfaces, and the first temperature-changing surface is in thermal contact with the ice-making box; and

[0008] A heat-dissipating assembly is arranged in the ice-making compartment of the refrigerator, the heat-dissipating assembly comprising a housing with a heat-dissipating channel and a heat-dissipating fan rotatably arranged in the heat-dissipating channel, a first end of the heat-dissipating channel is in communication with the ice-making compartment of the refrigerator, a second end of the heat-dissipating channel is in communication with the air duct, and the second temperature-changing surface is in thermal contact with the housing;

[0009] The ice-making assembly can work in an ice-making state and an ice-removing state, when the ice-making assembly is in the ice-making state, the first temperature-changing surface provides cold energy to the water in the ice-making box to form ice cubes, and the heat-dissipating fan is used to drive the cold air in the ice-making compartment of the refrigerator to flow into the air duct through the first end of the heat-dissipating channel and the second end of the heat-dissipating channel in sequence.

[0010] In some embodiments, the ice-making box and the housing are respectively made of a heat-conducting material, the first temperature-changing surface is attached to the outer sidewall of the ice-making box, and the second temperature-changing surface is attached to the outer sidewall of the housing.

[0011] In some embodiments, the semiconductor refrigeration sheet is in a plurality, and the plurality of semiconductor refrigeration sheets are arranged in sequence and spaced apart between the ice-making box and the housing.

[0012] In some embodiments, at least one metal heat-dissipating sheet extending along the direction from the first end of the heat-dissipating channel to the second end of the heat-dissipating channel is arranged in the heat-dissipating channel, and the metal heat-dissipating sheet is in thermal contact with the housing.

[0013] In some embodiments, the heat-dissipating fan is arranged close to the second end of the heat-dissipating channel, and the heat-dissipating metal sheet is located between the first end of the heat-dissipating channel and the heat-dissipating fan.

[0014] In some embodiments, the metal heat-dissipating sheet is an aluminum alloy sheet or a copper alloy sheet.

[0015] In some embodiments, a first end of the housing is provided with an air inlet in communication with the first end of the heat-dissipating channel, and a second end of the housing is provided with an air outlet in communication with the second end of the heat-dissipating channel.

[0016] In some embodiments, the ice-making assembly further comprises an ice storage box arranged below the ice-making box and an electric motor for driving the ice-making box to rotate.

[0017] When the ice making assembly is in the defrosting state, the first temperature changing surface provides heat to the ice making box to separate the ice cubes in the ice making box from the ice making grid, and the motor drives the ice making box to rotate to make the ice cubes in the ice making box fall into the ice storage box.

[0018] In some embodiments, a water collecting tray and an evaporation dish are further included, the water collecting tray is arranged below the ice making box, and the water collecting tray is communicated with the evaporation dish through a pipeline;

[0019] The ice making assembly can also work in a defrosting state;

[0020] When the ice making assembly is in the defrosting state, the first temperature changing surface provides heat to the ice making box to separate the ice cubes in the ice making box from the ice making grid, and the motor drives the ice making box to rotate to make the ice cubes in the ice making box fall into the ice storage box.

[0021] Compared with the prior art, the refrigerator of the present application has the following beneficial effects:

[0022] In the ice making state of the ice making assembly, the first temperature changing surface of the semiconductor refrigerating sheet generates cold energy, and the second temperature changing surface generates heat, the ice making box receives the cold energy of the first temperature changing surface in a heat conduction mode to freeze water into ice cubes, the freezing speed is relatively fast, and the ice making efficiency is improved.

