Cooling system, cabinet and data center

Abstract

The application discloses a cooling system, a cabinet and a data center. The cooling system is applied to the cabinet and comprises a water-cooled heat exchanger, a thin-film cooler, a circulating pump and a water supplement device. The water-cooled heat exchanger is arranged at an air inlet of the cabinet and is used for heat exchange and temperature reduction of air at the air inlet. The thin-film cooler is arranged at an air outlet of the cabinet and is used for heat exchange and temperature reduction of air at the air outlet. The water-cooled heat exchanger is provided with a first water inlet and a first water outlet. The thin-film cooler is provided with a second water inlet and a second water outlet. The first water inlet is communicated with the second water outlet, and the first water outlet is communicated with the second water inlet. The circulating pump can make water in a first water cavity and water in a second water cavity flow circularly. The water supplement device is communicated with the water-cooled heat exchanger or the thin-film cooler and is used for water supplement of the cooling system. The above cooling system can not only save arrangement space but also reduce energy consumption.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cabinet cooling systems, in particular to a cooling system, a cabinet and a data center. BACKGROUND

[0002] In the wave of "new infrastructure", the construction of data centers is showing a rapid growth trend. With the increasing demand for energy saving in data centers, high efficiency and energy saving have become a key demand in the construction of data centers. At present, small and medium-sized data centers commonly use air-cooled air conditioners and chilled water air conditioners for heat dissipation, and large data centers gradually use indirect evaporative cooling systems using natural cold sources for heat dissipation. On the one hand, these precision air conditioning systems all need to occupy a large space to arrange the units, on the other hand, with the gradual tightening of energy consumption requirements of data centers, traditional air-cooled, chilled water and indirect evaporative cooling refrigeration systems have gradually approached the limit and cannot meet the requirements of lower energy consumption efficiency. SUMMARY

[0003] The present application provides a cooling system, a cabinet and a data center, which can save layout space and further reduce energy consumption.

[0004] In a first aspect, the present application provides a cooling system, which can be applied to a cabinet. The cabinet can include a cabinet body, which can be provided with an air inlet and an air outlet. The cooling system is located inside the cabinet body and includes a water-cooled heat exchanger, a thin film cooler, a circulating pump and a water supplementing device. The water-cooled heat exchanger is located at the air inlet of the cabinet body and is used to exchange heat and cool the air at the air inlet. The thin film cooler is located at the air outlet of the cabinet body and is used to exchange heat and cool the air at the air outlet. The water-cooled heat exchanger is provided with a first water inlet and a first water outlet, and the thin film cooler is provided with a second water inlet and a second water outlet. The first water inlet and the second water outlet are communicated, and the first water outlet and the second water inlet are communicated. The circulating pump can be arranged between the first water inlet and the second water outlet, or arranged between the first water outlet and the second water inlet, so that the water in the first water cavity and the water in the second water cavity can circulate and flow. The water supplementing device is communicated with the thin film cooler and is used to supplement water for the thin film cooler, or the water supplementing device is communicated with the water-cooled heat exchanger and is used to supplement water for the water-cooled heat exchanger.

[0005] Compared with the traditional scheme, in the cooling system, the air can be cooled by heat exchange when passing through the water-cooled heat exchanger, the water with increased temperature in the water-cooled heat exchanger can flow into the thin film cooler, the air with increased temperature after heat exchange with the heating element can pass through the thin film cooler, the water in the thin film cooler absorbs heat and continuously evaporates, part of the water vapor can be used to cool the high-temperature water in the thin film cooler, and the other part can pass through the film into the high-temperature air and cool the high-temperature air. The cooling system uses the thin film cooler, the water-cooled heat exchanger and the cabinet to form an integrated cooling system, without the need to separately configure a precision air conditioner for the data center, the layout space can be saved, and the above cooling method can further reduce energy consumption.

[0006] In some possible embodiments, the water-cooled heat exchanger can be a coil heat exchanger, which can effectively exchange heat with the air and facilitate water circulation between the thin film cooler.

[0007] In some possible embodiments, the material of the thin film cooler can be polyvinylidene fluoride, which has good high-temperature resistance and corrosion resistance.

