Apparatus and method for operating at least two tools

Abstract

The invention relates to an apparatus and method for operating at least two tools in a first and at least a second processing area, wherein in each processing area a plurality of processing positions is assigned to the tools, by means of which a first component carried by a component web is conveyed along a track through the first and at least a second processing area, wherein the total number of tools in the apparatus is less than the number of processing positions in each processing area, wherein the track comprises a plurality of sub-tracks corresponding to the plurality of processing positions, wherein the tools of each processing area are adapted to couple a respective second component to a respective first component at each associated processing position in its processing area, and wherein the apparatus comprises a control unit which is adapted to, in response to a conveying movement of the component web along the track, (i) position the tools at one or more of the plurality of processing positions in its processing area; and (ii) actuate the tools to mount the first or second components at the respective processing positions, such that in the first area (i) selected first components conveyed along a first sub-track on the component web, and (ii) selected first components conveyed along a second sub-track on the component web are processed by the tools of the first area, and in the second area (i) selected first components conveyed along a third sub-track on the component web, and (ii) first components conveyed along the second sub-track on the component web and not processed in the first area are processed by the tools of the second area.

Description

TECHNICAL FIELD

[0001] Presented herein are apparatuses for operating at least two tools. The at least two tools operate in a first processing area and at least a second processing area of the apparatus. Associated methods are also presented. BACKGROUND

[0002] When transferring electronic components, in particular chips, and especially when transferring single electronic components, a general problem exists that the electronic components can be susceptible to damage and thus have to be handled with great care. Furthermore, electronic components are subject to continuous miniaturization, such that the requirements on the accuracy of the electronic component transfer continuously increase. Furthermore, also the requirements on the number of (electronic) components transferred per unit of time (throughput) increase.

[0003] DE 103 49 847 B3 describes a placement apparatus and a placement method for transferring electronic components. Semiconductor wafers arranged on a carrier foil are arranged above and parallel to a tape substrate. The wafers can be displaced within the wafer plane by means of wafer holders and can furthermore be rotated about a rotation axis perpendicular to the wafer plane. The ejection apparatus comprises ejection needles which act by moving downward on the back of the chip to be separated and separate the chip from the carrier foil. The chips separated from the carrier foil are then deposited on adhesive locations on the tape substrate.

[0004] WO 2017 / 076989 A1 relates to a handling system and method for handling a flexible substrate, e.g. a track, using a tensioner with an indexer intermittently moving the flexible substrate for handling, the tensioner having a vacuum plate movable along a transport direction of the flexible substrate. The vacuum plate is adapted to move along the transport direction. The indexer is adapted to intermittently move the flexible substrate for handling. A controller is adapted to control the tensioner and the indexer to maintain a relative speed between the indexer and the vacuum plate of the tensioner above a predetermined threshold value under all working conditions, even when the flexible substrate is stopped. The track, which can be used in the handling system, has several electrical structures separated by a certain distance. These electrical structures can be any type of flexible electronics.

[0005] DE 10 2011 104 225 B4 relates to an apparatus for positioning electronic components to be transferred relative to an ejector, wherein the ejector comprises a slider for at least one electronic component and a housing surrounding the slider, the housing having a first light-transmissive region. A first carrier provides the electronic components to be transferred. The first carrier has a first side facing the ejector and a second side facing away from the ejector. A plurality of electronic components is arranged on the second side. An image data acquisition apparatus is adapted to acquire image data of a region in which the slider is adapted to interact with the at least one electronic component via the first translucent region of the housing. A controller is adapted to determine position data of the electronic component to be transferred from the captured image data and to generate a control command based on the position data. At least one actuator is adapted to move the first carrier and the ejector relative to each other based on the control command to change an offset between a longitudinal axis of the slider and a central axis of the electronic component to be transferred, wherein the ejector comprises a first mirror arranged inside the housing.

[0006] JP 2003-109979 A relates to an apparatus having at least two sliders for separating components from a first carrier. The components are each picked up by a suction pipette for transferring the components. In a final step, the transfer element, together with the suction pipette and the components, is positioned above a second carrier, which has been prepared with an adhesive, and the components are deposited on the second carrier. The components are not transferred directly from the first carrier to the second carrier, but are picked up from the first carrier after separation by means of the transfer element and precisely oriented and attached to the second carrier in a subsequent step.

[0007] Other devices and methods for transferring electronic components forming the technical background of the devices and methods described herein are described in JP 5267451 A, EP 0 565 781 B1 and DE 198 22 512 A1, US 4,667,402 B1, US 2008 / 0086874 A1, EP 2 764826 A1, US 2002 / 0019074 A1, US 2009 / 242124 A1, EP 0 140126 A1, US 4,990,051 B1, DE 198 22 512 A1, US 2006 / 237142 A1, US 2007 / 293022 A1, US 6,201,306 B1, JP 2009-238881 A, JP 2010-161 155 A, US 4,667,402 B1, JP 60-097634 A, JP 01 -109737 A, JP 55-070041 A, JP 2002-050670 A, JP 09-162204 A, JP 53-100765 A, JP 2003-109979 A, JP 2008-004936 A, WO 2007 / 137888 A1, WO 2000 / 014789 A1, EP 949662 A2, US 2006 / 013680 A1, US 2016 / 308269 A1, DE 10 201 1 017218 A1, EP 2 491 583 B1.

[0008] To increase the throughput of the device, for example, the method will transfer a looped belt with several tracks of components arranged next to each other by means of several transfer devices arranged one after the other in an assembly line. Each transfer device contains a tool, for example in the form of a pre-bonder, which assembles further components together with a respective first component. This increases the throughput of the entire assembly line. Each tool in the line acts on a section of the multiple rows of belt material, for example, the tool processes row 1 and row 2 on a material with 8 rows.

[0009] However, this type of processing causes adverse effects. Since all transfer devices / tools in the assembly line are arranged one after the other in the direction of conveyance of the belt material or component web, and the buffer capacity between the transfer devices is limited, delays can occur depending on the processing time of the individual tools. Furthermore, all transfer devices in the assembly line must be adapted to the feed rate or the processing time of the slowest tool.

[0010] This means that the number of rows or tracks has a significant impact on the throughput of an assembly line. As long as the tools only process complete rows, for example, in an assembly line with four tools and five rows of components, one tool must process two rows while the other three tools each process one row. The tool processing two rows determines the overall conveying speed of the conveyor belt. Therefore, the three tools in the other rows can process only one row of components at a time (and wait for a period of time), while the tool processing two rows is busy throughout the entire process. Thus, the three tools assigned only one row cannot utilize their full throughput potential. Throughput can decrease by up to 50% compared to the same assembly line with four rows of conveyor belt. Summary of the Invention

[0011] question

[0012] The problem concerns assembly lines with at least two coupled tools. Therefore, the objective is to provide a device that achieves higher assembly throughput on assembly lines where tools are associated with more than one row of components to be processed.

[0013] Scheme

[0014] To this end, it is proposed herein a device having the following features: A device for operating at least two tools in a first processing area and at least a second processing area, wherein in each processing area a plurality of processing positions is assigned to a respective tool, by means of which a first component carried by a component web is conveyed along a track through the first processing area and at least a second processing area, wherein a total number t of tools in the device is less than a number p of processing positions in each processing area, wherein the track comprises a plurality of sub-tracks corresponding to the plurality of processing positions, wherein the tools of each processing area are adapted to couple a respective second component to a respective first component at each associated processing position in its processing area, wherein the tools comprise a component supply for the second component and a socket for the component supply, and wherein the device comprises: a control unit adapted to, in response to a conveyance movement of the component web along the track: (i) position the tools and associated sockets at one or more of the plurality of processing positions in its processing area, wherein the tools have a needle or a laser source, and wherein the positioning comprises moving the sockets in at least one of an x-direction, a y-direction and a z-direction; and (ii) actuate the tools to mount a first component or a second component at a respective processing position, such that in the first processing area (i) selected first components conveyed along a first sub-track on the component web; and (ii) selected first components conveyed along a second sub-track on the component web are processed by the tools of the first processing area, and in the second processing area (i) selected first components conveyed along a third sub-track on the component web, and (ii) first components conveyed along the second sub-track on the component web and not processed in the first processing area are processed by the tools of the second processing area. This device is for operating at least two tools in a first processing area and at least a second processing area, in each processing area a plurality of processing positions is assigned to a respective tool, by means of which a first component carried by a component web is conveyed along a track through the first processing area and at least a second processing area. In addition, a total number of tools in the device is less than a number of processing positions in each processing area. Furthermore, the track comprises a plurality of sub-tracks equal to the number of processing positions. In addition, for example, the tools of each processing area can be adapted to mount a second component to a first component at each associated processing position in its processing area.

