Wafer test chuck with adjustable vacuum zones

Abstract

The application relates to a wafer test bearing disc capable of adjusting a vacuum area, belonging to the field of semiconductor production and manufacturing, and comprising an adsorbing bearing disc, a bottom disc and a vacuum adjusting slide rod. A circular groove is formed in the center area of the bottom of the adsorbing bearing disc, an annular partition and a longitudinal partition are arranged in the circular groove, a cavity A is formed between the inside of the annular partition and the bottom disc, a cavity B is formed between the outside of the annular partition and the bottom disc, vacuum pipes A and B are communicated with the cavities A and B respectively, the vacuum adjusting slide rod is arranged along the radial direction of the circular groove and can rotate along the center of the circular groove, and is used for adjusting the angle between the vacuum adjusting slide rod and the longitudinal partition, so that the wafer disc with incomplete shape and the wafer disc with complete shape can be adsorbed. The wafer disc with incomplete shape can be placed according to the shape of the wafer disc, the adsorbing effect is good, the universality is higher, the stability of the wafer disc is improved, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a wafer test carrier plate with adjustable vacuum area, and belongs to the technical field of semiconductor production and manufacturing. BACKGROUND

[0002] Nowadays, intelligent electronic technology devices are developing towards lightness, thinness and integration. In order to meet the needs of technological development, wafer chips for production and testing are becoming thinner and thinner. After being thinned, the wafer chips need to be tested by devices with good adsorption and fixing ability to ensure the testing accuracy.

[0003] After being thinned, the gallium arsenide wafer is extremely thin and fragile, has a certain degree of warping, and is very easy to break. When testing the wafer, the wafer chip must be stably fixed on a platform to prevent shaking during the testing process and cause deviation in the test results.

[0004] In order to avoid the wafer chip from shaking, a special carrier plate is usually used at the bottom of the wafer chip. At present, in the wafer test industry, the fixing methods for testing and processing semiconductor wafer chips are two-end pressing method and vacuum adsorption method, the structures of which are shown in Figure 1 、 Figure 2 The disadvantage of the former is that when the two ends are pressed tightly, the stress is uneven, which easily causes the thinned wafer chip to break, and the wafer chip will leave marks pressed. This method is not convenient to operate, and there is no fixed limiting measure, so the position is not accurately positioned, and the two-end pressing method is only suitable for complete wafer chips. The disadvantage of the latter is that the universality is low, a vacuum carrier plate of one size can only correspond to one size of wafer chip, and testing other sizes or broken wafer chips will cause a part of the holes on the surface of the carrier plate to be not covered by the wafer chip, so that the vacuum cannot reach a closed environment.

[0005] At present, the vacuum adsorption method has a relatively perfect adsorption carrier plate for complete semiconductor wafer chips. However, there is no good fixing method for incomplete or broken wafer chips. A complete carrier plate can only be used for complete wafer chips, but cannot be used for incomplete wafer chips, because the incomplete wafer chips cannot completely cover the vacuum suction holes on the surface of the wafer carrier plate, which often causes insufficient vacuum adsorption capacity of the carrier plate or waste of vacuum, resulting in failure to test normally.

[0006] Therefore, the purpose of the present application is to provide a carrier plate that can adsorb incomplete wafer chips. SUMMARY

[0007] To solve the above problems, the application provides a wafer test bearing disc capable of adjusting a vacuum area, which can adjust the vacuum area according to the shape of a wafer, can place an incomplete wafer, has good adsorption effect, is more versatile, improves the stability of the wafer and improves production efficiency.

[0008] The application adopts the following technical scheme:

[0009] A wafer test bearing disc capable of adjusting a vacuum area, which comprises an adsorption bearing disc, a bottom disc and a vacuum adjusting slide rod, the adsorption bearing disc is circular and is provided with vacuum adsorption holes for adsorbing wafers, the bottom center of the adsorption bearing disc is hollowed out to form a circular groove, an annular partition is arranged in the circular groove, the annular partition divides the circular groove into two spaces, a longitudinal partition is fixedly arranged between the center of the circular groove and the inner wall and is perpendicular to the annular partition.

