Connecting element used to electrically connect two circuit carriers

Abstract

The present invention relates to a connecting element (1) for electrically connecting a circuit carrier (25) to another circuit carrier (20). The connecting element (1) has at least one brazing head (7, 8, 28, 29) for surface brazing with the circuit carrier (25) and a connecting pin electrically connected to the brazing head (7, 8, 28, 29) for insertion into the other circuit carrier (20). According to the invention, the connecting element (1) has a retainer (2), particularly a plastic body (2), and elastically configured contact elements (3, 4, 16, 26, 34) connected to the retainer (2). The contact elements (3, 4, 16, 26, 34) have end sections in which brazing heads are formed. The connecting element (1) has a locking element connected to the connecting element (1) in a manner that allows it to move back and forth between a locked position and a released position. The locking element is configured to limit the spring travel of the contact elements (3, 4, 16, 26, 34) in the locked position and release the contact elements (3, 4, 16, 26, 34) in the released position for elastic movement.

Description

Technical Field

[0001] This invention relates to a connection element for electrically connecting a circuit carrier to another circuit carrier. The connection element has at least one brazing head for surface soldering to the circuit carrier and a THT connector (Through-Hole Technology), particularly a connecting pin, electrically connected to the brazing head for insertion into another circuit carrier. Background Technology

[0002] A circuit board connection element is known from DE 102014109220A1. The circuit board connection element is configured to electrically and / or mechanically connect two circuit boards and has solderable SMD connection surfaces and / or pluggable THT wire connectors. The circuit board connection element has a carrier body and a support body disposed on the carrier body for supporting on the circuit board, thereby enabling mechanical unloading of the SMD connection surfaces or THT wire connectors during pressing. Summary of the Invention

[0003] According to the invention, the connecting element has a retainer, particularly a plastic body, and a resiliently configured contact element connected to the retainer. The contact element has an end section on which the brazing joint is formed. The connecting element has a locking element connected to it in a manner that allows it to move back and forth between a locked position and a released position. The locking element is configured to limit the spring travel of the contact element in the locked position and to release the contact element in the released position for resilient movement. Advantageously, the connecting element can thus be placed on and brazed to a circuit carrier configured for surface brazing in the locked position of the locking element. Here, the brazing joint can precisely contact the contact surfaces of the circuit carrier configured for surface brazing, provided that these contact surfaces are fixed in predetermined positions by means of the locking element, particularly while adhering to a predetermined distance relative to each other. After surface brazing, the locking element can move to the released position and thus restrain the contact element to resiliently block movement caused by the movement of the two circuit carriers, particularly gravitational movement.

[0004] In a preferred embodiment, the locking element is formed by a frame surrounding the retainer, wherein the frame is configured to engage and secure longitudinal sections of the contact element in the locked position. Advantageously, the contact element, for example formed by a longitudinally extending conductor or stamped grid, can be held by means of the locking element in a predetermined position relative to the retainer, particularly at a predetermined distance radially spaced from the retainer.

[0005] The plastic body is preferably formed of polyamide, polyetheretherketone, PPS (Poly-Propylen-Sulfid) or LCP (Liquid-Chrystal-Polymer). Advantageously, the plastic body can withstand high temperatures when brazing connecting elements.

[0006] In a preferred embodiment, the connecting element is configured to be placed onto a circuit carrier for surface soldering. Preferably, the contact element has solder feet forming solder joints, which are constructed, particularly in the case of extending bently from the contact element, on the end section of the contact element. Advantageously, the solder feet can therefore be constructed on the contact element, particularly shaped onto the contact element, with minimal effort.

[0007] In a preferred embodiment, the contact element is formed from, in particular, stamped contact wire having solder feet on the end section pointing towards the circuit carrier. The contact element preferably has a THT connector, in particular a connection pin, or a press-in contact at the end opposite the solder feet. The press-in contact is configured to be pressed into, in particular, a metallized through-hole in the circuit board and therein make electrical contact with the circuit board while being mechanically secured in the through-hole.

