Display device

Abstract

A display device is disclosed, comprising: a display panel, comprising a display area and a non-display area surrounding the display area; a back plate, disposed on one surface of the display panel and comprising a first ground path unit; and a heat dissipation plate, disposed on the back side of the back plate and comprising a second ground path unit, wherein the first ground path unit covers at least each corner of the back plate, and wherein the second ground path unit overlaps with the first ground path unit in a vertical direction.

Description

Technical Field

[0001] The present disclosure relates to a display device, and to a display device capable of preventing deterioration of the quality of a display panel due to static electricity in a vehicle display device. Background Art

[0002] Display devices are being used in various electronic devices such as televisions, mobile phones, notebook computers, and tablet computers. For this reason, research is continuing to develop thinner, lighter, and lower-power-consuming display devices.

[0003] Display devices may include liquid crystal display devices (LCDs), plasma display devices (PDPs), field emission display devices (FEDs), electrowetting display devices (EWDs), and organic light emitting display devices (OLEDs).

[0004] An organic light-emitting display (OLED) includes a plurality of pixel regions arranged in a display area for displaying an image, and a plurality of organic light-emitting elements corresponding to the plurality of pixel regions. Because organic light-emitting elements are self-luminous, they can have faster response speeds, higher luminous efficiency, higher brightness, a wider viewing angle, and superior contrast and color gamut compared to liquid crystal displays.

[0005] Due to the aforementioned advantages of organic light-emitting display devices, OLEDs are widely used not only in electronic devices such as televisions, mobile phones, and laptops, but also in other electronic devices. As the electrification of vehicles accelerates, the application of organic light-emitting display devices in vehicle user interfaces is increasing. For example, organic light-emitting display devices are used to implement vehicle displays, such as vehicle dashboards (or instrument panels) that provide necessary information to the driver, as well as navigation or audio multimedia information.

[0006] In display devices for vehicles, including vehicle instrument panels, user convenience and safety must be considered. Therefore, it is important to provide high-quality display panels. Summary of the Invention

[0007] An object according to one embodiment of the present disclosure is to provide a display device that can prevent deterioration of the quality of a display panel due to static electricity generated in a process of peeling off a release film before bonding a back plate and a display panel to each other.

[0008] Furthermore, an object according to one embodiment of the present disclosure is to provide a display device capable of improving heat dissipation function, and the display device can effectively dissipate heat generated by a display panel when a vehicle is traveling.

[0009] Furthermore, an object according to one embodiment of the present disclosure is to provide a display device capable of absorbing or alleviating vibration or shock transmitted to a display panel when a vehicle is traveling.

[0010] The purpose of the present disclosure is not limited to the above-mentioned purpose. Other purposes and advantages not mentioned in the present disclosure can be understood based on the following description and can be more clearly understood based on the embodiments of the present disclosure. In addition, it will be easily understood that the purposes and advantages of the present disclosure can be achieved using the means shown in the claims and their combinations.

[0011] A display device according to one embodiment of the present disclosure includes: a display panel, including a display area and a non-display area; a back plate, provided on one surface of the display panel and including a first ground path unit; and a heat dissipation plate, provided on a back surface of the back plate and including a second ground path unit, wherein the first ground path unit covers at least each corner of the back plate, and the second ground path unit is provided to overlap with the first ground path unit in a vertical direction.

[0012] According to one embodiment of the present disclosure, a first ground path unit provided on the back plate and a second ground path unit provided on the heat dissipation plate can be introduced to discharge static electricity generated during the process of peeling off the release film before bonding the back plate and the display panel to each other to the outside.

[0013] Therefore, static electricity can be prevented from flowing into the display panel, thereby preventing the generation of an electrostatic induction area, so that the quality of the display panel can be uniform.

[0014] Furthermore, disposing the first ground path unit on the edge region of the back plate so as not to overlap with the display region of the display panel may provide an advantage of preventing a yellowing or greening phenomenon of the display panel.

[0015] Furthermore, a plurality of second ground path units having a groove shape may be formed in the metal substrate of the heat dissipation plate, thereby increasing the exposed surface area of ​​the metal substrate and thus improving the heat dissipation effect.

[0016] Furthermore, a plurality of second ground path units having a groove shape may be formed in the metal substrate of the heat dissipation plate, thereby preventing or reducing vibration and impact from being transferred to the light emitting element layer of the display panel.

[0017] Furthermore, the thickness of the first ground path unit may be greater than that of the display panel, and the display panel may be disposed inside the first ground path unit, thereby absorbing and reducing vibration or impact transmitted to the side of the display panel when the vehicle travels.

[0018] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects that are not mentioned will be clearly understood by those skilled in the art through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a diagram illustrating an application configuration of a display device according to one embodiment of the present disclosure.

[0020] Figures 2 to 4 is a diagram illustrating an electrostatic induction area defect that may occur in a display panel.