[0015] Preferably, the device comprises a control unit adapted to position the tools at one or more of the plurality of processing positions in its processing area in dependence on a conveyance movement of the component web along the track. The control unit is further adapted to operate the tools to, for example, mount a first component or a second component at a respective processing position.

[0016] The control unit can be further adapted such that in the first zone, the selected first components conveyed on the component web along the first sub-track and the selected first components conveyed on the component web along the second sub-track are processed by the tool of the first zone. The control unit is further adapted such that in the second zone, the selected first components conveyed on the component web along the third sub-track and the first components conveyed on the component web along the second sub-track and not processed in the first zone are processed by the tool of the second zone.

[0017] In one variant, the apparatus has for example two second component sources (each in the form of a wafer) from which second components are transferred to a plurality (for example three rows) of first components. Second components are transferred from each of the two sources (wafers) to two rows of first components, but not to more than two (for example three), but the respective source can also be arranged in the apparatus to more than two (for example up to three) rows of first components.

[0018] In some variants, the selected first components are all components in a sub-track. This allows the tool to work in the most efficient way for the sub-track on which the tool works.

[0019] The apparatus can cause an increase in the capacity utilization of a single tool by implementing the joint use of sub-tracks. This can cause the tool to no longer process a single row completely, but only partially. A subsequent tool can then process the still unprocessed processing locations in the row so that the row is finally completely processed (for example, second components are mounted on the first part of the row).

[0020] This can result in an apparatus that realizes the highest throughput of an assembly line. In this case, two tools share a sub-track, wherein the second sub-track is adjacent to both the first sub-track and the third sub-track. Since the tools do not have to cross two sub-tracks in order to work on the common sub-track, this can enable a higher throughput of the assembly line.

[0021] In some examples, the component web conveyed along the track through the first processing zone and at least the second processing zone is conveyed intermittently or continuously via a transport function. This allows the component web to be stopped among at least two tools to ensure more accurate processing, since the tools do not have to work on a continuously moving track. This can also allow continuous movement of the component web, thus enabling a higher throughput of the assembly line.

[0022] In some variants, the control unit of each processing area is coupled to a master control unit. This allows the control units to be synchronized with each other if needed, so that no processing area is processed twice. If the width of the track changes depending on, for example, the number of rows on the assembly web and / or the number of sub-tracks and / or the number of processing positions changes, it can also allow a change in the processing method. This can thus enable a more flexible apparatus that can process a variety of different assembly webs.

[0023] In some variants, the total number of tools of the apparatus and the number of processing positions in each processing area follow the mathematical relationship t < p < floor(1,5t). In this mathematical relationship, t equals the total number of tools in the apparatus, and p equals the number of processing positions in each processing area (or equals the number of rows of first assemblies on the assembly web). Compliance with this relationship can allow a higher throughput, since no tool will process more than two positions on the assembly web.

[0024] Additionally, in another variant, the total number of tools and the number of processing positions furthermore follow the equation p = 1,5t. This can allow the most efficient throughput, where each tool completely separately processes one processing position and shares a second processing position with a second tool. The tools can thus be fully utilized.

[0025] In some variants, the tools of the first processing area move in response to the tools of the second processing area. This can allow efficient control of the tools, since the movement does not depend on another tool. This in turn can result in a higher throughput of the assembly line.

[0026] In some variants, the control unit is further adapted to operate the tools so that the tools of the first processing area process first assemblies of a second sub-track. Furthermore, the tools of the second processing area process the next b first assemblies of the second sub-track, and wherein b is an integer.

[0027] Alternatively, the control unit is further adapted to operate the tools so that the tools of the first processing area process b first assemblies of a second sub-track. Furthermore, the tools of the second processing area subsequently process c first assemblies of the second sub-track, wherein b and c are integers, and b≠c.

[0028] This allows the tools to process the sub-tracks and their respective processing positions in a more efficient manner in the case where the number of sub-tracks and / or processing positions changes. This can also allow a higher throughput to be achieved in the case where the first assemblies at each processing position and / or on each sub-track are not identical.

[0029] In some variants, one or more of the first assemblies and / or one or more of the second assemblies are electronic assemblies.

[0030] In some other variants, at least one of the first electronic components and / or the second electronic components is an (RFID) antenna or a ladder structure. Subsequently, at least one of the first electronic components and / or the second electronic components is an (RFID) chip compatible with the (RFID) antenna or a component suitable for emitting light.

[0031] In some variants, the number of sub-tracks is an integer multiple of the number of processing positions. This allows multiple processing positions within a single sub-track. This enables a higher throughput in case the first components and / or the second components in each sub-track are not identical and the processing of these components takes a different amount of time.

[0032] In some variants, the control unit is further adapted to receive information about whether a first component conveyed along a second sub-track on the component web has been processed. This can result in fewer errors occurring during processing, since the control unit receives information about the processing status of each component. This can result in a reduction in the number of processing positions that have to be processed twice.

[0033] In other variants, the control unit receives the information by means of optical means. The optical means can be a camera, which can obtain information about the processing status of each component by means of a UV lamp, an infrared lamp or other means.

[0034] In some variants, the number of processing positions assigned to each tool in its respective processing area depends on the time required for the tool to move from one of the processing positions to the next processing position and possibly on the conveyance of the component web through the processing area. In view of this, a higher device throughput is allowed when the processing positions approached by the tools are ordered, since the tools can be used very efficiently.

[0035] In some variants, the device comprises a marking unit adapted to mark one or more of the first components and / or the second components. This allows the control unit of each respective processing area to check whether a first component in a common sub-track has been processed by a tool in its processing area. This allows a continuous and automatic adaptation of the component web and its processing status. In this way, errors in the processing process can be reduced.

[0036] In some other variants, the main control unit controls the marking unit. In this way, the main control unit can precisely determine the first components processed by each tool. In some other variants, there is no marking unit, since the component web has already been marked before it enters the device.

[0037] In some variants, the apparatus includes one or more detection units adapted to detect one or more of the components before and / or after processing in one or more of the processing regions. When the detection unit is placed at a location downstream of the tool processing the first component and the second component, the detection unit can match markings on the first component and / or the second component with information in the control unit of the processing region. For example, if the detection unit is placed at a location downstream of the tool, the detection unit can check the placement of the second component to ensure that it has been processed correctly. Additionally or alternatively, the detection unit can detect any features even if they are not marked. In some other variants, the detection unit can check if the second component has been placed correctly relative to / on the first component without reference to markings on or at either of the components.

[0038] In some variants, the apparatus includes an adhesive application unit adapted to apply adhesive to one or more of the first components. The adhesive can provide a more secure (and possibly conductive) attachment of the second components to the first components. The adhesive application unit can receive instructions from the main control unit, or alternatively can be a separate control unit independent of the main control unit or control unit.

[0039] In some variants, the transport function (conveyor drive) receives instructions from the main control unit. For example, this can enable the main control unit to slow down or stop the component web in the event of an error occurring in the processing process.

