Optical image stabilization camera module

Abstract

The application relates to an optical anti-shake camera module, which comprises a lens, a photosensitive assembly with a photosensitive chip, a first driving part adapted to drive the lens to translate in the x-axis and y-axis directions, and a second driving part comprising a second base part and a second movable part, wherein the second driving part has four side surfaces, each of which is provided with two SMA wires intersecting with each other, and the two ends of each SMA wire are connected with a fixed end of the second base part and a fixed end of the second movable part respectively; each fixed end is located in a corner area of the second base part or the second movable part; the photosensitive assembly is fixed to the second movable part, the second movable part is adapted to drive the photosensitive chip to move on the xoy plane under the driving of the SMA wires; and the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. The application can improve the anti-shake stroke and the anti-shake response speed of the camera module at the cost of a smaller volume.

Description

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 202011303700.X, entitled "Optical Image Stabilization Camera Module," filed on November 19, 2020, and Chinese Patent Application No. 202011334144.2, entitled "Optical Image Stabilization Camera Module," filed on November 25, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to the field of camera equipment technology, and more specifically, to an optical image stabilization camera module. Background Technology

[0004] As consumers' demand for mobile phone photography increases, the functions of mobile phone cameras (i.e., camera modules) are becoming more and more abundant. Features such as portrait shooting, telephoto shooting, optical zoom, and optical image stabilization are all integrated into cameras with limited space. Among them, functions such as autofocus, optical image stabilization, and optical zoom often rely on optical actuators (sometimes also called motors) to achieve their functions.

[0005] Figure 1 This illustrates a typical camera module with a motor in the prior art. (Reference) Figure 1 This camera module typically includes a lens 1, a motor mechanism 2 (which can be simply referred to as a motor), and a photosensitive element 3. In shooting mode, light from the subject is focused through the lens 1 onto the photosensitive element 3a of the photosensitive element 3. Structurally, the lens 1 is fixed to the motor carrier of the motor. Figure 1(As shown in the image below), the motor carrier is a movable part. It typically moves the lens 1 along the optical axis under the action of the motor's drive element to achieve focusing. For camera modules with optical image stabilization (OIS), the motor often has a more complex structure. This is because, in addition to driving the lens along the optical axis, the motor also needs to drive the lens 1 to move in other degrees of freedom (e.g., perpendicular to the optical axis) to compensate for camera shake during shooting. Generally, camera module shake includes translation (x-axis and y-axis translation) and rotation (rotation in the xoy plane, whose axis of rotation can be approximately the same as the optical axis) perpendicular to the optical axis, as well as tilt shake (rotation around the x and y axes; in the field of camera modules, tilt shake is also called tilt shake). When the gyroscope (or other position sensing element) in the module detects shake in a certain direction, it can issue a command to drive the motor to move the lens a distance in the opposite direction, thereby compensating for lens shake. Generally speaking, the lens only translates and / or rotates in a direction perpendicular to the optical axis to compensate for camera module shake. This is because if the lens is rotated around the x and y axes, i.e., if the image stabilization effect is achieved through lens tilt adjustment, it may lead to a decrease in the module's image quality, or even cause blurring and make it difficult to meet basic image quality requirements.

[0006] However, as the image quality requirements for mobile phone camera modules increase, the size and weight of lenses are also increasing, placing greater demands on the driving force of motors. Current electronic devices (such as mobile phones) also face significant limitations in terms of camera module size, and the space occupied by the motor increases accordingly with the lens size. In other words, while lenses are trending towards larger size and greater weight, the driving force provided by the motor cannot be increased accordingly. With limited driving force, the heavier the lens, the shorter the distance the motor can move the lens, affecting image stabilization capabilities. On the other hand, the heavier the lens, the slower the motor can move the lens, and the longer it takes for the lens to reach the predetermined compensation position, which also affects image stabilization performance.

[0007] Therefore, there is an urgent need for a solution that can improve the stabilization travel and stabilization response speed of camera modules. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide a solution that can improve the stabilization travel and stabilization response speed of a camera module.

[0009] To address the aforementioned technical problems, the present invention provides an optical image stabilization camera module, comprising: a lens; a photosensitive component having a photosensitive chip; a first driving unit adapted to mount the lens and drive the lens to translate in the x-axis and y-axis directions; and a second driving unit comprising a second base and a second movable part, the second base and the second movable part being movably connected by an elastic connecting part, and the second driving unit having four sides, wherein each side is provided with two intersecting SMA lines, and the two ends of each SMA line are respectively connected to a fixed end of the second base and a movable end of the second movable part. A fixed end of the movable part; each fixed end is located in a corner region of the second base part or the second movable part; wherein the photosensitive component is fixed to the second movable part, the second movable part is adapted to drive the photosensitive chip to move on the xoy plane under the drive of the SMA line; and the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions; wherein the x-axis and the y-axis are coordinate axes perpendicular to the optical axis of the camera module, the x-axis and the y-axis are perpendicular to each other, and the xoy plane is the plane formed by the x-axis and the y-axis.

[0010] The second drive unit has four corner regions, each corner region is provided with two fixed ends, and the two ends of each SMA line are respectively fixed and electrically connected to the fixed ends of two adjacent corner regions.

[0011] In any of the corner regions, the two fixed ends are arranged along the optical axis. In this case, the two intersecting SMA lines are approximately located on the xoz or yoz plane (the z-axis is a coordinate axis parallel to the optical axis), meaning the two fixed ends in the corner region are vertically arranged (e.g., one fixed end is directly above the other). The z-axis is a coordinate axis parallel to the optical axis. The two SMA lines are intersecting because their projections on the xoz or yoz planes intersect, but they do not directly contact each other to avoid interference when the two SMA lines contract, which could reduce the accuracy of position adjustment.

[0012] In this configuration, all four fixed ends of any two adjacent corner regions are located in a plane parallel to the xoy plane. For example, in any corner region, one fixed end is located outside the other fixed end. Here, "outside" refers to the side away from the photosensitive center of the photosensitive chip, while "inside" refers to the side facing the photosensitive center of the photosensitive chip.

[0013] Each of the corner regions has two fixed ends, including one type A fixed end and one type B fixed end, wherein the type A fixed end and the type B fixed end are at different heights; the type A fixed ends of two diagonally opposite corner regions are at the same height, and the type B fixed ends of two diagonally opposite corner regions are also at the same height; each side of the second drive unit is provided with two SMA lines, wherein each SMA line is connected to one type A fixed end and one type B fixed end located in an adjacent corner region, thereby causing the two SMA lines to intersect each other.

[0014] Wherein, the four Class A fixed ends of the four corner regions are at the same height; and the four Class B fixed ends of the four corner regions are at the same height.

[0015] The four corner regions include a first corner, a second corner, a third corner, and a fourth corner. The first corner and the third corner are located on one diagonal of the second driving part, and the second corner and the fourth corner are located on the other diagonal of the second driving part. The second movable part extends outward at the positions of the first corner and the third corner, forming a first extension part and a third extension part. The first extension part is provided with a first A fixed end and a first B fixed end at different heights, and the third extension part is provided with a third A fixed end and a third B fixed end at different heights. The second base part is provided with a second A fixed end and a second B fixed end at different heights at the second corner position. The second base part is provided with a fourth A fixed end and a fourth B fixed end at different heights at the fourth corner position. The first A fixed end, the second A fixed end, the third A fixed end, and the fourth A fixed end all belong to the A-type fixed end. The first B fixed end, the second B fixed end, the third B fixed end, and the fourth B fixed end all belong to the B-type fixed end.

[0016] The second movable part also has notches at the second corner and the fourth corner to avoid the fixed end provided on the second base part.

[0017] The type A fixing end and the type B fixing end, located in the same corner area, are stacked and arranged, and are separated from each other by an insulating material.

[0018] The second movable part is further adapted to drive the photosensitive chip to move in a direction of rotation about the z-axis under the drive of the SMA line; wherein the z-axis is a coordinate axis parallel to the optical axis.

[0019] The second movable part is further adapted to drive the photosensitive chip to move in a direction of translation along the z-axis under the drive of the SMA line; wherein the z-axis is a coordinate axis parallel to the optical axis.

[0020] The four corner regions include a first corner, a second corner, a third corner, and a fourth corner. The first and third corners are located on the first diagonal of the second driving part, and the second and fourth corners are located on the second diagonal of the second driving part. The second movable part extends outward from the first and third corners respectively, forming a first extension and a third extension. Two fixed ends of the first corner of the second driving part are disposed on the first extension, and two fixed ends of the third corner of the second driving part are disposed on the third extension. Two fixed ends of the second corner of the second driving part are disposed on the second corner of the second base part. The two fixed ends at the four corners are disposed at the fourth corner of the second base portion; for each side of the second driving portion, the two intersecting SMA lines disposed on that side are fixed and electrically connected to the four fixed ends located in the two corner regions of that side; wherein, by driving the two pairs of intersecting SMA lines on the two intersecting sides of the second driving portion to contract, a translation component of the photosensitive chip in the direction of the first diagonal or the direction of the second diagonal is generated; the combination of the translation component in the direction of the first diagonal and the translation component in the direction of the second diagonal makes the movement direction of the photosensitive chip in the xoy plane opposite to the movement direction of the lens.

[0021] Specifically, the photosensitive chip is rotated in the Rz direction by driving the two pairs of interlaced SMA lines on opposite sides of the second driving part to contract. The Rz direction is the direction of rotation about the z-axis, which is a coordinate axis parallel to the optical axis.

[0022] Specifically, the rotational component of the photosensitive chip in the Rx or Ry direction is generated by driving the contraction of a single SMA line on a single side of the second driving unit; wherein the Rx direction is the direction of rotation about the x-axis and the Ry direction is the direction of rotation about the y-axis.

[0023] Specifically, the photosensitive chip is translated in the z-axis direction by driving the first and second sets of SMA lines of the second driving unit to contract; and the translation direction of the photosensitive chip in the z-axis direction is opposite to the translation direction of the lens in the z-axis direction, where the z-axis is a coordinate axis parallel to the optical axis; wherein the first set of SMA lines consists of two SMA lines having a first common fixed end, which are respectively located on two intersecting sides of the second driving unit; the second set of SMA lines consists of two other SMA lines having a second common fixed end, which are located on two other intersecting sides of the second driving unit; and both the first and second common fixed ends are one of the eight fixed ends of the second driving unit, and the first and second common fixed ends are at the same height.

[0024] The first driving part includes a first base part and a first movable part, and the second base part is fixed to the first base part.

[0025] The first base portion is located around the first movable portion; the second base portion includes a base portion sidewall and a base, the bottom surface of the base portion sidewall is connected to the base, and the top surface of the base portion sidewall is connected to the first base portion.

[0026] The bottom edge region of the first base portion forms a stepped notch, and the sidewall of the base portion can extend upward and into the stepped notch, and connect with the first base portion.

[0027] The second movable part includes a movable part body, which is flat and has a light-transmitting hole in the center; the outer edge region of the bottom surface of the movable part body extends downward to form a movable part sidewall.

[0028] The photosensitive component includes a photosensitive chip, a circuit board, a lens mount, and a filter. The photosensitive chip is mounted on the upper surface of the circuit board, the lens mount is mounted on the upper surface of the circuit board and surrounds the photosensitive chip, and the filter is mounted on the lens mount. The bottom surface of the movable part sidewall is bonded to the upper surface of the circuit board of the photosensitive component. An accommodating cavity is formed between the inner side surface of the movable part sidewall, the bottom surface of the movable part body, the upper surface of the circuit board, and the outer side surface of the lens mount, and electronic components are arranged in the accommodating cavity.

[0029] The movable part has a stepped notch on the inner edge of its main body to avoid part of the optical lens structure.

[0030] The second base is fixed to the first drive unit. The second base includes a base sidewall that surrounds the second movable part. There is a gap between the base sidewall and the second movable part for accommodating the SMA line.

[0031] The photosensitive component includes a suspended circuit board, which comprises a rigid circuit board body and a flexible connecting strip. The connecting strip extends from a first side and a second side of the circuit board body and bends upward to form a bend. The top of the bend extends horizontally along the periphery of the photosensitive component, such that the connecting strip surrounds the first side, the second side, and the third side of the photosensitive component. The connecting strips on the first side and the second side each have at least one suspension portion, which is fixed to the second base portion of the second drive portion or fixed to the second base portion through an intermediary. The photosensitive component has a first side and a second side that are aligned with the circuit board body, and the first side and the second side are arranged opposite to each other. The third side intersects both the first side and the second side.

[0032] The suspension part has a suspension hole, and the second base part or the intermediary has a hook that hooks onto the suspension hole.

[0033] In this embodiment, a section of the connecting strip is reinforced by attaching a rigid substrate to form the suspension portion.

[0034] The suspended circuit board is made of a rigid-flex board, wherein the main body of the circuit board and the suspension part are formed by the rigid part of the rigid-flex board, and the bending part and the connecting strip section connecting the multiple suspension parts are formed by the flexible part of the rigid-flex board.

[0035] The connecting strip includes a third connecting strip and a fourth connecting strip. The third connecting strip extends from the first side of the circuit board body and bends upward to form a bend, then extends along the first side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The fourth connecting strip extends from the second side of the circuit board body and bends upward to form another bend, then extends along the second side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The third connecting strip and the fourth connecting strip join together on the third side and are interconnected.

[0036] The camera module further includes a first connecting strip electrically connected to the first driving unit. The first connecting strip extends from the top region of the first driving unit, then bends downward and engages with the third connecting strip or the fourth connecting strip on the third side and conducts electricity.

