Three-dimensional hybrid integrated filter and electronic device thereof

Abstract

The application discloses a three-dimensional mixed integrated filter and an electronic device thereof, which comprises a medium for bearing a capacitor, a medium for bearing an inductor and a bearing substrate arranged along a stacking direction, the medium for bearing the capacitor and the bearing substrate are arranged above and below the medium for bearing the inductor respectively, the medium for bearing the capacitor comprises a MIM capacitor, the medium for bearing the inductor and the bearing substrate are connected through a BGA ball grid array packaging mode, the medium for bearing the capacitor, the medium for bearing the inductor and the bearing substrate comprise a plurality of dielectric layers stacked along the stacking direction; the coupling between inductors can be greatly reduced, and the three-dimensional mixed integrated filter has the characteristics of high suppression and wide stop band.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of band-pass filter, in particular to a three-dimensional hybrid integrated filter and an electronic device thereof. BACKGROUND

[0002] Currently, the complexity of wireless radio frequency communication system and mode is increasing, especially the terminal equipment of today's mobile communication system, which often needs to support different system communication modes such as 2G, 3G, 4G, 5G and WiFi in the same terminal equipment limited space, which makes the number of radio frequency bands required to be supported by related equipment increase, therefore, as the key device of filtering noise and ensuring the working of multi-band fusion in wireless terminal, the number of filter required also increases greatly, which brings great challenges to the integration of terminal radio frequency system, especially the miniaturization and integration capability of related filter.

[0003] Generally speaking, for the miniaturized integrated filter used in high-density integration, the process system usually adopts CMOS or compound-based semiconductor passive integration process, the resonator usually adopts the lumped parameter idea based on inductive and capacitive structure for design, and the integration of inductor physical realization and capacitor generally adopts two-dimensional planar integration method, but the inductance Q value under this integration method is low, which will lead to the significant decrease of filter rectangular coefficient; at the same time, the planar integration method leads to the occupation of a large amount of device planar load space by inductance, which limits the miniaturization and integration capability of filter.

[0004] Based on the multi-layer high-density substrate process, three-dimensional inductance can be designed, and the Q value is much larger than that of the planar inductance based on the semiconductor passive integration process, but due to the large height between the metal layers of this process, the area of capacitive structure designed by this process will be much larger than that of the semiconductor passive integration process. Therefore, both the multi-layer high-density substrate process and the semiconductor passive integration process have their own shortcomings. SUMMARY

[0005] In order to solve the above technical problems, the present application provides a three-dimensional hybrid integrated filter, which comprises a medium for carrying capacitors, a medium for carrying inductors and a carrying substrate arranged along the stacking direction, the medium for carrying capacitors and the carrying substrate are arranged above and below the medium for carrying inductors respectively, the medium for carrying capacitors comprises MIM capacitors; the medium for carrying inductors and the carrying substrate are connected by BGA ball grid array packaging method; the medium for carrying capacitors, the medium for carrying inductors and the carrying substrate comprise a plurality of dielectric layers stacked along the stacking direction;

[0006] The medium for carrying inductance includes first to seventh three-dimensional spiral inductances L1-L7, which are composed of multiple metalized electrodes arranged at different horizontal planes and multiple via conductors penetrating through the partial medium layer in the vertical direction; the first three-dimensional spiral inductance L1 has the same structure as the sixth three-dimensional spiral inductance L6, the second three-dimensional spiral inductance L2 has the same structure as the fifth three-dimensional spiral inductance L5, and the third three-dimensional spiral inductance L3 has the same structure as the fourth three-dimensional spiral inductance L4.

