Substrate transport module and semiconductor manufacturing apparatus provided with same

Abstract

Embodiments of the present application provide a substrate transport module and a semiconductor manufacturing apparatus having the same, which provide a clean environment in order to prevent particles from being transferred to a substrate. A substrate transport module of a semiconductor manufacturing apparatus according to an embodiment of the present application includes a transport chamber providing a transfer space of a substrate and having a groove portion formed at a certain height from a bottom surface to form a gap with respect to the bottom surface, a guide rail member disposed inside the transport chamber, and a substrate transfer robot moving along the guide rail member and transporting the substrate.

Description

Technical Field

[0001] The present invention relates to a substrate transport module for maintaining a clean environment and semiconductor manufacturing equipment having the same. Background Technology

[0002] Semiconductor (or display) manufacturing processes are processes used to manufacture semiconductor devices on a substrate (e.g., a wafer), including processes such as exposure, evaporation, etching, ion implantation, and cleaning. To perform each manufacturing process, semiconductor manufacturing equipment is installed in a cleanroom within a semiconductor manufacturing plant to execute the respective processes, and the substrates fed into the semiconductor manufacturing equipment undergo process treatment.

[0003] Typically, semiconductor manufacturing equipment includes a process processing module for process handling and a substrate transport module for transferring substrates from the process processing module and removing the processed substrates from the process processing module.

[0004] On the other hand, as semiconductor manufacturing processes become more refined, the management of foreign matter (particles) that may affect the input-output ratio of the substrate is becoming more sophisticated, and the requirements for a clean environment inside semiconductor manufacturing equipment are also increasing. It is important not only to maintain a clean environment for the substrate within the process handling modules, but also to maintain a clean environment in the substrate transport modules to prevent particles from being transferred to the substrate. Summary of the Invention

[0005] Therefore, embodiments of the present invention provide a substrate transport module that provides a clean environment to prevent particles from being transferred to the substrate, and semiconductor manufacturing equipment having the same.

[0006] The problems solved by the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other problems not mentioned from the following description.

[0007] According to an embodiment of the present invention, a substrate transport module of a semiconductor manufacturing apparatus includes: a transport chamber providing a transport space for the substrate and having a cavity portion that descends a certain height from the bottom surface and forms a gap relative to the bottom surface; a chassis disposed at the upper end of the bottom surface; a guide rail component disposed at the upper end of the chassis; and a substrate transport robot that moves along the guide rail component and transports the substrate.

[0008] According to an embodiment of the present invention, a plurality of through holes may be formed in the region corresponding to the cavity in the chassis.

[0009] According to an embodiment of the present invention, the cavity portion may include: a cavity center portion formed in the central region of the bottom surface; and a plurality of cavity pattern portions protruding from both sides of the cavity center portion.

[0010] According to an embodiment of the present invention, fastening openings may be formed on the chassis and the bottom surface in the region between the cavity pattern portions, and the chassis may be fixedly disposed on the bottom surface by fastening members coupled to the fastening openings on the bottom surface.

[0011] According to an embodiment of the present invention, at least one opening may be formed in the cavity portion.

[0012] According to an embodiment of the present invention, the opening may be connected to an exhaust pipe that discharges air from the inside of the delivery chamber to the outside.

[0013] According to an embodiment of the present invention, particles trapped in the space between the chassis and the cavity can be discharged to the outside by applying vacuum pressure to the discharge pipe.

[0014] Alternatively, the substrate transport module of a semiconductor manufacturing apparatus according to another embodiment of the present invention may include: a transport chamber providing a transport space for the substrate; a chassis having a mounting portion fixedly mounted on the bottom surface of the transport chamber and a groove portion that rises a certain height from the mounting portion and forms a gap with respect to the mounting portion; a guide rail component disposed at the upper end of the chassis; and a substrate transport robot that moves along the guide rail component and transports the substrate.

[0015] According to an embodiment of the present invention, a plurality of through holes may be formed in the groove portion of the chassis.

[0016] According to an embodiment of the present invention, the groove portion may include: a groove center portion formed in the central region of the bottom surface; and a plurality of groove pattern portions protruding from both sides of the groove center portion.

[0017] According to an embodiment of the present invention, fastening openings may be formed on the bottom surface and the setting portion in the area between the plate groove pattern portions, and the chassis may be fixedly disposed on the bottom surface by fastening members coupled to the fastening openings.

[0018] According to an embodiment of the present invention, at least one opening may be formed in the area corresponding to the groove portion on the bottom surface of the conveying chamber.

[0019] According to an embodiment of the present invention, the groove portion may include: a cavity center portion formed at the center of the bottom surface; and a plurality of cavity pattern portions protruding from both sides of the cavity center portion.

[0020] According to an embodiment of the present invention, fastening openings may be formed on the bottom surface and the setting portion in the area between the plate groove pattern portions, and the chassis may be fixedly disposed on the bottom surface by fastening members coupled to the fastening openings.

[0021] According to an embodiment of the present invention, at least one opening may be formed in the area corresponding to the groove portion on the bottom surface of the conveying chamber.