[0023] The heat generated by the second temperature changing surface is transmitted to the shell in a heat conduction mode, the heat dissipation fan is driven to rotate to make the heat dissipation channel in a negative pressure state, the airflow flow direction is from the first end of the heat dissipation channel to the second end of the heat dissipation channel, the cold air in the refrigerator liner flows into the air duct in sequence through the first end to the second end of the heat dissipation channel, the cold air in the refrigerator liner is used to cool the shell and form hot air entering the air duct, and the evaporator cools the hot air and then returns to the refrigerator liner through the ventilation channel, so as to achieve the purpose of cooling the second temperature changing surface of the semiconductor refrigerating sheet. Wherein, the present application increases the contact area with the cold air by transmitting the heat of the second temperature changing surface to the shell, so as to improve the heat exchange effect; at the same time, the high pressure hot air in the heat dissipation channel is guided to the low pressure air duct, the hot air is discharged from the inside to the outside to achieve heat dissipation, the problem of large air resistance caused by inhaling cold air from the outside to the inside is avoided, and the heat exchange efficiency is not good, so as to achieve the purpose of quickly cooling the second temperature changing surface.

[0024] The present application cools and dissipates heat of the second temperature changing surface by skillfully using the cold air in the refrigerator liner, avoids the problem of frost caused by using the evaporation pipe to cool, does not need to additionally increase the defrosting device, makes the overall structure relatively simple, and is convenient for processing and manufacturing and later maintenance. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic diagram of a refrigerator according to some embodiments of the present application;

[0026] Figure 2 is a structural schematic diagram of a refrigerator according to some embodiments of the present application, in which the inner liner of the refrigerator is omitted;

[0027] Figure 3 is a structural schematic diagram of an ice making assembly and a heat dissipation assembly according to some embodiments of the present application;

[0028] Figure 4 is a split schematic diagram of Figure 3 ;

[0029] Figure 5 is a sectional view along A-A of Figure 3 ;

[0030] in the diagram,

[0031] 1, inner liner of the refrigerator;

[0032] 2, air duct cover plate; 21, air vent;

[0033] 3, evaporator;

[0034] 4, ice making assembly; 41, ice making box; 411, ice making grid; 42, semiconductor refrigeration sheet; 421, first temperature changing surface; 422, second temperature changing surface;

[0035] 5, heat dissipation assembly; 51, shell; 511, heat dissipation channel; 512, air inlet; 513, air outlet; 52, heat dissipation fan;

[0036] 6, metal heat dissipation sheet;

[0037] 7, ice storage box. DETAILED DESCRIPTION

[0038] The specific embodiments of the present application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the present application, but are not used to limit the scope of the present application.

[0039] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0040] In addition, the terms "first", "second", etc. are used only for the purpose of description and do not imply or imply relative importance or imply the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0041] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0042] In the present application, unless otherwise explicitly specified and limited, the "first" feature is "on" or "under" the "second" feature, which can include the first and second features in direct contact, or the first and second features not in direct contact but in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the first feature is less than the second feature in horizontal height.

[0043] Please refer to Figure 1 - Figure 5The embodiment of the present application provides a refrigerator, which comprises a refrigerator liner 1, an air duct cover plate 2, an ice making assembly 4 and a heat dissipation assembly 5. The refrigerator liner 1 is, for example, a freezing chamber or a refrigerating chamber in the prior art, and the internal temperature thereof is generally lower than 10 DEG C, so as to store food or other articles which need to be stored for a long time. The air duct cover plate 2 is arranged in the refrigerator liner 1 and close to the rear side wall of the refrigerator liner 1, and the air duct cover plate 2 and the rear side wall of the refrigerator liner 1 enclose an air duct, and an evaporator 3 for generating cold energy is arranged in the air duct, and the air duct cover plate 2 is provided with a ventilation hole 21 which is communicated with the air duct; the ice making assembly 4 is arranged in the refrigerator liner 1, and the ice making assembly 4 comprises an ice making box 41 and a semiconductor refrigeration fin 42, the ice making box 41 is formed with at least one ice making grid 411 for containing water, and the semiconductor refrigeration fin 42 has opposite first temperature changing surfaces 421 and second temperature changing surfaces 422, and the first temperature changing surfaces 421 are in heat conductive connection with the ice making box 41; the heat dissipation assembly 5 is arranged in the refrigerator liner 1, and the heat dissipation assembly 5 comprises a shell 51 with a heat dissipation channel 511 and a heat dissipation fan 52 which is rotatably arranged in the heat dissipation channel 511, the first end of the heat dissipation channel 511 is communicated with the refrigerator liner 1, the second end of the heat dissipation channel 511 is communicated with the air duct, and the second temperature changing surfaces 422 are in heat conductive connection with the shell 51; wherein the ice making assembly 4 can work in an ice making state and an ice removing state; when the ice making assembly 4 is in the ice making state, the first temperature changing surfaces 421 provide cold energy to the water in the ice making box 41 to form ice blocks, and the heat dissipation fan 52 is used for driving the cold air in the refrigerator liner 1 to flow into the air duct through the first end of the heat dissipation channel 511 and the second end of the heat dissipation channel 511 in sequence.

