Waterproof interface connection structure and electronic equipment

Abstract

The present application discloses a waterproof interface connection structure and electronic device, wherein the waterproof interface connection structure includes: a stretchable base layer, a stretchable conductor line, a first packaging layer, a flexible circuit board, and a second packaging layer; the stretchable conductor line is arranged on the stretchable base layer; the first packaging layer is laid on the stretchable base layer and the stretchable conductor line, and the first packaging layer is provided with a through hole; the flexible circuit board is arranged on the first packaging layer and is electrically connected to the stretchable conductor line via a contact pad; the second packaging layer is laid on the flexible circuit board and the first packaging layer, and is used to fix the flexible circuit board between the first packaging layer and the second packaging layer. By using a flexible circuit board to connect the stretchable conductor line and the signal acquisition device, no protrusions are generated on the second packaging layer, and the flexible circuit board is not easy to slide relative to the stretchable conductor line, so that the overall structure has stable waterproof performance.

Description

Technical Field

[0001] The present application relates to the field of motion sensing technology, and in particular to a waterproof interface connection structure and electronic equipment. Background Art

[0002] Stretchable flexible sensors have broad application prospects in wearable health monitoring devices, soft robotics, and electronic flexible skin. Typically, the flexible portion of a flexible sensor needs to be electrically connected to a PCB-based signal acquisition module for signal transmission. This means the flexible sensor requires an interface structure to achieve a hardware-software integration with the hardware.

[0003] like Figure 1 As shown, Figure 1 This is a side view of the interface structure of an existing flexible sensor. In the prior art, flexible sensors typically consist of a base layer, a stretchable sensing layer, and an encapsulation layer. The interface structure typically embeds one end of an electrode between the flexible sensor's encapsulation layer and the stretchable sensing layer, electrically connecting the stretchable sensing layer and the electrode. The other end of the electrode is then connected to a signal acquisition module, which then acquires the flexible sensor's electrical signal. However, because flexible sensors rely on their own deformation to detect strain, deformation at the flexible sensor interface can cause the relatively rigid electrode to slide relative to the stretchable sensing layer, resulting in poor contact.

[0004] And, as Figure 2 As stated, Figure 2 This is a front view schematic diagram of the interface structure of an existing flexible sensor. At the connection point between the electrode and the stretchable sensing layer, the thickness of the electrode itself causes the flexible sensor to produce a bulge in the area where the electrode is buried. When the flexible sensor is under pressure, the pressure is easily applied to the contact area between the electrode and the stretchable sensing layer because the above-mentioned bulge is applied to the stretchable sensing layer, causing damage to the stretchable sensing layer.

[0005] At the same time, due to the above reasons, when the flexible sensor is deformed by pressure, the waterproof performance of the existing interface structure will decrease, and there is a risk of water ingress. As the application scenarios of flexible sensors diversify, the usage scenarios they face are becoming more and more complicated; for example, applying a stretchable sensing layer to a wearable motion detection terminal needs to meet the working conditions required by various sports scenarios faced by users; for example, in the scenario of running, the stretchable sensing structure needs to maintain normal operation when it is soaked due to sweating by the wearer; in the scenario of swimming, it needs to be able to maintain normal operation under a certain water pressure; for example, on wearable smart clothing, the stretchable sensing structure needs to be able to be washed with the clothes through a washing machine without being damaged. However, since the interface structure of the existing technology cannot achieve waterproofness when the flexible sensor is deformed, it brings difficulties to the practical application of flexible sensors on wearable devices. Summary of the Invention

[0006] In view of this, the purpose of this application is to provide a waterproof interface connection structure and electronic equipment to solve the problem that the interface structure of the existing flexible sensor is prone to poor contact and damage when the flexible sensor is deformed by pressure, resulting in a decrease in waterproof performance.

[0007] To achieve the above technical objectives, the present application provides a first aspect of a waterproof interface connection structure, comprising:

[0008] a stretchable base layer;

[0009] a stretchable conductor circuit, wherein the stretchable conductor circuit is disposed on the stretchable base layer;

[0010] a first packaging layer, the first packaging layer being laid on the stretchable base layer and the stretchable conductor circuit, and being used to fix the stretchable conductor circuit on the stretchable base layer, and the first packaging layer being provided with a through hole;

[0011] a flexible circuit board, the flexible circuit board being disposed on the first packaging layer and provided with contact pads for electrically connecting to the stretchable conductor circuit, the contact pads being disposed corresponding to positions of the through holes;

[0012] The second packaging layer is laid on the flexible circuit board and the first packaging layer, and is used to fix the flexible circuit board between the first packaging layer and the second packaging layer.