[0022] According to an embodiment of the present invention, the opening on the bottom surface may be connected to an exhaust pipe that discharges air from the inside of the conveying chamber to the outside.

[0023] According to an embodiment of the present invention, foreign matter trapped between the chassis and the bottom surface may be discharged to the outside by applying vacuum pressure to the discharge pipe.

[0024] A semiconductor manufacturing apparatus according to an embodiment of the present invention includes: a loading unit for receiving a cassette containing a substrate and for removing the substrate from the cassette or storing the substrate in the cassette; a process processing module for performing process processing on the substrate; and a substrate transport module for transporting the substrate between the loading unit and the process processing module. The substrate transport module includes: a transport chamber for providing transport space for the substrate and having a cavity portion that descends a certain height from a bottom surface to form a first interval relative to the bottom surface and has at least one opening; a chassis having a mounting portion fixedly mounted to the bottom surface of the transport chamber and a tray portion that rises a certain height from the mounting portion to form a second interval relative to the mounting portion; a guide rail component disposed at the upper end of the chassis; and a substrate transport robot that moves along the guide rail component and transports the substrate.

[0025] According to an embodiment of the present invention, a plurality of through holes may be formed in the groove portion of the chassis.

[0026] According to an embodiment of the present invention, the cavity portion may include: a cavity center portion formed in the center of the bottom surface; and a plurality of cavity pattern portions protruding from both sides of the cavity center portion; the plate groove portion may include: a plate groove center portion formed in the central region of the bottom surface; and a plurality of plate groove pattern portions protruding from both sides of the plate groove center portion.

[0027] According to an embodiment of the present invention, fastening openings may be formed on the bottom surface and the setting portion in the region between the cavity pattern portions, and the chassis may be fixedly disposed on the bottom surface by fastening members coupled to the fastening openings.

[0028] According to an embodiment of the present invention, at least one opening may be formed in the cavity portion.

[0029] According to an embodiment of the present invention, the opening may be connected to a discharge pipe that discharges air from the inside of the conveying chamber to the outside, and foreign matter trapped between the chassis and the bottom surface may be discharged to the outside by applying vacuum pressure to the discharge pipe.

[0030] According to the present invention, particles are collected and discharged into the space created by the gap between the bottom surface of the conveying chamber and the substrate, thereby preventing particles from being transferred from the substrate conveying module to the substrate.

[0031] The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description. Attached Figure Description

[0032] Figure 1 A schematic structure of a semiconductor manufacturing apparatus to which the present invention can be applied is shown.

[0033] Figure 2 as well as Figure 3 The structure of a substrate transport module according to a first embodiment of the present invention is shown.

[0034] Figure 4 The process of particles being discharged from a substrate conveying module according to a first embodiment of the present invention is shown.

[0035] Figure 5 The bottom structure of the transport chamber in the substrate transport module according to a first embodiment of the present invention is shown.

[0036] Figure 6a as well as Figure 6b The bottom surface of the transport chamber and the structure of the chassis in the substrate transport module according to a first embodiment of the present invention are shown.

[0037] Figure 7 The structure of a substrate transport module according to a second embodiment of the present invention is shown.

[0038] Figure 8 The process of particles being discharged from the substrate conveying module according to a second embodiment of the present invention is shown.

[0039] Figure 9a as well as Figure 9b The bottom surface of the transport chamber and the structure of the chassis in the substrate transport module according to a second embodiment of the present invention are shown.

[0040] Figure 10 The structure of a substrate transport module according to a third embodiment of the present invention is shown.

[0041] Figure 11 The process of particles being discharged from the substrate conveying module according to a third embodiment of the present invention is shown.

[0042] Figure 12a as well as Figure 12b The bottom surface of the transport chamber and the structure of the chassis in the substrate transport module according to a third embodiment of the present invention are shown.

[0043] Figure 13 This illustrates a substrate transport module with a ball screw structure.

[0044] (Explanation of reference numerals in the attached diagram)

[0045] 1: Semiconductor manufacturing equipment

[0046] 10: Loading Section

[0047] 12: Loading Port

[0048] 14: Index Section

[0049] 15: Load the interlocking room

[0050] 20: Processing Module

[0051] 30: Substrate transport module

[0052] 310: Delivery Chamber

[0053] 320: Chassis

[0054] 330: Guide rail components

[0055] 340: Substrate Transfer Robot

[0056] 350: Discharge pipe Detailed Implementation

[0057] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can readily implement it. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0058] For the purpose of clearly illustrating the invention, parts that are not related to the description have been omitted, and the same or similar components are marked with the same reference numerals throughout the specification.

[0059] Furthermore, in multiple embodiments, the same reference numerals are used for components with the same structure, and only representative embodiments are described. In other embodiments, only representative embodiments and other components are described.

[0060] In the specification as a whole, when it is stated that a certain part is "connected (or combined)" with other parts, it not only refers to "direct connection (or combination)" but also to "indirect connection (or combination)" through other components. Furthermore, when it is stated that a certain part "includes" a certain constituent element, unless otherwise stated otherwise, it means that other constituent elements may also be included, rather than excluding other constituent elements.

