Driving structure for optical actuator and corresponding camera module

Abstract

The application relates to a driving structure for an optical actuator, which comprises a first driving part suitable for mounting a lens and a second driving part suitable for mounting a photosensitive component, the first driving part and the second driving part have a shared magnet, the shared magnet is arranged on the first base part or the second base part, the photosensitive component comprises a photosensitive chip, the first driving part drives the lens to move in x-axis and y-axis directions through electromagnetic induction of a lens driving coil and the shared magnet, the second driving part drives the photosensitive chip to move in the x-axis and y-axis directions through electromagnetic induction of a photosensitive component driving coil and the shared magnet, the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. The application also provides a corresponding camera module. The application can improve the anti-shake stroke and the anti-shake response speed of the camera module while keeping the module small in size.

Description

[0001] Related Applications

[0002] This application claims priority to Chinese Patent Application No. 202011338741.2, filed on November 25, 2020, entitled “Driving Structure for Optical Actuator and Corresponding Camera Module,” and Chinese Patent Application No. 202011338735.7, filed on November 25, 2020, entitled “Optical Anti-shake Camera Module,” and incorporates by reference the entirety of the above-mentioned applications. TECHNICAL FIELD

[0003] The present application relates to the technical field of camera equipment, in particular, the present application relates to a driving structure for optical actuator and corresponding camera module. BACKGROUND

[0004] With the increasing demand of consumers for mobile phone photography, the functions of mobile phone camera (i.e., camera module) are becoming more and more rich, portrait shooting, long-distance shooting, optical zoom, optical anti-shake and other functions are integrated in the limited volume of camera, and among them, automatic focusing, optical anti-shake, optical zoom and other functions often need to rely on optical actuator (sometimes also can be called motor) to realize.

[0005] Figure 1 A typical camera module with a motor in the prior art is shown. Referring to Figure 1 , the camera module generally includes a lens 1, a motor mechanism 2 (which can be simply referred to as a motor) and a photosensitive assembly 3. In the shooting state, the light from the shooting object is focused on the photosensitive element 3a of the photosensitive assembly 3 through the lens 1. In structure, the lens 1 is fixed to the motor carrier of the motor 2, and the photosensitive assembly 3 is fixed to the lens carrier of the motor 2. The motor carrier and the lens carrier are connected by a lens carrier connecting rod 4. The photosensitive assembly 3 is connected to the lens carrier by a photosensitive assembly connecting rod 5. The motor 2 is connected to the lens carrier by a motor connecting rod 6. Figure 1The motor carrier is a movable component, which can generally move the lens 1 in the optical axis direction under the action of the driving element of the motor to realize the focusing function. For the camera module with optical image stabilization (OIS) function, the motor often has a more complex structure. This is because the motor needs to drive the lens to move in other degrees of freedom (for example, in the direction perpendicular to the optical axis) in addition to driving the lens to move in the optical axis direction to compensate for the shake during shooting. Generally speaking, the shake of the camera module includes translation (x-axis and y-axis translation) and rotation (rotation in the xoy plane, and the rotation axis direction can be approximately the same as the optical axis) in the direction perpendicular to the optical axis, and tilt shake (rotation around the x and y axes, which is also called tilt shake in the field of camera modules). When the gyroscope (or other position sensing element) in the module detects a shake in a certain direction, it can issue a command to make the motor drive the lens to move a distance in the opposite direction, thereby compensating for the shake of the lens. Generally speaking, the lens only translates and / or rotates in the direction perpendicular to the optical axis to compensate for the shake of the camera module, because if the lens is rotated around the x and y axes, i.e., if the tilt adjustment of the lens is used to achieve the anti-shake effect, it may cause the imaging quality of the module to decrease, and even cause the image to be blurred and difficult to meet the basic imaging quality requirements.

[0006] However, as the imaging quality requirements of the camera module of the mobile phone become higher and higher, the volume and weight of the lens become larger and larger, and the driving force requirement of the motor also becomes higher and higher. However, the current electronic equipment (such as a mobile phone) has a great limitation on the volume of the camera module, and the occupied volume of the motor increases accordingly as the lens increases. In other words, under the trend of the lens developing towards larger volume and larger weight, the driving force that the motor can provide is difficult to increase accordingly. Under the premise of limited driving force, the heavier the lens is, the shorter the travel of the lens driven by the motor is, which affects the anti-shake ability. On the other hand, the heavier the lens is, the slower the speed of the lens driven by the motor is, and the longer the time for the lens to reach the predetermined compensation position is, which also affects the anti-shake effect.

[0007] Therefore, there is an urgent need for a solution that can improve the anti-shake travel and anti-shake response speed of the camera module. SUMMARY

[0008] The purpose of the present application is to overcome the shortcomings of the prior art and provide a solution that can improve the anti-shake travel and anti-shake response speed of the camera module.

[0009] To solve the above technical problems, the application provides a driving structure for an optical actuator, which comprises: a first driving part adapted to mount a lens, the first driving part comprising a first base part, a first movable part movably connected with the first base part, and a lens driving coil mounted on the first movable part, wherein the x-axis and the y-axis are coordinate axes perpendicular to an optical axis of the lens, and the x-axis and the y-axis are perpendicular to each other; and a second driving part adapted to mount a photosensitive component, the second driving part comprising a second base part, a second movable part movably connected with the second base part, and a photosensitive component driving coil mounted on the second movable part, the photosensitive component being located below the second movable part and fixed to the second movable part. Wherein the first driving part and the second driving part have a common magnet, the common magnet being arranged on the first base part or the second base part, the photosensitive component comprising a photosensitive chip, the first driving part driving the lens to translate in the x-axis and y-axis directions through electromagnetic induction of the lens driving coil and the common magnet, the second driving part driving the photosensitive chip to translate in the x-axis and y-axis directions through electromagnetic induction of the photosensitive component driving coil and the common magnet; and the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions.

[0010] Wherein the first base part and the second base part are fixed by adhesive.

[0011] Wherein the second driving part is further used to drive the photosensitive chip to rotate on the xoy plane.

[0012] Wherein according to the detected tilt shake angle a of the camera module, the lens movement distance b of the lens moved by the first driving module is determined, and the photosensitive chip movement distance c of the photosensitive chip moved by the second driving module is determined; wherein the lens movement distance b, the photosensitive chip movement distance c, and the image side focal length f of the camera module satisfy: a = arctan(b / f) + arctan(c / f).

[0013] Wherein the driving structure further comprises a driving logic module, which is used to keep the proportion of the lens movement distance b and the photosensitive chip movement distance c at a preset fixed proportion.

[0014] Wherein the driving structure further comprises a driving logic module, which has an anti-shake threshold K, the driving logic module is used to keep the proportion of the lens movement distance b and the photosensitive chip movement distance c at a preset fixed proportion when the tilt shake angle a is less than or equal to the anti-shake threshold K, and make the photosensitive chip movement distance c reach its maximum movement distance c when the tilt shake angle a is greater than the anti-shake threshold K.max , the lens moving distance b is according to the relationship b=tan(a / f)-c max is calculated.

[0015] The preset fixed ratio of the lens moving distance and the photosensitive chip moving distance is set according to the weight of the lens, the driving force of the first driving part, the weight of the photosensitive chip or photosensitive assembly, and the driving force of the second driving part, so that the time for the lens and the photosensitive chip to move to the respective anti-shake target positions is consistent.

[0016] The second movable part is movably connected with the second base part through a ball, and the movement freedom degree of the second movable part relative to the second base part is limited within the xoy plane through a suspension system based on the ball.

[0017] The ball is arranged at the four-corner region of the second driving part in the top view angle.

[0018] The driving structure further comprises a rear shell located below the second driving part, the rear shell is connected with the second base part and forms an accommodating cavity, the second movable part and the photosensitive assembly are located in the accommodating cavity, and there is a gap between the photosensitive assembly and the bottom of the rear shell.

[0019] The second movable part has an extension arm extending downward, the extension arm is bonded with the circuit board of the photosensitive assembly, and the extension arm is provided with an FPC which is directly welded to the circuit board.

[0020] The second movable part and the second base part both have a light passing hole in the center.

[0021] The second base part comprises a base and a cover, the cover comprises a side wall extending downward from the base to surround the second movable part and a bearing table extending horizontally inward from the side wall.

[0022] The ball and the edge region of the second movable part are clamped between the base and the bearing table.

[0023] The upper surface of the second base part has a stepped structure, the stepped structure comprises a first step surface located at the outer side and a second step surface located at the inner side, and the height of the second step surface is lower than that of the first step surface.

[0024] The upper surface of the edge region of the second movable part has a groove, and the ball is placed in the groove.

[0025] The upper surface of the edge area of the second movable part has a recessed step, the outer step surface of the recessed step is lower than the inner step surface, and the recessed step, together with the side wall of the cover and the base, forms a containing cavity for containing the balls.

[0026] The balls are located between the bearing table and the second movable part.

[0027] A layer of balls is arranged between the base and the second movable part, and between the second movable part and the bearing table.

[0028] The outer surface of the second movable part is provided with an inwardly recessed clamping groove, and the bearing table is embedded in the clamping groove.

[0029] The lower end surface of the second movable part and the upper end surface of the lens seat of the photosensitive assembly are arranged with glue, and the glue avoids the four corner areas of the second movable part.

[0030] The common magnet is arranged at the edge area of the second base part, and the lens driving coil is arranged at the edge area of the second movable part.

[0031] In the second driving part, the coil magnet combination composed of the common magnet and the photosensitive assembly driving coil includes a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; the first coil magnet pair and the second coil magnet pair are used to provide driving force in the x-axis direction; the third coil magnet pair is used to provide driving force in the y-axis direction; and in the top view angle, the outer shape of the second driving part is rectangular, the first coil magnet pair and the second coil magnet pair are arranged along the first edge and the second edge of the second driving part respectively, the first edge and the second edge do not intersect, and the second coil magnet pair is arranged along the third edge of the second driving part, the third edge intersects with the first edge and the second edge; and the lens driving coil includes a first lens driving coil, a second lens driving coil and a third lens driving coil arranged above the first coil magnet pair, the second coil magnet pair and the third coil magnet pair respectively; the first lens driving coil and the common magnet of the first coil magnet pair, and the second lens driving coil and the common magnet of the second coil magnet pair are used to provide driving force in the x-axis direction, and the third lens driving coil and the common magnet of the third coil magnet pair are used to provide driving force in the y-axis direction.

[0032] The first base part includes a motor base located below the first movable part, the motor base has a light hole, the common magnet is installed at the edge area of the motor base, and the lens driving coil is installed at the bottom of the first movable part; the magnet coil pair composed of the common magnet and the lens driving coil includes a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; the first coil magnet pair and the second coil magnet pair are used to provide driving force in the x-axis direction; the third coil magnet pair is used to provide driving force in the y-axis direction; and in the top view, the outer contour of the first driving part is rectangular, the first coil magnet pair and the second coil magnet pair are arranged along the first side and the second side of the first driving part respectively, the first side and the second side do not intersect, and the third coil magnet pair is arranged along the third side of the second driving part, the third side intersects with the first side and the second side; and the photosensitive component driving coil includes a first photosensitive component driving coil, a second photosensitive component driving coil and a third photosensitive component driving coil arranged below the first coil magnet pair, the second coil magnet pair and the third coil magnet pair respectively; the first photosensitive component driving coil and the common magnet of the first coil magnet pair, and the second photosensitive component driving coil and the common magnet of the second coil magnet pair are used to provide driving force in the x-axis direction, and the third photosensitive component driving coil and the common magnet of the third coil magnet pair are used to provide driving force in the y-axis direction.

[0033] In the top view, the second base part is provided with a notch or a through hole corresponding to the position of the photosensitive component driving coil.

[0034] The magnet coil pair composed of the common magnet and the photosensitive component driving coil includes a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; the first coil magnet pair and the second coil magnet pair are used to provide driving force in the x-axis direction; the third coil magnet pair is used to provide driving force in the y-axis direction; and in the top view, the outer contour of the second driving part is rectangular, the first coil magnet pair and the second coil magnet pair are arranged along the first side and the second side of the first driving part respectively, the first side and the second side do not intersect, and the third coil magnet pair is arranged along the third side of the second driving part, the third side intersects with the first side and the second side. The lens driving coil includes an x-axis lens driving coil and a y-axis lens driving coil, the x-axis lens driving coil is located directly above the first coil magnet pair, and the y-axis lens driving coil is located directly above the third coil magnet pair.

[0035] According to another aspect of the present application, a camera module is also provided, comprising: a lens; a photosensitive assembly; and the driving structure for an optical actuator according to any one of the preceding aspects; wherein the lens is mounted to the first driving part, and the photosensitive assembly is mounted to the second driving part.

[0036] The photosensitive assembly comprises a circuit board, and the camera module further comprises a first connecting band and a second connecting band, the first connecting band is arranged at a top region of the first driving part and electrically connected to the first driving part, and the second connecting band is connected to the circuit board of the photosensitive assembly and is conductive; wherein the second connecting band is arranged in a plurality of bending to form a curved laminated shape.

[0037] The first driving part comprises a first base part and a first movable part, and the second driving part comprises a second base part and a second movable part; wherein the second base part is fixed together with the first base part, the second movable part is located below the second base part and is movably connected to the second base part, and the photosensitive assembly is located below the second movable part and is fixed to the second movable part. The photosensitive assembly comprises a suspension type circuit board, the suspension type circuit board comprises a rigid circuit board body and a flexible connecting band, the connecting band is led out from a first side and a second side of the circuit board body and is bent upwards to form a bending part, a top of the bending part extends along a circumferential edge of the photosensitive assembly in a horizontal direction, so that the connecting band is wrapped around a first side, a second side and a third side of the photosensitive assembly, and the connecting band at each of the first side, the second side and the third side has at least one suspension part, the suspension part is fixed to the second base part of the second driving part or is fixed to the second base part through an intermediary; wherein the photosensitive assembly has a first side and a second side which are positionally consistent with the circuit board body, the first side and the second side are oppositely arranged, and the third side intersects with both the first side and the second side.

[0038] The suspension part has a suspension hole, and the second base part or the intermediary has a hook, the hook hooks the suspension hole.

[0039] The connecting band includes a third connecting band and a fourth connecting band. The third connecting band is led out from the first side of the circuit board body and is bent upward to form a bending part, then extends along the first side of the photosensitive assembly, is bent in a horizontal direction at a corner, and continues to extend along the third side. The fourth connecting band is led out from the second side of the circuit board body and is bent upward to form another bending part, then extends along the second side of the photosensitive assembly, is bent in a horizontal direction at a corner, and continues to extend along the third side. The third connecting band and the fourth connecting band are jointed at the third side and are conductive to each other. The hanging part of the connecting band at the third side is also connected with a fifth connecting band, and the fifth connecting band has a connector for external connection. The hanging circuit board also has a fixing part for fixing the fifth connecting band.

[0040] The photosensitive assembly includes a circuit board, a photosensitive chip mounted on the surface of the circuit board, a lens holder mounted on the surface of the circuit board and surrounding the photosensitive chip, a filter mounted on the lens holder, and an electronic element mounted on the surface of the circuit board and located outside the lens holder. In the second driving part, the second movable part has a rigid extension arm extending downward, the extension arm is bonded with the circuit board of the photosensitive assembly, the extension arm surrounds the lens holder, and the electronic element is located between the inner side of the extension arm and the outer side of the lens holder. The photosensitive assembly driving coil is electrically connected with the circuit board through an FPC, the FPC is attached to the side of the extension arm, and the FPC is directly soldered to the circuit board.

[0041] To solve the above technical problems, the application further provides an optical anti-shake camera module, which comprises: a lens; a photosensitive assembly comprising a photosensitive chip; a first driving part adapted to mount the lens and drive the lens to translate in x-axis and y-axis directions; and a second driving part adapted to mount the photosensitive assembly and drive the photosensitive chip to translate in x-axis and y-axis directions, the lens and the photosensitive chip being configured to be driven simultaneously and move towards opposite directions, wherein the x-axis and the y-axis are two coordinate axes perpendicular to the optical axis direction of the camera module, and the x-axis and the y-axis are perpendicular to each other; wherein the second driving part comprises a second base part and a second movable part, the second base part comprises a base part base and a cover; the second movable part comprises at least two chip end carriers arranged from bottom to top; a plurality of guide grooves are arranged on the base part base and the at least two chip end carriers, the guide grooves comprise first guide grooves and second guide grooves; the upper surface of the base part base or the lower surface of the chip end carrier located at the lowermost position of the second movable part has the first guide groove, the first guide groove is provided with first balls and the first balls can roll along the first guide groove, the upper surface of the base part base and the chip end carrier located at the lowermost position of the second movable part are supported by the first balls; in the second movable part, for any two adjacent upper and lower chip end carriers, the upper surface of the chip end carrier located at the lower position or the lower surface of the chip end carrier located at the upper position has the second guide groove, the second guide groove is provided with second balls and the second balls can roll along the second guide groove, the upper surface of the chip end carrier located at the lower position and the lower surface of the chip end carrier located at the upper position are supported by the second balls; the photosensitive assembly is mounted on the chip end carrier located at the uppermost position of the second movable part; and among the plurality of guide grooves, the guide direction of at least one guide groove is the direction of translation along the x-axis, and the guide direction of at least one guide groove is the direction of translation along the y-axis.