[0013] Furthermore, the second packaging layer covers the top surface and side surfaces of the flexible circuit board and the first packaging layer.

[0014] Furthermore, the first packaging layer is a hot melt adhesive film.

[0015] Furthermore, the stretchable conductor circuit includes a plurality of;

[0016] The first packaging layer is provided with a plurality of through holes;

[0017] The flexible circuit board is provided with a plurality of contact pads;

[0018] The plurality of contact pads are arranged in a one-to-one correspondence with the plurality of through holes;

[0019] The flexible circuit board is electrically connected to each of the stretchable conductor circuits through the contact pads.

[0020] Furthermore, the size of the contact pad is larger than the outline size of the through hole so that the contact pad completely covers the through hole.

[0021] Furthermore, the rear end of the flexible circuit board extends out of the stretchable base layer, and a rigid reinforcement area is provided on the end;

[0022] The rigid reinforcement area is provided with a plurality of signal contacts for connecting with a signal acquisition device.

[0023] Furthermore, the front end of the flexible circuit board is provided with a plurality of protrusions extending outwards;

[0024] The contact pad is disposed on the protrusion.

[0025] Furthermore, the multiple protrusions of the flexible circuit board are staggered, so that the protruding lengths of two adjacent protrusions are different.

[0026] Furthermore, each of the protrusions is provided with a plurality of the contact pads;

[0027] The contact pads on the same protrusion are all electrically connected to the same stretchable conductor line.

[0028] Furthermore, the flexible circuit board is further provided with a connecting portion;

[0029] The connecting portion connects the protruding portions on the flexible circuit board.

[0030] Furthermore, a plurality of positioning holes are provided on the flexible circuit board.

[0031] Furthermore, it also includes:

[0032] The first protective layer is an elastic body with a honeycomb hollow structure and is laid on the second packaging layer and the first packaging layer.

[0033] Furthermore, it also includes:

[0034] an adhesive layer, the adhesive layer covering the first protective layer;

[0035] A second protective layer is covered on the first protective layer through the adhesive layer.

[0036] Furthermore, it also includes:

[0037] A conductive adhesive layer is provided between the contact pad and the stretchable conductor circuit, and is used to bond the contact pad to the stretchable conductor circuit.

[0038] Furthermore, the conductive adhesive layer is anisotropic conductive adhesive.

[0039] Furthermore, the upper surface and the lower surface of the flexible circuit board are both surface-treated to have uneven upper and lower surfaces, so that the connection between the flexible circuit board and the first packaging layer and the second packaging layer is more secure.

[0040] A second aspect of the present application provides an electronic device comprising any of the above described waterproof interface connection structures.

[0041] It can be seen from the above technical solution that the present application provides a waterproof interface connection structure and an electronic device, wherein the waterproof interface connection structure includes: a stretchable base layer, a plurality of stretchable conductor lines, a first packaging layer, a flexible circuit board and a second packaging layer; the plurality of stretchable conductor lines are all arranged on the stretchable base layer; the first packaging layer is laid on the stretchable base layer and the stretchable conductor line, and is used to fix the stretchable conductor line on the stretchable base layer, and the first packaging layer is provided with multiple through holes; the flexible circuit board is arranged on the first packaging layer, and is electrically connected to each of the stretchable conductor lines through a plurality of contact pads that extend into the through holes in a one-to-one correspondence; the second packaging layer is laid on the flexible circuit board and the first packaging layer, and is used to fix the flexible circuit board between the first packaging layer and the second packaging layer. By using a flexible circuit board to connect the stretchable conductor line and the signal acquisition device, no protrusions like the existing interface structure will be generated on the second packaging layer, thereby increasing the pressure-bearing capacity of the overall structure. The flexible circuit board is not easy to slide relative to the stretchable conductor line, which can avoid poor contact between the stretchable conductor line and the flexible circuit board, and thus the whole has stable waterproof performance, effectively solving the problem that the interface structure of the existing flexible sensor is prone to poor contact and damage when the flexible sensor is deformed by pressure, resulting in a decrease in waterproof performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0043] Figure 1 A side sectional view of the interface structure of the existing flexible sensor provided in this application;

[0044] Figure 2 A front cross-sectional view of the interface structure of the existing flexible sensor provided in this application;

[0045] Figure 3 A top view of the interface structure of the existing flexible sensor provided in this application after removing the packaging layer;

[0046] Figure 4 A front cross-sectional view of a waterproof interface connection structure provided in an embodiment of the present application;

[0047] Figure 5 A schematic diagram of a first packaging layer and its through-holes of a waterproof interface connection structure provided in an embodiment of the present application;

[0048] Figure 6 A top view of a waterproof interface connection structure provided in an embodiment of the present application after removing the second packaging layer;