[0061] Unless otherwise defined, technical or scientific terms, including those commonly understood by one of ordinary knowledge in the art to which this invention pertains, shall have the same meaning as commonly understood by one of ordinary knowledge in the relevant technical context. Terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as they have in the relevant technical context, and shall not be ideally or excessively interpreted as having a formal meaning unless expressly defined in this application.

[0062] The following describes a substrate transport module according to the present invention for preventing particles from being transferred to the substrate and maintaining a clean environment, as well as a semiconductor manufacturing apparatus equipped with the same.

[0063] Figure 1 A general structure of a semiconductor manufacturing apparatus 1 to which the present invention can be applied is shown. The semiconductor manufacturing apparatus 1 to which the present invention can be applied serves as an apparatus for performing semiconductor processing processes such as etching, cleaning, coating, developing, and vapor deposition. The present invention is not limited to an apparatus for a specific process, but can also be applied to any type of equipment.

[0064] According to an embodiment of the present invention, a semiconductor manufacturing apparatus 1 includes: a loading unit 10 for receiving a cassette F containing a substrate and for removing the substrate from the cassette F or storing the substrate in the cassette F; a process processing module 20 for performing process processing on the substrate; and a substrate transport module 30 for transporting the substrate between the loading unit 10 and the process processing module 20.

[0065] The loading unit 10 includes: a loading port 12 for holding a cassette F containing substrates; and an indexing unit 14 for removing substrates from the cassette F placed at the loading port 12 or moving substrates that have undergone processing into the cassette F. Multiple loading ports 12 can be arranged outside the semiconductor manufacturing equipment 1 along a specific direction (e.g., the Y-axis direction), and the doors of the cassette F can be opened after the cassette F is placed and transported via OHT (overhead hoist transport). The indexing unit 14 can be arranged adjacent to the loading port 12. The indexing unit 14 may include: a cable guide rail component 142 arranged along the arrangement direction (Y-axis) of the loading ports 12; and an indexing robot 144 that moves along the cable guide rail component 142 and transfers substrates. The indexing robot 144 can retrieve substrates from the cassette F and transfer them to a loading interlock chamber 15 for temporary substrate storage, or retrieve substrates temporarily stored in the loading interlock chamber 15 and transfer them to the interior of the cassette F.

[0066] The process processing module 20, as an apparatus for performing process processing on a substrate, may include one or more process processing chambers 200. Multiple process processing chambers 200 may be arranged along a specific direction (e.g., the X-direction). Each process processing chamber 200 may perform the same process or different processes. For example, some process processing chambers 200 may perform an etching process on the substrate, while the remaining process processing chambers 200 may perform a cleaning process on the etched substrate.

[0067] The substrate transport module 30 can be configured adjacent to the process processing module 20, and can collect substrates from the loading interlock chamber 15 and transport them to the process processing module 20, or transfer substrates that have completed processing from the process processing module 20 to the loading interlock chamber 15. The substrate transport module 30 may include: a guide rail component 330 configured along the direction (X direction) where the process processing chamber 200 is configured; and a substrate transport robot 340 that transports substrates while moving along the guide rail component 330.

[0068] The structure of the substrate transport module 30 according to the present invention will be described in detail. In the following description, the application of the present invention to the substrate transport module 30 of semiconductor manufacturing equipment 1 is illustrated by example, but the present invention can also be applied to any type of device for transporting substrates (e.g., indexing section 14).

[0069] In the case of a moving device such as a substrate transport robot 340, friction is generated due to the movement, and foreign matter (particles) may be generated due to the friction. Particles generated in the substrate transport module 30 may adhere to the substrate, and the particles may become a cause of reduced input-output ratio during the process. Therefore, the present invention provides a substrate transport module 30 that can collect and discharge particles generated during the transport of the substrate to the outside, thereby preventing particles from being transferred to the substrate and improving the cleanliness of the manufacturing process, and a semiconductor manufacturing apparatus 1 equipped with the same.

[0070] Figure 2 as well as Figure 3 The structure of a substrate transport module according to a first embodiment of the present invention is shown. Figure 2 This is a cross-sectional view showing the side portion of the substrate transport module 30. Figure 3 This is a perspective view showing the structure of the substrate transfer robot 340.

[0071] The substrate conveying module 30 according to a first embodiment of the present invention includes: a conveying chamber 310 providing a conveying space for the substrate and having a cavity 310B that descends a certain height from the bottom surface 310A and forms a gap G1 relative to the bottom surface 310A; a guide rail component 330 disposed inside the conveying chamber 310; and a substrate conveying robot 340 that moves along the guide rail component 330 and conveys the substrate. A chassis 320 may be disposed at the upper end of the bottom surface 310A of the conveying chamber 310, and the guide rail component 330 may be disposed at the upper end of the chassis 320.

