Pressure control device and semiconductor process apparatus

By employing flow control and recoil components in semiconductor process equipment, utilizing elastic elements to drive piston movement and pre-set pressure to protect against corrosion with protective gas, the corrosion problem of process chamber pressure controllers is solved, achieving stable pressure control and a long lifespan for the device.

CN116364605BActive Publication Date: 2026-07-03BEIJING AURASKY ELECTRONICS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING AURASKY ELECTRONICS CO LTD
Filing Date
2023-03-28
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In semiconductor manufacturing processes, it is difficult to effectively control the pressure in the process chamber, which leads to corrosion problems of the pressure controller, affects the coating thickness parameters, and results in a short service life of the pressure controller.

Method used

A pressure control device is adopted, which includes a flow control component, a sleeve, a backflushing component, an inlet channel, and an outlet channel. The gas pressure is controlled by driving the piston movement through an elastic element, and the backflushing component is used to introduce a preset pressure protective gas to prevent corrosive gas from contacting the components.

Benefits of technology

Stable control of process chamber pressure was achieved, extending the service life of the pressure control device and improving the stability of coating thickness parameters.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116364605B_ABST
    Figure CN116364605B_ABST
Patent Text Reader

Abstract

This invention provides a pressure control device, including a flow control assembly, a sleeve, a backflushing assembly, an inlet channel, and an outlet channel. The flow control assembly includes a piston, an elastic element, and a control element. The bottom opening of the sleeve communicates with the outlet of the inlet channel. A connecting hole is formed on the side wall of the sleeve, connecting the interior of the sleeve with the outlet channel. The control element is connected to the piston via the elastic element and is used to drive the piston to move within the sleeve via the elastic element. Multiple through holes are also provided on the side wall of the sleeve. The backflushing assembly includes a first air inlet pipe communicating with the multiple through holes, used to introduce a first preset pressure protective gas between the piston and the inner wall of the sleeve. The pressure control device provided by this invention can extend the service life of the pressure control device while achieving stable control of the process chamber pressure. This invention also provides a semiconductor process apparatus.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of semiconductor process equipment, and more specifically, to a pressure control device and a semiconductor process equipment including the pressure control device. Background Technology

[0002] In semiconductor manufacturing processes, oxidation furnaces are among the most important pieces of equipment. Hydrogen (H2), hydrogen chloride (HCl), excess oxygen (O2), a small amount of dichloroethylene (C2H2Cl2), and nitrogen (N2) entering the reaction chamber of the oxidation furnace need to undergo a chemical reaction under constant pressure to ensure the thickness of the coating. The stability of the reaction chamber pressure is the main factor affecting the coating thickness parameter.

[0003] Under complex conditions such as the presence of various corrosive gases, it is difficult to solve the corrosion problem of process chamber pressure controllers. How to extend the life cycle of pressure controllers and effectively control the pressure inside the chamber has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0004] The present invention aims to provide a pressure control device and a semiconductor process apparatus including the pressure control device, the pressure control device having a long service life and being able to improve the stability of the internal pressure of the process chamber in the semiconductor process apparatus.

[0005] To achieve the above objectives, as one aspect of the present invention, a pressure control device is provided, comprising a flow control assembly, a sleeve, a backwash assembly, an inlet channel, and an outlet channel. The flow control assembly includes a piston, an elastic element, and a control element. The bottom opening of the sleeve communicates with the outlet of the inlet channel. A connecting hole is formed on the side wall of the sleeve, which connects the interior of the sleeve with the outlet channel. The control element is connected to the piston via the elastic element and is used to drive the piston to move in the sleeve along a direction close to or away from the outlet of the inlet channel, thereby changing the gas pressure at the front end of the inlet channel when the control element drives the piston to press down and block the bottom opening of the sleeve.

[0006] The sleeve is also provided with a plurality of through holes on its side wall. The through holes are located on the side of the connecting hole away from the bottom opening. The recoil assembly includes a first air inlet pipe, which is connected to the plurality of through holes and is used to introduce a first preset pressure protective gas between the piston and the inner wall of the sleeve.

[0007] Optionally, the sleeve includes a guide section, a connecting section, and a blocking section connected sequentially from top to bottom. A connecting cavity is formed in the connecting section. A guide hole is formed in the guide section that penetrates the guide section vertically. A flow-through hole is formed in the blocking section that penetrates the blocking section vertically. The cross-sectional dimension of the flow-through hole is smaller than the cross-sectional dimension of the piston. The bottom end of the flow-through hole is connected to the outlet of the inlet channel.

[0008] The connecting hole connects the connecting cavity to the outflow channel, and the position of the through hole corresponds to the position of the guide section.

[0009] Optionally, the plurality of through holes are evenly distributed circumferentially around the axis of the sleeve, and the axis of the through holes is perpendicular to the axis of the sleeve and forms a preset angle with the radial direction of the sleeve.

[0010] Optionally, an annular air guide passage is formed in the sleeve, the annular air guide passage extends around the axis of the sleeve, one end of the through hole is connected to the annular air guide passage, and the other end is connected to the interior of the sleeve; the first air inlet pipe is connected to the plurality of through holes through the annular air guide passage.

