Apparatus and method for testing electrical performance parameters of bipolar transistors

Abstract

The present application relates to a device for testing electrical performance parameters of bipolar transistors, comprising a test fixture for operatively mechanically and electrically coupling a bipolar transistor to be tested, a test circuit for applying a test input signal to the transistor under test, a measurement circuit for measuring an output signal of the transistor and determining electrical performance parameters thereof, and a controller for automating the testing process and analyzing the measurement data, wherein the test fixture has fluid cavities formed through its length by one or more flow holes, and at least one cooling section in the form of a uniform or non-uniform spiral is arranged in each fluid cavity to extend along the corresponding fluid cavity. The test circuit comprises a signal generator for generating the input signal and a power supply for providing necessary bias voltages to the transistor; the measurement circuit comprises an oscilloscope for measuring the output signal and a computer for processing the measurement data; the controller is capable of automatically acquiring and analyzing the measurement data of the transistor to determine the electrical performance parameters.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of bipolar transistor testing, and particularly relates to a device and method for testing electrical performance parameters of a bipolar transistor. BACKGROUND

[0002] A bipolar transistor, also known as a bipolar junction transistor (BJT), is a type of electronic device that has three terminals and is made of three parts of differently doped semiconductors. The charge flow in a bipolar transistor is mainly due to the diffusion of charge carriers at the PN junction and drift motion.

[0003] A bipolar transistor is a current-controlled device composed of two back-to-back PN structures, with both electrons and holes participating in conduction to achieve voltage, current, or signal gain. In the three-layer semiconductor formed internally, the middle layer is called the base region, and the outer two layers are called the emitter region and the collector region. When a small amount of current is injected into the base region, a larger current is formed between the emitter region and the collector region, resulting in an amplification effect.

[0004] Bipolar transistors are widely used in various electronic devices, including amplifiers, switches, and voltage stabilizers. To ensure the normal operation and reliability of bipolar transistors, it is very important to accurately measure their electrical performance parameters, such as gain, frequency response, and breakdown voltage. However, manually testing these parameters can be time-consuming and prone to errors, especially when testing a large number of transistors.

[0005] In addition, it is known that during the testing process, the continuous input and output of current can cause fluctuations in the testing environment of the bipolar transistor, such as temperature, and the combined effects of environmental temperature and humidity. Temperature and humidity fluctuations have a significant impact on the electrical performance testing of bipolar transistors, not only affecting the accuracy and reliability of the test results, but also easily causing electrical safety accidents when the testing temperature exceeds the safety level.

[0006] In addition, on the one hand, due to the difference in understanding of those skilled in the art; on the other hand, due to the fact that the applicant has studied a large number of literatures and patents when making the present application, but limited by the size and has not listed all the details and contents in detail, but this is not that the present application does not have the characteristics of these prior arts, on the contrary, the present application has all the characteristics of the prior art, and the applicant reserves the right to add relevant prior art in the background art. SUMMARY

[0007] In view of the deficiencies of the prior art, the present application provides a device and method for quickly and reliably testing the electrical performance parameters of bipolar transistors, aiming to solve at least one or more technical problems existing in the prior art.

[0008] To achieve the above-mentioned purpose, the present application provides a device for quickly and reliably testing the electrical performance parameters of bipolar transistors, comprising:

[0009] A clamping unit comprising a test fixture for operatively mechanically and electrically coupling one or more bipolar transistors to be tested;

[0010] A power supply unit for providing a test input signal for testing the bipolar transistor;

[0011] A measurement unit for receiving a test feedback signal of the bipolar transistor and determining at least one electrical performance parameter of the bipolar transistor;

[0012] Among them,

[0013] The test fixture has a fluid cavity formed through the length direction of one or more flow guide edges of its side end face, and at least one cooling section extending in the form of equal or unequal spirals is arranged in the fluid cavity.

[0014] Preferably, the cooling sections arranged in each fluid cavity can fluidly connect the physically separated fluid cavities in a head-to-tail manner.

[0015] Preferably, the cooling sections arranged in adjacent fluid cavities are connected in a head-to-tail manner by a transition section with a predetermined curvature to form a circulation loop for circulating the cooling medium.

[0016] Preferably, the cooling sections in adjacent fluid cavities can be arranged in such a way that the cooling medium in them has the same or opposite flow direction.

[0017] Preferably, the cooling sections in the fluid cavity are arranged in the form of unequal spirals with varying gaps, and the gaps of the cooling sections vary in view of the variation of the distance between them and the corresponding flow guide holes.

[0018] Preferably, the cooling sections are symmetrically arranged in the corresponding fluid cavities in such a way that the two ends have larger gaps than the middle.

