A Small Dual-Polarized Patch Antenna with High Isolation and Its Application

Abstract

The present invention discloses a small-sized dual-polarized patch antenna with high isolation and its application, which includes a ground plane, a dielectric substrate, and a patch layer stacked in sequence. The patch layer includes a first patch and a second patch arranged at intervals. Both the first patch and the second patch are right-angled triangles. The first patch is provided with a first metallized via array, and the second patch is provided with a second metallized via array. The first metallized via array and the second metallized via array are perpendicular. By using the right-angled triangular first patch and second patch as the receiving and transmitting antennas and introducing a short-circuit structure, compared with the traditional patch antenna, the resonant size is smaller, only half of that of the conventional triangular patch. At the same time, the antenna area is reduced by more than 50% compared with the traditional square patch, realizing the miniaturization of the antenna. The perpendicular arrangement of the first metallized via array and the second metallized via array also makes the radiated polarizations orthogonal and the isolation good, up to -40 dB, which is suitable for the sensor antenna of smart home.

Description

Technical Field

[0001] The present invention belongs to the technical field of wireless communication, and relates to an antenna, specifically to a small dual-polarized patch antenna with high isolation and its applications. Background Art

[0002] As a device for transmitting and receiving electromagnetic waves, an antenna plays an important role in a wireless communication system. In recent years, to meet the needs of signal transmission and reception and the requirements of communication capacity, multi-antenna technologies have been widely applied in various wireless communication systems. Among them, dual-polarized antennas have become one of the key technologies in wireless communication because they can enable the antenna to work for reception and transmission simultaneously, enhance the quality and reliability of the wireless link, and reduce the situation of multipath fading.

[0003] The development trend of electronic products applying dual-polarized antennas tends to be compact and miniaturized. Therefore, the requirements for the miniaturization and high isolation of dual-polarized antennas are getting higher and higher. Researchers at home and abroad have done a lot of relevant research work. For example, the technical solution of adding an additional resonant structure between antenna elements is disclosed in the literature "Enhancing isolation between two closely spaced patch antennas using parasitic elements" (IEEE International Symposium on Antennas and Propagation & USNC / URSI National Radio Science Meeting. IEEE, 2015: 386-387. Qi H, Yin X, Zhao H, et al.). The field generated by this resonant structure cancels out the field generated by adjacent antenna elements, thereby achieving good isolation between antenna elements. However, using an additional resonant structure to achieve decoupling will lead to the complication of the overall antenna structure, resulting in an increase in its volume and cost.

[0004] The document "A novel slot-array defected ground structure for decoupling microstrip antenna array" (IEEE Transactions on Antennas and Propagation, 2020, 68 (10): 7027-7038. D. Gao, ZX Cao, S. D. Fu, X. Quan and P. Chen.) discloses a slot structure for decoupling microstrip antenna arrays. A long strip of slots is used to surround each antenna unit and load it on the floor. From the perspective of the current path, the slots in the floor cut off the original floor current path between the ports, and the floor current will bypass the slots and couple to the adjacent units. The floor current will attenuate more after a longer distance, thereby reducing the floor current coupling between antennas. However, this decoupling method is not suitable for applications such as sensors. The slot defect structure destroys the integrity of the floor and deteriorates the front-to-back ratio of the antenna. In addition, the energy leaked from the floor slots is also likely to affect the operation of other components in the system where the antenna is located, thereby limiting the application of the above antenna structure.

[0005] In view of this, it is necessary to further improve the dual-polarization antenna in the prior art. Summary of the invention

[0006] To this end, the present invention is to solve the above technical problems, thereby proposing a small dual-polarized patch antenna with high isolation, small size, simple feeding, easy integration, low production cost and its application.