[0037] The camera module further includes a housing, the inner side of which has a receiving groove for accommodating the joint portion of the third side; wherein the joint portion is a joint portion in which the first connecting strip, the third connecting strip and the fourth connecting strip engage with each other; the receiving groove is filled with adhesive to fix the first connecting strip, the third connecting strip and the fourth connecting strip to the housing.

[0038] The connecting strip located on the third side is also connected to a fifth connecting strip, which has a connector for external connection; the suspended circuit board also has a fixing part for fixing the fifth connecting strip.

[0039] Specifically, based on the detected tilt jitter angle 'a' of the camera module, the lens movement distance 'b' driven by the first driving unit to move the lens, and the photosensitive chip movement distance 'c' driven by the second driving unit to move the photosensitive chip, are determined; wherein the lens movement distance 'b', the photosensitive chip movement distance 'c', and the image-side focal length 'f' of the camera module satisfy the following relationship: a = arctan(b / f) + arctan(c / f).

[0040] It also includes a driving logic module, which is used to maintain the ratio of the lens movement distance b to the photosensitive chip movement distance c at a preset fixed ratio.

[0041] This also includes a drive logic module, which has a stabilization threshold K. The drive logic module is used to maintain the ratio of the lens movement distance b to the image sensor movement distance c at a preset fixed ratio when the tilt angle a is less than or equal to the stabilization threshold K, and to ensure that the image sensor movement distance c reaches its maximum value c of its movement range when the tilt angle a is greater than the stabilization threshold K. max The lens movement distance b is based on the relationship b = tan(a / f) - c max Obtained through calculation.

[0042] The preset fixed ratio of the lens movement distance and the image sensor movement distance is set according to the weight of the lens, the driving force of the first drive unit, the weight of the image sensor or image sensor assembly, and the driving force of the second drive unit, so that the lens and the image sensor move to their respective image stabilization target positions in the same time.

[0043] Compared with the prior art, this application has at least one of the following technical effects:

[0044] 1. This application can increase the stabilization travel of the camera module, thereby compensating for larger camera module shakes;

[0045] 2. This application can improve the image stabilization response speed of the camera module;

[0046] 3. The optical image stabilization camera module of this application has the advantage of compact structure, making it particularly suitable for miniaturized camera modules;

[0047] 4. In some embodiments of this application, the driving force of the first driving unit, the weight of the photosensitive chip (or photosensitive component), the driving force of the second driving unit, etc., can be set so that the time for the lens and the photosensitive chip to move to their respective anti-shake target positions is basically the same, thereby obtaining a better anti-shake effect;

[0048] 5. In some embodiments of this application, staggered SMA lines can be arranged on the four sides of the second driving part to achieve adjustment of the photosensitive chip in multiple degrees of freedom in a smaller space;

[0049] 6. In some embodiments of this application, the translation component of the photosensitive chip in the direction of the first diagonal or the direction of the second diagonal can be generated by driving the two pairs of intersecting SMA lines on the two intersecting sides of the second driving part to contract; the combination of the translation component in the direction of the first diagonal and the translation component in the direction of the second diagonal makes the movement direction of the photosensitive chip in the xoy plane opposite to the movement direction of the lens. This design can improve the image stabilization travel and image stabilization response speed of the camera module with less space cost;

[0050] 7. In some embodiments of this application, in the second driving unit, in any of the corner regions, the two fixed ends are arranged along the optical axis direction. This arrangement can effectively utilize the space of the photosensitive component in the height direction (z-axis direction), thus not increasing the height of the camera module; at the same time, it can also save space in the x-axis and y-axis directions of the camera module, thereby reducing the lateral size of the camera module;

[0051] 8. In some embodiments of this application, the adhesive material used to bond the first base portion and the second base portion is arranged between the stepped notch of the first base portion and the top surface of the base portion sidewall extending into the notch, thereby preventing the camera module from taking pictures with stains caused by the overflow of the AA adhesive material. Attached Figure Description

[0052] Figure 1 This illustrates a typical camera module with a motor in the prior art.

[0053] Figure 2 A cross-sectional schematic diagram of a camera module with image stabilization function according to an embodiment of this application is shown.

[0054] Figure 3 A cross-sectional schematic diagram of a camera module with image stabilization according to another embodiment of this application is shown.

[0055] Figure 4 The diagram illustrates the relationship between the moving distance of the lens and the image sensor and the tilt angle of the module under four different scenarios in this application.

[0056] Figure 5 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown.

[0057] Figure 6 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown.

[0058] Figure 7 A cross-sectional schematic diagram of a camera module in yet another embodiment of this application is shown.

[0059] Figure 8 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown.

[0060] Figure 9a A three-dimensional schematic diagram of a camera module cut open according to one embodiment of this application is shown.

[0061] Figure 9b A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown.

[0062] Figure 10a A three-dimensional schematic diagram of a camera module cut open according to another embodiment of this application is shown.

[0063] Figure 10b A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown.

[0064] Figure 11a It shows Figure 10a and Figure 10b The diagram shows a three-dimensional structure of the second drive unit.

[0065] Figure 11b It shows Figure 11a A three-dimensional exploded view.

[0066] Figure 12 A schematic diagram of the connection of the SMA line of the second drive unit in one embodiment of this application is shown.

[0067] Figure 13A three-dimensional schematic diagram of the second driving unit and photosensitive component assembled according to one embodiment of this application is shown.

[0068] Figure 14 An exploded schematic diagram of a second driving unit and a photosensitive component in one embodiment of this application is shown.

[0069] Figure 15 A perspective view of a photosensitive component and its suspended circuit board in one embodiment of this application is shown.

[0070] Figure 16a A front view of the suspended circuit board after unfolding is shown in one embodiment of this application.

[0071] Figure 16b A schematic diagram of the back of a suspended circuit board after unfolding is shown in one embodiment of this application.

[0072] Figure 17a A front view of the suspended circuit board after unfolding is shown in another embodiment of this application.

[0073] Figure 17b A schematic diagram of the back of a suspended circuit board after unfolding is shown in one embodiment of this application.

[0074] Figure 18 An exploded perspective view of a camera module based on a suspended circuit board according to one embodiment of this application is shown.

[0075] Figure 19 A perspective view of a suspended circuit board-based camera module with a housing is shown in one embodiment of this application.

[0076] Figure 20 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown.

[0077] Figure 21 A top view of the second drive unit in one embodiment of this application is shown.

[0078] Figure 22 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown.

[0079] Figure 23 It shows the basis Figure 22 A cross-sectional view of a portion of the edge area of ​​the camera module's circuit board. Detailed Implementation

[0080] To better understand this application, various aspects of this application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of this application and are not intended to limit the scope of this application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0081] It should be noted that in this specification, the terms "first," "second," etc., are used only to distinguish one feature from another and do not imply any limitation on the features. Therefore, without departing from the teachings of this application, the first subject discussed below may also be referred to as the second subject.

[0082] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for ease of illustration. The drawings are for illustrative purposes only and are not drawn to scale.

[0083] It should also be understood that the terms "comprising," "including," "having," "containing," and / or "comprising," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed feature, not individual elements in the list. Additionally, when describing embodiments of this application, the word "may" is used to mean "one or more embodiments of this application." And the term "exemplary" is intended to refer to an example or illustration.

[0084] As used herein, the terms “basically,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art.

[0085] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0086] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0087] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0088] Figure 2 A cross-sectional schematic diagram of a camera module with image stabilization according to an embodiment of this application is shown. (Reference) Figure 2 In this embodiment, the camera module includes a lens 10, a photosensitive component 20, a first driving unit 30, and a second driving unit 40. The photosensitive component 20 includes a photosensitive chip 21. The first driving unit 30 is configured to drive the lens 10 to move in both the x and y directions, and the second driving unit 40 is configured to drive the photosensitive chip 21 to move in both the x and y directions. In this embodiment, the x and y directions are perpendicular to each other and parallel to the photosensitive surface of the photosensitive component 20. The z-direction is parallel to the normal direction of the photosensitive surface. For ease of understanding, Figure 2The diagram also illustrates a three-dimensional Cartesian coordinate system constructed based on the x, y, and z directions. In this embodiment, optical image stabilization of the camera module is achieved by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions via a control module. Specifically, the lens 10 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions. For example, if the lens 10 is driven to move in the positive x-axis direction, the photosensitive chip 21 is driven to move in the negative x-axis direction; if the lens 10 is driven to move in the positive y-axis direction, the photosensitive chip 21 is driven to move in the negative y-axis direction; or the lens 10 is driven to move along both the x and y axes, while the photosensitive chip 21 is driven to move along both the x and y axes in directions opposite to the movement of the lens 10. In other words, when simultaneous movement along both the x and y axes is required, the displacement vectors of the lens 10 and the photosensitive chip 21 in the xoy plane are in opposite directions. The camera module typically includes a position sensor used to detect shake in the camera module or terminal device (i.e., an electronic device equipped with the camera module, such as a mobile phone). When shaking is detected, the position sensor sends a signal to the camera module, driving the lens 10 and the photosensitive chip 21 to move accordingly to compensate for the shaking, thereby achieving optical image stabilization. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the movement directions of the lens 10 and the photosensitive chip 21 are opposite, which can achieve a faster response and better image stabilization effect. In addition, the image stabilization angle range of the camera module is usually limited by the suspension system and the drive system, and it is not possible to achieve a relatively large compensation angle range. In this embodiment, by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions, a large-angle shake compensation is achieved. Furthermore, in this embodiment, by simultaneously driving the lens 10 or the photosensitive chip 21 to move in opposite directions, compared with the solution of only driving the lens 10 to move, there is a larger relative movement stroke between the lens 10 and the photosensitive chip 21 (for ease of description, this relative movement stroke can be referred to as the image stabilization stroke), which can have a better compensation effect. In particular, due to the increase in the image stabilization stroke, this embodiment also has a better compensation effect for tilt shake of the camera module. Furthermore, in this embodiment, the direction of the image stabilization movement can be limited to the xoy plane, without tilting the optical axis of the lens 10 or the image sensor 21, thereby avoiding the blurring problem caused by the image stabilization movement.

[0089] Furthermore, in another embodiment of this application, the photosensitive chip 21 can also be driven by the second driving unit 40 to rotate in the xoy plane, thereby achieving compensation for jitter in the rotation direction of the camera module.

[0090] Furthermore, still referencing Figure 2In one embodiment of this application, the camera module includes a first driving unit 30, a lens 10, a second driving unit 40, and a photosensitive component 20. The lens 10 is mounted on the first driving unit 30. The first driving unit 30 may have a cylindrical first motor carrier, which can serve as the movable part of the first driving unit, and the lens is mounted on the inner side of the first motor carrier. The first driving unit also has a stationary part, or base part. In this embodiment, the base part can be implemented as a motor housing. The motor housing may include a base and a cover. The base has a light-transmitting hole. The movable part is movably connected to the base part. The driving element may be a coil magnet combination, which can be installed between the movable part and the base part. For example, it can be installed between the first motor carrier and the motor housing. In fact, the first driving unit in this embodiment can directly adopt the common structure of optical image stabilization motors in the prior art. Further, in this embodiment, the second driving unit 40 can rest on and be fixed to the bottom surface of the first driving unit 30. The second driving unit 40 may also include a base part and a movable part. The base part is directly connected to the first driving unit. The movable part is located below the base and is movably connected to the base. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21 mounted on the surface of the circuit board, and a lens mount 22 surrounding the photosensitive chip 21. The bottom of the lens mount 22 can be mounted on the surface of the circuit board 23, and its top surface can be fixed to the movable part of the second driving part 40. The lens mount 22 has a light-transmitting hole in the center, and a filter 24 is mounted on the lens mount 22 (the filter 24 can also be considered as a component of the photosensitive assembly 20). Driven by the movable part of the second driving part 40, the photosensitive assembly 20 can translate relative to the base in the x and y directions or rotate in the xoy plane. For ease of description, the base of the first driving part 30 is sometimes referred to as the first base, the base of the second driving part 40 as the second base, the movable part of the first driving part 30 as the first movable part, and the movable part of the second driving part 40 as the second movable part.

[0091] Figure 3 A cross-sectional schematic diagram of a camera module with image stabilization according to another embodiment of this application is shown. In this embodiment, the camera module includes a first driving unit 30, a lens 10, a second driving unit 40, and a photosensitive component 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly method of the first driving unit 30 and the lens 10 can be similar to those of other modules. Figure 2The previous embodiment is identical and will not be repeated. The difference between this embodiment and the previous embodiment is that the second driving part 40 is located inside the photosensitive component 20. In this embodiment, the photosensitive component 20 includes a circuit board 23, a lens mount 22, a filter 24, and a photosensitive chip 21. The bottom of the lens mount 22 can be mounted on the surface of the circuit board 23, and its top surface can be fixed to the base of the first driving part 30. The lens mount 22 has a light-transmitting hole in its center, and a filter 24 is mounted on the lens mount 22. The lens mount 22, the filter 24, and the circuit board 23 can form a cavity, and the photosensitive chip 21 is located in the cavity 25. In this embodiment, the second driving part 40 can also be located in the cavity 25. Specifically, the base of the second driving part 40 can be mounted on the surface of the circuit board 23, and the movable part of the second driving part 40 is movably connected to the base. The photosensitive chip 21 is mounted on the surface of the movable part. In this way, the photosensitive chip 21 can be translated in the x and y directions or rotated in the xoy plane relative to the base unit under the drive of the movable part of the second driving unit 40.