[0008] In some possible embodiments, the thin film cooler can include a plurality of thin film tubes, the plurality of thin film tubes are sequentially connected, and the plurality of thin film tubes can increase the area of the thin film, so that the water in the thin film cooler can be discharged from the thin film cooler more when the water evaporates to generate water vapor.

[0009] In some embodiments, the material of the inner wall of the thin film tube can be super-hydrophobic material, so that the water vapor can be discharged from the thin film cooler more.

[0010] In some possible embodiments, the water supplement device can include a water supplement tank, the water supplement tank can be provided with a third water inlet, a third water outlet and a water overflow port, the third water outlet is communicated with the second water cavity, so that the water supplement tank can receive the supplemented water through the third water inlet, and supply the water to the thin film cooler or the water-cooled heat exchanger through the third water outlet, to ensure that the thin film cooler and the water-cooled heat exchanger can continuously circulate water.

[0011] In a second aspect, the present application provides a cabinet, which comprises a cabinet body. The cabinet body can comprise two first side plates arranged oppositely and in a first direction. The cabinet further comprises the cooling system according to any one of the above embodiments. One of the first side plates is provided with an air inlet, and the other first side plate is provided with an air outlet. The water-cooled heat exchanger in the cooling system can be located at the air inlet, and the thin film cooler can be located at the air outlet. When air enters the cabinet from the air inlet, the air is cooled by the water-cooled heat exchanger and then exchanges heat with the heat generating elements in the cabinet, thereby taking away the heat in the cabinet. When the high-temperature air passes through the thin film cooler and is discharged from the air outlet, the water in the thin film cooler can continuously evaporate by absorbing heat, and the generated water vapor can be used to cool the high-temperature water in the thin film cooler, and the other part of the water vapor can pass through the thin film into the high-temperature air and cool the high-temperature air, thereby improving the cooling effect and reducing the energy consumption.

[0012] In some possible embodiments, the cabinet body can further comprise two second side plates arranged oppositely and in a second direction. The second side plates are located between and connected to the two first side plates. The water-cooled heat exchanger can have a dimension in the second direction equal to that of the first side plates in the second direction. The thin film cooler can also have a dimension in the second direction equal to that of the first side plates in the second direction, so that the cooling area of the water-cooled heat exchanger and the thin film cooler for air is as large as possible, thereby achieving a better cooling effect.

[0013] In a third aspect, the present application provides a data center comprising the cabinet according to any one of the above embodiments. The data center is provided with an air exhaust channel having an air exhaust opening for communication with the outside. The cabinet is placed inside the data center, and the air outlet of each cabinet is in communication with the air exhaust channel. The data center is further provided with a fresh air inlet for supplementing fresh air inside the data center. In the above data center, the air exhausted from the cabinet can be discharged from the air exhaust channel, so that the data center can be cooled in time. In addition, the thin film cooler can continuously permeate water vapor when working, thereby cooling and humidifying the data center.

[0014] In some possible embodiments, the data center can further comprise an air exhaust fan arranged at the air exhaust opening of the air exhaust channel for discharging the humid and hot air.

[0015] In some possible embodiments, the fresh air inlet can comprise a filter permeation window arranged on a wall of the data center. The filtered fresh air passing through the filter permeation window can ensure the cleanliness of the air, thereby ensuring the cooling effect of the cabinets. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1A schematic diagram of a top view of a data center according to an embodiment of the present application is provided.

[0017] Figure 2 A schematic diagram of a top view of a data center according to an embodiment of the present application is provided. Figure 1 A schematic diagram of a top view of a data center according to an embodiment of the present application is provided.

[0018] Figure 3 A schematic diagram of a top view of a data center according to an embodiment of the present application is provided. Figure 2 A schematic diagram of a cross-section structure of a film cooler according to an embodiment of the present application is provided.

[0019] Figure 4 A schematic diagram of a cross-section structure of a film cooler according to an embodiment of the present application is provided. Figure 2 A schematic diagram of a cross-section structure of a film cooler according to an embodiment of the present application is provided.

