A Miniaturized and Highly Reliable Integrated External Dimming Transmitter and Packaging Method

Abstract

The present invention discloses a miniaturized, highly reliable, integrated external modulation optical transmitter, comprising: a package housing with an internal cavity, a radio frequency signal hole and a power supply hole on the side, and a fiber optic signal hole at one end; an external modulation laser assembly, a laser coupling assembly, an intensity modulation assembly, and a modulator coupling assembly, which are sequentially arranged within the cavity; a tail pipe, arranged outside the package housing, with its axis coaxial with the fiber optic signal hole; a drive control assembly, arranged within the cavity, and electrically connected to the external modulation laser assembly and the intensity modulation assembly, respectively; an radio frequency connector, electrically connected to the intensity modulation assembly through the radio frequency signal hole; a power supply insulator, electrically connected to the drive control assembly through the power supply hole; and an output metalized fiber optic assembly, which passes through the tail pipe and faces the modulator coupling assembly. The present invention has the advantages of small size, high reliability, good airtightness, and high output optical power.

Description

Technical Field

[0001] The present invention relates to the field of high-speed microwave optical link equipment, and in particular to a miniaturized high-reliability integrated external modulation optical transmitter and a packaging method thereof. Background Art

[0002] Externally modulated optical transmitters, consisting of an externally modulated laser and an intensity modulator, play a crucial role in high-speed microwave optical links. Integrated externally modulated optical transmitters combine the externally modulated laser, intensity modulator, and its drive control circuitry in a single package. This overcomes the drawbacks of separate externally modulated laser and intensity modulator components, such as the large housing size and increased bulk associated with fiber bends.

[0003] The package design of an integrated externally modulated optical transmitter primarily assembles the externally modulated laser chip, circuit board base, thermistor, cooler, intensity modulator chip, output fiber, RF connector, backlight monitoring chip, and driver control circuit board within a sealed tube shell, enabling internal and external interconnection of optical and electrical signals. The externally modulated laser chip emits light, which is coupled into the intensity modulator chip. The input RF signal is then modulated into an optical signal, achieving electrical-to-optical conversion. Finally, the optical carrier signal is coupled into the optical fiber for output.

[0004] In existing integrated externally modulated optical transmitters, a fiber adapter is used to connect the laser chip and the intensity modulator chip. Light emitted by the laser chip is first coupled into the fiber adapter and then into the intensity modulator chip. Optical adhesive is used to secure the fiber adapter and output fiber at both ends of the intensity modulator chip. To ensure thermal reliability, a bare fiber section is reserved at the output fiber end to prevent stretch damage, and glue is used to seal the fiber outlet of the tube and housing.

[0005] This traditional packaging form has the following main disadvantages:

[0006] (1) Large size: The setting of the transfer fiber and the reserved fiber at the output end results in a total waste of about 20mm of length space.

[0007] (2) Low reliability: The optical coupling of the intensity modulator chip is fixed with optical glue, and vibration and mechanical shock can easily cause the coupling point to fall off.

[0008] (3) Low air tightness: The fiber outlet is sealed with glue, which is not conducive to sealing performance.

[0009] (4) Low output optical power: The setting of the switching optical fiber adds a coupling point between the externally modulated laser and the intensity modulator chip, which increases the coupling loss and reduces the output optical power. Summary of the Invention

[0010] In view of the above-mentioned defects of the prior art, the object of the present invention is to provide a miniaturized high-reliability integrated external modulation optical transmitter and its packaging method, which have the advantages of small size, high reliability, good airtightness and high output optical power.

[0011] The objective of the present invention is achieved through such technical solution:

[0012] A miniaturized, highly reliable, integrated externally modulated optical transmitter comprising:

[0013] The packaging shell has an accommodating cavity inside, and a radio frequency signal hole and a power supply hole connected to the accommodating cavity are provided on the side; an optical fiber signal hole is provided at one end to communicate with the accommodating cavity.

