Circuit board half-hole forming method and half-hole circuit board

Abstract

The application provides a circuit board semi-hole forming method and a semi-hole circuit board. The method comprises the following steps: placing a to-be-drilled semi-hole circuit board on a drilling base; driving a drilling motor to perform first drilling processing on the to-be-drilled semi-hole circuit board, to obtain a semi-hole circuit intermediate board; and driving the drilling motor to perform second drilling processing on the semi-hole circuit intermediate board, to obtain a semi-hole circuit board. The drilling tool compensation of the first drilling processing is less than the drilling tool compensation of the second drilling processing. The edges of the to-be-drilled semi-hole circuit board are subjected to twice drilling processing respectively. In the first drilling processing, the compensation of the drilling tool is low, while in the second drilling processing, the compensation of the drilling tool is high. The semi-holes of the edges of the semi-hole circuit board are kept consistent in height, so that the bonding force between each position of the copper foil in the semi-hole and the substrate is the same, and the probability of the copper foil falling off in the semi-hole is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a method for forming a half-hole circuit board and a half-hole circuit board. Background Technology

[0002] PCB half-holes retain the conductivity of the original holes while using the half-hole walls for soldering and fixing. This allows for a simpler and more convenient way to secure components with higher strength, and they are now widely used in computers, cameras, webcams, and other devices. They are particularly effective at securing CCD and CMOS components compared to traditional pin-based mounting, significantly improving product lifespan and stability.

[0003] However, existing conventional manufacturing methods are prone to problems such as the copper foil being pulled off or damaged during half-hole production. For example, the patent application with application number CN202010857100.1 results in incomplete functionality, affects product performance, and leads to a decrease in product yield and an increase in costs for manufacturers. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for forming half-hole circuit boards and a half-hole circuit board that effectively reduces the probability of copper foil falling off.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A method for forming a half-hole in a circuit board includes: forming a half-hole in the circuit board using a circuit board half-hole drilling device, wherein the circuit board half-hole drilling device includes: a drilling base and a half-hole forming assembly; the drilling base is used to fix the circuit board to be drilled with a half-hole; the half-hole forming assembly includes a drilling bracket, a drilling moving part, a drilling motor, and a drilling cutter; the drilling base is disposed in the drilling working area of ​​the drilling bracket; the drilling moving part is connected to the drilling bracket; the drilling moving part is located on the side of the circuit board to be drilled with a half-hole away from the drilling base; the drilling moving part is also connected to the drilling motor to drive the drilling motor to move along the edge of the circuit board to be drilled with a half-hole; the rotating shaft of the drilling motor is connected to the drilling cutter; the drilling cutter is used to drill a half-hole on the edge of the circuit board to be drilled with a half-hole.

[0007] The circuit board half-hole forming method includes the following steps:

[0008] Place the circuit board with the half hole to be drilled on the drilling platform;

[0009] The driving drilling motor performs the first milling hole processing on the half-hole circuit board to be drilled, resulting in a half-hole circuit intermediate board.

[0010] A driving drilling motor performs a second milling process on the semi-hole circuit board to obtain a semi-hole circuit board, wherein the milling cutter compensation for the first milling process is less than the milling cutter compensation for the second milling process.

[0011] In one embodiment, the drive drilling motor performs a first milling process on the half-hole circuit board to be drilled to obtain a half-hole circuit intermediate board, including: the drilling milling cutter driving the drilling motor performs a first counterclockwise milling along the edge of the half-hole circuit board to be drilled.

[0012] In one embodiment, the drilling cutter that drives the drilling motor performs a first counterclockwise milling hole along the edge of the circuit board with the half-hole to be drilled, comprising: the first drilling cutter that drives the drilling motor performs an uncompensated counterclockwise milling hole on the edge of the circuit board with the half-hole to be drilled.

[0013] In one embodiment, the diameter of the first drilling cutter is 1.12 mm to 1.37 mm.

[0014] In one embodiment, the diameter of the first drilling cutter is 1.2 mm.