[0021] Figures 5 to 7B is a diagram illustrating a display device according to an embodiment of the present disclosure.

[0022] Figures 8A to 8C is a diagram illustrating a first ground path unit according to an embodiment of the present disclosure.

[0023] Figure 9 It shows Figure 7B A cross-sectional view of the display device along the II' direction.

[0024] Figure 10 yes Figure 9 Top view of the heat sink.

[0025] Figure 11 is a diagram showing another example of a heat sink. DETAILED DESCRIPTION

[0026] The advantages and features of the present disclosure, as well as methods for achieving these advantages and features, will become apparent by reference to the embodiments described in detail later in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but may be implemented in a variety of different forms. Therefore, these embodiments are set forth only to complete the present disclosure and fully inform those skilled in the art of the present disclosure of its scope, and the present disclosure is limited only by the scope of the claims.

[0027] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for describing the embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto. In this article, the same reference numerals refer to the same elements. In addition, for the sake of brevity, the descriptions and details of well-known steps and elements are omitted. In addition, in the following detailed description of the present disclosure, many specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it should be understood that the present disclosure can be practiced without these specific details. In other cases, well-known methods, procedures, components and circuits are not described in detail to avoid unnecessarily blurring the various aspects of the present disclosure.

[0028] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular constructions "one" and "an" are intended to also include plural constructions, unless the context clearly indicates otherwise. It should be further understood that when used in this specification, the terms "include", "comprise" specify the presence of the features, integers, operations, elements and / or parts described, but do not exclude the presence or addition of one or more other features, integers, operations, elements, parts and / or parts thereof. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. For example, when the expression "at least one" is present before a list of elements, the entire list of elements may be modified without modifying the individual elements in the list. In the interpretation of numerical values, errors or tolerances may occur therein even if there is no clear description.

[0029] Furthermore, it should be understood that when a first element or layer is referred to as being “on” a second element or layer, the first element can be directly disposed on the second element or can be indirectly disposed on the second element or layer in such a way that a third element or layer is disposed between the first and second elements or layers. It should be understood that when an element or layer is referred to as being “connected to” or “coupled to” another element or layer, it can be directly located, connected to, or coupled to the other element or layer, or one or more intervening elements or layers may be present. It should be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may be present.

[0030] Furthermore, as used herein, when a layer, film, region, plate, etc. is disposed “on” or “on top of” another layer, film, region, plate, etc., the former may be in direct contact with the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed directly “on” or “on top of” another layer, film, region, plate, etc., the former may be in direct contact with the latter and another layer, film, region, plate, etc. may not be disposed between the former and the latter. Furthermore, as used herein, when a layer, film, region, plate, etc. is disposed “under” or “beneath” another layer, film, region, plate, etc., the former may be in direct contact with the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed directly “under” or “beneath” another layer, film, region, plate, etc., the former may be in direct contact with the latter and another layer, film, region, plate, etc. may not be disposed between the former and the latter.

[0031] In descriptions of a temporal relationship, such as a temporal precedent relationship between two events, such as "after," "subsequently," "before," etc., another event can occur between the two events unless "directly after," "directly subsequent," or "directly before" is not specified.

[0032] It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or part from another element, component, region, layer, and / or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, component, region, layer, and / or part described below may be referred to as a second element, component, region, layer, and / or part.

[0033] The features of the various embodiments of the present disclosure may be combined with each other in part or in whole, and may be technically associated with each other or operate with each other. These embodiments may be implemented independently of each other, or may be implemented together in an associated relationship.

[0034] When interpreting numerical values, the values ​​are interpreted as including the error range unless otherwise explicitly stated.

[0035] It will be understood that when an element or layer is referred to as being “connected to” or “coupled to” another element or layer, it can be directly connected or coupled to the other element or layer, or one or more intervening elements or layers may be present. Additionally, it will be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may be present.

[0036] The features of the various embodiments of the present disclosure may be combined with each other in part or in whole, and may be technically associated with each other or operate with each other. These embodiments may be implemented independently of each other, or may be implemented together in an associated relationship.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present inventive concept belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0038] Figure 1 is a diagram illustrating an application configuration of a display device according to one embodiment of the present disclosure. Figures 2 to 4 A diagram illustrating an electrostatic induction area defect occurring in a display panel.

[0039] Reference Figure 1The display device according to one embodiment of the present disclosure can be applied to a vehicle dashboard DP1, a navigation device DP2, a center panel DP3, or an interior rearview mirror display DP4 installed in a vehicle. Furthermore, although not shown in the figures, the display device can be installed in any location where a display device can be applied. For example, the display device can be applied as a side mirror or a head-up display in a vehicle to provide information to the driver.