[0007] The further limited technical solutions of the application are:

[0008] Further, the first three-dimensional spiral inductance L1 and the second three-dimensional spiral inductance L2 are arranged such that the magnetic lines of force at both ends of the first three-dimensional spiral inductance and the second three-dimensional spiral inductance are perpendicular to each other, and at least one grounding via is arranged between the first three-dimensional spiral inductance L1 and the second three-dimensional spiral inductance L2; the third three-dimensional spiral inductance L3 and the second three-dimensional spiral inductance L2 are arranged such that the magnetic lines of force at both ends of the third three-dimensional spiral inductance L3 and the second three-dimensional spiral inductance L2 are perpendicular to each other, and at least one grounding via is arranged between the third three-dimensional spiral inductance L3 and the second three-dimensional spiral inductance L2; the seventh three-dimensional spiral inductance L7 is arranged such that the magnetic lines of force at both ends of the seventh three-dimensional spiral inductance L7 are perpendicular to the magnetic lines of force at both ends of the first three-dimensional spiral inductance L1 and the sixth three-dimensional spiral inductance L6, respectively.

[0009] The three-dimensional hybrid integrated filter as described above, the third three-dimensional spiral inductance L3 and the fourth three-dimensional spiral inductance L4 are placed side by side, and the magnetic lines of force at both ends thereof are parallel to each other.

[0010] The three-dimensional hybrid integrated filter as described above, the spacing between the third three-dimensional spiral inductance L3 and the fourth three-dimensional spiral inductance L4 can be adjusted to change the frequency point of the transmission zero point in the frequency response of the filter.

[0011] The three-dimensional hybrid integrated filter as described above, the second three-dimensional spiral inductance L2, the fifth three-dimensional spiral inductance L5, and the seventh three-dimensional spiral inductance L5 are electrically connected to the carrying substrate by a BGA ball grid array packaging method.

[0012] The three-dimensional hybrid integrated filter as described above, the medium for carrying capacitance is integrated with the medium for carrying inductance by using a reverse mounting method.

[0013] The three-dimensional hybrid integrated filter as described above, the medium for carrying capacitance is electrically connected to the medium for carrying inductance by using a copper pillar.

[0014] The three-dimensional hybrid integrated filter as claimed in the preceding claim, comprises a port Port 1 and a port Port 2 in the medium for carrying the capacitance, the port Port 1 and the port Port 2 are connected with the carrying substrate by the BGA ball grid array packaging mode.

[0015] The three-dimensional hybrid integrated filter as claimed in the preceding claim, comprises a capacitance C1, a capacitance C2, a capacitance C3, a capacitance C4, a capacitance C5, a capacitance C6 and two capacitances C7 in the medium for carrying the capacitance, the capacitances C1-C7 are composed of a plurality of mutually opposed metallized electrodes in the stacking direction and the medium inside the medium for carrying the capacitance;

[0016] The first three-dimensional spiral inductor L1 is connected with the capacitance C1 in the medium for carrying the capacitance through the metallized transmission line and the copper column, to form a resonator R 1， The second three-dimensional spiral inductor L2 is connected with the capacitance C2 in the medium for carrying the capacitance through the metallized transmission line and the copper column, to form a resonator R 2， The third three-dimensional spiral inductor L3 is connected with the capacitance C3 in the medium for carrying the capacitance through the metallized transmission line and the copper column, to form a resonator R 3， The fourth three-dimensional spiral inductor L4 is connected with the capacitance C4 in the medium for carrying the capacitance through the metallized transmission line and the copper column, to form a resonator R 4， The fifth three-dimensional spiral inductor L5 is connected with the capacitance C5 in the medium for carrying the capacitance through the metallized transmission line and the copper column, to form a resonator R 5， The sixth three-dimensional spiral inductor L6 is connected with the capacitance C6 in the medium for carrying the capacitance through the metallized transmission line and the copper column, to form a resonator R6; the two capacitances C7 in the medium for carrying the capacitance are connected with the ground via hole in the medium for carrying the inductance through the metallized transmission line and the copper column;

[0017] The resonator R1 is connected with the port Port 1 through the metallized transmission line and the copper column, the resonator R1 is connected with the resonator R2 through the metallized transmission line in the medium for carrying the capacitance, the resonator R2 is connected with the carrying substrate by the BGA ball grid array packaging mode, the resonator R1 is connected with the resonator R3 through the metallized transmission line in the medium for carrying the capacitance, the resonator R1 is connected with one capacitance C7 through the metallized transmission line in the medium for carrying the capacitance, the resonator R3 is connected with the seventh three-dimensional spiral inductor L7 through the copper column;