[0019] Preferably, the cooling sections are symmetrically arranged in the corresponding fluid chambers such that the fluid pipe diameters at both ends are smaller than those at the middle.

[0020] Preferably, the apparatus for testing the electrical performance parameters of a bipolar transistor according to the present invention may further include a control unit electrically connected to the power supply unit and the measurement unit in a manner that controllably adjusts the power supply unit and the measurement unit, and is at least used to acquire at least one electrical performance parameter related to the bipolar transistor under test from the measurement unit.

[0021] Preferably, the apparatus for testing the electrical performance parameters of a bipolar transistor according to the present invention may further include one or more environmental sensors configured to acquire temperature information related to the testing of at least one electrical performance parameter of the bipolar transistor.

[0022] Preferably, the present invention also relates to a testing method using an apparatus for testing the electrical performance parameters of a bipolar transistor, the method comprising:

[0023] Mechanically and electrically couple one or more bipolar transistors to be tested to the test fixture;

[0024] Set test parameters to provide test input signals to one or more bipolar transistors under test;

[0025] Obtain the test feedback signal output by the bipolar transistor based on the test input signal;

[0026] Determine at least one electrical performance parameter of the bipolar transistor based on the test feedback signal;

[0027] in,

[0028] The test fixture has a fluid cavity formed by one or more flow guide holes extending along its length from its side end face, and at least one cooling section extending in an equal or unequal spiral manner is arranged in the fluid cavity.

[0029] The beneficial technical effects of this invention include: the testing apparatus and method provided by this invention offer a fast and reliable means of testing the electrical performance parameters of bipolar transistors (BPTs), enabling the testing of a large number of BPTs in a short time, reducing overall testing time and cost, and making it an effective tool in production environments; highly autonomous testing reduces potential human error during the testing process, thereby making the test results more accurate and reliable; the user interface allows for simple customization and analysis of the test results, enabling users to quickly identify and troubleshoot any problems with the transistors; and, to maintain a stable testing environment, this invention provides a test fixture containing multiple fluid-connected cooling sections to provide circulating cooling fluid during the testing process, thereby maintaining the constantly changing test temperature within a constant range, ensuring the safety and stability of the testing process and the accuracy and reliability of the measurement results. Attached Figure Description

[0030] Figure 1 This is an assembly diagram of a bipolar transistor according to a preferred embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of the structure of a bipolar transistor according to a preferred embodiment of the present invention;

[0032] Figure 3 This is a circuit diagram of a test device according to a preferred embodiment of the present invention;

[0033] Figure 4 This is an isometric structural diagram of a test substrate according to a preferred embodiment of the present invention;

[0034] Figure 5 These are cross-sectional and top views of a test substrate according to a preferred embodiment of the present invention.

[0035] List of reference numerals

[0036] 1: Substrate; 2: First solder layer; 3: Substrate; 4: Second solder layer; 5: Semiconductor chip; 6: Bonding wire; 7: Frame; 8: Terminal block; 9: Cover; 10: Test substrate; 11: Cooling section; 12: Transition section; 13: Connector; 100: Drain hole. Detailed Implementation

[0037] The following is a detailed explanation with reference to the accompanying drawings.

[0038] This invention provides a device for testing the electrical performance parameters of bipolar transistors, such as... Figure 3 As shown, the testing device may include a power supply unit, a measurement unit, a control unit, a cooling unit, a clamping unit, and a housing for protecting the aforementioned functional units.

[0039] According to a preferred embodiment, the power supply unit can be used to provide a test voltage source to the bipolar transistor under test. Specifically, the power supply unit may include one or more DC / AC power supplies. The specific power supply type typically depends on the test requirements. In particular, the power supply unit is configured to be adjustable to allow for the provision of voltages in different time and / or frequency domains for the testing of the bipolar transistor.

[0040] According to a preferred embodiment, the measurement unit can be used to measure one or more electrical performance parameters of a bipolar transistor, including but not limited to current, voltage, capacitance, and frequency. Specifically, an example of the measurement unit includes one or more multimeters and an oscilloscope. In particular, the multimeter can be a digital multimeter or an analog multimeter. The specific type of multimeter typically depends on the accuracy and precision required for the test. Further, the oscilloscope can be a digital oscilloscope or an analog oscilloscope, used to measure the waveform and / or frequency of electrical signals in the bipolar transistor.

[0041] According to a preferred embodiment, the control unit can be used to determine the test results of the electrical performance parameters of a bipolar transistor, and to store and display the test results. Specifically, the control unit may include a microcontroller and a human-machine interface. In particular, the microcontroller includes, but is not limited to, a CPU (Central Processing Unit), an MPU (Microprocessor Unit), a MCU (Micro Control Unit), and a SOC (System on Chip).