[0040] When a display device is installed inside a vehicle, its display panel is constantly exposed to vibration and shock due to the characteristics of the vehicle's driving environment. Furthermore, when the vehicle is driving outdoors, the display device must be able to accurately convey necessary information to the driver while being exposed to sunlight. Therefore, the display panel must be able to provide a uniform image quality even when subjected to vibration and shock, and even when the display device is exposed to sunlight.

[0041] A large-area display panel introduced into a vehicle display device may include a substrate made of a plastic material having excellent elasticity. In one example, the substrate of the display panel may include a flexible plastic material such as polyimide (PI). Substrates including plastic materials are very thin, making it difficult to handle the substrate. To this end, a glass substrate serving as a support substrate may be disposed below the plastic material substrate, and then pixels and drive circuit elements may be formed on the plastic material substrate, from which the glass substrate may then be removed.

[0042] For example, circuit elements for driving a display panel including pixels may be formed on a display substrate comprising a plastic material. An encapsulation process may then be performed to protect the components, followed by a laser lift-off (LLO) process in which a laser is irradiated onto the bottom of a glass substrate to remove the display substrate from the glass substrate. Because the display substrate separated from the glass substrate is very thin and difficult to handle, a backplane, which can serve as a support for securing the display device inside a vehicle, may be attached to the bottom of the display substrate of the display panel.

[0043] Reference Figures 2 to 4 The backplane 20 may be configured to include a base substrate 10 and an adhesive layer 15 provided on one surface of the base substrate 10. The base substrate 10 of the backplane 20 may be made of a PET film having high thermal stability and relatively high mechanical strength. Until the backplane 20 is attached to the display panel, the backplane 20 may have a release film 25 attached thereto via the adhesive layer 15 provided on one surface thereof and a protective film 30 attached to the other surface opposite to the one surface of the base substrate 10. In this regard, the release film 25 is used to prevent foreign matter from adhering to the adhesive layer 15 until the backplane 20 is attached to the display panel.

[0044] Next, the release film 25 is peeled off from the adhesive layer 15 of the back sheet 20, and the protective film 30 is peeled off from the back sheet 20. Figure 3 As shown, the adhesive layer 15 of the back plate 20 is attached to the other surface opposite to the one surface of the display panel 40 where the display area is provided.

[0045] However, during the process of peeling the release film 25 from the adhesive layer 15 of the backsheet 20, the adhesive layer 15 and the release film 25, which were in close contact with each other, separate from each other, causing the charge to be separated into two areas, resulting in the accumulation of charge on the backsheet 20. This causes a difference in the amount of static electricity generated by the pressure applied to the release film 25. In particular, the smaller the area of ​​the release film 25 that remains, the greater the pressure applied to the release film 25. As a result, the amount of charge increases, and the static electricity increases.

[0046] Static electricity, which is a fixed unstable charge, may flow into the display panel 40 along the back plate 20 and may damage the organic light emitting element and the circuit elements for driving the organic light emitting element. In addition, when an image is displayed on the display panel 40 in a state where static electricity is not removed, as shown in FIG. Figure 4 As shown in FIG. 1 , a strip-shaped area A may appear on the screen. In particular, when Figure 4 When the release film is removed as shown by the arrow in FIG, a band-like area A may appear at the opposite corners because the area of ​​the release film remaining during the removal process becomes narrower.

[0047] The band-shaped area A may reduce the quality of images provided by a vehicle display device (e.g., a vehicle dashboard or navigation device) located within the vehicle. For example, the brightness of the image provided by the display panel may decrease. When the brightness of the image decreases, it becomes difficult to accurately provide the necessary information to the driver. This may affect the reliability of the display device and the stability of the vehicle's driving.

[0048] Therefore, embodiments of the present disclosure are directed to providing a display device capable of improving the reliability of image quality by removing static electricity accumulated in a process of peeling a release film from an adhesive layer of a back plate.

[0049] Hereinafter, a display device according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0050] Figures 5 to 7B is a diagram illustrating a display device according to an embodiment of the present disclosure. Figures 8A to 8C is a diagram illustrating a first ground path unit according to an embodiment of the present disclosure. Figure 9 It shows Figure 7B A cross-sectional view of the display device along the II' direction. Figure 10 is a top view of a heat dissipation plate according to the present disclosure. Figure 11 is a diagram showing another example of a heat sink.

[0051] In this regard, Figure 5 is an exploded perspective view schematically illustrating a display device according to an embodiment of the present disclosure. Figure 6 is an enlarged cross-sectional view of the display panel. Figure 7A and Figure 7B FIG. 1 is a diagram illustrating a display device including a first ground path unit and a second ground path unit.

[0052] Reference Figures 5 to 7B The display device according to one embodiment of the present disclosure may include a display panel P, a back plate 151 including a first ground path unit 200 disposed in a non-display area NA of the display panel P, and a heat dissipation plate 155 having a second ground path unit 157a.