[0007] In order to solve the above technical problems, the technical solution of the present invention is:

[0008] A first aspect of the present invention provides a small dual-polarized patch antenna with high isolation, which includes a floor, a dielectric substrate and a patch layer stacked in sequence, the patch layer includes a first patch and a second patch arranged at intervals, the first patch and the second patch are both right-angled triangles, a first metallized via array is arranged in the first patch and along a right-angled side of the first patch, a second metallized via array is arranged in the second patch and along a right-angled side of the second patch, and the first metallized via array is arranged vertically to the second metallized via array.

[0009] Preferably, the first patch includes a first right-angled side, a second right-angled side and a first hypotenuse connected in sequence, the second patch includes a third right-angled side, a fourth right-angled side and a second hypotenuse connected in sequence, the first right-angled side is spaced apart from and parallel to the third right-angled side, the first metallized via array is distributed along the second right-angled side, and the second metallized via array is distributed along the third right-angled side.

[0010] Alternatively, as a preference, the first patch includes a first right-angled side, a second right-angled side, and a first hypotenuse connected in sequence. The second patch includes a third right-angled side, a fourth right-angled side, and a second hypotenuse connected in sequence. The first hypotenuse and the second hypotenuse are spaced apart and arranged in parallel. The first metallized via array is distributed along the second right-angled side, and the second metallized via array is distributed along the third right-angled side.

[0011] As a preference, both the first patch and the second patch are isosceles right-angled triangles.

[0012] As a preference, the patch antenna further includes a first feeding unit and a second feeding unit. One end of the first feeding unit is connected to the ground plane, and the other end penetrates through the dielectric substrate and is connected to the first patch. One end of the second feeding unit is connected to the ground plane, and the other end penetrates through the dielectric substrate and is connected to the second patch.

[0013] As a preference, the first patch is connected to a radio frequency chip socket through a first microstrip feeder and a first pad connected in sequence. The second patch is connected to the radio frequency chip socket through a second microstrip feeder and a second pad connected in sequence.

[0014] As a preference, the thickness of the dielectric substrate is 0.01 - 0.1 times the vacuum wavelength.

[0015] As a preference, the first feeding unit includes a first conductor part and a second conductor part connected to each other. The first conductor part penetrates through the dielectric substrate and is connected to the first patch, and the second conductor part protrudes outside the ground plane. The second feeding unit includes a third conductor part and a fourth conductor part connected to each other. The third conductor part penetrates through the dielectric substrate and is connected to the second patch, and the fourth conductor part protrudes outside the ground plane. The ground plane is provided with ground plane through holes corresponding to the positions of the first conductor part and the third conductor part, and the diameters of the first conductor part and the third conductor part are smaller than the diameter of the ground plane through holes.

[0016] As a preference, the first metallized via array includes a plurality of first metallized vias spaced apart along the second right-angled side. One end of the first metallized via is connected to the ground plane, and the other end penetrates through the dielectric substrate and is connected to the first patch. The second metallized via array includes a plurality of second metallized vias spaced apart along the third right-angled side. One end of the second metallized via is connected to the ground plane, and the other end penetrates through the dielectric substrate and is connected to the first patch.

[0017] The second aspect of the present invention provides an application of the high isolation small dual-polarization patch antenna in a smart home sensor.

[0018] The above technical solution of the present invention has the following advantages compared with the prior art:

[0019] The high isolation small dual-polarized patch antenna provided by the present invention includes a ground plane, a dielectric substrate, and a patch layer stacked in sequence. The patch layer includes a first patch and a second patch arranged at intervals. Both the first patch and the second patch are right-angled triangles. Inside the first patch, a first metallized via array is distributed at intervals along one right-angled side of the first patch. Inside the second patch, a second metallized via array is distributed at intervals along one right-angled side of the second patch. The first metallized via array and the second metallized via array are perpendicularly arranged. By using the first patch and the second patch with the shape of right-angled triangles as the receiving and transmitting antennas respectively, and introducing the short-circuit structure of the metallized via array, working in the half-mode resonance state, compared with the traditional patch, the resonance size is smaller, only half of that of the conventional triangular patch. At the same time, the antenna area is reduced by more than 50% compared with the traditional square patch as the receiving and transmitting antenna, realizing the miniaturization of the antenna; by arranging the metallized via array on the right-angled side of the first patch and the second patch, and the first metallized via array and the second metallized via array are perpendicularly arranged, the radiated polarizations are orthogonal and the isolation is good, up to -40 dB, which is suitable for the sensor antenna of smart home. Description of the Drawings