[0049] Figure 7 A top view of a waterproof interface connection structure provided by another embodiment of the present application with the second packaging layer removed;

[0050] Figure 8 A schematic diagram of a flexible circuit board with a waterproof interface connection structure provided by another embodiment of the present application;

[0051] Figure 9 A schematic diagram of a flexible circuit board with a waterproof interface connection structure provided in another embodiment of the present application;

[0052] Figure 10 A schematic diagram of a flexible circuit board with a waterproof interface connection structure provided in a more specific embodiment of the present application;

[0053] Figure 11 A front cross-sectional view of a waterproof interface connection structure provided by one embodiment of the present application, taken along a protruding portion;

[0054] Figure 12 A front cross-sectional view of a waterproof interface connection structure provided by another embodiment of the present application, taken along a protruding portion;

[0055] Figure 13 A front cross-sectional view of a waterproof interface connection structure provided in another embodiment of the present application, taken along a protruding portion;

[0056] In the figure: 1. Bottom layer; 2. Stretchable sensing layer; 3. Encapsulation layer; 4. Electrode; 5. Protrusion; 6. Cavitation defect area; 10. Stretchable base layer; 20. Stretchable conductor line; 30. First encapsulation layer; 40. Flexible circuit board; 50. Second encapsulation layer; 60. First protective layer; 70. Adhesive layer; 80. Second protective layer; 90. Conductive adhesive layer; 31. Through hole; 41. Contact pad; 42. Rigid reinforcement area; 43. Protrusion; 44. Connecting part; 45. Positioning hole; 421. Signal contact. DETAILED DESCRIPTION

[0057] The following will clearly and completely describe the technical solutions of the embodiments of the present application in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection requested by this application.

[0058] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0059] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, replaceable connections, or integral connections. They can also refer to mechanical connections or electrical connections. They can also refer to direct connections or indirect connections through an intermediate medium. They can also refer to internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0060] See also Figure 4 and Figure 5In the first aspect provided in the embodiments of the present application, a waterproof interface connection structure is provided, comprising: a stretchable base layer 10, a stretchable conductor line 20, a first packaging layer 30, a flexible circuit board 40 and a second packaging layer 50. The stretchable base layer 10 is a flexible material having elasticity that allows deformation. The stretchable conductor line 20 is arranged on the stretchable base layer 10. The stretchable conductor line 20 also has the ability to deform, can follow the deformation of the stretchable base layer 10, and produce corresponding changes in electrical performance during deformation. Then, by measuring the changes in the electrical performance parameters of the stretchable conductor line 20, the overall deformation degree can be mapped.

[0061] A first encapsulation layer 30 is laid over the stretchable base layer 10 and the stretchable conductor tracks 20, covering both the stretchable base layer 10 and the stretchable conductor tracks 20 and securing the stretchable conductor tracks 20 to the stretchable base layer 10. The first encapsulation layer 30 is provided with through-holes 31. A flexible printed circuit board (FPCB) 40 is disposed over the first encapsulation layer 30 and is provided with contact pads 41 for electrical connection to the stretchable conductor tracks 20. The contact pads 41 correspond to the positions of the through-holes 31, and the FPCB 40 is electrically connected to each stretchable conductor track 20 via the contact pads 41 extending into the through-holes 31. A second encapsulation layer 50 is laid over the FPCB 40 and the first encapsulation layer 30 and secures the FPCB 40 between the first encapsulation layer 30 and the second encapsulation layer 50.

[0062] Specifically, a contact pad 41 is provided on the flexible circuit board 40 and is electrically connected to the flexible circuit board 40. A through hole 31 is provided on the first packaging layer 30 and is connected to the stretchable conductor track 20 within the first packaging layer 30. After aligning the contact pad 41 with the through hole 31, the contact pad 41 is fully or partially inserted into the through hole 31 and in contact with the stretchable conductor track 20 to achieve electrical connection between the stretchable conductor track 20 and the flexible circuit board 40. After the flexible circuit board 40 is electrically connected to the signal acquisition device, the electrical performance parameters of the stretchable conductor track 20 can be collected by the signal acquisition device. In this embodiment, the electrical performance parameter can be capacitance or resistance.