[0008] Advantageously, the two circuit carriers can be interconnected with low power by means of a connecting element. In a preferred embodiment, the contact element has a raised region on the longitudinal section forming the locking region, and the locking element has a recess for the raised region, particularly corresponding to the raised region. The locking element is configured to fix the contact element on the raised region in the locked position when inserted into the recess. The locking element is also preferably configured to release the contact element on the raised region in the released position for movement. Advantageously, locking of the contact element can thus be achieved with low power.

[0009] In a preferred embodiment, the contact element has a larger diameter in the longitudinal section formed for locking, particularly in the raised area, than in the section adjacent to the longitudinal section constructed for releasing. Advantageously, the longitudinal section constructed for locking can be produced with low cost through appropriate shaping when the contact element is stamped from a sheet metal.

[0010] In a preferred embodiment, the locking element is configured to engage the contact element over a longitudinal section, wherein the longitudinal section having a smaller diameter is arranged in a recess in the release position, and the protruding region is arranged in the recess in the locking position.

[0011] Advantageously, the locking element is thus capable of moving back and forth along the longitudinal extension of the connecting element, and especially laterally to the flat extension of the circuit carrier configured for surface soldering.

[0012] In another embodiment, the locking element is configured to move back and forth in a plane parallel to the surface brazing. The locking element, for example formed by a connecting element, particularly a U-shaped or O-shaped frame surrounding the retaining body, can therefore have a perforation, which is, for example, longitudinally elongated and configured to engage and secure the contact element at narrow locations.

[0013] In a preferred embodiment, the contact element is configured in an L-shape or T-shape at the raised area. Advantageously, the raised area can therefore be produced with low cost by stamping it onto the contact element from a sheet metal.

[0014] In a preferred embodiment, the THT connector is configured as a press-fit contact. The press-fit contact is preferably configured to be elastically secured, particularly radially outward, in a through-hole of another circuit carrier. The contact element preferably extends beyond the end section of the retainer pointing towards the circuit carrier, so that the connecting element can elastically deform (nachgeben) when the other circuit carrier is pressed onto the connecting element, such that the end section forms an end stop that limits the spring travel of the deformation. Advantageously, the end stop can therefore be formed by the retainer itself. Furthermore, advantageously, the retainer therefore does not require additional radially offset arms or stop elements that limit spring travel during press-fitting.

[0015] In a preferred embodiment, the locking element has at least one foot or leg formed onto it, the foot or leg being configured to extend in the locked position through a plane formed by the circuit carrier, particularly by a circuit carrier configured for surface soldering, such that the connecting element, together with the solder feet and at least one foot, can be placed on the circuit carrier, especially when not held in place. Advantageously, the locking element can thus form an additional support that can secure the connecting element, particularly the solder connection of the solder feet relative to the circuit carrier, when pressed against another circuit carrier. Furthermore advantageously, the connecting element can then be formed with only one or a few contact elements, which can establish a reliable foothold on the circuit carrier configured for surface soldering.

[0016] In a preferred embodiment, the connecting element is configured to secure the locking element in the release position such that the locking element is form-locked to the retainer in a snap-locking manner or additionally force-locked. Advantageously, the locking element therefore does not cause rattling noise in the release position. In a preferred embodiment, the locking element is formed onto the connecting element and connected by means of the connecting element via a target separation or target breakage point. Advantageously, the locking element can therefore be released from the connecting element at the target separation or target breakage point by means of a pressing tool and moved into the locked position.

[0017] The locking element and connecting element can be configured such that the locking element can be releasably or inreleasably locked in the release position. Therefore, the locking element can be reliably secured in the release position after being brazed to a circuit carrier constructed for surface soldering, and thus without causing rattling noise.

[0018] In a preferred embodiment, the locking element is configured for longitudinal extension along the plane of the connecting element, extending transversely to the contact plane, and particularly transversely to the plane of the circuit carrier configured for surface soldering. Advantageously, the locking element is thus able to move back and forth between a release position and / or a locking position by means of a pressing or stamping tool.