[0040] In some variants, the tool is a pre-bonder adapted to pre-bond one or more corresponding second components with one or more corresponding first components.

[0041] In some variants, the apparatus includes an epoxy application unit for applying epoxy to one or more of the processed components. This allows the processed components to be bonded and / or protected from external influences.

[0042] Further, a method is presented herein having the following features: A method of operating at least two tools in a first processing area and at least a second processing area, the method comprising the steps of: assigning a plurality of processing positions to a respective tool in each processing area, by means of which a first component carried by a component web is conveyed along a track through the first processing area and the at least second processing area, wherein a total number of tools t is less than a number of processing positions p in each processing area, wherein the track comprises a plurality of sub-tracks corresponding to the plurality of processing positions, and the method comprises the steps of: configuring the tools to mount a respective second component to a respective first component at each associated processing position in its processing area, wherein the tools comprise a component supply for the second component and a socket for the component supply; configuring a control unit to move in response to a conveyance movement of the component web along the track, (i) position the tools at one or more of the plurality of processing positions in its processing area, wherein the tools have a needle or a laser source, and wherein the positioning comprises moving the socket in at least one of an x-direction, a y-direction, and a z-direction and (ii) actuate the tools to mount a first component or a second component at a respective processing position, such that in the first processing area, (i) selected first components conveyed along a first sub-track on the component web; and (ii) selected first components conveyed along a second sub-track on the component web are processed by the tools of the first processing area, and in the second processing area, (i) selected first components conveyed along a third sub-track on the component web; and (ii) first components conveyed along a second sub-track on the component web and not processed in the first processing area are processed by the tools of the second processing area.

[0043] Such a method is to operate at least two tools in a first processing area and at least a second processing area. A respective tool in each processing area is assigned a plurality of processing positions, by means of which a first component carried by a component web is conveyed along a track through the first and at least second processing area. Further, a total number of tools in the method is less than a number of processing positions in each processing area. Moreover, the track contains a plurality of sub-tracks equal to the number of processing positions. Further, each tool is adapted to mount a second component to a corresponding first component at each processing position in its processing area.

[0044] In one variant, the method contains configuring a control unit to position the tools at one or more of the plurality of processing positions in its processing area in response to a conveyance movement of the component web along the track.

[0045] Furthermore, the control unit can be further adapted to operate the tools to assemble the first components or the second components at the respective processing locations. The control unit can be further configured such that in the first zone, selected first components conveyed along the first sub-track along the component web and selected first components conveyed along the second sub-track along the component web are processed by the tools of the first zone. The control unit is further configured such that in the second zone, selected first components conveyed along the third sub-track on the component web and first components conveyed along the second sub-track on the component web and not processed in the first zone are processed by the tools of the second zone.

[0046] The method can result in an increase in capacity utilization of the individual tools by enabling sharing of sub-tracks. This can result in a tool assembling only part of a single row, rather than a complete row. Subsequent tools can then equip the processing zone that is still unprocessed to enable the row to be finally completely assembled.

[0047] This can result in a method that allows for a high throughput of the assembly line. In this mode, two tools share a sub-track that is connected to other sub-tracks that must also be processed by the respective tool.

[0048] In some variants, the second sub-track is adjacent to both the first sub-track and the third sub-track. This can enable a higher throughput of the assembly line, as the tool does not have to cross two sub-tracks in order to process a common sub-track.

[0049] Furthermore, it is proposed herein a second apparatus having the following features: An apparatus for operating at least two tools in a first processing area and at least a second processing area, wherein in each processing area a plurality of processing positions is assigned to a respective tool, by means of which a first component carried by a component web is conveyed along a track through the first processing area and at least a second processing area, wherein a total number t of tools in the apparatus is greater than a number p of processing positions in each processing area, wherein the track comprises a plurality of sub-tracks corresponding to the plurality of processing positions, wherein the tools of each processing area are adapted to attach a respective second component to a respective first component at each associated processing position in its processing area, wherein the tools comprise a component supply for the second component and a socket for the component supply, and wherein the apparatus comprises: a control unit adapted to, in response to a conveyance movement of the component web along the track: (i) position the tools and associated sockets at one or more of the plurality of processing positions in its processing area, wherein the tools have a needle or a laser source, and wherein the positioning comprises moving the sockets in at least one of an x-direction, a y-direction, and a z-direction, and (ii) actuate the tools to mount a first component or a second component at a respective processing position, such that in the first processing area (i) selected first components conveyed along a first sub-track on the component web, and (ii) selected first components conveyed along a second sub-track on the component web are processed by the tools of the first processing area, and in the second processing area (i) selected first components conveyed along a third sub-track on the component web, and (ii) first components conveyed along the second sub-track on the component web and not processed in the first processing area are processed by the tools of the second processing area. This apparatus is for operating at least two tools in a first processing area and at least a second processing area, in each processing area a plurality of processing positions is associated with a respective tool, by means of which a first component carried by a component web is conveyed along a track through the first processing area and at least a second processing area. In addition, a total number of tools in the apparatus is greater than a number of processing positions in each processing area. In this respect, the track contains a number of sub-tracks equal to the number of processing positions. Furthermore, for example, the tools of each processing area can be adapted to mount a second component to a first component at each associated processing position in its processing area.

[0050] Preferably, the apparatus comprises a control unit adapted to position the tools at one or more of the plurality of processing positions in its processing area in response to a conveyance movement of the component web along the track. The control unit is further adapted to operate the tools to, for example, mount a first component or a second component at a respective processing position.

[0051] The control unit can be further adapted such that in the first zone, the selected first components conveyed on the component web along the first sub-track and the selected first components conveyed on the component web along the second sub-track are processed by the tools of the first zone. The control unit is further adapted such that in the second zone, the selected first components conveyed on the component web along the third sub-track and the first components conveyed on the component web along the second sub-track and not processed in the first zone are processed by the tools of the second zone.

[0052] The apparatus can cause an increase in the capacity utilization of individual tools by enabling the joint use of sub-tracks. This can cause tools to no longer process a single row completely, but only partially. Subsequent tools can then process the remaining unprocessed processing locations in the row, so that the row is eventually processed completely (e.g., a second component is mounted on the first processed portion of the row). This can cause an apparatus that realizes the highest throughput of an assembly line.

[0053] In some variants, the selected first components are all components in a sub-track. This allows the tools to operate in a particularly efficient manner for the component web on which the tools operate.

[0054] In some variants, the second sub-track is adjacent to both the first sub-track and the third sub-track. This can give rise to a higher throughput of an assembly line, because tools do not have to cross two sub-tracks to process a common sub-track. In some variants, a minimum of two tools work together to process all processing locations in the first sub-track.

[0055] In some alternative variants, the first sub-track and the third sub-track are the same sub-track. This can enable a high throughput of the apparatus, since the tools processing the sub-track can not need to travel back and forth between sub-tracks, thereby reducing the dwell time of the tools.

[0056] In some variants, the number of processing locations is an integer multiple of the number of tools. This makes it possible for multiple tools to process a single sub-track. This can enable an efficient throughput when the first and / or second parts in each sub-track are not the same and require different tools to process them.

[0057] The second apparatus can also comprise aspects described with respect to the first apparatus, as long as they are compatible.

[0058] While some of the aspects described above relate to an apparatus, these aspects can also relate to a method and vice versa.