[0063] It should be noted that the number of stretchable conductor lines 20 can be one or more; in the case of multiple stretchable conductor lines 20, all of the stretchable conductor lines 20 are covered by the first encapsulation layer 30. Compared to the smaller contact area between the electrode 4 and the encapsulation layer 3 in the waterproof interface structure of the prior art, in this embodiment, by providing a flexible circuit board 40 to connect the stretchable conductor lines 20, on the one hand, the contact area between the flexible circuit board 40 and both the first encapsulation layer 30 and the second encapsulation layer 50 can be increased. On the other hand, in the case of multiple stretchable conductor lines 20, there is no need to use multiple different electrodes to connect the multiple stretchable conductive lines, thereby allowing the flexible circuit board 40 to be more firmly fixed to the first encapsulation layer 30, thereby reducing the risk of relative sliding between the flexible circuit board 40 and the stretchable conductor lines 20, resulting in poor contact and signal abnormalities. At the same time, because the flexible circuit board 40 is more firmly fixed, the overall waterproof performance is also improved and more stable.

[0064] In one embodiment, the first encapsulation layer 30 may be provided with a plurality of through-holes 31 corresponding to the plurality of stretchable conductive lines 20, and the flexible circuit board 40 may be provided with a plurality of contact pads 41. The plurality of contact pads 41 are provided in a one-to-one correspondence with the plurality of through-holes 31; the flexible circuit board 40 is electrically connected to each of the stretchable conductive lines 20 via the plurality of contact pads 41.

[0065] See also Figure 2 and Figure 3 In the interface structure of existing flexible sensors, the interface structure is not strong enough and the contact area between a single electrode 4 and the encapsulation layer 3 is small. When the stretchable sensing layer 2 is stretched or bent, or when the electrode 4 is pulled, the single electrode 4 will apply a large local pressure to the encapsulation layer 3 or the bottom layer 1. As a result, gaps are easily generated in the contact area between the electrode 4 and the encapsulation layer 3, resulting in poor contact. In the case where the stretchable sensing layer 2 is made of liquid metal, the liquid metal may also seep out of the gap at the interface structure, causing a short circuit between two adjacent electrodes 4.

[0066] In this embodiment, since the flexible circuit board 40 is a sheet-like structure as an integral whole, it does not have the protrusions 5 as in the electrode 4 in the prior art, which would cause the encapsulation layer 3 to be easily damaged when under pressure because the protrusions 5 squeeze the contact area between the stretchable sensing layer 2 and the electrode 4. Instead, the pressure can be dispersed to the entire flexible circuit board 40, thereby enhancing the pressure-bearing capacity of the waterproof interface connection structure of this embodiment.

[0067] Furthermore, in this embodiment, a first encapsulation layer 30 is disposed beneath the flexible circuit board 40. The flexible circuit board 40 only directly contacts the stretchable conductor track 20 at the contact pads 31, via the through-holes 31 in the first encapsulation layer 30. Therefore, the first encapsulation layer 30 separates the majority of the flexible circuit board 40 from the stretchable conductor track 20. Consequently, when the waterproof interface connection structure is subjected to pressure, most of the pressure applied to the flexible circuit board 40 is not directly transmitted to the stretchable conductor track 20. Instead, it is transferred to the first encapsulation layer 30, where it is absorbed and dispersed. This enhances the pressure-bearing capacity of the waterproof interface connection structure. When the flexible circuit board 40 is subjected to force, the force is dispersed across the stretchable conductor track 20, the first encapsulation layer 30, and the second encapsulation layer 50, making it less likely that gaps will form between the contact pads 41 and the stretchable conductor track 20.

[0068] Furthermore, since two packaging layers (a first packaging layer 30 and a second packaging layer 50) are provided in the area where the flexible circuit board 40 is connected to the stretchable conductor circuit 20, that is, near the contact pad 41, the Young's modulus of this area is larger than that of the area without two packaging layers, making this area less prone to deformation, thereby further improving the stability of the waterproof interface connection structure.

[0069] Also, see Figure 2 The interface structure of the existing flexible sensor uses only one packaging layer to hot-press the stretchable sensing layer 2 and the electrode 4. During the hot-pressing process, since both the electrode 4 and the stretchable sensing layer 2 have a certain thickness, a cavitation defect area 6 may appear near the stretchable sensing layer 2 where the packaging layer 3 and the bottom layer 1 are not bonded together. Due to the presence of the cavitation defect area 6, the connection strength between the packaging layer 3 and the bottom layer 1 is weakened. In addition, when the lines of two adjacent stretchable sensing layers 2 are made of liquid metal, the liquid metal is prone to leak into the cavitation defect area 6 and short-circuit with the adjacent lines.