[0019] In a preferred embodiment, the connecting element has an opening for embedding a engagement aid, particularly a centering pin, the engagement aid having a longitudinally elongated opening shape, particularly an opening face. Advantageously, the connecting element can thus be rotatably oriented about the longitudinal extension of the connecting element by means of the centering pin, thereby aligning the contact element, particularly the press-in contact of the connecting element, with the through-hole of the circuit carrier to be connected. Advantageously, the connecting element can thus be easily engaged with another circuit carrier.

[0020] The opening is preferably oval, elliptical, rectangular, semi-circular, or semi-elliptical. Advantageously, this allows for rotation of the connecting element to the engagement position, in which the contact element can be easily pressed in.

[0021] In another embodiment, the connecting element has two spaced-apart, particularly circular or elliptical, openings for inserting two engagement aids, particularly centering pins, the openings being arranged on the connecting element such that it can rotate about a longitudinal axis extending particularly transversely to the plane of the circuit carrier when engaging another circuit carrier. Advantageously, the contact element can thus be precisely aligned with a corresponding perforation in the other circuit carrier.

[0022] The present invention also relates to a contact system having a locking element of the aforementioned type. The contact system includes the connecting element and two circuit carriers, particularly the circuit carrier and another circuit carrier, electrically and mechanically connected to the connecting element.

[0023] The present invention also relates to a controller, inverter, DC-DC converter, or charging appliance having a contact system of the aforementioned type for a motor vehicle. For the contact system, the circuit carrier configured for surface bonding forms a power component including a semiconductor switching half-bridge, particularly an inverter. The additional circuit carrier forms a control device for operating the inverter, particularly the semiconductor switches of the inverter. Attached Figure Description

[0024] The invention will now be described below with the aid of the accompanying drawings and other embodiments. Other advantageous embodiments are derived from combinations of features described in the drawings and dependent claims.

[0025] in:

[0026] Figure 1 A connecting element for electrically connecting a circuit carrier to another circuit carrier is shown, wherein the connecting element has a retainer and contact elements for electrically connecting the circuit carriers held in the retainer, and the contact elements are respectively configured for surface soldering to the circuit carrier and for press-fitting to another circuit carrier.

[0027] Figure 2 A top view shows the... Figure 1 The connecting elements shown in the figure;

[0028] Figure 3 A variation for a connecting element is shown, wherein a locking element that holds the retainer of the connecting element can secure the contact element and, in this case, support the circuit carrier. Detailed Implementation

[0029] Figure 1 A connecting element for electrically connecting two circuit carriers is shown. The connecting element 1 has a retainer configured to hold at least one contact element, in this embodiment four contact elements, of which contact elements 3 and 4 are shown. Each contact element has a brazing lead for soldering to circuit carrier 25 and a press-in contact for pressing into another circuit carrier 20.

[0030] The contact elements each have a connecting section that is elastically configured and electrically connects the press-in section and the solder foot to each other. Contact element 3 has a press-in contact 5 and a solder foot 7, wherein the press-in contact 5 and the solder foot 7 are electrically connected to each other by means of a connecting section 9. Press-in contact 4 has a press-in section 6 that is electrically connected to the solder foot 8 by means of a particularly elastically configured connecting section 10. The press-in contacts 3 and 4 are constructed, for example, as stamped sheet metal parts, particularly stamped grids or lead frames. The press-in contacts 5 and 6 are respectively configured for pressing into through-holes in the other circuit carrier, i.e., into through-hole 21 or through-hole 22. The other circuit carrier 20 can therefore be electrically connected to the circuit carrier 25 by means of contact elements 3 and 4.

[0031] The connecting element 1 is configured for placement onto the circuit carrier 25. In this embodiment, the connecting element 1 is configured for placement onto the circuit carrier 25 with solder leads, particularly solder leads 7 and 8. Here, the end region 39 of the retainer 2 is spaced apart from the circuit carrier 25.

