A fully inorganic packaging production and preparation device and method for deep ultraviolet chips

Abstract

The present invention discloses a fully inorganic packaging production and preparation device and method for a deep ultraviolet chip in the field of deep ultraviolet light-emitting diode packaging technology. The device comprises a base plate and a first belt conveyor assembly, a second belt conveyor assembly, a packaging shell assembly, a packaging base assembly and an installation assembly arranged on the base plate. The first belt conveyor assembly and the second belt conveyor assembly are respectively used to convey the packaging shell assembly and the packaging base assembly; the installation assembly is used to automatically install the packaging shell assembly on the packaging base to realize automatic inorganic packaging of the deep ultraviolet chip; the present invention can not only realize automatic inorganic packaging of the deep ultraviolet chip, but also make the deep ultraviolet chip after inorganic packaging more beautiful.

Description

Technical Field

[0001] The present invention relates to the technical field of deep ultraviolet light-emitting diode packaging, and in particular to a fully inorganic packaging production and preparation device and method for deep ultraviolet chips. Background Art

[0002] High-power deep ultraviolet light-emitting diodes with wavelengths between 220nm and 350nm are widely used in sterilization, water purification, medical treatment, high-density optical recording, high-color rendering LED lighting, and high-speed decomposition and treatment of pollutants. To date, deep ultraviolet light sources have been dominated by ultraviolet lasers and gas lamps using gases and solids as media, such as excimer lasers and various frequency-doubled lasers. High-brightness deep ultraviolet LEDs and deep ultraviolet LDs using semiconductors can be miniaturized to obtain inexpensive, efficient and long-life ultraviolet light sources, and have broad application prospects.

[0003] At present, when deep ultraviolet chips are inorganically packaged, the installation of packaging materials is mostly done manually, which is not conducive to the mass production of deep ultraviolet chip inorganic packaging; and tin is mostly used as the packaging material. Although the solder can package the chip well after melting, the solder will diffuse outward when melting, causing some solder to overflow outside the packaging material, which will not only greatly reduce the aesthetics, but also increase the installation space of the package.

[0004] Based on this, the present invention designs a fully inorganic packaging production and preparation device and method for deep ultraviolet chips to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a fully inorganic packaging production and preparation device and method for deep ultraviolet chips to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a fully inorganic packaging production and preparation equipment for deep ultraviolet chips, comprising a base plate and a first belt conveyor assembly, a second belt conveyor assembly, a packaging shell assembly, a packaging base assembly and an installation assembly arranged on the base plate, wherein the first belt conveyor assembly and the second belt conveyor assembly are used to convey the packaging shell assembly and the packaging base assembly respectively; the installation assembly is used to automatically install the packaging shell assembly on the packaging base to realize automatic inorganic packaging of the deep ultraviolet chip.

[0007] As a further solution of the present invention, the packaging base assembly includes a substrate, a mounting seat for mounting a deep ultraviolet chip is provided in the center of the substrate, and an annular mounting groove is provided on the substrate; the annular mounting groove surrounds the mounting seat on its inner side, and the tops of the inner and outer rings of the annular mounting groove are provided with mounting chamfers, a solder ring is installed in the annular mounting groove and fits with its inner ring, and an annular sealing block is provided above the solder ring and fits with the inner ring mounting chamfer; a number of limit grooves are provided on the annular sealing block; a number of arc-shaped sealing blocks distributed in a circular array are provided on the outside of the annular mounting groove, and a number of the arc-shaped sealing blocks can be combined into a circular ring that fits with the outer ring mounting chamfer; the arc-shaped sealing blocks are all slidably connected to a first clamping block, and the first clamping block is fixedly connected to a first spring for its reset; the bottom of the annular mounting groove is provided with a number of T-shaped clamping grooves distributed in a circular array.

