Glue overflow blocking test method, device, equipment and computer readable storage medium

Abstract

The application discloses a glue overflow and load blocking test method, device, equipment and computer readable storage medium. The method comprises the following steps: obtaining a target no-pressure signal amount collected by a pressure sensor of a to-be-tested earphone when the to-be-tested earphone is not subjected to external force, wherein the to-be-tested earphone is placed on a loading platform of a test equipment; obtaining a target channel compensation value output by the pressure sensor when the to-be-tested earphone is subjected to external force; and obtaining a test result of glue overflow of the to-be-tested earphone if it is detected that the target channel compensation value is less than the target no-pressure signal amount. The application can determine whether glue overflow occurs in the internal part of a packaged to-be-tested earphone, and thus can exclude to-be-tested earphones with internal glue overflow in the production process to ensure the sensitivity of touch sensing of the batch of earphones.

Description

Technical Field

[0001] The present invention relates to the field of earphone technology, and in particular to a method, device, equipment and computer-readable storage medium for testing overflow glue interception. Background Art

[0002] During the earphone production process, the earphone shell joints and the pressure sensor backplate need to be glued together. During this gluing process, glue overflow may occur, resulting in insensitive touch sensing of the earphones. Therefore, after production, the earphones need to be tested for glue overflow to ensure normal function and appearance. Existing technology can only detect glue overflow on the exterior surface of the packaged earphones, and cannot detect whether glue overflow occurs when the earphones are packaged internally. Therefore, determining whether glue overflow occurs inside the packaged earphones becomes very important. Summary of the Invention

[0003] The main purpose of the present invention is to provide a method, device, equipment and computer-readable storage medium for testing overflow glue, aiming to propose a test scheme for overflow glue to detect whether there is overflow glue inside the packaged earphones, and then exclude the earphones with overflow glue to ensure the sensitivity of the touch sensing of this batch of earphones.

[0004] To achieve the above object, the present invention provides a method for testing overflow glue loading, the method comprising the following steps:

[0005] The overflow glue interception test method is applied to a test device, and the overflow glue interception test method includes:

[0006] Obtaining a target no-pressure signal amount collected by a pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, wherein the headphone under test is placed on a platform of the testing device;

[0007] Obtaining a target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force;

[0008] If it is detected that the target channel compensation value is less than the target pressure-free signal amount, a test result indicating that glue overflow occurs in the earphone to be tested is obtained.

[0009] Optionally, the step of obtaining a target pressure-free signal amount collected by a pressure sensor of the headphone under test when the headphone under test is not subjected to an external force includes:

[0010] When it is detected that the earphone to be tested is not subjected to an external force, controlling the pressure sensor to collect a first preset number of pressure-free signal quantities at a first preset time interval, and obtaining each pressure-free signal quantity collected by the pressure sensor;

[0011] The target non-pressure-sensitive signal amount is obtained by calculating an average value of each non-pressure-sensitive signal amount.

[0012] Optionally, when the earphone to be tested is not subjected to an external force, controlling the pressure sensor to collect a first preset number of pressure-free signal quantities at a first preset time interval, and obtaining each pressure-free signal quantity collected by the pressure sensor includes:

[0013] When it is detected that the headset to be tested is not subjected to an external force, sending a communication interaction instruction to the headset to be tested;

[0014] Continuously detecting whether the headset to be tested sends a communication interaction instruction confirmation signal within a second preset time period;

[0015] If not, returning to the step of sending the communication interaction instruction to the headset to be tested;

[0016] If so, the pressure sensor is controlled to collect the first preset number of pressure-free signal quantities at a first preset time interval, and each pressure-free signal quantity collected by the pressure sensor is obtained.

[0017] Optionally, the step of obtaining the target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force includes:

[0018] When the earphone to be tested is subjected to an external force, controlling the pressure sensor to collect channel compensation values ​​for a second preset number of times at a third preset time interval, and obtaining each channel compensation value collected by the pressure sensor;

[0019] The target channel compensation value is obtained by calculating the compensation values ​​of each channel and calculating the average value.

[0020] Optionally, before the step of controlling the pressure sensor to collect the channel compensation values ​​for a second preset number of times at a third preset time interval, the method further includes:

[0021] The pressure device is controlled to apply pressure to the earphone to be tested.