[0011] Optionally, an annular gas equalization channel is formed on the inner wall of the sleeve, the annular gas equalization channel extends around the axis of the sleeve, and the plurality of through holes are connected to the interior of the sleeve through the annular gas equalization channel.

[0012] Optionally, the piston includes a cylinder and a sealing element, the sealing element sealing the bottom end of the cylinder and used to block the flow hole, the elastic element being disposed inside the cylinder and connected between the control element and the top of the sealing element.

[0013] Optionally, the piston further includes a blocking portion disposed on the side of the cylinder away from the flow hole.

[0014] Optionally, a flange extending radially outward along the cylinder is formed at one end of the cylinder away from the flow hole, and the flange is formed as the blocking portion.

[0015] Optionally, the backflush assembly further includes a second air inlet pipe, which is used to provide a second preset pressure protection gas to the outlet of the inlet channel.

[0016] Optionally, the backflush assembly further includes a main air intake pipe, the air intake end of which is connected to a protective gas source, and the air outlet end of which is connected to the air intake ends of the first air intake pipe and the second air intake pipe. A first pressure regulating valve is provided on the first air intake pipe, and a second pressure regulating valve is provided on the second air intake pipe.

[0017] Optionally, the backflushing assembly further includes a third air intake pipe, a first pressure sensor, and a flow regulating valve. The first pressure sensor and the flow regulating valve are disposed on the third air intake pipe. The first air intake pipe includes a first pipe section and a second pipe section. The air intake end of the first pipe section is connected to the air outlet end of the main air intake pipe. The air outlet end of the first pipe section is connected to the air intake end of the second pipe section and the air intake end of the third air intake pipe. The air outlet end of the second pipe section is used to introduce the first preset pressure protection gas into the sleeve. The air intake end of the third air intake pipe is used to introduce the third preset pressure protection gas into the third air intake pipe. The air outlet end of the third air intake pipe is used to connect to the exhaust end of the process chamber.

[0018] Optionally, the pressure control device further includes a flow guide block and a flow control block. Both the inlet channel and the outlet channel are formed in the flow guide block. The inlet of the inlet channel is formed on one side surface of the flow guide block, the outlet of the inlet channel and the inlet of the outlet channel are both formed on the top surface of the flow guide block, and the outlet of the outlet channel is formed on the other side surface of the flow guide block. A connecting opening is formed at the bottom of the flow control block. The top surface of the flow guide block is sealed to the bottom surface of the flow control block, and the outlet of the inlet channel and the inlet of the outlet channel correspond to and are connected to the connecting opening. A mounting hole communicating with the connecting opening is formed at the top of the flow control block. The sleeve is disposed in the mounting hole, and the outer wall of the sleeve is sealed to the mounting hole.

[0019] Optionally, a gas guide groove is formed on the top of the flow guide block, the gas guide groove surrounds the outlet of the inlet channel, and a gas guide hole is also formed in the flow guide block. One end of the gas guide hole forms a gas guide inlet on the top of the flow guide block, and the other end of the gas guide hole communicates with the gas guide groove. The outlet end of the second air inlet pipe is used to introduce the second preset pressure protection gas into the gas guide inlet, so as to introduce the second preset pressure protection gas into the outlet of the inlet channel through the gas guide hole.

[0020] Optionally, an annular protrusion is formed between the bottom of the air guide groove and the inner wall of the inlet channel, and the height of the annular protrusion is lower than the top surface of the guide block.

[0021] The flow guide block also has a condensation flow guide hole. One end of the condensation flow guide hole is connected to the gas guide groove, and the other end forms an opening on the side wall of the flow guide block. The condensation flow guide hole is used to discharge the liquid from the gas guide groove.

[0022] As a second aspect of the present invention, a semiconductor process apparatus is provided, including the process chamber and the aforementioned pressure control device, wherein the inlet end of the inlet channel of the pressure control device is connected to the exhaust end of the process chamber.

[0023] In the semiconductor process equipment provided by the present invention, the control element of the pressure control device is used to drive the piston in the sleeve to move in the direction of the outlet close to or away from the inlet channel through the elastic element. On the one hand, the piston is connected to the control element through the elastic element, and the gas in the inlet channel interacts with the elastic force of the elastic element to realize the adjustment of the piston opening, thereby controlling the gas pressure of the process chamber connected upstream of the pressure control device. On the other hand, when the pressure change is large and the current elastic force of the elastic element cannot achieve pressure control, the control element can further drive the piston to move for auxiliary pressure control.