[0015] In one embodiment, the driving drilling motor performs a second milling process on the half-hole circuit intermediate board to obtain a half-hole circuit board, including: the drilling milling cutter driving the drilling motor performs a second counterclockwise milling along the edge of the half-hole circuit intermediate board.

[0016] In one embodiment, the drilling cutter driving the drilling motor performs a second counterclockwise milling hole along the edge of the half-hole circuit intermediate plate, which includes: the second drilling cutter driving the drilling motor performs a left-compensating counterclockwise milling hole on the edge of the half-hole circuit intermediate plate.

[0017] In one embodiment, the diameter of the second drilling cutter is 0.65 mm to 0.96 mm.

[0018] In one embodiment, the diameter of the second drilling cutter is 0.8 mm.

[0019] A half-hole circuit board is prepared using the half-hole forming method for circuit boards described in any of the above embodiments.

[0020] Compared with the prior art, the present invention has at least the following advantages:

[0021] The edge of the circuit board with half-holes is processed twice. In the first process, the compensation of the drilling and routing tool is lower, while in the second process, the compensation of the drilling and routing tool is higher. This ensures that the half-holes on the edge of the circuit board are at the same height on both sides, thus ensuring that the bonding force between the copper foil in each position of the half-hole and the substrate is the same, effectively reducing the probability of the copper foil falling off in the half-hole. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a flowchart of a circuit board half-hole forming method in one embodiment. Detailed Implementation

[0024] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] This invention relates to a method for forming half-holes in a circuit board. In one embodiment, the method includes placing the circuit board to be drilled with a half-hole on a drilling platform; driving a drilling motor to perform a first routing process on the circuit board to be drilled with a half-hole, obtaining a half-hole intermediate board; and driving the drilling motor to perform a second routing process on the half-hole intermediate board, obtaining a half-hole circuit board. The routing cutter compensation for the first routing process is less than that for the second routing process. By performing two routing processes on the edge of the circuit board to be drilled with a half-hole, the routing cutter compensation is lower in the first routing process and higher in the second routing process. This ensures that the half-holes on the edge of the circuit board maintain a consistent height from left to right, thereby ensuring that the bonding force between the copper foil in the half-hole and the substrate is the same at all positions, effectively reducing the probability of copper foil detachment from the half-hole.

[0028] Please see Figure 1 This is a flowchart of a circuit board half-hole forming method according to an embodiment of the present invention. The circuit board half-hole forming method includes some or all of the following steps.

[0029] S100: Place the circuit board with the half hole to be drilled on the drilling platform.

[0030] In this embodiment, the circuit board to be drilled with a half-hole is a circuit board without drilled holes on its edge, meaning it requires router drilling on its edge, or in other words, it has no holes on its edge. The circuit board to be drilled with a half-hole with copper foil attached needs to be formed on its edge to facilitate soldering to other components. To facilitate router drilling, the circuit board is fixed to a drilling base. For example, the drilling base has a fixing groove, and the circuit board to be drilled is held in the fixing groove, ensuring stable mounting on the drilling base. This improves the stability of the circuit board on the drilling base and reduces vibration on the board when the router drills holes in its edge, thus improving the stability of the router drilling.

[0031] S200: Drive the drilling motor to perform the first drilling process on the half-hole circuit board to be drilled, and obtain the half-hole circuit intermediate board.

[0032] In this embodiment, the circuit board to be drilled with a half-hole is a circuit board without drilled holes on its edge, meaning it requires router drilling on its edge, or in other words, it has no holes on its edge. The circuit board to be drilled with a half-hole with copper foil attached needs to be formed on its edge to facilitate soldering to other components. To facilitate router drilling, the circuit board is fixed to a drilling base. For example, the drilling base has a fixing groove, and the circuit board to be drilled is held in the fixing groove, ensuring stable mounting on the drilling base. This improves the stability of the circuit board on the drilling base and reduces vibration on the board when the router drills holes in its edge, thus improving the stability of the router drilling. After the half-hole circuit board to be drilled is fixed, the drilling motor is driven to move, causing the drilling and router blade to move to a designated position. This allows the drilling and router blade to perform the first router hole processing on the half-hole circuit board. Specifically, the drilling and router blade performs router hole operations along the edge of the half-hole circuit board to form multiple holes of a specified size, thereby facilitating the formation of the half-hole circuit board intermediate board. The drilling platform can also hold a large board formed by splicing multiple half-hole circuit boards, and the drilling and router blade performs router hole operations along the junctions of the various half-hole circuit boards.