[0042] Furthermore, the control unit is configured to control the power supply unit and the measurement unit, and can be used to display the measured electrical performance parameters of the bipolar transistor. Specifically, the microcontroller can be programmed or store computer-readable media to execute various test schemes and sequences, thereby enabling automated and conformance testing of the bipolar transistor. The human-machine interface may include a combination of a touch-sensitive display screen and various function buttons, allowing users to input and retrieve test results and control commands.

[0043] According to a preferred embodiment, the cooling unit can be used to maintain the test temperature of the bipolar transistor within a target temperature range during testing. Specifically, the cooling unit may include a heat sink and a fan. The heat sink may be made of a material with high thermal conductivity, such as aluminum or copper, and may be directly or indirectly thermally coupled to the bipolar transistor to dissipate heat generated during testing. The fan may be a cooling fan or a centrifugal fan, used to circulate air over the heat sink to further dissipate the heat generated by the bipolar transistor during testing. Alternatively, in addition to air cooling, the cooling unit may also employ liquid cooling.

[0044] According to a preferred embodiment, the testing apparatus provided by the present invention may further include one or more environmental sensors. Specifically, the environmental sensors include, but are not limited to, temperature sensors, humidity sensors, etc. Specifically, the temperature sensor and humidity sensor can be used to measure the temperature and humidity conditions during the bipolar transistor testing process. In particular, since temperature and humidity have a significant impact on the electrical performance of bipolar transistors, and thus affect the electrical performance test results of bipolar transistors, the participation of the temperature sensor and / or humidity sensor allows users to monitor the test environment conditions in real time / online, and at least selectively control the operation of cooling or heat dissipation components based on the temperature and humidity monitoring results to maintain the stability of the test environment temperature, thereby keeping the electrical performance of the bipolar transistor stable and obtaining accurate test results of electrical performance parameters.

[0045] According to a preferred embodiment, the clamping unit of the present invention can be used to clamp and fix a bipolar transistor to be tested, and to enable the bipolar transistor to maintain a stable electrical and / or mechanical connection with the power supply unit and the measurement unit. Specifically, the clamping unit can be a clamp, which may include one or more sets of probes and connectors. Further, the probes can be spring-loaded or Pogo Pin type, for making electrical contact with the bipolar transistor. The connectors can be banana connectors, test clips, or other suitable connectors for securely fixing the probes and electrically connecting them to the power supply unit and the measurement unit.

[0046] According to a preferred embodiment, Figure 1 and Figure 2 This illustrates a special case of bipolar transistor, namely the IGBT (Insulated Gate Bipolar Transistor). Specifically, besides the semiconductor chip 5, an IGBT module typically consists of a frame, substrate, base plate, and package. For details, see [link to documentation]. Figure 2 A first solder layer 2 is formed on the top surface of substrate 1. The first solder layer 2 can be a system solder layer. Substrate 1 can be a multilayer substrate formed by repeatedly stacking insulating layers and wiring layers. Substrate 1 can be various types of substrates known in the art, such as printed circuit boards, flexible substrates, ceramic substrates, or glass substrates. In particular, if necessary, substrate 1 can also be a double-sided substrate in which wiring layers are formed on the back-facing surface of an insulating layer.

[0047] Furthermore, the wiring layer of substrate 1 may include one or more terminals 8 (or antennas). The terminals 8 and substrate 1 are physically connected to each other and electrically connected to each other. The terminals 8 may be formed using a conductive adhesive such as solder, but are not limited thereto. The terminals 8 may be disposed on either the upper surface or the side surface of substrate 1, as well as inside substrate 1. The wiring layer may be formed using a conductive metal such as copper, nickel, aluminum, silver, or gold.

[0048] According to a preferred embodiment, see Figure 2 A substrate 3 may be formed on the surface of the first solder layer 2. One or more second solder layers 4 spaced apart from each other may be further formed on the surface of the substrate 3. Specifically, the second solder layers 4 may be chip solder layers. Further, a semiconductor chip 5 may be formed on the surface of the second solder layers 4. The semiconductor chip 5 is preferably mechanically and / or electrically coupled to the substrate 3 and / or terminals 8 via bonding wires 6. In particular, the terminals 8 are typically housed within a frame 7.

[0049] According to a preferred embodiment, see Figure 2 The cover 9 is coupled to the frame 7 containing the terminal block 8 to seal the structure carrying the semiconductor chip 5 together with the substrate 1.

