A data center machine room model and layout analysis method for optimizing air flow organization
By using computational fluid dynamics analysis and airflow optimization with deflectors, the problem of localized overheating in data center server rooms was solved, achieving efficient cooling and low-cost airflow optimization, thus improving the operating environment of data centers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-09
- Publication Date
- 2026-03-20
AI Technical Summary
Due to the high density of equipment and uneven airflow in data center server rooms, localized overheating problems occur. Existing technologies increase cooling energy consumption by lowering the cooling temperature, and there is a lack of effective methods to optimize airflow organization.
Computational fluid dynamics was used to analyze airflow organization, and airflow organization was optimized by means of auxiliary fans and deflectors. The improvement effect was verified by combining airflow organization evaluation indicators, and a data center computer room model with optimized airflow organization was constructed.
It enables precise cooling for servers, improves cooling efficiency, reduces data center renovation costs, and improves the temperature and velocity field distribution within the data center.
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Figure CN116341401B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of data center room layout, in particular to a data center room model for optimizing air flow organization and a layout analysis method. BACKGROUND
[0002] With the upgrading of network communication and the rapid development of data services, the equipment density in the data center room is getting higher and higher, and the power consumption and heat generation are also getting larger and larger. Due to the uneven arrangement of the load in multiple areas of the computer room, and the lack of effective control of the air flow organization in the computer room, the cold and hot air flow in the computer room is disordered, resulting in multiple local overheating problems that are difficult to solve. In order to solve the problem of local hot spots, many data centers use the method of directly reducing the cooling temperature, which is simple to operate, but may lead to excessive cooling load and increase the energy consumption of refrigeration. Therefore, it is necessary to analyze the air flow organization in the computer room, adjust the layout of the data center room, and optimize the air flow organization to improve the operating environment of IT equipment and provide a safe and stable operating environment for the data center. SUMMARY
[0003] (I) Technical problems to be solved
[0004] In view of the deficiencies of the prior art, the present application provides a data center room model for optimizing air flow organization and a layout analysis method. The method uses computational fluid dynamics to analyze the air flow organization of the data center room, and uses auxiliary fans and other methods to optimize the air flow organization, improves the cooling efficiency of the data center, and calculates the air flow organization evaluation index to verify the effectiveness of the improvement method.
[0005] (II) Technical solutions
[0006] To achieve the above purpose, the present application is realized by the following technical solutions:
[0007] On the one hand, a data center room layout analysis method for optimizing air flow organization is provided, characterized in that the method comprises:
[0008] constructing a data center room model;
[0009] using fluid mechanics method to numerically calculate and analyze the air flow organization of the data center room;
[0010] based on the server power and the air flow organization, revising the air volume of the auxiliary fan;
[0011] using computational fluid dynamics method to simulate and verify the data center room after revising the air volume of the auxiliary fan, and calculating the air flow organization evaluation index.
[0012] Preferably, the air volume of the auxiliary fan is:
[0013]
[0014] where q f is the air volume of the auxiliary fan, P is the power of the server, c pair is the specific heat capacity of air at constant pressure, p air is the air density, T out is the server outlet temperature, T in is the server inlet temperature, and k is a correction factor.
[0015] Preferably, the air flow organization evaluation index includes a temperature field uniformity evaluation index D(T) and a velocity field uniformity evaluation index D(v):
[0016]
[0017]
[0018] where T s is the temperature distribution on the s plane, is the average temperature, S is the effective area through which the air flows, and v s is the velocity distribution on the s plane, is the average velocity.
[0019] Preferably, the air flow organization situation analysis includes room velocity distribution analysis, room temperature analysis, cold aisle temperature analysis, inlet and outlet face temperature analysis, and server temperature analysis.
[0020] In another aspect, the application provides a data center room model for optimizing air flow organization, which comprises a floor, cabinets, and room air conditioners, the cabinets are arranged in 4 columns and 6 rows, and each cabinet is provided with 10 equipment layers, each equipment layer is provided with a server, and the server inlet is provided with an auxiliary fan.