[0059] In some variants, a buffer region of the assembly web is provided between the single or all processing regions of the apparatus in order to compensate for differences in the sequence of movements of the assembly web at successive processing regions. These differences are caused by (i) any differences in the required time of the respective tools during processing at the processing locations and / or (ii) when changing from one sub-track to the next sub-track. BRIEF DESCRIPTION OF DRAWINGS

[0060] Further aspects of the above and technical solutions will be illustrated hereinafter by means of the drawings, in which identical reference numerals refer to identical parts, and in which:

[0061] Figure 1 A perspective view showing a schematic representation of an apparatus for operating at least two tools according to variants described herein is shown;

[0062] Figure 2 A perspective view showing a schematic representation of one of the various processing regions according to variants described herein is shown;

[0063] Figure 3a and Figure 3b A cross-sectional view showing a schematic representation of a track and assembly web according to some variants described herein is shown;

[0064] Figure 4 A perspective view showing a schematic representation of an assembly web and track corresponding to variants described herein is shown;

[0065] Figure 5 A block diagram of an apparatus according to variants described herein is shown;

[0066] Figure 6 A schematic representation of a portion of an assembly line corresponding to variants described herein is shown;

[0067] Figure 7a to Figure 7g A schematic representation of various processing modes according to some variants described herein is shown;

[0068] Figure 8 A table showing the total number of tools, processing locations and sub-tracks according to some variants described herein is shown; and

[0069] Figure 9 A flowchart of a method according to variants described herein is shown. DETAILED DESCRIPTION

[0070] Figure 1 A perspective view showing a schematic representation of an apparatus for operating at least two tools according to variants described herein is shown.

[0071] In Figure 1In this variant, the device 10 comprises two tools 100, 105 adapted to move in the direction of their respective arrows 102, 107. The assembly web 215 is adapted to move from left to right in the direction of arrow 217. The tools 100, 105 each move therefore orthogonally to the movement of the assembly web 215. The movement of the tools 100, 105 and of the assembly web 215 is not limited to the directions shown in this variant.

[0072] In this variant, each tool 100, 105 has a corresponding processing area 110, 115. Each tool 100, 105 is limited to move within its own processing area 110, 115, the areas 110, 115 being determined by reference to the control unit. Figure 5 The processing areas 110, 115 in this variant span the entire assembly web 215. In some variants not shown, the processing areas 110, 115 do not span the entire assembly web 215. In some variants also not shown, more than one tool 100, 105 is located in the same processing area 110, 115.

[0073] In this variant, the tools 100, 105 each have a needle, an assembly supply with a second assembly (see Figure 2 ), and a socket for the assembly supply. In some variants, each tool has only some of these assemblies, or a point laser source instead of a needle. The device is displaceable in the x-direction, the y-direction, and in the rotational direction with the assembly supply. In some variants, the device is displaceable on only some of these directions. The second assembly (see Figure 2 ) is adhered to a support (e.g. a foil or a glass plate) with its side facing away from the assembly web 215 and is transferred via the needle or the laser beam onto the first assembly (see Figure 2 ). The second assembly (see Figure 2 ) can be transferred to the first assembly (see Figure 2 ) via any suitable method.

[0074] The device 10 is not limited to only two tools 100, 105; it can comprise any number t (e.g. 2 to 10 or more than 10) of tools 100, 105. In some variants, each tool 100, 105 and its respective processing area 110, 115 are located in a separate module. In some variants not shown, multiple tools 100, 105 are within the same housing. In some variants, the tools 100, 105 are pre-connectors (so-called pre-bonders) adapted to pre-connect a respective second assembly (see Figure 2 ) to a respective first assembly (see Figure 2 ).

[0075] In this variant, each tool 100, 105 is adapted to move at least almost synchronously with respect to and dependent on the other tool 100, 105. In some variants, each tool 100, 105 moves at least almost synchronously with the movement of the other tool 100, 105 and not dependent on the other tool 100, 105 via a controller.

[0076] Figure 2 A perspective view showing a schematic representation of one of the various processing regions according to the variants described herein is shown.

[0077] In Figure 2 In variants of the apparatus 10, there are three processing locations 200, 205, 210 in the processing region 110 of the tool 100. It is to be understood that the apparatus can include more than three processing locations 200, 205, 210. In some variants, the tool 100 does not process all of the processing locations 200, 205, 210 in its processing region 110. It is to be understood that each processing region includes a plurality of processing locations, such as three processing locations, but the tool only processes two of those processing locations. In this regard, the tool does not need to process all of the processing locations. Indeed, one or more of the tools is limited to processing only one or some of the processing locations 200, 205, 210 in its processing region 110.

[0078] The assembly web 215 to be processed in the apparatus 10 has a plurality of rows of first assemblies 220 and second assemblies 225, and each row of assemblies is guided at / next to the processing locations 200, 205, 210. In this variant, there are three rows of assemblies 220, 225 and three processing locations 200, 205, 210. The number p of processing locations 200, 205, 210 can vary depending on the number of rows of assemblies 220, 225 on the assembly web 215. In this variant, the second assemblies 225 are placed on the first assemblies 220 during processing. In some other variants, the second assemblies 225 are placed on the first assemblies 220 prior to processing.

[0079] In this variant, the first assemblies 220 are conveyed through the processing region 110 via the assembly web 215, and the second assemblies 225 are placed on the first assemblies 220 prior to or during processing via the tool 100. In some variants, the second assemblies 225 are separated from the first assemblies 220 via a support layer.

[0080] In some variants, the second assemblies 225 are secured to a support layer and approach the second assembly web over the first assemblies 220.

[0081] In some variants, one or more of the first assemblies 220 and / or the second assemblies 225 are electronic assemblies, see Figure 3b and Figure 4The processing / treatment of the first and / or second components depends on what type of components the first and / or second components are. In some variations, the processing / treatment includes mechanically actuated components, heating components and / or optical components and / or ultrasonic components and / or any other suitable components.

[0082] In some variations, one or more of the first and / or second electronic components are (RFID) antennas, and one or more of the first and / or second electronic components are chips. In some variations, the chip is an RFID chip.

[0083] Figure 3a and Figure 3b A schematic cross-sectional view of the track and component webs according to some of the variations described herein is shown.

[0084] exist Figure 3a In this variant, track 300 is U-shaped, with the component web 215 conveyed through the device between the various lateral supports of the U-shaped track. Track 300 can be made of any suitable low-friction material, which allows the component web 215 to move unimpeded / easier along track 300. Figure 3b In one variant, track 300 is a plane. In another variant, the track is a vacuum roller for conveying the component web 215. In a variant where each module has a vacuum roller or a bending support, the track is a bending roll. In some other variants, there is no physical track 300, and track 300 is a fictitious plane under the component web 215. In this variant, the first component is the electronic component 230. The track is the location of the component web. Therefore, there is a single track on which the component web moves through the entire device.

[0085] Figure 4 A perspective view showing a schematic representation of the component web and track corresponding to the variant described herein.

[0086] exist Figure 4 In the variant, component web 215 is located Figure 3bThe second electronic components 235 are conveyed on the track 300 shown in the middle and in the direction of the arrow 217 along this track 300. In this variant, the track 300 is divided into three sub-tracks 305, 310, 315 corresponding to the three processing positions 200, 205, 210. Thus, in each sub-track 305, there is a processing position 200 and a series of first electronic components 230 and second electronic components 235 are conveyed together when the second components 235 have been placed. Thus, the sub-track 305 is a first row of antennas, the sub-track 310 is a second row, and the sub-track 315 is a third row. In some variants, there is more than one processing position 200, 205, 210 in each sub-track 305, 310, 315. In some variants, the number s of sub-tracks 305, 310, 315 is an integer multiple of the number p of processing positions 200, 205, 210. In some variants, the number p of processing positions 200, 205, 210 in each sub-track 305, 310, 315 is not equal. In some variants, the number s of sub-tracks is determined by the control unit (see Figure 5 ) of each processing region 110, 115 or the main control unit (see Figure 5 ). The sub-tracks are a series of antennas. For example, the sub-track 305 is a first row of antennas, the sub-track 310 is a second row, and the sub-track 315 is a third row.

[0087] Figure 5 A block diagram of an apparatus according to variants described herein is shown.