[0050] As mentioned above, when using the test apparatus provided by this invention to measure bipolar transistors (such as...) Figure 1 , 2 When testing the electrical performance parameters of the IGBT module shown, the temperature and humidity of the test environment significantly affect the electrical performance test results of the bipolar transistor. Especially during testing, the bipolar transistor generates significant Joule heat due to current input. This heat not only affects the accuracy of the test results (such as noticeable data drift or loss), but also the thermal instability caused by excessive Joule heat can easily lead to electrical safety accidents. Therefore, in this invention, when using a test fixture to mechanically and / or electrically connect the bipolar transistor for electrical performance testing, a cooling unit / component can be directly or indirectly coupled to the test fixture, or a test fixture with a cooling unit / component can be provided to maintain the temperature stability of the bipolar transistor during testing.

[0051] According to a preferred embodiment, a specific example of the test fixture of the present invention can be found in [reference needed]. Figure 4The test fixture may specifically include a test substrate 10. Further, the surface of the test substrate 10 can be used for physical and electrical connections to one or more bipolar transistors (such as IGBTs) to be tested. Alternatively, in an optional embodiment, the test substrate 10 itself may be a separate heat dissipation substrate, and this heat dissipation substrate may be mechanically coupled to the bottom of the test fixture to assist in heat dissipation of the test fixture carrying the bipolar transistors. It is understood that providing a heat dissipation substrate at the bottom of an existing test fixture or constructing at least a portion of an existing test fixture with a heat dissipation structure are both included in the technical concept of this invention, and those skilled in the art can choose according to their needs.

[0052] According to a preferred embodiment, see Figure 4 The test substrate 10 has two substantially horizontal end faces, and one of the end faces of the test substrate 10 is provided with one or more flow guide holes 100. Further, one or more flow guide holes 100 extend along the length direction of the test substrate 10 through one of the end faces of the test substrate 10 and penetrate to its other end face, so as to form one or more fluid cavities within the test substrate 10 for the flow of cooling media (such as condensate or other organic / inorganic liquid cooling media).

[0053] According to a preferred embodiment, the cross-sectional shape of the guide hole 100 can be circular, elliptical, rectangular, polygonal, or other possible geometric shapes. See also Figure 5 In this invention, the cross-sectional shape of the guide hole 100 is preferably circular. It should be understood that those skilled in the art can adjust the specific cross-sectional shape of the guide hole 100 as needed.

[0054] According to a preferred embodiment, see Figure 4 Each fluid cavity may contain at least one cooling section 11, generally in a spiral / coiled configuration. Specifically, the cooling section 11 may be a fluid conduit formed of a material with a higher thermal conductivity than air, such as copper (approximately 400 W / mK), aluminum, etc. Furthermore, the cooling section 11 is typically integrally formed. Alternatively, in some alternative embodiments, the cooling section 11 may also be formed by detachably mechanically coupling multiple independent segmented tubes.

[0055] Specifically, the cooling section 11 can be a fluid conduit extending within the fluid cavity in a substantially equal spiral configuration. An equal spiral configuration can be understood as the spacing between the segments of the cooling section 11 being substantially equal. In other words, the cooling section 11 is arranged with equal spacing between its segments. Furthermore, the cooling section 11 can also be a fluid conduit extending within the fluid cavity in a non-equal spiral configuration. For example, the cooling section 11 may have varying spacing between its segments within the fluid cavity. Alternatively, the cooling section 11 may have linearly or non-linearly varying spacing between its segments.

[0056] Generally, technicians prefer to configure the cooling sections 11 with equal spacing, as this is not only easier to manufacture, but also generally considered to have advantages in heat dissipation (e.g., more uniform heat dissipation). However, due to the characteristics of heat dissipation, the portion of the test substrate 10 closer to the center or inner side is more prone to generating more heat, since the portion of the test substrate 10 closer to the periphery usually does not provide test-related electronic components or has a simpler circuit layout and carries very few semiconductor modules under test (such as IGBTs). Therefore, to overcome the drawbacks of existing heat dissipation methods, in this invention, the cooling sections 11 preferably extend within the fluid cavity in an unequal spiral manner. Alternatively, at least one cooling section 11 in an unequal spiral form is arranged within each fluid cavity. In particular, the unequal spiral can be a segmented tube spacing with linear or non-linear variations as described above.

