Thermal management method, apparatus, chip and device for electronic device

Abstract

This application relates to the field of heat dissipation technology, specifically disclosing a thermal management method, apparatus, chip, and device for electronic devices. The method includes: acquiring a first temperature of the heat-generating component; comparing the first temperature with a trigger threshold temperature for a protection mechanism; determining whether the first temperature is greater than the trigger threshold temperature; if the first temperature is greater than the trigger threshold temperature, adjusting the acquisition frequency of the heat-generating component's temperature and periodically acquiring a second temperature of the heat-generating component according to the adjusted acquisition frequency; and determining whether to trigger the protection mechanism based on the second temperature. Through this method, this application can extend the lifespan of electronic devices and improve user experience.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a thermal management method, apparatus, chip, and device for electronic devices. Background Technology

[0002] Laptops are popular due to their portability, but the resulting heat dissipation issues have been a persistent complaint among consumers, negatively impacting the user experience. Currently, the mainstream laptop cooling system uses copper pipes to conduct heat to a fan module, which then dissipates the heat to cool the laptop. The core of this control system is the laptop's embedded controller (EC).

[0003] Currently, the thermal management mechanism for triggering CPU high-temperature limits is a one-time action. When the protection mechanism is triggered, the limit can only be lifted by shutting down, restarting, or other manual operations. There is no additional judgment redundancy time during the triggering process. Frequent triggering of the protection mechanism will reduce the lifespan of the CPU and cause frequent computer lag, resulting in a poor user experience. Summary of the Invention

[0004] This application provides a thermal management method, apparatus, chip, and device for electronic devices, which can extend the service life of electronic devices and improve user experience.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a thermal management method for electronic devices, comprising:

[0006] The first temperature of the heating component is obtained, and the first temperature is compared with the trigger critical temperature of the trigger protection mechanism to determine whether the first temperature is greater than the trigger critical temperature.

[0007] If the first temperature is greater than the trigger critical temperature, the acquisition frequency of the temperature of the heating element is adjusted and the second temperature of the heating element is periodically acquired according to the adjusted acquisition frequency.

[0008] Whether to trigger the protection mechanism is determined based on the second temperature.

[0009] According to one embodiment of this application, after obtaining the first temperature of the heating element and before comparing the first temperature with the trigger critical temperature of the trigger protection mechanism, the method further includes:

[0010] Compare the first temperature with the thermal control critical temperature to determine whether the first temperature is greater than the thermal control critical temperature.

[0011] If the first temperature is greater than the thermal control critical temperature, then the first temperature is compared with the trigger critical temperature.

[0012] According to one embodiment of this application, before obtaining the first temperature of the heating element, the method further includes:

[0013] The performance mode of the electronic device is obtained, and the thermal control critical temperature and the trigger critical temperature for triggering the protection mechanism are determined based on the performance mode.

[0014] According to one embodiment of this application, the performance modes include multiple types, each performance mode corresponds to one or more of the protection mechanisms, and each protection mechanism corresponds to a trigger critical temperature.

[0015] According to one embodiment of this application, each performance mode corresponds to multiple protection mechanisms; obtaining the first temperature of the heating component, comparing the first temperature with the trigger critical temperature of the protection mechanism, and determining whether the first temperature is greater than the trigger critical temperature includes:

[0016] Obtain the first temperature of the heating element, and obtain the minimum trigger critical temperature among the plurality of trigger critical temperatures;

[0017] The first temperature is compared with the minimum trigger critical temperature to determine whether the first temperature is greater than the minimum trigger critical temperature.

[0018] According to one embodiment of this application, if the first temperature is greater than the trigger critical temperature, adjusting the acquisition frequency of the temperature of the heating element and periodically acquiring the second temperature of the heating element according to the adjusted acquisition frequency includes:

[0019] If the first temperature is greater than the minimum trigger critical temperature, then the first temperature is compared with each of the trigger critical temperatures respectively;

[0020] The frequency of temperature acquisition of the heating element is adjusted according to the comparison results, and the second temperature of the heating element is periodically acquired according to the adjusted acquisition frequency.

