A method for manufacturing a multi-unit aluminum-based rigid-flex plate

Abstract

This invention provides a method for manufacturing a multi-unit aluminum-based rigid-flex board. The method involves attaching multiple aluminum substrate units to a flexible board onto which an aluminum substrate is to be attached, forming the multi-unit aluminum-based rigid-flex board. The manufacturing steps are as follows: taking a support plate, attaching a cover film layer, attaching a first release layer, and attaching a first adhesive layer with a complementary pattern to the first release layer; taking a filler layer, attaching a second release layer corresponding to the pattern of the first adhesive layer; milling away the filler layer corresponding to each aluminum substrate unit to form through slots; fabricating aluminum substrate units and embedding them into the through slots; sequentially stacking and pressing the flexible board onto which the aluminum substrate is to be attached, the aluminum substrate filler structure, and the support structure; removing the support structure and the aluminum substrate centrifugal structure to form the multi-unit aluminum-based rigid-flex board. By setting up the support structure and the filler release structure, the aluminum substrate units can be more smoothly and effectively attached to the surface of the flexible board, avoiding blackening during processing, as well as defects such as bonding indentations and scratches.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and more particularly to a method for manufacturing a multi-unit aluminum-based rigid-flex board. Background Technology

[0002] Rigid-flex PCBs are a type of printed circuit board that combines a rigid board and a flexible board. They combine a thin, flexible underlayer with a rigid underlayer and then laminate them into a single component, forming a circuit board with solder support and flexibility. Rigid-flex PCBs have changed the traditional planar design concept, expanding to a three-dimensional space, which brings great convenience to product design but also presents significant technical challenges.

[0003] If three-dimensional assembly is required during the assembly process, a rigid-flex plate is needed as a support circuit board, a rigid plate is used as a carrier for welding components and providing support, and a flexible plate is used as a connecting section for connecting and bending in three-dimensional assembly.

[0004] As electronic products become increasingly integrated, the density of circuit boards supporting their soldering and support functions also increases. This leads to a greater and faster accumulation of heat during use, placing higher demands on the heat dissipation characteristics of internal components. Currently, aluminum substrates are generally used as auxiliary layers to improve the heat dissipation efficiency of circuit boards. In rigid-flex boards, the aluminum substrate can not only provide high heat dissipation but also serve as a rigid support plate, providing soldering support.

[0005] The design of aluminum-based rigid-flex panels varies depending on the application. For electronic products that require diverse installation methods (e.g., LED light strips with various shapes), multi-unit aluminum-based rigid-flex panels, which include multiple rigid plate areas and flexible plate (i.e., flexible board) areas in the same rigid-flex panel, can meet diverse needs.

[0006] Multi-unit aluminum-based rigid-flex PCBs contain multiple rigid and flexible plate areas, thus requiring multi-unit lamination fabrication of the aluminum substrate and the flexible plate.

[0007] Currently, the general process involves first treating the aluminum substrate with a black-brown coating to make the surface uniformly rough and clean, then attaching an adhesive layer to the surface of the aluminum substrate, then fabricating the aluminum substrate into aluminum substrate unit bodies that need to be laminated, and finally aligning and laminating each aluminum substrate unit body with the flexible board to form a multi-unit aluminum-based rigid-flex board.

[0008] The above production method has the following two main problems:

[0009] (1) Since the edges of the sub-units are relatively sharp after the aluminum substrate is made into aluminum substrate unit, there is a certain height difference between the flexible plate area without aluminum substrate and the rigid plate area with aluminum substrate during the pressing process. Therefore, the flexible plate is easily scratched and torn by the edges of the aluminum substrate of the sub-unit during pressing, and may be bent or folded internal circuit structure, resulting in poor electrical performance, poor appearance, or even scrapping of the board. Furthermore, directly pressing the aluminum substrate has problems of inaccurate alignment and low processing precision.