[0008] As a further solution of the present invention, the packaging shell assembly includes an annular sleeve; a lens is fixedly connected to the inner wall of the annular sleeve, and a plurality of fixed blocks are fixedly connected to the bottom of the annular sleeve, and the number of the fixed blocks is the same as the number of the T-shaped slots; the fixed block is slidably connected to a first trapezoidal block, and the first trapezoidal blocks are fixedly connected to a second spring for their reset, and the first trapezoidal blocks can cooperate with the T-shaped slot to limit the fixed block; a plurality of first limit blocks are fixedly connected to the inner wall of the annular sleeve, and the number of the first limit blocks is the same as the number of the limit grooves, and the first limit blocks can be respectively engaged with the limit grooves; a plurality of first slots distributed in a circular array are provided on the outer wall of the annular sleeve, and the number of the first slots is equal to the number of the first blocks and can be engaged with the first blocks.

[0009] As a further solution of the present invention, the first belt conveyor assembly includes two first conveyor rollers and a first belt, the two first conveyor rollers are rotatably connected to the bottom plate, and the first belt is transmission-connected to the two first conveyor rollers.

[0010] As a further solution of the present invention, the second belt conveyor assembly includes two second conveyor rollers and a second belt, the two second conveyor rollers are rotatably connected to the base plate, the second conveyor roller is located on the rear side of the first conveyor roller, and the second belt is transmission-connected to the two first conveyor rollers.

[0011] The top end of the lifting plug in the spring is fixedly provided with a toothed connecting strip which is cooperatively connected with the toothed connecting strip, and the bottom end of the lifting plug in the toothed connecting strip is connected with the toothed connecting strip in a forward and backward direction. The cam is fixedly mounted on the support frame, and the cam is secured to the support frame with an angular channel formed between a first end of and a second end of which the cam is secured to a first position and a second position relative to the support frame.

[0012] As a further solution of the present invention, a second clamping block is slidably connected to the outer wall of the arc-shaped sealing block, and a sixth spring for resetting the second clamping block is fixedly connected to the second clamping block; a second clamping groove that can be clamped with the second clamping block is opened on the base plate.

[0013] A method for producing a fully inorganic package of a deep ultraviolet chip, the method comprising the following steps:

[0014] Step 1: The staff places the package shell assembly and the package base assembly on the first belt conveyor assembly and the second belt conveyor assembly respectively;

[0015] Step 2: After the packaging base assembly moves to the bottom of the installation assembly, stop the operation of the first belt conveyor assembly and the second belt conveyor assembly;

[0016] Step 3: Start the installation component to grab the package shell component, and then the installation component installs the package shell component on the package base component, so that the package shell component and the package base component realize inorganic packaging of the deep ultraviolet chip;

[0017] Step 4: The second belt conveyor assembly transports the packaged finished products to the collection location, where staff collect the finished products.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention can make the docking of the substrate and the annular sleeve more convenient and simple by setting the packaging base component and the packaging shell component. After the substrate and the annular sleeve are docked, the substrate, the solder ring, the annular sealing block, the arc-shaped sealing block, the annular sleeve and the lens will form a relatively fixed sealed space, and the deep ultraviolet chip will be sealed in the sealed space; then the solder ring is heated to melt the solder ring. After the solder ring is melted, the annular sleeve, the substrate and the annular sealing block are fixed more stably, and the space inside the substrate and the annular sleeve can be absolutely sealed, so that The deep ultraviolet chip works in a completely sealed space, and the solder ring will not overflow to the outside of the annular sleeve after melting. At the same time, the solder on the inner side of the substrate will also be blocked by the annular sealing block, so that the solder will not overflow upward to the inner top surface of the substrate, which can ensure that the solder will not be seen when looking down at the chip from the lens, and can ensure that solder will not appear on the outside of the substrate, which can greatly increase the aesthetics of the inorganic package; and the solder ring will not cause the annular sleeve to shift when melting, which can ensure that the position of the lens relative to the chip remains in the most central position, so that the chip can work better.