[0024] Furthermore, the pressure control device in the semiconductor process equipment provided by the present invention also includes a recoil assembly. The first air inlet pipe of the recoil assembly is connected to multiple through holes for introducing a first preset pressure protective gas between the piston and the inner wall of the sleeve through the through holes, thereby preventing the gas discharged from the upstream process chamber from contacting the elastic element and the control element. Even if the gas discharged from the process chamber contains corrosive components, it can prevent the gas from corroding the elastic element, the control element and related components, thereby extending the service life of the pressure control device while achieving stable control of the process chamber pressure. Attached Figure Description

[0025] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the following detailed description to explain the invention, but do not constitute a limitation thereof. In the drawings:

[0026] Figure 1 This is a schematic diagram of the pressure control device provided in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the gas flow direction in the pressure control device provided in an embodiment of the present invention;

[0028] Figure 3 This is a cross-sectional view of a portion of the structure of the pressure control device provided in an embodiment of the present invention along a horizontal section;

[0029] Figure 4 This is a partial structural schematic diagram of the pressure control device provided in an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of the semiconductor process equipment provided in an embodiment of the present invention;

[0031] Figure 6 This is a partial structural schematic diagram of the pressure control device provided in an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] 100: Control component; 110: Elastic component

[0034] 120: Coupling; 200: Piston

[0035] 210: Cylinder body; 300: Sleeve

[0036] 310: Annular air guide passage; 320: Through hole

[0037] 330: Annular gas distribution passage; 340: Connecting hole

[0038] 350: Annular sealing ring; 400: Flow guide block

[0039] 410: Inflow channel; 420: Outflow channel

[0040] 431: Air guide groove; 432: Annular protrusion

[0041] 440: Condensation guide hole; 450: Air guide hole

[0042] 500: Flow control block; 510: Connecting opening

[0043] 610: Main intake pipe; 620: First intake pipe

[0044] 621: First pressure regulating valve; 622: First pressure sensor

[0045] 623: Flow regulating valve; 630: Second intake pipe

[0046] 631: Second pressure regulating valve; 640: Detachable branch pipe

[0047] 641: Second pressure sensor Detailed Implementation

[0048] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0049] To address the aforementioned technical problems, as one aspect of the present invention, a pressure control device is provided, such as... Figure 1As shown, the pressure control device includes a flow control assembly, a sleeve 300, a backflow assembly, a piston 200, an inflow channel 410, and an outflow channel 420. The flow control assembly includes the piston 200, an elastic element 110, and a control element 100. The bottom opening of the sleeve 300 communicates with the outlet of the inflow channel 410. A connecting hole 340 is formed on the side wall of the sleeve 300, connecting the interior of the sleeve 300 with the outflow channel 420. The control element 100 is connected to the piston 200 through the elastic element 110 and is used to control the flow through the elastic element 110. The piston 200 moves within the sleeve 300 in a direction close to or away from the outlet of the inlet channel 410. On one hand, the piston and the control element are connected by an elastic element. When the gas pressure in the inlet channel 410 fluctuates, the gas pressure interacts with the elastic force of the elastic element to adjust the opening of the piston 200, thereby changing the gas pressure at the front end of the inlet channel 410. On the other hand, when the gas pressure at the front end of the inlet channel 410 changes significantly and cannot be controlled by the current elastic force, the control element can further drive the piston to move for auxiliary pressure control.

[0050] The sleeve 300 is also provided with a plurality of through holes 320. The through holes 320 are located on the side of the connecting hole 340 away from the bottom opening of the sleeve 300. The recoil assembly includes a first air inlet pipe 620, which is connected to the plurality of through holes 320 and is used to introduce a first preset pressure protective gas between the piston 200 and the inner wall of the sleeve 300.

[0051] In the pressure control device provided by the present invention, the control element 100 is used to drive the piston 200 to move in the sleeve 300 along the direction close to or away from the outlet of the inlet channel 410 through the elastic element 110. When the gas pressure in the inlet channel 410 changes, the control element interacts with the elastic force generated by the elastic element 110 to change the position of the piston 200, thereby controlling the gas pressure of the process chamber connected upstream of the pressure control device. Furthermore, when the gas pressure at the front end of the inlet channel 410 changes significantly and cannot be controlled by the current elastic force, the control element can further drive the piston to move for auxiliary pressure control.

[0052] Furthermore, the control device provided by the present invention also includes a recoil assembly. The first air inlet pipe 620 of the recoil assembly is connected to a plurality of through holes 320 for introducing a first preset pressure protective gas between the piston 200 and the inner wall of the sleeve 300 through the through holes 320, thereby preventing the gas discharged from the upstream process chamber from contacting the elastic element 110 and the control element 100. Even if the gas discharged from the process chamber contains corrosive components, it can prevent the gas from corroding the elastic element 110, the control element 100 and related components, thereby extending the service life of the pressure control device while achieving stable control of the process chamber pressure.

[0053] It should be noted that the first preset pressure protective gas can be a chemically inert gas. For example, as an optional embodiment of the present invention, the first preset pressure protective gas can be nitrogen or argon.

[0054] As an optional embodiment of the present invention, such as Figure 4 As shown, the sleeve 300 includes a guide section a, a connecting section b, and a blocking section c connected sequentially from top to bottom. A connecting cavity is formed in the connecting section b. A guide hole is formed in the guide section a that penetrates the guide section vertically. A flow hole is formed in the blocking section c that penetrates the blocking section vertically. The cross-sectional dimension of the flow hole is smaller than the cross-sectional dimension of the piston 200. The bottom end of the flow hole is connected to the outlet of the inlet channel 410.