[0020] Figure 5 A schematic diagram of a top view of a data center according to an embodiment of the present application is provided.

[0021] Reference signs:

[0022] 1 - data center; 10 - cabinet; 20 - exhaust passage; 21 - exhaust port; 30 - exhaust passage; 40 - fresh air inlet; 41 - filter penetration window; 50 - exhaust fan; 100 - cooling system; 101 - water-cooled heat exchanger; 1011 - water-cooled heat exchanger; 1011 - first water inlet; 1012 - first water outlet; 1013 - coil heat exchanger; 102 - film cooler; 1021 - second water inlet; 1022 - second water outlet; 1023 - film tube; 103 - water supplement tank; 1031 - third water inlet; 1032 - third water outlet; 1033 - overflow port; 104 - circulating pump; 105 - first water pipe; 106 - second water pipe; 200 - first side plate; 300 - second side plate. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

[0024] In the embodiments of the present application, the terms "first", "second", "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third" can explicitly or implicitly include one or more of the features.

[0025] In the embodiments of the present application, "and / or" is only a description of the association relationship between the associated objects, which means that there can be three kinds of relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents a "or" relationship between the front and rear associated objects. The connection includes direct connection or indirect connection.

[0026] Reference to "one embodiment" or "some embodiments" or "one implementation" or "some implementations" etc., in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in some embodiments" or "in other embodiments" or "in still other embodiments" or other similar phrases in various places in the specification are not necessarily all referring to the same embodiment, but can refer to one or more but not all embodiments of the application, unless otherwise indicated by the context of the usage in which it appears. The use of the terms "including", "containing", "having" and their variations mean "including but not limited to", unless otherwise expressly so specified.

[0027] Current small and medium-sized data center cooling systems mainly use air cooling systems and chilled water systems. The air cooling system includes an indoor unit and an outdoor unit. The indoor unit is placed in the data center. The refrigerant exchanges heat in the evaporator of the indoor unit and carries away the heat generated by the cabinet. The heat is dissipated to the outdoor air through the condenser of the outdoor unit. The chilled water system includes a front-end cooling water tower, a water-cooled chiller unit, a water pump, a chilled water storage tank, and an end chilled water air conditioning unit. The prepared low-temperature chilled water is sent to the end chilled water air conditioning unit from the storage tank. The low-temperature water carries away the heat in the data center, and then is cooled by the cooling water tower and the water-cooled chiller unit, and then returns to the storage tank, so as to realize the continuous heat dissipation of the data center. With the continuous growth of computing power consumption, the energy consumption of data centers increases year by year. Current large data centers gradually use indirect evaporative cooling systems that can use natural cold sources to control temperature. The indirect evaporative cooling system unit is placed outside the data center. The hot air in the data center enters the indirect evaporative cooling system unit through the air pipe, exchanges heat with the outdoor cold air through the heat exchange core, and is then sent back into the data center.

[0028] The above data center cooling systems need to occupy a large amount of space to arrange the units on one hand. On the other hand, with the gradual increase of the energy consumption requirement of data centers, the energy efficiency of traditional air cooling, chilled water, and indirect evaporative cooling refrigeration systems has gradually approached the limit due to the existence of a large number of fans, compressors, water pumps, and other power consumption devices, which cannot meet the requirement of lower energy consumption.

[0029] Therefore, the embodiments of the present application provide a cooling system which can be used for dissipating heat of cabinets in a data center. The application of the cooling cabinet can save the layout space in the data center on one hand, and can also reduce the energy consumption of the data center on the other hand. The cooling system, the cabinet applying the cooling cabinet, and the data center will be specifically introduced below with reference to the accompanying drawings.