[0020] 2. The present invention arranges the clamping plate and the third push rod, so that the annular sleeve can be automatically inserted into the annular mounting groove and fixed to the substrate. After the annular sleeve is relatively fixed to the substrate, the arc-shaped sealing block can be driven to automatically move into the outer mounting chamfer, so that the arc-shaped sealing block can seal the outer mounting chamfer, thereby ensuring the aesthetics of the substrate of the clamping plate, and ensuring the accuracy and efficiency of the inorganic packaging of the deep ultraviolet chip, so that the inorganic packaging of the deep ultraviolet chip can be more easily mass-produced. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a flow chart of the method of the present invention;

[0022] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 3 This is a schematic structural diagram of the packaging base assembly of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the package shell assembly of the present invention;

[0025] Figure 5It is a schematic cross-sectional view of the structure after the package base component and the package shell component of the present invention are assembled;

[0026] Figure 6 for Figure 5 A partial enlarged view of the middle A;

[0027] Figure 7 for Figure 5 Schematic diagram of the front view in the state;

[0028] Figure 8 for Figure 7 A partial enlarged view of point B in the middle;

[0029] Figure 9 This is a schematic cross-sectional view of the arc-shaped sealing plate structure of the present invention;

[0030] Figure 10 It is a schematic cross-sectional view of the overall structure of the present invention;

[0031] Figure 11 for Figure 10 A partial enlarged view of point C in the middle;

[0032] Figure 12 This is a cross-sectional diagram of the relationship between the structure of the mounting assembly and the position of the annular sleeve of the present invention;

[0033] Figure 13 Schematic diagram of the connection and positional relationship between the second mounting plate and the third push rod of the present invention.

[0034] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0035] Substrate 101, mounting seat 102, annular mounting groove 103, mounting chamfer 104, solder ring 105, annular sealing block 106, limiting groove 107, arc-shaped sealing block 108, first clamping block 109, first spring 110, T-shaped clamping groove 111, annular sleeve 201, lens 202, fixing block 203, first trapezoidal clamping block 204, second spring 205, first limiting block 206, first clamping groove 207, first conveyor roller 301, first belt 302, second conveyor roller 401, second belt 402 , first mounting plate 501, threaded rod 502, first slider 503, cylinder 504, fixing plate 505, third spring 506, mounting frame 507, clamping plate 508, fourth spring 509, first push rod 510, second limit block 511, second trapezoidal block 512, fifth spring 513, first gas spring 514, second push rod 515, wedge block 516, second mounting plate 517, third push rod 518, arc spring 519, second slider 520, second block 6, sixth spring 7, base plate 8. DETAILED DESCRIPTION

[0036] See also Figure 1-13The present invention provides a technical solution: a fully inorganic packaging production and preparation equipment for deep ultraviolet chips, including a base plate 8 and a first belt conveyor assembly, a second belt conveyor assembly, a packaging shell assembly, a packaging base assembly and an installation assembly arranged on the base plate 8, the first belt conveyor assembly and the second belt conveyor assembly being used to convey the packaging shell assembly and the packaging base assembly respectively; the installation assembly being used to automatically install the packaging shell assembly on the packaging base to realize automatic inorganic packaging of the deep ultraviolet chip.

[0037] When the above scheme is put into actual use, the staff will place the packaging shell assembly and the packaging base assembly on the first belt conveyor assembly and the second belt conveyor assembly respectively, so that the first belt conveyor assembly and the second belt conveyor assembly convey the packaging shell assembly and the packaging base assembly to the bottom of the installation assembly, and then start the installation assembly. The installation assembly will first clamp the packaging shell assembly, and after the packaging shell assembly moves to just above the packaging base assembly, the installation assembly will drive the packaging shell assembly to move downward, so that the packaging shell assembly is inserted into the packaging base assembly. After the packaging shell assembly moves downward to a point where it cannot move, the packaging shell assembly and the packaging base assembly are docked, and then the installation assembly can return to its initial position, and the first belt conveyor assembly will then convey the docked packaging shell assembly and packaging base assembly to the right, and before moving to the collection position, the packaging base assembly is heated so that the packaging base assembly and the packaging shell assembly are combined into a whole to form an inorganic package; this can ensure the accuracy and efficiency of the inorganic packaging of deep ultraviolet chips, and can make the inorganic packaging of deep ultraviolet chips more mass-produced.