[0021] Preferably, each cabinet includes an inlet face and an outlet face, a closed shell is arranged between the inlet faces of two columns of cabinets, a ventilation floor is arranged below the closed shell, and a room air conditioner is arranged on each side of the cabinet, and the room air conditioner includes an air outlet and an air return.
[0022] Preferably, the data center room model includes a room and a static pressure tank, the air outlet is located in the static pressure tank, the air return is located in the room, and the static pressure tank is provided with a first diversion plate, a second diversion plate, a third diversion plate, and a fourth diversion plate between the air outlet of the room air conditioner and the ventilation floor, the heights of the first diversion plate, the second diversion plate, the third diversion plate, and the fourth diversion plate are consistent with the height of the static pressure tank, and the first diversion plate and the second diversion plate and the third diversion plate and the fourth diversion plate form a first cold air duct, a second cold air duct, and a third cold air duct, respectively.
[0023] Preferably, the first drainage plate and the second drainage plate are provided with arc-shaped plates, the bottom surface of the arc-shaped plate is tangent to the bottom surface of the static pressure tank, and the top surface of the arc-shaped plate is connected with the first floor.
[0024] Preferably, the bottom of the cabinet is provided with a trapezoidal plate, the bottom edge of the trapezoidal plate coincides with the bottom edge of the cabinet, and the upper edge of the trapezoidal plate coincides with the bottom edge of the server.
[0025] Preferably, the surface of the ventilation floor is provided with a first porous floor and a second porous floor, the porosity of the first porous floor is 0.5, and the porosity of the second porous floor is 0.3.
[0026] (Three) beneficial effects
[0027] (1) The data center machine room model and layout analysis method for optimizing air flow organization of the application adopts the mode of auxiliary fan to adjust the air supply of different power servers, realizes accurate cooling of the server, and improves the refrigeration efficiency of the machine room air conditioner on the server.
[0028] (2) The data center machine room model and layout analysis method for optimizing air flow organization of the application adopts the guide plate and the drainage plate to improve the air flow organization of the data machine room, so that the cold air of the machine room air conditioner is uniformly supplied to the cabinet, and the refrigeration efficiency of the machine room air conditioner is improved while the layout improvement cost of the machine room is reduced.
[0029] (3) The data center machine room model and layout analysis method for optimizing air flow organization of the application uses the method of fluid mechanics to carry out numerical analysis on the velocity field and temperature field of the data center machine room, which is convenient for predicting the improvement effect of air flow organization and verifying the effectiveness of the method of optimizing air flow organization before actually transforming the machine room. BRIEF DESCRIPTION OF DRAWINGS
[0030] Figure 1 It is a three-dimensional view of the structural data center machine room model of the application.
[0031] Figure 2 It is a top view of the data center machine room model of the application.
[0032] Figure 3 It is a front view of the data center machine room model of the application.
[0033] Figure 4 It is a flow chart of the data center machine room layout analysis method for optimizing air flow organization of the application.
[0034] The components are as follows: 1. Enclosed shell; 2. Room; 3. Server; 4. Server rack; 5. Floor 1; 6. Static pressure box; 7. Server room air conditioner; 8. Return air vent; 9. Air outlet; 10. First perforated floor; 11. Second perforated floor; 12. Auxiliary fan; 13. Air inlet surface; 14. Air outlet surface; 15. Trapezoidal plate; 16. Cold aisle; 17. First air intake plate; 18. Curved plate; 19. Second air intake plate; 20. Third air intake plate; 21. Fourth air intake plate; 22. First cold air duct; 23. Second cold air duct; 24. Third cold air duct; 25. Ventilated floor. Detailed Implementation
[0035] The technical solutions in the embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0036] Example
[0037] like Figures 1-3 As shown, on the one hand, a data center computer room model with optimized airflow organization is provided. The data center computer room model includes a floor 5, a rack 4 and a computer room air conditioner 7. The rack 4 has 4 columns and 6 rows, and each rack 4 has 10 equipment layers. Each equipment layer has a server 3, and the entrance of the server 3 is equipped with an auxiliary fan 12.