[0014] An external laser assembly is disposed in the accommodating cavity;

[0015] A laser coupling assembly is disposed in the accommodating cavity, with its axis facing the light-emitting surface of the external laser chip of the external laser assembly;

[0016] The intensity modulation component is arranged in the accommodating cavity; the laser coupling component is located between the intensity modulation component and the external modulation laser component;

[0017] The modulator coupling assembly is disposed in the packaging shell and is coaxially arranged with the laser coupling assembly;

[0018] The tail pipe is arranged outside the packaging shell, and its axis is coaxial with the optical fiber signal hole;

[0019] The drive control component is disposed in the accommodating cavity and is electrically connected to the external laser component and the intensity modulation component respectively;

[0020] A radio frequency connector, passing through the radio frequency signal hole and electrically connected to the intensity modulation component;

[0021] A power supply insulator, passing through the power supply hole and electrically connected to the drive control assembly;

[0022] The output metallized optical fiber component passes through the tail tube and faces the modulator coupling component.

[0023] Furthermore, the packaging shell includes:

[0024] The box body has an upper concave accommodating groove on its upper surface and a lower concave accommodating groove on its lower surface; the external modulation laser assembly, laser coupling assembly, intensity modulation assembly, and modulator coupling assembly are all arranged in the upper accommodating groove; the radio frequency signal hole and the optical fiber signal hole are connected to the upper accommodating groove; the drive control assembly is arranged in the lower accommodating groove, and the power supply hole is connected to the lower accommodating groove;

[0025] The upper cover is fixed to the box body and closes the upper receiving groove;

[0026] The lower cover plate and the box body are fixed to fix the lower accommodating groove.

[0027] Furthermore, the lower surface of the box body is provided with a plurality of mounting holes with internal threads; the outer surface of the lower cover does not exceed the lower surface of the box body;

[0028] The box body is provided with a through hole communicating with the upper accommodating groove and the lower accommodating groove for electrically connecting the drive control component with the external laser component and the intensity modulation component.

[0029] Furthermore, electrical connection insulators are provided in the perforations, and the electrical connection insulators are divided into two groups and are electrically connected to the intensity modulation component and the external modulation laser component respectively through the drive control component;

[0030] An electric transmission adapter plate is provided in the accommodating cavity, and two ends thereof are electrically connected to a group of electric connection insulators and an external laser assembly respectively.

[0031] Furthermore, the external laser assembly includes:

[0032] A cooling plate is sintered in the accommodating cavity and electrically connected to the drive control component;

[0033] The circuit board base is sintered on the cooling sheet;

[0034] Thermistor, sintered on the base of the circuit board;

[0035] The external laser chip is sintered on the circuit board base, with its light-emitting surface facing the axis of the laser coupling component;

[0036] The laser backlight monitoring chip is sintered on the circuit board base and detects the laser emitted by the external laser chip. The thermistor, external laser chip and laser backlight monitoring chip are all electrically connected to the drive control component.

[0037] Furthermore, the laser coupling assembly includes:

[0038] The laser metal sleeve is fixed in the accommodating cavity and is located between the external modulation laser component and the intensity modulation component;

[0039] The laser coupling lens is arranged in the laser metal sleeve, and its axis is aligned with the light-emitting surface of the external laser chip of the external laser assembly;

[0040] The optical isolator is arranged in the laser metal sleeve, is coaxial with the laser coupling lens, faces the intensity modulation component, and is coaxial with the modulator coupling component.

[0041] Furthermore, the intensity modulation component includes:

[0042] The intensity modulator chip is disposed in the accommodating cavity, located between the laser coupling component and the modulator coupling component, and is electrically connected to the radio frequency connector and the drive control component;

[0043] a ceramic resistor, disposed in the accommodating cavity and electrically connected to the intensity modulator chip;

[0044] The modulator backlight monitoring chip is bonded to the tail end of the intensity modulator chip and is electrically connected to the drive control component.