[0092] The above description, in conjunction with two embodiments, illustrates different structural implementations of the second drive unit of the camera module described in this application. The following further introduces a method for compensating for tilt and jitter in the camera module based on the design concept of this application.

[0093] Figure 4 This diagram illustrates the relationship between the lens and image sensor movement distance and the module tilt angle under four different scenarios in this application. Position A in the diagram represents the combination of lens and image sensor movement distances used to compensate for camera module shake angle α. Figure 4As shown in the figure, the lens moves a distance of b, and the image sensor (sometimes referred to as the chip below) moves a distance of c. The distance the lens or chip moves can be equivalent to the angle at which the image plane deviates from the optical axis during optical imaging. Specifically, when the lens moves a distance of b in the xoy plane, the resulting image plane offset angle α1 has an arithmetic relationship with the image distance. The image distance is different at different shooting distances. For ease of calculation and expression, the image distance is represented by the image-side focal length. Specifically, the relationship between the resulting image plane offset angle α1 and the image-side focal length f of the lens is: tan(α1) = b / f. When the image sensor moves a distance of c in the xoy plane, the relationship between the resulting image plane offset angle α2 and the image-side focal length f of the lens is: tan(α2) = c / f. In this embodiment, the lens and the image sensor move in opposite directions. Therefore, the calculation method for the overall compensation angle a of the camera module is: a = α1 + α2 = arctan(b / f) + arctan(c / f). In one embodiment, the movement distances of the lens and the photosensitive chip can be set to be the same, i.e., b = c. In another embodiment, the movement distances of the lens and the photosensitive chip can be set to be unequal; for example, the movement distance of the lens can be greater than the movement distance of the photosensitive chip, i.e., b > c. In this embodiment, the second driving unit can be selected from smaller drivers (such as MEMS drivers, which typically have relatively small travel distances) to help achieve overall miniaturization of the camera module.

[0094] Furthermore, in one embodiment of this application, the ratio of the lens movement distance to the image sensor movement distance can be optionally set to maintain a fixed ratio, such as b / c = 6:4, b / c = 7:3, or b / c = 5:5. Regardless of the compensation value of the camera module shake (e.g., the comprehensive compensation angle α), the movement distance of the lens and the image sensor remains at this preset ratio. This is beneficial for ensuring uniform compensation effect of the camera module within the compensable range and also helps to reduce the design difficulty of the camera module's image stabilization system drive logic module.

[0095] Furthermore, in a configuration where the lens movement distance and the image sensor movement distance are based on a fixed ratio for image stabilization, the limited range of motion of the image sensor sometimes means that camera module shake may exceed the maximum movement distance of the image sensor. Therefore, in one embodiment of this application, an image stabilization threshold can be set. For example, for a shake angle 'a' that needs compensation, a threshold K can be set. When the actually calculated shake angle 'a' is less than or equal to the image stabilization threshold K, the lens movement distance 'b' and the image sensor movement distance 'c' are maintained at a fixed ratio. This fixed ratio can be preset, for example, b / c = 6:4, b / c = 7:3, or b / c = 5:5. When the actually calculated shake angle 'a' is greater than the image stabilization threshold K, the image sensor movement distance 'c' is taken as the maximum value of its movement distance, i.e., the maximum movement distance 'c' of the image sensor. maxThe distance the camera moves is b = tan(a / f) - c max In other words, when the camera module needs to compensate for shake angles above the stabilization threshold K, based on a preset fixed ratio, the lens moves to the maximum distance corresponding to the sensor's movement (i.e., the sensor's maximum travel distance c). max After reaching the position, the first drive unit can drive the lens to continue moving until the lens has moved a distance b = tan(a / f) - c. max At the same time, the photosensitive chip first moves synchronously in the opposite direction to the maximum distance c that the photosensitive chip has moved. max Then remain still.

[0096] Furthermore, in another embodiment of this application, the maximum travel distance b of the lens movement within the xoy plane is... max The corresponding stabilization angle (referring to the angle of camera module tilt) can be less than the maximum travel distance c of the image sensor. max The corresponding stabilization angle. With this design, the camera module's stabilization system can have a faster response speed. High-end lenses often have a large number of lens elements; for example, the rear main camera lens in current smartphones can have up to eight lens elements. To further improve image quality, some lenses also use glass lenses, all of which result in a heavier lens. When the driving force does not increase significantly, the speed at which the driving device moves the lens will decrease. However, the image sensor or image sensor assembly is relatively light and can reach the preset position with a smaller driving force. Therefore, in this embodiment, the advantages of the relatively light weight and relatively fast movement speed of the image sensor or image sensor assembly can be better utilized to effectively improve the response speed of the camera module's stabilization system.

[0097] Furthermore, in another embodiment of this application, the fixed ratio between the lens movement distance and the image sensor movement distance can be set according to factors such as the lens weight, the driving force of the first drive unit, the weight of the image sensor (or image sensor assembly), and the driving force of the second drive unit. Setting an appropriate fixed ratio allows the time taken for the lens and the image sensor to reach their respective image stabilization target positions to be substantially the same, thereby achieving a better image stabilization effect. Specifically, the lens weight and the driving force of the first drive unit can substantially determine the lens movement speed, while the weight of the image sensor (or image sensor assembly) and the driving force of the second drive unit can substantially determine the image sensor movement speed. When the lens movement speed is less than the image sensor movement speed (e.g., in the case of a heavier lens), the image sensor movement distance can account for a larger proportion when setting the fixed ratio. This utilizes the characteristic of the image sensor's faster movement speed, allowing the image sensor to move a longer distance, thus ensuring that the time taken for the lens and the image sensor to reach their respective image stabilization target positions is substantially the same.

[0098] Furthermore, in another embodiment of this application, the first drive unit may employ a drive element with a large driving force and a suspension system with a large stroke. For example, the first drive unit may be driven by an SMA (shape memory alloy) element. Compared to the traditional coil magnet combination, the SMA element can provide a larger driving force with a smaller footprint, thus the first drive unit can be designed to be more compact, which is beneficial for the miniaturization of the camera module.

[0099] Furthermore, Figure 5 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Reference) Figure 5 In this embodiment, the base of the second drive unit 40 and the base of the first drive unit 30 ( Figure 5 (Not specifically shown) are fixed together. Lens 10 can be mounted on the movable part of the first drive unit 30 (e.g., the first motor carrier, Figure 5 (Not specifically shown). The photosensitive component 20 includes a circuit board 23, a photosensitive chip 21, a lens mount 22, a filter 24, etc. The photosensitive component 20 can be mounted on the movable part 42 of the second drive unit 40. Specifically, the bottom surface of the movable part 42 can rest against the top surface of the lens mount 22 of the photosensitive component 20. In the second drive unit 40, the second base part 41 and the second movable part 42 can be elastically connected by a suspension system. In this embodiment, the suspension system allows the second movable part 42 to translate relative to the second base part 41 in the xoy plane. Optionally, the suspension system can be a ball bearing system, which has the advantage that: in the z-direction, the second movable part 42 and the second base part 41 are in contact through the ball bearings, and the second movable part 42 only moves in the xoy plane, while the movement in the optical axis direction can be prevented by the ball bearings between the second movable part 42 and the second base part 41, thereby avoiding any impact on the focusing of the camera module.

[0100] Optionally, in another embodiment, the suspension system may include an elastic element (such as a spring) through which the fixed part and the movable part are connected. This elastic element allows the movable part to translate relative to the base in the xoy plane, but prevents the movable part from moving relative to the base outside the xoy plane. Compared to a ball bearing system, the advantage of using an elastic element is that it can provide an initial force between the base and the movable part. This initial force, in conjunction with the driving force of the drive element, can control the distance the movable part moves or maintain its position, eliminating the need for a separate drive element to provide a conjugate driving force to control the position of the movable part. With a ball bearing system, the movable part moves freely relative to the base in the xoy direction when the drive element does not provide a driving force; therefore, at least one pair of opposing driving forces are often required to keep the movable part in its initial position.

[0101] Furthermore, still referencing Figure 5 In one embodiment of this application, image stabilization can be achieved by driving the entire photosensitive assembly 20 to move. Simultaneously, the circuit board 23, photosensitive chip 21, lens mount 22, and filter 24 are packaged as a single unit, forming a closed space in which the photosensitive chip 21 is housed. This improves the sealing of the photosensitive assembly 20, ensuring that the image formed by the photosensitive chip 21 is not affected by dust during the manufacturing or use of the camera module.

[0102] In this embodiment, reference is still made. Figure 5 In one embodiment of this application, the back of the circuit board can directly rest against the terminal device (i.e., an electronic device equipped with the camera module, such as a mobile phone). Specifically, the back of the circuit board 23 can rest against the motherboard or other supporting component 90 of the terminal device. Although in this embodiment the second movable part 42 is connected to the photosensitive component 20 and the second base part 41 is connected to the first driving part 30, it is understood that the movement of the second movable part 42 and the second base part 41 is relative. In image stabilization movement, opposite movement directions mean that the movement direction of the movable part of the first driving part relative to its base part is opposite to the movement direction of the movable part of the second driving part relative to its base part.

[0103] Furthermore, Figure 6 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown. (Reference) Figure 6 In this embodiment, a rear shell 49 is added below the second driving part 40. The rear shell 49 is connected to the second base part 41 of the second driving part 40 and forms a receiving cavity, which accommodates the second movable part 42 and the photosensitive component 20 of the second driving part 40. Figure 6 A gap 49a may exist between the photosensitive component 20 and the bottom of the rear housing 49. That is, the photosensitive component 20 is suspended, and it is only connected to the second movable part 42 of the second drive unit 40. In this embodiment, the rear housing 49 directly rests on the terminal device. Since the rear housing 49 connects the terminal device, the second drive unit 40, and the base of the first drive unit 30, during image stabilization, with the terminal device as a reference, the movable parts of the first drive unit 30 and the second drive unit 40 simultaneously drive the lens 10 and the photosensitive component 20 to move in opposite directions. Furthermore, in this embodiment, the second movable part 42 of the second drive unit 40 is directly bonded to the upper surface of the photosensitive component 20, which can separate the filter 24 from the external space, thereby preventing debris generated by friction or collision of the second movable part 42 relative to the second base unit 41 from falling directly onto the surface of the filter 24.

[0104] Figure 7 A cross-sectional schematic diagram of a camera module according to yet another embodiment of this application is shown. (See reference) Figure 7 In this embodiment, the first drive unit 30 is configured to drive the lens 10 to move along the optical axis to achieve focusing, and also to drive the lens 10 to move in the xoy plane to achieve image stabilization. Optionally, the first drive unit 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32. The lens 10 rests on the first carrier 31, and a suspension system is provided between the first carrier 31 and the second carrier 32. A suspension system is also provided between the second carrier 32 and the housing 33 of the first drive unit 30. In this embodiment, the suspension system between the first carrier 31 and the second carrier 32 (i.e., the first suspension system) is a ball bearing system, and the suspension system between the second carrier 32 and the housing 33 (i.e., the second suspension system) is a suspension system based on an elastic element (such as a spring). In this embodiment, the second suspension system is located outside the first suspension system. The first suspension system allows the lens 10 and the first carrier 31 to translate in the xoy plane to achieve image stabilization, and the second suspension system allows the lens 10, the first carrier 31, and the second carrier 32 to move as a whole along the optical axis to achieve focusing. Optionally, in another embodiment, the second suspension system may also be disposed inside the first suspension system. In another modified embodiment, the second suspension system may also be disposed below the first suspension system. In this embodiment, a suspension system refers to a system that movably connects two components, and the degree of freedom of their relative movement (i.e., the direction of movement) is restricted to a certain extent. These two movably connected components may be referred to as the base and the movable part, respectively. Generally, the suspension system is used in conjunction with a drive element (e.g., an SMA element or a coil magnet combination). The drive element provides a driving force, under which the movable part moves relative to the base in the direction of movement defined by the suspension system.

[0105] Furthermore, Figure 8 A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown. (See reference) Figure 8 In this embodiment, the movable part of the second driving unit 40 may be provided with a downwardly extending extension arm 42a, which is bonded to the circuit board 23 of the photosensitive component 20. An FPC board 42b may be provided on the extension arm 42a, which can be directly soldered to the circuit board 23, thereby enabling electrical connection between the driving element mounted on the movable part and the circuit board 23. This embodiment avoids glue flowing onto the filter when the photosensitive component 20 is bonded to the movable part, thus preventing it from affecting imaging. Furthermore, in this embodiment, a gap exists between the upper surface (i.e., the top) of the photosensitive component 20 and the second driving unit 40, preventing the color filter from being scratched or broken.

[0106] Furthermore, in some embodiments of this application, an SMA element can be used to provide driving force to the second drive unit, thereby achieving controlled movement of the second movable part relative to the second base unit. Generally speaking, an SMA element can provide a large driving force with a small footprint. The second drive unit driven by SMA will be described below with reference to the accompanying drawings and an embodiment based on eight SMA lines.