[0055] The connecting hole 340 connects the connecting cavity to the outflow channel 420, and the position of the through hole 320 corresponds to the position of the guide section a.

[0056] To ensure the airtightness of the channel, in a preferred embodiment of the present invention, the inflow channel 410, the connecting opening 510, and the outflow channel 420 can be formed in the corresponding seat blocks, and a dual-channel laminar flow structure is adopted. Specifically, as shown in... Figure 1 As shown, the pressure control device also includes a flow guide block 400 and a flow control block 500. The inlet channel 410 and the outlet channel 420 are both formed in the flow guide block 400. The inlet of the inlet channel 410 is formed on one side surface of the flow guide block 400. The outlet of the inlet channel 410 and the inlet of the outlet channel 420 are both formed on the top surface of the flow guide block 400. The outlet of the outlet channel 420 is formed on the other side surface of the flow guide block 400.

[0057] The bottom of the flow control block 500 has a connecting opening 510. The top surface of the flow guide block 400 is sealed to the bottom surface of the flow control block 500. The outlet of the inlet channel 410 and the inlet of the outlet channel 420 are both corresponding to and connected to the connecting opening 510. The top of the flow control block 500 has a mounting hole that communicates with the connecting opening 510. The sleeve 300 is disposed in the mounting hole and the outer wall of the sleeve 300 is sealed to the mounting hole.

[0058] As an optional embodiment of the present invention, the mating surfaces of the flow guide block 400 and the flow control block 500 are sealed with a sealing ring, and the flow guide block 400 and the flow control block 500 can be fastened together by multiple (e.g., 4) studs.

[0059] In this embodiment of the invention, the combined structure design of the flow guide block 400 and the flow control block 500 helps to reduce the installation difficulty, and the use of the gas pressure difference principle can make the airflow stratification more stable. The first preset pressure protection gas and the corrosive process gas are stratified by inertia. The protective layer formed by the high pressure first preset pressure protection gas is located in the upper layer, and the low pressure process gas is located in the lower layer, reducing the risk of gas overflow.

[0060] During the use of the pressure control device, the internal gas flow direction is as follows: Figure 2 As shown, the process gas flows into the sleeve 300 from the inlet channel 410 in the direction indicated by the arrow, passes through the connecting hole 340 of the sleeve 300 and enters the connecting opening 510, then flows downward into the outlet channel 420 and downstream. The flow control assembly can control the deformation of the elastic element 110, thereby changing the gas pressure required for the gas in the inlet channel 410 to overcome the elastic force generated by the elastic element 110 to push the piston 200 and discharge it downstream through the outlet channel 420, thus controlling the gas pressure in the process chamber connected upstream of the pressure control device.

[0061] At the same time, the backflushing assembly introduces a first preset pressure protective gas between the piston 200 and the inner wall of the sleeve 300, thereby preventing the process gas from flowing upward along the gap between the sleeve 300 and the piston 200, and thus preventing the relevant components of the flow control assembly from being corroded.

[0062] To improve the stability of the pressure control effect, as a preferred embodiment of the present invention, such as... Figure 1 As shown, a mounting blind hole coaxial with the piston 200 is formed on the top of the piston 200, and an elastic member 110 is disposed in the mounting blind hole, and the elastic member 110 is connected between the bottom of the mounting blind hole and the control member 100.

[0063] As an optional embodiment of the present invention, the elastic element 110 can be a spring.

[0064] In this embodiment of the invention, the flow control component includes an elastic element 110. The control element 100 is connected to the piston 200 through the elastic element 110, thereby using the elastic force of the elastic element 110 to control the position of the piston 200. When the process gas in the inlet channel 410 flows downstream, it needs to overcome the elastic force of the elastic element 110. When the upstream (process chamber) gas pressure is higher than the current target pressure, the process gas pushes the piston 200 and the elastic element 110, causing the piston 200 to rise, increase the opening, and accelerate the gas discharge rate, thereby reducing the upstream (process chamber) gas pressure. When the upstream (process chamber) gas pressure is lower than the current target pressure, the opening decreases to reduce the gas discharge rate, or the process gas cannot push the piston 200 and the elastic element 110, and the piston 200 blocks the flow hole, stopping the gas discharge. Thus, the elastic element 110 achieves stable control of the internal pressure of the upstream process chamber.

[0065] As an optional embodiment of the present invention, the flow control assembly further includes a coupling 120, which is connected between the output end of the control element 100 and the elastic element 110.

[0066] To further improve the stability of the pressure control effect, as a preferred embodiment of the present invention, such as... Figure 3 , Figure 4 As shown, multiple through holes 320 are evenly distributed circumferentially around the axis of the sleeve 300. The axis of the through holes 320 is perpendicular to the axis of the sleeve 300 and forms a preset angle with the radial direction of the sleeve 300.