[0045] Furthermore, the modulator coupling assembly includes a modulator coupling lens, which is arranged in the optical fiber signal hole and is coaxial with the laser coupling assembly.

[0046] Furthermore, the drive control component includes a drive control circuit board, which is provided with an external laser power supply pad, an intensity modulation power supply pad, and an external power supply pad; the external laser power supply pad is electrically connected to the external laser component; the intensity modulation power supply pad is electrically connected to the intensity modulation component; and the external power supply pad is electrically connected to the power supply insulator.

[0047] A packaging method for a miniaturized, highly reliable, integrated externally modulated optical transmitter comprises the following steps:

[0048] S1. Sinter the RF connector to the RF signal hole of the package shell using AuSn solder;

[0049] S2. Sintering the power supply insulator at the power supply hole of the package shell using AuSn solder;

[0050] S3. Use AuSn solder to sinter the external laser chip, thermistor, and laser backlight monitoring chip to the reserved pads on the circuit board base through vacuum sintering, and use feedback microstrip bonding gold wire to electrically connect the circuit board base with the external laser chip, thermistor, and laser backlight monitoring chip;

[0051] S4, fixing the electrical transmission microstrip in the upper receiving groove of the package shell by vacuum sintering using PbSn solder;

[0052] S4, fixing the circuit board base, the cooler, and the accommodating cavity of the package shell in the upper accommodating groove in sequence by using PbSn solder through vacuum sintering;

[0053] S5. Adhere the laser coupling lens, optical isolator, and laser metal sleeve together with epoxy glue, and fix the integrated laser metal sleeve of the laser coupling lens and optical isolator into the upper receiving groove of the package shell by laser welding;

[0054] S6. Adhere the intensity modulator chip to the upper receiving groove of the package shell with conductive adhesive, and the RF input interface of the intensity modulator chip is located below the internal pin of the RF connector;

[0055] S7, welding the modulator coupling lens to the optical fiber signal hole of the package shell;

[0056] S8. Insert the metallized end of the output metallized optical fiber assembly into the tail tube of the package housing, facing the axis of the modulator coupling lens;

[0057] S9. Bond the ceramic resistor to the upper receiving groove of the package shell with conductive glue, and connect the RF terminal matching interface of the intensity modulator chip to the ceramic resistor bonding wire;

[0058] S10, bonding the modulator backlight monitoring chip to the tail end of the intensity modulator chip using optical adhesive;

[0059] S11. Install the drive control circuit board in the lower accommodating groove, fix the electrical connection insulator in the through hole between the upper accommodating groove and the lower accommodating groove, and electrically connect the drive control circuit board to the modulator backlight monitoring chip, the circuit board base, the cooler, and the intensity modulator chip through the electrical connection insulator;

[0060] S12, using the upper cover plate and the lower cover plate to evacuate the upper accommodating tank and the lower accommodating shielding tank respectively, and finally sealing them by parallel welding.

[0061] Due to the adoption of the above technical solution, the present invention has the following advantages:

[0062] 1. The structure of the present invention is small in size. Specifically, aspheric lenses are used for optical system coupling in the coupling of the external laser chip and the intensity modulator chip, and in the coupling of the intensity modulator chip and the output optical fiber in the tail tube. Compared with the traditional structure, the internal optical fiber length space is saved, and the size in the length direction is reduced by 1 / 4 (about 20 mm). A radio frequency connector (SMPM) is used to replace the traditional coaxial V-shaped female radio frequency connector for installation, which is encapsulated inside the tube shell cavity wall, and threads are used to open holes from the four corners of the bottom, and the bottom installation method is used instead of the traditional front installation. The length and width directions are reduced by about 5 mm respectively. In summary, the volume of the structure of the present invention is reduced by about 1 / 3 compared with the traditional structure.