[0038] As a further solution of the present invention, the package base assembly includes a substrate 101, a mounting seat 102 for mounting a deep ultraviolet chip is provided at the center of the substrate 101, and an annular mounting groove 103 is provided on the substrate 101; the annular mounting groove 103 surrounds the mounting seat 102 on its inner side, and the tops of the inner and outer circles of the annular mounting groove 103 are provided with mounting chamfers 104, a solder ring 105 is installed in the annular mounting groove 103 to fit with its inner circle, and an annular sealing member 105 is provided above the solder ring 105 to fit with the inner circle mounting chamfer 104. Block 106; a plurality of limiting grooves 107 are provided on the annular sealing block 106; a plurality of arc-shaped sealing blocks 108 distributed in a circular array are provided on the outside of the annular mounting groove 103, and a plurality of the arc-shaped sealing blocks 108 can be combined into a circular ring that fits the outer ring mounting chamfer 104; the arc-shaped sealing blocks 108 are all slidably connected to a first clamping block 109, and the first clamping block 109 is fixedly connected to a first spring 110 for its reset; the bottom of the annular mounting groove 103 is provided with a plurality of T-shaped clamping grooves 111 distributed in a circular array.

[0039] The packaging shell assembly includes an annular sleeve 201; a lens 202 is fixedly connected to the inner wall of the annular sleeve 201, and a plurality of fixed blocks 203 are fixedly connected to the bottom of the annular sleeve 201. The number of the fixed blocks 203 is the same as the number of the T-shaped card slots 111. The fixed blocks 203 are slidably connected to the first trapezoidal card blocks 204. The first trapezoidal card blocks 204 are all fixedly connected to the second spring 205 for resetting. The first trapezoidal card blocks 204 can be fixedly connected to the T-shaped card slots. 111 cooperates with the limiting fixing block 203; a plurality of first limiting blocks 206 are fixedly connected to the inner wall of the annular sleeve 201, the number of the first limiting blocks 206 is the same as the number of the limiting grooves 107, and the first limiting blocks 206 can be respectively engaged with the limiting grooves 107; a plurality of first engaging grooves 207 distributed in a circular array are provided on the outer wall of the annular sleeve 201, the number of the first engaging grooves 207 is equal to the number of the first engaging blocks 109 and can be engaged with the first engaging blocks 109.

[0040] When the above solution is put into practical use, when installing the package base assembly, first place the deep ultraviolet chip into the mounting seat 102, and then place the solder ring 105 into the annular mounting groove 103. By setting the mounting chamfer 104, the solder ring 105 can be aligned more simply and placed more easily; then place the annular sealing block 106 above the solder ring 105 so that the annular sealing block 106 fills the mounting chamfer 104; when the mounting assembly drives the package shell assembly to move downward, the annular sleeve 201 drives the fixing block 203 and the first trapezoidal block 204 to move downward. When the first trapezoidal block 204 is moved to contact the side of the T-shaped slot 111, the T-shaped slot 111 will squeeze the inclined surface of the first trapezoidal block 204 to make the first trapezoidal block 204 move closer to the fixed block 203. When the bottom surface of the fixed block 203 is in contact with the bottom surface of the T-shaped slot 111, the first trapezoidal block 204 moves to the bottom of the T-shaped slot 111. Then, the first trapezoidal block 204 will move outward under the elastic force of the second spring 205. At this time, the first trapezoidal block 204 cooperates with the side wall of the T-shaped slot 111 to make the annular sleeve 201 and the base The plate 101 is relatively fixed, and the first limiting block 206 will be inserted into the limiting groove 107. The first limiting block 206 can limit the annular sealing block 106, so that the first limiting block 206, the annular sleeve 201 and the substrate 101 are relatively fixed; after the installation component drives the annular sleeve 201 to be inserted into the annular installation groove 103, the installation component will drive the arc-shaped sealing block 108 to move toward the direction close to the annular sleeve 201 until the arc-shaped sealing block 108 is inserted into the outer installation chamfer 104. At this time, the top surface of the arc-shaped sealing block 108 is aligned with the top surface of the substrate 101. The arcuate surfaces of the plurality of arcuate sealing blocks 108 will form a circle that is completely in contact with the outer wall of the annular sleeve 201 after being inserted into the outer mounting chamfer 104, and the first clamping block 109 will be inserted into the corresponding first clamping groove 207, and then the arcuate sealing block 108 will be relatively fixed to the annular sleeve 201 through the first clamping block 109; at this time, the substrate 101, the solder ring 105, the annular sealing block 106, the arcuate sealing block 108, the annular sleeve 201 and the lens 202 form a relatively fixed sealed space, and the deep ultraviolet chip is sealed in the sealed space;The solder ring 105 is then heated to melt it. Once melted, the solder ring 105 secures the annular sleeve 201, substrate 101, and annular sealing block 106 more stably. This ensures that the substrate 101 and the space inside the annular sleeve 201 are absolutely sealed, allowing the deep ultraviolet chip to operate in a completely sealed space. After melting, the solder ring 105 will not overflow outside the annular sleeve 201. At the same time, the solder inside the substrate 101 will be blocked by the annular sealing block 106, preventing it from overflowing upward onto the inner top surface of the substrate 101. This ensures that the solder is not visible when looking down at the chip from the lens 202, and that no solder appears on the outside of the substrate 101, greatly enhancing the aesthetics of the inorganic package. Furthermore, when melted, the solder ring 105 will not cause the annular sleeve 201 to shift, ensuring that the lens 202 remains in the most central position relative to the chip, allowing the chip to operate better.