[0018] Resonator R6 is connected with port Port2 through metallized transmission line and copper column, resonator R6 is connected with resonator R5 through metallized transmission line in medium for bearing capacitor, resonator R5 is connected with bearing substrate through BGA ball grid array packaging mode, resonator R6 is connected with resonator R4 through metallized transmission line in medium for bearing capacitor, resonator R6 is connected with a capacitor C7 through metallized transmission line in medium for bearing capacitor, resonator R4 is connected with seventh three-dimensional spiral inductor L7 through copper column.

[0019] Another object of the present application is to provide an electronic device with the above three-dimensional hybrid integrated filter.

[0020] The present application has the following advantages:

[0021] The present application provides a three-dimensional hybrid integrated filter, the chip of integrated high-density capacitor of the three-dimensional hybrid integrated filter is stacked on inductor through Bump (conductive piece), the size of the filter can be greatly reduced by using high-density capacitor and vertically distributed capacitor inductor, the filter is integrated in communication system through BGA mode, in addition, the filter can greatly reduce the coupling between inductors by skillfully arranging the positions of three-dimensional spiral inductors, making the magnetic field direction of both ends of the three-dimensional spiral inductor perpendicular or parallel to each other, and placing the inductor with magnetic field perpendicular to the magnetic field of the other two inductors between the two inductors can further reduce the coupling of the two inductors, the frequency response of the filter has three transmission zeros, and has the characteristics of high suppression and wide stop band. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a filter schematic diagram of the embodiment of the present application;

[0023] Figure 2 It is an integrated architecture schematic diagram of the embodiment of the present application;

[0024] Figure 3 It is an architecture schematic diagram of medium for bearing capacitor and medium for bearing inductor in the embodiment of the present application;

[0025] Figure 4 It is a medium for bearing capacitor schematic diagram in the embodiment of the present application;

[0026] Figure 5 It is a medium for bearing inductor schematic diagram in the embodiment of the present application;

[0027] Figure 6 It is a filter performance schematic diagram in the embodiment of the present application. DETAILED DESCRIPTION

[0028] The embodiment provides a three-dimensional mixed integrated filter, that is, a high-suppression 6-order band-pass filter with 3 zeros, as shown in the figure. Figures 1 to 5 As shown in the figure, the three-dimensional mixed integrated filter comprises a medium for carrying a capacitor, a medium for carrying an inductor and a carrying substrate arranged along a stacking direction, the medium for carrying the capacitor and the carrying substrate are arranged above and below the medium for carrying the inductor respectively, and the medium for carrying the capacitor comprises MIM capacitors; the medium for carrying the inductor and the carrying substrate are connected through a BGA ball grid array packaging mode; the medium for carrying the capacitor, the medium for carrying the inductor and the carrying substrate comprise a plurality of dielectric layers stacked along the stacking direction.

[0029] The medium for carrying the inductor comprises first to seventh three-dimensional spiral inductors L1-L7, the first to seventh three-dimensional spiral inductors L1-L7 are composed of a plurality of metalized electrodes arranged on different horizontal planes and a plurality of via conductors penetrating through the partial dielectric layers along the vertical direction; the first three-dimensional spiral inductor L1 has the same structure as the sixth three-dimensional spiral inductor L6, the second three-dimensional spiral inductor L2 has the same structure as the fifth three-dimensional spiral inductor L5, and the third three-dimensional spiral inductor L3 has the same structure as the fourth three-dimensional spiral inductor L4.