[0010] (2) Before lamination, the aluminum substrate is usually subjected to blackening treatment. However, due to the special properties of aluminum, the aluminum substrate will be oxidized by the browning agent during the blackening treatment, and an oxide film will be generated on the surface, which will passivate the surface of the aluminum substrate and prevent further blackening treatment. As a result, the blackening treatment of the aluminum substrate is not easy to form a uniform, rough and clean surface. Even if a uniform and rough blackening surface is formed, there will be unevenness and non-uniformity on the surface.

[0011] Based on the above background and problems, there is a need to provide a new method for manufacturing multi-unit aluminum-based rigid-flex PCBs. Summary of the Invention

[0012] This invention aims to address the processing of multi-unit aluminum-based rigid-flex panels, solving the problems of easy surface passivation and edge scratches, tearing, and indentations that arise during the pressing process in existing manufacturing methods that involve blackening and browning the aluminum substrate sub-units. The invention provides a method for manufacturing multi-unit aluminum-based rigid-flex panels, characterized by attaching ≥2 aluminum substrate units to a flexible board onto which the aluminum substrate is to be attached to form the multi-unit aluminum-based rigid-flex panel; the manufacturing method includes the following steps:

[0013] S10: Construct the supporting structure, including the following steps:

[0014] S110: Take a support plate with an area equal to that of the rigid-flexible bonded plate, and attach a covering film layer to the support plate to form a covering film support plate;

[0015] S120: On one side of the support plate of the cover film support plate, corresponding to the pattern distribution of each aluminum substrate unit, a first release layer is made to form a release support plate;

[0016] S130: A first adhesive layer is formed on the release support plate to form the support structure, wherein the first adhesive layer and the first release layer are distributed in a complementary pattern.

[0017] S20: Create the filler release structure:

[0018] S210: Take a filler layer with an area equal to that of the flexible plate to which the aluminum substrate is to be attached, and make a second release layer on the filler layer to form a release filler layer. The distribution pattern of the second release layer corresponds to the distribution pattern of the first adhesive layer.

[0019] S220: The release filler layer is milled to remove the filler layer corresponding to the area of ​​each aluminum substrate unit, forming a through groove, and the whole is formed into a filler release structure.

[0020] S30: Fabrication of multi-unit aluminum-based rigid-flex plate:

[0021] S310: According to the aluminum base unit pattern to be bonded, an aluminum base unit is fabricated, the aluminum base unit is embedded into the through slot, and a second adhesive layer is fabricated on the aluminum base unit to form an aluminum base filling structure.

[0022] S320: The flexible plate to be attached to the aluminum base layer, the aluminum base filling structure, and the support structure are sequentially aligned, stacked, and pressed together to form an integral pressed structure;

[0023] S330: Remove the supporting structure and the filling release structure from the overall pressing structure to form the multi-unit aluminum-based rigid-flexible plate.

[0024] Furthermore, the support plate is made of FR-4 sheet material with a thickness of 0.3mm to 1.0mm.

[0025] Furthermore, the first release layer is made by applying adhesive or coating, and the material of the first release layer is PTFE or polyimide.

[0026] Furthermore, the first adhesive layer is made by coating or attaching, and the first adhesive layer is a polyolefin adhesive layer, an epoxy resin adhesive layer, a polyurethane adhesive layer, or an acrylic resin adhesive layer.

[0027] Furthermore, a gap of 5μm to 35μm is provided between the first adhesive layer and the first release layer.

[0028] Furthermore, the filler layer is FR-4 board material.

[0029] Furthermore, the second release layer is manufactured by applying adhesive or coating, and the material of the second release layer is PTFE or polyimide.

[0030] Furthermore, the thickness of the aluminum substrate unit is less than or equal to the thickness of the filling release structure, and the size of the aluminum substrate unit on one side is smaller than the size of the through slot.

[0031] Furthermore, the alignment and stacking arrangement is as follows: first, the flexible plate to be attached to the aluminum base layer is aligned and stacked with the aluminum base filling structure, and then the support structure is aligned and stacked with the aluminum base filling structure to form a stacked arrangement structure.