[0020] In order to make the content of the present invention easier to be clearly understood, the following further details the present invention according to the specific embodiments of the present invention and in conjunction with the drawings, where

[0021] Figure 1 is the top view of the patch structure in the high isolation small dual-polarized patch antenna described in Embodiment 1 of the present invention;

[0022] Figure 2 is the cross-sectional schematic view of the patch structure in the high isolation small dual-polarized patch antenna described in Embodiment 1 of the present invention;

[0023] Figure 3 is the exploded schematic view of the patch structure in the high isolation small dual-polarized patch antenna described in Embodiment 1 of the present invention;

[0024] Figure 4 is the top view of the high isolation small dual-polarized patch antenna described in Embodiment 1 of the present invention;

[0025] Figure 5 is the top view of the patch structure in the high isolation small dual-polarized patch antenna described in Embodiment 2 of the present invention;

[0026] Figure 6 is the cross-sectional schematic view of the patch structure in the high isolation small dual-polarized patch antenna described in Embodiment 2 of the present invention;

[0027] Figure 7 It is an exploded view of the patch structure in the high-isolation small-sized dual-polarized patch antenna described in Embodiment 2 of the present invention;

[0028] Figure 8 It is a top view of the high-isolation small-sized dual-polarized patch antenna described in Embodiment 2 of the present invention;

[0029] Figure 9 It is a test chart of the reflection coefficient of the high-isolation small-sized dual-polarized patch antenna described in Embodiment 1 of the present invention;

[0030] Figure 10 It is a test chart of the isolation of the high-isolation small-sized dual-polarized patch antenna described in Embodiment 1 of the present invention;

[0031] Figure 11 It is a radiation pattern of the high-isolation small-sized dual-polarized patch antenna described in Embodiment 1 of the present invention;

[0032] Figure 12 It is a test chart of the reflection coefficient of the high-isolation small-sized dual-polarized patch antenna described in Embodiment 2 of the present invention;

[0033] Figure 13 It is a test chart of the isolation of the high-isolation small-sized dual-polarized patch antenna described in Embodiment 2 of the present invention;

[0034] Figure 14 It is a radiation pattern of the high-isolation small-sized dual-polarized patch antenna described in Embodiment 1 of the present invention.

[0035] In the figure, the reference numerals are represented as follows: 1 - floor; 2 - dielectric substrate; 3 - first patch; 301 - first right-angled side; 302 - second right-angled side; 303 - first hypotenuse; 4 - second patch; 401 - first right-angled side; 402 - second right-angled side; 403 - second hypotenuse; 5 - first metallized via array; 501 - first metallized via; 6 - second metallized via array; 601 - second metallized via; 7 - first feeding unit; 701 - first conductor part; 702 - second conductor part; 8 - second feeding unit; 801 - third conductor part; 802 - fourth conductor part; 9 - first microstrip feeder; 10 - first pad; 11 - RF chip socket; 12 - second microstrip feeder; 13 - second pad. Detailed implementation manners

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0037] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship when the product of the present invention is normally placed, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0038] The "first", "second", etc. in the present invention are only used for distinction in description and have no special meaning.