[0088] In variants of Figure 5 , the control unit 400, 405 of each tool 100, 105 is coupled to a main control unit 410. In some variants, the main control unit 410 can receive and process input from an external program or input from an operator. In some variants, the main control unit 410 has no external operator input. In some variants, the control unit 400, 405 controls more than one tool 100, 105.

[0089] In this variant, the main control unit 410 is coupled to a conveying function 120. This conveying function 120 is adapted to convey the component web 215 through the apparatus 10. The conveying function 120 can convey the component web 215 continuously or intermittently depending on the movement required. In some examples, the conveying function 120 is independent of the main control unit 410.

[0090] In this variant, the main control unit 410 is coupled to the marking unit 125. The main control unit 410 controls the marking unit 125 to mark the first assembly 220, 230 and / or the second assembly 225, 235 with one or more indicators as the assembly 220, 225, 230, 235 passes through or under the marking unit 125. These indicators can indicate to the control unit 400, 405 of each tool 100, 105 whether the assembly 220, 225, 230, 235 needs to be processed by its respective tool 100, 105. In some variants, the marking unit 125 provides information to the main control unit 410 indicating the assembly 220, 225, 230, 235 with one or more indicators and the indicators used to mark the assembly 220, 225, 230, 235. In some variants, each control unit 400, 405 has a corresponding marking unit 125. In some variants, there is no marking unit 125. In some variants, the marking unit 125 is independent of the main control unit 410 and the control units 400, 405.

[0091] In Figure 5 In this variant, the main control unit 410 is coupled to the adhesive application unit 130, which is adapted to apply adhesive to one or more of the first assemblies 220, 230 as the assembly 200, 225, 230, 235 passes through or under the adhesive application unit 130. The main control unit 410 can send information to the adhesive application unit 130 about which first assemblies 220, 230 need to be coated with adhesive. In some variants, each control unit 400, 405 has an adhesive application unit 130. In some variants, the adhesive application unit 130 is independent of the main control unit 410 and the control units 400, 405. In some variants, there is no adhesive application unit 130.

[0092] In Figure 5In this variant, the control units 400 and 405 of each tool 100, 105 are coupled to two detection units 415, 420, 425, and 430. The corresponding detection unit 415 and 425 upstream of each tool 100, 105 detects components 220, 225, 230, 235 as they pass through or under the detection units 415 and 425 to verify whether components 220, 225, 230, 235 have been processed. The detection units 415 and 425 then send this information to their respective control units 400 and 405. The detection units 415 and 425 may obtain this information via optical components, such as cameras or other suitable optical sensor components. In some variations, detection units 415, 425 receive information about indicators marked by marking unit 125 on components 220, 225, 230, 235 via the same or another optical component.

[0093] exist Figure 5 In some variations, as components 200, 225, 230, 235 pass through or under detection units 420, 430, detection units 420, 430 detect components 220, 225, 230, 235 after each corresponding tool 100, 105 to determine whether components 220, 225, 230, 235 have been correctly processed. In some variations, detection units 420, 430 also check whether the placement of second components 225, 235 is correct. In some variations, detection units 420, 430 then send this information to their respective control units 400, 405. In some variations, control units 400, 405 may send this information to a main control unit 410. In some variations, the main control unit 410 may override and control the control units 400, 405 of subsequent tools 100, 105 to process any missed components 220, 225, 230, 235. In some variations, the main control unit 410 may trigger an alarm or send a visual notification to the operator to indicate that components 220, 225, 230, 235 have been missed by tools 100, 105. In some variations, the alarm is triggered or a visual notification is sent when the placement of second components 225, 235 is not satisfactory. Detection units 420, 430 may obtain this information via optical components, such as cameras, UV lamps, infrared lamps, or any other suitable optical components.

[0094] In some variants, each or at least some of the detection units 415, 420, 425, 430 has at least one camera and optionally at least one light source and a deflection mirror. The detection units 415, 420, 425, 430 or at least parts of the detection units 415, 420, 425, 430 (if light source and deflection mirror are provided) before and / or after the respective tools 100, 105 can be positioned orthogonal to the movement of the assembly web 215 for image capturing.

[0095] In some variants, detection units 415, 420, 425, 430 are present upstream and / or downstream of the plurality of tools 100, 105. In some variants, detection units 415, 420, 425, 430 are present at the beginning of the apparatus 10 and at the end of the apparatus 10. In some variants, no detection units 415, 420, 425, 430 are present in the apparatus 10.

[0096] In some variants, the main control unit 410 is coupled to an epoxy coating unit (not shown) adapted to coat epoxy to the assembly 220, 225, 230, 235 to be processed as the assembly 220, 225, 230, 235 passes through or under the epoxy coating unit. The main control unit 410 can send information to the epoxy coating unit indicating which processed assembly needs to be coated with epoxy. In some variants, each control unit 400, 405 comprises an epoxy coating unit. In some variants, the epoxy coating unit is independent of the main control unit 410 and the control units 400, 405. In some variants, no epoxy coating unit is present.

[0097] In some variants, each control unit 400, 405 and its respective tools 100, 105 and detection units 415, 420, 425, 430 are in separate modules, independent of but coupled to other modules (upstream and downstream) of the apparatus 10. In some variants, a plurality of control units 400, 405 and their respective assemblies are in the same module. In each such case, each module is coupled to the main control unit 410. In some variants, the entire apparatus 10 is one module.

[0098] In some variants, a main control unit 410 interface is provided on the apparatus 10. The interface will allow the user to obtain information about the apparatus 10 and input parameters and / or instructions. In some variants not shown, the apparatus 10 also comprises a short-range transceiver for transmitting information about the apparatus 10 to a mobile device. The short-range transceiver will also allow receiving input to the main control unit 410 from the mobile device. In some variants, the main control unit 410 is connected to the interface and / or any other suitable device for remote monitoring and control via an Ethernet network, a fieldbus, etc.

[0099] In some variants, each control unit 400, 405 and / or each detection unit 415, 420, 425, 430 and / or the transport function 120 and / or the marking unit 125 and / or the adhesive application unit 130 and / or the epoxy application unit has its own interface. Each of these interfaces can be associated with the apparatus and / or use a short-range transceiver to send and receive information from a mobile device and / or be connected via an Ethernet network and / or any other suitable means for remote monitoring and control.

[0100] The apparatus 10 can comprise some or all of the above components. The above components can perform their respective processes in a different order than described above, and some of the components can perform their processes simultaneously.

[0101] Figure 6 A schematic representation of an apparatus as part of an assembly line corresponding to the variants described herein is shown.

[0102] In Figure 6 In the variant of Fig. 5, there are two embodiments of the apparatus 10 as shown in Figure 1 In the variant of Fig. 5, there are two embodiments of the apparatus 10 as shown in

[0103] In this variant, there is an unwinding drum 505 adapted to feed the component web 215 into the assembly line 500 in the direction of the arrow 502.

[0104] In this variant, there are a plurality of transport drums 507 for guiding the component web 215 through the assembly line 500. These drums 507 are used because there is no physical track 300 in this variant. These drums 507 convey the component web 215 through each module as unobstructed as possible. Even if a physical track 300 were present, the drums 507 would be able to guide the component web 215 through the modules.

[0105] In some variants, each module (including 130, 415, 100, 420) has at least one vacuum drum under the tool 100 for conveying the assembly web 215 in the direction of arrow 502, or each tool has an associated vacuum drum. A second vacuum drum can be provided under the adhesive coating unit 130.

[0106] In this variant, the assembly web 215 is introduced into a buffer module 510 after passing through each of the various modules. The buffer module 510 is adapted to buffer the assembly web 215 when units downstream of the buffer module 510 fall behind units upstream of the buffer module 510 in processing assemblies on the assembly web 215. In some variants, there is no buffer module 510 in the assembly line 500.