[0032] Furthermore, the stacked layout also includes a release layer, a cover layer, and a heat-conducting layer sequentially disposed outward from the upper and lower surfaces of the stacked layout structure.

[0033] This invention employs a support structure and an aluminum-based filling structure to integrate multiple aluminum substrate units onto the aluminum-based filling structure. The aluminum-based filling structure provides support and wrapping to the sides of the aluminum substrate units, effectively defining their position. This allows for high-precision attachment of the aluminum substrate units through alignment holes and patterns designed in the filling layer, achieving a highly efficient one-time attachment. Simultaneously, the aluminum-based filling structure forms a unified structure, resulting in a seamless overall attachment and effectively preventing damage to the flexible board caused by individually attaching aluminum substrate units. Issues such as edge scratches, tears, and bending of the internal circuit structure are addressed. The support structure serves to adhere the filler layer of the aluminum base filler structure after the overall lamination is completed, making it easy and safe to remove. This prevents the filler layer from being difficult to remove after lamination or causing damage to the aluminum substrate unit during removal. It also protects the aluminum base filler structure, acting as a buffer, sealing protection, and overall support during the lamination process and subsequent processing. The entire processing avoids processes such as blackening and browning that would cause oxidation on the aluminum substrate surface, effectively improving the processing effect and product reliability. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0035] Figure 1 This is a process flow diagram of the manufacturing method of the multi-unit aluminum-based rigid-flex plate according to an embodiment of the present invention.

[0036] Figure 2 This is a schematic cross-sectional view of the processing to form the cover film support plate according to an embodiment of the present invention;

[0037] Figure 3 This is a schematic cross-sectional view of the release support plate formed according to an embodiment of the present invention.

[0038] Figure 4 This is a schematic diagram of the cross-sectional structure of the support structure formed according to an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the cross-sectional structure of the release filler layer formed according to an embodiment of the present invention;

[0040] Figure 6 This is a schematic diagram of the cross-sectional structure of the filling release structure formed according to an embodiment of the present invention;

[0041] Figure 7 This is a schematic cross-sectional view of the aluminum-based filling structure formed according to an embodiment of the present invention;

[0042] Figure 8 This is a schematic cross-sectional view of the integral pressing structure formed according to an embodiment of the present invention;

[0043] Figure 9 This is a schematic diagram of the cross-sectional structure of a multi-unit aluminum-based rigid-flexible plate according to an embodiment of the present invention.

[0044] Attached image captions:

[0045] 10A - Flexible board to be attached to aluminum substrate, 410 - Filler layer, 100 - Cover film support plate, 420 - Second release layer, 110 - Support plate, 500 - Filler release structure, 120 - Cover film, 510 - Through slot, 200 - Release support plate, 600 - Aluminum base filler structure, 210 - First release layer, 610 - Aluminum substrate unit, 300 - Support structure, 620 - Second adhesive layer, 310 - First adhesive layer, 700 - Overall pressing structure, 400 - Release filler layer, 800 - Multi-unit aluminum base rigid-flex board. Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0047] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0048] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0049] The method for manufacturing a multi-unit aluminum-based rigid-flex plate provided in this embodiment involves attaching ≥2 aluminum substrate units 610 onto a flexible plate 10A to which an aluminum substrate is to be attached to form a multi-unit aluminum-based rigid-flex plate 800.

[0050] Please see Figure 1 , Figure 1 This is a process flow diagram illustrating the manufacturing method of a multi-unit aluminum-based rigid-flex plate according to an embodiment of the present invention.

[0051] This implementation method is based on Figure 1 The process flow shown is followed by a detailed explanation of each step:

[0052] Please refer to the following: Figures 2 to 9 , Figures 2 to 9 The steps of the manufacturing method of the multi-unit aluminum-based rigid-flex plate in this embodiment are illustrated.

[0053] The manufacturing method includes the following steps:

[0054] Step S10:

[0055] The support structure 300 is fabricated, specifically including the following steps.