[0107] Figure 9a A cutaway perspective view of a camera module according to one embodiment of this application is shown. (Reference) Figure 9a In this embodiment, the first driving part has a receiving hole 30a at its center that is adapted to the outer surface of the optical lens 10, so that the optical lens 10 can be installed in the receiving hole 30a. The second driving part 40 is located below the first driving part 30. The second driving part 40 includes a second base part 41 and a second movable part 42. In this embodiment, the second base part 41 can be an annular frame structure. Specifically, the frame structure can be formed by an annular base part sidewall 41a, which can surround the second movable part 42. The top surface of the base part sidewall 41a can be bonded to the first driving part 30 by a second adhesive material 23b to fix the second driving part 40 and the first driving part 30 together. Note that Figure 9a Only the overall shape of the first drive unit 30 is shown; the first base unit and the first movable part are not shown. Typically, the first base unit is located around the periphery of the first movable part. In this embodiment, a stepped notch 33 can be formed in the edge region of the bottom surface of the first drive unit (i.e., the edge region of the bottom surface of the first base unit), and the base sidewall 41a of the second base unit 41 can extend upwards and into the stepped notch 33. This design enhances the structural strength of the second base unit 41, allowing for more reliable mounting of the SMA cable and its suspended second movable part 42 and photosensitive component 20. Furthermore, this design also improves the connection stiffness between the second base unit 41 and the first drive unit 30, resulting in more stable and precise movement of the second movable part 42. Figure 9b A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Referring to the reference...) Figure 9a and Figure 9bIn this embodiment, the bottom surface of the second movable part 42 can be bonded to the circuit board 23 of the photosensitive component 20 via the first adhesive material 23a, thereby fixing the photosensitive component 20 and the second movable part 42 together. A gap exists between the outer surface of the second movable part 42 and the inner surface of the second base part 41 (i.e., the inner surface of the base part sidewall 41a), which can accommodate the SMA wire 48 and the spring piece 47 supporting the second movable part. Specifically, the second base part 41 and the second movable part 42 can be movably connected via the spring piece 47 (which can also be replaced by other elastic connecting parts). The SMA wire can also be connected between the second base part 41 and the second movable part 42 and provide driving force for the movement of the second movable part 42.

[0108] Furthermore, still referencing Figure 9b In one embodiment of this application, the second movable part 42 may include a movable part body 42a, which is generally flat and has a through hole (i.e., a light-transmitting hole) in its center to allow light used for imaging to pass through. The outer edge region of the bottom surface of the movable part body 42a extends downward to form a movable part sidewall 42b, the bottom surface of which is bonded to the upper surface of the circuit board 23. A receiving cavity is formed between the inner surface of the movable part sidewall 42b, the bottom surface of the movable part body 42a, the upper surface of the circuit board 23, and the outer surface of the mirror mount 22. This receiving cavity can be used to arrange electronic components 29. The electronic components 29 include resistors, capacitors, etc. These electronic components 29, together with the wiring in the circuit board 23, can constitute a circuit board circuit.

[0109] Furthermore, still referencing Figure 9b In one embodiment of this application, the inner edge of the movable part body has a stepped notch 43 to avoid the optical lens 10, thereby allowing the optical lens 10 to have a larger range of motion (i.e., a larger focusing travel or image stabilization travel).

[0110] Furthermore, Figure 10a A three-dimensional schematic diagram of a camera module cut open according to another embodiment of this application is shown. Figure 10b A cross-sectional schematic diagram of a camera module according to another embodiment of this application is shown. (Referring to the reference...) Figure 10a and Figure 10bIn this embodiment, the second base portion includes a base portion sidewall 41a and a base 41b. The base 41b is generally flat and has a through hole in its center to avoid the imaging optical path. In this embodiment, the base 41b can be located above the second movable portion 42. The base 41b and the base portion sidewall 41a can be integrally formed. The base portion sidewall 41a can surround the second movable portion 42. The top surface of the base portion sidewall 41a can be bonded to the first base portion to fix the second driving portion 40 and the first driving portion 30 together.

[0111] Furthermore, Figure 11a It shows Figure 10a and Figure 10b The diagram shows a three-dimensional structural schematic of the second driving unit. Figure 11 is a schematic diagram after being flipped up and down, with the second movable part 42 positioned above the base 41b to facilitate a clearer view of its detailed structure. Figure 10a and Figure 10b In the middle, the second movable part 42 is located below the base 41b. Figure 11b It shows Figure 11a A three-dimensional exploded view. Figure 12 A schematic diagram of the SMA line connection of the second drive unit in one embodiment of this application is shown. (Reference) Figure 11a , Figure 11b and Figure 12 In one embodiment of this application, the second drive unit 40 includes eight SMA lines 48, which can be fixed to eight fixed ends located at the second base unit 41 and the second movable unit 42, respectively. Specifically, the second drive unit 40 has a generally rectangular outer contour in a top view, and the four corner regions of the rectangular outer contour can be respectively designated as the first corner 51, the second corner 52, the third corner 53, and the fourth corner 54. The first corner 51 and the third corner 53 are located on one diagonal AX1, and the second corner 52 and the fourth corner 53 are located on another diagonal AX2 (see reference). Figure 12In this embodiment, the movable body 42a of the second movable part 42 can extend outward at the first corner 51 and the third corner 53 respectively to form a first extension part 51a and a third extension part 53a. The first extension part 51a can be provided with a first A fixed end 1a and a first B fixed end 1b, wherein the first B fixed end 1b can be mounted or formed on the upper surface of the first extension part 51a (here formed in a one-piece molding manner, which will not be described in detail below), the first A fixed end 1a can be located above the first B fixed end 1b, and the first A fixed end 1a and the first B fixed end 1b can be isolated by an insulating material to prevent short circuit of the circuit used to drive the SMA line. Similarly, the third extension portion 53a may be provided with a third A fixed end 3a and a third B fixed end 3b, wherein the third B fixed end 3b may be mounted or formed on the upper surface of the third extension portion 53a, and the third A fixed end 3a may be located above the third B fixed end 3b. The third A fixed end 3a and the third B fixed end 3b may be isolated by an insulating material to prevent short circuits in the circuit used to drive the SMA line. Furthermore, the movable part body 42a may also be designed with notches at the positions of the second corner 52 and the fourth corner 54 to accommodate the functional structures of the second base portion 41 at the second corner 52 and the fourth corner 54. Here, the functional structures of the second base portion 41 at the second corner 52 and the fourth corner 54 refer to the second A fixed end 2a, the second B fixed end 2b, the fourth A fixed end 4a, and the fourth B fixed end 4b located on the second base portion 41. Specifically, a second A fixing end 2a and a second B fixing end 2b can be provided at the second corner 52 position of the second base part 41. The second B fixing end 2b can be installed or formed on the upper surface of the second corner 52 region of the base 41b. The second A fixing end 2a can be located above the second B fixing end 2b. The second A fixing end 2a and the second B fixing end 2b can be isolated from each other using an insulating material. A fourth A fixing end 4a and a fourth B fixing end 4b can be provided at the fourth corner 54 position of the second base part 41. The fourth B fixing end 4b can be installed or formed on the upper surface of the fourth corner 54 region of the base 41b. The fourth A fixing end 4a can be located above the fourth B fixing end 4b. The fourth A fixing end 4a and the fourth B fixing end 4b can be isolated from each other using an insulating material. Note that in this paragraph, "above" and "below" are based on... Figure 11a , Figure 11b and Figure 12 In other words, these diagrams are inverted, meaning the object is at the bottom. And... Figure 10a and Figure 10b In the middle, the directions above and below need to be interchanged, that is, in Figure 10a and Figure 10bIn the middle, the top is the object side. Further, in this embodiment, eight SMA lines are respectively fixed between the eight fixed ends. Specifically, the first fixed end A is connected to the fourth fixed end B via an SMA line; for ease of description, this SMA line is designated as line 1a-4b. The first fixed end B is connected to the fourth fixed end A via an SMA line; for ease of description, this SMA line is designated as line 1b-4a. The first fixed end A is connected to the second fixed end B via an SMA line; for ease of description, this SMA line is designated as line 1a-2b. The first fixed end B is connected to the second fixed end A via an SMA line; for ease of description, this SMA line is designated as line 1b-2a. The second fixed end A is connected to the third fixed end B via an SMA line, which is referred to as line 2a-3b for ease of description; the second fixed end B is connected to the third fixed end A via an SMA line, which is referred to as line 2b-3a for ease of description; the third fixed end A is connected to the fourth fixed end B via an SMA line, which is referred to as line 3a-4b for ease of description; the third fixed end B is connected to the fourth fixed end A via an SMA line, which is referred to as line 3b-4a for ease of description. Figure 11a , Figure 11b and Figure 12 To avoid obscuring the image, only two SMA lines are shown, namely the 1a-4b line and the 1b-4a line. Figure 12 The middle section shows all eight SMA lines. See Figure 11 and... Figure 12 In this embodiment, two intersecting SMA lines are arranged on each of the four sides of the second drive unit. By selectively passing current through all or part of the SMA lines, all or part of the SMA lines can be contracted, thereby driving the second movable part to move in the set degrees of freedom.

[0112] Specifically, the methods for driving the second movable part to move can include translational driving on the xoy plane, Rz degree-of-freedom driving, tilting driving (i.e., Rx and Ry degree-of-freedom driving), and z-axis translational driving. In this embodiment, the fixed ends located at the four corners are both the mechanical fixed ends of the SMA wire and the electrical connection terminals of the SMA wire. SMA is the abbreviation for shape memory alloy. When current is passed through the SMA wire, the SMA wire can contract under the action of the shape memory alloy effect, thereby driving the movement of the second movable part. The larger the current passed through, the greater the contraction of the SMA wire. The current passed through the SMA wire can also be called the driving current of the SMA wire. Based on the above driving principle, these four types of driving methods are described below.

[0113] Translation drive on the xoy plane: When lines 1a-2b and 1b-2a contract synchronously (their contraction amounts can be the same) and lines 1a-4b and 1b-4a contract synchronously (their contraction amounts can be the same), the second movable part 42 can be driven to translate along the first diagonal AX1 on the xoy plane; when lines 1a-2b and 1b-2a contract synchronously (their contraction amounts can be the same) and lines 2a-3b and 2b-3a contract synchronously (their contraction amounts can be the same), the second movable part 42 can be driven to translate along the second diagonal AX2 on the xoy plane. In this embodiment, the translation of the first diagonal AX1 and the second diagonal AX2 can be perpendicular to each other, so that the direction of the first diagonal AX1 and the direction of the second diagonal AX2 constitute two components of the displacement vector on the xoy plane. By controlling the magnitude of these two components, a displacement vector in any direction on the xoy plane can be constructed. When the first drive unit drives the lens to translate along the x and y axes, the x-axis and y-axis components of this translational motion determine the direction of movement of the lens in the xoy plane, which is referred to as the first direction for ease of description. By controlling the magnitude of the components of the photosensitive chip along the first diagonal AX1 and the second diagonal AX2, a second direction vector opposite to the first direction can be constructed, thereby enabling the photosensitive chip to move in the xoy plane in the opposite direction to the lens translation direction (i.e., the second direction).

[0114] It should be noted that the SMA line combination driving method used in this application to achieve translation driving of the photosensitive chip in the xoy plane is not limited to the driving method described above. For example, translation in the first diagonal AX1 direction can also be achieved by driving lines 2a-3b and 2b-3a to contract synchronously (the contraction amount can be the same) and lines 3a-4b and 4a-3b to contract synchronously (the contraction amount can be the same); translation in the second diagonal AX2 direction can be achieved by driving lines 1a-4b and 1b-4a to contract synchronously (the contraction amount can be the same) and lines 3a-4b and 4a-3b to contract synchronously (the contraction amount can be the same). In summary, translation in one diagonal direction can be achieved when the four SMA lines on two adjacent sides of the second driving unit contract synchronously. Simultaneously driving translation in two diagonal directions, by different linear combinations of the translation amounts in these two diagonal directions, a displacement vector in any direction on the xoy plane can be constructed, so that the movement direction of the photosensitive chip on the xoy plane is opposite to the movement direction of the lens on the xoy plane.

[0115] Driven by the Rz degree of freedom: When lines 1a-2b and 1b-2a contract synchronously (their contraction amounts can be the same), and lines 3a-4b and 3b-4a contract synchronously (their contraction amounts can be the same), the second movable part can be driven to rotate relative to the second base part in the xoy plane, i.e., rotate around the z-axis. When driving the other four lines, i.e., lines 2a-3b and 2b-3a contract synchronously (their contraction amounts can be the same), and lines 1a-4b and 1b-4a contract synchronously (their contraction amounts can be the same), the movable part can be driven to rotate relative to the second base part in the opposite direction around the z-axis. For example, assuming that when the first set of SMA lines is energized, the second movable part rotates clockwise relative to the second base part around the z-axis, then when the second set of SMA lines is energized, the second movable part rotates counterclockwise relative to the second base part around the z-axis. The first set of SMA lines refers to the 1a-2b line, 1b-2a line, 3a-4b line, and 3b-4a line, while the second set of SMA lines refers to the 1a-4b line, 1b-4a line, 2a-3b line, and 2b-3a line.

[0116] Tilt Drive: Tilt drive, also known as tilt drive, refers to drive in the two rotational degrees of freedom, Rx and Ry. When current is applied to line 1a-2b and it contracts, the second movable part can rotate relative to the second base part in the Ry direction, i.e., around the y-axis. When current is applied to line 1a-4b and it contracts, the second movable part can rotate relative to the second base part in the Rx direction, i.e., around the x-axis. Current can be applied to lines 1a-2b and 1a-4b simultaneously, and the amount of contraction can be the same or different. By applying different amounts of current, the amount of contraction of lines 1a-2b and 1a-4b can be changed, thereby making the displacement vector of the second movable part (i.e., the displacement vector of the photosensitive chip) have different Rx and Ry components. In this embodiment, the tilt drive of the second driving part can be achieved by combining SMA lines to adjust the tilt angle (i.e., tilt) of the photosensitive chip, thereby compensating for the tilt of the image plane of the camera module and improving image quality.