[0057] According to a preferred embodiment, the cooling section 11 is formed with a gap L (see...) Figure 5 The gap L of the cooling section 11 varies with the distance between it and the corresponding guide hole 100. Specifically, the gap L of the cooling section 11 may decrease as the distance between it and the corresponding guide hole 100 increases. Alternatively, the gap L of the cooling section 11 may first decrease and then increase along the extension direction of the guide hole 100. In particular, for example, with Figure 5 As shown in the top-view view, the gap L can represent the distance between the extended ends of adjacent pipe sections on the same side of the cooling section 11. Specifically, in this invention, the cooling section 11 has a smaller gap L towards the center than the remaining portions closer to the ends. Alternatively, the two sides of the cooling section 11 are symmetrically arranged with a larger gap L towards the center compared to its central portion.

[0058] Specifically, when the cooling section 11 extends within the fluid cavity corresponding to each guide hole 100 in the manner described above, the relatively densely packed gaps L in the middle of the cooling section 11 make it easier for the cooling fluid to form turbulence there, and allow the cooling fluid to undergo a longer flow period to maintain sufficient contact and heat exchange with the heat from the bipolar transistor and the test substrate 10. In particular, the spiral-shaped tube structure allows the cooling medium to undergo one or more cycles of eddies to fully contact the heat generated from all circumferential directions. In other words, by providing sufficient volume / weight of cooling fluid to the test substrate 10 and the transistor under test it carries through the unequal spiral-shaped cooling section 11 and allowing sufficient heat exchange time, the heat generated on the test substrate 10 can be uniformly reduced.

[0059] Furthermore, considering the uneven heat generation exhibited by the test substrate 10 in most states, in this invention, the portion of the cooling section 11 closer to the center can have a larger fluid pipe diameter than the portions at its ends. Alternatively, the two sides of the cooling section 11 can be symmetrically arranged with smaller fluid pipe diameters than the middle portion. In particular, when the portion of the cooling section 11 closer to the center has a larger fluid pipe diameter, the middle portion of the cooling section 11 will contain a larger volume / weight of cooling fluid, providing sufficient cooling fluid to the test substrate 10 for heat dissipation / cooling, and ensuring that the temperature of the test substrate 10 during operation can be uniformly controlled within a suitable range, thereby guaranteeing the stability and accuracy of the bipolar transistor electrical performance test results.

[0060] According to a preferred embodiment, see Figure 5 The cooling sections 11 within each fluid cavity can be fluidly connected by connecting them end-to-end, thus fluidly connecting the physically separate fluid cavities. Specifically, in order to promote the circulation of cooling fluid within the test substrate 10, the cooling sections 11 within each fluid cavity can be connected in series through transition sections 12 to communicate with each other in the direction of cooling fluid movement. This allows the cooling fluid to enter the cooling section 11 through the guide hole 100 at the initial port and exit the cooling section 11 through the guide hole 100 at the end of the cooling section 11 in sequence after passing through one or more circulating serpentine or meandering flows.

[0061] According to a preferred embodiment of the present invention, the cooling sections 11 in adjacent fluid cavities may have the same or different flow directions. For example, the cooling fluid in the upstream cooling section 11 flows clockwise, while the cooling fluid in the downstream cooling section 11 flows counterclockwise. It should be understood that those skilled in the art can reasonably set the specific arrangement (e.g., flow direction) of the cooling sections 11 in each fluid cavity as needed.

[0062] Furthermore, depending on the temperature change after the cooling cycle, the cooling fluid that has undergone at least one complete cooling cycle can be directly introduced or subjected to one or more cooling cycles before being introduced into the test substrate 10. Alternatively, the cooling fluid after the cooling cycle can be recycled for other uses. In particular, the circulation and extraction of the cooling fluid can be accomplished using a device such as a pump.

[0063] According to a preferred embodiment, see Figure 5The transition section 12 is constructed with a predetermined curvature. Specifically, the transition section 12 serves to connect multiple cooling sections 11 to form a circulating fluid loop, while also securing the cooling sections 11 to prevent them from sliding within the fluid cavity. Specifically, the predetermined curvature of the transition section 12 is typically determined by a technician as needed. This predetermined curvature is designed to increase its securing ability when connecting adjacent cooling sections 11, and also to facilitate the smooth transition of cooling fluid from the upstream cooling section 11 to the downstream cooling section 11 without blockage or stagnation. This is especially important when the total pipeline length is long and the power provided by equipment such as pumps may be insufficient; in such cases, zigzag or right-angled pipes tend to slow down fluid flow.

[0064] According to a preferred embodiment, a transition section 12 with a predetermined curvature can be embedded in channels formed on both end faces of the test substrate 10. Specifically, the transition section 12 can be a flexible hose or a rigid tube. In particular, the transition section 12 can be made of materials such as aluminum, copper, plastic, or rubber. Further, the transition sections 12 between adjacent cooling sections 11 can be detachably connected. For example, the transition sections 12 between adjacent cooling sections 11 can be connected by a connector 13. Specifically, the connector 13 can be in the form of a male and female connector.