[0053] The display panel P may include a display area AA for displaying an image and a non-display area NA. The non-display area NA may be an area surrounding the display area AA where no image is displayed. The non-display area NA may be referred to as a bezel area. The driver integrated circuit 175 and the like may be disposed in the non-display area NA of the display panel P, and a ground terminal GND may be disposed in the non-display area NA.

[0054] In an embodiment of the present disclosure, the driving integrated circuit 175 may be implemented as a chip on film (COF) directly mounted on the display panel P. However, the present disclosure is not limited thereto.

[0055] The back plate 151 having the first ground path unit 200 may be disposed on a rear surface of the display panel P opposite to a front surface where a display area AA where an image is displayed is disposed. Figure 7B , the first ground path unit 200 may be disposed to be in contact with each of the four side surfaces of the display panel P.

[0056] The back plate 151 may be configured to include a base substrate 145 and an adhesive layer 150 disposed on the front surface of the base substrate 145. The back plate 151 may be disposed on the back surface of the display panel P to supplement the rigidity of the display panel. To this end, the base substrate 145 of the back plate 151 may include a PET film having high mechanical strength and high thermal stability. The adhesive layer 150 disposed on the front surface of the base substrate 145 is used to secure the display panel P and the back plate 151 together.

[0057] The heat dissipation plate 155 having the second ground path unit 157a may be provided on the back surface of the back plate 151. In addition, the guide holder 160 may be provided on the back surface of the heat dissipation plate 155. The guide holder 160 may be a guide member for connecting the display panel P with the vehicle instrument panel DP1 (see FIG. Figure 1), components that mechanically combine the navigation device DP2, the middle panel DP3, or the display device DP4 with each other. In one example, the guide holder 160 may include a space (not shown) defined on the back side thereof, to which the circuit board 170 may be attached.

[0058] The circuit board 170 may be implemented as a flexible printed circuit board (FPCB) and may be attached to the guide holder 160. In another example, the circuit board 170 may be directly mounted on the display panel P or attached to the display panel P.

[0059] Referring to the enlarged display panel P Figure 6 , the display panel P applied to the embodiment of the present disclosure may include a light emitting array 113. The light emitting array 113 may include a display substrate 100 and a pixel array 105 provided on the display substrate. The display substrate 100 may be configured to include a plastic material having flexibility, such as polyimide (PI). The pixel array 105 may be implemented in the form of various elements for displaying images. The pixel array 105 may include a plurality of pixels 105a, 105b, and 105c, which are provided in pixel areas defined by signal lines on the display substrate 100 and display images based on signals provided to the signal lines. The signal lines may include gate lines, data lines, and pixel driving power lines.

[0060] Each of the plurality of pixels 105a, 105b, and 105c may include a thin film transistor in each pixel region, an anode electrically connected to the thin film transistor, a light emitting element layer formed on the anode, and a cathode electrically connected to the light emitting element layer.

[0061] A thin film transistor may include a gate, a semiconductor layer, a source electrode, and a drain electrode. The semiconductor layer of the thin film transistor may include silicon, such as amorphous silicon, polycrystalline silicon, or low-temperature polycrystalline silicon, or an oxide semiconductor, such as IGZO (indium gallium zinc oxide).

[0062] The anode electrode may be disposed to correspond to an opening area defined according to a pattern shape of each pixel 105 a , 105 b , and 105 c in each pixel area and may be electrically connected to the thin film transistor.

[0063] The light emitting element layer may include, for example, a plurality of organic light emitting elements formed on an anode. The organic light emitting elements may be implemented to emit light of different colors, such as red, green, and blue, from different pixels, or to emit light of the same color, such as white light, from different pixels.

[0064] The cathode may be commonly connected to the organic light emitting elements of the light emitting element layer provided in the pixel region. The encapsulation member 110 may be formed on the display substrate 100 to cover the pixel array 105, thereby preventing oxygen, moisture, or foreign matter from invading the organic light emitting elements of the pixel array 105. The encapsulation member 110 may be formed, for example, as a multilayer structure in which organic insulating material layers and inorganic insulating material layers are alternately stacked.

[0065] The cover member 140 may be disposed on the packaging member 110. Since the cover member 140 includes a display area for displaying a picture, the cover member may be made of a transparent material to display the picture. For example, the cover member 140 may include a transparent plastic material, a glass material, or a reinforced glass material.

[0066] The optical functional film 135 may be disposed between the packaging member 110 and the cover member 140. The optical functional film 135 may have a form of stacking one or more functional layers. In one example, the optical functional film 135 may include a polarizing film 115, a touch panel 125, and a light control film 130.

[0067] Polarizing film 115 can prevent reflection of external light to improve the visibility and contrast of information displayed on display panel P. When the driver touches display panel P with his finger, touch panel 125 can sense the touch position and send the position to the system. Light control film 130 can control the angle of light emitted from display panel P to prevent the viewing angle from increasing in an unnecessary direction.