[0010] The bottom disc is preferably fixed to the bottom of the adsorption bearing disc by fixed screws, a cavity A is formed between the inner part of the annular partition and the bottom disc, a cavity B is formed between the outer part of the annular partition and the bottom disc, the bottom disc is internally provided with a vacuum pipe A and a vacuum pipe B, one end of the vacuum pipe A is communicated with the cavity A and the other end is located on the side wall of the bottom disc, one end of the vacuum pipe B is communicated with the cavity B and the other end is also located on the side wall of the bottom disc, which are used for vacuumizing, the vacuum pipes A and B enter the cavities A and B from the upper surface of the bottom disc through the side wall, different exhaust holes are used for vacuum adsorption according to the different sizes of semiconductor wafers, when the size of the wafer is small, only the cavity A is used, so only the vacuum pipe A is vacuumized, when the size of the wafer is large, the cavities A and B are used together, so the vacuum pipes A and B are vacuumized at the same time, and the wafer adsorption of different sizes is realized.

[0011] The vacuum adjusting slide rod is arranged along the radial direction of the circular groove and can rotate along the center of the circular groove, which is used for adjusting the angle between the slide rod and the longitudinal partition, and adsorbing incomplete wafers and complete wafers.

[0012] Preferably, the vacuum adjusting slide rod comprises a slide rod, an adjusting rod and a rotating shaft which are fixedly connected together, the adjusting rod and the slide rod are arranged in parallel and one end of each is fixed on the rotating shaft, the slide rod is arranged between the bottom disc and the adsorption bearing disc and is used for adjusting the angle between the slide rod and the longitudinal partition, and the adjusting rod is arranged outside the bottom disc and is used for manual adjustment.

[0013] The bottom center of the adsorption bearing disc is fixedly provided with a positioning column, the rotating shaft is arranged on the positioning column and can rotate along the positioning column, the slide rod is arranged in the circular groove at the bottom of the adsorption bearing disc and is provided with a sliding groove on the slide rod, which is used for cooperating with the annular partition, the sliding groove is in close contact with the annular partition, which does not affect the rotation of the slide rod and can ensure a certain sealing property.

[0014] The bottom of the rotating shaft penetrates the bottom plate and is located at the lower part of the bottom plate, that is, the bottom of the rotating shaft and the adjusting rod are located at the lower part of the bottom plate (outside the chamber A and the chamber B), since the sliding rod, the adjusting rod and the rotating shaft are fixedly connected, the rotation of the adjusting rod can adjust the rotation of the internal sliding rod.

[0015] Preferably, the initial angle between the sliding rod and the longitudinal partition is preferably 30°, and the maximum is 360°, and the longitudinal partition is coincident, and the vacuum pipeline A and the vacuum pipeline B are always located in the space between the sliding rod and the longitudinal partition.

[0016] The minimum angle between the sliding rod and the longitudinal partition is 30°, that is, the region between 0° and 30° is a region that must be used, and the region is always communicated with the vacuum pipeline A and the vacuum pipeline B, when the angle is between 30° and 360°, it is used for testing incomplete wafer, when it is necessary to measure irregular wafer, the angle between the sliding rod and the longitudinal partition (minimum 30°) can be adjusted according to the size of the irregular wafer, and it is judged whether the vacuum pipeline A works alone, the vacuum pipeline B works alone, or the vacuum pipeline A and B work together, when the angle is 360°, it is the maximum vacuum region, and the longitudinal partition is coincident, and this angle is commonly used for testing complete wafer.

[0017] Preferably, the vacuum adsorption holes of the adsorption carrier are distributed in rows along the central radius, and are diffused from the center to the outside, and each row of vacuum adsorption holes is on a straight line, so that the sliding rod of the vacuum adjusting sliding rod covers or does not cover all the vacuum adsorption holes on a straight line, if not on a straight line, it may cause that the vacuum adjusting sliding rod cannot cover all the air holes on a straight line on the bottom surface of the adsorption carrier, thereby causing air leakage.

[0018] Preferably, the vacuum adsorption holes penetrate the inner and outer of the adsorption carrier and are communicated with the chamber A or the chamber B, the upper surface hole diameter of the vacuum adsorption hole is 0.3mm, and the lower surface hole diameter is 3mm, the air hole with a diameter of 0.3mm on the upper surface can avoid too much stress on the wafer itself, and the air hole with a diameter of 3mm on the bottom of the carrier can provide sufficient vacuum for the air hole with a diameter of 0.3mm on the upper surface.