[0033] S300: Drive the drilling motor to perform a second milling process on the semi-hole circuit intermediate board to obtain a semi-hole circuit board, wherein the milling cutter compensation for the first milling process is less than the milling cutter compensation for the second milling process.

[0034] In this embodiment, the circuit board to be drilled with a half-hole is a circuit board without drilled holes on its edge, meaning it requires router drilling on its edge, or in other words, it has no holes on its edge. The circuit board to be drilled with a half-hole with copper foil attached needs to be formed on its edge to facilitate soldering to other components. To facilitate router drilling, the circuit board is fixed to a drilling base. For example, the drilling base has a fixing groove, and the circuit board to be drilled is held in the fixing groove, ensuring stable mounting on the drilling base. This improves the stability of the circuit board on the drilling base and reduces vibration on the board when the router drills holes in its edge, thus improving the stability of the router drilling. After the half-hole circuit board to be drilled is fixed, the drilling motor is driven to move, so that the drilling and router cutter moves to a designated position, so that the drilling and router cutter can perform the first router hole processing on the half-hole circuit board to be drilled. Specifically, the drilling and router cutter performs router hole operation along the edge of the half-hole circuit board to be drilled, so as to form multiple holes of a specified size on the edge of the half-hole circuit board to be drilled, thereby facilitating the obtaining of the half-hole circuit intermediate board. After the first routing process, a hole of a certain size is formed on the edge of the half-hole circuit board to be drilled. However, the hole on the edge of the half-hole circuit board to be drilled has not yet met the requirements, that is, the half-hole of the specified radius has not yet been formed. Therefore, the drilling motor is driven again to perform a second routing process on the half-hole circuit board, that is, to perform a second routing process on the hole formed on the half-hole circuit board. Moreover, the routing cutter compensation of the first routing process is less than that of the second routing process, which makes the routing cutter compensation of the second routing process larger. This allows the half-hole on the edge of the half-hole circuit board to maintain the same height on the left and right sides during the process of forming a half-hole of the specified radius. That is, the distance from the left and right endpoints of the half-hole on the edge of the half-hole to the bottom of the half-hole is equal. This makes the bonding force between the copper foil at each position in the half-hole of the half-hole and the substrate the same, effectively reducing the probability of the copper foil falling off in the half-hole. The drilling cutter used in the second drilling process is of a different type than the drilling cutter used in the first drilling process. For example, the diameter of the drilling cutter used in the second drilling process is smaller than the diameter of the drilling cutter used in the first drilling process.

[0035] In this embodiment, the edge of the circuit board with half-holes to be drilled is processed twice. In the first drilling process, the compensation of the drilling cutter is low, while in the second drilling process, the compensation of the drilling cutter is high. This ensures that the half-holes on the edge of the circuit board are kept at the same height on both sides, thereby ensuring that the bonding force between the copper foil in each position of the half-hole and the substrate is the same, effectively reducing the probability of the copper foil falling off in the half-hole.