[0070] Compared with the prior art method of encapsulating by only using one encapsulation layer 3 pressed onto the bottom layer 1, in this embodiment, a first encapsulation layer 30 is further provided between the flexible circuit board 40 and the stretchable base layer 10, and a second encapsulation layer 50 is further provided above the flexible circuit board 40 to press the flexible circuit board 40 and the first encapsulation layer 30 onto the stretchable base layer 10, so that the connection between the first encapsulation layer 30 and the stretchable base layer 10 is tighter, thereby avoiding the cavitation defect area 6 caused by the loose connection between the encapsulation layer 3 and the bottom layer 1 in the prior art, and also avoiding the generation of gaps between the bottom layer 1 and the encapsulation layer 3 when the waterproof interface connection structure is stretched or bent or the electrode is pulled by external force, thereby improving the durability and waterproof performance of the waterproof interface connection structure, so that it can meet the usage requirements of scenarios such as swimming or machine washing and cleaning.

[0071] In another embodiment, the second packaging layer 50 covers the top and side surfaces of the flexible circuit board 40 and the first packaging layer 30. Figure 4 As shown, the top surfaces of the flexible circuit board 40 and the first packaging layer 30 refer to the upper sides of the two.

[0072] Specifically, see Figure 4 and Figure 5 , with the stretchable base layer 10 as the bottom layer and the first encapsulation layer 30 located above the stretchable base layer 10, the second encapsulation layer 50 is pressed over the flexible circuit board 40 and the first encapsulation layer 30, and at the same time seals the side surfaces of the flexible circuit board 40 and the side surfaces of the first encapsulation layer 30, so that the first encapsulation layer 30 covers multiple seams between the flexible circuit board 40 and the first encapsulation layer 30, and between the first encapsulation layer 30 and the stretchable base layer 10, that is, the first encapsulation layer 30 covers multiple locations between the flexible circuit board 40 and the first encapsulation layer 30, and between the first encapsulation layer 30 and the stretchable base layer 10 where gaps are prone to appear, thereby significantly reducing the risk of water leakage in the waterproof interface structure and improving the overall waterproof performance.

[0073] In one embodiment, the first encapsulation layer 30 can be a hot melt adhesive film, so that the first encapsulation layer 30 is easily melted by heat during reprocessing, so that it can be better filled between the flexible circuit board 40 and the stretchable base layer 10, thereby avoiding the appearance of cavitation defect area 6, and can more firmly adhere the flexible circuit board 40 and the stretchable base layer 10 together, thereby further improving the overall stability and durability.

[0074] It should be noted that the stretchable conductor line 20 is made of stretchable conductor materials, including but not limited to liquid metal materials, conductive polymer materials, stretchable conductive silver paste materials, carbon nanomaterials, etc.

[0075] In this embodiment, the stretchable conductive circuit 20 comprises a flowable liquid metal material. Therefore, in addition to providing waterproofing, fixation, and protection, the first encapsulation layer 30 also serves to stabilize the shape of the stretchable conductive circuit 20. Changes in the electrical properties of the stretchable conductive circuit 20 can refer to changes in capacitance or resistance. In this embodiment, the stretchable conductive circuit 20 utilizes gallium-indium, gallium-tin, gallium-indium-tin, or gallium-zinc alloys as the stretchable conductive material. The advantages of using such liquid metal materials include excellent electrical conductivity, stretchability, and biosafety.

[0076] In a more specific embodiment, the stretchable conductor line 20 may be formed of a sponge-like polymer material filled with liquid metal material, and has a certain elastic deformation capability.

[0077] The material of the stretchable base layer 10 can be selected from one or more of the following materials: polydimethylsiloxane, natural rubber, polyurethane, polyethylene, polyvinyl alcohol, polytetrafluoroethylene, polyimide, polystyrene, polyethylene terephthalate, polylactic acid, polyglycolic acid, polylactic acid-glycolic acid copolymer, polylactic acid-caprolactone, poly-L-lactide-caprolactone, polyvinyl chloride and polycaprolactone.

[0078] In this embodiment, the stretchable base layer 10 is made of thermoplastic polyurethane material.

[0079] In a further improved embodiment, the size of the contact pad 41 is larger than the outline size of the through hole 31 , so that the contact pad 41 can completely cover the through hole 31 , thereby preventing liquid metal from leaking out of the through hole 31 .

[0080] In practical applications, the contact pad 41 may be provided with an interference fit with the through hole 31 , specifically, the contact pad 41 may completely seal the through hole 31 .

[0081] See also Figure 6 In another embodiment, the rear end of the flexible circuit board 40 extends out of the stretchable base layer 10, and a rigid reinforcement area 42 is provided on the end; a plurality of signal contacts 421 for connecting to a signal acquisition device are provided on the rigid reinforcement area 42.