[0019] Preferably, a sealing strip is arranged on the upper part of the sliding rod and is in contact with the bottom of the adsorption carrier, and is used for sealing between the upper part of the sliding rod and the adsorption carrier, and the sealing is as good as possible without affecting the sliding in advance.

[0020] After installation, the bottom of the annular partition and the longitudinal partition is tightly attached to the bottom plate, and is sealed by vacuum grease, the bottom of the sliding rod is in contact with the bottom plate, and the sealing is as good as possible without affecting the sliding in advance, in order to better seal, the remaining contact places can be sealed by vacuum grease according to the specific situation.

[0021] Preferably, the annular partition is preferably 2 inches in range, the circular groove is preferably 4 inches in range (which can also extend to larger sizes), and the internal vacuum adjustment slide rod can adjust the size of the vacuum area at the bottom of the adsorption carrier plate, which can be used together with the bottom cavities A and B of the adsorption carrier plate or used alone. This method can enable one adsorption carrier plate to adsorb a variety of wafer pieces of corresponding sizes, and the vacuum area can be adjusted by the vacuum adjustment slide rod for adsorbing irregular wafer pieces, and the vacuum area is slightly smaller than the wafer piece to be tested during testing of the irregular wafer piece, so that stable adsorption can be achieved.

[0022] Preferably, a wrench is arranged at the end of the adjusting rod to facilitate manual adjustment.

[0023] In the present application, the incomplete wafer piece has the same function as the complete wafer piece. The incomplete wafer piece is only damaged or broken during processing and testing, and the edge part and a small part of the broken part may not be usable, but a large part of the middle part is still in good condition and can be used. The present application mainly adsorbs 2 / 4-inch fan-shaped wafer pieces, and other irregular wafer pieces are also possible. The vacuum area can be adjusted to be slightly smaller than the area of the irregular wafer piece, which can also achieve good fixing effect (the vacuum area cannot be larger than the area of the irregular wafer piece).

[0024] The details of the present application can be referred to the prior art.

[0025] The beneficial effects of the present application are:

[0026] 1) The adjustable vacuum area wafer test carrier plate of the present application adopts vacuum adsorption, and different cavities and vacuum area sizes can be selected according to the size and shape of different wafer pieces. Not only complete wafer pieces can be tested, but also incomplete wafer pieces can be tested, which can meet the testing requirements of wafer pieces of different sizes and have stronger adaptability, solving the previous predicament that only complete wafer pieces can be tested.

[0027] 2) The present application has a simple structure, and complete wafer pieces and incomplete wafer pieces can be tested by using one carrier plate without increasing equipment investment, which reduces the unqualified rate of wafer pieces during processing and testing, saves the loss of raw materials, greatly improves the production efficiency, has low cost, and is beneficial to mass production and application. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is a traditional two-end tablet fixing method;

[0029] Figure 2 It is a carrier plate structure of the current vacuum adsorption method, wherein (a) is the bottom of the carrier plate, and (b) is the upper part of the carrier plate.

[0030] Figure 3A structural schematic diagram of a wafer test carrier plate with adjustable vacuum area according to the present application;

[0031] Figure 4 A structural schematic diagram of an adsorption carrier plate according to the present application;

[0032] Figure 5 A structural schematic diagram of a vacuum adjustment slide rod according to the present application;

[0033] Figure 6 A structural schematic diagram of a base plate according to the present application;

[0034] Figure 7 A structural schematic diagram of a slide rod and a longitudinal partition with an included angle of 30° according to the present application;

[0035] Figure 8 A structural schematic diagram of a slide rod and a longitudinal partition with an included angle of 360° according to the present application;

[0036] Wherein, 1 is an adsorption carrier plate, 2 is a base plate, 3 is a vacuum adjustment slide rod, 4 is a vacuum adsorption hole, 5 is an annular partition, 6 is a longitudinal partition, 7 is a fixing screw, 8 is a vacuum pipeline A, 9 is a vacuum pipeline B, 10 is a slide rod, 11 is an adjustment rod, 12 is a rotating shaft, 13 is a positioning column, 14 is a sliding groove, 15 is a sealing strip, and 16 is a wrench. DETAILED DESCRIPTION

[0037] To make the technical problems, technical solutions and advantages of the present application clearer, specific embodiments will be described in detail below with reference to the accompanying drawings, but the present application is not limited to the embodiments. The present application is not described in detail, and is based on the conventional technology in the art.