[0021] According to one embodiment of this application, determining whether to trigger the protection mechanism based on the second temperature includes:

[0022] The second temperature in each cycle is calculated according to a preset algorithm to obtain the calculation results for each cycle. Each calculation result is compared with the trigger critical temperature to determine whether each calculation result is greater than the trigger critical temperature.

[0023] If all the calculated results are greater than the trigger critical temperature, then the protection mechanism is triggered.

[0024] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a thermal management device for electronic devices, wherein the electronic devices include heat-generating components, and the thermal management device includes:

[0025] The acquisition module is used to acquire the first temperature of the heating component, compare the first temperature with the trigger critical temperature of the trigger protection mechanism, and determine whether the first temperature is greater than the trigger critical temperature.

[0026] An adjustment module is used to adjust the acquisition frequency of the temperature of the heating element and periodically acquire the second temperature of the heating element according to the adjusted acquisition frequency if the first temperature is greater than the trigger critical temperature.

[0027] The triggering module is used to determine whether to trigger the protection mechanism based on the second temperature.

[0028] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a chip, including the aforementioned thermal management device for electronic devices.

[0029] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide an electronic device, including the aforementioned chip.

[0030] The beneficial effects of this application are: by combining data from multiple cycles to determine the triggering of the protection mechanism in real time, the data acquisition error rate can be reduced, the accidental and random triggering of the protection mechanism can be avoided, and the use of non-one-time contact behavior to trigger the protection mechanism can reduce the frequency of triggering the protection mechanism, thereby extending the service life of electronic devices and improving user experience. This solves the problem of frequent triggering of the protection mechanism, which affects the service life of electronic devices and results in a poor user experience. Attached Figure Description

[0031] Figure 1 This is a schematic flowchart of a thermal management method for electronic devices according to an embodiment of this application;

[0032] Figure 2 This is a schematic flowchart of a thermal management method for electronic devices according to an embodiment of this application;

[0033] Figure 3 This is a schematic flowchart of a thermal management method for electronic devices according to an embodiment of this application;

[0034] Figure 4 This is a schematic flowchart of a thermal management method for electronic devices according to an embodiment of this application;

[0035] Figure 5 This is a schematic diagram of the structure of a thermal management device for electronic devices according to an embodiment of this application;

[0036] Figure 6 This is a schematic diagram of the structure of a chip according to an embodiment of this application;

[0037] Figure 7 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] Figure 1 This is a flowchart illustrating a thermal management method for electronic devices according to the first embodiment of this application. It should be noted that if substantially the same result is achieved, the method of this application does not necessarily require further elaboration. Figure 1 The illustrated process sequence is limited. For example... Figure 1 As shown, the method includes the following steps:

[0042] Step S101: Obtain the first temperature of the heating component, compare the first temperature with the trigger critical temperature of the trigger protection mechanism, and determine whether the first temperature is greater than the trigger critical temperature.

[0043] In step S101, the electronic device includes heat-generating components, such as a CPU or a heat-generating chip. This embodiment can acquire the first temperature of the heat-generating component in real time or periodically, and compare the first temperature with the trigger threshold temperature of the protection mechanism. This allows for a preliminary determination of whether the current first temperature is likely to trigger the protection mechanism. If the first temperature is greater than the trigger threshold temperature, the protection mechanism may be triggered.

[0044] The protection mechanism in this embodiment is a high-temperature protection measure for the heating component, and there can be one or more protection mechanisms. In one feasible implementation, if there are multiple protection mechanisms, each corresponding to a trigger critical temperature, then in step S101, the first temperature is compared with the minimum trigger critical temperature to determine whether the first temperature is greater than the minimum trigger critical temperature. If the first temperature is greater than the minimum trigger critical temperature, the protection mechanism may be triggered.

[0045] Step S102: If the first temperature is greater than the trigger critical temperature, adjust the acquisition frequency of the heating element's temperature and periodically acquire the second temperature of the heating element according to the adjusted acquisition frequency.