[0044] It can be understood that the semiconductor refrigeration fin 42 of the embodiment of the present application has opposite first temperature changing surfaces 421 and second temperature changing surfaces 422, and the semiconductor refrigeration fin 42 is passed through current, and one of the first temperature changing surfaces 421 and the second temperature changing surfaces 422 generates cold energy and the other generates heat by controlling the direction of the current, then the first temperature changing surfaces 421 transmit the cold energy or the heat to the ice making box 41 in a direct heat conduction or indirect heat conduction mode, and the ice making box 41 receives the cold energy to freeze the water into ice blocks or receives the heat to melt the ice blocks and separate the ice blocks from the ice making box 41. When the ice making assembly 4 is in the ice making state, the first temperature changing surfaces 421 generate cold energy and the second temperature changing surfaces 422 generate heat, and the heat of the second temperature changing surfaces 422 is transmitted to the shell 51 in a direct heat conduction or indirect heat conduction mode, and the cold energy in the refrigerator liner 1 directly cools the shell 51 to achieve heat dissipation, and the rotating heat dissipation fan 52 forms an air flow to flow the heat in the heat dissipation channel 511 into the air duct along the air flow, so as to complete the heat dissipation treatment of the second temperature changing surfaces 422.

[0045] Based on the above scheme, the heat generated by the second temperature change surface 422 is transmitted to the shell 51 by heat conduction, and the heat dissipation channel 511 is in a negative pressure state by driving the heat dissipation fan 52 to rotate, so that the airflow flows from the first end of the heat dissipation channel 511 to the second end of the heat dissipation channel 511, so that the cold air in the refrigerator liner 1 flows into the air duct through the first end of the heat dissipation channel 511 to the second end of the heat dissipation channel 511 in turn, and the cold air in the refrigerator liner 1 is cooled by the shell 51 and forms hot air after entering the air duct. The evaporator 3 cools the hot air and returns to the refrigerator liner 1 through the ventilation hole 21, so as to achieve the purpose of cooling the second temperature change surface 422 of the semiconductor refrigeration piece 42. Wherein, the present application increases the contact area of the second temperature change surface 422 by transmitting the heat of the second temperature change surface 422 to the shell 51, so as to improve the heat exchange effect; at the same time, by guiding the high-pressure hot air in the heat dissipation channel 511 to the low-pressure air duct, the hot air is discharged from the inside to the outside to achieve heat dissipation, avoiding the problem that the air resistance is large when the cold air is sucked from the outside to the inside, so as to realize the purpose of quickly cooling the second temperature change surface 422.

[0046] It can be further understood that the ice making box 41 is usually provided with a plurality of ice making grids 411, and the number of semiconductor refrigeration pieces 42 can be one or more. When the number of semiconductor refrigeration pieces 42 is one, one semiconductor refrigeration piece 42 is in thermal contact with the side wall or bottom wall of the plurality of ice making grids 411 of the ice making box 41 at the same time, so as to provide cold energy for the plurality of ice making grids 411 at the same time. When the number of semiconductor refrigeration pieces 42 is more than one, the number of semiconductor refrigeration pieces 42 can be the same as the number of ice making grids 411, and the first temperature change surface 421 of each semiconductor refrigeration piece is in thermal contact with the side wall or bottom wall of an ice making grid 411, so as to improve the refrigeration efficiency and speed up the production efficiency of ice blocks.