[0082] Specifically, in this embodiment, the rear end of the flexible circuit board 40 is as follows: Figure 6As shown in , it refers to the end thereof extending outside the stretchable base layer 10; correspondingly, the front end of the flexible circuit board 40 refers to the end thereof extending into the stretchable base layer 10 and connected to the stretchable conductor line 20. By providing a rigid reinforcement area 42, the flexible circuit board 40 has an area with relatively strong rigidity and will not bend easily. Since a signal contact 421 is provided on the rigid reinforcement area 42, the rigid reinforcement area 42 can be used as a plug to be inserted into an external interface, such as the interface of a signal acquisition device, and can thereby ensure the stability of the connection between the signal contact 421 and the external interface. In addition, if the signal contact 421 is connected to an external signal acquisition device by welding, the rigid reinforcement area 42 can also improve the stability of the welding; and outside the rigid reinforcement area 42, the flexible circuit board 40 is still flexible, so that it can still bend along with the waterproof interface connection structure as a whole.

[0083] In other embodiments, see Figure 7 and Figure 8 The front end of the flexible circuit board 40 is provided with a plurality of protrusions 43 extending outward; the contact pads 41 are provided on the protrusions 43 .

[0084] By providing the protrusion 43, the contact pad 41 can be located at the front end of the flexible circuit board 40, so that the front, left and right sides of the contact pad are all wrapped by the first packaging layer 30 and the second packaging layer 50, thereby reducing or avoiding the relative sliding of the contact pad 41 relative to the first packaging layer 30 and the second packaging layer 50 when the waterproof interface connection structure is deformed, thereby avoiding poor contact and improving durability.

[0085] At the same time, although multiple discrete protrusions 43 are provided at the front end of the flexible circuit board 40, a large area of ​​the board body of the flexible circuit board 40 is still fixed between the first packaging layer 30 and the second packaging layer 50, so it can still maintain a large contact area with the first packaging layer 30 and the second packaging layer 50, thereby ensuring stability.

[0086] In addition, by providing the protrusion 43, the flexible circuit board 40 can be made easier to bend. Therefore, when the waterproof interface connection structure of this embodiment is applied to a wearable device, the waterproof interface connection structure can fit the human body better, thereby improving the wearing comfort of the wearable device.

[0087] It should be noted that, in the above embodiment, Figure 6 and Figure 7 It can be seen that the stretchable conductor line 20 does not mean that the first packaging layer 30 does not completely cover the stretchable conductor line 20, but only part of the first packaging layer 30 is shown for the convenience of showing the stretchable conductor line 20. Figure 6 and Figure 7The structure shown is intended to limit the structure of this solution. In application, the first encapsulation layer 30 can fully cover the stretchable conductor line 20, thereby providing protection for the stretchable conductor line 20 as a whole.

[0088] As a further improvement, see Figure 9 and Figure 10 The multiple protrusions 43 of the flexible circuit board 40 are staggered, so that the protruding lengths of two adjacent protrusions 43 are different.

[0089] Specifically, since the size of the contact pad 41 needs to be larger than the size of the through hole 31, in order to adjust the size of each part of the flexible circuit board 40 and avoid the situation where two adjacent contact pads 41 contact and short-circuit, the protrusion lengths of two adjacent protrusions 43 are set to be unequal. This can prevent the two adjacent contact pads 41 from being arranged side by side, thereby reducing the distance between the two adjacent protrusions 43, thereby controlling the overall size of the flexible circuit board 40.

[0090] Similarly, the plurality of signal contacts 421 on the rigid reinforcement region 42 may also be arranged in multiple rows in parallel to adjust the width of the rigid reinforcement region 42 .

[0091] In addition, if the distance between two adjacent through holes 31 on the first packaging layer 30 is too close, in the event of liquid metal leakage, the stretchable conductor lines 20 corresponding to the two adjacent through holes 31 are easily short-circuited. Therefore, by setting the protruding lengths of two adjacent protrusions 43 to be different, the distance between the two adjacent through holes 31 on the first packaging layer 30 can also be increased to improve the reliability of the waterproof interface connection structure.

[0092] Further, see Figure 9 , a plurality of contact pads 41 are provided on each protrusion 43 ; the contact pads 41 located on the same protrusion 43 are all electrically connected to the same stretchable conductor line 20 .

[0093] Specifically, the multiple contact pads 41 on a single protrusion 43 correspond to multiple different through holes 31 on the first packaging layer 30, but the multiple contact pads 41 on a single protrusion 43 all correspond to the same stretchable conductor line 20 and the same signal contact 421; that is, the multiple contact pads 41 on a single protrusion 43 serve as backups for each other. In the event that one contact pad 41 on a single protrusion 43 has poor contact, as long as the other contact pads 41 on the protrusion 43 have normal contact, it will not affect the signal transmission, thereby further improving the stability of the signal transmission.

[0094] In a further improved embodiment, see Figure 10 , a connecting portion 44 is further provided on the flexible circuit board 40 ; the connecting portion 44 connects the protruding portions 43 on the flexible circuit board 40 .