[0038] Example 1

[0039] A wafer test carrier plate with adjustable vacuum area, as shown in Figures 3-8 The wafer test carrier plate with adjustable vacuum area includes an adsorption carrier plate 1, a base plate 2 and a vacuum adjustment slide rod 3. The adsorption carrier plate 1 is circular and has vacuum adsorption holes 4 distributed thereon for adsorbing wafer pieces. A circular recess is formed in the center of the bottom of the adsorption carrier plate 1. An annular partition 5 is arranged in the circular recess, which divides the circular recess into two spaces. A longitudinal partition 6 is fixedly arranged between the center of the circular recess and the inner wall, and is perpendicular to the annular partition 5.

[0040] The bottom plate 2 is preferably fixed to the bottom of the adsorption carrier plate 1 by fixing screws 7, a chamber A is formed between the inner part of the annular partition 5 and the bottom plate 2, a chamber B is formed between the outer part of the annular partition 5 and the bottom plate 2, the bottom plate 2 is internally provided with a vacuum pipe A 8 and a vacuum pipe B 9, one end of the vacuum pipe A 8 is communicated with the chamber A and the other end is located at the side wall of the bottom plate 2, one end of the vacuum pipe B 9 is communicated with the chamber B and the other end is also located at the side wall of the bottom plate 2, which is used for vacuumizing, the vacuum pipe A / B is connected with the chamber A / chamber B respectively from the upper surface of the bottom plate through the side wall, different exhaust holes are used for vacuum adsorption according to the different size requirements of the semiconductor wafer, when the size of the wafer is small, only the chamber A is used, and only the vacuum pipe A is vacuumized, when the size of the wafer is large, the chambers A and B are used together, and the vacuum pipes A and B are vacuumized at the same time, so that the wafers of different sizes can be adsorbed.

[0041] The vacuum adjusting slide rod 3 is arranged along the radial direction of the circular groove and can rotate along the center of the circular groove, which is used for adjusting the angle between the slide rod and the longitudinal partition, and adsorbing the incomplete wafer and the complete wafer.

[0042] Embodiment 2

[0043] A wafer test bearing plate with adjustable vacuum area, the structure is as described in embodiment 1, the difference is that the vacuum adjusting slide rod 3 includes a slide rod 10, an adjusting rod 11 and a rotating shaft 12 which are fixedly connected together, the adjusting rod 11 and the slide rod 10 are arranged in parallel and one end of each is fixed on the rotating shaft 12, the slide rod 10 is arranged between the bottom plate 2 and the adsorption carrier plate 1, which is used for adjusting the angle between the slide rod 10 and the longitudinal partition 6, and the adjusting rod 11 is arranged outside the bottom plate 2, which is used for manual adjustment.

[0044] A positioning column 13 is fixedly arranged at the center of the bottom of the adsorption carrier plate 1, the rotating shaft 12 is arranged on the positioning column 13 and can rotate along the positioning column 13, the slide rod 10 is arranged in the circular groove at the bottom of the adsorption carrier plate, and a sliding groove 14 is arranged on the slide rod 10, which is used for cooperating with the annular partition, the sliding groove 14 is in close contact with the annular partition, which does not affect the rotation of the slide rod and can ensure a certain sealing property.

[0045] The rotating shaft 12 penetrates the bottom plate and is located at the lower part of the bottom plate, that is, the bottom of the rotating shaft 12 together with the adjusting rod 11 is located at the lower part of the bottom plate (outside the chamber A and the chamber B), since the slide rod, the adjusting rod and the rotating shaft are fixedly connected, the rotation of the internal slide rod 10 can be adjusted by the rotation of the adjusting rod 11.

[0046] Embodiment 3

[0047] A wafer test carrier plate with adjustable vacuum area, the structure is as described in embodiment 2, the difference is that the initial angle between the slide bar 10 and the longitudinal partition 6 is 30°, and the maximum is 360° (coinciding with the longitudinal partition 6), and the vacuum pipe A 8 and the vacuum pipe B 9 are always located in the space between the slide bar and the longitudinal partition.