[0030] The first three-dimensional spiral inductor L1 and the second three-dimensional spiral inductor L2 are arranged such that the magnetic lines of force at the two ends of the first three-dimensional spiral inductor and the second three-dimensional spiral inductor are perpendicular to each other, and at least one grounding via hole is arranged between the first three-dimensional spiral inductor L1 and the second three-dimensional spiral inductor L2; the third three-dimensional spiral inductor L3 and the second three-dimensional spiral inductor L2 are arranged such that the magnetic lines of force at the two ends of the third three-dimensional spiral inductor L3 and the second three-dimensional spiral inductor L2 are perpendicular to each other, and at least one grounding via hole is arranged between the third three-dimensional spiral inductor L3 and the second three-dimensional spiral inductor L2; the seventh three-dimensional spiral inductor L7 is arranged such that the magnetic lines of force at the two ends of the seventh three-dimensional spiral inductor L7 are perpendicular to the magnetic lines of force at the two ends of the first three-dimensional spiral inductor L1 and the sixth three-dimensional spiral inductor L6 respectively.

[0031] The third three-dimensional spiral inductor L3 and the fourth three-dimensional spiral inductor L4 are arranged side by side, and the magnetic lines of force at the two ends thereof are parallel to each other; the frequency point of the transmission zero point in the frequency response of the filter can be changed by adjusting the spacing of the third three-dimensional spiral inductor L3 and the fourth three-dimensional spiral inductor L4; the second three-dimensional spiral inductor L2, the fifth three-dimensional spiral inductor L5 and the seventh three-dimensional spiral inductor L5 are electrically connected to the carrying substrate through a BGA ball grid array packaging mode; the medium for carrying the capacitor is integrated with the medium for carrying the inductor through a reverse mounting mode; the medium for carrying the capacitor and the medium for carrying the inductor are electrically connected through copper pillars; the medium for carrying the inductor comprises a port Port1 and a port Port2, and the port Port1 and the port Port2 are connected to the carrying substrate through a BGA ball grid array packaging mode.

[0032] The capacitors C1, C2, C3, C4, C5, C6 and two capacitors C7 in the dielectric for carrying capacitors are composed of a plurality of mutually opposed metallized electrodes in the stacking direction and the dielectric inside the dielectric for carrying capacitors.

[0033] The first three-dimensional spiral inductor L1 is connected with the capacitor C1 in the dielectric for carrying capacitors through the metallized transmission line and the copper column, and constitutes the resonator R 1， The second three-dimensional spiral inductor L2 is connected with the capacitor C2 in the dielectric for carrying capacitors through the metallized transmission line and the copper column, and constitutes the resonator R 2， The third three-dimensional spiral inductor L3 is connected with the capacitor C3 in the dielectric for carrying capacitors through the metallized transmission line and the copper column, and constitutes the resonator R 3， The fourth three-dimensional spiral inductor L4 is connected with the capacitor C4 in the dielectric for carrying capacitors through the metallized transmission line and the copper column, and constitutes the resonator R 4， The fifth three-dimensional spiral inductor L5 is connected with the capacitor C5 in the dielectric for carrying capacitors through the metallized transmission line and the copper column, and constitutes the resonator R 5， The sixth three-dimensional spiral inductor L6 is connected with the capacitor C6 in the dielectric for carrying capacitors through the metallized transmission line and the copper column, and constitutes the resonator R6; the two capacitors C7 in the dielectric for carrying capacitors are connected with the ground via hole in the dielectric for carrying inductors through the metallized transmission line and the copper column.

[0034] The resonator R1 is connected with the port Port1 through the metallized transmission line and the copper column, the resonator R1 is connected with the resonator R2 through the metallized transmission line in the dielectric for carrying capacitors, the resonator R2 is connected with the carrying substrate through the BGA ball grid array packaging mode, the resonator R1 is connected with the resonator R3 through the metallized transmission line in the dielectric for carrying capacitors, the resonator R1 is connected with one capacitor C7 through the metallized transmission line in the dielectric for carrying capacitors, and the resonator R3 is connected with the seventh three-dimensional spiral inductor L7 through the copper column.