[0047] In some embodiments, the ice making box 41 and the shell 51 are respectively made of heat-conducting materials, such as metal materials, preferably aluminum or aluminum-based alloys, which have good heat conductivity. The materials of the ice making box 41 and the shell 51 can be the same or different. The first temperature change surface 421 is attached to the outer side wall of the ice making box 41, and the second temperature change surface 422 is attached to the outer side wall of the shell 51, so as to improve the transmission efficiency of the cold energy of the first temperature change surface 421 to the ice making box 41 by direct contact, avoiding the loss of cold energy; and improve the transmission efficiency of the heat of the second temperature change surface 422 to the shell 51, and speed up the cooling and heat dissipation efficiency.

[0048] Further, in some embodiments, the number of semiconductor refrigeration pieces 42 is multiple, and the multiple semiconductor refrigeration pieces 42 are sequentially and spacedly arranged between the ice making box 41 and the shell 51, wherein the more the number of semiconductor refrigeration pieces 42 is, the faster the ice making speed is, which is beneficial to improve the ice block generation efficiency. Further, the semiconductor refrigeration pieces 42 can be fixedly connected with the ice making box 41 and the shell 51 respectively by adhesion (e.g. heat-conducting silicon glue).

[0049] In some embodiments, at least one metal heat dissipation fin 6 extending along the direction from the first end of the heat dissipation channel 511 to the second end of the heat dissipation channel 511 is arranged in the heat dissipation channel 511, and the metal heat dissipation fin 6 is in heat-conducting connection with the shell. The two sides of the metal heat dissipation fin 6 can be fixedly connected with the opposite two sides of the heat dissipation channel 511 respectively, or can be in contact connection. In this way, the heat on the shell 51 is distributed on the metal heat dissipation fin 6, so as to increase the heat exchange area and improve the heat dissipation efficiency. The metal heat dissipation fin 6 can be arranged horizontally, vertically or obliquely, which is not limited here, as long as the airflow in the heat dissipation channel 511 continuously flows along the surface of the metal heat dissipation fin 6, so as to prevent the metal heat dissipation fin 6 from causing air resistance to the airflow.

[0050] In some embodiments, the heat dissipation fan 52 is arranged close to the second end of the heat dissipation channel 511, and the metal heat dissipation fin 6 is located between the first end of the heat dissipation channel 511 and the heat dissipation fan 52. In this way, the airflow efficiency is improved, and the heat dissipation fan 52 is prevented from being too close to the user to cause safety hazards. In some other embodiments, the heat dissipation fan 52 can be arranged at the middle part of the heat dissipation channel 511, and the metal heat dissipation fin can be located between the first end of the heat dissipation channel 511 and the heat dissipation fan 52, and between the heat dissipation fan 52 and the second end of the heat dissipation channel 511.

[0051] In some embodiments, the metal heat dissipation fin 6 is an aluminum alloy sheet or a copper alloy sheet. The aluminum alloy sheet or the copper alloy sheet has excellent heat conductivity, and can quickly exchange heat with the cold air flow in the heat dissipation channel 511, so as to improve the heat dissipation effect.

[0052] In some embodiments, the first end of the shell 51 is provided with an air inlet 512 communicating with the first end of the heat dissipation channel 511, and the second end of the shell 51 is provided with an air outlet 513 communicating with the second end of the heat dissipation channel 511. Specifically, the cold energy of the refrigerator liner 1 enters the heat dissipation channel 511 from the air inlet 512, and then enters the air duct from the air outlet 513 through the air duct cover plate 2, which is provided with a through hole communicating with the air outlet 513. The shell 51 can be formed by a thin plate through a bending process to have a hollow structure with openings at both ends. The shell 51 has a cylindrical shape or a square column shape, so that the openings at both ends of the shell 51 are the air inlet 512 and the air outlet 513, respectively, to realize that the cold energy in the refrigerator liner 1 enters the heat dissipation channel 511 through the air inlet 512, exchanges heat with the shell 51 and the metal heat dissipation fins 6, and then enters the air duct through the air outlet 513.