[0048] The minimum angle between the slide bar 10 and the longitudinal partition 6 in this embodiment is 30°, that is, the area between 0° and 30° is the area that must be used, and this area is always in communication with the vacuum pipe A and the vacuum pipe B, when the angle is between 30° and 360°, it is used for testing incomplete wafer, when irregular wafer needs to be measured, the angle between the slide bar 10 and the longitudinal partition 6 can be adjusted (the minimum is 30°) according to the size of the irregular wafer, and it is judged whether the vacuum pipe A works alone (small size) or the vacuum pipe A and B work together (large size), when the angle is 360°, it is the maximum vacuum area, coinciding with the longitudinal partition, and this angle is often used for testing complete wafer.

[0049] Embodiment 4:

[0050] A wafer test carrier plate with adjustable vacuum area, the structure is as described in embodiment 3, the difference is that the vacuum adsorption holes 4 of the adsorption carrier plate 1 are distributed in rows along the center radius, and spread outwards from the center, and each row of vacuum adsorption holes 4 is on a straight line, which facilitates the slide bar 10 of the vacuum adjustment slide bar to cover or not cover all the vacuum adsorption holes on a straight line, if not on a straight line, it may cause the vacuum adjustment slide bar to not cover all the air holes on a straight line on the bottom surface of the adsorption carrier plate, thereby causing air leakage.

[0051] Embodiment 5:

[0052] A wafer test carrier plate with adjustable vacuum area, the structure is as described in embodiment 4, the difference is that the vacuum adsorption holes 4 penetrate the inner and outer of the adsorption carrier plate 1 and are in communication with the chamber A or the chamber B, the upper surface hole diameter of the vacuum adsorption hole 4 is 0.3mm, and the lower surface hole diameter is 3mm, the 0.3mm air hole on the upper surface can avoid causing too much stress on the wafer itself, and the 3mm diameter air hole on the bottom of the carrier plate can provide sufficient vacuum for the 0.3mm diameter air hole on the upper surface.

[0053] Embodiment 6:

[0054] A wafer test carrier plate with adjustable vacuum area, the structure is as described in embodiment 5, the difference is that a sealing strip 15 is arranged on the upper part of the slide bar 10 and in contact with the bottom of the adsorption carrier plate 1, which is used for sealing between the upper part of the slide bar and the adsorption carrier plate, and the sealing is as good as possible without affecting the rotation in advance;

[0055] After installation, the annular partition 5 and the bottom of the longitudinal partition 6 are tightly attached to the bottom plate, and a vacuum grease seal is used, the bottom of the sliding rod is in contact with the bottom plate, and the sealing is maintained as much as possible without affecting the sliding, in order to better seal, the remaining contact places can be sealed with vacuum grease according to the specific situation.

[0056] Example 7

[0057] A wafer test bearing disc with adjustable vacuum area, the structure is as described in Example 6, the difference is that the annular partition 5 is 2 inches in range, the circular groove is 4 inches in range (which can also be extended to a larger size), the internal vacuum adjusting sliding rod can adjust the size of the vacuum area at the bottom of the adsorbing bearing disc, and can be used together with the adsorbing bearing disc bottom cavity A, B or independently, this method can make one adsorbing bearing disc adsorb a variety of corresponding size wafer, and can adjust the vacuum area through the vacuum adjusting sliding rod for adsorbing irregular wafer, and when testing irregular wafer, the vacuum area is slightly smaller than the tested wafer, which can be stably adsorbed.

[0058] Example 8

[0059] A wafer test bearing disc with adjustable vacuum area, the structure is as described in Example 7, the difference is that the end of the adjusting rod 11 is detachably provided with a wrench 16, which is convenient for manual adjustment.

[0060] Experimental example

[0061] A wafer test bearing disc with adjustable vacuum area, when testing incomplete or broken wafers, because of the incomplete shape, the fixed 2-inch, 4-inch and other wafer placement positions cannot meet the requirements, the vacuum adjusting sliding rod can adjust the vacuum space of the wafer adsorbing bearing disc, and the angle can be adjusted according to the requirements to test the incomplete wafer, and the vacuum pipe A and the vacuum pipe B can be used separately or jointly.

[0062] The wafer bearing disc with adjustable vacuum area of the present application can selectively use the air holes on the surface of the bearing disc according to requirements, meet the requirements of processing and testing, and ensure the absolute level of each point of the wafer, good position stability, and less deviation, so that the failure rate is greatly reduced in the production and processing process, and the product consistency is higher.