[0117] Z-axis translation drive: When the four SMA lines 1a-2b, 1a-4b, 2b-3a, and 3a-4b contract simultaneously with the same amount of contraction, the second movable part can be driven to translate relative to the second base part in the Z-axis direction. The translation of the second movable part in the Z-axis direction can be combined with the translational degree of freedom of the first drive part in the Z-axis direction, thereby helping to improve the focusing speed and increase the focusing range of the camera module. Specifically, during the focusing process, the first drive part can drive the optical lens to move along the Z-axis, while the second drive part can drive the photosensitive component to move along the Z-axis in the opposite direction (to the direction of lens movement), thereby improving the focusing speed. On the other hand, it can also increase the relative movement distance of the optical lens and the photosensitive chip in the Z-axis direction, thereby increasing the focusing range of the camera module.

[0118] The above describes the implementation methods of translational drive, Rz degree-of-freedom drive, tilt drive (i.e., Rx and Ry degree-of-freedom drive), and z-axis translational drive on the xoy plane with a specific embodiment. However, it should be noted that the implementation methods of this application are not limited to the above embodiments. More generally, in some embodiments of this application, the second driving part is generally rectangular in shape, and its four corner regions include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on the first diagonal of the second driving part, and the second corner and the fourth corner are located on the second diagonal of the second driving part. The second movable part extends outward at the positions of the first corner and the third corner, respectively, to form a first extension part and a third extension part. The two fixed ends of the first corner of the second driving part are disposed in the first extension part, and the two fixed ends of the third corner of the second driving part are disposed in the third extension part. The two fixed ends of the second corner of the second driving part are disposed in the second corner of the second base part, and the two fixed ends of the fourth corner of the second driving part are disposed in the fourth corner of the second base part. For each side of the second drive unit, the two intersecting SMA lines disposed on that side are fixed and electrically connected to the four fixed ends located in the two corner regions of that side.

[0119] In some embodiments, for the degree of freedom of translation in the xoy plane, the translational component of the photosensitive chip in the direction of the first diagonal or the second diagonal can be generated by contracting the two pairs of intersecting SMA lines on the two intersecting sides of the second driving unit. The combination of the translational components in the first and second diagonal directions ensures that the direction of movement of the photosensitive chip in the xoy plane is opposite to the direction of movement of the lens. Grouping the two intersecting sides into one group yields four groups. The contraction of the two pairs (four lines in total) of intersecting SMA lines on any group of sides can generate either a translational component of the photosensitive chip in the direction of the first diagonal or a translational component of the photosensitive chip in the direction of the second diagonal. By shrinking all the intersecting SMA lines on the sides of at least two sets that produce translation components in different diagonal directions (the shrinkage amount corresponding to different translation components can be different), the translation components in the direction of the first diagonal and the translation components in the direction of the second diagonal can be combined to form the translation direction of the photosensitive chip at any angle on the xoy plane.

[0120] Furthermore, in some embodiments, for Rz degree of freedom actuation, the rotation of the photosensitive chip in the Rz direction can be generated by driving the contraction of two pairs of interlaced SMA lines on two opposite sides of the second driving part. The Rz direction is the direction of rotation about the z-axis, which is a coordinate axis parallel to the optical axis.

[0121] Furthermore, in some embodiments, tilting can generate a rotational component of the photosensitive chip in the Rx or Ry direction by driving a single SMA line on a single side of the second driving unit to contract; wherein the Rx direction is the direction of rotation about the x-axis and the Ry direction is the direction of rotation about the y-axis.

[0122] Furthermore, in some embodiments, for translational drive in the z-axis direction, the photosensitive chip can be translated in the z-axis direction by driving the first set of SMA lines and the second set of SMA lines of the second driving part to contract; and the translational direction of the photosensitive chip in the z-axis direction is opposite to the translational direction of the lens in the z-axis direction, where the z-axis is a coordinate axis parallel to the optical axis; wherein, the first set of SMA lines consists of two SMA lines having a first common fixed end, which are respectively located on two intersecting sides of the second driving part; the second set of SMA lines consists of two other SMA lines having a second common fixed end, which are located on two other intersecting sides of the second driving part; and both the first common fixed end and the second common fixed end are one of the eight fixed ends of the second driving part, and the first common fixed end and the second common fixed end are located at the same height.

[0123] It should be noted that when tilt adjustment is not required, the four Class A fixed ends and the four Class B fixed ends mentioned above can be at different heights. For example, when the second drive unit only needs to achieve translation in the xoy plane, it is sufficient that the two Class A fixed ends on the same diagonal are at the same height, and the two Class B fixed ends on the same diagonal are at the same height. Specifically, the Class A fixed ends at the first and third corners are at the same height, and the Class A fixed ends at the second and fourth corners are at the same height. However, the two Class A fixed ends in adjacent corner areas (i.e., two corner areas not on the same diagonal) do not need to be at the same height, and the two Class B fixed ends in adjacent corner areas (i.e., two corner areas not on the same diagonal) also do not need to be at the same height.

[0124] It should be noted that in the above embodiments, all eight fixed ends are arranged as follows: in any of the corner regions, the two fixed ends are arranged along the optical axis. In this case, the two intersecting SMA lines are approximately located on the xoz plane or yoz plane (the z-axis is a coordinate axis parallel to the optical axis), that is, the two fixed ends in the corner region are arranged vertically (for example, one fixed end is located directly above the other fixed end). In this article, the two intersecting SMA lines mean that the projections of these two SMA lines on the xoz plane or yoz plane intersect, but in actual manufacturing, these two SMA lines do not directly contact each other (they are slightly offset to avoid direct contact), so as to avoid mutual interference when the two SMA lines contract, which would lead to a decrease in the accuracy of position adjustment.

[0125] In this configuration, all four fixed ends of any two adjacent corner regions are located in a plane parallel to the xoy plane. For example, in any one corner region, one fixed end is located outside the other. Here, "outside" refers to the side away from the photosensitive center of the photosensitive chip, and "inside" refers to the side facing the photosensitive center of the photosensitive chip. This arrangement effectively utilizes the space of the photosensitive component in the height direction (z-axis direction), thus not increasing the height of the camera module. It also saves space in the x and y axes of the camera module, thereby reducing the lateral size of the camera module. That is, the photosensitive chip can be adjusted in multiple degrees of freedom of movement with a smaller volume. However, it should be noted that the arrangement of the eight fixed ends in this application is not limited to this. In other embodiments of this application, the eight fixed ends can also be arranged as follows: all four fixed ends of any two adjacent corner regions are located in a plane parallel to the xoy plane.

[0126] In some embodiments of this application, the lens and the first driving unit can be assembled into a first assembly first, and the photosensitive component and the second driving unit can be assembled into a second assembly first, and then the first assembly and the second assembly are bonded together based on an active calibration process (AA process).

[0127] Furthermore, in one embodiment of this application, the adhesive used in the AA process can be disposed between the second base portion and the first base portion. Specifically, referring to the reference... Figure 9a and Figure 9bIn this embodiment, a stepped notch 33 can be formed in the edge region of the bottom surface of the first driving part (i.e., the edge region of the bottom surface of the first base part), and the base sidewall 41a of the second base part 41 can extend upward and into the stepped notch 33. Adhesive material for bonding the first assembly and the second assembly can be arranged between the stepped notch 33 and the top surface of the base sidewall 41a. This design helps prevent AA adhesive material from overflowing and contaminating the imaging optical path (AA bonding may require a large amount of adhesive material, thus posing a risk of overflow at the adhesive application location), thereby preventing smudges from appearing in the camera module's photographs.

[0128] Furthermore, in one embodiment of this application, the second base portion may include a base 41b and a base portion sidewall 41a, and the second movable portion 42 may be located below the base (see reference). Figure 10a and Figure 10b In this design, when the first assembly and the second assembly are bonded using the AA process, the photosensitive component 20 mounted on the second movable part 42 can be protected by the base 41b, thereby helping to prevent the AA adhesive from overflowing and contaminating the imaging optical path, and thus preventing the camera module from taking pictures with blemishes. Furthermore, in this embodiment, the adhesive used to bond the first assembly (first base part) and the second assembly (second base part) can also be arranged between the stepped notch 33 and the top surface of the base part sidewall 41a, thereby further preventing the camera module from taking pictures with blemishes caused by the overflow of the AA adhesive.

[0129] Furthermore, in some embodiments of this application, the eight fixed ends used to mount the eight SMA lines can be installed on the surface of the base or on the inner side of the base sidewall.

[0130] Furthermore, in a camera module, the circuit board of the photosensitive component typically includes a rigid circuit board body and a flexible connecting strip. One end of the flexible connecting strip is connected to the circuit board body, and the other end is connected to and conducts power to the motherboard or other components of the electronic device via a connector. In the prior art, the flexible connecting strip of the photosensitive component typically extends from the side of the circuit board body, and the flexible connecting strip is roughly parallel to the surface of the circuit board column. In this arrangement, the flexible connecting strip generates significant resistance to the movement of the circuit board body, which may increase the force required to drive the circuit board body, resulting in insufficient stroke for image stabilization compensation and a decrease in response speed. Moreover, the resistance caused by the connecting strip is irregular, making it difficult for the second drive unit to compensate for this resistance, which may lead to a decrease in the accuracy of image stabilization compensation. Therefore, this embodiment provides a suspended circuit board as the circuit board of the photosensitive component adapted to the second drive unit. This design helps to overcome the above-mentioned defects caused by the connecting strip.

[0131] Figure 13 A three-dimensional schematic diagram of the second driving unit and photosensitive component assembled according to one embodiment of this application is shown. Figure 14 An exploded schematic diagram of a second driving unit and a photosensitive component in one embodiment of this application is shown. Figure 15 A perspective view of a photosensitive component and its suspended circuit board according to one embodiment of this application is shown. (Reference) Figure 13 , Figure 14 and Figure 15 In the camera module of this embodiment, the photosensitive component 20 is connected to the second movable part 42 of the second driving part 40, so the circuit board body 71 can move in the xoy plane under the drive of the second movable part 42. The circuit board 23 of this embodiment is designed as a suspended structure. Specifically, the circuit board 23 includes a rigid circuit board body 71 and a flexible connecting strip 72. The connecting strip 72 may include a third connecting strip 72a and a fourth connecting strip 72b, which can be led out from two opposite sides of the circuit board body 71 (for ease of description, these two opposite sides can be referred to as the first side 74a and the second side 74b) and bent upwards. The bent third connecting strip 72a and the fourth connecting strip 72b can each form a suspension part 75. The suspension part 75 can be connected to the base of the second driving part 40 (or the first driving part 30) to form a suspension structure. This suspension structure allows the base portion to suspend the circuit board body 71 and its various mounted components (i.e., the photosensitive assembly 20) via the bend 73 of the flexible connecting strip 72. Specifically, in one example, the suspension portion 75 may have a through hole (suspension hole 75a), and the second base portion 41 of the second drive portion 40 may have a corresponding hook 75b, which hooks the through hole of the suspension portion 75 to connect the suspension portion 75. In the prior art, the connecting strip and the circuit board body are usually on the same plane, and the deflection of the connecting strip relative to the circuit board body on the same plane will generate greater resistance. In this embodiment, the connection position between the connecting strip 72 and the circuit board body 71 is provided with an upward bend 73, in which case the resistance generated by the connecting strip 72 relative to the circuit board body 71 in the xoy plane (which can be regarded as a horizontal plane) is relatively small.

[0132] Furthermore, in one embodiment of this application, the third connecting strip 72a and the fourth connecting strip 72b may extend along the periphery of the circuit board body 71 and the photosensitive component 20, thereby causing the connecting strip 72 to surround the photosensitive component on at least three sides. Furthermore, the third connecting strip 72a and the fourth connecting strip 72b are interconnected and electrically conductive. The photosensitive component 20 has a first side 74a and a second side 74b positioned corresponding to the circuit board body 71. The first side 74a and the second side 74b are arranged opposite each other (i.e., they do not intersect), while the third side 74c of the photosensitive component 20 intersects both the first side 74a and the second side 74b. The connecting strip 72 may surround the first side 74a, the second side 74b, and the third side 74c of the photosensitive component 20. The third connecting strip 72a extends from the first side 74a of the circuit board body 71 and bends upward to form the bend 73, then extends along the first side 74a of the photosensitive component 20, bends horizontally at a corner, and continues to extend along the third side 74c. The fourth connecting strip 72b extends from the second side 74b of the circuit board body 71 and bends upward to form another bend 73, then extends along the second side 74b of the photosensitive component 20, bends horizontally at a corner, and continues to extend along the third side 74c. The third connecting strip 72a and the fourth connecting strip 72b can join and communicate with each other on the third side 74c, thereby forming a complete connecting strip 72. The three connecting strip segments located on the first side 74a, the second side 74b, and the third side 74c can each have at least one suspension portion 75, and each suspension portion 75 has at least one through hole for connection with the base of the second drive portion 40 (or the first drive portion 30). In this embodiment, the suspension part 75 can suspend the circuit board body 71 through the bending parts 73 located on opposite sides of the circuit board body 71, so that when the circuit board body 71 is driven to move by the second driving part 40, the bending part 73 and the connecting strip 72 can be bent and deformed to meet the movement stroke of the circuit board body 71.

[0133] Furthermore, in one embodiment of this application, the suspension portions 73 located in the three connecting strip sections of the first side 74a, the second side 74b, and the third side 74c can all be reinforced by rigid substrates. For example, a rigid substrate can be attached to a portion of the flexible connecting strip to form the suspension portions 73. Other areas of the flexible connecting strip remain flexible to allow for bending deformation, thus satisfying the movement stroke of the circuit board body 71.