[0053] In some embodiments, the ice making assembly 4 further includes an ice storage box 7 arranged below the ice making box 41 and a motor (not shown in the figure) for driving the ice making box 41 to rotate. When the ice making assembly 4 is in the ice removal state, the first temperature changing surface 421 provides heat to the ice making box 41 to separate the ice blocks in the ice making box 41 from the ice making grids 411, and the motor drives the ice making box 41 to rotate to make the ice blocks in the ice making box 41 fall into the ice storage box 7. Specifically, the first temperature changing surface 421 generates heat by controlling the direction of the current flowing into the semiconductor refrigeration sheet 42, and the second temperature changing surface 422 generates cold energy at this time. The heat of the first temperature changing surface 421 is transmitted to the ice making box 41 by heat conduction to heat and melt the frozen ice blocks after a certain period of time, and the ice blocks are separated from the inner wall of the ice making grid 411. The motor drives the ice making box 41 to rotate by a certain angle (usually 180°) to make the ice blocks fall into the ice storage box 7 under the action of gravity for storage, so that the user can take out the ice blocks from the ice storage box 7 at any time.

[0054] In some embodiments, due to the low temperature of the semiconductor refrigeration sheet 42, ice frost is easily formed on the surface of the semiconductor refrigeration sheet 42 and the ice making box 41. In order to avoid affecting the normal ice making and ice removal work of the ice making box 41, the refrigerator of the present embodiment further includes a water pan (not shown in the figure) and an evaporation dish (not shown in the figure). The water pan is arranged below the ice making box 41 and is communicated with the evaporation dish through a pipeline. The ice making assembly 4 can also work in a defrosting state. When the ice making assembly 4 is in the defrosting state, the first temperature changing surface 421 provides heat to the ice making box 41 to melt the ice frost on the surface of the ice making box 41 into water, which falls into the water pan and is then discharged to the evaporation dish along the pipeline. At least a part of the evaporation dish is located outside the refrigerator to drain the defrosted water outside the refrigerator for natural evaporation.

[0055] In summary, the refrigerator provided by the application has the following advantages: when the ice making component 4 is in an ice making state, the first temperature changing surface 421 of the semiconductor refrigerating sheet 42 generates cold energy, and the second temperature changing surface 422 generates heat, the ice making box 41 receives the cold energy of the first temperature changing surface 421 in a heat conduction mode to freeze water into ice blocks, and the freezing speed is relatively fast, which is beneficial to improving the ice making efficiency. The heat generated by the second temperature changing surface 422 is transmitted to the shell 51 in a heat conduction mode, the heat dissipation channel 511 is in a negative pressure state by driving the heat dissipation fan 52 to rotate, the airflow flowing direction is from the first end of the heat dissipation channel 511 to the second end of the heat dissipation channel 511, the cold air in the refrigerator inner container 1 flows into the air duct in sequence from the first end of the heat dissipation channel 511 to the second end of the heat dissipation channel 511, the cold air in the refrigerator inner container 1 is used to cool the shell 51 and form hot air, and the evaporator 3 cools the hot air and then returns to the refrigerator inner container 1 through the ventilation hole 21, so that the purpose of cooling the second temperature changing surface 422 of the semiconductor refrigerating sheet 42 is achieved. In the application, the heat of the second temperature changing surface 422 is transmitted to the shell 51 to increase the contact area with the cold air, so as to improve the heat exchange effect. At the same time, the high-pressure hot air in the heat dissipation channel 511 is guided into the low-pressure air duct, the hot air is discharged from the inside to the outside to achieve heat dissipation, the problem of large air resistance caused by the air suction from the outside to the inside is avoided, and the heat exchange efficiency is not good, so that the purpose of quickly cooling the second temperature changing surface 422 is achieved. The application uses the cold air in the refrigerator inner container 1 to cool and dissipate heat of the second temperature changing surface 422, avoids the problem of frost caused by the use of the evaporating pipe for cooling, the application does not need to additionally increase the defrosting device, the overall structure is relatively simple, and the processing and manufacturing and the later maintenance are facilitated.