[0022] Optionally, before the step of obtaining the target pressure-free signal amount collected by the pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, the method further includes:

[0023] Control the initial pressure sensing signal of the pressure sensor to return to zero.

[0024] Optionally, after the step of obtaining a test result indicating that glue overflow occurs in the headphone under test if it is detected that the target channel compensation value is less than the target pressure-free signal amount, the method further includes:

[0025] The test result of glue overflow of the earphone to be tested is sent to the MES system, so that the MES system can store the test result.

[0026] In addition, to achieve the above-mentioned purpose, the present invention further provides a glue overflow interception test device, which includes:

[0027] a first acquisition module, configured to acquire a target pressure-free signal amount collected by a pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, wherein the headphone under test is placed on a platform of the test device;

[0028] a second acquisition module, configured to acquire a target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force;

[0029] The result judgment module is used to obtain a test result that glue overflow occurs in the earphone under test if it is detected that the target channel compensation value is less than the target pressure-free signal amount.

[0030] In addition, to achieve the above-mentioned purpose, the present invention also provides a glue overflow loading test device, which includes: a memory, a processor, and a glue overflow loading test program stored in the memory and runnable on the processor. When the glue overflow loading test program is executed by the processor, the steps of the above-mentioned glue overflow loading test method are implemented.

[0031] In addition, to achieve the above-mentioned purpose, the present invention provides a computer-readable storage medium, on which a glue overflow interception test program is stored. When the glue overflow interception test program is executed by a processor, the steps of the above-mentioned glue overflow interception test method are implemented.

[0032] The present invention obtains a target pressure-free signal amount collected by a pressure sensor of the earphone to be tested when the earphone to be tested is not subjected to an external force, wherein the earphone to be tested is placed on a carrier of the testing device; obtains a target channel compensation value output by the pressure sensor when the earphone to be tested is subjected to an external force; if it is detected that the target channel compensation value is less than the target pressure-free signal amount, a test result of glue overflow in the earphone to be tested is obtained, thereby making it possible to judge whether glue overflow occurs inside the packaged earphone to be tested, and then to exclude earphones to be tested with glue overflow inside during the production process to ensure the sensitivity of touch sensing of this batch of earphones. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic flow chart of a first embodiment of a method for testing overflow glue loading;

[0034] Figure 2 This is a schematic diagram of the principle of a glue overflow interception test according to an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of the structure of the hardware operating environment involved in the embodiment of the present invention.

[0036] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0037] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] Please refer to Figure 1 , Figure 1 Schematic diagram of the flow of the first embodiment of the overflow glue interception test method of the present invention.

[0039] An embodiment of the present invention provides an embodiment of a method for testing an overflowing glue. It should be noted that although a logical sequence is shown in the flow chart, in some cases, the method for testing an overflowing glue can certainly perform the steps shown or described in a different order than that shown here.

[0040] In addition, the overflow glue interception test method of the present invention is applied to the overflow glue interception test equipment. For ease of explanation and understanding, the overflow glue interception test method of the present invention is described below using the test equipment as the execution subject.

[0041] In an embodiment of the present invention, the overflow glue interception test method of the present invention may include:

[0042] Step S10, obtaining a target no-pressure signal amount collected by the pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, wherein the headphone under test is placed on a platform of the testing device;

[0043] It should be noted that, in this embodiment, overflow glue interception refers to screening and excluding the headphones to be tested with overflow glue from normal headphone products to ensure the touch sensing sensitivity of this batch of headphone products. The pressure sensor is arranged in the cavity of the headphone to be tested, near one end of the back shell of the headphone. The amount of non-pressure-sensitive signal refers to the amount of pressure-sensitive signal collected by the pressure sensing module when the pressure sensor of the headphone to be tested is not subjected to external pressure. The headphone to be tested is placed on the carrier of the test equipment and can be connected to the test equipment wirelessly via Bluetooth or directly through a physical interface.

[0044] There are many ways for the test device to obtain the pressure-free signal amount collected by the pressure sensor in the headphone under test when the headphone under test is not subjected to external force, which are not limited in this embodiment. For example, in one feasible implementation, after the test device and the headphone under test are connected, the test device sends a pressure sensing self-calibration test instruction to the headphone under test. After receiving the instruction, the headphone under test performs the pressure sensing self-calibration test and sends the obtained pressure sensing signal amount as the pressure-free signal amount to the test device.