[0134] Furthermore, in one embodiment of this application, the connecting strip section located on the third side 74c may have a rigid suspension portion 75c, which may lead out a fifth connecting strip 76, which may be used to connect the motherboard of an electronic device (e.g., a mobile phone).

[0135] Furthermore, in another embodiment of this application, the suspension portion may also be connected to an outer bracket (not shown in the figure), which is directly or indirectly fixed to the base portion of the second drive portion. In this application, the suspension portion may be fixed to the base portion of the second drive portion via other intermediaries. These intermediaries may be directly or indirectly fixed to the base portion of the second drive portion. The intermediary may have hooks to engage the suspension portion, or the intermediary may be adhered to the suspension portion. The intermediary may be an outer bracket, the base portion of the first drive portion, or other intermediaries.

[0136] Furthermore, in another embodiment of this application, the suspension portion may not have the through hole. In this embodiment, the suspension portion can be fixed to the base portion of the second driving portion (or to the base portion of the first driving portion or the outer bracket) by bonding. Furthermore, in another embodiment of this application, the third connecting strip and the fourth connecting strip can be rigid-flexible composite plates, wherein the portion forming the suspension portion can be made of rigid plate, while the portion connecting the suspension portion and the bent portion formed by upward bending can both be made of flexible plate. Since the suspension portion is directly formed of rigid plate, in this embodiment, the suspension portion does not need to be reinforced with a rigid substrate.

[0137] Furthermore, in one embodiment of this application, the circuit board body, the third connecting strip, and the fourth connecting strip may be composed of a single rigid-flex board.

[0138] Furthermore, still referencing Figure 13 , Figure 14 and Figure 15 In one embodiment of this application, the circuit board may also have a fixing part 76a for fixing the fifth connecting strip 76. This design can prevent the circuit board body 71, the third connecting strip 72a and the fourth connecting strip 72b from being affected by external factors.

[0139] Furthermore, Figure 16a A front view of the suspended circuit board after unfolding is shown in one embodiment of this application; Figure 16b A schematic diagram of the rear of a suspended circuit board according to one embodiment of this application is shown. (See reference) Figure 16a and Figure 16bIn this embodiment, the circuit board 23 can be constructed from a rigid-flex board. The sections of the third connecting strip 72a and the fourth connecting strip 72b located on the third side 74c can be interlocked via connectors 78 and 79 (see reference). Figure 15 The third connecting strip 72a and the fourth connecting strip 72b are connected and fixed, and further electrical connection is achieved. Both the third connecting strip 72a and the fourth connecting strip 72b contain circuitry to lead the circuitry within the circuit board body 71 outwards, and then connect to external circuitry via the fifth connecting strip 76 and its connector 77. Since the third connecting strip 72a and the fourth connecting strip 72b can each lead out a portion of the circuitry through the corresponding upward bend 73, the amount of circuitry required to be led out at each bend 73 can be reduced. This reduces the width of each bend 73, further reducing the resistance of the flexible connecting strip 72 to the movement of the circuit board body 71, and thus reducing the driving force required by the second driving unit 40. It should be noted that in other embodiments of this application, the circuitry of the circuit board body may also be led out through only one bend (e.g., the upward bend of the third connecting strip or the upward bend of the fourth connecting strip).

[0140] Furthermore, Figure 17a This paper shows a front view of the suspended circuit board after it has been unfolded, according to another embodiment of this application. Figure 17b A schematic diagram of the rear of a suspended circuit board according to one embodiment of this application is shown. (See reference) Figure 17a and Figure 17bThe photosensitive component 20 includes a suspended circuit board, which comprises a rigid circuit board body 71 and a flexible connecting strip 72. The connecting strip 72 extends from a first side 74a and a second side 74b of the circuit board body 71 and bends upward to form a bent portion. The top of the bent portion extends horizontally along the periphery of the photosensitive component 20, such that the connecting strip 72 surrounds the first side 74a, the second side 74b, and the third side 74c of the photosensitive component 20. The connecting strips on the first side 74a and the second side 74b each have at least one suspension portion 75, which is fixed to the second base portion 41 of the second drive portion 40 or fixed to the second base portion 41 through an intermediary. The photosensitive component 20 has a first side 74a and a second side 74b that are aligned with the circuit board body 71. The first side 74a and the second side 74b are arranged opposite each other, and the third side 74c intersects with both the first side 74a and the second side 74b. The suspension portion 75 has a suspension hole 75a, and the second base portion 41 or the intermediary has a hook that hooks onto the suspension hole 75a. A portion of the connecting strip is reinforced with a rigid substrate to form the suspension portion (in a modified embodiment, the suspended circuit board can also be made of a rigid-flex board, wherein the circuit board body and the suspension portion are formed by the rigid portion of the rigid-flex board, and the bent portion and the connecting strip section connecting the plurality of suspension portions are formed by the flexible portion of the rigid-flex board). Unlike the previous embodiment, in this embodiment, the third side surface 74c does not have a suspension portion; that is, the suspension portion 75 and the suspension hole 75a are only provided on the first side surface 74a and the second side surface 74b. Alternatively, in this embodiment, the connecting strip of the third side surface 74c is fixed to the second base portion 41 by adhesive (or fixed to the second base portion 41 by an intermediary). Specifically, in this embodiment, the connecting strip may include a third connecting strip 72a and a fourth connecting strip 72b. The third connecting strip 72a extends from the first side 74a of the circuit board body 71 and bends upward to form a bend 73, then extends along the first side 74a of the photosensitive component 20, bends horizontally at a corner, and continues to extend along the third side 74c. The fourth connecting strip 72b extends from the second side 74b of the circuit board body 71 and bends upward to form another bend, then extends along the second side 74b of the photosensitive component 20, bends horizontally at a corner, and continues to extend along the third side 74c. The third connecting strip 72a and the fourth connecting strip 72b are joined and interconnected on the third side 74c (the connection and interconnection can be achieved by fastening with a male and female connector or by soldering). Further, Figure 18An exploded perspective view of a camera module based on a suspended circuit board according to one embodiment of this application is shown. Figure 19 A perspective view of a suspended circuit board-based camera module with a housing, according to one embodiment of this application, is shown. (Referring to the reference...) Figure 17a , Figure 17b , Figure 18 and Figure 19 In this embodiment, the camera module further includes a first connecting strip 84 electrically connected to the first driving unit. The first connecting strip 84 extends from the top region of the first driving unit, then bends downward and engages with the third connecting strip 72a or the fourth connecting strip 72b on the third side 74c, thus establishing communication. The camera module also includes a housing 81 and a module base 80. The inner side of the housing 81 has a receiving groove 82 for accommodating the engagement portion of the third side 74c. The engagement portion is a joint 83 where the first connecting strip, the third connecting strip 72a, and the fourth connecting strip 72b engage with each other. Adhesive is injected into the receiving groove 82 to fix the first connecting strip, the third connecting strip 72a, and the fourth connecting strip 72b to the housing 81. The module base 80 and the housing 81 can be snapped together to encapsulate the first optical driving assembly 85 and the second optical driving assembly 86 inside the base 80 and the housing 81 (see reference). Figure 18 and Figure 19 Furthermore, the connecting strip located on the third side 74c is also connected to a fifth connecting strip 76, which has an external connector 77; the suspended circuit board may also have a fixing part 76a for fixing the fifth connecting strip 76. The first optical driving assembly 85 includes a first driving part and an optical lens, the optical lens being mounted in a first movable part of the first driving part. The second optical driving assembly 86 includes a second driving part and a photosensitive assembly, the photosensitive assembly being fixed to a second movable part of the second driving part.

[0141] During assembly, the first driving unit and optical lens are first assembled into a first optical driving assembly 85, and the second driving unit and photosensitive component are assembled into a second optical driving assembly 86. Then, the relative positions of the optical lens and photosensitive chip are adjusted using an active calibration process, and the first driving unit (first base unit) and the second driving unit (second base unit) are bonded together with adhesive. Next, the bonded first optical driving assembly 85 and second optical driving assembly 86 are assembled from bottom to top into the through-hole of the module housing 81, and then the module base 80 is attached to the module housing 81. Finally, adhesive is poured into the receiving groove 82 of the housing to fix the first optical driving assembly 85, the second optical driving assembly 86, and the module housing 81. Simultaneously, the adhesive poured into the receiving groove 82 can also fix the joint of the first connecting strip 84, the third connecting strip 72a, and the fourth connecting strip 72b to the module housing 81, the first base unit, or the second base unit.

[0142] In the above embodiments, each side of the second drive unit is configured with a pair of staggered SMA lines to achieve multi-axis drive, but this is not the only way to set up SMA in this application (i.e., SMA mounting method). The following will combine... Figure 9a ,picture Figure 20-23 Another type of SMA setup is described.

[0143] refer to Figure 9a In another embodiment of this application, the center of the first driving part has a receiving hole 30a adapted to the outer surface of the optical lens 10, so as to install the optical lens 10 in the receiving hole 30a. The second driving part 40 is located below the first driving part 30. The second driving part 40 includes a second base part 41 and a second movable part 42. In this embodiment, the second base part 41 can be an annular frame structure. Specifically, the frame structure can be formed by an annular base part sidewall 41a, which can surround the second movable part 42. The top surface of the base part sidewall 41a can be bonded to the first driving part 30 by a second adhesive material 23b to fix the second driving part 40 and the first driving part 30 together. Note that Figure 9aOnly the overall shape of the first drive unit 30 is shown; the first base unit and the first movable part are not shown. Typically, the first base unit is located around the periphery of the first movable part. In this embodiment, a stepped notch 33 can be formed in the edge region of the bottom surface of the first drive unit (i.e., the edge region of the bottom surface of the first base unit), and the base sidewall 41a of the second base unit 41 can extend upwards and into the stepped notch 33. This design enhances the structural strength of the second base unit 41, allowing for more reliable mounting of the SMA cable and its suspended second movable part 42 and photosensitive component 20. Furthermore, this design also improves the connection stiffness between the second base unit 41 and the first drive unit 30, resulting in more stable and precise movement of the second movable part 42. Figure 20 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Referring to the reference...) Figure 9a and Figure 20 In this embodiment, the bottom surface of the second movable part 42 can be bonded to the circuit board 23 of the photosensitive component 20 via the first adhesive material 23a, thereby fixing the photosensitive component 20 and the second movable part 42 together. A gap exists between the outer surface of the second movable part 42 and the inner surface of the second base part 41 (i.e., the inner surface of the base part sidewall 41a), which can accommodate the SMA wire 48 and the spring piece 47 supporting the second movable part. Specifically, the second base part 41 and the second movable part 42 can be movably connected via the spring piece 47 (which can also be replaced by other elastic connecting parts). The SMA wire can also be connected between the second base part 41 and the second movable part 42 and provide driving force for the movement of the second movable part 42.

[0144] Furthermore, still referencing Figure 20 In one embodiment of this application, the second movable part 42 may include a movable part body 42a, which is generally flat and has a through hole (i.e., a light-transmitting hole) in its center to allow light used for imaging to pass through. The outer edge region of the bottom surface of the movable part body 42a extends downward to form a movable part sidewall 42b, the bottom surface of which is bonded to the upper surface of the circuit board 23. A receiving cavity is formed between the inner surface of the movable part sidewall 42b, the bottom surface of the movable part body 42a, the upper surface of the circuit board 23, and the outer surface of the lens mount 22. This receiving cavity can be used to arrange electronic components 29. The electronic components 29 include resistors, capacitors, etc. These electronic components 29, together with the wiring in the circuit board 23, can constitute a circuit board circuit (i.e., the various functional circuits required by the camera module).

[0145] Furthermore, still referencing Figure 20In one embodiment of this application, the inner edge of the movable part body has a stepped notch 43 to avoid the optical lens 10, thereby allowing the optical lens 10 to have a larger range of motion (i.e., a larger focusing travel or image stabilization travel).

[0146] Furthermore, Figure 21 A top view schematic diagram of the second drive unit in one embodiment of this application is shown. (Reference) Figure 21 In this embodiment, the second base 41 may include a base base 41b and a base sidewall 41a mounted on the base base 41b (refer to reference). Figure 22The end face of the base sidewall 41a can be connected to the edge region of the base base 41b, or the base sidewall 41a and the base base 41b can be integrally formed. The photosensitive component can be fixed to the second movable part 42. The second base part 41 and the second movable part 42 are movably connected by an elastic connecting part (e.g., a spring 47). The second drive part 40 has four sides, wherein at least one SMA line 48 is arranged on at least one side of the second drive part 40. Each SMA line 48 is located in the gap between the outer side of the second movable part 42 and the inner side of the second base part 41. The two ends of each SMA line 48 are fixed and electrically connected to two fixed ends located on the second base part 41 (e.g., the first fixed end A and the second fixed end B, or the third fixed end C and the fourth fixed end D). The two fixed ends are located in two adjacent corner areas of the second base part (e.g., the first corner and the second corner, or the second corner and the third corner; wherein the first corner and the third corner are diagonal to each other, and the second fixed end B and the third fixed end C can both be located at the second corner, that is, the second corner is a common corner). The outer surface of the second movable part 42 has an extension 44, which contacts the waist 48a of the SMA line 48. Under the elastic action of the elastic connecting part (e.g., spring 47), the extension 44 presses against the waist 480 of the SMA line 48 along the x-axis or y-axis direction, causing it to bend. The second driving part 40 causes the SMA line 48 to contract by passing current through it, thereby moving the photosensitive chip in the x-axis or y-axis direction. On the other hand, in this embodiment, the first driving part is adapted to drive the lens to translate in the x-axis and y-axis directions. The lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions; wherein the x-axis and y-axis are coordinate axes perpendicular to the optical axis of the camera module, and the x-axis and y-axis are perpendicular to each other. Further, in this embodiment, the SMA line 48 includes an x-axis driving SMA line and a y-axis driving SMA line; at least one x-axis driving SMA line 48a is arranged on at least one side 45a of the second driving part perpendicular to the x-axis. The second driving part causes the x-axis driving SMA line 48a to contract by passing current through it, thereby moving the second movable part 42 in the x-axis direction, and thus driving the photosensitive chip to move in the x-axis direction. Also, at least one y-axis driving SMA line 48b is arranged on at least one side 45b of the second driving part 40 perpendicular to the y-axis. The second driving part 40 causes the y-axis driving SMA line 48b to contract by passing current through it, thereby moving the second movable part 42 in the y-axis direction, and thus driving the photosensitive chip to move in the y-axis direction.