[0072] According to the present invention, particles P generated due to the activity of the substrate transport robot 340 or other reasons are captured in the space formed by the gap G1 between the cavity 310B formed below the transport chamber 310 and the chassis 320. Therefore, it is possible to prevent particles P from adhering to the substrate in the substrate transport module 30, improve the cleanliness within the semiconductor manufacturing equipment 1, and thus prevent the reduction in process input-output ratio caused by particles P adhering to the substrate.

[0073] like Figure 1 As shown, the transport chamber 310 can be configured in a cuboid shape along the arrangement direction (X direction) of the process chamber 200, and provides space for the substrate transport robot 340 to move. Although not shown, a door for inserting a substrate into the process chamber 200 can be configured on the side wall of the transport chamber 310. According to an embodiment of the present invention, the lower part of the transport chamber 310 can be composed of a bottom surface 310A and a cavity portion 310B that descends from the bottom surface 310A by a certain distance G1.

[0074] The chassis 320 is fixed to the bottom surface 310A of the conveying chamber 310, and a pair of guide rail components 330 can be disposed above the chassis 320. The chassis 320 can be fixed to the bottom surface 310A by fastening components B (e.g., bolts). According to an embodiment of the present invention, a gap G1 can be formed between the chassis 320 and the cavity portion 310B, and particles P can be captured in the space formed by the gap G1.

[0075] The guide rail component 330 is disposed above the chassis 320 and provides a movement path for the substrate transfer robot 340. The guide rail component 330 may be provided in pairs on both sides along the X-axis direction.

[0076] like Figure 3As shown, the substrate transfer robot 340 moves and transfers substrates within the internal space of the transfer chamber 310. The substrate transfer robot 340 includes: a linear drive unit 342 configured to move along a guide rail member; a robotic arm unit 346, which is composed of an arm member that moves the substrate by rotating around multiple axes; an arm drive unit 344 that controls the operation of the robotic arm unit 346; and a robotic hand unit 348, which is attached to the robotic arm unit 346 and supports the substrate below.

[0077] According to this embodiment, in the chassis 320, a plurality of through holes 320C can be formed in the region corresponding to the cavity portion 310B. For example... Figure 2 As shown, multiple through holes 320C can be formed in the central region of the chassis 320. Particles P flow towards the through holes 320C, thus trapping the particles P in the space between the chassis 320 and the cavity 310B. Figure 4 As shown, particles P may be generated due to friction between the guide rail component 330 and the linear drive unit 342. Particles P can move along the through hole 320C formed in the chassis 320 to the space between the chassis 320 and the cavity 310B.

[0078] According to an embodiment of the present invention, the cavity portion 310B may include: a cavity center portion 310BA, formed in a central region below the transport chamber 310; and a plurality of cavity pattern portions 310BB, protruding from the side of the cavity center portion 310BA. Figure 6a as well as Figure 6b As shown, the cavity section 310B may include: a cavity center section 310BA, which is formed spaciously in the center below the transport chamber 310; and a cavity pattern section 310BB, which is composed of patterns with a certain interval on both sides of the cavity center section 310BA.

[0079] According to an embodiment of the present invention, in the region between the cavity pattern portions 310BB, fastening openings 310D and 320D are formed on the chassis 320 and the bottom surface 310A, respectively. The chassis 320 is fixedly disposed on the bottom surface 310A by fastening member B that is coupled to the fastening opening 310D of the bottom surface 310A. Figure 6a as well as Figure 6b As shown, fastening ports 310D and 320D are formed at a certain interval between the chassis 320 and the bottom surface 310A, and a cavity pattern portion 310BB is formed in order to create a wider particle trapping space between the fastening ports 310D and 320D.

[0080] According to an embodiment of the present invention, at least one opening 310C may be formed in the cavity portion 310A. For example... Figures 2 to 5As shown, at least one opening 310C is formed in the cavity 310A, and particles P that have accumulated in the space between the chassis 320 and the cavity 310A can flow out from the opening 310C.

[0081] According to an embodiment of the present invention, the opening 310C can be connected to a discharge pipe 350 that discharges air from the inside of the conveying chamber 310 to the outside. The discharge pipe 350 communicates with the opening 310C, and due to the pressure difference between the discharge pipe 350 and the inside of the conveying chamber 310, particles P can be discharged to the outside along with the air inside the conveying chamber 310. Due to the pressure difference between the discharge pipe 350 and the conveying chamber 310, a downward airflow is formed inside the conveying chamber 310. Because of this downward airflow, particles P can be collected in the space between the chassis 320 and the cavity portion 310B without scattering onto the substrate or other devices, and are discharged along the discharge pipe 350.

[0082] According to an embodiment of the present invention, particles P trapped in the space between the chassis 320 and the cavity 310A can be discharged to the outside by applying vacuum pressure to the discharge pipe 350. The vacuum pressure applied to the discharge pipe 350 creates a pressure difference between the discharge pipe 350 and the conveying chamber 310, resulting in a downward airflow within the conveying chamber 310. Particles P trapped in the space between the chassis 320 and the cavity 310A can be discharged to the outside by applying vacuum pressure to the discharge pipe 350.