[0068] Adhesive fixing members 120a, 120b, and 120c of transparent material may be respectively disposed between polarizing film 115 and touch panel 125, between touch panel 125 and light control film 130, and between light control film 130 and cover member 140. Adhesive fixing members 120a, 120b, and 120c are used to adhere one or more functional layers to each other.

[0069] Each of the adhesive fixing members 120a, 120b, and 120c may be formed by coating a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0070] Reference Figure 7A and Figure 7B The back plate 151 including the first ground path unit 200 may be disposed between the display panel P and the heat dissipation plate 155 including the second static path unit 157a. The display panel P includes a display area AA for displaying an image and a non-display area NA. A plurality of ground terminals GND may be disposed in the non-display area NA of the display panel P.

[0071] Since the display panel P includes a display substrate including a flexible plastic material, the back plate 151 is provided on the rear surface of the display panel P so that the display panel P is fixed to the interior of the vehicle while maintaining its shape.

[0072] The back plate 151 includes a base substrate 145 and an adhesive layer 150 disposed on the front surface of the base substrate 145. The adhesive layer 150 may be as follows: Figure 9 The display panel P and the back plate 151 are fixed together as shown.

[0073] The back plate 151 may include a main area MA1 and an edge area FA1 surrounding the main area MA1. In one example, the main area MA1 of the back plate 151 may have the same size as the display area AA of the display panel P. The edge area FA1 of the display panel P may have the same size as the non-display area NA. However, the present disclosure is not limited thereto. In another example, the main area MA1 of the back plate 151 may have a size that is at least larger than the display area AA of the display panel P.

[0074] In the embodiment of the present disclosure, for ease of explanation, the back plate 151 is shown as having a rectangular shape. However, the present disclosure is not limited thereto. In another example, when the display panel P is formed to have a curved shape, the back plate 151 may also be formed to have a curved shape.

[0075] The first ground path unit 200 is provided on the edge area FA1 of the back plate 151. The first ground path unit 200 may cover at least the four corners in the edge area FA1 of the back plate 151. In this regard, the first ground path unit 200 may extend from the top surface of the adhesive layer 150 of the back plate 151 toward the base substrate 145. Therefore, the conductive portion may extend from the display panel P to the base substrate 145 of the back plate 151 to form a ground path that can discharge static electricity to the outside. In one example, the first ground path unit 200 may extend to a portion of the back surface of the base substrate 145. In addition, as Figure 7B As shown, the first ground path unit 200 may be disposed in contact with the outer surface of the display panel P. In addition, the first ground path unit 200 has a thickness such that the first ground path unit 200 may protrude a predetermined vertical dimension from the surface of the adhesive layer 150 of the back plate 151. This will be described in detail later.

[0076] The first ground path unit 200 may include a conductive polymer material. In one example, the first ground path unit 200 may be configured to include a conductive polymer material, such as PEDOT (poly(3,4-ethy-lenedioxythiophene)) or a polymer including carbon black. To this end, the first ground path unit 200 may be formed by applying the conductive polymer material to the edge region FA1 of the back plate 151, or by attaching a tape including the conductive polymer material to the edge region FA1.

[0077] The first ground path unit 200 may be formed to have various shapes while covering at least four corners in the edge area FA1 of the back plate 151 .

[0078] Figures 8A to 8C Various examples of the shape of the first ground path unit according to the embodiment of the present disclosure are shown.

[0079] Reference Figure 8A According to the example, the first ground path unit 200a can cover at least the four corners in the edge area FA1 of the back plate 151. When viewed from above, the first ground path unit 200a can have an "L" shape or an "inverted L" shape. In this regard, the first ground path unit 200a can extend from the top surface of each corner of the back plate 151 to its side surface. In other words, according to Figure 8A The first ground path unit 200 a of the example extends from the top surface of the adhesive layer 150 of the back plate 151 toward the base substrate 145 .

[0080] In addition, refer to Figure 8B According to another example, the first ground path unit 200b may cover the entire edge area FA1 of the back plate 151 and may be provided to have a rectangular ring shape in a plan view. Therefore, the surface of the adhesive layer 150 on the main area MA1 of the back plate 151 may be exposed.

[0081] Reference Figure 8C According to yet another example, the first ground path unit 200 c has a triangular pattern shape in a plan view, while covering at least four corners in the edge area FA1 of the back plate 151 .

[0082] In other words, each of the first ground path units 200a, 200b, and 200c may be disposed in a region where a maximum amount of triboelectric charges may be generated, thereby discharging excess charges on the back plate to the outside and thereby preventing static electricity from being generated.

[0083] In addition, if Figure 9As shown, since the thickness of each of the first ground path units 200a, 200b, and 200c is greater than the thickness of the display panel P, the vertical height of the top surface thereof may be set to be higher than the vertical height of the top surface of the display panel P.