[0147] In some embodiments of this application, the extension may be configured as a hook, pulley, or arc track.

[0148] Still referencing Figure 21 In some embodiments of this application, the second base portion 40 has four corner regions, three of which have the aforementioned fixed ends, and the fixed end in one of the corner regions fixes both the x-axis drive SMA line 48a and the y-axis drive SMA line 48b. The second drive portion 40 has a first side 46a, a second side 46b intersecting the first side 46a, a third side 46c opposite to the first side 46a, and a fourth side 46d opposite to the second side 46b; the x-axis drive SMA line 45a is only disposed on the first side 46a, and the y-axis drive SMA line 45b is only disposed on the second side 46b. Further, in one embodiment of this application, the second drive portion may have only one x-axis drive SMA line and one y-axis drive SMA line. This design can reduce the number of SMA lines, which helps to reduce the lateral dimension of the camera module. Here, the lateral dimension can also be called the radial dimension, that is, the dimension in the direction perpendicular to the optical axis of the camera module.

[0149] Furthermore, in some embodiments of this application, in the second driving part, the gap between the inner side surface of the second base part and the outer side surface of the second movable part located on the first side (i.e., the gap between the base part sidewall 41a on the first side and the second movable part 42) is larger than the gap between the inner side surface of the second base part and the outer side surface of the second movable part located on the third side (i.e., the gap between the base part sidewall 41a on the third side and the second movable part 42). The gap between the second base part and the second movable part located on the second side is larger than the gap between the second base part and the second movable part located on the fourth side. Furthermore, Figure 22 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Reference) Figure 22 In this embodiment, the photosensitive component 20 may include a photosensitive chip, a circuit board, and electronic components 26 mounted on the surface of the circuit board. The photosensitive chip 21 is mounted in the central region of the circuit board 23, and the electronic components 26 are located outside the photosensitive chip 21. Furthermore, all electronic components 26 are located on the first side 46a and / or the second side 46b (i.e., the side where the x-axis drive SMA line and / or y-axis drive SMA line are provided). Figure 23 It shows the basis Figure 22 A cross-sectional view of a portion of the edge area of ​​the camera module's circuit board. (Reference) Figure 23In this embodiment, the circuit board 23 of the photosensitive component has four edge regions: a first edge region 46a' located on the first side 46a, a second edge region located on the second side 46b, a third edge region 46c' located on the third side 46c, and a fourth edge region located on the fourth side 46d. The width of the third edge region is smaller than the width of the first edge region; the width of the fourth edge region is smaller than the width of the first edge region; wherein, the width of the edge region is the distance from the edge of the photosensitive chip to the edge of the circuit board. In this embodiment, electronic components can be concentrated on the first and second sides of the circuit board, thereby effectively utilizing the lateral space used for setting SMA lines, reducing the lateral space occupied by the circuit board and the second driving part on the third and fourth sides, thereby helping to reduce the lateral size of the camera module. Here, the lateral size can also be called the radial size, that is, the size in the direction perpendicular to the optical axis of the camera module.

[0150] Furthermore, in one embodiment of this application, in the second driving part, the extension and the fixed end are at different heights, where the height is the position in the z-axis direction, and the z-axis is a coordinate axis perpendicular to the x-axis and the y-axis. Optionally, in this embodiment, the extension can be higher than the fixed end (meaning the contact point between the extension and the SMA line is higher than the contact point between the fixed end and the SMA line). This allows the SMA line to exert a downward (downward along the z-axis) component of the force on the extension. This downward component, in conjunction with the spring (or bending element), can better restrict the movement of the second movable part in the z-axis direction, i.e., it can more reliably confine the anti-shake movement of the second movable part within the xoy plane. In contrast, if only a spring is used to restrict the movement of the second movable part in the z-axis direction, it sometimes cannot prevent the second movable part from deviating in the z-axis direction.

[0151] Furthermore, in a camera module, the circuit board of the photosensitive component typically includes a rigid circuit board body and a flexible connecting strip. One end of the flexible connecting strip is connected to the circuit board body, and the other end is connected to and conducts power to the motherboard or other components of the electronic device via a connector. In the prior art, the flexible connecting strip of the photosensitive component typically extends from the side of the circuit board body, and the flexible connecting strip is roughly parallel to the surface of the circuit board column. In this arrangement, the flexible connecting strip generates significant resistance to the movement of the circuit board body, which may increase the force required to drive the circuit board body, resulting in insufficient stroke for image stabilization compensation and a decrease in response speed. Moreover, the resistance caused by the connecting strip is irregular, making it difficult for the second drive unit to compensate for this resistance, which may lead to a decrease in the accuracy of image stabilization compensation. Therefore, this application also provides a suspended circuit board as the circuit board of the photosensitive component adapted to the second drive unit. This design will help overcome the above-mentioned defects caused by the connecting strip. This suspended circuit board can be applied to... Figure 20-23 In the SMA mounting embodiment shown, the various technical details of the suspended circuit board have been combined with the preceding text. Figure 13-19 The details will not be elaborated here.

[0152] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. An optical image stabilization camera module, characterized in that, include: Lens; A photosensitive component, which has a photosensitive chip; A first driving unit is adapted to mount the lens and drive the lens to translate in the x-axis and y-axis directions; as well as The second drive unit includes a second base unit and a second movable unit. The second base unit and the second movable unit are movably connected by an elastic connecting part. The second drive unit has four sides, each side having two intersecting SMA lines. The two ends of each SMA line are respectively connected to a fixed end of the second base unit and a fixed end of the second movable unit. Each fixed end is located in a corner area of ​​the second base unit or the second movable unit. The photosensitive component is fixed to the second movable part, which is adapted to move the photosensitive chip on the xoy plane under the drive of the SMA line. The lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. The x-axis and y-axis are coordinate axes perpendicular to the optical axis of the camera module, and are mutually perpendicular. The xoy plane is the plane formed by the x-axis and y-axis. The photosensitive component includes a suspended circuit board, which comprises a rigid circuit board body and a flexible connecting strip. The connecting strip extends from a first side and a second side of the circuit board body. The photosensitive component is extended and bent upwards to form a bend, the top of which extends horizontally along the periphery of the photosensitive component, such that the connecting strip surrounds the first, second, and third sides of the photosensitive component, and the connecting strips on the first and second sides each have at least one suspension portion, which is fixed to the second base portion of the second drive portion or fixed to the second base portion through an intermediary; wherein, the photosensitive component has a first side and a second side that are aligned with the position of the circuit board body, the first and second sides are arranged opposite to each other, and the third side intersects with both the first and second sides.

2. The optical image stabilization camera module according to claim 1, characterized in that, The second drive unit has four corner regions, each corner region is provided with two fixed ends, and the two ends of each SMA line are respectively fixed and electrically connected to the fixed ends of the two adjacent corner regions.

3. The optical image stabilization camera module according to claim 2, characterized in that, In any of the corner regions, the two fixed ends are arranged along the optical axis.

4. The optical image stabilization camera module according to claim 2, characterized in that, All four fixed ends of any two adjacent corner regions are located in a plane parallel to the xoy plane.

5. The optical image stabilization camera module according to claim 2, characterized in that, Each of the two fixed ends in each corner region includes a type A fixed end and a type B fixed end, wherein the type A fixed end and the type B fixed end are at different heights; the type A fixed ends in two diagonally opposite corner regions are at the same height, and the type B fixed ends in two diagonally opposite corner regions are also at the same height; each side of the second drive unit is provided with two SMA lines, wherein each SMA line is connected to a type A fixed end and a type B fixed end in an adjacent corner region at its two ends, thereby causing the two SMA lines to intersect each other.

6. The optical image stabilization camera module according to claim 5, characterized in that, The four Class A fixed ends of the four corner regions are at the same height; and the four Class B fixed ends of the four corner regions are at the same height.

7. The optical image stabilization camera module according to claim 6, characterized in that, The four corner regions include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on one diagonal of the second driving part, and the second corner and the fourth corner are located on the other diagonal of the second driving part; the second movable part extends outward at the positions of the first corner and the third corner respectively to form a first extension and a third extension; the first extension is provided with a first A fixed end and a first B fixed end at different heights, and the third extension is provided with a third A fixed end and a third B fixed end at different heights; The second base is provided with a second A fixed end and a second B fixed end at different heights at the second corner position; the second base is provided with a fourth A fixed end and a fourth B fixed end at different heights at the fourth corner position. The first A-fixed end, the second A-fixed end, the third A-fixed end, and the fourth A-fixed end all belong to the A-type fixed end; the first B-fixed end, the second B-fixed end, the third B-fixed end, and the fourth B-fixed end all belong to the B-type fixed end.

8. The optical image stabilization camera module according to claim 7, characterized in that, The second movable part also has notches at the second corner and the fourth corner to avoid the fixed end provided on the second base part.

9. The optical image stabilization camera module according to claim 6, characterized in that, The Class A fixing end and the Class B fixing end, located in the same corner area, are stacked and separated by an insulating material.

10. The optical image stabilization camera module according to claim 7, characterized in that, The second movable part is also adapted to drive the photosensitive chip to move in a direction of rotation about the z-axis under the drive of the SMA line; wherein the z-axis is a coordinate axis parallel to the optical axis.

11. The optical image stabilization camera module according to claim 7, characterized in that, The second movable part is also adapted to drive the photosensitive chip to move in a direction of translation along the z-axis under the drive of the SMA line; wherein the z-axis is a coordinate axis parallel to the optical axis.

12. The optical image stabilization camera module according to claim 3, characterized in that, The four corner regions include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on the first diagonal of the second drive unit, and the second corner and the fourth corner are located on the second diagonal of the second drive unit; The second movable part extends outward at the first corner and the third corner positions respectively, forming a first extension portion and a third extension portion; The two fixed ends of the first corner of the second driving part are disposed on the first extension part, and the two fixed ends of the third corner of the second driving part are disposed on the third extension part; The two fixed ends of the second corner of the second driving part are disposed at the second corner of the second base part, and the two fixed ends of the fourth corner of the second driving part are disposed at the fourth corner of the second base part; For each side of the second drive unit, the two intersecting SMA lines disposed on that side are fixed and electrically connected to the four fixed ends located in the two corner regions of that side; Specifically, by driving the two pairs of intersecting SMA lines on the two intersecting sides of the second driving unit to contract, a translation component of the photosensitive chip in the direction of the first diagonal or the direction of the second diagonal is generated; the combination of the translation component in the direction of the first diagonal and the translation component in the direction of the second diagonal makes the moving direction of the photosensitive chip in the xoy plane opposite to the moving direction of the lens.

13. The optical image stabilization camera module according to claim 12, characterized in that, The photosensitive chip is rotated in the Rz direction by driving the two pairs of interlaced SMA lines on opposite sides of the second driving unit to contract. The Rz direction is the direction of rotation about the z-axis, which is a coordinate axis parallel to the optical axis.

14. The optical image stabilization camera module according to claim 12, characterized in that, The rotational component of the photosensitive chip in the Rx or Ry direction is generated by driving the contraction of a single SMA line on a single side of the second driving unit; wherein the Rx direction is the direction of rotation about the x-axis and the Ry direction is the direction of rotation about the y-axis.

15. The optical image stabilization camera module according to claim 12, characterized in that, The photosensitive chip is translated in the z-axis direction by driving the first set of SMA lines and the second set of SMA lines of the second driving unit to contract; and the translation direction of the photosensitive chip in the z-axis direction is opposite to the translation direction of the lens in the z-axis direction, where the z-axis is a coordinate axis parallel to the optical axis. The first group of SMA lines consists of two SMA lines having a first common fixed end, which are located on two intersecting sides of the second drive unit. The second group of SMA lines consists of two more SMA lines having a second common fixed end, which are located on two other intersecting sides of the second drive unit. Furthermore, both the first common fixed end and the second common fixed end are one of the eight fixed ends of the second drive unit, and both are located at the same height.

16. The optical image stabilization camera module according to claim 1, characterized in that, The first driving part includes a first base part and a first movable part, and the second base part is fixed to the first base part.

17. The optical image stabilization camera module according to claim 16, characterized in that, The first base part is located around the first movable part; the second base part includes a base part sidewall and a base, the bottom surface of the base part sidewall is connected to the base, and the top surface of the base part sidewall is connected to the first base part.

18. The optical image stabilization camera module according to claim 17, characterized in that, A stepped notch is formed at the edge of the bottom surface of the first base part, and the sidewall of the base part extends upward and into the stepped notch, and connects with the first base part.