[0039] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set" and "installed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] Embodiment 1

[0041] This embodiment provides a small-sized dual-polarized patch antenna with high isolation. Please refer to Figure 1-4 , the dual-polarized patch antenna includes a ground plane 1, a dielectric substrate 2, and a patch layer stacked in sequence. The ground plane 1 is made of metal to form a metal ground plane layer. The dielectric substrate 2 is made of FR4 material, and the patch layer is also made of metal. Among them, the metal patch layer includes a first patch 3 and a second patch 4 arranged at intervals. Specifically, both the first patch 3 and the second patch 4 are in a right-angled triangle structure. Inside the first patch 3, a first metallized via array 5 is arranged along one right-angled side of the first patch 3. Inside the second patch 4, a second metallized via array 6 is arranged along one right-angled side of the second patch 4. Among them, the first metallized via array 5 is composed of at least one first metallized via 501, and the second metallized via array 6 is composed of at least one second metallized via 601.

[0042] Preferably, in this embodiment, the first metallized via array 5 is formed by arranging a plurality of first metallized vias 501 at intervals in a one-row and multi-column manner, and the second metallized via array 6 is formed by arranging a plurality of second metallized vias 601 at intervals in a one-row and multi-column manner. As shown in the figure, in this embodiment, the first metallized via array 5 is composed of 8 first metallized vias 501 arranged at intervals, and the second metallized via array 6 is composed of 8 second metallized vias 601 arranged at intervals. The arrangement direction of the 8 first metallized vias 501 is perpendicular to the arrangement direction of the 8 second metallized vias 601, forming a form in which the first metallized via array 5 and the second metallized via array 6 are orthogonally arranged. Of course, the number of the first metallized vias 501 and the second metallized vias 601 can be adjusted to other numbers according to actual needs. The first metallized vias 501 and the second metallized vias 601 can extend from one end of the right-angled side to the other end respectively, or only cover a part of the right-angled side area.

[0043] Preferably, in this embodiment, both the first patch 3 and the second patch 4 are isosceles right-angled triangle patch structures, and the thickness of the dielectric substrate 2 made of FR4 material is 0.01 - 0.1 times the vacuum wavelength. In this embodiment, it is preferably that the thickness of the dielectric substrate is 0.03 times the vacuum wavelength.

[0044] The small dual-polarized patch antenna with high isolation provided in this embodiment uses the first patch 3 and the second patch 4 in the shape of right-angled triangles as the receiving and transmitting antennas respectively. The first metallized via array 5 and the second metallized via array 6 are respectively arranged on the right-angled sides of the first patch 3 and the second patch 4, so that the radiation side length is 1 / 4 of the dielectric wavelength at the resonant frequency, while the side length of the traditional square patch antenna is 1 / 2 of the dielectric wavelength at the resonant frequency. Two right-angled triangle patches are used as the receiving and transmitting antennas respectively, and by introducing the short-circuit structure of the metallized via array, it works in the half-mode resonance state. Compared with the traditional rectangular patch, the resonance size is smaller, only half of that of the conventional triangular patch. At the same time, the overall area of the antenna is reduced by more than 50% compared with the traditional square patch used as the receiving and transmitting antenna, achieving the technical effect of antenna miniaturization. At the same time, the first metallized via array 5 and the second metallized via array 6 are arranged on the right-angled sides of the first patch 3 and the second patch 4, and the first metallized via array 5 and the second metallized via array 6 are perpendicularly arranged, so that the polarizations radiated by the two patches are orthogonal. The differential mode and common mode decoupling technology is used to adjust the resonant frequencies of the differential mode and common mode of the antenna element. When the two are equal, decoupling is achieved. At this time, the isolation of the two orthogonal short-circuit right-angled triangle patches is good. At the working frequency point, the isolation of the first patch 3 can reach -40 dB, and the isolation of the second patch 4 can reach -15 dB. The dual-polarized patch antenna provided in this embodiment has a small size and high isolation, and is suitable for the sensor antenna of smart home with relatively compact size.