[0107] In one variant, a buffer module (not shown) can be disposed in each module between the respective adhesive coating unit 130 and the respective tool 100, and downstream of the respective tool 100 and upstream of the subsequent adhesive coating unit of the downstream module, or in other words, upstream and downstream of the respective tool, to temporarily store or delay the assembly web 215.

[0108] In this variant, the assembly web 215 is then passed through an epoxy curing module 515. This final curing module is adapted to place the second assembly 225, 235 on top of the first assembly 220, 230 as the assemblies 220, 225, 230, 235 pass through the curing module 515. In some variants, there is no curing module 515 in the assembly line 500.

[0109] In Figure 6 In some variants, the testing module 520 is adapted to verify that the processed assemblies 220, 225, 230, 235 are technically functional and / or fully cured as the assemblies 220, 225, 230, 235 pass through the testing module 520. In some variants, the testing module 520 is adapted to verify that all assemblies 220, 225, 230, 235 have been processed and that the second assembly 225, 235 is electrically and / or mechanically connected to the first assembly 220, 230. The testing module 520 can be adapted to check for faults or other appropriate parameters of functionality of the assemblies. In some variants, there is no testing module 520 in the assembly line 500.

[0110] In Figure 6A buffer region of assembly web 215 is provided between the processing regions of the apparatus shown in the form of sag loops of assembly web 215. These sag loops of assembly web 215 compensate for differences in the sequence of movement of assembly web at successive processing regions. These differences arise (i) when processing at processing locations and / or (ii) when changing from one sub-track to the next sub-track due to any differences in the time requirements of the respective tools.

[0111] In Figure 6 In variants of this, there is a rewinder 525. Rewinder 525 is adapted to wind assembly web 215 with processed assemblies 220, 225, 230, 235. The output of the finished processed web material is not limited to rewinder 525. The (rectangular) array of assemblies can also be output after the finished processed web material has been divided into corresponding sections.

[0112] Assembly line 500 can also contain other modules or units.

[0113] Figure 7a to Figure 7g Schematic representations of different processing patterns according to some variants described herein are shown. Each square corresponds to a first assembly to be processed, with equally shaded squares being processed by the same tool.

[0114] In variants in which all tools 100, 105 process an equal number p of processing locations 200, 205, 210 in a repeating pattern, very high throughput of apparatus 10 is achieved. The optimal repeating pattern depends on the speed of movement of the tools from assembly 220, 230 to assembly 220, 230 in each processing region 110, 115.

[0115] In some variants, the time required for a tool 100, 105 to move between rows of assemblies and the time required to place the next column of assemblies 220, 230 under the tool 100, 105 is substantially the same. In these variants, the pattern of the sequence of movements performed by each tool plays a minor role. Instead, the number p of processing locations 200, 205, 210 processed in each repeating pattern is more important. In some variants, each tool 100, 105 processes the same number p of processing locations 200, 205, 210 in each repeating pattern as the other tools 100, 105.

[0116] In some variants, the time required for a tool 100, 105 to move between rows of assemblies is greater than the time required to place the next column of assemblies 220, 230 under the tool 100, 105. In these variants, the sequence of movements performed by each tool 100, 105 includes as few movements between rows of assemblies as possible.

[0117] In some variants, the time required for the tools 100, 105 to move between rows of components is less than the time required to place the next column of components 220, 230 under the tools 100, 105 includes as few movements between assembly columns in the sequence of movements performed by each tool 100, 105 as possible.

[0118] In Figure 7a variants, there are four tools 100, 105 per processing area 110, five rows of first assemblies 220, 230 on the assembly web 215, five sub-tracks 305, 310, 315, and six processing locations 200, 205, 210. The tools cannot skip to a common processing location. Figure 7a Each pattern 600, 605, 610, 615 in corresponds to one tool, i.e. the top pattern 600 corresponds to the first tool, the second pattern 605 corresponds to the second tool, etc. In this variant, the tools 100, 105 associated with the two upper patterns 600, 605 share three processing locations 200, 205, 210 and three sub-tracks 305, 310, 315. It can also be seen that the tools 100, 105 share a sub-track and each operate separately on one sub-track. Each of the individual tools transfers a second assembly to a first assembly at two processing locations in its processing area.

[0119] In some variants, the shared sub-track is not the middle sub-track 310 but one of the outer sub-tracks 305, 315. This variant does not allow the tools 100, 105 associated with the two lower patterns 610, 615 to operate at their maximum efficiency as they have to wait for the tools associated with the two upper patterns 600, 605 to finish the shared sub-track.

[0120] In Figure 7b variants, there are four tools 100, 105 per processing area 110, six rows of first assemblies 220, 230 on the assembly web 215, six sub-tracks 305, 310, 315, and six processing locations 200, 205, 210. It can be seen that the two upper patterns 600, 605 share three sub-tracks 305, 310, 315 and the two lower patterns 610, 615 share the other three sub-tracks. This allocation for sharing is the most efficient for the sub-tracks. In this variant, the first tool 100 processes two assemblies in each pair in the shared sub-tracks in columns k and k+1. This is followed by the second tool 105 which processes the following two assemblies 220, 225, 230, 235 in the shared sub-tracks in columns k+2 and k+3. A pair is here two tools working together to process three rows of antennas. In Figure 7b for example, the tools with patterns 600 and 605 are a pair and the tools with patterns 610 and 615 are a second pair.

[0121] In Figure 7c variations, there are four tools 100, 105 per processing area 110, six rows of components 220, 225, 230, 235 on the assembly web 215, six sub-tracks 305, 310, 315, and six processing locations 200, 205, 210. Figure 7c The process is similar to Figure 7b . However, the first tool 100 and the second tool 105 in each pair alternately process the components 220, 225, 230, 235 in the common sub-tracks. The first tool 100 processes the common sub-tracks in columns k and k+2, while the second tool 105 processes the common sub-tracks in columns k+1 and k+3.

[0122] In some variations, the tools 100, 105 each process more than two consecutive components 220, 225, 230, 235 in the common sub-tracks. In some variations, the common sub-tracks are unevenly shared between the two tools 100, 105. For example, the first tool 100 processes a component 220, 225, 230, 235 in the common sub-track, then the second tool 105 processes two subsequent components 220, 225, 230, 235 in the common sub-track. These are just examples. The common sub-tracks can also be processed jointly by the tools 100, 105 in other ways.

[0123] In Figure 7d variations, there are four tools 100, 105 per processing area 110, seven rows of components 220, 225, 230, 235 on the assembly web 215, seven sub-tracks 305, 310, 315, and seven processing locations 200, 205, 210. In this variation, it can be seen that the tools 100, 105 associated with the lower pattern 615 are the only tools 100, 105 processing these two sub-tracks. This variation does not allow the tools 100, 105 associated with the two upper patterns 600, 605 to operate at their maximum efficiency, as they must wait for the tools 100, 105 associated with the two lower patterns 610, 615.

[0124] In Figure 7eIn a variation of the first embodiment, there are four tools 100, 105, five rows of assemblies 220, 225, 230, 235 on the assembly web 215, five sub-tracks 305, 310, 315, and five processing locations 200, 205, 210. In this variation, each tool 100, 105 repeats its respective pattern 600, 605, 610, 615 every eight columns and performs the same number of moves between sub-tracks 305, 310, 315. This makes the work load even for all tools 100, 105 and minimizes movement between rows of assemblies. This pattern is particularly good for variations in which the time required for each tool 100, 105 to move between rows of assemblies is greater than or substantially equal to the time required to position the next column of assemblies 220, 230 under each tool 100, 105.