19. The optical image stabilization camera module according to claim 16, characterized in that, The second movable part includes a movable part body, which is flat and has a light-transmitting hole in the center; the outer edge region of the bottom surface of the movable part body extends downward to form a movable part sidewall.

20. The optical image stabilization camera module according to claim 19, characterized in that, The photosensitive component includes a photosensitive chip, a circuit board, a lens mount, and a filter; the photosensitive chip is mounted on the upper surface of the circuit board, the lens mount is mounted on the upper surface of the circuit board and surrounds the photosensitive chip, and the filter is mounted on the lens mount. The bottom surface of the movable part sidewall is bonded to the upper surface of the circuit board of the photosensitive component; an accommodating cavity is formed between the inner side surface of the movable part sidewall, the bottom surface of the movable part body, the upper surface of the circuit board and the outer side surface of the mirror mount, and electronic components are arranged in the accommodating cavity.

21. The optical image stabilization camera module according to claim 19, characterized in that, The inner edge region of the movable part has a stepped notch facing the object side to avoid part of the optical lens structure.

22. The optical image stabilization camera module according to claim 1, characterized in that, The second base is fixed to the first drive unit. The second base includes a base sidewall that surrounds the second movable part. There is a gap between the base sidewall and the second movable part for accommodating the SMA line.

23. The optical image stabilization camera module according to claim 1, characterized in that, The suspension part has a suspension hole, and the second base part or the intermediate part has a hook that hooks onto the suspension hole.

24. The optical image stabilization camera module according to claim 1, characterized in that, A section of the connecting strip is reinforced by attaching a rigid substrate to form the suspension portion.

25. The optical image stabilization camera module according to claim 1, characterized in that, The suspended circuit board is made of a rigid-flex PCB.

26. The optical image stabilization camera module according to claim 25, characterized in that, The circuit board body and the suspension portion are formed by the rigid portion of the rigid-flex board, and the bending portion and the connecting strip section connecting the plurality of suspension portions are formed by the flexible portion of the rigid-flex board.

27. The optical image stabilization camera module according to claim 26, characterized in that, The connecting strip includes a third connecting strip and a fourth connecting strip. The third connecting strip extends from the first side of the circuit board body and bends upward to form a bend, then extends along the first side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The fourth connecting strip extends from the second side of the circuit board body and bends upward to form another bend, then extends along the second side of the photosensitive component, bends horizontally at a corner, and continues to extend along the third side. The third connecting strip and the fourth connecting strip join together on the third side and are interconnected.

28. The optical image stabilization camera module according to claim 27, characterized in that, The camera module also includes a first connecting strip electrically connected to the first driving unit. The first connecting strip extends from the top region of the first driving unit, then bends downward and engages with the third connecting strip or the fourth connecting strip on the third side and conducts through it.

29. The optical image stabilization camera module according to claim 28, characterized in that, The camera module also includes a housing, the inner side of which has a receiving groove for accommodating the joint portion of the third side; wherein the joint portion is a joint portion in which the first connecting strip, the third connecting strip and the fourth connecting strip engage with each other; the receiving groove is filled with adhesive to fix the first connecting strip, the third connecting strip and the fourth connecting strip to the housing.

30. The optical image stabilization camera module according to claim 27, characterized in that, The connecting strip located on the third side is also connected to a fifth connecting strip, which has a connector for external connection; the suspended circuit board also has a fixing part for fixing the fifth connecting strip.

31. An optical image stabilization camera module, characterized in that, include: Lens; A photosensitive component, which has a photosensitive chip; A first driving unit is adapted to mount the lens and drive the lens to translate in the x-axis and y-axis directions; as well as The second drive unit includes a second base unit and a second movable unit. The second base unit and the second movable unit are movably connected by an elastic connecting part. The second drive unit has four sides, each side having two intersecting SMA lines. The two ends of each SMA line are respectively connected to a fixed end of the second base unit and a fixed end of the second movable unit. Each fixed end is located in a corner area of ​​the second base unit or the second movable unit. The photosensitive component is fixed to the second movable part, which is adapted to drive the photosensitive chip to move on the xoy plane under the drive of the SMA line. The lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. The x-axis and y-axis are coordinate axes perpendicular to the optical axis of the camera module, and are mutually perpendicular. The xoy plane is the plane formed by the x-axis and y-axis. Based on the detected tilt angle 'a' of the camera module, the lens movement distance 'b' driven by the first driving part and the photosensitive chip movement distance 'c' driven by the second driving part are determined. The lens movement distance 'b', the photosensitive chip movement distance 'c', and the image-side focal length 'f' of the camera module satisfy the following relationship: a = arctan(b / f) + arctan(c / f).

32. The optical image stabilization camera module according to claim 31, characterized in that, It also includes a drive logic module, which is used to maintain the ratio of the lens movement distance b to the photosensitive chip movement distance c at a preset fixed ratio.

33. The optical image stabilization camera module according to claim 31, characterized in that, It also includes a drive logic module with a stabilization threshold K. This drive logic module is used to maintain the ratio of the lens movement distance b to the image sensor movement distance c at a preset fixed ratio when the tilt angle a is less than or equal to the stabilization threshold K, and to ensure that the image sensor movement distance c reaches its maximum travel value c when the tilt angle a is greater than the stabilization threshold K. max The lens movement distance b is based on the relationship b = tan(a / f) - c max Obtained through calculation.

34. The optical image stabilization camera module according to claim 32 or 33, characterized in that, The preset fixed ratio of the lens movement distance and the image sensor movement distance is set according to the weight of the lens, the driving force of the first drive unit, the weight of the image sensor or image sensor assembly, and the driving force of the second drive unit, so that the lens and the image sensor move to their respective image stabilization target positions at the same time.

35. An optical image stabilization camera module, characterized in that, include: Lens; A photosensitive component, which has a photosensitive chip; A first driving unit is adapted to mount the lens and drive the lens to translate in the x-axis or y-axis direction; as well as The second driving part includes a second base part and a second movable part. The photosensitive component is fixed to the second movable part. The second base part and the second movable part are movably connected by an elastic connecting part. The second driving part has four sides. At least one SMA line is arranged on at least one side of the second driving part. Each SMA line is located in the gap between the second movable part and the second base part. Both ends of the SMA line are fixed and electrically connected to two fixed ends located in two adjacent corner regions of the second base part. The outer surface of the second movable part has an extension that contacts the waist of the SMA line. Under the elastic action of the elastic connection part, the extension bends the SMA line along the x-axis or y-axis direction at its waist. The second driving part contracts the SMA line by passing current through it, thereby moving the photosensitive chip in the x-axis or y-axis direction. Furthermore, the lens and the photosensitive chip are configured to... The second driving part is driven by time and moves in the opposite direction; wherein the x-axis and the y-axis are coordinate axes perpendicular to the optical axis of the camera module, and the x-axis and the y-axis are perpendicular to each other; wherein the SMA line includes an x-axis driven SMA line and a y-axis driven SMA line; the second driving part has a first side, a second side intersecting the first side, a third side opposite to the first side, and a fourth side opposite to the second side; wherein the x-axis driven SMA line is only provided on the first side, and the y-axis driven SMA line is only provided on the second side; wherein in the second driving part, the gap between the inner surface of the second base part and the outer surface of the second movable part located on the first side is greater than the gap between the inner surface of the second base part and the outer surface of the second movable part located on the third side.

36. The optical image stabilization camera module according to claim 35, characterized in that, The first driving unit is adapted to drive the lens to translate in the x-axis and y-axis directions; At least one x-axis drive SMA line is arranged on at least one side of the second driving unit perpendicular to the x-axis. The second driving unit causes the x-axis drive SMA line to retract by passing current through it, thereby moving the second movable part in the x-axis direction and thus driving the photosensitive chip to move in the x-axis direction. At least one side of the second driving unit perpendicular to the y-axis is provided with at least one y-axis driving SMA line. The second driving unit causes the y-axis driving SMA line to contract by passing current through it, thereby moving the second movable part in the y-axis direction and driving the photosensitive chip to move in the y-axis direction.

37. The optical image stabilization camera module according to claim 35, characterized in that, The extension is configured as a hook, pulley, or arc track.

38. The optical image stabilization camera module according to claim 35, characterized in that, The second base has four corner regions, three of which have the fixed ends, and the fixed end in one of the corner regions fixes both the x-axis drive SMA line and the y-axis drive SMA line.

39. The optical image stabilization camera module according to claim 35, characterized in that, The second drive unit is provided with only one x-axis drive SMA line and one y-axis drive SMA line.

40. The optical image stabilization camera module according to claim 35, characterized in that, In the second driving part, the gap between the inner side of the second base part and the outer side of the second movable part located on the second side is greater than the gap between the inner side of the second base part and the outer side of the second movable part located on the fourth side.

41. The optical image stabilization camera module according to claim 40, characterized in that, The photosensitive assembly further includes a circuit board and electronic components mounted on the surface of the circuit board. The photosensitive chip is mounted in the central area of ​​the circuit board, and the electronic components are located outside the photosensitive chip. All electronic components are located on the first side and / or the second side.

42. The optical image stabilization camera module according to claim 41, characterized in that, In the photosensitive component, the circuit board has four edge regions: a first edge region located on the first side, a second edge region located on the second side, a third edge region located on the third side, and a fourth edge region located on the fourth side.

43. The optical image stabilization camera module according to claim 42, characterized in that, The width of the third edge region is less than the width of the first edge region; the width of the fourth edge region is less than the width of the first edge region; wherein, the width of the edge region is the distance from the edge of the photosensitive chip to the edge of the circuit board.

44. The optical image stabilization camera module according to claim 35, characterized in that, The extension and the fixed end are at different heights, where the height is the position in the z-axis direction, and the z-axis is a coordinate axis perpendicular to the x-axis and the y-axis.

45. The optical image stabilization camera module according to claim 35, characterized in that, The first driving part includes a first base part and a first movable part, and the second base part is fixed to the first base part.

46. ​​The optical image stabilization camera module according to claim 45, characterized in that, The first base part is located around the first movable part; the second base part includes a base part sidewall and a base, the bottom surface of the base part sidewall is connected to the base, and the top surface of the base part sidewall is connected to the first base part.

47. The optical image stabilization camera module according to claim 46, characterized in that, A stepped notch is formed at the edge of the bottom surface of the first base part, and the sidewall of the base part extends upward and into the stepped notch, and connects with the first base part.

48. The optical image stabilization camera module according to claim 45, characterized in that, The second movable part includes a movable part body, which is flat and has a light-transmitting hole in the center; the outer edge region of the bottom surface of the movable part body extends downward to form a movable part sidewall.

49. The optical image stabilization camera module according to claim 48, characterized in that, The photosensitive component includes a photosensitive chip, a circuit board, a lens mount, and a filter; the photosensitive chip is mounted on the upper surface of the circuit board, the lens mount is mounted on the upper surface of the circuit board and surrounds the photosensitive chip, and the filter is mounted on the lens mount. The bottom surface of the movable part sidewall is bonded to the upper surface of the circuit board of the photosensitive component; an accommodating cavity is formed between the inner side surface of the movable part sidewall, the bottom surface of the movable part body, the upper surface of the circuit board and the outer side surface of the mirror mount, and electronic components are arranged in the accommodating cavity. The second driving unit has a first side, a second side intersecting the first side, a third side opposite to the first side, and a fourth side opposite to the second side; the x-axis driving SMA line is only provided on the first side, and the y-axis driving SMA line is only provided on the second side; all electronic components are located on the first side and / or the second side.

50. The optical image stabilization camera module according to claim 48, characterized in that, The inner edge region of the movable part body has a stepped notch facing the object side to avoid the optical lens.

51. The optical image stabilization camera module according to claim 35, characterized in that, The second base is fixed to the first drive unit. The second base includes a base sidewall that surrounds the second movable part. There is a gap between the base sidewall and the second movable part for accommodating the SMA line.

52. An optical image stabilization camera module, characterized in that, include: Lens; A photosensitive component, which has a photosensitive chip; A first driving unit is adapted to mount the lens and drive the lens to translate in the x-axis or y-axis direction; as well as The second driving part includes a second base part and a second movable part. The photosensitive component is fixed to the second movable part. The second base part and the second movable part are movably connected by an elastic connecting part. The second driving part has four sides. At least one SMA line is arranged on at least one side of the second driving part. Each SMA line is located in the gap between the second movable part and the second base part. Both ends of the SMA line are fixed and electrically connected to two fixed ends located in two adjacent corner regions of the second base part. The outer surface of the second movable part has an extension that contacts the waist of the SMA line. Under the elastic action of the elastic connection part, the extension presses against the waist of the SMA line along the x-axis or y-axis direction, causing it to bend. The second driving part contracts the SMA line by passing current through it, thereby moving the photosensitive chip in the x-axis or y-axis direction. The lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. The x-axis and y-axis are coordinates perpendicular to the optical axis of the camera module. The x-axis and y-axis are perpendicular to each other. The photosensitive component includes a suspended circuit board, which includes a rigid circuit board body and a flexible connecting strip. The connecting strip extends from a first side and a second side of the circuit board body and bends upward to form a bend. The top of the bend extends horizontally along the periphery of the photosensitive component, such that the connecting strip surrounds the first side, second side, and third side of the photosensitive component. The connecting strips on the first side and the second side each have at least one suspension portion, which is fixed to the second base of the second drive unit or fixed to the second base through an intermediary. The photosensitive component has a first side and a second side that are aligned with the circuit board body. The first side and the second side are arranged opposite to each other, and the third side intersects both the first side and the second side.

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