[0042] Among the first guide grooves, the guide direction is the direction of translation along the x-axis or the y-axis, and the guide direction of the second guide groove of one of the chip end carriers is perpendicular to the guide direction of the first guide groove.

[0043] Among the chip end carriers, the chip end carriers comprise a chip end first carrier, a chip end second carrier and a chip end third carrier arranged in sequence from top to bottom; the second guide groove comprises an arc-shaped guide groove and a straight line guide groove; the arc-shaped guide groove is used for guiding the second balls to roll along a circular arc rotating around the z-axis, wherein the z-axis is a coordinate axis consistent with the optical axis direction; the straight line guide groove is used for guiding the second balls to roll along the x-axis or the y-axis.

[0044] In the second movable part, for any two adjacent chip carriers, the lower surface of the upper chip carrier or the upper surface of the lower chip carrier has a second adapter groove, which is adapted to the second guide groove and together forms the guide channel of the second ball.

[0045] The arc center of the arc-shaped guide groove is located directly below the photosensitive center, which is the center of the photosensitive area of ​​the photosensitive chip.

[0046] Each of the chip-end carriers includes a carrier substrate and a carrier wall extending upward from the edge region of the carrier substrate, the carrier wall surrounding the photosensitive component.

[0047] The second guide groove is located on the upper surface of the carrier wall; for any two adjacent chip carriers, the lower surface of the carrier wall of the upper chip carrier is supported by the second ball bearing.

[0048] The carrier wall includes a wall body and an extension portion extending outward from the top region of the wall body; for any two adjacent chip carriers, the second guide groove is located on the upper surface of the extension portion of the lower chip carrier, and the lower surface of the extension portion of the upper chip carrier is supported by the second ball bearing.

[0049] Wherein, for any two adjacent chip end carriers, the wall of the lower chip end carrier surrounds the wall of the upper chip end carrier; and there is a gap between the walls of the two chip end carriers.

[0050] Each of the chip-end carriers includes an annular carrier wall surrounding the photosensitive component, and the second guide groove is located on the upper surface of the carrier wall.

[0051] In this embodiment, at least one of the chip-end carriers is a frame structure consisting solely of the carrier wall.

[0052] In the second movable part, a portion of the chip end carrier is a frame structure composed solely of the carrier wall, and the other portion of the chip end carrier includes a carrier substrate and the carrier wall extending upward from the edge region of the carrier substrate.

[0053] In the second movable part, the uppermost chip carrier includes the carrier substrate and the carrier wall, and the photosensitive component is installed in the receiving groove formed by the carrier substrate and the carrier wall.

[0054] The lower surface of the chip-end carrier or the upper surface of the base-end pedestal of the second movable part has a first fitting groove which is fitted with the first guide groove and jointly forms a guide channel for the first ball.

[0055] The second ball includes upper-layer second balls and lower-layer second balls; the upper-layer second balls are arranged between the lower surface of the chip-end first carrier and the upper surface of the chip-end second carrier; the lower-layer second balls are arranged between the lower surface of the chip-end second carrier and the upper surface of the chip-end third carrier.

[0056] The first ball is arranged between the lower surface of the chip-end third carrier and the upper surface of the base-end pedestal.

[0057] The arc-shaped guide groove is located on the lower surface of the chip-end first carrier or the upper surface of the chip-end second carrier; the straight-line guide groove is located on the lower surface of the chip-end second carrier or the upper surface of the chip-end third carrier.

[0058] The cover includes a cover sidewall and a resting platform extending inward from the top region of the cover sidewall; the bottom of the cover sidewall is connected to the base-end pedestal, the resting platform is located above the chip-end first carrier, and the lower surface of the resting platform has a gap with the upper surface of the chip-end first carrier.

[0059] In a top view, the chip-end carrier has a rectangular shape, the edge region of the chip-end carrier includes a first side, a second side opposite to the first side, a third side intersecting with the first side, and a fourth side opposite to the third side; the length of the first side and the second side is greater than the length of the third side and the fourth side; in the top view, the arc-shaped guide groove is arranged on the first side and the second side.

[0060] In the top view, the straight-line guide groove is arranged on the corner region of the chip-end carrier.

[0061] In the top view, the second base-end has a rectangular shape; the first guide groove is arranged on the corner region of the second base-end or the chip-end carrier.

[0062] The driving element of the second driving part is a coil magnet combination, wherein the magnets in the coil magnet combination are mounted on the edge region of the second base part, and the coils in the coil magnet combination are mounted on the edge region of the chip-end first carrier; the coil magnet combination comprises a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; wherein the first coil magnet pair and the second coil magnet pair are used to provide driving force in the x-axis direction; the third coil magnet pair is used to provide driving force in the y-axis direction; and in the top view, the first coil magnet pair and the second coil magnet pair can be arranged along the first edge and the second edge of the second driving part respectively, the first edge and the second edge do not intersect, and the second coil magnet pair is arranged along the third edge of the second driving part, the third edge intersects with the first edge and the second edge.

[0063] The cover includes a cover sidewall and a resting platform extending inward from the top region of the cover sidewall; the bottom of the cover sidewall is connected to the base part base, the resting platform is above the chip-end first carrier, and there is a gap between the lower surface of the resting platform and the upper surface of the chip-end first carrier; wherein the magnets in the coil magnet combination are mounted on the cover, the base part base or the chip-end third carrier; and wherein the magnets in the first coil magnet pair and the magnets in the second coil magnet pair are mounted on the same member, which is one of the cover, the base part base and the chip-end third carrier.

[0064] The magnets of the first coil magnet pair are arranged on one side of the first edge close to the third edge, and the second coil magnet pair is arranged on the side of the second edge away from the third edge.

[0065] According to the detected tilt angle a of the camera module, the first driving module drives the lens to move a lens movement distance b, and the second driving module drives the photosensitive chip to move a photosensitive chip movement distance c; wherein the lens movement distance b, the photosensitive chip movement distance c and the image side focal length f of the camera module satisfy: a = arctan(b / f) + arctan(c / f).

[0066] The driving structure further comprises a driving logic module, which is used to keep the ratio of the lens movement distance b and the photosensitive chip movement distance c at a preset fixed ratio.

[0067] The driving structure further comprises a driving logic module having an anti-shake threshold K, the driving logic module is configured to keep a preset fixed ratio of the lens moving distance b and the photosensitive chip moving distance c when the tilt shake angle a is less than or equal to the anti-shake threshold K, and the photosensitive chip moving distance c reaches a maximum value c when the tilt shake angle a is greater than the anti-shake threshold K max , the lens moving distance b is calculated according to the relationship b = tan(a / f) - c max .

[0068] The preset fixed ratio of the lens moving distance and the photosensitive chip moving distance is set according to the weight of the lens, the driving force of the first driving part, the weight of the photosensitive chip or the photosensitive assembly, and the driving force of the second driving part, so that the lens and the photosensitive chip move to the respective anti-shake target positions at the same time.

[0069] The first driving part comprises a first base part and a first movable part, and the first base part is fixed together with the second base part.

[0070] The photosensitive assembly comprises a circuit board, the camera module further comprises a first connecting belt and a second connecting belt, the first connecting belt is arranged at the top area of the first driving part and electrically connected to the first driving part, and the second connecting belt is connected to the circuit board of the photosensitive assembly and is conductive; wherein the second connecting belt is arranged in a plurality of bending to form a curved laminated shape.

[0071] The first driving part comprises a first base part and a first movable part, and the second driving part comprises a second base part and a second movable part; the second base part is fixed with the first base part, the second movable part is located below the second base part and is movably connected with the second base part, and the photosensitive assembly is located below the second movable part and is fixed to the second movable part; the photosensitive assembly comprises a suspension type circuit board, the suspension type circuit board comprises a rigid circuit board body and a flexible connecting band, the connecting band is led out from the first side and the second side of the circuit board body and is bent upwards to form a bending part, the top of the bending part extends along the circumferential edge of the photosensitive assembly in the horizontal direction, so that the connecting band is wrapped around the periphery of the first side, the second side and the third side of the photosensitive assembly, and the connecting band located at the first side, the second side and the third side each has at least one suspension part, which is fixed to the second base part of the second driving part or is fixed to the second base part through an intermediate object; wherein the photosensitive assembly has a first side and a second side which are located in the same position as the circuit board body, the first side and the second side are oppositely arranged, and the third side intersects with the first side and the second side.

[0072] The connecting band comprises a third connecting band and a fourth connecting band, the third connecting band is led out from the first side of the circuit board body and is bent upwards to form a bending part, then extends along the first side of the photosensitive assembly, and is bent in the horizontal direction at the corner and continues to extend along the third side; the fourth connecting band is led out from the second side of the circuit board body and is bent upwards to form another bending part, then extends along the second side of the photosensitive assembly, and is bent in the horizontal direction at the corner and continues to extend along the third side; the third connecting band and the fourth connecting band are joined and conduct with each other at the third side; the suspension part of the connecting band located at the third side is further connected with a fifth connecting band, the fifth connecting band has a connector for external connection; the suspension type circuit board further has a fixing part for fixing the fifth connecting band.

[0073] Compared with the prior art, the present application has at least one of the following technical effects:

[0074] 1. The present application can improve the anti-shake stroke of the camera module, so that larger shaking of the camera module can be compensated;

[0075] 2. The present application can improve the anti-shake response speed of the camera module;

[0076] 3. The driving structure for the optical actuator of the present application has the advantage of compact structure, and is particularly suitable for miniaturized camera modules;

[0077] 4. In some embodiments of the present application, the time for the lens and the photosensitive chip to move to the respective anti-shake target positions can be set to be substantially the same according to the lens weight, the driving force of the first driving part, the photosensitive chip (or photosensitive assembly) weight, the driving force of the second driving part, and other factors, so as to obtain a better anti-shake effect;

[0078] 5. In some embodiments of the present application, the interference of the connecting band on the anti-shake movement of the photosensitive assembly can be reduced by using a suspension type circuit board, so as to effectively guarantee the anti-shake stroke and response speed;

[0079] 6. In some embodiments of the present application, the volume occupied by the first base part or the second base part for mounting the magnet can be reduced by using a common magnet, so as to help the anti-shake camera module to realize the reduction in the height direction. BRIEF DESCRIPTION OF DRAWINGS

[0080] Figure 1 A typical camera module with a motor in the prior art is shown.

[0081] Figure 2 A cross-sectional view of a camera module with an anti-shake function in an embodiment of the present application is shown.

[0082] Figure 3 A cross-sectional view of a camera module with an anti-shake function in another embodiment of the present application is shown.

[0083] Figure 4 A schematic view of the relationship between the movement distance of the lens and the photosensitive chip and the module tilt angle in four different situations in the present application is shown.

[0084] Figure 5 A cross-sectional view of a camera module in an embodiment of the present application is shown.

[0085] Figure 6 A cross-sectional view of a camera module in another embodiment of the present application is shown.

[0086] Figure 7 A cross-sectional view of a camera module in yet another embodiment of the present application is shown.

[0087] Figure 8 A cross-sectional view of a camera module in still another embodiment of the present application is shown.

[0088] Figure 9a A perspective view of the second driving part in an embodiment of the present application is shown.

[0089] Figure 9b A perspective exploded view of the second driving part in an embodiment of the present application is shown.

[0090] Figure 10aA cross-sectional view of the second driving part and the photosensitive assembly in one embodiment of the present application is shown.

[0091] Figure 10b A cross-sectional view of the second driving part in which the balls are arranged on the lower side of the movable part in one variant embodiment of the present application is shown.

[0092] Figure 10c A cross-sectional view of the second driving part with two layers of balls in one variant embodiment of the present application is shown.

[0093] Figure 11a A cross-sectional view of the second driving part in one embodiment of the present application is shown.

[0094] Figure 11b An assembly view of the second driving part in one embodiment of the present application is shown.

[0095] Figure 11c A cross-sectional view of the second driving part in another embodiment of the present application is shown.

[0096] Figure 12 A cross-sectional view of the second driving part in yet another embodiment of the present application is shown.

[0097] Figure 13a A bottom view of the movable part of the second driving part in one embodiment of the present application is shown.

[0098] Figure 13b A bottom view of the movable part of the second driving part in another embodiment of the present application is shown.

[0099] Figure 14 An installation position of the driving element of the second driving part in one embodiment of the present application is shown from a bottom view.

[0100] Figure 15a A cross-sectional view of the second driving part including the driving element in one embodiment of the present application is shown.

[0101] Figure 15b A cross-sectional view of the camera module in one embodiment of the present application is shown.

[0102] Figure 15c A cross-sectional view of the camera module in yet another embodiment of the present application is shown.

[0103] Figure 15d A cross-sectional view of the camera module in one variant embodiment of the present application is shown.

[0104] Figure 15e A perspective view of the second driving part with a notch in the second base part is shown.

[0105] Figure 15f A perspective exploded view of the second driving part with the second base part having a notch is shown.

[0106] Figure 15g A perspective view of the second driving part with the second base part having a through hole is shown.

[0107] Figure 15h A perspective exploded view of the second driving part with the second base part having a through hole is shown.

[0108] Figure 16a A cross-sectional view of the camera module in one embodiment of the present application is shown.

[0109] Figure 16b A perspective view of the camera module in one embodiment of the present application is shown.

[0110] Figure 16c A cross-sectional view of the camera module in another embodiment of the present application is shown.

[0111] Figure 17 A perspective view of the camera module and the arrangement of the connecting belt in one embodiment of the present application is shown.

[0112] Figure 18 A perspective view of the second driving part and the photosensitive assembly after assembly in one embodiment of the present application is shown.

[0113] Figure 19 An exploded view of the second driving part and the photosensitive assembly in one embodiment of the present application is shown.

[0114] Figure 20 A perspective view of the photosensitive assembly and the suspension type circuit board used by the photosensitive assembly in one embodiment of the present application is shown.

[0115] Figure 21a A front view of the suspension type circuit board after unfolding in one embodiment of the present application is shown.

[0116] Figure 21b A back view of the suspension type circuit board after unfolding in one embodiment of the present application is shown.

[0117] Figure 22 A cross-sectional view of the camera module in still another embodiment of the present application is shown.

[0118] Figure 23 A perspective exploded view of the second driving part in one embodiment of the present application is shown.

[0119] Figure 24 A partial enlarged view of one corner region of the chip end third carrier and the base part pedestal in one embodiment of the present application is shown.

[0120] Figure 25 A perspective view of two chip end carriers and a base seat is shown in FIG. 1.

[0121] Figure 26 A perspective view of two chip end carriers and a base seat is shown in FIG. 1. Figure 25

[0122] Figure 27 A cross-sectional view of a camera module is shown in FIG. 2.

[0123] Figure 28 An enlarged view of region A in FIG. 2 is shown in FIG. 3. Figure 27

[0124] Figure 29 A cross-sectional view of a second driving portion of a base seat with a through hole is shown in FIG. 4.

[0125] Figure 30a An installation position of a driving element of a second driving portion in a top view is shown in FIG. 5.

[0126] Figure 30b A cross-sectional view of a second driving portion including a driving element is shown in FIG. 6.

[0127] Figure 31a A perspective exploded view of a second driving portion showing the positions of a coil and a magnet is shown in FIG. 7.

[0128] Figure 31b A perspective exploded view of a second driving portion showing the positions of a coil and a magnet is shown in FIG. 8.

[0129] Figure 31c A perspective exploded view of a second driving portion showing the positions of a coil and a magnet is shown in FIG. 9.

[0130] Figure 31d A perspective exploded view of a second driving portion showing the positions of a coil and a magnet is shown in FIG. 10.

[0131] Figure 32a A schematic view of an assembly method of a second driving portion before assembly is shown in FIG. 11.

[0132] Figure 32b A schematic view of an assembly method of a second driving portion before assembly is shown in FIG. 12.

[0133] Figure 33 An arrangement of a camera module and a connecting band thereof is shown in FIG. 13.​​

[0134] Figure 34a FIG. 4 shows a front view of a suspended circuit board according to an embodiment of the present application.

[0135] Figure 34b FIG. 5 shows a back view of a suspended circuit board according to an embodiment of the present application.