[0045] In another feasible implementation, step S10 includes:

[0046] Step S101: When it is detected that the earphone to be tested is not subjected to an external force, controlling the pressure sensor to collect a first preset number of pressure-free signal quantities at a first preset time interval, and obtaining each pressure-free signal quantity collected by the pressure sensor;

[0047] In this embodiment, after the test device establishes a connection with the earphone under test, when it detects that the earphone under test is not subjected to an external force, the test device can control the pressure sensor of the earphone under test to collect a first preset number of pressure-free signals at intervals of a first preset duration. The first preset duration and the first preset number of times can be set as needed and are not limited in the embodiments of the present invention. For example, the first preset duration can be set to 1000ms, and the first preset number of times can be set to 5. In one feasible embodiment, the test device can control the earphone under test by sending control instructions to the pressure sensor of the earphone under test; in another feasible embodiment, the test device can directly control the earphone under test through the connection established with the earphone under test.

[0048] Step S102 : Calculate the average value of each non-pressure-sensitive signal value to obtain the target non-pressure-sensitive signal value.

[0049] In this embodiment, after the testing device obtains multiple pressure-free signal quantities sent by the headphones to be tested, it calculates the average of the obtained pressure-free signal quantities, and uses the obtained average as the pressure-free signal quantity when the headphones to be tested are not subjected to external force. In this way, the accuracy of the obtained pressure-free signal quantity is guaranteed to a great extent.

[0050] Step S20, obtaining a target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force;

[0051] It should be noted that, in this embodiment, when the pressure sensor is subjected to an external force, it will output a pressure signal and a channel compensation value (offset value).

[0052] In one feasible implementation, the above step S20 includes:

[0053] Step S201, when the earphone to be tested is subjected to an external force, controlling the pressure sensor to collect channel compensation values ​​for a second preset number of times at a third preset time interval, and obtaining each channel compensation value collected by the pressure sensor;

[0054] In this embodiment, when the earphones to be tested are subjected to external force, the testing device can control the pressure sensor in the earphones to be tested to collect channel compensation values ​​for a second preset number of times at a time interval of a third preset time length; the third preset time length and the second preset number of times can be set as needed, and there is no restriction on this in the embodiment of the present invention. For example, the fourth preset time length can be set to 200 milliseconds, and the third preset number of times can be set to 3 times. The testing device controls the pressure sensor of the earphones to be tested to output channel compensation values ​​3 times at a time interval of 200 milliseconds.

[0055] Step S202 , calculating the compensation values ​​of each channel and calculating the average value to obtain the target channel compensation value.

[0056] In this embodiment, after the test device obtains the compensation values ​​of each channel, it calculates the average of these channel compensation values ​​and uses the calculated average as the target channel compensation value when the headphone under test is subjected to external force. In this way, the accuracy of the obtained channel compensation values ​​is ensured.

[0057] In step S30 , if it is detected that the target channel compensation value is less than the target pressure-free signal value, a test result indicating that glue overflow occurs in the earphone under test is obtained.

[0058] The testing device can compare the target channel compensation value with the target pressure-free signal amount and determine whether the headphone under test has glue overflow based on the comparison result. Specifically, if the target channel compensation value is less than the target pressure-free signal amount, that is, if the result of subtracting the target pressure-free signal amount from the target channel compensation value is a negative value, it can be determined that glue overflow has occurred in the headphone under test. Otherwise, it can be determined that glue overflow has not occurred in the headphone under test.

[0059] like Figure 2 As shown, the earphones to be tested are schematically drawn on the platform of the test equipment. The position marked 1 in the figure is the front shell of the earphones to be tested, the position marked 2 is the back shell of the earphones to be tested, and the joint between the front shell and the back shell is the middle shell of the earphones to be tested. The middle shell needs to be glued with glue when packaging the earphones. The number 3 is the platform of the test equipment (that is, the fixed platform in the figure), and the number 4 is the pressure sensor in the earphones to be tested.