[0036] In one embodiment, the driving drilling motor performs a first milling process on the half-hole circuit board to be drilled, obtaining a half-hole circuit intermediate board, including: the drilling milling cutter driving the drilling motor performs a first counterclockwise milling along the edge of the half-hole circuit board to be drilled. In this embodiment, the half-hole circuit board to be drilled is a circuit board without holes drilled on its edge, that is, the half-hole circuit board to be drilled is a circuit board that needs to be milled on its edge, that is, the half-hole circuit board to be drilled is a circuit board without holes on its edge. The circuit board to be drilled needs to have a half-hole with copper foil attached formed on its edge to facilitate the formation of soldering positions with other components. To facilitate drilling the circuit board with a router, the circuit board is fixed on a drilling base. For example, the drilling base has a fixing groove, and the circuit board is held in the fixing groove, so that the circuit board is stably held on the drilling base, improving the stability of the circuit board on the drilling base, thereby reducing the vibration generated on the board when the router drills the edge of the circuit board, that is, improving the stability of the router hole of the circuit board. After the circuit board with the half-hole to be drilled is fixed, the drilling motor is driven to move, so that the drilling cutter moves to the designated position, so that the drilling cutter can perform the first drilling hole processing on the circuit board with the half-hole to be drilled. Specifically, the drilling cutter rotates counterclockwise to rough drill the edge of the circuit board with the half-hole to be drilled, so as to form a notch with an arc angle of less than 180 degrees on the edge of the circuit board with the half-hole to be drilled, thereby reducing the friction and vibration time between the copper foil in the circuit board with the half-hole to be drilled and the drilling cutter, effectively improving the bonding force between the copper foil and the substrate in the hole formed on the edge of the circuit board with the half-hole to be drilled, thereby effectively reducing the probability of copper foil falling off when making half-holes.

[0037] Further, the step of the drilling and milling cutter driving the drilling motor to perform a first counterclockwise milling hole along the edge of the circuit board with a half-hole to be drilled includes: driving the first drilling and milling cutter of the drilling motor to perform an uncompensated counterclockwise milling hole on the edge of the circuit board with a half-hole to be drilled. In this embodiment, the circuit board with a half-hole to be drilled is a circuit board with no holes drilled on its edge, that is, the circuit board with a half-hole to be drilled is a circuit board that needs to be milled on its edge, or in other words, the circuit board with a half-hole to be drilled is a circuit board without holes on its edge. The circuit board to be drilled with a half-hole needs to have a copper foil attached to its edge to facilitate soldering to other components. To facilitate drilling the half-hole circuit board, it is fixed to a drilling base. For example, the drilling base has a fixing groove, and the half-hole circuit board is held in the fixing groove, ensuring its stability on the drilling base. This improves the stability of the half-hole circuit board on the drilling base and reduces the vibration generated on the board when drilling the edge of the half-hole circuit board, thus improving the stability of the drilling. After the half-hole circuit board is fixed, the drilling motor is driven to move the drilling and drilling tool to a designated position, facilitating the first drilling process. Specifically, the drilling and milling cutter rotates counterclockwise to rough-mill the edge of the circuit board to be drilled with a half-hole, creating a notch with an arc angle of less than 180 degrees. Furthermore, the first drilling and milling cutter is used during the first counterclockwise milling of the half-hole edge, and it operates in a non-compensated counterclockwise milling mode. Thus, during the milling process, the first drilling and milling cutter does not perform tool travel compensation, further reducing the friction and vibration time between the copper foil and the drilling and milling cutter within the half-hole circuit board. This effectively improves the bonding force between the copper foil and the substrate within the hole formed on the edge of the half-hole circuit board, thereby effectively reducing the probability of copper foil detachment during half-hole fabrication.

[0038] In another embodiment, the diameter of the first drilling and routing cutter is 1.12 mm to 1.37 mm, specifically, the diameter of the first drilling and routing cutter is 1.2 mm. To form a half-hole with a radius of 0.35 mm on the half-hole circuit board, a larger diameter routing cutter is used during the first routing process, and the arc angle corresponding to the formed hole is less than 180 degrees. This effectively reduces the contact area between the first drilling and routing cutter and the circuit board to be drilled, thereby reducing the damage to the bonding force between the copper foil and the substrate within the formed hole.