[0136] Figure 35 FIG. 6 shows a perspective exploded view of a camera module based on a suspended circuit board according to an embodiment of the present application.

[0137] Figure 36 FIG. 7 shows a perspective view of a camera module based on a suspended circuit board according to an embodiment of the present application. DETAILED DESCRIPTION

[0138] For a better understanding of the present application, various aspects of the present application will be described in greater detail below with reference to the accompanying drawings. It is to be noted that these detailed descriptions are merely descriptive of exemplary embodiments of the present application and are not intended in any way to limit the scope of the present application. Throughout the specification, like reference numerals will refer to like elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0139] It should be noted that the expressions first, second, etc. are used in this specification merely to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, the first subject discussed below can also be referred to as the second subject without departing from the teachings of the present application.

[0140] In the drawings, the thickness, size, and shape of objects have been exaggerated slightly for ease of explanation. The drawings are merely examples and are not strictly drawn to scale.

[0141] It should also be understood that the expressions "comprise", "comprising", "have", "having", "contain", "containing", "include", and / or "including", when used in this specification, indicate the presence of the stated features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, when describing the embodiments of the present application, the use of "can" means "one or more embodiments of the present application". Also, the expression "exemplary" is intended to mean an example or an illustration.

[0142] As used herein, the terms "substantially," "about," and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art.

[0143] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an overly idealized or overly formal sense unless expressly so defined herein.

[0144] It should be noted that the embodiments and features in the embodiments in the present application can be combined with each other without conflict if possible.

[0145] The present application will be further described below with reference to the drawings and specific embodiments.

[0146] Figure 2 A cross-sectional schematic diagram of a camera module with anti-shake function according to an embodiment of the present application is shown. Referring to Figure 2 In the embodiment, the camera module includes a lens 10, a photosensitive assembly 20, a first driving part 30, and a second driving part 40. The photosensitive assembly 20 includes a photosensitive chip 21. The first driving part 30 is configured to drive the lens 10 to move in x and y directions, and the second driving part 40 is configured to drive the photosensitive chip 21 to move in x and y directions. In the embodiment, the x and y directions are perpendicular to each other and parallel to a photosensitive surface of the photosensitive assembly 20. A z direction is parallel to a normal direction of the photosensitive surface. For the convenience of understanding, Figure 2A three-dimensional rectangular coordinate system constructed based on the x, y, z directions is also shown. In this embodiment, the optical image stabilization of the camera module is realized by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions through the control module. Specifically, the lens 10 and the photosensitive chip 21 are configured to be simultaneously driven and move in opposite directions. For example, the lens 10 is driven to move in the positive direction of the x-axis, and the photosensitive chip 21 is driven to move in the negative direction of the x-axis. The lens 10 is driven to move in the positive direction of the y-axis, and the photosensitive chip 21 is driven to move in the negative direction of the y-axis. Or the lens 10 is driven to move in the x-axis and y-axis, and the photosensitive chip 21 is driven to move in the x-axis and y-axis in the opposite direction of the lens 10. In other words, when moving in the x-axis and y-axis is needed, the displacement vector of the lens 10 and the displacement vector of the photosensitive chip 21 in the xoy plane are in opposite directions. The camera module usually includes a position sensor for detecting the shaking of the camera module or the terminal device (i.e. the electronic device carrying the camera module, such as a mobile phone). When the shaking is detected, the position sensor sends a signal to the camera module to drive the lens 10 and the photosensitive chip 21 to move accordingly to compensate for the shaking, thereby achieving optical image stabilization. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously and in opposite directions, which can achieve faster response and better anti-shake effect. In addition, the anti-shake angle range of the camera module is usually limited by the suspension system and the driving system, and cannot achieve a large compensation angle range. In this embodiment, by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions, a large-angle shaking compensation is achieved. In addition, by simultaneously driving the lens 10 and the photosensitive chip 21 to move in opposite directions in this embodiment, compared with the scheme of only driving the lens 10 to move, the lens 10 and the photosensitive chip 21 have a larger relative movement stroke (for the sake of description, this relative movement stroke can be referred to as an anti-shake stroke), which can have a better compensation effect. In particular, due to the increase of the anti-shake stroke, this embodiment also has a good compensation effect on the tilt shaking of the camera module. Further, the movement direction of the anti-shake movement of this embodiment can be limited in the xoy plane, without tilting the optical axis of the lens 10 or the photosensitive chip 21, thereby avoiding the image blur problem caused by anti-shake movement.

[0147] Further, in another embodiment of the present application, the photosensitive chip 21 can also be driven to rotate in the xoy plane by the second driving part 40, thereby realizing compensation for the shaking in the rotation direction of the camera module.

[0148] Further, still referring to Figure 2In one embodiment of the present application, the camera module includes a first driving part 30, a lens 10, a second driving part 40 and a photosensitive assembly 20. The lens 10 is mounted on the first driving part 30. The first driving part 30 can have a cylindrical first motor carrier which can be used as a movable part of the first driving part, and the lens is mounted on the inner side of the first motor carrier. The first driving part also has a stationary part, or base part. In this embodiment, the base part can be implemented as a motor housing. The motor housing can include a base and a cover. The base has a light passage hole. The movable part is movably connected to the base part. The driving element can be a coil-magnet combination which can be mounted between the movable part and the base part, for example, between the first motor carrier and the motor housing. In fact, the first driving part in this embodiment can directly adopt the common structure of the optical anti-shake motor in the prior art. Further, in this embodiment, the second driving part 40 can be supported and fixed on the bottom surface of the first driving part 30. The second driving part 40 can also include a base part and a movable part. The base part is directly connected to the first driving part. The movable part is located below the base part and movably connected to the base part. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21 mounted on the surface of the circuit board, and a lens seat 22 surrounding the photosensitive chip 21. The bottom of the lens seat 22 can be mounted on the surface of the circuit board 23, and the top surface can be fixed to the movable part of the second driving part 40. The lens seat 22 has a light passage hole in the center, and a filter 24 is mounted on the lens seat 22 (the filter 24 can also be regarded as a component part of the photosensitive assembly 20). Under the driving of the movable part of the second driving part 40, the photosensitive assembly 20 can translate in the x and y directions or rotate in the xoy plane relative to the base part. For the convenience of description, the base part of the first driving part 30 is referred to as the first base part, the base part of the second driving part 40 is referred to as the second base part, the movable part of the first driving part 30 is referred to as the first movable part, and the movable part of the second driving part 40 is referred to as the second movable part.

[0149] Figure 3 A cross-sectional view of a camera module with an anti-shake function is shown. In this embodiment, the camera module includes a first driving part 30, a lens 10, a second driving part 40 and a photosensitive assembly 20. The lens 10 is mounted on the first driving part 30. The structure and assembly method of the first driving part 30 and the lens 10 can be the same as those in the first embodiment of the present application. Figure 2The first embodiment is consistent with the previous embodiment and will not be repeated. The difference between the present embodiment and the previous embodiment is that the second driving part 40 is located inside the photosensitive component 20. In the present embodiment, the photosensitive component 20 includes a circuit board 23, a lens seat 22, a filter 24, and a photosensitive chip 21. The bottom of the lens seat 22 can be mounted on the surface of the circuit board 23, and the top surface can be fixed to the base part of the first driving part 30. The lens seat 22 has a light passing hole in the center, and a filter 24 is mounted on the lens seat 22. The lens seat 22, the filter 24, and the circuit board 23 can form a cavity, and the photosensitive chip 21 is located in the cavity 25. In the present embodiment, the second driving part 40 can also be located in the cavity 25. Specifically, the base part of the second driving part 40 can be mounted on the surface of the circuit board 23, and the movable part of the second driving part 40 is movably connected with the base part. The photosensitive chip 21 is mounted on the surface of the movable part. In this way, the photosensitive chip 21 can be driven by the movable part of the second driving part 40 to translate in the x and y directions or rotate in the xoy plane relative to the base part.

[0150] The second driving part of the camera module in the present application is described above in combination with two embodiments. The following further introduces a method for compensating for the tilt and shake of the camera module based on the design idea of the present application.

[0151] Figure 4 The relationship between the movement distance of the lens and the photosensitive chip and the module tilt angle in four different situations in the present application is shown. Position A in the figure represents the movement distance combination of the lens and the photosensitive chip for compensating for the tilt angle a of the camera module. As shown in the figure, the movement distance of the lens is represented by the length of the arrow, and the movement distance of the photosensitive chip is represented by the length of the arrow. Figure 4As shown, the lens moves a distance b and the photosensitive chip (hereinafter sometimes referred to as a chip) moves a distance c. The lens or chip movement distance can be equivalent to the angle of the image plane deviating from the optical axis during optical imaging. Specifically, when the lens is translated in the xoy plane by a distance b, the angle a1 of the image plane deviation and the image distance have an arithmetic relationship. The image distance is different at different shooting distances. In order to calculate and express conveniently, the image distance is replaced by the image-side focal length. Specifically, the relationship between the angle a1 of the image plane deviation and the image-side focal length f of the lens is tan(a1) = b / f. When the photosensitive chip is translated in the xoy plane by a distance c, the relationship between the angle a2 of the image plane deviation and the image-side focal length f of the lens is tan(a2) = c / f. In this embodiment, the movement directions of the lens and the photosensitive chip are opposite, and therefore the calculation method of the comprehensive compensation angle a of the camera module is a = a1 + a2 = arctan(b / f) + arctan(c / f). In one embodiment, the movement distances of the lens and the photosensitive chip can be set to be the same, i.e., b = c. In another embodiment, the movement distances of the lens and the photosensitive chip can be set to be different, for example, the movement distance of the lens can be greater than the movement distance of the photosensitive chip, i.e., b > c. In this embodiment, the second driving part can select a smaller driver (such as a mems driver, etc., and the movable stroke of such a driver is usually relatively small) to help the camera module to be miniaturized as a whole.

[0152] Further, in one embodiment of the present application, the ratio of the lens movement distance and the photosensitive chip movement distance can be optionally set to maintain a fixed ratio, such as b / c = 6:4, or b / c = 7:3, or b / c = 5:5. Regardless of the compensation value (such as the comprehensive compensation angle a) of the camera module shake, the movement distances of the lens and the photosensitive chip maintain the preset ratio, which is beneficial to the uniformity of the compensation effect of the camera module within the compensable range, and is also beneficial to reducing the design difficulty of the driving logic module of the camera module anti-shake system.

[0153] Further, in the configuration of the lens movement distance and the photosensitive chip movement distance based on the fixed ratio for anti-shake movement, since the movable range of the photosensitive chip is small, sometimes the shake of the camera module can exceed the maximum movement stroke of the photosensitive chip. Therefore, in one embodiment of the present application, a shake threshold can be set, for example, for the compensation angle a of the shake to be compensated, a threshold K can be set. When the actually calculated shake angle a is less than or equal to the anti-shake threshold K, the lens movement distance b and the photosensitive chip movement distance c maintain a fixed ratio, which can be preset, for example, b / c = 6:4, or b / c = 7:3, or b / c = 5:5. When the actually calculated shake angle a is greater than the anti-shake threshold K, the photosensitive chip movement distance c takes the maximum value of the movement stroke of the photosensitive chip, i.e., the maximum stroke c of the photosensitive chip is used. maxand the lens moving distance b = tan(a / f)-c max In other words, when the shake angle that the camera module needs to compensate is above the anti-shake threshold K, based on the preset fixed ratio, the lens moves to a position corresponding to the maximum moving distance of the photosensitive chip (i.e., the maximum stroke c max of the photosensitive chip, and then remains stationary. max Meanwhile, the photosensitive chip moves synchronously to the maximum moving distance c max of the photosensitive chip in the opposite direction first, and then remains stationary.

[0154] Further, in another embodiment of the present application, in the xoy plane, the maximum stroke b max of the lens corresponds to an anti-shake angle (which refers to the angle of the camera module tilting shake) that can be smaller than the anti-shake angle corresponding to the maximum stroke c max of the photosensitive chip. Under this design, the anti-shake system of the camera module can have a faster response speed. In high-end lenses, the lens often has a large number of lenses, for example, the number of lenses in the rear main camera lens of a current smartphone can reach 8, and in order to further improve the imaging quality, glass lenses are also used in some lenses, which all result in a larger weight of the lens. When the driving force does not increase significantly, the speed of the driving device driving the lens to move will decrease. The weight of the photosensitive chip or photosensitive assembly is relatively light, and it can reach the preset position with a smaller driving force. Therefore, in the scheme of the present embodiment, the advantage of the relatively light weight and relatively fast moving speed of the photosensitive chip or photosensitive assembly can be better utilized, and the response speed of the anti-shake system of the camera module can be effectively improved.

[0155] Further, in another embodiment of the present application, the fixed ratio of the lens moving distance and the photosensitive chip moving distance can be set according to the lens weight, the driving force of the first driving part, the photosensitive chip (or photosensitive assembly) weight, the driving force of the second driving part, and other factors. By setting a suitable fixed ratio, the time for the lens and the photosensitive chip to move to their respective anti-shake target positions can be made substantially consistent, thereby obtaining a better anti-shake effect. Specifically, the lens weight and the driving force of the first driving part can basically determine the moving speed of the lens, and the photosensitive chip (or photosensitive assembly) weight and the driving force of the second driving part can basically determine the moving speed of the photosensitive chip. When the moving speed of the lens is less than the moving speed of the photosensitive chip (for example, in the case of a larger lens weight), the moving distance of the photosensitive chip can have a larger proportion when setting the fixed ratio. In this way, the faster moving speed of the photosensitive chip can be utilized to make the photosensitive chip move a longer distance, and the time for the lens and the photosensitive chip to move to their respective anti-shake target positions can be made substantially consistent.

[0156] Furthermore, in another embodiment of this application, the first drive unit may employ a drive element with a large driving force and a suspension system with a large stroke. For example, the first drive unit may be driven by an SMA (shape memory alloy) element. Compared to the traditional coil magnet combination, the SMA element can provide a larger driving force with a smaller footprint, thus the first drive unit can be designed to be more compact, which is beneficial for the miniaturization of the camera module.

[0157] Furthermore, Figure 5 A cross-sectional schematic diagram of a camera module according to one embodiment of this application is shown. (Reference) Figure 5 In this embodiment, the second base part 41 of the second drive part 40 and the base part of the first drive part 30 ( Figure 5 (Not specifically shown) are fixed together. Lens 10 can be mounted on the movable part of the first drive unit 30 (e.g., the first motor carrier, Figure 5 (Not specifically shown). The photosensitive component 20 includes a circuit board 23, a photosensitive chip 21, a lens mount 22, a filter 24, etc. The photosensitive component 20 can be mounted on the second movable part 42 of the second drive unit 40. Specifically, the bottom surface of the second movable part 42 can rest against the top surface of the lens mount 22 of the photosensitive component 20. In the second drive unit 40, the second base part 41 and the second movable part 42 can be elastically connected by a suspension system. In this embodiment, the suspension system allows the second movable part 42 to translate relative to the second base part 41 in the xoy plane. Optionally, the suspension system can be a ball bearing system, which has the advantage that: in the z-direction, the second movable part 42 and the second base part 41 are in contact through the ball bearings, and the second movable part 42 only moves in the xoy plane, while the movement in the optical axis direction can be prevented by the ball bearings between the second movable part 42 and the second base part 41, thereby avoiding any impact on the focusing of the camera module.

[0158] Optionally, in another embodiment, the suspension system may include an elastic element (such as a spring) through which the fixed part and the movable part are connected. This elastic element allows the movable part to translate relative to the base in the xoy plane, but prevents the movable part from moving relative to the base outside the xoy plane. Compared to a ball bearing system, the advantage of using an elastic element is that it can provide an initial force between the base and the movable part. This initial force, in conjunction with the driving force of the drive element, can control the distance the movable part moves or maintain its position, eliminating the need for a separate drive element to provide a conjugate driving force to control the position of the movable part. With a ball bearing system, the movable part moves freely relative to the base in the xoy direction when the drive element does not provide a driving force; therefore, at least one pair of opposing driving forces are often required to keep the movable part in its initial position.

[0159] Furthermore, still referencingFigure 5 In one embodiment of the present application, the anti-shake can be realized by driving the whole light sensing assembly 20 to move. Meanwhile, the circuit board 23, the light sensing chip 21, the lens seat 22 and the filter 24 are packaged as a whole, the circuit board 23, the lens seat 22 and the filter 24 form a closed space, and the light sensing chip 21 is contained in the closed space, thus improving the sealing property of the light sensing assembly 20 and ensuring that the imaging of the light sensing chip 21 is not affected by dust during the manufacturing or using of the camera module.