[0095] like Figure 10 As shown, by providing the connecting portion 44, the contact area between the flexible circuit board 40 and the first packaging layer 30 and the second packaging layer 50 in the area where the protrusion 43 is located can be increased, thereby improving the packaging effect; in addition, the connecting portion 44 makes it more difficult for the front end of the protrusion 43 to swing laterally, thereby further reducing the possibility of poor contact between the contact pad 41 and the stretchable conductor circuit 20; and, the flexible circuit board 40 that is not prone to swinging laterally can facilitate the alignment of the contact pad 41 with the through hole 31 on the first packaging layer 30 during the processing of the waterproof interface connection structure, thereby reducing the difficulty of processing the waterproof interface connection structure.

[0096] Furthermore, a plurality of positioning holes 45 are provided on the flexible circuit board 40 .

[0097] On the one hand, the positioning holes 45 are used to position the flexible circuit board 40 through the positioning columns on the mold during the processing of the waterproof interface connection structure to improve the processing accuracy and reduce the difficulty of processing; on the other hand, by opening corresponding holes in the first packaging layer 30, the second packaging layer 50 and the stretchable base layer 10, and supplemented by conventional bolts, rivets and other components, the various layers of the waterproof interface connection structure can be further fixed.

[0098] See also Figure 11 Another embodiment provided by this solution further includes: a first protective layer 60; the first protective layer 60 is an elastomer having a honeycomb hollow structure and is laid on the second encapsulation layer 50 and the first encapsulation layer 30. Specifically, the first protective layer 60 completely covers the second encapsulation layer 50 and the first encapsulation layer 30, providing waterproofing and protection for the second encapsulation layer 50 and the first encapsulation layer 30.

[0099] The first protective layer 60 can be made of silicone. Its honeycomb hollow structure can improve the waterproof performance of the waterproof sensing structure as a whole, while minimizing the impact on overall comfort and elastic modulus. The outer surface of the first protective layer 60 is a smooth closed-cell foamed elastomer. By setting its surface to a smooth surface, its waterproof performance can be further improved. Furthermore, the Young's modulus of the first protective layer 60 can be set lower than that of the stretchable base layer 10 and the first encapsulation layer 30, making it easier to bend toward the stretchable base layer 10.

[0100] In another embodiment, see Figure 12 , further comprising: an adhesive layer 70 and a second protective layer 80 ; the adhesive layer 70 covers the first protective layer 60 ; the second protective layer 80 covers the first protective layer 60 through the adhesive layer 70 .

[0101] Since the first protective layer 60 is made of silicone, its scratch resistance is relatively poor. By providing the second protective layer 80 on the first protective layer 60, the first protective layer 60 can be protected from being damaged by scratches, thereby further improving the durability and stability of the waterproof sensing structure.

[0102] Specifically, the adhesive layer 70 not only serves to connect the second protective layer 80 and the first protective layer 60, but also because the first protective layer 60 is made of rubber material, it is easy to produce cracks on the surface after aging, resulting in a decrease in waterproof performance. Therefore, the adhesive layer 70 arranged between the first protective layer 60 and the second protective layer 80 can also prevent the surface of the first protective layer 60 from cracking, thereby further improving the durability of the waterproof sensing structure.

[0103] The second protective layer 80 may be made of a polyurethane film, which is mainly used to protect the first protective layer 60 from being scratched.

[0104] It should be noted that providing the first protective layer 60 can further increase the elastic modulus of the flexible circuit board 40 , thereby improving the stability of the waterproof interface connection structure.

[0105] Further, see Figure 13 , further comprising: a conductive adhesive layer 90 , which is disposed between the contact pad 41 and the stretchable conductor line 20 and is used to bond the contact pad 41 to the stretchable conductor line 20 .

[0106] The conductive adhesive layer 90 can bond the contact pad 41 to the flexible circuit board 40 to improve the stability of the connection between the two. In addition, when the stretchable conductor line 20 is liquid metal, it can also prevent the liquid metal from overflowing from the through hole 31.

[0107] Specifically, the conductive adhesive layer 90 can be an anisotropic conductive adhesive, so that the conductive adhesive layer 90 has conductivity only in a single direction (that is, the direction from the stretchable conductor line 20 to the contact pad 41), so as to prevent the conductive adhesives in different through holes 31 from being squeezed out of the through holes 31 and connected to each other after the waterproof interface connection structure is pulled or compressed, thereby further improving stability.

[0108] In one embodiment, the upper and lower surfaces of the flexible circuit board 40 are surface-treated so that the flexible circuit board 40 has uneven upper and lower surfaces, thereby making the connection between the flexible circuit board 40 of this embodiment and the first packaging layer 30 and the second packaging layer 50 more secure than that of the flexible circuit board 40 that has not been surface-treated.