[0056] Please see Figure 2 , Figure 2 This is a schematic cross-sectional view of the support plate for forming the cover film according to an embodiment of the present invention.

[0057] Step S110:

[0058] Take a support plate 110 with the same area as the rigid-flexible bond plate, and attach a cover film layer 120 to the support plate 110 to form a cover film support plate 100.

[0059] In this embodiment, the support plate is FR-4 sheet material with a thickness of 0.3mm to 1.0mm.

[0060] The support plate 110 is made of FR-4 sheet material and is relatively thin. Because FR-4 sheet material has strong machinability and is relatively brittle, it can be easily peeled off from the filler layer 410 after the overall pressing is completed. However, due to its brittleness, it is easy to break during processing (especially during the overall pressing process). Therefore, a cover film layer 120 is attached to the support plate 110. The cover film layer 120 is generally made of polyimide material. The strong toughness of the cover film layer 120 can improve the toughness of the support plate 110 and make it easy to peel off the support plate 110 together with the filler layer 410 after pressing is completed. The support plate 100 can also play an effective buffering role.

[0061] It should be noted that, since the bonding force between the cover film layer 120 and the release layer 210 is relatively weak, while the bonding force between the support plate 110 and the release layer 210 is relatively strong, if the cover film layer 120 is used directly without the support plate 110, the release layer and the cover film layer 120 will not bond firmly when the release layer 210 is subsequently made on its surface, which will affect the final peeling process.

[0062] The cover film 120 generally has its own adhesive layer, so the cover film 120 can be directly adhered to the support plate 110 through the adhesive layer; the thickness of the cover film 120 can be a commonly used thickness, ranging from 20μm to 75μm.

[0063] Please see Figure 3 , Figure 3 This is a schematic diagram of the cross-sectional structure of the release support plate formed according to an embodiment of the present invention.

[0064] Step S120:

[0065] A first release layer 210 is formed on one side of the support plate 110 of the cover film support plate 100, corresponding to the pattern distribution of each aluminum substrate unit, to form a release support plate 200.

[0066] In this embodiment, the first release layer 210 is made by applying adhesive or coating, and the material of the first release layer 210 is PTFE or polyimide.

[0067] By setting the distribution pattern of the first release layer 210, contact is formed between the first release layer 210 and the aluminum substrate unit 610 during the subsequent pressing process. During the pressing process, the first release layer 210 and the aluminum substrate unit 610 will not adhere to each other, so that the support structure 300 can be peeled off more easily and will not adhere to the aluminum substrate unit 610. Normally, the surface of the first release layer 210 is coated with an adhesive layer, which can be used to adhere the first release layer 210 to the cover film support plate 100. The thickness of the first release layer 210 can be selected from 5μm to 35μm according to the requirements.

[0068] Please see Figure 4 , Figure 4 This is a schematic diagram of the cross-sectional structure of the support structure formed according to an embodiment of the present invention.

[0069] Step S130:

[0070] A first adhesive layer 310 is formed on the release support plate 200 to form the support structure 300. The first adhesive layer 310 and the first release layer 210 are distributed in a complementary pattern.

[0071] In this embodiment, the first adhesive layer 310 is made by coating or attaching, and the first adhesive layer 310 is a polyolefin adhesive layer, an epoxy resin adhesive layer, a polyurethane adhesive layer, or an acrylic resin adhesive layer.

[0072] The distribution pattern of the first adhesive layer 310 is set to form a pattern complementary to the first release layer 210, so that the first adhesive layer 310 is subsequently bonded to the filler layer 410 (but not to the aluminum substrate unit 610). When the support structure 300 is finally peeled off, the filler layer 410 can be peeled off through the first adhesive layer 310 (leaving the aluminum substrate unit 610).

[0073] The first adhesive layer 310 is selected from a colloid with strong adhesion, so that the first adhesive layer 310 can form a fully adhesive effect with the filler layer 410 under high temperature and high pressure conditions.

