Fingerprint module and electronic device

Abstract

The application provides a fingerprint module and an electronic device. The fingerprint module comprises an ultrasonic sensor and a circuit board. The ultrasonic sensor comprises a first electrode layer, an acoustic layer, a second electrode layer and a first electrical connection area. The second electrode layer is electrically connected to the first side of the acoustic layer along the thickness direction. The first electrode layer is electrically connected to the second side of the acoustic layer along the thickness direction. The first electrode layer and the second electrode layer are both electrically connected to the first electrical connection area. The acoustic layer is used for emitting an ultrasonic signal and receiving an ultrasonic signal reflected by an external structure. The first electrode layer and the second electrode layer are used for providing the acoustic layer with a voltage for emitting and receiving the ultrasonic signal. The circuit board is provided with a second electrical connection area. The first electrical connection area is electrically connected to the second electrical connection area through a conductive adhesive layer. The ultrasonic sensor is used for processing the received ultrasonic signal into an electrical signal and sending the electrical signal to a processing unit through the circuit board, so that the processing unit performs fingerprint identification based on the electrical signal.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of fingerprint module, and particularly relate to a fingerprint module and an electronic device. BACKGROUND

[0002] With the development of consumer electronics industry, the display screen of mobile communication devices and other devices is developing towards full screen, and the demand for under-screen fingerprint identification technology is increasing. There are two main under-screen fingerprint identification solutions: the first is an optical solution, and the second is an ultrasonic solution. The performance of the optical fingerprint module is greatly affected by the optical transmittance of the screen. With the increasing complexity of internal wiring of the display screen and the development of flexible screen solutions, the optical transmittance of the screen is reduced, which makes the optical fingerprint solution unable to meet the application requirements. The ultrasonic fingerprint module does not depend on the optical transmittance of the screen, and is a good alternative solution. Therefore, a new ultrasonic fingerprint module solution is needed to meet the current application requirements of under-screen fingerprint identification. SUMMARY

[0003] To solve the above problems, embodiments of the present application provide a fingerprint module and an electronic device to at least partially solve the above problems.

[0004] According to a first aspect of the present application, a fingerprint module is provided, comprising:

[0005] an ultrasonic sensor, comprising: a first electrode layer, an acoustic layer, a second electrode layer, a protective layer, and a first electrical connection area, the second electrode layer is electrically connected to a first side of the acoustic layer along the thickness direction, the first electrode layer is electrically connected to a second side of the acoustic layer along the thickness direction, the first electrode layer and the second electrode layer are both electrically connected to the first electrical connection area, the protective layer covers a side of the second electrode layer away from the acoustic layer, the acoustic layer is used for emitting ultrasonic signals and receiving ultrasonic signals reflected back by an external structure, and the first electrode layer and the second electrode layer are used for providing the acoustic layer with a voltage for emitting and receiving ultrasonic signals;

[0006] a circuit board, the circuit board is provided with a second electrical connection area, and the first electrical connection area is electrically connected to the second electrical connection area through a conductive adhesive layer;

[0007] the ultrasonic sensor is electrically connected to a processing unit outside the fingerprint module through the first electrical connection area, the conductive adhesive layer, and the second electrical connection area, the ultrasonic sensor is used for processing the received ultrasonic signals into electrical signals, and sending the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint identification based on the electrical signals.

[0008] In some optional embodiments, the ultrasonic sensor further comprises a sensor substrate, the first electrode layer is formed on the sensor substrate; the second side of the acoustic layer in the thickness direction is attached to the first electrode layer, and the first electrode layer is located within the outer contour of the acoustic layer.

[0009] In some optional embodiments, on the sensor substrate, the first electrode layer and the first electrical connection region are located on the same side of the sensor substrate in the thickness direction, and there is a spacing between the first electrode layer and the first electrical connection region to form a blank area on the sensor substrate; the fingerprint module further comprises a first reinforcing plate, the first reinforcing plate is arranged in the blank area; wherein the thickness T1 of the first reinforcing plate satisfies: 30um≤T1≤100um.

[0010] In some optional embodiments, the fingerprint module further comprises a second reinforcing plate, the second reinforcing plate and the second electrical connection region are arranged on the same side of the circuit board in the thickness direction, and the second reinforcing plate and the second electrical connection region are not in contact; wherein the thickness T2 of the second reinforcing plate satisfies: 30um≤T2≤100um.

[0011] In some optional embodiments, the first reinforcing plate protrudes from the edge of the ultrasonic sensor, the second reinforcing plate protrudes from the edge of the circuit board, and the part of the first reinforcing plate protruding from the edge of the ultrasonic sensor is connected to the part of the second reinforcing plate protruding from the edge of the circuit board.

[0012] In some optional embodiments, in the thickness direction of the acoustic layer, the thickness H of the fingerprint module satisfies: H<0.3mm.

[0013] In some optional embodiments, the fingerprint module satisfies at least one of the following conditions: the circuit board comprises an FPC circuit board; the acoustic layer comprises a piezoelectric material; the conductive adhesive layer comprises an ACF conductive adhesive film; the ultrasonic sensor comprises a COMS ultrasonic sensor

[0014] According to a second aspect of the embodiments of the present application, an electronic device is provided, comprising: a processing unit, a screen, and a fingerprint module according to any one of the first aspect; the electronic device further comprises an adhesive layer, and the fingerprint module is attached to the back of the screen through the adhesive layer.

[0015] In some optional embodiments, the screen is a non-foldable screen, the screen includes a screen substrate and a buffer layer, the buffer layer is mounted on the screen substrate, and the buffer layer is used to buffer the screen; the buffer layer is provided with a first opening, the adhesive layer is located in the first opening and is bonded to the screen substrate, and the fingerprint module is bonded to the screen substrate through the adhesive layer.

[0016] In some optional embodiments, the electronic device further includes a first light-shielding structure and a first fixing structure, the first light-shielding structure is used to cover a gap formed between an edge of the adhesive layer and an edge of the first opening, and the first fixing structure is used to fix an edge of the ultrasonic sensor on the adhesive layer; or the electronic device further includes a second fixing structure, the second fixing structure is used to fix the edge of the ultrasonic sensor on the screen substrate.

[0017] In some optional embodiments, the screen is a foldable screen, the screen includes a support sheet, and the support sheet is used to support the screen; the fingerprint module is bonded to the support sheet through the adhesive layer.

[0018] In some optional embodiments, the electronic device further includes a third fixing structure, the third fixing structure is used to fix the edge of the ultrasonic sensor on the adhesive layer; or the electronic device further includes a fourth fixing structure, the fourth fixing structure is used to fix the edge of the ultrasonic sensor on the support sheet.

[0019] In summary, the fingerprint module in the embodiments of the present application includes an ultrasonic sensor and a circuit board, the second electrode layer of the ultrasonic sensor is electrically connected to the first side of the acoustic layer along the thickness direction, the first electrode layer is electrically connected to the second side of the acoustic layer along the thickness direction, the first electrode layer and the second electrode layer are both electrically connected to the first electrical connection area, the protective layer covers the side of the second electrode layer away from the acoustic layer, the acoustic layer can be used to emit ultrasonic signals and receive ultrasonic signals reflected back by external structures, the first electrode layer and the second electrode layer can be used to provide the acoustic layer with voltage for emitting and receiving ultrasonic signals, the circuit board is provided with a second electrical connection area, the first electrical connection area is electrically connected to the second electrical connection area through the conductive adhesive layer, the ultrasonic sensor is electrically connected to the processing unit outside the fingerprint module through the first electrical connection area, the conductive adhesive layer and the second electrical connection area, the ultrasonic sensor can be used to process the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint identification based on the electrical signals, therefore, the fingerprint module in the present application can be effectively used for fingerprint identification, the disadvantages of optical fingerprint modules can be avoided, and the application requirements including but not limited to under-screen fingerprint identification can be met. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art based on these drawings.

[0021] Figure 1A A structural schematic diagram of an exemplary fingerprint module according to the present application is shown.

[0022] Figure 1B A structural schematic diagram of an exemplary ultrasonic sensor according to the present application is shown.

[0023] Figure 2A A structural schematic diagram of another exemplary fingerprint module according to the present application is shown.

[0024] Figure 2B A structural schematic diagram of still another exemplary fingerprint module according to the present application is shown.

[0025] Figure 2C An exemplary matrix distribution schematic diagram of a plurality of sub-electrodes according to the present application is shown.

[0026] Figure 3A A schematic diagram of a first bonding pad of an exemplary ultrasonic sensor according to the present application is shown.

[0027] Figure 3B A schematic diagram of Figure 3A An enlarged schematic diagram at point Q.

[0028] Figure 4 A schematic diagram of an exemplary first reinforcing plate and second reinforcing plate according to the present application is shown.

[0029] Figure 5A A schematic diagram of manufacturing a first electrical connection region by way 1 in the present application is shown.

[0030] Figure 5B A schematic diagram of manufacturing a first electrical connection region by way 2 in the present application is shown.

[0031] Figure 6 A schematic diagram of an exemplary electronic device according to the present application is shown.

[0032] Figure 7 A schematic diagram of another exemplary electronic device according to the present application is shown.

[0033] Figure 8 A schematic diagram of an exemplary double-sided adhesive according to the present application is shown.

[0034] Figure 9A A schematic diagram of a fingerprint module and a non-foldable screen according to the present application is shown.

[0035] Figure 9B Another schematic diagram of a fingerprint module and a non-foldable screen according to the present application is shown.

[0036] Figure 10A A schematic diagram of a fingerprint module and another non-foldable screen according to the present application is shown.

[0037] Figure 10B Another schematic diagram of a fingerprint module and another non-foldable screen according to the present application is shown.

[0038] Figure 11A A schematic diagram of a fingerprint module and a foldable screen according to the present application is shown.

[0039] Figure 11B Another schematic diagram of a fingerprint module and a foldable screen according to the present application is shown.

[0040] Figure 12A A schematic diagram of a fingerprint module and another foldable screen according to the present application is shown.

[0041] Figure 12B Another schematic diagram of a fingerprint module and another foldable screen according to the present application is shown. DETAILED DESCRIPTION

[0042] In order to make personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application should belong to the scope of protection of the present application.

[0043] The specific implementation of the fingerprint module and the electronic device according to the embodiments of the present application will be described below in conjunction with the drawings. It should be noted that in order to facilitate the illustration, the structures in the following drawings are not necessarily drawn according to the actual proportions.