[0063] 2. The present invention offers high reliability. Specifically, in conventional packaging methods, the alignment and coupling between the adapter fiber and the intensity modulator chip, and between the intensity modulator chip and the output fiber in the tail tube, is secured with UV optical glue. This can easily lead to mechanical vibration and shock causing the coupling points to fall off, resulting in product failure. The present invention utilizes aspheric lenses for spatial coupling. The aspheric lenses are secured by welding, making them less susceptible to vibration and shock causing coupling optical path deviation, which can lead to product failure.

[0064] 3. The present invention has high airtightness. Specifically, in the traditional packaging method, the optical fiber at the tail tube is fixed with glue, which has poor airtightness. The present invention uses metallized optical fiber, performs thermal resistance welding and injects solder to achieve good airtight fixation.

[0065] 4. The present invention has a high output optical power index. Specifically: In the present invention, the external modulation laser chip and the intensity modulator chip use an aspheric lens for high-precision spatial alignment coupling, avoiding the secondary coupling loss caused by traditional methods. Compared with traditional packaging methods, the output optical power index is improved by 1.5dBm.

[0066] Other advantages, objects and features of the present invention will be described in part in the following description and, in part, will be apparent to those skilled in the art based on an examination of the following or may be learned from the practice of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] The accompanying drawings of the present invention are as follows:

[0068] Figure 1 This is a schematic diagram of the first three-dimensional structure of a miniaturized, highly reliable, integrated externally modulated optical transmitter.

[0069] Figure 2 This is a schematic diagram of the second-dimensional structure of a miniaturized, highly reliable, integrated externally modulated optical transmitter.

[0070] Figure 3 Schematic diagram of the three-dimensional structure of a miniaturized, highly reliable integrated externally modulated optical transmitter with the top cover removed.

[0071] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle.

[0072] Figure 5 for Figure 3 Enlarged structural diagram at point B in the middle.

[0073] Figure 6 for Figure 3 Enlarged structural diagram at point C in the middle.

[0074] Figure 7 Schematic diagram of the structure after removing the lower cover of a miniaturized, highly reliable integrated externally modulated optical transmitter when viewed from above.

[0075] Figure 8 Schematic diagram of the cross-section structure of a miniaturized, highly reliable integrated externally modulated optical transmitter after removing the upper and lower covers.

[0076] Figure 9 for Figure 8 Enlarged structural diagram at point D in the middle.

[0077] Figure: 11. Box body; 111. Upper accommodating groove; 112. Lower accommodating groove; 113. Upper cover; 114. Lower cover; 115. Mounting hole; 116. Through hole; 117. Electrical connection insulator; 118. Electrical transmission adapter plate; 101. RF signal hole; 12. Power supply hole; 13. Fiber optic signal hole; 21. Cooling plate; 22. Circuit board base; 23. Thermistor; 24. External laser chip; 25. Laser backlight monitor Chip; 31. Laser metal sleeve; 32. Laser coupling lens; 33. Optical isolator; 41. Intensity modulator chip; 42. Ceramic resistor; 43. Modulator backlight monitoring chip; 5. Modulator coupling component; 6. Tail pipe; 7. Drive control circuit board; 71. External laser power supply pad; 72. Intensity modulation power supply pad; 73. External power supply pad; 8. RF connector; 9. Power supply insulator; 10. Output metal fiber optic component. DETAILED DESCRIPTION

[0078] The present invention will be further described below with reference to the accompanying drawings and examples.

[0079] Example:

[0080] like Figures 1 to 9 As shown, a miniaturized high-reliability integrated external modulation optical transmitter includes: a packaging shell, an external modulation laser component, a laser coupling component, an intensity modulation component, a modulator coupling component 5, a tail pipe 6, a drive control component, a radio frequency connector 8, a power supply insulator 9, and an output metalized optical fiber component.