[0083] The preceding section, as a first embodiment of the present invention, described a substrate transport module 30 in which a groove is formed on the bottom surface 310A of the transport chamber 310. Furthermore, as a second embodiment of the present invention, a groove can be formed on the lower surface of the chassis 320, thus forming a space between the chassis 320 and the bottom surface 310A of the transport chamber 310.

[0084] Figure 7 The structure of the substrate transport module 30 according to a second embodiment of the present invention is shown.

[0085] According to another embodiment of the present invention, the substrate transport module 30 of the semiconductor manufacturing equipment 1 includes: a transport chamber 310 providing a transport space for the substrate; a chassis 320 having a mounting portion 320A fixedly mounted on the bottom surface 310A of the transport chamber 310 and a groove portion 320B that rises a certain height from the mounting portion 320A and forms a gap G2 relative to the mounting portion 320A; a guide rail component 330 disposed at the upper end of the chassis 320; and a substrate transport robot 340 that moves along the guide rail component 330 and transports the substrate.

[0086] According to this embodiment, particles P generated by the activity of the substrate transport robot 340 or other reasons are captured in the space formed by the gap G2 between the tray groove 320B of the chassis 320 and the bottom surface 310A of the lower part of the transport chamber 310. Therefore, it is possible to prevent particles P from adhering to the substrate in the substrate transport module 30, thereby improving the cleanliness within the semiconductor manufacturing equipment 1 and preventing a decrease in the process input-output ratio caused by particles P adhering to the substrate.

[0087] like Figure 1 As shown, the transport chamber 310 can be configured in a cuboid shape along the configuration direction (X direction) of the process chamber 200, and provides space for the substrate transport robot 340 to move. Although not shown, a door for inserting the substrate into the process chamber 200 can be configured on the side wall of the transport chamber 310.

[0088] The chassis 320 is fixed to the bottom surface 310A of the conveying chamber 310, and a pair of guide rail components 330 can be provided above the chassis 320. The chassis 320 can be fixed to the bottom surface 310A by fastening components B (e.g., bolts). According to an embodiment of the present invention, a mounting portion 320A fixedly mounted to the bottom surface 310A of the conveying chamber 310 and a groove portion 320B formed at a distance G2 from the mounting portion 320A are formed in the lower part of the chassis 320. Therefore, a space is formed between the groove portion 320B of the chassis 320 and the bottom surface 310A of the conveying chamber 310 by the distance G2, and particles P can be captured in the corresponding space.

[0089] The guide rail component 330 is disposed above the chassis 320 and provides a movement path for the substrate transfer robot 340. The guide rail component 330 may be provided in pairs on both sides along the X-axis direction.

[0090] The substrate transfer robot 340 moves and transfers substrates within the internal space of the transfer chamber 310. The substrate transfer robot 340 includes: a linear drive unit 342 configured to move along a guide rail member; a robotic arm unit 346, which is composed of an arm member that moves the substrate by rotating around multiple axes; an arm drive unit 344 that controls the operation of the robotic arm unit 346; and a robotic hand unit 348, which is attached to the robotic arm unit 346 and supports the substrate below.

[0091] According to this embodiment, multiple through holes 320C can be formed in the groove portion 320B of the chassis 320. For example... Figure 7 , Figure 8 , Figure 9b As shown, multiple through holes 320C can be formed in the center of the chassis 320. Particles P flow into the through holes 320C and can be captured in the space between the groove portion 320B of the chassis 320 and the bottom surface 310A of the lower part of the conveying chamber 310. Figure 8 As shown, particles P may be generated due to friction between the guide rail component 330 and the linear drive unit 342. Particle P can move along the through hole 320C formed in the chassis 320 to the space between the disk groove 320B of the chassis 320 and the bottom surface 310A of the conveying chamber 310.

[0092] Figure 9a as well as Figure 9b The diagram illustrates the structure of the bottom surface 310A of the transport chamber 310 and the lower surface of the chassis 320 in a substrate transport module 30 according to a second embodiment of the present invention. According to an embodiment of the present invention, the tray portion 320B may include: a tray center portion 320BA, formed in the central region of the lower surface of the tray portion 320B; and a plurality of tray pattern portions 320BB, protruding from both sides of the tray center portion 320BA. For example... Figure 9a as well as Figure 9b As shown, the groove portion 320B may include: a groove center portion 320BA, which is formed spaciously in the center of the groove portion 320B; and a groove pattern portion 320BB, which is composed of patterns with a certain interval on both sides of the groove center portion 320BA.

[0093] According to an embodiment of the present invention, in the area between the plate groove pattern portion 320BB, fastening openings 310D and 320D are formed on the chassis 320 and the bottom surface 310A respectively, and the chassis 320 is fixedly disposed on the bottom surface 310A by fastening members B connected to the fastening openings 310D and 320D. Figure 9a as well as Figure 9b As shown, a fastening port 320D is formed at a certain interval on the chassis 320, and a plate groove pattern portion 320BB is formed in order to create a wider particle trapping space between the fastening ports 320D.