[0044] In order to at least partially improve the problems existing in the prior art, according to a first aspect of the present application, a fingerprint module is provided. Figure 1A A structural schematic diagram of an exemplary fingerprint module according to the present application is shown. Referring to Figure 1AAs shown, the fingerprint module 100 includes: an ultrasonic sensor 110 and a circuit board 120; the ultrasonic sensor 110 includes: a first electrode layer 111, an acoustic layer 112, a second electrode layer 121, a protective layer 116, and a first electrical connection area 113, the second electrode layer 121 is electrically connected to a first side of the acoustic layer 112 along a thickness direction, the first electrode layer 111 is electrically connected to a second side of the acoustic layer 112 along the thickness direction, the first electrode layer 111 and the second electrode layer 121 are both electrically connected to the first electrical connection area 113, the protective layer 116 covers a side of the second electrode layer 121 away from the acoustic layer 112, the acoustic layer 112 is configured to emit ultrasonic signals and receive ultrasonic signals reflected back by external structures, the first electrode layer 111 and the second electrode layer 121 are configured to provide the acoustic layer 112 with voltages for emitting and receiving the ultrasonic signals; the circuit board 120 is provided with a second electrical connection area 122, the first electrical connection area 113 is electrically connected to the second electrical connection area 122 through a conductive adhesive layer 130; the ultrasonic sensor 110 is electrically connected to a processing unit 210 outside the fingerprint module 100 through the first electrical connection area 113, the conductive adhesive layer 130, and the second electrical connection area 122, the ultrasonic sensor 110 is configured to process the received ultrasonic signals into electrical signals, and send the electrical signals to the processing unit 210 through the circuit board 120, so that the processing unit 210 performs fingerprint recognition based on the electrical signals.

[0045] The fingerprint module in the embodiments of the present application includes an ultrasonic sensor and a circuit board, the second electrode layer of the ultrasonic sensor is electrically connected to a first side of the acoustic layer along a thickness direction, the first electrode layer is electrically connected to a second side of the acoustic layer along the thickness direction, the first electrode layer and the second electrode layer are both electrically connected to the first electrical connection area, the protective layer covers a side of the second electrode layer away from the acoustic layer, the acoustic layer can be configured to emit ultrasonic signals and receive ultrasonic signals reflected back by external structures, the first electrode layer and the second electrode layer can be configured to provide the acoustic layer with voltages for emitting and receiving the ultrasonic signals, the circuit board is provided with a second electrical connection area, the first electrical connection area is electrically connected to the second electrical connection area through a conductive adhesive layer, the ultrasonic sensor is electrically connected to a processing unit outside the fingerprint module through the first electrical connection area, the conductive adhesive layer, and the second electrical connection area, the ultrasonic sensor can be configured to process the received ultrasonic signals into electrical signals, and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signals, therefore the fingerprint module in the present application can be effectively used for fingerprint recognition, the drawbacks of optical fingerprint modules can be avoided, and the application requirements including but not limited to under-screen fingerprint recognition can be met.

[0046] The details of the fingerprint module 100 and the electronic device 200 in the present application will be described below, and it should be understood that the following description does not limit the present application.

[0047] Optionally, the fingerprint module 100 can be installed on an electronic device 200 during use. This application does not limit the type of electronic device 200; the electronic device 200 can be, but is not limited to, a mobile phone, a tablet, or other electronic devices requiring fingerprint recognition functionality. The processing unit can be any external processing unit to the fingerprint module 100. Optionally, the processing unit can be the processing unit 210 within the electronic device 200. The electronic device 200 of this application will be described in detail below, and will not be repeated here.

[0048] In this application, the acoustic layer 112 is used to transmit ultrasonic signals and receive ultrasonic signals reflected back by an external structure. Optionally, the external structure can be a user's finger (see reference). Figure 7 (In the example shown, the finger is indicated by the symbol 300). For example, in one application scenario, the fingerprint module 100 is used for under-display fingerprint recognition. The user touches a specific area of ​​the screen with their finger 300. The acoustic layer 112 of the ultrasonic sensor 110 of the fingerprint module 100 emits an ultrasonic signal. The user's finger 300 reflects at least a portion of the ultrasonic signal, and the acoustic layer 112 receives the ultrasonic signal reflected back by the user's finger 300.

[0049] In this application, the ultrasonic sensor 110 can process the received ultrasonic signal into an electrical signal. Optionally, the ultrasonic sensor 110 may include a sensor substrate 114, on which an ultrasonic signal processing circuit is formed, which can process the received ultrasonic signal into an electrical signal. The ultrasonic signal processing circuit can adopt any existing technical solution or other innovative technical solutions, and this application does not limit it. After the ultrasonic sensor 110 processes the received ultrasonic signal into an electrical signal, the electrical signal can be sent to the processing unit 210 outside the fingerprint module 100 through the circuit board 120, so that the processing unit 210 can perform fingerprint recognition based on the electrical signal.

[0050] Optionally, the sensor substrate 114 can be a silicon-based substrate or a substrate of other materials, and this application does not impose any limitations on it. For the sake of illustrating this embodiment, the sensor substrate 114 will be used as a silicon-based substrate in the following description.

[0051] In the present application, the circuit board 120 can be used for wiring, for example, the circuit board 120 can be provided with an electric connection line, the second electric connection area 112 can be electrically connected with a processing unit outside the fingerprint module 100 through the electric connection line, based on this, the ultrasonic sensor 110 can be electrically connected with the processing unit outside the fingerprint module 100 through the first electric connection area 113, the conductive adhesive layer 130 and the second electric connection area 122, after the ultrasonic sensor 110 processes the received ultrasonic signal into an electric signal, the electric signal can be sent to the processing unit 210 outside the fingerprint module 100 through the circuit board 120, so that the processing unit 210 can perform fingerprint identification based on the electric signal.

[0052] In the present application, the thickness of each structure (for example, the first electrode layer 111, the acoustic layer 112, the second electrode layer 121 and the protective layer 116 hereinafter) of the ultrasonic sensor 110 of the fingerprint module 100 is not limited, referring to the thickness of each structure of the fingerprint module 100 shown in one example of Figure 1A and Figure 1B the fingerprint module 100 shown in another example of Figure 2A and Figure 2B the fingerprint module 100 shown in another example of Figure 2A the thickness of each structure of the fingerprint module 100 shown in Figure 1A and Figure 1B the thickness of each structure of the fingerprint module 100 shown in Figure 2B the thickness of each structure of the fingerprint module 100 shown in

[0053] Optionally, the total thickness of the ultrasonic sensor 110 of the present application can satisfy the following value range: 80um-200um. The total thickness of the ultrasonic sensor 110 can be the total thickness of the ultrasonic sensor 110 along the thickness direction of the acoustic layer 112. Referring to the example of Figure 1B the total thickness of the ultrasonic sensor 110, that is, the distance between the upper and lower sides. The total thickness of the ultrasonic sensor 110 satisfies the above value range, which can better match the performance of the fingerprint module 100 and better match the structural requirements of the electronic device 200 to which the fingerprint module 100 is applied.

[0054] Optionally, the ultrasonic sensor 110 includes a CMOS ultrasonic sensor. Compared with a TFT ultrasonic sensor, the CMOS ultrasonic sensor has better pixel integration, stability and driving performance, and the CMOS ultrasonic sensor is manufactured based on a CMOS process, and the size can not be too large and too thick, and does not occupy too much space, so it can meet the application requirements of mobile terminals for performance and space at the same time.

[0055] Optionally, the acoustic layer 112 in the present application comprises a piezoelectric material. In the present application, the piezoelectric material of the acoustic layer 112 is provided with a voltage, based on the piezoelectric effect of the piezoelectric material, so that the acoustic layer 112 can emit ultrasonic signals and receive ultrasonic signals reflected by external structures. Optionally, the piezoelectric material of the acoustic layer 112 can be a film layer, for example, the film layer can be formed by a coating process. The piezoelectric material in the present application is not limited, for example, the piezoelectric material can include PVDF (Polyvinylidene fluoride) material, which includes but is not limited to PVDF and its copolymer. Based on this, the acoustic layer 112 in the present application comprises a PVDF material layer, which can effectively meet the needs of emitting ultrasonic signals and receiving ultrasonic signals reflected by external structures.

[0056] In the present application, the second electrode layer 121 is electrically connected to the first side of the acoustic layer 112 along the thickness direction, and the first electrode layer 111 is electrically connected to the second side of the acoustic layer 112 along the thickness direction. The first electrode layer 111 and the second electrode layer 121 can provide the acoustic layer 112 with a voltage (which can be an alternating voltage) for emitting and receiving ultrasonic signals. Specifically, the first electrode layer 111 and the second electrode layer 121 can be one anode layer and the other cathode layer. For example, in some optional embodiments, the second electrode layer 121 can be the anode layer of the acoustic layer 112, and the first electrode layer 111 can be the cathode layer of the acoustic layer 112. Optionally, the voltage value applied to the first electrode layer 111 is different from the voltage value applied to the second electrode layer 121, so as to form a voltage difference between the first electrode layer 111 and the second electrode layer 121, which can serve as the voltage for the acoustic layer 112 to emit and receive ultrasonic signals, so as to realize the function of the acoustic layer 112.

[0057] Optionally, the second electrode layer 121 is the anode layer of the acoustic layer 112, and the second electrode layer 121 is electrically connected to the first electrical connection area 113 and grounded through the first electrical connection area 113, the conductive adhesive layer 130 and the second electrical connection area 122; the first electrode layer 111 is the cathode layer of the acoustic layer 112, and the first electrode layer 111 is electrically connected to the first electrical connection area 113 and connected to an external voltage through the first electrical connection area 113, the conductive adhesive layer 130 and the second electrical connection area 122, so as to form a voltage difference between the first electrode layer 111 and the second electrode layer 121, thereby providing the acoustic layer 112 with a voltage for emitting and receiving ultrasonic signals.

[0058] In other optional embodiments, the second electrode layer 121 can also be the cathode layer of the acoustic layer 112, and the first electrode layer 111 can be the anode layer of the acoustic layer 112, which is not limited in the present application.

[0059] In some optional embodiments, referring to Figure 1A 、 Figure 1B 、 Figure 2A 、 Figure 2B The ultrasonic sensor 110 of the fingerprint module 100 further includes a sensor substrate 114, and the first electrode layer 111 is formed on the sensor substrate 114. The acoustic layer 112 is attached to the first electrode layer 111 along the second side in the thickness direction, and the first electrode layer 111 is located within the outer contour of the acoustic layer 112. In this application, based on such a structure, the function of the acoustic layer 112 can be guaranteed, and the first electrode layer 111 can form a stable electrical connection with the acoustic layer 112.