[0060] In this embodiment, the principle of the glue overflow interception test is: whether there is glue overflow is determined based on the difference in the sensor diff value (the result of subtracting the target no-pressure signal amount from the target channel compensation value) when the pressure sensor is subjected to force. When the sealant of the middle shell and the rear shell overflows onto the pressure sensor module PCB (Printed Circuit Board), when only the middle shell is pressed, the deformation of the middle shell will drive the deformation of the pressure sensor module PCB. At this time, the Air GAP (air gap) for the module becomes larger, and the size of the Air GAP value affects the Sensor diff value. The increase in the Air GAP value is fed back to the product sensor diff value, which is a negative value. If the sensor diff value is negative, it is judged as glue overflow, and if the sensor diff value is positive, it is judged as no glue overflow. During a normal product pressure-sensing test, the back shell of the earphone is pressed, causing a relatively small deformation of about 1µm. This deformation has almost no effect on the pressure sensor module PCB and does not cause a change in the module's Air GAP value. This test equipment solution is designed based on the principle that pressing the middle shell and the back shell will produce different deformations, resulting in different sensor diff values.

[0061] In one possible implementation, Figure 2 As shown, the earphone to be tested is placed on the carrier and can be embedded in the carrier, and the placement angle of the earphone is the parting surface of the earphone (the junction surface between the front shell and the back shell of the earphone, Figure 2 The angle between the plane where the PCB board of the middle pressure sensor module is located (parallel to the parting surface) and the horizontal plane of the fixing table is greater than 90 degrees, for example, 105 degrees, to ensure that the direction of applied pressure passes through the center of the pressure sensor, so that the pressure sensor can detect the pressure more accurately. When pressure is applied to the middle shell of the earphone to be tested fixed on the fixing table, due to the interaction force, the fixing table will apply pressure to the back shell of the earphone to be tested fixed therein. When there is no glue overflow on the appearance surface and the internal packaging module of the earphone to be tested, the deformation of the middle shell of the earphone to be tested after the pressure device applies pressure to the earphone to be tested is only about one micron, and the influence of this deformation on the pressure collected by the pressure sensor of the earphone to be tested can be ignored. When glue overflows from the outer surface of the earphone under test, i.e., the middle shell, or from the internal packaging module of the earphone, the deformation of the middle shell after applying pressure to the earphone under test will cause the PCB where the pressure sensor of the earphone under test is located to deform, thereby increasing the Air GAP value in the cavity of the earphone under test. The Air GAP value affects the Sensor Diff value. The increase in the Air GAP value is fed back to the product Sensor Diff value as a negative value. A negative Sensor Diff value is judged as glue overflow.

[0062] In this embodiment, a target pressure-free signal amount collected by the pressure sensor of the earphone to be tested when the earphone to be tested is not subjected to external force is obtained, wherein the earphone to be tested is placed on the carrier of the testing device; a target channel compensation value output by the pressure sensor when the earphone to be tested is subjected to external force is obtained; if it is detected that the target channel compensation value is less than the target pressure-free signal amount, a test result of glue overflow in the earphone to be tested is obtained, thereby making it possible to judge whether glue overflow occurs inside the packaged earphone to be tested, and then to exclude the earphone to be tested with glue overflow inside during the production process to ensure the sensitivity of touch sensing of this batch of earphones.

[0063] Furthermore, based on the first embodiment of the overflow glue interception test method of the present invention, a second embodiment of the overflow glue interception test method of the present invention is proposed. In this embodiment, the above step S101 includes:

[0064] Step S1011: When it is detected that the headset to be tested is not subjected to an external force, a communication interaction instruction is sent to the headset to be tested;

[0065] It should be noted that, in this embodiment, the test device and the headset to be tested can be communicated via Bluetooth wireless or physical cable connection; the communication interaction instruction refers to an instruction sent to the device to be connected to request the establishment of a communication connection.

[0066] In one feasible implementation, when the test device detects that the headset under test is not subjected to external force, it sends a communication interaction instruction to the headset under test through SPP (Serial Port Profile) with which a Bluetooth wireless communication connection has been established to confirm that the headset under test can communicate and interact normally.

[0067] Step S1012, continuously detecting whether the headset to be tested sends a communication interaction instruction confirmation signal within a second preset time period;

[0068] It should be noted that, in this embodiment, the second preset time length can be customized according to different earphones to be tested, and there is no limitation on this in this embodiment. For example, the second preset time length can be set to 1000 milliseconds.