[0038] As a further embodiment, each rack 4 includes an air inlet surface 13 and an air outlet surface 14. A closed shell 1 is provided between the air inlet surfaces 13 of two rows of racks 4. A ventilation floor 25 is provided below the closed shell 1. A computer room air conditioner 7 is provided on both sides of the rack 4. The computer room air conditioner 7 includes an air outlet 9 and a return air outlet 8.
[0039] As a further embodiment, the data center computer room model includes a room 2 and a static pressure box 6. The air outlet 9 is located in the static pressure box 6, and the return air outlet 8 is located in the room 2. A first air diversion plate 17, a second air diversion plate 19, a third air diversion plate 20, and a fourth air diversion plate 21 are provided between the air outlet 9 of the computer room air conditioner 7 and the ventilation floor 25 inside the static pressure box 6. The height of the first air diversion plate 17, the second air diversion plate 19, the third air diversion plate 20, and the fourth air diversion plate 21 are the same as the height of the static pressure box 6. The first air diversion plate 17 and the second air diversion plate 19, and the third air diversion plate 20 and the fourth air diversion plate 21 respectively form a first cold air duct 22, a second cold air duct 23, and a third cold air duct 24.
[0040] As a further scheme of the embodiment, the arc-shaped plates 18 are arranged between the first drainage plates 17 and the second drainage plates 19 and between the third drainage plates 20 and the fourth drainage plates 20, the bottom surfaces of the arc-shaped plates 18 are tangent to the bottom surface of the static pressure tank 6, and the top surfaces of the arc-shaped plates 18 are connected to the floor 5.
[0041] As a further scheme of the embodiment, the trapezoidal plates 15 are arranged at the bottom of the cabinet 4, the bottom edges of the trapezoidal plates 15 are coincident with the bottom edge of the cabinet 4, and the top edges of the trapezoidal plates 15 are coincident with the bottom edges of the servers 3.
[0042] As a further scheme of the embodiment, the first porous floor 10 and the second porous floor 11 are arranged on the surface of the ventilation floor 25, the porosity of the first porous floor 10 is 0.5, and the porosity of the second porous floor 11 is 0.3.
[0043] As shown in Figure 4 On the other hand, a data center machine room layout analysis method for optimizing air flow organization is provided, and the method comprises the following steps:
[0044] A data center machine room model is constructed;
[0045] A fluid mechanics method is used to perform numerical calculation and air flow organization analysis on the air flow organization of the data center machine room;
[0046] The air volume of the auxiliary fan 12 is revised based on the power of the server 3 and the air flow organization;
[0047] The data center machine room after the air volume of the auxiliary fan 12 is revised is simulated and verified by using a computational fluid dynamics method, and an air flow organization evaluation index is calculated.
[0048] As a further scheme of the embodiment, the air volume of the auxiliary fan 12 is:
[0049]
[0050] In the formula, q f is the air volume of the auxiliary fan 12, P is the power of the server 3, c pair is the constant-pressure specific heat capacity of air, p air is the density of air, T out is the outlet air temperature of the server 3, T in is the inlet air temperature of the server 3, and k is a revision coefficient.
[0051] As a further scheme of the embodiment, the air flow organization evaluation index comprises a temperature field uniformity evaluation index D(T) and a velocity field uniformity evaluation index D(v):
[0052]
[0053]
[0054] where T is the temperature distribution in the s-plane, s is the temperature distribution in the s-plane, is the average temperature, S is the effective area through which the air flows, and v s is the velocity distribution in the s-plane, is the average velocity.
[0055] As a further aspect of the present embodiment, the air flow organization analysis includes a room 2 velocity distribution analysis, a room 2 temperature analysis, a cold aisle 16 temperature analysis, an inlet face 13 and outlet face 14 temperature analysis, and a server 3 temperature analysis.
[0056] The present application proposes a data center room layout analysis method for optimizing air flow organization, constructs a data center room model, uses computational fluid dynamics to numerically calculate the air flow organization of the data center room, improves the temperature field and velocity field distribution of the room by means of auxiliary fans 12, flow guide plates, flow guide plates, etc., and verifies the optimization effect by using computational fluid dynamics, which can realize the optimization of data center air flow organization, precise cooling of servers 3, and reduce the cost of data center transformation.