[0041] As a further solution of the present invention, the first belt conveyor assembly includes two first conveyor rollers 301 and a first belt 302, the two first conveyor rollers 301 are rotatably connected to the base plate 8, and the first belt 302 is transmission-connected to the two first conveyor rollers 301; during operation, the packaging shell assembly is placed on the first belt 302, and then the first conveyor roller 301 is rotated, and the first belt 302 drives the packaging shell assembly to move right to the front and bottom of the installation assembly.

[0042] As a further solution of the present invention, the second belt conveyor assembly includes two second conveyor rollers 401 and a second belt 402, the two second conveyor rollers 401 are rotatably connected to the base plate 8, the second conveyor roller 401 is located on the rear side of the first conveyor roller 301, and the second belt 402 is transmission-connected to the two first conveyor rollers 301; when working, the packaging base assembly is placed on the second belt 402, and then the second conveyor roller 401 is rotated, and the second belt 402 drives the packaging base assembly to move to the right to directly below the installation assembly.

[0043] As a further solution of the present invention, the mounting assembly includes a first mounting plate 501, the first mounting plate 501 is fixedly connected to the top of the base plate 8, the first mounting plate 501 is rotatably connected to a threaded rod 502, the threaded rod 502 is threadedly connected to a first slider 503, the first slider 503 is slidably connected to the first mounting plate 501 in the front-back direction, the bottom of the first slider 503 is fixedly connected to a cylinder 504, the output end of the cylinder 504 is fixedly connected to a fixed plate 505, and the bottom of the fixed plate 505 is fixedly connected to a third elastic member. The bottom end of the third spring 506 is fixedly connected to a mounting bracket 507, and the mounting bracket 507 is slidably connected to the fixed plate 505 in the vertical direction. The mounting bracket 507 is slidably connected to two symmetrically arranged clamping plates 508 in the left and right directions. The clamping plates 508 are fixedly connected to a fourth spring 509 for resetting them; the sides of the clamping plates 508 can be provided with a first push rod 510 for driving them to slide outward; the first push rod 510 is fixedly connected to the fixed plate 505, and the first push rod 510 is fixedly connected to the second limiting The second limit block 511 can be provided with a second trapezoidal block 512 below the second limit block 511, and the second trapezoidal block 512 is slidably connected to the second slider 520, and the second slider 520 is slidably connected to the mounting bracket 507 in the front and rear directions; the second trapezoidal block 512 is fixedly connected to a fifth spring 513 for its reset; the second slider 520 is fixedly connected to a first gas spring 514 for its reset, and the second slider 520 is fixedly connected to a second push rod 515, and the front side of the second push rod 515 is provided with a gas spring for driving the second push rod 515. The wedge block 516 moves backward, and the wedge block 516 is fixedly connected to the base plate 8; the outer side of the clamping plate 508 is provided with a second mounting plate 517, and the second mounting plate 517 is fixedly connected to the fixed plate 505; a plurality of third push rods 518 are rotatably connected to the second mounting plate 517, and the number of the third push rods 518 is equal to the number of the arc-shaped sealing blocks 108, and the third push rods 518 are respectively used to drive the arc-shaped sealing blocks 108 to move; the side wall of the third push rod 518 is fixedly connected with an arc spring 519 for its reset.