[0045] Specifically, in this embodiment, as Figure 1 shown, the first patch 3 has an isosceles right triangle structure, including a first right-angled side 301, a second right-angled side 302, and a first hypotenuse 303 connected in sequence. The second patch 4 also has an isosceles right triangle structure. To distinguish it from the first patch 3, the second patch 4 includes a third right-angled side 401, a fourth right-angled side 402, and a second hypotenuse 403 connected in sequence. The first right-angled side 301 and the third right-angled side 401 are spaced apart and arranged in parallel, such that the first patch 3 and the second patch 4 are axisymmetric structures with respect to the midline between them. The first metallized via array 5 is distributed along the second right-angled side 302, and the second metallized via array 6 is distributed along the third right-angled side 401, so that the extending direction of the first metallized via array 5 is perpendicular to the extending direction of the second metallized via array 6, forming a form in which two sets of metallized via arrays are orthogonally arranged.

[0046] Among them, each first metallized via 501 in the first metallized via array 5 is connected to the ground plane 1 at one end and penetrates through the dielectric substrate 2 to be connected to the first patch 3 at the other end, forming a structure that conducts up and down. Each second metallized via 601 in the second metallized via array 6 is also connected to the ground plane 1 at one end and penetrates through the dielectric substrate 2 to be connected to the second patch 4 at the other end, forming a structure that conducts up and down.

[0047] The dual-polarized patch antenna provided in this embodiment further includes a first feeding unit 7 and a second feeding unit 8. The first feeding unit 7 and the second feeding unit 8 can use SMA (Small A Type) connectors. The first feeding unit 7 and the second feeding unit 8 can also use microstrip lines for feeding. In this embodiment, the first feeding unit 7 and the second feeding unit 8 use SMA connectors. Among them, one end of the first S feeding unit 7 is connected to the ground plane 1, and the other end penetrates through the dielectric substrate 2 to be connected to the first patch 3. One end of the second feeding unit 8 is connected to the ground plane 1, and the other end penetrates through the dielectric substrate 2 to be connected to the second patch 4. Please refer to Figure 2, in the dual-polarized patch antenna provided in this embodiment, the first feeding unit 7 and the feeding unit 8 have the same structure. For the convenience of distinguishing and describing, the first feeding unit 7 includes a first conductor part 701 and a second conductor part 702 connected to the side of the first conductor part 701 close to the floor 1. Among them, the first conductor part 701 penetrates through the dielectric substrate 2 and is connected to the first patch 3, and the second conductor part 702 protrudes from the surface of the floor 1 away from the first patch 3. Thus, the first conductor part 701 forms the inner conductor of the SMA connector, and the first conductor part 701 has a cylindrical structure and functions as a metal probe. To connect the first feeding unit 7 to the floor 1, the dielectric substrate 2, and the first patch 3, the floor 1 is provided with a floor through-hole, and the dielectric substrate 2 is also correspondingly provided with a through-hole penetrating through the dielectric substrate 2. The first conductor part 701 and the floor through-hole are concentric, and the diameter of the first conductor part 701 is smaller than the diameter of the floor through-hole. Such a setting prevents the short circuit between the first conductor part 701 and the floor 1. The second conductor part 702 protrudes outside the floor 1 and forms the outer conductor of the SMA connector, which is connected to the floor 1. One end of the first conductor part 701 away from the second conductor part 702 is connected to the first patch 3.

[0048] The second feeding unit 8 includes a third conductor part 801 and a fourth conductor part 802 connected to the side of the third conductor part 801 close to the floor 1. The third conductor part 801 penetrates through the dielectric substrate 2 and is connected to the second patch 4. The third conductor part 801 has a cylindrical structure and forms the inner conductor of the SMA connector (functioning as a metal probe). The fourth conductor part 802 protrudes from the side of the floor 1 away from the fourth patch 4 and forms the outer conductor of the SMA connector. The floor 2 is provided with a floor through-hole corresponding to the position of the third conductor part 801, and the dielectric substrate 2 is also correspondingly provided with a through-hole penetrating up and down. The third conductor part 801 and the floor through-hole are concentric, and the diameter of the third conductor part 801 is smaller than the diameter of the floor through-hole. In this way, the problem of short circuit between the third conductor part 801 and the floor 1 is prevented. The fourth conductor part 802 protrudes outside the floor 1 and is connected to the floor 1. One end of the third conductor part 801 away from the fourth conductor part 802 is connected to the second patch 4.