[0057] It should be noted that, in this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without limitation, an element preceded by "comprises... a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the identified element.
Claims
1. A method for analyzing the layout of a data center computer room to optimize airflow organization, characterized in that, The method includes: Build a data center model; The fluid dynamics method is used to perform numerical calculations and airflow organization analysis of the data center computer room; The air volume of the auxiliary fan (12) was revised based on the server (3) power and airflow organization. Computational fluid dynamics was used to simulate and verify the air volume of the data center after the revision of the auxiliary fan (12), and the airflow organization evaluation index was calculated. The data center model includes a floor (5), cabinets (4) and a computer room air conditioner (7). Each cabinet (4) includes an air inlet (13) and an air outlet (14). A closed shell (1) is provided between the air inlet (13) of two rows of cabinets (4). A ventilated floor (25) is provided below the closed shell (1). Computer room air conditioners (7) are provided on both sides of the cabinets (4). The computer room air conditioners (7) include an air outlet (9) and a return air outlet (8). The data center computer room model includes a room (2) and a static pressure box (6). The air outlet (9) is located in the static pressure box (6), and the return air outlet (8) is located in the room (2). A first diversion plate (17), a second diversion plate (19), a third diversion plate (20), and a fourth diversion plate (21) are provided between the air outlet (9) of the computer room air conditioner (7) and the ventilation floor (25) in the static pressure box (6). The height of the first diversion plate (17), the second diversion plate (19), the third diversion plate (20), and the fourth diversion plate (21) is the same as the height of the static pressure box (6). The first diversion plate (17) and the second diversion plate (19), and the third diversion plate (20) and the fourth diversion plate (21) respectively form a first cold air duct (22), a second cold air duct (23), and a third cold air duct (24). An arc-shaped plate (18) is provided between the first diversion plate (17) and the second diversion plate (19), and between the third diversion plate (20) and the third diversion plate (20). The bottom surface of the arc-shaped plate (18) is tangent to the bottom surface of the static pressure box (6), and the top surface of the arc-shaped plate (18) is connected to the floor 1 (5). The bottom of the cabinet (4) is provided with a trapezoidal plate (15), the bottom edge of the trapezoidal plate (15) coincides with the bottom edge of the cabinet (4), and the top edge of the trapezoidal plate (15) coincides with the bottom edge of the server (3).
2. The data center layout analysis method for optimizing airflow organization according to claim 1, characterized in that: The air volume of the auxiliary fan (12) is: In the formula, To increase the airflow of the auxiliary fan (12), For server (3) power, The specific heat capacity of air at constant pressure. air density, For the exhaust temperature of server (3), For the server (3) intake air temperature, This is the revision factor.
3. The data center layout analysis method for optimizing airflow organization according to claim 1, characterized in that: The airflow organization evaluation indicators include the temperature field uniformity evaluation indicator D(T) and the velocity field uniformity evaluation indicator D(v). In the formula for Temperature distribution on a plane Average temperature For the effective area through which airflow passes, for Velocity distribution on a plane This represents the average speed.
4. The data center layout analysis method for optimizing airflow organization according to claim 1, characterized in that: The airflow organization analysis includes room (2) velocity distribution analysis, room (2) temperature analysis, cold aisle (16) temperature analysis, air inlet (13) and air outlet (14) temperature analysis and server (3) temperature analysis.
5. The data center layout analysis method for optimizing airflow organization according to claim 1, characterized in that, The cabinet (4) has 4 columns and 6 rows, and each cabinet (4) has 10 equipment layers. Each equipment layer has a server (3), and the entrance of the server (3) is equipped with an auxiliary fan (12).
6. The data center layout analysis method for optimizing airflow organization according to claim 1, characterized in that: The surface of the ventilated floor (25) is provided with a first porous floor (10) and a second porous floor (11), the porosity of the first porous floor (10) is 0.5, and the porosity of the second porous floor (11) is 0.3.