[0094] According to an embodiment of the present invention, at least one opening 310C may be formed on the bottom surface 310A of the transport chamber 310. For example... Figure 7 , Figure 8 , Figure 9a As shown, at least one opening 310C is formed on the bottom surface 310A of the conveying chamber 310, and particles P that are gathered in the space between the groove portion 320B of the chassis 320 and the bottom surface 310A of the conveying chamber 310 can flow out from the opening 310C.

[0095] According to an embodiment of the present invention, the opening 310C can be connected to a discharge pipe 350 that discharges air from the inside of the conveying chamber 310 to the outside. The discharge pipe 350 communicates with the opening 310C, and due to the internal pressure difference between the discharge pipe 350 and the conveying chamber 310, particles P can be discharged to the outside along with the air inside the conveying chamber 310. Due to the pressure difference between the discharge pipe 350 and the conveying chamber 310, a downward airflow is formed inside the conveying chamber 310. Because of this downward airflow, particles P can be collected in the space between the tray portion 320B and the bottom surface 310A without scattering onto the substrate or other devices, and are discharged along the discharge pipe 350.

[0096] According to an embodiment of the present invention, particles P trapped in the space between the chassis 320 and the cavity 310A can be discharged to the outside by applying vacuum pressure to the discharge pipe 350. The vacuum pressure applied to the discharge pipe 350 creates a pressure difference between the discharge pipe 350 and the conveying chamber 310, resulting in a downward airflow within the conveying chamber 310. Particles P trapped in the space between the tray 320B and the bottom surface 310A can also be discharged to the outside by applying vacuum pressure to the discharge pipe 350.

[0097] As a third embodiment of the present invention, a substrate conveying module 30 is described, in which grooves are formed on both the lower part of the conveying chamber 310 and the lower surface of the chassis 320 to collect and discharge particles P.

[0098] Figure 10 The structure of a substrate transport module 30 according to a third embodiment of the present invention is shown. The substrate transport module 30 according to this embodiment includes: a transport chamber 310 providing a transport space for the substrate and having a cavity portion 310B that descends a certain height from the bottom surface 310A and forms a first interval G1 relative to the bottom surface 310A; a chassis 320 having a mounting portion 320A fixedly mounted to the bottom surface 310A of the transport chamber 310 and a tray portion 320B that rises a certain height from the mounting portion 320A and forms a second interval G2 relative to the mounting portion 320A; a guide rail component 330 disposed at the upper end of the chassis 320; and a substrate transport robot 340 that moves along the guide rail component 330 and transports the substrate.

[0099] According to this embodiment, particles P generated by the activity of the substrate transport robot 340 or other reasons are captured in the space formed by the intervals G1 and G2 between the tray groove portion 320B of the chassis 320 and the cavity groove portion 310B of the transport chamber 310. Therefore, it is possible to prevent particles P from adhering to the substrate in the substrate transport module 30, thereby improving the cleanliness within the semiconductor manufacturing equipment 1 and preventing a decrease in the process input-output ratio caused by particles P adhering to the substrate.

[0100] like Figure 1 As shown, the transport chamber 310 can be configured in a cuboid shape along the configuration direction (X direction) of the process chamber 200, and provides space for the substrate transport robot 340 to move. Although not shown, a door for inserting the substrate into the process chamber 200 can be configured on the side wall of the transport chamber 310.

[0101] The chassis 320 is fixed to the bottom surface 310A of the conveying chamber 310, and a pair of guide rail components 330 can be provided above the chassis 320. The chassis 320 can be fixed to the bottom surface 310A by fastening components B (e.g., bolts).

[0102] According to one embodiment of the present invention, a cavity groove portion 310B is formed in the lower part of the conveying chamber 310, descending a certain height from the bottom surface 310A and forming a space interval G1. Additionally, a mounting portion 320A fixedly mounted to the bottom surface 310A of the conveying chamber 310 and a disc groove portion 320B rising a certain height from the mounting portion 320A and forming a space interval G2 are formed in the lower part of the chassis 320. Therefore, a space is formed between the disc groove portion 320B of the chassis 320 and the cavity groove portion 310B of the conveying chamber 310 through the spaces G1 and G2, allowing particles P to be captured in the corresponding space.

[0103] The guide rail component 330 is disposed above the chassis 320 and provides a movement path for the substrate transfer robot 340. The guide rail component 330 may be provided in pairs on both sides along the X-axis direction.

[0104] The substrate transfer robot 340 moves and transfers substrates within the internal space of the transfer chamber 310. The substrate transfer robot 340 includes: a linear drive unit 342 configured to move along a guide rail member; a robotic arm unit 346, which is composed of an arm member that moves the substrate by rotating around multiple axes; an arm drive unit 344 that controls the operation of the robotic arm unit 346; and a robotic hand unit 348, which is attached to the robotic arm unit 346 and supports the substrate below.