[0060] Optionally, the first electrode layer 111 in this application can not be an integral whole, and can include a plurality of sub-electrodes 1111 (the shape, size, number, and spacing between each other of the plurality of sub-electrodes 1111 are not limited in this application), which are distributed in a matrix to form the first electrode layer 111 (for example, refer to Figure 2C It is understood that the dashed box P shows one example of the matrix distribution of the plurality of sub-electrodes 1111, and the dashed box P can be regarded as the outer contour of the first electrode layer 111). Each sub-electrode 1111 corresponds to a “pixel”. After the acoustic layer 112 receives the ultrasonic signal reflected by the external structure (for example, a finger), the voltage signal converted on each sub-electrode 1111 will be different according to the intensity of the ultrasonic signal. The ultrasonic signal processing circuit of the ultrasonic sensor 110 calculates the voltage signal of each sub-electrode 1111 through an algorithm, and sends each voltage signal to the processing unit 210. The processing unit 210 processes and outputs a fingerprint image based on each voltage signal to perform fingerprint recognition. For example, each sub-electrode 1111 can be a metal electrode, for example, a metal electrode made of copper or silver.

[0061] For example, when manufacturing the ultrasonic sensor 110 of the fingerprint module 100, a metal layer (including a plurality of matrix-distributed metal electrodes, which are the aforementioned sub-electrodes 1111) can be formed on a region of the sensor substrate 114 of the ultrasonic sensor 110 as the first electrode layer 111. Then, the acoustic layer 112 is formed on the first electrode layer 111, so that the acoustic layer 112 can be attached to the first electrode layer 111 along the first side in the thickness direction and form an electrical connection. The outer contour of the acoustic layer 112 can be larger than the outer contour of the first electrode layer 111 (the first electrode layer 111 includes a plurality of matrix-distributed sub-electrodes 1111, and the outer contour of the first electrode layer 111 can be the outer contour of the minimum circumscribed rectangle of the plurality of sub-electrodes 1111, which can be combined with Figure 2CIt is understood that the dashed box P is only used as an example for better understanding and should not be considered as a limitation of the present application) is slightly larger so that the first electrode layer 111 is located within the outer contour of the acoustic layer 112. For example, the acoustic layer 112 is a layer of PVDF material, the PVDF material can be coated on the first electrode layer 111 in a coating process to form the acoustic layer 112. It is understood that this is only an example and should not be considered as a limitation of the embodiments of the present application.

[0062] In some other optional embodiments, the first electrode layer 111 can also be a whole and can meet the needs.

[0063] Optionally, as shown in Figure 3A The ultrasonic sensor 110 in the present application has a recognition area AA and a non-recognition area NAA. The recognition area AA is an area on the ultrasonic sensor 110 that can be used for fingerprint recognition. At least part of the acoustic layer 112 can be located in the recognition area AA. Optionally, the recognition area AA can include the outer contour area of the first electrode layer 111 (for example, the recognition area AA can have the same position and size as the outer contour area of the first electrode layer 111, for example, in combination with Figure 2C and Figure 3A As shown in the outer contour area of the first electrode layer 111 (i.e., the area of the dashed box P) and the recognition area AA have the same position and size (it is understood that this is only an example for better understanding and should not be considered as a limitation of the present application), because fingerprint recognition can be performed in the outer contour area of the first electrode layer 111. The non-recognition area NAA is an area on the ultrasonic sensor 110 that cannot be used for fingerprint recognition. It includes areas other than the recognition area AA (refer to Figure 3A , areas other than the dashed box of the recognition area AA can be considered as the non-recognition area NAA). The non-recognition area NAA can be used to carry some other components of the ultrasonic sensor 110, such as the first electrical connection area 113, etc. The size of the recognition area AA is not specifically limited in the present application and can meet the needs.

[0064] In the present application, the conductive adhesive layer 130 can be any conductive adhesive layer structure, for example, can be a conductive adhesive. In some alternative embodiments, the conductive adhesive layer 130 includes an ACF (Anisotropic Conductive Film) conductive adhesive film. The ACF conductive adhesive film is also called ACF anisotropic conductive adhesive film, which is a conductive adhesive film with the functions of one-way (verticality conduction, parallel non-conduction) conduction and adhesive fixation. Through the ACF conductive adhesive film (i.e. the conductive adhesive layer 130), the first electrical connection area 113 of the ultrasonic sensor 110 can be reliably electrically connected with the second electrical connection area 122 of the circuit board 120, and the two can be electrically connected by pressing, which is very convenient in process, thereby simplifying the complexity of the manufacturing process of the fingerprint module 100, and can more conveniently meet the application requirements.

[0065] Optionally, the edge of the acoustic layer 112 in the present application does not exceed the edge of the second electrode layer 121. For example, referring to the examples of the fingerprint module 100 shown in Figure 1A and Figure 2A , the edge of the acoustic layer 112 is flush with the edge of the second electrode layer 121; for example, referring to the example of the fingerprint module 100 shown in Figure 2B , the edge of the acoustic layer 112 does not exceed the edge of the second electrode layer 121, and the outer contour of the acoustic layer 112 is smaller than the outer contour of the second electrode layer 121. It should be understood that these are only examples for easy understanding, and do not limit the present application in any way.

[0066] Optionally, when the conductive adhesive layer 130 in the present application is an ACF conductive adhesive film, the thickness of the ACF conductive adhesive film after being pressed by the first electrical connection area 113 and the second electrical connection area 122 satisfies the following value range: 3um~10um. Being within this value range can better adapt to the light and thin requirements of the fingerprint module 100.

[0067] Optionally, after the first electrical connection area 113 and the second electrical connection area 122 are electrically connected by the conductive adhesive layer 130 (for example, the ACF conductive adhesive film), a protective adhesive 150 can be added outside the conductive adhesive layer 130 to protect the conductive adhesive layer 130, which can be specifically referred to Figure 1A , Figure 2A , Figure 2B , Figure 9B , Figure 10B , Figure 11B , Figure 12B .

[0068] In the present application, the second electrode layer 121 can be made on the first side of the acoustic layer 112 along the thickness direction, and the second electrode layer 121 can be a metal layer, such as a silver layer or a copper layer, etc. Optionally, taking the silver layer as an example, one or more layers of silver paste can be brushed on the first side of the acoustic layer 112 along the thickness direction to form the second electrode layer 121.

[0069] In some optional embodiments, referring to Figure 1A 、 Figure 1B 、 Figure 2A 、 Figure 2B As shown, the ultrasonic sensor 110 further includes a protective layer 116 covering the side of the second electrode layer 121 away from the acoustic layer 112. The protective layer 116 can prevent water and oxygen from penetrating to oxidize the second electrode layer 121 (for example, a silver layer formed by silver paste) or cause the performance of the acoustic layer 112 (for example, a PVDF piezoelectric material layer) to degrade, and the protective layer 116 can also serve as an insulating layer.

[0070] Optionally, the circuit board 120 can be an FPC (Flexible Printed Circuit) circuit board. The FPC circuit board has good flexibility and strength and can meet the circuit trace requirements of the fingerprint module 100 and can adapt to the structural needs of the fingerprint module 100 in the electronic device 200. Optionally, when the circuit board 120 is an FPC circuit board, it can be made based on a double-sided flexible copper clad laminate (FCCL).

[0071] Optionally, the first electrical connection area 113 in the present application is formed on the sensor substrate 114 of the ultrasonic sensor 110 and can be a gold finger area of the ultrasonic sensor 110. The second electrical connection area 122 in the present application is formed on the circuit board 120 (for example, an FPC circuit board) and can be a gold finger area on the circuit board 120. Optionally, referring to Figure 1A 、 Figure 1B 、 Figure 3A 、 Figure 3BAs shown, the ultrasonic sensor 110 can further include a pin pad area 115, which is electrically connected with the first electrical connection area 113. Optionally, the pin pad area 115 includes pads (hereinafter referred to as pin pads 1151) of multiple pins of the ultrasonic sensor 110, which are electrically connected with the pin pad area 115 by the first electrical connection area 113, which is further electrically connected with the second electrical connection area 122 by the conductive adhesive layer 130, which can be electrically connected with the external processing unit 210 by an electrical connection line (which can be arranged on the circuit board 120), thereby satisfying the requirement that the ultrasonic sensor 110 is electrically connected with the external processing unit 210 through the first electrical connection area 113, the conductive adhesive layer 130 and the second electrical connection area 122.

[0072] Optionally, the first electrical connection area 113 in the present application is a single-layer trace; and optionally, the second electrical connection area 122 in the present application is a single-layer trace.

[0073] In some optional embodiments, referring to Figure 1A and Figure 3A As shown, the first electrical connection area 113 includes N first pads 1131, and the second electrical connection area 122 includes N second pads (not shown in the figure), each of the N first pads 1131 is electrically connected with one second pad by the conductive adhesive layer 130, and different first pads 1131 are electrically connected with different second pads by the conductive adhesive layer 130, wherein N≥2 and is an integer. Through such a structure, the present application can achieve the purpose of electrically connecting the first electrical connection area 113 with the second electrical connection area 122 through the conductive adhesive layer 130.

[0074] In addition, taking the conductive adhesive layer 130 as an example of an ACF conductive adhesive film, when a whole piece of ACF conductive adhesive film is adhered to the second electrical connection area 122, the N first pads 1131 of the first electrical connection area 113 of the ultrasonic sensor 110 can be aligned with the N second pads of the second electrical connection area 122 of the circuit board 120 (or the N second pads of the second electrical connection area 122 of the circuit board 120 can be aligned with the N first pads 1131 of the first electrical connection area 113 of the ultrasonic sensor 110), and then the N first pads 1131 and the N second pads are bonded by pressing. Since the ACF conductive adhesive film has a one-way conductive characteristic, each of the N first pads 1131 can only form an electrical conduction with one second pad at its corresponding position, and different first pads 1131 and different second pads form electrical connections through the conductive adhesive layer 130, so that the electrical connection error can be avoided.

[0075] Optionally, referring to Figure 3A and Figure 3BIt is understood that the pin pad area 115 may include N pin pads 1151, each of the N pin pads 1151 being electrically connected to a first pad 1131, and different pin pads 1151 being electrically connected to different first pads 1131. This satisfies the requirement that the ultrasonic sensor 110 is electrically connected to the external processing unit 210 through the first electrical connection area 113, the conductive adhesive layer 130, and the second electrical connection area 122.