[0030] Reference Figure 1 and Figure 2 ,Figure 1 This is a top view of a data center 1 provided in an embodiment of this application. Figure 2 for Figure 1 This is a top view of a cooling system. Data center 1 includes an exhaust duct 20 and multiple independent server racks 10. One end of the exhaust duct 20 has an exhaust vent 21, allowing the exhaust duct 20 to connect to the outside environment. Each server rack 10 may have an independent cooling system 100, which cools the corresponding rack 10. The rack 10 may include a cabinet with an air inlet and an air outlet. The air outlet can connect to the exhaust duct 20, allowing the cooled air to be exhausted to the outside environment through the exhaust duct 20. For example, an exhaust channel 30 may be provided at the air outlet of the rack 10, allowing the rack 10 to connect to the exhaust duct 20. That is, the hot and humid air exhausted from the rack 10 can enter the exhaust channel 30 from the air outlet, then enter the exhaust duct 20 through the exhaust channel 30, and finally be exhausted to the outside environment through the exhaust channel 30.

[0031] Continue to refer to Figure 1 The arrows in the diagram can be interpreted as the direction of air flow. The data center can also be equipped with a fresh air inlet 40. Fresh air that is used to supplement the data center can enter the data center through the fresh air inlet 40. The fresh air enters the cabinet 10 through the air inlet and is cooled by the cooling system 100. The heated air enters the exhaust channel 30 through the air outlet of the cabinet 10 and is finally discharged to the outside through the exhaust channel 20. This cycle is repeated to achieve the cooling effect of the data center 1.

[0032] In some embodiments, a filter infiltration window 41 can be installed at the fresh air inlet 40. The filter infiltration window 41 can be installed on the wall of the data center to filter the fresh air and remove impurities in the air. This ensures that the air cleanliness is maintained during the cooling process of each server rack 10 after the fresh air enters the data center 1, thereby ensuring that the working components inside the server rack 10 are not contaminated by impurities in the air and ensuring the normal operation of the server rack 10.

[0033] The number of filter permeation windows 41 is unlimited. For example, there can be one, two, three, etc. The amount of fresh air entering the data center can be controlled by setting different numbers of filter permeation windows 41, or the amount of fresh air can be controlled by controlling the area of ​​the filter permeation windows 41.

[0034] In some embodiments, an exhaust fan 50 may be installed at the exhaust port 21 of the exhaust duct 20 to increase the exhaust rate of the exhaust duct, thereby helping to improve the heat dissipation effect on the cabinet.

[0035] Continue to refer toFigure 2 The arrows in the figure can be understood as the direction of air flow. The cabinet 10 can have a substantially hexahedral shape, including two first side plates 200 arranged opposite to each other and two second side plates 300 arranged opposite to each other. The two first side plates 200 can be arranged along a first direction, and the two second side plates 300 can be arranged along a second direction. The second side plates 300 are connected between the two first side plates 200, and the first side plates 200 and the second side plates 300 can be perpendicular to each other. The air inlet and the air outlet of the cabinet can be respectively formed in the two first side plates 200, so that air can enter the cabinet 10 from the air inlet and be discharged from the cabinet 10 from the air outlet. The cooling system 100 can include a water-cooled heat exchanger 101, a thin film cooler 102, a circulating pump 104, and a water supplementing device (see reference numeral 103 in Figure 2 The water-cooled heat exchanger 101 can be arranged at the air inlet. The water-cooled heat exchanger 101 can include a first water cavity filled with cooling water, and the first water cavity can be provided with a first water inlet 1011 and a first water outlet 1012. The thin film cooler 102 is arranged at the air outlet. The thin film cooler 102 can include a second water cavity also filled with cooling water, and the side wall of the second water cavity is a thin film. The thin film can be used to discharge water vapor generated by evaporation due to temperature rise. The second water cavity can be provided with a second water inlet 1021 and a second water outlet 1022. The first water inlet 1011 of the first water cavity and the second water outlet 1022 of the second water cavity can be communicated through a first water pipe 105, and the first water outlet 1012 of the first water cavity and the second water inlet 1021 of the second water cavity can be communicated through a second water pipe 106. The first water pipe 105 and the second water pipe 106 can be arranged on the same side of the cabinet 10. The circulating pump 104 can be used to make the water in the first water cavity and the second water cavity circulate, that is, the water in the first water cavity enters the second water cavity through the second water inlet 1021 from the first water outlet 1012, or the water in the second water cavity enters the first water cavity through the first water inlet 1011 from the second water outlet 1022. It should be noted that the circulating pump 104 can be installed on the first water pipe 105 or the second water pipe 106. The installation position can be designed according to actual needs, which is not limited here.