[0039] In one embodiment, the driving drilling motor performs a second milling process on the half-hole circuit intermediate board to obtain a half-hole circuit board, including: the drilling milling cutter driving the drilling motor performs a second counterclockwise milling along the edge of the half-hole circuit intermediate board. In this embodiment, the half-hole circuit intermediate board is obtained by processing the first milling process on the half-hole circuit board to be drilled. The half-hole circuit board to be drilled is a circuit board with no holes drilled on its edge, that is, the half-hole circuit board to be drilled is a circuit board that needs to be milled on its edge, that is, the half-hole circuit board to be drilled is a circuit board without holes on its edge. The circuit board to be drilled with a half-hole needs to have a copper foil attached to its edge to facilitate soldering to other components. To facilitate drilling the half-hole circuit board, it is fixed to a drilling base. For example, the drilling base has a fixing groove, and the half-hole circuit board is held in the fixing groove, ensuring its stability on the drilling base. This improves the stability of the half-hole circuit board on the drilling base and reduces the vibration generated on the board when drilling the edge of the half-hole circuit board, thus improving the stability of the drilling. After the half-hole circuit board is fixed, the drilling motor is driven to move the drilling and drilling tool to a designated position, facilitating the first drilling process. Specifically, the drilling and milling cutter rotates counterclockwise to rough-mill the edge of the circuit board to be drilled with a half-hole, creating a notch with an arc angle of less than 180 degrees. Furthermore, the first drilling and milling cutter is used during the first counterclockwise milling of the half-hole edge, and it operates in a non-compensated counterclockwise milling mode. Thus, during the milling process, the first drilling and milling cutter does not perform tool travel compensation, further reducing the friction and vibration time between the copper foil and the drilling and milling cutter within the half-hole circuit board. This effectively improves the bonding force between the copper foil and the substrate within the hole formed on the edge of the half-hole circuit board, thereby effectively reducing the probability of copper foil detachment during half-hole fabrication. After obtaining the semi-hole circuit intermediate board, the edge of the semi-hole circuit intermediate board has not yet formed a semi-hole of the specified diameter. It is necessary to perform secondary milling processing on the edge hole of the semi-hole circuit intermediate board, that is, to perform a second counterclockwise milling on the edge of the semi-hole circuit intermediate board, that is, to perform precision milling on the edge hole of the semi-hole circuit intermediate board, so that the edge hole of the semi-hole circuit intermediate board forms a semi-hole that meets the requirements.

[0040] Further, the step of the drilling and milling cutter driving the drilling motor to perform a second counterclockwise milling along the edge of the half-hole circuit intermediate board includes: driving the second drilling and milling cutter of the drilling motor to perform a left-compensating counterclockwise milling on the edge of the half-hole circuit intermediate board. In this embodiment, the half-hole circuit intermediate board is obtained by processing the first milling on the half-hole circuit board to be drilled. The half-hole circuit board to be drilled is a circuit board with no holes drilled on its edge, that is, the half-hole circuit board to be drilled is a circuit board that needs to be milled on its edge, that is, the half-hole circuit board to be drilled is a circuit board without holes on its edge. The circuit board to be drilled with a half-hole needs to have a copper foil attached to its edge to facilitate soldering to other components. To facilitate drilling the half-hole circuit board, it is fixed to a drilling base. For example, the drilling base has a fixing groove, and the half-hole circuit board is held in the fixing groove, ensuring its stability on the drilling base. This improves the stability of the half-hole circuit board on the drilling base and reduces the vibration generated on the board when drilling the edge of the half-hole circuit board, thus improving the stability of the drilling. After the half-hole circuit board is fixed, the drilling motor is driven to move the drilling and drilling tool to a designated position, facilitating the first drilling process. Specifically, the drilling and milling cutter rotates counterclockwise to rough-mill the edge of the circuit board to be drilled with a half-hole, creating a notch with an arc angle of less than 180 degrees. Furthermore, the first drilling and milling cutter is used during the first counterclockwise milling of the half-hole edge, and it operates in a non-compensated counterclockwise milling mode. Thus, during the milling process, the first drilling and milling cutter does not perform tool travel compensation, further reducing the friction and vibration time between the copper foil and the drilling and milling cutter within the half-hole circuit board. This effectively improves the bonding force between the copper foil and the substrate within the hole formed on the edge of the half-hole circuit board, thereby effectively reducing the probability of copper foil detachment during half-hole fabrication. After obtaining the semi-hole circuit intermediate board, the edge of the semi-hole circuit intermediate board has not yet formed a semi-hole of the specified diameter. It is necessary to perform secondary milling processing on the edge hole of the semi-hole circuit intermediate board, that is, to perform a second counterclockwise milling on the edge of the semi-hole circuit intermediate board, that is, to perform precision milling on the edge hole of the semi-hole circuit intermediate board, so that the edge hole of the semi-hole circuit intermediate board forms a semi-hole that meets the requirements, that is, to form a hole with a specified radius and arc of 180 degrees on the edge of the semi-hole circuit intermediate board, for example, a semi-hole with a radius of 0.35mm.The second routing process involves using a second drilling and routing tool to create routing holes on the edge of the semi-hole circuit intermediate board. The second drilling and routing tool uses a counter-clockwise rotating tool with left compensation to ensure that the left and right heights of the semi-holes formed on the edge of the semi-hole circuit intermediate board are consistent. This ensures that the bonding force between the copper foil in each position within the semi-hole and the substrate is the same, effectively reducing the probability of the copper foil falling off within the semi-hole.