[0109] The surface treatment may include but is not limited to frosting, sandblasting, etc.

[0110] A second aspect of the present application provides an electronic device comprising any of the above-mentioned waterproof interface connection structures.

[0111] Specifically, the aforementioned electronic device can incorporate a waterproof interface connection structure into wearable devices such as smart sensing gloves, smart yoga pants, smart swimsuits, and smart fitness clothing. Taking smart sensing gloves as an example, the waterproof interface connection structure can be positioned on the wrist, a part of the body that experiences less movement than finger joints, thereby improving the durability of the waterproof interface connection structure. The wearable device provided in this embodiment has excellent waterproof performance and can meet the durability requirements of washing machines.

[0112] The above are only preferred embodiments of the present application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the aforementioned examples or make equivalent replacements for some of the technical features therein. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A waterproof interface connection structure, characterized in that: include: a stretchable base layer; a stretchable conductor circuit, wherein the stretchable conductor circuit is disposed on the stretchable base layer; a first packaging layer, the first packaging layer being laid on the stretchable base layer and the stretchable conductor circuit, and being used to fix the stretchable conductor circuit on the stretchable base layer, and the first packaging layer being provided with a through hole; a flexible circuit board, the flexible circuit board being disposed on the first packaging layer and provided with contact pads for electrically connecting to the stretchable conductor circuit, the contact pads being disposed corresponding to positions of the through holes; a second encapsulation layer, the second encapsulation layer being laid on the flexible circuit board and the first encapsulation layer and being used to fix the flexible circuit board between the first encapsulation layer and the second encapsulation layer; The stretchable conductor circuit includes a plurality of conductors; The first packaging layer is provided with a plurality of through holes; The flexible circuit board is provided with a plurality of contact pads; The plurality of contact pads are arranged in a one-to-one correspondence with the plurality of through holes; The flexible circuit board is electrically connected to each of the stretchable conductor circuits via a plurality of contact pads; The front end of the flexible circuit board is provided with a plurality of protrusions extending outward; The contact pad is disposed on the protrusion.

2. The waterproof interface connection structure according to claim 1, characterized in that: The second packaging layer covers the top surface and side surfaces of the flexible circuit board and the first packaging layer.

3. The waterproof interface connection structure according to claim 1, characterized in that: The size of the contact pad is larger than the outline size of the through hole so that the contact pad completely covers the through hole.

4. The waterproof interface connection structure according to claim 1, characterized in that: The rear end of the flexible circuit board extends out of the stretchable base layer, and a rigid reinforcement area is provided on the end; The rigid reinforcement area is provided with a plurality of signal contacts for connecting with a signal acquisition device.

5. The waterproof interface connection structure according to claim 1, characterized in that: The multiple protrusions of the flexible circuit board are staggeredly distributed, so that the protruding lengths of two adjacent protrusions are different.

6. The waterproof interface connection structure according to claim 1, characterized in that: A plurality of contact pads are provided on each of the protrusions; The contact pads on the same protrusion are all electrically connected to the same stretchable conductor line.

7. The waterproof interface connection structure according to claim 1, characterized in that: The flexible circuit board is also provided with a connecting portion; The connecting portion connects the protruding portions on the flexible circuit board.

8. The waterproof interface connection structure according to claim 1, characterized in that: The flexible circuit board is also provided with a plurality of positioning holes.

9. The waterproof interface connection structure according to claim 1, characterized in that: Also includes: The first protective layer is an elastic body with a honeycomb hollow structure and is laid on the second packaging layer and the first packaging layer.

10. The waterproof interface connection structure according to claim 9, characterized in that: Also includes: an adhesive layer, the adhesive layer covering the first protective layer; A second protective layer is covered on the first protective layer through the adhesive layer.

11. The waterproof interface connection structure according to claim 1, characterized in that: Also includes: A conductive adhesive layer is provided between the contact pad and the stretchable conductor circuit, and is used to bond the contact pad to the stretchable conductor circuit.

12. The waterproof interface connection structure according to claim 11, characterized in that: The conductive adhesive layer is anisotropic conductive adhesive.

13. The waterproof interface connection structure according to claim 11, characterized in that: The upper surface and the lower surface of the flexible circuit board are both surface-treated so that the flexible circuit board has uneven upper and lower surfaces, thereby making the connection between the flexible circuit board and the first packaging layer and the second packaging layer more secure.

14. An electronic device, characterized in that: The waterproof interface connection structure comprises the waterproof interface connection structure according to any one of claims 1 to 13.

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