[0044] When the above-mentioned mounting assembly is actually working, the external motor is first started to drive the threaded rod 502 to rotate, so that the threaded rod 502 drives the first slider 503, the cylinder 504, the fixed plate 505, the mounting bracket 507 and the clamping plate 508 to move forward together. When the clamping plate 508 moves to the top of the package shell assembly, the motor is stopped, and then the cylinder 504 drives the fixed plate 505, the mounting bracket 507 and the clamping plate 508 to move downward until the two clamping plates 508 clamp the annular sleeve 201. Then the cylinder 504 drives the fixed plate 505, the mounting bracket 507, the clamping plate 508 and the annular sleeve 201 to move upward, and then the motor is started to drive the threaded rod 502 to move forward. The rod 502 is reversed, so that the threaded rod 502 drives the first slider 503, the cylinder 504, the fixed plate 505, the mounting bracket 507, the clamping plate 508 and the annular sleeve 201 to move backward until the annular sleeve 201 moves to the top of the sealing base assembly, and then the motor is stopped. Then the cylinder 504 can drive the fixed plate 505, the mounting bracket 507, the clamping plate 508 and the annular sleeve 201 to move downward, so that the annular sleeve 201 is inserted into the annular mounting groove 103. After the annular sleeve 201 is relatively fixed to the base plate 101, the mounting bracket 507 no longer moves downward, and the cylinder 504 will continue to drive the fixed plate 505 to move downward. Thereafter, the fixed plate 505 will By compressing the third spring 506, the fixed plate 505 will first drive the first push rod 510 to move downward, and the first push rod 510 will first drive the clamping plate 508 to move outward, so that the clamping plate 508 cancels the clamping of the annular sleeve 201 until the second limit block 511 moves to the bottom of the second trapezoidal block 512 and is clamped by the second trapezoidal block 512; after the annular sleeve 201 and the base plate 101 are relatively fixed, the third push rod 518 moves to a position in contact with the base plate 101, and when the fixed plate 505 moves downward again, the third push rod 518 pushes the arc-shaped sealing block 108 to move into the outer mounting chamfer 104, and then the cylinder can drive the fixed plate 505 and the mounting frame 5 07. The clamping plate 508 and the second mounting plate 517 move back to their initial positions. The present invention can automatically insert the annular sleeve 201 into the annular mounting groove 103 and fix it to the substrate 101 through the setting of the clamping plate 508 and the third push rod 518. After the annular sleeve 201 and the substrate 101 are relatively fixed, the arc-shaped sealing block 108 can be driven to automatically move into the outer mounting chamfer 104, so that the arc-shaped sealing block 108 can seal the outer mounting chamfer 104, thereby ensuring the aesthetics of the substrate 101, and ensuring the accuracy and efficiency of the inorganic packaging of the deep ultraviolet chip, so that the inorganic packaging of the deep ultraviolet chip can be more easily mass-produced.

[0045] As a further solution of the present invention, the outer side wall of the arc-shaped sealing block 108 is slidably connected with a second clamping block 6, and the second clamping block 6 is fixedly connected with a sixth spring 7 for its reset; the base plate 101 is provided with a second clamping groove 701 that can be clamped with the second clamping block 6; when working, after the arc-shaped sealing block 108 is inserted into the outer mounting chamfer 104, the second clamping block 6 will be inserted into the second clamping groove 701, which can make the arc-shaped sealing block 108 more stable.

[0046] A method for producing a fully inorganic package of a deep ultraviolet chip, the method comprising the following steps:

[0047] Step 1: The staff places the package shell assembly and the package base assembly on the first belt conveyor assembly and the second belt conveyor assembly respectively;

[0048] Step 2: After the packaging base assembly moves to the bottom of the installation assembly, stop the operation of the first belt conveyor assembly and the second belt conveyor assembly;

[0049] Step 3: Start the installation component to grab the package shell component, and then the installation component installs the package shell component on the package base component, so that the package shell component and the package base component realize inorganic packaging of the deep ultraviolet chip;

[0050] Step 4: The second belt conveyor assembly transports the packaged finished products to the collection location, where staff collect the finished products.