[0084] In one example, each of the first ground path units 200 a, 200 b, and 200 c as described above is disposed in a region corresponding to the non-display area NA except for the display area AA of the display panel P. The conductive polymer may be denatured over time due to a chemical reaction with the adhesive layer 150 or exposure to ultraviolet (UV) light, resulting in a yellowing or greenish phenomenon.

[0085] Therefore, when each of the first ground path units 200a, 200b, and 200b is arranged to extend into the display area AA, a viewer may visually perceive a yellowing or greening phenomenon through the display area AA. This yellowing or greening phenomenon may degrade image quality, making it difficult to provide accurate information to the driver. Therefore, each of the first ground path units 200a, 200b, and 200b may be arranged only in an area corresponding to the non-display area NA of the display panel P, thereby preventing degradation of the display panel P's quality due to the yellowing or greening phenomenon.

[0086] Refer again Figure 9 The display panel P can be fixed to the back plate 151 via the adhesive layer 150. In this regard, since the thickness of the first ground path unit 200 is greater than that of the display panel, the display panel P can be disposed inside the first ground path unit 200. Therefore, the first ground path unit 200 can absorb and mitigate vibration or impact transmitted to the side of the display panel when the vehicle is traveling.

[0087] The heat dissipation plate 155 may be provided on the back surface of the back plate 151. The heat dissipation plate 155 may dissipate heat generated when the display panel P is in operation. When the display panel P is driven to display an image, the light emitting array 113 (see FIG. 114 ) Figure 6 ) generates heat. When such heat continues to remain on the display panel P, the color to be achieved may change or an afterimage may appear. Therefore, a heat dissipation plate 155 may be provided instead of the cover member 140 or the display substrate 100 having relatively low thermal conductivity to dissipate heat from the display panel P.

[0088] The heat dissipation plate 155 may have the same shape as the display panel P or the back panel 151. For example, when each of the display panel P and the back panel 151 has a rectangular shape, the heat dissipation plate 155 may also be formed to have a rectangular shape. When each of the display panel P and the back panel 151 is formed to have a curved shape, the heat dissipation plate 155 may also be formed to have a curved shape. In addition, the heat dissipation plate 155 may have the same size as the display panel P or the back panel 151. The heat dissipation plate 155 may include an edge area FA2 and a main area MA2 surrounded by the edge area FA2.

[0089] Reference Figure 9 and Figure 10 , the heat dissipation plate 155 having the second ground path unit 157a may include a structure in which a black ink layer 156 is provided on each of the top and bottom surfaces of the metal substrate 157. The metal substrate 157 may include but is not limited to aluminum (Al). The metal substrate 157 may include a metal material with high thermal conductivity, such as gold (Au), copper (Cu), etc. The metal substrate 157 may have a thickness dimension such that the substrate 157 can complement the rigidity of the display panel P including a flexible material together with the back plate 151. The black ink layer 156 may include a material that contributes to heat dissipation and is therefore provided on each of the two surfaces (top and bottom surfaces) of the metal substrate 157 that are opposite in the vertical direction to improve the heat dissipation effect. The black ink layer 156 may be set to have a predetermined thickness to improve the heat dissipation effect. In one example, the black ink layer 156 may include carbon black.

[0090] The second ground path unit 157a is provided on the edge area FA2 of the heat dissipation plate 155. The edge area FA2 of the heat dissipation plate 155 may be provided to surround the four sides of the main area MA2 of the heat dissipation plate 155. In this regard, the size of the main area MA2 of the heat dissipation plate 155 may be the same as the size of the main area MA1 of the back plate 151 or larger than the size of the main area MA1 of the back plate 151. In addition, the size of the edge area FA2 of the heat dissipation plate 155 may be larger than the size of the edge area FA1 of the back plate 151.

[0091] The second ground path unit 157a may include a first portion 157e and a second portion 157f. The first portion 157e includes a groove formed by partially removing the black ink layer 156 and the metal substrate 157. The groove of the first portion 157e may have a first depth d and a first width w1 to the surface of the metal substrate 157 of the heat sink 155. The second portion 157f is formed by removing the black ink layer 156 from the outermost portion of the edge region FA2 facing the bottom surface 201 of the first ground path unit 200 to partially expose the surface of the metal substrate 157. The second portion 157f of the second ground path unit 157a may be formed to partially expose the surface of the metal substrate 157 in the outermost portion of the edge region FA2 of the heat sink 155, allowing the exposed surface of the metal substrate 157 to contact the bottom surface 201 of the first ground path unit 200, thereby discharging static electricity to the outside. This forms a ground path through which static electricity can be discharged.

[0092] Since the first portion 157e of the second ground path unit 157a is formed into a groove shape defined in the surface of the metal substrate 157, the surface of the metal substrate 157 can be exposed through the bottom surface and both side surfaces of the groove. Therefore, the exposed surface area of ​​the metal substrate 157 can be increased, thereby enhancing the heat dissipation effect. In addition, the black ink layer 156 can be retained at least in the main area MA1, thereby improving the heat dissipation effect.