[0069] In this embodiment, after the test device sends a communication interaction instruction to the headset under test, it continuously detects whether the headset under test sends a confirmation signal of the communication interaction instruction within a second preset time period to determine whether the headset under test can communicate with the test device to perform the overflow glue interception test.

[0070] Step S1013: If not, return to step S1011;

[0071] In this embodiment, if the test device does not detect the confirmation signal of the communication interaction instruction sent by the headset to be tested within the second preset time period, it returns to the step of sending the communication interaction instruction to the headset to be tested for retrying. If the signal is still not detected after multiple retries, the subsequent steps of the overflow glue interception test method are stopped, and it is confirmed that the headset to be tested cannot pass normally. In this way, the efficiency of the overflow glue interception test is ensured.

[0072] Step S1014: If yes, control the pressure sensor to collect the first preset number of pressure-free signal quantities at a first preset time interval, and obtain each pressure-free signal quantity collected by the pressure sensor.

[0073] In this embodiment, when the testing device detects a communication interaction instruction confirmation signal sent by the headset to be tested within a second preset time period, it controls the pressure sensor of the headset to be tested to collect a first preset number of pressure-free signal quantities at time intervals of a first preset time period, and obtains each pressure-free signal quantity to calculate the target pressure-free signal quantity based on each pressure-free signal quantity.

[0074] In this embodiment, when it is detected that the headset to be tested is not subjected to external force, a communication interaction instruction is sent to the headset to be tested; then, whether the headset to be tested sends a communication interaction instruction confirmation signal is continuously detected within a second preset time period; then, if not, the step of sending the communication interaction instruction to the headset to be tested is returned to; finally, if the confirmation signal is detected within the continuous time period, the pressure sensor is controlled to collect a preset number of third pressure sensing signal quantities at a preset time interval and obtain each third pressure sensing signal quantity, thereby effectively screening out the headset to be tested that is unable to communicate and interact, and greatly improving the test efficiency of the overflow glue interception test.

[0075] Furthermore, based on the first embodiment and / or the second embodiment of the overflow glue interception test method of the present invention, a third embodiment of the overflow glue interception test method of the present invention is proposed. In this embodiment, before step S10, the following steps are further included:

[0076] Step S40: Control the initial pressure sensing signal of the pressure sensor to return to zero.

[0077] It should be noted that the pressure sensor packaged in the headset to be tested may be purchased from other manufacturers. The pressure sensor may have an initial pressure-sensing signal due to factory inspection and other reasons, which may affect the accuracy of the pressure sensing function of the pressure sensor.

[0078] Before obtaining the amount of no-pressure-sensing signal collected by the pressure sensor of the earphone under test when the earphone under test is not subjected to an external force, the test equipment controls the amount of the initial pressure-sensing signal of the pressure sensor of the earphone under test to be zero.

[0079] In this embodiment, the test equipment controls the initial pressure sensing signal of the pressure sensor of the earphone to be tested to zero before performing the glue overflow interception test, thereby eliminating the influence of the initial pressure sensing signal on the accuracy of data collected by the pressure sensor in the earphone to be tested, thereby further improving the accuracy of judging whether glue overflow occurs in the earphone to be tested.

[0080] Furthermore, based on the first, second, and / or third embodiments of the above-mentioned overflow glue arresting test method of the present invention, a fourth embodiment of the overflow glue arresting test method of the present invention is proposed. In this embodiment, before step S201, when the earphone under test is subjected to an external force, controlling the pressure sensor to collect a second preset number of fourth pressure sensing signals at a third preset time interval, and obtaining each of the fourth pressure sensing signals collected by the pressure sensor, further includes:

[0081] Step S50: Control the pressure device to apply pressure to the earphone to be tested.

[0082] The test equipment can be equipped with a pressure device for applying pressure to the headphones under test, and this pressure device can precisely control the amount of pressure applied to the headphones under test. The test equipment controls the pressure device to apply pressure to the headphones under test, and controls the pressure to be within the maximum pressure range that a user can apply to the headphones under normal use, thereby simulating the actual use scenario of the headphones. The maximum pressure range can be determined through experiments and is not limited in this embodiment.

[0083] In one feasible implementation, the test equipment can pre-pressurize the pressure sensor of the earphone under test. The pre-pressurization is controllable and visualized. The applied pressure is adjusted according to the pressure value and diff value to ensure that the diff value of the earphone under test is stable.