[0074] In this embodiment, a gap of 5 μm to 35 μm is provided between the first adhesive layer 310 and the first release layer 210.

[0075] The gap is set so that, on the premise that the first adhesive layer 310 can fully adhere to the filler layer 410, it can prevent the first adhesive layer 310 from adhering to the aluminum substrate unit 610 during the subsequent overall pressing process due to misalignment error, which would make it difficult to peel off the support structure 300.

[0076] Step S20:

[0077] The process of creating a 500-sized release liner includes the following steps.

[0078] Please see Figure 5 , Figure 5 This is a schematic diagram of the cross-sectional structure of the release filler layer formed according to an embodiment of the present invention.

[0079] Step S210:

[0080] Take a filler layer 410 with an area equal to that of the flexible board to which the aluminum substrate is to be attached, and make a second release layer 420 on the filler layer 410 to form a release filler layer 400. The distribution pattern of the second release layer 420 corresponds to the distribution pattern of the first adhesive layer 310. In this embodiment, the filler layer is an FR-4 board.

[0081] The second release layer 420 corresponds to the pattern distribution of the first adhesive layer 310, that is, it corresponds to the pattern distribution of the flexible plate area of ​​the flexible plate 10A to which the aluminum base layer is to be attached. This setting can ensure that the second release layer 420 will not adhere to the flexible plate area of ​​the flexible plate 10A to which the aluminum base layer is to be attached during the subsequent pressing process, thus avoiding the problem of the filler layer being difficult to peel off during the final peeling. The filler layer 410 is made of FR-4 board, which facilitates processing and makes it easy to match the properties of other materials.

[0082] In this embodiment, the second release layer 420 is made by applying adhesive or coating, and the material of the second release layer 420 is PTFE or polyimide.

[0083] Similar to the fabrication of the first release layer 210, the second release layer 420 can also be fabricated by attachment or coating. The thickness of the second release layer 420 can be selected from 5μm to 35μm depending on the requirements.

[0084] Please see Figure 6 , Figure 6 This is a schematic diagram of the cross-sectional structure of the filling release structure formed according to an embodiment of the present invention.

[0085] Step S220:

[0086] The release filler layer 400 is milled to remove the filler layer 410 corresponding to the area of ​​each aluminum substrate unit 610, forming a through groove 510, and the whole is formed into a filler release structure 500.

[0087] The through slot 510 serves as a slot structure for the subsequent aluminum substrate unit 610 to be embedded into the filler layer 410. Therefore, the through slot 510 corresponds to the pattern distribution of the aluminum substrate unit 610.

[0088] It should be noted that the size of the second release layer 420 is smaller on one side than the size of the through groove 510, with a size difference ranging from 5μm to 25μm. This size difference is to allow for a processing error range.

[0089] Please see Figure 7 , Figure 7 This is a schematic cross-sectional view of the aluminum-based filling structure formed according to an embodiment of the present invention.

[0090] Step S30:

[0091] The fabrication of a multi-unit aluminum-based rigid-flex plate 800 includes the following steps.

[0092] Step S310:

[0093] According to the aluminum base unit pattern to be bonded, an aluminum base unit 610 is fabricated, the aluminum base unit 610 is embedded into the through slot 510, and a second adhesive layer 620 is fabricated on the aluminum base unit 610 to form an aluminum base filling structure 600.

[0094] It should be noted that the aluminum substrate unit 610 can be fabricated and embedded into the through slot 510 by setting a matching structure on the entire aluminum substrate that matches the filling release structure 500, or the aluminum substrate unit 610 can be transferred into the through slot 510 by micro-adhesive film transfer.

[0095] The function of fabricating a second adhesive layer 620 on the aluminum substrate unit 610 is to provide an adhesive structure for the aluminum substrate unit 610 to be attached to the flexible plate 10A of the aluminum substrate to be attached. The adhesive is a polyolefin adhesive, epoxy resin adhesive, polyurethane adhesive or acrylic resin adhesive with strong adhesion, and can be processed by attaching, pressing or coating.