[0081] Specifically, the packaging shell includes:

[0082] The box body 11 has a concave upper accommodating groove 111 on its upper surface and a concave lower accommodating groove 112 on its lower surface. The external modulation laser assembly, laser coupling assembly, intensity modulation assembly, and modulator coupling assembly 5 are all arranged in the upper accommodating groove 111. The RF signal hole 101 and the optical fiber signal hole 13 are connected to the upper accommodating groove 111. The drive control assembly is arranged in the lower accommodating groove 112, and the power supply hole 12 is connected to the lower accommodating groove 112. The lower surface of the box body is provided with a plurality of mounting holes 115 with internal threads.

[0083] The upper cover 113 is fixed to the box body 11 to close the upper receiving groove 111;

[0084] The lower cover 114 is fixed to the box body 11, and the lower accommodating groove 112 is fixed; the outer surface of the lower cover 114 does not exceed the lower surface of the box body 11. When fixed, M1.6 threaded holes are opened at the four corners corresponding to the bottom of the box body 11, and screws are used to install and fix the lower cover 114 to the box body 11

[0085] The box body 11 is provided with a through hole 116 connecting the upper accommodating groove 111 and the lower accommodating groove 112, for electrically connecting the drive control component with the external laser component and the intensity modulation component; the through hole 116 is provided with an electrical connection insulator 117, which is divided into two groups and electrically connected to the intensity modulation component and the external laser component through the drive control component respectively;

[0086] An electrical transmission adapter plate 118 is provided in the accommodating cavity, and its two ends are electrically connected to a group of electrical connection insulators 117 and an external laser assembly respectively.

[0087] Specifically, the external laser assembly includes:

[0088] The cooling plate 21 is sintered in the accommodating cavity and electrically connected to the drive control component; it plays the role of cooling or heating the external laser chip 24;

[0089] The circuit board base 22 is sintered on the cooling plate 21; the circuit board base 22 is made of AlN material, and the bottom and upper electrical connection areas are gold-plated.

[0090] The thermistor 23 is sintered on the circuit board base 22; the thermistor 23, the cooling plate 21 and the drive control component realize the automatic temperature control function of the external laser chip 24;

[0091] The external laser chip 24 is sintered on the circuit board base 22, with its light-emitting surface facing the axis of the laser coupling assembly;

[0092] The laser backlight monitoring chip 25 is sintered on the circuit board base 22 to detect the laser emitted by the external laser chip 24; the thermistor 23, the external laser chip 24, and the laser backlight monitoring chip 25 are all electrically connected to the drive control component.

[0093] Specifically, the laser coupling component includes:

[0094] The laser metal sleeve 31 is fixed in the accommodating cavity and is located between the external laser component and the intensity modulation component;

[0095] The laser coupling lens 32 is arranged in the laser metal sleeve 31, and its axis is aligned with the light-emitting surface of the external laser chip of the external laser assembly; the laser coupling lens 32 is an aspherical lens;

[0096] The optical isolator 33 is disposed in the laser metal sleeve 31 , is coaxial with the laser coupling lens 32 , faces the intensity modulation component, and is coaxial with the modulator coupling component 5 .

[0097] Specifically, the intensity modulation component includes:

[0098] The intensity modulator chip 41 is disposed in the accommodating cavity, located between the laser coupling component and the modulator coupling component 5, and electrically connected to the RF connector 8 and the drive control component;

[0099] The ceramic resistor 41 is disposed in the accommodating cavity and is electrically connected to the intensity modulator chip 41 . The ceramic resistor 41 is made of Al 2 O 3 material, and the electrical connection parts at the bottom and top are gold-plated.

[0100] The modulator backlight monitoring chip 43 is bonded to the tail end of the intensity modulator chip 41 and is electrically connected to the drive control component.