[0084] In this embodiment, the test equipment controls the way in which the pressure device applies pressure to the earphones under test so that the pressure applied to the earphones under test is within the maximum pressure applied by the user to the earphones under normal use, thereby ensuring the stability of the applied pressure and further ensuring the accuracy of the channel compensation values ​​collected by the earphones under test.

[0085] Furthermore, based on the first, second, third, and / or fourth embodiments of the aforementioned glue overflow prevention test method of the present invention, a fifth embodiment of the glue overflow prevention test method of the present invention is proposed. In this embodiment, after step S30, in which the test result indicating glue overflow occurs in the headphone under test is obtained if the channel compensation value is detected to be less than the pressure-free signal amount, the method further includes:

[0086] Step S60: Send the glue overflow test result of the earphone to be tested to the MES system, so that the MES system can store the test result.

[0087] It should be noted that the MES (Manufacturing Execution System) system refers to a "management information system for the workshop level located between the upper-level planning management system and the lower-level industrial control system". It provides operators / managers with plan execution, tracking, and the current status of all resources (people, equipment, materials, customer needs, etc.).

[0088] In this embodiment, after the testing equipment obtains the test result that glue overflow occurs in the earphones to be tested, the test result is sent to the MES system. The MES system receives and stores the test result, thereby effectively screening out the earphones with glue overflow and ensuring the sensitivity of the touch sensing of this batch of earphones.

[0089] In addition, an embodiment of the present invention further provides a device for testing overflow glue and preventing loading, which is applied to a test device and includes:

[0090] a first acquisition module, configured to acquire a target pressure-free signal amount collected by a pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, wherein the headphone under test is placed on a platform of the test device;

[0091] a second acquisition module, configured to acquire a target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force;

[0092] The result judgment module is used to obtain a test result that glue overflow occurs in the earphone under test if it is detected that the target channel compensation value is less than the target pressure-free signal amount.

[0093] Furthermore, the first acquisition module is further configured to:

[0094] When it is detected that the earphone to be tested is not subjected to an external force, controlling the pressure sensor to collect a first preset number of pressure-free signal quantities at a first preset time interval, and obtaining each pressure-free signal quantity collected by the pressure sensor;

[0095] The target non-pressure-sensitive signal amount is obtained by calculating an average value of each non-pressure-sensitive signal amount.

[0096] Furthermore, the first acquisition module is further configured to:

[0097] When it is detected that the headset to be tested is not subjected to an external force, sending a communication interaction instruction to the headset to be tested;

[0098] Continuously detecting whether the headset to be tested sends a communication interaction instruction confirmation signal within a second preset time period;

[0099] If not, returning to the step of sending the communication interaction instruction to the headset to be tested;

[0100] If so, the pressure sensor is controlled to collect the first preset number of pressure-free signal quantities at a first preset time interval, and each pressure-free signal quantity collected by the pressure sensor is obtained.

[0101] Furthermore, the second acquisition module is further configured to:

[0102] When the earphone to be tested is subjected to an external force, controlling the pressure sensor to collect channel compensation values ​​for a second preset number of times at a third preset time interval, and obtaining each channel compensation value collected by the pressure sensor;

[0103] The target channel compensation value is obtained by calculating the compensation values ​​of each channel and calculating the average value.

[0104] Furthermore, the device further comprises:

[0105] The first control module is configured to control the pressure device to apply pressure to the earphone to be tested.

[0106] Furthermore, the device further comprises:

[0107] The second control module is used to control the initial pressure sensing signal of the pressure sensor to return to zero.

[0108] Furthermore, the device further comprises:

[0109] The sending module is used to send the test result of glue overflow of the earphone to the MES system, so that the MES system can store the test result.

[0110] The expanded content of the specific implementation of the overflow glue interception test device of the present invention is basically the same as the various embodiments of the above-mentioned overflow glue interception test method, and will not be repeated here.

[0111] In addition, the embodiment of the present invention also provides a glue overflow interception test device, such as Figure 3 As shown, Figure 3 It should be noted that the overflow glue interception test device of the embodiment of the present invention can be a headset, a smart phone, a personal computer, a server and other devices, and is not specifically limited here.