[0160] In the embodiment, still referring to Figure 5 In one embodiment of the present application, the back of the circuit board can be directly supported on the terminal device (i.e. the electronic device on which the camera module is mounted, such as a mobile phone), specifically, the back of the circuit board 23 can be supported on the main board or other supporting member 90 of the terminal device. Although the second movable part 42 is connected to the light sensing assembly 20 and the second base part 41 is connected to the first driving part 30 in the embodiment, it can be understood that the movement of the second movable part 42 and the second base part 41 is relative. In the anti-shake movement, the movement directions of the movable part of the first driving part relative to the base part thereof and the movable part of the second driving part relative to the base part thereof are opposite.

[0161] Further, Figure 6 A cross-sectional view of the camera module in another embodiment of the present application is shown. Referring to Figure 6 In the embodiment, a rear shell 49 is added below the second driving part 40, the rear shell 49 is connected to the second base part 41 of the second driving part 40 and forms a containing cavity, the second movable part 42 of the second driving part 40 and the light sensing assembly 20 are both contained in the containing cavity. As shown in Figure 6 There can be a gap 49a between the light sensing assembly 20 and the bottom of the rear shell 49, i.e. the light sensing assembly 20 is suspended and only connected to the second movable part 42 of the second driving part 40. In the embodiment, the rear shell 49 is directly supported on the terminal device. Since the rear shell 49 is connected to the terminal device and the base parts of the second driving part 40 and the first driving part 30, in the anti-shake process, the movable parts of the first driving part 30 and the second driving part 40 drive the lens 10 and the light sensing assembly 20 to move in opposite directions at the same time with the terminal device as the reference. Further, in the embodiment, the second movable part 42 of the second driving part 40 is directly bonded to the upper end surface of the light sensing assembly 20, thus the filter 24 can be separated from the external space, so as to avoid the debris generated by the friction or collision of the second movable part 42 relative to the second base part 41 from directly falling on the surface of the filter 24.

[0162] Figure 7 A cross-sectional view of the camera module in another embodiment of the present application is shown. Referring toFigure 7 In the embodiment, the first driving part 30 is adapted to drive the lens 10 to move in the optical axis direction to realize the focusing function, and also adapted to drive the lens 10 to move in the xoy plane to realize the anti-shake function. Optionally, the first driving part 30 comprises at least two carriers, i.e. a first carrier 31 and a second carrier 32, the lens 10 is supported on the first carrier 31, a suspension system is arranged between the first carrier 31 and the second carrier 32, and a suspension system is arranged between the second carrier 32 and a housing 33 of the first driving part 30. In the embodiment, the suspension system between the first carrier 31 and the second carrier 32 (i.e. the first suspension system) is a ball bearing system, and the suspension system between the second carrier 32 and the housing 33 (i.e. the second suspension system) is a suspension system based on elastic elements (e.g. elastic sheets). In the embodiment, the second suspension system is arranged outside the first suspension system, the first suspension system allows the lens 10 and the first carrier 31 to move in the xoy plane to realize the anti-shake function, and the second suspension system allows the lens 10, the first carrier 31 and the second carrier 32 to move as a whole in the optical axis direction to realize the focusing function. Optionally, in another embodiment, the second suspension system can also be arranged inside the first suspension system. In another variant, the second suspension system can also be arranged below the first suspension system. In the embodiment, the suspension system refers to a system that movably connects two components, and the freedom degree (i.e. the moving direction) of the relative movement of the two components is limited. The two movably connected components can be referred to as a base part and a movable part respectively. Generally, the suspension system is used in cooperation with a driving element (e.g. an SMA element or a coil-magnet combination). The driving force is provided by the driving element, and under the action of the driving force, the movable part moves relative to the base part in the moving direction defined by the suspension system.

[0163] Further, Figure 8 A sectional view of a camera module in another embodiment of the application is shown. Referring to Figure 8 In the embodiment, the movable part of the second driving part 40 can be provided with a downwardly extending extension arm 42a, which is bonded to the circuit board 23 of the photosensitive assembly 20. An FPC board 42b can be arranged on the extension arm 42a, which can be directly soldered to the circuit board 23, so that the driving element mounted on the movable part is electrically connected to the circuit board 23. In the embodiment, the adhesive can be prevented from flowing onto the filter when the photosensitive assembly 20 is bonded to the movable part, thereby affecting the imaging. In addition, in the embodiment, the upper end surface (i.e. the top end) of the photosensitive assembly 20 has a gap with the second driving part 40, which can prevent the color filter from being scratched or broken.

[0164] Further, Figure 9a A perspective view of the second driving part in an embodiment of the application is shown, Figure 9bA perspective exploded view of the second driving part in one embodiment of the present application is shown. Referring to Figure 9a and Figure 9b In this embodiment, the second movable part 42 of the second driving part 40 and the center of the second base part 41 both have a light passing hole through which light passing through the lens is incident on the photosensitive chip and forms an image. In this embodiment, the balls 80 are preferably four, each arranged at a corner of the second driving part 40 (referring to the four corner positions in the top view).

[0165] Further, Figure 10a A cross-sectional view of the second driving part and the photosensitive assembly in one embodiment of the present application is shown. Referring to Figure 10a In this embodiment, the second driving part 40 includes a second movable part 42 and a second base part 41, wherein the second base part 41 includes a base 41a and a cover 41b. The cover 41b includes a side wall 41c extending downward from the base 41a to form a ring around the second movable part 42 and a resting platform 41d extending horizontally inward from the side wall 41c. The top of the side wall 41c is connected to the base 41a, and the lower surface of the edge region 42a of the second movable part 42 can rest on the upper surface of the resting platform 41d. The balls 80 and the edge region 42a of the second movable part 42 are clamped between the base 41a and the resting platform 41d of the cover 41b, ensuring that the second movable part 42 and the second base part 41 do not move relative to each other in the optical axis direction (i.e., the z-axis direction). In this way, the second driving part 40 only allows the second movable part 42 to translate relative to the second base part 41 in the xoy plane. More specifically, at least one accommodation space is provided between the base 41a and the cover 41b, which accommodates the balls 80, and the second movable part 42 and the base 41a respectively abut the balls 80, thereby ensuring that the second movable part 42 and the second base part 41 do not move relative to each other in the optical axis direction. The second movable part 42 can include a main body part 42b and an edge region 42a, and the thickness of the edge region 42a can be less than the thickness of the main body part 42b. The lower surface (also referred to as the lower end surface or the bottom surface) of the main body part 42b can be lower than the lower surface (also referred to as the lower end surface or the bottom surface) of the cover 41b, thereby ensuring that the photosensitive assembly 20 does not contact the cover 41b after being attached to the second movable part 42, avoiding the photosensitive assembly 20 from colliding or rubbing against the cover when performing anti-shake movement.

[0166] Further, still referring to Figure 10aIn an embodiment of the present application, the upper surface of the second base portion 41 can have a stepped structure, which can include a first stepped surface 41e on the outer side and a second stepped surface 41f on the inner side, the height of the second stepped surface 41f being lower than that of the first stepped surface 41e, thereby providing a larger axial (i.e. z-axis direction) moving space for the focusing of the camera module. In this embodiment, the first driving portion can be mounted on the first stepped surface 41e of the second base portion 41 of the second driving portion 40. The upper surface of the edge region 42a of the second movable portion 42 can form a groove, which can accommodate the ball 80 and restrict the movement of the ball 80 within the groove, while also allowing the debris generated by the friction between the ball 80 and the second movable portion 42 or the second base portion 41 to be retained within the groove. Moreover, since the ball 80 can be placed within the groove, the second movable portion 42, the base 41a and the cover 41b of the second base portion 41 can be more convenient to assemble. In another embodiment, the protrusion on the outer side of the groove can be cancelled, which can reduce the lateral size of the second driving portion, thereby facilitating the miniaturization of the camera module. Since the protrusion on the outer side of the groove is cancelled, the groove is actually degenerated into a recessed step, the outer stepped surface of which is lower than the inner stepped surface, and the recessed step, together with the side wall of the cover and the base, forms an accommodation cavity for accommodating the ball.

[0167] Further, in an embodiment of the present application, the edge region of the movable portion can be provided with a plurality of grooves, the number of which can match the number of balls. Each of the balls is accommodated in a corresponding groove. The bottom surface of the groove can be a plane, which can ensure that the movable portion will not tilt when translating, and at the same time, only a single layer of balls can achieve the relative movement between the movable portion and the base portion in the xoy plane in three axes. Alternatively, the base can also be provided with a base groove at a position corresponding to the movable portion groove. In the case of a certain ball diameter, this design can reduce the thickness of the second driving portion. Moreover, the bottom surface of the groove or the bottom surface of the recessed step (referring to the outer stepped surface of the recessed step) can be a plane, which can allow the movable portion to rotate relative to the base portion in the xoy plane, i.e. around the z-axis. The rotation direction around the z-axis can be referred to as the Rz direction, or the Rz-axis rotation. In this embodiment, the photosensitive chip can move in the x, y, Rz three directions to achieve anti-shake, thereby having better anti-shake ability. Since the x, y, Rz three moving directions are all in the xoy plane, the aforementioned relative movement in the xoy plane in three axes refers to movement in the x, y, Rz three directions.

[0168] Figure 10b A cross-sectional view of the second driving portion in which the balls are arranged on the lower side of the movable portion is shown in a variant embodiment of the present application. Referring to FIG. 6, the balls 80 are arranged on the lower side of the movable portion 42, and the upper surface of the edge region 42a of the movable portion 42 is provided with a plurality of grooves 42g, the number of which matches the number of balls 80. Each of the balls 80 is accommodated in a corresponding groove 42g. The bottom surface of the groove 42g is a plane, which can ensure that the movable portion 42 will not tilt when translating, and at the same time, only a single layer of balls 80 can achieve the relative movement between the movable portion 42 and the base portion 41 in the xoy plane in three axes. Alternatively, the base 41a can also be provided with a base groove 41g at a position corresponding to the movable portion groove 42g. In the case of a certain ball diameter, this design can reduce the thickness of the second driving portion. Moreover, the bottom surface of the groove 42g or the bottom surface of the recessed step (referring to the outer stepped surface of the recessed step) can be a plane, which can allow the movable portion 42 to rotate relative to the base portion 41 in the xoy plane, i.e. around the z-axis. The rotation direction around the z-axis can be referred to as the Rz direction, or the Rz-axis rotation. In this embodiment, the photosensitive chip can move in the x, y, Rz three directions to achieve anti-shake, thereby having better anti-shake ability. Since the x, y, Rz three moving directions are all in the xoy plane, the aforementioned relative movement in the xoy plane in three axes refers to movement in the x, y, Rz three directions. Figure 10bIn this embodiment, the ball bearing 80 is located between the support platform 41d of the cover 41b and the second movable part 42. At the corresponding position of the ball bearing 80, the edge region 42a of the second movable part 42 and / or the support platform 41d can be provided with a groove, and the bottom surface of the groove can be set as a plane, thereby allowing the second movable part 42 to move relative to the second base part 41 only in the xoy plane, and without tilting when moving in the xoy plane.

[0169] Figure 10c A cross-sectional schematic diagram of a second drive unit with two layers of balls is shown in a modified embodiment of this application. In this embodiment, two layers of balls 81 and 82 are provided. Specifically, one layer of balls 81 is provided between the base 41a and the second movable part 42, and one layer of balls 82 is provided between the second movable part 42 and the support platform 41d of the cover 41b. Compared to Figure 10a In the embodiment shown, because a layer of ball bearings 82 is added between the second movable part 42 and the support platform 41d, the second movable part 42 will not directly rub against the support platform 41d during anti-shake movement, reducing the generation of debris. Furthermore, by providing two layers of ball bearings 81 and 82, the resistance of the second movable part 42 during movement can be reduced.

[0170] Furthermore, Figure 11a A cross-sectional schematic diagram of the second drive unit in one embodiment of this application is shown. (Reference) Figure 11a In this embodiment, the outer side of the second movable part 42 is provided with an inwardly recessed groove 42c, and the support platform 41d of the cover 41b of the second base part 41 is fitted into the groove 42c. In this solution, the lower end face of the second driving part 40 can have a large area. When the lens mount 22 is attached to the second movable part 42, the adhesive can be placed in a region further out of the lens mount 22, thereby keeping the adhesive as far away from the filter as possible, reducing the risk of adhesive flowing onto the filter 24, and also completely avoiding the risk of the lens mount 22 rubbing against the second base part 41 during image stabilization movement. Furthermore, in this embodiment, the second movable part 42 can be a split type. For example, the second movable part 42 can include a first movable part component 43 and a second movable part component 44, with the sides of the second movable part component 44 and / or the first movable part component 43 recessed inward to form the groove 42c. Further, Figure 11b A schematic diagram of the assembly of the second drive unit according to one embodiment of this application is shown. (Referring to the reference...) Figure 11a and Figure 11b During the assembly of the second drive unit 42, the movable first component 43, the second base 41, and the ball bearing 80 can be assembled first, and then the movable second component 44 can be attached to the lower end face of the movable first component 43. With this design, there is no need to worry about the glue coming into contact with the base when attaching the lens mount, and the glue can also be placed near the edge of the lens mount (without having to avoid the base at the four corners) to avoid glue contamination of the color filter.

[0171] Optionally, Figure 11c A cross-sectional view of a second driving part in another embodiment of the present application is shown. Referring to Figure 11c In this embodiment, the second movable part 42 can be integrally formed, i.e. the clamping groove 42c is formed directly when the second movable part 42 is formed. The cover 41b can be split type. Referring to Figure 11b The cover 41b can include two split cover members 41b1 and 41b2, which can be inserted into the clamping groove 42c of the second movable part 42 from the left and right sides respectively, to fix the axial (i.e. z-axis direction) position of the second movable part 42 and the second base part 41, and thus complete the packaging of the second driving part 40.

[0172] Further, Figure 12 A cross-sectional view of a second driving part in another embodiment of the present application is shown. Referring to Figure 12 In this embodiment, the outer side of the second movable part 42 is provided with a clamping groove 42c recessed inwardly, and the abutting table 41d of the second base part 41 and the ball 80 are both arranged in the clamping groove.

[0173] Further, in one embodiment of the present application, the movable part is bonded to the upper end surface of the lens holder of the photosensitive assembly, so as to realize the connection of the movable part and the photosensitive assembly. In a variant embodiment, the movable part can also be provided with an extension arm extending downwardly, and the circuit board of the photosensitive assembly is bonded through the extension arm, so as to realize the connection of the movable part and the photosensitive assembly. Referring to Figure 8 In the scheme in which the extension arm 42a of the movable part is bonded to the circuit board 23, optionally, the lens holder can be selected as a small lens holder 22a with low height, which is only used for mounting the photosensitive chip 24, and the electronic elements 25 such as capacitors and the like are arranged outside the photosensitive chip 21 and the small lens holder 22a. This scheme can reduce the height of the lens holder, so as to reduce the back focal length of the camera module, and thus reduce the overall height of the module. In this embodiment, since at least part of the electronic elements are arranged outside the lens holder, preferably, the outer side of the movable part of the second driving part 40 is provided with the clamping groove, so as to arrange the extension arm at the edge of the second driving part, so that the extension arm is far away from the electronic elements as much as possible, and the effect of the glue on the electronic elements is avoided.

[0174] Figure 13aA bottom view of the movable part of the second driving part in one embodiment of the present application is shown. In this embodiment, glue 50 is arranged between the lower end surface of the second movable part 42 and the upper end surface of the lens holder of the photosensitive assembly. The glue 50 can be arranged to avoid the four corners, so as to avoid the glue 50 from leaking into the gap of the ball accommodating structure at the four corners, which can negatively affect the anti-shake movement. Meanwhile, the edge of the second movable part 42 can be kept away from the filter, so as to reduce the risk of the glue contaminating the filter. Figure 13b A bottom view of the movable part of the second driving part in another embodiment of the present application is shown. In this embodiment, the glue 50 can be arranged along the edge of the lower end surface of the second movable part 42 to form a closed loop. This design can increase the sealing of the photosensitive assembly, so as to avoid dust from falling onto the color filter.

[0175] It should be noted that the above embodiments can be combined with each other. For example, the card slot design shown in 11a, Figure 11b and Figure 12 can be combined with the double-layer ball design. In this case, the groove / recessed step can be arranged on the bearing table or on the movable part.

[0176] Further, Figure 14 A bottom view of the installation position of the driving element of the second driving part in one embodiment of the present application is shown. Figure 15a A cross-sectional view of the second driving part in one embodiment of the present application is shown. In this embodiment, the magnet 61 can be arranged at the edge of the second base part 41, and the coil 62 can be arranged at the edge 42a of the second movable part 42. The coil 62 can be connected to the circuit board 23 of the photosensitive assembly 20 through the FPC board arranged on the second movable part 42. Since the second movable part 42 and the photosensitive assembly 20 move synchronously during the anti-shake process, the coil 62 is connected to the circuit board 23 through the FPC board, so as to ensure that there is no relative movement of the wire or the welding part during the movement, thereby reducing the risk of the electrical connection failure or poor contact at the welding part. In this embodiment, the magnet can be arranged at the base 41a of the second base part 41.