[0101] Specifically, the modulator coupling assembly 5 includes a modulator coupling lens, which is disposed in the optical fiber signal hole 13 and is coaxial with the laser coupling assembly. The modulator coupling lens is an aspheric lens, packaged in a SF20T metal tube, and the surface is gold-plated.

[0102] Specifically, the drive control component includes a drive control circuit board 7, which is provided with an external laser power supply pad 71, an intensity modulation power supply pad 72, and an external power supply pad 73; the external laser power supply pad 71 is electrically connected to the external laser component; the intensity modulation power supply pad 72 is electrically connected to the intensity modulation component; and the external power supply pad 73 is electrically connected to the power supply insulator 9.

[0103] The tail pipe 6 is arranged outside the box body 11, and its axis is coaxial with the optical fiber signal hole 13;

[0104] The drive control component is disposed in the lower accommodating groove 112 and is electrically connected to the circuit board base 22, the cooling plate 21, and the intensity modulator chip 41 respectively;

[0105] The RF connector 8 passes through the RF signal hole 101 and is electrically connected to the intensity modulator chip 41 ; the RF connector 8 is an SMPM(M)-JPD-L connector.

[0106] The power supply insulator 9 passes through the power supply hole 12 and is electrically connected to the drive control component;

[0107] The output metallized optical fiber assembly passes through the tail tube 6 and faces the modulator coupling assembly 5. Solder is flowed into the tail tube 6 from the opening using thermal resistance welding to secure the metal tube (i.e., optical fiber assembly) to the tail tube 6 in an airtight manner.

[0108] The packaging method of a miniaturized, highly reliable integrated externally modulated optical transmitter requires the use of various accessories. The packaging shell is obtained by one-time processing and molding. The upper accommodating groove 111, the lower accommodating groove 112, the mounting hole 115, the RF signal hole 101, the power supply hole 12, and the optical fiber signal hole 13 are designed. The upper cover 113 and the lower cover 114 are also processed, and the cavities of the upper accommodating groove 111 and the lower accommodating groove 112 and the surfaces of the upper cover 113 and the lower cover 114 are nickel-plated and gold-plated.

[0109] The specific steps for packaging are as follows:

[0110] S1, sintering the RF connector 8 to the RF signal hole 101 of the package shell using AuSn solder;

[0111] S2, sintering the power supply insulator 9 at the power supply hole 12 of the package shell using AuSn solder;

[0112] S3. Use AuSn solder to sinter the external laser chip 24, thermistor 23, and laser backlight monitoring chip 25 on the reserved pads of the circuit board base 22 through vacuum sintering. Then use feedback microstrip bonding wire to electrically connect the circuit board base 22 with the external laser chip 24, thermistor 23, and laser backlight monitoring chip 25.

[0113] S4, fixing the electrical transmission microstrip in the upper receiving groove 111 of the package shell by vacuum sintering using PbSn solder;

[0114] S4, fixing the circuit board base 22, the cooler, and the accommodating cavity of the package shell in the upper accommodating groove 111 in sequence by using PbSn solder through vacuum sintering;

[0115] S5. Adhere the laser coupling lens 32, the optical isolator 33, and the laser metal sleeve 31 together with epoxy glue, and fix the integrated laser metal sleeve 31 of the laser coupling lens 32 and the optical isolator 33 in the upper receiving groove 111 of the package shell by laser welding;

[0116] S6. Adhere the intensity modulator chip 41 to the upper receiving groove 111 of the package shell with conductive adhesive. The RF input interface of the intensity modulator chip 41 is located below the lead pin inside the RF connector 8.