[0036] In some embodiments, continuing to refer to Figure 2The water-cooled heat exchanger 101 can be a coil-type heat exchanger 1013. Cooling water can flow continuously in the coil-type heat exchanger 1013, flowing from the first inlet 1011 to the first outlet 1012. During operation, after the cooling water enters the first water chamber through the first inlet 1011, it exchanges heat with the air and becomes warm, then flows to the first outlet 1012 and enters the thin-film cooler 102 through the first outlet 1012. The water in the thin-film cooler 102 is cooled by the evaporation of water vapor and then flows back to the coil-type heat exchanger 1013. The structure of the coil-type heat exchanger 1013 allows the water in the first water chamber to maintain a low temperature after exchanging heat with the air, thereby continuously exchanging heat and cooling the air at the air inlet, improving the cooling effect, and reducing energy consumption by utilizing the water circulation working mode.

[0037] To improve the heat exchange effect with air, the dimension of the coil heat exchanger 1013 along the second direction can be the same as the dimension of the first side plate 300 along the second direction. This structural arrangement increases the heat exchange area between the coil heat exchanger 1013 and the air, allowing the coil heat exchanger 1013 to exchange heat with the air to a greater extent, thereby further reducing the temperature of the air after heat exchange and cooling. For example, the dimension of the coil heat exchanger 1013 along the first direction can be 300mm-600mm.

[0038] In some embodiments, reference is also made to Figure 2 , Figure 3 and Figure 4 , Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure of the thin-film cooler 102 perpendicular to the first direction. Figure 4 for Figure 2 The diagram shows a cross-sectional view of the thin-film cooler 102 perpendicular to the second direction. The thin-film cooler 102 may include multiple thin-film tubes 1023, which can be sequentially connected to form a second water chamber. In a specific implementation, the multiple thin-film tubes 1023 can be arranged in an array, and the thin-film tubes 1023 can extend along the second direction. In a specific implementation, the second outlet 1022 can be set in the thin-film tube 1023 at the lower left corner, and the second inlet 1021 can be set in the thin-film tube 1023 at the lower right corner. After the cooling water enters the thin-film tube 1023 from the second inlet 1021, it flows through the adjacent thin-film tubes 1023 in an "S"-shaped flow path and finally flows out from the second outlet 1022.

[0039] When the air enters the cabinet 10 through the air inlet, the water-cooled heat exchanger 101 at the air inlet can exchange heat with the air to reduce the temperature of the air entering the cabinet 10. The air after being cooled by the water-cooled heat exchanger 101 exchanges heat with the heat generating elements in the cabinet 10 and is heated again. At the same time, the water in the water-cooled heat exchanger 101 that has exchanged heat with the air and has a higher temperature enters the thin film cooler 102. The high-temperature air in the cabinet 10 passes through the thin film cooler 102 before being discharged from the air outlet. The water in the thin film cooler 102 evaporates due to the absorption of heat from the high-temperature air and continuously evaporates to cool the water in the second water cavity. At the same time, the water vapor generated by the evaporation of the water in the thin film cooler 102 can enter the high-temperature air discharged from the cabinet 10 through the thin film and cool the high-temperature air. That is, the refrigeration capacity generated by the evaporation of the water in the thin film cooler 102 is used to cool the high-temperature water in the second water cavity and the high-temperature air discharged from the cabinet 10.

[0040] In addition, during the evaporation of the water in the thin film cooler 102, water vapor continuously permeates out of the thin film cooler 102. The water vapor can also be used to humidify the data center 1. Therefore, the structure of the thin film cooler 102 (i.e., the plurality of arrayed thin film tubes 1023) can not only increase the amount of water in the second water cavity to achieve better cooling effect when exchanging heat with the high-temperature air, but also increase the amount of humidification. In some embodiments, the circulating pump 104 can be used to control the amount of humidification. For example, when it is necessary to increase the amount of humidification, the power of the circulating pump 104 can be increased to increase the rotating speed of the impeller inside the circulating pump 104, so that the amount of cooling water entering the thin film cooler 102 per unit time is increased. Since the amount of water in the thin film cooler 102 is increased, more water vapor can be generated when exchanging heat with the high-temperature air, thereby increasing the amount of humidification. Similarly, when it is necessary to reduce the amount of humidification, the power of the circulating pump 104 can be reduced to achieve the purpose, which will not be described here.