[0065] According to a preferred embodiment, based on the temperature detection data of the test substrate 10 and the bipolar transistors carried thereon obtained by the temperature sensor and humidity sensor, the technician can controllably adjust the power of the power equipment (such as a water pump) through the control unit to control process parameters such as the flow rate and / or velocity of the cooling fluid in each cooling section 11.

[0066] According to a preferred embodiment, the housing described in this invention can be used to house and protect the aforementioned power supply unit, measuring unit, control unit, clamping unit, and cooling unit. Specifically, the housing can be made of a durable insulating material, such as plastic or metal. Furthermore, the housing can be a sealed structure to prevent contamination of the internal components.

[0067] According to a preferred embodiment, the testing apparatus provided by the present invention may further include one or more pressure testing units. The pressure testing units are configured to apply mechanical pressure to the bipolar transistor during testing. Specifically, the pressure testing unit may be a pneumatic press or a hydraulic press, which can be used to test the mechanical durability and reliability of the bipolar transistor. Furthermore, the pressure testing unit may be controlled by a microcontroller of a control unit, and the test results may be displayed on a user interface.

[0068] According to a preferred embodiment, the testing apparatus of the present invention may have a database for storing and retrieving test results of electrical performance parameters of bipolar transistors. Specifically, the database may be a local database stored in a control unit or a remote database accessed via a communication interface. Based on the database, test results of different bipolar transistors can be easily referenced and compared, and can be organized and searched using various criteria such as type, model, manufacturer, and test parameters.

[0069] Furthermore, the testing apparatus of the present invention may also include at least one communication interface capable of interacting with external devices. The testing apparatus can communicate with at least one external device through the communication interface to transmit and receive test results and control commands. Specifically, the communication interface may be a wired interface (such as USB or Ethernet) or a wireless interface (such as Bluetooth or Wi-Fi). The communication interface can remotely control and monitor the testing process and integrate with other testing systems. For example, the communication interface can be used to transmit test results to terminal devices such as computers or smartphones for further analysis and reporting, or to receive control commands from testing software or a testing supervisor. In addition, the testing apparatus of the present invention can also communicate with at least one external network through a network adapter. The network adapter can communicate with a communication bus.

[0070] According to a preferred embodiment, the testing apparatus provided by this invention can also be used to test other types of electronic components, such as diodes, resistors, capacitors, and inductors. Specifically, the power supply unit, measurement unit, and control unit can be adapted to the testing requirements of different electronic components. The test fixture can be modified to accommodate and electrically connect different electronic components. The database and communication interface can also be used to store and retrieve test results and control commands for different components.

[0071] The testing apparatus provided by this invention offers a rapid and reliable means of testing the electrical performance parameters of bipolar transistors (BPTs). Specifically, a microcontroller and a user interface are deployed in the control unit, allowing for precise control of the testing process and easy display of test results. Considering the influence of factors such as temperature and humidity on the electrical performance of BPTs, the addition of a cooling component ensures stable testing conditions during BPT testing. The test fixture provides a safe and reliable electrical connection between the BPT and the power supply and measurement units. A protective housing protects the internal components of the instrument from damage and contamination. Optional database and communication interfaces facilitate the storage and retrieval of test results, and enable remote control and integration with other testing systems.

[0072] Based on the testing apparatus for the electrical performance parameters of bipolar transistors provided by the present invention, the present invention also preferably provides a method for testing the electrical performance parameters of bipolar transistors, which may include the following steps:

[0073] One or more bipolar transistors to be tested are mechanically and electrically coupled to the clamping unit.

[0074] Set the test parameters to provide test input signals to one or more bipolar transistors under test.

[0075] Obtain test feedback signals from one or more bipolar transistors based on the test input signal.

[0076] Determine at least one electrical performance parameter of a bipolar transistor based on test feedback signals from one or more bipolar transistors.

[0077] Specifically, the testing method provided by this invention may be:

[0078] Step 1: Connect the bipolar transistor to the test fixture and establish electrical and / or mechanical connections with the power supply unit and measurement unit.

[0079] Step 2: Set one or more test parameters related to the electrical performance parameters to be tested through the control unit.

[0080] Step 3: Activate the power supply unit and measurement unit.

[0081] Step 4: Use a measurement unit to measure one or more electrical performance parameters of the bipolar transistor.

[0082] Step 5: Determine, store, and display one or more measured electrical performance parameters through the control unit.

[0083] According to a preferred embodiment, the method for testing the electrical performance parameters of a bipolar transistor provided by the present invention may further include step six: storing one or more measured electrical performance parameters in an offline / cloud database.