[0117] S7, welding the modulator coupling lens to the optical fiber signal hole 13 of the package shell;

[0118] S8. Insert the metallized end of the output metallized optical fiber assembly into the tail tube 6 of the package housing, facing the axis of the modulator coupling lens;

[0119] S9. Adhere the ceramic resistor 41 to the upper receiving groove 111 of the package shell with conductive glue, and connect the RF terminal matching interface of the intensity modulator chip 41 to the ceramic resistor 41 with gold bonding wires;

[0120] S10, bonding the modulator backlight monitoring chip 43 to the tail end of the intensity modulator chip 41 with optical glue;

[0121] S11. Install the drive control circuit board 7 in the lower accommodating groove 112. Fix the electrical connection insulator 117 in the through hole 116 between the upper accommodating groove 111 and the lower accommodating groove 112. Electrically connect the drive control circuit board 7 to the modulator backlight monitoring chip 43, the circuit board base 22, the cooler, and the intensity modulator chip 41 through the electrical connection insulator 117.

[0122] S12, using the upper cover plate 113 and the lower cover plate 114 to evacuate the upper accommodating groove 111 and the lower accommodating shielding groove respectively, and finally sealing them by parallel welding.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solutions, which should all be included in the scope of the claims of the present invention.

Claims

1. A miniaturized, highly reliable, integrated externally modulated optical transmitter, characterized in that: include: The packaging shell has an accommodating cavity inside, a radio frequency signal hole and a power supply hole connected to the accommodating cavity on the side, and an optical fiber signal hole connected to the accommodating cavity at one end; An external laser assembly is disposed in the accommodating cavity; A laser coupling assembly is disposed in the accommodating cavity, with its axis facing the light-emitting surface of the external laser chip of the external laser assembly; The intensity modulation component is arranged in the accommodating cavity; the laser coupling component is located between the intensity modulation component and the external modulation laser component; The modulator coupling assembly is disposed in the packaging shell and is coaxially arranged with the laser coupling assembly; The tail pipe is arranged outside the packaging shell, and its axis is coaxial with the optical fiber signal hole; The drive control component is disposed in the accommodating cavity and is electrically connected to the external laser component and the intensity modulation component respectively; A radio frequency connector, passing through the radio frequency signal hole and electrically connected to the intensity modulation component; A power supply insulator, passing through the power supply hole and electrically connected to the drive control assembly; The output metallized optical fiber component passes through the tail tube and faces the modulator coupling component; The packaging shell includes: The box body has an upper concave accommodating groove on its upper surface and a lower concave accommodating groove on its lower surface; the external modulation laser assembly, laser coupling assembly, intensity modulation assembly, and modulator coupling assembly are all arranged in the upper accommodating groove; the radio frequency signal hole and the optical fiber signal hole are connected to the upper accommodating groove; the drive control assembly is arranged in the lower accommodating groove, and the power supply hole is connected to the lower accommodating groove; The upper cover is fixed to the box body and closes the upper receiving groove; The lower cover plate fixes the box body and the lower accommodating groove; The laser coupling assembly comprises: The laser metal sleeve is fixed in the accommodating cavity and is located between the external modulation laser component and the intensity modulation component; The laser coupling lens is arranged in the laser metal sleeve, and its axis is aligned with the light-emitting surface of the external laser chip of the external laser assembly; The optical isolator is arranged in the laser metal casing, is coaxial with the laser coupling lens, faces the intensity modulation component, and is coaxial with the modulator coupling component; The modulator coupling component includes a modulator coupling lens, which is arranged in the optical fiber signal hole and is coaxial with the laser coupling component.

2. The miniaturized high-reliability integrated external modulation optical transmitter according to claim 1, characterized in that: The lower surface of the box body is provided with a plurality of mounting holes with internal threads; the outer surface of the lower cover does not exceed the lower surface of the box body; The box body is provided with a through hole communicating with the upper accommodating groove and the lower accommodating groove for electrically connecting the drive control component with the external laser component and the intensity modulation component.

3. The miniaturized high-reliability integrated external modulation optical transmitter according to claim 2, characterized in that: The through-hole is provided with an electrical connection insulator, which is divided into two groups and electrically connected to the intensity modulation component and the external laser component respectively through the drive control component; An electric transmission adapter plate is provided in the accommodating cavity, and two ends thereof are electrically connected to a group of electric connection insulators and an external laser assembly respectively.