[0096] In this embodiment, the thickness of the aluminum substrate unit 610 is less than or equal to the thickness of the filling release structure 500, and the size of the aluminum substrate unit 610 is smaller on one side than the size of the through slot 510.

[0097] The thickness difference allows for expansion and contraction compensation during the pressing process; the size difference allows for expansion and contraction allowance between the through slot 510 and the aluminum substrate unit 610, and can also prevent the filler layer 410 and the aluminum substrate unit 610 from sticking together during the pressing process, which would make it difficult to peel off or pull off the aluminum substrate unit 610 during the final peeling process.

[0098] Please see Figure 8 , Figure 8 This is a schematic cross-sectional view of the integral pressing structure formed according to an embodiment of the present invention.

[0099] S320: The flexible plate 10A to be attached to the aluminum base layer, the aluminum base filling structure 600, and the support structure 300 are sequentially aligned, stacked, and pressed together to form an integral pressed structure 700.

[0100] In this embodiment, the alignment and stacking layout is as follows: first, the flexible plate 10A to be attached to the aluminum base layer is aligned and stacked with the aluminum base filling structure 600, and then the support structure 300 is aligned and stacked with the aluminum base filling structure 600 to form a stacked layout structure.

[0101] Through overall layout and pressing, the second adhesive layer 420 in the aluminum-based filling structure 600 is bonded to the area of ​​the aluminum substrate to be bonded on the flexible plate 10A to which the aluminum base layer is to be bonded. The first adhesive layer 310 in the support structure 300 is bonded to the filling layer 410 in the aluminum-based filling structure 600. The first release layer 210 is in contact with the surface of the aluminum substrate unit 610 in the aluminum-based filling structure 600 but does not adhere to each other. The second release layer 420 is in contact with the position on the flexible plate 10A to which the flexural area needs to be formed but does not adhere to each other. The filling layer 410 in the aluminum-based filling structure 600 serves to fix and support the aluminum substrate unit 610, while the support structure 300 serves to support the aluminum-based filling structure 600 and adhere to the filling layer 410. The interior forms a staggered stepped adhesion and release effect, which facilitates subsequent peeling processing.

[0102] In this embodiment, the stacked layout further includes a release layer, a cover layer, and a heat-conducting layer disposed sequentially outward from the upper and lower surfaces of the stacked layout structure.

[0103] The release layer can be made of polytetrafluoroethylene, which serves as a release layer during and after the pressing process; the cover layer can be made of polyolefin, kraft paper, or epoxy resin, which serves as a cover layer during the pressing process; the heat-conducting layer can be made of steel plate or aluminum sheet, which serves as a heat-conducting and leveling layer.

[0104] Please see Figure 9 , Figure 9 This is a schematic diagram of the cross-sectional structure of a multi-unit aluminum-based rigid-flexible plate according to an embodiment of the present invention.

[0105] S330: Remove the support structure 300 and the filling release structure 500 from the integral pressing structure 700 to form the multi-unit aluminum-based rigid-flexible plate 800.

[0106] When removing the aluminum-based filling structure 600, if the thickness is thin (≤0.5mm), a tear can be made first, and then the support structure 300 can be torn off directly along with the filling release structure 500. If the thickness of the aluminum-based filling structure 600 is thick (>0.5mm), the position and outline of each filling unit of the filling layer 410 of each aluminum-based filling structure 600 can be controlled by milling the plate on the surface of the corresponding support structure 300, milling through the support structure without damaging the aluminum substrate unit 610. After milling, the milled units can be removed step by step.

[0107] The manufacturing method of this embodiment can produce a multi-unit aluminum-based rigid-flexible bonded plate 800 with a flat flexible area and a firm bond between the aluminum substrate unit 610 and the flexible plate 10A to be attached to the aluminum base layer.