[0041] In addition, the water in the thin film cooler 102 that has been cooled by evaporation of water vapor can enter the water-cooled heat exchanger 101 (i.e., the first water cavity) through the first water inlet 1011 from the second water outlet 1022, thereby realizing the circulation of the cooling water.

[0042] The material of the thin film cooler 102 can be polyvinylidene fluoride, which has corrosion resistance and high temperature resistance, so as to ensure the stability of the structure of the thin film tube 1023 during use and thus ensure the cooling effect. In addition, the thin film tube 1023 can be designed in the form of a light tube, and the material of the inner wall of the thin film tube 1023 can be designed as a super-hydrophobic material, so that more water vapor can permeate out of the thin film cooler 102 when the water vapor evaporates, thereby improving the humidification effect on the data center.

[0043] To improve the heat exchange effect on the air, the size of the film cooler 102 along the second direction can be the same as the size of the second side plate 300 along the second direction. Through this structure, the heat exchange area of the film cooler 102 and the air is increased, and the high-temperature air can be cooled to a greater extent, so that the temperature of the air after heat exchange and cooling can be further reduced. Exemplarily, the size of the film cooler 102 along the first direction can be 300-600 mm.

[0044] It should be noted that the distance between the two first side plates 200 of the cabinet 10 can be about 1500 mm. On this basis, the coil heat exchanger 1013 is located at the air inlet, the film cooler 102 is located at the air outlet, and the heating element is located between the coil heat exchanger 1013 and the film cooler 102. The size of the coil heat exchanger 1013 and the film cooler 102 along the first direction is not limited here.

[0045] Since the water in the film cooler 102 is in a state of continuous evaporation, in order to ensure that there is enough water in the film cooler 102 to cool the high-temperature air, a water supplementing device can be in communication with the film cooler 102 to supplement cooling water to the film cooler 102 in real time.

[0046] Continuing to refer to Figure 2 , the water supplementing device can include a water supplementing tank 103 corresponding to each cabinet 10, so as to supplement water to the film cooler 102. In specific implementation, the water supplementing tank 103 can be provided with a third water inlet 1031 and a third water outlet 1032. The third water outlet 1032 is in communication with the film cooler 102, and the third water inlet 1031 can be in communication with a water supplementing pipe in the data center, so as to control the water supplementing amount. In addition, the water supplementing tank 103 can also be provided with a water overflow port 1033. When the cooling water in the water supplementing tank 103 is too much, the cooling water can flow out from the water overflow port 1033, so as to prevent the cooling water in the water supplementing tank 103 from being too much to cause the water pressure in the film cooler 102 to be too large and affect the cooling effect.

[0047] Referring to Figure 5 , Figure 5 Another top view structural schematic diagram of the data center provided by the embodiment of the present application is provided. The water supplementing device can also include a water supplementing tank 103 corresponding to multiple cabinets 10 in the data center. The water supplementing tank 103 is provided with multiple third water outlets 1032, and the multiple third water outlets 1032 can be provided in one-to-one correspondence with the cabinets 10, so that one water supplementing tank 103 can simultaneously supplement cooling water to multiple film coolers 102. Of course, the structure of the water supplementing tank can also adopt other forms, which will not be exemplified one by one here.

[0048] It should be noted that in the above embodiment, only the structure that the water supplement tank 103 communicates with the thin film cooler 102 is described, and in actual application, the water supplement tank 103 can also communicate with the water-cooled heat exchanger 101. Since the circulating pump 104 can make the water circulation between the water-cooled heat exchanger 101 and the thin film cooler 102, this design can also supplement water to the cooling system in time. In specific implementation, the structure of the water supplement tank 103 can refer to the structure in Figure 2 or Figure 5 , which will not be described here.