[0046] In step S102, if a temperature exceeds the trigger threshold temperature, the protection mechanism is immediately triggered. This can easily lead to erroneous triggering of the protection mechanism due to temperature acquisition errors. Furthermore, frequent triggering of the protection mechanism can occur when the operating environment of the heating component is unstable, causing electronic device lag and impacting user experience. Therefore, this embodiment adds a fault-tolerant judgment mechanism before determining whether to trigger the protection mechanism to ensure the accuracy of the acquired temperature. That is, when the first temperature exceeds the trigger threshold temperature, the corresponding protection mechanism is not immediately triggered. Instead, the acquisition frequency of the heating component's temperature is adjusted, and the temperature of the heating component is periodically acquired according to the adjusted acquisition frequency and recorded as the second temperature.

[0047] In one feasible embodiment, if multiple protection mechanisms are included, the trigger critical temperatures are also set one-to-one with each protection mechanism. Taking three protection mechanisms as an example, these include a first protection mechanism, a second protection mechanism, and a third protection mechanism. Each of the three protection mechanisms can correspond to a different level of protection. For example, taking the CPU as the heat-generating component, the first protection mechanism corresponds to a severe level, the second protection mechanism to a moderate level, and the third protection mechanism to a mild level. In one feasible implementation, the first protection mechanism can be shutdown, stopping the CPU from working; the second protection mechanism can be CPU frequency reduction, lowering the CPU operating frequency to a minimum frequency, such as 400 MHz; the third protection mechanism can be CPU frequency reduction, lowering the CPU operating frequency to 1 / 3 or 1 / 5 of the CPU's normal operating frequency. The trigger critical temperatures include a first critical temperature for triggering the first protection mechanism, a second critical temperature for triggering the second protection mechanism, and a third critical temperature for triggering the third protection mechanism, wherein the first critical temperature is higher than the second critical temperature, and the second critical temperature is higher than the third critical temperature.

[0048] The acquisition frequency can be set according to different trigger critical temperatures. Generally, the higher the trigger critical temperature, the higher the acquisition frequency. The acquisition frequency can be 1 time / second, 5 times / second, or 10 times / second, depending on the temperature of the heating element. In one feasible implementation, when the temperature of the heating element is within the normal operating temperature range, the acquisition frequency of the heating element's temperature is 1 time / second; when the temperature of the heating element is above the second or third critical temperature, the acquisition frequency is 5 times / second; and when the temperature of the heating element is above the first critical temperature, the acquisition frequency is 10 times / second.

[0049] The acquisition cycle can be set based on a comprehensive consideration of the user's data requirements and control efficiency; the specific number of cycles is not limited here.

[0050] In one feasible implementation, if the protection mechanism includes multiple mechanisms, please refer to [link to relevant documentation]. Figure 2 Step S102 may also include:

[0051] Step S201: If the first temperature is greater than the minimum triggering critical temperature, then compare the first temperature with each triggering critical temperature respectively;

[0052] In step S201, the first temperature is compared with each triggering critical temperature. The comparison can be made in ascending order or descending order. Alternatively, each triggering critical temperature can be divided into intervals to directly determine the interval range into which the first temperature falls.

[0053] Step S202: Adjust the acquisition frequency of the heating element's temperature according to the comparison results, and periodically acquire the second temperature of the heating element according to the adjusted acquisition frequency.

[0054] In one feasible implementation, taking a protection mechanism comprising three elements as an example, if the first temperature is greater than the minimum trigger critical temperature, then it is determined whether the first temperature is greater than the first critical temperature; if the first temperature is greater than the first critical temperature, then the temperature acquisition frequency of the heating element is adjusted according to the first critical temperature, and the second temperature of the heating element is periodically acquired according to the adjusted acquisition frequency. If the first temperature is not greater than the first critical temperature, then it is determined whether the first temperature is greater than the second critical temperature; if the first temperature is greater than the second critical temperature, then the temperature acquisition frequency of the heating element is adjusted according to the second critical temperature, and the second temperature of the heating element is periodically acquired according to the adjusted acquisition frequency. If the first temperature is not greater than the second critical temperature, then it is determined whether the first temperature is greater than the third critical temperature; if the first temperature is greater than the third critical temperature, then the temperature acquisition frequency of the heating element is adjusted according to the third critical temperature, and the second temperature of the heating element is periodically acquired according to the adjusted acquisition frequency.