[0056] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0057] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A refrigerator characterized by comprising: The refrigerator comprises: a refrigerator liner; an air duct cover plate arranged in the refrigerator liner and close to the rear side wall of the refrigerator liner, the air duct cover plate and the rear side wall of the refrigerator liner forming an air duct, the air duct being provided with an evaporator for generating cold air, the air duct cover plate being provided with a ventilation hole communicating with the air duct; an ice making assembly arranged in the refrigerator liner, the ice making assembly comprising an ice making box and a semiconductor refrigeration sheet, the ice making box being formed with at least one ice making grid for containing water, the semiconductor refrigeration sheet having opposite first and second temperature changing surfaces, the first temperature changing surface being in thermal connection with the ice making box; a heat dissipation assembly arranged in the refrigerator liner, the heat dissipation assembly comprising a housing with a heat dissipation channel and a heat dissipation fan rotatably arranged in the heat dissipation channel, a first end of the heat dissipation channel being in communication with the refrigerator liner, a second end of the heat dissipation channel being in communication with the air duct, the second temperature changing surface being in thermal connection with the housing; wherein the ice making assembly can work in an ice making state and an ice removing state; when the ice making assembly is in the ice making state, the first temperature changing surface provides cold air to the water in the ice making box to form ice blocks, and the heat dissipation fan is used to drive the cold air in the refrigerator liner to flow into the air duct through the first end of the heat dissipation channel and the second end of the heat dissipation channel in sequence; at least one metal heat dissipation sheet extending along the direction from the first end of the heat dissipation channel to the second end of the heat dissipation channel is arranged in the heat dissipation channel, the metal heat dissipation sheet being in thermal connection with the housing, and the airflow in the heat dissipation channel continuously flows along the surface of the metal heat dissipation sheet. The ice making box and the housing are respectively made of thermal conductive materials, the first temperature changing surface is attached to the outer side wall of the ice making box, and the second temperature changing surface is attached to the outer side wall of the housing.

2. The refrigerator according to claim 1, wherein The number of semiconductor refrigeration sheets is multiple, and the multiple semiconductor refrigeration sheets are arranged in sequence and spaced apart between the ice making box and the housing.

3. The refrigerator according to claim 2, wherein The heat dissipation fan is arranged close to the second end of the heat dissipation channel, and the metal heat dissipation sheet is located between the first end of the heat dissipation channel and the heat dissipation fan.

4. The refrigerator according to claim 1, wherein The metal heat dissipation sheet is an aluminum alloy sheet or a copper alloy sheet.

5. The refrigerator according to claim 1 or 4, wherein The first end of the housing is provided with an air inlet communicating with the first end of the heat dissipation channel, and the second end of the housing is provided with an air outlet communicating with the second end of the heat dissipation channel.

6. The refrigerator according to claim 1, wherein The ice making assembly further comprises an ice storage box arranged below the ice making box and a motor driving the ice making box to rotate; 7. The refrigerator according to claim 1, wherein when the ice making assembly is in the ice removing state, the first temperature changing surface provides heat to the ice making box to separate the ice blocks in the ice making box from the ice making grids, and the motor drives the ice making box to rotate to make the ice blocks in the ice making box fall into the ice storage box. The refrigerator further comprises a water pan and an evaporation dish, the water pan being arranged below the ice making box and being in communication with the evaporation dish through a pipeline; 8. The refrigerator according to claim 1 or 7, wherein the ice making assembly can also work in a defrosting state; ​ When the ice making assembly is in the defrosting state, the first temperature changing surface provides heat to the ice making tray to melt the frost on the surface of the ice making tray into water and drop to the back end of the drain line to the evaporating pan.

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