[0067] In this embodiment of the invention, the sleeve 300 has circumferentially uniformly distributed through holes 320. A first preset pressure protective gas is sprayed from the through holes 320 onto the outer wall of the piston 200, driving the piston 200 to rotate and create a levitation effect. The elastic element 110 (spring) swings with the piston 200 and moves up and down with the piston 200. Under the action of the resultant force, the piston 200 eventually reaches a steady state without moving, and the elastic element 110 will not twist. Furthermore, in the initial state, the piston 200 is subjected to the first preset pressure protective gas sprayed from the through holes 320 and will swing clockwise (from a top view angle). After reaching a certain rotation angle (about 10°), it swings counterclockwise under the force of the spring. As the piston 200 rises and falls in the sleeve 300, the amplitude of the piston 200's swing rotation around the axis becomes smaller and smaller, and finally reaches a steady state under the action of the resultant force.

[0068] In this embodiment of the invention, the sleeve 300 can drive the piston 200 to rotate through the through hole 320. This part is designed in accordance with Bernoulli's principle and utilizes the principle of air-floating piston motion to achieve the suspension motion of the piston 200. It has low friction characteristics. In addition, this solution is not affected by the placement direction. Whether it is placed horizontally or vertically, the piston 200 can be suspended. At the same time, the piston 200 has rotational motion during the up-and-down reciprocating motion, which is conducive to the rapid balance of pressure control and steady state.

[0069] To improve the uniformity of the flow rate of the protective gas provided by the multiple through holes 320 to the gap between the sleeve 300 and the piston 200 at the first preset pressure, and to further improve the stability of the pressure control effect, as a preferred embodiment of the present invention, such as... Figure 3 , Figure 4 As shown, an annular air guide passage 330 is formed in the sleeve 300. The annular air guide passage 330 extends around the axis of the sleeve 300. One end of the through hole 320 is connected to the annular air guide passage 330, and the other end is connected to the interior of the sleeve 300. The first air inlet pipe 620 is connected to multiple through holes 320 through the annular air guide passage 330.

[0070] As an optional embodiment of the present invention, such as Figure 1 , Figure 3 , Figure 4 As shown, the annular air guide passage 310 can be formed into a groove structure on the outer wall of the sleeve 300, and the annular air guide passage 310 can be sealed by the inner wall of the mounting hole of the flow control block 500 to form a closed annular channel structure.

[0071] To improve the airtightness of the annular air guide passage 310, preferably, as follows: Figure 1 , Figure 4 As shown, two annular sealing grooves are formed on the outer wall of the sleeve 300 corresponding to the two sides of the annular air guide passage 310. Annular sealing rings 350 are provided in the annular sealing grooves one by one. After the sleeve 300 is inserted into the mounting hole, the annular sealing rings 350 are pressed against the inner wall of the mounting hole to seal the annular air guide passage 310.

[0072] As an optional embodiment of the present invention, such as Figure 1 , Figure 3 , Figure 4 As shown, an annular gas equalization passage 330 is formed on the inner wall of the sleeve 300. The annular gas equalization passage 330 extends around the axis of the sleeve 300, and multiple oblique holes 320 are connected to the interior of the sleeve 300 through the annular gas equalization passage 330.

[0073] As an optional embodiment of the present invention, such as Figure 6 As shown, the piston 200 includes a cylinder 210 and a sealing member 220. The sealing member 220 seals the bottom end of the cylinder 210 and is used to block the flow hole. An elastic member is disposed inside the cylinder 210 and is connected between the control member and the top of the sealing member 220.

[0074] As an optional embodiment of the present invention, such as Figure 6 As shown, the piston 200 also includes a blocking portion 230, which is disposed on the side of the cylinder 210 away from the flow hole. As a preferred embodiment of the present invention, as... Figure 6 As shown, a flange extending radially outward along the end of the cylinder 210 away from the flow hole is formed. This flange is formed as a blocking part 230. When the first preset pressure protective gas flows upward between the piston 200 and the inner wall of the sleeve 300, it can give the piston 200 an upward force through the blocking part 230, which helps to further realize the levitation movement of the piston 200.

[0075] As an optional embodiment of the present invention, the backflush assembly further includes a second air inlet pipe 630, which is used to introduce a second preset pressure protection gas into the inlet channel 410.

[0076] In this embodiment of the invention, the backflushing assembly further includes a second air inlet pipe 630. The second air inlet pipe 630 can introduce a second preset pressure protective gas into the inlet channel 410. Firstly, when the piston 200 is at the bottom opening of the sealing sleeve 300, it assists in opening the piston 200. Specifically, the pressure in the process chamber is negative (lower than atmospheric pressure, less than 14 psig), while the pressure above the piston 200 is atmospheric pressure. Introducing the second protective gas (high pressure, greater than atmospheric pressure) can assist in opening the piston. Secondly, the second preset pressure protective gas can stratify with the corrosive process gas due to inertia, thereby preventing the process gas from flowing upwards along the gap between the sleeve 300 and the piston 200.

[0077] In other words, the protective layer formed by the high-pressure second preset pressure protective gas is located in the upper layer, while the low-pressure process gas is basically located in the lower channel (i.e., the inlet channel 410 and the outlet channel 420). The two are separated at the contact surface of the guide block 400 and the control block 500, forming a protective layer at the process gas. The protective layer formed by the second preset pressure protective gas (e.g., nitrogen) flows in the connecting opening 510, while the corrosive process gas flows entirely in the lower channel, reducing the risk of gas spillage.