[0049] To form a complete antenna structure, in this embodiment, the first patch 3 is connected to a radio frequency chip socket 11 through a first microstrip feeder 9 and a first pad 10 connected in sequence, and the second patch 4 is connected to the radio frequency chip socket 11 through a second microstrip feeder 12 and a second pad 13 connected in sequence. Among them, the first patch 3 serves as the transmitting unit of the antenna, the second patch 4 serves as the receiving unit of the antenna, the first pad 10 serves as the transmitting-end pad of the radio frequency chip, and the second chip 13 serves as the receiving-end pad of the radio frequency chip, forming a dual-polarized antenna applicable to the sensor of smart home products.

[0050] Embodiment 2

[0051] As Figures 5-8As shown in the figure, this embodiment provides a small-sized dual-polarized patch antenna with high isolation. Its structure is basically the same as that of Embodiment 1, except for the positional relationship between the first patch 3 and the second patch 4. Specifically, both the first patch 3 and the second patch 4 are in an isosceles right triangle structure. The first patch 3 includes a first right-angled side 301, a second right-angled side 302, and a first hypotenuse 303 connected in sequence. The second patch 4 includes a third right-angled side 401, a fourth right-angled side 402, and a second hypotenuse 403 connected in sequence. Among them, the first hypotenuse 303 and the second hypotenuse 403 are arranged at intervals and in parallel. The distance between the first hypotenuse 303 and the second hypotenuse 403 is greater than 0.01 times the vacuum wavelength and less than the side length of the patch. The first patch 3 and the second patch 4 are symmetrically arranged along the midline of the interval between the first hypotenuse 303 and the second hypotenuse 403. And the first metallized via array 5 is distributed at intervals along the second right-angled side 302, and the second metallized via array 6 is distributed at intervals along the third right-angled side 401, so that the extension direction of the first metallized via array 5 is perpendicular to the extension direction of the second metallized via array 6.

[0052] This dual-polarized patch antenna has the characteristics of miniaturization and high isolation, and is suitable for use as an antenna for smart home product sensors.

[0053] Test example

[0054] 1. Test the reflection coefficients of the two excitation ports of the small-sized dual-polarized patch antenna with high isolation provided in Embodiment 1. The test results are as Figure 9 shown. It can be seen from the S11 and S22 curves in the figure that the operating frequencies of the first patch 3 and the second patch 4 are basically the same, and the center operating frequency is 5.8 GHz. The -10 dB bandwidth of the dual-polarized patch antenna provided in Embodiment 1 is 151 MHz (relative bandwidth is about 2.6%).

[0055] 2. Test the isolation of the two excitation ports of the small-sized dual-polarized patch antenna with high isolation provided in Embodiment 1. The test results are as Figure 10 shown. It can be seen from the S12 curve in the figure that the isolation between the first patch 3 (antenna receiving unit) and the second patch 4 (antenna transmitting unit) can reach -40 dB.

[0056] 3. Test the radiation pattern of the small-sized dual-polarized patch antenna with high isolation provided in Embodiment 1. The test results are as Figure 11 shown. It can be seen from the figure that the dual-polarized antenna formed by the first patch 3 (antenna receiving unit) and the second patch 4 (antenna transmitting unit) can well achieve signal coverage. The maximum gain of the second patch 4 (antenna transmitting unit) is 2.87 dBi, and the maximum gain of the first patch 3 (antenna receiving unit) is 2.22 dBi.