[0035] The resonator R6 is connected with the port Port2 through the metallized transmission line and the copper column, the resonator R6 is connected with the resonator R5 through the metallized transmission line in the dielectric for carrying capacitors, the resonator R5 is connected with the carrying substrate through the BGA ball grid array packaging mode, the resonator R6 is connected with the resonator R4 through the metallized transmission line in the dielectric for carrying capacitors, the resonator R6 is connected with one capacitor C7 through the metallized transmission line in the dielectric for carrying capacitors, and the resonator R4 is connected with the seventh three-dimensional spiral inductor L7 through the copper column.

[0036] Figure 6For the S parameter performance of the filter of the embodiment, the filter passband center frequency is 1GHz, the relative bandwidth is 30%, the return loss is 12dB, the insertion loss is 3dB, and the 20dB stopband can extend to 4.65f0 frequency.

[0037] The chip of the integrated high-density capacitor of the three-dimensional hybrid integrated filter is stacked on the inductor through a bump, the high-density capacitor and the vertically distributed capacitor inductor can greatly reduce the size of the filter, the filter is integrated in a communication system through a BGA mode, in addition, the filter can greatly reduce the coupling between the inductors by skillfully arranging the positions of the three-dimensional spiral inductors so that the magnetic field directions of the two ends of the three-dimensional spiral inductors are perpendicular or parallel to each other, and can further reduce the coupling between the two inductors by placing the inductor with the magnetic field perpendicular to the magnetic fields of the other two inductors between the two inductors, the frequency response of the filter has three transmission zeros, and has the characteristics of high suppression and wide stopband.

[0038] In addition to the above-mentioned embodiments, the present application can have other implementation manners. Any technical solution formed by equivalent substitution or equivalent transformation falls within the protection scope required by the present application.