[0041] In another embodiment, the diameter of the second drilling and routing cutter is 0.65mm to 0.96mm, specifically, the diameter of the second drilling and routing cutter is 0.8mm. To form a half-hole with a radius of 0.35mm on the half-hole circuit board, a smaller diameter routing cutter is used during the second routing process, ensuring that the arc angle corresponding to the formed hole is 180 degrees. Furthermore, the left and right heights of the half-hole remain consistent, effectively improving the uniform bonding force between the copper foil and the substrate at various locations within the half-hole, further reducing the probability of copper foil detachment.

[0042] In the actual production process of the semi-hole circuit board, the semi-hole processing is a back-end process, which is basically after the circuit exposure and development of the circuit board. At this time, the required circuit structure has been formed on the circuit board. However, the router blade used for semi-hole processing is prone to expansion during long-term use, especially for multi-layer copper-embedded boards or double-sided aluminum substrates. The heat generated by the router blade is too large, which affects the size of the semi-hole formed and makes it easy to break the circuit near the edge of the board.

[0043] To improve the yield rate of the semi-hole circuit board, the driving drilling motor performs a first drilling process on the semi-hole circuit board to be drilled, resulting in a semi-hole circuit intermediate board. The process then includes the following steps:

[0044] Obtain a rough image of the intermediate board of the half-hole circuit;

[0045] The distance from the forming line is obtained based on the rough mill image;

[0046] Detect whether the distance from the forming line is less than or equal to the preset line distance;

[0047] When the distance from the forming line is less than or equal to the preset line distance, a tool change signal is sent to the half-hole milling tool monitoring system to replace the new drilling milling tool in the first milling hole processing.

[0048] In this embodiment, the drilling cutter used for the first routing process has a relatively large diameter. After the first routing process, the hole formed on the edge of the resulting half-hole circuit board is essentially a coarse routing hole. At this point, the hole on the edge of the half-hole circuit board serves as a pre-routing process for the second routing process, reducing the probability of copper foil detachment within the half-hole. By acquiring an image of the routing surface of the half-hole circuit board, a coarse routing image with coarse routing holes is obtained. Then, the distance between the coarse routing hole and the circuit on the circuit board is determined based on the coarse routing image, facilitating the determination of the distance between the hole formed on the edge of the half-hole circuit board and the circuit on it. Specifically, the distance from the forming line is the shortest line distance between the boundary of the hole formed on the edge of the half-hole circuit board and the circuit on it. The preset line spacing is the safe line spacing between the boundary of the hole formed on the edge of the semi-hole circuit board and the line on it. If the distance to the forming line spacing is less than or equal to the preset line spacing, it indicates that the line spacing between the hole formed on the edge of the semi-hole circuit board and the line on it is too small, that is, the hole formed on the edge of the semi-hole circuit board and the line on it are too close. This also indicates that the drilling cutter used in the first routing process is experiencing drilling expansion. In this case, the drilling cutter used in the first routing process will increase the probability of breaking the line in subsequent drilling. To avoid producing scrap boards, a cutter replacement signal is sent to the semi-hole drilling cutter monitoring system to replace it with a new drilling cutter used in the first routing process, that is, to replace the first drilling cutter, effectively improving the finished product qualification rate of the semi-hole circuit board. In another embodiment, the preset line spacing is 0.09mm, and this line spacing is designed based on the radius of the semi-hole and the material of the substrate, so as to optimize the bonding force between the copper foil in the semi-hole and the substrate to the maximum.