[0076] Optionally, a passivation layer 117 can generally be formed on the sensor substrate 114 of the ultrasonic sensor 110 (see reference). Figure 5A and Figure 5B (As shown). Optionally, the first electrical connection area 113 (e.g., including N first pads 1131) can be fabricated in this application using either method 1 or method 2, specifically:

[0077] Method 1: Refer to Figure 5A For example, an RDL (ReDistributionLayer) circuit can be fabricated on the surface of the passivation layer 117 of the sensor substrate 114 of the ultrasonic sensor 110 using an RDL (ReDistributionLayer) process. One end of the RDL circuit is electrically connected to the pin pad 1151 of the pin pad area 115 of the ultrasonic sensor 110 that needs to output a line, and the RDL circuit can form the first pad 1131 of the first electrical connection area 113.

[0078] Method 2: Refer to Figure 5B For example, during the chip design of the ultrasonic sensor 110, an area for forming N first pads 1131 for forming the first electrical connection area 113 can be pre-added below the pin pads 1151 of the pin pad area 115 of the ultrasonic sensor 110 (which can be understood as appropriately designing the pin pads 1151 to be larger), and a window is opened on the surface of the passivation layer 117 of the sensor substrate 114 of the ultrasonic sensor 110 to expose the area. Then, a conductive layer of appropriate thickness is set on the area (the way of setting the conductive layer is not limited here, for example, it can be achieved by plating an Au layer, etc.) to form the first pads 1131 of the first electrical connection area 113.

[0079] Both methods can be used to create a first electrical connection region 113 including N first pads 1131, and the choice can be made as needed; this application does not impose any restrictions on this method. Of course, other methods can also be used to create a first electrical connection region 113 including N first pads 1131, and this application does not impose any restrictions on these methods either.

[0080] Alternatively, a second electrical connection area 122 (e.g., including N second pads) can be fabricated on the circuit board 120, which can also be done with reference to the aforementioned methods 1 and 2. The implementation process and principle are quite similar, so they will not be described in detail here.

[0081] In some optional embodiments, referring to Figs. 11A and 11B, a distance A between the midlines of each two adjacent first pads 1131 in the N first pads 1131 satisfies: 50um≤A≤200um. Figure 3A Figure 3B In the example shown in Figs. 11A and 11B, the first pads 1131 are approximately rectangular in shape, and the midline of the first pad 1131 is the line connecting the midpoints of the upper and lower edges of the rectangle. In this application, the distance A between the midlines of each two adjacent first pads 1131 in the N first pads 1131 satisfies the above range, which can satisfy the signal transmission performance of the fingerprint module 100, and has good heat dissipation. When the ACF conductive adhesive film is used as the conductive adhesive layer 130, it can better ensure the uniform curing effect of the ACF adhesive and the uniform explosion of the conductive particles in the ACF adhesive. Figure 3A Figure 3B Optionally, a distance between the midlines of each two adjacent second pads in the N second pads satisfies: 50um≤A≤200um, so as to adapt to the requirement that the N first pads 1131 and the N second pads are respectively electrically connected through the conductive adhesive layer 130 (such as the ACF conductive adhesive film). It should be understood that although the second pads are not shown in the figure, they can be understood in combination with Figs. 11A and 11B.

[0082] Optionally, referring to Figs. 11A and 11B, a width W of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: W≥0.03mm. Optionally, a length L of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: L≥0.01mm. Optionally, a distance T between the bottom edge of the electrical connection region between the first pad 1131 and the pin pad 1151 and the bottom edge of the sensor substrate 114 satisfies: T≥0.01mm. These value ranges can better guarantee the stability of the electrical connection between the first pad 1131 and the pin pad 1151, can satisfy the signal transmission performance of the fingerprint module 100, and better provide heat dissipation capability. Figure 3A Figure 3B Optionally, referring to Figs. 11A and 11B, a width W of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: W≥0.03mm. Optionally, a length L of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: L≥0.01mm. Optionally, a distance T between the bottom edge of the electrical connection region between the first pad 1131 and the pin pad 1151 and the bottom edge of the sensor substrate 114 satisfies: T≥0.01mm. These value ranges can better guarantee the stability of the electrical connection between the first pad 1131 and the pin pad 1151, can satisfy the signal transmission performance of the fingerprint module 100, and better provide heat dissipation capability.

[0083] Optionally, referring to Figs. 11A and 11B, a width W of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: W≥0.03mm. Optionally, a length L of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: L≥0.01mm. Optionally, a distance T between the bottom edge of the electrical connection region between the first pad 1131 and the pin pad 1151 and the bottom edge of the sensor substrate 114 satisfies: T≥0.01mm. These value ranges can better guarantee the stability of the electrical connection between the first pad 1131 and the pin pad 1151, can satisfy the signal transmission performance of the fingerprint module 100, and better provide heat dissipation capability. Figure 3A Figure 3B Optionally, referring to Figs. 11A and 11B, a width W of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: W≥0.03mm. Optionally, a length L of the electrical connection region between the first pad 1131 and the pin pad 1151 satisfies: L≥0.01mm. Optionally, a distance T between the bottom edge of the electrical connection region between the first pad 1131 and the pin pad 1151 and the bottom edge of the sensor substrate 114 satisfies: T≥0.01mm. These value ranges can better guarantee the stability of the electrical connection between the first pad 1131 and the pin pad 1151, can satisfy the signal transmission performance of the fingerprint module 100, and better provide heat dissipation capability.

[0084] ​​​​In some optional embodiments, the surface of the first pad 1131 is provided with a conductive plating layer, and / or the surface of the second pad is provided with a conductive plating layer. Optionally, the conductive plating layer can be made into a conductive film. The reason why the conductive plating layer is additionally provided on the first pad 1131 and / or the second pad in the present application is that, under the influence of some manufacturing processes, the first pad 1131 / second pad will have a certain degree of concave (for example, 1um-2um) during the manufacturing of the first pad 1131 / second pad. Therefore, the additional provision of the conductive plating layer on the first pad 1131 and / or the second pad in the present application is beneficial to the protection of the first pad 1131 and / or the second pad, and can pad up the concave part on the first pad 1131 and / or the second pad, so as to better adapt to the requirement of electrically connecting the first pad 1131 and the second pad through the conductive adhesive layer 130 (for example, ACF conductive adhesive film).

[0085] The present application does not limit the material of the conductive plating layer, which can meet the needs. Optionally, the conductive plating layer includes at least one of ITO (Indium Tin Oxides, Indium Tin Metal Oxide) plating layer, Ti plating layer (i.e., titanium plating layer), Ni plating layer (i.e., nickel plating layer), Ag plating layer (i.e., silver plating layer), Au plating layer (i.e., gold plating layer). These kinds of conductive plating layers can better conduct electricity and better adapt to the process requirement of electrically connecting the first pad 1131 and the second pad through the conductive adhesive layer 130 (for example, ACF conductive adhesive film).

[0086] In some optional embodiments, the fingerprint module 100 further includes a reinforcing structure 140 for reinforcing the strength of the conductive adhesive layer 130 between the first electrically connecting area 113 and the second electrically connecting area 122. Optionally, the reinforcing structure 140 can be provided on the sensor substrate 114 and / or the circuit board 120. Through the reinforcing structure 140, the present application can reinforce the strength of the conductive adhesive layer 130, improve the stability of the electrical connection formed by the adhesion of the first electrically connecting area 113 and the second electrically connecting area 122 through the conductive adhesive layer 130, and strengthen the adhesion force and pulling force of the adhesion of the first electrically connecting area 113 and the second electrically connecting area 122 through the conductive adhesive layer 130, so as to achieve better reliability.

[0087] In addition, the reinforcing structure 140 in the present application has better beneficial effects for the case that the ultrasonic sensor 110 is a CMOS ultrasonic sensor, because the area of the first electrical connection area 113 made on the CMOS ultrasonic sensor is smaller than that of the TFT ultrasonic sensor to meet the application requirements, and the stability requirement of the electrical connection formed by bonding the first electrical connection area 113 and the second electrical connection area 122 on the circuit board 120 through the conductive adhesive layer 130 is higher. Therefore, the fingerprint module 100 in the present application can reinforce the strength of the conductive adhesive layer 130 through the reinforcing structure 140, and can meet the stability requirement of the electrical connection formed by bonding the first electrical connection area 113 and the second electrical connection area 122 on the circuit board 120 through the conductive adhesive layer 130 when the ultrasonic sensor 110 is a CMOS ultrasonic sensor, to achieve better reliability.

[0088] The specific composition of the reinforcing structure 140 in the present application is not specifically limited, and the specific setting position of the reinforcing structure 140 on the sensor substrate 114 and / or the circuit board 120 is also not limited, as long as it can meet the needs. For example, as shown in FIGS. 1 to 3, in some optional embodiments, the first electrode layer 111 and the first electrical connection area 113 are located on the same side of the sensor substrate 114 along the thickness direction, and there is a spacing between the first electrode layer 111 and the first electrical connection area 113 to form a blank area 1141 on the sensor substrate 114; the reinforcing structure 140 includes a first reinforcing plate 141, and the first reinforcing plate 141 is arranged on the blank area 1141. Figure 1A 、 Figure 1B 、 Figure 2A 、 Figure 2B As shown in FIGS. 1 to 3, in some optional embodiments, the first electrode layer 111 and the first electrical connection area 113 are located on the same side of the sensor substrate 114 along the thickness direction, and there is a spacing between the first electrode layer 111 and the first electrical connection area 113 to form a blank area 1141 on the sensor substrate 114; the reinforcing structure 140 includes a first reinforcing plate 141, and the first reinforcing plate 141 is arranged on the blank area 1141.

[0089] Based on this structure, the first reinforcing plate 141 in the present application is arranged on the blank area 1141 on the sensor substrate 114, which can avoid the influence of the first reinforcing plate 141 on other structures of the ultrasonic sensor 110, and can effectively reinforce the strength of the conductive adhesive layer 130, improve the stability of the electrical connection formed by bonding the first electrical connection area 113 and the second electrical connection area 122 through the conductive adhesive layer 130, and strengthen the bonding force and pulling force of the bonding of the first electrical connection area 113 and the second electrical connection area 122 through the conductive adhesive layer 130, to achieve better reliability.

[0090] The application does not limit the setting mode of the first reinforcing plate 141 on the blank area 1141. For example, in some optional embodiments, the first reinforcing plate 141 is bonded to the blank area 1141. For example, the bonding can be performed by double-sided adhesive tape, or directly by adhesive such as glue, which is not limited herein. Through bonding, the first reinforcing plate 141 can be stably fixed to the blank area 1141, and it is less likely to cause damage to the blank area 1141 on the sensor substrate 114 than other fixing modes.