[0112] like Figure 3As shown, the overflow glue interception test equipment may include: a processor 1001, such as a CPU, a network interface 1004, a user interface 1003, a memory 1005, and a communication bus 1002. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a WI-FI interface). The memory 1005 may be a high-speed RAM memory, or it may be a stable memory (non-volatile memory), such as a disk memory. The memory 1005 may optionally also be a storage device independent of the aforementioned processor 1001.

[0113] Those skilled in the art will understand that Figure 3 The device structure shown in the figure does not constitute a limitation on the overflow glue interception test device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0114] like Figure 3 As shown, the memory 1005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a glue overflow interception test program. The operating system is a program that manages and controls the hardware and software resources of the device and supports the operation of the glue overflow interception test program and other software or programs. Figure 3 In the device shown, the user interface 1003 is mainly used to communicate data with the client; the network interface 1004 is mainly used to establish a communication connection with the server; and the processor 1001 can be used to call the overflow glue interception test program stored in the memory 1005 and perform the following operations:

[0115] Obtaining a target no-pressure signal amount collected by a pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, wherein the headphone under test is placed on a platform of the testing device;

[0116] Obtaining a target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force;

[0117] If it is detected that the target channel compensation value is less than the target pressure-free signal amount, a test result indicating that glue overflow occurs in the earphone to be tested is obtained.

[0118] Furthermore, the step of obtaining a target pressure-free signal amount collected by the pressure sensor of the headphone under test when the headphone under test is not subjected to an external force includes:

[0119] When it is detected that the earphone to be tested is not subjected to an external force, controlling the pressure sensor to collect a first preset number of pressure-free signal quantities at a first preset time interval, and obtaining each pressure-free signal quantity collected by the pressure sensor;

[0120] The target non-pressure-sensitive signal amount is obtained by calculating an average value of each non-pressure-sensitive signal amount.

[0121] Furthermore, when the earphone to be tested is not subjected to an external force, controlling the pressure sensor to collect a first preset number of pressure-free signal quantities at a first preset time interval, and obtaining each pressure-free signal quantity collected by the pressure sensor includes:

[0122] When it is detected that the headset to be tested is not subjected to an external force, sending a communication interaction instruction to the headset to be tested;

[0123] Continuously detecting whether the headset to be tested sends a communication interaction instruction confirmation signal within a second preset time period;

[0124] If not, returning to the step of sending the communication interaction instruction to the headset to be tested;

[0125] If so, the pressure sensor is controlled to collect the first preset number of pressure-free signal quantities at a first preset time interval, and each pressure-free signal quantity collected by the pressure sensor is obtained.

[0126] Furthermore, the step of obtaining the target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force includes:

[0127] When the earphone to be tested is subjected to an external force, controlling the pressure sensor to collect channel compensation values ​​for a second preset number of times at a third preset time interval, and obtaining each channel compensation value collected by the pressure sensor;

[0128] The target channel compensation value is obtained by calculating the compensation values ​​of each channel and calculating the average value.

[0129] Furthermore, before the step of controlling the pressure sensor to collect the channel compensation values ​​for a second preset number of times at a third preset time interval, the method further includes:

[0130] The pressure device is controlled to apply pressure to the earphone to be tested.

[0131] Furthermore, before the step of obtaining the target pressure-free signal amount collected by the pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, the method further includes:

[0132] Control the initial pressure sensing signal of the pressure sensor to return to zero.

[0133] Furthermore, after the step of obtaining a test result indicating that glue overflow occurs in the earphone under test if it is detected that the target channel compensation value is less than the target pressure-free signal amount, the method further includes:

[0134] The test result of glue overflow of the earphone to be tested is sent to the MES system, so that the MES system can store the test result.

[0135] In addition, the present invention also provides a computer-readable storage medium, which stores a glue overflow loading test program. When the glue overflow loading test program is executed by a processor, the steps of the glue overflow loading test method described in any of the above embodiments are implemented.

[0136] The specific embodiments of the computer-readable storage medium of the present invention are basically the same as the embodiments of the above-mentioned overflow glue interception test method, and will not be described in detail here.

[0137] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or system comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or system. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or system comprising the element.

[0138] The serial numbers of the above embodiments of the present invention are for description only and do not represent the advantages or disadvantages of the embodiments.