[0093] In one example, if Figure 10 As shown, the second ground path unit 157a can be arranged to surround the four sides of the heat sink 155 and extend along the edge area FA2. The first portion 157e of the second ground path unit 157a can have a groove shape, which can include one or more grooves. The grooves adjacent to the second ground path unit 157a can be arranged to be spaced apart from each other by a predetermined distance. Therefore, when viewed from above, each of the multiple grooves of the second ground path unit 157a can have a rectangular ring shape.

[0094] Static electricity can be discharged to the outside through the ground terminal GND provided on the display panel P via the first ground path unit 200 provided on the back plate 151. Alternatively, the conductive portion of the first ground path unit 200 can extend from the display panel P to the base substrate 145 of the back plate 151, and the bottom surface 201 of the first ground path unit 200 can be connected to the second ground path unit 157a provided on the heat dissipation plate 151, so that the charge can be discharged to the outside of the heat dissipation plate 151. In other words, the first ground path unit 200 and the second ground path unit 157a can constitute a combined ground path through which static electricity can be discharged to the outside.

[0095] The display device according to the present disclosure may be upright inside a vehicle. In this case, vibration and impact may be applied in an upward direction from the heat dissipation plate 155 of the display panel P to the display panel P or in a lateral direction.

[0096] Since the second ground path unit 157a is formed to include one or more groove-shaped first portions 157e having a first width w1 and defined in the surface of the metal substrate 157, a space of the size of the first width w1 can be ensured. The space defined in the grooves can serve as a shock-absorbing layer that can reduce damage that may occur when vibration and impact applied upward or laterally during vehicle travel are transmitted to the light-emitting element layer of the display panel P. Therefore, it is preferable to retain the black ink layer 156 in the edge region FA2 of the heat dissipation plate 155, excluding the outermost portion in contact with the first ground path unit 200.

[0097] When the plurality of first portions 157 e of the second ground path unit 157 a are disposed in the edge area FA2 of the heat dissipation plate 155 , the first portion 157 e disposed adjacent to the main area MA2 of the heat dissipation plate 155 is disposed in an area corresponding to the edge area FA1 of the back plate 155 .

[0098] When the first portion 157 e of the second ground path unit 157 a is disposed on the main area MA1 and does not exist in the edge area FA1 of the back plate 155 , the first portion 157 e may be exposed to the driver in a direction toward the display panel P. Therefore, the first portion 157 e of the second ground path unit 157 a is preferably disposed in an area corresponding to the edge area FA1 of the back plate 155 .

[0099] Figure 11 Another example of the second ground path unit according to an embodiment of the present disclosure is shown. Figure 11 In, with Figure 10 Like reference numerals denote like components, and thus description thereof will be simplified.

[0100] Reference Figure 11 The second ground path unit 157b may have a black ink layer pattern including a plurality of opening areas, which are formed by removing the surface of the black ink layer 156 of the heat dissipation plate 155 by a second width w2 to partially expose the surface of the metal substrate. The plurality of opening areas may include upper surfaces having the same height. The second ground path unit 157b may serve as a path for discharging static electricity to the outside through the exposed surface of the metal substrate 157. For example, Figure 9 As shown, static electricity may be discharged to the outside through contact between the bottom surface 201 of the first ground path unit 200 and the exposed outermost portion of the metal substrate 157 in the edge area FA2 of the heat dissipation plate 155 .

[0101] The second ground path unit 157b may be disposed on the edge area FA2 of the heat dissipation plate 155 and may extend along four sides of the area FA2. At least one or more of the plurality of second ground path units 157b may be horizontally arranged and spaced apart from each other by a predetermined interval.

[0102] The second ground path unit 157b is provided on the edge area FA2 of the heat dissipation plate 155. The edge area FA2 of the heat dissipation plate 155 may be provided to surround the four sides of the main area MA2 of the heat dissipation plate 155. In this regard, the size of the main area MA2 of the heat dissipation plate 155 may be the same as the size of the main area MA1 of the back plate 151 or larger than the size of the main area MA1 of the back plate 151. In addition, the size of the edge area FA2 of the heat dissipation plate 155 may be larger than the size of the edge area FA1 of the back plate 151.

[0103] The second ground path unit 157 b disposed on the edge area FA2 of the heat dissipation plate 155 may be disposed in a region corresponding to the edge area FA1 of the back plate 155 such that the second ground path unit 157 b is not exposed to the driver.

[0104] According to one embodiment of the present disclosure, a first ground path unit is provided at the edge of the backplate so as not to overlap with the display area of ​​the display panel. A second ground path unit, provided at the edge of the heat sink and in contact with the first ground path unit, can be introduced to discharge static electricity generated during the process of peeling off the release film before joining the backplate and display panel to the outside. This prevents static electricity from flowing into the display panel and generating an electrostatic induction zone, thereby ensuring uniform quality of the display panel.