[0177] Further, Figure 15b A cross-sectional view of the camera module in one embodiment of the present application is shown. Referring to Figure 14 and Figure 15b , in one embodiment of the present application, the driving elements of the first driving part 30 and the second driving part 40 are both coil-magnet combinations, and the first driving part 30 and the second driving part 40 can have a shared magnet 61’. The shared magnet 61’ can be arranged on the first base part 31 or on the second base part 41 (as shown in Figure 15b). For the convenience of description, the coil of the first driving part 30 is referred to as a lens driving coil 62a, and the coil of the second driving part 40 is referred to as a photosensitive component driving coil 62b. The lens driving coil 62a is mounted on the first movable part 32, and the photosensitive component driving coil 62b is mounted on the second movable part 42. In the present embodiment, the first driving part 30 drives the lens 10 to translate in the x-axis and y-axis directions through electromagnetic induction between the lens driving coil 62a and the common magnet 61', and the second driving part 40 drives the photosensitive chip to translate in the x-axis and y-axis directions through electromagnetic induction between the photosensitive component driving coil 62b and the common magnet 61'. Further, in the present embodiment, the common magnet 61' is arranged at the edge region of the second base part 41, and the lens driving coil 62a is arranged at the edge region of the second movable part 42. For the convenience of description, the common magnet 61' and the photosensitive component driving coil 62b in the second driving part 40 are referred to as a coil-magnet combination. For reference, see Figure 14 In the present embodiment, in the top view, the coil-magnet combination includes a first coil-magnet pair 63, a second coil-magnet pair 64, and a third coil-magnet pair 65; the first coil-magnet pair 63 and the second coil-magnet pair 64 are used to provide driving force in the x-axis direction; and the third coil-magnet pair 65 is used to provide driving force in the y-axis direction. In the top view, the second driving part 40 has a rectangular shape, the first coil-magnet pair 61 and the second coil-magnet pair 62 are arranged along the first side 48 and the second side 49 of the second driving part 40 respectively, and the first side 48 and the second side 49 do not intersect. The second coil-magnet pair 63 is arranged along the third side 47 of the second driving part 40, and the third side 47 intersects both the first side 48 and the second side 49. Correspondingly, in the present embodiment, the lens driving coil includes a first lens driving coil 62a1, a second lens driving coil 62a2, and a third lens driving coil 62a3 arranged above the first coil-magnet pair 63, the second coil-magnet pair 64, and the third coil-magnet pair 65 respectively (not shown in the figure). The first lens driving coil 62a1 and the common magnet 61' of the first coil-magnet pair 63, and the second lens driving coil 62a2 and the common magnet 61' of the second coil-magnet pair 64 are used to provide driving force in the x-axis direction, and the third lens driving coil 62a3 and the common magnet 61' of the third coil-magnet pair 65 are used to provide driving force in the y-axis direction. Figure 15b The positions in the top view can be referred to the positions of the third coil-magnet pair 65 in Figure 14 The first lens driving coil 62a1 and the common magnet 61' of the first coil-magnet pair 63, and the second lens driving coil 62a2 and the common magnet 61' of the second coil-magnet pair 64 are used to provide driving force in the x-axis direction, and the third lens driving coil 62a3 and the common magnet 61' of the third coil-magnet pair 65 are used to provide driving force in the y-axis direction.

[0178] Further, Figure 15c shows a cross-sectional schematic view of a camera module according to another embodiment of the present application. For reference, see Figure 14 andFigure 15c In this embodiment, the first base portion 31 can include a motor base 31a located below the first movable portion 32, the motor base 31a having a light passage hole. In this embodiment, the common magnet 61' is mounted at an edge region of the motor base 31a; the first movable portion 32 is in a cylindrical shape, the lens driving coil is mounted at an inner side surface of the first movable portion 32, and the lens driving coil 62a (e.g., first lens driving coil 62a1, second lens driving coil 62a2) is mounted at a bottom of the first movable portion 32. In this embodiment, the common magnet 61' and the lens driving coil 62a constitute a magnet coil pair including a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65 (refer to FIG. 6B for details). Figure 14 In this embodiment, the first base portion 31 can include a motor base 31a located below the first movable portion 32, the motor base 31a having a light passage hole. In this embodiment, the common magnet 61' is mounted at an edge region of the motor base 31a; the first movable portion 32 is in a cylindrical shape, the lens driving coil is mounted at an inner side surface of the first movable portion 32, and the lens driving coil 62a (e.g., first lens driving coil 62a1, second lens driving coil 62a2) is mounted at a bottom of the first movable portion 32. In this embodiment, the common magnet 61' and the lens driving coil 62a constitute a magnet coil pair including a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65 (refer to FIG. 6B for details).

[0179] Further, in a variant of the present application, in the first driving part, one of the first lens driving coil and the second lens driving coil can be omitted, i.e. the first base part of the first driving part can only install the first lens driving coil or only install the second lens driving coil to provide the driving force in the x-axis direction. In this embodiment, the lens does not need the movement freedom of rotating around the z-axis, and the first lens driving coil and the third lens driving coil are retained, i.e. the movement of the x-axis and the y-axis can be realized. Specifically, in this embodiment, the magnet coil pair composed of the common magnet and the photosensitive assembly driving coil includes: a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; wherein the first coil magnet pair and the second coil magnet pair are used to provide the driving force in the x-axis direction; the third coil magnet pair is used to provide the driving force in the y-axis direction; and in the top view, the outer contour of the second driving part is rectangular, the first coil magnet pair and the second coil magnet pair are arranged along the first edge and the second edge of the first driving part respectively, the first edge and the second edge do not intersect, and the third coil magnet pair is arranged along the third edge of the second driving part, the third edge intersects both the first edge and the second edge. The lens driving coil includes an x-axis lens driving coil and a y-axis lens driving coil, the x-axis lens driving coil can be located directly above the first coil magnet pair, and the y-axis lens driving coil can be located directly above the third coil magnet pair. The second coil magnet pair can not be arranged directly above the lens driving coil. This design can reduce the number of lens driving coils of the first movable part, which will help to reduce the difficulty of electrical connection between the coils of the first movable part and the circuit board of the photosensitive assembly, thereby reducing the process cost and improving the production yield. At the same time, due to the Rz movement freedom (i.e. the freedom of rotating around the z-axis) of the second movable part, the present embodiment can still realize the relative rotation between the photosensitive chip and the electronic terminal device (such as a mobile phone) in the Rz freedom.

[0180] Further, Figure 15d A cross-sectional schematic diagram of a camera module of a variant of the present application is shown. This embodiment can be regarded as Figure 15c a variant of the embodiment. Referring to Figure 15dIn this embodiment, the common magnet is mounted on the bottom of the first base (e.g. on the motor base). In this design, the distance between the lens driving coil 62a in the first driving part and the common magnet 61' is small, which can increase the driving force of the coil-magnet pair in the first driving part. However, the distance between the common magnet 61' and the coil (photosensitive component driving coil 62b) of the second driving part can be relatively large. Therefore, in this embodiment, a notch 68 or a through hole 69 (i.e. the photosensitive component driving coil is not blocked by the second base in the perspective view by the hollow structure) can be provided on the second base 41 at the position corresponding to the common magnet 61' to avoid the reduction of the electromagnetic force between the common magnet 61' and the photosensitive component driving coil 62b due to the blockage of the second base 41. In this embodiment, the notch 68 or the through hole 69 refers to the hollow structure formed by hollowing out part of the blocks of the second base. Further, Figure 15e a perspective view of the second driving part with the second base having a notch, Figure 15f a perspective exploded view of the second driving part with the second base having a notch. Referring to Figure 15e and Figure 15f It can be seen that the notch 68 refers to the hollow structure which is not surrounded by the non-hollow blocks of the second base on at least one side. For example, when the coil is arranged close to the outer side of the second driving part, the edge block of the second base corresponding to the coil can be hollowed out to form the notch. The photosensitive component driving coil can be any one or more of the first photosensitive component driving coil, the second photosensitive component driving coil and the third photosensitive component driving coil. Figure 15g a perspective view of the second driving part with the second base having a through hole, Figure 15h a perspective exploded view of the second driving part with the second base having a through hole. Referring to Figure 15g and Figure 15h It can be seen that the through hole 69 refers to the hollow structure which is still surrounded by the non-hollow blocks of the second base 41 on the periphery. In this embodiment, the base 41b of the second base 41 is located between the motor base 31a and the second movable part 42, and therefore the notch 68 or the through hole 69 is located on the base 41b of the second base 41. It should be noted that the through hole 69 here refers to the through hole in the edge area for avoiding the magnetic field of the magnet, and is not the central through hole for light transmission.

[0181] In the above embodiments, the first driving part and the second driving part share the magnet, which can reduce the volume occupied by the first base part or the second base part for mounting the magnet, and help reduce the thickness of the first base part base (e.g. motor base) or the second base part base (usually located between the first base part and the second movable part), thereby helping to reduce the height of the anti-shake camera module.

[0182] In the above embodiments, the bottom surface of the first base part and the top surface of the second base part can be bonded by the first adhesive to bond the first combination of the first driving part and the lens assembly, and the second combination of the second driving part and the photosensitive assembly, thereby forming a complete camera module. In the top view, the first adhesive can be arranged outside the shared magnet of the first base part or the second base part. This design can avoid the negative impact of the bonding force between the first base part and the second base part. This is because the adhesive is usually selected according to the materials of the first base part and the second base part, so the bonding force between the adhesive and the magnet is usually weaker than the bonding force between the adhesive and the first base part and the second base part. Therefore, in the present embodiment, the arrangement position of the adhesive avoids the shared magnet of the first base part or the second base part, which can help improve the structural strength and reliability of the camera module.

[0183] Further, according to an embodiment of the present application, the photosensitive assembly in the camera module can include a circuit board, a photosensitive chip mounted on the surface of the circuit board, a lens seat mounted on the surface of the circuit board and surrounding the photosensitive chip, a filter mounted on the lens seat, and an electronic component mounted on the surface of the circuit board and located outside the lens seat. In the second driving part, the second movable part can have a rigid extension arm extending downward, the extension arm is bonded to the circuit board of the photosensitive assembly, the extension arm surrounds the lens seat, and the electronic component is located between the inner side of the extension arm and the outer side of the lens seat; and the photosensitive assembly driving coil is electrically connected to the circuit board through an FPC, the FPC is attached to the side of the extension arm, and the FPC is directly soldered to the circuit board. In the present embodiment, the rigid extension arm surrounding the lens seat can protect the electronic component. The electronic component may, for example, be a resistor, a capacitor, etc., which can together with the circuit in the circuit board form various functional circuits required by the camera module.

[0184] Further, Figure 16a A cross-sectional view of the camera module in an embodiment of the present application is shown. Referring to FIG. 1, the camera module includes a first base part 1, a second base part 2, a first driving part 3, a second driving part 4, a lens assembly 5, and a photosensitive assembly 6. Figure 16aIn this embodiment, the sidewall of the rear shell 49 can have a first through hole 49b for a flexible printed circuit (FPC) of the circuit board 23 to pass through, so as to be electrically connected to a main board or other components of a terminal device. The central part of the bottom plate 49c of the rear shell 49 can have a second through hole 49d for facilitating assembly of the camera module. The process of assembling the camera module can include: first, mounting the lens 10 to the first driving part 30, then attaching the second driving part 40 to the bottom of the first driving part 30, and finally attaching the photosensitive assembly 20 to the second movable part 42 of the second driving part 40 through the second through hole 49d in the bottom of the rear shell 49.

[0185] Figure 16b A schematic diagram showing the assembly method of the camera module in one embodiment of the present application is shown. In this embodiment, the photosensitive assembly 20 can be placed on the adjustment device 29, and the second through hole 49d in the bottom of the rear shell 49 allows the adjustment device 29 to determine the preferred position and attitude of the photosensitive assembly 20 through an active calibration process, and then bond the photosensitive assembly 20 to the second movable part 42 of the second driving part 40 through the adhesive 28.

[0186] Figure 16c A cross-sectional schematic diagram of the camera module in another embodiment of the present application is shown. Referring to Figure 16c In this embodiment, the bottom of the rear shell 49 is a complete bottom plate 49c, i.e., the bottom plate 49c is not provided with a second through hole. During assembly, the second driving part 40 and the photosensitive assembly 20 can be attached together to form a first combination, the first driving part 30 and the lens 10 can be assembled together to form a second combination, and then the relative position of the first combination and the second combination can be determined through an active calibration process (active calibration includes adjustment of position and attitude), and finally the first driving part 30 and the second driving part 40 can be bonded according to the relative position determined by the active calibration, wherein the adhesive 27 used to bond the first combination and the second combination can be arranged between the bottom surface of the first driving part 30 and the top surface of the second driving part 40.

[0187] Further, Figure 17 A schematic diagram showing the arrangement of the camera module and its connecting band in one embodiment of the present application is shown. Referring to Figure 17In the embodiment, the camera module can include a first connecting strip 26a and a second connecting strip 26b. The first connecting strip 26a is arranged at the top region of the first driving part 30 and electrically connected to the first driving part 30. The second connecting strip 26b is in communication with the circuit board 23 of the photosensitive assembly 20. The second connecting strip 26b can be provided with multiple bending portions to form a curved and stacked shape, so as to buffer the stress caused by the movement of the photosensitive assembly 20. The end of the second connecting strip 26b can be provided with a connector which is fixed and electrically connected to the transfer column 26c by pressing, and then the main board (or other components) of the terminal device is conducted through the transfer column 26c. Similarly, the end of the first connecting strip 26a can also be connected to a connector which is fixed and electrically connected to the transfer column 26c by pressing, and then the main board (or other components) of the terminal device is conducted through the transfer column 26c. In the scheme of the embodiment, the conduction circuit of the first driving part 30 can be separated from the photosensitive assembly 20 and is not affected by the movement of the photosensitive assembly 20. The second connecting strip 26b and the transfer column 26c can be accommodated in the second housing 70, and the first connecting strip 26a is located outside the second housing 70. The top of the second housing 70 can be provided with a third through hole 70a, so that the connector of the first connecting strip 26a extends into and is electrically conducted with the second connecting strip 26b or the transfer column 26c.

[0188] In the above embodiments, the first driving part and the second driving part can constitute a driving structure for an optical actuator, in which the first driving part is adapted to mount a lens, and the second driving part is adapted to mount a photosensitive component, the lens and the photosensitive component are configured to be driven simultaneously and move in opposite directions. For example, the lens is driven to move in the positive direction of the x-axis, and the photosensitive component is driven to move in the negative direction of the x-axis; or the lens is driven to move in the positive direction of the y-axis, and the photosensitive component is driven to move in the negative direction of the y-axis; or the lens is driven to move in the x-axis and the y-axis, and the photosensitive component is driven to move in the x-axis and the y-axis in the opposite direction of the lens, in other words, when it is necessary to move in the x-axis and the y-axis simultaneously, the directions of the displacement vectors of the lens and the photosensitive component in the xoy plane are opposite. In the present embodiment, the lens and the photosensitive component are configured to move simultaneously and in opposite directions, which can achieve faster response and better anti-shake effect. In addition, the anti-shake angle range of a general camera module is limited by the suspension system and the driving system, and it is difficult to achieve a relatively large compensation angle range. In the present embodiment, by simultaneously driving the lens and the photosensitive component to move in opposite directions, a large-angle anti-shake compensation is achieved. In addition, by simultaneously driving the lens and the photosensitive component to move in opposite directions in the present embodiment, compared with a scheme in which only the lens is driven to move, the lens and the photosensitive component have a larger relative movement stroke (for the convenience of description, this relative movement stroke can be referred to as an anti-shake stroke), which can have a better compensation effect. In particular, due to the increase of the anti-shake stroke, the present embodiment also has a good compensation effect on the tilt shake of the camera module. Further, the movement direction of the anti-shake movement of the present embodiment can be limited in the xoy plane, without tilting the optical axis of the lens or the photosensitive component, thereby avoiding the image blur problem caused by anti-shake movement.