[0125] In a variation of the first embodiment, Figure 7f In a variation of the first embodiment, there are four tools 100, 105, five rows of assemblies 220, 225, 230, 235 on the assembly web 215, five sub-tracks 305, 310, 315, and five processing locations 200, 205, 210. In this variation, each tool 100, 105 repeats its respective pattern 600, 605, 610, 615 every eight columns and performs the same number of moves between sub-tracks 305, 310, 315. This makes the work load even for all tools 100, 105 and minimizes movement between rows of assemblies. This pattern is particularly good for variations in which the time required for each tool 100, 105 to move between rows of assemblies is greater than or substantially equal to the time required to position the next column of assemblies 220, 230 under each tool 100, 105.

[0126] In a variation of the first embodiment, Figure 7gIn a variant, there are four tools 100, 105, three rows of components 220, 225, 230, 235 on the component web 215, three sub - tracks 305, 310, 315, and three processing positions 200, 205, 210. In this example, there are more tools 100, 105 than sub - tracks 305, 310, 315 and processing positions 200, 205, 210. The tools 100, 105 associated with patterns 600, 605, 610 process most of each sub - track 305, 310, 315. In this case, these tools periodically miss the processing positions 200, 205, 210. These missed processing positions 200, 205, 210 are then processed by the tools 100, 105 assigned to them by the fourth pattern 615. Depending on the component web 215 and the associated components 220, 225, 230, 235, this can result in a more efficient device 10. The number of tools 100, 105 and their corresponding movement patterns 600, 605, 610, 615 can be varied according to the number of sub - tracks 305, 310, 315 and processing positions 200, 205, 210.

[0127] Figure 8 A table shows the total number of tools, processing positions, and sub - tracks according to some variants described herein.

[0128] Figure 8 A table shows different variants of the device, where t is the total number of tools in the device 10, p is the number of processing positions 200, 205, 210 in each of the processing areas 110, 115, and s is the number of sub - tracks 305, 310, 315 on the track 300. These values can vary depending on the component web 215 as long as t < p and the number s of sub - tracks 305, 310, 315 is equal to the number p of processing positions 200, 205, 210. In some variants, t < p ≦ floor(1.5t). In some other variants, p = 1.5t applies.

[0129] Figure 9 A flowchart shows a method according to the variants described herein.

[0130] In Figure 9 the variant, at step 705, each tool 100, 105 is assigned multiple p processing positions 200, 205, 210 in its corresponding processing area 110, 115. In some variants, the control units 400, 405 assign the processing positions 200, 205, 210 to each tool 100. In some variants, the main control unit 410 assigns the processing positions 200, 205, 210 to each tool 100, 105.

[0131] In this variant, one or more of the first components 220, 230 are subsequently marked with one or more indicators at step 710. In some variants, the marking is performed by the marking unit 125. In some variants, the main control unit 410 controls the marking of the first components 220, 230. In some variants, the marking unit 125 marks the first components 220, 230 and sends this relevant information to the main control unit 410. In some variants, the marking of the first components 220, 230 is controlled by the control unit 400, 405 of each tool 100, 105. In some variants, the marking of the first components 220, 230 is independent of the main control unit 410 and the control units 400, 405. In some variants, the second components 225, 235 are marked.

[0132] In this variant, one or more of the first components 220, 230 are subsequently detected by the detection unit 415, 425 at step 715. The detection unit 415, 425 detects the components 220, 225, 230, 235 to determine whether the components 220, 225, 230, 235 have been processed. The detection unit 415, 425 subsequently sends this information to its respective control unit 400, 405 and / or the main control unit 410. The detection unit 415, 425 can use optical means such as a camera to detect the components 220, 225, 230, 235.

[0133] In this variant, adhesive is subsequently applied to one or more of the respective first components 220, 230 via the adhesive application unit 130 at step 720. The adhesive application unit 130 can receive instructions from the main control unit 410 or the control units 400, 405 regarding which first components 220, 230 to apply adhesive to. In some variants, the adhesive application unit 130 is independent of the main control unit 410 and the control units 400, 405.

[0134] In this variant, each of the tools 100, 105 is positioned by the control unit 400, 405 of said tool 100, 105 at one or more of the processing positions 200, 205, 210 in its respective processing area 110, 115 at step 725. The tools 100, 105 are subsequently actuated by the control units 400, 405 to process one or more of the components 220, 225, 230, 235 at step 730.

[0135] In this variant, at step 735, another of the machined assemblies 220, 225, 230, 235 is detected by the detection unit 420, 430 to verify that the assembly 220, 225, 230, 235 has been correctly machined. In some variants, the detection unit 420, 430 checks that the placement of the second assembly 225, 235 is correct. In some variants, the detection unit 420, 430 then sends this corresponding information to its corresponding control unit 400, 405. In some variants, the control unit 400, 405 also sends this information to the main control unit 410. In some variants, the main control unit 410 can override the control unit 400, 405 of the subsequent tool 100, 105 and control it to process the missed assembly 220, 225, 230, 235. In some variants, the main control unit 410 can trigger an alarm or send a visual notification to the operator to indicate that an assembly 220, 225, 230, 235 has been missed by the tool 100, 105. In some variants, the triggering of the alarm or the sending of the visual notification occurs when the placement of the second assembly 225, 235 is not in compliance. The detection unit 420, 430 can receive this information via a visual means such as a camera.

[0136] In some variants, the transport of the assembly web 215 is controlled by the main control unit 410. The transport function 120 can continuously or intermittently convey the assembly web 215 depending on the movement required. In some examples, the transport function 120 is independent of the main control unit 410.

[0137] In some variants, epoxy resin is applied to one or more of the machined assemblies 220, 225, 230, 235. In some variants, the application is controlled by the main control unit 410. In some variants, the application is controlled by one or more control units 400, 405. In some variants, the main control unit 410 or the control units 400, 405 send information to the epoxy resin application unit regarding which processed assemblies need to be coated with epoxy resin. In some variants, the epoxy resin application unit is independent of the main control unit 410 and the control units 400, 405.

[0138] The method 20 can include some or all of the above steps. The above steps can be performed in a different order than shown in Figure 9 some of the steps can be performed simultaneously.

Claims

1. An apparatus (10) for operating at least two tools (100, 105) in a first processing area (110) and at least a second processing area (115), wherein In each processing area (110, 115), a plurality of processing positions (200, 205, 210) is assigned to a respective tool (100, 105) by means of which a first component (220) carried by a component web (215) is conveyed along a track (300) through the first processing area (110) and the at least second processing area (115), wherein the total number t of tools in the apparatus (10) is less than the number p of processing positions (200, 205, 210) in each processing area (110, 115), wherein the track (300) comprises a plurality of sub-tracks (305, 310, 315) corresponding to the plurality of processing positions (200, 205, 210), wherein the tools (100, 105) of each processing area (110, 115) are adapted to couple a respective second component (225) to a respective first component (220) at each associated processing position (200, 205, 210) in its processing area (110, 115), wherein the tools (100, 105) comprise a component supply for the second component (225) and a socket for the component supply, and wherein the apparatus (10) comprises: a control unit (400, 405) adapted to, in response to a conveying movement of the component web (215) along the track (300): (i) position the tools (100, 105) and associated sockets at one or more of the plurality of processing positions (200, 205, 210) in its processing area (110, 115), wherein the tools have a needle or a laser source, and wherein the positioning comprises moving the sockets in at least one of an x-direction, a y-direction and a z-direction; and (ii) actuate the tools (100, 105) to mount a first component (220) or a second component (225) at a respective processing position (200, 205, 210) such that in the first processing area (110), (i) selected first components (220) conveyed on the component web (215) along a first sub-track (305); and (ii) selected first components (220) conveyed on the component web (215) along a second sub-track (310) are processed by the tools (100) of the first processing area (110), and in the second processing area (115), (i) selected first components (220) conveyed on the component web (215) along a third sub-track (315), and (ii) selected first components (220) conveyed on the component web (215) along a fourth sub-track (320) (ii) first components (220) conveyed on the assembly web (215) along the second sub-track (310) and not processed in the first processing area (110) are processed by the tools (105) of the second processing area (115).