[0055] In this embodiment, if the first temperature is greater than the first critical temperature, it indicates that the current temperature may trigger the first protection mechanism. If the first temperature is not greater than the first critical temperature, it indicates that the current temperature will not trigger the first protection mechanism. In this case, it is necessary to determine whether the current temperature will trigger the second protection mechanism. Therefore, it is necessary to continue to determine whether the first temperature is greater than the second critical temperature. If the first temperature is greater than the second critical temperature, it indicates that the current temperature may trigger the second protection mechanism. If the first temperature is not greater than the second critical temperature, it indicates that the current temperature will not trigger the second protection mechanism. In this case, it is necessary to determine whether the current temperature will trigger the third protection mechanism. Therefore, it is necessary to continue to determine whether the first temperature is greater than the third critical temperature. If the first temperature is greater than the third critical temperature, it indicates that the current temperature may trigger the third protection mechanism. If the first temperature is not greater than the third critical temperature, it indicates that the current temperature will not trigger the third protection mechanism. In this case, the temperature of the heating component is monitored.

[0056] Step S103: Determine whether to trigger the protection mechanism based on the second temperature.

[0057] In step S103, in one feasible embodiment, all second temperatures are compared with the trigger critical temperature. If all second temperatures are greater than the trigger critical temperature, the protection mechanism is triggered. In another feasible embodiment, the second temperatures in each cycle are calculated according to a preset algorithm to obtain the calculation results for each cycle. Each calculation result is compared with the trigger critical temperature to determine whether each calculation result is greater than the trigger critical temperature. If each calculation result is greater than the trigger critical temperature, the protection mechanism is triggered. The preset algorithm in this embodiment can be an average algorithm or a weighted average algorithm, etc.

[0058] In calculating the average temperature for each period, in one feasible implementation, if the second temperatures within the same period are not significantly different, the average of the second temperatures for that period is taken as the average temperature for that period. In another feasible implementation, if there are second temperatures with significant differences within the same period, the maximum and minimum values ​​are removed, and the average of the remaining second temperatures is calculated as the average temperature for that period.

[0059] Taking a protection mechanism comprising three elements as an example: If the first temperature is greater than the first critical temperature, the average of the second temperature over each period is calculated. This average is then compared to the first critical temperature to determine if each average is greater than the first critical temperature. If all averages are greater than the first critical temperature, the first protection mechanism is triggered. If the first temperature is greater than the second critical temperature, the average of the second temperature over each period is calculated. This average is then compared to the second critical temperature to determine if each average is greater than the second critical temperature. If all averages are greater than the second critical temperature, the second protection mechanism is triggered. If the first temperature is greater than the third critical temperature, the average of the second temperature over each period is calculated. This average is then compared to the third critical temperature to determine if each average is greater than the third critical temperature. If all averages are greater than the third critical temperature, the third protection mechanism is triggered.

[0060] The thermal management method for electronic devices in this application reduces the data acquisition error rate and avoids accidental and random triggering of the protection mechanism by combining data from multiple cycles to determine the triggering of the protection mechanism in real time. By adopting a non-one-time contact behavior to trigger the protection mechanism, the frequency of triggering the protection mechanism can be reduced, thereby extending the service life of the electronic device and improving the user experience. This solves the problem that frequent triggering of the protection mechanism affects the service life of the electronic device and results in a poor user experience.

[0061] Based on the above embodiments, in one feasible embodiment, before step S101, the method further includes: obtaining the performance mode of the electronic device, and determining the thermal control critical temperature and the trigger critical temperature of the trigger protection mechanism based on the performance mode.