[0051] Working principle: The staff places the packaging shell assembly and the packaging base assembly on the first belt conveyor assembly and the second belt conveyor assembly respectively, so that the first belt conveyor assembly and the second belt conveyor assembly convey the packaging shell assembly and the packaging base assembly to the bottom of the installation assembly, and then starts the installation assembly. The installation assembly will first clamp the packaging shell assembly. After the packaging shell assembly moves to just above the packaging base assembly, the installation assembly will drive the packaging shell assembly to move downward, so that the packaging shell assembly is inserted into the packaging base assembly. After the packaging shell assembly moves downward to a point where it cannot move, the packaging shell assembly and the packaging base assembly are docked, and then the installation assembly can return to its initial position. The first belt conveyor assembly then conveys the docked packaging shell assembly and packaging base assembly to the right. Before moving to the collection position, the packaging base assembly is heated so that the packaging base assembly and the packaging shell assembly are combined into a whole to form an inorganic package.

Claims

1. A fully inorganic packaging production and preparation equipment for deep ultraviolet chips, characterized by: The invention comprises a bottom plate (8) and a first belt conveying assembly, a second belt conveying assembly, a package shell assembly, a package base assembly and a mounting assembly arranged on the bottom plate (8), wherein the first belt conveying assembly and the second belt conveying assembly are used to convey the package shell assembly and the package base assembly respectively; the mounting assembly is used to automatically mount the package shell assembly on the package base, thereby realizing automatic inorganic packaging of deep ultraviolet chips; The package base assembly comprises a substrate (101), a mounting seat (102) for mounting a deep ultraviolet chip is provided at the center of the substrate (101), and an annular mounting groove (103) is provided on the substrate (101); the annular mounting groove (103) surrounds the mounting seat (102) on its inner side, and the tops of the inner and outer circles of the annular mounting groove (103) are provided with mounting chamfers (104), a solder ring (105) is installed in the annular mounting groove (103) and is fitted with the inner circle thereof, and an annular sealing block (106) is provided above the solder ring (105) and is fitted with the inner circle mounting chamfer (104). The annular sealing block (106) is provided with a plurality of limiting grooves (107); the outer side of the annular mounting groove (103) is provided with a plurality of arc-shaped sealing blocks (108) distributed in a circumferential array, and the plurality of arc-shaped sealing blocks (108) can be combined into a circular ring that fits the outer ring mounting chamfer (104); the arc-shaped sealing blocks (108) are all slidably connected to a first clamping block (109), and the first clamping block (109) is fixedly connected to a first spring (110) for resetting the first clamping block (109); the bottom of the annular mounting groove (103) is provided with a plurality of T-shaped clamping grooves (111) distributed in a circumferential array; The packaging shell assembly comprises an annular sleeve (201); a lens (202) is fixedly connected to the inner wall of the annular sleeve (201); a plurality of fixed blocks (203) are fixedly connected to the bottom of the annular sleeve (201); the number of the fixed blocks (203) is the same as the number of the T-shaped card slots (111); the fixed blocks (203) are slidably connected to first trapezoidal card blocks (204); the first trapezoidal card blocks (204) are fixedly connected to second springs (205) for resetting the first trapezoidal card blocks (204); the first trapezoidal card blocks (204) can be slidably connected to the T-shaped card slots ( 111) cooperates with the limiting fixing block (203); a plurality of first limiting blocks (206) are fixedly connected to the inner wall of the annular sleeve (201), the number of the first limiting blocks (206) is the same as the number of the limiting grooves (107), and the first limiting blocks (206) can be respectively engaged with the limiting grooves (107); a plurality of first engaging grooves (207) distributed in a circumferential array are opened on the outer wall of the annular sleeve (201), the number of the first engaging grooves (207) is equal to the number of the first engaging blocks (109) and can be engaged with the first engaging blocks (109).

2. The all-inorganic packaging production equipment for deep ultraviolet chips according to claim 1, characterized in that: The first belt conveyor assembly comprises two first conveyor rollers (301) and a first belt (302), wherein the two first conveyor rollers (301) are both rotatably connected to the bottom plate (8), and the first belt (302) is transmission-connected to the two first conveyor rollers (301).