[0091] The application does not limit the type of the first reinforcing plate 141. For example, the first reinforcing plate 141 can be a metal plate, such as a reinforcing steel plate, a reinforcing copper plate, or other reinforcing plates with good strength.

[0092] The application does not limit the thickness of the first reinforcing plate 141, which can meet the requirements. It should be noted that the thickness of the first reinforcing plate 141 in the application refers to the thickness of the first reinforcing plate 141 along the thickness direction of the acoustic layer 112, which can be understood with reference to the mark T1 in Figure 1A 、 Figure 2A 、 Figure 2B In some optional embodiments, the thickness T1 of the first reinforcing plate 141 satisfies: 30um≤T1≤100um. Based on this, the thickness T1 of the first reinforcing plate 141 satisfies such a range of values, which can better reinforce the strength of the conductive adhesive layer 130, improve the stability of the electrical connection formed by the bonding of the first electrical connection area 113 and the second electrical connection area 122 through the conductive adhesive layer 130, strengthen the bonding force and pulling force of the bonding of the first electrical connection area 113 and the second electrical connection area 122 through the conductive adhesive layer 130, and achieve better reliability. In addition, the first reinforcing plate 141 will not be too thick, so as to adapt to the demand for thinning of the fingerprint module 100.

[0093] Optionally, as shown in Figure 1A 、 Figure 1B 、 Figure 2A 、 Figure 2B The first reinforcing plate 141 does not contact the first electrode layer 111, the acoustic layer 112, and the second electrode layer 121.

[0094] As shown in Figure 1A 、 Figure 2A 、 Figure 2B In some optional embodiments, the reinforcing structure 140 includes a second reinforcing plate 142, the second reinforcing plate 142 is disposed on the same side of the second electrical connection area 122 along the thickness direction of the circuit board 120, and the second reinforcing plate 142 does not contact the second electrical connection area 122.

[0095] Based on the structure, the second reinforcing plate 142 and the second electric connection area 122 are arranged on the same side of the circuit board 120 along the thickness direction, and the second reinforcing plate 142 and the second electric connection area 122 are not in contact, which can avoid the influence of the second reinforcing plate 142 on the second electric connection area 122, and effectively reinforce the strength of the conductive adhesive layer 130, and improve the stability of the electrical connection formed by the first electric connection area 113 and the second electric connection area 122 through the conductive adhesive layer 130.

[0096] In the present application, the arrangement of the second reinforcing plate 142 on the circuit board 120 is not limited. For example, in some optional embodiments, the second reinforcing plate 142 is bonded to the circuit board 120. For example, it can be bonded by double-sided adhesive tape, or directly bonded by adhesive such as glue, which is not limited herein. Through bonding, the second reinforcing plate 142 can be stably fixed to the circuit board 120, and it is less likely to cause damage to the circuit board 120 compared to other fixing methods.

[0097] The present application does not limit the type of the second reinforcing plate 142. For example, the second reinforcing plate 142 can be a metal plate, such as a reinforcing steel plate, a reinforcing copper plate, or other reinforcing plates with good strength.

[0098] The thickness of the second reinforcing plate 142 is not limited in the present application, as long as it meets the requirements. It should be noted that the thickness of the second reinforcing plate 142 in the present application refers to the thickness of the second reinforcing plate 142 along the thickness direction of the circuit board 120, which can be understood with reference to the mark T2 in Figure 1A Figure 2A Figure 2B In some optional embodiments, the thickness T2 of the second reinforcing plate 142 satisfies: 30um≤T2≤100um. Based on this, the thickness T1 of the second reinforcing plate 142 satisfies such a range of values, which can better reinforce the strength of the conductive adhesive layer 130 to improve the stability of the electrical connection formed by the first electric connection area 113 and the second electric connection area 122 through the conductive adhesive layer 130, and the second reinforcing plate 142 will not be too thick, thereby being able to adapt to the demand for thinning of the fingerprint module 100.

[0099] Referring to the example of the fingerprint module 100 shown in Figure 1A Figure 2A Figure 2B The reinforcing structure 140 simultaneously includes the first reinforcing plate 141 and the second reinforcing plate 142, so as to better reinforce the strength of the conductive adhesive layer 130 between the first electric connection area 113 and the second electric connection area 122, and strengthen the bonding force and the pulling force of the bonding of the first electric connection area 113 and the second electric connection area 122 through the conductive adhesive layer 130, to achieve better reliability. From Figure 1A ​​​​、 Figure 2A 、 Figure 2B As shown from the perspective of the view angle of the fingerprint module 100, the first reinforcing plate 141 is located above the blank area of the sensor substrate 114, and the second reinforcing plate 142 is located below the circuit board 120. It should be understood that, Figure 1A 、 Figure 2A The example of the fingerprint module 100 shown in the figure is not intended to limit the embodiments of the present application in any way.

[0100] In some optional embodiments, referring to Figure 2B As shown, the first reinforcing plate 141 extends beyond the edge of the ultrasonic sensor 110, the second reinforcing plate 142 extends beyond the edge of the circuit board 120, and the part of the first reinforcing plate 141 extending beyond the edge of the ultrasonic sensor 110 is connected to the part of the second reinforcing plate 142 extending beyond the edge of the circuit board 120. Such a structure can further reinforce the strength of the conductive adhesive layer 130 between the first electrical connection area 113 and the second electrical connection area 122, and strengthen the bonding force and pulling force of the conductive adhesive layer 130 between the first electrical connection area 113 and the second electrical connection area 122, thereby achieving better reliability.

[0101] Optionally, the part of the first reinforcing plate 141 extending beyond the edge of the ultrasonic sensor 110 is connected to the part of the second reinforcing plate 142 extending beyond the edge of the circuit board 120 by bonding, which can be achieved by an adhesive layer such as double-sided tape or other adhesive, which is not limited herein.

[0102] Optionally, referring to the example shown in Figure 4 As shown, the two parts of the first reinforcing plate 141 extending beyond the edge of the ultrasonic sensor 110 are bent, and both ends extend towards the direction of the circuit board 120 and are connected to the two ends of the two parts of the second reinforcing plate 142 extending beyond the edge of the circuit board 120 (such as the FPC circuit board) by bonding. In this way, the first reinforcing plate 141 and the second reinforcing plate 142 form a ring after bonding, which can form a more stable bonding and further reinforce the strength of the conductive adhesive layer 130 between the first electrical connection area 113 and the second electrical connection area 122. It should be understood that, Figure 4 In order to schematically represent the structure, the part of the second reinforcing plate 142 that is blocked is schematically shown by a dashed line, which is not intended to limit the present application in any way.

[0103] Optionally, referring to the example shown in Figure 4 As shown, the widths T3 and T4 of the two parts of the second reinforcing plate 142 extending beyond the edge of the circuit board 120 (such as the FPC circuit board) are both greater than 1 mm (refer to Figure 4It should be understood that the widths T3 and T4 herein can be understood as the distances between the edges of the two parts and the edges of the circuit board 120 respectively, so as to facilitate the provision of bonding areas on the second reinforcing plate 142 to achieve the bonding of the first reinforcing plate 141 and the second reinforcing plate 142.

[0104] In some optional embodiments, the thickness H of the fingerprint module 100 along the thickness direction of the acoustic layer 112 satisfies: H < 0.3 mm. The distance H in the present application can be regarded as the thickness of the fingerprint module 100, which satisfies the above value range and can adapt to the light and thin requirements of the fingerprint module 100 and match the performance requirements of the fingerprint module 100.

[0105] It should be noted that the thickness H of the fingerprint module 100 in the present application is determined by the thickness (along the thickness direction of the acoustic layer 112) of the ultrasonic sensor 110. For example, referring to the examples of the fingerprint module 100 shown in Figs. 1 and 2, the thickness of the ultrasonic sensor 110 is small, and the surface of the ultrasonic sensor 110 away from the sensor substrate 114 does not exceed the circuit board 120, so the thickness H of the fingerprint module 100 is the distance between the side of the sensor substrate 114 away from the circuit board 120 and the side of the circuit board 120 away from the sensor substrate 114; referring to the examples of the fingerprint module 100 shown in Figs. 3 and 4, the thickness of the ultrasonic sensor 110 is large, and the surface of the ultrasonic sensor 110 away from the sensor substrate 114 exceeds the circuit board 120, so the thickness H of the fingerprint module 100 is the thickness of the ultrasonic sensor 110. Figure 4 Figure 2A Figure 1A It should be understood that the above examples are not intended to limit the present application in any way.

[0106] It should be understood that the above embodiments are only examples of some of the fingerprint modules 100 in the embodiments of the present application, and are not intended to limit the fingerprint modules 100 in the embodiments of the present application in any way.

[0107] Next, the electronic device provided by the second aspect of the present application will be described in detail. Figure 2B A structural schematic diagram of an exemplary electronic device 200 according to the present application is shown. The electronic device 200 comprises a processing unit 210, and the fingerprint module 100 provided by the first aspect of the present application. Specifically, the processing unit 210 can be the "processing unit outside the fingerprint module" in the foregoing fingerprint module embodiments, which can be used to receive the electrical signal processed by the ultrasonic sensor 110 of the fingerprint module 100 from the ultrasonic signal received by the ultrasonic sensor 110, and can perform fingerprint recognition based on the electrical signal. The processing unit 210 can comprise at least one chip capable of data processing, such as CPU, GPU, MCU, DSP, FPGA, etc.

[0108] ​​Optionally, the processing unit 210 in the present application can process the electrical signal through image processing circuit and / or image processing algorithm when performing fingerprint identification based on the electrical signal, generate a fingerprint image, and perform fingerprint identification based on the fingerprint image.

[0109] The present application does not limit the type of electronic device 200, which can include but is not limited to a mobile phone, a PAD, etc., or other electronic devices that require fingerprint identification function, such as a fingerprint lock, etc.

[0110] The present application does not limit the setting position of the fingerprint module 100 on the electronic device 200, which can be set at any suitable position as needed. Optionally, the electronic device 200 can include a screen 220, and the fingerprint module 100 is located below the screen 220. The present application can achieve an under-screen fingerprint identification function by setting the fingerprint module 100 below the screen 220, for example, the under-screen fingerprint identification function can be used for under-screen fingerprint unlocking function, under-screen fingerprint payment function, etc. of the electronic device 200 (including but not limited to a mobile phone).

[0111] The screen 220 in the present application can be any type of screen, including but not limited to an LCD screen, an LED screen, an OLED screen, etc. The screen 220 can be a non-foldable screen or a foldable screen, which is not limited in the present application.