4. The miniaturized high-reliability integrated external modulation optical transmitter according to claim 1, characterized in that: The external laser assembly includes: A cooling plate is sintered in the accommodating cavity and electrically connected to the drive control component; The circuit board base is sintered on the cooling sheet; Thermistor, sintered on the base of the circuit board; The external laser chip is sintered on the circuit board base, with its light-emitting surface facing the axis of the laser coupling component; The laser backlight monitoring chip is sintered on the circuit board base and detects the laser emitted by the external laser chip. The thermistor, external laser chip and laser backlight monitoring chip are all electrically connected to the drive control component.

5. The miniaturized high-reliability integrated external modulation optical transmitter according to claim 1, characterized in that: The intensity modulation component comprises: The intensity modulator chip is disposed in the accommodating cavity, located between the laser coupling component and the modulator coupling component, and is electrically connected to the radio frequency connector and the drive control component; a ceramic resistor, disposed in the accommodating cavity and electrically connected to the intensity modulator chip; The modulator backlight monitoring chip is bonded to the tail end of the intensity modulator chip and is electrically connected to the drive control component.

6. The miniaturized high-reliability integrated external modulation optical transmitter according to claim 1, characterized in that: The drive control component includes a drive control circuit board, which is provided with an external laser power supply pad, an intensity modulation power supply pad, and an external power supply pad; the external laser power supply pad is electrically connected to the external laser component; the intensity modulation power supply pad is electrically connected to the intensity modulation component; and the external power supply pad is electrically connected to the power supply insulator.

7. A packaging method for a miniaturized, highly reliable, integrated externally modulated optical transmitter, characterized in that: The following steps are involved: S1. Sinter the RF connector to the RF signal hole of the package shell using AuSn solder; S2. Sintering the power supply insulator at the power supply hole of the package shell using AuSn solder; S3. Use AuSn solder to sinter the external laser chip, thermistor, and laser backlight monitoring chip to the reserved pads on the circuit board base through vacuum sintering, and use feedback microstrip bonding gold wire to electrically connect the circuit board base with the external laser chip, thermistor, and laser backlight monitoring chip; S4, fixing the electrical transmission microstrip in the upper receiving groove of the package shell by vacuum sintering using PbSn solder; S4, fixing the circuit board base, the cooler, and the accommodating cavity of the package shell in the upper accommodating groove in sequence by using PbSn solder through vacuum sintering; S5. Adhere the laser coupling lens, optical isolator, and laser metal sleeve together with epoxy glue, and fix the integrated laser metal sleeve of the laser coupling lens and optical isolator into the upper receiving groove of the package shell by laser welding; S6. Adhere the intensity modulator chip to the upper receiving groove of the package shell with conductive adhesive, and the RF input interface of the intensity modulator chip is located below the internal pin of the RF connector; S7, welding the modulator coupling lens to the optical fiber signal hole of the package shell; S8. Insert the metallized end of the output metallized optical fiber assembly into the tail tube of the package housing, facing the axis of the modulator coupling lens; S9. Bond the ceramic resistor to the upper receiving groove of the package shell with conductive glue, and connect the RF terminal matching interface of the intensity modulator chip to the ceramic resistor bonding wire; S10, bonding the modulator backlight monitoring chip to the tail end of the intensity modulator chip using optical adhesive; S11. Install the drive control circuit board in the lower accommodating groove, fix the electrical connection insulator in the through hole between the upper accommodating groove and the lower accommodating groove, and electrically connect the drive control circuit board to the modulator backlight monitoring chip, the circuit board base, the cooler, and the intensity modulator chip through the electrical connection insulator; S12, using the upper cover plate and the lower cover plate to evacuate the upper accommodating tank and the lower accommodating shielding tank respectively, and finally sealing them by parallel welding.

Images