[0063] Comparative example

[0064] A wafer test bearing disc with adjustable vacuum area, as shown in Example 8, the difference is that the air holes on the surface of the bearing disc cannot be selectively used according to requirements, only two situations of all use and all not use. The original semiconductor wafer bearing disc is generally 4 inches in size.

[0065] If a machine is installed with a 4-inch wafer carrier, the machine can only test 4-inch wafers. If a broken wafer is to be tested, a large number of air holes will not be covered by the wafer, which will cause two problems: first, the vacuum will be wasted; second, the vacuum degree will be reduced because a large number of air holes are not covered by the wafer and are in communication with the atmosphere, the wafer will not be adsorbed firmly, and the test result will be affected. The current solution is to cut a piece of paper into a 4-inch circle, and then cut out a shape according to the wafer to be tested according to a 1:1 ratio in the middle, so as to complement a 4-inch circle and place it on the carrier. The air holes not covered by the wafer are covered by the cut paper to form a vacuum environment. This method is inconvenient and time-consuming and laborious. One piece of paper can only correspond to one incomplete wafer, and cannot be used with other wafers. This method seriously reduces the production efficiency, and the paper is relatively fragile and is prone to hidden dangers if not fixed properly.

[0066] The above is the preferred embodiment of the present application. It should be noted that for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which should also be considered within the scope of protection of the present application.

Claims

1. A wafer testing support disk with an adjustable vacuum region, characterized in that, The device includes an adsorption carrier, a base, and a vacuum adjustment slide bar. The adsorption carrier is circular and has vacuum adsorption holes distributed on it for adsorbing wafers. A circular groove is formed by hollowing out the central area at the bottom of the adsorption carrier. An annular partition is provided in the circular groove, which divides the circular groove into two spaces. A longitudinal partition is fixed between the center of the circular groove and the inner wall, perpendicular to the annular partition. The chassis is fixed to the bottom of the adsorption carrier. The annular partition forms a chamber A between itself and the chassis, and the annular partition forms a chamber B between itself and the chassis. Vacuum pipe A and vacuum pipe B are provided inside the chassis. One end of vacuum pipe A is connected to chamber A, and the other end is located on the side wall of the chassis. One end of vacuum pipe B is connected to chamber B, and the other end is also located on the side wall of the chassis. It is used for evacuation. The vacuum adjustment slide is arranged radially along the circular groove and can rotate around the center of the circular groove to adjust the angle between it and the longitudinal partition, and to adsorb incomplete wafers and complete wafers. The vacuum adjustment slide bar includes a slide bar, an adjustment rod, and a rotating shaft that are fixedly connected together. The adjustment rod and the slide bar are arranged in parallel, and one end of each is fixed on the rotating shaft. The slide bar is located between the chassis and the adsorption carrier plate and is used to adjust the angle between the slide bar and the longitudinal partition. The adjustment rod is located outside the chassis and is used for manual adjustment. A positioning post is fixedly installed at the center of the bottom of the adsorption carrier plate. A rotating shaft is installed on the positioning post and can rotate along the positioning post. The sliding rod is installed in the circular groove at the bottom of the adsorption carrier plate, and a sliding groove is provided on the sliding rod for cooperating with the annular partition. The bottom of the rotating shaft passes through the chassis and is located at the bottom of the chassis, that is, the bottom of the rotating shaft together with the adjusting rod is located at the bottom of the chassis; The angle between the sliding rod and the longitudinal partition is initially 30° and maximum 360°. Vacuum pipe A and vacuum pipe B are always located in the space between the sliding rod and the longitudinal partition. The vacuum adsorption holes of the adsorption carrier disk are arranged in rows radially along its center, spreading outward from the center, with each row of vacuum adsorption holes in a straight line. The vacuum adsorption hole penetrates both the inside and outside of the adsorption carrier disk. The upper surface diameter of the vacuum adsorption hole is 0.3 mm, and the lower surface diameter is 3 mm. A sealing strip is provided on the upper part of the slide bar, which contacts the bottom of the adsorption tray and is used to seal the upper part of the slide bar and the adsorption tray.

2. The wafer test support disk with adjustable vacuum region according to claim 1, characterized in that, The circular divider is 2 inches in length, and the circular recess is 4 inches in length.

3. The wafer test support disk with adjustable vacuum region according to claim 2, characterized in that, A wrench is provided at the end of the adjusting rod for easy manual adjustment.

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