[0189] Further, in the camera module, the circuit board of the photosensitive component generally includes a rigid circuit board body and a flexible connecting strip, one end of the flexible connecting strip is connected to the circuit board body, and the other end is connected to and conducts the mainboard or other components of the electronic device through a connector. In the prior art, the flexible connecting strip of the photosensitive component is generally led out from the side surface of the circuit board body, and the flexible connecting strip is generally parallel to the surface of the circuit board body. In this arrangement, the flexible connecting strip will generate a large resistance to the movement of the circuit board body, which may increase the force required to drive the circuit board body to move, resulting in insufficient anti-shake compensation stroke and decreased response speed. Moreover, the resistance caused by the connecting strip is irregular, which makes it difficult for the second driving part to compensate for the resistance, and may result in decreased anti-shake compensation accuracy. Therefore, in the present embodiment, a suspension type circuit board is provided as the circuit board of the photosensitive component adapted to the second driving part, which will help to overcome the above-mentioned defects caused by the connecting strip.

[0190] Figure 18 Fig. 7 shows a perspective view of the second driving part and the photosensitive assembly in one embodiment of the present application. Figure 19 Fig. 8 shows an exploded view of the second driving part and the photosensitive assembly in one embodiment of the present application. Figure 20 Fig. 9 shows a perspective view of the photosensitive assembly and the suspension circuit board used in one embodiment of the present application. Figure 18 Figure 19 Figure 20 In the camera module of the embodiment, the photosensitive assembly 20 is connected with the second movable part 42 of the second driving part 40, so that the circuit board body 71 can be moved in the xoy plane under the driving of the second movable part 42. The circuit board 23 of the embodiment is designed as a suspension structure. Specifically, the circuit board 23 includes a rigid circuit board body 71 and a flexible connecting band 72, which can include a third connecting band 72a and a fourth connecting band 72b. The third connecting band 72a and the fourth connecting band 72b can be respectively led out from two opposite sides (for the convenience of description, the two opposite sides can be referred to as a first side 74a and a second side 74b) of the circuit board body 71 and bent upwards. The bent third connecting band 72a and the bent fourth connecting band 72b can form a suspension part 75, respectively. The suspension part 75 can be connected with the base part of the second driving part 40 (or the first driving part 30), thereby forming a suspension structure. The suspension structure can allow the base part to suspend the circuit board body 71 and the various components mounted on the surface of the circuit board body 71 (i.e., the photosensitive assembly 20) through the bent part 73 of the flexible connecting band 72. Specifically, in one example, the suspension part 75 can have a through hole (suspension hole 75a), and the second base part 41 of the second driving part 40 can have a corresponding hook 75b, which hooks the through hole of the suspension part 75 to connect the suspension part 75. In the prior art, the connecting band and the circuit board body are usually in the same plane, and the deflection of the connecting band relative to the circuit board body in the same plane will generate a relatively large resistance. In the embodiment, the connecting position of the connecting band 72 and the circuit board body 71 is provided with a bent part 73 bent upwards, and the resistance generated by the connecting band 72 relative to the circuit board body 71 in the xoy plane (which can be regarded as a horizontal plane) is relatively small.

[0191] ​​Further, in one embodiment of the present application, the third connecting band 72a and the fourth connecting band 72b can extend along the periphery of the circuit board body 71 and the photosensitive assembly 20, so that the connecting band 72 surrounds the photosensitive assembly on at least three sides. Moreover, the third connecting band 72a and the fourth connecting band 72b are connected to each other and electrically conductive. The photosensitive assembly 20 has a first side 74a and a second side 74b which are located in the same position as the circuit board body 71. The first side 74a and the second side 74b are oppositely arranged (i.e. they do not intersect each other), while the third side 74c of the photosensitive assembly 20 intersects both the first side 74a and the second side 74b. The connecting band 72 can surround the first side 74a, the second side 74b and the third side 74c of the photosensitive assembly 20. The third connecting band 72a is led out from the first side 74a of the circuit board body 71 and is bent upward to form the bent portion 73, then extends along the first side 74a of the photosensitive assembly 20, and is bent in the horizontal direction at the corner and continues to extend along the third side 74c. The fourth connecting band 72b is led out from the second side 74b of the circuit board body 71 and is bent upward to form another bent portion 73, then extends along the second side 74b of the photosensitive assembly 20, and is bent in the horizontal direction at the corner and continues to extend along the third side 74c. The third connecting band 72a and the fourth connecting band 72b can be joined at the third side 74c and conductive to each other, thereby forming a complete connecting band 72. The three connecting band sections located at the first side 74a, the second side 74b and the third side 74c can each have at least one suspension portion 75, and each of the suspension portions 75 has at least one through hole for connecting with the second base portion 41 of the second driving portion 40 (or the first driving portion 30). In the present embodiment, the suspension portion 75 can suspend the circuit board body 71 through the bent portions 73 located at the opposite sides of the circuit board body 71, so that when the circuit board body 71 is driven to move by the second driving portion 40, the bent portions 73 and the connecting band 72 can be deformed by bending, thereby satisfying the movement stroke of the circuit board body 71.

[0192] Further, in one embodiment of the present application, the suspension portions 75 of the three connecting band sections located at the first side 74a, the second side 74b and the third side 74c can each be reinforced by a rigid substrate. For example, a rigid substrate can be attached to part of the flexible connecting band to form the suspension portion 75. While the other areas of the flexible connecting band remain flexible to be deformed by bending, thereby satisfying the movement stroke of the circuit board body 71.

[0193] Further, in one embodiment of the present application, the connecting strip section at the third side 74c can have a rigid suspension 75c, which can lead to a fifth connecting strip 76, which can be used to connect the main board of an electronic device (such as a mobile phone).

[0194] Further, in another embodiment of the present application, the suspension can also be connected with an outer support (not shown in the figure), which is directly or indirectly fixed with the base of the second driving part. In the present application, the suspension can be fixed with the base of the second driving part through other intermediaries. The intermediary can be directly or indirectly fixed with the base of the second driving part. The intermediary has a hook to hook the suspension, or the intermediary is bonded with the suspension. The intermediary can be the outer support, the base of the first driving part, or other intermediaries.

[0195] Further, in another embodiment of the present application, the suspension can not have the through hole. In this embodiment, the suspension can be fixed with the base of the second driving part (or the base of the first driving part or the outer support) through bonding. Further, in another embodiment of the present application, the third connecting strip and the fourth connecting strip can be a rigid-flexible combined board, in which the part forming the suspension can adopt a rigid board, and the part connecting the suspension and the bending part formed by the upward bending can adopt a flexible board. Since the suspension is directly formed by the rigid board, the suspension in this embodiment can no longer be attached to a rigid substrate for reinforcement.

[0196] Further, in one embodiment of the present application, the circuit board body, the third connecting strip and the fourth connecting strip can be composed of a complete rigid-flexible combined board.

[0197] Further, still referring to Figure 18 , Figure 19 and Figure 20 , in one embodiment of the present application, the circuit board can also have a fixing part 76a for fixing the fifth connecting strip 76, which can avoid the circuit board body 71, the third connecting strip 72a and the fourth connecting strip 72b from being affected by external factors.

[0198] Further, Figure 21a shows the front view of the suspension type circuit board after being unfolded in one embodiment of the present application; Figure 21b shows the back view of the suspension type circuit board after being unfolded in one embodiment of the present application. Referring to Figure 21a and Figure 21bIn the embodiment, the circuit board 23 can be made of a rigid-flexible combined board. The segments of the third connecting band 72a and the fourth connecting band 72b located at the third side 74c can be mutually buckled by connectors 78, 79 (which can be combined with reference to Figure 20 ), so as to connect and fix the third connecting band 72a and the fourth connecting band 72b and further realize electrical connection. The third connecting band 72a and the fourth connecting band 72b are both provided with circuits to lead out the circuits in the circuit board body 71, and then connect external circuits through the fifth connecting band 76 and the connector 77 thereof. Since the third connecting band 72a and the fourth connecting band 72b can each lead out a part of the circuits through the corresponding bending part 73 formed by the upward bending, the circuits required to be led out by each bending part 73 can be reduced, so that the width of each bending part 73 can be reduced, thereby further reducing the resistance formed by the flexible connecting band 72 to the movement of the circuit board body 71, and further reducing the driving force required to be provided by the second driving part 40. It should be noted that in other embodiments of the present application, the circuits of the circuit board body can also be led out through only one bending part (for example, the upward bending bending part of the third connecting band or the upward bending bending part of the fourth connecting band).

[0199] It should be noted that the suspension system of the second driving part of the present application is not limited to the above embodiment. For example, in some other embodiments of the present application, the second driving part can realize a multi-axis adjustable suspension system based on a multi-layer frame and a ball structure. The following will be described in detail in combination with Figure 22- Figure 33 such a suspension system and the corresponding camera module.

[0200] Figure 22 A perspective structure schematic diagram of the second driving part in an embodiment of the present application is shown. Referring to Figure 22 In an embodiment of the present application, the second driving part 40 includes a second movable part 42 and a second base part 41. The second base part 41 includes a base part base 41a and a cover 41b. The edge region of the second movable part 42 is arranged between the base part base 41a and the cover 41b.

[0201] Further, Figure 23 A perspective exploded schematic diagram of the second driving part in an embodiment of the present application is shown. Referring to Figure 23 In the embodiment, the second movable part includes at least two chip end carriers arranged in a lower layer stack. Figure 23Three chip-side carriers are shown in FIG. 4, which are a first chip-side carrier 421, a second chip-side carrier 422 and a third chip-side carrier 423. The upper surface of the base 41a or the lower surface of the chip-side carrier at the bottom of the second movable part 42 has a first guide groove 431 in which a first ball 46a is arranged and can roll along the first guide groove 431, and the upper surface of the base 41a and the chip-side carrier at the bottom of the second movable part 42 are supported by the first ball 46a. In the second movable part 42, for any two adjacent chip-side carriers from top to bottom, the upper surface of the chip-side carrier at the bottom or the lower surface of the chip-side carrier at the top has a second guide groove 432 in which a second ball 46b is arranged and can roll along the second guide groove 432, and the upper surface of the chip-side carrier at the bottom and the lower surface of the chip-side carrier at the top are supported by the second ball 46b. In this embodiment, the photosensitive assembly 20 is mounted on the chip-side carrier at the top of the second movable part 42; and the guide direction of the first guide groove 431 is the x-axis translation direction or the y-axis translation direction (x-axis translation direction in FIG. 4) Figure 23 , and the guide direction of the second guide groove 432 of one of the chip-side carriers is perpendicular to the guide direction of the first guide groove 431 (y-axis translation direction in FIG. 4). Figure 23

[0202] More specifically, still referring to Figure 23 , in this embodiment, the chip-side carriers include the first chip-side carrier 421, the second chip-side carrier 422 and the third chip-side carrier 423. The first chip-side carrier 421, the second chip-side carrier 422 and the third chip-side carrier 423 are arranged from top to bottom. The second guide groove 432 includes an arc-shaped guide groove and a straight guide groove; the arc-shaped guide groove is used to guide the second ball 46b to roll along a circular arc rotating around the z-axis, which is a coordinate axis consistent with the direction of the optical axis; and the straight guide groove is used to guide the second ball 46b to roll along the x-axis or the y-axis. Figure 23 In this embodiment, the second guide groove 432 of the third chip-side carrier 423 is a straight guide groove, and the guide direction is the y-axis translation direction, which is perpendicular to the guide direction of the first guide groove 431 (x-axis translation direction). Further, Figure 24 FIG. 5 shows a partial enlarged view of a corner region of the third chip-side carrier and the base in one embodiment of the present application. Figure 24 ​The image shows a first guide groove 431 and a first ball bearing 46a disposed in the first guide groove 431. It also shows a second guide groove 432, which is a linear guide groove disposed on the upper surface of the third carrier 423 at the chip end, and a second ball bearing 46b disposed in the first guide groove. Further, Figure 25 A perspective view of three chip-end carriers and a base pedestal in one embodiment of this application is shown. Figure 26 It shows Figure 25 A three-dimensional schematic diagram of the two chip-end carriers and the base of the foundation. (Refer to reference.) Figure 24 , Figure 25 and Figure 26 In this embodiment, the second ball 46b includes an upper second ball 46b1 and a lower second ball 46b2; the upper second ball 46b1 is disposed between the lower surface of the first carrier 421 at the chip end and the upper surface of the second carrier 422 at the chip end; the lower second ball 46b2 is disposed between the lower surface of the second carrier 422 at the chip end and the upper surface of the third carrier 423 at the chip end. The first ball 46a is disposed between the lower surface of the third carrier 423 at the chip end and the upper surface of the base 41a of the foundation portion. The second guide groove 432 includes two types located in different layers: an arc-shaped guide groove and a straight guide groove. The arc-shaped guide groove is located on the lower surface of the first carrier 421 at the chip end or the upper surface of the second carrier 422 at the chip end; the straight guide groove is located on the lower surface of the second carrier 422 at the chip end or the upper surface of the third carrier 423 at the chip end.

[0203] Furthermore, in one embodiment of this application, the center of the arc-shaped guide groove is located directly below the photosensitive center, wherein the photosensitive center is the center of the photosensitive area of ​​the photosensitive chip.

[0204] It should be noted that although the arc-shaped guide groove is disposed between the first carrier and the second carrier at the chip end in the above embodiments, this application is not limited thereto. For example, in another embodiment, the arc-shaped guide groove may also be disposed between the base and the third carrier at the chip end. Specifically, the arc-shaped guide groove may be disposed on the upper surface of the base, wherein a first ball bearing is arranged. In this way, the second movable part can rotate as a whole relative to the base in the direction of rotation about the z-axis.

[0205] Furthermore, Figure 27 A cross-sectional schematic diagram of a camera module according to an embodiment of this application is shown. Figure 28 It shows Figure 27 A magnified view of region A in the middle. (Refer to reference.) Figure 27 and Figure 28In the embodiment, each of the chip-side carriers includes a carrier substrate 440 and a carrier wall 441 extending upward from an edge region of the carrier substrate 440, the carrier wall 441 surrounding the photosensitive assembly 20. The second guide groove 432 is located on an upper surface of the carrier wall 441; for any two adjacent chip-side carriers in the up-down direction, a lower surface of the carrier wall 441 of the upper chip-side carrier is supported by the second rolling ball 46b. The carrier wall 441 includes a wall body 441a and an extension 441b extending outward from a top region of the wall body 441a; for any two adjacent chip-side carriers in the up-down direction, the second guide groove 432 is located on an upper surface of the extension 441b of the lower chip-side carrier, and a lower surface of the extension 441b of the upper chip-side carrier is supported by the second rolling ball 46b. For any two adjacent chip-side carriers in the up-down direction, the wall body 441a of the lower chip-side carrier surrounds the wall body 441a of the upper chip-side carrier, and a gap is formed between the wall bodies 441a of the two chip-side carriers. Further, the cover 41b includes a cover side wall 41b1 and a resting platform 41b2 extending inward from a top region of the cover side wall 41b1; a bottom of the cover side wall 41b1 is connected to the base 41a, the resting platform 41b2 is located above the chip-side first carrier 421, and a gap is formed between a lower surface of the resting platform 41b2 and an upper surface of the chip-side first carrier 421. In the embodiment, a top surface of the resting platform 41b2 and a bottom surface of the first driving part 30 are bonded by the adhesive 90. The adhesive 90 can be an adhesive used for active calibration. In the embodiment, a gap suitable for active calibration can be reserved between the top surface of the resting platform 41b2 and the bottom surface of the first driving part 30 in the design stage, then the relative position of the optical lens and the photosensitive chip is determined through active calibration, and finally the adhesive 90 is used to bond the components into a complete camera module. It should be noted that Figure 27 In the embodiment, the first driving part includes a first base and a first movable part. In the embodiment, the bottom surface of the first driving part is generally the bottom surface of the first base, and the first base can include a motor housing and a motor base. The bottom surface of the first driving part can be the bottom surface of the motor base. Active calibration is a process of adjusting the attitude (inclination) and optical center of the lens and the photosensitive chip based on the actual imaging result of the photosensitive chip to optimize the imaging quality. The adjustment degrees of freedom of active calibration can include one or more of the six degrees of freedom of x-axis, y-axis, z-axis translation, rotation around x-axis, y-axis, and z-axis.

[0206] Further, in one embodiment of the present application, each of the chip-side carriers comprises a carrier wall in the shape of a ring surrounding the photosensitive component, and the second guide groove is located on the upper surface of the carrier wall. At least one of the chip-side carriers is a frame structure formed by the carrier wall alone (i.e., the chip-side carrier can not be provided with a carrier substrate, and forms a hollow frame structure. This design helps to reduce the height of the camera module).

[0207] Further, in another embodiment of the present application, in the second movable part, a part of the chip-side carriers is a frame structure formed by the carrier wall alone, and another part of the chip-side carriers comprises a carrier substrate and the carrier wall extending upward from the edge region of the carrier substrate. In the second movable part, the uppermost chip-side carrier comprises the carrier substrate and the carrier wall, and the photosensitive component is mounted in the accommodating groove formed by the carrier substrate and the carrier wall. The uppermost chip-side carrier has a carrier substrate, which can abut against the bottom surface of the photosensitive component, to enhance the reliability and firmness of the bonding between the second movable part and the photosensitive component.