Claims

1. A three-dimensional hybrid integrated filter, characterized by: The resonator R1 is connected with the port Port1 through the metallized transmission line and the copper column, the resonator R1 is connected with the resonator R2 through the metallized transmission line in the medium for carrying the capacitor, the resonator R2 is connected with the carrying substrate through the BGA ball grid array packaging mode, the resonator R1 is connected with the resonator R3 through the metallized transmission line in the medium for carrying the capacitor, the resonator R1 is connected with one of the capacitor C7 through the metallized transmission line in the medium for carrying the capacitor, and the resonator R3 is connected with the seventh three-dimensional spiral inductor L7 through the copper column. The medium for carrying the inductor is connected with the carrying substrate through the BGA ball grid array packaging mode; the medium for carrying the capacitor, the medium for carrying the inductor and the carrying substrate comprise a plurality of dielectric layers stacked along the stacking direction; The medium for carrying the inductor comprises first to seventh three-dimensional spiral inductors L1-L7, which are composed of a plurality of metalized electrodes arranged on different horizontal planes and a plurality of via conductors penetrating through the partial dielectric layers in the vertical direction; the first three-dimensional spiral inductor L1 has the same structure as the sixth three-dimensional spiral inductor L6, the second three-dimensional spiral inductor L2 has the same structure as the fifth three-dimensional spiral inductor L5, and the third three-dimensional spiral inductor L3 has the same structure as the fourth three-dimensional spiral inductor L4; The medium for carrying the inductor comprises a port Port1 and a port Port2, which are connected with the carrying substrate through the BGA ball grid array packaging mode; The medium for carrying the capacitor comprises capacitors C1, C2, C3, C4, C5, C6 and two capacitors C7, which are composed of a plurality of metalized electrodes opposite to each other in the stacking direction and the medium inside the medium for carrying the capacitor; The first three-dimensional spiral inductor L1 is connected with the capacitor C1 in the medium carrying the capacitor through the metallized transmission line and the copper column, and constitutes a resonator R 1， The second three-dimensional spiral inductor L2 is connected with the capacitor C2 in the medium carrying the capacitor through the metallized transmission line and the copper column, and constitutes a resonator R 2， The third three-dimensional spiral inductor L3 is connected with the capacitor C3 in the medium carrying the capacitor through the metallized transmission line and the copper column, and constitutes a resonator R 3， The fourth three-dimensional spiral inductor L4 is connected with the capacitor C4 in the medium carrying the capacitor through the metallized transmission line and the copper column, and constitutes a resonator R 4， The fifth three-dimensional spiral inductor L5 is connected with the capacitor C5 in the medium carrying the capacitor through the metallized transmission line and the copper column, and constitutes a resonator R 5， The sixth three-dimensional spiral inductor L6 is connected with the capacitor C6 in the medium carrying the capacitor through the metallized transmission line and the copper column, and constitutes a resonator R6; two capacitors C7 in the medium carrying the capacitor are connected with the ground via hole in the medium carrying the inductor through the metallized transmission line and the copper column; The resonator R1 is connected with the port Port1 through the metallized transmission line and the copper column, the resonator R1 is connected with the resonator R2 through the metallized transmission line in the medium for carrying the capacitor, the resonator R2 is connected with the carrying substrate through the BGA ball grid array packaging mode, the resonator R1 is connected with the resonator R3 through the metallized transmission line in the medium for carrying the capacitor, the resonator R1 is connected with one of the capacitor C7 through the metallized transmission line in the medium for carrying the capacitor, the resonator R3 is connected with the seventh three-dimensional spiral inductor L7 through the copper column; The resonator R6 is connected with the port Port2 through the metallized transmission line and the copper column, the resonator R6 is connected with the resonator R5 through the metallized transmission line in the medium for carrying the capacitor, the resonator R5 is connected with the carrying substrate through the BGA ball grid array packaging mode, the resonator R6 is connected with the resonator R4 through the metallized transmission line in the medium for carrying the capacitor, the resonator R6 is connected with one of the capacitor C7 through the metallized transmission line in the medium for carrying the capacitor, and the resonator R4 is connected with the seventh three-dimensional spiral inductor L7 through the copper column. The first three-dimensional spiral inductor L1 and the second three-dimensional spiral inductor L2 are arranged such that the magnetic lines of force at both ends of the first three-dimensional spiral inductor L1 and the second three-dimensional spiral inductor L2 are perpendicular to each other, and at least one grounding via is arranged between the first three-dimensional spiral inductor L1 and the second three-dimensional spiral inductor L2; the third three-dimensional spiral inductor L3 and the second three-dimensional spiral inductor L2 are arranged such that the magnetic lines of force at both ends of the third three-dimensional spiral inductor L3 and the second three-dimensional spiral inductor L2 are perpendicular to each other, and at least one grounding via is arranged between the third three-dimensional spiral inductor L3 and the second three-dimensional spiral inductor L2; the seventh three-dimensional spiral inductor L7 is arranged such that the magnetic lines of force at both ends of the seventh three-dimensional spiral inductor L7 are perpendicular to the magnetic lines of force at both ends of the first three-dimensional spiral inductor L1 and the sixth three-dimensional spiral inductor L6, respectively. The third three-dimensional spiral inductor L3 and the fourth three-dimensional spiral inductor L4 are arranged side by side, and the magnetic lines of force at both ends thereof are parallel to each other.

2. The three-dimensional hybrid integrated filter of claim 1, wherein: By adjusting the spacing between the third three-dimensional spiral inductor L3 and the fourth three-dimensional spiral inductor L4, the frequency point of the transmission zero point in the filter frequency response can be changed.

3. The three-dimensional hybrid integrated filter of claim 1, wherein: The second three-dimensional spiral inductor L2, the fifth three-dimensional spiral inductor L5, and the seventh three-dimensional spiral inductor L5 are electrically connected to the carrier substrate by a BGA ball grid array packaging method.

4. The three-dimensional hybrid integrated filter of claim 1, wherein: The medium for carrying the capacitor is integrated with the medium for carrying the inductor by a reverse mounting method.

5. The three-dimensional hybrid integrated filter of claim 4, wherein: The medium for carrying the capacitor and the medium for carrying the inductor are electrically connected by copper pillars. 6.An electronic device, characterized by comprising: The three-dimensional hybrid integrated filter of any one of claims 1-5. The three-dimensional hybrid integrated filter of any one of claims 1-5.

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