[0078] As an optional embodiment of the present invention, such as Figure 1 As shown, a vent hole 450 is also formed in the flow guide block 400. One end of the vent hole 450 forms a vent inlet at the top of the flow guide block 400, and the other end of the vent hole 450 is connected to the outlet of the inlet channel 410 (specifically, connected to the vent groove 431). The second inlet pipe 630 is used to introduce a second preset pressure protection gas into the vent inlet, so as to introduce the second preset pressure protection gas into the inlet channel 410 through the vent hole 450.

[0079] like Figure 2 As shown, a portion of the second preset pressure protection gas flows down to the piston 200 through the air guide hole 450 and merges with the process gas, acting on the bottom of the piston 200 to form an upward thrust, which is used to overcome the gravity of the piston 200, the elastic force of the elastic element 110 (spring) and atmospheric pressure, etc. Through a multi-force balance steady-state process, the pressure of the process chamber is finally controlled.

[0080] As an optional embodiment of the present invention, such as Figure 1 As shown, the recoil assembly also includes a main air intake pipe 610. The air intake end of the main air intake pipe 610 is used to connect with a protective gas source. The air outlet end of the main air intake pipe 610 is connected to the air intake end of the first air intake pipe 620 and the air intake end of the second air intake pipe 630. A first pressure regulating valve 621 is provided on the first air intake pipe 610, and a second pressure regulating valve 631 is provided on the second air intake pipe 620.

[0081] As an optional embodiment of the present invention, such as Figure 1 As shown, the main intake pipe 610, the first intake pipe 620 and the second intake pipe 630 can be partially embedded in the guide block 400.

[0082] In this embodiment of the invention, a high-pressure second preset pressure protection gas (e.g., nitrogen or argon) is proportionally adjusted by a first pressure regulating valve 621 and a second pressure regulating valve 631 before entering the pressure control device and splitting into two paths to perform their respective functions.

[0083] In a preferred embodiment of the present invention, the surface of the flow guide block 400 is formed with a first mounting hole and a second mounting hole, and the first pressure regulating valve 621 and the second pressure regulating valve 631 are respectively disposed in the first mounting hole and the second mounting hole.

[0084] To improve pressure control accuracy, as a preferred embodiment of the present invention, such as... Figure 1 , Figure 2 As shown, the backflushing assembly also includes a third intake pipe 650, a first pressure sensor 622, and a flow regulating valve 623. The first pressure sensor 622 and the flow regulating valve 623 are disposed on the third intake pipe 650. The first pressure sensor 622 is used to detect the pressure in the process chamber. The first intake pipe 650 includes a first pipe section 601 and a second pipe section 602. The intake end of the first pipe section 601 is connected to the outlet end of the main intake pipe 610, and the outlet end of the first pipe section 601 is connected to the second pipe section 602. The inlet end of section 2 is connected to the inlet end of the third inlet pipe 650. The outlet end of the second pipe section 602 is used to introduce the first preset pressure protection gas into the sleeve 300. The inlet end of the third inlet pipe 650 is used to introduce the third preset pressure protection gas into the third inlet pipe 650. The outlet end of the third inlet pipe 650 is used to connect to the exhaust end of the process chamber to prevent process gas from entering the detachable branch pipe 640 and corroding the first pressure sensor 622, thereby reducing the pressure measurement accuracy and affecting the pressure control effect.

[0085] For example, alternatively, such as Figure 1 , Figure 2 As shown, the backflush assembly also includes a detachable branch pipe 640 and a second pressure sensor 641. The detachable branch pipe 640 is detachably connected between the outlet end of the third intake pipe 650 and the inlet end of the inlet channel 410, and the second pressure sensor 641 is disposed on the detachable branch pipe 640.

[0086] In this embodiment of the invention, the outlet end of the third air inlet pipe 650 can be connected to the exhaust end of the process chamber (through the detachable branch pipe 640). At this time, the flow regulating valve 623 can be used to adjust the pressure difference between the first pressure sensor 622 and the second pressure sensor 641, so that a communicating vessel is formed between the detachable branch pipe 640 and the air inlet end of the inlet channel 410, that is, the pressure at all points on the detachable branch pipe 640 is equal, ensuring that the pressure detected by the first pressure sensor 622 is consistent with the pressure of the process chamber.

[0087] It should be noted that the second pressure sensor 641 is only connected during the nitrogen calibration of the product. Its purpose is to adjust the opening of the flow regulating valve 623 so that the pressure difference between the first pressure sensor 622 and the second pressure sensor 641 is zero. Once confirmed, no further adjustment is needed, and the second pressure sensor 641 can be removed.

[0088] As an optional embodiment of the present invention, the pressure control device further includes a bracket (not shown in the figure), which is fixedly connected to the flow guide block 400. The control component 100, the first pressure sensor 622, and the flow regulating valve 623 are all fixedly mounted on the bracket.