[0208] Further, in combination with reference to Figure 27 and Figure 28 In one embodiment of the present application, the lower surface of the lowermost chip-side carrier of the second movable part or the upper surface of the base has a first fitting groove 431a, which is fitted with the first guide groove 431, and together forms the guide channel of the first rolling ball 46a. Further, in the second movable part, for any two adjacent chip-side carriers above and below, the lower surface of the chip-side carrier above or the upper surface of the chip-side carrier below has a second fitting groove 432a, which is fitted with the second guide groove 432, and together forms the guide channel of the second rolling ball 46b.

[0209] Further, in one embodiment of the present application, in the plan view, the chip-side carrier has a rectangular shape, and the edge region of the chip-side carrier comprises a first side 45a, a second side 45b opposite to the first side 45a, a third side 45c intersecting the first side 45a, and a fourth side 45d opposite to the third side 45c; the lengths of the first side 45a and the second side 45b are greater than the lengths of the third side 45c and the fourth side 45d; and in the plan view, the arc-shaped guide groove is located on the first side 45a and the second side 45b (for reference Figure 26). It is noted that the position of the arc-shaped guide slot in the present embodiment is not unique. For example, in another embodiment, the arc-shaped guide slot can be arranged at the corner regions of the chip-side carrier. The corner regions refer to the corner regions of the rectangular chip-side carrier, which will not be described again below.

[0210] Further, in another embodiment of the present application, the straight guide slot is arranged at the corner regions of the chip-side carrier in the top view; the second base portion has a rectangular shape; and the first guide slot is arranged at the corner regions of the second base portion or the chip-side carrier.

[0211] Further, Figure 29 FIG. 6 shows a cross-sectional view of the second driving portion with a through hole in the base portion pedestal in an embodiment of the present application. Referring to FIG. 6, Figure 29 In the present embodiment, the central part of the base portion pedestal 41a of the second base portion 41 has a through hole 41a1, and at least a part of the chip-side third carrier 423 (the lowermost chip-side carrier) is located in the through hole 41a1. This design can further reduce the height (i.e., the dimension in the z-axis direction) of the camera module.

[0212] Further, Figure 30a FIG. 7 shows the mounting position of the driving element of the second driving portion in the top view in an embodiment of the present application. Figure 30b FIG. 8 shows a cross-sectional view of the second driving portion with a driving element in an embodiment of the present application. Referring to FIG. 8, Figure 30a and Figure 30b In an embodiment of the present application, the driving element of the second driving portion 40 is a coil-magnet combination. The magnet 61 can be arranged at the edge region of the second base portion 41, specifically, the magnet 61 can be arranged at the abutting table 41b2 of the cover 41b in the present embodiment. The coil 62 can be arranged at the edge region of the chip-side first carrier 421. The coil 62 can be electrically connected to the circuit board 23 of the photosensitive assembly 20 through the FPC board (flexible board) arranged at the chip-side first carrier 421. Since the chip-side first carrier 421 and the photosensitive assembly 20 move synchronously during the anti-shake process, when the coil 62 is designed to be welded to the circuit board 23 through the FPC board, the wire or the welding portion does not have relative movement during the movement, which reduces the risk of electrical connection failure or poor contact at the welding portion. In another embodiment, since the relative position of the chip-side first carrier 421 and the photosensitive assembly 20 is fixed, the coil 62 and the circuit board of the photosensitive assembly 20 can be electrically connected through a contact array, thereby avoiding the use of the FPC board (flexible board) for electrical connection.

[0213] Further, referring to Figure 30aIn one embodiment of the present application, preferably, the coil-magnet combination includes three coil-magnet pairs, referred to as first coil-magnet pair 63, second coil-magnet pair 64 and third coil-magnet pair 65, respectively. Each coil-magnet pair can include one coil and one magnet. The first coil-magnet pair 63 and the second coil-magnet pair 64 are used to drive the translation of the movable part 42 in the x-axis direction, i.e. to provide driving force in the x-axis direction. The third coil-magnet pair 65 is used to drive the translation of the movable part 42 in the y-axis direction, i.e. to provide driving force in the y-axis direction. In the top view (or bottom view), the first coil-magnet pair 63 and the second coil-magnet pair 64 can be arranged along two opposite edges of the second driving part, referred to as first edge 48 and second edge 49, respectively, which are not intersected (typically, the first edge 48 is parallel to the second edge 49). The second coil-magnet pair 64 can be arranged along a third edge 47 of the second driving part, which is intersected by both the first edge 48 and the second edge 49 (typically, the third edge 47 is perpendicular to the first edge 48 and also perpendicular to the second edge 49). In this embodiment, the three coil-magnet pairs can be used to achieve both x-axis translation and y-axis translation, as well as rotation in the xoy plane. For example, when the first coil-magnet pair 63 and the second coil-magnet pair 64 provide driving forces in opposite directions, a combined driving force can be generated to rotate one chip-side carrier of the second movable part in the xoy plane. It is noted that this is not the only way to provide driving force for rotation in the xoy plane. For example, the first coil-magnet pair 63 and the third coil-magnet pair 65 can also be used to generate a combined driving force to rotate one chip-side carrier of the second movable part in the xoy plane. Optionally, the first coil-magnet pair and the second coil-magnet pair can be staggered (i.e. the first coil-magnet pair and the second coil-magnet pair can be asymmetrically arranged about the central axis of the second driving part) to provide driving force for rotation in the xoy plane (i.e. movement in the Rz direction). Specifically, the magnet of the first coil-magnet pair 63 is arranged on the side of the first edge 48 close to the third edge 47, and the second coil-magnet pair 64 is arranged on the side of the second edge 49 close to the fourth edge (i.e. the side facing away from the third edge 47), so that the first coil-magnet pair 63 and the second coil-magnet pair 64 are staggered.

[0214] Further, Figure 31a A perspective exploded view of the second driving part showing the positions of the coils and magnets in one embodiment of the present application is shown. Referring to FIG. 6, the second driving part includes a second driving base 61, a first coil-magnet pair 63, a second coil-magnet pair 64 and a third coil-magnet pair 65. The first coil-magnet pair 63 and the second coil-magnet pair 64 are arranged along two opposite edges of the second driving base 61, referred to as first edge 48 and second edge 49, respectively, which are not intersected (typically, the first edge 48 is parallel to the second edge 49). The second coil-magnet pair 64 is arranged along a third edge 47 of the second driving base 61, which is intersected by both the first edge 48 and the second edge 49 (typically, the third edge 47 is perpendicular to the first edge 48 and also perpendicular to the second edge 49). The third coil-magnet pair 65 is arranged along a fourth edge 50 of the second driving base 61, which is intersected by both the first edge 48 and the second edge 49 (typically, the fourth edge 50 is perpendicular to the first edge 48 and also perpendicular to the second edge 49). In this embodiment, the three coil-magnet pairs can be used to achieve both x-axis translation and y-axis translation, as well as rotation in the xoy plane. For example, when the first coil-magnet pair 63 and the second coil-magnet pair 64 provide driving forces in opposite directions, a combined driving force can be generated to rotate one chip-side carrier of the second movable part in the xoy plane. It is noted that this is not the only way to provide driving force for rotation in the xoy plane. For example, the first coil-magnet pair 63 and the third coil-magnet pair 65 can also be used to generate a combined driving force to rotate one chip-side carrier of the second movable part in the xoy plane. Optionally, the first coil-magnet pair and the second coil-magnet pair can be staggered (i.e. the first coil-magnet pair and the second coil-magnet pair can be asymmetrically arranged about the central axis of the second driving part) to provide driving force for rotation in the xoy plane (i.e. movement in the Rz direction). Specifically, the magnet of the first coil-magnet pair 63 is arranged on the side of the first edge 48 close to the third edge 47, and the second coil-magnet pair 64 is arranged on the side of the second edge 49 close to the fourth edge (i.e. the side facing away from the third edge 47), so that the first coil-magnet pair 63 and the second coil-magnet pair 64 are staggered. Figure 31aIn this embodiment, the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65 are located on the first side 48, the second side 49, and the third side 47, respectively. The first coil magnet pair 63 is located in the middle region of the first side 48, and the second coil magnet pair 64 is located in the middle region of the second side 47; that is, the first coil magnet pair 63 and the second coil magnet pair 64 can be arranged symmetrically. The first magnet 63a (i.e., the magnet of the first coil magnet pair), the second magnet 64a (i.e., the magnet of the first coil magnet pair), and the third magnet 65a (i.e., the magnet of the third coil magnet pair) are all located on the cover 41b of the second base portion, and the first coil 63b (i.e., the coil of the first coil magnet pair), the second coil 64b (i.e., the coil of the second coil magnet pair), and the third coil 65b (i.e., the coil of the third coil magnet pair) are all located on the first carrier 421 at the chip end. The first coil 63b, the second coil 64b, and the third coil 65b can be located directly below the first magnet 63a, the second magnet 63b, and the third magnet 63c, respectively.

[0215] Furthermore, Figure 31b An exploded perspective view of the second drive unit, showing the positions of the coils and magnets, is shown in another embodiment of this application. In this embodiment, the positions of the first coil magnet pair 63 and the second coil magnet pair 64 are staggered to reduce the effort required to drive the photosensitive component to rotate in the xoy plane (thus helping to increase the stabilization travel and improve the stabilization response speed). Apart from this, other aspects of this embodiment are similar to... Figure 31a The implementation examples are completely identical and will not be repeated here.

[0216] Figure 31c An exploded perspective view of the second drive unit, showing the positions of the coils and magnets, is shown in a modified embodiment of this application. In this embodiment, the positions of the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65 are... Figure 31b The embodiments are consistent. The difference in this embodiment is that in this embodiment, only the third magnet 65a is located on the cover 41b of the second base, while the first magnet 63a and the second magnet 64a are both located in the edge region of the base 41a.

[0217] Figure 31d An exploded perspective view of the second drive unit, showing the positions of the coils and magnets, is shown in another modified embodiment of this application. In this embodiment, the positions of the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65 are... Figure 31b The embodiments are consistent. The difference in this embodiment is that in this embodiment, only the third magnet 65a is located in the edge region of the base 41a, while the first magnet 63a and the second magnet 64a are both located in the edge region of the third carrier 623 at the chip end.

[0218] In the foregoing several embodiments, the magnet arrangement in the coil magnet combination is given. In general, in some embodiments of the present application, the magnets in the coil magnet combination (i.e. three coil magnet pairs) can be mounted on the cover, the base part base or the chip end third carrier; and wherein the magnets in the first coil magnet pair and the magnets in the second coil magnet pair are mounted on the same component so that the first coil magnet pair and the second coil magnet pair can be better matched for use, so as to more accurately provide a combined driving force. Here the component refers to one of the cover, the base part base and the chip end third carrier. Further, in some preferred embodiments, the magnets in the coil magnet combination (i.e. three coil magnet pairs) can be mounted on the base part base or the chip end third carrier, that is, the magnets are avoided to be mounted on the cover. This design can avoid the magnets interfering with the glue distribution of the bonding surface of the second base part and the first base part. Generally speaking, the glue material has a relatively large bonding force with the material of the second base part, while the bonding force of the glue material with the magnets is relatively small. The top surface (upper surface) of the cover is often the bonding surface bonded with the first base part, so if the magnets are avoided to be arranged on the cover, the magnets can be avoided to occupy part of the bonding surface, thereby avoiding the decrease in the reliability of the module structure due to insufficient bonding force.

[0219] Further, Figure 32a A schematic diagram of the assembly mode of the second driving part before assembly in another embodiment of the present application is shown. Referring to Figure 32a In this embodiment, the second driving part 40 can be assembled by three main components separated from each other, which are the base part base 41a, the cover 41b and the second movable part 42, and they can be assembled in the vertical direction. For example, the base part base 41a with the first ball 46a can be arranged on the assembly table first, then the second movable part 42 is placed above the base 41a, supported by the first ball 46a in the base part base 41a, and finally the cover 41b is moved above the base part base 41a and the second movable part 42, and then the cover 41b is moved downward so that the bottom surface of the cover side wall 41b1 approaches the top surface of the base part base 41a, and then the bottom surface of the cover side wall 41b1 is bonded with the top surface of the base 41a, thereby completing the assembly of the second driving part 40. The base part base 41a can be composed of a base side wall and a base plate. However, it should be noted that in other embodiments, the base part base 41a can also be in the form of a flat plate without a base side wall, which can also be referred to as a base plate or a bottom plate.

[0220] Further, Figure 32b A schematic diagram of the assembly mode of the second driving part before assembly in another embodiment of the present application is shown. Referring to Figure 32bIn the embodiment, the second driving portion 40 can be assembled by a lateral assembly method. Specifically, three main components, i.e., the base portion main body 41', the second movable portion 42 and the side cover 41b'' can be prepared first. The base portion main body 41' can include a base portion base 41a and a cover main body 41b' connected with the base portion base 41a (in some embodiments, the base portion base 41a and the cover main body 41b' can be integrally formed), and the cover main body 41b' is a part of the complete cover 41b, which together with the side cover 41b'' constitutes the complete cover 41b. In the embodiment, the cover main body 41b' can surround the second movable portion 42 (or the photosensitive assembly) on three sides, and the remaining one side is left with a gap, which can be used to insert the second movable portion 42 (or the combination of the second movable portion 42 and the photosensitive assembly) from the side into the base portion main body 41'. The side cover 41b'' corresponds to the gap, and after the combination of the second movable portion 42 and the photosensitive assembly is inserted from the gap, the side cover 41b'' can be approached to the base portion base 41a from the side, and the outer side of the base portion base 41a and the inner side of the side cover 41b'' are bonded together, thereby constituting the complete second driving portion 40. In this lateral bonding fixing method, the parallelism of the upper and lower end faces of the second base portion 41 is only determined by the manufacturing precision of the second base portion 41 itself, and therefore the lateral bonding fixing method can improve the parallelism of the upper and lower end faces of the second base portion 41 and the parallelism between the upper end face of the second base portion 41 and the second movable portion 42.

[0221] Further, Figure 33 An arrangement of a camera module and a connecting band thereof in an embodiment of the present application is shown. Referring to Figure 33In the embodiment, the camera module can include a first connecting strip 26a and a second connecting strip 26b. The first connecting strip 26a is arranged at the top region of the first driving part 30 and electrically connected to the first driving part 30. The second connecting strip 26b is in communication with the circuit board 23 of the photosensitive assembly 20. The second connecting strip 26b can be provided with multiple bends to form a curved laminated shape to buffer the stress caused by the movement of the photosensitive assembly 20. The end of the second connecting strip 26b can be provided with a connector which is fixed and electrically connected to the transfer column 26c by pressing and then conducts the mainboard (or other components) of the terminal device through the transfer column 26c. Similarly, the end of the first connecting strip 26a can also be connected to a connector which is fixed and electrically connected to the transfer column 26c by pressing and then conducts the mainboard (or other components) of the terminal device through the transfer column 26c. In the scheme of the embodiment, the conduction circuit of the first driving part 30 can be separated from the photosensitive assembly 20 and is not affected by the movement of the photosensitive assembly 20. The second connecting strip 26b and the transfer column 26c can be accommodated in the second housing 70, and the first connecting strip 26a is located outside the second housing 70. The top of the second housing 70 can have a third through hole 70a so that the connector of the first connecting strip 26a extends into and electrically conducts with the second connecting strip 26b or the transfer column 26c.

[0222] Further, in the series of embodiments shown in the foregoing Figure 22- Figure 33 , the camera module can adopt a suspended circuit board. The structure and technical details of the suspended circuit board have been described in detail in the foregoing Figure 20- Figure 22 , Figure 23 , and will not be repeated here.

[0223] It should be noted that the suspended circuit board of the present application can also be implemented in another way. The following will be described in combination with Figure 34a , Figure 34b , Figure 35 and Figure 36 .