[0032] The connecting element 1 has a locking element 13 configured to move from a locked position 13′ to a released position, as specifically indicated by arrow 41. The locking element 13 is configured to form-lock the contact elements 3 and 4 in the locked position 13′ into the area of ​​the solder pads, particularly solder pad 7 or solder pad 8, and to ensure that the press-fit contacts 5 and 6 are engaged in corresponding through-holes in the additional circuit carrier 20. For this purpose, the locking element 13 has at least one... Figure 2 The recess shown is configured to secure the T-shaped protrusion 11 of the press-in contact 3 and the T-shaped protrusion 12 of the press-in contact 4 in the corresponding recess. For this purpose, the locking element 13 has a separate recess for each protrusion. In this embodiment, the locking element 13 is formed as a plate that surrounds the retainer 2, particularly in annular form. The locking element 13 is configured to move back and forth along the longitudinal extension 40 of the connecting element 1, which extends transversely to the flat extension and thus transversely to the circuit carrier 20 corresponding to the plane normal.

[0033] In this embodiment, the connecting element 1 is configured to mechanically and electrically connect the circuit carriers, particularly the circuit carrier 25 and the other circuit carrier 20, in parallel and spaced apart from each other.

[0034] The circuit carrier 25 can be easily bent, particularly convex or concave, or the press-in contact may have a lateral offset relative to the circuit carrier 20, for example, due to tolerances. This allows the connecting element 1, which is brazed to the circuit carrier 25, to extend at a slight angle relative to the other circuit carrier 20, thereby as in Figure 1 As shown, the press-in contacts 5 and 6 are not precisely aligned with the perforations 21 or 22 of the other circuit carrier 20. When pressing the circuit carriers 25 and 20, as in... Figure 1 As shown, the press-in contacts 5 and 6 will encounter another circuit carrier 20 and miss the through holes 21 or 22 and thus bend.

[0035] In this embodiment, the additional circuit carrier 20 has a bonding auxiliary through-hole 23 configured to receive a bonding auxiliary member 18. The bonding auxiliary member 18 is longitudinally elongated in this embodiment and has a diameter and cross-sectional shape corresponding to the through-hole 23 of the additional circuit carrier 20. In this embodiment, the through-hole 23 is configured between through-holes 21 and 22 for pressing in contacts 5 or 6.

[0036] The engagement aid 18 has a tapered end section 19, which is constructed to gradually taper towards the end. In this embodiment, the tapered end section 19 is tapered, allowing its pointed tip to engage with a recess 17 formed in the retainer 2. The recess 17, in particular, corresponds in its opening diameter to the diameter of the longitudinal section of the engagement aid 18 adjacent to the tapered end section 19. In this way, the engagement aid 18 can be inserted into the recess 17 by pressing down another circuit carrier 20, supported by a pressing shoulder 24, and thus corrects the retainer 2 of the connecting element 1 in its orientation and position relative to the other circuit carrier 20, so that the pressing contacts 5 and 6 can be aligned and inserted into the corresponding through holes 21 or 22 when the two circuit carriers are connected.

[0037] The contact elements 3 and 4 can elastically prevent movement of the connecting element 1 on the elastically constructed connecting sections 9 and 10, thus preventing the solder joints 7 and 8 from being released from the circuit carrier 25. In this embodiment, the connecting sections 9 and 10 are longitudinally elongated and bent. The connecting sections 9 and 10 may have at least one bend. This allows the contact elements 3 and 4 to elastically compensate for the positional correction implemented by means of the engagement aid 18 along the longitudinal extension 40 of the connecting element.

[0038] The locking element 13 is capable of moving from the locked position 13', as indicated by arrow 41, after the connecting element 1 is soldered to the circuit carrier 25 and therefore before the connecting element 1 is plugged into another circuit carrier 20. Figure 1 The release position shown allows the connecting segments 9 and 10 to bounce freely.

[0039] Figure 2 A top view of the press-in contacts 5 and 6 shows that they have already been pressed in. Figure 1 The connecting element 1 is shown in the figure. The opening 17 in the retainer 2 is also visible, which is configured to receive the engagement aid 18 in a form-locking manner, and in particular in a shape-fitting manner, at least in the longitudinal section adjacent to the tapered end section 19.

[0040] Figure 2 T-shaped protrusions 11 and 12 are also shown, which are respectively arranged in the corresponding recesses 14 or 15 of the locking element 13 and held there in a form-locking and / or force-locking manner.