[0084] According to a preferred embodiment, the method for testing the electrical performance parameters of a bipolar transistor provided by the present invention may further include step seven: disconnecting the bipolar transistor that has completed the test from the test fixture and connecting at least one other bipolar transistor to continue the test.

[0085] According to a preferred embodiment, the method for testing the electrical performance parameters of a bipolar transistor provided by the present invention may further include step eight: providing a circulating cooling fluid to the test fixture 10 carrying the bipolar transistor through one or more cooling sections 11 contained in the test fixture 10. In particular, given the structural characteristics of the cooling sections 11 mentioned above, excess heat can be uniformly dissipated during the testing of the bipolar transistor to maintain a constant and uniform test temperature on the test platform.

[0086] According to a preferred embodiment, in step one, the bipolar transistor is connected to a test fixture. Probes of the test fixture can be inserted into the appropriate terminals of the bipolar transistor. Connectors can be connected to the power supply unit and the measurement unit. The test fixture securely holds the bipolar transistor and electrically connects it to the power supply unit and the measurement unit.

[0087] According to a preferred embodiment, in step two, the required test parameters are set using the control unit. Specifically, the user can input one or more test parameters, such as voltage level, current range, and frequency, using the human-machine interface of the control unit. The microcontroller of the control unit can accordingly set and / or adjust the operating states of the power supply unit and the measurement unit.

[0088] According to a preferred embodiment, in step three, the power supply unit is configured to provide a test voltage source to the bipolar transistor under test. The measurement unit is configured to receive a test feedback signal output by the bipolar transistor.

[0089] According to a preferred embodiment, in step four, the measurement unit measures the electrical performance parameters of the bipolar transistor based on the feedback output signal of the bipolar transistor. Specifically, the multimeter in the measurement unit can be used to measure the current and voltage of the bipolar transistor. The oscilloscope in the measurement unit can be used to measure the waveform and frequency of the electrical signals in the bipolar transistor.

[0090] According to a preferred embodiment, in step five, the microcontroller of the control unit can retrieve the measured electrical performance parameters from the measurement unit and display them on the user interface. Furthermore, the user can view the test results of the electrical performance parameters of different bipolar transistors on the user interface's display screen or touchscreen.

[0091] According to a preferred embodiment, in step six, the user can choose to save the test results to a local database or a cloud database using the user interface of the control unit. Specifically, the test results for bipolar transistors can be organized and searched using various criteria, such as type, model, manufacturer, and test parameters.

[0092] According to a preferred embodiment, in step seven, the connector of the test fixture is separated from the power supply unit and the measurement unit, and the probe is removed from the terminals of the bipolar transistor. The test fixture releases the bipolar transistor, and the test process ends.

[0093] A specific example of the method for testing the electrical performance parameters of bipolar transistors according to the present invention can be used to test a batch of bipolar transistors for amplifier circuits. Specifically, the power supply unit is configured to provide a 15V voltage to the bipolar transistor under test via a control unit. The measurement unit is configured to measure the current and voltage of the bipolar transistor. The control unit is configured to display the test results on a display screen or touch screen. The user connects the bipolar transistor to the test fixture and starts the power supply unit and the measurement unit. The measurement unit measures the current and voltage of the bipolar transistor, and the control unit displays the test results on the display screen. The user can view the test results and compare them with the specifications of the amplifier circuit. If the test results meet the specifications, the user can store them in a database for future reference. If the test results do not meet the specifications, the user can discard the bipolar transistors and repeat the testing process with a new batch.

[0094] It should be understood that the present invention is not limited to the specific examples described above, and various modifications and variations can be made without departing from the scope and spirit of the invention. For example, the device can be made portable by using a battery as a power unit, and can be made more robust by using a weather-resistant and shock-resistant protective housing. The device can also be modularized to facilitate maintenance and upgrades of individual components. The device can be used in a variety of applications, including but not limited to research and development, manufacturing, quality control, and field testing of electronic circuits and devices.

[0095] Furthermore, those skilled in the art will understand that the various exemplary embodiments described in this invention can be implemented by software or by combining software with necessary hardware. Therefore, specific embodiments of the present invention can be embodied in the form of a software product, which can be stored on a non-volatile storage medium or a non-transitory computer-readable storage medium (such as a CD-ROM, USB flash drive, portable hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, mobile terminal, or network device, etc.) to execute the test method according to the present invention.

[0096] In exemplary embodiments, the program product of the present invention can employ any combination of one or more readable media. A readable medium can be a readable signal medium or a readable storage medium. A readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media include, but are not limited to: electrical connections having one or more wires, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0097] Accordingly, based on the same inventive concept, the present invention also provides an electronic device.