[0105] Furthermore, disposing the first ground path unit on the edge area of ​​the backplate so as not to overlap with the display area of ​​the display panel can provide an advantage in preventing the display panel from turning yellow or green. Furthermore, a plurality of second ground path units having a groove shape can be formed in the metal substrate of the heat dissipation plate, thereby increasing the exposed surface area of ​​the metal substrate and thus improving the heat dissipation effect.

[0106] Furthermore, multiple second ground path elements with groove shapes can be formed in the metal substrate of the heat sink, thereby preventing or reducing the transmission of vibration and impact to the light-emitting element layer of the display panel. Furthermore, the thickness of the first ground path element can be greater than that of the display panel, and the display panel can be positioned inside the first ground path element, thereby absorbing and reducing vibration or impact transmitted to the sides of the first ground path element during vehicle driving.

[0107] The scope of protection of the present disclosure should be interpreted by the scope of the claims, and all technical concepts within the equivalent scope should be understood to be included in the scope of the present disclosure. Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments. The present disclosure can be implemented in various modified ways without departing from the scope of the technical concept of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical concept of the present disclosure, but are used to describe the present disclosure. The scope of the technical concept of the present disclosure is not limited by the embodiments. Therefore, it should be understood that the above embodiments are illustrative and not restrictive in all aspects. The scope of protection of the present disclosure should be interpreted by the claims, and all technical concepts within the scope of the present disclosure should be understood to be included in the scope of the present disclosure.

Claims

1. A display device, comprising: The display panel comprises a display area and a non-display area surrounding the display area; a back plate disposed on a rear surface of the display panel, the back plate including a first ground path unit and including a main area and an edge area surrounding the main area; as well as a heat dissipation plate, disposed on the back surface of the back plate and comprising a second ground path unit, Wherein, the first ground path unit is arranged at the edge area of ​​the back plate, The first grounding unit extends from the top surface of the back plate toward the back surface of the back plate. Wherein, the first grounding unit contacts at least one of the four side surfaces of the display panel, and Wherein, the second ground path unit is electrically connected to the first ground path unit, The heat dissipation plate includes a metal substrate and a black ink layer provided on each of the bottom surface and the top surface of the metal substrate. The heat dissipation plate has a main area vertically overlapping with the display area of ​​the display panel, and an edge area surrounding the main area of ​​the heat dissipation plate. wherein the second ground path unit is provided in the edge region of the heat dissipation plate so as not to overlap with the main region of the heat dissipation plate in a vertical direction, and the second ground path unit comprises a metal material having high thermal conductivity, Wherein, the second ground path unit includes: a first portion comprising a plurality of grooves defined in a surface of the metal substrate and having a first depth and a first width; and a second portion disposed above an outermost portion of the edge region of the heat dissipation plate, wherein the second portion exposes a top surface of the metal substrate; The surface of the metal substrate is exposed through the bottom surface and two side surfaces of the groove of the first portion located below the top surface of the metal substrate.

2. The display device according to claim 1, wherein The first ground path unit contacts each of the four side surfaces of the display panel.

3. The display device according to claim 1, wherein The main area of ​​the backplane overlaps with the display area of ​​the display panel in a vertical direction, Wherein, the first grounding path unit comprises a conductive polymer material.

4. The display device according to claim 3, wherein The first ground path unit is disposed in the edge region and extends from the top surface of each corner of the back plate to the back surface, wherein each first ground path unit has an "L" shape or an "inverted L" shape when looking down at the display device.

5. The display device according to claim 3, wherein The first ground path unit covers the entire edge area and extends from the top surface of the back plate to the back surface of the back plate. The display device according to claim 5 , wherein: When the display device is viewed from above, the first ground path unit has a rectangular ring shape and exposes the main area of ​​the back plate.

7. The display device according to claim 3, wherein: The first ground path unit has a triangular shape when the display device is viewed from above, and extends from a top surface of each corner of the back plate to a back surface.

8. The display device according to claim 1, wherein The thickness of the first ground path unit is greater than the thickness of the display panel, so that the vertical height of the top surface of the first ground path unit is higher than the vertical height of the top surface of the display panel.

9. The display device according to claim 1, wherein The first portion includes a plurality of grooves defined in the surface of the metal substrate, wherein the grooves of the first portion are provided in the edge region of the heat sink, wherein the groove of the first portion extends along four sides of the edge region, The grooves of the first portion are arranged horizontally and spaced apart from each other.

10. The display device according to claim 9, wherein Each of the plurality of grooves has a rectangular ring shape when the display device is viewed from above, wherein the plurality of grooves are spaced apart from each other.

11. The display device according to claim 1, wherein The second ground path unit includes a black ink layer pattern, and the black ink layer pattern includes an opening area partially exposing a surface of the metal substrate.

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