[0105] According to this embodiment, multiple through holes 320C can be formed in the groove portion 320B of the chassis 320. For example... Figures 10 to 11 As shown, multiple through holes 320C can be formed in the center of the chassis 320. Particles P flow into the through holes 320C and can be captured in the space between the disk groove portion 320B of the chassis 320 and the cavity groove portion 310B of the conveying chamber 310. Figure 11 As shown, particles P may be generated due to friction between the guide rail component 330 and the linear drive unit 342. Particle P can move along the through hole 320C formed in the disk groove portion 320B of the chassis 320 to the space between the disk groove portion 320B and the cavity portion 310B of the chassis 320.

[0106] Figure 12a The shape of the bottom surface 310A and the cavity portion 310B of the delivery chamber 310 is shown. Figure 12b The shapes of the mounting portion 320A and the groove portion 320B on the lower surface of the chassis 320 are shown. According to an embodiment of the present invention, the groove portion 310B may include a groove center portion 310BA formed in the central region of the bottom surface 310A and a plurality of groove pattern portions 310BB protruding from the side of the groove center portion 310BA, and the groove portion 320B may include a plate groove center portion 320BA formed in the central region of the lower surface and a plurality of plate groove pattern portions 320BB protruding from both sides of the plate groove center portion 320BA.

[0107] According to an embodiment of the present invention, fastening openings 310D and 320D are formed in the corresponding areas of the bottom surface 310A and the setting portion 320A between the cavity pattern portions 310BB, respectively. The chassis 320 can be fixedly disposed on the bottom surface 310A by fastening members B that are coupled to the fastening openings 310D and 320D. Figure 12a as well as Figure 12b As shown, fastening ports 310D and 320D can be formed at a certain interval between the bottom surface 310A of the conveying chamber 310 and the chassis 320. In order to form a wider particle collection space between the fastening ports 310D and 320D, plate groove pattern portion 320BB and cavity groove pattern portion 310BB can be formed.

[0108] According to an embodiment of the present invention, at least one opening 310C may be formed in the cavity portion 310B of the transport chamber 310. For example... Figure 10 as well as Figure 11 As shown, at least one opening 310C may be formed in the cavity section 310B of the conveying chamber 310, so that particles P accumulated in the space between the disc section 320B and the cavity section 310B of the chassis 320 can flow out from the opening 310C.

[0109] According to an embodiment of the present invention, the opening 310C can be connected to a discharge pipe 350 that discharges air from the inside of the conveying chamber 310 to the outside. The discharge pipe 350 communicates with the opening 310C, and due to the pressure difference between the discharge pipe 350 and the inside of the conveying chamber 310, particles P can be discharged to the outside along with the air inside the conveying chamber 310. Due to the pressure difference between the discharge pipe 350 and the conveying chamber 310, a downward airflow is formed inside the conveying chamber 310. Because of this downward airflow, particles P can be collected in the space between the tray portion 320B and the cavity portion 310B without scattering onto the substrate or other devices, and are discharged along the discharge pipe 350.

[0110] According to an embodiment of the present invention, particles P trapped in the space between the chassis 320 and the cavity 310A can be discharged to the outside by applying vacuum pressure to the discharge pipe 350. The vacuum pressure applied to the discharge pipe 350 creates a pressure difference between the discharge pipe 350 and the conveying chamber 310, resulting in a downward airflow within the conveying chamber 310. Particles P trapped in the space between the chassis 320 and the cavity 310A can be discharged to the outside by applying vacuum pressure to the discharge pipe 350.

[0111] On the other hand, the embodiments described above are for the purpose of describing the structure of a substrate transfer robot 340 with a linear drive unit using a linear motor and a robotic arm 346 composed of multi-joint arm components, and a substrate transfer module 30 including the same.

[0112] However, embodiments of the present invention are not limited thereto and can be applied to various types of substrate transfer robots 340. For example... Figure 13 As shown, the substrate transfer robot 340 may include: an X-axis ball screw member 343A and an X-axis guide rail member 330A, which move the X-axis linear drive unit 342A along the X-axis direction for the movement of the manipulator 348 in the X-axis direction; and a Y-axis ball screw member 343B and a Y-axis guide rail member 330B, which move the Y-axis linear drive unit 342B in the Y-axis direction for the movement of the manipulator 348 in the Y-axis direction. On the other hand, the manipulator 348 is coupled to a rotation axis 345 and rotates relative to the Y-axis linear drive unit 342B and is driven to move forward and backward, thereby transferring the substrate.

[0113] The X-axis linear drive unit 342A and the Y-axis linear drive unit 342B can move in the horizontal direction (X and Y directions) by rotating the X-axis ball screw member 343A and the Y-axis ball screw member 343B. Along with the rotation of the X-axis ball screw member 343A and the Y-axis ball screw member 343B, a large number of particles may be generated due to friction between the X-axis guide rail member 330A and the Y-axis guide rail member 330B. As explained above, a cavity portion 310B according to the invention can be formed on the bottom surface 310A to guide the particles to be discharged to the outside without scattering.