[0098] In an exemplary embodiment, the electronic device is manifested as a general-purpose computing device. Components of the electronic device may include, but are not limited to, at least one processor, at least one memory, and a bus connecting different system components (including the memory and the processor).

[0099] Specifically, the memory stores program code that can be executed by a processor to perform the test method described in this invention. The memory may include readable media in the form of volatile memory cells, such as random access memory (RAM) and / or cache memory cells, and may further include read-only memory cells (ROM).

[0100] The memory of the present invention may also include a program / utility having a set (at least one) of program modules, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0101] It should be noted that the specific embodiments described above are exemplary. Those skilled in the art can devise various solutions inspired by the disclosure of this invention, and these solutions all fall within the scope of this invention and its protection. Those skilled in the art should understand that this specification and its accompanying drawings are illustrative and not intended to limit the scope of the claims. The scope of protection of this invention is defined by the claims and their equivalents. This specification contains multiple inventive concepts; terms such as "preferredly," "according to a preferred embodiment," or "optionally" indicate that the corresponding paragraph discloses an independent concept. The applicant reserves the right to file divisional applications based on each inventive concept.

Claims

1. An apparatus for testing the electrical performance parameters of a bipolar transistor, characterized in that, include: The clamping unit includes a test clamp (10) for operatively mechanically and electrically coupling one or more bipolar transistors to be tested; The power supply unit is used to provide test input signals for testing bipolar transistors; A measurement unit is used to receive test feedback signals from a bipolar transistor and determine at least one electrical performance parameter of the bipolar transistor. A control unit is electrically connected to the power supply unit and the measurement unit in a manner that allows controllable adjustment of the power supply unit and the measurement unit, and is at least used to acquire at least one electrical performance parameter related to the bipolar transistor under test from the measurement unit. One or more environmental sensors are configured to acquire temperature information related to the testing of at least one electrical performance parameter of a bipolar transistor. in, The test fixture (10) has a fluid cavity formed by one or more flow guide holes (100) extending along its length from its side end face, and the fluid cavity is provided with at least one cooling section (11) extending in an equal or unequal spiral manner. The cooling section (11) is symmetrically arranged in the corresponding fluid cavity such that the forming gap at both ends is larger than the forming gap in the middle, and the fluid pipe diameter at both ends is smaller than the fluid pipe diameter in the middle. The forming gap of the cooling section (11) varies due to the change in its distance from the corresponding flow guide hole (100), and the forming gap in the middle of the cooling section (11) can cause the cooling fluid to form turbulence, so as to uniformly reduce the heat generated on the test fixture (10). The cooling sections (11) arranged in each fluid cavity can fluidly connect the physically separated fluid cavities in a head-to-tail manner. The cooling sections (11) arranged in adjacent fluid cavities are detachably connected by transition sections (12) with a predetermined curvature to form a circulation loop that allows the cooling medium to circulate. The transition section (12) is also used to fasten the cooling section (11) to prevent the cooling section (11) from sliding in the fluid cavity. The control unit controls the flow rate and / or velocity of the cooling medium in the cooling section (11) based on the temperature information obtained by the environmental sensor.

2. The apparatus according to claim 1, characterized in that, The cooling sections (11) in adjacent fluid chambers can be arranged in such a way that the cooling media therein have the same or opposite flow directions.

3. The apparatus according to claim 1, characterized in that, The cooling section (11) in the fluid cavity is arranged in an unequal spiral pattern with varying gaps.

4. A test method using the apparatus for testing the electrical performance parameters of a bipolar transistor as described in any one of claims 1 to 3, characterized in that, include: One or more bipolar transistors to be tested are mechanically and electrically coupled to the test fixture (10). Set test parameters to provide test input signals to one or more bipolar transistors under test; Obtain the test feedback signal output by the bipolar transistor based on the test input signal; Determine at least one electrical performance parameter of the bipolar transistor based on the test feedback signal; in, The test fixture (10) has a fluid cavity formed by one or more flow guide holes (100) extending along its length from its side end face, and at least one cooling section (11) extending in an equal or unequal spiral manner is arranged in the fluid cavity. The cooling section (11) is symmetrically arranged in the corresponding fluid cavity such that the gap between its two ends is larger than the gap in its middle, so as to uniformly reduce the heat generated on the test fixture (10). The cooling sections (11) arranged in adjacent fluid cavities are detachably connected by a transition section (12) with a predetermined curvature to form a circulation loop that allows the cooling medium to circulate. The transition section (12) is also used to fasten the cooling sections (11) to prevent the cooling sections (11) from sliding in the fluid cavity.

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