[0139] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better embodiment. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes a number of instructions for enabling a test device (which can be a computer, server, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0140] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for testing overflow glue loading, characterized in that: The overflow glue interception test method is applied to a test device, and the overflow glue interception test method includes: Obtaining a target no-pressure signal amount collected by a pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, wherein the headphone under test is placed on a platform of the testing device; Obtaining a target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force; If it is detected that the target channel compensation value is less than the target pressure-free signal value, a test result indicating that glue overflow occurs in the headphone under test is obtained; The step of obtaining the target channel compensation value output by the pressure sensor when the earphone to be tested is subjected to an external force comprises: When the earphone to be tested is subjected to an external force, controlling the pressure sensor to collect channel compensation values ​​for a second preset number of times at a third preset time interval, and obtaining each channel compensation value collected by the pressure sensor; The target channel compensation value is obtained by calculating the compensation values ​​of each channel and calculating the average value.

2. The overflow glue interception test method according to claim 1, characterized in that: The step of obtaining a target pressure-free signal amount collected by the pressure sensor of the headphone under test when the headphone under test is not subjected to an external force comprises: When it is detected that the earphone to be tested is not subjected to an external force, controlling the pressure sensor to collect a first preset number of pressure-free signal quantities at a first preset time interval, and obtaining each pressure-free signal quantity collected by the pressure sensor; The target non-pressure-sensitive signal amount is obtained by calculating an average value of each non-pressure-sensitive signal amount.

3. The overflow glue interception test method according to claim 2, characterized in that: The step of controlling the pressure sensor to collect a first preset number of no-pressure signal quantities at a first preset time interval when it is detected that the earphone to be tested is not subjected to an external force, and obtaining each no-pressure signal quantity collected by the pressure sensor includes: When it is detected that the headset to be tested is not subjected to an external force, sending a communication interaction instruction to the headset to be tested; Continuously detecting whether the headset to be tested sends a communication interaction instruction confirmation signal within a second preset time period; If not, returning to the step of sending the communication interaction instruction to the headset to be tested; If so, the pressure sensor is controlled to collect the first preset number of pressure-free signal quantities at a first preset time interval, and each pressure-free signal quantity collected by the pressure sensor is obtained.

4. The overflow glue interception test method according to claim 1, characterized in that: Before the step of controlling the pressure sensor to collect the channel compensation values ​​for a second preset number of times at a third preset time interval, the method further includes: The pressure device is controlled to apply pressure to the earphone to be tested.

5. The overflow glue interception test method according to claim 1, characterized in that: Before the step of obtaining the target pressure-free signal amount collected by the pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, the method further includes: Control the initial pressure sensing signal of the pressure sensor to return to zero.

6. The overflow glue interception test method according to any one of claims 1 to 5, characterized in that: After the step of obtaining a test result indicating that glue overflow occurs in the earphone under test if it is detected that the target channel compensation value is less than the target pressure-free signal amount, the method further includes: The test result of glue overflow of the earphone to be tested is sent to the MES system, so that the MES system can store the test result.

7. A test device for overflow glue interception, characterized in that: The overflow glue interception test device is applied to the test equipment, and the device comprises: a first acquisition module, configured to acquire a target pressure-free signal amount collected by a pressure sensor of the headphone under test when the headphone under test is not subjected to an external force, wherein the headphone under test is placed on a platform of the testing device; a second acquisition module, configured to acquire a target channel compensation value output by the pressure sensor when the headphone to be tested is subjected to an external force; A result judgment module is configured to obtain a test result indicating that glue overflow occurs in the earphone under test if it is detected that the target channel compensation value is less than the target pressure-free signal amount; The second acquisition module is further configured to: When the earphone to be tested is subjected to an external force, controlling the pressure sensor to collect channel compensation values ​​for a second preset number of times at a third preset time interval, and obtaining each channel compensation value collected by the pressure sensor; The target channel compensation value is obtained by calculating the compensation values ​​of each channel and calculating the average value.

8. A test device for overflow glue interception, characterized in that: The device includes: a memory, a processor, and a glue overflow loading test program stored in the memory and runnable on the processor. When the glue overflow loading test program is executed by the processor, the steps of the glue overflow loading test method as described in any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores an overflow glue loading test program, and when the overflow glue loading test program is executed by the processor, the steps of the overflow glue loading test method according to any one of claims 1 to 6 are implemented.

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