2. The apparatus (10) of claim 1, wherein, The second sub-track (310) is adjacent to both the first sub-track (305) and the third sub-track (315).

3. The apparatus (10) of claim 1 or 2, wherein, The assembly web (215) conveyed along the track (300) through the first processing area (110) and the at least second processing area (115) is conveyed intermittently or continuously via a transport function (120).

4. The apparatus (10) of claim 1 or 2, wherein, The control unit (400, 405) of each processing area (110, 115) is coupled to a master control unit (410).

5. The apparatus (10) of claim 1 or 2, wherein, The total number t of tools in the apparatus (10) and the number p of processing positions (200, 205, 210) in each processing area (110, 115) complies with the mathematical relationship: t < p < floor(l,5t).

6. The apparatus (10) of claim 1 or 2, wherein, The tools (100) of the first processing area (110) are moved in response to the tools (105) of the second processing area (115).

7. The apparatus (10) of claim 1 or 2, wherein, The control unit (400, 405) is further adapted to operate the tools (100, 105) such that the tools (100) of the first processing area (110) process b first components (220) of the second sub-track (310) and the tools (105) of the second processing area (115) process subsequent b first components (220) of the second sub-track (310), and wherein b is an integer.

8. The apparatus (10) of claim 1 or 2, wherein, The control unit (400, 405) is further adapted to operate the tools (100, 105) such that the tools (100) of the first processing area (110) process b first components (220) of the second sub-track (310) and the tools (105) of the second processing area (115) subsequently process c first components (220) of the second sub-track (310), wherein b and c are integers, and wherein b ≠ c.

9. The apparatus (10) of claim 1 or 2, wherein, One or more of the first components (220) and / or one or more of the second components (225) are electronic components (230, 235).

10. The apparatus (10) of claim 9, wherein, At least one of the first electronic components (230) and / or second electronic components (235) is an antenna, and at least one of the first electronic components (230) and / or second electronic components (235) is a chip compatible with the antenna.

11. The apparatus (10) of claim 1 or 2, wherein, The number s of sub-tracks (305, 310, 315) is an integer multiple of the number p of processing positions (200, 205, 210).

12. The apparatus (10) of claim 1 or 2, wherein, The control unit (400, 405) is further adapted to receive information about whether the first components (220) conveyed on the assembly web (215) along the second sub-track (310) have been processed.

13. The apparatus (10) of claim 12, wherein, The control unit (400, 405) obtains the information by means of optical means. The control unit (400, 405) is further adapted to receive information about whether the first components (220) conveyed on the assembly web (215) along the second sub-track (310) have been processed. The control unit (400, 405) obtains the information by means of optical means.

14. The apparatus (10) of claim 3, wherein, The number of processing positions (200, 205, 210) assigned to each tool (100, 105) in its respective processing area (110, 115) depends on the time required for the tool (100, 105) to move between the processing positions (200, 205, 210) and, if necessary, on the conveying of the assembly web (215) through the processing areas (110, 115).

15. A method (20) of operating at least two tools (100, 105) in a first processing area (110) and at least a second processing area (115), the method (20) comprising the steps of: assigning a plurality of processing positions (200, 205, 210) to respective tools in each processing area (110, 115) by means of which a first assembly (220) carried by an assembly web (215) is conveyed along a track (300) through the first processing area (110) and the at least second processing area (115), wherein the total number of tools t is less than the number of processing positions (200, 205, 210) p in each processing area (110, 115), wherein the track (300) comprises a plurality of sub-tracks (305, 310, 315) corresponding to the plurality of processing positions (200, 205, 210) and the method comprises the steps of: configuring the tools (100, 105) to mount a respective second assembly (225) to a respective first assembly (220) at each associated processing position (200, 205, 210) in their processing area (110, 115), wherein the tools (100, 105) comprise an assembly supply for the second assembly (225) and a socket for the assembly supply; configuring a control unit (400, 405) to move in response to the conveying of the assembly web (215) along the track (300), (i) positioning the tools (100, 105) at one or more of the plurality of processing positions (200, 205, 210) in their processing area (110, 115), wherein the tools have a needle or a laser source, and wherein the positioning comprises moving the socket in at least one of an x-direction, a y-direction, and a z-direction and (ii) actuating the tools (100, 105) to mount a first assembly (220) or a second assembly (225) at a respective processing position (200, 205, 210) such that in the first processing area (110), (i) selected first assemblies (220) conveyed along a first sub-track (305) on the assembly web (215); and (ii) selected first assemblies (220) conveyed along a second sub-track (310) on the assembly web (215) are processed by the tools (100) of the first processing area (110), and in the second processing area (115), (i) selected first assemblies (220) conveyed along a first sub-track (305) on the assembly web (215); and (ii) selected first assemblies (220) conveyed along a second sub-track (310) on the assembly web (215) are processed by the tools (100) of the first processing area (110), and in the second processing area (115), (i) selected first components (220) conveyed on the component web (215) along a third sub-track (315); and (ii) first components (220) conveyed on the component web (215) along a second sub-track (310) and not processed in the first processing area (110) are processed by the tool (105) of the second processing area (115).

16. The method (20) of claim 15, wherein The second sub-track (310) is adjacent to both the first sub-track (305) and the third sub-track (315).

17. An apparatus (10) for operating at least two tools (100, 105) in a first processing area (110) and at least a second processing area (115), wherein In each processing area (110, 115), a plurality of processing positions (200, 205, 210) is assigned to the respective tool (100, 105) by means of which first components (220) carried by a component web (215) are conveyed along a track (300) through the first processing area (110) and the at least second processing area (115), wherein the total number t of tools in the apparatus (10) is greater than the number p of processing positions (200, 205, 210) in each processing area (110, 115), wherein the track (300) comprises a plurality of sub-tracks (305, 310, 315) corresponding to a plurality of numbers of processing positions (200, 205, 210), wherein the tools (100, 105) of each processing area (110, 115) are adapted to attach a respective second component (225) to a respective first component (220) at each associated processing position (200, 205, 210) in its processing area (110, 115), wherein the tools (100, 105) comprise a component supply for the second component (225) and a socket for the component supply, and wherein the apparatus (10) comprises: a control unit (400, 405) adapted to respond to the conveyance movement of the component web (215) along the track (300) by: (i) positioning the tools (100, 105) and associated sockets at one or more of the plurality of processing positions (200, 205, 210) in its processing area (110, 115), wherein the tools have a needle or a laser source, and wherein the positioning comprises moving the sockets in at least one of an x-direction, a y-direction, and a z-direction, and (ii) actuating the tools (100, 105) to mount a first component (220) or a second component (225) at the respective processing position (200, 205, 210) such that in the first processing area (110), (i) selected first components (220) conveyed on the component web (215) along a first sub-track (305), and (ii) first components (220) conveyed on the component web (215) along a second sub-track (310) and not processed in the first processing area (110) are processed by the tool (105) of the second processing area (115). (ii) selected first components (220) of the assembly web (215) being conveyed along a second sub-track (310) are processed by the tools (100, 105) of the first processing region (110), and in the second processing region (115), (i) selected first components (220) of the assembly web (215) being conveyed along a third sub-track (315), and (ii) first components (220) of the assembly web (215) being conveyed along the second sub-track (310) and not being processed in the first processing region (110) are processed by the tools (105) of the second processing region (115).

18. The apparatus (10) of claim 17, wherein, The second sub-track (310) is adjacent to both the first sub-track (305) and the third sub-track (315).

19. The apparatus (10) of claim 17, wherein, The first sub-track (305) and the third sub-track (315) are the same sub-track.

20. The apparatus (10) according to any one of claims 17 to 19, wherein, The number p of processing positions (200, 205, 210) is an integer multiple of the total number t of tools (100, 105).

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