[0224] Figure 34a shows the front view of the suspended circuit board after being unfolded in another embodiment of the present application, Figure 34b shows the back view of the suspended circuit board after being unfolded in an embodiment of the present application. Reference is made to Figure 34a and Figure 34bIn some embodiments of the present application, the light sensing component 20 comprises a suspension circuit board, which includes a rigid circuit board body 71 and flexible connecting strips 72, the connecting strips 72 are led out from the first side 74a and the second side 74b of the circuit board body 71 and are bent upwards to form bent portions, the top of the bent portions extends along the periphery of the light sensing component 20 in the horizontal direction, so that the connecting strips 72 are wrapped around the first side 74a, the second side 74b and the third side 74c of the light sensing component 20, and the connecting strips on the first side 74a and the second side 74b each have at least one suspension portion 75, which is fixed to the second base portion 41 of the second driving portion 40 or is fixed to the second base portion 41 through an intermediary. The light sensing component 20 has a first side 74a and a second side 74b which are located in the same position as the circuit board body 71, the first side 74a and the second side 74b are oppositely arranged, and the third side 74c intersects with the first side 74a and the second side 74b. The suspension portion 75 has a suspension hole 75a, and the second base portion 41 or the intermediary has a hook which hooks the suspension hole 75a. Part of the connecting strip is attached to a rigid substrate for reinforcement to form the suspension portion (in a deformed embodiment, the suspension circuit board can also be made of a rigid-flexible combined board, wherein the circuit board body and the suspension portion are formed by the hard board portion of the rigid-flexible combined board, and the bent portion and the connecting strip section connected between a plurality of suspension portions are formed by the soft board portion of the rigid-flexible combined board). Unlike the previous embodiment, in the present embodiment, the third side 74c is not provided with a suspension portion, that is, the suspension portion 75 and the suspension hole 75a are only provided on the first side 74a and the second side 74b. Instead, in the present embodiment, the connecting strip of the third side 74c is fixed to the second base portion 41 (or fixed to the second base portion 41 through an intermediary) by adhesive material. Specifically, in the present embodiment, the connecting strip can include a third connecting strip 72a and a fourth connecting strip 72b, the third connecting strip 72a is led out from the first side 74a of the circuit board body 71 and bent upwards to form a bent portion 73, then extends along the first side 74a of the light sensing component 20, and is bent in the horizontal direction at the corner and continues to extend along the third side 74c; the fourth connecting strip 72b is led out from the second side 74b of the circuit board body 71 and bent upwards to form another bent portion, then extends along the second side 74b of the light sensing component 20, and is bent in the horizontal direction at the corner and continues to extend along the third side 74c; the third connecting strip 72a and the fourth connecting strip 72b are joined and conduct with each other at the third side 74c (the joining and conduction can be achieved by male-female connector buckling or by welding). Further,Figure 35 A perspective exploded view of a suspension-based circuit board camera module in one embodiment of the present application is shown. Figure 36 A perspective view of a suspension-based circuit board camera module with a housing in one embodiment of the present application is shown. Refer to Figure 34a , Figure 34b , Figure 35 and Figure 36 , in this embodiment, the camera module further includes a first connecting strip 84 electrically connected to the first driving part, the first connecting strip 84 is led out from the top area of the first driving part, then is bent downward and is connected and conducted with the third connecting strip 72a or the fourth connecting strip 72b at the joint part 83 of the third side 74c. The camera module further includes a housing 81 and a module base 80, the inner side of the housing 81 has a receiving groove 82 for receiving the joint part of the third side 74c; wherein the joint part is the joint part 83 of the first connecting strip, the third connecting strip 72a and the fourth connecting strip 72b; the receiving groove 82 is filled with glue material to fix the first connecting strip, the third connecting strip 72a and the fourth connecting strip 72b to the housing 81. The module base 80 and the housing 81 can be buckled together, so as to encapsulate the first optical driving assembly 85 and the second optical driving assembly 86 inside the base 80 and the housing 81 (refer to Figure 35 and Figure 36 ). Further, the connecting strip at the third side 74c is further connected with a fifth connecting strip 76, the fifth connecting strip 76 has a connector 77 for external connection; the suspension-based circuit board can further have a fixing part 76a for fixing the fifth connecting strip 76. Wherein the first optical driving assembly 85 includes a first driving part and an optical lens, the optical lens is installed in a first movable part of the first driving part. The second optical driving assembly 86 includes a second driving part and a photosensitive assembly, the photosensitive assembly is fixed to a second movable part of the second driving part.

[0225] In the assembling process, the first driving part and the optical lens are assembled into the first optical driving assembly 85, and the second driving part and the photosensitive component are assembled into the second optical driving assembly 86. Then, the relative positions of the optical lens and the photosensitive chip are adjusted by the active calibration process, and the first driving part (the first base part) and the second driving part (the second base part) are bonded by the glue. Next, the bonded first optical driving assembly 85 and the second optical driving assembly 86 are assembled from bottom to top in the through hole of the module shell 81, and the module base 80 is attached to the module shell 81. Finally, the glue is poured into the accommodating groove 82 of the shell to fix the first optical driving assembly 85, the second optical driving assembly 86 and the module shell 81. At the same time, the glue poured into the accommodating groove 82 can also fix the joint of the first connecting band 84, the third connecting band 72a and the fourth connecting band 72b to the module shell 81, the first base part or the second base part.

[0226] The above description is merely preferred embodiments of the present application and a description of the technical principles of the application. It should be understood by those skilled in the art that the scope of the application disclosed in the present application is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by any combinations of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features can be replaced with the technical features disclosed in the present application (but not limited to) having similar functions to form technical solutions.

Claims

1. A drive structure for an optical actuator, characterized by, The driving structure comprises: a first driving part adapted to mount a lens, the first driving part comprising a first base part, a first movable part movably connected with the first base part, and a lens driving coil mounted on the first movable part; the x-axis and the y-axis are coordinate axes perpendicular to an optical axis of the lens, and the x-axis and the y-axis are perpendicular to each other; and a second driving part adapted to mount a photosensitive assembly, the second driving part comprising a second base part, a second movable part movably connected with the second base part, and a photosensitive assembly driving coil mounted on the second movable part, the photosensitive assembly being located below the second movable part and fixed to the second movable part; wherein the first driving part and the second driving part have a common magnet, the common magnet being arranged on the first base part or the second base part, the photosensitive assembly comprising a photosensitive chip, the first driving part driving the lens to move in the x-axis and y-axis directions through electromagnetic induction of the lens driving coil and the common magnet, the second driving part driving the photosensitive chip to move in the x-axis and y-axis directions and / or rotate in an xoy plane through electromagnetic induction of the photosensitive assembly driving coil and the common magnet, and the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions.

2. The drive structure for an optical actuator according to claim 1, wherein According to the detected tilt shake angle a of the camera module, a lens movement distance b of the lens driven by the first driving module and a photosensitive chip movement distance c of the photosensitive chip driven by the second driving module are determined; wherein the lens movement distance b, the photosensitive chip movement distance c and an image side focal length f of the camera module satisfy: a = arctan(b / f) + arctan(c / f).

3. The drive structure for an optical actuator according to claim 2, wherein The driving structure further comprises a driving logic module for keeping a preset fixed ratio of the lens movement distance b and the photosensitive chip movement distance c.

4. The drive structure for an optical actuator according to claim 2, wherein The driving structure further comprises a driving logic module having a shake prevention threshold K, the driving logic module being configured to keep a ratio of the lens moving distance b and the photosensitive chip moving distance c at a preset fixed ratio when the tilt shake angle a is less than or equal to the shake prevention threshold K, and to make the photosensitive chip moving distance c reach a maximum value c max of a moving stroke of the photosensitive chip when the tilt shake angle a is greater than the shake prevention threshold K, the lens moving distance b being obtained according to a relationship b=tan(a / f)-c max .

5. Drive structure for an optical actuator according to claim 3 or 4, characterized in that The preset fixed ratio of the lens movement distance and the photosensitive chip movement distance is set according to a weight of the lens, a driving force of the first driving part, a weight of the photosensitive chip or the photosensitive assembly, and a driving force of the second driving part, so that the lens and the photosensitive chip move to respective anti-shake target positions at the same time.

6. The drive structure for an optical actuator according to claim 1, wherein The second movable part is movably connected with the second base part through balls, and the movement freedom degree of the second movable part relative to the second base part is limited within the xoy plane through a suspension system based on the balls.

7. The drive structure for an optical actuator according to claim 6, wherein The balls are arranged in four corner regions of the second driving part in a top view.

8. The drive structure for an optical actuator according to claim 6, wherein The driving structure further comprises a rear shell located below the second driving part, the rear shell being connected with the second base part and forming an accommodation cavity, the second movable part and the photosensitive assembly being located in the accommodation cavity; and the photosensitive assembly and a bottom of the rear shell have a gap therebetween.

9. The drive structure for an optical actuator according to claim 6, wherein The second movable part has an extending arm extending downwardly, which is bonded with a circuit board of the photosensitive assembly; the extending arm is provided with an FPC directly welded to the circuit board.

10. The drive structure for an optical actuator of claim 6, wherein, The second base part includes a base and a cover, the cover includes a side wall formed by extending downwardly from the base and surrounding the second movable part, and a bearing platform formed by extending horizontally inwardly from the side wall.

11. The drive structure for an optical actuator according to claim 10, wherein, The edge region of the second movable part and the ball are clamped between the base and the bearing platform.

12. The drive structure for an optical actuator of claim 10, wherein, The upper surface of the second base part has a stepped structure, which includes a first step surface on the outer side and a second step surface on the inner side, the height of the second step surface is lower than that of the first step surface.

13. The drive structure for an optical actuator of claim 11, wherein, The upper surface of the edge region of the second movable part has a recessed step, the outer step surface of the recessed step is lower than the inner step surface, and the recessed step, the side wall of the cover and the base jointly form a containing cavity for containing the ball.

14. The drive structure for an optical actuator of claim 10, wherein, The ball is located between the bearing platform and the second movable part.

15. The drive structure for an optical actuator of claim 10, wherein, A layer of balls is respectively arranged between the base and the second movable part, and between the second movable part and the bearing platform.

16. The drive structure for an optical actuator of claim 10, wherein, The outer side surface of the second movable part is provided with an inwardly recessed clamping groove, and the bearing platform is embedded into the clamping groove.

17. The drive structure for an optical actuator of claim 10, wherein, The common magnet is arranged at the edge region of the second base part, and the lens driving coil is arranged at the edge region of the second movable part.

18. The drive structure for an optical actuator of claim 17, wherein, In the second driving part, the coil magnet combination formed by the common magnet and the photosensitive assembly driving coil includes a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; the first coil magnet pair and the second coil magnet pair are used to provide driving force in the x-axis direction; the third coil magnet pair is used to provide driving force in the y-axis direction; and in the top view, the outer shape of the second driving part is rectangular, the first coil magnet pair and the second coil magnet pair are arranged along the first edge and the second edge of the second driving part respectively, the first edge and the second edge do not intersect, and the second coil magnet pair is arranged along the third edge of the second driving part, the third edge intersects with the first edge and the second edge; and The lens driving coil includes a first lens driving coil, a second lens driving coil and a third lens driving coil arranged above the first coil magnet pair, the second coil magnet pair and the third coil magnet pair respectively; the first lens driving coil and the common magnet of the first coil magnet pair, and the second lens driving coil and the common magnet of the second coil magnet pair are used to provide driving force in the x-axis direction, and the third lens driving coil and the common magnet of the third coil magnet pair are used to provide driving force in the y-axis direction.

19. The drive structure for an optical actuator of claim 10, wherein, The first base part includes a motor base located below the first movable part, the motor base has a light passing hole, the common magnet is mounted at the edge region of the motor base, and the lens driving coil is mounted at the bottom of the first movable part. The magnet coil pairs composed of the common magnets and the lens driving coils include a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; wherein the first coil magnet pair and the second coil magnet pair are used to provide driving force in x-axis direction; the third coil magnet pair is used to provide driving force in y-axis direction; and in plan view, the outer contour of the first driving part is rectangular, the first coil magnet pair and the second coil magnet pair are arranged along the first side and the second side of the first driving part respectively, the first side and the second side do not intersect, and the third coil magnet pair is arranged along the third side of the second driving part, the third side intersects with the first side and the second side; and The photosensitive assembly driving coils include a first photosensitive assembly driving coil, a second photosensitive assembly driving coil and a third photosensitive assembly driving coil arranged below the first coil magnet pair, the second coil magnet pair and the third coil magnet pair respectively; the first photosensitive assembly driving coil and the common magnet of the first coil magnet pair, and the second photosensitive assembly driving coil and the common magnet of the second coil magnet pair are used to provide driving force in x-axis direction, and the third photosensitive assembly driving coil and the common magnet of the third coil magnet pair are used to provide driving force in y-axis direction.

20. The drive structure for an optical actuator of claim 19, wherein, In plan view, the second base part is provided with a notch or a through hole at a position corresponding to the photosensitive assembly driving coils.

21. The drive structure for an optical actuator of claim 19, wherein, The magnet coil pairs composed of the common magnets and the photosensitive assembly driving coils include a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; wherein the first coil magnet pair and the second coil magnet pair are used to provide driving force in x-axis direction; the third coil magnet pair is used to provide driving force in y-axis direction; and in plan view, the outer contour of the second driving part is rectangular, the first coil magnet pair and the second coil magnet pair are arranged along the first side and the second side of the first driving part respectively, the first side and the second side do not intersect, and the third coil magnet pair is arranged along the third side of the second driving part, the third side intersects with the first side and the second side; The lens driving coils include an x-axis lens driving coil and a y-axis lens driving coil, the x-axis lens driving coil is located directly above the first coil magnet pair, and the y-axis lens driving coil is located directly above the third coil magnet pair.

22. An image capture module, comprising: It comprises: a lens; a photosensitive assembly; and the driving structure for optical actuator in any one of claims 1-21; wherein the lens is mounted on the first driving part, and the photosensitive assembly is mounted on the second driving part.

23. The camera module of claim 22, wherein, The photosensitive assembly includes a circuit board, the camera module further includes a first connecting strip and a second connecting strip, the first connecting strip is arranged at the top area of the first driving part and electrically connected with the first driving part, and the second connecting strip is connected with the circuit board of the photosensitive assembly and is conductive; wherein the second connecting strip is provided with a plurality of bending to form a curved laminated shape.

24. The camera module of claim 22, wherein, The first driving part comprises a first base part and a first movable part, and the second driving part comprises a second base part and a second movable part; the second base part is fixed with the first base part, the second movable part is located below the second base part and is movably connected with the second base part, and the photosensitive assembly is located below the second movable part and is fixed with the second movable part; The photosensitive assembly comprises a suspension type circuit board, the suspension type circuit board comprises a rigid circuit board body and flexible connecting bands, the connecting bands are led out from first and second side surfaces of the circuit board body and are bent upwards to form bending parts, top parts of the bending parts extend along a circumferential edge of the photosensitive assembly in a horizontal direction, so that the connecting bands are wrapped around peripheries of first, second and third side surfaces of the photosensitive assembly, and the connecting bands located at the first, second and third side surfaces each have at least one suspension part which is fixed to the second base part of the second driving part or is fixed to the second base part through an intermediate object; the photosensitive assembly has first and second side surfaces which are located at the same positions as the circuit board body, the first and second side surfaces are oppositely arranged, and the third side surface intersects with the first and second side surfaces.

25. The camera module of claim 24, wherein, The suspension part has a suspension hole, and the second base part or the intermediate object has a hook which hooks the suspension hole.

26. The camera module of claim 24, wherein, The connecting bands comprise third and fourth connecting bands, the third connecting band is led out from the first side surface of the circuit board body and is bent upwards to form one of the bending parts, then extends along the first side surface of the photosensitive assembly, is bent in a horizontal direction at a corner and continues to extend along the third side surface, the fourth connecting band is led out from the second side surface of the circuit board body and is bent upwards to form another one of the bending parts, then extends along the second side surface of the photosensitive assembly, is bent in a horizontal direction at a corner and continues to extend along the third side surface, the third and fourth connecting bands are jointed at the third side surface and are conductively connected with each other, the suspension part of the connecting band located at the third side surface is further connected with a fifth connecting band, the fifth connecting band has a connector for external connection, and the suspension type circuit board further has a fixing part for fixing the fifth connecting band.

27. The camera module of claim 22, wherein, The photosensitive assembly comprises a circuit board, a photosensitive chip mounted on a surface of the circuit board, a lens seat mounted on the surface of the circuit board and wrapped around the photosensitive chip, a filter mounted on the lens seat, and an electronic element mounted on the surface of the circuit board and located outside the lens seat; In the second driving part, the second movable part has a rigid extension arm extending downwards, the extension arm is bonded with the circuit board of the photosensitive assembly, the extension arm is wrapped around the lens seat, and the electronic element is located in a gap between an inner side surface of the extension arm and an outer side surface of the lens seat; and The photosensitive assembly comprises a circuit board, a photosensitive chip mounted on a surface of the circuit board, a lens seat mounted on the surface of the circuit board and wrapped around the photosensitive chip, a filter mounted on the lens seat, and an electronic element mounted on the surface of the circuit board and located outside the lens seat; The photosensitive component driving coil is electrically connected with the circuit board through an FPC, the FPC is attached to the side of the extension arm, and the FPC is directly welded to the circuit board.

Images