[0057] 4. Measure the reflection coefficients of the two excitation ports of the small dual-polarized patch antenna with high isolation provided in Test Example 2. The test results are as follows Figure 12 shown. It can be seen from the S11 and S22 curves in the figure that the operating frequencies of the first patch 3 and the second patch 4 are basically the same, and the center operating frequency is 5.8 GHz. The -10 dB bandwidth of the dual-polarized patch antenna provided in Example 2 is 120 MHz (relative bandwidth is approximately 2.06%).

[0058] 5. Measure the isolation of the two excitation ports of the small dual-polarized patch antenna with high isolation provided in Test Example 2. The test results are as follows Figure 13 shown. It can be seen from the S12 curve in the figure that the isolation between the first patch 3 (antenna receiving unit) and the second patch 4 (antenna transmitting unit) can reach -17 dB.

[0059] 6. Measure the radiation pattern of the small dual-polarized patch antenna with high isolation provided in Test Example 2. The test results are as follows Figure 14 shown. It can be seen from the figure that the dual-polarized antenna formed by the first patch 3 (antenna receiving unit) and the second patch 4 (antenna transmitting unit) can achieve good signal coverage. The maximum gain of the second patch 4 (antenna transmitting unit) is 1.58 dBi, and the maximum gain of the first patch 3 (antenna receiving unit) is 1.53 dBi.

[0060] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. A small dual-polarized patch antenna with high isolation, characterized in that, It includes a floor, a dielectric substrate, and a patch layer arranged in sequence and stacked. The patch layer includes a first patch and a second patch arranged at intervals. Both the first patch and the second patch are right-angled triangles. Inside the first patch, a first metallized via array is arranged along one right-angled side of the first patch. Inside the second patch, a second metallized via array is arranged along one right-angled side of the second patch. The first metallized via array and the second metallized via array are arranged perpendicular to each other; the first patch includes a first right-angled side, a second right-angled side, and a first hypotenuse connected in sequence. The second patch includes a third right-angled side, a fourth right-angled side, and a second hypotenuse connected in sequence. The first hypotenuse and the second hypotenuse are arranged at intervals and parallel to each other; the patch antenna further includes a first feeding unit and a second feeding unit. One end of the first feeding unit is connected to the floor, and the other end passes through the dielectric substrate and is connected to the first patch; one end of the second feeding unit is connected to the floor, and the other end passes through the dielectric substrate and is connected to the second patch; The first metallized via array includes a number of first metallized vias spaced along the second right-angled side. One end of the first metallized via is connected to the floor, and the other end passes through the dielectric substrate and is connected to the first patch; The second metallized via array includes a number of second metallized vias spaced along the third right-angled side. One end of the second metallized via is connected to the floor, and the other end passes through the dielectric substrate and is connected to the first patch.

2. The small-sized dual-polarized patch antenna with high isolation according to claim 1, characterized in that Both the first patch and the second patch are isosceles right-angled triangles.

3. The small dual-polarized patch antenna with high isolation according to claim 2, characterized in that, The first patch is connected to a radio frequency chip socket through a first microstrip feeder and a first pad connected in sequence. The second patch is connected to the radio frequency chip socket through a second microstrip feeder and a second pad connected in sequence.

4. The small dual-polarized patch antenna with high isolation according to claim 3, characterized in that, The thickness of the dielectric substrate is 0.01 - 0.1 times the vacuum wavelength.

5. The small dual-polarized patch antenna with high isolation according to claim 4, characterized in that The first feeding unit includes a first conductor part and a second conductor part connected to each other. The first conductor part passes through the dielectric substrate and is connected to the first patch. The second conductor part protrudes outside the floor; the second feeding unit includes a third conductor part and a fourth conductor part connected to each other. The third conductor part passes through the dielectric substrate and is connected to the second patch. The fourth conductor part protrudes outside the floor; the floor is provided with floor through holes corresponding to the positions of the first conductor part and the third conductor part. The diameters of the first conductor part and the third conductor part are smaller than the diameter of the floor through holes.

6. Application of a high isolation small dual-polarization patch antenna according to any one of claims 1 - 5 in a smart home sensor.

Images