[0112] It can be understood that the screen 220 includes a front surface and a back surface, and the front surface of the screen 220 is the surface for displaying pictures. For under-screen fingerprint identification, as shown in Figure 6 , a user can use a finger 300 to input a fingerprint in a specific area of the front surface of the screen 220; and the back surface of the screen 220 is the surface opposite to the front surface of the screen 220, which generally does not display pictures (for example, taking the mobile phone as an example, the back surface of the screen 220 is often located inside the shell of the mobile phone).

[0113] The present application also does not limit the mounting method of the fingerprint module 100 below the screen 220, for example, in some optional embodiments, as shown in Figure 7 , the electronic device 200 further includes an adhesive layer 230, and the fingerprint module 100 is bonded to the back surface of the screen 220 through the adhesive layer 230. In the present application, the adhesive layer 230 can ensure that the fingerprint module 100 is bonded to the back surface of the screen 220, maintain the installation stability of the fingerprint module 100 on the electronic device 200, and facilitate the electronic device 200 to utilize the function of the fingerprint module 100.

[0114] In the present application, the adhesive layer 230 can be any adhesive structure. Optionally, the adhesive layer 230 can include a double-sided adhesive tape. The double-sided adhesive tape can achieve the function of bonding the fingerprint module 100 to the back of the screen 220, and some types of double-sided adhesive tape can also play the role of cushioning and insulating the fingerprint module 100 and the screen 220 when needed.

[0115] The adhesive layer 230 can use any type of double-sided adhesive tape, which is not limited in the present application. For example, Figure 7 An exemplary schematic diagram of a double-sided adhesive tape according to the present application is shown. Referring to FIG. 9, in some optional embodiments, the double-sided adhesive tape (i.e., the adhesive layer 230) can include a first double-sided adhesive tape layer 231, a metal foil layer 232, and a second double-sided adhesive tape layer 233, the first double-sided adhesive tape layer 231 is bonded to the first side of the metal foil layer 232 in the thickness direction, and the second double-sided adhesive tape layer 233 is bonded to the second side of the metal foil layer 232 in the thickness direction. When using this double-sided adhesive tape, the side of the first double-sided adhesive tape layer 231 away from the metal foil layer 232 can be bonded to the back of the screen 220 (i.e., the first double-sided adhesive tape layer 231 can be a screen-facing double-sided adhesive tape layer), and the fingerprint module 100 can be bonded to the side of the second double-sided adhesive tape layer 233 away from the metal foil layer 232, so that the fingerprint module 100 can be bonded to the back of the screen 220 through the double-sided adhesive tape (i.e., the adhesive layer 230). The metal foil layer 232 is located between the first double-sided adhesive tape layer 231 and the second double-sided adhesive tape layer 233, which can improve the structural stability of the double-sided adhesive tape to some extent. For example, the metal foil layer 232 can be a copper foil layer, or it can also be other metal foil layers that meet the needs. Optionally, the first double-sided adhesive tape layer 231 and the second double-sided adhesive tape layer 233 can both be made by coating glue on both sides of a double-sided adhesive tape substrate. The double-sided adhesive tape substrate can include a high polymer material, including but not limited to acrylic material and the like.

[0116] In some optional embodiments, referring to Figure 8 、 Figure 9B 、 Figure 10B 、 Figure 11B The ultrasonic sensor 110 of the fingerprint module 100 is in contact with the adhesive layer 230, so that the fingerprint module 100 is bonded to the back of the screen 220 through the adhesive layer 230. Through such a structure, the present application can effectively bond the fingerprint module 100 to the back of the screen 220 through the adhesive layer 230, and according to the principle of ultrasonic coherent superposition and acoustic simulation, the performance of the stack using this structure is relatively good, and does not affect the function of the fingerprint module 100.

[0117] Specifically, the ultrasonic sensor 110 can be in contact with the adhesive layer 230 along a first side of the acoustic layer 112 in the thickness direction of the acoustic layer 112, or the ultrasonic sensor 110 can be in contact with the adhesive layer 230 along a second side of the acoustic layer 112 in the thickness direction of the acoustic layer 112 (which can be simply understood as being able to be attached in a positive manner or in a reverse manner), so that the ultrasonic sensor 110 is bonded to the adhesive layer 230, so that the fingerprint module 100 is bonded to the back of the screen 220 through the adhesive layer 230. Neither of the two ways affects the function of the fingerprint module 100, so the two ways can be selected as needed to paste the fingerprint module 100 on the back of the screen 220.

[0118] In some optional embodiments, referring to Figure 12B and Figure 9A 、 Figure 9B and Figure 10A For the screen 220 of the electronic device 200 being a non-foldable screen, the screen 220 includes a screen substrate 221 and a buffer layer 222, the buffer layer 222 is mounted on the screen substrate 221, and the buffer layer 222 is used to buffer the screen 220; the buffer layer 222 is provided with a first opening 2221, the adhesive layer 230 is located in the first opening 2221 and is bonded to the screen substrate 221, and the fingerprint module 100 is bonded to the screen substrate 221 through the adhesive layer 230.

[0119] Specifically, the buffer layer 222 and the screen substrate 221 can form the back of the screen 220. The buffer layer 222 buffers the screen 220 (non-foldable screen), and the characteristics of the non-foldable screen require the buffering effect of the buffer layer 222 to reduce the impact on the screen 220. The buffer layer 222 can generally be made of a structure with elasticity, and it should be understood that the buffer layer 222 can be selected in different structures for different screens 220, and the present application is not limited. For example, in some embodiments, the buffer layer 222 can include foam and the like.

[0120] Optionally, the buffer layer 222 can be the same color as or close to the color of the first double-sided adhesive layer 231 of the aforementioned adhesive layer 230, so that the electronic device 200 has a better appearance display effect when the buffer layer 222 is provided with the first opening 2221, and the whole is more beautiful. In addition, the aforementioned first double-sided adhesive layer 231 (i.e., the screen-facing double-sided adhesive layer) can be black, so that the adhesive layer 230 can play a light-shielding role, which can effectively improve the problem of poor screen display due to the first opening 2221 on the buffer layer 222.

[0121] In the present application, the first opening 2221 is opened on the buffer layer 222 for buffering the screen 220, a part of the screen substrate 221 is exposed from the first opening 2221, and the adhesive layer 230 (for example, double-sided tape) is bonded on the screen substrate 221 exposed from the first opening 2221, which can reduce the hindering and absorbing effect of the buffer layer 222 on the ultrasonic wave signals transmitted and received by the ultrasonic sensor 110 of the fingerprint module 100, thereby improving the use effect of the fingerprint module 100 and meeting the application requirements of the fingerprint module 100 in the electronic device 200 with a non-foldable screen.

[0122] The size and shape of the first opening 2221 can be as required, and the present application does not make any limitation thereon. Referring to Figure 10B and Figure 9A , Figure 9B and Figure 10A It is shown that the outer contour of the first opening 2221 is larger than the outer contour of the adhesive layer 230, and also larger than the outer contour of the ultrasonic sensor 110 of the fingerprint module 100. Figure 10B , Figure 9A The shape of the first opening 2221 is a rounded rectangle as shown in the examples in

[0123] In some optional embodiments, in the electronic device 200, the screen 220 is a non-foldable screen, and the electronic device 200 further comprises a first light shielding structure 240 and a first fixing structure 251, wherein the first light shielding structure 240 is used to cover the gap formed between the edge of the adhesive layer 230 and the edge of the first opening 2221, and the first fixing structure 251 is used to fix the edge of the ultrasonic sensor 110 on the adhesive layer 230.

[0124] For example, in some example embodiments, referring to Figure 10A and Figure 9A It is shown that in the electronic device 200, the screen 220 is a non-foldable screen, the gap B between the edge of the adhesive layer 230 and the edge of the first opening 2221 is ≥0.1mm, and along the thickness direction of the acoustic layer 112, the first vertical projection of the ultrasonic sensor 110 towards the adhesive layer 230 is located within the adhesive layer 230, the gap C between the edge of the first vertical projection and the edge of the adhesive layer 230 is ≥0.5mm, and the electronic device 200 further comprises a first light shielding structure 240 and a first fixing structure 251, wherein the first light shielding structure 240 is used to cover the gap formed between the edge of the adhesive layer 230 and the edge of the first opening 2221, and the first fixing structure 251 is used to fix the edge of the ultrasonic sensor 110 on the adhesive layer 230.

[0125] Specifically, when the gap B between the edge of the adhesive layer 230 and the edge of the first opening 2221 is ≥ 0.1 mm, at this time, the outer contour of the adhesive layer 230 does not exceed the outer contour of the first opening 2221 (which can be understood in combination with the description of FIG. 2B) Figure 9B and Figure 9A As shown, a part of the screen substrate 221 of the screen 220 (non-foldable screen) can be exposed from the gap formed between the edge of the adhesive layer 230 and the edge of the first opening 2221, and the screen 220 may have light leakage, so based on this structure, on the one hand, the gap formed between the edge of the adhesive layer 230 and the edge of the first opening 2221 can be covered by the first light-shielding structure 240, thereby improving the adverse effects of the display effect of the screen 220 and the appearance of the electronic device 200 caused by light leakage of the screen 220; along the thickness direction of the acoustic layer 112, the first vertical projection of the ultrasonic sensor 110 towards the adhesive layer 230 is located in the adhesive layer 230, and when the gap C between the edge of the first vertical projection and the edge of the adhesive layer 230 is ≥ 0.5 mm, at this time, the outer contour of the adhesive layer 230 exceeds the outer contour of the ultrasonic sensor 110 too much, so based on this structure, on the other hand, the edge of the ultrasonic sensor 110 can be fixed on the adhesive layer 230 by the first fixing structure 251, thereby improving the stability of the fingerprint module 100 installed on the electronic device 200; on the other hand, since in this structure of the present application, the edge of the ultrasonic sensor 110 is fixed on the adhesive layer 230 by the first fixing structure 251, it is convenient to disassemble the fingerprint module 100 from the electronic device 200, and it is also less likely to damage the screen 220, and it is also conducive to the rework installation of the fingerprint module 100 of the electronic device 200.