[0062] In this embodiment, there can be multiple performance modes, each corresponding to one or more protection mechanisms, and each protection mechanism corresponding to a trigger critical temperature. The performance mode is related to the thermal management critical temperature and the trigger critical temperature of the protection mechanism. The thermal management critical temperature is the boundary condition for determining whether thermal management is required, and the trigger critical temperature is the boundary condition for selecting which protection mechanism to use for thermal management.

[0063] In one feasible implementation, the performance modes include a high-performance mode, a medium-performance mode, and a low-performance mode, which can be switched between through human-computer interaction or automatically. In this embodiment, the user switches between different performance modes through button input in the human-computer interaction center. Generally, the lower the performance mode level, the more energy-efficient it is, and the lower the corresponding thermal management critical temperature and the trigger threshold value of each protection mechanism are set. For example, in high-performance mode, the thermal management critical temperature is 80°C, and the third, second, and first critical temperatures are 85°C, 90°C, and 101°C, respectively; in medium-performance mode, the thermal management critical temperature is 75°C, and the third, second, and first critical temperatures are 80°C, 85°C, and 95°C, respectively; in low-performance mode, the thermal management critical temperature is 70°C, and the third, second, and first critical temperatures are 75°C, 80°C, and 90°C, respectively.

[0064] Based on the above embodiments, in one feasible embodiment, please refer to [link to relevant documentation]. Figure 3 Step S101 further includes:

[0065] Step S301: Obtain the first temperature of the heating element;

[0066] Step S302: Compare the first temperature with the thermal control critical temperature to determine whether the first temperature is greater than the thermal control critical temperature;

[0067] Step S303: If the first temperature is greater than the thermal control critical temperature, then compare the first temperature with the trigger critical temperature.

[0068] In this embodiment, if the first temperature is greater than the thermal control critical temperature, it indicates that a protection mechanism may need to be triggered to control the temperature of the heat-generating component. In one feasible implementation, if the first temperature is not greater than the thermal control critical temperature, a preset temperature range is determined based on the first temperature, and the power of the heat dissipation component is matched according to the preset temperature range. This embodiment sets the temperature range and the corresponding power of the heat dissipation component within the normal operating temperature range of the heat-generating component. Generally, the higher the temperature value of the temperature range, the greater the power of the heat dissipation component. The heat dissipation component in this embodiment can be a cooling fan.

[0069] In one feasible implementation, please refer to Figure 4 After step S103, the method further includes: step S401: if the protection mechanism is determined to be triggered, then after the protection mechanism is triggered, the third temperature of the heating component is obtained, and it is determined whether the third temperature is less than the trigger critical temperature.

[0070] Step S402: If the third temperature is less than the trigger critical temperature, the fourth temperature of the heating component is periodically acquired according to the acquisition frequency, the fourth temperature in each preset period is calculated, and the calculation results are compared with the trigger critical temperature.

[0071] Step S403: If all calculation results are less than the trigger critical temperature, the protection mechanism is released.

[0072] Figure 5 This is a schematic diagram of the structure of a thermal management device for electronic devices according to an embodiment of this application. Figure 5 As shown, the device 50 includes an acquisition module 51, an adjustment module 52, and a trigger module 53.

[0073] The acquisition module 51 is used to acquire the first temperature of the heating component, compare the first temperature with the trigger critical temperature of the trigger protection mechanism, and determine whether the first temperature is greater than the trigger critical temperature.

[0074] The adjustment module 52 is used to adjust the acquisition frequency of the heating element's temperature if the first temperature is greater than the trigger critical temperature, and periodically acquire the second temperature of the heating element according to the adjusted acquisition frequency.

[0075] Trigger module 53 is used to determine whether to trigger the protection mechanism based on the second temperature.

[0076] Please see Figure 6 , Figure 6 This is a schematic diagram of the chip structure according to an embodiment of this application. Figure 6 As shown, the chip 6 includes the aforementioned thermal management device 50 for electronic devices.

[0077] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Figure 7 As shown, the electronic device 7 includes the aforementioned chip 60. The electronic device in this embodiment is a portable computer, such as a laptop computer.