[0049] It should be noted that, taking the power of the cabinet as 10kW for example, the energy consumption of the existing indirect evaporative cooling system 100 without straight-through air is 0.156, and the energy consumption of the indirect evaporative cooling system 100 with straight-through air is 0.136, while in the embodiment of the present application, since the water-cooled heat exchanger 101, the thin film cooler 102 and the cabinet 10 are designed as an integrated structure, there is no need to separately configure a precision air conditioner for the data center, which can effectively reduce the energy consumption of the cabinet 10. Exemplarily, in combination with Figure 1 and Figure 2 , when the working power of the cabinet 10 is 10kW, the energy consumption of each cabinet 10 using the cooling system 100 without exhaust fan 50 can be reduced to 0.0254, and the energy consumption of each cabinet 10 using the cooling system 100 with exhaust fan 50 can be reduced to 0.0735, compared with the existing cooling system 100, the cooling system 100 of the embodiment of the present application effectively reduces the energy consumption.

[0050] Compared with the traditional cooling system, the cooling system in the embodiment of the present application forms an integrated system by the water-cooled heat exchanger, the thin film cooler and the cabinet, so that the cooling system has both refrigeration mode and humidification mode, which not only improves the refrigeration effect, but also effectively reduces the energy consumption of the cabinet.

[0051] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A cooling system applied to a server rack, the server rack comprising a cabinet body, the cabinet body being provided with an air inlet and an air outlet, characterized in that, The cooling system is housed within the cabinet and includes a water-cooled heat exchanger, a thin-film cooler, a circulating pump, and a water replenishment device, wherein: The water-cooled heat exchanger is located at the air inlet, and the water-cooled heat exchanger is provided with a first water inlet and a first water outlet; The thin-film cooler is located at the air outlet. The thin-film cooler has a second water inlet and a second water outlet. The second water inlet is connected to the first water outlet, and the second water outlet is connected to the first water inlet. The circulation pump is used to circulate water between the first water chamber and the second water chamber. The water replenishment device is used to replenish water to the thin-film cooler or the water-cooled heat exchanger.

2. The cooling system according to claim 1, characterized in that, The material of the thin-film cooler is polyvinylidene fluoride.

3. The cooling system according to claim 1 or 2, characterized in that, The thin-film cooler includes multiple thin-film tubes that are connected in sequence.

4. The cooling system according to claim 3, characterized in that, The inner wall of the membrane tube is made of a superhydrophobic material.

5. The cooling system according to any one of claims 1-4, characterized in that, The water replenishment device includes a water replenishment tank, which has a third water inlet, a third water outlet and an overflow outlet. The third water outlet is connected to the thin film cooler or the water-cooled heat exchanger.

6. The cooling system according to any one of claims 1-5, characterized in that, The water-cooled heat exchanger is a coil-type heat exchanger.

7. A server rack, characterized in that, The device includes a cabinet and a cooling system as described in any one of claims 1-6, the cooling system being located within the cabinet, the cabinet including two opposing first side panels arranged along a first direction, one of the first side panels having an air inlet and the other first side panel having an air outlet, the water-cooled heat exchanger of the cooling system being located at the air inlet, and the thin-film cooler of the cooling system being located at the air outlet.

8. The cabinet according to claim 7, characterized in that, The cabinet also includes two opposing second side panels, which are arranged along a second direction and connected between the two first side panels; The dimension of the water-cooled heat exchanger along the second direction is equal to the dimension of the first side plate along the second direction, and / or the dimension of the thin-film cooler along the second direction is equal to the dimension of the first side plate along the second direction.

9. A data center, characterized in that, Includes multiple cabinets as described in claim 7 or 8, wherein: The data center is equipped with an exhaust duct, and the exhaust duct is equipped with an exhaust outlet. The air outlet of the cabinet is connected to the exhaust duct; The data center is also equipped with a fresh air inlet, which is used to replenish the interior of the data center with fresh air.

10. The data center according to claim 9, characterized in that, It also includes an exhaust fan installed at the exhaust vent.

11. The data center according to claim 9, characterized in that, The fresh air inlet is equipped with a filter permeation window, which is installed on the wall of the data center.

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