[0049] Further, the step of detecting whether the distance from the forming line is less than or equal to a preset line distance also includes the following steps:

[0050] When the distance from the forming line is greater than the preset line distance, the first edge line distance and the second edge line distance are obtained according to the rough milling image;

[0051] Calculate the difference between the first edge-to-bottom distance and the second edge-to-bottom distance to obtain the edge-to-bottom difference component;

[0052] Detect whether the edge-to-bottom difference component matches the preset edge-to-bottom amount;

[0053] When the edge-bottom difference component does not match the preset edge-bottom amount, a left-compensation fine milling signal is sent to the half-hole milling tool monitoring system so that the drilling milling tool in the second milling hole processing moves to the left for compensation.

[0054] In this embodiment, whether the distance from the forming line is greater than the preset line distance indicates that the line distance between the hole formed on the edge of the semi-hole circuit intermediate plate and the line on it is large enough, that is, it indicates that the hole formed on the edge of the semi-hole circuit intermediate plate and the line on it are at a safe distance, and that the drilling and milling tool used in the first milling process is in a usable state. The rough milling image includes the shape structure of the hole on the edge of the semi-hole circuit intermediate plate. The first edge line distance and the second edge line distance correspond to the hole on the edge of the semi-hole circuit intermediate plate. Specifically, the first edge line distance and the second edge line distance are the shortest vertical distances between the left and right endpoints of the hole on the edge of the semi-hole circuit intermediate plate and the bottom of the hole. The edge-to-bottom difference component is the difference between the first edge-to-bottom distance and the second edge-to-bottom distance, which facilitates the accurate definition of the difference between the first edge-to-bottom distance and the second edge-to-bottom distance. This facilitates the determination of the vertical height difference between the left and right endpoints of the half-hole circuit intermediate plate and the bottom of the hole, and further facilitates the determination of the height consistency between the left and right endpoints of the half-hole circuit intermediate plate. The mismatch between the edge-to-bottom difference component and the preset edge-to-bottom amount indicates that the distances from the left and right endpoints of the hole on the half-hole circuit intermediate board to the bottom of the hole are unequal, which means that the heights of the left and right endpoints of the hole on the half-hole circuit intermediate board are inconsistent. At this time, the half-hole circuit intermediate board needs to be precision-milled. By adjusting the tool path compensation of the drilling and milling cutter in the second milling process, that is, designing the tool path of the second drilling and milling cutter to be counterclockwise rotating and left-side compensated, it is easy to adjust the heights of the left and right endpoints of the hole on the half-hole circuit intermediate board to be consistent, thereby facilitating the formation of a standard half-hole and effectively ensuring that the bonding force between the copper foil and the substrate at various positions in the half-hole is the same, further reducing the probability of copper foil falling off.