[0089] As an optional embodiment of the present invention, such as Figure 1 As shown, a guide groove 431 is formed on the top of the guide block 400. The guide groove 431 surrounds the outlet of the inlet channel 410. A guide hole 450 is also formed in the guide block 400. One end of the guide hole 450 forms a guide air inlet on the top of the guide block 400. The other end of the guide hole 450 is connected to the guide groove 431. The outlet end of the second air inlet pipe is used to introduce a second preset pressure protection gas into the guide air inlet, so that the second preset pressure protection gas can be introduced into the outlet of the inlet channel 410 through the guide hole.

[0090] To improve the accuracy of gas pressure control by the pressure control device, as a preferred embodiment of the present invention, such as... Figure 1 As shown, an annular protrusion 432 is formed between the bottom of the air guide groove 431 and the inner wall of the inlet channel 410. The height of the annular protrusion 432 is lower than the top surface of the guide block 400.

[0091] A condensation guide hole 440 is also formed in the guide block 400. One end of the condensation guide hole 440 is connected to the gas guide groove 431, and the other end forms an opening on the side wall of the guide block 400. The condensation guide hole 440 is used to discharge the liquid in the gas guide groove 431.

[0092] In this embodiment of the invention, the gas guide groove 431 can accommodate the condensate formed by the cooling of water vapor in the process gas, and lead the condensate out to the outside of the pressure control device through the condensate guide hole 440, thereby preventing water vapor from entering the sleeve 300 and affecting the movement of components such as the piston 200, and improving the accuracy of the pressure control device in controlling the gas pressure.

[0093] As a second aspect of the present invention, a semiconductor process apparatus is provided, such as... Figure 5 As shown, the semiconductor process equipment includes a process chamber 20 and a pressure control device 21 provided in this embodiment of the invention. The inlet end of the inlet channel 410 of the pressure control device 21 is connected to the exhaust end of the process chamber 20.

[0094] In the semiconductor process equipment provided by the present invention, the control element 100 of the pressure control device 21 is used to drive the piston 200 to move in the sleeve 300 along the direction close to or away from the outlet of the inlet channel 410 through the elastic element 110. The piston and the control element are connected by the elastic element, so that when the gas pressure in the inlet channel 410 fluctuates, the gas pressure and the elastic force of the elastic element interact to adjust the opening of the piston 200, thereby changing the gas pressure at the front end of the inlet channel 410. Furthermore, when the gas pressure at the front end of the inlet channel 410 changes significantly and cannot be controlled by the current elastic force, the control element can further drive the piston to move for auxiliary pressure control.

[0095] Furthermore, the pressure control device in the semiconductor process equipment provided by the present invention also includes a recoil assembly. The first air inlet pipe 620 of the recoil assembly is connected to a plurality of through holes 320 for introducing a first preset pressure protective gas between the piston 200 and the inner wall of the sleeve 300 through the through holes 320, thereby preventing the gas discharged from the upstream process chamber from contacting the elastic element 110 and the control element 100. Even if the gas discharged from the process chamber contains corrosive components, it can prevent the gas from corroding the elastic element 110, the control element 100 and related components, thereby extending the service life of the pressure control device while achieving stable control of the process chamber pressure.

[0096] As an optional embodiment of the present invention, such as Figure 5 As shown, the semiconductor process equipment also includes a flow controller 19 and a plant exhaust device 22. The flow controller 19 is connected between the air inlet of the process chamber 20 and the air source. The detachable branch pipe 640 is installed on the exhaust pipe of the process chamber 20 through a tee connector. One end of the branch pipe is connected to the exhaust end of the process chamber 20, and the other end is connected to the air inlet of the inlet channel 410 of the pressure control device 21. The plant exhaust device 22 is connected to the air outlet of the outlet channel 420 of the pressure control device 21.

[0097] The working process of this semiconductor process equipment is as follows: the process gas required for the semiconductor process enters the process chamber 20 through the flow controller 19, reacts in the chamber and is discharged from the chamber exhaust end, and enters the plant exhaust device 22 through the pressure control device 21. During this process, the plant exhaust device 22 is used to provide the suction force required for normal operation (generally -0.3Kpa to -1.3Kpa).

[0098] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A pressure control device, characterized in that, The device includes a flow control assembly, a sleeve, a backflushing assembly, an inlet channel, and an outlet channel. The flow control assembly includes a piston, an elastic element, and a control element. The bottom opening of the sleeve communicates with the outlet of the inlet channel. A connecting hole is formed on the side wall of the sleeve, which connects the interior of the sleeve with the outlet channel. The control element is connected to the piston through the elastic element and is used to drive the piston to move in the sleeve in a direction close to or away from the outlet of the inlet channel, thereby changing the gas pressure at the front end of the inlet channel. The sleeve is also provided with a plurality of through holes on its side wall. The through holes are located on the side of the connecting hole away from the bottom opening. The recoil assembly includes a first air inlet pipe, which is connected to the plurality of through holes and is used to introduce a first preset pressure protective gas between the piston and the inner wall of the sleeve. The plurality of through holes are evenly distributed circumferentially around the axis of the sleeve, and the axis of the through holes is perpendicular to the axis of the sleeve and forms a preset angle with the radial direction of the sleeve.