[0041] In this embodiment, the connecting element 1 has two additional contact elements 16 and 26, which, like contact elements 3 and 4, are held in the retainer 2 in at least one longitudinal section. The contact elements can be embedded, in particular filled into, or inserted into the retainer 2 and locked therein.

[0042] In this embodiment, the contact elements 3, 4, 16, and 26 are arranged regularly, particularly in a rectangular shape, relative to each other in a contact plane that extends transversely to the longitudinal extension 40 of the connecting element 1. Therefore, the connecting element 1 can be placed onto the circuit carrier 25 with the solder feet 7 and 8 of contact elements 3 or 4 and the solder feet 28 and 29 of contact elements 16 or 26, and reliably positioned there.

[0043] Figure 2 It also shows in Figure 1 A variant of the connecting element 1 is shown. In this variant, the opening 27, indicated by dashed lines, is longitudinally elongated and, in this embodiment, oval-shaped. Correspondingly, in this variant, a coupling aid, whose cross-section is oval, and especially elliptical, can be inserted into the oval, and especially elliptical, opening 27. Advantageously, the retainer 2 can therefore also be positionally corrected by means of the coupling aid having a longitudinally elongated cross-section when rotated or twisted about the longitudinal extension 40 of the connecting element 1, so that the press-in contact is precisely aligned with the corresponding perforation in the other circuit carrier 20.

[0044] Figure 3 It shows a kind of Figure 1 and Figure 2 An embodiment of a variant of the connecting element 1 shown. Figure 3 A connecting element 30 with a retainer 31 is shown.

[0045] In this embodiment, the connecting element 30 includes a locking element 32 that surrounds the retainer 31 annularly at least along a circumferential section in this embodiment. In this embodiment, the connecting element 30 has only one contact element 34, so that the connecting element 30 cannot be positioned on the circuit carrier 37 by means of solder feet 35 formed on the contact element 34 alone.

[0046] The locking element 32 can be held in the release position 32' by form-locking and / or force-locking using a locking nose 38 formed on the retainer 31. The locking element 32 can move from the release position 32' toward the circuit carrier 37, so that the protrusion 36 formed on the contact element 34 can be held in the corresponding recess of the locking element 32 by form-locking and / or force-locking using the locking element 32.

[0047] In this embodiment, the locking element 32 has an additional leg 33 extending laterally to a flat extension of the locking element 32, which ensures that the connecting element 30 is placed onto the circuit carrier 37. The connecting element 30 may have only one, two, or three contact elements, so that only one or two contact elements cannot ensure that the connecting element 30 is placed independently on the circuit carrier 37. The additional leg 33 allows reliable placement of the connecting element 30 on the circuit carrier 37 by pushing the locking element 32 toward the circuit carrier 37. The locking element 32 can remain on the circuit carrier 37 after the solder pads 35 are soldered to ensure mechanical unloading of the solder connection between the solder pads 35 and the circuit carrier 37, or return to the release position 32' to allow for complete freedom of movement of the contact element 34.

Claims

1. Connection element (1) for electrically connecting a circuit carrier (25) with a further circuit carrier (20), wherein the connection element (1) has at least one solder joint (7, 8, 28, 29) for surface soldering with the circuit carrier (25) and a THT contact (5, 6) electrically connected with the solder joint (7, 8, 28, 29) for insertion into the further circuit carrier (20), characterized in that the connection element (1) has a holding body (2) and a resiliently embodied contact element (3, 4, 16, 26, 34) connected with the holding body (2), wherein the contact element (3, 4, 16, 26, 34) has the solder joint (7, 8, 28, 29, 35) on an end section, and the connection element (1) has a locking element (13, 32) connected with the connection element (1) in a manner movable back and forth between a locked position (13') and a released position (32'), which locking element is configured for limiting the resilient travel of the contact element (3, 4, 16, 26, 34) in the locked position and for releasing the contact element (3, 4, 16, 26, 34) for resilient movement in the released position (32'), wherein the locking element (13, 32) is formed by a frame surrounding the holding body (2), which frame is configured for clamping and fixing a longitudinal section of the contact element (3, 4, 16, 26, 34) in the locked position (13').