[0108] It should be noted that, since the thickness of the rigid-flexible bonding plate and each processing layer is relatively thin during the actual processing, the accompanying drawings of this embodiment illustrate the processing process in the form of schematic diagrams. The drawings do not represent the thickness of each layer during the actual processing, nor are they proportionally enlarged structures.

[0109] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a multi-unit aluminum-based rigid-flex plate, characterized in that, The manufacturing method involves attaching ≥2 aluminum substrate units to a flexible board on which an aluminum substrate is to be attached to form a multi-unit aluminum-based rigid-flex board. The manufacturing method includes the following steps: S10: Construct the supporting structure, including the following steps: S110: Take a support plate with an area equal to that of the rigid-flexible bonded plate, and attach a covering film layer to the support plate to form a covering film support plate; S120: On one side of the support plate of the cover film support plate, corresponding to the pattern distribution of each aluminum substrate unit, a first release layer is made to form a release support plate; S130: A first adhesive layer is formed on the release support plate to form the support structure, wherein the first adhesive layer and the first release layer are distributed in a complementary pattern. S20: Create the filler release structure: S210: Take a filler layer with an area equal to that of the flexible plate to which the aluminum substrate is to be attached, and make a second release layer on the filler layer to form a release filler layer. The distribution pattern of the second release layer corresponds to the distribution pattern of the first adhesive layer. S220: The release filler layer is milled to remove the filler layer corresponding to the area of ​​each aluminum substrate unit, forming a through groove, and the whole is formed into a filler release structure. The thickness of the aluminum substrate unit is less than or equal to the thickness of the filling release structure, and the size of the aluminum substrate unit on one side is smaller than the size of the through slot. S30: Fabrication of multi-unit aluminum-based rigid-flex plate: S310: According to the aluminum base unit pattern to be bonded, an aluminum base unit is fabricated, the aluminum base unit is embedded into the through slot, and a second adhesive layer is fabricated on the aluminum base unit to form an aluminum base filling structure. S320: The flexible plate to be attached to the aluminum base layer, the aluminum base filling structure, and the support structure are sequentially aligned, stacked, and pressed together to form an integral pressed structure; The alignment and stacking arrangement is as follows: first, the flexible plate to be attached to the aluminum base layer is aligned and stacked with the aluminum base filling structure, and then the support structure is aligned and stacked with the aluminum base filling structure to form a stacked arrangement structure. S330: Remove the supporting structure and the filling release structure from the overall pressing structure to form the multi-unit aluminum-based rigid-flexible plate.

2. The method for manufacturing a multi-unit aluminum-based rigid-flex plate as described in claim 1, characterized in that, The support plate is made of FR-4 sheet material with a thickness of 0.3mm to 1.0mm.

3. The method for manufacturing a multi-unit aluminum-based rigid-flex plate as described in claim 1, characterized in that, The first release layer is made by applying adhesive or coating, and the material of the first release layer is PTFE or polyimide.

4. The method for manufacturing a multi-unit aluminum-based rigid-flex plate as described in claim 1, characterized in that, The first adhesive layer is made by coating or attaching, and the first adhesive layer is a polyolefin adhesive layer, an epoxy resin adhesive layer, a polyurethane adhesive layer, or an acrylic resin adhesive layer.

5. The method for manufacturing a multi-unit aluminum-based rigid-flex plate as described in claim 1, characterized in that, A gap of 5μm to 35μm is provided between the first adhesive layer and the first release layer.

6. The method for manufacturing a multi-unit aluminum-based rigid-flex plate as described in claim 1, characterized in that, The filler layer is FR-4 board.

7. The method for manufacturing a multi-unit aluminum-based rigid-flex plate as described in claim 1, characterized in that, The second release layer is made by applying adhesive or coating, and the material of the second release layer is PTFE or polyimide.

8. The method for manufacturing a multi-unit aluminum-based rigid-flex plate as described in claim 1, characterized in that, The stacked layout also includes a release layer, a cover layer, and a heat-conducting layer arranged sequentially outward from the upper and lower surfaces of the stacked layout structure.

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