2. The pressure control device according to claim 1, characterized in that, The sleeve includes a guide section, a connecting section, and a blocking section connected sequentially from top to bottom. A connecting cavity is formed in the connecting section. A guide hole is formed in the guide section, penetrating the guide section vertically. A flow-through hole is formed in the blocking section, penetrating the blocking section vertically. The cross-sectional dimension of the flow-through hole is smaller than that of the piston. The bottom end of the flow-through hole is connected to the outlet of the inlet channel. The connecting hole connects the connecting cavity to the outflow channel, and the position of the through hole corresponds to the position of the guide section.

3. The pressure control device according to claim 1, characterized in that, An annular air guide passage is formed in the sleeve, and the annular air guide passage extends around the axis of the sleeve. One end of the through hole is connected to the annular air guide passage, and the other end is connected to the interior of the sleeve. The first air inlet pipe is connected to multiple through holes through the annular air guide passage.

4. The pressure control device according to claim 3, characterized in that, An annular gas equalization channel is formed on the inner wall of the sleeve, and the annular gas equalization channel extends around the axis of the sleeve. The plurality of through holes are connected to the interior of the sleeve through the annular gas equalization channel.

5. The pressure control device according to claim 2, characterized in that, The piston includes a cylinder and a sealing element. The sealing element seals the bottom end of the cylinder and is used to block the flow hole. The elastic element is disposed inside the cylinder and is connected between the control element and the top of the sealing element.

6. The pressure control device according to claim 5, characterized in that, The piston also includes a shielding portion, which is disposed on the side of the cylinder away from the flow hole.

7. The pressure control device according to claim 6, characterized in that, The end of the cylinder away from the flow hole is formed with a flange extending radially outward along the cylinder, and the flange is formed as the blocking part.

8. The pressure control device according to any one of claims 1 to 7, characterized in that, The backflush assembly further includes a second air inlet pipe, which is used to provide a second preset pressure protection gas to the outlet of the inlet channel.

9. The pressure control device according to claim 8, characterized in that, The recoil assembly also includes a main air intake pipe, the air intake end of which is connected to a protective gas source, and the air outlet end of which is connected to the air intake ends of the first air intake pipe and the second air intake pipe. A first pressure regulating valve is provided on the first air intake pipe, and a second pressure regulating valve is provided on the second air intake pipe.

10. The pressure control device according to claim 9, characterized in that, The backflushing assembly further includes a third air intake pipe, a first pressure sensor, and a flow regulating valve. The first pressure sensor and the flow regulating valve are disposed on the third air intake pipe. The first air intake pipe includes a first pipe section and a second pipe section. The air intake end of the first pipe section is connected to the air outlet end of the main air intake pipe. The air outlet end of the first pipe section is connected to the air intake end of the second pipe section and the air intake end of the third air intake pipe. The air outlet end of the second pipe section is used to introduce the first preset pressure protection gas into the sleeve. The air intake end of the third air intake pipe is used to introduce the third preset pressure protection gas into the third air intake pipe. The air outlet end of the third air intake pipe is used to connect to the exhaust end of the process chamber.

11. The pressure control device according to claim 8, characterized in that, The pressure control device further includes a flow guide block and a flow control block. Both the inlet channel and the outlet channel are formed in the flow guide block. The inlet of the inlet channel is formed on one side surface of the flow guide block, the outlet of the inlet channel and the inlet of the outlet channel are both formed on the top surface of the flow guide block, and the outlet of the outlet channel is formed on the other side surface of the flow guide block. A connecting opening is formed at the bottom of the flow control block. The top surface of the flow guide block is sealed to the bottom surface of the flow control block, and the outlet of the inlet channel and the inlet of the outlet channel correspond to and are connected to the connecting opening. A mounting hole communicating with the connecting opening is formed at the top of the flow control block. The sleeve is disposed in the mounting hole, and the outer wall of the sleeve is sealed to the mounting hole.

12. The pressure control device according to claim 11, characterized in that, The top of the flow guide block is formed with an air guide groove, which surrounds the outlet of the inlet channel. An air guide hole is also formed in the flow guide block. One end of the air guide hole forms an air guide inlet on the top of the flow guide block, and the other end of the air guide hole communicates with the air guide groove. The outlet end of the second air inlet pipe is used to introduce the second preset pressure protection gas into the air guide inlet, so that the second preset pressure protection gas can be introduced into the outlet of the inlet channel through the air guide hole.

13. The pressure control device according to claim 12, characterized in that, An annular protrusion is formed between the bottom of the air guide groove and the inner wall of the inlet channel, and the height of the annular protrusion is lower than the top surface of the guide block. The flow guide block also has a condensation flow guide hole. One end of the condensation flow guide hole is connected to the gas guide groove, and the other end forms an opening on the side wall of the flow guide block. The condensation flow guide hole is used to discharge the liquid from the gas guide groove.

14. A semiconductor process apparatus, comprising a process chamber and a pressure control device according to any one of claims 1 to 13, wherein the inlet end of the inlet channel of the pressure control device is connected to the exhaust end of the process chamber.