2. Connection element (1) according to claim 1, characterized in that the THT contact (5, 6) is a connection pin.

3. Connection element (1) according to claim 1, characterized in that the holding body (2) is a plastic body.

4. Connection element (1) according to any one of claims 1 to 3, characterized in that the connection element (1) is configured for being placed onto the circuit carrier (25) for surface soldering and the contact element (3, 4, 16, 26, 34) for this purpose has a solder leg (7, 8, 28, 29, 35) forming the solder joint, which solder leg is configured on an end section of the contact element (3, 4, 16, 26, 34).

5. Connection element (1) according to claim 4, characterized in that the solder leg (7, 8, 28, 29, 35) is configured on the end section of the contact element (3, 4, 16, 26, 34) in a manner bent from the contact element (3, 4, 16, 26, 34).

6. Connection element (1) according to any one of claims 1 to 3, characterized in that The contact elements (3, 4, 16, 26) are formed by contact wires which have solder feet (7, 8, 28, 29, 35) on end sections pointing towards the circuit carrier (25) and have through-hole technology contacts (5, 6) on ends arranged opposite the solder feet (7, 8, 28, 29, 35).

7. Connection element (1) according to claim 6, characterized in that the contact wires are stamped contact wires.

8. Connection element (1) according to claim 6, characterized in that the through-hole technology contacts (5, 6) are press-in contacts.

9. Connection element (1) according to one of claims 1 to 3, characterized in that the contact elements (3, 4, 16, 26) have a raised area (11, 12, 36) on a longitudinal section configured for locking, and the locking element (13, 32) has a recess (14, 15) for the raised area (11, 12, 36), and the locking element is configured to fix the contact elements (3, 4, 16, 26, 34) in the locked position (13') on the raised area (11, 12, 36) when embedded in the recess (14, 15).

10. Connection element (1) according to claim 9, characterized in that the contact elements (3, 4, 16, 26, 34) have a greater diameter on a longitudinal section configured for locking than on a section adjacent to the longitudinal section configured for releasing.

11. Connection element (1) according to claim 9, characterized in that the contact elements (3, 4, 16, 26) are formed L-shaped or T-shaped on the raised area (11, 12, 36).

12. Connection element (1) according to one of claims 1 to 3, characterized in that the THT contacts (5, 6) are configured as press-in contacts, and the contact elements (3, 4, 16, 26) extend beyond an end section (39) of the holding body (2) pointing towards the circuit carrier (25), so that the connection element (1) can be elastically deformed when a further circuit carrier (20) is pressed onto the connection element (1), so that the end section (39) forms an end stop limiting the elastic travel of the deformation.

13. Connection element (1) according to claim 4, characterized in that the locking element (13, 32) has at least one leg (33) shaped into the locking element (13, 32), which is configured to extend in the locked position (13') up to a plane formed by the circuit carrier (25), so that the connection element (1) can lie on the circuit carrier together with the solder feet (7, 8, 28, 29, 35) and the at least one leg (33).

14. Connection element (1) according to claim 13, characterized in that the at least one leg (33) is configured as a press-in leg. The leg (33) is configured to extend in the latching position (13') up to a plane formed by the circuit carrier (25) such that the connecting element (1) can be placed on the circuit carrier together with the soldering leg (7, 8, 28, 29, 35) and at least one leg (33) without being held.

15. The connecting element (1) according to any one of claims 1 to 3, characterized in that The connecting element (1) is configured to fix the latching element (32) in the release position (32') such that the latching element (32) is connected in a form- locking or additionally force-locked manner with the holding body (31, 38) in a latching manner.

16. The connecting element (1) according to any one of claims 1 to 3, characterized in that The connecting element (1) is configured to move along a longitudinal extension (40) of the connecting element (1) which extends transversely to a plane of a circuit carrier configured for surface soldering.

17. The connecting element (1) according to any one of claims 1 to 3, characterized in that The holding body (2) of the connecting element (1) has an opening (17, 27) for embedding a centering pin (18), wherein the opening (17, 27) has a longitudinally elongated opening shape (27).

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