3. The all-inorganic packaging production equipment for deep ultraviolet chips according to claim 2, characterized in that: The second belt conveyor assembly comprises two second conveyor rollers (401) and a second belt (402), the two second conveyor rollers (401) are both rotatably connected to the bottom plate (8), the second conveyor rollers (401) are located at the rear side of the first conveyor roller (301), and the second belt (402) is transmission-connected to the two first conveyor rollers (301).

4. The all-inorganic packaging production equipment for deep ultraviolet chips according to claim 3, characterized in that: The mounting assembly comprises a first mounting plate (501), the first mounting plate (501) being fixedly connected to the top of the base plate (8), a threaded rod (502) being rotatably connected to the first mounting plate (501), a first slider (503) being threadedly connected to the threaded rod (502), the first slider (503) being slidably connected to the first mounting plate (501) in the front-back direction, a cylinder (504) being fixedly connected to the bottom of the first slider (503), a fixed plate (505) being fixedly connected to the output end of the cylinder (504), a third spring (506) being fixedly connected to the bottom of the fixed plate (505), and the third spring (506) being fixedly connected to the output end of the cylinder (504). The bottom ends of the three springs (506) are fixedly connected to a mounting frame (507), the mounting frame (507) is slidably connected to the fixed plate (505) in the vertical direction, the mounting frame (507) is slidably connected to two symmetrically arranged clamping plates (508) in the left-right direction, the clamping plates (508) are fixedly connected to a fourth spring (509) for resetting the clamping plates (508); the sides of the clamping plates (508) can be provided with a first push rod (510) for driving the clamping plates (508) to slide outward; the first push rod (510) is fixedly connected to the fixed plate (505), and the first push rod (510) is fixedly connected to a second limit block (511) A second trapezoidal block (512) can be provided below the second limit block (511), and the second trapezoidal block (512) is slidably connected to a second slider (520), and the second slider (520) is slidably connected to the mounting frame (507) in the front-to-back direction; a fifth spring (513) for resetting the second trapezoidal block (512) is fixedly connected; a first gas spring (514) for resetting the second slider (520) is fixedly connected; a second push rod (515) is fixedly connected to the second slider (520), and a gas spring (515) for driving the second push rod (515) to move backward is provided on the front side of the second push rod (515). The wedge block (516) is fixedly connected to the bottom plate (8); a second mounting plate (517) is sleeved on the outer side of the clamping plate (508), and the second mounting plate (517) is fixedly connected to the fixed plate (505); a plurality of third push rods (518) are rotatably connected to the second mounting plate (517), the number of the third push rods (518) is equal to the number of the arc-shaped sealing blocks (108), and the third push rods (518) are respectively used to drive the arc-shaped sealing blocks (108) to move; an arc spring (519) is fixedly connected to the side wall of the third push rod (518) for its reset.

5. The all-inorganic packaging production equipment for deep ultraviolet chips according to claim 4, characterized in that: The outer side walls of the arc-shaped sealing blocks (108) are slidably connected to second clamping blocks (6), and the second clamping blocks (6) are fixedly connected to sixth springs (7) for resetting the second clamping blocks (6); and a second clamping groove (701) capable of being clamped to the second clamping blocks (6) is provided on the base plate (101).

6. A method for producing a fully inorganic package of a deep ultraviolet chip, which is applicable to the fully inorganic package production equipment of a deep ultraviolet chip according to claim 5, characterized in that: The method includes the following steps: Step 1: The staff places the package shell assembly and the package base assembly on the first belt conveyor assembly and the second belt conveyor assembly respectively; Step 2: After the packaging base assembly moves to the bottom of the installation assembly, stop the operation of the first belt conveyor assembly and the second belt conveyor assembly; Step 3: Start the installation component to grab the package shell component, and then the installation component installs the package shell component on the package base component, so that the package shell component and the package base component realize inorganic packaging of the deep ultraviolet chip; Step 4: The second belt conveyor assembly transports the packaged finished products to the collection location, where staff collect the finished products.

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