[0126] Optionally, the first light-shielding structure 240 can adopt any suitable light-shielding structure, as long as it can meet the requirements. For example, the first light-shielding structure 240 can include light-shielding glue, which can be applied to the gap formed between the edge of the adhesive layer 230 and the edge of the first opening 2221, so that the light-shielding glue after curing covers the gap, thereby achieving the function of light shielding. Optionally, the curing shrinkage rate of the light-shielding glue is less than 3%. When the curing shrinkage rate of the light-shielding glue is too large, it is easy to form a pulling force on the screen 220, causing the display effect of the screen 220 to be poor, and in the present application, the light-shielding glue with a curing shrinkage rate of less than 3% is selected as the first light-shielding structure 240, which can better avoid the problem that the display effect of the screen 220 is poor due to the light-shielding glue pulling the screen 220. The present application does not make any limitation on the type of light-shielding glue, as long as it meets the requirements. For example, the light-shielding glue can adopt at least one of UV-cured adhesive (such as UV glue, i.e. shadowless glue, which needs to be cured by ultraviolet light irradiation), UV and moisture-cured adhesive, and low-temperature-cured adhesive (for example, low temperature refers to less than 100°C).

[0127] Optionally, the first fixing structure 251 can adopt any suitable fixing structure, and the fixing structure can be selected according to requirements. For example, the first fixing structure 251 can include fixing glue, and the fixing glue can be used to fix the edge of the ultrasonic sensor 110 on the adhesive layer 230 by being applied at the edge of the ultrasonic sensor 110 and the adhesive layer 230. Optionally, the curing shrinkage of the fixing glue is less than 3%. If the curing shrinkage of the fixing glue is too large, the fixing glue is likely to generate a pulling force on the screen 220, which can cause the screen 220 to have a poor display effect. In the present application, the fixing glue with a curing shrinkage less than 3% is selected as the first fixing structure 251, which can effectively avoid the problem that the fixing glue generates a pulling force on the screen 220, thereby causing the screen 220 to have a poor display effect. The present application does not limit the type of fixing glue, and any fixing glue meeting the requirements can be used. For example, the fixing glue can be at least one of UV-cured adhesive (for example, UV glue, which needs to be cured by ultraviolet irradiation), UV and moisture-cured adhesive, and low-temperature-cured adhesive (for example, the low temperature is less than 100°C).

[0128] Therefore, in some embodiments of the present application, the installation of the fingerprint module 100 between the screen 220 (non-foldable screen) can be achieved by applying two types of glue (i.e., the light-blocking glue (i.e., the first light-blocking structure 240) and the fixing glue (i.e., the first fixing structure 251)), which can meet the requirements of light blocking and module fixing.

[0129] Alternatively, in some other optional embodiments, the screen 220 in the electronic device 200 is a non-foldable screen, and the electronic device 200 further includes a second fixing structure 252 for fixing the edge of the ultrasonic sensor 110 on the screen substrate 221.

[0130] For example, in some example embodiments, referring to FIGS. 1 to 3, the screen 220 in the electronic device 200 is a non-foldable screen, the second vertical projection of the ultrasonic sensor 110 towards the screen substrate 221 along the thickness direction of the acoustic layer 112 is located in the first opening 2221, the gap D between the edge of the second vertical projection and the edge of the first opening 2221 is greater than or equal to 0.5 mm, the edge of the adhesive layer 230 does not exceed the edge of the bonding surface on the fingerprint module 100, and the electronic device 200 further includes a second fixing structure 252 for fixing the edge of the ultrasonic sensor 110 on the screen substrate 221. Figure 9B Figure 10A For example, in some example embodiments, referring to FIGS. 1 to 3, the screen 220 in the electronic device 200 is a non-foldable screen, the second vertical projection of the ultrasonic sensor 110 towards the screen substrate 221 along the thickness direction of the acoustic layer 112 is located in the first opening 2221, the gap D between the edge of the second vertical projection and the edge of the first opening 2221 is greater than or equal to 0.5 mm, the edge of the adhesive layer 230 does not exceed the edge of the bonding surface on the fingerprint module 100, and the electronic device 200 further includes a second fixing structure 252 for fixing the edge of the ultrasonic sensor 110 on the screen substrate 221.

[0131] ​Specifically, along the thickness direction of the acoustic layer 112, the second vertical projection of the ultrasonic sensor 110 towards the screen substrate 221 is located within the first opening 2221, the gap between the edge of the second vertical projection and the edge of the first opening 2221 is D≥0.5mm, and the edge of the adhesive layer 230 does not exceed the edge of the bonding surface on the fingerprint module 100 which forms the bonding with the adhesive layer 230 (the bonding surface on the fingerprint module 100 can be the surface on the ultrasonic sensor 110 (for example Figure 10B may be the surface on the ultrasonic sensor 110 away from the sensor substrate 114, the surface of the protective layer 116 in the embodiment, or the surface of the sensor substrate 114 in other optional embodiments) Figure 9B may be the surface on the ultrasonic sensor 110 away from the sensor substrate 114, the surface of the protective layer 116 in the embodiment, or the surface of the sensor substrate 114 in other optional embodiments) In this embodiment, the light shielding structure is not separately provided, but the edge of the ultrasonic sensor 110 is directly fixed on the screen substrate 221 by the second fixing structure 252. Based on such a structure, on the one hand, the edge of the ultrasonic sensor 110 can be fixed on the screen substrate 221 by the second fixing structure 252, thereby improving the stability of the installation of the fingerprint module 100 on the electronic device 200. On the other hand, the second fixing structure 252 can also improve the screen light leakage to some extent, achieve the effect of light shielding, and improve the adverse effects of screen light leakage on the display effect of the screen 220 and the appearance of the electronic device 200. On the other hand, since the light shielding structure is not separately provided, the manufacturing process of the electronic device 200 is also simplified.

[0132] Optionally, the second fixing structure 252 can adopt any suitable fixing structure, as long as it can meet the requirements. For example, the second fixing structure 252 can include fixing glue, which can be applied to the edge of the ultrasonic sensor 110 and the screen substrate 211 (for example, the fixing glue can be applied to the edge of the first opening 2221), thereby achieving the function of fixing the edge of the ultrasonic sensor 110 on the screen substrate 211. Optionally, the curing shrinkage rate of the fixing glue is less than 3%. If the curing shrinkage rate of the fixing glue is too large, it is easy to form a pulling force on the screen 220, causing the display effect of the screen 220 to be poor. However, by selecting the fixing glue with a curing shrinkage rate less than 3% as the second fixing structure 252 in the present application, the problem of poor display effect of the screen 220 caused by the fixing glue pulling the screen 220 can be well avoided. The present application does not make any limitation on the type of fixing glue, as long as it can meet the requirements. For example, the fixing glue can adopt at least one of UV-cured adhesive (for example, UV glue, which needs to be cured by ultraviolet light), UV and moisture-cured adhesive, and low-temperature-cured adhesive (for example, low temperature refers to less than 100°C).

[0133] Therefore, in some embodiments of the present application, the fingerprint module 100 can be installed between the screen 220 (non-foldable screen) by point gluing (i.e., the aforementioned fixed glue (i.e., the second fixed structure 252)), which takes into account the needs of light shielding and module fixation.

[0134] In some optional embodiments, referring to Figure 9B and Figure 11A 、 Figure 11B and Figure 12A , for the screen 220 of the electronic device 200 being a foldable screen, the screen 220 includes a support sheet 223 for supporting the screen 220, and the fingerprint module 100 is adhered to the support sheet 223 through an adhesive layer 230.

[0135] Specifically, the support sheet 223 can form the back of the screen 220. The support sheet 223 supports the screen 220 (foldable screen), and the characteristics of the foldable screen make it necessary for the screen 220 to be supported by the support sheet 223 to improve stability. The foldable screen generally does not need to be provided with a separate buffer layer, so there is no problem of the buffer layer affecting the ultrasonic wave signals sent and received by the ultrasonic sensor 110 of the fingerprint module 100. The support sheet 223 can generally be made of a material with plasticity and a certain strength, such as a metal material, for example, in some optional embodiments, the support sheet 223 can be a support steel sheet, or in other embodiments, it can also be a support copper sheet, etc., which is not specifically limited in the present application. Of course, the support sheet 223 can also be made of other suitable materials as needed.

[0136] In the present application, by adhering the fingerprint module 100 to the support sheet 223 for supporting the screen 220 through the adhesive layer 230, the fingerprint module 100 can be adhered to the back of the screen 220 without affecting the function of sending and receiving ultrasonic wave signals of the fingerprint module 100, which can improve the use effect of the fingerprint module 100 and meet the application requirements of the fingerprint module 100 in the electronic device 200 with a foldable screen.

[0137] In some optional embodiments, in the electronic device 200, the screen 220 is a foldable screen, and the electronic device 200 further includes a third fixed structure 253 for fixing the edge of the ultrasonic sensor 110 to the adhesive layer 230.

[0138] For example, in some example embodiments, referring to Figure 12B and Figure 11AAs shown, in the electronic device 200, the screen 220 is a folding screen, along the thickness direction of the acoustic layer 112, the first vertical projection of the ultrasonic sensor 110 towards the adhesive layer 230 is located in the adhesive layer 230, the gap C between the edge of the first vertical projection and the edge of the adhesive layer 230 is greater than or equal to 0.5 mm, and the electronic device 200 further comprises a third fixing structure 253 for fixing the edge of the ultrasonic sensor 110 on the adhesive layer 230.

[0139] Specifically, along the thickness direction of the acoustic layer 112, the first vertical projection of the ultrasonic sensor 110 towards the adhesive layer 230 is located in the adhesive layer 230, and the gap C between the edge of the first vertical projection and the edge of the adhesive layer 230 is greater than or equal to 0.5 mm. At this time, the outer contour of the adhesive layer 230 exceeds the outer contour of the ultrasonic sensor 110 too much, and therefore, based on this structure, on the one hand, the edge of the ultrasonic sensor 110 can be fixed on the adhesive layer 230 by the third fixing structure 253, thereby improving the stability of the fingerprint module 100 installed on the electronic device 200; on the other hand, since the edge of the ultrasonic sensor 110 is fixed on the adhesive layer 230 by the third fixing structure 253 in this structure, it is convenient to disassemble the fingerprint module 100 from the electronic device 200, and it is also less likely to damage the screen 220, and it is also conducive to the rework installation of the fingerprint module 100 of the electronic device 200.

[0140] Optionally, the third fixing structure 253 can adopt any suitable fixing structure, and the requirement can be met as appropriate. For example, the third fixing structure 253 can include fixing glue, which can be applied at the edge of the ultrasonic sensor 110 and the adhesive layer 230, thereby achieving the function of fixing the edge of the ultrasonic sensor 110 on the adhesive layer 230. Optionally, the curing shrinkage rate of the fixing glue is less than 3%. When the curing shrinkage rate of the fixing glue is too large, it is easy to form a pulling force on the screen 220, causing the display effect of the screen 220 to be poor, and in the present application, the fixing glue with a curing shrinkage rate of less than 3% is selected as the third fixing structure 253, which can better avoid the problem of poor display effect of the screen 220 caused by the fixing glue pulling the screen 220. The present application does not make any limitation on the type of fixing glue, and the requirement can be met. For example, the fixing glue can adopt at least one of UV-cured adhesive (such as UV glue, which needs to be cured by ultraviolet irradiation), UV and moisture-cured adhesive, and low-temperature-cured adhesive (for example, low temperature refers to less than 100°C).