[0114] This embodiment and the accompanying drawings are merely illustrative of a portion of the technical concept included in this invention. It is obvious that variations and specific embodiments that can be readily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of this invention are all included within the scope of the claims of this invention.

[0115] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only to the appended claims, but also to all concepts that are equivalent or modified from the claims.

Claims

1. A substrate transport module, which is a substrate transport module for semiconductor manufacturing equipment, the substrate transport module comprising: The transport chamber provides a space for transporting the substrate and has a cavity section that descends a certain height from the bottom surface and forms a gap relative to the bottom surface; The guide rail component is disposed inside the conveying chamber; A substrate conveying robot moves along the guide rail component and transports the substrate. as well as The chassis is located at the upper end of the bottom surface. The guide rail component is located at the upper end of the chassis. The cavity includes: a cavity center portion, formed in the central region of the bottom surface; And multiple cavity pattern portions, protruding from both sides of the center portion of the cavity.

2. The substrate conveying module according to claim 1, wherein, Multiple through holes are formed in the area of ​​the chassis corresponding to the cavity.

3. The substrate conveying module according to claim 1, wherein, Fastening openings are formed on the chassis and the bottom surface in the area between the cavity pattern portions. The chassis is fixed to the bottom surface by fastening components that are connected to fastening ports on the bottom surface.

4. The substrate conveying module according to claim 1, wherein, At least one opening is formed in the cavity.

5. The substrate conveying module according to claim 4, wherein, The opening is connected to an exhaust pipe that discharges air from inside the delivery chamber to the outside.

6. The substrate conveying module according to claim 5, wherein, The particles trapped in the space between the chassis and the cavity are discharged to the outside by applying vacuum pressure to the discharge pipe.

7. A substrate transport module, which is a substrate transport module for semiconductor manufacturing equipment, the substrate transport module comprising: The transport chamber provides space for transporting the substrate; The chassis has a mounting portion fixedly installed on the bottom surface of the conveying chamber and a groove portion that rises a certain height from the mounting portion and forms a gap with respect to the mounting portion; The guide rail component is located at the upper end of the chassis; A substrate conveying robot moves along the guide rail component and transports the substrate. as well as The chassis is located at the upper end of the bottom surface. The groove portion includes: a groove center portion formed in the central region of the bottom surface; and a plurality of groove pattern portions protruding from both sides of the groove center portion.

8. The substrate conveying module according to claim 7, wherein, Multiple through holes are formed in the groove portion of the chassis.

9. The substrate conveying module according to claim 7, wherein, Fastening openings are formed on the bottom surface and the setting portion in the area between the plate groove pattern portions. The chassis is fixed to the bottom surface by fastening components that are connected to the fastening port.

10. The substrate conveying module according to claim 7, wherein, At least one opening is formed in the area corresponding to the groove portion on the bottom surface of the conveying chamber.

11. The substrate conveying module according to claim 10, wherein, The opening on the bottom surface is connected to an exhaust pipe that discharges air from the inside of the delivery chamber to the outside.

12. The substrate conveying module according to claim 11, wherein, Foreign matter trapped between the chassis and the bottom surface is discharged to the outside by applying vacuum pressure to the discharge pipe.

13. A semiconductor manufacturing apparatus, comprising: The loading section accommodates a box containing a substrate and removes the substrate from the box or stores the substrate in the box. The process processing module performs process processing on the substrate; as well as A substrate transport module transfers the substrate between the loading section and the process module. The substrate conveying module includes: A transport chamber provides a transport space for the substrate and has a cavity portion that descends a certain height from the bottom surface, forms a first interval relative to the bottom surface, and has at least one opening. The chassis has a mounting portion fixedly installed on the bottom surface of the conveying chamber and a groove portion that rises a certain height from the mounting portion and forms a second interval relative to the mounting portion; The guide rail component is located at the upper end of the chassis; A substrate transfer robot moves along the guide rail component and transports the substrate; and The cavity portion includes: a cavity center portion formed at the center of the bottom surface; and a plurality of cavity pattern portions protruding from both sides of the cavity center portion.

14. The semiconductor manufacturing apparatus according to claim 13, wherein, Multiple through holes are formed in the groove portion of the chassis.

15. The semiconductor manufacturing apparatus according to claim 13, wherein, The groove portion includes: a groove center portion formed in the central region of the bottom surface; and a plurality of groove pattern portions protruding from both sides of the groove center portion.

16. The semiconductor manufacturing apparatus according to claim 15, wherein, Fastening openings are formed on the bottom surface and the setting portion in the area between the cavity pattern portions. The chassis is fixed to the bottom surface by fastening components that are connected to the fastening port.

17. The semiconductor manufacturing apparatus according to claim 13, wherein, The opening is connected to an exhaust pipe that discharges air from inside the delivery chamber to the outside.

18. The semiconductor manufacturing apparatus according to claim 17, wherein, Foreign matter trapped between the chassis and the bottom surface is discharged to the outside by applying vacuum pressure to the discharge pipe.

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