[0078] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between apparatuses or units, and may be electrical, mechanical, or other forms.

[0079] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0080] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A thermal management method for an electronic device, the electronic device including a heat-generating component, characterized in that, include: The performance mode of the electronic device is obtained, and the thermal control critical temperature and trigger critical temperature are determined based on the performance mode. Obtain the first temperature of the heating element, compare the first temperature with the thermal control critical temperature, and determine whether the first temperature is greater than the thermal control critical temperature. If the first temperature is greater than the thermal control critical temperature, the first temperature is compared with the trigger critical temperature of the trigger protection mechanism to determine whether the first temperature is greater than the trigger critical temperature. If the first temperature is greater than the trigger critical temperature, the acquisition frequency of the temperature of the heating element is adjusted and the second temperature of the heating element is periodically acquired according to the adjusted acquisition frequency. Whether to trigger the protection mechanism is determined based on the second temperature; This includes: calculating the second temperature in each cycle according to a preset algorithm to obtain the calculation result for each cycle; comparing each calculation result with the trigger critical temperature to determine whether each calculation result is greater than the trigger critical temperature; and triggering the protection mechanism if each calculation result is greater than the trigger critical temperature.

2. The thermal control method according to claim 1, characterized in that, The performance modes include multiple types, each performance mode corresponds to one or more of the protection mechanisms, and each protection mechanism corresponds to a trigger critical temperature.

3. The thermal control method according to claim 2, characterized in that, Each performance mode corresponds to multiple protection mechanisms; obtaining the first temperature of the heating component, comparing the first temperature with the trigger threshold temperature of the protection mechanism, and determining whether the first temperature is greater than the trigger threshold temperature includes: Obtain the first temperature of the heating element, and obtain the minimum trigger critical temperature among the plurality of trigger critical temperatures; The first temperature is compared with the minimum trigger critical temperature to determine whether the first temperature is greater than the minimum trigger critical temperature.

4. The thermal control method according to claim 3, characterized in that, If the first temperature is greater than the trigger critical temperature, adjusting the temperature acquisition frequency of the heating element and periodically acquiring the second temperature of the heating element according to the adjusted acquisition frequency includes: If the first temperature is greater than the minimum trigger critical temperature, then the first temperature is compared with each of the trigger critical temperatures respectively; The frequency of temperature acquisition of the heating element is adjusted according to the comparison results, and the second temperature of the heating element is periodically acquired according to the adjusted acquisition frequency.

5. A thermal management device for an electronic device, the electronic device including a heat-generating component, characterized in that, The thermal control device includes: The acquisition module is used to acquire the first temperature of the heating component, compare the first temperature with the trigger critical temperature of the trigger protection mechanism, and determine whether the first temperature is greater than the trigger critical temperature. An adjustment module is used to adjust the acquisition frequency of the temperature of the heating element and periodically acquire the second temperature of the heating element according to the adjusted acquisition frequency if the first temperature is greater than the trigger critical temperature. The triggering module is used to determine whether to trigger the protection mechanism based on the second temperature; Before obtaining the first temperature of the heating element, the method further includes: The performance mode of the electronic device is obtained, and the thermal control critical temperature and trigger critical temperature are determined based on the performance mode. After obtaining the first temperature of the heating component, the method further includes: comparing the first temperature with the thermal control critical temperature to determine whether the first temperature is greater than the thermal control critical temperature; if the first temperature is greater than the thermal control critical temperature, comparing the first temperature with the trigger critical temperature of the trigger protection mechanism. The step of determining whether to trigger the protection mechanism based on the second temperature includes: calculating the second temperature in each cycle according to a preset algorithm to obtain the calculation result for each cycle, comparing each calculation result with the trigger critical temperature, and determining whether each calculation result is greater than the trigger critical temperature; if each calculation result is greater than the trigger critical temperature, then the protection mechanism is triggered.

6. A chip, characterized in that, include: The thermal management device for electronic devices as described in claim 5.

7. An electronic device, characterized in that, include: The chip as described in claim 6.

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