[0141] Therefore, in some embodiments of the present application, the installation of the fingerprint module 100 between the screens 220 (folding screens) can be achieved by applying fixing glue (i.e., the aforementioned fixing glue (i.e., the third fixing structure 253)) once, which takes into account the requirements of light shielding and module fixing.

[0142] Alternatively, in some other optional embodiments, the screen 220 of the electronic device 200 is a folding screen, and the electronic device 200 further comprises a fourth fixing structure 254 for fixing the edge of the ultrasonic sensor 110 to the support sheet 223.

[0143] For example, in some example embodiments, referring to FIGS. 1-2, the screen 220 of the electronic device 200 is a folding screen, and the edge of the adhesive layer 230 does not exceed the edge of the bonding surface on the fingerprint module 100 that forms the bonding with the adhesive layer 230 (the bonding surface on the fingerprint module 100 can be the surface on the ultrasonic sensor 110 (e.g., the surface on the sensor substrate 114, the surface on the protective layer 116, or the surface on the sensor substrate 114 in other optional embodiments) that forms the bonding with the adhesive layer 230). Figure 11B and Figure 12A For example, in some example embodiments, referring to FIGS. 1-2, the screen 220 of the electronic device 200 is a folding screen, and the edge of the adhesive layer 230 does not exceed the edge of the bonding surface on the fingerprint module 100 that forms the bonding with the adhesive layer 230 (the bonding surface on the fingerprint module 100 can be the surface on the ultrasonic sensor 110 (e.g., the surface on the sensor substrate 114, the surface on the protective layer 116, or the surface on the sensor substrate 114 in other optional embodiments) that forms the bonding with the adhesive layer 230).

[0144] Specifically, the edge of the adhesive layer 230 does not exceed the edge of the bonding surface on the fingerprint module 100 that forms the bonding with the adhesive layer 230 (the bonding surface on the fingerprint module 100 can be the surface on the ultrasonic sensor 110 (e.g., the surface on the sensor substrate 114, the surface on the protective layer 116, or the surface on the sensor substrate 114 in other optional embodiments) that forms the bonding with the adhesive layer 230). Figure 12B may be the surface on the ultrasonic sensor 110 away from the sensor substrate 114, the Figure 10B surface on the protective layer 116, or the surface on the sensor substrate 114 in other optional embodiments), the edge of the ultrasonic sensor 110 can be fixed to the support sheet 223 by the fourth fixing structure 254 in the present application, thereby improving the stability of the installation of the fingerprint module 100 on the electronic device 200.

[0145] Optionally, the fourth fixing structure 254 can adopt any suitable fixing structure, and the choice can be made according to the requirements. For example, the fourth fixing structure 254 can comprise fixing glue, and the edge of the ultrasonic sensor 110 can be fixed to the support sheet 223 by applying the fixing glue at the edge of the ultrasonic sensor 110 and the support sheet 223. Optionally, the curing shrinkage rate of the fixing glue is less than 3%. When the curing shrinkage rate of the fixing glue is too large, the fixing glue is prone to form a pulling force on the screen 220, thereby causing poor display effect of the screen 220. However, the fixing glue with a curing shrinkage rate less than 3% is selected as the fourth fixing structure 254 in the present application, which can better avoid the problem of poor display effect of the screen 220 caused by the fixing glue pulling the screen 220. The present application does not make any limitation on the type of fixing glue, and the choice can be made according to the requirements. For example, the fixing glue can adopt at least one of UV curing adhesive (e.g., UV glue, i.e., invisible glue, which needs to be cured by ultraviolet irradiation), UV and moisture curing adhesive, and low-temperature curing adhesive (e.g., low temperature refers to less than 100°C).

[0146] Therefore, in some embodiments of this application, the fingerprint module 100 can be installed between the screens 220 (folding screen) by applying adhesive once (i.e., the aforementioned fixing adhesive (i.e., the fourth fixing structure 254)), which takes into account both the needs of light shielding and module fixing.

[0147] In some alternative embodiments, refer to Figure 10B Figure 7 As shown, the electronic device 200 also includes a battery 260, and the vertical projection of the fingerprint module 100 along the thickness direction of the electronic device 200 does not overlap with the battery 260. The battery in this application can power the electronic device 200 and can be a primary or secondary battery, including but not limited to lead-acid batteries, lithium-ion batteries, sodium-ion batteries, etc. Through this structure, the fingerprint module 100 and the battery 260 of the electronic device 200 do not overlap, making the fingerprint module 100 less susceptible to adverse effects from the battery 260 (such as battery compression, heat generation during battery use, etc.), thereby better meeting the functional and usage requirements of the fingerprint module 100. Furthermore, this structure can effectively reduce the thickness of the electronic device 200.

[0148] For example, in one instance, taking an electronic device 200 as a mobile phone, the fingerprint module 100 can pass through the middle frame of the phone and be placed in the non-battery area of ​​the phone, and be electrically connected to the main control circuit board of the phone (e.g., the processing unit 210 can be disposed on the main control circuit board) via an electrical connection cable, and the fingerprint module 100 does not overlap with the battery.

[0149] It is understood that the above embodiments are merely examples of fingerprint modules and electronic devices in this application, and are not intended to limit the fingerprint modules and electronic devices in this application.

[0150] It should be noted that the term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc., mentioned in this application are only used to distinguish different devices, modules, or units, and are not used to limit the order of functions performed by these devices, modules, or units or their interdependencies.

[0151] It should be noted that the terms "a" and "a plurality of" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0152] It should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same. Although the present application has been described in detail with reference to the foregoing examples, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent features. Such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A fingerprint module, characterized in that, The fingerprint module comprises: an ultrasonic sensor comprising: a first electrode layer, an acoustic layer, a second electrode layer, a protective layer, and a first electrical connection region, the second electrode layer is electrically connected to a first side of the acoustic layer along a thickness direction, the first electrode layer is electrically connected to a second side of the acoustic layer along the thickness direction, the first electrode layer and the second electrode layer are both electrically connected to the first electrical connection region, the protective layer covers a side of the second electrode layer away from the acoustic layer, the acoustic layer is used for emitting ultrasonic signals and receiving ultrasonic signals reflected by an external structure, and the first electrode layer and the second electrode layer are used for providing the acoustic layer with a voltage for emitting and receiving ultrasonic signals; a circuit board, the circuit board is provided with a second electrical connection region, and the first electrical connection region is electrically connected to the second electrical connection region through a conductive adhesive layer; the ultrasonic sensor is electrically connected to a processing unit outside the fingerprint module through the first electrical connection region, the conductive adhesive layer, and the second electrical connection region, the ultrasonic sensor is used for processing received ultrasonic signals into electrical signals and sending the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint identification based on the electrical signals; the fingerprint module further comprises a first reinforcing plate and a second reinforcing plate, wherein the first reinforcing plate is arranged on the ultrasonic sensor and extends beyond an edge of the ultrasonic sensor, the second reinforcing plate is arranged on the circuit board and extends beyond an edge of the circuit board, and a part of the first reinforcing plate extending beyond the edge of the ultrasonic sensor is connected to a part of the second reinforcing plate extending beyond the edge of the circuit board.

2. The fingerprint module of claim 1, wherein, The ultrasonic sensor further comprises a sensor substrate, and the first electrode layer is formed on the sensor substrate. A second side of the acoustic layer along the thickness direction is attached to the first electrode layer, and the first electrode layer is located within an outer contour of the acoustic layer.

3. The fingerprint module of claim 2, wherein, On the sensor substrate, the first electrode layer and the first electrical connection region are located on the same side of the sensor substrate along the thickness direction, and there is a spacing between the first electrode layer and the first electrical connection region to form a blank area on the sensor substrate. The first reinforcing plate is arranged in the blank area, and a thickness T1 of the first reinforcing plate satisfies 30um≤T1≤100um.

4. The fingerprint module of claim 3, wherein, The second reinforcing plate and the second electrical connection region are arranged on the same side of the circuit board along the thickness direction, and the second reinforcing plate and the second electrical connection region are not in contact; and a thickness T2 of the second reinforcing plate satisfies 30um≤T2≤100um.

5. The fingerprint module according to any one of claims 1-4, wherein, Along the thickness direction of the acoustic layer, a thickness H of the fingerprint module satisfies H<0.3mm.

6. The fingerprint module according to any one of claims 1-4, wherein, The fingerprint module satisfies at least one of the following conditions: The circuit board comprises an FPC circuit board; the acoustic layer comprises a piezoelectric material; the conductive adhesive layer comprises an ACF conductive adhesive film; and the ultrasonic sensor comprises a COMS ultrasonic sensor.

7. An electronic device, comprising: The fingerprint module comprises: a processing unit, a screen, and the fingerprint module according to any one of claims 1-6. The electronic device further comprises an adhesive layer, and the fingerprint module is attached to the back of the screen through the adhesive layer.

8. The electronic device of claim 7, wherein, The screen is a non-foldable screen, and the screen comprises a screen substrate and a buffer layer, the buffer layer being installed on the screen substrate, and the buffer layer being used for buffering the screen. The buffer layer is provided with a first opening, the adhesive layer is located in the first opening and attached to the screen substrate, and the fingerprint module is attached to the screen substrate through the adhesive layer.

9. The electronic device of claim 8, wherein The electronic device further comprises a first light-shielding structure and a first fixing structure, wherein the first light-shielding structure is used for covering a gap formed between an edge of the adhesive layer and an edge of the first opening, and the first fixing structure is used for fixing an edge of the ultrasonic sensor on the adhesive layer. Alternatively, The electronic device further comprises a second fixing structure, and the second fixing structure is used for fixing the edge of the ultrasonic sensor on the screen substrate.

10. The electronic device of claim 7, wherein, The screen is a foldable screen, and the screen comprises a support sheet, and the support sheet is used for supporting the screen. The fingerprint module is attached to the support sheet through the adhesive layer.

11. The electronic device of claim 10, wherein The electronic device further comprises a third fixing structure, and the third fixing structure is used for fixing the edge of the ultrasonic sensor on the adhesive layer. Alternatively, The electronic device further comprises a fourth fixing structure, and the fourth fixing structure is used for fixing the edge of the ultrasonic sensor on the support sheet.

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