[0055] In one embodiment, this application also provides a circuit board half-hole drilling device, the circuit board half-hole drilling device comprising: a drilling base and a half-hole forming assembly, the drilling base being used to fix the circuit board to be drilled with a half-hole; the half-hole forming assembly comprising a drilling bracket, a drilling moving part, a drilling motor and a drilling cutter, the drilling base being disposed within the drilling working area of ​​the drilling bracket, the drilling moving part being connected to the drilling bracket, the drilling moving part being located on the side of the circuit board to be drilled with a half-hole away from the drilling base, the drilling moving part being also connected to the drilling motor to drive the drilling motor to move along the edge of the circuit board to be drilled with a half-hole, the rotating shaft of the drilling motor being connected to the drilling cutter, the drilling cutter being used to drill a half-hole on the edge of the circuit board to be drilled with a half-hole.

[0056] In this embodiment, the edge of the circuit board with half-holes to be drilled is processed twice. In the first drilling process, the compensation of the drilling cutter is low, while in the second drilling process, the compensation of the drilling cutter is high. This ensures that the half-holes on the edge of the circuit board are kept at the same height on both sides, thereby ensuring that the bonding force between the copper foil in each position of the half-hole and the substrate is the same, effectively reducing the probability of the copper foil falling off in the half-hole.

[0057] In another embodiment, the drilling and routing cutter includes a first drilling and routing cutter and a second drilling and routing cutter. The first drilling and routing cutter is connected to the first output shaft of the drilling motor to rotate and raise the first drilling and routing cutter to perform a first routing process on the half-hole circuit board to be drilled. The second drilling and routing cutter is connected to the second output shaft of the drilling motor to rotate and raise the second drilling and routing cutter to perform a second routing process on the half-hole circuit intermediate board.

[0058] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for forming half-holes in a circuit board, characterized in that, include: A circuit board half-hole drilling device is used to form half-holes in a circuit board. The circuit board half-hole drilling device includes: A drilling base, used to fix the circuit board with a half-hole to be drilled; A half-hole forming assembly includes a drilling bracket, a drilling moving part, a drilling motor, and a drilling cutter. The drilling base is disposed in the drilling working area of ​​the drilling bracket. The drilling moving part is connected to the drilling bracket and is located on the side of the circuit board to be drilled that is away from the drilling base. The drilling moving part is also connected to the drilling motor to drive the drilling motor to move along the edge of the circuit board to be drilled. The rotating shaft of the drilling motor is connected to the drilling cutter, which is used to drill a half-hole on the edge of the circuit board to be drilled. The circuit board half-hole forming method includes the following steps: Place the circuit board with the half hole to be drilled on the drilling platform; The driving drilling motor performs the first milling process on the half-hole circuit board to be drilled to obtain the half-hole circuit intermediate board. The first milling process is that the drilling milling cutter rotates counterclockwise to rough mill the edge of the half-hole circuit board to be drilled, so as to form a notch with an arc angle of less than 180 degrees on the edge of the half-hole circuit board to be drilled. Moreover, when milling the first counterclockwise milling on the edge of the half-hole circuit board to be drilled, the first drilling milling cutter is used, and the first drilling milling cutter performs the counterclockwise milling without compensation. A driving drilling motor performs a second milling process on the semi-hole circuit intermediate board to obtain a semi-hole circuit board. The milling cutter compensation for the first milling process is less than that for the second milling process. The second milling process involves using a second drilling milling cutter to mill holes on the edge of the semi-hole circuit intermediate board. The second drilling milling cutter uses a counterclockwise rotating cutter with left compensation to ensure that the left and right heights of the semi-holes formed on the edge of the semi-hole circuit intermediate board are consistent, forming holes with a specified radius and an arc angle of 180 degrees.

2. The circuit board half-hole forming method according to claim 1, characterized in that, The diameter of the first drilling cutter is 1.12 mm to 1.37 mm.

3. The circuit board half-hole forming method according to claim 2, characterized in that, The diameter of the first drilling cutter is 1.2mm.

4. The circuit board half-hole forming method according to claim 1, characterized in that, The diameter of the second drilling cutter is 0.65mm to 0.96mm.

5. The circuit board half-hole forming method according to claim 4, characterized in that, The diameter of the second drilling cutter is 0.8mm.

6. A half-hole circuit board, characterized in that, It is prepared by the circuit board half-hole forming method as described in any one of claims 1 to 5.

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